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JP6989765B2 - How to inspect the light emitting device - Google Patents

How to inspect the light emitting device Download PDF

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Publication number
JP6989765B2
JP6989765B2 JP2017179984A JP2017179984A JP6989765B2 JP 6989765 B2 JP6989765 B2 JP 6989765B2 JP 2017179984 A JP2017179984 A JP 2017179984A JP 2017179984 A JP2017179984 A JP 2017179984A JP 6989765 B2 JP6989765 B2 JP 6989765B2
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light emitting
emitting device
resin package
opening
geometric center
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JP2019057559A (en
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章裕 大原
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Nichia Corp
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Nichia Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Description

本開示は、発光装置の検査方法に関する。 The present disclosure relates to a method for inspecting a light emitting device.

凹部を備えた樹脂パッケージに半導体発光素子（以下、「発光素子」とも称する）が配置されたＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）などの発光装置が知られている。 A light emitting device such as an LED (Light Emitting Diode) in which a semiconductor light emitting element (hereinafter, also referred to as “light emitting element”) is arranged in a resin package provided with a recess is known.

このような発光装置は、個別に成形された樹脂パッケージを、連結するリードフレームを切断することで個片化することで得ることができる。また、複数の樹脂パッケージが繋がった状態で成形された樹脂パッケージの集合体を、リードフレームと樹脂とを同時に切断することで個片化する方法が知られている（例えば特許文献１）。 Such a light emitting device can be obtained by separating individually molded resin packages into individual pieces by cutting a lead frame to be connected. Further, a method is known in which an aggregate of resin packages molded in a state where a plurality of resin packages are connected is individually cut by cutting the lead frame and the resin at the same time (for example, Patent Document 1).

樹脂パッケージを切断する際に、意図しない位置で切断してしまう場合がある。切断位置がずれると、凹部の位置がずれてしまうため、規格から外れる場合がある。そのため、外観検査において、凹部の位置ずれを検査する必要がある。外観検査法としては、例えば、特定の部材の露出の有無を確認することによって位置ずれを検査する方法が知られている（例えば特許文献２）。 When cutting the resin package, it may be cut at an unintended position. If the cutting position shifts, the position of the recess will shift, which may deviate from the standard. Therefore, in the visual inspection, it is necessary to inspect the misalignment of the concave portion. As an appearance inspection method, for example, a method of inspecting a positional deviation by confirming the presence or absence of exposure of a specific member is known (for example, Patent Document 2).

特開２０１１－３８５３号公報Japanese Unexamined Patent Publication No. 2011-3853 特開２０１２－１５１７６号公報Japanese Unexamined Patent Publication No. 2012-15176

しかしながら、最終的に切断することで個片化される発光装置は、上記の検査方法で凹部の位置を検査する方法は有効ではない。 However, the method of inspecting the position of the concave portion by the above-mentioned inspection method is not effective for the light emitting device which is finally separated into pieces by cutting.

本開示は、以下の構成を含む。
側壁と底面とを備え、上面に開口部を有する凹部を備えた樹脂パッケージと、凹部内に配置される発光素子と、を備える発光装置を準備する工程と、樹脂パッケージの幾何中心位置Ｐ１を測定する工程と、開口部の幾何中心位置Ｐ２を測定する工程と、Ｐ１と前記Ｐ２の差分を算出する工程と、差分が、側壁の上面の幅の規定値の３５％より大きい場合を不合格とする判定工程と、を備える発光装置の検査方法。 The disclosure includes the following configurations:
A step of preparing a light emitting device including a resin package having a side wall and a bottom surface and a recess having an opening on the upper surface, and a light emitting element arranged in the recess, and a geometric center position P1 of the resin package. When the difference between the step of measuring, the step of measuring the geometric center position P 2 of the opening, and the step of calculating the difference between P 1 and P 2 and the difference is larger than 35% of the specified value of the width of the upper surface of the side wall. A method for inspecting a light emitting device, which comprises a determination step of rejecting.

以上により、凹部の位置ずれを検査することができる。 From the above, it is possible to inspect the misalignment of the recess.

本実施形態に係る検査方法で測定する発光装置の一例を示す概略上面図である。It is a schematic top view which shows an example of the light emitting device to measure by the inspection method which concerns on this embodiment. 図１Ａの概略断面図である。It is a schematic cross-sectional view of FIG. 1A. 発光装置の製造方法を説明する概略上面図である。It is a schematic top view explaining the manufacturing method of a light emitting device. 本実施形態に係る発光装置の検査製造方法を示す概略図である。It is a schematic diagram which shows the inspection manufacturing method of the light emitting device which concerns on this embodiment. 本実施形態に係る発光装置の検査製造方法を示す概略図である。It is a schematic diagram which shows the inspection manufacturing method of the light emitting device which concerns on this embodiment.

本発明を実施するための形態を、以下に図面を参照しながら説明する。ただし、以下に示す形態は、本発明の技術思想を具体化するための発光装置の検査方法を例示するものであって、本発明は、発光装置の検査方法を以下に限定するものではない。 A mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below exemplifies an inspection method of a light emitting device for embodying the technical idea of the present invention, and the present invention does not limit the inspection method of the light emitting device to the following.

また、本明細書は、特許請求の範囲に示される部材を、実施の形態の部材に特定するものでは決してない。特に、実施の形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限りは、本開示の範囲をそれのみに限定する趣旨ではない。尚、各図面が示す部材の大きさや位置関係等は、説明を明確にするため誇張していることがある。さらに以下の説明において、同一の名称、符号については同一もしくは同質の部材を示しており、詳細説明を適宜省略する。 Further, the present specification does not specify the members shown in the claims as the members of the embodiment. In particular, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present disclosure to that alone unless otherwise specified. The size and positional relationship of the members shown in each drawing may be exaggerated for the sake of clarity. Further, in the following description, members of the same or the same quality are shown with the same name and reference numeral, and detailed description thereof will be omitted as appropriate.

（発光装置を準備する工程）
実施形態に係る検査を行う発光装置１００の一例を図１Ａ、図１Ｂに示す。発光装置１００は、樹脂パッケージ１０と、発光素子２０と、を備える。樹脂パッケージ１０は、正負一対の電極として機能するリード１１と、リード１１を一体的に保持する成形樹脂１２と、を備える。樹脂パッケージ１０は、凹部１３を備える。凹部１３は、側壁１４と底面１８とを備え、上面に開口部１９を備える。発光素子２０は凹部１３の底面１８上に載置されており、ワイヤ３０等を用いてリード１１と電気的に接続される。 (Process to prepare light emitting device)
1A and 1B show an example of a light emitting device 100 that performs an inspection according to an embodiment. The light emitting device 100 includes a resin package 10 and a light emitting element 20. The resin package 10 includes a lead 11 that functions as a pair of positive and negative electrodes, and a molding resin 12 that integrally holds the lead 11. The resin package 10 includes a recess 13. The recess 13 includes a side wall 14 and a bottom surface 18, and has an opening 19 on the upper surface. The light emitting element 20 is placed on the bottom surface 18 of the recess 13, and is electrically connected to the lead 11 by using a wire 30 or the like.

樹脂パッケージ１０は、例えば、上面視形状が長方形であり、開口部１９の形状も長方形である。つまり、側壁１４の上面１７は、樹脂パッケージ１０の上面において、四角環状である。 The resin package 10 has, for example, a rectangular shape when viewed from above, and the shape of the opening 19 is also rectangular. That is, the upper surface 17 of the side wall 14 is a square ring on the upper surface of the resin package 10.

樹脂パッケージ１０の上面視形状は、長方形のほか、正方形でもよい。また、開口部１９の上面視形状は、樹脂パッケージ１０と相似形とすることができる。例えは、長方形の樹脂パッケージ１０に長方形の開口部１９、正方形の樹脂パッケージ１０に正方形の開口部１９、とすることができる。このように、樹脂パッケージと開口部とが相似形の場合は、各側壁１４の上面１７は、全て同じ幅とすることが好ましい。 The top view shape of the resin package 10 may be a square as well as a rectangular shape. Further, the top view shape of the opening 19 can be similar to that of the resin package 10. For example, the rectangular resin package 10 may have a rectangular opening 19, and the square resin package 10 may have a square opening 19. As described above, when the resin package and the opening have similar shapes, it is preferable that the upper surface 17 of each side wall 14 has the same width.

また、開口部１９の上面視形状は、円形、又は、四角形の角部が丸みを帯びた形状、トラック形状等とすることができる。上面視形状が四角形の樹脂パッケージ１０に、このような円形等の開口部１９を備える場合は、側壁１４の上面１７は、１つの辺において幅が異なる部分を備える。このような場合、側壁１４の上面１７の幅の規定値とは、最も幅の小さい部分の幅の規定値を指す。例えば、上面視形状が正方形の樹脂パッケージ１０に、上面視形状が円形の開口部１９を備える場合、各辺の中央において、側壁１４の上面１７の幅が最も狭くなり、この部分の幅の規定値で合否判定を行う。 Further, the top view shape of the opening 19 can be a circular shape, a shape in which the corners of a quadrangle are rounded, a track shape, or the like. When the resin package 10 having a rectangular top view shape is provided with such a circular opening 19, the upper surface 17 of the side wall 14 includes a portion having a different width on one side. In such a case, the specified value of the width of the upper surface 17 of the side wall 14 refers to the specified value of the width of the narrowest portion. For example, when the resin package 10 having a square top view is provided with an opening 19 having a circular top view, the width of the top surface 17 of the side wall 14 is the narrowest at the center of each side, and the width of this portion is defined. A pass / fail judgment is made based on the value.

このような発光装置１００は、図２に示すような、発光装置の集合体１００Ａを、回転刃などの切断刃５０を用いて切断することで形成される。切断位置は、隣接する凹部１３の間の壁部の中央になるように設定されているが、成形時の金型のズレや、基板の反り、更には切断刃の摩耗等により、中央からずれる場合がある。これにより、切断後に、側壁１４の厚みが異なる、つまり、側壁１４の上面１７の幅の異なる発光装置１００が得られる。 Such a light emitting device 100 is formed by cutting an aggregate 100A of light emitting devices as shown in FIG. 2 using a cutting blade 50 such as a rotary blade. The cutting position is set so as to be in the center of the wall portion between the adjacent recesses 13, but the cutting position is displaced from the center due to the displacement of the mold during molding, the warp of the substrate, the wear of the cutting blade, and the like. In some cases. As a result, after cutting, a light emitting device 100 having a different thickness of the side wall 14, that is, a different width of the upper surface 17 of the side wall 14, can be obtained.

樹脂パッケージ１０の幾何中心位置Ｐ１と、開口部１９の幾何中心位置Ｐ２とは、一致していることが好ましい。樹脂パッケージ１０の幾何中心位置Ｐ１と、開口部１９の幾何中心位置Ｐ２とが大きくずれると、発光装置１００の上面において、発光部となる開口部１９の位置が中心からずれていることになる。開口部１９がずれた発光装置１００を、２次基板上に実装すると、発光位置が所定の位置よりずれることになる。そのため、例えば、発光モジュール等とした場合に、レンズの光軸とずれるなどの問題が生じる。また、樹脂パッケージ１０の幾何中心位置Ｐ１と、開口部１９の幾何中心位置Ｐ２とが大きくずれると、側壁１４の厚みが左右で異なることになる。側壁１４は、光反射性の樹脂部材から構成されているが、厚みが薄くなると、光が漏れやすくなる。そのため、配光特性が左右で異なるなどの問題が生じる。 It is preferable that the geometric center position P1 of the resin package 10 and the geometric center position P2 of the opening 19 coincide with each other. When the geometric center position P1 of the resin package 10 and the geometric center position P2 of the opening 19 are largely deviated, the position of the opening 19 which is the light emitting portion on the upper surface of the light emitting device 100 is deviated from the center. Become. When the light emitting device 100 in which the opening 19 is displaced is mounted on the secondary substrate, the light emitting position is shifted from a predetermined position. Therefore, for example, when a light emitting module or the like is used, there arises a problem such as deviation from the optical axis of the lens. Further, if the geometric center position P1 of the resin package 10 and the geometric center position P2 of the opening 19 are largely deviated from each other, the thickness of the side wall 14 will be different on the left and right. The side wall 14 is made of a light-reflecting resin member, but when the thickness is reduced, light is likely to leak. Therefore, there arises a problem that the light distribution characteristics are different on the left and right.

そのため、樹脂パッケージ１０の幾何中心位置Ｐ１と、開口部１９の幾何中心位置Ｐ２とが、規定された範囲からずれる場合は、判定工程において不合格とする。具体的には、樹脂パッケージ１０の幾何中心位置Ｐ１と、開口部１９の幾何中心位置Ｐ２とが、以下の関係を満たさない場合は、判定工程において不合格とする。 Therefore, if the geometric center position P 1 of the resin package 10 and the geometric center position P 2 of the opening 19 deviate from the specified range, the determination process is rejected. Specifically, if the geometric center position P 1 of the resin package 10 and the geometric center position P 2 of the opening 19 do not satisfy the following relationship, the determination process is rejected.

（樹脂パッケージの幾何中心位置を測定する工程）
発光装置１００の検査方法においては、例えば、図３に示すような、検査装置を用いる。検査装置は、発光装置１００を載置するための支持台２００と、支持台２００の上方に配置した測定カメラ３００と、を備える。 (Process of measuring the geometric center position of the resin package)
In the inspection method of the light emitting device 100, for example, an inspection device as shown in FIG. 3 is used. The inspection device includes a support base 200 for mounting the light emitting device 100, and a measurement camera 300 arranged above the support base 200.

測定カメラ３００は、例えば、図４に示すような四角形の撮像エリアＳに設定されている。撮像エリアＳは、例えば、左上角部を基準点Ｐ０＝（０、０）と、その対角点ＰＺ＝（１５９９、１１９９）とする、横１６００画素、縦１２００の画素を備える。１画素は、例えば、４μｍに設定しており、画素数を計測することで、発光装置の長さ等を測定することができる。尚、測定カメラ３００の画素サイズに応じて、撮像エリアＳの画素数が決定される。測定カメラ３００の画素サイズが小さいほど、1辺当りの画素数が多くなるため、解像度を高く設定することができ、これにより測定値の精度は上がる。ただし、その場合は、測定にかかる時間が長くなるため、求められる精度等に適した画素数の測定カメラを用いることが好ましい。また、測定カメラ３００の画素サイズ、撮像エリアの画素数、更には、測定カメラと発光素子との距離などに応じて、１画素の長さの設定を調整することが好ましい。 The measuring camera 300 is set in, for example, a rectangular imaging area S as shown in FIG. The imaging area S includes, for example, 1600 pixels in the horizontal direction and 1200 pixels in the vertical direction in which the upper left corner portion is a reference point P 0 = (0, 0) and the diagonal point P Z = (1599, 1199). One pixel is set to, for example, 4 μm, and the length of the light emitting device can be measured by measuring the number of pixels. The number of pixels in the imaging area S is determined according to the pixel size of the measurement camera 300. The smaller the pixel size of the measuring camera 300, the larger the number of pixels per side, so the resolution can be set higher, and the accuracy of the measured value is improved. However, in that case, since it takes a long time to measure, it is preferable to use a measuring camera having a number of pixels suitable for the required accuracy and the like. Further, it is preferable to adjust the setting of the length of one pixel according to the pixel size of the measuring camera 300, the number of pixels in the imaging area, the distance between the measuring camera and the light emitting element, and the like.

まず、樹脂パッケージ１０の幾何中心位置Ｐ１を測定するために、発光装置１００の樹脂パッケージ１０の幅（縦幅）Ｌ１と、樹脂パッケージ１０の幅（横幅）Ｗ１を測定する。得られた測定値から、樹脂パッケージ１０の幾何中心位置Ｐ１＝（Ｘ１、Ｙ１）が算出される。 First , in order to measure the geometric center position P1 of the resin package 10, the width (vertical width) L1 of the resin package 10 of the light emitting device 100 and the width (horizontal width) W1 of the resin package 10 are measured. From the obtained measured values, the geometric center position P 1 = (X 1 , Y 1 ) of the resin package 10 is calculated.

（開口部の幾何中心位置を測定する工程）
次いで、開口部１９の幅（縦幅）Ｌ２と、幅（横幅）Ｗ２を測定する。得られた測定値から、開口部１９の幾何中心位置Ｐ２＝（Ｘ２、Ｙ２）が算出される。 (Step of measuring the geometric center position of the opening)
Next, the width (vertical width) L 2 and the width (horizontal width) W 2 of the opening 19 are measured. From the obtained measured values, the geometric center position P 2 = (X 2 , Y 2 ) of the opening 19 is calculated.

尚、開口部１９の幾何中心位置Ｐ２の測定は、樹脂パッケージ１０の幾何中心位置Ｐ１の測定の前に行ってもよい。また、開口部１９の幾何中心位Ｐ２の測定と樹脂パッケージ１０の幾何中心Ｐ１の測定を同時に行ってもよい。 The measurement of the geometric center position P2 of the opening 19 may be performed before the measurement of the geometric center position P1 of the resin package 10 . Further, the measurement of the geometric center position P2 of the opening 19 and the measurement of the geometric center P1 of the resin package 10 may be performed at the same time.

（差分を算出する工程）
樹脂パッケージ１０の幾何中心位置Ｐ１と開口部１９の幾何中心位置Ｐ２の差分ＤＸ及びＤＹは、以下の式（１）（２）から得られる。
ＤＸ＝｜Ｘ１－Ｘ２｜…式（１）
ＤＹ＝｜Ｙ１－Ｙ２｜…式（２） (Process to calculate the difference)
The difference DX and DY between the geometric center position P1 of the resin package 10 and the geometric center position P2 of the opening 19 are obtained from the following equations ( 1 ) and (2).
DX = | X 1 -X 2 | ... Equation (1)
DY = | Y 1 -Y 2 | ... Equation (2)

発光装置１００は、あらかじめ側壁１４の上面１７の幅（横幅Ｗ３、縦幅Ｌ３）が規定されており、上記の式（１）（２）で得られた差分ＤＸ、ＤＹが、以下の式（３）（４）のいずれか、又は、両方を満たす場合は、不合格と判定する。
ＤＸ＞Ｗ３×０．３５…式（３）
ＤＹ＞Ｌ３×０．３５…式（４） In the light emitting device 100, the width (horizontal width W 3 and vertical width L 3 ) of the upper surface 17 of the side wall 14 is defined in advance, and the differences DX and DY obtained by the above equations (1) and (2) are If either or both of the following equations (3) and (4) are satisfied, it is determined to be unacceptable.
DX> W 3 x 0.35 ... Equation (3)
DY > L 3 x 0.35 ... Equation (4)

例えば、発光装置１００の樹脂パッケージ１０が、上面視形状が縦幅１．４ｍｍ×横幅３．０ｍｍの四角形であり、開口部１０が、上面視形状が縦幅１．０ｍｍ×横幅２．６ｍｍの四角形である発光装置１００を例に挙げる。側壁１４の上面１７は、縦幅Ｌ３及び横幅Ｗ３は、それぞれ０．２ｍｍである。つまり、式（３）及び式（４）に当てはめると、ＤＸ＞０．０７、ＤＹ＞０．０７を満たす場合は不合格と判定される。 For example, the resin package 10 of the light emitting device 100 is a quadrangle having a top view shape of 1.4 mm in length × 3.0 mm in width, and the opening 10 has a top view shape of 1.0 mm in length × 2.6 mm in width. Take the quadrangular light emitting device 100 as an example. The upper surface 17 of the side wall 14 has a vertical width L 3 and a horizontal width W 3 of 0.2 mm, respectively. That is, when applied to the equations (3) and (4), if DX > 0.07 and DY > 0.07 are satisfied, it is determined to be rejected.

サンプルＡは、樹脂パッケージ１０の幾何中心位置Ｐ１＝（Ｘ１、Ｙ１）＝（０．２４ｍｍ、０．３６ｍｍ、）であり、開口部１９の幾何中心位置Ｐ２は＝（Ｘ２、Ｙ２）＝（０．２４ｍｍ、０．４４ｍｍ、）である。つまり、Ｐ１とＰ２の差分は、式（１）よりＤＸ＝０．００ｍｍとなり、式（２）によりＤＹ＝０．０８ｍｍである。つまり、ＤＹ＝０．０８は式（４）を満たし、ＤＸは式（３）を満たさない。そのため、サンプルＡは不合格である。 In the sample A, the geometric center position P 1 = (X 1 , Y 1 ) = (0.24 mm, 0.36 mm,) of the resin package 10, and the geometric center position P 2 of the opening 19 is = (X 2 , ,. Y 2 ) = (0.24 mm, 0.44 mm,). That is, the difference between P 1 and P 2 is DX = 0.00 mm from the equation (1), and DY = 0.08 mm according to the equation (2). That is, DY = 0.08 satisfies the equation (4), and DX does not satisfy the equation (3). Therefore, sample A fails.

サンプルＢは、樹脂パッケージ１０の幾何中心位置Ｐ１＝（Ｘ１、Ｙ１）＝（０．２４ｍｍ、０．３６ｍｍ）であり、開口部１９の幾何中心位置Ｐ２は＝（Ｘ２、Ｙ２）＝（０．２４ｍｍ、０．３９ｍｍ）である。つまり、Ｐ１とＰ２の差分は、式（１）よりＤＸ＝０．００ｍｍとなり、式（２）によりＤＹ＝０．０３ｍｍである。そして、ＤＸは式（３）を満たさず、ＤＹも式（４）を満たさない。そのため、サンプルＢは合格である。 In the sample B, the geometric center position P 1 = (X 1 , Y 1 ) = (0.24 mm, 0.36 mm) of the resin package 10, and the geometric center position P 2 of the opening 19 is = (X 2 , Y). 2 ) = (0.24 mm, 0.39 mm). That is, the difference between P 1 and P 2 is DX = 0.00 mm from the equation (1), and DY = 0.03 mm according to the equation (2). Then, DX does not satisfy the equation (3), and DY also does not satisfy the equation (4). Therefore, sample B is acceptable.

本発明に係る発光装置の検査方法は、凹部を備えた発光装置の検査に適用することができ、照明用光源、各種インジケーター用光源、車載用光源、液晶のバックライト用光源、センサー用光源に用いられる発光装置に適用することができる。 The method for inspecting a light emitting device according to the present invention can be applied to an inspection of a light emitting device provided with a recess, and can be applied to a light source for lighting, a light source for various indicators, an in-vehicle light source, a light source for a liquid crystal backlight, and a light source for a sensor. It can be applied to the light source used.

１００…発光装置
１００Ａ…発光装置の集合体
１０…樹脂パッケージ
１１…リード
１２…成形樹脂
１３…凹部
１４…側壁（１５…内側面、１６…外側面、１７…上面）
１８…底面
１９…開口部
２０…発光素子
３０…ワイヤ
４０…封止部材
５０…切断刃
Ｌ１…樹脂パッケージの縦幅
Ｗ１…樹脂パッケージの横幅
Ｐ１…樹脂パッケージの幾何中心位置
Ｌ２…開口部の縦幅
Ｗ２…開口部の横幅
Ｐ２…開口部の幾何中心位置
Ｌ３…側壁の上面の縦幅
Ｗ３…側壁の上面の横幅
２００…支持台
３００…測定カメラ
Ｓ…撮像エリア
Ｐ０…基準点
ＰＺ…対角点 100 ... Light emitting device 100A ... Assembly of light emitting device 10 ... Resin package 11 ... Lead 12 ... Molding resin 13 ... Recess 14 ... Side wall (15 ... Inner side surface, 16 ... Outer surface, 17 ... Top surface)
18 ... Bottom surface 19 ... Opening 20 ... Light emitting element 30 ... Wire 40 ... Sealing member 50 ... Cutting blade L 1 ... Vertical width of resin package W 1 ... Horizontal width of resin package P 1 ... Geometric center position of resin package L 2 ... Vertical width of the opening W 2 ... Horizontal width of the opening P 2 ... Geometric center position of the opening L 3 ... Vertical width of the upper surface of the side wall W 3 ... Horizontal width of the upper surface of the side wall 200 ... Support base 300 ... Measuring camera S ... Imaging area P 0 ... Reference point P Z ... Diagonal point

Claims (3)

側壁と底面とを備え、上面に開口部を有する凹部を備えた樹脂パッケージと、前記凹部内に配置される発光素子と、を備える発光装置を準備する工程と、
前記樹脂パッケージの幾何中心位置Ｐ１を測定する工程と、
前記開口部の幾何中心位置Ｐ２を測定する工程と、
前記Ｐ１と前記Ｐ２の差分を算出する工程と、
前記差分が、前記側壁の上面の幅の規定値の３５％より大きい場合を不合格とする判定工程と、
を備える発光装置の検査方法。 A step of preparing a light emitting device including a resin package having a side wall and a bottom surface and having a recess having an opening on the upper surface, and a light emitting element arranged in the recess.
The step of measuring the geometric center position P1 of the resin package and
The step of measuring the geometric center position P2 of the opening and
The step of calculating the difference between P 1 and P 2 and
When the difference is larger than 35% of the specified value of the width of the upper surface of the side wall, the determination step is rejected.
A method for inspecting a light emitting device. 前記発光装置を準備する工程は、前記発光装置の集合体を切断して得る工程を経て前記発光装置を得る工程を含む、請求項１記載の発光装置の検査方法。 The method for inspecting a light emitting device according to claim 1, wherein the step of preparing the light emitting device includes a step of obtaining the light emitting device through a step of cutting an aggregate of the light emitting devices to obtain the light emitting device. 前記樹脂パッケージは、上面視形状が四角形であり、前記開口部は、前記樹脂パッケージの上面視形状と相似形である、請求項１又は請求項２に記載の発光装置の検査方法。 The method for inspecting a light emitting device according to claim 1 or 2, wherein the resin package has a rectangular top view shape, and the opening has a shape similar to the top view shape of the resin package.
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JP2004157338A (en) 2002-11-06 2004-06-03 Sony Corp Electronic imaging apparatus
JP2008153553A (en) 2006-12-19 2008-07-03 Nichia Chem Ind Ltd Light-emitting device and method of manufacturing same
JP2012028686A (en) 2010-07-27 2012-02-09 Nitto Denko Corp Light emitting apparatus inspection method, and light emitting apparatus processing method after inspection
US20160197044A1 (en) 2013-09-23 2016-07-07 Osram Opto Semiconductors Gmbh Method and apparatus that processes an optoelectronic component

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Publication number Priority date Publication date Assignee Title
JP2004157338A (en) 2002-11-06 2004-06-03 Sony Corp Electronic imaging apparatus
JP2008153553A (en) 2006-12-19 2008-07-03 Nichia Chem Ind Ltd Light-emitting device and method of manufacturing same
JP2012028686A (en) 2010-07-27 2012-02-09 Nitto Denko Corp Light emitting apparatus inspection method, and light emitting apparatus processing method after inspection
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