JP6975417B2 - 成膜用霧化装置およびこれを用いた成膜装置 - Google Patents
成膜用霧化装置およびこれを用いた成膜装置 Download PDFInfo
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- 230000015572 biosynthetic process Effects 0.000 title claims description 34
- 238000000889 atomisation Methods 0.000 title description 5
- 239000002994 raw material Substances 0.000 claims description 65
- 239000003595 mist Substances 0.000 claims description 35
- 239000007788 liquid Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 21
- 230000001902 propagating effect Effects 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000010408 film Substances 0.000 description 130
- 239000002245 particle Substances 0.000 description 31
- 239000000243 solution Substances 0.000 description 27
- 239000000203 mixture Substances 0.000 description 16
- 239000012159 carrier gas Substances 0.000 description 14
- 239000000446 fuel Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 229910001873 dinitrogen Inorganic materials 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 239000010453 quartz Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 5
- 238000002441 X-ray diffraction Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001195 gallium oxide Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZVYYAYJIGYODSD-LNTINUHCSA-K (z)-4-bis[[(z)-4-oxopent-2-en-2-yl]oxy]gallanyloxypent-3-en-2-one Chemical compound [Ga+3].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O ZVYYAYJIGYODSD-LNTINUHCSA-K 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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Description
図1に、本発明に係る成膜用霧化装置100を示す。成膜用霧化装置100は、原料溶液114を収容する原料容器111と、原料容器111の内部と外部を空間的に接続し、且つその下端が原料容器111内において原料溶液114の液面に触れないように設置された筒状部材113と、超音波を照射する超音波発生源(超音波振動板)121を一つ以上有する超音波発生器120と、超音波を原料溶液114に中間液123を介して伝播させる液槽122とを具備する。
本発明は、さらに図1および図2で説明した成膜用霧化装置を用いた成膜装置を提供する。
図1および図2に示した成膜用霧化装置と、図3に示した成膜装置を用いて、α−酸化ガリウムの成膜を行った。
窒素ガス流量を10L/minとした以外は実施例1と同様に成膜を行った。
成膜装置に図4で示した成膜装置を用いた他は、実施例1と同様の装置および原料溶液を使用してα−酸化ガリウムの成膜を行った。ミスト吐出ノズルには石英製のものを使用した。サセプターにはアルミ製ホットプレートを使用し、基板を450℃に加熱した。次にサセプターを10mm/sの速度でミスト吐出ノズルの下を水平方向に往復駆動させ、さらにミスト吐出ノズルからサセプター上の基板へ混合気を5L/min供給して60分間成膜を行った。
超音波を、筒状部材の側壁に向けて照射した他は、実施例1と同様に成膜を行った。
超音波を、筒状部材の側壁に向けて照射した他は、実施例2と同様に成膜を行った。
成膜時間、すなわち、成膜室にミストと窒素ガスの混合気を供給する時間を120分間としたこと以外は実施例1と同じ条件で成膜を行い、膜厚1μm以上の半導体膜の成膜を行った。そして、成膜して得た膜の表面のパーティクル(直径0.3μm以上)密度を、基板検査機(KLA candela−CS10)で評価した。
成膜時間を120分間としたこと以外は実施例2と同条件で成膜し、実施例4と同条件で評価を行った。
成膜時間を120分間としたこと以外は実施例3と同条件で成膜し、実施例4と同条件で評価を行った。
成膜時間を120分間としたこと以外は比較例1と同条件で成膜し、実施例4と同条件で評価を行った。
成膜時間を120分間としたこと以外は比較例2と同条件で成膜し、実施例4と同条件で評価を行った。
113…筒状部材、 114…原料溶液、 120…超音波発生器、
121…超音波発生源、 121a…角度調節機構、 122…液槽、
123…中間液、 131…キャリアガス、 132…ミスト、 133…混合気、
211…原料容器、 213…筒状部材、 214…原料溶液、 214p…液柱、
221…超音波発生源、 221a…角度調節機構、
300…成膜装置、 311…キャリアガス供給部、 313、324…配管、
320…霧化手段(成膜用霧化装置)、 321…原料溶液、 322…ミスト、
330…成膜手段、 331…成膜室、 332…サセプター、 333…加熱手段、
334…基体、 340…排気手段、 351…キャリアガス、 352…混合気、
400…成膜装置、 422…ミスト、 430…成膜手段、 431…ノズル、
432…サセプター、 433…加熱手段、 434…基体、 435…排気手段、
452…混合気。
Claims (4)
- 原料溶液を収容する原料容器と、前記原料容器の内部と外部を空間的に接続し、且つその下端が前記原料容器内において前記原料溶液の液面に触れないように設置された筒状部材と、超音波を照射する超音波発生源を一つ以上有する超音波発生器と、前記超音波を前記原料溶液に中間液を介して伝播させる液槽とを有する成膜用霧化装置であって、
前記超音波発生源は、前記液槽の外側にあり、
前記超音波発生源の中心が前記原料容器の側壁の内側の延長がなす面と前記筒状部材の側壁の外側の延長がなす面との間にあり、
前記超音波発生源の超音波射出面の中心線をuとしたとき、前記中心線uが前記筒状部材の側壁と交わらず、且つ前記原料容器の側壁に交わるように超音波発生源が設けられていることを特徴とする成膜用霧化装置。 - 前記超音波発生源は、前記中心線uと前記筒状部材の中心を通る線cが任意の点で交わるように設けられているか、又は、前記中心線uが前記筒状部材の中心を通る線cに対してねじれの位置にあるように設けられていることを特徴とする請求項1に記載の成膜用霧化装置。
- 前記超音波発生源の中心を通り、前記筒状部材の外壁と平行な直線と前記筒状部材の外壁との距離dが、5mm以上となるように超音波発生源が設けられていることを特徴とする請求項1又は請求項2に記載の成膜用霧化装置。
- 原料溶液を霧化して原料ミストを形成する霧化手段と、前記ミストを基体に供給して前記基体上に膜を形成する成膜手段とを少なくとも具備する成膜装置であって、
前記霧化手段が請求項1から請求項3のいずれか一項に記載の霧化装置であることを特徴とする成膜装置。
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