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JP6968015B2 - Manufacturing method of in-vehicle lamps and in-vehicle lamps - Google Patents

Manufacturing method of in-vehicle lamps and in-vehicle lamps Download PDF

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JP6968015B2
JP6968015B2 JP2018054499A JP2018054499A JP6968015B2 JP 6968015 B2 JP6968015 B2 JP 6968015B2 JP 2018054499 A JP2018054499 A JP 2018054499A JP 2018054499 A JP2018054499 A JP 2018054499A JP 6968015 B2 JP6968015 B2 JP 6968015B2
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substrate
positioning
fixing member
vehicle
light source
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JP2019169278A (en
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崇文 森原
孝 大澤
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Mitsubishi Electric Corp
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Description

この発明は、車載用灯具及び車載用灯具の製造方法に関するものである。 The present invention relates to an in-vehicle lamp and a method for manufacturing an in-vehicle lamp.

昨今、前照灯、車幅灯及び尾灯等の車載用灯具の光源には、従来のタングステンフィラメントの電球及びアーク放電による放電灯に代替して、発光ダイオード(LED)及びレーザダイオード(LD)等の半導体光源が普及してきた。当半導体光源は、長寿命であり、かつ、少ない電力で必要な明るさを確保できるうえに、一定の電流を供給する簡単な制御によって安定した明るさを発することができるため、車載用灯具の光源として好適な光源である。 In recent years, light emitting diodes (LEDs), laser diodes (LDs), etc. have been used as light sources for in-vehicle lighting equipment such as headlights, side lights, and taillights, in place of conventional tungsten filament bulbs and discharge lamps by arc discharge. Semiconductor light sources have become widespread. This semiconductor light source has a long life, can secure the required brightness with a small amount of electric power, and can emit stable brightness by simple control to supply a constant current. It is a suitable light source as a light source.

また、上記半導体光源の発光部は、上記タングステンフィラメントに対して小さいため、上記半導体光源を用いる車載用灯具を、小形に構成することができる。そのため、車体デザインの自由度が増して、ユーザの嗜好に沿った好ましいデザインの車体が実現しやすい。 Further, since the light emitting portion of the semiconductor light source is smaller than the tungsten filament, the in-vehicle lamp using the semiconductor light source can be configured in a small size. Therefore, the degree of freedom in vehicle body design is increased, and it is easy to realize a vehicle body having a preferable design according to the user's preference.

なお、光源が小形になったことによって車載用灯具のレンズ及び反射鏡等の光学部材が小形になると、光源の位置ずれが光学系に及ぼす影響が大きくなる。そのため、光源の小さな位置ずれによって、車載用灯具として必要な明るさ及び配光を確保できないことがある。つまり、発光部が小さな半導体光源を光源として用いる車載用灯具においては、半導体光源を精度よく固定する必要がある。特に小形の車載用灯具においては、さらに高精度に半導体光源を固定することが要求される。 When the optical member such as the lens and the reflector of the in-vehicle lamp becomes smaller due to the smaller light source, the influence of the misalignment of the light source on the optical system becomes large. Therefore, it may not be possible to secure the brightness and light distribution required for an in-vehicle lamp due to a small misalignment of the light source. That is, in an in-vehicle lamp that uses a semiconductor light source having a small light emitting unit as a light source, it is necessary to fix the semiconductor light source with high accuracy. In particular, for small in-vehicle lamps, it is required to fix the semiconductor light source with higher accuracy.

例えば、特許文献1に係る光源モジュールは、LEDパッケージを搭載したモジュール基板をネジによりランプユニットの台座に固定支持する構成である。モジュール基板の支持バネ板は、ネジを台座のネジ穴に螺合したときにモジュール基板を台座の基準ピンに当接させる。この支持バネ板により、ネジ穴の公差にかかわらず、高い位置精度で光源モジュールを組み立てることができる。 For example, the light source module according to Patent Document 1 has a configuration in which a module substrate on which an LED package is mounted is fixedly supported on a pedestal of a lamp unit by screws. The support spring plate of the module board brings the module board into contact with the reference pin of the pedestal when the screw is screwed into the screw hole of the pedestal. This support spring plate allows the light source module to be assembled with high position accuracy regardless of the tolerance of the screw holes.

特開2010−20917号公報Japanese Unexamined Patent Publication No. 2010-20917

特許文献1に記載された構成は、ネジ穴の公差に起因した光源の位置ずれを回避できるが、支持バネ板等の追加部品を配置する空間の確保が必要となり、小形の車載用灯具を実現するための障害になるという課題があった。 The configuration described in Patent Document 1 can avoid the misalignment of the light source due to the tolerance of the screw hole, but it is necessary to secure a space for arranging additional parts such as a support spring plate, and a small in-vehicle lamp is realized. There was a problem that it became an obstacle to doing so.

この発明は、上記のような課題を解決するためになされたもので、追加部品を用いずに半導体光源を高精度に位置決めすることを目的とする。 The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to position a semiconductor light source with high accuracy without using additional parts.

この発明に係る車載用灯具は、半導体光源と、表面に半導体光源が実装され、端面に複数の位置決め用凹部が形成されている基板と、半導体光源が発する光を車両の前方へ導く光学部材と、基板の位置決め用凹部に当接する位置決め用凸部を有し、基板と光学部材とが固定された固定部材とを備える車載用灯具であって、基板が固定部材に固定される前の、基板の複数の位置決め用凹部の当接部を直線でつないでできる多角形が、固定部材の複数の位置決め用凸部の当接部を直線でつないでできる多角形より大きいものである。 The in-vehicle lighting equipment according to the present invention includes a semiconductor light source, a substrate on which a semiconductor light source is mounted on the surface and a plurality of positioning recesses are formed on the end faces, and an optical member that guides the light emitted by the semiconductor light source to the front of the vehicle. An in-vehicle lighting tool having a positioning convex portion that abuts on a positioning concave portion of a substrate and having a fixing member to which the substrate and an optical member are fixed, and is a substrate before the substrate is fixed to the fixing member. The polygon formed by connecting the contact portions of the plurality of positioning recesses of the above with a straight line is larger than the polygon formed by connecting the contact portions of the plurality of positioning protrusions of the fixing member with a straight line.

この発明によれば、基板が固定部材に固定される前の、基板の複数の位置決め用凹部の当接部を直線でつないでできる多角形が、固定部材の複数の位置決め用凸部の当接部を直線でつないでできる多角形より大きいので、追加部品を用いずに半導体光源を高精度に位置決めすることができる。 According to the present invention, a polygon formed by connecting abutting portions of a plurality of positioning recesses of a substrate with a straight line before the substrate is fixed to the fixing member is a contact of a plurality of positioning convex portions of the fixing member. Since it is larger than a polygon formed by connecting parts with a straight line, the semiconductor light source can be positioned with high accuracy without using additional parts.

実施の形態1に係る前照灯の車両設置例を示す図である。It is a figure which shows the vehicle installation example of the headlight which concerns on Embodiment 1. FIG. 実施の形態1に係るすれ違い灯用ユニットの構成例を示す模式図である。It is a schematic diagram which shows the structural example of the passing lamp unit which concerns on Embodiment 1. FIG. 実施の形態1に係る走行灯用ユニットの構成例を示す側面図である。It is a side view which shows the structural example of the traveling light unit which concerns on Embodiment 1. FIG. 実施の形態1における基板の構成例を示す平面図である。It is a top view which shows the structural example of the substrate in Embodiment 1. FIG. 実施の形態1における基板の別の構成例を示す平面図である。It is a top view which shows another structural example of the substrate in Embodiment 1. FIG. 実施の形態1におけるLEDの構成例を示す断面図である。It is sectional drawing which shows the structural example of the LED in Embodiment 1. FIG. 実施の形態1における基板の加工例を説明する斜視図である。It is a perspective view explaining the processing example of the substrate in Embodiment 1. FIG. 実施の形態1において基板が固定部材に固定される手順を説明する斜視図である。It is a perspective view explaining the procedure of fixing a substrate to a fixing member in Embodiment 1. FIG. 実施の形態1において基板が固定部材に固定される手順を説明する側面図であり、図9Aは基板が押し込まれる前、図9Bは押し込まれた後の状態である。FIG. 9A is a side view illustrating a procedure for fixing the substrate to the fixing member in the first embodiment, FIG. 9A is a state before the substrate is pushed in, and FIG. 9B is a state after being pushed in. 実施の形態1において基板が固定部材に固定される手順を説明する斜視図である。It is a perspective view explaining the procedure of fixing a substrate to a fixing member in Embodiment 1. FIG. 図11Aは、実施の形態1における固定部材の変形例を示す側面図であり、図11Bは、図11Aにおいて破線で囲まれた部分の拡大図である。11A is a side view showing a modified example of the fixing member according to the first embodiment, and FIG. 11B is an enlarged view of a portion surrounded by a broken line in FIG. 11A. 実施の形態1における基板の変形例を示す平面図である。It is a top view which shows the modification of the substrate in Embodiment 1. FIG.

実施の形態1.
図1は、実施の形態1に係る前照灯1の車両設置例を示す図である。前照灯1は、車体前部の左側及び右側に1つずつ設置され、車両の前方を照らす。図1においては右側に設置された前照灯1を示す。図1の例では、前照灯1は、ロービームを照射するすれ違い灯用ユニット2と、ハイビームを照射する走行灯用ユニット3とを備える。すれ違い灯用ユニット2及び走行灯用ユニット3を含む前照灯1は、車載用灯具のひとつである。
Embodiment 1.
FIG. 1 is a diagram showing a vehicle installation example of the headlight 1 according to the first embodiment. One headlight 1 is installed on the left side and one on the right side of the front part of the vehicle body to illuminate the front of the vehicle. FIG. 1 shows the headlight 1 installed on the right side. In the example of FIG. 1, the headlight 1 includes a passing light unit 2 that irradiates a low beam and a traveling light unit 3 that irradiates a high beam. The headlight 1 including the passing light unit 2 and the traveling light unit 3 is one of the in-vehicle lighting tools.

図2は、実施の形態1に係るすれ違い灯用ユニット2の構成例を示す模式図である。図2では、外殻部材17の一部が切断され、すれ違い灯用ユニット2の内部構成が模式的に図示されている。紙面左側が車両前方、紙面右側が車両後方である。すれ違い灯用ユニット2は、光源であるLED11、基板12、光学部材13、固定部材16、外殻部材17、及びLED点灯装置20を備える。基板12の表面には、LED11が実装される。基板12の裏面は、固定部材16に固定される。光学部材13は、配光部材14及び投影レンズ15を含み、LED11が発する光を車両の前方へ導く。配光部材14は、LED11が発する光をすれ違い灯用の配光に形成する。投影レンズ15は、配光部材14により形成されたすれ違い灯用の光を、車両の前方へ照射する凸レンズである。固定部材16は、LED11の前方において配光部材14を固定し、配光部材14の前方において投影レンズ15を固定する。また、この固定部材16は、LED11が発する熱を後方に伝え放熱するヒートシンクとしても機能する。外殻部材17は、前面レンズ18及びケース19により構成され、LED11、基板12、光学部材13、及び固定部材16を収容する。外殻部材17の底面には、LED11の点灯を制御するLED点灯装置20が固定される。 FIG. 2 is a schematic diagram showing a configuration example of the passing lamp unit 2 according to the first embodiment. In FIG. 2, a part of the outer shell member 17 is cut off, and the internal configuration of the passing lamp unit 2 is schematically shown. The left side of the page is the front of the vehicle, and the right side of the page is the rear of the vehicle. The passing lamp unit 2 includes an LED 11, a substrate 12, an optical member 13, a fixing member 16, an outer shell member 17, and an LED lighting device 20, which are light sources. The LED 11 is mounted on the surface of the substrate 12. The back surface of the substrate 12 is fixed to the fixing member 16. The optical member 13 includes a light distribution member 14 and a projection lens 15, and guides the light emitted by the LED 11 to the front of the vehicle. The light distribution member 14 forms the light emitted by the LED 11 into a light distribution for a passing lamp. The projection lens 15 is a convex lens that irradiates the light for a passing lamp formed by the light distribution member 14 toward the front of the vehicle. The fixing member 16 fixes the light distribution member 14 in front of the LED 11, and fixes the projection lens 15 in front of the light distribution member 14. Further, the fixing member 16 also functions as a heat sink that transfers heat generated by the LED 11 to the rear and dissipates heat. The outer shell member 17 is composed of a front lens 18 and a case 19, and houses an LED 11, a substrate 12, an optical member 13, and a fixing member 16. An LED lighting device 20 that controls lighting of the LED 11 is fixed to the bottom surface of the outer shell member 17.

図3は、実施の形態1に係る走行灯用ユニット3の構成例を示す図である。走行灯用ユニット3は、基本的に、すれ違い灯用ユニット2と同じ構成であり、LED11、基板12、光学部材13、固定部材16、外殻部材17、及びLED点灯装置20を備える。ただし、走行灯用ユニット3の光学部材13には、すれ違い灯用に必要な配光を形成する配光部材14はない。 FIG. 3 is a diagram showing a configuration example of the traveling light unit 3 according to the first embodiment. The traveling light unit 3 has basically the same configuration as the passing light unit 2, and includes an LED 11, a substrate 12, an optical member 13, a fixing member 16, an outer shell member 17, and an LED lighting device 20. However, the optical member 13 of the traveling light unit 3 does not have the light distribution member 14 that forms the light distribution required for the passing light.

なお、すれ違い灯用ユニット2及び走行灯用ユニット3の光源は、半導体光源であればよく、発光ダイオード(LED)に限らずレーザダイオード(LD)等であってもよい。 The light source of the passing light unit 2 and the traveling light unit 3 may be a semiconductor light source, and may be a laser diode (LD) or the like as well as a light emitting diode (LED).

図4は、実施の形態1における基板12の構成例を示す平面図である。基板12は、一般的なガラスエポキシ基板及びセラミック基板に比べて、熱伝導性が高く、かつ柔らかいアルミニウムを基材とした基板であることが望ましい。基板12の表面にはLED11がはんだ付けされている。基板12の端面には、基板12を固定部材16に位置決めするための、円弧状の位置決め用凹部12a,12b,12cが形成されている。図4の例では、基板12の位置決め用凹部12a,12b,12cは、位置決め用凹部12aの当接部と位置決め用凹部12bの当接部と位置決め用凹部12cの当接部とを直線でつないでできる三角形が位置決め用凹部12aの当接部を頂点とする二等辺三角形101になるように、配置されている。また、LED11は、LED11と位置決め用凹部12a,12b,12cが定められた位置関係になるよう、配置されている。例えば、二等辺三角形101の重心、内心、又は外心等に相当する位置にLED11が配置される。なお、位置決め用凹部の数及び位置は任意でよく、各位置決め用凹部の当接部をつないでできる多角形の形状も任意でよいが、各位置決め用凹部間の距離が略均等で、形成される多角形の面積が大きいほど、基板12は固定部材16に安定して固定される。 FIG. 4 is a plan view showing a configuration example of the substrate 12 according to the first embodiment. It is desirable that the substrate 12 is a substrate made of aluminum, which has higher thermal conductivity and is softer than a general glass epoxy substrate and a ceramic substrate. The LED 11 is soldered to the surface of the substrate 12. On the end surface of the substrate 12, arc-shaped positioning recesses 12a, 12b, 12c for positioning the substrate 12 on the fixing member 16 are formed. In the example of FIG. 4, the positioning recesses 12a, 12b, 12c of the substrate 12 connect the contact portion of the positioning recess 12a, the contact portion of the positioning recess 12b, and the contact portion of the positioning recess 12c with a straight line. The triangle formed by the above is arranged so as to be an isosceles triangle 101 having the abutting portion of the positioning recess 12a as an apex. Further, the LED 11 is arranged so that the LED 11 and the positioning recesses 12a, 12b, 12c have a defined positional relationship. For example, the LED 11 is arranged at a position corresponding to the center of gravity, the inner center, the outer center, or the like of the isosceles triangle 101. The number and position of the positioning recesses may be arbitrary, and the polygonal shape formed by connecting the contact portions of the positioning recesses may be arbitrary, but the distances between the positioning recesses are substantially uniform. The larger the area of the polygon, the more stably the substrate 12 is fixed to the fixing member 16.

また、図4の基板12には、基板12を固定部材16に固定するための固定用ビス23a,23bを貫通させる固定用穴12d,12eが2つ形成されている。固定用ビス23a,23bについては後述する。さらに、図4の基板12には、位置決め用凹部12aの近傍に丸穴形状の変形部12fが形成されている。変形部12fは、穴、切り欠き、溝、又は基板12の厚さを薄くした形状等である。従って、基板12において変形部12fが形成された部位は、基板12の他の部位に比べて変形しやすい。なお、変形部12fが近傍に形成された位置決め用凹部12aは「第1位置決め用凹部」に相当し、位置決め用凹部12aに当接する位置決め用凸部16aは「第1位置決め用凸部」に相当する。 Further, the substrate 12 of FIG. 4 is formed with two fixing holes 12d and 12e through which the fixing screws 23a and 23b for fixing the substrate 12 to the fixing member 16 pass through. The fixing screws 23a and 23b will be described later. Further, on the substrate 12 of FIG. 4, a round hole-shaped deformed portion 12f is formed in the vicinity of the positioning recess 12a. The deformed portion 12f has a hole, a notch, a groove, a shape in which the thickness of the substrate 12 is reduced, or the like. Therefore, the portion of the substrate 12 on which the deformed portion 12f is formed is more likely to be deformed than the other portions of the substrate 12. The positioning concave portion 12a formed in the vicinity of the deformed portion 12f corresponds to the "first positioning concave portion", and the positioning convex portion 16a abutting on the positioning concave portion 12a corresponds to the "first positioning convex portion". do.

図5は、実施の形態1における基板12の別の構成例を示す平面図である。図5の例では、基板12の位置決め用凹部12a,12b,12cは、位置決め用凹部12aの当接部と位置決め用凹部12bの当接部と位置決め用凹部12cの当接部とをつないでできる三角形が正三角形101aになるように、配置されている。また、変形部12fは、切り欠きである。 FIG. 5 is a plan view showing another configuration example of the substrate 12 in the first embodiment. In the example of FIG. 5, the positioning recesses 12a, 12b, 12c of the substrate 12 can be formed by connecting the contact portion of the positioning recess 12a, the contact portion of the positioning recess 12b, and the contact portion of the positioning recess 12c. The triangles are arranged so as to be an equilateral triangle 101a. Further, the deformed portion 12f is a notch.

図6は、実施の形態1におけるLED11の構成例を示す断面図である。図6のLED11は、基台11a、青色を発光する青色発光LED11b、及び黄色を発光する黄色発光蛍光体11cにより構成され、はんだ21によって基台11aが基板12の表面に実装されて固定される。このLED11は、基台11aに設置された青色発光LED11bが発する青色光と、青色光に励起された黄色発光蛍光体11cが発する黄色光とが混合された白色光を発する。なお、一般的な表面実装方法においては、ペースト状のはんだ21を使用してLED11を基板12の表面に実装する都合上、加熱して溶融したはんだ21の上にLED11を浮かせ、その後、冷却してはんだ21を凝固してLED11を固定、即ち実装する工程が存在する。この工程において、溶融したはんだ21に浮くLED11を支持しながらはんだ21を凝固することが困難である。そのため、LED11の実装位置ははんだ21の固まり具合に任せざるを得ない。つまり、表面実装タイプのLED11を基板12に対して精度よく実装することが困難であることは否めない。従って、はんだ21が凝固するときにLED11がずれて実装されることを考慮して、実際に実装されたLED11の位置を基準にして、基板12を固定部材16に固定することが望ましい。 FIG. 6 is a cross-sectional view showing a configuration example of the LED 11 according to the first embodiment. The LED 11 of FIG. 6 is composed of a base 11a, a blue light emitting LED 11b that emits blue light, and a yellow light emitting phosphor 11c that emits yellow light, and the base 11a is mounted and fixed on the surface of the substrate 12 by solder 21. .. The LED 11 emits white light in which the blue light emitted by the blue light emitting LED 11b installed on the base 11a and the yellow light emitted by the yellow light emitting phosphor 11c excited by the blue light are mixed. In a general surface mounting method, for the convenience of mounting the LED 11 on the surface of the substrate 12 using the paste-like solder 21, the LED 11 is floated on the heated and melted solder 21 and then cooled. There is a step of solidifying the solder 21 and fixing the LED 11, that is, mounting it. In this step, it is difficult to solidify the solder 21 while supporting the LED 11 floating on the molten solder 21. Therefore, the mounting position of the LED 11 must be left to the degree of solidification of the solder 21. That is, it is undeniable that it is difficult to accurately mount the surface mount type LED 11 on the substrate 12. Therefore, considering that the LED 11 is displaced and mounted when the solder 21 solidifies, it is desirable to fix the substrate 12 to the fixing member 16 with reference to the position of the actually mounted LED 11.

換言すれば、実装位置が不定なLED11を固定部材16の所定の位置に配置するために、基板12の端面に設ける位置決め用凹部12a,12b,12cの位置を、実際に基板12の表面に実装されたLED11の位置を基準にして決定することが望ましい。図6に示される構成のLED11において、位置決め用凹部12a,12b,12cの位置は、LED11の外形11dの位置を基準にして決定されてもよいし、LED11の発光部11eの位置を基準にして決定されてもよい。例えば、位置決め用凹部12a,12b,12cの位置を、LED11の発光部11eの位置が重心になる二等辺三角形101の3つの頂点に位置するように、決定してもよい。 In other words, in order to arrange the LED 11 whose mounting position is indefinite at a predetermined position of the fixing member 16, the positions of the positioning recesses 12a, 12b, 12c provided on the end face of the board 12 are actually mounted on the surface of the board 12. It is desirable to determine based on the position of the LED 11. In the LED 11 having the configuration shown in FIG. 6, the positions of the positioning recesses 12a, 12b, and 12c may be determined with reference to the position of the outer shape 11d of the LED 11 or with reference to the position of the light emitting portion 11e of the LED 11. It may be decided. For example, the positions of the positioning recesses 12a, 12b, and 12c may be determined so as to be located at the three vertices of the isosceles triangle 101 where the position of the light emitting portion 11e of the LED 11 is the center of gravity.

LED11の外形11dの位置は、カメラを用いた画像認識等により、容易に特定できる。一方、LED11の表面に設けられた黄色発光蛍光体11cは、青色光を発する青色発光LED11bより大きく、かつ青色発光LED11bを覆い隠すため、外見では青色発光LED11bの位置、つまり実際に発光する発光部11eの位置を特定することは困難である。対策として、LED11を点灯することによって、黄色発光蛍光体11cに隠れた実際に光っている青色発光LED11bの位置を特定する。LED11が点灯すれば、青色発光LED11bの発光部は、黄色発光蛍光体11cの中に明部として現れるため、簡素な光学式センサにより容易に青色発光LED11bの位置を特定できる。 The position of the outer shape 11d of the LED 11 can be easily specified by image recognition using a camera or the like. On the other hand, the yellow light emitting phosphor 11c provided on the surface of the LED 11 is larger than the blue light emitting LED 11b that emits blue light and covers the blue light emitting LED 11b. It is difficult to identify the position of 11e. As a countermeasure, by turning on the LED 11, the position of the actually shining blue light emitting LED 11b hidden in the yellow light emitting phosphor 11c is specified. When the LED 11 is turned on, the light emitting portion of the blue light emitting LED 11b appears as a bright part in the yellow light emitting phosphor 11c, so that the position of the blue light emitting LED 11b can be easily specified by a simple optical sensor.

図7は、実施の形態1における基板12の加工例を説明する斜視図である。図7の例では、基板12の端面が、回転方向31の方向に回転する回転刃物30によって切削され、位置決め用凹部12a,12b,12cが形成される。位置決め用凹部12a,12b,12cの切削加工位置は、上述したように、LED11の実装位置を基準にした位置に決定される。 FIG. 7 is a perspective view illustrating a processing example of the substrate 12 according to the first embodiment. In the example of FIG. 7, the end face of the substrate 12 is cut by the rotary cutting tool 30 that rotates in the direction of rotation 31, and the positioning recesses 12a, 12b, and 12c are formed. As described above, the cutting positions of the positioning recesses 12a, 12b, and 12c are determined to be positions based on the mounting position of the LED 11.

図7に示される回転刃物30の周面には、軸方向に渡る切削歯が複数形成されており、回転することによって、基板12の端面が切削され、位置決め用凹部12a,12b,12cが形成される。なお、LED11の表面実装時の位置ずれは1mmに満たない小さなものであり、実際に当LED11の位置ずれを相殺するために行う基板12の切削加工量は少ないので、切削歯への負担は少ない。また、回転刃物30が基板12の端面を切削加工する際、切削歯の使用部位を軸方向に順次変えることで、1本の回転刃物30で多くの基板12を切削加工することができ、メンテナンス費用を削減できる。ちなみに、回転刃物30にて切削する工法に代えて、ドリルにて位置決め用凹部12a,12b,12cを穿孔する工法を採用してもよい。ただし、ドリルを用いる場合、LED11の位置ずれの有無又は位置ずれの大小にかかわらず常に同じ大きさの穴を穿孔することとなるため、回転刃物30にて基板12の端面を切削する工法に比べて、必然的に切削量が多く、基板12を穿孔する切削歯は先端部だけであり、切削歯への負担は多い。従って、1本のドリルで加工できる基板12の数は、1本の回転刃物30で加工できる基板12の数より少ない。また、回転刃物30及びドリルのような加工用の刃物は切削力が低下すると交換せざるを得ないため、回転刃物30に比べてドリルの方が交換頻度が高い。以上より、ドリルによる加工に比べて回転刃物30による加工の方がメンテナンス費用が安い。 A plurality of cutting teeth extending in the axial direction are formed on the peripheral surface of the rotary cutting tool 30 shown in FIG. 7, and the end surface of the substrate 12 is cut by rotation to form positioning recesses 12a, 12b, 12c. Will be done. The displacement of the LED 11 when mounted on the surface is small, less than 1 mm, and the amount of cutting of the substrate 12 actually performed to offset the displacement of the LED 11 is small, so that the burden on the cutting teeth is small. .. Further, when the rotary blade 30 cuts the end face of the substrate 12, many substrates 12 can be cut with one rotary blade 30 by sequentially changing the parts where the cutting teeth are used in the axial direction, and maintenance is possible. You can reduce costs. Incidentally, instead of the method of cutting with the rotary cutting tool 30, a method of drilling the positioning recesses 12a, 12b, 12c with a drill may be adopted. However, when a drill is used, holes of the same size are always drilled regardless of the presence or absence of misalignment of the LED 11 or the magnitude of the misalignment. Therefore, the amount of cutting is inevitably large, and the cutting tooth for drilling the substrate 12 is only the tip portion, which places a heavy burden on the cutting tooth. Therefore, the number of substrates 12 that can be machined with one drill is smaller than the number of substrates 12 that can be machined with one rotary cutting tool 30. Further, since the rotary blade 30 and the blade for machining such as a drill have to be replaced when the cutting force decreases, the drill has a higher replacement frequency than the rotary blade 30. From the above, the maintenance cost is cheaper in the machining with the rotary blade 30 than in the machining with the drill.

図8、図9、及び図10は、実施の形態1において基板12が固定部材16に固定される手順を説明する図である。図2又は図3に示される固定部材16のうちの一部が、図8、図9、及び図10に示されているものとする。 8, 9, and 10 are diagrams illustrating a procedure in which the substrate 12 is fixed to the fixing member 16 in the first embodiment. It is assumed that a part of the fixing member 16 shown in FIG. 2 or FIG. 3 is shown in FIGS. 8, 9, and 10.

固定部材16は、ヒートシンクとして機能するために、熱伝導性が高いアルミニウム等により構成されることが望ましい。図8の斜視図に示されるように、固定部材16の表面には、基板12の位置決め用凹部12aが当接するための位置決め用凸部16aと、位置決め用凹部12bが当接するための位置決め用凸部16bと、位置決め用凹部12cが当接するための位置決め用凸部16cとが形成されている。固定部材16の位置決め用凸部16a,16b,16cは、位置決め用凸部16aの当接部と位置決め用凸部16bの当接部と位置決め用凸部16cの当接部とを直線でつなぎ位置決め用凸部16aの当接部を頂点とする二等辺三角形102が、基板12の位置決め用凹部12aの当接部と位置決め用凹部12bの当接部と位置決め用凹部12cの当接部とを直線でつなぎ位置決め用凹部12aの当接部を頂点とする二等辺三角形101より小さくなるように配置されている。 In order to function as a heat sink, the fixing member 16 is preferably made of aluminum or the like having high thermal conductivity. As shown in the perspective view of FIG. 8, the surface of the fixing member 16 has a positioning convex portion 16a for contacting the positioning concave portion 12a of the substrate 12 and a positioning convex portion for contacting the positioning concave portion 12b. The portion 16b and the positioning convex portion 16c for abutting the positioning concave portion 12c are formed. The positioning convex portions 16a, 16b, 16c of the fixing member 16 are positioned by connecting the contact portion of the positioning convex portion 16a, the contact portion of the positioning convex portion 16b, and the contact portion of the positioning convex portion 16c with a straight line. The isosceles triangle 102 whose apex is the contact portion of the convex portion 16a is a straight line between the contact portion of the positioning recess 12a of the substrate 12, the contact portion of the positioning recess 12b, and the contact portion of the positioning recess 12c. It is arranged so as to be smaller than the isosceles triangle 101 whose apex is the abutting portion of the positioning recess 12a.

また、固定部材16と基板12の間には、放熱グリス等の、熱伝導性が高い放熱部材22が介在している。放熱部材22は、LED11が発する熱を、固定部材16に伝熱し放熱性を向上する。さらに、固定部材16には、基板12を固定部材16に固定するための固定用ビス23a,23bを螺合する固定用穴16d,16eが、2つ形成されている。 Further, a heat radiating member 22 having high thermal conductivity, such as heat radiating grease, is interposed between the fixing member 16 and the substrate 12. The heat radiating member 22 transfers the heat generated by the LED 11 to the fixing member 16 to improve the heat radiating property. Further, the fixing member 16 is formed with two fixing holes 16d and 16e for screwing the fixing screws 23a and 23b for fixing the substrate 12 to the fixing member 16.

図8に示されるように、基板12は、組み付け方向103へ組み付けられる。その際、図9Aの側面図に示されるように、先ず、基板12の位置決め用凹部12aが固定部材16の位置決め用凸部16aの先端側に当接された状態で、基板12の位置決め用凹部12b,12cが固定部材16の位置決め用凸部16b,16cの根元側へ組み付けられる。続いて、基板12の位置決め用凹部12aが、固定部材16の位置決め用凸部16aの周面に沿って押し込み方向104へ押し込まれる。基板12の位置決め用凹部12aと位置決め用凹部12bとの距離及び位置決め用凹部12aと位置決め用凹部12cとの距離よりも、固定部材16の位置決め用凸部16aと位置決め用凸部16bとの距離及び位置決め用凸部16aと位置決め用凸部16cとの距離の方が短い。そのため、基板12の位置決め用凹部12aが押し込み方向104へ押し込まれる際に、変形部12fが押し潰されて変形させられることによって、基板12が割れたり欠けたりすることなく位置決め用凹部12aを固定部材16の位置決め用凸部16aの根元部まで押し込み可能となると共に、押圧方向105の力が好適な大きさに調整される。また、基板12の位置決め用凹部12aが押し込み方向104へ押し込まれる際に、位置決め用凹部12b,12cが押圧方向105に押圧され固定部材16の位置決め用凸部16b,16cに押し付けられることによって、基板12の位置決め用凹部12b,12cが位置決めされる。 As shown in FIG. 8, the substrate 12 is assembled in the assembly direction 103. At that time, as shown in the side view of FIG. 9A, first, in a state where the positioning recess 12a of the substrate 12 is in contact with the tip end side of the positioning protrusion 16a of the fixing member 16, the positioning recess 12a of the substrate 12 is contacted. 12b and 12c are assembled to the root side of the positioning convex portion 16b and 16c of the fixing member 16. Subsequently, the positioning recess 12a of the substrate 12 is pushed in the pushing direction 104 along the peripheral surface of the positioning protrusion 16a of the fixing member 16. The distance between the positioning concave portion 12a and the positioning concave portion 12b of the substrate 12 and the distance between the positioning concave portion 12a and the positioning concave portion 12c, rather than the distance between the positioning convex portion 16a and the positioning convex portion 16b of the fixing member 16 and the distance between the positioning concave portions 16b. The distance between the positioning convex portion 16a and the positioning convex portion 16c is shorter. Therefore, when the positioning recess 12a of the substrate 12 is pushed in the pushing direction 104, the deformed portion 12f is crushed and deformed, so that the positioning recess 12a is fixed without cracking or chipping the substrate 12. The positioning convex portion 16a of 16 can be pushed to the root portion, and the force in the pressing direction 105 is adjusted to a suitable magnitude. Further, when the positioning recess 12a of the substrate 12 is pushed in the pushing direction 104, the positioning recesses 12b, 12c are pressed in the pressing direction 105 and pressed against the positioning protrusions 16b, 16c of the fixing member 16, whereby the substrate is pressed. The positioning recesses 12b and 12c of 12 are positioned.

なお、固定部材16の位置決め用凸部16a,16c,16bのうちの少なくとも1つは、先端部から根元部へ向かうにつれて外径が大きくなるテーパ形状であることが望ましい。図8、図9、及び図10の例では、位置決め用凸部16a,16b,16cのすべてがテーパ形状になっている。固定部材16の位置決め用凸部をテーパ状にすることで実質的な開口部が広がり、基板12を組み付けやすい。また、変形部12fが近傍に形成されている位置決め用凹部12aに対応する位置決め用凸部16aが、テーパ形状である場合、位置決め用凹部12aが押し込み方向104へ押し込まれる際に押圧方向105の力を基板12に加えることができるので、基板12の位置決め精度が向上する。なお、固定部材16の位置決め用凸部16a,16c,16bがテーパ形状である場合、基板12の位置決め用凹部12a,12b,12cのそれぞれの当接部をつないでできる二等辺三角形101は、完成状態において基板12のそれぞれの当接部が当接する位置決め用凸部16a,16c,16bの各部位をつないでできる二等辺三角形102より大きい。 It is desirable that at least one of the positioning convex portions 16a, 16c, 16b of the fixing member 16 has a tapered shape in which the outer diameter increases from the tip portion toward the root portion. In the examples of FIGS. 8, 9, and 10, all of the positioning protrusions 16a, 16b, and 16c have a tapered shape. By tapering the positioning convex portion of the fixing member 16, the substantially opening is widened, and the substrate 12 can be easily assembled. Further, when the positioning convex portion 16a corresponding to the positioning concave portion 12a formed in the vicinity of the deformed portion 12f has a tapered shape, the force in the pressing direction 105 when the positioning concave portion 12a is pushed in the pushing direction 104. Can be added to the substrate 12, so that the positioning accuracy of the substrate 12 is improved. When the positioning protrusions 16a, 16c, 16b of the fixing member 16 have a tapered shape, the isosceles triangle 101 formed by connecting the contact portions of the positioning recesses 12a, 12b, 12c of the substrate 12 is completed. It is larger than the isosceles triangle 102 formed by connecting the respective portions of the positioning protrusions 16a, 16c, and 16b to which the respective contact portions of the substrate 12 abut in the state.

基板12の位置決め用凹部12aが押し込み方向104へ押し込まれる際、位置決め用凹部12aが固定部材16の位置決め用凸部16aの周面に沿って根元部へ移動していくと、位置決め用凸部16aの表面を削る可能性があり、根元部には切削粉が落ちる可能性がある。切削粉等の異物が基板12と固定部材16との間に挟み込まれた場合、基板12が固定部材16から浮き上がり、LED11が投影レンズ15に接近して投影レンズ15の焦点との位置関係がずれることとなり、配光特性を損ねることになる。そのため、固定部材16の位置決め用凸部16aの根元部に、基板12が対面する固定部材16の表面より低い凹部が形成されていることが望ましい。 When the positioning recess 12a of the substrate 12 is pushed in the pushing direction 104, when the positioning recess 12a moves to the root portion along the peripheral surface of the positioning convex portion 16a of the fixing member 16, the positioning convex portion 16a There is a possibility of scraping the surface of the material, and cutting powder may fall on the root. When a foreign substance such as cutting powder is sandwiched between the substrate 12 and the fixing member 16, the substrate 12 floats from the fixing member 16, the LED 11 approaches the projection lens 15, and the positional relationship with the focal point of the projection lens 15 shifts. As a result, the light distribution characteristics are impaired. Therefore, it is desirable that a concave portion lower than the surface of the fixing member 16 facing the substrate 12 is formed at the base of the positioning convex portion 16a of the fixing member 16.

図11Aは、実施の形態1における固定部材16の変形例を示す側面図であり、図11Bは、図11Aにおいて破線で囲まれた部分の拡大図である。図11Aに示されるように、位置決め用凸部16aの根元部には、固定部材16の表面より低い凹部16fが形成されている。図11Bに示されるように、位置決め用凹部12aが押し込み方向104へ押し込まれる際に位置決め用凸部16aが削られて切削粉110が生じても、凹部16fに落ち、基板12と固定部材16との間に介在する放熱部材22に巻き込まれて固定される。そのため、たとえ切削粉110が生じたとしても、この切削粉110が障害を及ぼす異物になることはない。 11A is a side view showing a modified example of the fixing member 16 in the first embodiment, and FIG. 11B is an enlarged view of a portion surrounded by a broken line in FIG. 11A. As shown in FIG. 11A, a concave portion 16f lower than the surface of the fixing member 16 is formed at the base of the positioning convex portion 16a. As shown in FIG. 11B, even if the positioning convex portion 16a is scraped to generate cutting powder 110 when the positioning concave portion 12a is pushed in the pushing direction 104, the cutting powder 110 falls into the concave portion 16f, and the substrate 12 and the fixing member 16 It is caught and fixed by the heat radiating member 22 interposed between the two. Therefore, even if the cutting powder 110 is generated, the cutting powder 110 does not become a foreign substance that causes an obstacle.

また、固定部材16がダイキャストによって製造されたものである場合、固定部材16の表面と位置決め用凸部16a,16b,16cの各根元部との境界には、図11Bに示されるようなスロープ16gが形成される。基板12を固定部材16に組み付ける際、当スロープ16gの途中に基板12が係止されると、基板12が浮き上がった状態になる。基板12が固定部材16から浮き上がれば、上記と同様に、配光特性を損ねる。そのため、固定部材16がダイキャストによって製造される場合、基板12を沿わせて押し込む部位である位置決め用凸部16aの根元部だけでなく、位置決め用凸部16bの根元部及び位置決め用凸部16cの根元部にも凹部16fが形成されていることが望ましい。これにより、スロープ16gは、基板12が当接する部位より低い凹部16f内に形成されることになり、基板12の厚み方向の位置決めに悪い影響を及ぼすことなく、組み付けを阻害することはない。 Further, when the fixing member 16 is manufactured by die casting, a slope as shown in FIG. 11B is formed at the boundary between the surface of the fixing member 16 and the root portions of the positioning protrusions 16a, 16b, 16c. 16 g is formed. When the substrate 12 is assembled to the fixing member 16, if the substrate 12 is locked in the middle of the slope 16g, the substrate 12 is in a raised state. If the substrate 12 floats from the fixing member 16, the light distribution characteristics are impaired in the same manner as described above. Therefore, when the fixing member 16 is manufactured by die-casting, not only the root portion of the positioning convex portion 16a, which is a portion where the substrate 12 is pushed along, but also the root portion of the positioning convex portion 16b and the positioning convex portion 16c. It is desirable that the recess 16f is also formed at the base of the die. As a result, the slope 16g is formed in the recess 16f lower than the portion where the substrate 12 abuts, which does not adversely affect the positioning of the substrate 12 in the thickness direction and does not hinder the assembly.

図9Bに示されるように、基板12が固定部材16の位置決め用凸部16a,16b,16cの内側に押し込まれて基板12が固定部材16に対して位置決めされた後、図10の斜視図に示されるように、固定用ビス23a,23bによって基板12が固定部材16に固定される。固定用ビス23aは、固定用穴12d,16dに固定され、固定用ビス23bは、固定用穴12e,16eに固定される。なお、基板12の固定部材16への固定方法は、固定用ビス23a,23bを用いた締結方法以外の方法であってもよい。例えば、LED11を露出させる開口部が形成されたばね部材によって、基板12が固定部材16に押し付けられて固定されてもよい。 As shown in FIG. 9B, after the substrate 12 is pushed inside the positioning protrusions 16a, 16b, 16c of the fixing member 16 and the substrate 12 is positioned with respect to the fixing member 16, the perspective view of FIG. 10 is shown. As shown, the substrate 12 is fixed to the fixing member 16 by the fixing screws 23a and 23b. The fixing screw 23a is fixed to the fixing holes 12d and 16d, and the fixing screw 23b is fixed to the fixing holes 12e and 16e. The method of fixing the substrate 12 to the fixing member 16 may be a method other than the fastening method using the fixing screws 23a and 23b. For example, the substrate 12 may be pressed against the fixing member 16 by a spring member having an opening for exposing the LED 11.

なお、固定用ビス23a,23bによって基板12を固定部材16に直接締め付ける工法において、固定用ビス23a,23bの回転に引きずられて基板12が回転すると、LED11の位置がずれてしまう。そのため、基板12の回転を抑制することが望ましい。 In the method of directly tightening the substrate 12 to the fixing member 16 by the fixing screws 23a and 23b, if the substrate 12 is rotated by the rotation of the fixing screws 23a and 23b, the position of the LED 11 is displaced. Therefore, it is desirable to suppress the rotation of the substrate 12.

図12は、実施の形態1における基板12の変形例を示す平面図である。図12に示される基板12において、固定用ビス23aが固定用穴12d,16dに最初に締め付けられるものとする。固定用ビス23aが回転方向120の方向へ回転して締め付けられる場合、基板12には、固定用ビス23aの回転に引きずられて回転方向121のトルクが生じる。図12の例では、固定用ビス23aによる基板12の回転方向120の回転を止めるべく位置決め用凸部16cが配置され、固定用ビス23aと位置決め用凸部16cをつなぐ直線と、位置決め用凸部16aと位置決め用凸部16cをつなぐ直線が直交するように位置決め用凸部16aが配置されている。当位置決め用凸部16a,16cの配置により、基板12の位置決め用凹部12a,12cが固定部材16の位置決め用凸部16a,16cに当接することによって生じる位置決め用の押圧方向105に対する抗力の方向と、回転方向121のトルクに対する抗力122の方向が同一方向になり、基板12の位置決めを歪ませることなく回転が規制される。また、位置決め用凸部16c及び位置決め用凹部12cは、固定用ビス23aが締め付けられる固定用穴12d,16dからできるだけ遠い位置に配置されることで、固定用ビス23aが回転する時のトルクに対する抗力を小さくしている。 FIG. 12 is a plan view showing a modified example of the substrate 12 in the first embodiment. In the substrate 12 shown in FIG. 12, it is assumed that the fixing screw 23a is first tightened to the fixing holes 12d and 16d. When the fixing screw 23a is rotated and tightened in the direction of rotation 120, the substrate 12 is dragged by the rotation of the fixing screw 23a to generate torque in the rotation direction 121. In the example of FIG. 12, a positioning convex portion 16c is arranged to stop the rotation of the substrate 12 in the rotation direction 120 by the fixing screw 23a, a straight line connecting the fixing screw 23a and the positioning convex portion 16c, and a positioning convex portion. The positioning convex portion 16a is arranged so that the straight line connecting the 16a and the positioning convex portion 16c is orthogonal to each other. Due to the arrangement of the positioning convex portions 16a and 16c, the direction of the drag force against the positioning pressing direction 105 generated by the positioning concave portions 12a and 12c of the substrate 12 coming into contact with the positioning convex portions 16a and 16c of the fixing member 16. , The direction of the drag force 122 against the torque in the rotation direction 121 becomes the same direction, and the rotation is restricted without distorting the positioning of the substrate 12. Further, the positioning convex portion 16c and the positioning concave portion 12c are arranged at positions as far as possible from the fixing holes 12d and 16d to which the fixing screws 23a are tightened, so that the drag force against the torque when the fixing screws 23a rotates. Is made smaller.

以上のように、実施の形態1に係る前照灯1は、LED11と、基板12と、光学部材13と、固定部材16とを備える。基板12は、表面にLED11が実装され、端面に複数の位置決め用凹部12a,12b,12cが形成されている。光学部材13は、LED11が発する光を車両の前方へ導く。固定部材16は、基板12の複数の位置決め用凹部12a,12b,12cに当接して基板12を位置決めする複数の位置決め用凸部16a,16b,16cを有し、基板12と光学部材13とが固定される。この前照灯1において、基板12が固定部材16に固定される前の、基板12の複数の位置決め用凹部12a,12b,12cを直線でつないでできる多角形は、固定部材16の複数の位置決め用凸部16a,16b,16cを直線でつないでできる多角形より大きい。そのため、基板12が固定部材16に組み付けられる際、位置決め用凹部12a,12b,12cが位置決め用凸部16a,16b,16cに押圧されることによって、LED11が実装された基板12が、固定部材16に対して高精度に位置決めされる。この構成により、支持バネ板等の追加部品を用いずに、LED11が実装された基板12を高精度に位置決めすることができ、その結果、車両の前方に照射される光の配光及び明るさのばらつきを減らすことができ、高品質の車載用灯具を実現することができる。 As described above, the headlight 1 according to the first embodiment includes an LED 11, a substrate 12, an optical member 13, and a fixing member 16. The LED 11 is mounted on the surface of the substrate 12, and a plurality of positioning recesses 12a, 12b, 12c are formed on the end surface. The optical member 13 guides the light emitted by the LED 11 to the front of the vehicle. The fixing member 16 has a plurality of positioning protrusions 16a, 16b, 16c that abut on the plurality of positioning recesses 12a, 12b, 12c of the substrate 12 to position the substrate 12, and the substrate 12 and the optical member 13 are connected to each other. It is fixed. In this headlight 1, a polygon formed by connecting a plurality of positioning recesses 12a, 12b, 12c of the substrate 12 with a straight line before the substrate 12 is fixed to the fixing member 16 is a plurality of positioning of the fixing member 16. It is larger than a polygon formed by connecting the convex portions 16a, 16b, and 16c with a straight line. Therefore, when the substrate 12 is assembled to the fixing member 16, the positioning recesses 12a, 12b, 12c are pressed against the positioning protrusions 16a, 16b, 16c, so that the substrate 12 on which the LED 11 is mounted is the fixing member 16. It is positioned with high accuracy. With this configuration, the substrate 12 on which the LED 11 is mounted can be positioned with high accuracy without using additional parts such as a support spring plate, and as a result, the light distribution and brightness of the light emitted to the front of the vehicle can be achieved. It is possible to reduce the variation in the light intensity and realize high quality in-vehicle lighting equipment.

また、実施の形態1において、複数の位置決め用凸部16a,16b,16cのうちの少なくとも1つの根元部には、基板12が対面する固定部材16の面より低い凹部16fが形成される。これにより、LED11が実装された基板12の平面方向の位置ずれに加えて、基板12の厚み方向の位置ずれも抑制することができる。その結果、配光及び明るさのばらつきをさらに減らすことができ、さらに高品質の車載用灯具を実現することができる。 Further, in the first embodiment, a concave portion 16f lower than the surface of the fixing member 16 facing the substrate 12 is formed at the root portion of at least one of the plurality of positioning convex portions 16a, 16b, 16c. As a result, in addition to the positional deviation in the plane direction of the substrate 12 on which the LED 11 is mounted, the positional deviation in the thickness direction of the substrate 12 can be suppressed. As a result, variations in light distribution and brightness can be further reduced, and higher quality in-vehicle lamps can be realized.

また、実施の形態1において、基板12は、複数の位置決め用凹部12a,12b,12cのうちの1つの近傍に、基板12の他の部位より変形しやすい変形部12fを有する。基板12が固定部材16に組み付けられる際に変形部12fが変形することにより、基板12の端面が位置決め用凸部16b,16cに押圧される力を好適な大きさに調整することができる。 Further, in the first embodiment, the substrate 12 has a deformed portion 12f that is more easily deformed than other parts of the substrate 12 in the vicinity of one of the plurality of positioning recesses 12a, 12b, 12c. When the substrate 12 is assembled to the fixing member 16, the deformed portion 12f is deformed, so that the force with which the end face of the substrate 12 is pressed against the positioning convex portions 16b and 16c can be adjusted to a suitable magnitude.

また、実施の形態1において、固定部材16の複数の位置決め用凸部16a,16b,16cのうちの少なくとも1つは、先端部から根元部へ向かうにつれて外径が大きくなるテーパ形状である。これにより、位置決め用凸部16a,16b,16cの内側に基板12を組み付けやすくなる。また、基板12が、位置決め用凹部12aのテーパ形状の周面に沿って固定部材16側へ押し込まれることにより、基板12を位置決め用凸部16b,16cの方向にずらして押し当てる力を、基板12に加えることができ、基板12を精度よく位置決めできる。 Further, in the first embodiment, at least one of the plurality of positioning convex portions 16a, 16b, 16c of the fixing member 16 has a tapered shape in which the outer diameter increases from the tip portion toward the root portion. This makes it easier to assemble the substrate 12 inside the positioning protrusions 16a, 16b, 16c. Further, the substrate 12 is pushed toward the fixing member 16 along the peripheral surface of the tapered concave portion 12a, so that the substrate 12 is displaced in the direction of the positioning convex portions 16b and 16c and pressed against the substrate. It can be added to 12, and the substrate 12 can be positioned accurately.

また、実施の形態1において、基板12は、アルミニウムを基材にした基板である。熱伝導性が高いアルミニウムを基材に使用することで、LED11が発する熱を、ヒートシンクとして機能する固定部材16に伝熱し放熱する効果が高くなり、LED11の熱ストレスを軽減できる。また、アルミニウムの基板12は、ガラスエポキシ基板及びセラミック基板より粘り、かつ柔らかいため、位置決め用凹部12aを位置決め用凸部16aに沿わせながら基板12を固定部材16側へ押し込んでも、割れたり欠けたりせず、基板12の特性を損なうことがない。従って、車載用灯具の信頼性が向上する。 Further, in the first embodiment, the substrate 12 is a substrate based on aluminum. By using aluminum having high thermal conductivity as the base material, the effect of transferring the heat generated by the LED 11 to the fixing member 16 functioning as a heat sink and dissipating the heat is enhanced, and the thermal stress of the LED 11 can be reduced. Further, since the aluminum substrate 12 is more sticky and softer than the glass epoxy substrate and the ceramic substrate, even if the substrate 12 is pushed toward the fixing member 16 while the positioning recess 12a is along the positioning convex portion 16a, the substrate 12 may be cracked or chipped. It does not impair the characteristics of the substrate 12. Therefore, the reliability of the in-vehicle lamp is improved.

また、実施の形態1において、基板12の複数の位置決め用凹部12a,12b,12cは、それぞれ、LED11の実装位置を基準位置とした複数の位置に形成される。これにより、はんだ21が凝固するときにLED11がずれて固定されても、固定部材16に対してLED11を高精度に位置決めすることができる。その結果、配光及び明るさのばらつきをさらに減らすことができ、さらに高品質の車載用灯具を実現することができる。 Further, in the first embodiment, the plurality of positioning recesses 12a, 12b, 12c of the substrate 12 are formed at a plurality of positions with the mounting position of the LED 11 as a reference position, respectively. As a result, even if the LED 11 is displaced and fixed when the solder 21 solidifies, the LED 11 can be positioned with high accuracy with respect to the fixing member 16. As a result, variations in light distribution and brightness can be further reduced, and higher quality in-vehicle lamps can be realized.

また、実施の形態1において、基板12の複数の位置決め用凹部12a,12b,12cの基準位置となるLED11の実装位置は、LED11の発光部11eの位置である。これにより、はんだ21が凝固するときにLED11がずれて固定されても、固定部材16に対してLED11の実際に光る発光部11eを高精度に位置決めすることができる。その結果、配光及び明るさのばらつきをさらに減らすことができ、さらに高品質の車載用灯具を実現することができる。 Further, in the first embodiment, the mounting position of the LED 11 which is the reference position of the plurality of positioning recesses 12a, 12b, 12c of the substrate 12 is the position of the light emitting portion 11e of the LED 11. As a result, even if the LED 11 is displaced and fixed when the solder 21 solidifies, the actually shining light emitting portion 11e of the LED 11 can be positioned with high accuracy with respect to the fixing member 16. As a result, variations in light distribution and brightness can be further reduced, and higher quality in-vehicle lamps can be realized.

また、実施の形態1において、基板12の複数の位置決め用凹部12a,12b,12cは、基板12の端面を切削して形成される。回転刃物30を用いて基板12の端面を切削する工法は、ドリルを用いて基板12を穿孔する工法に比べて、工具のメンテナンス費用が安い。 Further, in the first embodiment, the plurality of positioning recesses 12a, 12b, 12c of the substrate 12 are formed by cutting the end face of the substrate 12. The method of cutting the end face of the substrate 12 using the rotary cutting tool 30 has a lower tool maintenance cost than the method of drilling the substrate 12 with a drill.

また、実施の形態1において、基板12の位置決め用凹部12aの近傍に、基板12の他の部位より変形しやすい変形部12fが形成される。そして、当基板12の位置決め用凹部12aが、固定部材16の位置決め用凸部16aの先端側に当接してから、基板12の変形部12fが変形させられながら固定部材16の位置決め用凸部16aの周面に沿って根元部に押し込まれる。これにより、基板12の位置決め用凹部12b,12cが固定部材16の位置決め用凸部16b,16cに押し付けられ、位置決め用凹部12b,12cが精度よく位置決めされる。また、変形部12fが押し潰されて変形させられることによって、基板12が割れたり欠けたりすることなく位置決め用凹部12aを位置決め用凸部16aの根元部まで押し込み可能となると共に、基板12を位置決め用凸部16b,16cの方向にずらして押し当てる力を好適な大きさに調整できる。 Further, in the first embodiment, a deformed portion 12f that is more easily deformed than other parts of the substrate 12 is formed in the vicinity of the positioning recess 12a of the substrate 12. Then, after the positioning recess 12a of the substrate 12 comes into contact with the tip end side of the positioning convex portion 16a of the fixing member 16, the positioning convex portion 16a of the fixing member 16 is deformed while the deformed portion 12f of the substrate 12 is deformed. It is pushed into the root along the peripheral surface of. As a result, the positioning recesses 12b and 12c of the substrate 12 are pressed against the positioning protrusions 16b and 16c of the fixing member 16, and the positioning recesses 12b and 12c are accurately positioned. Further, by crushing and deforming the deformed portion 12f, the positioning recess 12a can be pushed to the root of the positioning convex portion 16a without cracking or chipping, and the substrate 12 can be positioned. The pressing force can be adjusted to a suitable size by shifting in the direction of the convex portions 16b and 16c.

なお、本発明はその発明の範囲内において、実施の形態の任意の構成要素の変形、又は実施の形態の任意の構成要素の省略が可能である。 In the present invention, it is possible to modify any component of the embodiment or omit any component of the embodiment within the scope of the invention.

上記説明では、車載用灯具として前照灯1のすれ違い灯用ユニット2及び走行灯用ユニット3を例示したが、車載用灯具はこれらに限定されるものではなく、車幅灯及び尾灯等であってもよい。 In the above description, the passing light unit 2 and the traveling light unit 3 of the headlight 1 are exemplified as the vehicle-mounted lighting equipment, but the vehicle-mounted lighting equipment is not limited to these, and may be a vehicle side lamp, a tail lamp, or the like. You may.

1 前照灯、2 すれ違い灯用ユニット 3 走行灯用ユニット、11 LED、11a 基台、11b 青色発光LED、11c 黄色発光蛍光体、11d 外形、11e 発光部、12 基板、12a 位置決め用凹部(第1位置決め用凹部)、12b,12c 位置決め用凹部、12d,12e,16d,16e 固定用穴、12f 変形部、13 光学部材、14 配光部材、15 投影レンズ、16 固定部材、16a 位置決め用凸部(第1位置決め用凸部)、16b,16c 位置決め用凸部、16f 凹部、16g スロープ、17 外殻部材、18 前面レンズ、19 ケース、20 LED点灯装置、21 はんだ、22 放熱部材、23a,23b 固定用ビス、30 回転刃物、31,120,121 回転方向、101,102 二等辺三角形、101a 正三角形、103 組み付け方向、104 押し込み方向、105 押圧方向、110 切削粉、122 抗力。 1 Headlight, 2 Passing light unit 3 Running light unit, 11 LED, 11a base, 11b blue light emitting LED, 11c yellow light emitting phosphor, 11d outer shape, 11e light emitting part, 12 board, 12a positioning recess (No. 1 Positioning recess), 12b, 12c Positioning recess, 12d, 12e, 16d, 16e Fixing hole, 12f deformed part, 13 Optical member, 14 Light distribution member, 15 Projection lens, 16 Fixing member, 16a Positioning convex part (1st positioning convex part), 16b, 16c Positioning convex part, 16f concave part, 16g slope, 17 outer shell member, 18 front lens, 19 case, 20 LED lighting device, 21 solder, 22 heat dissipation member, 23a, 23b Fixing screw, 30 rotating blade, 31,120,121 rotation direction, 101,102 isotropic triangle, 101a equilateral triangle, 103 assembly direction, 104 pushing direction, 105 pressing direction, 110 cutting powder, 122 resistance.

Claims (10)

半導体光源と、
表面に前記半導体光源が実装され、端面に複数の位置決め用凹部が形成されている基板と、
前記半導体光源が発する光を車両の前方へ導く光学部材と、
前記基板の複数の位置決め用凹部に当接して前記基板を位置決めする複数の位置決め用凸部を有し、前記基板と前記光学部材とが固定された固定部材とを備える車載用灯具であって、
前記基板が前記固定部材に固定される前の、前記基板の複数の位置決め用凹部の当接部を直線でつないでできる多角形が、前記固定部材の複数の位置決め用凸部の当接部を直線でつないでできる多角形より大きいことを特徴とする車載用灯具。
With a semiconductor light source
A substrate on which the semiconductor light source is mounted on the surface and a plurality of positioning recesses are formed on the end surface.
An optical member that guides the light emitted by the semiconductor light source to the front of the vehicle,
An in-vehicle lamp having a plurality of positioning protrusions that abut on a plurality of positioning recesses of the substrate to position the substrate, and having a fixing member to which the substrate and the optical member are fixed.
Before the substrate is fixed to the fixing member, the polygon formed by connecting the contact portions of the plurality of positioning recesses of the substrate with a straight line forms the contact portions of the plurality of positioning protrusions of the fixing member. An in-vehicle lamp that is larger than a polygon that can be connected by a straight line.
前記複数の位置決め用凸部のうちの少なくとも1つの根元部に、前記基板が対面する前記固定部材の面より低い凹部が形成されていることを特徴とする請求項1記載の車載用灯具。 The vehicle-mounted lamp according to claim 1, wherein a recess lower than the surface of the fixing member facing the substrate is formed at the root of at least one of the plurality of positioning protrusions. 前記基板は、前記複数の位置決め用凹部のうちの1つの近傍に、前記基板の他の部位より変形しやすい変形部を有することを特徴とする請求項1記載の車載用灯具。 The vehicle-mounted lamp according to claim 1, wherein the substrate has a deformed portion that is more easily deformed than other portions of the substrate in the vicinity of one of the plurality of positioning recesses. 前記複数の位置決め用凸部のうちの少なくとも1つは、先端部から根元部へ向かうにつれて外径が大きくなるテーパ形状であることを特徴とする請求項1記載の車載用灯具。 The vehicle-mounted lamp according to claim 1, wherein at least one of the plurality of positioning convex portions has a tapered shape in which the outer diameter increases from the tip portion toward the root portion. 前記基板は、アルミニウムを基材にした基板であることを特徴とする請求項3記載の車載用灯具。 The vehicle-mounted lamp according to claim 3, wherein the substrate is a substrate based on aluminum. 前記複数の位置決め用凹部は、それぞれ、実装された前記半導体光源の位置を基準位置にして形成されていることを特徴とする請求項1記載の車載用灯具。 The vehicle-mounted lamp according to claim 1, wherein each of the plurality of positioning recesses is formed with the position of the mounted semiconductor light source as a reference position. 前記複数の位置決め用凹部の前記基準位置となる前記半導体光源の位置は、前記半導体光源の発光部の位置であることを特徴とする請求項6記載の車載用灯具。 The vehicle-mounted lamp according to claim 6, wherein the position of the semiconductor light source, which is the reference position of the plurality of positioning recesses, is the position of the light emitting portion of the semiconductor light source. 半導体光源と、
表面に前記半導体光源が実装され、端面に複数の位置決め用凹部が形成されている基板と、
前記半導体光源が発する光を車両の前方へ導く光学部材と、
前記基板の複数の位置決め用凹部に当接して前記基板を位置決めする複数の位置決め用凸部を有し、前記基板と前記光学部材とが固定された固定部材とを備え、
前記基板が前記固定部材に固定される前の、前記基板の複数の位置決め用凹部の当接部を直線でつないでできる多角形が、前記固定部材の複数の位置決め用凸部の当接部を直線でつないでできる多角形より大きい車載用灯具の製造方法であって、
前記複数の位置決め用凹部は、前記基板に実装された前記半導体光源の位置を基準位置にして形成されることを特徴とする車載用灯具の製造方法。
With a semiconductor light source
A substrate on which the semiconductor light source is mounted on the surface and a plurality of positioning recesses are formed on the end surface.
An optical member that guides the light emitted by the semiconductor light source to the front of the vehicle,
It has a plurality of positioning protrusions that abut on a plurality of positioning recesses of the substrate to position the substrate, and includes a fixing member to which the substrate and the optical member are fixed.
Before the substrate is fixed to the fixing member, the polygon formed by connecting the contact portions of the plurality of positioning recesses of the substrate with a straight line forms the contact portions of the plurality of positioning protrusions of the fixing member. It is a method of manufacturing in-vehicle lamps that are larger than polygons that can be connected by straight lines.
A method for manufacturing an in-vehicle lamp, wherein the plurality of positioning recesses are formed with the position of the semiconductor light source mounted on the substrate as a reference position.
前記複数の位置決め用凹部は、前記基板の端面を切削して形成されることを特徴とする請求項8記載の車載用灯具の製造方法。 The method for manufacturing an in-vehicle lamp according to claim 8, wherein the plurality of positioning recesses are formed by cutting an end face of the substrate. 前記基板の前記複数の位置決め用凹部のうちの1つである第1位置決め用凹部の近傍に、前記基板の他の部位より変形しやすい変形部が形成され、
前記基板の前記第1位置決め用凹部が、前記固定部材の前記複数の位置決め用凸部のうちの1つである第1位置決め用凸部の先端側に当接してから、前記基板の前記変形部が変形させられながら前記固定部材の前記第1位置決め用凸部の周面に沿って根元部に押し込まれることを特徴とする請求項8記載の車載用灯具の製造方法。
A deformed portion that is more easily deformed than other parts of the substrate is formed in the vicinity of the first positioning recess, which is one of the plurality of positioning recesses of the substrate.
After the first positioning concave portion of the substrate abuts on the tip end side of the first positioning convex portion, which is one of the plurality of positioning convex portions of the fixing member, the deformed portion of the substrate. The method for manufacturing an in-vehicle lamp according to claim 8, wherein the fixing member is pushed into the root portion along the peripheral surface of the first positioning convex portion of the fixing member.
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