JP6942208B2 - Organic EL device and its manufacturing method - Google Patents

Description

The present invention relates to an organic EL device (for example, an organic EL display device and an organic EL lighting device) and a method for manufacturing the same.

Organic EL (Electro Luminescence) display devices have begun to be put into practical use. One of the features of the organic EL display device is that a flexible display device can be obtained. The organic EL display device has at least one organic EL element (Organic Light Emitting Diode: OLED) for each pixel, and at least one TFT (Thin Film Transistor) that controls the current supplied to each OLED. Hereinafter, the organic EL display device will be referred to as an OLED display device. Such an OLED display device having a switching element such as a TFT for each OLED is called an active matrix type OLED display device. Further, the substrate on which the TFT and the OLED are formed is referred to as an element substrate.

OLEDs (particularly organic light emitting layers and cathode electrode materials) are liable to deteriorate under the influence of moisture and are liable to cause display unevenness. Thin film encapsulation (TFE) technology has been developed as a technology for protecting an OLED from moisture and providing a sealing structure that does not impair flexibility. The thin film sealing technique attempts to obtain sufficient water vapor barrier properties in a thin film by alternately laminating inorganic barrier layers and organic barrier layers. From the viewpoint of moisture resistance and reliability of the OLED display device, the WVTR (Water Vapor Transmission Rate) of the thin film sealing structure is typically required to be 1 × 10 ^-4 g / m ² / day or less.

The thin film sealing structure used in the currently commercially available OLED display device has an organic barrier layer (polymer barrier layer) having a thickness of about 5 μm to about 20 μm. Such a relatively thick organic barrier layer also plays a role of flattening the surface of the device substrate. However, if the organic barrier layer is thick, there is a problem that the flexibility of the OLED display device is limited.

There is also a problem that mass productivity is low. The above-mentioned relatively thick organic barrier layer is formed by using a printing technique such as an inkjet method or a microjet method. On the other hand, the inorganic barrier layer is formed in a vacuum (for example, 1 Pa or less) atmosphere by using a thin film film forming technique. Since the formation of the organic barrier layer using printing technology is performed in the air or nitrogen atmosphere and the formation of the inorganic barrier layer is performed in vacuum, the device substrate is moved from the vacuum chamber in the process of forming the thin film sealing structure. The mass productivity is low because it is taken in and out.

Therefore, for example, as disclosed in Patent Document 1, a film forming apparatus capable of continuously producing an inorganic barrier layer and an organic barrier layer has been developed.

Further, in Patent Document 2, when the first inorganic material layer, the first resin material, and the second inorganic material layer are formed in this order from the element substrate side, the first resin material is used as the first resin material. A thin film sealing structure unevenly distributed around a convex portion (first inorganic material layer covering the convex portion) of the inorganic material layer is disclosed. According to Patent Document 2, by unevenly distributing the first resin material around the convex portion which may not be sufficiently covered by the first inorganic material layer, the invasion of water and oxygen from the portion is suppressed. Further, since the first resin material functions as the base layer of the second inorganic material layer, the second inorganic material layer is properly formed into a film, and the side surface of the first inorganic material layer is formed with the desired film thickness. It becomes possible to cover properly with. The first resin material is formed as follows. The heated and vaporized mist-like organic material is supplied onto the device substrate maintained at a temperature of room temperature or lower, and the organic material condenses and drops on the substrate. The droplet-like organic material moves on the substrate due to the capillary phenomenon or surface tension, and is unevenly distributed at the boundary between the side surface of the convex portion of the first inorganic material layer and the surface of the substrate. Then, by curing the organic material, a first resin material is formed at the boundary portion. Patent Document 3 also discloses an OLED display device having a similar thin film sealing structure. Further, Patent Document 4 discloses a film forming apparatus used for manufacturing an OLED display apparatus.

Japanese Unexamined Patent Publication No. 2013-186971 International Publication No. 2014/196137 Japanese Unexamined Patent Publication No. 2016-39120 Japanese Unexamined Patent Publication No. 2013-64187

Since the thin film sealing structure described in Patent Documents 2 or 3 does not have a thick organic barrier layer, it is considered that the flexibility of the OLED display device is improved. Further, since the inorganic barrier layer and the organic barrier layer can be continuously formed, mass productivity is also improved.

However, according to the study by the present inventor, when the organic barrier layer is formed by the method described in Patent Documents 2 or 3, there is a problem that sufficient moisture resistance reliability cannot be obtained.

When the organic barrier layer is formed by a printing method such as an inkjet method, the organic barrier layer is formed only in an active region (sometimes referred to as an "element forming region" or a "display region") on the device substrate. It can be prevented from being formed in a region other than the active region. Therefore, in the periphery (outside) of the active region, there is a region in which the first inorganic material layer and the second inorganic material layer are in direct contact with each other, and the organic barrier layer includes the first inorganic material layer and the second inorganic material layer. It is completely surrounded by and isolated from the surroundings.

On the other hand, in the method for forming an organic barrier layer described in Patent Documents 2 or 3, a resin (organic material) is supplied to the entire surface of the element substrate, and the surface tension of the liquid resin is used to utilize the surface tension of the surface of the element substrate. The resin is unevenly distributed at the boundary between the side surface of the convex portion and the surface of the substrate. Therefore, the area outside the active area (sometimes referred to as “peripheral area”), that is, the terminal area where a plurality of terminals are arranged and the lead wiring area where the lead wiring from the active area to the terminal area is formed. An organic barrier layer may be formed. Specifically, for example, the resin is unevenly distributed at the boundary between the side surface of the drawer wiring and the terminal and the surface of the substrate. Then, the end portion of the portion of the organic barrier layer formed along the drawer wiring is not surrounded by the first inorganic barrier layer and the second inorganic barrier layer, and is exposed to the atmosphere (ambient atmosphere).

Since the organic barrier layer has a lower water vapor barrier property than the inorganic barrier layer, the organic barrier layer formed along the lead-out wiring becomes a path for guiding water vapor in the atmosphere into the active region.

Here, the problem of the thin film sealing structure preferably used for the flexible organic EL display device has been described, but the thin film sealing structure is not limited to the organic EL display device, and other organic EL devices such as the organic EL lighting device. It is also used for.

The present invention has been made to solve the above problems, and is an organic EL device having a thin film sealing structure having a relatively thin organic barrier layer with improved mass productivity and moisture resistance reliability, and a method for manufacturing the same. The purpose is to provide.

The organic EL device according to an embodiment of the present invention includes a substrate, a plurality of TFTs formed on the substrate, a plurality of gate bus lines and a plurality of source buses, each of which is connected to any of the plurality of TFTs. A drive circuit layer and a drive circuit layer having a line, a plurality of terminals, and a plurality of lead wires connecting the plurality of terminals and the plurality of gate bus lines or the plurality of source bus lines. A first inorganic protective layer formed on the first inorganic protective layer that exposes at least the plurality of terminals, and an organic flattening layer formed on the first inorganic protective layer, which has a surface having an arithmetic average roughness Ra of more than 50 nm. The organic flattening layer, the second inorganic protective layer formed on the organic flattening layer, the second inorganic protective layer having a surface having an arithmetic average roughness Ra of 50 nm or less, and the second inorganic protective layer. An organic EL element layer having a plurality of organic EL elements formed on the top and each connected to one of the plurality of TFTs, and a first inorganic barrier layer formed so as to cover the organic EL element layer. It has an organic barrier layer in contact with the upper surface of the first inorganic barrier layer and a second inorganic barrier layer in contact with the upper surface of the organic barrier layer, and the organic barrier layer includes the first inorganic barrier layer and the second inorganic. It has a thin film transistor encapsulation structure formed in a region surrounded by an inorganic barrier layer joint that is in direct contact with the barrier layer, and when viewed from the normal direction of the substrate, the first The organic flattening layer is formed in the region where the inorganic protective layer is formed, and the plurality of organic EL elements are arranged in the region where the organic flattening layer is formed, and the thin film transistor is sealed. The outer edge of the stop structure intersects the plurality of drawer wires and exists between the outer edge of the organic flattening layer and the outer edge of the first inorganic protective layer, and the first is on the plurality of drawer wires. In the portion where the 1-inorganic protective layer and the 1st inorganic barrier layer are in direct contact with each other, the taper angle of the side surface of the 1st inorganic barrier layer in the shape of the cross section parallel to the line width direction of the plurality of leader wires is 90. Less than °.

In certain embodiments, the taper angle of the side surface of the first inorganic barrier layer is less than 70 °.

In certain embodiments, the organic flattening layer is formed of a non-photosensitive resin.

In certain embodiments, the organic flattening layer is made of polyimide.

The method for manufacturing an organic EL device according to an embodiment of the present invention is any of the above methods for manufacturing an organic EL device, in which the step A of forming the drive circuit layer on the substrate and the drive circuit layer Step B for forming the first inorganic protective film on the surface, step C for forming the organic flattening film on the first inorganic protective film, and step D for forming the second inorganic protective film on the organic flattening film. By patterning the first inorganic protective film, the organic flattening film, and the second inorganic protective film in the step E of applying chemical mechanical polishing to the surface of the second inorganic protective film, the first inorganic protective film is protected. After the step F for obtaining the layer, the organic flattening layer and the second inorganic protective layer, the step G for heating the organic flattening layer to a temperature of 100 ° C. or higher, and the step G, the second inorganic protective layer Above, the step H of forming the organic layer contained in the organic EL element is included.

In certain embodiments, the step F includes a step of collectively forming a contact hole penetrating the first inorganic protective film, the organic flattening film, and the second inorganic protective film.

In a certain embodiment, the manufacturing method includes a step F1 of forming a positive photoresist film covering the organic flattening layer after the step F and before the step G, and the entire surface of the photoresist film. The step F2 of removing the photoresist film by developing after exposure is further included.

In certain embodiments, the step of storing or transporting the substrate on which the photoresist film is formed is further included between the step F1 and the step F2.

In a certain embodiment, the manufacturing method includes, after the step H, a step I of selectively forming the first inorganic barrier layer in an active region in which the plurality of organic EL elements are formed, and a step I of the step I. Later, the step J of arranging the substrate in the chamber and supplying the vapor or atomized photocurable resin of the photocurable resin into the chamber, and the photocurable resin on the first inorganic barrier layer. In the step of condensing, the step K of condensing the photocurable resin so that the photocurable resin does not exist on the portion of the first inorganic barrier layer having a taper angle of less than 90 °. After the step K , the step L of forming the organic barrier layer made of the photocurable resin by irradiating the condensed photocurable resin with light is included.

In a certain embodiment, the manufacturing method includes, after the step G, a step I of selectively forming the first inorganic barrier layer in an active region in which the plurality of organic EL elements are formed, and a step I of the step I. Later, the step J of arranging the substrate in the chamber and supplying the vapor or atomized photocurable resin of the photocurable resin into the chamber, and the photocurable resin on the first inorganic barrier layer. Step K to form a liquid film by condensing, a step L to form a photocurable resin layer by irradiating the liquid film of the photocurable resin with light, and a portion of the photocurable resin layer. Includes the step M of forming the organic barrier layer by ashing.

According to an embodiment of the present invention, there is provided an organic EL display device having a thin film sealing structure having a relatively thin organic barrier layer, which has improved mass productivity and moisture resistance reliability, and a method for manufacturing the same.

(A) is a schematic partial cross-sectional view of an active region of the OLED display device 100 according to the embodiment of the present invention, and (b) is a partial cross-sectional view of a TFE structure 10 formed on the OLED 3. It is a schematic plan view of the OLED display device 100A according to the embodiment of the present invention. (A) and (b) are schematic cross-sectional views of the OLED display device 100A, (a) is a cross-sectional view taken along the line 3A-3A'in FIG. 2, and (b) is a cross-sectional view in FIG. It is a cross-sectional view along the line 3B-3B', and (c) is a cross-sectional view showing the taper angle θ of the side surface of each layer. (A) to (d) are schematic cross-sectional views of the OLED display device 100A, (a) is a cross-sectional view taken along the line 4A-4A'in FIG. 2, and (b) is a cross-sectional view in FIG. It is a cross-sectional view along the 4B-4B'line, (c) is a cross-sectional view along the 4C-4C' line in FIG. 2, and (d) is a cross-sectional view along the 4D-4D' line in FIG. It is a cross-sectional view. (A) and (b) are schematic cross-sectional views corresponding to FIG. 4 (b) in the OLED display devices 100B1 and 100B2 of the comparative example. It is a schematic plan view of the OLED display device 100C of the comparative example. (A) and (b) are schematic cross-sectional views of the OLED display device 100C, (a) is a cross-sectional view taken along the line 7A-7A'in FIG. 6, and (b) is a cross-sectional view in FIG. It is sectional drawing along the line 7B-7B'. (A) to (c) are schematic cross-sectional views of the OLED display device 100C, (a) is a cross-sectional view taken along the line 8A-8A'in FIG. 6, and (b) is a cross-sectional view in FIG. It is a cross-sectional view along the line 8B-8B', and (c) is a cross-sectional view along the line 8C-8C'in FIG. (A) and (b) are schematic cross-sectional views which show the example of the TFT which the OLED display device by embodiment can have, respectively. (A) to (c) are schematic cross-sectional views of other OLED display devices according to the embodiment, and correspond to FIGS. 4 (b) to 4 (d), respectively. (A) to (c) are schematic cross-sectional views of still another OLED display device according to the embodiment. (A) and (b) are diagrams schematically showing the configuration of the film forming apparatus 200, and (a) is the film forming apparatus 200 in the step of condensing the photocurable resin on the first inorganic barrier layer. The state is shown, and (b) shows the state of the film forming apparatus 200 in the step of curing a photocurable resin.

Hereinafter, the OLED display device according to the embodiment of the present invention and the manufacturing method thereof will be described with reference to the drawings. In the following, an OLED display device having a flexible substrate will be illustrated, but the embodiment of the present invention is not limited to the organic EL display device, and may be another organic EL device such as an organic EL lighting device. It is not limited to the embodiment to be performed.

First, the basic configuration of the OLED display device 100 according to the embodiment of the present invention will be described with reference to FIGS. 1 (a) and 1 (b). FIG. 1 (a) is a schematic partial cross-sectional view of an active region of the OLED display device 100 according to the embodiment of the present invention, and FIG. 1 (b) is a partial cross-sectional view of a TFE structure 10 formed on the OLED 3. Is.

The OLED display device 100 has a plurality of pixels, and each pixel has at least one organic EL element (OLED). Here, for the sake of simplicity, a structure corresponding to one OLED will be described.

As shown in FIG. 1A, the OLED display device 100 includes a flexible substrate (hereinafter, may be simply referred to as a “board”) 1 and a circuit (“drive circuit”” including a TFT formed on the substrate 1. Alternatively, it may be referred to as a "backplane circuit") 2, an inorganic protective layer (first inorganic protective layer) 2Pa formed on the circuit 2, and an organic flattening layer 2Pb formed on the inorganic protective layer 2Pa. It has an OLED 3 formed on the organic flattening layer 2Pb and a TFE structure 10 formed on the OLED 3. Hereinafter, the substrate 1, the circuit 2 formed on the substrate 1, the inorganic protective layer 2Pa, the organic flattening layer 2Pb, and the OLED 3 may be referred to as an element substrate 20. That is, the substrate 1 and the components arranged on the substrate 1 closer to the substrate 1 than the TFE structure 10 are collectively referred to as an element substrate.

OLED3 is, for example, a top emission type. The uppermost portion of the OLED 3 is, for example, an upper electrode or a cap layer (refractive index adjusting layer). The layer in which a plurality of OLEDs 3 are arranged may be referred to as an OLED layer 3. An optional polarizing plate 4 is arranged on the TFE structure 10. The circuit 2 and the OLED layer 3 may share some components. Further, for example, a layer having a touch panel function may be arranged between the TFE structure 10 and the polarizing plate 4. That is, the OLED display device 100 can be modified into an on-cell type display device with a touch panel.

The substrate 1 is, for example, a polyimide film having a thickness of 15 μm. The thickness of the circuit 2 including the TFT is, for example, 4 μm. The inorganic protective layer 2Pa is, for example, a SiN _x layer (500 nm) / SiO ₂ layer (100 nm) (upper layer / lower layer). The inorganic protective layer 2Pa may _{also have a three-layer structure of, for example, a SiO 2} layer / SiN _x layer / SiO ₂ layer, and the thickness of each layer is, for example, 200 nm / 300 nm / 100 nm. Further, the inorganic protective layer 2Pa may be a single layer of _{SiN x layer (200 nm).} The organic flattening layer 2Pb is, for example, an acrylic resin layer, an epoxy resin layer, or a polyimide layer having a thickness of 4 μm. The organic flattening layer 2Pb is preferably formed using a non-photosensitive resin, but may be formed using a photosensitive resin. The thickness of the OLED 3 is, for example, 1 μm. The thickness of the TFE structure 10 is, for example, 2.5 μm or less.

FIG. 1B is a partial cross-sectional view of the TFE structure 10 formed on the OLED 3. A first inorganic barrier layer (for example, SiN _x layer) 12 is formed directly above the OLED 3, and an organic barrier layer (for example, an acrylic resin layer) 14 is formed on the first inorganic barrier layer 12, and the organic barrier layer is formed. A second inorganic barrier layer (for example, SiN _x layer) 16 is formed on the 14.

For example, the first inorganic barrier layer 12 is, for example, a SiN _x layer having a thickness of 1.5 μm, the second inorganic barrier layer 16 is, for example, a SiN _x layer having a thickness of 800 nm, and the organic barrier layer 14 is, for example, a thickness. Is an acrylic resin layer having a size of less than 100 nm. The thickness of the first inorganic barrier layer 12 and the thickness of the second inorganic barrier layer 16 are independently 200 nm or more and 1500 nm or less, and the thickness of the organic barrier layer 14 is 50 nm or more and less than 200 nm. The thickness of the TFE structure 10 is preferably 400 nm or more and less than 3 μm, and more preferably 400 nm or more and 2.5 μm or less.

The TFE structure 10 is formed so as to protect the active region of the OLED display device 100 (see the active region R1 in FIG. 2), and at least the active region R1 is in order from the side closer to the OLED 3 as described above. , A first inorganic barrier layer 12, an organic barrier layer 14, and a second inorganic barrier layer 16. The organic barrier layer 14 does not exist as a film covering the entire surface of the active region R1, but has an opening. The portion of the organic barrier layer 14 excluding the opening where the organic film actually exists is referred to as a “solid portion”. The organic barrier layer 14 can be formed, for example, by the method described in Patent Document 1 or 2, or by using the film forming apparatus 200 described later.

Further, the "opening" (sometimes referred to as "non-solid part") does not need to be surrounded by the solid part and includes a notch or the like. In the opening, the first inorganic barrier layer 12 And the second inorganic barrier layer 16 are in direct contact with each other. Hereinafter, the portion where the first inorganic barrier layer 12 and the second inorganic barrier layer 16 are in direct contact with each other is referred to as an “inorganic barrier layer joint portion”.

Next, the structure and manufacturing method of the OLED display device 100A according to the embodiment of the present invention will be described with reference to FIGS. 2 and 3.

FIG. 2 shows a schematic plan view of the OLED display device 100A according to the embodiment of the present invention. Further, the cross-sectional structure of the OLED display device 100A will be described with reference to FIGS. 3 (a) to 3 (c) and FIGS. 4 (a) to 4 (d). 3 (a) and 3 (b) are schematic cross-sectional views of the OLED display device 100A, and FIG. 3 (a) is a cross-sectional view taken along the line 3A-3A'in FIG. ) Is a cross-sectional view taken along the line 3B-3B'in FIG. FIG. 3C is a cross-sectional view showing a taper angle θ on the side surface of each layer. 4 (a) to 4 (d) are schematic cross-sectional views of the OLED display device 100A, and FIG. 4 (a) is a cross-sectional view taken along the line 4A-4A'in FIG. 2 and FIG. 4 (b). ) Is a cross-sectional view taken along the line 4B-4B'in FIG. 2, FIG. 4 (c) is a cross-sectional view taken along the line 4C-4C'in FIG. 2, and FIG. 4 (d) is a cross-sectional view taken along the line 4C-4C'. It is sectional drawing along the 4D-4D'line inside.

First, refer to FIG. The circuit 2 formed on the substrate 1 includes a plurality of TFTs (not shown), a plurality of gate bus lines (not shown) and a plurality of sources, each of which is connected to one of the plurality of TFTs (not shown). It has a bus line (not shown). The circuit 2 may be a known circuit for driving a plurality of OLEDs 3. The plurality of OLEDs 3 are connected to any of the plurality of TFTs included in the circuit 2. The OLED 3 may also be a known OLED.

The circuit 2 further includes a plurality of terminals 34 arranged in a peripheral region R2 outside the active region (region surrounded by a broken line in FIG. 2) R1 in which a plurality of OLEDs 3 are arranged, and a plurality of terminals 34. It has a plurality of leader wires 32 that connect to either a plurality of gate bus lines or a plurality of source bus lines. The entire circuit 2 including a plurality of TFTs, a plurality of gate bus lines, a plurality of source bus lines, a plurality of leader wires 32, and a plurality of terminals 34 may be referred to as a drive circuit layer 2. Further, in the drive circuit layer 2, the portion formed in the active region R1 is referred to as the drive circuit layer 2A.

In FIG. 2 and the like, only the lead wiring 32 and / or the terminal 34 may be shown as a component of the drive circuit layer 2, but the drive circuit layer 2 is only a conductive layer including the lead wiring 32 and the terminal 34. However, it has one or more conductive layers, one or more insulating layers, and one or more semiconductor layers. The configuration of the conductive layer, the insulating layer, and the semiconductor layer included in the drive circuit layer 2 can be changed by, for example, the configuration of the TFT illustrated later in FIGS. 9A and 9B. Further, an insulating film (base coat) may be formed on the substrate 1 as a base film of the drive circuit layer 2.

When viewed from the normal direction of the substrate 1, the organic flattening layer 2Pb is formed in the region where the inorganic protective layer 2Pa is formed, and the active region R1 is formed in the region where the organic flattening layer 2Pb is formed. (2A, 3) are arranged. The outer edge of the TFE structure 10 intersects the plurality of drawer wirings 32 and exists between the outer edge of the organic flattening layer 2Pb and the outer edge of the inorganic protective layer 2Pa. Therefore, the organic flattening layer 2Pb is surrounded by the joint portion in which the inorganic protective layer 2Pa and the first inorganic barrier layer 12 are in direct contact with the OLED layer 3 (see FIGS. 3 (b) and 4 (b)). ). The inorganic protective layer 2Pa is formed so as to expose at least a plurality of terminals 34 by, for example, a plasma CVD method using a mask (for example, a metal mask). Alternatively, once an inorganic protective film is formed so as to cover the terminal 34 by a plasma CVD method, and then patterned by a photolithography process (including a dry etching process) to form an opening for exposing the terminal 34, the inorganic protective film is formed. The protective layer 2Pa may be obtained. As will be described later, when the second inorganic protective layer 2Pa2 is formed on the organic flattening layer 2Pb (see FIG. 11B), the patterning including the formation of contact holes is performed by the inorganic protective film 2Pa (first inorganic). It is preferable that the protective film 2Pa1), the organic flattening film 2Pb, and the second inorganic protective layer 2Pa2 are collectively applied.

The inorganic protective layer 2Pa protects the drive circuit layer 2. The organic flattening layer 2Pb flattens the surface of the base on which the OLED layer 3 is formed. Like the organic barrier layer 14, the organic flattening layer 2Pb has a lower water vapor barrier property than the inorganic protective layer 2Pa and the inorganic barrier layers 12 and 16. Therefore, when a part of the organic flattening layer 2Pbc of the OLED display device 100C of the comparative example shown in FIGS. 6 to 8 is exposed to the atmosphere (ambient atmosphere), moisture is absorbed from the organic flattening layer 2Pbc. As a result, the organic flattening layer 2Pbc becomes a path for guiding water vapor in the atmosphere into the active region R1. As described above, in the OLED display device 100 according to the embodiment, the organic flattening layer 2Pb is surrounded by the joint portion in which the inorganic protective layer 2Pa and the first inorganic barrier layer 12 are in direct contact with each other. Moisture is prevented from being guided into the active region R1 from 2Pb.

The organic flattening layer 2Pb is formed of an organic resin. As the organic resin, an acrylic resin, an epoxy resin or a polyimide resin can be preferably used. The organic flattening layer 2Pb is obtained by patterning an organic resin film formed by using various coating methods and printing methods. The organic resin film is formed, for example, by using a resin having no photosensitivity. However, a photosensitive resin may be used. As the photosensitive resin, it is preferable to use a positive photosensitive resin. When a photosensitive resin is used, an organic resin film can be formed only in a predetermined region by a photolithography process. For example, by applying the photosensitive resin to almost the entire surface of the element substrate and then exposing and developing the photosensitive resin, an organic substance is formed in a predetermined region (for example, see FIG. 11C) excluding the peripheral portion of the element substrate. A resin film can be formed.

The patterning of the organic resin film is the case of forming the second inorganic protective layer 2Pa2 formed on the organic flattening layer 2Pb (see FIG. 11B), and the formation of the contact hole is the formation of the inorganic protective film 2Pa (first inorganic). It is preferable that the protective film 2Pa1), the organic flattening film 2Pb, and the second inorganic protective layer 2Pa2 are collectively applied.

Organic resins tend to contain water. On the other hand, as described above, the OLED (particularly the organic light emitting layer and the cathode electrode material) is easily deteriorated by the influence of moisture. Therefore, before forming the OLED layer 3 on the organic flattening layer 2Pb, it is preferable to heat (bake) in order to remove the moisture contained in the organic flattening layer 2Pb. The heating temperature is preferably 100 ° C. or higher (for example, 1 hour or longer), and more preferably 250 ° C. or higher (for example, 15 minutes or longer). The atmosphere may be atmospheric pressure. The heating time can be shortened by heating in a reduced pressure atmosphere. A resin material having high heat resistance is preferable, and polyimide is preferable, for example, so that thermal deterioration does not occur in this heating (baking) step.

After forming the organic flattening layer 2Pb, the element substrate may be stored or transported before forming the OLED layer 3. That is, after the element substrate on which the drive circuit layer 2, the inorganic protective layer 2Pa, and the organic flattening layer 2Pb are formed is produced, there is a time before the OLED layer 3 is formed (for example, it is stored for one day or more for several days). ) Or may move to another factory. During this period, as a method of preventing the surface of the organic flattening layer 2Pb from being contaminated or dust from adhering during movement, for example, a positive photoresist film covering the organic flattening layer 2Pb is formed. do it. This photoresist film is formed by applying a photoresist solution and then prebaking (volatilizing and removing the solvent: for example, heating in a temperature range of about 90 ° C. or higher and about 110 ° C. or lower for about 5 minutes to about 30 minutes). It is preferable to do so. A clean surface of the organic flattening layer 2Pb can be obtained by removing the photoresist film after storage or movement and immediately before forming the OLED layer 3. To remove the photoresist film, it is preferable to expose the entire surface of the photoresist film and then develop or prebake without performing normal post-baking, and then peel off with a stripping solution without performing full-scale exposure. .. As a material for forming the positive photoresist film, for example, the product name OFPR-800 manufactured by Tokyo Ohka Co., Ltd., which is a positive photoresist, can be preferably used.

As will be described later with reference to FIG. 11B, a bank layer may be formed in the process of forming the OLED element 3. The bank layer is formed after forming the lower electrode and before forming the organic layer (organic EL layer). Since the bank layer is formed of an organic resin (for example, polyimide), it easily contains water and comes into contact with the organic layer. Therefore, it is preferable to heat the bank layer to remove water. Therefore, even if the organic flattening layer 2Pb is formed, the lower electrode is formed, the bank layer is formed, and then the positive photoresist film that protects the surface of the device substrate is formed as described above. good. After the necessary storage and / or transportation, the photoresist film is removed as described above, and just before the formation of the organic layer, the water content in the organic flattening layer 2Pb and the bank layer is removed by heating. As described above, the heating step for removing the water contained in the organic flattening layer 2Pb and the heating step for removing the water contained in the bank layer may be combined. Of course, as described above, a heating step for protecting the organic flattening layer 2Pb with a positive photoresist film, removing the positive photoresist film, and then removing the water contained in the organic flattening layer 2Pb. After that, after forming the lower electrode and the bank layer, and before forming the organic layer, a heating step for removing water contained in the bank layer may be performed.

Next, the cross-sectional structure of the OLED display device 100A will be described in more detail with reference to FIGS. 3 (a) to 3 (c) and FIGS. 4 (a) to 4 (d).

As shown in FIGS. 3 (a) and 3 (b) and 4 (a) and 4 (b), the TFE structure 10A is formed on the first inorganic barrier layer 12 and the first inorganic barrier layer 12 formed on the OLED 3. It has an organic barrier layer 14 in contact with the organic barrier layer 14 and a second inorganic barrier layer 16 in contact with the organic barrier layer 14. The first inorganic barrier layer 12 and the second inorganic barrier layer 16 are, for example, SiN _x layers, and are selectively formed only in a predetermined region so as to cover the active region R1 by a plasma CVD method using a mask. ..

The organic barrier layer 14 can be formed, for example, by the method described in Patent Document 2 or 3 above. For example, in a chamber, a vapor or atomized organic material of an organic material (eg, acrylic monomer) is supplied onto an element substrate maintained at a temperature below room temperature, condensed on the element substrate, and liquefied. Due to the capillary phenomenon or surface tension of the material, the first inorganic barrier layer 12 is unevenly distributed at the boundary between the side surface of the convex portion and the flat portion. Then, by irradiating the organic material with, for example, ultraviolet rays, a solid portion of the organic barrier layer (for example, an acrylic resin layer) 14 is formed at the boundary portion around the convex portion. The organic barrier layer 14 formed by this method has substantially no solid portion in the flat portion. Regarding the method for forming the organic barrier layer, the disclosure contents of Patent Documents 2 and 3 are incorporated herein by reference.

The organic barrier layer 14 is also adjusted by adjusting the initial thickness of the resin layer formed by using the film forming apparatus 200 (for example, less than 100 nm) and / or by ashing the resin layer once formed. , Can also be formed. The ashing procedure can be performed, for example, by plasma ashing with at least one of the gases _{N 2} O, O ₂ and O _{3, as described in detail later.}

FIG. 3A is a cross-sectional view taken along the line 3A-3A'in FIG. 2, and shows a portion including particles P. The particles P are fine dust generated during the manufacturing process of the OLED display device, for example, fine pieces of glass, metal particles, and organic particles. When the mask deposition method is used, particles are particularly likely to be generated.

As shown in FIG. 3A, the organic barrier layer (solid part) 14 can be formed only around the particles P. This is because the acrylic monomer added after forming the first inorganic barrier layer 12 is condensed and unevenly distributed around the surface of the first inorganic barrier layer 12a on the particles P (taper angle θ is 90 ° or more). Is. The flat portion of the first inorganic barrier layer 12 is an opening (non-solid portion) of the organic barrier layer 14.

In the presence of particles (for example, having a diameter of about 1 μm or more) P, cracks (defects) 12c may be formed in the first inorganic barrier layer 12. It is considered that this is caused by the collision (impingement) between _{the SiN x} layer 12a growing from the surface of the particles P _{and the SiN x} layer 12b growing from the flat portion of the surface of the OLED 3. The presence of such cracks 12c reduces the barrier property of the TFE structure 10A.

In the TFE structure 10A of the OLED display device 100A, as shown in FIG. 3A, the organic barrier layer 14 is formed so as to fill the cracks 12c of the first inorganic barrier layer 12, and the organic barrier layer 14 is formed. The surface continuously and smoothly connects the surface of the first inorganic barrier layer 12a on the particles P and the surface of the first inorganic barrier layer 12b on the flat portion of the OLED3. Therefore, a dense film is formed without forming defects in the first inorganic barrier layer 12 on the particles P and the second inorganic barrier layer 16 formed on the organic barrier layer 14. As described above, the organic barrier layer 14 can maintain the barrier property of the TFE structure 10A even in the presence of the particles P.

Next, the cross-sectional structure on the drawer wiring 32 and the terminal 34 will be described with reference to FIGS. 3 (b) and 4 (a) to 4 (d).

As shown in FIG. 3B, the drawer wiring 32 and the terminal 34 are integrally formed on the substrate 1, and the inorganic protective layer 2Pa is formed on the drawer wiring 32 so as to expose the terminal 34. ing. An organic flattening layer 2Pb is formed on the inorganic protective layer 2Pa, and an OLED layer 3 is formed on the organic flattening layer 2Pb. The TFE structure 10A is formed so as to cover the OLED layer 3 and the organic flattening layer 2Pb, and the OLED layer 3 and the organic flattening layer 2Pb are in direct contact with the inorganic protective layer 2Pa and the first inorganic barrier layer 12. Surrounded by joints. Since the organic barrier layer (solid part) 14 between the first inorganic barrier layer 12 and the second inorganic barrier layer 16 of the TFE structure 10A is formed only around the convex portion such as particles, it is described here. Not shown. The organic barrier layer (solid part) 14 is surrounded by an inorganic barrier layer joint portion in which the first inorganic barrier layer 12 and the second inorganic barrier layer 16 are in direct contact with each other.

As shown in FIG. 4A, in the region close to the active region R1 (cross section along the line 4A-4A'in FIG. 2), the inorganic protective layer 2Pa and the organic flattening layer are placed on the leader wiring 32. 2Pb and TFE structure 10A are formed.

As shown in FIG. 4B, in the cross section along the line 4B-4B'in FIG. 2, the inorganic protective layer 2Pa and the first inorganic barrier layer 12 are in direct contact with each other, and the organic flattening layer 2Pb Is surrounded by a joint in which the inorganic protective layer 2Pa and the first inorganic barrier layer 12 are in direct contact with each other (see FIGS. 2 and 3 (b)).

As shown in FIG. 4C, in the region close to the terminal 34, only the inorganic protective layer 2Pa is formed on the lead-out wiring 32.

As shown in FIG. 4D, the terminal 34 is also exposed from the inorganic protective layer 2Pa and is used for electrical connection with an external circuit (for example, FPC (Flexible Printed Circuits)).

Since the region including the portions shown in FIGS. 4 (b) to 4 (d) is not covered with the organic flattening layer 2Pb, the organic barrier layer (solid) is formed in the process of forming the organic barrier layer 14 of the TFE structure 10A. Part) can be formed. For example, if the side surface of the drawer wiring 32 in the cross-sectional shape parallel to the line width direction has a taper angle θ of 90 ° or more, an organic barrier layer can be formed along the side surface of the drawer wiring 32. However, as shown in FIGS. 4 (b) to 4 (d), in the OLED display device 100A according to the embodiment, at least in these regions, the taper angle θ of the side surface in the cross-sectional shape of the drawer wiring 32 and the terminal 34 is 90 °. It is said to be less than, and the photocurable resin is not unevenly distributed. Therefore, the organic barrier layer (solid portion) is not formed along the side surfaces of the drawer wiring 32 and the terminal 34.

Here, the taper angle θ of the side surface of each layer will be described with reference to FIG. 3C. FIG. 3C is a cross-sectional view showing the taper angle θ of the side surface of each layer, and corresponds to, for example, the cross-sectional view shown in FIG. 4B. As shown in FIG. 3C, the taper angle θ of the side surface in the cross-sectional shape parallel to the width direction of the lead wiring 32 is represented by θ (32), and the taper angle θ of the side surface of the other layer is also θ (). It will be represented by the reference code of the component).

Then, each taper of the side surface of the first inorganic barrier layer 12 and the side surface of the second inorganic barrier layer 16 of the TFE structure 10A formed on the inorganic protective layer 2Pa formed on the leader wiring 32 and the inorganic protective layer 2Pa. The angle θ satisfies the relationship of θ (32) ≧ θ (2Pa) ≧ θ (12) ≧ θ (16). Therefore, if the taper angle θ (32) on the side surface of the leader wiring 32 is less than 90 °, the taper angle θ (2Pa) on the side surface of the inorganic protective layer 2Pa and the taper angle θ (12) on the side surface of the first inorganic barrier layer 12 ) Is also less than 90 °.

When the taper angle θ of the side surface is 90 ° or more, in the method for forming the organic barrier layer described in Patent Documents 2 or 3, along the boundary between the side surface and the flat surface (forming an angle of 90 ° or less), The vapor or mist of organic material (eg, acrylic monomer) is condensed to form an organic barrier layer (solid part). Then, for example, the organic barrier layer (solid part) formed along the lead-out wiring becomes a path for guiding water vapor in the atmosphere into the active region.

For example, as shown in the schematic cross-sectional view corresponding to FIG. 4B in the OLED display device 100B1 of the comparative example of FIG. 5A, the taper angle θ (32B1) on the side surface of the drawer wiring 32B1 and the first inorganic material. When the taper angle θ (12B1) on the side surface of the barrier layer 12B1 is 90 ° or more, the first inorganic barrier layer 12B1 and the second inorganic barrier layer 16B1 are arranged along the side surface of the first inorganic barrier layer 12B1 of the TFE structure 10B1. An organic barrier layer (solid part) 14B1 is formed between the two. In the OLED display device 100B1, for example, the inorganic protective layer 2Pa in the OLED display device 100 according to the embodiment is omitted, and the taper angle θ (32) on the side surface of the drawer wiring 32 and the side surface of the first inorganic barrier layer 12 The taper angle θ (12) may be modified to 90 ° or more.

Further, as shown in a schematic cross-sectional view corresponding to FIG. 4 (b) in the OLED display device 100B2 of the comparative example of FIG. 5 (b), the lead wire 32B2, the inorganic protective layer 2PaB2, and the first inorganic barrier layer 12B2. When the side taper angles θ (32B2), θ (2PaB2) and θ (12B2) are 90 ° or more, the first inorganic barrier layer 12B2 and the first inorganic barrier layer 12B2 along the side surface of the first inorganic barrier layer 12B2 of the TFE structure 10B2. 2 An organic barrier layer (solid part) 14B2 is formed between the inorganic barrier layer 16B2 and the inorganic barrier layer 16B2. The OLED display device 100B2 modifies, for example, the side taper angle θ (32) of the drawer wiring 32 and the side taper angle θ (12) of the first inorganic barrier layer 12 in the OLED display device 100A according to the embodiment to 90 ° or more. It may be the one that was done.

Unlike the OLED display device 100B1, the OLED display device 100B2 has an inorganic protective layer 2PaB2, so that the side taper angle θ (12B2) of the first inorganic barrier layer 12B2 is the first inorganic barrier layer of the OLED display device 100B1. It tends to be smaller than the side taper angle θ (12B1) of 12B1.

The taper angles θ (32) and θ (32) of the side surfaces of the drawer wiring 32, the inorganic protective layer 2Pa, and the first inorganic barrier layer 12 in the OLED display device 100A according to the embodiment of the present invention shown in FIGS. 4 (b) to 4 (d). Both 2Pa) and θ (12) are less than 90 °, and the organic barrier layer 14 is not formed along these side surfaces. Therefore, moisture in the atmosphere does not reach the active region R1 through the organic barrier layer (solid part) 14, and excellent moisture resistance reliability can be obtained. Here, an example is shown in which the taper angles θ (32), θ (2Pa), and θ (12) are all less than 90 °, but the present invention is not limited to this, and at least the surface directly below the organic barrier layer 14 is formed. If the taper angle θ (12) on the side surface of the first inorganic barrier layer 12 is less than 90 °, the laminated structure shown in FIG. 4B (inorganic protective layer 2Pa and the first inorganic barrier layer 12 are in direct contact with each other). A portion (where the organic flattening layer 2Pb does not exist) and a portion where the first inorganic barrier layer 12 and the second inorganic barrier layer 16 are in direct contact (there is no organic barrier layer 14) are formed. Therefore, it is possible to suppress / prevent the invasion of atmospheric moisture into the active region R1 via the organic flattening layer 2Pb or the organic barrier layer 14. Further, by having the inorganic protective layer 2Pa, the first Since the taper angle θ (12) of the 1 inorganic barrier layer 12 can be reduced, even if the taper angle θ (32) of the leader wiring 32 is relatively large (for example, 90 °), the taper angle θ (32) of the first inorganic barrier layer 12 can be reduced. The taper angle θ (12) can be made less than 90 °. That is, the taper angle θ (32) of the lead wire 32 can be brought close to 90 ° or 90 °, so that the L / S of the lead wire 32 can be reduced. You get the advantage of being able to.

In the range where the taper angle θ of the side surface is 70 ° or more and less than 90 °, the organic barrier layer (solid portion) 14 may be formed along the side surface. Of course, if the ashing treatment is performed, the resin unevenly distributed along the inclined side surface can be removed, but the time required for the ashing treatment becomes long. For example, a long ashing treatment is required even after removing the resin formed on the flat surface. Alternatively, as a result of excessive ashing (removal) of the organic barrier layer (solid portion) formed around the particles P, there may be a problem that the effect of forming the organic barrier layer is not sufficiently exhibited. In order to suppress / prevent this, the taper angle θ (12) of the first inorganic barrier layer 12 is preferably less than 70 °, more preferably less than 60 °.

Next, the structure of the OLED display device 100C of the comparative example will be described with reference to FIGS. 6 to 8. FIG. 6 shows a schematic plan view of the OLED display device 100C. 7 (a) and 7 (b) are schematic cross-sectional views of the OLED display device 100C, and FIG. 7 (a) is a cross-sectional view taken along the line 7A-7A'in FIG. ) Is a cross-sectional view taken along the line 7B-7B'in FIG. 8 (a) to 8 (c) are schematic cross-sectional views of the OLED display device 100C, and FIG. 8 (a) is a cross-sectional view taken along the line 8A-8A'in FIG. ) Is a cross-sectional view taken along the line 8B-8B'in FIG. 6, and FIG. 8C is a cross-sectional view taken along the line 8C-8C'in FIG.

The OLED display device 100C differs from the OLED display device 100 according to the embodiment in that it does not have the inorganic protective layer 2Pa and the organic flattening layer 2Pbc extends to a region not covered by the TFE structure 10C. .. The components substantially the same as the components of the OLED display device 100A may be designated by the same reference numerals and the description thereof may be omitted.

For example, as is clear from FIGS. 6, 7 (b) and 8 (b), a part of the organic flattening layer 2Pbc is exposed to the atmosphere (ambient atmosphere). Then, the organic flattening layer 2Pbc absorbs moisture from the portion exposed to the atmosphere and becomes a path for guiding the water vapor in the atmosphere into the active region R1. On the other hand, in the OLED display device 100A according to the embodiment, as shown in FIGS. 3B and 4B, the organic flattening layer 2Pb, together with the OLED layer 3, has an inorganic protective layer 2Pa and a first inorganic material. It is surrounded by a joint that is in direct contact with the barrier layer 12. Therefore, the above-mentioned problem of the OLED display device 100C of the comparative example can be solved.

Next, with reference to FIGS. 9 and 10, an example of the TFT used in the OLED display device 100A and an example of the lead wiring and the terminal formed by using the gate metal layer and the source metal layer when manufacturing the TFT. explain. The structure of the TFT, the lead-out wiring, and the terminal described below can be used for the OLED display device 100A of the above-described embodiment.

High-definition small and medium-sized OLED display devices include high-mobility low-temperature polysilicon (abbreviated as "LTPS") TFTs or oxide TFTs (for example, In (indium), Ga (gallium), Zn (zinc). ), O (oxygen) -containing quaternary (In-Ga-Zn-O) oxide TFT) is preferably used. Since the structures and manufacturing methods of LTPS-TFTs and In-Ga-Zn-O-based TFTs are well known, only a brief description will be given below.

9 (a) is a schematic sectional view of the _{LTPS-TFT2 P T, TFT2 P} T may be included in the circuit 2 of the OLED display device 100A. LTPS-TFT2 _P T is a top-gate type TFT.

The TFT 2 _{P T is formed on the base coat 2 P} p on the substrate (for example, a polyimide film) 1. Although omitted in the above description, it is preferable to form a base coat formed of an inorganic insulator on the substrate 1.

The TFT 2 _P T is formed on the polysilicon layer 2 _P se formed on the base coat 2 _P p, the gate insulating layer 2 _P gi formed on the polysilicon layer 2 _P se, and the gate insulating layer 2 _P gi. The gate electrode 2 _P g, the interlayer insulating layer 2 _P i formed on the gate electrode 2 _P g, the source electrode 2 _P ss and the drain electrode 2 _P sd formed on the interlayer insulating layer 2 _{P i.} have. The source electrode 2 _P ss and the drain electrode 2 _P sd are connected to the source region and the drain region of the _{polysilicon layer 2 P} se in the contact holes formed in the interlayer insulating layer 2 _P i and the gate insulating layer 2 _{P gi, respectively.} Has been done.

The gate electrode 2 _P g is contained in the same gate metal layer as the gate bus line, and the source electrode 2 _P ss and the drain electrode 2 _P sd are contained in the same source metal layer as the source bus line. Drawer wiring and terminals are formed using the gate metal layer and the source metal layer (described later with reference to FIG. 10).

TFT 2 _P T, for example, be fabricated in the following manner.

As the substrate 1, for example, a polyimide film having a thickness of 15 μm is prepared.

A base coat 2 _P p (SiO ₂ film: 250 nm / SiN _x film: 50 nm / SiO ₂ film: 500 nm (upper layer / intermediate layer / lower layer)) and an a-Si film (40 nm) are formed by a plasma CVD method.

The a-Si film is dehydrogenated (for example, annealed at 450 ° C. for 180 minutes).

The a-Si film is polysiliconed by an excimer laser annealing (ELA) method.

An active layer (semiconductor island) is formed by patterning an a-Si film in a photolithography process.

A gate insulating film (SiO ₂ film: 50 nm) is formed by a plasma CVD method.

^{Doping (B +} ) is performed on the channel region of the active layer.

Gate metal: a (Mo 250 nm) was deposited by sputtering, (to form the gate electrode 2 _P g and the gate bus lines, etc.) that a photolithography process for patterning (including a dry etching process).

^{Doping (P +} ) is performed on the source region and drain region of the active layer.

Activation annealing (eg, annealing at 450 ° C. for 45 minutes) is performed. Polysilicon layer 2 _P se is thus obtained.

An interlayer insulating film (for example, SiO ₂ film: 300 nm / SiN _x film: 300 nm (upper layer / lower layer)) is formed by a plasma CVD method.

Contact holes are formed in the gate insulating film and the interlayer insulating film by dry etching. In this way, the interlayer insulating layer 2 _P i and the gate insulating layer 2 _P gi are obtained.

A source metal (Ti film: 100 nm / Al film: 300 nm / Ti film: 30 nm) is formed by a sputtering method and patterned by a photolithography process (including a dry etching process) (source electrode 2 _P ss, drain electrode 2 _P). sd and source bus line etc. are formed).

After that, the above-mentioned inorganic protective layer 2Pa (see FIGS. 2 and 3) is formed by, for example, a plasma CVD method.

9 (b) is a schematic cross-sectional view of the In-Ga-Zn-O-based TFT2 _O T, TFT2 _O T may be included in the circuit 2 of the OLED display device 100A. The TFT2 _O T is a bottom gate type TFT.

TFT 2 _O T is formed on a substrate (e.g., polyimide film) over the basecoat 2 _O p on 1. TFT 2 _O T includes a base coat 2 _O p on the formed gate electrode 2 _O g, a gate insulating layer 2 _O gi formed on the gate electrode 2 _O g, was formed on the gate insulating layer 2 _O gi has the oxide semiconductor layer 2 _O se, an oxide semiconductor layer 2 _O se source electrode 2 is connected to the source regions and drain regions of _O ss and the drain electrode 2 _O sd. The source electrode 2 _O ss and the drain electrode 2 _O sd are covered with an interlayer insulating layer 2 _{O i.}

The gate electrode 2 _O g is included in the same gate metal layer and the gate bus line, a source electrode 2 _O ss and drain electrodes 2 _O sd are included in the same source metal layer and the source bus line. The gate metal layer and the source metal layer are used to form lead wiring and terminals, which may have a structure described below with reference to FIG.

TFT 2 _O T is prepared, for example, in the following manner.

As the substrate 1, for example, a polyimide film having a thickness of 15 μm is prepared.

Basecoat 2 _O p deposited (SiO ₂ film: 250 nm / SiN _x film:: 50 nm / SiO ₂ film 500 nm (upper / middle layer / lower layer)) with a plasma CVD method.

Gate metal (Cu film: 300 nm / Ti layer: 30 nm (upper / lower layer)) was deposited by sputtering and patterned by photolithography process (including dry etching step) (gate electrode 2 _O g and the gate bus line or the like To form).

A gate insulating film (SiO ₂ film: 30 nm / SiN _x film: 350 nm (upper layer / lower layer)) is formed by a plasma CVD method.

An active layer (semiconductor island) is formed by forming an oxide semiconductor film (In-Ga-Zn-O-based semiconductor film: 100 nm) by a sputtering method and patterning it in a photolithography step (including a wet etching step). do.

A source metal (Ti film: 100 nm / Al film: 300 nm / Ti film: 30 nm (upper layer / intermediate layer / lower layer)) is formed by a sputtering method and patterned by a photolithography step (including a dry etching step) (source electrode). 2 _O ss, the drain electrode 2 _O sd and source bus lines, etc.).

Activation annealing (eg, annealing at 300 ° C. for 120 minutes) is performed. In this way, the oxide semiconductor layer 2 _O se is obtained.

Thereafter, as a protective film, an interlayer insulating layer 2 _O i (e.g., SiN _x film: 300 nm / SiO ₂ film: 300 nm (upper / lower layer)) is formed with a plasma CVD method. The interlayer insulating layer 2 _O i can also serve as the above-mentioned inorganic protective layer 2 Pa (see FIGS. 2 and 3). Of course, on the interlayer insulating layer 2 _O i, may be further formed an inorganic protective layer 2 Pa.

Next, the structure of another OLED display device according to the embodiment will be described with reference to FIGS. 10 (a) to 10 (c). Circuit (backplane) 2 of the OLED display device has a TFT 2 _O T shown in TFT 2 _P T or FIG 9 (b) shown in FIG. 9 (a), to produce a TFT 2 _P T or TFT 2 _O T The lead-out wiring 32A and the terminal 34A are formed by using the gate metal layer and the source metal layer. 10 (a) to 10 (c) correspond to FIGS. 4 (b) to 4 (d), respectively, and "A" is added to the reference code of the corresponding component. Furthermore, the base coat 2p in FIG. 10 corresponds to the base coat 2 _O p in FIG. 2 _P p and the base coat in FIG. 9 (a) 9 (b), the gate insulating layer 2gi in FIG. 10, FIG. 9 ( Corresponding to the gate insulating layer 2 _P gi in a) and the gate insulating layer 2 _O gi in FIG. 9 (b), the interlayer insulating layer 2i in FIG. 10 corresponds to the interlayer insulating layer 2 _{P in FIG. 9 (a).} Corresponds to i and _{the interlayer insulating layer 2 O} i in FIG. 9 (b), respectively.

As shown in FIGS. 10A to 10C, the gate metal layer 2g and the source metal layer 2s are formed on the base coat 2p formed on the substrate 1. Although omitted in FIGS. 3 and 4, it is preferable to form a base coat 2p formed of an inorganic insulator on the substrate 1.

As shown in FIGS. 10A to 10C, the drawer wiring 32A and the terminal 34A are formed as a laminate of the gate metal layer 2g and the source metal layer 2s. The portion formed by the gate metal layer 2g of the leader wiring 32A and the terminal 34A has the same cross-sectional shape as, for example, the gate bus line, and the portion formed by the source metal layer 2s of the drawer wiring 32A and the terminal 34A is, for example, a source. It has the same cross-sectional shape as the bus line. For example, in the case of a 5.7-inch display device of 500 ppi, the line width of the portion formed by the gate metal layer 2 g is, for example, 10 μm, the distance between adjacent portions is 16 μm (L / S = 10/16), and the source metal. The line width of the portion formed by the layer 2s is, for example, 16 μm, and the distance between the adjacent layers is 10 μm (L / S = 16/10). The taper angle θ is less than 90 °, preferably less than 70 °, and more preferably 60 ° or less. The taper angle of the portion formed under the organic flattening layer Pb may be 90 ° or more.

Next, with reference to FIG. 11, the structure and manufacturing method of another OLED display device according to another embodiment of the present invention will be described. OLED display device shown in FIG. 11 has a LTPS-TFT 2 _P T shown in Figure 9 (a). Of course, instead of the LTPS-TFT 2 _P T, it can either be used an In-Ga-Zn-O-based TFT 2 _O T shown in FIG. 9 (b), it is possible to use other known of the TFT. _{Further, FIGS. 11A and 11B also show a common wiring 2 P} c and a contact portion 2 _P cV electrically connected to the upper electrode (common electrode) 46 of the OLED.

The OLED display device 100D of the present embodiment further has a second inorganic protective layer 2Pa2 formed on the organic flattening layer 2Pb, and the arithmetic average roughness Ra of the surface of the second inorganic protective layer 2Pa2 is 50 nm or less. In that respect, it differs from the previous embodiment.

High flatness is required for the lower electrode of the OLED3 and the organic layer (also referred to as an organic EL layer, including at least an organic light emitting layer). If the flatness is low, for example, the luminous efficiency of the OLED 3 decreases. Since the organic flattening layer 2Pb is formed from a liquid organic resin material (which may contain a solvent) applied to the surface of the element substrate (referred to as an element substrate for simplicity during manufacturing), it is organic. It is possible to absorb the unevenness (step) of the base of the flattening layer 2Pb and form a flat surface. However, the surface of the organic resin film formed from the liquid resin material has an arithmetic average roughness Ra of more than 100 nm and a roughness of up to about 300 nm (which can be expressed as “waviness”) (FIG. 11). (A). If the OLED 3 is formed on the organic flattening layer 2Pb having such a surface roughness, the luminous efficiency cannot be sufficiently improved. For example, even if a microcavity structure is adopted, there is a problem that the effect cannot be sufficiently exhibited.

Therefore, in the embodiment according to the present invention, a second inorganic protective film is formed on the organic resin film formed as described above, and chemical mechanical polishing (CMP) is formed on the surface of the second inorganic protective film. , Hereinafter referred to as "CMP"). By applying CMP, the arithmetic mean roughness Ra of the second inorganic protective film is controlled to 50 nm or less, preferably 30 nm or less. The arithmetic average roughness Ra is preferably small, and the lower limit is not limited. However, considering the relationship between the cost and time required for CMP and the effect, the arithmetic average roughness Ra may be 10 nm or more, and may be 20 nm or more. May be.

The surface roughness can be measured using, for example, a confocal laser scanning microscope or an atomic force microscope (AFM). The measurement range preferably includes the vicinity of the center of the pixel, and the reference length is appropriately set according to the surface roughness.

In the present specification, in order to distinguish between the flattening by the organic flattening layer 2Pb and the flattening by CMP, the flattening by CMP may be referred to as "smoothing".

FIG. 11A shows a first inorganic protective film 2Pa1 serving as a first inorganic protective layer 2Pa1, an organic flattening film 2Pb serving as an organic flattening layer 2Pb, and a second inorganic protective layer 2Pa2 on the drive circuit layer 2. The state immediately after the formation of the second inorganic protective film 2Pa2 is schematically shown. The first inorganic protective film 2Pa1 and the second inorganic protective film 2Pa2 are selectively formed in a desired region by a metal mask. Further, the organic flattening film 2Pb is selectively coated or formed on a desired region of the element substrate 20, or is once formed on the entire surface, and then unnecessary portions are removed. The first inorganic protective film 2Pa1 and the second inorganic protective film 2Pa2 are different from the first inorganic protective layer 2Pa1 and the second inorganic protective layer 2Pa2 in that they do not have openings such as contact holes, respectively, but for the sake of simplicity. Indicated by the same reference code. Similarly, the organic flattening film 2Pb is different from the organic flattening layer 2Pb in that it does not have an opening such as a contact hole, but is indicated by the same reference numeral for simplicity. The first inorganic protective layer 2Pa1 and the second inorganic protective layer 2Pa2 are formed in the same manner as the above-mentioned inorganic protective layer 2Pa.

The surface 2Pb_Sa of the organic flattening film 2Pb has an arithmetic average roughness Ra of more than 100 nm and a roughness of up to about 300 nm. When formed using a non-photosensitive resin, a surface having a smaller arithmetic mean roughness can be obtained due to the effect of adding a leveling agent or the like, as compared with the case where it is formed using a photosensitive resin. Exceeds 50 nm.

The surface roughness of the surface 2Pa2_Sa of the second inorganic protective film 2Pa2 formed on the surface 2Pb_Sa of the organic flattening film 2Pb reflects the surface roughness of the surface 2Pb_Sa of the organic flattening film 2Pb, and its arithmetic mean. Roughness Ra exceeds 50 nm.

Therefore, in the OLED display device 100D of the embodiment according to the present invention, as shown in FIG. 11B, the surface 2Pa2_Sb of the second inorganic protective film 2Pa2 is smoothed, and the arithmetic average roughness Ra is 50 nm or less. Is controlled by.

The thickness of the second inorganic protective film 2Pa2 at the time of film formation (FIG. 11A) is set to be about 3 times or more the arithmetic mean roughness Ra of the surface 2Pb_Sa of the organic flattening film 2Pb, and the surface is CMPed. , Obtain a surface 2Pa2_Sb having an arithmetic mean roughness Ra of 50 nm or less. The arithmetic mean roughness Ra of the surface 2Pa2_Sb is preferably 30 nm or less. The arithmetic average roughness Ra is preferably small, and the lower limit is not limited. However, considering the relationship between the cost and time required for CMP and the effect, the arithmetic average roughness Ra may be 10 nm or more, and may be 20 nm or more. May be.

For example, when the second inorganic protective film 2Pa2 is formed by a plasma CVD method with a single layer of _{SiN x film, for example, if the SiN x} film is formed at a film formation rate not exceeding 10 nm / s, the organic flatness as the base thereof is formed. The surface 2Pa2_Sa of the second inorganic protective film 2Pa2 that reflects the arithmetic mean roughness Ra of the surface 2Pb_Sa of the chemical film 2Pb almost as it is is obtained. By applying the subsequent CMP, the surface 2Pa2_Sb of the second inorganic protective film 2Pa2 is smoothed so that the arithmetic mean roughness Ra is 50 nm or less.

CMP is performed using, for example, _{a slurry containing a neutral ceria (CeO 2} ) -based abrasive, or a slurry containing a fumed silica-based or colloidal silica-based abrasive. Alternatively, a slurry containing alumina (Al ₂ O ₃ ) powder can also be used. As the chemical solution, in addition to a neutral aqueous solution or alcohol, when the substrate 1 is a glass substrate, a KOH aqueous solution can be used. When the substrate 1 is a polyimide film, a neutral chemical solution is preferable. The load of the polishing pad ^{is preferably 50 g / cm 2} or more and 150 g / cm ² or less, and the rotation speed is preferably 20 rpm or more and 40 rpm or less. The time required for polishing is about 30 seconds to about 150 seconds.

In the OLED display device according to the embodiment of the present invention, the level of smoothing required to suppress the decrease in light emission efficiency is higher than the level of smoothing required for the photo process of the VLSI and the surface of the optical lens. Since it is about an order of magnitude lower (the value of the arithmetic mean roughness Ra is about 10 times larger), a known polishing agent generally used for CMP can be widely used.

By smoothing the surface of the second inorganic protective layer 2Pa2, the lower electrode, the organic layer and the upper electrode of the OLED 3 formed on the second inorganic protective layer 2Pa2 can be smoothed, so that the luminous efficiency of the OLED display device is improved. Can be made to.

Next, by collectively patterning the first inorganic protective film 2Pa1, the organic flattening film 2Pb, and the second inorganic protective film 2Pa2 formed in the desired region of the element substrate 20, the openings of the contact holes CH1, CH2, etc. To form. This patterning can be performed by, for example, dry etching using a mixed gas of _{O 2} and CF _4. Therefore, the resin forming the organic flattening film 2Pb does not have to have photosensitivity. As shown in FIG. 11C, in order to form a portion in which the first inorganic protective layer 2Pa1 and the first inorganic barrier layer (not shown) constituting the TFE structure 10D are in direct contact with each other, the first inorganic protective layer is protected. The portion that leaves only the layer 2Pa1 can be formed, for example, by using a multi-gradation mask.

Next, the lower electrode 42 and the contact portion 43 for the upper electrode are formed. The lower electrode 42 is electrically connected to the _{drain electrode 2 P sd in the contact hole CH1.}

Next, the bank layer 48 that defines each of the plurality of pixel Pix is formed. The bank layer 48 has an opening corresponding to the pixel Pix, and the side surface of the opening has a slope having a forward tapered side surface portion. The slope of the bank layer 48 surrounds each pixel. The bank layer 48 is formed using, for example, a photosensitive resin (for example, polyimide or acrylic resin). The thickness of the bank layer 48 is, for example, 1 μm or more and 2 μm or less. The inclination angle of the slope of the bank layer 48 is 60 ° or less. If the inclination angle θb of the slope of the bank layer 48 is more than 60 °, defects may occur in the layer located above the bank layer 48.

As described above, it is preferable to heat (bake) in order to remove the moisture contained in the bank layer 48 and the moisture contained in the organic flattening layer 2Pb. The heating temperature is preferably 100 ° C. or higher (for example, 1 hour or longer), and more preferably 250 ° C. or higher (for example, 15 minutes or longer). The atmosphere may be atmospheric pressure. The heating time can be shortened by heating in a reduced pressure atmosphere. The bank layer 48 and the organic flattening layer 2Pb are preferably formed of a resin material having high heat resistance, and are preferably made of, for example, polyimide so that thermal deterioration does not occur in this heating (baking) step. Is preferable.

After that, the production of the element substrate may be interrupted, and the element substrate may be stored or transported. In that case, as described above, a positive photoresist film covering the surface of the device substrate formed up to the bank layer 48 may be formed. A clean surface can be obtained by removing the photoresist film after storage or transfer and just before the formation of the organic layer 44. Further, immediately before the formation of the organic layer 44, the water contained in the organic flattening layer 2Pb and the bank layer 48 is removed by heating.

Next, the organic layer 44 is formed on the lower electrode 42. The organic layer 44 is formed, for example, by a vapor deposition method. The upper electrode 46 is formed on the organic layer 44. The upper electrode 46 comes into contact with the contact portion 43 for the upper electrode and is electrically connected to the common wiring 2 _{P c via the contact portion 2 P cV.}

The lower electrode 42 and the upper electrode 46 form, for example, an anode and a cathode, respectively. The upper electrode 46 is a common electrode formed over the entire pixel in the active region, and the lower electrode (pixel electrode) 42 is formed for each pixel. If the bank layer 48 is present between the lower electrode 42 and the organic layer 44, holes are not injected from the lower electrode 42 into the organic layer 44. Therefore, since the region where the bank layer 48 exists does not function as the pixel Pix, the bank layer 48 defines the outer edge of the pixel Pix. The bank layer 48 is sometimes called a PDL (Pixel Defining Layer).

After forming the OLED 3 in this way, the TFE structure 10D is formed. The TFE structure 10D has the same structure as the TFE structure 10A described above. That is, the TFE structure 10D has a first inorganic barrier layer (for example, SiN _x layer) 12, an organic barrier layer 14, and a second inorganic barrier layer (for example, SiN _x layer) 16 from the side close to OLED3. .. As shown in FIG. 11C, the first inorganic barrier layer 12 is in contact with the upper surface and the inclined side surface of the second inorganic protective layer 2Pa2, the inclined side surface of the organic flattening layer 2Pb, and the upper surface of the first inorganic protective layer 2Pa1. ing. That is, the OLED display device 100D has a structure similar to that of the OLED display device 100A shown in FIG. 3B at its end, and has excellent moisture resistance and reliability.

Next, the film forming apparatus 200 used for forming the organic barrier layer and the film forming method using the film forming apparatus 200 will be described with reference to FIGS. 12 (a) and 12 (b). 12 (a) and 12 (b) are views schematically showing the configuration of the film forming apparatus 200, and FIG. 12 (a) is a chamber containing a vapor of a photocurable resin or a atomized photocurable resin. The state of the film forming apparatus 200 in the step of condensing the photocurable resin on the first inorganic barrier layer is shown in FIG. 12 (b). The state of the film forming apparatus 200 in the step of curing a curable resin is shown.

The film forming apparatus 200 has a chamber 210 and a partition wall 234 that divides the inside of the chamber 210 into two spaces. A stage 212 and a shower plate 220 are arranged in one of the spaces inside the chamber 210, which is partitioned by the partition wall 234. The ultraviolet irradiation device 230 is arranged in the other space partitioned by the partition wall 234. The space inside the chamber 210 is controlled to a predetermined pressure (vacuum degree) and temperature. The stage 212 has an upper surface that receives the element substrate 20 having a plurality of OLEDs 3 on which the first inorganic barrier layer is formed, and the upper surface can be cooled to, for example, −20 ° C.

The shower plate 220 is arranged so as to form a gap 224 between the shower plate 220 and the partition wall 234, and has a plurality of through holes 222. The vertical size of the gap 224 can be, for example, 100 mm or more and 1000 mm or less. The acrylic monomer (steam or mist) supplied to the gap 224 is supplied to the space on the stage 212 side in the chamber 210 from the plurality of through holes 222 of the shower plate 220. If necessary, the acrylic monomer is heated. The vapor of the acrylic monomer or the atomized acrylic monomer 26p adheres to or comes into contact with the first inorganic barrier layer of the device substrate 20. The acrylic monomer 26 is supplied from the container 202 into the chamber 210 at a predetermined flow rate. Acrylic monomer 26 is supplied to the container 202 via the pipe 206, and nitrogen gas is supplied from the pipe 204. The flow rate of the acrylic monomer to the container 202 is controlled by the mass flow controller 208. The raw material supply device is composed of a shower plate 220, a container 202, pipes 204, 206, a mass flow controller 208, and the like.

The ultraviolet irradiation device 230 has an ultraviolet light source and an optional optical element. The ultraviolet light source may be, for example, an ultraviolet lamp (for example, a mercury lamp (including high pressure and ultrahigh pressure), a mercury xenon lamp or a metal halide lamp). Optical elements are, for example, reflectors, prisms, lenses, and diffraction elements.

When the ultraviolet irradiation device 230 is arranged at a predetermined position, it emits light having a predetermined wavelength and intensity toward the upper surface of the stage 212. The partition wall 234 and the shower plate 220 are preferably made of a material having a high ultraviolet transmittance, for example, quartz.

The organic barrier layer 14 can be formed by using the film forming apparatus 200, for example, as follows. Here, an example in which an acrylic monomer is used as the photocurable resin will be described.

Acrylic monomer 26p is supplied into the chamber 210. The element substrate 20 is cooled on the stage 212 to, for example, −15 ° C. The acrylic monomer 26p is condensed on the first inorganic barrier layer 12 of the device substrate 20. By controlling the conditions at this time, the liquid acrylic monomer can be unevenly distributed only around the convex portion of the first inorganic barrier layer 12. Alternatively, the conditions are controlled so that the acrylic monomer condensed on the first inorganic barrier layer 12 forms a liquid film.

By adjusting the viscosity and / or surface tension of the liquid photocurable resin, the thickness of the liquid film and the shape (concave shape) of the portion of the first inorganic barrier layer 12 in contact with the convex portion can be controlled. For example, the viscosity and surface tension are temperature dependent and can be controlled by adjusting the temperature of the device substrate. For example, the size of the solid portion existing on the flat portion can be controlled by the shape (concave shape) of the portion of the liquid film in contact with the convex portion of the first inorganic barrier layer 12 and the conditions of the ashing treatment to be performed later.

Subsequently, the ultraviolet irradiation device 230 is used to irradiate the entire upper surface of the element substrate 20 with ultraviolet rays 232 to cure the acrylic monomer on the first inorganic barrier layer 12. As the ultraviolet light source, for example, a high-pressure mercury lamp having a main peak at 365 nm is used, and irradiation is performed at an ultraviolet intensity of, for example, 12 mW / cm ² for about 10 seconds.

The organic barrier layer 14 made of acrylic resin is formed in this way. The tact time of the process of forming the organic barrier layer 14 is, for example, less than about 30 seconds, and the mass productivity is very high.

After curing the liquid film-like photocurable resin, the organic barrier layer 14 may be formed only around the convex portion through an ashing treatment. The ashing treatment may also be applied when the organic barrier layer 14 is formed by curing the unevenly distributed photocurable resin. By the ashing treatment, the adhesiveness between the organic barrier layer 14 and the second inorganic barrier layer 16 can be improved. That is, the ashing treatment may be used not only for removing an excess portion of the organic barrier layer once formed, but also for modifying (hydrophilizing) the surface of the organic barrier layer 14.

Ashing can be performed using a known plasma ashing device, photoexcited ashing device, or UV ozone ashing device. For example, _{plasma ashing using at least one of N 2} O, O ₂ and O ₃ gas, or a combination of these with ultraviolet irradiation can be performed. _{When a SiN x} film is formed as the first inorganic barrier layer 12 and the second inorganic barrier layer 16 by the CVD method, N ₂ O is used as the raw material gas, so that the apparatus can be simplified by using _{N 2 O for ashing.} The advantage is obtained.

When ashing is performed, the surface of the organic barrier layer 14 is oxidized and modified to be hydrophilic. Further, the surface of the organic barrier layer 14 is scraped almost uniformly, and extremely fine irregularities are formed to increase the surface area. The surface area increasing effect when ashing is performed is greater on the surface of the organic barrier layer 14 than on the first inorganic barrier layer 12, which is an inorganic material. Therefore, since the surface of the organic barrier layer 14 is modified to be hydrophilic and the surface area is increased, the adhesion to the second inorganic barrier layer 16 is improved.

After that, it is conveyed to a CVD chamber for forming the second inorganic barrier layer 16, and for example, the second inorganic barrier layer 16 is formed under the same conditions as the first inorganic barrier layer 12. Since the second inorganic barrier layer 16 is formed in the region where the first inorganic barrier layer 12 is formed, the first inorganic barrier layer 12 and the second inorganic barrier layer 16 are formed in the non-solid portion of the organic barrier layer 14. An inorganic barrier layer joint is formed in direct contact with. Therefore, as described above, it is suppressed / prevented that water vapor in the atmosphere reaches the active region through the organic barrier layer.

The first inorganic barrier layer 12 and the second inorganic barrier layer 16 are formed, for example, as follows. A plasma CVD method using SiH ₄ and N ₂ O gas, for example, in a state where the temperature of the substrate (OLED3) to be filmed is controlled to 80 ° C. or lower, the film formation rate is 400 nm / min, and the thickness is 400 nm. An inorganic barrier layer can be formed. The refractive index of the inorganic barrier layer thus obtained is 1.84, and the transmittance of visible light at 400 nm is 90% (thickness 400 nm). The absolute value of the film stress is 50 MPa.

As the inorganic barrier layer, in addition to the SiN _x layer, a SiO ₂ layer, a SiO _x N _y (x> y) layer, a SiN _{x Oy} (x> y) layer, an Al ₂ O ₃ layer, or the like can also be used. .. The photocurable resin contains, for example, a vinyl group-containing monomer. Among them, an acrylic monomer is preferably used. A photopolymerization initiator may be mixed with the acrylic monomer, if necessary. Various known acrylic monomers can be used. A plurality of acrylic monomers may be mixed. For example, a bifunctional monomer and a trifunctional or higher functional monomer may be mixed. Further, the oligomer may be mixed. The viscosity of the photocurable resin at room temperature (for example, 25 ° C.) before curing preferably does not exceed 10 Pa · s, and particularly preferably 1 to 100 mPa · s. If the viscosity is high, it may be difficult to form a thin liquid film having a thickness of 500 nm or less.

In the above, an embodiment of an OLED display device having a flexible substrate and a method for manufacturing the same has been described, but the embodiment of the present invention is not limited to the examples, and is formed on a substrate having no flexibility (for example, a glass substrate). It can be widely applied to an organic EL device having an organic EL element and a thin film sealing structure formed on the organic EL element (for example, an organic EL lighting device).

Embodiments of the present invention are used in organic EL devices and methods for manufacturing them. The embodiment of the present invention is particularly preferably used for a flexible organic EL display device and a method for manufacturing the same.

1: Flexible board 2: Backplane (circuit)
2Pa: Inorganic protective layer (first inorganic protective layer), inorganic protective film (first inorganic protective film)
2Pa1: 1st inorganic protective layer, 1st inorganic protective film 2Pa2: 2nd inorganic protective layer, 2nd inorganic protective film 2Pb: Organic flattening layer, organic flattening film 3: Organic EL element 4: Polarizing plate 10: Thin film sealing Stop structure (TFE structure)
12: First inorganic barrier layer (SiN _x layer)
14: Organic barrier layer (acrylic resin layer)
16: Second inorganic barrier layer (SiN _x layer)
20: Element substrate 26: Acrylic monomer 26p: Vapor or mist-like acrylic monomer of acrylic monomer 100, 100A, 100D: Organic EL display device 200: Film forming device

Claims (10)

With the board
A plurality of TFTs formed on the substrate, a plurality of gate bus lines and a plurality of source bus lines each connected to any of the plurality of TFTs, a plurality of terminals, the plurality of terminals, and the plurality of terminals. A drive circuit layer having a plurality of lead wires connecting to either the gate bus line of the above or the plurality of source bus lines.
A first inorganic protective layer formed on the drive circuit layer and exposing at least the plurality of terminals,
The organic flattening layer formed on the first inorganic protective layer and
A second inorganic protective layer formed on the organic flattening layer, which has a surface having an arithmetic average roughness Ra of 50 nm or less, and a second inorganic protective layer.
An organic EL element layer having a plurality of organic EL elements formed on the second inorganic protective layer and each connected to any of the plurality of TFTs.
It has a first inorganic barrier layer formed so as to cover the organic EL element layer, an organic barrier layer in contact with the upper surface of the first inorganic barrier layer, and a second inorganic barrier layer in contact with the upper surface of the organic barrier layer. The organic barrier layer is formed in a region surrounded by an inorganic barrier layer joint in which the first inorganic barrier layer and the second inorganic barrier layer are in direct contact with each other. And have
When viewed from the normal direction of the substrate, the organic flattening layer is formed in the region where the first inorganic protective layer is formed, and the organic flattening layer is formed in the region where the organic flattening layer is formed. A plurality of organic EL elements are arranged, the outer edge of the thin film sealing structure intersects the plurality of drawer wirings, and between the outer edge of the organic flattening layer and the outer edge of the first inorganic protective layer. Exists in
A cross section of the first inorganic barrier layer parallel to the line width direction of the plurality of leader wirings at a portion where the first inorganic protective layer and the first inorganic barrier layer come into direct contact with each other on the plurality of leader wirings. The side taper angle in the shape of is less than 90 °, an organic EL device. The organic EL device according to claim 1, wherein the taper angle of the side surface of the first inorganic barrier layer is less than 70 °. The organic EL device according to claim 1 or 2, wherein the organic flattening layer is formed of a non-photosensitive resin. The organic EL device according to any one of claims 1 to 3, wherein the organic flattening layer is formed of polyimide. The method for manufacturing an organic EL device according to any one of claims 1 to 4.
Step A of forming the drive circuit layer on the substrate,
Step B of forming the first inorganic protective film on the drive circuit layer,
Step C of forming an organic flattening film on the first inorganic protective film,
Step D of forming the second inorganic protective film on the organic flattening film,
Step E of applying chemical mechanical polishing to the surface of the second inorganic protective film,
Step F to obtain the first inorganic protective layer, the organic flattening layer and the second inorganic protective layer by patterning the first inorganic protective film, the organic flattening film and the second inorganic protective film.
In step G of heating the organic flattening layer to a temperature of 100 ° C. or higher,
A manufacturing method comprising the step H of forming the organic layer contained in the organic EL element on the second inorganic protective layer after the step G. The production method according to claim 5, wherein the step F includes a step of collectively forming a contact hole penetrating the first inorganic protective film, the organic flattening film, and the second inorganic protective film. After the step F and before the step G, the step F1 of forming a positive photoresist film covering the organic flattening layer and the step F1 in which the photoresist film is fully exposed and then developed are used. The production method according to claim 5 or 6, further comprising the step F2 for removing the photoresist film. The manufacturing method according to claim 7, further comprising a step of storing or transporting the substrate on which the photoresist film is formed between the step F1 and the step F2. After the step H, the step I of selectively forming the first inorganic barrier layer in the active region where the plurality of organic EL elements are formed, and
After the step I, the substrate is placed in the chamber, and the vapor of the photocurable resin or the atomized photocurable resin is supplied into the chamber.
In the step of condensing the photocurable resin on the first inorganic barrier layer, the photocurable resin is not allowed to exist on the portion of the first inorganic barrier layer having a taper angle of less than 90 °. In step K of condensing the photocurable resin,
Any of claims 5 to 8 including the step L of forming the organic barrier layer made of the photocurable resin by irradiating the condensed photocurable resin with light after the step K. The manufacturing method described in. After the step G, the step I of selectively forming the first inorganic barrier layer in the active region where the plurality of organic EL elements are formed, and
After the step I, the substrate is placed in the chamber, and the vapor of the photocurable resin or the atomized photocurable resin is supplied into the chamber.
Step K of condensing the photocurable resin on the first inorganic barrier layer to form a liquid film, and
Step L of forming a photocurable resin layer by irradiating the liquid film of the photocurable resin with light,
The production method according to any one of claims 5 to 8, comprising the step M of forming the organic barrier layer by partially ashing the photocurable resin layer.

Images