JP6835670B2 - Board processing equipment - Google Patents

Description

The present invention relates to a substrate processing apparatus for processing a substrate such as a semiconductor wafer.

Conventionally, a substrate cleaning device for cleaning the surface (first surface) of a substrate has been known. As an example, a substrate cleaning device having a chuck for holding a substrate and a rotating mechanism for rotating the substrate held by the chuck is known (Patent Document 1). In such a substrate processing and cleaning apparatus, as shown in FIG. 1 of Patent Document 1, a member for fixing and supporting the chuck is provided on the back surface (second surface) side of the substrate, so that the chuck rotates. The airflow is turbulent. There is also a problem that the back surface (second surface) of the substrate cannot be cleaned.

On the other hand, in order to reduce such turbulence of the air flow and to clean the back surface of the substrate, a substrate cleaning device having a rotation support portion that supports the substrate while rotating it may be used (Patent Document 2). However, in such a rotary support portion, dust may be generated between the rotating substrate and the rotary support portion, and it is not particularly suitable for final cleaning of the substrate.

Japanese Unexamined Patent Publication No. 2015-153761 Japanese Unexamined Patent Publication No. 10-321572

In order to solve such a problem, a rotated portion connected to a holding portion for holding the substrate and a rotating portion for rotating the rotated portion are provided outside the peripheral edge of the rotated portion, and the rotated portion is rotated. It is conceivable to rotate with. The present invention provides a mechanism for holding a substrate in a holding portion and removing a substrate held by the holding portion in such an embodiment.

The substrate processing apparatus for processing a substrate according to the present invention is
A holding portion having a holding member for holding the substrate and an elastic member for applying an urging force to the holding member.
The rotated part connected to the holding part and
A rotating portion provided outside the peripheral edge of the rotated portion to rotate the rotated portion, and a rotating portion.
An opening device that applies a force on the opposite side to the urging force of the elastic member to open the holding member.
May be provided.

In the substrate processing apparatus according to the present invention
The opening device may approach the holding member from the front surface side of the substrate to open the holding member.

In the substrate processing apparatus according to the present invention
The opening device may have a supporting member that supports the back surface of the substrate when the holding member is opened.

In the substrate processing apparatus according to the present invention
The support member moves closer to the back surface side of the substrate from the front surface side of the substrate, is positioned on the back surface side of the substrate before the holding member is in the open state, and the holding member is in the open state. When it becomes, the back surface of the substrate may be supported.

The substrate processing apparatus according to the present invention
A rotating cup connected to the holding portion or the rotated portion is further provided.
The support member may be located inside the peripheral edge of the rotating cup, passing outside the peripheral edge of the substrate, and being positioned on the back surface side of the substrate.

In the substrate processing apparatus according to the present invention
The opening device has a pressing member that moves along the in-plane direction of the substrate.
The holding portion has a pressed member that is pressed by the pressing member.
When the pressed member is pressed by the pressing member, the holding member may be opened.

The substrate processing apparatus according to the present invention
A rotating cup connected to the holding portion or the rotated portion is further provided.
When viewed from the front surface side of the substrate, the pressed member may be provided between the inner peripheral edge of the rotating cup and the outer peripheral edge of the substrate.

In the substrate processing apparatus according to the present invention
The holding portion may have a swing shaft that swings the holding member in the in-plane direction of the substrate.

In the substrate processing apparatus according to the present invention
The holding portion may have a weight member provided on the base end side of the swing shaft.

In the substrate processing apparatus according to the present invention
Has multiple holding members
The first urging force applied to one holding member may be larger than the second urging force applied to another holding member.

In the substrate processing apparatus according to the present invention
The holding portion has a regulated portion for restricting the inward movement of the holding member.
The rotated portion has a regulating portion for restricting the movement of the regulated portion.
The holding member to which the first urging force is applied may be restricted from moving inward on the outer periphery of the holding member to which the second urging force is applied.

Effect of the present invention

According to the present invention, the substrate is held by the holding portion, and the holding portion itself is rotated by rotating the rotated portion by the rotating portion. For this reason, since a mechanism such as a spindle that causes rubbing against the substrate is not used, dust can be less likely to be generated, and back pollution to the substrate can be reduced. Further, according to the present invention, since a mechanism for supporting the chuck as shown in FIG. 1 of Patent Document 1 is not provided on the back surface (second surface) side of the substrate, the turbulence of the air flow can be reduced. You can also.

FIG. 1 is an upper plan view showing an overall configuration of a substrate processing apparatus including a substrate cleaning apparatus according to the first embodiment of the present invention. FIG. 2 is a side sectional view when the substrate cleaning device according to the first embodiment of the present invention is in the cleaning position. FIG. 3 is a side sectional view when the substrate cleaning device according to the first embodiment of the present invention is in the standby position. FIG. 4 is a side sectional view of the substrate cleaning device according to the first embodiment that can be adopted in the first embodiment of the present invention when it is in the cleaning position. FIG. 5 is a side sectional view when the substrate cleaning device according to the second embodiment that can be adopted in the first embodiment of the present invention is in the cleaning position. FIG. 6 is a side sectional view when the substrate cleaning device according to the modified example of the first embodiment of the present invention is in the standby position. FIG. 7 is a perspective view of a holding portion that can be used in the second embodiment of the present invention. FIG. 8 is a perspective view of an opening device that can be used in the second embodiment of the present invention. 9 (a) is a plan view of an elastic member that can be used in the second embodiment of the present invention, and FIG. 9 (b) is a side view of FIG. 9 (a). FIG. 10 is a perspective view of another holding portion that can be used in the second embodiment of the present invention. FIG. 11 is a side sectional view of a substrate cleaning device that can be used in the second embodiment of the present invention. FIG. 12 is a side sectional view showing a protrusion and a stopper that can be used in the second embodiment of the present invention. FIG. 13 is a plan view showing a plurality of holding portions provided on the rotated portion that can be used in the second embodiment of the present invention. FIG. 14 is a plan view showing another example of a plurality of holding portions provided in the rotated portion that can be used in the second embodiment of the present invention. 15 (a)-(d) are side sectional views showing a series of flow modes of moving modes of the holding member and the opening device that can be used in the second embodiment of the present invention. 16 (a) is a side sectional view showing a holding portion that can be used in the first modification of the second embodiment of the present invention, and FIG. 16 (b) is a holding member in FIG. 16 (a). It is a side sectional view which showed the mode when it became an open state. FIG. 17 is a perspective view of an opening device that can be used in the second and third modifications of the second embodiment of the present invention. FIG. 18 is a side sectional view showing an opening device fixing portion that can be used in the modified example 5 of the second embodiment of the present invention. FIG. 19 is a plan view showing a plurality of holding portions provided on the rotated portion that can be used in the third embodiment of the present invention. FIG. 20 is a side sectional view showing a holding member and an opening device that can be used in the fourth embodiment of the present invention. FIG. 21 is a side sectional view showing a mode in which the holding member and the opening device are moved to one side from the state shown in FIG. FIG. 22 is a side sectional view showing a mode in which the holding member and the opening device are further moved to one side from the state shown in FIG.

First Embodiment << Configuration >>
Hereinafter, the first embodiment of the substrate processing apparatus having the substrate cleaning apparatus according to the present invention will be described with reference to the drawings. In the present embodiment, "the front side of the substrate" means the upper side of FIG. 2, "the back side of the substrate" means the lower side of FIG. 2, and the normal direction of the substrate is "first." It is called "direction", and the in-plane direction of the substrate W is called "in-plane direction". The "front side of the substrate" is also referred to as "one side", and the "back surface side of the substrate" is also referred to as "other side".

As shown in FIG. 1, the substrate processing apparatus has a substantially rectangular housing 110 and a load port 112 on which a substrate W cassette for stocking a large number of substrates W is placed. The load port 112 is arranged adjacent to the housing 110. An open cassette, a SMIF (Standard Mechanical Interface) pod, or a FOUP (Front Opening Unified Pod) can be mounted on the load port 112. The SMIF pod and FOUP are airtight containers that can maintain an environment independent of the external space by storing the substrate W cassette inside and covering it with a partition wall. Examples of the substrate W include semiconductor wafers and the like.

Inside the housing 110, a plurality of (four in the embodiment shown in FIG. 1) polishing units 114a to 114d, a first cleaning unit 116 and a second cleaning unit 118 for cleaning the polished substrate W, and after cleaning A drying unit 120 for drying the substrate W is housed. The polishing units 114a to 114d are arranged along the longitudinal direction of the substrate processing apparatus, and the cleaning units 116 and 118 and the drying unit 120 are also arranged along the longitudinal direction of the substrate processing apparatus. According to the substrate processing apparatus of the present embodiment, a semiconductor wafer having a diameter of 300 mm or 450 mm, a flat panel, CMOS (Complementary Metal Oxide Semiconductor) or CC
Image sensor such as D (Charge Coupled Device), MRAM (Magnetoresistive Random)
In the manufacturing process of the magnetic film in Access Memory), various substrates W can be polished.

The first transfer robot 122 is arranged in the area surrounded by the load port 112, the polishing unit 114a located on the load port 112 side, and the drying unit 120. Further, the transport unit 124 is arranged in parallel with the polishing units 114a to 114d and the cleaning units 116 and 118 and the drying unit 120. The first transfer robot 122 receives the substrate W before polishing from the load port 112 and delivers it to the transfer unit 124, or receives the substrate W after drying from the drying unit 120.

A second transfer robot 126 that transfers the substrate W between the first cleaning unit 116 and the second cleaning unit 118 is arranged between the first cleaning unit 116 and the second cleaning unit 118, and the second cleaning unit is provided. A third transfer robot 128 that transfers the substrate W between the second cleaning unit 118 and the drying unit 120 is arranged between the 118 and the drying unit 120. Further, inside the housing 110, a control unit 50 that controls the movement of each device of the substrate processing device is arranged. In the present embodiment, the mode in which the control unit 50 is arranged inside the housing 110 will be described, but the present invention is not limited to this, and the control unit 50 may be arranged outside the housing 110. , It may be possible to remotely control from a remote location. Further, the control unit 50 may be composed of a plurality of devices, and when the control unit 50 is composed of a plurality of devices, the devices constituting the control unit 50 may be installed in different rooms or different places. , A part of the control unit 50 and the rest of the control unit 50 may be arranged in a remote place.

As the first cleaning unit 116, in the presence of the cleaning liquid, a roll cleaning member extending linearly over almost the entire diameter of the substrate W is brought into contact with the first cleaning unit 116, and the surface of the substrate W is scrubbed while rotating around a central axis parallel to the substrate W. A roll cleaning device for cleaning may be used. Further, as the second cleaning unit 118, in the presence of the cleaning liquid, the lower end contact surface of the cylindrical pencil cleaning member extending in the vertical direction is brought into contact with the lower end contact surface, and the pencil cleaning member is rotated and moved in one direction to move the substrate. A pencil cleaning device that scrubs the surface of W may be used. Further, as the drying unit 120, the IPA steam is ejected from the moving injection nozzle toward the horizontally rotating substrate W to dry the substrate W, and the substrate W is further rotated at high speed to dry the substrate W by centrifugal force. A spin drying unit may be used.

As the first cleaning unit 116, a pencil cleaning device similar to the second cleaning unit 118 may be used instead of the roll cleaning device, or a two-fluid jet cleaning device that cleans the surface of the substrate W with a two-fluid jet may be used. You may. Further, as the second cleaning unit 118, a roll cleaning device similar to that of the first cleaning unit 116 may be used instead of the pencil cleaning device, or a two-fluid jet cleaning device for cleaning the surface of the substrate W with a two-fluid jet may be used. You may. Aspects of the present invention can be applied to both the first cleaning unit 116 and the second cleaning unit 118, and can be used together with a roll cleaning device, a pencil cleaning device, and / or a two-fluid jet cleaning device. The embodiments shown in FIGS. 2 to 6 show typical ones, and the embodiments of the present invention are used for the pencil cleaning device and the two-fluid jet cleaning device.

The cleaning solution of the present embodiment includes a rinse solution such as pure water (DIW), hydrogen peroxide (SC1), hydrogen peroxide (SC2), hydrogen peroxide (SPM), sulfuric acid, hydrofluoric acid, and the like. Contains chemicals. Unless otherwise specified in the present embodiment, the cleaning solution means either a rinsing solution or a chemical solution.

As shown in FIG. 2, the substrate cleaning device according to the embodiment of the present invention is connected to a housing 5, a holding portion 60 including a chuck for holding the substrate W in the housing 5, and a holding portion 60. The rotated portion 30, the rotating portion 35 provided outside the peripheral edge of the rotated portion 30 to rotate the rotated portion 30, and the cleaning portions 10 and 20 for physically cleaning the substrate W held by the holding portion 60. May have. In the embodiment as shown in FIG. 2, the rotated portion 30 is provided inside the housing 5 and the rotating portion 35 is provided outside the housing 5, but the present invention is not limited to this, and the housing 5 Both the rotated portion 30 and the rotating portion 35 may be provided inside. The holding portion 60 is in an open or closed state when the substrate W is not held, and is in a closed state when the substrate W is held. The opening and closing of the holding unit 60 may be controlled based on a command from the control unit 50, or the holding unit 60 is automatically closed by placing the substrate W, and when the substrate W is removed (more than a certain level). It may be automatically opened (by applying the force of).

In the embodiment shown in FIG. 2, only two holding portions 60 are shown, but when viewed from above, the four holding portions 60 are evenly arranged (an angle of 90 ° with respect to the center of rotation) in the present embodiment. May be placed). The number of holding portions 60 may be, for example, three as long as the substrate W can be stably supported. Further, the holding portion 60 may hold the entire peripheral edge of the substrate W. FIG. 2 shows an example in which the substrate W is held in the horizontal direction, but the present invention is not limited to this, and for example, the substrate W may be held in the vertical direction (vertical direction) or tilted in the horizontal direction. It may be configured to hold the substrate W.

The rotating portion 35 may rotate the rotated portion 30 in a state of being in non-contact with the rotated portion 30. As an example, the rotating portion 35 may serve as a stator, the rotated portion 30 may serve as a rotor, and the rotated portion 30 may be rotated in a non-contact state by magnetic force. In this case, the rotated portion 30 may have a magnet, and the rotating portion 35 may have a coil or a coil and a magnet. On the contrary, the rotated portion 30 may have a coil or a coil and a magnet, and the rotating portion 35 may have a magnet. The rotating portion 35 may be provided so as to surround the entire peripheral edge of the housing 5. Incidentally, considering the routing of the wiring to the coil and the like, it is more advantageous that the rotated portion 30 has a magnet and the rotating portion 35 has a coil or a coil and a magnet. The rotating portion 35 and the rotated portion 30 form a so-called bearingless motor that can rotate the rotated portion 30 while controlling its position in the in-plane direction without contacting the rotated portion 30 without supporting the shaft with a bearing. Due to the miniaturization of the board cleaning device, this bearingless motor does not have a separate magnetic bearing to hold the rotor in space. A known bearingless motor can be used. Even when the rotation of the rotated portion 30 is stopped and the substrate W is held and opened, the position of the rotated portion 30 in the first direction, the position in the in-plane direction, and the rotation phase are set to predetermined positions by magnetic force. Can be maintained in phase.

As another example of the rotating portion 35 and the rotated portion 30, the rotating portion 35 and the rotated portion 30 are composed of a combination of a motor, a radial magnetic bearing, and a thrust magnetic bearing as described in JP-A-4-94537. May be good.

The rotated portion 30 may be rotated while the rotating portion 35 is in contact with the rotated portion 30. As an example, each of the rotated portion 30 and the rotating portion 35 has a gear and is physically connected to each other by the gear so that the rotated portion 30 rotates as the rotating portion 35 rotates. May be good.

The cleaning units 10 and 20 physically clean the first surface (upper surface in FIG. 2) of the substrate W and the second surface (lower surface in FIG. 2) opposite to the first surface. It may have a second cleaning unit 20. In the present embodiment, the "first surface" is also referred to as the "front surface (front surface)", and the "second surface" is also referred to as the "back surface".

A rotary cup 40 connected to the holding portion 60 may be provided. Then, the rotating cup 40 may be provided with the rotated portion 30. As an example, as shown in FIG. 2, a rotated portion 30 may be provided at the other end of the rotating cup 40.

A mode in which the rotated portion 30 has a magnet and the rotating portion 35 has a coil or a coil and a magnet, or a mode in which the rotated portion 30 has a coil or a coil and a magnet and the rotating portion 35 has a magnet is adopted. In this case, the rotating cup 40 and the rotated portion 30 do not come into contact with any of the housings 5, and are rotated while floating in the air. According to the embodiment of the present embodiment, the substrate W can be rotated at, for example, 400 rpm to 1250 rpm, preferably 500 rpm to 1000 rpm. By the way, if the rotation speed is too high, the turbulence of the air flow becomes severe, the cleaning liquid scatters greatly, and the substrate W also becomes easy to dry. Therefore, from these viewpoints, it is preferable that the rotation speed is not larger than 1250 rpm, and it is more preferable that the rotation speed is not larger than 1000 rpm. However, according to the aspect of the present embodiment, it is also possible to rotate at 3000 rpm.

When a rotation support portion such as a spindle is adopted, in order to prevent dust generated between the rotation support portion and the substrate W, the rotation support portion is rotated at a maximum rotation speed of 500 rpm. On the other hand, according to the present embodiment, it is possible to rotate at preferably 500 rpm or more, so that the cleaning ability can be enhanced as compared with the case where a rotation support portion such as a spindle is adopted.

Further, as shown in FIG. 2, a support column 41 for supporting the holding portion 60 is provided inside the rotary cup 40, and one end of the support column 41 (a substrate along the normal direction of the substrate W). A holding portion 60 may be provided at the end portion on the W side). In the embodiment shown in FIG. 2, the one-sided end portion of the rotary cup 40 is positioned at a position farther than the substrate W than the one-sided end portion of the holding portion 60. Further, a rotated portion 30 is provided at the other end of the rotating cup 40 (the end opposite to the substrate W along the normal direction of the substrate W), and one side of the support column 41 extending from the rotated portion 30 is provided. When the mode in which the holding portion 60 is provided at the end portion (the end portion on the substrate W side along the normal direction of the substrate W) is adopted, the substrate W is more reliably cooled by the cleaning liquid while the rotated portion 30 is cooled. It is advantageous in that the rotary cup 40 can be positioned outside the peripheral edge of the.

A fixed cup 45 may be provided on the outer periphery of the rotary cup 40. By adopting such a fixed cup 45, it is advantageous in that the turbulence of the air flow caused by the rotating cup 40 can be suppressed.

The rotary cup 40 may be provided with one or more discharge portions (not shown) for draining the cleaning liquid received by the rotary cup 40. The cleaning liquid discharged from the discharge unit may be guided to the drain and drained. When a plurality of discharge parts are provided, the discharge parts may be provided evenly in the circumferential direction. Further, as shown in FIG. 2, a gap is provided between the fixed cup 45 and the rotating cup 40, and the cleaning liquid received by the fixed cup 45 is guided to the drain through the inner wall of the fixed cup 45. , Drainage treatment may be performed.

The cleaning units 10 and 20 may physically clean the substrate W with 0.3N or more and 3N or less. The "physical cleaning" of the present embodiment means cleaning in which a force equal to or higher than the threshold value (for example, 0.3N or more) is applied, and if a force equal to or higher than the threshold value is applied, a fluid such as a two-fluid jet cleaning is used. The cleaning used is also included. When a force exceeding 3N is applied, for example, it is assumed that the sponge member is pressed against the substrate W and the dust cannot be removed. Alternatively, there is a concern that the jet flow from the two-fluid jet may damage the substrate W. Of course, when a force significantly exceeding 3N (for example, a force exceeding 10N) happens to be applied at a position far away from the center of gravity of the substrate W, the substrate W or the rotating cup 40 in which the substrate W floats in the air and rotates is formed. There is a possibility of tilting in some cases. Therefore, the mode in which the rotated portion 30 has a magnet and the rotating portion 35 has a coil or a coil and a magnet, or the mode in which the rotated portion 30 has a coil or a coil and a magnet and the rotating portion 35 has a magnet. When is adopted, the force for physical cleaning is preferably 3N or less. Further, if it is less than 0.3N, the cleaning power for the substrate W is inferior. Therefore, the force for physical cleaning is preferably 0.3 N or more.

As shown in FIG. 2, the first cleaning unit 10 is provided on the first arm 15 that swings around the first swing shaft 16 and the tip end side of the first arm 15, and extends toward the substrate W side. It may also have first cleaning units 11 and 12. In the embodiment shown in FIG. 2, the first cleaning units 11 and 12 have a first fluid jet cleaning unit 12 and a first pencil cleaning unit 11. For example, an actuator or the like is provided as a first moving portion (not shown), and each of the first fluid jet cleaning portion 12 and the first pencil cleaning portion 11 is brought close to the first surface of the substrate W by the first moving portion. , They may be separated in a direction away from the first surface. Further, the first arm 15 itself may be brought closer to the first surface of the substrate W, or may be separated from the first surface. The fluid jet cleaning unit has a two-fluid jet nozzle that ejects a liquid and a mixed fluid of the liquid at high speed.

As shown in FIG. 2, the second cleaning unit 20 is provided on the tip side of the second arm 25 that swings around the second swing shaft 26 and the tip end side of the second arm 25, and extends toward the substrate W side. It may also have second cleaning units 21 and 22. In the embodiment shown in FIG. 2, the second cleaning units 21 and 22 have a second fluid jet cleaning unit 22 and a second pencil cleaning unit 21. The second moving portion (not shown) is composed of, for example, an actuator or the like, and each of the second fluid jet cleaning portion 22 and the second pencil cleaning portion 21 is brought close to the second surface of the substrate W by the second moving portion. It may be separated in a direction away from the second surface. Further, the second arm 25 itself may be brought closer to the second surface of the substrate W, or may be separated from the second surface.

Further, a first chemical solution supply nozzle 91a for supplying the chemical solution and a first rinse solution supply nozzle 91b for supplying the rinse solution may be provided on the first surface. Similarly, a second chemical solution supply nozzle 92a for supplying the chemical solution and a second rinse solution supply nozzle 92b for supplying the rinse solution may be provided on the second surface.

The first pencil cleaning unit 11 is rotatably provided at the tip of the first arm 15, and may be rotated (rotated) around its central axis by a drive mechanism (not shown). This rotation axis is, for example, an axis along the normal direction of the substrate W. The tip of the first pencil cleaning unit 11 may be made of, for example, a PVA sponge. When the first arm 15 is swung around the first swing shaft 16, the first pencil cleaning portion 11 attached to the tip of the first arm 15 draws an arc-shaped locus on the substrate W. To move. The first pencil cleaning unit 11 may pass through the center of the substrate W. Further, the first pencil cleaning unit 11 may be moved to the outer periphery of the substrate W. Further, the movement locus of the first pencil cleaning portion 11 due to the swing of the first arm 15 has an arc shape having the length of the first arm 15 as a radius, and the movement range is from the outer periphery of the substrate W to the substrate W. It may be past the center of.

Similarly, the second pencil cleaning unit 21 is rotatably provided at the tip of the second arm 25, and may rotate (rotate) around its central axis by a drive mechanism (not shown). This rotation axis is, for example, an axis along the normal direction of the substrate W. The second pencil cleaning unit 21 may be made of, for example, PVA. When the second arm 25 is swung around the second swing shaft 26, the second pencil cleaning portion 21 attached to the tip of the second arm 25 draws an arc-shaped locus on the substrate W. To move. The second pencil cleaning unit 21 may pass through the center of the substrate W. Further, the second pencil cleaning unit 21 may be moved to the outer periphery of the substrate W. Further, the movement locus of the second pencil cleaning portion 21 due to the swing of the second arm 25 has an arc shape having the length of the second arm 25 as a radius, and the movement range is from the outer periphery of the substrate W to the substrate W. It may be past the center of.

Each of the first fluid jet cleaning unit 12 and the second fluid jet cleaning unit 22 is for cleaning the substrate W with two fluids in which a liquid and a gas are mixed.

As shown in FIG. 3, the first cleaning unit 10 may not be located above the substrate W during standby. By adopting such an aspect, it is possible to prevent the cleaning liquid from dripping from the first cleaning unit 10 on the substrate W during standby. Further, by preventing the first cleaning unit 10 from being located in the normal direction of the substrate W (upward in FIG. 3) during standby, the first cleaning unit 10 is carried into the housing 5 when the substrate W is carried into the housing 5. It is possible to prevent 10 from becoming an obstacle. Further, it may be positioned at a position farther from the substrate W than the tip of the fixed cup 45 (upper end in FIG. 3) in the normal direction of the substrate W and outside the peripheral edge of the tip of the fixed cup 45. By locating the first cleaning unit 10 at this position, it is possible to more reliably prevent the first cleaning unit 10 from becoming an obstacle when the substrate W is carried into the housing 5.

As shown in FIG. 3, the second cleaning unit 20 is located at a position farther from the substrate W than the rotated portion 30 in the normal direction of the substrate W (downward in FIG. 3) during standby (the rotated portion in FIG. 3). It may be positioned below 30). By locating the second cleaning unit 20 at this position, it is possible to more reliably prevent the second cleaning unit 20 from becoming an obstacle when the substrate W is carried into the housing 5. By the way, the second cleaning unit 20 may not be an obstacle when the substrate W is carried into the housing 5. In this case, it is not necessary to position the second cleaning unit 20 at the standby position as shown in FIG.

"Method"
An example of a substrate W cleaning method (board processing method) using the substrate cleaning device of the present embodiment is as follows. In addition, since it overlaps with the above, only a brief description will be given, but all the aspects described in the above "configuration" can be applied in the "method". On the contrary, all the aspects described in the "method" can be applied in the "configuration". Further, the program for carrying out the method of the present embodiment may be recorded on a recording medium, and by reading the recording medium with a computer (not shown), the method of the present embodiment can be carried out by a substrate processing apparatus. It may be carried out.

First, the substrate W conveyed into the housing 5 by the transfer unit 124 or the second transfer robot 126 is held by the holding portion 60 such as a chuck. At this time, the first cleaning unit 10 and the second cleaning unit 20 are positioned at the standby positions shown in FIG.

Next, the rotated portion 30 is rotated by the rotating portion 35, and as a result, the substrate W held by the holding portion 60 integrally with the rotating cup 40 is rotated. When the substrate W is held by the holding portion 60 in this way, the aspects after the second embodiment described later may be adopted.

While the substrate W is rotating, the chemical solution is supplied to the first surface of the substrate W from the first chemical solution supply nozzle 91a, and the chemical solution is supplied to the second surface of the substrate W from the second chemical solution supply nozzle 92a. .. While the chemical solution is being supplied, the first pencil cleaning unit 11 physically cleans the first surface of the substrate W, and the second pencil cleaning unit 21 physically cleans the second surface of the substrate W. More specifically, the first arm 15 is swung around the first swing shaft 16, and the first pencil cleaning portion 11 is moved through the center of the substrate W to the outer periphery of the substrate W. .. Similarly, the second arm 25 is swung around the second swing shaft 26, and the second pencil cleaning portion 21 passes through the center of the substrate W and is moved to the outer periphery of the substrate W. During this time, each of the first pencil cleaning unit 11 and the second pencil cleaning unit 21 may be rotated while being pressed against the substrate W at 0.3N or more and 3N or less (for example, 2N).

When the cleaning by the first pencil cleaning unit 11 and the second pencil cleaning unit 21 is completed, each of the first pencil cleaning unit 11 and the second pencil cleaning unit 21 is separated from the substrate W. Then, at the same time as or immediately before the supply of the chemical solution is stopped, each of the first fluid jet cleaning unit 12 and the second fluid jet cleaning unit 22 is positioned close to the substrate W, and is placed on the first surface of the substrate W. Two fluids are injected from the first fluid jet cleaning unit 12, and two fluids are injected from the second fluid jet cleaning unit 22 onto the second surface of the substrate W. It is preferable that the two fluids are injected onto the substrate W at the same time as or before the supply of the chemical solution is stopped. The bifluid nozzle can be an external mixing type nozzle in which a liquid and a gas are mixed outside the casing of the bifluid nozzle to form a liquid droplet. Alternatively, instead of this, an internally mixed type nozzle in which a liquid and a gas are mixed inside the nozzle to form droplets of the liquid can be used as a two-fluid nozzle.

While the two fluids are being injected in this way, the first arm 15 is swung around the first swing shaft 16, and the first fluid jet cleaning unit 12 passes through the center of the substrate W. It is moved to the outer circumference of the substrate W. Similarly, the second arm 25 is swung around the second swing shaft 26, and the second fluid jet cleaning unit 22 passes through the center of the substrate W and is moved to the outer periphery of the substrate W. Even in cleaning using such two fluids, a constant pressure acts on the substrate W. This pressure may be 0.3N or more and 3N or less, and is 1.5N as an example.

Simultaneously or immediately before stopping the two-fluid jet cleaning, the chemical solution is supplied to the first surface of the substrate W from the first chemical solution supply nozzle 91a, and the chemical solution is supplied to the second surface of the substrate W from the second chemical solution supply nozzle 92a. To. While the chemical solution is being supplied in this way, the first cleaning unit 10 and the second cleaning unit 20 are positioned at the standby positions shown in FIG.

Next, the rinse liquid is supplied to the first surface of the substrate W from the first rinse liquid supply nozzle 91b, and the rinse liquid is supplied to the second surface of the substrate W from the second rinse liquid supply nozzle 92b. After the time required for the rinse solution to reach the substrate W or a sufficient time has elapsed, the supply of the chemical solution from each of the first chemical solution supply nozzle 91a and the second chemical solution supply nozzle 92a is stopped. A pre-measured time may be used to determine whether the time required for the rinse liquid to reach the substrate W has elapsed. In this case, for example, the control unit 50 may stop the supply of the chemical solution at a scheduled timing by reading the recipe stored in the storage unit (not shown).

After cleaning each of the first surface and the second surface of the substrate W with the rinsing liquid for a predetermined time, the rotation of the substrate W is stopped. More specifically, the rotation of the rotated portion 30 by the rotating portion 35 is stopped, and as a result, the rotation of the substrate W held by the holding portion 60 together with the rotating cup 40 is stopped.

The substrate W is taken out from the housing 5 by the second transfer robot 126 or the third transfer robot 128 in a wet state. When the substrate W is taken out in this way, the substrate W may be removed from the holding portion 60 by adopting the aspects after the second embodiment described later.

In the case of finish cleaning and the substrate W is cleaned by the second cleaning unit 118, even if the substrate W is taken out from the housing 5 by the third transfer robot 128 and the substrate W is conveyed into the drying unit 120. Good. Then, when the substrate W is conveyed into the drying unit 120 in this way, the substrate W is dried by the drying unit 120.

After cleaning with a rinse, the supply of the rinse liquid from the first rinse liquid supply nozzle 91b and the second rinse liquid supply nozzle 92b is stopped, and the substrate W held by the holding unit 60 is rotated at high speed. The rinse solution may be shaken off and dried. In the present embodiment, since the substrate W can be rotated at a rotation speed of up to 3000 rpm, for example, it is possible to dry the substrate W in this way. When this aspect is adopted, it is advantageous in that the process from finish cleaning to drying can be performed in one unit.

As described above, both the first surface and the second surface of the substrate W are simultaneously washed with a chemical solution or a two-fluid jet cleaning using the pencil cleaning portions 11 and 21 to perform the first surface or the first surface. It is advantageous in that the substrate W can be cleaned in a short time as compared with the embodiment in which only one of the two surfaces is cleaned and inverted.

《Action / Effect》
Next, the actions / effects according to the present embodiment having the above-described configuration, which have not been described yet, will be mainly described. In addition, the embodiment described in "Action / Effect" can also be applied in the above "Structure".

In the present embodiment, the substrate W is held by the holding portion 60, and the holding portion 60 itself is rotated by rotating the rotated portion 30 by the rotating portion 35. Therefore, since a mechanism such as a spindle that causes rubbing against the substrate W is not used, dust can be less likely to be generated, and back pollution to the substrate W can be reduced. Further, according to the present embodiment, since the mechanism for supporting the chuck as shown in FIG. 1 of Patent Document 1 is not provided on the back surface (second surface) side of the substrate W, the turbulence of the air flow can be prevented. The amount can be reduced, and the physical cleaning of the back surface (second surface) side of the substrate W can be performed relatively easily.

In particular, as shown in FIGS. 2 to 6, when the rotating portion 35 has a hollow shape, the second cleaning portions 21 and 22 can be accessed from the second surface side without any problem. Therefore, the second surface can be physically cleaned more easily. Further, when the mode in which the rotating portion 35 has a hollow shape is adopted, the member is not provided in the central portion of the rotating member (the one that functions as a blade is not provided). Therefore, it is possible to more reliably prevent the turbulence of the air flow and the generation of negative pressure. If the air flow is turbulent or a negative pressure is generated, the cleaning liquid in the atmosphere may return and adhere to the substrate W, eventually becoming dirty. In this regard, by adopting a mode in which the rotating portion 35 has a hollow shape, it is possible to prevent such an inconvenience from occurring.

Further, according to the present embodiment, both the first surface and the second surface of the substrate W can be easily cleaned at the same time, so that only one of the first surface and the second surface can be cleaned and inverted. In comparison, it is also advantageous in that the substrate W can be cleaned in a short time. Further, while the apparatus configuration becomes large when the substrate W is inverted, according to the present embodiment, it is possible to avoid the apparatus configuration from becoming large as much as possible.

Further, a mode in which the rotated portion 30 has a magnet and the rotating portion 35 has a coil or a coil and a magnet, or a mode in which the rotated portion 30 has a coil or a coil and a magnet and the rotating portion 35 has a magnet. When adopted, a certain degree of heat generation may be generated from the rotated portion 30 and the rotating portion 35. However, by adopting an embodiment in which the rotated portion 30 can be cooled with the cleaning liquid as shown in FIGS. 2 to 6, it is possible to eliminate the possibility of inconvenience caused by the heat generated by the rotated portion 30. When the rotating portion 35 is provided inside the housing 5, the rotating portion 35 can be cooled by the cleaning liquid, and conversely, when the rotating portion 35 is provided outside the housing 5, air cooling is performed. The rotating portion 35 can be cooled. When the rotating portion 35 is provided on the outside of the housing 5, the rotating portion 35 may be attached to a base member such as metal (for example, an aluminum base member), a heat radiating jacket, or a water-cooled jacket for cooling.

When the rotating portion 35 adopts a mode in which the rotated portion 30 is rotated in a non-contact state with the rotated portion 30, it is possible to prevent dust from being generated from the rotating portion 35 and the rotated portion 30. It is beneficial in that it can be done. That is, in a mode in which each of the rotated portion 30 and the rotating portion 35 has a gear and is physically connected to each other by the gear, and the rotated portion 35 rotates to rotate the rotated portion 30, the gear is used. Dust may be generated due to the grease applied. In this respect, according to the above-described aspect, it is possible to prevent the generation of such dust.

In the case where the rotated portion 30 has a magnet and the rotating portion 35 has a coil and a magnet, or the rotated portion 30 has a coil and a magnet and the rotating portion 35 has a magnet. When no current is supplied to the coil, the magnet of the rotating portion 35 and the magnet as the rotated portion 30 are attracted to each other, and the rotating cup 40 comes into contact with any inner surface of the housing 5. In general, it is preferable that the rotating cup 40 and the housing 5 do not come into contact with each other. Therefore, as shown in FIG. 6, the magnet as the rotated portion 30 has a protruding portion 30a that protrudes outward from the peripheral edge of the rotating cup 40. You may adopt the aspect which is. By providing such a protruding portion 30a, it is possible to prevent the protruding portion 30a from coming into contact with the housing 5 and the rotary cup 40 from coming into contact with the housing 5. The protrusions 30a may be provided over the entire peripheral edge, may be provided intermittently, or may be provided evenly at several locations (for example, 4 to 12 locations).

According to this embodiment, dust can be less likely to be generated, which is suitable for finish cleaning. As an example, the roll cleaning member adopted in the first cleaning unit 116 cleans the first surface and the second surface of the substrate W relatively roughly, and the pencil cleaning portions 11 and 21 and the fluid jet of the second cleaning unit 118 are cleaned. The cleaning units 12 and 22 may perform finish cleaning of the first surface and the second surface. Since the fluid jet cleaning units 12 and 22 are less likely to get dirty due to the cleaning unit than the pencil cleaning units 11 and 21, the fluid jet cleaning unit 12 is cleaned by the pencil cleaning units 11 and 21. , 22 is more beneficial to clean.

Conventionally, a high degree of cleaning is not required for the second surface, which is the back surface, and the device configuration becomes large and takes time. Therefore, the second surface is cleaned with a high degree of cleaning. Did not go. In this respect, according to the present embodiment, since these disadvantages do not exist, it is advantageous in that a high degree of cleaning can be easily realized also on the second surface which is the back surface.

When the rotary cup 40 is adopted, it is possible to prevent the cleaning liquid or the like scattered from the substrate W from rebounding to the substrate W again. That is, in the embodiment in which the rotating cup 40 does not exist and only the fixed cup 45 exists, the cleaning liquid or the like scattered from the substrate W may bounce back to the substrate W. However, by adopting the rotating cup 40, It is possible to prevent such inconvenience from occurring.

In particular, when the rotary cup 40 is provided with the rotated portion 30 connected to the holding portion 60, the substrate W and the rotary cup 40 can be rotated at the same rotation speed. Therefore, it is possible to more reliably prevent the cleaning liquid or the like splashed from the substrate W from rebounding to the substrate W again. In addition, since the weight becomes heavy when the rotating cup 40 is adopted, a person skilled in the art usually adopts a mode in which the rotating portion 35 rotates the rotated portion 30 in a non-contact state with the rotated portion 30. I don't want to try it. In this regard, as a result of prioritizing the generation of dust from the rotating portion 35 and the rotated portion 30 and aiming to minimize the influence on the substrate W, such an embodiment is used in the present embodiment. Is shown to be adopted.

The control unit 50 may control the location where the force is applied by the first cleaning units 11 and 12 and the location where the force is applied by the second cleaning units 21 and 22 so that they are point-symmetrical in the plan view (see FIG. 4). ). By adopting such an embodiment, the force applied from the first surface side of the substrate W and the force applied from the second surface side can be point-symmetrical, and it can be expected that they are offset in a well-balanced manner. Therefore, it is possible to prevent the rotation of the substrate W from being hindered by the force applied by the first cleaning units 11 and 12 and the second cleaning units 21 and 22. In particular, a mode in which the rotated portion 30 has a magnet and the rotating portion 35 has a coil or a coil and a magnet, or a mode in which the rotated portion 30 has a coil or a coil and a magnet and the rotating portion 35 has a magnet. When adopted, the substrate W floats in the air and rotates. Therefore, adopting such an embodiment is advantageous in that the substrate W can be prevented from tilting. When this aspect is adopted, from the viewpoint of canceling the force, the force applied by the first cleaning units 11 and 12 and the force applied by the second cleaning units 21 and 22 are the same or the same or the same. It is beneficial to make them substantially the same. In addition, "substantially the same" means that the difference is within 5% of the average of both forces, and the force F1 applied by the first cleaning units 11 and 12 is applied by the second cleaning units 21 and 22. When the force is F2 and the average value of F1 and F2 is Fa, it means that 0.95 × Fa ≦ F1 and F2 ≦ 1.05 × Fa.

Further, the control unit 50 may control the location where the force is applied by the first cleaning units 11 and 12 and the location where the force is applied by the second cleaning units 21 and 22 to be the same in the plan view (FIG. 5). By adopting such an embodiment, the force applied from the first surface side of the substrate W and the force applied from the second surface side can be more reliably offset. Therefore, it is possible to prevent the rotation of the substrate W from being hindered by the force applied by the first cleaning units 11 and 12 and the second cleaning units 21 and 22. In particular, a mode in which the rotated portion 30 has a magnet and the rotating portion 35 has a coil or a coil and a magnet, or a mode in which the rotated portion 30 has a coil or a coil and a magnet and the rotating portion 35 has a magnet. When adopted, the substrate W floats in the air and rotates. Therefore, by adopting such an embodiment, it is advantageous in that the substrate W can be more reliably prevented from tilting. When this aspect is adopted, from the viewpoint of canceling the force, the force applied by the first cleaning units 11 and 12 and the force applied by the second cleaning units 21 and 22 are the same or the same or the same. It is beneficial to make them substantially the same.

Second Embodiment Next, a second embodiment of the present invention will be described.

In the present embodiment, as shown in FIG. 7, the holding portion 60 has a holding member 162 for holding the substrate W and an elastic member 169 (see FIG. 9) for applying an urging force to the holding member 162. It has become. Further, an opening device 170 (see FIG. 8) is provided which applies a force on the opposite side to the urging force of the elastic member 169 to open the holding member 162. The opening device 170 may be controlled by the control unit 50. In this case, the holding unit 60 of the substrate W can hold the opening device 170, and the substrate W held by the holding unit 60 can be automatically removed. It is beneficial. Other configurations are the same as those in the first embodiment. In this embodiment, any aspect described in the first embodiment can be adopted. The members described in the first embodiment will be described using the same reference numerals.

In the present embodiment, as an example, an embodiment in which four holding portions 60 (60a-60d) are provided as shown in FIG. 13 will be described. This is just an example, and the holding portions 60 may be provided with two, three, or five or more.

The opening device 170 may come into contact with the holding member 162 on the front surface side of the substrate W to open the holding member 162. The opening devices 170 are arranged corresponding to the holding portions 60, and may be provided in the same number as the holding portions 60. By adopting such an embodiment, the plurality of holding members 162 can be opened at the same timing. The opening mechanism may be configured from a plurality of opening devices 170. In the embodiment as shown in FIG. 14, the opening device 170 for opening the first holding portion 60a and the opening device 170 for opening the second holding portion 60b form one opening mechanism, and the third holding portion 60c The opening device 170 for opening the fourth holding portion 60d and the opening device 170 for opening the fourth holding portion 60d may form another opening mechanism.

The opening device 170 may be in a mode in which the holding member 162 is opened in the open state in the vicinity of the holding portion 60 from the front surface side of the substrate W (see FIG. 15). However, the present invention is not limited to this, and the opening device 170 may approach the holding portion 60 from the back surface side of the substrate W, or may approach the holding portion 60 from the side of the substrate W. When the opening device 170 adopts a mode in which the holding member 162 is opened close to the holding portion 60 from the front surface side of the substrate W, it is not necessary to provide a device related to the opening mechanism on the back surface side. Therefore, it is advantageous in that the back surface of the substrate W can be easily cleaned.

As shown in FIG. 8, the opening device 170 may have an opening main body portion 171 and a first-direction moving portion 172 that moves the opening main body portion 171 along the first direction. The first-direction moving portion 172 may be, for example, an air cylinder or the like. The opening device 170 may be attached to the inner peripheral surface of one side portion of the housing 5 of the substrate cleaning device. For example, when the housing 5 is separable on one side and the other side, the housing 5 The opening device 170 may be attached to the inner peripheral surface on one side.

When the first-direction moving portion 172 that moves the support member 180 and the pressing member 190 described later in the first direction is adopted, the support member 180 is used when the opening device 170 is not used, such as while cleaning the substrate W. It is also advantageous in that the pressing member 190 can be positioned at a retracted position (for example, a position on one side of the substrate W).

As shown in FIG. 7, the holding portion 60 is provided between the holding main body portion 161 and the holding member 162 provided on the tip end side of the holding main body portion 161 and the tip end and the base end of the holding main body portion 161 to hold. It may have a swing shaft 163 for swinging the member 162 and an elastic member 169 (see FIG. 9) for pressing the tip end side of the holding member 162 inward in the peripheral edge. The swing shaft 163 may swing the holding member 162 in the in-plane direction, but the swing shaft 163 is not limited to this, and the swing shaft 163 tilts the holding member 162 in the in-plane direction to swing. Or it may be swung along the first direction. In the present embodiment, the side on which the holding member 162 is provided is referred to as the "tip side" of the holding portion 60, and the opposite side is referred to as the "base end side".

The elastic member 169 may be provided so as to abut the holding main body portion 161 and the rotated portion 30. As an example, the elastic member 169 may be a torsion spring provided in the holding main body portion 161 and in the rotated portion 30 as shown in FIG. In this case, one end side of the torsion spring may come into contact with the groove 39 provided in the rotated portion 30, and the other end side of the torsion spring may come into contact with the groove 39 provided in the holding main body portion 161. The holding portion 60 is swingably attached to the rotated portion 30 around the swing shaft 163. As the elastic member 169, the torsion spring urges the holding main body 163 so as to rotate the holding main body 161 around the swing shaft 163 in the direction of the arrow A in FIG. The tip of the holding member 162 is urged by the elastic member 169 in the direction of holding the peripheral edge of the substrate. The state in which the holding member 162 holds the peripheral edge of the substrate is referred to as a "closed state", and the state in which the holding of the peripheral edge of the substrate is released is referred to as an "open state".

The tip of the holding member 162 on the arrow A direction side (that is, the portion of the holding member 162 that holds the substrate W) may have a claw shape having a V-shaped cross section as shown in FIG.

As shown in FIG. 8, the opening device 170 may have a support member 180 that supports the back surface of the substrate W when the holding member 162 is in the open state. The support member 180 may be provided at the other end of the support extension portion 181 extending from the open main body portion 171 to the other side. The support member 180 moves closer to the back surface side of the substrate W from the front surface side of the substrate W, is positioned on the back surface side of the substrate W before the holding member 162 is in the open state, and the holding member 162 is in the open state. When it becomes, the back surface of the substrate W may be supported (see FIGS. 15B and 15C). In this case, the support extending portion 181 may be rotated so that the support member 180 is positioned on the back surface side of the substrate W. When the aspect of rotating the support extension portion 181 is adopted in this way, the front surface side (or the first direction) of the substrate W is used when the opening device 170 is not used, such as while cleaning the substrate W. ), It is advantageous in that the support member 180 cannot be positioned and the size of the substrate W can be prevented from increasing in the radial direction (compared to the embodiment shown in the modified example 2 described later). is there. The substrate support surface of the support member 180 may be an inclined surface that is inclined with respect to the in-plane direction of the substrate W, or may have a convex portion that faces the back surface of the substrate W. When these aspects are adopted, the contact area of the substrate W with the back surface can be reduced, which is advantageous in that contact contamination can be suppressed.

In the embodiment in which the rotary cup 40 is provided, the support member 180 is located inside the peripheral edge of the rotary cup 40, passes outside the peripheral edge of the substrate W, and is positioned on the back surface side of the substrate W. It may be (see FIG. 15 (b)).

As shown in FIG. 8, the opening device 170 may have a pressing member 190 that moves along the in-plane direction of the substrate W. As shown in FIG. 7, the holding portion 60 may have a pressed member 165 pressed by the pressing member 190. Then, when the pressed member 165 is pressed by the pressing member 190, the holding member 162 may be opened. "Along the in-plane direction" in the present embodiment means having a component along the in-plane direction, and also includes an aspect of inclining with respect to the in-plane direction. When the tip extending to the other side of the pressing portion 190 is pressed in the direction opposite to the arrow A in FIG. 7, that is, in the direction of the arrow B so as to catch the pressed portion 165, the holding portion 60 (holding body portion 161) of the elastic member 169 It swings in the direction of arrow B against the urging force.

In the embodiment in which the rotary cup 40 is provided, the pressed member 165 is provided between the inner peripheral edge of the rotary cup 40 and the outer peripheral edge of the substrate W when viewed from the front surface side of the substrate W. It may be (see FIG. 15).

As shown in FIG. 8, the pressing member 190 may be provided at the other end of the pressing extending portion 191 extending from the open main body portion 171 to the other side. Like the support member 180, the pressing member 190 may approach the substrate W from the front surface side. In this case, the pressing extension portion 191 may be rotated so that the pressing member 190 abuts on the pressed member 165 and presses the pressed member 165 to open the holding member 162 (FIG. 15). (D)). Even when the mode of rotating the pressing extension portion 191 is adopted in this way, the front surface side (or the first direction) of the substrate W is not used when the opening device 170 is not used, such as while cleaning the substrate W. ), It is advantageous in that the pressing member 190 can be prevented from being positioned and the size of the substrate W can be prevented from increasing in the radial direction (compared to the embodiment as shown in the modified example 3 described later). is there.

The open main body portion 171 has a first actuator for rotating the pressing portion 190 around the pressing extending portion 191 and a second actuator for rotating the support member 180 around the supporting extending portion 181. You may. The first actuator and the second actuator are, for example, motors. In the examples shown in FIGS. 7 and 8, when the pressing portion 190 rotates in the direction of arrow C to press the pressed portion 165, the holding portion 60 rotates in the direction of arrow B. Then, the tip of the holding member 162 is separated from the peripheral edge of the substrate W to release the holding of the substrate W. When opening the holding of the substrate W or prior to the opening, the support member 180 rotates in the direction of F to support the back surface of the substrate W. Further, when the pressing portion 190 rotates in the direction of arrow C to swing the holding portion 60 in the direction of arrow B to release the holding of the substrate, and then the pressing portion 190 rotates in the direction of arrow D, the holding portion 190 The 60 swings in the direction of the arrow A by the urging force of the elastic member 169, and the tip of the holding member 162 holds the peripheral edge portion of the substrate W. When the holding portion 60 holds the substrate W, the support member 180 rotates in the direction of the arrow E and is located outside the peripheral edge portion of the substrate W.

An example of a mode in which the held substrate W is opened will be described with reference to FIG.

First, the support member 180 and the pressing member 190 approach from the front surface side of the substrate W, pass between the rotary cup 40 and the substrate W, and are positioned on the back surface side of the substrate W (FIGS. 15A and 15B). )reference). The distance between the rotary cup 40 and the substrate W may be, for example, about 20 to 30 mm. In the operation in which the support member 180 and the pressing member 190 approach from the front surface side of the substrate W and are positioned on the back surface side of the substrate W, the first direction moving portion 172 of the opening device 170 moves the opening main body portion 171 in the first direction. It is done by moving along.

Next, the support extension portion 181 is rotated, and the support member 180 is positioned on the back surface side of the substrate W (see FIG. 15C).

Next, the pressing extension portion 191 is rotated, the pressed member 165 is pressed by the pressing member 190, and the holding member 162 is opened (see FIG. 15D). When the holding member 162 is opened in this way, the back surface of the substrate W is supported by the support member 180.

Next, the substrate W supported by the support member 180 is moved to one side by the opening device 170, and stops after the substrate W is moved to one side of the one side end of the holding member 162. After that, the pressing extension portion 191 is rotated in the direction opposite to that described above, and the holding member 162 returns to the original position. By adopting such an aspect, it is possible to prevent the pressing member 190 from coming off the pressed member 165 and the holding member 162 from being suddenly closed.

Next, the substrate W supported by the support member 180 is further moved to one side by the opening device 170, and then the second transfer robot 126 or the third transfer robot 128 receives the substrate W from the opening device 170. It is desirable that the substrate W moves to a position higher than the rotating cup 40 and the fixed cup 45. When the second transfer robot 126 or the third transfer robot 128 receives the substrate W from the opening device 170, the hand of the second transfer robot 126 or the third transfer robot 128 supports the second surface of the substrate W. After that, the support member 180 swings outward from the position where the substrate W is supported to the outer periphery of the substrate W. Then, the hand moves the substrate W to the other side by a predetermined distance, and then further conveys the substrate W to the outside of the housing 5. When the hand of the second transfer robot 126 or the third transfer robot 128 conveys the substrate W in this way, the substrate can be conveyed without the substrate W and the support extending portion 181 interfering with each other.

The operation of the opening device 170 to move the substrate W to one side is performed by the first-direction moving portion 172 of the opening device 170 moving the opening main body portion 171 along the first direction.

Since the first-direction moving portion 172 moves the support member 180 and the pressing member 190 along the first direction, the first-direction moving portion 172 can also be referred to as an opening device moving portion. Further, paying particular attention to moving the pressing member 190, the first-direction moving portion 172 can also be referred to as a pressing member moving portion.

The step of holding the substrate W by the holding member 162 may be the reverse of the above-described step.

Adopting such an embodiment is advantageous in that it is not necessary to provide the opening device 170 on the back surface side of the substrate W while using the rotary cup 40. Further, by adopting such an embodiment, it is advantageous in that it is not necessary to provide a hole in the rotary cup 40 for passing the support member 180 or the pressing member 190. If the rotary cup 40 is provided with a hole, inconveniences such as turbulence of the air flow and leakage of the cleaning liquid to the outside occur.

When one side corresponds to the upper side of the substrate W and the opening device 170 is positioned on the upper side of the substrate W, it is advantageous in that the waterproof configuration of the opening device 170 can be simplified.

As shown in FIG. 10, the holding portion 60 may have a weight member 167 provided on the proximal end side of the swing shaft 163. The centrifugal force acting on the weight member 167 when the holding portion 60 rotates causes the holding member 162 to receive a force in the direction toward the inside of the peripheral edge of the substrate, so that the holding force of the substrate can be strengthened.

In the embodiment shown in FIG. 13, the holding portion 60 has a first holding portion 60a, a second holding portion 60b, a third holding portion 60c, and a fourth holding portion 60d. Each of the holding portions 60 (60a-60d) includes a holding main body portion 161, a holding member 162 provided on the tip end side of the holding main body portion 161 and a weight member 167 provided on the base end side of the holding main body portion 161. , An elastic member 169 provided between the tip and the base end of the holding body portion 161 for pressing the swinging shaft 163 for swinging the holding member 162 and the base end side of the holding body portion 161 inward of the peripheral edge. And may have. Further, a part of the holding portion 60 (60a-60d) may have a different mode from the others. For example, a part of the holding portion 60 (60a-60d) may not be provided with the weight member 167, and the weight may be provided. The weight of the member 167 may be different between the holding portions 60 (60a-60d).

In the embodiment shown in FIG. 13, the first holding portion 60a has a first holding main body portion 161a, a first holding member 162a, a first weight member 167a, a first swing shaft 163a, and a first elastic member 169a. .. The second holding portion 60b has a second holding main body portion 161b, a second holding member 162b, a second weight member 167b, a second swing shaft 163b, and a second elastic member 169b. The third holding portion 60c has a third holding main body portion 161c, a third holding member 162c, a third weight member 167c, a third swing shaft 163c, and a third elastic member 169c. The fourth holding portion 60d has a fourth holding main body portion 161d, a fourth holding member 162d, a fourth weight member 167d, a fourth swing shaft 163d, and a fourth elastic member 169d. It should be noted that the holding portions 60 do not have to be arranged in the same manner when viewed along the rotation direction of the substrate W (for example, the clockwise direction in FIG. 13), and as shown in FIG. 14, the rotation direction of the substrate W. It may be facing in a different direction with respect to. In the embodiment shown in FIG. 14, the first holding portion 60a and the third holding portion 60c are oriented in the same direction with respect to the rotation direction of the substrate W, and the second holding portion 60b and the fourth holding portion 60d rotate the substrate W. The first holding portion 60a and the third holding portion 60c and the second holding portion 60b and the fourth holding portion 60d are oriented in the same direction with respect to the direction, and are oriented in different directions with respect to the rotation direction of the substrate W.

A metal plate such as a stainless steel plate may be used as each weight member 167. The weight member 167 may be provided on one side of the holding main body portion 161 or may be provided on the other side. However, when the holding portion 60 is provided on one surface of the rotated portion 30, the weight member 167 is one of the holding main body portions 161 from the viewpoint of not causing unnecessary friction with the rotated portion 30. It is better to be provided on the side surface. By using a metal plate, the thickness can be reduced, and turbulence of the air flow during rotation can be suppressed. The size of the metal plate may be, for example, 10 mm in width × 30 mm in length × 1.5 mm in thickness, and the weight thereof may be, for example, about 2 to 12 g. When the weight member 167 is made of metal, it is desirable to coat the surface of the weight member 167 with a resin (PFA, PTFE, etc.) to prevent metal corrosion and metal contamination of the substrate W.

The weight member 167 may be removable from the holding main body 161 and may be appropriately replaced depending on the rotation speed, the type of the substrate W to be handled, and the like. When such an aspect is adopted, it is advantageous in that the weight of the weight member 167 can be changed depending on the situation, and in some cases, it becomes possible to select not to use the weight member 167.

By providing the weight member 167 on the holding main body portion 161, the weight of the holding portion 60 may be increased by about 10% to 60%. The weight of each holding portion 60 when the weight member 167 is not provided may be, for example, about 20 g.

As shown in FIG. 10, the holding main body portion 161 may be provided with a holding protruding portion 164 projecting to one side on the tip side. The holding member 162 may be removable with respect to the holding protrusion 164. When such an embodiment is adopted, the holding member 162 can be replaced as appropriate, so that the holding member 162 can be prevented from being contaminated, or even if the holding member 162 is contaminated, the holding member 162 can be directly replaced. It is beneficial in that respect. The friction coefficient of the portion where the holding member 162 and the substrate W come into contact with each other may be equal to or higher than the threshold value, so that the substrate W may not slip easily.

Each holding member 162 may be provided on the holding protrusion 164. Each holding member 162 may have a claw shape for sandwiching the substrate W. The protrusion of the claw shape may be about 1 mm, and by shortening the protrusion in this way, it is possible to wash the peripheral edge of the substrate W as much as possible, which is advantageous in that back contamination can be prevented as much as possible.

By providing the holding protrusion 164 as shown in FIG. 10, the holding member 162 can be positioned at a position separated from the holding main body 161, and the weight member 167 provided on the holding main body 161 and the holding main body 161 can be positioned. It is advantageous in that the possibility that such a member and the substrate W are erroneously touched can be reduced.

The pressed member 165 may be provided on the side surface of the holding protrusion 164. The pressed member 165 may be a rod member extending in the in-plane direction. The rod member may have a cylindrical shape or a prismatic shape, and any shape can be adopted.

A rotation regulation mechanism for restricting pressing by the holding member 162 may be provided. The holding portion 60 may have a regulated portion for restricting the movement of the holding member 162 toward the inner peripheral side, and the rotated portion 30 may have a regulating portion for restricting the movement of the regulated portion. More specifically, as shown in FIG. 10, a protruding portion 168, which is an example of the regulated portion, is provided on the tip end side of the holding main body portion 161, and the rotated portion 30 is provided with a regulating portion that comes into contact with the protruding portion 168. A stopper 150, which is an example, may be provided. As shown in FIG. 12, the stopper 150 is provided between the pair of stopper surfaces 151 provided on one side and the other side of the protrusion 168 and the stopper contact provided between the pair of stopper surfaces 151 and comes into contact with the protrusion 168. It may have a part 152 and the like. By providing such a stopper surface 151, it is possible to prevent the protruding portion 168 from accidentally moving to the inner peripheral side of the stopper contact portion 152.

The regulated portion does not need to be provided on the tip end side of the holding main body portion 161. For example, the regulated portion is provided on the base end side of the holding main body portion 161 and a regulating portion such as a stopper is provided corresponding to the regulated portion. You may.

When the rotated portion 30 is rotated in a non-contact manner as in the first embodiment, the charge generated during the processing of the substrate W may adversely affect the substrate W. When a circuit is formed on the substrate W, there is a possibility that the circuit will be destroyed. Therefore, a part or all of the holding member 162 may be made of a conductive resin. Then, conductive fibers 210 (see FIG. 11) such as a string woven with stainless steel having a diameter of several μm, metal-plated fibers, and carbon-containing fibers are provided in the vicinity of the holding member 162 of the rotated portion 30. May be good. When such an embodiment is adopted, it is advantageous in that the corona discharge effect discharges the electric charge accumulated on the substrate W via the conductive fibers 210, and the electric charge can prevent the substrate W from being adversely affected. ..

(Modification example 1)
In the above, the mode in which the holding member 162 swings around the swing shaft 163 has been described, but the present invention is not limited to this, and as shown in FIG. 16, the holding member 162 has a reference to the rotated portion 30. It may be slidable. As an example of this aspect, the elastic member 169 may be a spring provided in the holding main body portion 161 and in the rotated portion 30. In this case, one end of the elastic member 169 such as a spring may come into contact with the inner peripheral surface of the groove of the rotated portion 30, and the other end of the elastic member 169 may come into contact with the holding main body portion 161. In the modified example, when the centrifugal force acts, the holding force by the holding member 162 decreases. Therefore, from this viewpoint, the mode in which the holding member 162 swings as described above is preferable. It is conceivable to increase the elastic force of the elastic member 169 in order to increase the holding force, but it is not preferable because the elastic member 169 becomes large when the elastic force is increased.

(Modification 2)
In the above, the support extending portion 181 is rotated to the back surface side of the substrate W before the holding member 162 is opened, and the support member 180 is positioned on the back surface side of the substrate W (FIG. 15). (C)), and the present invention is not limited to this, and as shown in FIG. 17, the support extending portion 181 slides on the back surface side of the substrate W before the holding member 162 is opened, so that the support member 180 may be positioned on the back surface side of the substrate W. In this case, the support member 180 may be positioned on the back surface side of the substrate W by sliding the support extension portion 181 in the in-plane direction.

(Modification 3)
In the above, the pressing extension portion 191 is rotated so that the pressing member 190 abuts on the pressed member 165 and presses the pressed member 165 to open the holding member 162 (FIG. 15 (d)). (See), and the present invention is not limited to this, and as shown in FIG. 17, the pressing member 190 may slide to press the pressed member 165 so that the holding member 162 opens. In this case, the pressing member 190 may be slid by sliding the pressing extending portion 191 in the in-plane direction.

(Modification example 4)
In the above, the opening device 170 has not only the pressing member 190 but also the supporting member 180, but the opening device 170 has only the pressing member 190, and the supporting member 180 that supports the back surface of the substrate W is the opening device 170. May support and separate the substrate W by another mechanical unit.

(Modification 5)
In the above, one opening device 170 has a form having a first actuator that swings one pressing member 190 in the in-plane direction and a second actuator that swings one support member 180 in the in-plane direction. However, it is not limited to such an aspect. As an example, one release device 170 may swing the two pressing members 190 in the in-plane direction and the two support members 180 in the in-plane direction. In the embodiment shown in FIG. 18, the opening device 170 shown on the left side of FIG. 18 has two pressing members 190 and two supporting members 180, and the opening device 170 shown on the right side of FIG. 18 has two pressing members. It has 190 and two support members 180. Further, the opening device 170 has a swing mechanism 173 that swings the opening main body 171 to one side and the other side. The first-direction moving portion 172 can move the open main body portion 171 and the swing mechanism 173 along the first direction.

In this modification, the open main body 171 is swung to one side so that it is positioned along the inner surface of the housing 5 and is positioned at the second retracted position. On the other hand, the open main body 171 is positioned from the second retracted position to the first retracted position by swinging to the other side, and the open main body 171 is positioned to the used position by moving from the first retracted position to the other side. Will be evacuated. By positioning the open main body 171 at the retracted position including the first retracted position and the second retracted position as in this embodiment, it is possible to prevent the opening device 170 from getting in the way in the cleaning process or the like, and in particular, the open main body 171 A greater effect can be obtained by positioning it in the second retracted position. After the open main body 171 is swung to the other side, the open main body 171 is moved to the other side, so that the pressing member 190 is positioned on the side of the pressed member 165 and the support member 180 is moved. It can be positioned on the back surface side of the substrate W (this position is the above-mentioned utilization position). Further, the first retracted position described above is the transfer position of the substrate W, and at the first retracted position, the second transfer robot 126 or the third transfer robot 128 receives the substrate W from the opening device 170, or the second transfer. The opening device 170 receives the substrate W from the robot 126 or the third transfer robot 128.

In this modification, one opening device 170 swings the two pressing members 190 in the in-plane direction and the two support members 180 swings in the in-plane direction, but the present invention is limited to this. There is no. One opening device 170 may adopt an aspect in which all four pressing members 190 are swung in the in-plane direction and all four support members 180 are swung in the in-plane direction. Also in this case, a swing mechanism 173 that swings the open main body 171 to one side and the other side may be provided. However, when all four pressing members 190 are swung in the in-plane direction and all four support members 180 are swung in the in-plane direction, the open main body 171 is moved to one side and the other. When the mode of swinging to the side is adopted, the size of the device in the first direction becomes large. From this point of view, as described above, in a mode in which one opening device 170 swings the two pressing members 190 and the two supporting members 180 in the in-plane direction, the opening body portion 171 is shaken to one side and the other side. Adopting a moving mode is advantageous in that it can prevent the size of the device from increasing in the first direction.

Third Embodiment Next, a third embodiment of the present invention will be described.

In the present embodiment, the first urging force applied to a certain holding member 162 is larger than the second urging force applied to another holding member 162. More specifically, the holding portion 60 has an elastic member 169 such as a spring, and the elastic member 169 of one holding portion 60 imparts a stronger urging force than the elastic member 169 of the other holding portion 60. (For example, it has a high spring constant). Other configurations are the same as those of the above-described embodiments, and any of the embodiments described in the above-described embodiments can be adopted. The members described in each of the above embodiments will be described using the same reference numerals.

As an example, the urging force of the elastic member 169 of the adjacent holding portions 60 (for example, the first holding portion 60a and the second holding portion 60b) is the urging force of the other adjacent holding portions 60 (for example, the third holding portion 60c and the fourth holding portion 60b). It may be larger than the urging force of the elastic member 169 of 60d) (see FIG. 19). When such an aspect is adopted, the substrate W is pushed toward the holding portion 60 side having the elastic member 169 having a weak urging force by receiving the force from the elastic member 169 having a strong urging force, and the urging force is adopted. The position of the substrate W will be positioned at the place where is balanced. By providing a difference in the urging force of the elastic member 169 in this way, it is advantageous in that the position of the substrate W can be determined to some extent. That is, when the urging force of the elastic member 169 is the same, the position at the time of holding the substrate W is not determined, or the center position of the substrate W shifts due to the centrifugal force when the substrate W rotates. In some cases, there is a risk that the substrate W will come off from the holding member 162. In this regard, by making the urging force of some of the elastic members 169 larger than the urging force of the remaining elastic members 169, it is possible to suppress the displacement of the center position of the substrate W due to centrifugal force, and by extension, the substrate from the holding member 162. The possibility that W will come off can be reduced.

When only three holding portions 60 are provided, the urging force of the elastic member 169 of the two holding portions 60 may be larger than the urging force of the elastic member 169 of the other holding portion 60. .. According to such an aspect, the substrate W can be positioned by the elastic member 169 having a strong urging force of the two holding portions 60.

Only the holding portion 60 having a large urging force of the elastic member 169 may have the weight member 167. According to such an aspect, it is advantageous that the substrate W can be positioned at a predetermined position by both the difference in the urging force of the elastic member 169 and the difference in the centrifugal force due to the weight member 167 when the substrate W rotates. is there. In the aspect shown in FIG. 19, the first holding portion 60a has the first weight member 167a, the second holding portion 60b has the second weight member 167b, but the third holding portion 60c has the third weight member. It does not have 167c, and the fourth holding portion 60d does not have a fourth weight member 167d.

Further, the weight of the weight member 167 of the holding portion 60 having a large urging force of the elastic member 169 may be made heavier than the weight of the weight member 167 of the holding portion 60 having a weak urging force of the elastic member 169. This aspect is advantageous in that the substrate W can be positioned by the difference in the centrifugal force while increasing the holding force by the holding portion 60 by the centrifugal force of the weight member 167.

The position of the rotating substrate W is adjusted by adjusting the working style of the centrifugal force according to whether or not the weight member 167 is attached or the difference in the weight of the weight member 167 without providing a difference in the magnitude of the urging force of the elastic member 169. May be positioned to some extent.

The position of the stopper 150 does not have to be uniform. As an example, the stopper 150 is positioned so that the holding member 162 can be closed only to the reference size (for example, diameter 300 mm) of the substrate W with respect to two adjacent two of the four holding portions 60, while the remaining two The stopper 150 may be positioned so that the holding member 162 closes to a position smaller than the reference dimension (for example, 295 mm in diameter).

The holding member to which the strong first urging force is applied may be restricted from moving inward on the outer periphery of the holding member to which the weak second urging force is applied. For example, the stopper 150 corresponding to the holding portion 60 having a strong urging force may be positioned so that the holding member 162 can be closed only up to the reference size (for example, a diameter of 300 mm) of the substrate W. In the above-described example, the stopper 150 corresponding to the first holding portion 60a and the second holding portion 60b may be positioned so that the holding member 162 can be closed only up to a reference dimension (for example, a diameter of 300 mm). The substrate W is pushed in the plane by the elastic member 150 having a strong urging force (for example, the first elastic member 150a and the second elastic member 150b), but the stopper 150 does not push the substrate W beyond the specified size. As a result, it is advantageous in that the substrate W can be held according to the reference size of the substrate W. It should be noted that between the elastic member 150 having a strong urging force (for example, the first elastic member 150a and the second elastic member 150b) and the elastic member 150 having a weak urging force (for example, the third elastic member 150c and the fourth elastic member 150d). The difference in urging force should be larger than the degree to which the holding member 162 corresponding to the elastic member 150 having strong urging force comes into contact with the stopper 150. This is because by adopting such an aspect, positioning can be reliably performed by the holding member 162 corresponding to the elastic member 150 having a strong urging force.

Each holding member 162 may be opened up to a position larger than the reference dimension of the substrate W (for example, a diameter of 305 mm). By opening the substrate W to a position larger than the reference dimension of the substrate W in this way, the substrate W can be easily held by the holding member 162. In the present embodiment, the rotated portion 30 does not come into contact with any of the housings 5 and is rotated while floating in the air. Therefore, the rotated portion 30 may deviate from the original center position when stopped. is there. In this respect, it is advantageous in that the substrate W can be held by the holding member 162 even if the position of the rotated portion 30 is displaced by opening the substrate W to a position larger than the reference dimension of the substrate W.

Fourth Embodiment Next, a fourth embodiment of the present invention will be described.

In the second embodiment and the third embodiment, the support member 180 is close to the front surface side of the substrate W, but in the present embodiment, the support member 180 is the substrate W. The mode is such that it approaches from the back surface side. Other configurations are the same as those of the above-described embodiments, and any of the embodiments described in the above-described embodiments can be adopted. The members described in each of the above embodiments will be described using the same reference numerals.

In the present embodiment, as shown in FIG. 20, the support member 180 is located on the other side (back surface side) of the substrate W, and the pressing member 190 is located on the other side of the pressed member 165. According to the embodiment in which the opening device 170 approaches from the back surface side of the substrate W as in the present embodiment, it is advantageous in that the opening device 170 can have a simple configuration. On the other hand, if the opening device 170 is provided on the back surface side of the substrate W in this way, the back surface side of the substrate W is occupied by the opening device 170, and the ease of cleaning the back surface side of the substrate W is reduced. It is necessary to be careful about it.

In the present embodiment, it is also possible to adopt an embodiment in which the same opening device 170 as used in the second embodiment and the third embodiment is positioned on the back surface side of the substrate W.

In the present embodiment, as an example, the opening device 170 includes a first-direction moving portion 172, a first opening main body portion 171a that is moved along the first direction by the first-direction moving portion 172, and a first opening main body. The portion 171a is provided via an elastic member 178 such as a spring, and is provided on the second open body portion 171b for supporting the support member 180 and the first open body portion 171a via a linear motion member 179 such as a spline shaft. And may have a third open body portion 171c for supporting the pressing member 190. As shown in FIG. 20, the second open main body portion 171b may be connected to the first open main body portion 171a via the elastic member 178 and the connecting member 177. The pressing member 190 of the present embodiment is provided on the pressing guide surface 193 and the pressing guide surface 193 which are inclined to the other side toward the outer periphery for guiding the pressed member 165, and are supported by the supporting member 180. It may have a pressing support member 194 that receives the back surface of the substrate W.

The second open main body portion 171b is capable of contacting the other side surface of the rotated portion 30, and when the second open main body portion 171b is positioned at a position where it abuts on the other side surface of the rotated portion 30. The support member 180 may slightly touch the back surface of the substrate W or may be provided with a slight gap of about several millimeters with respect to the back surface of the substrate W (see FIG. 21).

When this aspect is adopted, the first open main body 171a moves to one side in the first direction moving portion 172, so that the second open main body 171b and the third open main body 171c move to one side. .. When the second open main body 171b rises to a certain extent, the second open main body 171b comes into contact with the other side surface of the rotated portion 30 and does not move to one side any more (see FIG. 21).

When the first open main body 171a further moves to one side, the third open main body 171c moves to one side (see FIG. 22). Then, the pressing member 190 comes into contact with the pressed member 165 and presses the pressed member 165 in the in-plane direction. As a result, the holding member 162 is opened, and the back surface of the substrate W is supported by the support member 180.

So far, the substrate cleaning apparatus having the first cleaning unit 10 and the second cleaning unit 20 has been described as an embodiment, but the means for cleaning the substrate may be a chemical solution supply nozzle that supplies a chemical solution from a nozzle, and is super. The nozzle may be a nozzle that supplies a cleaning liquid to which ultrasonic waves are applied, and any nozzle may be used. Further, the configuration in which the rotating portion 35, the rotated portion 30, the holding portion 60, and the opening device 170 of the present embodiment are the main elements is not only the substrate cleaning device, but also the substrate drying device, the substrate etching device, and the coating device. It can be applied to various substrate processing devices such as plating devices. When the present invention is applied to a substrate drying apparatus, the substrate may be dried by rotating the substrate held by the holding portion at a high speed, or by an IPA steam drying method using IPA steam.

The description of the embodiment and the disclosure of the drawings described above are merely examples for explaining the invention described in the claims, and are described in the claims by the description of the above-described embodiments or disclosure of the drawings. The inventions made are not limited. For example, the substrate processing apparatus having the substrate cleaning apparatus according to the present invention includes a bevel polishing apparatus for polishing the end portion of the substrate W, a back surface polishing apparatus for polishing the back surface of the substrate W, or a metal film on the surface of the substrate W. A substrate plating apparatus for forming the above may be included. In addition to the semiconductor substrate, the substrate W in the present invention includes a liquid crystal display (LCD), a plasma display (PDP), an organic light emitting diode (OLED), and a field emission display (Field Display Display). Various substrates such as glass substrates for vacuum fluorescent displays (VFDs) and solar cell panels, glass for magnetic / optical disks, and ceramic substrates are included.

10 First cleaning unit (cleaning unit)
20 Second cleaning unit (cleaning unit)
30 Rotated part 35 Rotating part 40 Rotating cup 60 Holding part 162 Holding member 163 Shaking shaft 165 Pressed member 167 Weight member 168 Protruding part 169 Elastic member 170 Opening device 180 Support member 190 Pressing member W Substrate

Claims (10)

A substrate processing device that processes substrates
A holding portion having a holding member for holding the substrate and an elastic member for applying an urging force to the holding member.
The rotated part connected to the holding part and
A rotating portion provided outside the peripheral edge of the rotated portion to rotate the rotated portion, and a rotating portion.
An opening device that applies a force on the opposite side to the urging force of the elastic member to open the holding member.
Equipped with a,
The opening device is a substrate processing device characterized in that the holding member is brought close to the holding member from the first surface side of the substrate to open the holding member. A substrate processing device that processes substrates
A holding portion having a holding member for holding the substrate and an elastic member for applying an urging force to the holding member.
The rotated part connected to the holding part and
A rotating portion provided outside the peripheral edge of the rotated portion to rotate the rotated portion, and a rotating portion.
An opening device that applies a force on the opposite side to the urging force of the elastic member to open the holding member.
With
The opening device is a substrate processing device including a support member that supports a second surface of the substrate when the holding member is opened. The support member moves closer to the second surface side of the substrate from the first surface side of the substrate, is positioned on the second surface side of the substrate before the holding member is opened, and the holding member. There substrate processing apparatus according to claim 2, characterized in that for supporting the second surface of the substrate when it is opened. A rotating cup connected to the holding portion or the rotated portion is further provided.
The substrate processing apparatus according to claim 3 , wherein the support member is located inside the peripheral edge of the rotary cup, passes outside the peripheral edge of the substrate, and is positioned on the second surface side of the substrate. .. The opening device has a pressing member that moves along the in-plane direction of the substrate.
The holding portion has a pressed member that is pressed by the pressing member.
The substrate processing apparatus according to any one of claims 1 to 4 , wherein the holding member is opened when the pressed member is pressed by the pressing member. A substrate processing device that processes substrates
A holding portion having a holding member for holding the substrate and an elastic member for applying an urging force to the holding member.
The rotated part connected to the holding part and
A rotating portion provided outside the peripheral edge of the rotated portion to rotate the rotated portion, and a rotating portion.
An opening device that applies a force on the opposite side to the urging force of the elastic member to open the holding member.
With the rotating cup connected to the holding portion or the rotated portion,
Equipped with a,
The opening device has a pressing member that moves along the in-plane direction of the substrate.
The holding portion has a pressed member that is pressed by the pressing member.
When the pressed member is pressed by the pressing member, the holding member is opened.
A substrate processing apparatus, characterized in that the pressed member is provided between the inner peripheral edge of the rotating cup and the outer peripheral edge of the substrate when viewed from the first surface side of the substrate. The substrate processing apparatus according to any one of claims 1 to 6 , wherein the holding portion has a swing shaft that swings the holding member in an in-plane direction of the substrate. The substrate processing apparatus according to claim 7 , wherein the holding portion has a weight member provided on the base end side of the swing shaft. A substrate processing device that processes substrates
A holding portion having a holding member for holding the substrate and an elastic member for applying an urging force to the holding member.
The rotated part connected to the holding part and
A rotating portion provided outside the peripheral edge of the rotated portion to rotate the rotated portion, and a rotating portion.
An opening device that applies a force on the opposite side to the urging force of the elastic member to open the holding member.
With
Has multiple holding members
A substrate processing apparatus characterized in that the first urging force applied to a certain holding member is larger than the second urging force applied to another holding member. The holding portion has a regulated portion for restricting the inward movement of the holding member.
The rotated portion has a regulating portion for restricting the movement of the regulated portion.
Holding member, wherein said first urging force is applied, the claim 9 the movement of the peripheral outward of the holding member on which the second biasing force is applied to the inner side, characterized in that it is regulated Substrate processing equipment.