JP6897750B2 - Imaging unit - Google Patents

Description

The present invention relates to an imaging unit.

In recent years, the improvement of image processing technology has been remarkable, and high-performance cameras can be obtained at a relatively low price, so that the applied technology of the camera has been put into practical use. For example, a stereo ranging technique is known in which a plurality of cameras are attached to one housing and the distance to a shooting target is measured based on the shot images taken by each camera, such as a stereo camera. Currently, application to various fields is being considered.

In the case of a stereo camera or the like, it is important to eliminate the influence of temperature as much as possible regardless of the installation environment. For example, in Patent Document 1 below, from the viewpoint of distance measurement accuracy, a stereo camera accompanying an increase in ambient temperature in the installation environment. A configuration that reduces the impact on is disclosed.

On the other hand, in recent years, the sophistication and miniaturization of stereo cameras have been promoted, and the problem of temperature rise due to heat generation of parts mounted inside the stereo camera is becoming apparent. When the temperature inside the stereo camera rises, the risk of failure of the mounted parts increases. Therefore, from the viewpoint of extending the life, it is required to be configured to efficiently transfer heat or dissipate heat.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an imaging unit capable of suppressing a temperature rise.

In one aspect of the present disclosure, an image pickup unit having a plurality of image pickup devices, a housing for holding the plurality of image pickup devices, and a circuit board, comprising a heat transfer member provided in contact with the housing. The heat transfer member has a heat conductivity higher than that of the housing, includes a mounting portion for the member to be installed of the imaging unit , and the circuit board is connected to the housing via the heat transfer member. The member to be installed is the front glass of the vehicle, and the housing is surface-treated on the surface facing the front glass in a state of being installed on the front glass to reduce the sunlight absorption rate. The surface other than the surface facing the front glass is subjected to a surface treatment for increasing the radiation rate, and the back surface is subjected to a surface treatment for reducing the radiation rate. it provides an imaging unit, characterized in that.

According to the present disclosure, it is possible to provide an imaging unit capable of suppressing a temperature rise.

It is a perspective view explaining an example of the whole structure of the image pickup unit which concerns on one Embodiment of this invention. It is an exploded perspective view of the image pickup unit shown in FIG. It is a perspective view explaining an example of the whole structure of the camera provided in the image pickup unit shown in FIG. It is a figure explaining the heat transfer structure of the image pickup unit shown in FIG. It is sectional drawing explaining the heat transfer structure of the image pickup unit shown in FIG. 1, and is the XX sectional view of FIG. 4 explaining the heat transfer structure of an image pickup element. It is sectional drawing of the image pickup unit which concerns on embodiment different from the image pickup unit shown in FIG. ). It is a perspective view explaining the whole structure of the image pickup unit which concerns on embodiment different from the image pickup unit shown in FIG. It is a figure explaining an example of the whole structure of the image pickup unit when the image pickup unit shown in FIG. 1 and FIG. 7 is applied for FA. It is a perspective view explaining the whole structure of the image pickup unit which concerns on embodiment different from the image pickup unit shown in FIG. It is a YY cross-sectional view of the image pickup unit shown in FIG. 9, and is a schematic view which shows the internal structure of the image pickup unit.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the present specification and the drawings, components having substantially the same functional configuration are designated by the same reference numerals, and duplicate description thereof will be omitted.

[First Embodiment]
<Configuration of imaging unit 1>
The overall configuration of the imaging unit 1 according to this embodiment will be described with reference to the drawings. FIG. 1 is a perspective view illustrating an example of an overall configuration of an imaging unit according to an embodiment of the present invention. Further, FIG. 2 is an exploded perspective view of the imaging unit shown in FIG.

As shown in FIG. 1, the image pickup unit 1 includes a plurality of (two in FIG. 1) monocular cameras (imaging devices) 11 and 12, a housing 15 for holding the monocular cameras 11 and 12, a circuit board, and a circuit board. To be equipped. The image pickup unit 1 is provided with a heat transfer member provided in contact with the housing 15 or the circuit board. The circuit board is housed inside the housing 15.

The circuit board includes an image pickup element substrate 22a of the monocular cameras 11 and 12 and an image processing substrate 30a for processing an image captured by the monocular cameras 11 and 12. The image sensor 22b is mounted on the image sensor substrate 22a (see FIG. 3), and the electronic component 30b for image processing is mounted on the image processing substrate 30a (see FIG. 1).

In the present embodiment, the heat transfer members 38a and 38b are arranged one by one on the upper and lower surfaces of the housing 15. By setting the object in contact with the heat transfer members 38a and 38b as the housing 15, surface contact over a wider area is possible, so that the heat of the housing 15 can be effectively transferred to the outside.

The image pickup unit 1 further includes an installation member (bracket) 16 for attaching the image pickup unit 1 to the member to be installed. The member to be installed is, for example, the windshield F of the vehicle. Flat brackets 16 are installed on the left and right sides of the housing 15.

The bracket 16 is installed by engaging the convex protrusions 18 provided on the left and right side surfaces of the housing 15 with the concave groove 19 provided on the bracket 16 to adjust the position. Specifically, as shown in FIG. 2, the position adjustment is performed while moving the protrusion 18 along the groove 19, and after the position adjustment, the protrusions 18 are fixed to the left and right side surfaces of the housing 15 with screws 20. The bracket 16 includes an attachment portion 16a for the member to be installed in order to attach the image pickup unit 1 to the windshield F. Then, the imaging unit 1 is installed in the vehicle by fixing the mounting portion 16a of the bracket 16 to the windshield F. The mounting portion 16a is fixed to the windshield F, for example, by aligning the surfaces of the mounting portion 16a and the windshield F and adhering them with an adhesive, double-sided tape, or the like. Alternatively, the screw may be screwed into the screw hole of the windshield F and fastened.

By fixing the heat transfer member 38a to the windshield F, the image pickup unit 1 may be installed on the windshield F. The heat transfer member 38a is fixed to the windshield F with an adhesive, double-sided tape, screws, or the like as described above.

The housing 15 includes a first housing 15a and a second housing 15b attached to the first housing 15a, and the monocular cameras 11 and 12 are separated by a predetermined distance from the first housing 15. It is attached to the housing 15a. Specifically, the monocular camera 11 is attached to one end of the first housing 15a (left side in FIG. 1), and the monocular camera 12 is attached to the other end (right side in FIG. 1).

The subject is photographed by the two monocular cameras 11 and 12, respectively. The monocular cameras 11 and 12 are fixed to the housing 15 from the back side by screws 35 (three locations per monocular camera in FIG. 2).

The monocular cameras 11 and 12 are arranged at engaging portions 13 and 14 (see FIG. 2) provided at both ends of the first housing 15a. The positions of the monocular cameras 11 and 12 are adjusted while engaging with the engaging portions 13 and 14 so that the front surface 15c of the first housing 15a orthogonal to the imaging direction (optical axis) serves as a reference plane. After the adjustment, the monocular cameras 11 and 12 are attached to the first housing 15a from the back side by the screws 35. In FIG. 1, the xy plane indicates a reference plane, and the z-axis perpendicular to this plane indicates the optical axis direction.

As described above, the heat transfer members are arranged on the upper and lower surfaces of the housing 15, and in the following description, the heat transfer members arranged on the upper surface (first housing 15a) of the housing 15 are referred to as the heat transfer members 38a. It is called. The heat transfer member arranged on the lower surface of the housing 15 (second housing 15b) is referred to as a heat transfer member 38b.

The heat transfer member 38a is provided so as to be in contact with the housing 15 (first housing 15a). The heat transfer member 38a is provided between the monocular camera 11 and the monocular camera 12 so as to be in contact with the housing 15 (see the hatched portion S1 in FIG. 1). By setting the target to which the heat transfer member 38a is in contact with the first housing 15a, surface contact over a wider area is possible, so that the heat of the first housing 15a can be effectively transferred to the outside. it can.

Then, when the image pickup unit 1 is installed on the windshield F, the heat transfer member 38a is arranged at a position where it comes into contact with the windshield F. Specifically, the position of the heat transfer member 38a in the height direction of the contact surface with the front glass F (y-axis direction in FIG. 1) is the height direction of the mounting surface of the mounting portion 16a with respect to the front glass F (FIG. 1). The heat transfer member 38a is formed so as to be equal to the position in the y-axis direction of 1. Therefore, when the mounting portion 16a of the bracket 16 is fixed to the windshield F, the heat transfer member 38a is arranged at a position in contact with the windshield F.

The positions of the mounting portion 16a and the heat transfer member 38a in the height direction (y-axis direction in FIG. 1) are the same, and by fixing the mounting portion 16a to the windshield F, the heat transfer member 38a becomes the windshield F. Touch. In this case, the heat transfer member 38a may have at least a part of the surface of the windshield F in contact with the surface of the windshield F. However, it is preferable that the area in contact with the surface of the windshield F is large because the amount of heat transferred to the windshield F increases.

The heat transfer member 38a is arranged in the first housing 15a by screws 40 (four locations in FIG. 1). Specifically, the holes 15d and the screw holes 15e are aligned to adjust the position of the heat transfer member 38a (see FIG. 2), and the heat transfer member 38a is fixed by the screws 40 so as to be in contact with the first housing 15a.

The image sensor substrate 22a is attached to the monocular cameras 11 and 12, respectively. The image processing board 30a is fixed to the first housing 15a with screws (fastening members) 41 (two places in FIG. 2), and after the image processing board 30a is fixed to the first housing 15a, the second housing 15b Is attached to the first housing 15a.

Then, the image processing substrate 30a is attached to the first housing 15a by a screw (fastening member) 41 in a region in contact with the second housing 15b. Specifically, the second housing 15b, the image processing board 30a, and the heat transfer member 38b are integrally fixed to the first housing 15a so that the second housing 15b, the image processing board 30a, and the heat transfer member 38b are fixed to the first housing 15a. The positions of the holes 15f, 30c, and 38c formed in the heat transfer member 38b are adjusted. After this position adjustment, the second housing 15b is attached to the first housing 15a with screws (fastening members) 42 (four locations in FIG. 2). At this time, the image processing substrate 30a is internally attached to the first housing 15a by screws (fastening members) 42 (four locations in FIG. 2) so as to be in contact with the second housing 15b.

The image processing substrate 30a is provided so as to be in contact with the heat transfer member 38b via the second housing 15b. The heat transfer member 38b is provided so as to be in contact with the second housing 15b, and the image processing substrate 30a is provided so as to be in contact with the second housing 15b inside. By setting the target to which the heat transfer member 38b is in contact with the second housing 15b, surface contact over a wider area is possible, so that the heat of the second housing 15b can be effectively transferred to the outside. it can.

The range in which the heat transfer member 38b is in contact with the second housing 15b is a part of the portion of the back surface where the image processing substrate 30a is in contact with the second housing 15b (see S2 in FIG. 1). It may be all or all. Alternatively, the image processing substrate 30a may be wider than all in contact with the second housing 15b.

In the present embodiment, the imaging unit 1 is attached to the vehicle so that the direction orthogonal to the reference plane (z-axis direction) is the straight-ahead direction of the vehicle, and the distance to the subject in the straight-ahead direction of the vehicle is measured.

In order to recognize the subject in front of the vehicle with high accuracy, the image pickup unit 1 is required to have extremely high mounting accuracy. Since the imaging unit 1 generates a distance image from the parallax in the pair of captured images taken by the monocular cameras 11 and 12, the deviation of the imaging direction (optical axis) directly affects the calculated distance. is there.

However, the inclination angle of the windshield F differs depending on the vehicle model. Further, in reality, the imaging direction of the in-vehicle camera varies from individual to individual due to the distortion of the vehicle body itself and the limit of the mounting accuracy of the camera. Therefore, it is preferable to prepare a plurality of types of brackets 16 having different shapes and mounting positions. This makes it possible to provide an image pickup unit 1 having a heat transfer structure corresponding to various vehicle types. By simply preparing a plurality of types of brackets 16, it is possible to install an imaging unit 1 capable of keeping the range of deviation of the optical axis within an appropriate range for each vehicle type.

In the above, the case where the image pickup unit 1 is provided with two monocular cameras 11 and 12 has been illustrated and described, but the present invention is not limited to this configuration. Three or more monocular cameras may be provided. Hereinafter, a case where two monocular cameras 11 and 12 are provided in the image pickup unit 1 will be described.

Further, in the present embodiment, the case where the bracket 16 is separately attached to the left and right side surfaces of the housing 15 has been illustrated and described, but the present invention is not limited to this configuration. For example, it may be formed in a U-shape integrally so that the upper surface of the image pickup unit 1 and the left and right side surfaces are covered.

<Structure of Imaging Device 11>
Next, the overall configuration of the monocular camera (imaging apparatus) provided in the imaging unit 1 will be described with reference to the drawings. FIG. 3 is a perspective view illustrating an example of the overall configuration of the camera provided in the image pickup unit shown in FIG.

The monocular camera 11 provided in the image pickup unit 1 includes a holder 31, a lens 32 provided on the front side of the holder 31, and a lens fixing member (lens cell) 33 for holding the lens 32. The monocular camera 11 is provided with an image pickup element substrate 22a, and the image pickup element 22b is mounted on the image pickup element substrate 22a. In this embodiment, the subject side is the front side. The configuration of the monocular camera 12 is basically the same as the configuration of the monocular camera 11.

The image pickup device 22b is not limited to a CCD (Charge Coupled Device), and may be a CMOS (Complementary Metal Oxide Semiconductor) or the like. In the image pickup unit 1, two monocular cameras 11 and 12 are arranged so that their optical axes are parallel to each other at a certain distance of a predetermined baseline length.

By providing the two monocular cameras 11 and 12 in this way, the distance to the subject can be measured by utilizing the parallax (baseline length) between the left and right monocular cameras 11 and 12.

<Heat transfer structure of imaging unit 1>
Next, the heat transfer structure of the imaging unit 1 will be described with reference to the drawings. FIG. 4 is a diagram illustrating a heat transfer structure of the imaging unit 1 shown in FIG.

As described above, the housing 15 internally houses the image sensor substrate 22a and the image processing substrate 30a (circuit board), and the image sensor 22b and the electronic component 30b are mounted on the substrates 22a and 30a, respectively. ing.

<Heat transfer structure of image sensor 22b>
First, the heat transfer structure of the image pickup device 22b mounted on the image pickup device substrate 22a will be described. FIG. 5 is a cross-sectional view for explaining the heat transfer structure of the image pickup unit 1 shown in FIG. 1, and is an XX cross-sectional view of FIG. 4 for explaining the heat transfer structure of the image pickup device.

The image sensor substrate 22a is fixed in contact with the back surface of the holders 31 of the monocular cameras 11 and 12 by screws 35 after the position of the image sensor substrate 22a is adjusted with respect to the holder 31 (see FIG. 5). With the image sensor substrate 22a fixed to the monocular cameras 11 and 12, the monocular cameras 11 and 12 are arranged at engaging portions 13 and 14 (see FIG. 2) provided at both ends of the housing 15. As a result, the holders 31 of the monocular cameras 11 and 12 come into contact with the housing 15 (first housing 15a). Then, the heat transfer member 38a is fixed to the first housing 15a by the screw 40 (see FIG. 5). That is, the heat transfer member 38a is provided in contact with the housing 15 (first housing 15a).

The heat transfer member 38a is arranged at a position where it comes into contact with the windshield F when the image pickup unit 1 is installed on the windshield F. That is, when the image pickup unit 1 is installed on the windshield F, the heat transfer member 38a comes into contact with the windshield F.

Since it has the above configuration, as shown in FIG. 4, the heat of the image sensor 22b, which is a heat generation source, is conducted to the image sensor substrate 22a, passes through the holders 31 of the monocular cameras 11 and 12, and is the first housing. It is conducted from 15a to the heat transfer member 38a and discharged to the outside (see the white arrow).

More specifically, the heat of the image pickup device 22b is conducted to the holder 31 via the image pickup device substrate 22a (see arrow A1 in FIG. 5). The heat conducted to the holder 31 is then conducted to the first housing 15a in contact with the holder 31 (see arrow A2 in FIG. 5). Next, the heat conducted to the first housing 15a is conducted to the heat transfer member 38a fixed in contact with the first housing 15a (see arrow A3 in FIG. 5). Further, the image pickup unit 1 is installed on the windshield F so that the heat transfer member 38a is in contact with the windshield F. Therefore, the heat inside the housing 15 that has become hot due to the heat generated by the image sensor 22b is released to the outside of the vehicle through the windshield F (see arrow A4 in FIG. 5) (see arrow A5 in FIG. 5).

The image sensor substrate 22a is preferably made of a material (for example, thick copper) having excellent thermal conductivity and heat dissipation.

As a result, the heat inside the housing 15 can be efficiently transferred from the inside of the housing 15 having a small heat capacity to the outside of the housing 15 having a large heat capacity.

<Heat transfer structure of electronic component 30b>
Next, the heat transfer structure of the electronic component 30b mounted on the image processing substrate 30a will be described.

As described above, the image processing substrate 30a is provided so as to be in contact with the heat transfer member 38b via the second housing 15b. Specifically, the image processing board 30a is fixed to the first housing 15a with screws 41, and after the image processing board 30a is fixed, the second housing 15b is attached to the first housing 15a with screws 42. , The heat transfer member 38b is fixed to the second housing 15b so as to be in contact with the second housing 15b. As a result, the image processing substrate 30a comes into contact with the inside of the second housing 15b, and the heat transfer member 38b comes into contact with the surface of the second housing 15b. The bracket 16 is attached to the left and right side surfaces of the first housing 15a and the second housing 15b so as to come into contact with the heat transfer member 38b.

Since it has the above configuration, as shown in FIG. 4, the heat of the electronic component 30b, which is a heat generating source, is conducted to the image processing substrate 30a, and the bracket 16 passes from the second housing 15b through the heat transfer member 38b. It is conducted to the heat transfer member 38a via the heat transfer member 38a and discharged to the outside of the vehicle (see the arrow).

More specifically, the heat of the electronic component 30b is conducted to the image processing substrate 30a (see arrow B1 in FIG. 4). Next, the heat conducted on the image processing substrate 30a is conducted on the second housing 15b (see arrow B2 in FIG. 4). Next, the heat conducted to the second housing 15b is conducted to the heat transfer member 38b in contact with the second housing 15b (see arrow B3 in FIG. 4). The heat conducted to the heat transfer member 38b is then conducted to the bracket 16 (see arrow B4 in FIG. 4). The heat conducted to the bracket 16 is then conducted to the heat transfer member 38a (see arrow B5 in FIG. 4). Next, the heat conducted to the heat transfer member 38a is conducted through the windshield F, so that the heat inside the housing 15 that has become hot due to the heat generated by the electronic component 30b is released to the outside of the vehicle.

In this way, the heat inside the housing 15 can be efficiently transferred from the inside of the housing 15 having a small heat capacity to the outside of the housing 15 having a large heat capacity.

Then, the heat heated by the image pickup element 22b and the electronic component 30b is conducted to the heat transfer members 38a and 38b through the substrates 22a and 30a, so that the heat conducted to the heat transfer members 38a and 38b is naturally transferred to the outside of the vehicle. It can dissipate heat.

Here, as the material of the heat transfer members 38a and 38b, a material having a thermal conductivity higher than that of the housing 15 is preferable because heat is easily conducted. The materials of the heat transfer members 38a and 38b are not particularly limited as long as they have better thermal conductivity than the housing 15. For example, aluminum, copper, etc. are preferable because they have excellent thermal conductivity.

Since the heat transfer members 38a and 38b have a thermal conductivity higher than that of the housing 15, the heat of the housing 15 escapes to the heat transfer members 38a and 38b, and the temperature rise can be suppressed. In the present embodiment, since the heat transfer member 38a is provided around the monocular cameras 11 and 12, it is possible to suppress the deviation caused by the temperature rise in the positional relationship of the monocular cameras 11 and 12. If the distances between the monocular cameras 11 and 12 (x-axis direction, y-axis direction, z-axis direction in FIG. 1) are separated due to the expansion of the housing 15, the distance calculation accuracy may decrease. Then, the decrease can be suppressed. Further, although the lens optical systems of the monocular cameras 11 and 12 are also sensitive to heat, in the present embodiment, deterioration of optical performance due to a temperature rise of the lens optical system can be suppressed.

It is preferable to apply heat conductive grease, gel, or the like to the housing 15 and around the screws (fastening surface, screw holes, etc.). The thermal resistance of the member can be reduced to reduce the temperature rise, and the thermal conductivity of the housing 15 can be further improved.

In the above embodiment, the windshield F of the vehicle has been illustrated as an example of the member to be installed, but the present invention is not limited to this configuration. For example, the image pickup unit 1 may be installed on a frame (not shown) of the vehicle body instead of the windshield F. In this case, the heat conducted from the image sensor 22b and the electronic component 30b to the heat transfer member 38a is conducted to the frame of the vehicle body. The image pickup unit 1 is installed by fixing it to the frame of the vehicle body with an adhesive, double-sided tape, screws, or the like.

[Second Embodiment]
In the first embodiment, the case where the heat transfer members 38a and 38b are provided in contact with the image sensor substrate 22a and the image processing substrate 30a via another member such as a holder 31 or a housing 15 is illustrated. As described above, the present invention is not limited to this configuration. For example, the image sensor substrate 22a and the image processing substrate 30a may be configured to be in direct contact with the heat transfer members 38a and 38b. FIG. 6 is a cross-sectional view of an image pickup unit according to an embodiment different from that of the image pickup unit shown in FIG. 1, an internal structure diagram in the vicinity of the image sensor substrate (FIG. 6A), and an internal structure diagram in the vicinity of the image processing substrate (FIG. 6 (B)). The white arrows indicate the direction of heat transfer.

As shown in FIG. 6A, the heat transfer member 38a may be provided so as to be in direct contact with the image sensor substrate 22a. For example, the position of the image sensor substrate 22a is adjusted with respect to the holder 31. Then, the monocular cameras 11 and 12 are arranged in the engaging portions 13 and 14 (see FIG. 2) provided at both ends of the housing 15 (first housing 15a) in the position-adjusted state. After that, the holes of the image sensor substrate 22a and the holes of the heat transfer member 38a are aligned, and the image sensor substrate 22a and the heat transfer member 38a are fixed to the back surface of the holder 31 with screws 35, and the monocular camera is attached to the first housing 15a. Fix 11 and 12. A part of the heat transfer member 38a protrudes from the first housing 15a, and when the image pickup unit 1 is installed on the windshield F, the protruding portion is attached so as to be in contact with the windshield F. As a result, the heat of the image sensor substrate 22a is directly conducted to the heat transfer member 38a without passing through the holder 31 or the housing 15, and the heat can be effectively transferred.

Further, as shown in FIG. 6B, the heat transfer member 38b may be attached to the image processing substrate 30a so as to be in direct contact with the image processing substrate 30a. For example, the window portion 15h is provided on the surface 15g of the second housing 15b in contact with the image processing substrate 30a, and the heat transfer member 38b is arranged on the window portion 15h. The heat transfer member 38b and the image processing substrate 30a are fixed to the first housing 15a by the screws 42. The heat of the image processing substrate 30a is directly conducted to the heat transfer member 38b without passing through the housing 15, and the heat can be effectively transferred.

[Third Embodiment]
In the first embodiment, the case where the bracket 16 and the heat transfer members 38a and 38b are configured as separate members has been described as an example, but the present invention is not limited to this configuration. For example, as shown in FIG. 7, by using the heat transfer member 38b as a bracket, it may be configured as a cover 150a in which the heat transfer member 38b and the bracket are integrally formed. In this case, the heat transfer member 38b can also be used as the heat transfer member 38a. The imaging unit 100 is installed by fixing the mounting portion 150b to the windshield F with an adhesive, double-sided tape, screws, or the like. As a result, the number of parts can be reduced, so that it is possible to provide the image pickup unit 100 that can suppress the temperature rise at low cost.

At this time, the heat of the image sensor 22b is conducted in the order of the image sensor substrate 22a, the holder 31, the first housing 15a, the cover 150a (mounting portion 150b), and the windshield F. Further, the heat of the electronic component 30b is conducted in the order of the image processing substrate 30a, the second housing 15b, the cover 150a (mounting portion 150b), and the windshield F.

The material of the cover 150a is not particularly limited as long as it has thermal conductivity, rigidity and workability. Aluminum is preferable as a material having thermal conductivity, rigidity and workability, but it is not particularly limited as long as it is a material having characteristics equivalent to those of aluminum (high thermal conductivity, low linear expansion coefficient, etc.).

Alternatively, the heat transfer member 38b may be used as a bracket, and the bracket may be integrally formed with the first housing or the second housing. As a result, the number of parts can be further reduced, so that cost reduction can be realized. Further, since the bracket is integrally formed with the first housing or the second housing, it is not necessary to adjust the position of the bracket, and the assembling property is excellent. Further, since complicated processing such as protrusions and grooves on the housing and bracket is not required, the manufacturing man-hours can be reduced.

Since the image pickup unit according to the first to third embodiments has the above heat transfer structure, the heat generated by the image pickup element 22b and the electronic component 30b is efficiently transferred to the outside of the vehicle with a simple configuration. can do.

Further, in each of the above embodiments, the case where the image pickup element substrate 22a, the image pickup element 22b, the image processing substrate 30a, the electronic component 30b, and the heat transfer member are attached to the housing 15 by screws has been described as an example. The present invention is not limited to this configuration. As long as the above parts can be fixed to the housing 15, the fixing method is not particularly limited.

[Fourth Embodiment]
In the first to third embodiments described above, the case where the image pickup unit is applied to a vehicle is described, but the present invention is not limited to this configuration. For example, it may be applied to FA (Factory Automation) and used to calculate the distance to the picking target when picking a product or the like transported in a production factory.

<Configuration when imaging units 1 and 100 are applied for FA>
FIG. 8 is a diagram illustrating an example of the overall configuration of the imaging unit when the imaging units shown in FIGS. 1 and 7 are applied for FA.

As shown in FIG. 8, the imaging units 1 and 100 have monocular cameras 11 and 12 on the left and right, and a product (for example, an iron body) 1200 is arranged on the table 1210. The monocular cameras 11 and 12 are arranged at positions where the product 1200 arranged on the table 1210 can be photographed.

When the imaging units 1 and 100 are applied for FA, the imaging units 1 and 100 are fixed to the holding frame (installed member) 50. The height of the mounting surface of the holding frame 50 on which the imaging units 1 and 100 are installed is adjusted to a position where the product 1200 arranged on the table 1210 can be photographed. The holding frame 50 is formed by a combination of a plurality of metal plate-shaped members 50a. By fixing the mounting portion 16a of the bracket 16 (or the mounting portion 150b of the cover 150a) to the plate-shaped member 50a with screws, fixtures, adhesives, double-sided tape, etc., the imaging units 1 and 100 are attached to the holding frame 50. Install.

In this case, the heat conducted from the image sensor 22b and the electronic component 30b to the heat transfer member 38a (or the cover 150a, the mounting portion 150b) is conducted to the holding frame 50 and released into the atmosphere.

The material of the holding frame 50 is not particularly limited as long as it has thermal conductivity, rigidity and workability. Aluminum is preferable as a material having thermal conductivity, rigidity and workability, but it is not particularly limited as long as it is a material having characteristics equivalent to those of aluminum (high thermal conductivity, low linear expansion coefficient, etc.).

In this way, even when the imaging units 1 and 100 are applied for FA, the heat inside the housing 15 is efficiently transferred from the inside of the housing 15 having a small heat capacity to the outside of the housing 15 having a large heat capacity. It is possible to transfer heat in a targeted manner.

[Fifth Embodiment]
In each of the above embodiments, the case where the heat transfer member is arranged outside the housing 15 has been described as an example, but the heat transfer member can be configured to be arranged inside the housing 15. Further, by applying a surface treatment by radiation to each surface of the housing 15, it is possible to suppress a temperature rise inside the housing 15.

<Configuration of imaging unit 200>
The schematic configuration of the imaging unit 200 according to the present embodiment will be described with reference to the drawings. FIG. 9 is a perspective view illustrating an overall configuration of an imaging unit according to an embodiment different from that of the imaging unit shown in FIG. Further, FIG. 10 is a YY cross-sectional view of the image pickup unit shown in FIG. 9, which is a schematic view showing the internal structure of the image pickup unit 200.

As shown in FIG. 9, the image pickup unit 200 includes a plurality of (two in FIG. 1) monocular cameras (imaging devices) 11 and 12, a housing 15 for holding the monocular cameras 11 and 12, a circuit board, and a circuit board. To be equipped. The image pickup unit 200 is provided with a heat transfer member provided in contact with the housing 15 or the circuit board. The circuit board is housed inside the housing 15. The member to be installed is, for example, the windshield F of the vehicle.

The housing 15 includes a first housing 15a and a second housing 15b attached to the first housing 15a, and the monocular cameras 11 and 12 are separated by a predetermined distance from the first housing 15. It is attached to the housing 15a. Internal components such as a circuit board are housed inside the housing 15, and the circuit board is provided inside the housing 15 as an intermediate member via a heat transfer member 380. In FIG. 10, the circuit board is an image processing board 300a that processes images taken by the monocular cameras 11 and 12.

Specifically, an electronic component 300b for image processing is mounted on the image processing substrate 300a. The electronic component 300b is in contact with the heat transfer member 380, and the heat transfer member 380 is provided so as to be in contact with the housing 15. The heat transfer member 380 is arranged on the upper surface of the electronic component 300b, and is attached so as to be in contact with the back surface 17d of the first housing 15a. As a result, the heat transfer member 380 is provided so as to be sandwiched between the upper surface of the electronic component 300b and the back surface 17d of the housing 15 (first housing 15a). The heat transfer member 380 is attached to the upper surface of the electronic component 300b by, for example, applying heat conductive grease or gel. It is preferable because the thermal conductivity of the heat transfer member 380 can be further improved.

In the present embodiment, the case where the cross-sectional area of the heat transfer member 380 is formed to have a size having substantially the same cross-sectional area as the electronic component 300b has been described as an example, but the present invention is limited to this configuration. It's not a thing. The cross-sectional area of the heat transfer member 380 may be smaller than the electronic component 300b. However, the larger the surface area (cross-sectional area) of the heat transfer member 380, the larger the amount of heat transfer and the better the heat dissipation effect, which is preferable.

Other configurations are basically the same as those of the imaging unit 1.

Then, the image pickup unit 200 is arranged so that the surface of the image pickup unit 200 facing the windshield F (upper surface 17a in FIG. 9) becomes a sunlight receiving surface in a state of being installed on the windshield F of the vehicle. When the imaging unit 200 is installed on the windshield F, the upper surface of the housing 15 (first housing 15a) faces the outside of the vehicle body, and the lower surface of the housing 15 (second housing 15b) is inside the vehicle. If it is suitable, there is no particular limitation. For example, the image pickup unit 200 may be installed in the vicinity of the windshield F (for example, in the vicinity of the rearview mirror). Alternatively, the windshield F side may be installed so that the upper surface of the housing 15 (first housing 15a) is in contact with the windshield F side.

<Heat transfer structure of imaging unit 200>
The heat transfer structure of the imaging unit 200 according to the present embodiment will be described with reference to FIG. In FIG. 10, the thin arrow indicates the direction of sunlight, the thick arrow indicates the direction of heat transfer, and the white arrow indicates the direction of heat dissipation.

Surface treatment is applied to each surface of the housing 15 of the image pickup unit 200. The surface treatment applied to each surface of the housing 15 will be described with reference to FIG.

The side surface 17b and the lower surface 17c of the housing 15 are surface-treated by high radiation. Radiation can be performed efficiently. The surface treatment by high radiation is performed by, for example, alumite treatment. The side surface 17b and the lower surface 17c of the housing 15 may be formed of a high radiation material, or the side surface 17b and the lower surface 17c may be coated with a high radiation paint.

The back surface 17d of the housing 15 is surface-treated with low radiation. Surface treatment with low radiation is performed, for example, by polishing a metal material with a base material. A low-emissivity paint may be applied to the back surface 17d of the housing 15. The upper surface 17a of the housing 15 is also surface-treated with low radiation. The upper surface 17a of the housing 15 may be subjected to a surface treatment having a low solar transmittance.

That is, in the state of being installed on the windshield F of the vehicle, the surface (upper surface 17a) facing the windshield F is subjected to surface treatment for lowering the sunlight absorption rate. Then, the surfaces (side surfaces 17b and lower surface 17c) other than the surface facing the windshield F are subjected to surface treatment to increase the emissivity.

Here, the surface treatment of the side surface 17b and the lower surface 17c of the housing 15 by high radiation is performed by transferring the heat conducted from the electronic component 300b to the housing 15 through the heat transfer member 380 to the side surface 17b and the lower surface of the housing 15. This is to facilitate the release from the 17c side.

Further, the reason why the back surface 17d of the housing 15 is subjected to the surface treatment by low radiation is to prevent the heat conducted from the electronic component 300b to the housing 15 from escaping to the inside of the housing 15.

Further, in the present embodiment, since the upper surface 17a of the housing 15 is subjected to low radiation treatment, it is possible to reduce the heat reception to the housing 15 by solar radiation (see the thin line arrow in FIG. 10). In order to suppress heat reception due to solar radiation, it is preferable to apply a surface treatment having a low sunlight absorption rate to the upper surface 17a of the housing 15. For example, it is preferable to apply white paint to the upper surface 17a of the housing 15. The solar absorption rate can be lowered and the emissivity can be lowered.

Since the image pickup unit 200 has the above configuration, the heat generated by the electronic component 300b is first conducted to the heat transfer member 380. Next, the heat conducted to the heat transfer member 380 is transferred from the back surface 17d of the housing 15 that has been surface-treated by low radiation to the side surfaces 17b and 17c of the housing 15 that has been surface-treated by high radiation. It is conducted (see the thick arrow in FIG. 10). As a result, the heat generated by the electronic component 300b is released to the outside of the housing 15 (see the white arrow in FIG. 10).

At this time, since the back surface 17d of the housing 15 is surface-treated by low radiation, the heat conducted from the heat transfer member 380 to the housing 15 does not escape to the inside of the housing 15. Therefore, heat is trapped inside the housing 15 and the temperature around the electronic component 300b does not rise sharply. Further, since the upper surface 17a of the housing 15 is also surface-treated by low radiation, it is possible to reduce the heat reception to the housing 15 by solar radiation (see the thin line arrow in FIG. 10), and the periphery of the electronic component 300b. The rise in temperature can be further suppressed.

As described above, according to the image pickup unit 200, the heat inside the housing 15 can be efficiently dissipated from the inside of the housing 15 having a small heat capacity to the outside of the housing 15 having a large heat capacity.

<Summary>
In the first to fourth embodiments, the image pickup unit is provided with heat transfer members 38a and 38b.

More specifically, the heat transfer member 38a is provided so as to be in contact with the first housing 15a. Specifically, the heat transfer member 38a is provided between the monocular camera 11 and the monocular camera 12 so as to be in contact with the housing 15 (see the hatched portion S1 in FIG. 1). By setting the target to which the heat transfer member 38a is in contact with the first housing 15a, surface contact over a wider area is possible, so that the heat of the first housing 15a can be effectively transferred to the outside. it can.

The heat transfer member 38b is provided so as to be in contact with the second housing 15b. The range in which the heat transfer member 38b is in contact with the second housing 15b is a part of the portion of the back surface where the image processing substrate 30a is in contact with the second housing 15b (see S2 in FIG. 1). It may be all or all. Alternatively, the image processing substrate 30a may be wider than all in contact with the second housing 15b.

The image sensor substrate 22a and the image processing substrate 30a may be provided so as to be in contact with the heat transfer members 38a and 38b via another member such as the housing 15. By setting the object in contact with the heat transfer members 38a and 38b as the housing 15, surface contact over a wider area is possible, so that the heat of the housing 15 can be effectively transferred to the outside.

As shown in FIGS. 6A and 6B, the image sensor substrate 22a and the image processing substrate 30a may be configured to be in direct contact with the heat transfer members 38a and 38b. Since the heat of the image sensor substrate 22a and the image processing substrate 30a is directly conducted to the heat transfer members 38a and 38b without passing through another member such as the housing 15, the heat can be effectively transferred. Can be done.

According to the first to fourth embodiments, the heat transfer members 38a and 38b are provided so as to come into contact with the windshield F in a state where the image pickup unit 200 is installed on the windshield F (installed member).

In the first, third, and fourth embodiments, the image sensor 22b, the image sensor substrate 22a, the holder 31, the housing 15 (first housing 15a), the heat transfer member 38a (or the cover 150a), and the like. It has a first heat transfer path that is conducted in the order of the windshield F (or holding frame). Further, in the first, third, and fourth embodiments, the electronic component 30b, the image processing substrate 30a, the housing 15 (second housing 15b), the heat transfer member 38b, the bracket 16, and the heat transfer member 38a (or , Cover 150a), and has a second heat transfer path conducted in the order of the windshield F.

Further, according to the second embodiment, the third heat transfer path conducted in the order of the image pickup element 22b, the image pickup element substrate 22a, the heat transfer member 38a, and the front glass F, the electronic component 30b, the image processing substrate 30a, It has a fourth heat transfer path that is conducted in the order of the heat transfer member 38b. Since the heat of the image sensor substrate 22a and the image processing substrate 30a can be directly conducted to the heat transfer members 38a and 38b without passing through the housing 15, heat transfer can be effectively performed.

Therefore, the heat inside the housing 15 can be efficiently transferred from the inside of the housing 15 having a small heat capacity to the outside of the housing 15 having a large heat capacity.

Further, according to the fifth embodiment, the heat transfer member 380 is arranged between the back surface of the housing 15 and the electronic component 300b, and the emissivity, the sunlight absorption rate, etc. are taken into consideration on each surface of the housing 15. Various treatments have been applied.

Therefore, according to the first to fifth embodiments, the heat generated from the image pickup device and the electronic component is released into the atmosphere through the heat transfer member, so that an image pickup unit capable of suppressing an internal temperature rise is provided. be able to. As a result, deterioration of the characteristics of the internal components due to the temperature rise can be suppressed, and deterioration of the function of the imaging unit can be suppressed, so that the risk of failure of these internal components can be reduced and the life of the imaging unit can be extended.

Further, according to the first to fifth embodiments, even when the temperature inside the vehicle rises significantly, such as in the daytime in summer, heat transfer or heat dissipation to the outside is performed while minimizing the influence of solar radiation. It is possible to provide an imaging unit that can be efficiently performed.

Further, according to the first to fifth embodiments, the heat generated by the internal parts such as the image sensor can be efficiently released into the atmosphere by forming a heat transfer path utilizing the characteristics of the members. Therefore, heat dissipation parts such as a heat sink and a fan and a structure such as a sunshade are not required, and the image pickup unit can be made smaller and lighter.

Further, according to the first to fifth embodiments, even if the technology for increasing the speed of the system or reducing the size of the stereo camera is further advanced in the future, heat is trapped inside the housing and the image is captured. The characteristics of the unit do not deteriorate.

The present invention is not limited to the configurations shown here, such as combinations with other elements in the configurations and the like described in each of the above embodiments. These points can be changed without departing from the gist of the present invention, and can be appropriately determined according to the application form thereof.

1,100,200 Imaging units 11, 12 Monocular cameras (an example of imaging equipment)
15 Housing 15a First housing 15b Second housing 16 Installation member (bracket)
16a Mounting part 22a Image sensor board (example of circuit board)
22b Image sensor 30a, 300a Image processing board (example of circuit board)
30b, 300b Electronic components 38a, 38b, 380 Heat transfer member F Windshield (example of installed member)

JP-A-2007-225543

Claims (5)

With multiple imaging devices
A housing that holds the plurality of image pickup devices and
An imaging unit having a circuit board and
A heat transfer member provided in contact with the housing is provided.
The heat transfer member has a thermal conductivity higher than that of the housing , and includes a mounting portion for the member to be installed of the imaging unit.
The circuit board is provided in contact with the housing via the heat transfer member.
The installed member is the windshield of the vehicle.
The housing is
While installed on the windshield, the surface facing the windshield is surface-treated to reduce the sunlight absorption rate.
In the state of being installed on the windshield, a surface treatment for increasing the emissivity is applied to a surface other than the surface facing the windshield.
An imaging unit characterized in that the back surface is surface-treated to reduce the emissivity. The imaging unit according to claim 1, wherein the heat transfer member is provided in contact with the housing between the plurality of imaging devices. The imaging unit according to claim 1 or 2, wherein the circuit board includes an imaging element substrate of the imaging device and an image processing substrate that processes an image captured by the imaging device. The circuit board
The imaging unit according to claim 1, wherein the imaging unit is attached to the housing by a fastening member in a region in contact with the housing. The imaging unit according to any one of claims 1 to 4 , wherein the material of the heat transfer member is aluminum.

Images