JP6869305B2 - Slit nozzle and substrate processing equipment - Google Patents

Description

The present invention relates to a slit nozzle having a slit-shaped discharge port and a substrate processing apparatus for applying a processing liquid to a substrate using the slit nozzle. The above-mentioned substrates include a semiconductor substrate, a photomask substrate, a liquid crystal display substrate, an organic EL display substrate, a plasma display substrate, a FED (Field Emission Display) substrate, an optical disk substrate, a magnetic disk substrate, and an optical disk. Includes magnetic disk substrates and the like.

In the manufacturing process of electronic devices such as semiconductor devices and liquid crystal display devices, a substrate processing device is used in which a processing liquid is supplied to the surface of a substrate and the processing liquid is applied to the substrate. The substrate processing apparatus feeds the processing liquid to the slit nozzle while transporting the substrate in a floating state, discharges the processing liquid from the discharge port of the slit nozzle to the surface of the substrate, and applies the processing liquid to almost the entire substrate. To do. In another substrate processing device, while adsorbing and holding the substrate on the stage, the slit nozzle is moved relative to the substrate in a state of being discharged from the ejection port of the slit nozzle toward the surface of the substrate, so that almost the entire substrate is formed. Apply the treatment liquid to.

In recent years, with the improvement of product quality, it has become important to improve the uniformity of the film thickness of the treatment liquid applied by the substrate processing apparatus. For this purpose, a configuration has been proposed that allows the opening size of the slit-shaped discharge port to be individually adjusted for each position along the longitudinal direction of the slit. For example, Patent Document 1 describes a conventional configuration in which a plurality of differential screws are arranged in the longitudinal direction (FIG. 8) and one member as an adjustment mechanism in a configuration in which two members are combined and a gap between them is used as a discharge port. Discloses the configuration according to the invention (FIG. 2), which is divided in the longitudinal direction and enables independent gap adjustment between the central portion and the end portion of the discharge port.

Japanese Unexamined Patent Publication No. 2008-246280

From the standpoint of miniaturization of electronic devices and efficient use of materials, higher standards of coating uniformity are required than ever before. Therefore, it is necessary to adjust the opening size finer than before in the entire area extending in the longitudinal direction of the discharge port. However, the above-mentioned prior art has not been able to meet such demands.

The present invention has been made in view of the above problems, and in a slit nozzle having a slit-shaped discharge port and a substrate processing device provided with the slit nozzle for applying a treatment liquid to a substrate, the opening size of the discharge port is finely adjusted as compared with the conventional case. The purpose is to provide a technology that can be used.

One aspect of the slit nozzle according to the present invention has a first lip portion and a second lip portion, and has a first flat surface and the second lip provided on the first lip portion in order to achieve the above object. A nozzle body that forms a discharge port that opens in a slit shape with the direction parallel to the first flat surface as the longitudinal direction by facing the second flat surface provided on the portion with a gap, and the longitudinal direction. A plurality of first adjusting mechanisms, each of which displaces the first lip portion in the approaching and separating directions with respect to the second lip portion, and an arrangement along the longitudinal direction and in the longitudinal direction. The positions are arranged differently from the first adjusting mechanism, and each includes a plurality of second adjusting mechanisms that displace the second lip portion in the approaching and separating directions with respect to the first lip portion.

In the technique described in Patent Document 1 described above, the adjusting mechanism is provided only on one of the two lip portions facing each other across the discharge port, but in the present invention, the adjusting mechanism is independent for each of the two lip portions. Is provided.

In the invention configured as described above, the first adjusting mechanism has a function of displacing the first lip portion with respect to the second lip portion, while the second adjusting mechanism displaces the second lip portion with respect to the first lip portion. It has a function to displace. In this way, the opening size of the discharge port is adjusted by the displacement of the first lip portion and the second lip portion in the directions of approaching and separating from each other. By arranging a plurality of the first adjusting mechanism and the second adjusting mechanism in the longitudinal direction of the discharge port, the opening size can be individually adjusted at each position of the discharge port in the same direction.

Here, in the configuration in which a plurality of adjusting mechanisms are arranged in the longitudinal direction in this way, in order to enable finer adjustment of the opening size, it is possible to reduce the arrangement pitch of each of the first and second adjusting mechanisms. Conceivable. However, there is a limit to shortening the arrangement pitch due to problems such as mechanical dimensional restrictions and mutual interference generated between adjustment mechanisms arranged in close proximity.

In the present invention, the adjusting mechanism is arranged in each of the first lip portion and the second lip portion facing each other, and moreover, the first adjusting mechanism provided in the first lip portion and the second adjusting mechanism provided in the second lip portion are provided. The arrangement positions in the longitudinal direction are different from each other. Therefore, for example, the opening size of the portion that cannot be adjusted by the two adjacent first adjusting mechanisms can be adjusted by the second adjusting mechanism located between them in the longitudinal direction. As described above, since the complementary opening size can be adjusted by the first adjustment mechanism and the second adjustment mechanism, the present invention is more than the conventional technique in which the adjustment mechanism is provided only on one lip portion. Fine adjustment of opening size is possible.

As described above, according to the present invention, adjustment mechanisms are provided in each of the first lip portion and the second lip portion that form the discharge ports facing each other in the nozzle body, and the arrangement positions thereof are set. They are different from each other in the longitudinal direction of the discharge port. Therefore, the opening size of the discharge port can be finely adjusted as compared with the conventional case.

It is a figure which shows the coating apparatus which is one Embodiment of the substrate processing apparatus which concerns on this invention. It is an exploded view which shows the main structure of the 1st Embodiment of a slit nozzle. It is a three-view view of a slit nozzle. It is sectional drawing of the slit nozzle. It is a figure which shows the 2nd to 5th Embodiment of the slit nozzle which concerns on this invention.

<Overall configuration of coating device>
FIG. 1 is a diagram schematically showing an overall configuration of a coating apparatus according to an embodiment of the substrate processing apparatus according to the present invention. The coating device 1 is a slit coater that applies a coating liquid to the surface Sf of the substrate S that is conveyed in a horizontal posture from the left-hand side to the right-hand side in FIG. For example, for the purpose of forming a uniform coating film by applying various treatment liquids such as a coating liquid containing a resist film material and a coating liquid containing an electrode material to the surface Sf of various substrates S such as a glass substrate and a semiconductor substrate. , This coating device 1 can be preferably used.

In each of the following figures, the right-handed XYZ Cartesian coordinates are set as shown in FIG. 1 in order to clarify the arrangement relationship of each part of the device. The transport direction of the substrate S is referred to as "X direction", the horizontal direction from the left-hand side to the right-hand side in FIG. 1 is referred to as "+ X direction", and the reverse direction is referred to as "-X direction". Further, of the horizontal directions Y orthogonal to the X direction, the front side (front side in the drawing) of the device is referred to as "-Y direction", and the back side of the device is referred to as "+ Y direction". Further, the upward direction and the downward direction in the vertical direction Z are referred to as "+ Z direction" and "-Z direction", respectively.

First, the outline of the configuration and operation of the coating device 1 will be described with reference to FIG. 1, and then the detailed structure and opening size adjusting operation of the slit nozzle having the technical features of the present invention will be described. In the coating device 1, the input conveyor 100, the input transfer unit 2, the levitation stage unit 3, the output transfer unit 4, and the output conveyor 110 are close to each other in this order along the transport direction Dt of the substrate S, that is, (+ X direction). As will be described in detail below, a transport path for the substrate S extending in a substantially horizontal direction is formed by these.

The substrate S to be processed is carried into the input conveyor 100 from the left hand side of FIG. The input conveyor 100 includes a roller conveyor 101 and a rotation drive mechanism 102 that rotationally drives the roller conveyor 101, and the rotation of the roller conveyor 101 causes the substrate S to be conveyed in a horizontal posture on the downstream side, that is, in the (+ X) direction. The input transfer unit 2 includes a roller conveyor 21 and a rotation / elevation drive mechanism 22 having a function of rotationally driving the roller conveyor 21 and a function of raising and lowering the roller conveyor 21. As the roller conveyor 21 rotates, the substrate S is further conveyed in the (+ X) direction. Further, the vertical position of the substrate S is changed by moving the roller conveyor 21 up and down. The input transfer unit 2 configured in this way transfers the substrate S from the input conveyor 100 to the levitation stage unit 3.

The levitation stage portion 3 includes a flat plate-shaped stage divided into three along the transport direction Dt of the substrate. That is, the levitation stage portion 3 includes an inlet levitation stage 31, a coating stage 32, and an outlet levitation stage 33, and the surfaces of each of these stages form a part of the same plane as each other. A large number of ejection holes for ejecting compressed air supplied from the levitation control mechanism 35 are provided in a matrix on the surfaces of the inlet levitation stage 31 and the outlet levitation stage 33, and the buoyancy applied from the ejected airflow causes the buoyancy. The substrate S floats. In this way, the back surface Sb of the substrate S is supported in a horizontal posture in a state of being separated from the stage surface. The distance between the back surface Sb of the substrate S and the front surface of the stage, that is, the amount of levitation can be set to, for example, 10 micrometers to 500 micrometers.

On the other hand, on the surface of the coating stage 32, ejection holes for ejecting compressed air and suction holes for sucking air between the back surface Sb of the substrate S and the surface of the stage are alternately arranged. The levitation control mechanism 35 controls the amount of compressed air ejected from the ejection hole and the amount of suction from the suction hole, so that the distance between the back surface Sb of the substrate S and the front surface of the coating stage 32 is precisely controlled. As a result, the vertical position of the surface Sf of the substrate S passing above the coating stage 32 is controlled to a specified value. As a specific configuration of the levitation stage portion 3, for example, the one described in Japanese Patent No. 5346643 can be applied. The amount of levitation at the coating stage 32 is calculated by the control unit 9 based on the detection results by the sensors 61 and 62, which will be described in detail later, and can be adjusted with high accuracy by airflow control.

The inlet levitation stage 31 is provided with a lift pin not shown in the drawing, and the levitation stage portion 3 is provided with a lift pin drive mechanism 34 for raising and lowering the lift pin.

The substrate S carried into the levitation stage portion 3 via the input transfer portion 2 is given a propulsive force in the (+ X) direction by the rotation of the roller conveyor 21 and is conveyed onto the entrance levitation stage 31. The inlet levitation stage 31, the coating stage 32, and the outlet levitation stage 33 support the substrate S in a levitation state, but do not have a function of moving the substrate S in the horizontal direction. The transfer of the substrate S in the levitation stage portion 3 is performed by the substrate transfer portion 5 arranged below the inlet levitation stage 31, the coating stage 32, and the outlet levitation stage 33.

The substrate transport portion 5 is provided on a chuck mechanism 51 that supports the substrate S from below by partially contacting the lower peripheral edge portion of the substrate S, and a suction pad (not shown) provided on the suction member at the upper end of the chuck mechanism 51. It is provided with a suction / running control mechanism 52 having a function of applying a negative pressure to suck and hold the substrate S and a function of reciprocating the chuck mechanism 51 in the X direction. When the chuck mechanism 51 holds the substrate S, the back surface Sb of the substrate S is located at a position higher than the surface of each stage of the levitation stage portion 3. Therefore, the substrate S maintains the horizontal posture as a whole by the buoyancy applied from the buoyancy stage portion 3 while the peripheral portion is attracted and held by the chuck mechanism 51. A sensor 61 for measuring the plate thickness is arranged near the roller conveyor 21 in order to detect the vertical position of the surface of the substrate S at the stage where the back surface Sb of the substrate S is partially held by the chuck mechanism 51. .. By locating a chuck (not shown) in a state where the substrate S is not held directly below the sensor 61, the sensor 61 can detect the surface of the suction member, that is, the vertical position of the suction surface.

The chuck mechanism 51 holds the substrate S carried from the input transfer unit 2 to the levitation stage unit 3, and the chuck mechanism 51 moves in the (+ X) direction in this state, so that the substrate S is moved above the inlet levitation stage 31. Is conveyed above the outlet levitation stage 33 via above the coating stage 32. The conveyed substrate S is delivered to the output transfer unit 4 arranged on the (+ X) side of the outlet levitation stage 33.

The output transfer unit 4 includes a roller conveyor 41 and a rotation / elevation drive mechanism 42 having a function of rotationally driving the roller conveyor 41 and a function of raising and lowering the roller conveyor 41. By rotating the roller conveyor 41, a propulsive force is applied to the substrate S in the (+ X) direction, and the substrate S is further conveyed along the transfer direction Dt. Further, the vertical position of the substrate S is changed by moving the roller conveyor 41 up and down. The output transfer unit 4 transfers the substrate S to the output conveyor 110 from above the outlet levitation stage 33.

The output conveyor 110 includes a roller conveyor 111 and a rotation drive mechanism 112 that rotationally drives the roller conveyor 111. The rotation of the roller conveyor 111 further conveys the substrate S in the (+ X) direction, and finally outside the coating device 1. Will be paid out to. The input conveyor 100 and the output conveyor 110 may be provided as a part of the configuration of the coating device 1, but may be separate from the coating device 1. Further, for example, a substrate dispensing mechanism of another unit provided on the upstream side of the coating device 1 may be used as the input conveyor 100. Further, a substrate receiving mechanism of another unit provided on the downstream side of the coating device 1 may be used as the output conveyor 110.

A coating mechanism 7 for applying the coating liquid to the surface Sf of the substrate S is arranged on the transport path of the substrate S transported in this way. The coating mechanism 7 has a slit nozzle 71. Further, although not shown, a positioning mechanism is connected to the slit nozzle 71, and the slit nozzle 71 is positioned above the coating stage 32 by the positioning mechanism (position shown by a solid line in FIG. 1) and a maintenance position. Positioned to. Further, a coating liquid supply mechanism 8 is connected to the slit nozzle 71, the coating liquid is supplied from the coating liquid supply mechanism 8, and the coating liquid is discharged from a discharge port that opens downward to the lower part of the nozzle. The slit nozzle 71 will be described in detail later.

As shown in FIG. 1, the slit nozzle 71 is provided with a levitation height detection sensor 62 for detecting the levitation height of the substrate S in a non-contact manner. The levitation height detection sensor 62 can measure the separation distance between the levitation substrate S and the surface of the stage surface of the coating stage 32, and according to the detected value, the levitation height detection sensor 62 is used via the control unit 9. The position where the slit nozzle 71 descends can be adjusted. As the levitation height detection sensor 62, an optical sensor, an ultrasonic sensor, or the like can be used.

As shown in FIG. 1, the coating mechanism 7 is provided with a nozzle cleaning standby unit 72 in order to perform predetermined maintenance on the slit nozzle 71. The nozzle cleaning standby unit 72 mainly includes a roller 721, a cleaning unit 722, a roller butt 723, and the like. Then, with the slit nozzle 71 positioned at the maintenance position, nozzle cleaning and liquid pool formation are performed by these, and the discharge port of the slit nozzle 71 is adjusted to a state suitable for the next coating process.

In addition, the coating device 1 is provided with a control unit 9 for controlling the operation of each part of the device. The control unit 9 includes a storage unit that stores a predetermined program, various recipes, etc., an arithmetic processing unit such as a CPU that causes each unit of the device to execute a predetermined operation by executing the program, a display unit such as a liquid crystal panel, a keyboard, and the like. It has an input unit of.

Next, with reference to FIGS. 2 to 4, the configuration of the slit nozzle 71 and the method of adjusting the opening size of the discharge port will be described in detail. The adjustment of the opening size referred to here is not an adjustment aiming at the opening size being constant or a predetermined value, but the thickness of the coating film formed on the surface of the substrate S as a result of ejection. It is an adjustment that aims to make it uniform.

<First Embodiment>
FIG. 2 is an exploded assembly view schematically showing the main configuration of the first embodiment of the slit nozzle used in the coating apparatus of FIG. 1, and FIG. 3 is a three-view view of the slit nozzle. The slit nozzle 71 has a first main body portion 711, a second main body portion 712, a first side plate 713, and a second side plate 714. As shown by the alternate long and short dash arrow, the first main body portion 711 and the second main body portion 712 are connected in a state of facing each other in the X direction, and the first side plate 713 is also attached to the (-Y) side end surface of the combined body (-Y). The second side plate 714 is coupled to the + Y) side end surface to form the nozzle body 710.

Each of these members is machined from a metal block such as stainless steel or aluminum. The members constituting the nozzle body 710 are bonded to each other by being consolidated by an appropriate consolidation member such as a bolt, and such a bonding structure is known. Therefore, in order to make the drawings easier to see, the description of the configuration related to consolidation, such as the fixing bolt and the screw hole for inserting the fixing bolt, is omitted here.

The main surface of the first main body 711 on the side facing the second main body 712, that is, the lower half of the main surface on the (+ X) side is finished to be a flat surface 711a parallel to the XZ plane. Hereinafter, the flat surface 711a will be referred to as a “first flat surface”. The upper half of the main surface of the first main body portion 711 on the side facing the second main body portion 712 is also finished so as to be a flat surface 711b parallel to the XZ plane. Further, the lower portion of the first main body portion 711 projects downward to form the first lip portion 711c. The flat surfaces 711a and 711b are separated by a substantially semi-cylindrical groove 711d having the Y direction as the longitudinal direction. The groove 711d functions as a manifold in the flow path of the coating liquid.

On the other hand, the main surface of the second main body 712 facing the first main body 711, that is, the main surface on the (−X) side is a single flat surface 712a parallel to the XZ plane. Hereinafter, the flat surface 712a will be referred to as a “second flat surface”. Further, the lower portion of the second main body portion 712 projects downward to form the second lip portion 712c. The first main body portion 711 and the second main body portion 712 are connected so that the flat surface 711b and the upper half of the second flat surface 712a are in close contact with each other.

The first flat surface 711a is slightly retracted to the (−X) side from the flat surface 711b. Therefore, in a state where the first main body portion 711 and the second main body portion 712 are connected, the first flat surface 711a and the second flat surface 712a face each other in parallel with a minute gap. This gap portion serves as a flow path for the coating liquid from the manifold, and the lower end thereof functions as a discharge port 715 that opens downward toward the surface Sf of the substrate S. The discharge port 715 is a slit-shaped opening having a longitudinal direction in the Y direction and a minute opening size in the X direction.

A deep groove 711f extending in the Y direction is provided on the main surface 711e of the main surface of the first main body portion 711 on the side opposite to the first flat surface 711a. The depth of the deep groove 711f is, for example, more than half the thickness of the first main body portion 711 in the X direction. The deep groove 711f is provided with a uniform cross-sectional shape over the entire area of the first main body portion 711 in the Y direction. Therefore, the portion of the first main body portion 711 below the deep groove 711f is a first protruding portion 711g having a uniform cross-sectional shape in the Y direction and projecting in the (−X) direction. Similarly, of the main surface of the second main body portion 712, the main surface 712e on the side opposite to the second flat surface 712a is provided with a deep groove 712f extending in the Y direction. Therefore, the portion of the second main body portion 712 below the deep groove 712f is a second protruding portion 712g having a uniform cross-sectional shape in the Y direction and projecting in the (+ X) direction.

Screw holes 711h and 712h are provided on the lower surfaces of the first protruding portion 711g and the second protruding portion 712g to penetrate them in the vertical direction. A plurality of screw holes 711h are provided on the lower surface of the first protruding portion 711g along the Y direction. Further, a plurality of screw holes 712h are provided on the lower surface of the second protruding portion 712g along the Y direction. Adjusting screws 716 for adjusting the opening size of the discharge port 715 in the X direction are attached to the screw holes 711h and 712h as described later. The adjusting screw 716 straddles the deep grooves 711f and 712f, and the upper end thereof reaches the upper surface of the deep grooves 711f and 712f.

The adjusting screw 716 is, for example, a differential screw. The principle of the method of adjusting the opening size of the discharge port by using the differential screw is described in, for example, Japanese Patent Application Laid-Open No. 09-131561, and the same principle can be used in this embodiment. Detailed explanation is omitted.

As shown in the bottom view at the bottom of FIG. 3, the arrangement positions of the adjusting screws 716 are different in the Y direction between the first main body portion 711 and the second main body portion 712. Specifically, the screw holes 711h and 712h are positioned so that the adjusting screw 716 on the first main body 711 side is located between the two adjacent adjusting screws 716 and 716 on the second main body 712 side in the Y direction. Is placed. Therefore, when the slit nozzle 71 is viewed from the lower surface side, the adjusting screws 716 are arranged in a so-called staggered arrangement along the Y direction.

In order to make the drawings easier to see, the number of adjusting screws 716 is shown to be smaller than the actual number in FIGS. 2 and 3. That is, in an actual device, the adjusting screws 716 are arranged at a finer arrangement pitch than those shown in these figures. However, even in that case, the above-mentioned positional relationship of the staggered arrangement is maintained.

FIG. 4 is a cross-sectional view of the slit nozzle. More specifically, FIG. 4A is a sectional view taken along line AA of FIG. 3, and FIG. 4B is a sectional view taken along line BB of FIG. As shown in FIG. 4A, in the cross section taken along the line AA of FIG. 3, the adjusting screw 716 is attached to the first main body portion 711. As shown by the arrows in the figure, when the adjusting screw 716 rotates and the amount of screwing into the main body changes, the first protruding portion 711g is displaced in the vertical direction due to elastic deformation, and the opening width of the deep groove 711f changes. To do. Due to the displacement of the first protruding portion 711g, the first lip portion 711c is displaced in the X direction. This displacement will increase or decrease the opening size of the discharge port 715 at the position of the cross section. On the other hand, at this position, the second main body portion 712 is not provided with the adjusting screw 716, and therefore does not have a function of displacing the second lip portion 712c.

As shown in FIG. 4B, in the cross section taken along the line BB in FIG. 3, the adjusting screw 716 is attached to the second main body portion 712. Similar to the above, when the adjusting screw 716 rotates, the second protruding portion 712g is displaced in the vertical direction due to elastic deformation, and the second lip portion 712c is displaced in the X direction. This displacement increases or decreases the opening size of the discharge port 715 at the position of the cross section. At this position, the first body portion 711 is not provided with the adjusting screw 716 and therefore does not have the function of displacing the first lip portion 711c.

In this way, in the discharge port 715 extending in the Y direction, the opening size is adjusted by the displacement of the first lip portion 711c in the vicinity of the position where the adjusting screw 716 is provided on the first main body portion 711, while the opening size is adjusted by the displacement of the second main body portion 711. In the vicinity of the position where the adjusting screw 716 is provided on the portion 712, the opening size is adjusted by the displacement of the second lip portion 712c.

Therefore, as compared with the conventional technique described in Patent Document 1 described above, the opening size is finely adjusted as compared with the configuration in which the adjusting screw is arranged only on one of the first main body portion 711 and the second main body portion 712. It becomes possible. That is, by arranging the adjusting screws 716 in the first main body 711 and the second main body 712, respectively, and arranging them in a staggered manner, the adjustment "resolution" is compared with the case where the adjusting screws are arranged in only one of them. "Can be doubled. Even when the adjusting screws 716 are arranged on both the first main body portion 711 and the second main body portion 712, such an effect of improving the resolution can be obtained if the arrangement positions are the same in the Y direction. It is not possible, but rather the adjustment work becomes troublesome.

Of course, even in a configuration in which the adjusting screws are arranged only on one of the main bodies, it is possible to improve the adjustment resolution by making the arrangement pitch finer. However, when considering the workability in drilling screw holes, attaching adjusting screws to screw holes, and adjusting each adjusting screw, there is a mechanical dimensional limit in making the arrangement pitch finer. Further, on the principle of adjusting the opening size by elastically deforming a member made of a highly rigid material with an adjusting screw, it is expected that adjustment by adjacent adjusting screws interferes with each other and fine adjustment becomes difficult. .. As described above, there are various restrictions for arranging the adjusting screw only on one of the first and second main bodies.

It is required by arranging the adjusting screws 716 in each of the first main body portion 711 and the second main body portion 712 as in the present embodiment, and by arranging the adjusting screws 716 in a staggered arrangement between the two. It is possible to arrange the adjusting screws 716 at a larger arrangement pitch with respect to the adjustment resolution. Therefore, the above mechanical restrictions are alleviated. Moreover, higher resolution can be obtained within the same constraint condition range.

In the slit nozzle 71 of the first embodiment described above, the adjusting screws 716 are arranged at the first main body portion 711 and the second main body portion 712 at a constant arrangement pitch. However, as shown below as another embodiment, the arrangement pitch of the adjusting screws may be uneven. In the following description, in order to make the comparison with other embodiments easy to understand, the same reference numerals are given to the configurations having the same or slight differences as the existing configurations but having the corresponding functions. ..

<Second to fifth embodiments>
FIG. 5 is a diagram showing second to fifth embodiments of the slit nozzle according to the present invention. More specifically, FIG. 5 (a) shows the slit nozzle 71A of the second embodiment, FIG. 5 (b) shows the slit nozzle 71B of the third embodiment, and FIG. 5 (c) shows the slit of the fourth embodiment. FIG. 5D of the nozzle 71C is a bottom view of the slit nozzle 71D of the fifth embodiment, respectively.

In the slit nozzle 71A of the second embodiment shown in FIG. 5A, the adjusting screws 716 are arranged at a relatively coarse arrangement pitch in the central region Rc of the discharge port 715 in the Y direction, while the adjustment screws 716 are arranged in the Y direction of the discharge port 715. In the end region Rp, the adjusting screws 716 are arranged at a finer arrangement pitch. In coating using a slit nozzle, it is easy to obtain a relatively uniform film in the central part of the coating film to be formed, but in the peripheral part, the high-viscosity coating liquid swells or the low-viscosity coating liquid goes to the outside. The coating film is likely to be disturbed due to the outflow of the coating film. In order to suppress such turbulence, it is desirable that adjustment can be performed with a finer resolution in the vicinity of the end portion of the discharge port 715 in the longitudinal direction than in the central portion. The slit nozzle 71B of the second embodiment can meet such a demand.

In other words, by increasing the arrangement pitch of the adjusting screws 716 in the central region Rc where relatively uniformness is easily obtained, the number of parts and the adjusting man-hours can be reduced, which also contributes to the reduction of equipment cost and running cost. It is possible.

In the slit nozzle 71B of the third embodiment shown in FIG. 5B, from the same viewpoint, the adjusting screw 716 is arranged only in the second main body portion 712 in the central region Rc, and this is omitted in the first main body portion 711. There is. By doing so, it is possible to further reduce the number of parts and the adjustment man-hours while maintaining the uniformity of the coating film in practical use. Of course, the adjusting screw on the 712 side of the second main body may be omitted.

In each of the above embodiments, a single discharge port is provided in the longitudinal direction (Y direction) of the slit nozzle. However, in this type of coating device, there is also a usage mode in which the discharge port is divided into a plurality of parts in the longitudinal direction to form a plurality of coating films at the same time. The slit nozzle 71C of the fourth embodiment and the slit nozzle 71D of the fifth embodiment shown in FIG. 5C meet such needs.

In these slit nozzles 71C and 71D, discharge ports 715a and 715b divided into a plurality of parts in the Y direction are provided on the lower surface thereof. These embodiments differ in how the adjusting screws are arranged in such cases.

In the slit nozzle 71C of the fourth embodiment shown in FIG. 5C, the adjusting screw 716 has the same arrangement as the slit nozzle 71A of the second embodiment. As described above, the disturbance of the coating film is likely to occur at the end portion, but if this is due to mechanical factors such as the nozzle, the substrate, and the transport system, the discharge port is the central portion of the nozzle even if it is the end portion. It is considered that the disturbance of the coating film is slight on the side close to Rc. In consideration of this point, in the slit nozzle 71C of the fourth embodiment, a coarse arrangement pitch is adopted in the central region Rc of the nozzle and a fine arrangement pitch is adopted in the end region Rp.

On the other hand, the coating film is mechanically disturbed even at the ends of the discharge ports 715a and 715b near the center of the nozzle, such as the disturbance of the coating film caused by the flow of the coating liquid such as retention in the flow path in the nozzle. Can occur. In consideration of this point, in the slit nozzle 71D of the fifth embodiment shown in FIG. 5D, the central regions Rca and Rcb of the respective discharge ports 715a and 715b are coarse, and the end regions Rpa and Rpb are fine. Arrangement pitch is adopted.

In this way, by appropriately setting the arrangement pitch of the adjusting screw 716 and adjusting the opening size according to the purpose and the characteristics of the apparatus and the coating liquid, a more efficient and uniform coating film can be obtained. It is possible to realize the coating conditions that can be achieved. It is also possible to make the effective arrangement pitch uneven by disabling a part of the adjusting screws arranged in advance at a constant pitch. This can be disabled, for example, by removing or fixing some of the adjusting screws.

<Others>
As described above, in each of the above-described embodiments, the screw holes 711h, the adjusting screw 716, and the like provided in the first main body portion 711 collectively function as the "first adjusting mechanism" of the present invention. Further, the screw hole 712h, the adjusting screw 716, and the like provided in the second main body 712 collectively function as the "second adjusting mechanism" of the present invention. Further, the deep grooves 711f and 712f correspond to the "groove" of the present invention.

Further, the coating device 1 of the above embodiment corresponds to the "board processing device" of the present invention, and includes an input conveyor 100, an input transfer unit 2, a levitation stage unit 3, an output transfer unit 4, and an output conveyor 110. The substrate transport section 5 and the like integrally constitute the "relative movement mechanism" of the present invention. Further, the coating liquid supply mechanism 8 functions as the "treatment liquid supply unit" of the present invention.

The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the above embodiment, deep grooves 711f and 712f are provided on the side surfaces of the first main body portion 711 and the second main body portion 712, and the opening size of the discharge port 715 is adjusted by the adjusting screw 716 attached from below. However, the present invention is not limited to this, and the opening size may be adjusted by another method. For example, a deep groove may be provided on the lower surface of the nozzle, and the nozzle may be elastically deformed by an adjusting screw provided in the horizontal direction to increase or decrease the opening size.

Further, for example, in the above embodiment, as the adjusting screw, a differential screw that actively acts in both the direction of widening and the direction of narrowing the opening size is used. Appropriate opening dimensions can also be adjusted by adjusting screws that have an adjusting function in only one direction, such as shrinking or, conversely, expanding a preset opening dimension.

Further, in the above embodiment, the relative movement between the slit nozzle 71 and the substrate S is realized by transporting the substrate S below the slit nozzle 71. However, the method of realizing these relative movements is not limited to the above. For example, the present invention functions effectively even in a configuration in which the slit nozzle scans and moves with respect to the substrate held on the stage. Further, the transfer type of the substrate is not limited to the above-mentioned floating type, and various types such as roller transfer, belt transfer, and transfer by a moving stage can be applied.

Further, in the slit nozzle 71 of the above embodiment, the first flat surface 711a of the first main body 711 is retracted with respect to the other flat surface 711b, that is, a step is formed on the surface of the first main body facing the second main body. Is provided to form a gap that serves as a flow path for the coating liquid and a slit-shaped discharge port. Instead, the gap may be realized, for example, by sandwiching a thin spacer such as a shim between the two members.

Further, the arrangement of the adjusting screws 716 in the above embodiment has a configuration in which one adjusting screw of the first main body 712 is provided at a position corresponding to the middle of two adjacent adjusting screws 716 in the first main body 711. There is. However, this position does not necessarily have to be exactly in the middle, and may be offset in either direction. Further, for example, two or more adjusting screws in the second main body may be arranged between the two adjusting screws in the first main body 711. Further, the present invention does not exclude a configuration in which the Y-direction positions of some of the adjusting screws are the same between the first main body and the second main body.

Further, in the above embodiment, the present invention is applied to the coating device 1 that supplies the coating liquid to the surface Sf of the substrate S, but the application target of the present invention is not limited to this, and the slit nozzle. By supplying the treatment liquid to the slit nozzle, the treatment liquid is supplied from the slit nozzle to the surface of the substrate and moved relative to the slit nozzle to perform a predetermined treatment, which can be applied to all the substrate processing techniques.

The present invention is applicable to a slit nozzle having a slit-shaped discharge port and a general substrate processing apparatus for applying a processing liquid to a substrate using the slit nozzle.

1 Coating equipment (board processing equipment)
2 Input transfer part (relative movement mechanism)
3 Floating stage (relative movement mechanism)
4 Output transfer part (relative movement mechanism)
5 Board transfer unit (relative movement mechanism)
8 Coating liquid supply mechanism (treatment liquid supply unit)
71, 71A to 71D Slit nozzle 100 Input conveyor (relative movement mechanism)
110 Output conveyor 710 Nozzle body 711 First body (nozzle body)
711a 1st flat surface 711c 1st lip part 711f, 712f Deep groove (groove)
711h screw hole (first adjustment mechanism)
712 2nd body (nozzle body)
712a 2nd flat surface 712c 2nd lip part 712h Screw hole (2nd adjustment mechanism)
715 Discharge port 716 Adjusting screw (1st adjusting mechanism, 2nd adjusting mechanism)

Claims (9)

By having a first lip portion and a second lip portion, the first flat surface provided on the first lip portion and the second flat surface provided on the second lip portion face each other with a gap. A nozzle body that forms a discharge port that opens in a slit shape with the direction parallel to the first flat surface as the longitudinal direction.
A plurality of first adjusting mechanisms arranged along the longitudinal direction, each of which displaces the first lip portion in the approaching and separating directions with respect to the second lip portion.
The arrangement positions along the longitudinal direction and in the longitudinal direction are arranged differently from the first adjusting mechanism, and each displaces the second lip portion in the approaching and separating directions with respect to the first lip portion. A slit nozzle provided with a plurality of second adjusting mechanisms for causing. In the first lip portion, a groove extending along the longitudinal direction is provided on the surface opposite to the first flat surface, and the first lip portion on the discharge port side of the groove is the first lip portion. The adjustment mechanism is displaced,
In the second lip portion, a groove extending along the longitudinal direction is provided on the surface opposite to the second flat surface, and the second lip portion on the discharge port side of the groove is formed by the second lip portion. The slit nozzle according to claim 1, wherein the adjusting mechanism displaces. The second aspect of claim 2, wherein each of the first adjusting mechanism and the second adjusting mechanism is provided on the nozzle body so as to straddle the groove and has an adjusting screw that changes the width of the groove by increasing or decreasing the screwing amount. Slit nozzle. The slit nozzle according to claim 3, wherein the adjusting screw is a differential screw. The slit nozzle according to any one of claims 1 to 4, wherein the first main body portion having the first lip portion and the second main body portion having the second lip portion are combined to form the nozzle main body. The slit nozzle according to any one of claims 1 to 5, wherein the arrangement pitch in the longitudinal direction is uneven in at least one of the first adjusting mechanism and the second adjusting mechanism. The slit nozzle according to claim 6, wherein the arrangement pitch is smaller outside the central portion in the longitudinal direction than the central portion of the nozzle body in the longitudinal direction. The slit nozzle according to any one of claims 1 to 7.
A relative movement mechanism for arranging the substrate so as to face the discharge port of the slit nozzle and relatively moving the slit nozzle and the substrate in a direction intersecting the longitudinal direction.
A substrate processing apparatus including a processing liquid supply unit for supplying a processing liquid to the slit nozzle, and applying the processing liquid discharged from the discharge port to the surface of the substrate. The substrate processing apparatus according to claim 8, wherein a uniform coating film formed by the treatment liquid is formed on the surface of the substrate.

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