JP6718145B2 - Dust cover - Google Patents

Description

The present specification discloses a dustproof cover that covers electronic components exposed in the opening of an electronic device case when the sealing material attached to the periphery of the opening is removed.

For electronic devices, the lid that closes the opening of the case is opened during maintenance. Before the lid of the case is closed again, it is necessary to remove the previous sealing material attached around the opening of the case (flange surface of the opening). There is a demand for preventing the residue of the sealing material from entering the opening and adhering to the electronic component when the sealing material is removed. A technique that meets such a request is disclosed in Patent Document 1, for example. Patent Document 1 discloses a dustproof cover that covers electronic components exposed in the opening of the case. A pedestal surface is provided inside the opening, and the dustproof cover is placed on the pedestal surface when removing the sealing material on the flange surface around the opening. The dustproof cover catches the residue of the sealing material that falls into the opening, and prevents it from adhering to the electronic components in the case.

JP, 2014-103150, A

In the technique of Patent Document 1, the dustproof cover is simply placed on the pedestal surface inside the opening. Therefore, there is a problem that the dustproof cover is easily removed. On the other hand, if the dustproof cover is fixed with bolts or the like, there are problems that the cost increases and the work becomes complicated. The present specification provides a technique for fixing a dustproof cover with a simple structure.

The dustproof cover disclosed in this specification has a size that contacts the inner wall of the case over the entire circumference of the case opening, and includes a fitting portion into which the protrusion exposed at the opening is press-fitted. .. The dust-proof cover is fixed by press-fitting a protrusion provided on the case side. The dustproof cover is fixed to the case by press fitting and can be easily attached and detached. An electronic component exposed in the opening can be used as the protrusion to be press-fitted. The technology disclosed in this specification can be realized at low cost because the dustproof cover is fixed by the parts already existing in the case. Details of the technology disclosed in the present specification and further improvements will be described in the following “Description of Embodiments”.

It is a perspective view of the dustproof cover of an example (before mounting to a case). It is a perspective view of the dust-proof cover of the embodiment (state attached to the case). It is a top view of the case which attached the dustproof cover. FIG. 4 is a sectional view taken along line IV-IV in FIG. 3. FIG. 5 is a sectional view taken along the line VV of FIG. 3. It is a plan view of an injection-molded product in which a dustproof cover and a scraper are integrated.

The dustproof cover 2 of the embodiment will be described with reference to the drawings. 1 and 2 are perspective views showing a dustproof cover 2 of an embodiment and an electronic device 10 to which the dustproof cover 2 is used. FIG. 1 is a diagram before the dust cover 2 is attached to the case 12 of the electronic device 10. FIG. 2 is a view showing a state in which the dustproof cover 2 is attached to the case 12. 1 and 2, the lid of the case 12 has already been removed and is not shown.

The electronic device 10 is, for example, an inverter for a traveling motor of an electric vehicle. When performing maintenance (for example, component replacement) of the electronic device 10, the lid (not shown) of the case 12 is opened. The case 12 and the lid are sealed with a sealing material. In recent years, a sealing material called a liquid gasket (FIPG: Formed In Place Gasket) is often used. The liquid gasket is initially liquid, and when it is applied to the joint surface with the lid (flange surface 13a of the case 12) and the lid is attached, it solidifies after a predetermined time, and the case and the lid adhere. When a liquid gasket is used, the gasket remains in close contact with the flange surface 13a around the opening 12a after the lid is removed. Before closing the lid again, the scraper 20 must remove the previous sealing material remaining on the flange surface 13a around the opening 12a. 2 also shows the scraper 20 applied to the flange surface 13a. The dust-proof cover 2 is a cover for covering the parts inside the case 12 so that the residue of the sealing material scraped off by the scraper 20 does not adhere to the parts inside the case 12. The dustproof cover 2 is made of aluminum or resin. The dustproof cover 2 is made by injection molding of aluminum or resin.

The dustproof cover 2 and the electronic device 10 will be specifically described. The electronic device 10 has a case 12 in which a substrate 14 and electronic components 15-17 are housed. The component 15 is a connector, and the components 16 and 17 are a plurality of semiconductor chips. The connector 15 and the semiconductor chips 16 and 17 are all mounted on the substrate 14. The substrate 14, the connector 15, and the semiconductor chips 16 and 17 are exposed from the opening 12a of the case 12 when the lid (not shown) is opened. Further, the projection 18 extending from the inner wall of the case 12 penetrates the substrate 14 and is exposed from the opening 12a.

The opening 12a of the case 12 is usually covered with a lid (not shown). The lid is in close contact with the flange surface 13a of the flange 13 provided around the opening 12a of the case 12, and is fixed with a bolt. Reference numeral 13b is a hole for a bolt for fixing the lid. As described above, the liquid gasket is applied to the flange surface 13a before attaching the lid.

The dustproof cover 2 has a size such that the edge 3a of the base portion 3 contacts the inner wall 12b of the case 12 over the entire circumference of the opening 12a. That is, the dustproof cover 2 completely covers the opening 12a when mounted on the case 12. The base portion 3 is provided with accommodating portions 4a-4d corresponding to various protrusions (connector 15, semiconductor chips 16, 17, and protrusion 18) extending upward from the opening 12a. The housing portion 4a has a shape that covers the two connectors 15. The housing portion 4b has a shape that covers the plurality of semiconductor chips 16. The housing portion 4c has a shape that covers a plurality of different semiconductor chips 17. The housing portion 4d has a shape that covers the protrusion 18. The dustproof cover 2 not only covers the parts 15-18 exposed from the opening 12a, but also completely covers the opening 12a. Therefore, the last dust of the sealing material scraped off from the flange surface 13a by the scraper 20 is received by the dustproof cover 2 and does not adhere to the components 15-18 in the case 12.

The accommodating parts 4a and 4d of the dustproof cover 2 are sized so that the corresponding parts (the connector 15 and the protrusion 18) are press-fitted therein. In other words, the connector 15 is press-fitted into the housing portion 4a, and the protrusion 18 is press-fitted into the housing portion 4d. The dust-proof cover 2 is fixed to the case 12 by press-fitting the components. Therefore, even if the case 12 to which the dustproof cover 2 is attached is inverted, the dustproof cover 2 cannot be removed.

In other words, the housing portion 4a into which the connector 15 is press fitted is a fitting portion that fits into the connector 15 exposed in the opening 12a. In other words, the housing portion 4d into which the protrusion 18 is press-fitted is a fitting portion that fits into the protrusion 18 exposed in the opening 12a. A plurality of semiconductor chips 16 are loosely fitted in the housing portion 4b, and a plurality of semiconductor chips 17 are loosely fitted in the housing portion 4c.

FIG. 3 shows a plan view of the case 12 to which the dustproof cover 2 is attached. The connector 15 is press-fitted inside the housing portion 4a, and the protrusion 18 is press-fitted inside the housing portion 4d. A cross section taken along line IV-IV of FIG. 3 is shown in FIG. 4, and a cross section taken along line VV of FIG. 3 is shown in FIG. 4 and 5 show the combined state of the parts and the dustproof cover 2.

The protrusion 18 extends from the inner wall of the case 12 from 12b, penetrates the substrate 14, and is exposed in the opening 12a (see FIG. 4). The accommodating portion 4d of the dustproof cover 2 has an inner width in the Y direction of the coordinate system in the drawing that is slightly narrower than the protrusion 18, and when pressed against the protrusion 18, the protrusion 18 is press-fitted into the accommodating portion 4d. The housing portion 4 a houses the connector 15 attached to the board 14. The connector 15 is made of resin. The accommodating portion 4a has protrusions 4a1 on the inner side surfaces facing each other in the X direction in the coordinate system in the drawing (see FIG. 5). The distance between the pair of opposing projections 4a1 is slightly smaller than the width of the connector 15, and when the connector 15 is pressed against the connector 15, the connector 15 is press-fitted into the housing portion 4a (between the pair of projections 4a1). In this way, the components exposed in the opening 12a of the case 12 are press-fitted into the housing portions 4a and 4d, and the dustproof cover 2 is fixed to the case 12. When the dustproof cover 2 is attached to the case 12, the edge 3 a of the base portion 3 contacts the inner wall 12 b of the case 12. The edge 3a of the base portion 3 contacts the inner wall 12b over the entire circumference of the opening 12a, and the dustproof cover 2 completely closes the opening 12a. Since the dustproof cover 2 completely closes the opening 12a, the residue of the sealing material peeled off from the flange surface 13a does not adhere to the components inside the case 12.

Returning to FIG. 3, the description will be supplemented with respect to the accommodating portions 4a and 4d into which the components are press fitted. The two press-fitting locations (the accommodating portions 4a and 4d) are located apart from the base portion 3 when the dustproof cover 2 is viewed in a plan view. The dust-proof cover 2 is stably fixed by setting the press-fitting portions (the accommodating portions 4a and 4d) fixed to the parts of the case 12 at separate locations. Further, in the housing portion 4a, the connector 15 is press-fitted between a pair of inner side surfaces facing each other in the X direction of the coordinate system in the figure, and in the Y direction, there is room for the connector 15 and the housing portion 4a to move with each other. There is. On the other hand, in the accommodating portion 4d, the protrusion 18 is press-fitted between a pair of inner side surfaces facing each other in the Y direction of the coordinate system in the figure, and in the X direction, the protrusion 18 and the accommodating portion 4d leave a room for mutual movement. There is. That is, the fitting of the housing portion 4a and the connector 15 regulates the position of the dust cover 2 in the X direction, and the housing portion 4d and the protrusion 18 regulate the position of the dust cover 2 in the Y direction. Since the two press-fitting portions regulate the directions orthogonal to each other, the dustproof cover 2 can be easily attached to the case 12. As described above, the plurality of semiconductor chips 16 are loosely fitted in the housing portion 4b, and the other plurality of semiconductor chips 17 are loosely fitted in the housing portion 4c. That is, the accommodating portions 4b and 4c have room for movement in both the X and Y directions. Therefore, the accommodating portions 4b and 4c do not hinder the attachment of the dustproof cover 2.

As described above, the dust-proof cover 2 includes the fitting portions (accommodation portions 4a and 4d) into which the protrusions (the connector 15 and the protrusion 18) exposed in the opening 12a of the case 12 are press-fitted, and the case is press-fitted. It is fixed at 12. Since the dustproof cover 2 is fixed by press fitting, it can be easily attached and detached. Further, since the press-fitted parts (connector 15 and protrusion 18) are already existing in the case, there is no need to separately prepare a special part for fixing the dustproof cover, which can be realized at low cost.

On the other hand, since the dust-proof cover 2 is fixed to the case 12, for example, a working mode is possible in which the case 12 to which the dust-proof cover 2 is attached is laid down to remove the sealing material on the flange surface 13a.

As described above, the dustproof cover 2 is made by injection molding of aluminum or resin. It is also preferable to simultaneously injection-mold the scraper 20 at the same time as the dustproof cover 2. FIG. 6 shows a plan view of an injection molded product 9 in which the dustproof cover 2 and the scraper 20 are continuous. After the injection-molded product 9 is manufactured, the dust-proof cover 2 and the scraper 20 are completed by cutting off at the connecting portion 21.

Points to be noted regarding the technique described in the embodiment will be described. The dust-proof cover 2 covers the electronic components exposed in the opening 12a when removing the sealing material attached to the periphery (flange surface 13a) of the opening 12a of the case 12 of the electronic device 10, and the peeled sealing material is used as an electronic component. Prevents adhesion to parts. The shape of the base portion 3 of the dustproof cover 2 and the positions and shapes of the accommodating portions 4a-4d are determined according to the form of the electronic device to which the dustproof cover 2 is attached. The dust-proof cover 2 can be manufactured by a 3D printer as well as by injection molding.

The accommodating portions 4a and 4d of the embodiment correspond to an example of the "fitting portion" in the claims. The connector 15 and the protrusion 18 that are press-fitted into the accommodating portions 4a and 4d correspond to an example of the "protrusion exposed at the opening" in the claims.

Specific examples of the present invention have been described above in detail, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in the present specification or the drawings exert technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Further, the technique illustrated in the present specification or the drawings can simultaneously achieve a plurality of purposes, and achieving the one purpose among them has technical utility.

2: Dustproof cover 3: Foundation part 3a: Edges 4a-4d: Housing part 4a1: Protrusion 9: Injection molded product 10: Electronic device 12: Case 12a: Opening 12b: Inner wall 13: Flange 13a: Flange surface 14: Substrate 15: Connector 16, 17: Semiconductor chip 18: Protrusion 20: Scraper

Claims (1)

A dustproof cover that covers the electronic components exposed in the opening when removing the sealing material attached around the opening of the electronic device case, and has a size that contacts the inner wall of the case over the entire circumference of the opening. In addition, it is provided with a plurality of accommodating portions for accommodating each of the plurality of electronic components exposed in the opening ,
At least one of the plurality of accommodating portions is a fitting portion into which one of the electronic components is press-fitted ,
The fitting portion is a dustproof cover having a pair of protrusions that face the inner surfaces that face each other .

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