JP6706453B2 - ネガ型感光性樹脂組成物、硬化物および積層体 - Google Patents
ネガ型感光性樹脂組成物、硬化物および積層体 Download PDFInfo
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- JP6706453B2 JP6706453B2 JP2015216082A JP2015216082A JP6706453B2 JP 6706453 B2 JP6706453 B2 JP 6706453B2 JP 2015216082 A JP2015216082 A JP 2015216082A JP 2015216082 A JP2015216082 A JP 2015216082A JP 6706453 B2 JP6706453 B2 JP 6706453B2
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- 239000011342 resin composition Substances 0.000 title claims description 74
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- 150000001875 compounds Chemical class 0.000 claims description 236
- 229920001296 polysiloxane Polymers 0.000 claims description 74
- 125000000524 functional group Chemical group 0.000 claims description 70
- 239000000463 material Substances 0.000 claims description 32
- 125000000962 organic group Chemical group 0.000 claims description 27
- 125000004432 carbon atom Chemical group C* 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 20
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 125000003700 epoxy group Chemical group 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 7
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 6
- 125000002723 alicyclic group Chemical group 0.000 claims description 5
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- 238000006243 chemical reaction Methods 0.000 description 14
- 229910052760 oxygen Inorganic materials 0.000 description 14
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 239000007864 aqueous solution Substances 0.000 description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 13
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- 125000003118 aryl group Chemical group 0.000 description 12
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 10
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 10
- 150000003254 radicals Chemical class 0.000 description 10
- KSMGAOMUPSQGTB-UHFFFAOYSA-N 9,10-dibutoxyanthracene Chemical compound C1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 KSMGAOMUPSQGTB-UHFFFAOYSA-N 0.000 description 9
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- 230000002378 acidificating effect Effects 0.000 description 9
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 9
- 230000000704 physical effect Effects 0.000 description 9
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 8
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 125000002091 cationic group Chemical group 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 8
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- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 7
- 150000008065 acid anhydrides Chemical class 0.000 description 7
- 150000001450 anions Chemical class 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 125000004122 cyclic group Chemical group 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-M hydrogensulfate Chemical compound OS([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-M 0.000 description 7
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 7
- 150000002894 organic compounds Chemical class 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 229920002554 vinyl polymer Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 239000007983 Tris buffer Substances 0.000 description 6
- 230000002411 adverse Effects 0.000 description 6
- 239000003513 alkali Substances 0.000 description 6
- 125000005370 alkoxysilyl group Chemical group 0.000 description 6
- 230000003712 anti-aging effect Effects 0.000 description 6
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 238000004040 coloring Methods 0.000 description 6
- 239000003431 cross linking reagent Substances 0.000 description 6
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- 238000001879 gelation Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 6
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 6
- UCBVELLBUAKUNE-UHFFFAOYSA-N 1,3-bis(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)NC(=O)N(CC=C)C1=O UCBVELLBUAKUNE-UHFFFAOYSA-N 0.000 description 5
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 5
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 5
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- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 5
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 4
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- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 4
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 4
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- 239000000654 additive Substances 0.000 description 4
- XJHABGPPCLHLLV-UHFFFAOYSA-N benzo[de]isoquinoline-1,3-dione Chemical compound C1=CC(C(=O)NC2=O)=C3C2=CC=CC3=C1 XJHABGPPCLHLLV-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 238000006482 condensation reaction Methods 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- YSEKNCXYRGKTBJ-UHFFFAOYSA-N dimethyl 2-hydroxybutanedioate Chemical compound COC(=O)CC(O)C(=O)OC YSEKNCXYRGKTBJ-UHFFFAOYSA-N 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 4
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- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 4
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- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
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- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 3
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 description 3
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- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 2
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- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
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- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- RXHUEMZQJRTCIA-UHFFFAOYSA-N pyrrolidine-2,5-dione;trifluoromethanesulfonic acid Chemical compound O=C1CCC(=O)N1.OS(=O)(=O)C(F)(F)F RXHUEMZQJRTCIA-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000006798 ring closing metathesis reaction Methods 0.000 description 1
- 238000007152 ring opening metathesis polymerisation reaction Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical class O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- 125000005920 sec-butoxy group Chemical group 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 150000003458 sulfonic acid derivatives Chemical class 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003556 thioamides Chemical class 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 125000005323 thioketone group Chemical group 0.000 description 1
- OKYDCMQQLGECPI-UHFFFAOYSA-N thiopyrylium Chemical class C1=CC=[S+]C=C1 OKYDCMQQLGECPI-UHFFFAOYSA-N 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical class CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000002088 tosyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1C([H])([H])[H])S(*)(=O)=O 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- YIYBQIKDCADOSF-ONEGZZNKSA-N trans-pent-2-enoic acid Chemical compound CC\C=C\C(O)=O YIYBQIKDCADOSF-ONEGZZNKSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- UZIAQVMNAXPCJQ-UHFFFAOYSA-N triethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C(C)=C UZIAQVMNAXPCJQ-UHFFFAOYSA-N 0.000 description 1
- WDUXKFKVDQRWJN-UHFFFAOYSA-N triethoxysilylmethyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C=C WDUXKFKVDQRWJN-UHFFFAOYSA-N 0.000 description 1
- SUXIKHBBPQWLHO-UHFFFAOYSA-N trihydroxy-(8-methylnonyl)-(8-methyl-1-phenylnonyl)-lambda5-phosphane Chemical compound CC(C)CCCCCCCP(O)(O)(O)C(CCCCCCC(C)C)C1=CC=CC=C1 SUXIKHBBPQWLHO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- UOKUUKOEIMCYAI-UHFFFAOYSA-N trimethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C(C)=C UOKUUKOEIMCYAI-UHFFFAOYSA-N 0.000 description 1
- JPPHEZSCZWYTOP-UHFFFAOYSA-N trimethoxysilylmethyl prop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C=C JPPHEZSCZWYTOP-UHFFFAOYSA-N 0.000 description 1
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 1
- FNZBSNUICNVAAM-UHFFFAOYSA-N trimethyl-[methyl-[methyl-(methyl-phenyl-trimethylsilyloxysilyl)oxy-phenylsilyl]oxy-phenylsilyl]oxysilane Chemical compound C=1C=CC=CC=1[Si](C)(O[Si](C)(C)C)O[Si](C)(C=1C=CC=CC=1)O[Si](C)(O[Si](C)(C)C)C1=CC=CC=C1 FNZBSNUICNVAAM-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- ISJCSCLGELKMCR-UHFFFAOYSA-N tris(4-phenoxyphenyl)sulfanium Chemical compound C=1C=C([S+](C=2C=CC(OC=3C=CC=CC=3)=CC=2)C=2C=CC(OC=3C=CC=CC=3)=CC=2)C=CC=1OC1=CC=CC=C1 ISJCSCLGELKMCR-UHFFFAOYSA-N 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- 229960002703 undecylenic acid Drugs 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
のいずれかで表される少なくとも1種の化合物と、を含有することを特徴とするネガ型感光性樹脂組成物。
上記ネガ型感光性樹脂組成物は、(A)1分子中に、少なくとも1個の光重合性官能基および少なくとも1種のアルカリ可溶性官能基を有するポリシロキサン系化合物と、(B)特定の構造を有する少なくとも1種の化合物と、を含有する。以下では上記(A)1分子中に、少なくとも1個の光重合性官能基および少なくとも1種のアルカリ可溶性官能基を有するポリシロキサン系化合物を単に「成分(A)」と称し、上記(B)特定の構造を有する少なくとも1種の化合物を単に「成分(B)」と称する場合もある。
上記ネガ型感光性樹脂組成物は、成分(A)として、ポリシロキサン系化合物を含有している。
(α1)1分子中に、SiH基との反応性を有する1個以上の炭素−炭素二重結合と、上記式(X1)〜(X3)で表される各構造、フェノール性水酸基およびカルボキシル基からなる群より選ばれる少なくとも一種の酸性基とを有する有機化合物、
(β)1分子中に少なくとも2個のSiH基を有するポリシロキサン化合物、
(γ1)1分子中に、SiH基との反応性を有する少なくとも1個の炭素−炭素二重結合と、少なくとも1個の光重合性官能基と、を有する化合物。
(α1)1分子中に、SiH基との反応性を有する少なくとも1個の炭素−炭素二重結合と、上記式(X1)〜(X3)で表される各構造、フェノール性水酸基およびカルボキシル基からなる群より選ばれる少なくとも一種の酸性基とを有する有機化合物、
(α2)1分子中にSiH基との反応性を有する少なくとも1個の炭素−炭素二重結合を有する化合物、
(β)1分子中に少なくとも2個のSiH基を有するポリシロキサン化合物、
(γ1)1分子中に、SiH基との反応性を有する少なくとも1個の炭素−炭素二重結合と、少なくとも1個の光重合性官能基と、を有する化合物。
(α3)1分子中にSiH基との反応性を有する少なくとも2個の炭素−炭素二重結合を有する化合物、
(α4)1分子中に、少なくとも1個のSiH基と、上記式(X1)〜(X3)で表される各構造、フェノール性水酸基およびカルボキシル基からなる群より選ばれる少なくとも1種の酸性基と、を有する化合物、
(γ2)1分子中に、少なくとも1個の光重合性官能基と、少なくとも1個のSiH基とを有する化合物。
化合物(α1)は、1分子中に、SiH基との反応性を有する少なくとも1個の炭素−炭素二重結合と、上記式(X1)〜(X3)で表される各構造、フェノール性水酸基およびカルボキシル基からなる群より選ばれる少なくとも一種の酸性基とを有する有機化合物であれば特に限定されない。
のいずれかで表される化合物の少なくとも1種を使用することが好ましい。
化合物(α2)は、上記化合物(α1)および後述する化合物(γ1)に該当しない、1分子中にSiH基との反応性を有する少なくとも1個の炭素−炭素二重結合を有する化合物であれば特に限定されない。
で表される化合物であることが好ましい。
上記化合物(α2)のうち、SiH基との反応性を有する炭素−炭素二重結合を少なくとも2個有する化合物が、化合物(α3)として使用され得る。
化合物(α4)は、1分子中に、少なくとも1個のSiH基と、上記式(X1)〜(X3)で表される各構造、フェノール性水酸基およびカルボキシル基からなる群より選ばれる少なくとも1種の酸性基と、を有する化合物であれば、特に限定されない。
化合物(β)としては、1分子中に少なくとも2個のSiH基を有するポリシロキサン化合物であれば特に限定されず、例えば国際公開第96/15194号に記載される化合物で、1分子中に少なくとも2個のSiH基を有するもの等が使用できる。
で表される、1分子中に少なくとも3個のSiH基を有する環状オルガノポリシロキサンであることが好ましい。
化合物(γ1)は、1分子中に、SiH基との反応性を有する少なくとも1個の炭素−炭素二重結合と、少なくとも1個の光重合性官能基と、を有する化合物であれば特に限定されない。なお、ここでいう光重合性官能基は、前述の成分(A)が有する光重合性官能基と同一であって、好ましい態様も同様である。
で表される化合物であることが好ましい。なかでも、反応後の副生成物が除去されやすいという観点等から、化合物(γ1)は、特にトリメトキシビニルシラン、トリエトキシビニルシラン、ジメトキシメチルビニルシラン、ジエトキシメチルビニルシラン、メトキシジメチルビニルシランまたはエトキシジメチルビニルシランであることが好ましい。
で表される有機基とを同一分子内に1個ずつ以上有する化合物が挙げられる。
化合物(γ2)は、1分子中に、光重合性官能基と、ヒドロシリル化反応の反応性基であるSiH基とを少なくとも各1個有する化合物であれば、特に制限はない。光重合性官能基としては、上述のようなエポキシ基、架橋性ケイ素基(加水分解性シリル基)およびアクリロイル基等が挙げられる。
化合物(α1)〜(α4)、(β)および(γ1)〜(γ2)から選ばれる化合物を、ヒドロシリル化反応によって重合させる場合の触媒としては、公知のヒドロシリル化触媒を用いればよい。
反応の順序および方法としては種々の方法が挙げられるが、合成工程が簡便であるという観点からは、全ての化合物を1ポットに仕込んでヒドロシリル化反応を行い、最後に未反応の化合物を除去する方法が好ましい。
得られる反応物の保存安定性を改良する目的、または化合物(α1)(態様によっては、さらに化合物(α2))、化合物(β)および化合物(γ1)もしくは(γ2)を用いてヒドロシリル化反応を行った後に、溶媒および未反応の化合物を減圧脱揮により除去する場合の、加熱処理による増粘等の変質を抑制する目的で、ゲル化抑制剤を使用することができる。ゲル化抑制剤としては、脂肪族不飽和結合を含有する化合物、有機リン化合物、有機硫黄化合物、窒素含有化合物、スズ系化合物または有機過酸化物等の公知のゲル化抑制剤を使用でき、これらを併用してもかまわない。
上記ネガ型感光性樹脂組成物は、成分(B)として、以下に示す化合物を含有している。上記ネガ型感光性樹脂組成物では、成分(B)が含有されているがゆえに、単に密着性が向上するだけではなく、パターニング性を損なわずに耐薬品性も向上する。このことは、本発明者らが初めて見出したことである。
のいずれかで表される少なくとも1種の化合物である。
上記ネガ型感光性樹脂組成物は、光酸発生剤を含有していてもよい。上記光酸発生剤は、活性エネルギー線を照射されることにより、上記成分(A)が有する光重合性官能基を架橋させることができる酸性活性物質を放出することができる化合物であれば、特に限定されない。
上記ネガ型感光性樹脂組成物は、カチオン重合開始剤を含有していてもよい。上記カチオン重合開始剤としては、活性エネルギー線によりカチオン種もしくはルイス酸を発生する活性エネルギー線カチオン重合開始剤、または熱によりカチオン種もしくはルイス酸を発生する熱カチオン重合開始剤であれば、特に限定されず使用できる。上記カチオン種またはルイス酸により、上記成分(A)が有する光重合性官能基を架橋させることができる。
上記ネガ型感光性樹脂組成物は、ラジカル重合開始剤を含有していてもよい。上記ラジカル重合開始剤としては、活性エネルギー線によりラジカル種を発生する活性エネルギー線ラジカル重合開始剤、または熱によりラジカル種を発生する熱ラジカル重合開始剤であれば、特に限定されず使用できる。上記ラジカル種により、成分(A)が有する光重合性官能基を架橋させることができる。
(架橋剤)
上記ネガ型感光性樹脂組成物には、作業性、反応性、接着性および硬化物強度の調整のために、光重合性官能基を1分子中に2個以上有する架橋剤を添加することができる。上記架橋剤としては、硬化反応形式によって選択すれば特に限定されず、エポキシ化合物、オキセタン化合物、アルコキシシラン化合物および(メタ)アクリレート化合物等が挙げられる。
上記ネガ型感光性樹脂組成物は、増感剤を含有していてもよい。上記増感剤によれば、上記ネガ型感光性樹脂組成物において、可視光等への感度を向上させることができ、さらにg線(436nm)、h線(405nm)およびi線(365nm)等の高波長の光に感度を持たせることができる。これらの増感剤を、上述のカチオン重合開始剤、ラジカル重合開始剤および光酸発生剤等と併用して使用することにより、上記ネガ型感光性樹脂組成物の硬化性の調整を行うことができる。
上記ネガ型感光性樹脂組成物をラジカル硬化系として使用する場合には、反応性調整および酸素による硬化阻害抑制等のため、上記ネガ型感光性樹脂組成物が反応性調整剤を含有していてもよい。反応性調整剤としては、チオール化合物、アミン化合物およびホスフィン化合物等が挙げられる。
上記ネガ型感光性樹脂組成物は、接着性改良剤を含有していてもよい。接着性改良剤としては一般に用いられている接着剤の他、例えば種々のカップリング剤、エポキシ化合物、オキセタン化合物、フェノール樹脂、クマロン−インデン樹脂、ロジンエステル樹脂、テルペン−フェノール樹脂、α−メチルスチレン−ビニルトルエン共重合体、ポリエチルメチルスチレンおよび芳香族ポリイソシアネート等を挙げることができる。
上記ネガ型感光性樹脂組成物を光または熱により硬化させる場合であって、特に透明性を要求される用途で使用する場合は、光または熱による硬化後の色相を改善するために、上記ネガ型感光性樹脂組成物にリン化合物を添加することが好ましい。
上記ネガ型感光性樹脂組成物の特性を改質する等の目的で、上記ネガ型感光性樹脂組成物に種々の熱可塑性樹脂を添加することも可能である。上記熱可塑性樹脂としては、例えば、メチルメタクリレートの単独重合体またはメチルメタクリレートと他のモノマーとのランダム、ブロック、もしくはグラフト重合体等のポリメチルメタクリレート系樹脂(例えば日立化成社製オプトレッツ等)およびブチルアクリレートの単独重合体またはブチルアクリレートと他のモノマーとのランダム、ブロック、もしくはグラフト重合体等のポリブチルアクリレート系樹脂等に代表されるアクリル系樹脂、ビスフェノールA、3,3,5−トリメチルシクロヘキシリデンビスフェノール等をモノマー構造として含有するポリカーボネート樹脂等のポリカーボネート系樹脂(例えば帝人社製APEC等)、ノルボルネン誘導体、ビニルモノマー等を単独あるいは共重合した樹脂、ノルボルネン誘導体を開環メタセシス重合させた樹脂、あるいはその水素添加物等のシクロオレフィン系樹脂(例えば、三井化学社製APEL、日本ゼオン社製ZEONOR、ZEONEX、JSR社製ARTON等)、エチレンとマレイミドとの共重合体等のオレフィン−マレイミド系樹脂(例えば東ソー社製TI−PAS等)、ビスフェノール類(ビスフェノールAおよびビス(4−(2−ヒドロキシエトキシ)フェニル)フルオレン等)またはジオール類(ジエチレングリコール等)と、フタル酸類(テレフタル酸およびイソフタル酸等)または脂肪族ジカルボン酸類とを重縮合させたポリエステル等のポリエステル系樹脂(例えば鐘紡社製O−PET等)、ポリエーテルスルホン樹脂、ポリアリレート樹脂、ポリビニルアセタール樹脂、ポリエチレン樹脂、ポリプロピレン樹脂、ポリスチレン樹脂、ポリアミド樹脂、シリコーン樹脂、フッ素樹脂等の他、天然ゴム、EPDMといったゴム状樹脂が挙げられるが、これらに限定されない。
上記ネガ型感光性樹脂組成物には必要に応じて充填材を添加してもよい。
上記ネガ型感光性樹脂組成物には老化防止剤を添加してもよい。老化防止剤としては、ヒンダートフェノール系老化防止剤等の一般に用いられている老化防止剤の他、クエン酸、リン酸および硫黄系老化防止剤等が挙げられる。
上記ネガ型感光性樹脂組成物にはラジカル禁止剤を添加してもよい。ラジカル禁止剤としては、例えば、2,6−ジ−t−ブチル−3−メチルフェノール(BHT)、2,2’−メチレン−ビス(4−メチル−6−t−ブチルフェノール)およびテトラキス(メチレン−3(3,5−ジ−t−ブチル−4−ヒドロキシフェニル)プロピオネート)メタン等のフェノール系ラジカル禁止剤、並びにフェニル−β−ナフチルアミン、α−ナフチルアミン、N,N’−第二ブチル−p−フェニレンジアミン、フェノチアジンおよびN,N’−ジフェニル−p−フェニレンジアミン等のアミン系ラジカル禁止剤等が挙げられる。
上記ネガ型感光性樹脂組成物には紫外線吸収剤を添加してもよい。上記紫外線吸収剤としては、例えば2(2’−ヒドロキシ−3’,5’−ジ−t−ブチルフェニル)ベンゾトリアゾールおよびビス(2,2,6,6−テトラメチル−4−ピペリジン)セバケート等が挙げられる。
上記(A)ポリシロキサン系化合物が高粘度である場合、溶剤に溶解して用いることも可能である。上記溶剤は特に限定されるものではなく、具体的には、ベンゼン、トルエン、ヘキサンおよびヘプタン等の炭化水素系溶媒;テトラヒドロフラン、1,4−ジオキサン、1,3−ジオキソランおよびジエチルエーテル等のエーテル系溶媒;アセトン、メチルエチルケトン、メチルイソブチルケトンおよびシクロヘキサノン等のケトン系溶媒;プロピレングリコール−1−モノメチルエーテル−2−アセテート(PGMEA)およびエチレングリコールジエチルエーテル等のグリコール系溶剤;クロロホルム、塩化メチレンおよび1,2−ジクロロエタン等のハロゲン系溶剤等が挙げられる。
上記ネガ型感光性樹脂組成物には、着色剤、離型剤、難燃剤、難燃助剤、界面活性剤、消泡剤、乳化剤、レベリング剤、はじき防止剤、イオントラップ剤(アンチモン−ビスマス等)、チクソ性付与剤、粘着性付与剤、保存安定改良剤、オゾン劣化防止剤、光安定剤、増粘剤、可塑剤、反応性希釈剤、酸化防止剤、熱安定化剤、導電性付与剤、帯電防止剤、放射線遮断剤、核剤、リン系過酸化物分解剤、滑剤、顔料、金属不活性化剤、熱伝導性付与剤および物性調整剤等を、本発明の目的および効果を損なわない範囲において添加することができる。
上記ネガ型感光性樹脂組成物の調製方法は特に限定されず、種々の方法によって調製可能である。各種成分を硬化直前に混合調製してもよく、全成分を予め混合調製した一液の状態で低温貯蔵しておいてもよい。
上記ネガ型感光性樹脂組成物は液状でハンドリングすることができ、また、溶液塗布によって容易に薄膜を形成できる。そのため、上記ネガ型感光性樹脂組成物を基材上に層状硬化させることによって積層体を容易に形成することができる。換言すれば、上記積層体は、基材上に、上記ネガ型感光性樹脂組成物が硬化した硬化膜を備えている。
アルカリ現像によるパターニング形成について特に限定される方法はなく、一般的に行われる浸漬法またはスプレー法等の現像方法により未露光部を溶解および除去して所望のパターンを形成することができる。
上記ネガ型感光性樹脂組成物およびその硬化物は、種々の用途に用いることができる。従来のアクリル樹脂およびエポキシ樹脂接着剤が使用される各種用途に応用することが可能である。
実施例および比較例で得られた樹脂組成物を用いて下記のパターニング性評価サンプルを作製した。まず、ガラス上に窒化ケイ素膜を成膜して基板を作製した。次に、当該基板へ、実施例および比較例で得られた樹脂組成物をスピンコーティングした。得られた基板を、100℃に加熱したホットプレート上で2分間加熱した。さらに、露光装置(高圧水銀ランプ、手動露光機、大日本科研社製)を用い、5μmのラインアンドスペースパターンが刻まれたマスクを通して、それぞれの樹脂組成物に最適な積算光量で露光し(ソフトコンタクト露光)、露光後1分間放置した。その後、アルカリ性現像液(TMAH2.38%水溶液)に80秒間浸漬後、30秒間水洗して、圧縮空気または圧縮窒素で表面の水分を除去してパターンを形成した。
○:5μmラインアンドスペースに残膜無し。
×:5μmラインアンドスペースに残膜有り。
5μmのラインアンドスペースパターンが刻まれたマスクの代わりに10μmおよび20μmのラインアンドスペースパターンが刻まれたマスクを通して露光したこと以外は、パターニング性評価サンプルと同様にして、基板密着性評価サンプルを得た。
◎:10μmラインアンドスペースに剥離無し。
○:20μmラインアンドスペースに剥離無し。
×:20μmラインアンドスペースに剥離有り。
5μmのラインアンドスペースパターンが刻まれたマスクの代わりに100μmのラインアンドスペースパターンが刻まれたマスクを通して露光したこと以外は、パターニング性評価サンプルと同様にして、残膜率評価サンプルを得た。
ジアリルイソシアヌル酸40gおよびジアリルモノメチルイソシアヌル酸29gをジオキサン264gに溶解させ、白金ビニルシロキサン錯体のキシレン溶液(白金を3重量%含有する白金ビニルシロキサン錯体、ユミコアプレシャスメタルズジャパン製、Pt−VTSC−3X)143μLを加えた。このようにして得られた溶液を、酸素を3%含有する窒素雰囲気下、105℃に加熱した1,3,5,7−テトラハイドロジェン−1,3,5,7−テトラメチルシクロテトラシロキサン88gをトルエン176gに溶解させた溶液に3時間かけて滴下した。
成分(A)として製造例1に記載の「溶液A」を27g、成分(B)としてトリス[3−(トリメトキシシリルプロピル)]イソシアヌレートを0.068g、光酸発生剤としてBBI−103を0.41g、増感剤として9,10−ジブトキシアントラセンを0.68g添加した30%PGMEA溶液を調製した。
成分(A)として製造例1に記載の「溶液A」を27g、成分(B)としてトリス[3−(トリメトキシシリルプロピル)]イソシアヌレートを0.41g、光酸発生剤としてBBI−103を0.41g、増感剤として9,10−ジブトキシアントラセンを0.68g添加した30%PGMEA溶液を調製した。すなわち、実施例2は、実施例1と比べて成分(B)の添加量が異なる。
成分(A)として製造例1に記載の「溶液A」を27g、光酸発生剤としてBBI−103を0.41g、増感剤として9,10−ジブトキシアントラセンを0.68g添加した30%PGMEA溶液を調製した。すなわち、比較例1は、成分(B)を含んでいない。
成分(A)として製造例1に記載の「溶液A」を27g、成分(B)の代わりに2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシランを0.068g、光酸発生剤としてBBI−103を0.41g、増感剤として9,10−ジブトキシアントラセンを0.68g添加した30%PGMEA溶液を調製した。
成分(A)として製造例1に記載の「溶液A」を27g、成分(B)の代わりに2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシランを0.41g、光酸発生剤としてBBI−103を0.41g、増感剤として9,10−ジブトキシアントラセンを0.68g添加した30%PGMEA溶液を調製した。
成分(A)として製造例1に記載の「溶液A」を27g、成分(B)の代わりに2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシランを1.4g、光酸発生剤としてBBI−103を0.41g、増感剤として9,10−ジブトキシアントラセンを0.68g添加した30%PGMEA溶液を調製した。
実施例1〜2および比較例1〜4で得られた感光性樹脂組成物に対し、前述の評価を行った。その結果を表1に示す。
Claims (6)
- (A)1分子中に、少なくとも1個の光重合性官能基および少なくとも1種のアルカリ可溶性官能基を有するポリシロキサン系化合物と、
(B)下記式(Y1)〜(Y3)
のいずれかで表される少なくとも1種の化合物と、
を含有し、
上記光重合性官能基の少なくとも1個が脂環式エポキシ基またはグリシジル基であり、
上記ポリシロキサン系化合物は、ケイ素−炭素結合によって上記光重合性官能基および上記アルカリ可溶性官能基が導入されている化合物であることを特徴とするネガ型感光性樹脂組成物。 - 光酸発生剤を含有することを特徴とする請求項1または2に記載のネガ型感光性樹脂組成物。
- 請求項1〜3のいずれか1項に記載のネガ型感光性樹脂組成物が硬化した硬化物。
- 基材上に、請求項1〜3のいずれか1項に記載のネガ型感光性樹脂組成物が硬化した硬化膜を備えることを特徴とする積層体。
- 上記基材が表面に窒化ケイ素層を有することを特徴とする請求項5に記載の積層体。
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|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |