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JP6784319B2 - Light emitting device, light emitting module, light emitting device and manufacturing method of light emitting module - Google Patents

Light emitting device, light emitting module, light emitting device and manufacturing method of light emitting module Download PDF

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JP6784319B2
JP6784319B2 JP2019192743A JP2019192743A JP6784319B2 JP 6784319 B2 JP6784319 B2 JP 6784319B2 JP 2019192743 A JP2019192743 A JP 2019192743A JP 2019192743 A JP2019192743 A JP 2019192743A JP 6784319 B2 JP6784319 B2 JP 6784319B2
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light emitting
electrode
emitting device
pair
manufacturing
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JP2020181971A (en
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真一 大黒
真一 大黒
啓 橋本
啓 橋本
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Nichia Corp
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Nichia Corp
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Priority to CN201911043315.3A priority patent/CN111129273B/en
Priority to TW108139460A priority patent/TWI753318B/en
Priority to US16/670,585 priority patent/US11489098B2/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18High density interconnect [HDI] connectors; Manufacturing methods related thereto

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

本発明は、発光装置と、この発光装置をマウントしてなる発光モジュールと、発光装置及び発光モジュールの製造方法に関する。 The present invention relates to a light emitting device, a light emitting module obtained by mounting the light emitting device, and a light emitting device and a method for manufacturing the light emitting module.

一対の電極ポストを設けている発光素子の電極面を被覆部材で被覆し、被覆部材に露出する電極ポストに薄膜の電極層を接続した発光装置が開発されている。(特許文献1参照) A light emitting device has been developed in which the electrode surfaces of a light emitting element provided with a pair of electrode posts are covered with a coating member, and a thin electrode layer is connected to the electrode posts exposed on the coating member. (See Patent Document 1)

特開2012−124443号公報Japanese Unexamined Patent Publication No. 2012-124443

以上の発光装置は、電極層によって外部接続されるが、電極層が極めて薄いので外部接続が極めて難しくて手間がかかり、さらに安定して確実に接続するのが難しい。 The above light emitting device is externally connected by an electrode layer, but since the electrode layer is extremely thin, external connection is extremely difficult and time-consuming, and it is difficult to connect stably and reliably.

本発明は、以上の欠点を解消することを目的として開発されたもので、本発明の目的は、小型化しながら確実に安定して外部接続できる発光装置とその製造方法を提供することにある。 The present invention has been developed for the purpose of eliminating the above drawbacks, and an object of the present invention is to provide a light emitting device capable of reliably and stably externally connecting while being miniaturized, and a method for manufacturing the same.

本発明の実施形態の発光装置は、同一面側に一対の電極ポストを設けてなる発光素子と、一対の前記電極ポストを設けてなる前記発光素子の電極面及び前記発光素子の側面を覆い、かつ前記電極ポストの露出部を設けてなる被覆部材と、前記被覆部材の表面に設けられて前記電極ポストの露出部に電気接続してなる一対の電極層と、各々の前記電極層の表面に設けられ、一対の前記電極ポストよりも大面積であって、かつ外周縁を前記被覆部材の端部に配置してなる一対の電極端子と、一対の前記電極端子の間に設けられ、かつ前記電極端子の側面に接してなる絶縁性部材とを備える。 The light emitting device according to the embodiment of the present invention covers a light emitting element having a pair of electrode posts provided on the same surface side, an electrode surface of the light emitting element provided with the pair of electrode posts, and a side surface of the light emitting element. A coating member provided with an exposed portion of the electrode post, a pair of electrode layers provided on the surface of the coating member and electrically connected to the exposed portion of the electrode post, and a surface of each of the electrode layers. A pair of electrode terminals provided, which have a larger area than the pair of electrode posts and have an outer peripheral edge arranged at an end portion of the covering member, and a pair of electrode terminals provided between the pair of electrode terminals and said to be provided. It is provided with an insulating member formed in contact with the side surface of the electrode terminal.

本発明の実施形態の発光モジュールは、以上の発光装置と、外部に光を放射する発光面となる第1主面の反対側の第2主面に凹部を設けてなる透光性の導光板とを備え、発光装置を導光板の凹部に配置している。 The light emitting module of the embodiment of the present invention is a translucent light guide plate provided with the above light emitting device and a recess on the second main surface opposite to the first main surface which is a light emitting surface for radiating light to the outside. The light emitting device is arranged in the recess of the light guide plate.

本発明の実施形態にかかる発光装置の製造方法は、同一面側に一対の電極ポストを備えた発光素子を被覆部材で覆い、前記被覆部材に前記電極ポストの露出部を設けてなる中間体を準備する工程と、前記中間体の前記電極ポストの露出部に電気接続する一対の電極層を形成する工程と、一対の前記電極層に電気接続する一対の電極端子を、一対の前記電極ポストよりも大面積で、外周縁を被覆部材の端部に設ける工程と、一対の前記電極端子の間に、前記電極端子の側面に接する絶縁性部材を形成する工程と、を含む。 In the method for manufacturing a light emitting device according to an embodiment of the present invention, an intermediate body formed by covering a light emitting element having a pair of electrode posts on the same surface side with a covering member and providing an exposed portion of the electrode posts on the covering member. The step of preparing, the step of forming a pair of electrode layers electrically connected to the exposed portion of the electrode post of the intermediate body, and the step of forming a pair of electrode terminals electrically connected to the pair of the electrode layers from the pair of the electrode posts. Also includes a step of providing an outer peripheral edge at the end of the covering member and a step of forming an insulating member in contact with the side surface of the electrode terminal between the pair of the electrode terminals.

さらに、本発明の実施形態の発光モジュールの製造方法は、以上の方法で製造した発光装置と、発光面となる第1主面と、前記第1主面と反対側にあって凹部を設けてなる第2主面とを備える導光板とを準備する工程と、前記発光装置を前記凹部に固着する工程と、前記導光板の前記第2主面に、前記発光装置を埋設する光反射性部材を設ける工程と、前記光反射性部材を研磨して前記電極端子を露出し、該露出する電極端子の表面に導電膜を形成する工程とを含む。 Further, in the method for manufacturing the light emitting module according to the embodiment of the present invention, the light emitting device manufactured by the above method, the first main surface to be the light emitting surface, and the recesses on the side opposite to the first main surface are provided. A step of preparing a light guide plate provided with a second main surface, a step of fixing the light emitting device to the recess, and a light reflecting member for embedding the light emitting device in the second main surface of the light guide plate. Includes a step of polishing the light-reflecting member to expose the electrode terminals and forming a conductive film on the surface of the exposed electrode terminals.

本発明の発光装置又は、本発明の方法で製造される発光装置は、小型化しながら確実に安定して発光装置にマウントして能率よく多量生産できる特徴がある。 The light emitting device of the present invention or the light emitting device manufactured by the method of the present invention is characterized in that it can be reliably and stably mounted on the light emitting device while being miniaturized so that it can be efficiently mass-produced.

さらにまた、間隔の広い電極端子間に絶縁性部材を設ける構造によって、端子間ショート等の弊害を確実に阻止しながら外部接続できる。また大面積の電極端子の発光装置は、発光モジュールにマウントする工程で、確実に安定して電気接続できる特徴もある。 Furthermore, the structure in which the insulating member is provided between the electrode terminals having a wide interval enables external connection while reliably preventing adverse effects such as short circuit between terminals. Further, the light emitting device having a large area electrode terminal has a feature that it can be reliably and stably electrically connected in the process of mounting it on the light emitting module.

本発明の発光モジュールとその製造方法は、発光装置を小型化しながら確実に安定して発光モジュールにマウントして能率よく多量生産できる特徴がある。 The light emitting module of the present invention and its manufacturing method are characterized in that the light emitting device can be reliably and stably mounted on the light emitting module while being miniaturized, and can be efficiently mass-produced.

一実施形態に係る発光装置の概略断面図である。It is the schematic sectional drawing of the light emitting device which concerns on one Embodiment. 一実施形態に係る発光装置の下斜方から見た概略斜視図である。It is a schematic perspective view seen from the lower oblique side of the light emitting device which concerns on one Embodiment. 一実施形態に係る発光装置の上斜方から見た概略斜視図である。It is a schematic perspective view seen from the upper oblique side of the light emitting device which concerns on one Embodiment. 他の実施形態に係る発光装置の概略断面図である。It is the schematic sectional drawing of the light emitting device which concerns on other embodiment. 他の実施形態に係る発光装置の概略断面図である。It is the schematic sectional drawing of the light emitting device which concerns on other embodiment. 他の実施形態にかかる発光装置の概略断面図である。It is the schematic sectional drawing of the light emitting device which concerns on other embodiment. 図3A〜図3Eは、図1Aの発光装置の積層工程を示す概略断面図である。3A to 3E are schematic cross-sectional views showing a laminating step of the light emitting device of FIG. 1A. 一実施形態にかかる発光装置の概略平面図である。It is a schematic plan view of the light emitting device which concerns on one Embodiment. 他の実施形態にかかる発光装置の概略平面図である。It is the schematic plan view of the light emitting device which concerns on other embodiment. 他の実施形態にかかる発光装置の概略平面図である。It is the schematic plan view of the light emitting device which concerns on other embodiment. 他の実施形態にかかる発光装置の概略平面図である。It is the schematic plan view of the light emitting device which concerns on other embodiment. 他の実施形態にかかる発光モジュールの一部拡大概略断面図である。It is a partially enlarged schematic sectional view of the light emitting module which concerns on another embodiment. 図9A〜図9Cは、一実施形態にかかる発光モジュールの製造工程を示す概略断面図である。9A-9C are schematic cross-sectional views showing a manufacturing process of the light emitting module according to the embodiment. 図10A〜図10Bは、一実施形態にかかる発光モジュールの製造工程を示す概略断面図である。10A to 10B are schematic cross-sectional views showing a manufacturing process of the light emitting module according to the embodiment. 他の実施形態に係る発光モジュールの一部拡大概略断面図である。It is a partially enlarged schematic sectional view of the light emitting module which concerns on other embodiment. 他の実施形態に係る発光モジュールの一部拡大概略断面図である。It is a partially enlarged schematic sectional view of the light emitting module which concerns on other embodiment. 一実施形態に係る発光モジュールの概略平面図である。It is a schematic plan view of the light emitting module which concerns on one Embodiment.

以下、図面に基づいて本発明を詳細に説明する。なお、以下の説明では、必要に応じて特定の方向や位置を示す用語(例えば、「上」、「下」、及びそれらの用語を含む別の用語)を用いるが、それらの用語の使用は図面を参照した発明の理解を容易にするためであって、それらの用語の意味によって本発明の技術的範囲が制限されるものではない。また、複数の図面に表れる同一符号の部分は同一もしくは同等の部分又は部材を示す。 Hereinafter, the present invention will be described in detail with reference to the drawings. In the following description, terms indicating a specific direction or position (for example, "upper", "lower", and other terms including those terms) are used as necessary, but the use of these terms is used. This is for facilitating the understanding of the invention with reference to the drawings, and the meaning of these terms does not limit the technical scope of the present invention. Further, the parts having the same reference numerals appearing in a plurality of drawings indicate the same or equivalent parts or members.

さらに以下に示す実施形態は、本発明の技術思想の具体例を示すものであって、本発明を以下に限定するものではない。また、以下に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限り、本発明の範囲をそれのみに限定する趣旨ではなく、例示することを意図したものである。また、一の実施の形態、実施例において説明する内容は、他の実施の形態、実施例にも適用可能である。また、図面が示す部材の大きさや位置関係等は、説明を明確にするため、誇張していることがある。 Further, the embodiments shown below show specific examples of the technical idea of the present invention, and do not limit the present invention to the following. In addition, unless otherwise specified, the dimensions, materials, shapes, relative arrangements, etc. of the components described below are not intended to limit the scope of the present invention to that alone, but are exemplified. It was intended. Further, the contents described in one embodiment and the embodiment can be applied to other embodiments and the embodiments. In addition, the size and positional relationship of the members shown in the drawings may be exaggerated in order to clarify the explanation.

発光装置は、同一面側に一対の電極ポストを設けてなる発光素子と、一対の電極ポストを設けてなる発光素子の電極面を覆い、かつ電極ポストの露出部を設けてなる被覆部材と、被覆部材の表面に設けられて電極ポストの露出部に電気接続してなる一対の電極層と、電極層の表面に設けられて、一対の電極ポストよりも大面積であって、外周縁を被覆部材の端部に配置してなる一対の電極端子と、一対の電極端子の間に設けられ、かつ電極端子の側面に接してなる絶縁性部材とを備える。
<実施形態1>
The light emitting device includes a light emitting element provided with a pair of electrode posts on the same surface side, a covering member provided with an exposed portion of the electrode post and covering the electrode surface of the light emitting element provided with the pair of electrode posts. A pair of electrode layers provided on the surface of the covering member and electrically connected to the exposed portion of the electrode post, and a pair of electrode layers provided on the surface of the electrode layer, which have a larger area than the pair of electrode posts and cover the outer peripheral edge. It includes a pair of electrode terminals arranged at the end of the member, and an insulating member provided between the pair of electrode terminals and in contact with the side surface of the electrode terminals.
<Embodiment 1>

実施形態1に係る発光装置1を、図1Aの断面図と、図1Bの下斜方(図1Aの下斜方)から見た斜視図と、図1Cの上斜方(図1Aの上斜方)から見た斜視図に示す。発光装置1は、発光素子2と、被覆部材3と、透光性部材4と、電極層5と、電極端子6と、一対の電極端子6の間であって、電極端子6の側面に接して設けている絶縁性部材17とを備える。発光素子2は、半導体層を積層している積層構造体2aと、積層構造体2aの一方の面(図1Aにおいて下面)である電極面2bに設けた一対の電極ポスト2cとを備える。発光装置1は図1Aの断面図において上方に光を放射する。 A cross-sectional view of the light emitting device 1 according to the first embodiment, a perspective view seen from a lower oblique view of FIG. 1B (lower oblique view of FIG. 1A), and an upper oblique view of FIG. 1C (upper oblique view of FIG. 1A). It is shown in the perspective view seen from the side). The light emitting device 1 is between the light emitting element 2, the covering member 3, the translucent member 4, the electrode layer 5, the electrode terminals 6, and the pair of electrode terminals 6, and is in contact with the side surface of the electrode terminals 6. The insulating member 17 is provided. The light emitting element 2 includes a laminated structure 2a in which semiconductor layers are laminated, and a pair of electrode posts 2c provided on an electrode surface 2b which is one surface (lower surface in FIG. 1A) of the laminated structure 2a. The light emitting device 1 emits light upward in the cross-sectional view of FIG. 1A.

発光素子2は半導体の積層構造体2aを有する。積層構造体2aは、発光層と、発光層を挟むn型半導体層およびp型半導体層とを含み、電極面2bにn側とp側の電極ポスト2cを設けている。発光素子2としては、縦、横および高さの寸法に特に制限は無いが、好ましくは平面視において縦および横の寸法が1000μm以下の積層構造体2aを用い、より好ましくは縦および横の寸法が500μm以下であり、さらに好ましくは、縦および横の寸法が200μm以下とする。このような発光素子2を用いると、液晶ディスプレイ装置のローカルディミングを行った際に、高精細な映像を実現することができる。また、縦および横の寸法が500μm以下の発光素子2を用いると、発光素子2を安価に調達することができるため、発光モジュールを安価にすることができる。なお、縦および横の寸法の両方が250μm以下である発光素子2は、発光素子2の光放射面2dの面積が小さくなるため、相対的に発光素子2の側面からの光の出射量が多くなる。つまり、このような発光素子2は配向特性がバットウィング型になりやすくなるため、発光素子2が導光板に接合され、発光素子2と導光板との距離がごく短い本実施形態の発光モジュールに好ましく用いられる。 The light emitting element 2 has a semiconductor laminated structure 2a. The laminated structure 2a includes a light emitting layer, an n-type semiconductor layer and a p-type semiconductor layer sandwiching the light emitting layer, and is provided with electrode posts 2c on the n-side and p-side on the electrode surface 2b. The light emitting element 2 is not particularly limited in the vertical, horizontal and height dimensions, but preferably a laminated structure 2a having a vertical and horizontal dimensions of 1000 μm or less in a plan view is used, and more preferably vertical and horizontal dimensions. Is 500 μm or less, and more preferably 200 μm or less in the vertical and horizontal dimensions. When such a light emitting element 2 is used, a high-definition image can be realized when the liquid crystal display device is locally dimmed. Further, when the light emitting element 2 having the vertical and horizontal dimensions of 500 μm or less is used, the light emitting element 2 can be procured at low cost, so that the light emitting module can be made cheap. In the light emitting element 2 having both vertical and horizontal dimensions of 250 μm or less, the area of the light emitting surface 2d of the light emitting element 2 is small, so that the amount of light emitted from the side surface of the light emitting element 2 is relatively large. Become. That is, since the orientation characteristic of such a light emitting element 2 tends to be a batwing type, the light emitting element 2 is bonded to the light guide plate, and the distance between the light emitting element 2 and the light guide plate is very short. It is preferably used.

被覆部材3は、一対の電極ポスト2cの表面が露出するように発光素子2の電極面2b及び側面を覆うように設けられる。被覆部材3は、発光素子2の周囲にあって発光素子2を埋設して、発光素子2の電極ポスト2cを表面に露出させている。被覆部材3は、外周面を透光性部材4の外周面と同一平面として、透光性部材4にも密着している。被覆部材3は、発光素子2と透光性部材4と一体構造に接合された発光装置1として製作される。 The covering member 3 is provided so as to cover the electrode surface 2b and the side surface of the light emitting element 2 so that the surfaces of the pair of electrode posts 2c are exposed. In the covering member 3, the light emitting element 2 is embedded around the light emitting element 2 to expose the electrode post 2c of the light emitting element 2 to the surface. The covering member 3 has an outer peripheral surface flush with the outer peripheral surface of the translucent member 4, and is in close contact with the translucent member 4. The covering member 3 is manufactured as a light emitting device 1 in which the light emitting element 2 and the translucent member 4 are integrally joined.

被覆部材3は、例えば、シリコーン樹脂、シリコーン変性樹脂、エポキシ樹脂、フェノール樹脂などのポリマーを主成分とする樹脂部材が好ましい。被覆部材3は、光反射性の樹脂部材とすることが好ましい。光反射性樹脂とは、発光素子2からの光に対する反射率が70%以上の樹脂材料を意味する。例えば、白色樹脂などが好ましい。被覆部材3に達した光が反射されて、発光装置1の発光面に向かうことにより、発光装置1の光取出し効率を高めることができる。また、中間体8のような形状の場合、被覆部材3としては透光性の樹脂部材とすることが好ましい。この場合の被覆部材3は、後述の透光性部材4と同様の材料を用いることができる。 The coating member 3 is preferably a resin member whose main component is a polymer such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin. The covering member 3 is preferably a light-reflecting resin member. The light-reflecting resin means a resin material having a reflectance of 70% or more with respect to light from the light emitting element 2. For example, a white resin or the like is preferable. The light that has reached the covering member 3 is reflected and directed toward the light emitting surface of the light emitting device 1, so that the light extraction efficiency of the light emitting device 1 can be improved. Further, in the case of a shape like the intermediate body 8, it is preferable that the covering member 3 is a translucent resin member. As the covering member 3 in this case, the same material as the translucent member 4 described later can be used.

透光性部材4は、発光素子2の光放射面2d(図1Aでは上面であり、電極ポスト2cが形成された電極面2bと対向する面)を覆うように設けられており、光放射面2dから出射される光を透過させる。透光性部材4は、後述する蛍光体を含むことにより、発光素子2からの発光色を調整して放射することができる。透光性部材は、複数の層で形成することもできる。 The translucent member 4 is provided so as to cover the light emitting surface 2d of the light emitting element 2 (the upper surface in FIG. 1A and the surface facing the electrode surface 2b on which the electrode post 2c is formed). The light emitted from 2d is transmitted. By including the phosphor described later, the translucent member 4 can adjust the emission color from the light emitting element 2 and emit the light. The translucent member can also be formed of a plurality of layers.

透光性部材4は、透光性樹脂、ガラス等が使用できる。特に、透光性樹脂が好ましく、シリコーン樹脂、シリコーン変性樹脂、エポキシ樹脂、フェノール樹脂などのポリマー、ポリカーボネート樹脂、アクリル樹脂、メチルペンテン樹脂、ポリノルボルネン樹脂などの熱可塑性樹脂を用いることができる。特に、耐光性、耐熱性に優れるシリコーン樹脂が好適である。 As the translucent member 4, a translucent resin, glass, or the like can be used. In particular, a translucent resin is preferable, and polymers such as silicone resin, silicone modified resin, epoxy resin and phenol resin, and thermoplastic resins such as polycarbonate resin, acrylic resin, methylpentene resin and polynorbornene resin can be used. In particular, a silicone resin having excellent light resistance and heat resistance is preferable.

透光性部材4は蛍光体を含んでもよい。蛍光体は、発光素子からの発光で励起可能なものが使用される。例えば、青色発光素子又は紫外線発光素子で励起可能な蛍光体としては、セリウムで賦活されたイットリウム・アルミニウム・ガーネット系蛍光体(YAG:Ce);セリウムで賦活されたルテチウム・アルミニウム・ガーネット系蛍光体(LAG:Ce);ユウロピウムおよび/又はクロムで賦活された窒素含有アルミノ珪酸カルシウム系蛍光体(CaO−Al23−SiO2);ユウロピウムで賦活されたシリケート系蛍光体((Sr,Ba)2SiO4);βサイアロン蛍光体、CASN系蛍光体、SCASN系蛍光体等の窒化物系蛍光体;KSF系蛍光体(K2SiF6:Mn);硫化物系蛍光体、量子ドット蛍光体などが挙げられる。これらの蛍光体と、青色発光素子又は紫外線発光素子と組み合わせることにより、様々な色の発光装置1(例えば白色系の発光装置1)とすることができる。 The translucent member 4 may contain a phosphor. As the phosphor, a phosphor that can be excited by light emission from the light emitting element is used. For example, as a phosphor that can be excited by a blue light emitting element or an ultraviolet light emitting element, an yttrium / aluminum / garnet-based phosphor (YAG: Ce) activated with cerium; a lutetium / aluminum / garnet-based phosphor activated with cerium (LAG: Ce); nitrogen-containing calcium aluminosilicate-based fluorophore (CaO-Al 2 O 3- SiO 2 ) activated with europium and / or chromium; silicate-based phosphor activated with europium ((Sr, Ba)) 2 SiO 4 ); Nitride-based phosphors such as β-sialon phosphors, CASN-based phosphors, and SCASN-based phosphors; KSF-based phosphors (K 2 SiF 6 : Mn); Sulfur-based phosphors, quantum dot phosphors And so on. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, a light emitting device 1 of various colors (for example, a white light emitting device 1) can be obtained.

また、透光性部材4には、粘度を調整する等の目的で、各種のフィラー等を含有させてもよい。 Further, the translucent member 4 may contain various fillers and the like for the purpose of adjusting the viscosity and the like.

透光性部材4は、様々な態様を採ることができる。例えば透光性部材4の変形例を図1Dの断面図に示す。図1Dに示す発光装置1Dでは、第1の透光性部材4Aの放射面(図1Dでは上面であり、発光素子2と反対側の面)を覆う第2の透光性部材4Bとを備える。第1の透光性部材4Aは、発光素子2の光放射面2dに接合されて、発光素子2の光放射面2dから出射される光を透過させる。第1の透光性部材4Aは蛍光体を含んでもよい。第2の透光性部材4Bは透過光を拡散する光拡散部である。透光性部材4は、第1の透光性部材4Aと、第2の透光性部材4Bを接合して、第1の透光性部材4Aを発光面側に配置している。透光性部材は、複数の第1の透光性部材や第2の透光性部材を積層することもできる。 The translucent member 4 can take various forms. For example, a modified example of the translucent member 4 is shown in the cross-sectional view of FIG. 1D. The light emitting device 1D shown in FIG. 1D includes a second translucent member 4B that covers the radiation surface of the first translucent member 4A (the upper surface in FIG. 1D and the surface opposite to the light emitting element 2). .. The first translucent member 4A is joined to the light emitting surface 2d of the light emitting element 2 to transmit the light emitted from the light emitting surface 2d of the light emitting element 2. The first translucent member 4A may contain a phosphor. The second translucent member 4B is a light diffusing portion that diffuses transmitted light. In the translucent member 4, the first translucent member 4A and the second translucent member 4B are joined, and the first translucent member 4A is arranged on the light emitting surface side. As the translucent member, a plurality of first translucent members and second translucent members can be laminated.

透光性部材4は、さらに他の態様を採ることができる。透光性部材4の他の変形例を、図1Eの断面図に示す。図1Eに示す発光装置1Eの例では、透光性部材4は、発光素子2の光放射面2dおよび積層構造体2aの側面を覆うように設けられており、光放射面2dおよび積層構造体2aの側面から出射される光を透過させる。透光性部材4の上面に、光拡散部を設けてもよい。 The translucent member 4 can take still another aspect. Another modification of the translucent member 4 is shown in the cross-sectional view of FIG. 1E. In the example of the light emitting device 1E shown in FIG. 1E, the translucent member 4 is provided so as to cover the light emitting surface 2d of the light emitting element 2 and the side surface of the laminated structure 2a, and the light emitting surface 2d and the laminated structure The light emitted from the side surface of 2a is transmitted. A light diffusing portion may be provided on the upper surface of the translucent member 4.

図1Eでは、被覆部材3は、一対の電極ポスト2cの表面が露出するように透光性部材4の上面と反対側の面(図1Eでは下面)、発光素子2の電極面2b及び電極ポスト2c側面を覆うように設けられる。被覆部材3は、外周面を透光性部材4の外周面と同一平面として、透光性部材4にも密着している。被覆部材3は、発光素子2と透光性部材4と一体構造に接合された発光装置1として製作される。 In FIG. 1E, the covering member 3 has a surface opposite to the upper surface of the translucent member 4 (lower surface in FIG. 1E) so that the surfaces of the pair of electrode posts 2c are exposed, the electrode surface 2b of the light emitting element 2, and the electrode post. It is provided so as to cover the side surface of 2c. The covering member 3 has an outer peripheral surface flush with the outer peripheral surface of the translucent member 4, and is in close contact with the translucent member 4. The covering member 3 is manufactured as a light emitting device 1 in which the light emitting element 2 and the translucent member 4 are integrally joined.

一対の電極層5は、一対の電極ポスト2cにそれぞれ電気接続されている。各々の電極層5は、各々の電極ポスト2cの面積よりも面積が大きい。換言すると、電極層5は、発光素子2の電極ポスト2c及び被覆部材3とを連続して覆うように設けられている。 The pair of electrode layers 5 are electrically connected to the pair of electrode posts 2c, respectively. The area of each electrode layer 5 is larger than the area of each electrode post 2c. In other words, the electrode layer 5 is provided so as to continuously cover the electrode post 2c of the light emitting element 2 and the covering member 3.

電極端子6は電極層5の表面に積層して電気接続されている。電極端子6は被覆部材3の端部、すなわち電極面の端部に配置されている。一対の電極端子6は、一対の電極ポスト2cの間隔よりも広い間隔に離して配置されていることが好ましい。間隔の広い電極端子6は、端子間ショート等の弊害を防止しながら外部接続でき、また厚い電極端子6の発光装置1は、外部に確実に安定して電気接続できる。 The electrode terminals 6 are laminated on the surface of the electrode layer 5 and electrically connected. The electrode terminal 6 is arranged at the end of the covering member 3, that is, at the end of the electrode surface. It is preferable that the pair of electrode terminals 6 are arranged at a distance wider than the distance between the pair of electrode posts 2c. The electrode terminals 6 having a wide interval can be externally connected while preventing adverse effects such as short circuits between terminals, and the light emitting device 1 of the thick electrode terminals 6 can be reliably and stably electrically connected to the outside.

絶縁性部材17は、一対の電極端子6の間で、電極端子6の側面に接して電極層5の表面に接合している。図の発光装置1は、絶縁性部材17を電極端子6から露出する電極層5と被覆部材3の表面全体を覆うように設けている。ただし、絶縁性部材17は必ずしも電極端子6から露出する電極層5と被覆部材3の表面全体を覆うように設ける必要はなく、たとえば、図2に示すように、一対の電極端子6の側面に接して中央部に設けることなく配置することもできる。 The insulating member 17 is in contact with the side surface of the electrode terminal 6 and is joined to the surface of the electrode layer 5 between the pair of electrode terminals 6. The light emitting device 1 in the figure is provided so as to cover the entire surface of the electrode layer 5 and the covering member 3 exposed from the electrode terminal 6 with the insulating member 17. However, the insulating member 17 does not necessarily have to be provided so as to cover the entire surface of the electrode layer 5 and the covering member 3 exposed from the electrode terminals 6, and for example, as shown in FIG. 2, on the side surfaces of the pair of electrode terminals 6. It can also be placed in contact without being provided in the center.

図1Aに示すように、発光素子2の側面および透光性部材4の一部を透光性接着部材16が被覆している。なお、透光性接着部材16の外側面は、発光素子2の側面から透光性部材4に向かって広がる傾斜面であることが好ましく、発光素子2側に凸状の曲面であることがより好ましい。これにより、発光素子2の側面から出る光をより透光性部材4に導くことができ、光取り出し効率を高めることができる。 As shown in FIG. 1A, the side surface of the light emitting element 2 and a part of the translucent member 4 are covered with the translucent adhesive member 16. The outer surface of the translucent adhesive member 16 is preferably an inclined surface that extends from the side surface of the light emitting element 2 toward the translucent member 4, and is more preferably a curved surface that is convex toward the light emitting element 2. preferable. As a result, the light emitted from the side surface of the light emitting element 2 can be guided to the translucent member 4, and the light extraction efficiency can be improved.

また、発光素子2の主放射面2dと透光性部材4の間には、透光性接着部材16を有してもよい。これにより、例えば、透光性接着部材16に拡散剤等を含有することで発光素子2の主発光面2dから出る光が、透光性接着部材16で拡散され、透光性部材4に入ることで輝度ムラを少なくできる。透光性接着部材16は、後述する透光性接合部材12と同じ部材を使用することができる。 Further, a translucent adhesive member 16 may be provided between the main radiation surface 2d of the light emitting element 2 and the translucent member 4. As a result, for example, the light emitted from the main light emitting surface 2d of the light emitting element 2 by containing a diffusing agent or the like in the translucent adhesive member 16 is diffused by the translucent adhesive member 16 and enters the translucent member 4. As a result, uneven brightness can be reduced. As the translucent adhesive member 16, the same member as the translucent bonding member 12 described later can be used.

このような発光装置1は、以下の工程により形成することができる。
(1)電極面2bに一対の電極ポスト2cを備えた発光素子2と、各々の電極ポスト2cの表面の一部が露出するように発光素子2を覆う被覆部材3と、を備えた中間体8を準備する工程と、
(2)露出された一対の電極ポスト2cに電気接続する電極層5を形成する積層工程と、
(3)一対の電極層5に電気接続する一対の電極端子6を、電極ポスト2cよりも大面積で電極面の端部に設ける工程と、
(4)一対の電極端子6の間に、電極端子6の側面に接して絶縁性部材17を形成する工程と、
を含む。以下、図3A〜図3Eを用いて発光装置の製造工程について詳説する。
(中間体を準備する工程)
Such a light emitting device 1 can be formed by the following steps.
(1) An intermediate body including a light emitting element 2 having a pair of electrode posts 2c on the electrode surface 2b and a covering member 3 covering the light emitting element 2 so that a part of the surface of each electrode post 2c is exposed. The process of preparing 8 and
(2) A laminating step of forming an electrode layer 5 electrically connected to a pair of exposed electrode posts 2c, and
(3) A step of providing a pair of electrode terminals 6 electrically connected to the pair of electrode layers 5 at the end of the electrode surface in a larger area than the electrode post 2c.
(4) A step of forming an insulating member 17 in contact with the side surface of the electrode terminals 6 between the pair of electrode terminals 6.
including. Hereinafter, the manufacturing process of the light emitting device will be described in detail with reference to FIGS. 3A to 3E.
(Process to prepare intermediate)

図3Aに示すように、発光素子2と被覆部材3と、を備えた中間体8を準備する。発光素子2は、積層構造体2aと、積層構造体2aの同一面側に一対の電極ポスト2cを備えている。被覆部材3は、一対の電極ポスト2cの表面の一部が露出するように発光素子2を被覆している。1つの中間体8は、複数の発光素子2を備えており、各発光素子2は、縦方向及び横方向に規則的に配列された状態で、被覆部材3によって一体的に被覆されている。なお、工程を説明する図(例えば図3A〜図3E)においては説明の便宜上、2つ分の発光素子2を例示しているが、個数はこれに限定されるものではない。 As shown in FIG. 3A, an intermediate 8 including a light emitting element 2 and a covering member 3 is prepared. The light emitting element 2 includes a laminated structure 2a and a pair of electrode posts 2c on the same surface side of the laminated structure 2a. The covering member 3 covers the light emitting element 2 so that a part of the surface of the pair of electrode posts 2c is exposed. One intermediate body 8 includes a plurality of light emitting elements 2, and each light emitting element 2 is integrally covered with a covering member 3 in a state of being regularly arranged in the vertical direction and the horizontal direction. In the drawings for explaining the process (for example, FIGS. 3A to 3E), two light emitting elements 2 are illustrated for convenience of explanation, but the number is not limited to this.

発光素子2間の距離は、目的とする発光装置1の大きさ、発光素子2の大きさ等によって適宜選択することができる。ただし、後工程において被覆部材3を切断して複数の発光装置1に分割する方法にあっては、その切断部分の幅(切断刃の幅)等をも考慮して配置する。 The distance between the light emitting elements 2 can be appropriately selected depending on the size of the target light emitting device 1, the size of the light emitting element 2, and the like. However, in the method of cutting the covering member 3 and dividing it into a plurality of light emitting devices 1 in a subsequent step, the width of the cut portion (width of the cutting blade) and the like are also taken into consideration when arranging.

また、図3Aでは、発光素子2の下面(光放射面2dであって、電極面2bと対向する面)に透光性部材4を有した中間体8を例示している。しかしながら、透光性部材4は必ずしも必要ではなく、省略してもよい。中間体8は、支持部材30上に、電極ポスト2cが形成されていない側の面(図3Aでは透光性部材4が形成された面)を対向させて載置されている。
(金属層9を形成する積層工程)
Further, FIG. 3A illustrates an intermediate body 8 having a translucent member 4 on the lower surface of the light emitting element 2 (the surface which is the light emitting surface 2d and faces the electrode surface 2b). However, the translucent member 4 is not always necessary and may be omitted. The intermediate body 8 is placed on the support member 30 with the surface on the side where the electrode post 2c is not formed (the surface on which the translucent member 4 is formed in FIG. 3A) facing each other.
(Laminating process for forming the metal layer 9)

次に、図3Bに示すように、露出された一対の電極ポスト2cと被覆部材3とを連続して覆う金属層9を形成する。金属層9は、スパッタ、蒸着、原子層堆積(Atomic Layer Deposition;ALD)法や有機金属化学的気相成長(Metal Organic Chemical Vapor Deposition;MOCVD)法、プラズマCVD(Plasma-Enhanced Chemical Vapor Deposition;PECVD)法、大気圧プラズマ成膜法などによって形成することができる。 Next, as shown in FIG. 3B, a metal layer 9 is formed that continuously covers the pair of exposed electrode posts 2c and the covering member 3. The metal layer 9 is formed by sputter, thin film deposition, atomic layer deposition (ALD) method, metal organic chemical vapor deposition (MOCVD) method, plasma CVD (Plasma-Enhanced Chemical Vapor Deposition; PECVD) method. ) Method, atmospheric pressure plasma deposition method, etc.

金属層9は、例えば、最表面の層はAu、Pt等の白金族元素の金属が好ましい。また、最表面にはんだ付け性の良好なAuを用いることもできる。 As the metal layer 9, for example, the outermost layer is preferably a platinum group element metal such as Au or Pt. Further, Au having good solderability can be used on the outermost surface.

金属層9は単一の材料の一層のみで構成されてもよく、異なる材料の層が積層されて構成されていてもよい。特に、高融点の金属層9を用いるのが好ましく、例えば、Ru、Mo、Ta等を挙げることができる。また、これら高融点の金属を、発光素子2の電極ポスト2cと最表面の層との間に設けることにより、はんだに含まれるSnが電極ポスト2cや電極ポスト2cに近い層に拡散することを低減することが可能な拡散防止層とすることができる。このような拡散防止層を備えた積層構造の例としては、Ni/Ru/Au、Ti/Pt/Au等が挙げられる。また、拡散防止層(例えばRu)の厚みとしては、10Å〜1000Å程度が好ましい。 The metal layer 9 may be composed of only one layer of a single material, or may be composed of layers of different materials laminated. In particular, it is preferable to use a metal layer 9 having a high melting point, and examples thereof include Ru, Mo, and Ta. Further, by providing these high melting point metals between the electrode post 2c of the light emitting element 2 and the outermost layer, Sn contained in the solder is diffused to the electrode post 2c and the layer close to the electrode post 2c. It can be a diffusion prevention layer that can be reduced. Examples of the laminated structure provided with such a diffusion prevention layer include Ni / Ru / Au, Ti / Pt / Au and the like. The thickness of the diffusion prevention layer (for example, Ru) is preferably about 10 Å to 1000 Å.

金属層9の厚みは、種々選択することができる。レーザアブレーションが選択的に起こる程度とすることができ、例えば1μm以下であることが好ましく、1000Å以下がより好ましい。また、電極ポスト2cの腐食を低減することができる厚み、例えば5nm以上であることが好ましい。ここで、金属層9の厚みとは、金属層9が複数の層が積層されて構成されている場合には、該複数の層の合計の厚みのことをいう。
(金属層9の一部を除去する工程)
The thickness of the metal layer 9 can be variously selected. The degree to which laser ablation occurs selectively can be set to, for example, preferably 1 μm or less, and more preferably 1000 Å or less. Further, the thickness of the electrode post 2c is preferably 5 nm or more, which can reduce corrosion. Here, the thickness of the metal layer 9 means the total thickness of the plurality of layers when the metal layer 9 is formed by laminating a plurality of layers.
(Step of removing a part of the metal layer 9)

図3Cに示すように、金属層9にレーザー光を照射して、金属層9(電極層5)のない電極間スリットを絶縁領域10として設ける。レーザー光は、発光素子2の一対の電極ポスト2cの間に設ける絶縁領域10に照射する。図4の平面図は、電極層5の間に配置する絶縁領域10を示している。絶縁領域10は、発光素子2の一対の電極ポスト2cの間だけでなく、その延長方向にある被覆部材3の表面にも伸びて、金属層9を分割している。 As shown in FIG. 3C, the metal layer 9 is irradiated with laser light to provide an inter-electrode slit without the metal layer 9 (electrode layer 5) as an insulating region 10. The laser beam irradiates the insulating region 10 provided between the pair of electrode posts 2c of the light emitting element 2. The plan view of FIG. 4 shows an insulating region 10 arranged between the electrode layers 5. The insulating region 10 extends not only between the pair of electrode posts 2c of the light emitting element 2 but also on the surface of the covering member 3 in the extending direction thereof to divide the metal layer 9.

電極間スリットの絶縁領域10は、発光素子2の電極ポスト2c間の幅と略同じ幅である。図4の発光装置1は、絶縁領域10の幅を電極ポスト2cの幅よりも僅かに広くしている。絶縁領域10は、レーザアブレーションにより金属層9が除去される。金属層9が絶縁領域10で除去されて、発光素子2の一対の電極ポスト2cの間にスリット状に被覆部材3が露出する。 The insulating region 10 of the inter-electrode slit has substantially the same width as the width between the electrode posts 2c of the light emitting element 2. In the light emitting device 1 of FIG. 4, the width of the insulating region 10 is slightly wider than the width of the electrode post 2c. In the insulating region 10, the metal layer 9 is removed by laser ablation. The metal layer 9 is removed in the insulating region 10, and the covering member 3 is exposed in a slit shape between the pair of electrode posts 2c of the light emitting element 2.

レーザー光は、その照射スポットを部材上で連続的又は逐次移動させることにより、金属層9に照射することができる。レーザー光は、連続して照射してもよく、パルス照射でもよい。レーザー光の強度、照射スポットの径及び照射スポットの移動速度は、被覆部材3や金属層9の熱伝導率及びそれらの熱伝導率差等を考慮して、被覆部材上の金属層9にレーザアブレーションが生じるように、設定することができる。 The laser beam can irradiate the metal layer 9 by continuously or sequentially moving the irradiation spot on the member. The laser light may be continuously irradiated or may be pulsed. The intensity of the laser beam, the diameter of the irradiation spot, and the moving speed of the irradiation spot are determined by the laser on the metal layer 9 on the coating member in consideration of the thermal conductivity of the coating member 3 and the metal layer 9 and the difference in thermal conductivity between them. It can be set so that ablation occurs.

レーザー光の波長は、金属層に対する反射率が低い波長、例えば反射率が90%以下である波長を選択することが好ましい。例えば、金属層の最表面がAuである場合には、赤色領域(たとえば640nm)のレーザよりも、緑色領域(例えば550nm)より短い発光波長のレーザを用いることが好ましい。これにより、アブレーションを効率よく発生させ、量産性を高めることができる。 As the wavelength of the laser light, it is preferable to select a wavelength having a low reflectance with respect to the metal layer, for example, a wavelength having a reflectance of 90% or less. For example, when the outermost surface of the metal layer is Au, it is preferable to use a laser having an emission wavelength shorter than that in the green region (for example, 550 nm) rather than a laser in the red region (for example, 640 nm). As a result, ablation can be efficiently generated and mass productivity can be improved.

図4の平面図を示す発光装置は、複数の発光素子2を含む中間体11を用いているため、図3C及び図4に示すように、レーザー光を照射して金属層9の一部を除去することで、1つの発光素子2の一対の電極ポスト2c間で金属層9は分断された状態となるが、隣接する複数の発光素子2の電極ポスト2cを被覆している金属層9と連続している状態である。図4の中間体8は、後述する発光装置に分離する工程において、金属層9を隣接する発光素子間(図3Eの破線Xで示す切断ライン)で切断することで、金属層9が電極層5に分割される。なお、電極間スリットを形成する分割工程において、レーザ光を発光素子間の切断ラインX、Yにも照射することにより、レーザ照射のみで金属層9をそれぞれ独立した電極層5とすることができる。 Since the light emitting device shown in the plan view of FIG. 4 uses an intermediate body 11 including a plurality of light emitting elements 2, as shown in FIGS. 3C and 4, a part of the metal layer 9 is irradiated with laser light. By removing the metal layer 9 from the pair of electrode posts 2c of one light emitting element 2, the metal layer 9 is separated from the metal layer 9 covering the electrode posts 2c of a plurality of adjacent light emitting elements 2. It is in a continuous state. In the step of separating the intermediate body 8 of FIG. 4 into a light emitting device described later, the metal layer 9 is formed into an electrode layer by cutting the metal layer 9 between adjacent light emitting elements (the cutting line shown by the broken line X in FIG. 3E). It is divided into five. By irradiating the cutting lines X and Y between the light emitting elements with the laser beam in the dividing step of forming the slit between the electrodes, the metal layer 9 can be made into an independent electrode layer 5 only by the laser irradiation. ..

図4の中間体8は、レーザー光で金属層9をスリット状に除去して絶縁領域10を設けて、絶縁領域10の両側に一対の電極層5を形成している。この図の中間体8は、発光素子2の電極面2bの中央部分に配置する電極間スリットの絶縁領域10を、電極面2bの対角方向に伸びる傾斜スリット10aとして、傾斜スリット10aの両端部に平行スリット10bを連結している。両端部に設けた平行スリット10bは、互いに平行な姿勢で、電極面2bの対向する2辺と平行な方向に伸びている。図4の発光装置1は、電極面2bに設けている一対の電極ポスト2cの対向縁を、四角形である電極面2bの対角方向に配置して、この対向縁と平行に傾斜スリット10aを設けている。すなわち、傾斜スリット10aと電極ポスト2cの対向縁とを平行な姿勢として、電極層5の間に絶縁領域10を配置している。 In the intermediate body 8 of FIG. 4, the metal layer 9 is removed in a slit shape by laser light to provide an insulating region 10, and a pair of electrode layers 5 are formed on both sides of the insulating region 10. In the intermediate body 8 in this figure, the insulating regions 10 of the inter-electrode slits arranged in the central portion of the electrode surface 2b of the light emitting element 2 are set as inclined slits 10a extending in the diagonal direction of the electrode surface 2b, and both ends of the inclined slit 10a. A parallel slit 10b is connected to the. The parallel slits 10b provided at both ends extend in a direction parallel to the two opposite sides of the electrode surface 2b in a posture parallel to each other. In the light emitting device 1 of FIG. 4, the facing edges of the pair of electrode posts 2c provided on the electrode surface 2b are arranged in the diagonal direction of the rectangular electrode surface 2b, and the inclined slit 10a is provided in parallel with the facing edges. It is provided. That is, the insulating region 10 is arranged between the electrode layers 5 with the inclined slit 10a and the facing edges of the electrode posts 2c in parallel postures.

図4の中間体8は、電極ポスト2cが電極層5の絶縁領域10に僅かに突出しているので、各々の発光装置1に設けられる傾斜スリット10aの幅は、電極ポスト2cの間隔よりも僅かに広い。傾斜スリット10aと平行スリット10bとがなす角(α)は鈍角で、電極間スリットの絶縁領域10の両側に、幅広部5Aと幅狭部5Bとからなる一対の電極層5を設けて、絶縁領域10の対向する両側(図において左右の両側)に一対の電極層5を設けている。
(電極端子6の形成工程)
In the intermediate body 8 of FIG. 4, since the electrode posts 2c slightly project into the insulating region 10 of the electrode layer 5, the width of the inclined slits 10a provided in each light emitting device 1 is smaller than the distance between the electrode posts 2c. Wide. The angle (α) formed by the inclined slit 10a and the parallel slit 10b is an obtuse angle, and a pair of electrode layers 5 composed of a wide portion 5A and a narrow portion 5B are provided on both sides of the insulating region 10 of the inter-electrode slit to insulate. A pair of electrode layers 5 are provided on both opposite sides of the region 10 (both left and right sides in the drawing).
(Forming process of electrode terminal 6)

図3Dの工程は、金属層9の表面に導電ペーストを塗布して、被覆部材3の端部に電極端子6を設ける。被覆部材3の端部に配置された電極端子6は、電極間隔を広くできるので、導光板などにマウントされた状態でより確実に外部に電気接続できる。導電ペーストは、バインダーに金属粉末を混合したもので、バインダーが未硬化な液状ないしペースト状で金属層9の表面に一定の厚さに塗布される。金属層9の表面に塗布された導電ペーストは、バインダーが硬化して導電性の電極端子6を金属層9に電気接続して形成する。導電ペーストは、例えば金属粉末である銀や銅粉末を、バインダーであるポリマーに混合したもので、バインダーのポリマーを硬化させて導電性の電極端子6を形成する。バインダーに紫外線硬化樹脂や光硬化樹脂を使用する導電ペーストは、塗布した状態で紫外線や特定波長の光を照射してバインダーを短時間で硬化できる特徴がある。導電ペーストは、メタルマスクを使用して電極面2bの特定の位置に塗布される。メタルマスクは電極端子6を設ける位置に貫通穴を設けている。このメタルマスクを電極面2bに積層する状態で導電ペーストを塗布して、電極端子6を設ける位置に導電ペーストが塗布される。塗布された導電ペーストは、紫外線や光を照射して短時間に硬化されて電極端子6を形成する。この方法は、メタルマスクの厚さで電極端子6の膜厚を調整できる。メタルマスクの貫通穴に充填された導電ペーストが硬化して電極端子6となるからである。 In the process of FIG. 3D, the conductive paste is applied to the surface of the metal layer 9 and the electrode terminals 6 are provided at the ends of the covering member 3. Since the electrode terminals 6 arranged at the ends of the covering member 3 can widen the electrode spacing, they can be more reliably electrically connected to the outside in a state of being mounted on a light guide plate or the like. The conductive paste is a mixture of a metal powder and a binder, and the binder is uncured in a liquid or paste form and is applied to the surface of the metal layer 9 to a certain thickness. The conductive paste applied to the surface of the metal layer 9 is formed by curing the binder and electrically connecting the conductive electrode terminals 6 to the metal layer 9. The conductive paste is, for example, a mixture of silver or copper powder, which is a metal powder, with a polymer, which is a binder, and the polymer of the binder is cured to form a conductive electrode terminal 6. A conductive paste that uses an ultraviolet curable resin or a photocurable resin as a binder has a feature that the binder can be cured in a short time by irradiating the binder with ultraviolet rays or light of a specific wavelength in a coated state. The conductive paste is applied to a specific position on the electrode surface 2b using a metal mask. The metal mask is provided with a through hole at a position where the electrode terminal 6 is provided. The conductive paste is applied in a state where the metal mask is laminated on the electrode surface 2b, and the conductive paste is applied to the position where the electrode terminal 6 is provided. The applied conductive paste is irradiated with ultraviolet rays or light and cured in a short time to form the electrode terminals 6. In this method, the film thickness of the electrode terminal 6 can be adjusted by adjusting the thickness of the metal mask. This is because the conductive paste filled in the through hole of the metal mask is cured to become the electrode terminal 6.

電極端子6は金属層9よりも厚く、たとえば金属層9の10倍以上とする。電極端子6の厚さは、導電ペーストを塗布する厚さで調整する。電極端子6は、薄膜の金属層9に積層して設けられる。膜厚が、例えば500オングストローム程度の金属層9は、被覆部材3の損傷を少なくしてレーザー光で除去できる。 The electrode terminal 6 is thicker than the metal layer 9, for example, 10 times or more the metal layer 9. The thickness of the electrode terminal 6 is adjusted by the thickness at which the conductive paste is applied. The electrode terminal 6 is provided by being laminated on the metal layer 9 of the thin film. The metal layer 9 having a film thickness of, for example, about 500 angstroms can be removed by laser light with less damage to the covering member 3.

電極層5に積層して設けた厚い電極端子6の発光装置1は、電極端子6を安定して確実に外部に接続できる。電極層5に積層して設けられる電極端子6は、たとえば、厚さを好ましくは10μm以上、最適には20μm〜40μmとする。また、発光装置1は、導光板などにマウントされる工程で、表面にプラスチック等の光反射性部材を積層して導電膜に電気接続される。光反射性部材は、表面を研磨あるいは研削して、電極端子6を露出して光反射性部材と同一平面に加工した状態で、導電膜に電気接続される。光反射性部材の表面を研磨して電極端子6を同一平面に露出させる工程は、電極端子6の表面も一部が除去される。厚い電極端子6は、絶縁層の研磨工程で破損されることがなく、表面の一部が研磨されて、光反射性部材と同一平面に加工できる。 The light emitting device 1 of the thick electrode terminal 6 provided laminated on the electrode layer 5 can stably and reliably connect the electrode terminal 6 to the outside. The thickness of the electrode terminal 6 provided so as to be laminated on the electrode layer 5 is, for example, preferably 10 μm or more, and optimally 20 μm to 40 μm. Further, in the process of mounting the light emitting device 1 on a light guide plate or the like, a light reflecting member such as plastic is laminated on the surface and electrically connected to the conductive film. The light-reflecting member is electrically connected to the conductive film in a state where the surface is polished or ground to expose the electrode terminals 6 and processed into the same plane as the light-reflecting member. In the step of polishing the surface of the light reflecting member to expose the electrode terminals 6 on the same plane, a part of the surface of the electrode terminals 6 is also removed. The thick electrode terminal 6 is not damaged in the process of polishing the insulating layer, and a part of the surface thereof can be polished so that the thick electrode terminal 6 can be processed into the same plane as the light reflecting member.

電極端子6のない発光装置は、導光板にマウントされる状態で、光反射性部材の研磨が極めて難しい。それは、例えば、500オングストローム程度と極めて薄い電極層5を埋設している光反射性部材の表面を研磨して、薄膜の電極層5を損傷することなく露出させために、極めて高い研磨精度が要求されるからである。 In a light emitting device without an electrode terminal 6, it is extremely difficult to polish a light reflecting member in a state of being mounted on a light guide plate. For example, in order to polish the surface of a light-reflecting member in which an extremely thin electrode layer 5 of about 500 angstroms is embedded and expose the thin electrode layer 5 without damaging it, extremely high polishing accuracy is required. Because it is done.

電極ポスト2cよりも大面積の電極層5の表面に配置される電極端子6は、電極ポスト2cよりも大きな面積で、しかも電極ポスト2cよりも広い間隔で電極層5の表面に形成できる。導電ペーストは、電極層5表面の特定の位置に特定の形状で塗布して、電極端子6を形成できる。導電ペーストは、電極層5の表面をマスキングして、特定の領域に塗布される。 The electrode terminals 6 arranged on the surface of the electrode layer 5 having a larger area than the electrode post 2c can be formed on the surface of the electrode layer 5 having a larger area than the electrode post 2c and at a wider interval than the electrode post 2c. The conductive paste can be applied to a specific position on the surface of the electrode layer 5 in a specific shape to form the electrode terminal 6. The conductive paste masks the surface of the electrode layer 5 and is applied to a specific area.

図1Aの発光装置1は、スリット状の絶縁領域10の両側に、平行スリット10bの延伸方向に伸びる形状の電極端子6を配置している。この発光装置1は、電極層5の幅広部5Aの両側部に、平行スリット10bと平行に長方形の電極端子6を配置している。この発光装置1は、一対の電極端子6を、方形状である電極面2bの外周縁の対称位置に離して配置するので、電極ポスト2cの間隔に比較して相当に広い間隔で配置でき、また、電極ポスト2cよりも相当に大きい電極端子6を設けることができる。電極ポスト2cの間隔よりも広く、また電極ポスト2cよりも大きく、さらに電極層5よりも厚い電極端子6の発光装置1は、特定の位置にマウントされて発光モジュールとする工程で、導電膜に確実に電気接続できる。
(絶縁性部材17を設ける工程)
In the light emitting device 1 of FIG. 1A, electrode terminals 6 having a shape extending in the extending direction of the parallel slit 10b are arranged on both sides of the slit-shaped insulating region 10. In this light emitting device 1, rectangular electrode terminals 6 are arranged in parallel with the parallel slits 10b on both sides of the wide portion 5A of the electrode layer 5. In this light emitting device 1, since the pair of electrode terminals 6 are arranged at symmetrical positions on the outer peripheral edge of the rectangular electrode surface 2b, they can be arranged at a considerably wider interval than the interval of the electrode posts 2c. Further, the electrode terminal 6 which is considerably larger than the electrode post 2c can be provided. The light emitting device 1 of the electrode terminal 6 which is wider than the distance between the electrode posts 2c, larger than the electrode post 2c, and thicker than the electrode layer 5 is mounted on a specific position to form a light emitting module, and is used as a conductive film. You can make a reliable electrical connection.
(Step of providing the insulating member 17)

絶縁性部材17は、一対の電極端子6の表面を露出させて、電極端子6の側面に接して、一対の電極端子6の間で電極層5の表面に接合して設けられる。絶縁性部材17は、好ましくは図1に示すように、一対の電極端子6の間の凹部全体に設けられる。この絶縁性部材17は、電極端子6から露出する電極層5及び被覆部材3の表面全体を覆うように設けられる。絶縁性部材17は、電極端子6と同一平面に設けられる。この絶縁性部材17は、一対の電極端子6の間であって電極層5と被覆部材3に接合した後、表面を研磨して電極端子6と同一平面に均等化される。 The insulating member 17 is provided so that the surface of the pair of electrode terminals 6 is exposed, is in contact with the side surfaces of the electrode terminals 6, and is joined to the surface of the electrode layer 5 between the pair of electrode terminals 6. The insulating member 17 is preferably provided in the entire recess between the pair of electrode terminals 6, as shown in FIG. The insulating member 17 is provided so as to cover the entire surface of the electrode layer 5 and the covering member 3 exposed from the electrode terminal 6. The insulating member 17 is provided on the same plane as the electrode terminal 6. The insulating member 17 is between the pair of electrode terminals 6 and is joined to the electrode layer 5 and the covering member 3, and then the surface is polished to make it uniform on the same plane as the electrode terminals 6.

絶縁性部材17は被覆部材3と同様に、例えば、シリコーン樹脂、シリコーン変性樹脂、エポキシ樹脂、フェノール樹脂などのポリマーを主成分とする樹脂部材、ベークライト、メラミン又はホルムアルデヒドが好ましい。絶縁性部材17は、光反射性の樹脂部材とすることが好ましい。光反射性樹脂とは、発光素子2からの光に対する反射率が70%以上の樹脂材料を意味する。例えば、白色樹脂などが好ましい。絶縁性部材17に達した光が反射されて、発光装置1の発光面に向かうことにより、発光装置1の光取出し効率を高めることができる。 Similar to the coating member 3, the insulating member 17 is preferably a resin member containing a polymer as a main component, such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin, and bakelite, melamine, or formaldehyde. The insulating member 17 is preferably a light-reflecting resin member. The light-reflecting resin means a resin material having a reflectance of 70% or more with respect to light from the light emitting element 2. For example, a white resin or the like is preferable. The light that has reached the insulating member 17 is reflected and directed toward the light emitting surface of the light emitting device 1, so that the light extraction efficiency of the light emitting device 1 can be improved.

絶縁性部材17は、曲げ弾性率が高い樹脂を用いることが好ましい。個片化後の発光装置を電極端子6側を実装面として実装基板に実装する場合、金属からなる電極ポスト2cおよび電極端子6を起点として絶縁性部材17に曲げ応力が発生し、絶縁性部材17と接する電極層5が剥離または欠損する可能性がある。そこで、絶縁性部材17として曲げ弾性率が高い樹脂を用いることで、上述の電極層5の剥離または欠損が起こる可能性を効果的に低減することができる。絶縁性部材17の曲げ弾性率は、例えば、1000MPa〜30000MPaであり、5000MPa〜30000MPaであることが好ましく、10000MPa〜30000MPaであることがより好ましい。このような絶縁性部材17として、例えば、エポキシ樹脂にカーボンを含有する部材を用いることができる。また、絶縁性部材17の曲げ弾性率は、被覆部材3の曲げ弾性率よりも高くすることができる。これにより、個片化後の発光装置において、曲げ応力に対する剛性を絶縁性部材17で確保しつつ、被覆部材3として光反射性の高い部材を用いることができ、光取り出しが良好な発光装置とすることができる。 It is preferable to use a resin having a high flexural modulus for the insulating member 17. When the light emitting device after fragmentation is mounted on the mounting substrate with the electrode terminal 6 side as the mounting surface, bending stress is generated in the insulating member 17 starting from the metal electrode post 2c and the electrode terminal 6, and the insulating member The electrode layer 5 in contact with 17 may be peeled off or chipped. Therefore, by using a resin having a high flexural modulus as the insulating member 17, the possibility of peeling or chipping of the electrode layer 5 described above can be effectively reduced. The flexural modulus of the insulating member 17 is, for example, 1000 MPa to 30,000 MPa, preferably 5000 MPa to 30,000 MPa, and more preferably 10,000 MPa to 30,000 MPa. As such an insulating member 17, for example, a member containing carbon in an epoxy resin can be used. Further, the flexural modulus of the insulating member 17 can be made higher than the flexural modulus of the covering member 3. As a result, in the light emitting device after individualization, a member having high light reflection can be used as the covering member 3 while ensuring the rigidity against bending stress by the insulating member 17, and the light emitting device with good light extraction can be used. can do.

なお、本明細書における曲げ弾性率の測定方法等は、JIS K7171に従う。
(発光装置に分離する工程)
The method for measuring the flexural modulus in the present specification is in accordance with JIS K7171.
(Process of separating into light emitting device)

複数の発光装置を備える中間体は、電極端子6を設けた後、図3Eで示すように、切断ラインX、Yで切断して発光装置に分離される。分離された発光装置は、導光板にマウントされて発光モジュールとなる。 After providing the electrode terminals 6, the intermediate including the plurality of light emitting devices is cut at the cutting lines X and Y and separated into the light emitting devices as shown in FIG. 3E. The separated light emitting device is mounted on a light guide plate to form a light emitting module.

図4の中間体8は、破線で示す切断ラインXと切断ラインYで切断されて、複数の発光装置1に分離されるが、この図の中間体8は、切断ラインYに沿ってレーザー光を照射して金属層9のない絶縁領域10を分割スリット10cとして設けている。切断ラインYは、平行スリット10bに直交して発光装置1の外周縁に沿って設けられる。この中間体8は、分割された発光装置1の2辺に、金属層9のない分割スリット10cが配置される。分割スリット10cのある中間体8は、切断ラインYを分割スリット10c内に配置することで、各々の発光装置1に形成される一対の電極層5を確実に分離する。
<変形例1>
The intermediate body 8 in FIG. 4 is cut by the cutting line X and the cutting line Y shown by the broken line and separated into a plurality of light emitting devices 1. However, the intermediate body 8 in this figure is a laser beam along the cutting line Y. The insulating region 10 without the metal layer 9 is provided as the dividing slit 10c by irradiating with the above. The cutting line Y is provided along the outer peripheral edge of the light emitting device 1 at right angles to the parallel slit 10b. In the intermediate body 8, split slits 10c without a metal layer 9 are arranged on two sides of the split light emitting device 1. By arranging the cutting line Y in the dividing slit 10c, the intermediate body 8 having the dividing slit 10c surely separates the pair of electrode layers 5 formed in each light emitting device 1.
<Modification example 1>

図5は、変形例1にかかる発光装置1を示す。この発光装置1は、電極端子6の形状と位置が異なる変形例であって、他の構造は実施形態1と同様である。実施形態1の発光装置1は、細長い長方形の電極端子6を電極面2bの点対称の位置に平行スリット10bと平行に配置しているが、この発光装置1は、方形状である被覆部材3の対向する隅部であって中央部を除く領域に配置されている。具体的には、方形状である電極面2bの点対称の位置にあるふたつの隅部に電極端子6を配置している。電極端子6の外形は、方形状のひとつの隅部に切欠部6aを設けた形状で、切欠部6aを対向する位置に配置している。一対の電極端子6は、切欠部6aを対向する姿勢で配置して、両方の切欠部6aの間に電極ポスト2cを配置している。さらに電極端子6は、ふたつの外周縁を被覆部材の外周縁に配置している。この電極端子6は、被覆部材3の隅部に大きな面積で配置できる。したがって、この電極端子6は電極ポスト2cよりも大きい。
<実施形態2>
FIG. 5 shows a light emitting device 1 according to a modification 1. This light emitting device 1 is a modified example in which the shape and position of the electrode terminal 6 are different, and other structures are the same as those in the first embodiment. In the light emitting device 1 of the first embodiment, the elongated rectangular electrode terminal 6 is arranged parallel to the parallel slit 10b at a point-symmetrical position on the electrode surface 2b. The light emitting device 1 is a rectangular covering member 3. It is arranged in the opposite corners of the above, except for the central part. Specifically, the electrode terminals 6 are arranged at two corners at point-symmetrical positions on the rectangular electrode surface 2b. The outer shape of the electrode terminal 6 is such that a notch 6a is provided at one corner of the square, and the notch 6a is arranged at a position facing each other. The pair of electrode terminals 6 are arranged with the notch portions 6a facing each other, and the electrode posts 2c are arranged between the notch portions 6a. Further, the electrode terminal 6 has two outer peripheral edges arranged on the outer peripheral edge of the covering member. The electrode terminals 6 can be arranged in a large area at the corners of the covering member 3. Therefore, the electrode terminal 6 is larger than the electrode post 2c.
<Embodiment 2>

実施形態2に係る発光装置1は、電極端子6の形状が実施形態1と異なる。図6の平面図に示すように、スクリーン印刷して実施形態1とは異なる電極端子6を電極層5の表面に形成する。スクリーン印刷は、導電ペーストを被覆部材3の特定位置に塗布した後、硬化させて電極端子6とする。この実施形態の発光装置1は、実施形態1と同じ工程で金属層9を形成した後、金属層9にレーザー光を照射して、金属層9を分割する。レーザー光を照射して設ける絶縁領域10と、電極端子6は実施形態1と異なる。レーザー光は、一対の電極層5に分割する領域と、発光装置1の対向する上下の2辺に沿って照射される。レーザー光は、金属層9を除去してスリットの絶縁領域10を設けて電極層5を分割する。さらに、図6において、発光装置1の上縁と下縁に金属層9の除去された絶縁領域10を設ける。 In the light emitting device 1 according to the second embodiment, the shape of the electrode terminal 6 is different from that of the first embodiment. As shown in the plan view of FIG. 6, screen printing is performed to form an electrode terminal 6 different from the first embodiment on the surface of the electrode layer 5. In screen printing, a conductive paste is applied to a specific position of the coating member 3 and then cured to obtain an electrode terminal 6. The light emitting device 1 of this embodiment forms the metal layer 9 in the same process as that of the first embodiment, and then irradiates the metal layer 9 with a laser beam to divide the metal layer 9. The insulating region 10 provided by irradiating the laser beam and the electrode terminal 6 are different from those in the first embodiment. The laser beam is emitted along a region divided into a pair of electrode layers 5 and two opposite upper and lower sides of the light emitting device 1. The laser beam removes the metal layer 9 to provide an insulating region 10 of the slit to divide the electrode layer 5. Further, in FIG. 6, the insulating region 10 from which the metal layer 9 has been removed is provided on the upper edge and the lower edge of the light emitting device 1.

図6の発光装置1は、金属層9を除去して形成されるスリットの絶縁領域10として、電極面2bの中央部から対角方向に伸びる傾斜スリット10aを設けている。さらに、傾斜スリット10aの両端部に連結する平行スリット10bも設けている。平行スリット10bは、互いに平行に配置されて、方形状である電極面2bの対向する2辺(図において各々の発光装置1の上下の2辺)の外周縁に沿って平行に配置される。傾斜スリット10aと平行スリット10bの連結角(α)は鋭角で、傾斜スリット10aと平行スリット10bの連結部は被覆部材3の隅部に位置する。この発光装置1は、図6において方形状である被覆部材3の両側部に、平行スリット10bに交差する方向に伸びる形状で直角三角形状又は台形状の電極層5を設けて、傾斜スリット10aの両側に一対の電極端子6を配置している。 The light emitting device 1 of FIG. 6 is provided with an inclined slit 10a extending diagonally from the central portion of the electrode surface 2b as an insulating region 10 of the slit formed by removing the metal layer 9. Further, parallel slits 10b connected to both ends of the inclined slit 10a are also provided. The parallel slits 10b are arranged in parallel with each other, and are arranged in parallel along the outer peripheral edge of two opposite sides (two upper and lower sides of each light emitting device 1 in the figure) of the rectangular electrode surface 2b. The connecting angle (α) between the inclined slit 10a and the parallel slit 10b is an acute angle, and the connecting portion between the inclined slit 10a and the parallel slit 10b is located at a corner of the covering member 3. In this light emitting device 1, right-angled triangular or trapezoidal electrode layers 5 extending in a direction extending in a direction intersecting the parallel slit 10b are provided on both sides of the covering member 3 which is rectangular in FIG. 6, and the inclined slit 10a is provided. A pair of electrode terminals 6 are arranged on both sides.

図6の発光装置1は、電極面2bの両側に所定の横幅で電極端子6を設けている。切断ラインYの両側に配置される電極端子6は、ひとつに連続して帯状に設けている。これらの電極端子6は、切断ラインYで切断して分離される。ただ、切断ラインYの両側に配置される隣接する電極端子は、図示しないが、間隔を設けて分離された状態で設けると共に、これらの間において、切断ラインYで切断することもできる。この場合、分離された電極端子の間隔は、切断ラインYの切断幅よりも広くすることが好ましい。この発光装置は、外周縁から内側に離れて電極端子が配置されるので、切断ラインYで切断する工程で、電極端子は切断されない。したがって、この発光装置は、切断ラインYで切断する工程で、電極端子6や電極層5の損傷、たとえば剥離する弊害を少なくできる。
<実施形態3>
The light emitting device 1 of FIG. 6 is provided with electrode terminals 6 having a predetermined width on both sides of the electrode surface 2b. The electrode terminals 6 arranged on both sides of the cutting line Y are continuously provided in a band shape. These electrode terminals 6 are separated by cutting along the cutting line Y. However, although adjacent electrode terminals arranged on both sides of the cutting line Y are not shown, they can be provided in a separated state at intervals, and can be cut at the cutting line Y between them. In this case, the distance between the separated electrode terminals is preferably wider than the cutting width of the cutting line Y. In this light emitting device, since the electrode terminals are arranged inward from the outer peripheral edge, the electrode terminals are not cut in the step of cutting at the cutting line Y. Therefore, this light emitting device can reduce damage to the electrode terminals 6 and the electrode layer 5, for example, harmful effects of peeling in the step of cutting along the cutting line Y.
<Embodiment 3>

実施形態3に係る発光装置1は、図7の平面図に示すように、電極層5の形状を実施形態2とは異なる形状としている。この実施形態の発光装置1は、図5に示す発光装置1と同様に金属層9にレーザー光を照射して、金属層9を分割するが、発光装置1の対向する上下の2辺に沿って形成される平行スリット10bの幅が実施形態2と異なる。図6に示す発光装置1は、電極面2bの中央部から対角方向に伸びる傾斜スリット10aの両端部に連結する平行スリット10bの幅を、傾斜スリット10aの幅よりも広くしている。言い換えると、方形状である電極面2bの両側に対向して形成される平面視台形状の電極層5の幅(図においては上下幅)を実施形態2に示す電極層5よりも狭くしている。図に示す電極層5は、その上下幅を、発光素子2の1辺よりも大きくして電極面2bの電極ポスト2cを被覆できる幅とし、かつ発光装置1の1辺の1/2以下としている。さらに、図6に示す発光装置1は、方形状である被覆部材3の対向する隅部であって中央部を除く領域に電極端子6を配置している。これらの電極端子6は、図4に示す電極端子6と同様の形状としている。図に示すように、被覆部材3の対向する隅部であって点対称の位置に配置される一対の電極端子6は、電極層5と被覆部材3の表面に跨がって形成している。
(発光モジュール11)
In the light emitting device 1 according to the third embodiment, as shown in the plan view of FIG. 7, the shape of the electrode layer 5 is different from that of the second embodiment. In the light emitting device 1 of this embodiment, the metal layer 9 is irradiated with a laser beam to divide the metal layer 9 in the same manner as the light emitting device 1 shown in FIG. 5, but the metal layer 9 is divided along two opposite sides of the light emitting device 1. The width of the parallel slit 10b formed is different from that of the second embodiment. In the light emitting device 1 shown in FIG. 6, the width of the parallel slits 10b connected to both ends of the inclined slits 10a extending diagonally from the central portion of the electrode surface 2b is wider than the width of the inclined slits 10a. In other words, the width (vertical width in the figure) of the planar viewing table-shaped electrode layer 5 formed so as to face both sides of the rectangular electrode surface 2b is made narrower than that of the electrode layer 5 shown in the second embodiment. There is. The vertical width of the electrode layer 5 shown in the figure is set to be larger than one side of the light emitting element 2 so as to be able to cover the electrode post 2c of the electrode surface 2b, and is 1/2 or less of one side of the light emitting device 1. There is. Further, in the light emitting device 1 shown in FIG. 6, the electrode terminals 6 are arranged in the opposite corners of the rectangular covering member 3 except for the central portion. These electrode terminals 6 have the same shape as the electrode terminals 6 shown in FIG. As shown in the figure, a pair of electrode terminals 6 arranged at point-symmetrical positions at opposite corners of the covering member 3 are formed so as to straddle the surface of the electrode layer 5 and the covering member 3. ..
(Light emitting module 11)

以上の工程で製造された発光装置は、以下の工程で導光板にマウントされて発光モジュールにできる。
発光モジュール11は、図8の断面図に示すように、透光性の導光板7に設けた凹部7aに発光装置1をマウントしている。絶縁性部材17を設けている発光装置1は、電極端子6と絶縁性部材17を設けた表面を安定に吸着して確実に導光板7の凹部7aにマウントできる。導光板7は、外部に光を放射する発光面となる第1主面7cの反対側の第2主面7dに凹部7aを設けている。導光板7は、所定のピッチで多数の凹部7aを設けている。各々の凹部7aには発光装置1がマウントされる。発光モジュール11は、導光板7の各々の凹部7aにマウントされた多数の発光装置1によって、第1主面7cから均一に光を放射する。
(導光板7)
The light emitting device manufactured in the above steps can be mounted on a light guide plate to form a light emitting module in the following steps.
As shown in the cross-sectional view of FIG. 8, the light emitting module 11 mounts the light emitting device 1 in the recess 7a provided in the translucent light guide plate 7. The light emitting device 1 provided with the insulating member 17 can stably adsorb the surface provided with the electrode terminal 6 and the insulating member 17 and can be reliably mounted in the recess 7a of the light guide plate 7. The light guide plate 7 is provided with a recess 7a on the second main surface 7d on the opposite side of the first main surface 7c, which is a light emitting surface that emits light to the outside. The light guide plate 7 is provided with a large number of recesses 7a at a predetermined pitch. A light emitting device 1 is mounted in each recess 7a. The light emitting module 11 uniformly emits light from the first main surface 7c by a large number of light emitting devices 1 mounted on the respective recesses 7a of the light guide plate 7.
(Light guide plate 7)

導光板7は、光源から入射される光を面状にして外部に放射する透光性の部材である。図8の導光板7は、第2主面7dに複数の凹部7aを設けて、隣接する凹部7aの間にはV溝7eを設けている。凹部7a内に発光装置1をマウントしている。導光板7は、複数の凹部7aを設けて各々の凹部7aに発光装置1を配置して発光モジュール11とし、あるいは、図示しないが、ひとつの凹部のある導光板にひとつの発光装置を配置して発光ビットとし、複数の発光ビットを平面状に配置して発光モジュールとすることができる。複数の凹部7aを設けている導光板7は、図8に示すように、凹部7aの間に格子状のV溝7eを設けている。 The light guide plate 7 is a translucent member that makes light incident from a light source planar and radiates it to the outside. The light guide plate 7 of FIG. 8 is provided with a plurality of recesses 7a on the second main surface 7d, and a V groove 7e is provided between the adjacent recesses 7a. The light emitting device 1 is mounted in the recess 7a. The light guide plate 7 is provided with a plurality of recesses 7a and a light emitting device 1 is arranged in each recess 7a to form a light emitting module 11, or one light emitting device is arranged in a light guide plate having one recess (not shown). It can be used as a light emitting bit, and a plurality of light emitting bits can be arranged in a plane to form a light emitting module. As shown in FIG. 8, the light guide plate 7 provided with the plurality of recesses 7a is provided with lattice-shaped V-grooves 7e between the recesses 7a.

V溝7eは、光を反射する、後述する光反射性部材14が設けられる。V溝7eに充填される光反射性部材14は、好ましくは光を反射する白色樹脂で、白色樹脂の光反射性部材14は、発光装置1の発光が、V溝7eで区画された隣の導光板7に入射するのを防止して、各々の発光装置1の光が隣に漏れるのを防止する。 The V-groove 7e is provided with a light-reflecting member 14 which reflects light and will be described later. The light-reflecting member 14 filled in the V-groove 7e is preferably a white resin that reflects light, and the light-reflecting member 14 of the white resin is adjacent to the light-emitting device 1 partitioned by the V-groove 7e. It prevents the light from entering the light guide plate 7 and prevents the light of each light emitting device 1 from leaking to the side.

導光板7の大きさは、凹部7aの個数によって最適な大きさに設定されるが、例えば、複数の凹部7aのある導光板7にあっては、一辺が1cm〜200cm程度とすることができ、3cm〜30cm程度が好ましい。厚みは0.1mm〜5mm程度とすることができ、0.5mm〜3mmが好ましい。導光板7の平面形状は例えば、略矩形や略円形等とすることができる。 The size of the light guide plate 7 is set to an optimum size depending on the number of recesses 7a. For example, in the light guide plate 7 having a plurality of recesses 7a, one side can be about 1 cm to 200 cm. It is preferably about 3 cm to 30 cm. The thickness can be about 0.1 mm to 5 mm, preferably 0.5 mm to 3 mm. The planar shape of the light guide plate 7 can be, for example, a substantially rectangular shape, a substantially circular shape, or the like.

導光板7の材料としては、アクリル、ポリカーボネート、環状ポリオレフィン、ポリエチレンテレフタレート、ポリエステル等の熱可塑性樹脂、エポキシ、シリコーン等の熱硬化性樹脂等の樹脂材料やガラスなどの光学的に透明な材料を用いることができる。特に、熱可塑性の樹脂材料は、射出成型によって効率よく製造することができるため、好ましい。中でも、透明性が高く、安価なポリカーボネートが好ましい。製造工程において、リフロー半田のような高温環境にさらされることなく製造される発光モジュール11は、ポリカーボネートのような熱可塑性であり耐熱性の低い材料であっても用いることができる。 As the material of the light guide plate 7, a thermoplastic resin such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate and polyester, a resin material such as a thermosetting resin such as epoxy and silicone, and an optically transparent material such as glass are used. be able to. In particular, a thermoplastic resin material is preferable because it can be efficiently produced by injection molding. Of these, polycarbonate, which has high transparency and is inexpensive, is preferable. In the manufacturing process, the light emitting module 11 manufactured without being exposed to a high temperature environment such as reflow solder can be used even if it is a thermoplastic and low heat resistant material such as polycarbonate.

導光板7は、例えば、射出成型やトランスファーモールドで成形することができる。導光板7は、凹部7aのある形状に金型で形成して、凹部7aの位置ずれを低減しながら、安価に多量生産できる。ただし、導光板7は、板状に成形した後、NC加工機等で切削加工して凹部7aを設けることもできる。 The light guide plate 7 can be molded by injection molding or transfer molding, for example. The light guide plate 7 can be mass-produced at low cost while reducing the misalignment of the recess 7a by forming the light guide plate 7 into a shape having the recess 7a with a mold. However, the light guide plate 7 may be formed into a plate shape and then machined by an NC processing machine or the like to provide a recess 7a.

本実施形態の発光モジュールの導光板は単層で形成されていてもよく、複数の透光性の層が積層されて形成されていてもよい。複数の透光性の層が積層されている場合には、任意の層間に屈折率の異なる層、例えば空気の層等を設けることが好ましい。これにより、光をより拡散させやすくなり、輝度ムラを低減した発光モジュールとすることができる。このような構成は、例えば、任意の複数の透光性の層の間にスペーサを設けて離間させ、空気の層を設けることで実現することができる。また、導光板7の第1主面7c上に透光性の層と、導光板7の第1主面7cと透光性の層の間に屈折率の異なる層、例えば空気の層等を設けてもよい。これにより、光をより拡散させやすくなり、輝度ムラを低減した液晶ディスプレイ装置とすることができる。このような構成は、例えば、任意の導光板7と透光性の層の間にスペーサを設けて離間させ、空気の層を設けることで実現することができる。 The light guide plate of the light emitting module of the present embodiment may be formed of a single layer, or may be formed by stacking a plurality of translucent layers. When a plurality of translucent layers are laminated, it is preferable to provide layers having different refractive indexes, for example, an air layer, between arbitrary layers. This makes it easier to diffuse the light, and it is possible to obtain a light emitting module with reduced luminance unevenness. Such a configuration can be realized, for example, by providing a spacer between any plurality of translucent layers to separate them and providing an air layer. Further, a layer having a different refractive index, for example, an air layer, is formed between the first main surface 7c of the light guide plate 7 and the translucent layer between the first main surface 7c of the light guide plate 7 and the translucent layer. It may be provided. As a result, it becomes easier to diffuse the light, and the liquid crystal display device with reduced luminance unevenness can be obtained. Such a configuration can be realized, for example, by providing a spacer between the arbitrary light guide plate 7 and the translucent layer to separate them, and providing an air layer.

導光板7は、第1主面7c側に、発光装置1からの光の反射や拡散機能を有する光学機能部7bを設けている。この導光板7は、発光装置1からの光を側方に広げ、導光板7の面内における発光強度を平均化させることができる。光学機能部7bは、例えば、光を導光板7の面内で広げる機能を有することができる。光学機能部7bは、例えば、第1主面7c側に設けられた円錐や四角錐、六角錐等の多角錐形等の凹み、あるいは、円錐台(図8参照)や多角錐台等の凹みである。これにより、導光板1と、光学機能部1a内にある屈折率の異なる材料(例えば空気)と凹みの傾斜面との界面で照射された光を発光素子2の側方方向に反射するものを用いることができる。また、例えば、傾斜面を有する凹みに光反射性の材料(例えば金属等の反射膜や白色の樹脂)等を設けたものであってもよい。光学機能部7bの傾斜面は、断面視において平面でもよく、曲面でもよい。さらに、光学機能部7bである凹みの深さは、前述の凹部7aの深さを考慮して決定される。すなわち、光学機能部7bと凹部7aの深さは、これらが離間している範囲で適宜設定できる。 The light guide plate 7 is provided with an optical function unit 7b having a function of reflecting and diffusing light from the light emitting device 1 on the first main surface 7c side. The light guide plate 7 can spread the light from the light emitting device 1 to the side and average the light emission intensity in the plane of the light guide plate 7. The optical function unit 7b can have, for example, a function of spreading light in the plane of the light guide plate 7. The optical functional unit 7b is, for example, a recess such as a cone, a quadrangular pyramid, or a hexagonal pyramid provided on the first main surface 7c side, or a recess such as a truncated cone (see FIG. 8) or a truncated cone. Is. As a result, the light emitted at the interface between the light guide plate 1 and the material having a different refractive index (for example, air) in the optical functional unit 1a and the inclined surface of the recess is reflected in the lateral direction of the light emitting element 2. Can be used. Further, for example, a dent having an inclined surface may be provided with a light-reflecting material (for example, a reflective film such as metal or a white resin). The inclined surface of the optical functional unit 7b may be a flat surface or a curved surface in a cross-sectional view. Further, the depth of the recess, which is the optical functional unit 7b, is determined in consideration of the depth of the recess 7a described above. That is, the depths of the optical functional unit 7b and the recess 7a can be appropriately set within a range in which they are separated from each other.

発光装置1は、図9A〜図9C及び図10A〜図10Bに示す工程で、導光板7の凹部7aにマウントされる。導光板7は、図9A及び図9Bに示すように、ポリカーボネートなどの熱可塑性樹脂を成形して、第2主面7dに凹部7aを成形して、第1主面7cには円錐台状の光学機能部7bを設けている。この導光板7の凹部7aに、発光装置1が接合される。発光装置1は、未硬化状態で液状の透光性接合部材12を塗布した凹部7aに発光面側の一部、図においては透光性部材4を厚さ方向に挿入し、透光性接合部材12を硬化させて導光板7に固着される。発光装置1は、透光性接合部材12を凹部7aの中心に正確に挿入し、透光性接合部材12を硬化させて導光板7に接合される。凹部7aに塗布される未硬化状態にある透光性接合部材12は、発光装置1を導光板7に接合する状態で、凹部7aの内側に押し出されて凹部7aに充填される。ただ、未硬化状態の透光性接合部材は、発光装置1を導光板7に接合した後、凹部7aに充填することもできる。 The light emitting device 1 is mounted in the recess 7a of the light guide plate 7 in the steps shown in FIGS. 9A to 9C and 10A to 10B. As shown in FIGS. 9A and 9B, the light guide plate 7 is formed by molding a thermoplastic resin such as polycarbonate, forming a recess 7a on the second main surface 7d, and having a truncated cone shape on the first main surface 7c. An optical function unit 7b is provided. The light emitting device 1 is joined to the recess 7a of the light guide plate 7. In the light emitting device 1, a part of the light emitting surface side, in the figure, the translucent member 4 is inserted into the recess 7a coated with the liquid translucent bonding member 12 in the uncured state in the thickness direction, and the translucent bonding is performed. The member 12 is cured and fixed to the light guide plate 7. The light emitting device 1 accurately inserts the translucent joining member 12 into the center of the recess 7a, cures the translucent joining member 12, and joins it to the light guide plate 7. The uncured transparent joining member 12 applied to the recess 7a is extruded inside the recess 7a and filled in the recess 7a in a state where the light emitting device 1 is joined to the light guide plate 7. However, the uncured translucent bonding member can be filled in the recess 7a after the light emitting device 1 is bonded to the light guide plate 7.

透光性部材4を凹部7aの底面に接合する透光性接合部材12は、未硬化状態で両者の表面に密着し、硬化して透光性部材4の表面を凹部7aの底面に接合する。さらに、透光性部材4と凹部7aの底面の間から押し出された透光性接合部材12は、透光性部材4の外周を凹部7aの内周面に接合する。この製造方法は、凹部7aに充填した未硬化で液状の透光性接合部材12を凹部7aの内部に押し出して接合する。この方法は、凹部7aに充填された透光性接合部材12を接合剤とする。 The translucent joining member 12 for joining the translucent member 4 to the bottom surface of the recess 7a is in close contact with the surfaces of both in an uncured state, and is cured to join the surface of the translucent member 4 to the bottom surface of the recess 7a. .. Further, the translucent joining member 12 extruded from between the translucent member 4 and the bottom surface of the recess 7a joins the outer periphery of the translucent member 4 to the inner peripheral surface of the recess 7a. In this manufacturing method, the uncured and liquid translucent joining member 12 filled in the recess 7a is extruded into the recess 7a and joined. In this method, the translucent bonding member 12 filled in the recess 7a is used as the bonding agent.

また、凹部7a内に塗布する透光性接合部材12の塗布量を調整することで、凹部7aの内側面と発光装置1の外側面との間の隙間から凹部7aの外側まで透光性接合部材12が押し出される。凹部7aから押し出される透光性接合部材12は、被覆部材3の側面と接する位置まで這い上がって被覆部材3の側面を被覆する。さらに、透光性接合部材12は、第2主面7dと接する位置まで広がって、第2主面7dの一部を被覆する。この状態で、透光性接合部材12の上面は、垂直断面視において、発光装置1の上端部から外側に向かって傾斜面12aが形成される。これにより、透光性接合部材12を透過して傾斜面12aに入射する光を一様な状態で発光面側に反射できる。透光性接合部材12の傾斜面12aは、被覆部材3の外側面との間でなす角を鋭角とし、好ましくは傾斜角βが5°〜85°となるように形成される。 Further, by adjusting the coating amount of the translucent bonding member 12 applied in the recess 7a, the translucent bonding is performed from the gap between the inner surface of the recess 7a and the outer surface of the light emitting device 1 to the outside of the recess 7a. The member 12 is extruded. The translucent joining member 12 extruded from the recess 7a crawls up to a position where it comes into contact with the side surface of the covering member 3 and covers the side surface of the covering member 3. Further, the translucent joining member 12 extends to a position where it comes into contact with the second main surface 7d and covers a part of the second main surface 7d. In this state, the upper surface of the translucent joining member 12 is formed with an inclined surface 12a from the upper end portion of the light emitting device 1 toward the outside in a vertical cross-sectional view. As a result, the light transmitted through the translucent joining member 12 and incident on the inclined surface 12a can be reflected toward the light emitting surface side in a uniform state. The inclined surface 12a of the translucent joining member 12 is formed so that the angle formed with the outer surface of the covering member 3 is an acute angle, and the inclination angle β is preferably 5 ° to 85 °.

さらに、透光性接合部材12は、電極端子6の側面と接する位置まで這い上がって被覆部材及び電極端子6の側面を被覆してもよい。図11に示す透光性接合部材12は、電極端子6の外側面すべてを被覆している。これにより、傾斜面12aの面積を広くしてより多くの光を反射できる。また、透光性接合部材12は、電極端子6が設けられている領域以外の電極層5及び絶縁領域10の表面を被覆してもよい。 Further, the translucent joining member 12 may crawl up to a position where it comes into contact with the side surface of the electrode terminal 6 to cover the covering member and the side surface of the electrode terminal 6. The translucent bonding member 12 shown in FIG. 11 covers the entire outer surface of the electrode terminal 6. As a result, the area of the inclined surface 12a can be widened to reflect more light. Further, the translucent bonding member 12 may cover the surfaces of the electrode layer 5 and the insulating region 10 other than the region where the electrode terminal 6 is provided.

透光性接合部材12は、傾斜面12aを、断面視において、曲面とすることもできる。図12に示す透光性接合部材12は、傾斜面12aを凹部7a側に向かって凸状となる曲面としている。この傾斜面12aは、傾斜面12aにおける反射光の進行方向を広範囲にし、輝度ムラを低減できる。 The translucent joining member 12 may have an inclined surface 12a as a curved surface in a cross-sectional view. The translucent joining member 12 shown in FIG. 12 has an inclined surface 12a having a curved surface that becomes convex toward the concave portion 7a side. The inclined surface 12a can widen the traveling direction of the reflected light on the inclined surface 12a and reduce the uneven brightness.

さらに、図12に示す光反射性部材14は、傾斜面12aが、図8に示す状態よりも導光板7の第2主面7dの外側まで被覆している。詳細には、断面視において、透光性接合部材12が第2主面7dをより多く被覆していることが好ましい。ただし、1つの導光板7が複数の発光装置1を有している場合、透光性接合部材12は、隣接する発光装置1を被覆する透光性接合部材12と接しないことが好ましい。
Further, in the light reflecting member 14 shown in FIG. 12, the inclined surface 12a covers the outside of the second main surface 7d of the light guide plate 7 more than the state shown in FIG. More specifically, in cross-sectional view, it is preferable that the translucent bonding member 12 covers the second main surface 7d more. However, when one light guide plate 7 has a plurality of light emitting devices 1, it is preferable that the translucent joining member 12 does not come into contact with the translucent joining member 12 that covers the adjacent light emitting device 1.

これにより、傾斜面12aの面積を広くしてより多くの光を反射できる。また、この図に示す透光性接合部材12も、傾斜面12aを、断面視において、凹部7a側に向かって凸状の曲面とすることで、反射光を広範囲に拡散して、輝度ムラを低減できる。 As a result, the area of the inclined surface 12a can be widened to reflect more light. Further, the translucent bonding member 12 shown in this figure also has an inclined surface 12a having a curved surface that is convex toward the concave portion 7a side in a cross-sectional view, thereby diffusing the reflected light over a wide range and causing uneven brightness. Can be reduced.

図において、透光性部材4は、発光素子2から入射される光を透過させて、発光装置1がマウントされる導光板7に光を入射する。透光性部材4は、発光モジュール11を薄型化する目的から、好ましくは、図に示すように、マウントされる導光板7の凹部7aの内側にあって、第2主面7dから表面側にはみ出ることなく凹部7a内に配置される。図8の透光性部材4は、凹部7aの深さに等しい厚さとして、その表面を第2主面7dと同一平面に配置している。ただ、図示しないが透光性部材4は、凹部の内側にあって、導光板7の第2主面からわずかに表面側に出る厚さとすることもできる。 In the figure, the translucent member 4 transmits the light incident from the light emitting element 2 and incidents the light on the light guide plate 7 on which the light emitting device 1 is mounted. The translucent member 4 is preferably located inside the recess 7a of the light guide plate 7 to be mounted, from the second main surface 7d to the surface side, as shown in the figure, for the purpose of thinning the light emitting module 11. It is arranged in the recess 7a without protruding. The surface of the translucent member 4 of FIG. 8 is arranged on the same plane as the second main surface 7d so that the thickness is equal to the depth of the recess 7a. However, although not shown, the translucent member 4 may have a thickness that is inside the recess and slightly protrudes from the second main surface of the light guide plate 7 to the surface side.

発光装置1を導光板7の凹部7aに固着した後、図9Cに示す工程で、光反射性部材14を導光板7の第2主面7dに形成する。光反射性部材14には白色樹脂が使用され、発光装置1を内部に埋設する厚さに形成される。光反射性部材14は、埋設される発光装置1の側面に密着して、互いに隣接する発光装置1同士を絶縁状態で固定する。 After the light emitting device 1 is fixed to the recess 7a of the light guide plate 7, the light reflecting member 14 is formed on the second main surface 7d of the light guide plate 7 in the step shown in FIG. 9C. A white resin is used for the light reflective member 14, and the light emitting device 1 is formed to have a thickness embedded therein. The light reflecting member 14 is in close contact with the side surface of the light emitting device 1 to be embedded, and fixes the light emitting devices 1 adjacent to each other in an insulated state.

図10Aに示す工程で、硬化した光反射性部材14の表面を研磨して、電極端子6を表面に露出させる。 In the step shown in FIG. 10A, the surface of the cured light-reflecting member 14 is polished to expose the electrode terminals 6 to the surface.

図10Bに示す工程で、光反射性部材14の表面に導電膜15を形成する。この工程では、発光装置1の電極端子6と光反射性部材14の上に、Cu/Ni/Auの金属膜を印刷、スパッタ等で形成する。 In the process shown in FIG. 10B, the conductive film 15 is formed on the surface of the light reflective member 14. In this step, a metal film of Cu / Ni / Au is formed on the electrode terminal 6 of the light emitting device 1 and the light reflecting member 14 by printing, sputtering, or the like.

複数の発光装置1は、それぞれが独立で駆動するように配線されてもよい。また、図13に示すように、導光板7を複数の範囲に分割し、1つの範囲内に実装された複数の発光装置1を1つのグループとし、該1つのグループ内の複数の発光装置1同士を直列又は並列に電気的に接続することで同じ回路に接続し、このような発光装置グループを複数備えるようにしてもよい。このようなグループ分けを行うことで、ローカルディミング可能な発光モジュール11とすることができる。図13において、導光板7には、複数の発光モジュール11が配列されており、その外側に、一対のアライメントマーク18が設けられている。アライメントマーク18は、例えば2つの離間した窪みとして設けられている。この2つの窪みの間を通る切断ラインZで、例えばZ1、Z2、Z3の順に切断することで、発光モジュール11に分割することができる。この発光モジュール11は、発光装置1が4行4列のマトリクス状に配置されている。 The plurality of light emitting devices 1 may be wired so as to be driven independently of each other. Further, as shown in FIG. 13, the light guide plate 7 is divided into a plurality of ranges, and a plurality of light emitting devices 1 mounted in one range are grouped into one group, and a plurality of light emitting devices 1 in the one group. It may be connected to the same circuit by electrically connecting them in series or in parallel, and a plurality of such light emitting device groups may be provided. By performing such grouping, the light emitting module 11 capable of local dimming can be obtained. In FIG. 13, a plurality of light emitting modules 11 are arranged on the light guide plate 7, and a pair of alignment marks 18 are provided on the outside thereof. The alignment mark 18 is provided as, for example, two separated recesses. The light emitting module 11 can be divided by cutting in the order of, for example, Z1, Z2, Z3 at the cutting line Z passing between the two recesses. In the light emitting module 11, the light emitting device 1 is arranged in a matrix of 4 rows and 4 columns.

発光モジュール11は、1つが1つの液晶ディスプレイ装置のバックライトとして用いられてもよい。また、複数の発光モジュールが並べられて1つの液晶ディスプレイ装置のバックライトとして用いられてもよい。小さい発光モジュールを複数作り、それぞれ検査等を行うことで、大きく実装される発光装置の数が多い発光モジュールを作成する場合と比べて、歩留まりを向上させることができる。 One of the light emitting modules 11 may be used as a backlight of one liquid crystal display device. Further, a plurality of light emitting modules may be arranged side by side and used as a backlight of one liquid crystal display device. By making a plurality of small light emitting modules and inspecting each of them, the yield can be improved as compared with the case of making a light emitting module having a large number of light emitting devices mounted large.

1つの発光モジュール11は1つの配線基板に接合されてもよい。また、複数の発光モジュール11が、1つの配線基板に接合されてもよい。これにより、外部との電気的な接続端子(例えばコネクタ)を集約できる(つまり、発光モジュールを1つごとに用意する必要がない)ため、液晶ディスプレイ装置の構造を簡易にすることができる。 One light emitting module 11 may be bonded to one wiring board. Further, a plurality of light emitting modules 11 may be joined to one wiring board. As a result, the electrical connection terminals (for example, connectors) to the outside can be integrated (that is, it is not necessary to prepare each light emitting module), so that the structure of the liquid crystal display device can be simplified.

また、この複数の発光モジュールが接合された1つの配線基板を複数並べて一つの液晶ディスプレイ装置のバックライトとしてもよい。この時、例えば、複数の配線基板をフレーム等に載置し、それぞれコネクタ等を用いて外部の電源と接続することができる。 Further, one wiring board to which the plurality of light emitting modules are joined may be arranged side by side to serve as a backlight of one liquid crystal display device. At this time, for example, a plurality of wiring boards can be placed on a frame or the like and each can be connected to an external power supply by using a connector or the like.

なお、導光板7上には、拡散等の機能を有する透光性の部材をさらに積層してもよい。その場合、光学機能部7bが凹みである場合には、凹みの開口(つまり、導光板7の第1主面7cに近い部分)を塞ぐが、凹みを埋めないように、透光性の部材を設けることが好ましい。これにより、光学機能部7bの凹み内に空気の層を設けることができ、発光装置1からの光を良好に広げることができる。 A translucent member having a function such as diffusion may be further laminated on the light guide plate 7. In that case, when the optical function portion 7b is a dent, the opening of the dent (that is, the portion close to the first main surface 7c of the light guide plate 7) is closed, but a translucent member is used so as not to fill the dent. It is preferable to provide. As a result, an air layer can be provided in the recess of the optical function unit 7b, and the light from the light emitting device 1 can be satisfactorily spread.

以上、本発明に係るいくつかの実施形態について例示したが、本発明は上述した実施形態に限定されるものではなく、本発明の要旨を逸脱しない限り任意のものとすることができることは言うまでもない。 Although some embodiments of the present invention have been illustrated above, it goes without saying that the present invention is not limited to the above-described embodiments and can be arbitrary as long as it does not deviate from the gist of the present invention. ..

本明細書の開示内容は、以下の態様を含み得る。
(態様1)
Disclosures of the present specification may include the following aspects.
(Aspect 1)

同一面側に一対の電極ポストを設けてなる発光素子と、
一対の前記電極ポストを設けてなる前記発光素子の電極面及び前記発光素子の側面を覆い、かつ前記電極ポストの露出部を設けてなる被覆部材と、
前記被覆部材の表面に設けられて前記電極ポストの露出部に電気接続してなる一対の電極層と、
各々の前記電極層の表面に設けられ、一対の前記電極ポストよりも大面積であって、外周縁を前記被覆部材の端部に配置してなる一対の電極端子と、
一対の前記電極端子の間に設けられ、かつ前記電極端子の側面に接してなる絶縁性部材17と、を備える発光装置。
(態様2)
A light emitting element provided with a pair of electrode posts on the same surface side,
A coating member that covers the electrode surface of the light emitting element provided with the pair of electrode posts and the side surface of the light emitting element and is provided with an exposed portion of the electrode posts.
A pair of electrode layers provided on the surface of the covering member and electrically connected to the exposed portion of the electrode post,
A pair of electrode terminals provided on the surface of each of the electrode layers, having a larger area than the pair of the electrode posts, and having an outer peripheral edge arranged at the end of the covering member.
A light emitting device including an insulating member 17 provided between a pair of electrode terminals and in contact with a side surface of the electrode terminals.
(Aspect 2)

態様1に記載する発光装置であって、
前記絶縁性部材が前記電極端子から露出する前記電極層及び前記被覆部材の表面全体を覆うことを特徴とする発光装置。
(態様3)
The light emitting device according to the first aspect.
A light emitting device characterized in that the insulating member covers the entire surface of the electrode layer and the covering member exposed from the electrode terminals.
(Aspect 3)

態様1又は2に記載する発光装置であって、
前記絶縁性部材と前記電極端子の表面が同一平面であることを特徴とする発光装置。
(態様4)
The light emitting device according to the first or second aspect.
A light emitting device characterized in that the surfaces of the insulating member and the electrode terminals are flush with each other.
(Aspect 4)

態様1ないし3のいずれかに記載する発光装置であって、
前記絶縁性部材が透光性を有し、
前記絶縁性部材の内側に前記電極ポストが配置されてなることを特徴とする発光装置。
(態様5)
The light emitting device according to any one of aspects 1 to 3.
The insulating member has translucency and
A light emitting device characterized in that the electrode post is arranged inside the insulating member.
(Aspect 5)

態様1ないし4のいずれかに記載する発光装置であって、
前記電極端子が前記電極層よりも厚いことを特徴とする発光装置。
(態様6)
The light emitting device according to any one of aspects 1 to 4.
A light emitting device characterized in that the electrode terminals are thicker than the electrode layer.
(Aspect 6)

態様5に記載する発光装置であって、
前記電極端子の厚さが前記電極層の厚さの10倍以上であることを特徴とする発光装置。
(態様7)
The light emitting device according to the fifth aspect.
A light emitting device characterized in that the thickness of the electrode terminal is 10 times or more the thickness of the electrode layer.
(Aspect 7)

態様1ないし6のいずれかに記載する発光装置であって
一対の前記電極ポストを設けてなる前記発光素子の前記電極面が方形状で、
一対の前記電極端子が、前記電極面の外周縁の対称位置に配置されてなることを特徴とする発光装置。
(態様8)
The light emitting device according to any one of aspects 1 to 6, wherein the electrode surface of the light emitting element provided with the pair of the electrode posts is rectangular.
A light emitting device characterized in that a pair of the electrode terminals are arranged at symmetrical positions on the outer peripheral edge of the electrode surface.
(Aspect 8)

態様1ないし7のいずれかに記載する発光装置と、
外部に光を放射する発光面となる第1主面の反対側の第2主面に凹部を設けてなる透光性の導光板と、を備え、
前記発光装置が、前記導光板の前記凹部に配置されてなる発光モジュール。
(態様9)
The light emitting device according to any one of aspects 1 to 7.
A translucent light guide plate having a recess on the second main surface opposite to the first main surface, which is a light emitting surface that emits light to the outside, is provided.
A light emitting module in which the light emitting device is arranged in the recess of the light guide plate.
(Aspect 9)

同一面側に一対の電極ポストを備えた発光素子を被覆部材で覆い、前記被覆部材に前記電極ポストの露出部を設けてなる中間体を準備する工程と、
前記中間体の前記電極ポストの露出部に電気接続する一対の電極層を形成する工程と、
一対の前記電極層に電気接続する一対の電極端子を、一対の前記電極ポストよりも大面積で、外周縁を被覆部材の端部に設ける工程と、
一対の前記電極端子の間に、前記電極端子の側面に接する絶縁性部材を形成する工程と、
を含む発光装置の製造方法。
[態様9の効果]
A step of covering a light emitting element having a pair of electrode posts on the same surface side with a covering member and preparing an intermediate formed by providing an exposed portion of the electrode posts on the covering member.
A step of forming a pair of electrode layers electrically connected to an exposed portion of the electrode post of the intermediate, and
A step of providing a pair of electrode terminals electrically connected to the pair of electrode layers in a larger area than the pair of electrode posts and providing an outer peripheral edge at an end portion of the covering member.
A step of forming an insulating member in contact with the side surface of the electrode terminals between the pair of electrode terminals,
A method for manufacturing a light emitting device including.
[Effect of aspect 9]

以上の方法で製造される発光装置は、小型化しながら確実に安定して発光装置にマウントして能率よく多量生産できる特徴がある。それは、発光素子の電極ポストに、電極層を介して電極端子を電気接続する構造とし、さらに電極端子を電極ポストより大面積として、被覆部材の端部に配置して、電極端子の間で、電極端子の側面に接しているからである。電極端子の間に設けられた絶縁性部材は、電極端子と電極層と被覆部材とを接合して、電極端子や電極層の剥離を防止する。したがって、多数の発光装置をパーツとして発光モジュールを製造する工程において、発光装置の損傷を防止して発光モジュールを能率よく多量生産できる。さらに、絶縁性部材は電極層から突出している電極端子による表面の凹凸を少なくするので、表面を吸着するなどの方法で安定して確実に搬送して能率よく組み立てできる特徴も実現する。 The light emitting device manufactured by the above method has a feature that it can be reliably and stably mounted on the light emitting device while being miniaturized and can be efficiently mass-produced. It has a structure in which the electrode terminals are electrically connected to the electrode posts of the light emitting element via an electrode layer, and the electrode terminals are arranged at the ends of the covering member with a larger area than the electrode posts, and between the electrode terminals. This is because it is in contact with the side surface of the electrode terminal. The insulating member provided between the electrode terminals joins the electrode terminal, the electrode layer, and the covering member to prevent peeling of the electrode terminal and the electrode layer. Therefore, in the process of manufacturing a light emitting module using a large number of light emitting devices as parts, damage to the light emitting device can be prevented and the light emitting module can be efficiently mass-produced. Further, since the insulating member reduces the unevenness of the surface due to the electrode terminals protruding from the electrode layer, it also realizes a feature that the surface can be stably and surely conveyed and efficiently assembled by a method such as adsorption.

さらにまた、発光装置は、間隔の広い電極端子間に絶縁性部材を接合する構造によって、端子間ショート等の弊害を確実に阻止しながら外部接続できる。 Furthermore, the light emitting device can be externally connected while reliably preventing adverse effects such as short circuit between terminals due to a structure in which an insulating member is joined between electrode terminals having a wide interval.

また厚い電極端子の発光装置は、発光装置にマウントする工程で、確実に安定して電気接続できる特徴もある。発光装置が発光モジュールにマウントされる工程で、発光装置はプラスチック等の光反射性部材に埋設される。埋設された発光装置は、光反射性部材を研磨して電極端子を露出し、露出する電極端子に導電膜を電気接続している。厚い電極端子は、光反射性部材の研磨工程で破損されることがなく、表面部分の一部が研磨されて光反射性部材と均一な同一平面となって導電膜が形成される。
(態様10)
Further, the light emitting device having a thick electrode terminal has a feature that it can be reliably and stably electrically connected in the process of mounting on the light emitting device. In the process of mounting the light emitting device on the light emitting module, the light emitting device is embedded in a light reflecting member such as plastic. In the embedded light emitting device, the light reflecting member is polished to expose the electrode terminals, and the conductive film is electrically connected to the exposed electrode terminals. The thick electrode terminal is not damaged in the polishing process of the light-reflecting member, and a part of the surface portion is polished to form a uniform plane with the light-reflecting member to form a conductive film.
(Aspect 10)

態様9に記載する発光装置の製造方法であって、
前記中間体を準備する工程において、
複数の前記発光素子を被覆部材で覆い、前記電極層を形成する工程と前記電極端子を形成する工程において、
複数の前記発光素子の前記電極ポストに接続して前記電極層、及び前記電極端子を形成し、
前記絶縁性部材を形成する工程の後に、
前記発光素子間の前記被覆部材、前記電極層、前記電極端子を切断して発光装置に分離する工程を有する、
発光装置の製造方法。
(態様11)
The method for manufacturing a light emitting device according to the ninth aspect.
In the step of preparing the intermediate
In the steps of covering the plurality of light emitting elements with a covering member to form the electrode layer and forming the electrode terminals,
The electrode layer and the electrode terminal are formed by connecting to the electrode posts of the plurality of light emitting elements.
After the step of forming the insulating member,
It has a step of cutting the covering member, the electrode layer, and the electrode terminal between the light emitting elements and separating them into a light emitting device.
Manufacturing method of light emitting device.
(Aspect 11)

態様9又は10に記載する発光装置の製造方法であって、
前記絶縁性部材を前記電極端子から露出する前記電極層及び前記被覆部材の表面全体に形成することを特徴とする発光装置の製造方法。
(態様12)
The method for manufacturing a light emitting device according to aspect 9 or 10.
A method for manufacturing a light emitting device, which comprises forming the insulating member on the entire surface of the electrode layer and the covering member exposed from the electrode terminals.
(Aspect 12)

態様11に記載する発光装置の製造方法であって、
前記絶縁性部材と前記電極端子の表面を同一平面とすることを特徴とする発光装置の製造方法。
(態様13)
The method for manufacturing a light emitting device according to the eleventh aspect.
A method for manufacturing a light emitting device, wherein the surface of the insulating member and the surface of the electrode terminal are flush with each other.
(Aspect 13)

態様12に記載する発光装置の製造方法であって、
前記電極端子を埋設する状態で前記絶縁性部材17を設けた後、
前記絶縁性部材の表面を研磨又は切削して前記絶縁性部材17の表面を前記電極端子と同一平面とすることを特徴とする発光装置の製造方法。
(態様14)
A method for manufacturing a light emitting device according to aspect 12.
After providing the insulating member 17 in a state where the electrode terminals are embedded,
A method for manufacturing a light emitting device, which comprises polishing or cutting the surface of the insulating member to make the surface of the insulating member 17 flush with the electrode terminals.
(Aspect 14)

態様11ないし13のいずれかに記載する発光装置の製造方法であって、
前記絶縁性部材を、前記発光素子表面の前記被覆部材と、前記電極層と、前記電極端子とに接合することを特徴とする発光装置の製造方法。
(態様15)
A method for manufacturing a light emitting device according to any one of aspects 11 to 13.
A method for manufacturing a light emitting device, which comprises joining the insulating member to the covering member on the surface of the light emitting element, the electrode layer, and the electrode terminal.
(Aspect 15)

態様11ないし14のいずれかに記載する発光装置の製造方法であって、
前記絶縁性部材として透光性の材料を準備し、
前記電極ポストを埋設する状態で前記絶縁性部材を接合して、前記電極ポストを前記絶縁性部材の内側に配置することを特徴とする発光装置の製造方法。
(態様16)
The method for manufacturing a light emitting device according to any one of aspects 11 to 14.
A translucent material is prepared as the insulating member, and the material is prepared.
A method for manufacturing a light emitting device, which comprises joining the insulating member in a state where the electrode post is embedded and arranging the electrode post inside the insulating member.
(Aspect 16)

態様11ないし15のいずれかに記載する発光装置の製造方法であって、
前記電極端子の厚さを、前記電極層よりも厚くすることを特徴とする発光装置の製造方法。
(態様17)
The method for manufacturing a light emitting device according to any one of aspects 11 to 15.
A method for manufacturing a light emitting device, characterized in that the thickness of the electrode terminal is made thicker than that of the electrode layer.
(Aspect 17)

態様10又は16に記載する発光装置の製造方法であって、
前記電極層を金属の薄膜とし、前記電極層の表面に導電ペーストを塗布して前記電極端子を設けることを特徴とする発光装置の製造方法。
(態様18)
The method for manufacturing a light emitting device according to aspect 10 or 16.
A method for manufacturing a light emitting device, which comprises forming the electrode layer as a thin metal film, applying a conductive paste to the surface of the electrode layer, and providing the electrode terminals.
(Aspect 18)

態様10ないし17のいずれかに記載する方法で製造した発光装置と、
発光面となる第1主面と、前記第1主面と反対側にあって凹部を設けてなる第2主面と
を備える導光板と、
を準備する工程と、
前記発光装置を前記凹部に固着する工程と、
前記導光板の前記第2主面に、前記発光装置を埋設する光反射性部材を設ける工程と、
前記光反射性部材を研磨して前記電極端子を露出し、該露出する電極端子の表面に導電膜を形成する工程と、
を含む発光モジュールの製造方法。
A light emitting device manufactured by the method according to any one of aspects 10 to 17.
A light guide plate including a first main surface serving as a light emitting surface and a second main surface on the opposite side of the first main surface and having a recess.
And the process of preparing
The step of fixing the light emitting device to the recess and
A step of providing a light reflecting member for embedding the light emitting device on the second main surface of the light guide plate, and
A step of polishing the light-reflecting member to expose the electrode terminals and forming a conductive film on the surface of the exposed electrode terminals.
A method of manufacturing a light emitting module including.

本発明の発光装置、発光モジュール、発光装置及び発光モジュールの製造方法は面状体として有効に利用できる。 The light emitting device, the light emitting module, the light emitting device, and the method for manufacturing the light emitting module of the present invention can be effectively used as a planar body.

1、1D、1E…発光装置
2…発光素子
2a…積層構造体
2b…電極面
2c…電極ポスト
2d…光放射面
3…被覆部材
4…透光性部材
5…電極層
5A…幅広部
5B…幅狭部
6…電極端子
6a…切欠部
7…導光板
7a…凹部
7b…光学機能部
7c…第1主面
7d…第2主面
7e…V溝
8…中間体
9…金属層
10…絶縁領域
10a…傾斜スリット
10b…平行スリット
10c…分割スリット
11…発光モジュール
12…透光性接合部材
12a…傾斜面
14…反射性部材
15…導電膜
16…透光性接着部材
17…絶縁性部材
18…アライメントマーク
30…支持部材
X…切断ライン
Y…切断ライン
Z…切断ライン
1, 1D, 1E ... Light emitting device 2 ... Light emitting element 2a ... Laminated structure 2b ... Electrode surface 2c ... Electrode post 2d ... Light emitting surface 3 ... Covering member 4 ... Translucent member 5 ... Electrode layer 5A ... Wide portion 5B ... Narrow portion 6 ... Electrode terminal 6a ... Notch portion 7 ... Light guide plate 7a ... Recessed portion 7b ... Optical function portion 7c ... First main surface 7d ... Second main surface 7e ... V groove 8 ... Intermediate 9 ... Metal layer 10 ... Insulation Region 10a ... Inclined slit 10b ... Parallel slit 10c ... Divided slit 11 ... Light emitting module 12 ... Translucent joining member 12a ... Inclined surface 14 ... Light reflective member 15 ... Conductive electrode 16 ... Translucent adhesive member 17 ... Insulating member 18 ... Alignment mark 30 ... Support member X ... Cutting line Y ... Cutting line Z ... Cutting line

Claims (26)

同一面側に一対の電極ポストを設けてなる発光素子と、
一対の前記電極ポストを設けてなる前記発光素子の電極面及び前記発光素子の側面を覆い、かつ前記電極ポストの露出部を設けてなる被覆部材と、
前記被覆部材の表面に設けられて前記電極ポストの露出部に電気接続してなる一対の電極層と、
各々の前記電極層の表面に設けられ、一対の前記電極ポストよりも大面積であって、外周縁を前記被覆部材の端部に配置してなる一対の電極端子と、
一対の前記電極端子の間に設けられ、かつ前記電極端子の側面に接してなる絶縁性部材と、
を備えており、
前記電極端子の外周縁が、前記被覆部材の外周縁と同一平面状に形成されてなる発光装置。
A light emitting element provided with a pair of electrode posts on the same surface side,
A coating member that covers the electrode surface of the light emitting element provided with the pair of electrode posts and the side surface of the light emitting element and is provided with an exposed portion of the electrode posts.
A pair of electrode layers provided on the surface of the covering member and electrically connected to the exposed portion of the electrode post,
A pair of electrode terminals provided on the surface of each of the electrode layers, having a larger area than the pair of the electrode posts, and having an outer peripheral edge arranged at the end of the covering member.
An insulating member provided between the pair of electrode terminals and in contact with the side surface of the electrode terminals.
Equipped with a,
A light emitting device in which the outer peripheral edge of the electrode terminal is formed in the same plane as the outer peripheral edge of the covering member .
同一面側に一対の電極ポストを設けてなる発光素子と、
一対の前記電極ポストを設けてなる前記発光素子の電極面及び前記発光素子の側面を覆い、かつ前記電極ポストの露出部を設けてなる被覆部材と、
前記被覆部材の表面に設けられて前記電極ポストの露出部に電気接続してなる一対の電極層と、
各々の前記電極層の表面に設けられ、一対の前記電極ポストよりも大面積であって、外周縁を前記被覆部材の端部に配置してなる一対の電極端子と、
一対の前記電極端子の間に設けられ、かつ前記電極端子の側面に接してなる絶縁性部材と、
を備えており、
前記電極端子が一定の厚みを有し、かつ金属粉末と硬化されたポリマーを含んでなり、前記電極層が金属からなる発光装置。
A light emitting element provided with a pair of electrode posts on the same surface side,
A coating member that covers the electrode surface of the light emitting element provided with the pair of electrode posts and the side surface of the light emitting element and is provided with an exposed portion of the electrode posts.
A pair of electrode layers provided on the surface of the covering member and electrically connected to the exposed portion of the electrode post,
A pair of electrode terminals provided on the surface of each of the electrode layers, having a larger area than the pair of the electrode posts, and having an outer peripheral edge arranged at the end of the covering member.
An insulating member provided between the pair of electrode terminals and in contact with the side surface of the electrode terminals.
Is equipped with
A light emitting device in which the electrode terminals have a certain thickness and contain a metal powder and a cured polymer, and the electrode layer is made of metal .
請求項1又は2に記載する発光装置であって、 The light emitting device according to claim 1 or 2.
前記被覆部材が、一対の前記電極層間にレーザー損傷領域を有する発光装置。 A light emitting device in which the covering member has a laser damage region between the pair of electrode layers.
同一面側に一対の電極ポストを設けてなる発光素子と、 A light emitting element provided with a pair of electrode posts on the same surface side,
一対の前記電極ポストを設けてなる前記発光素子の電極面及び前記発光素子の側面を覆い、かつ前記電極ポストの露出部を設けてなる被覆部材と、 A coating member that covers the electrode surface of the light emitting element provided with the pair of electrode posts and the side surface of the light emitting element and is provided with an exposed portion of the electrode posts.
前記被覆部材の表面に設けられて前記電極ポストの露出部に電気接続してなる一対の電極層と、 A pair of electrode layers provided on the surface of the covering member and electrically connected to the exposed portion of the electrode post,
各々の前記電極層の表面に設けられ、一対の前記電極ポストよりも大面積であって、外周縁を前記被覆部材の端部に配置してなる一対の電極端子と、 A pair of electrode terminals provided on the surface of each of the electrode layers, having a larger area than the pair of the electrode posts, and having an outer peripheral edge arranged at the end of the covering member.
一対の前記電極端子の間に設けられ、かつ前記電極端子の側面に接してなる絶縁性部材と、 An insulating member provided between the pair of electrode terminals and in contact with the side surface of the electrode terminals.
を備えており、Is equipped with
前記被覆部材が、一対の前記電極層間にレーザー損傷領域を有する発光装置。 A light emitting device in which the covering member has a laser damage region between the pair of electrode layers.
請求項1ないし4のいずれか一項に記載する発光装置であって、
前記絶縁性部材が前記電極端子から露出する前記電極層及び前記被覆部材の表面全体を覆う発光装置。
The light emitting device according to any one of claims 1 to 4 .
A light emitting device that covers the entire surface of the electrode layer and the covering member with the insulating member exposed from the electrode terminals.
請求項1ないし5のいずれか一項に記載する発光装置であって、
前記絶縁性部材と前記電極端子の表面が同一平面である発光装置。
The light emitting device according to any one of claims 1 to 5 .
A light emitting device in which the surfaces of the insulating member and the electrode terminals are flush with each other.
請求項1ないしのいずれか一項に記載する発光装置であって、
前記絶縁性部材が透光性を有し、
前記絶縁性部材の内側に前記電極ポストが配置されてなる発光装置。
The light emitting device according to any one of claims 1 to 6 .
The insulating member has translucency and
A light emitting device in which the electrode post is arranged inside the insulating member.
請求項1ないしのいずれか一項に記載する発光装置であって、
前記電極端子が前記電極層よりも厚い発光装置。
The light emitting device according to any one of claims 1 to 7 .
A light emitting device in which the electrode terminals are thicker than the electrode layer.
請求項に記載する発光装置であって、
前記電極端子の厚さが前記電極層の厚さの10倍以上である発光装置。
The light emitting device according to claim 8 .
A light emitting device in which the thickness of the electrode terminal is 10 times or more the thickness of the electrode layer.
請求項1ないしのいずれか一項に記載する発光装置であって
一対の前記電極ポストを設けてなる前記発光素子の前記電極面が方形状で、
一対の前記電極端子が、前記電極面の外周縁の対称位置に配置されてなる発光装置。
The light emitting device according to any one of claims 1 to 9 , wherein the electrode surface of the light emitting element provided with the pair of the electrode posts is rectangular.
A light emitting device in which a pair of the electrode terminals are arranged at symmetrical positions on the outer peripheral edge of the electrode surface.
請求項1ないし10のいずれか一項に記載する発光装置であって、 The light emitting device according to any one of claims 1 to 10.
前記電極層の膜厚が、5nm以上100nm以下である発光装置。 A light emitting device having a film thickness of the electrode layer of 5 nm or more and 100 nm or less.
請求項1ないし11のいずれか一項に記載する発光装置と、
外部に光を放射する発光面となる第1主面の反対側の第2主面に凹部を設けてなる透光性の導光板と、を備え、
前記発光装置が、前記導光板の前記凹部に配置されてなる発光モジュール。
The light emitting device according to any one of claims 1 to 11 .
A translucent light guide plate having a recess on the second main surface opposite to the first main surface, which is a light emitting surface that emits light to the outside, is provided.
A light emitting module in which the light emitting device is arranged in the recess of the light guide plate.
同一面側に一対の電極ポストを備えた発光素子を被覆部材で覆い、前記被覆部材に前記電極ポストの露出部を設けてなる中間体を準備する工程と、
前記中間体の前記電極ポストの露出部に電気接続する一対の電極層を形成する工程と、
一対の前記電極層に電気接続する一対の電極端子を、一対の前記電極ポストよりも大面積で、外周縁を被覆部材の端部に設ける工程と、
一対の前記電極端子の間に、前記電極端子の側面に接する絶縁性部材を形成する工程と、
前記電極端子の外周縁が、前記被覆部材の外周縁と同一平面となるように形成する工程と、
を含む発光装置の製造方法。
A step of covering a light emitting element having a pair of electrode posts on the same surface side with a covering member and preparing an intermediate formed by providing an exposed portion of the electrode posts on the covering member.
A step of forming a pair of electrode layers electrically connected to an exposed portion of the electrode post of the intermediate, and
A step of providing a pair of electrode terminals electrically connected to the pair of electrode layers in a larger area than the pair of electrode posts and providing an outer peripheral edge at an end portion of the covering member.
A step of forming an insulating member in contact with the side surface of the electrode terminals between the pair of electrode terminals,
A step of forming the outer peripheral edge of the electrode terminal so as to be flush with the outer peripheral edge of the covering member.
A method for manufacturing a light emitting device including.
同一面側に一対の電極ポストを備えた発光素子を被覆部材で覆い、前記被覆部材に前記電極ポストの露出部を設けてなる中間体を準備する工程と、 A step of covering a light emitting element having a pair of electrode posts on the same surface side with a covering member and preparing an intermediate formed by providing an exposed portion of the electrode posts on the covering member.
前記中間体の前記電極ポストの露出部に電気接続する金属からなる一対の電極層を形成する工程と、 A step of forming a pair of electrode layers made of metal that are electrically connected to the exposed portion of the electrode post of the intermediate.
一対の前記電極層に電気接続する一対の電極端子を、一対の前記電極ポストよりも大面積で、外周縁を被覆部材の端部に設ける工程と、 A step of providing a pair of electrode terminals electrically connected to the pair of electrode layers in a larger area than the pair of electrode posts and providing an outer peripheral edge at an end portion of the covering member.
一対の前記電極端子の間に、前記電極端子の側面に接する絶縁性部材を形成する工程と、 A step of forming an insulating member in contact with the side surface of the electrode terminals between the pair of electrode terminals,
を含み、Including
前記電極端子を設ける工程において、金属粉末をバインダーであるポリマーに混合した混合物を前記電極層の表面に一定の厚みで塗布し、該混合物を硬化させて前記電極端子を設ける発光装置の製造方法。 A method for manufacturing a light emitting device in which a mixture of a metal powder mixed with a polymer as a binder is applied to the surface of the electrode layer to a certain thickness in the step of providing the electrode terminals, and the mixture is cured to provide the electrode terminals.
請求項13又は14に記載する発光装置の製造方法であって、 The method for manufacturing a light emitting device according to claim 13 or 14.
前記電極層を形成する工程において、 In the step of forming the electrode layer,
前記被覆部材の表面に金属層を形成し、前記金属層にレーザー光を照射して該金属層の一部を除去し、一対の前記電極層に分離すると共に、 A metal layer is formed on the surface of the covering member, the metal layer is irradiated with laser light to remove a part of the metal layer, and the metal layer is separated into a pair of electrode layers.
前記金属層の一部が除去された前記被覆部材の一対の前記電極層間に、レーザー損傷領域を形成する発光装置の製造方法。 A method for manufacturing a light emitting device in which a laser-damaged region is formed between a pair of electrode layers of the covering member from which a part of the metal layer has been removed.
同一面側に一対の電極ポストを備えた発光素子を被覆部材で覆い、前記被覆部材に前記電極ポストの露出部を設けてなる中間体を準備する工程と、 A step of covering a light emitting element having a pair of electrode posts on the same surface side with a covering member and preparing an intermediate formed by providing an exposed portion of the electrode posts on the covering member.
前記中間体の前記電極ポストの露出部に電気接続する一対の電極層を形成する工程と、 A step of forming a pair of electrode layers electrically connected to an exposed portion of the electrode post of the intermediate, and
一対の前記電極層に電気接続する一対の電極端子を、一対の前記電極ポストよりも大面積で、外周縁を被覆部材の端部に設ける工程と、 A step of providing a pair of electrode terminals electrically connected to the pair of electrode layers in a larger area than the pair of electrode posts and providing an outer peripheral edge at an end portion of the covering member.
一対の前記電極端子の間に、前記電極端子の側面に接する絶縁性部材を形成する工程と、 A step of forming an insulating member in contact with the side surface of the electrode terminals between the pair of electrode terminals,
を含み、Including
前記電極層を形成する工程において、 In the step of forming the electrode layer,
前記被覆部材の表面に金属層を形成し、前記金属層にレーザー光を照射して該金属層の一部を除去し、一対の前記電極層に分離すると共に、 A metal layer is formed on the surface of the covering member, the metal layer is irradiated with laser light to remove a part of the metal layer, and the metal layer is separated into a pair of electrode layers.
前記金属層の一部が除去された前記被覆部材の一対の前記電極層間に、レーザー損傷領域を形成する発光装置の製造方法。 A method for manufacturing a light emitting device in which a laser-damaged region is formed between a pair of electrode layers of the covering member from which a part of the metal layer has been removed.
請求項13ないし16のいずれか一項に記載する発光装置の製造方法であって、
前記中間体を準備する工程において、
複数の前記発光素子を被覆部材で覆い、前記電極層を形成する工程と前記電極端子を形成する工程において、
複数の前記発光素子の前記電極ポストに接続して前記電極層、及び前記電極端子を形成し、
前記絶縁性部材を形成する工程の後に、
前記発光素子間の前記被覆部材、前記電極層、前記電極端子を切断して発光装置に分離する工程を有する、
発光装置の製造方法。
The method for manufacturing a light emitting device according to any one of claims 13 to 16 .
In the step of preparing the intermediate
In the steps of covering the plurality of light emitting elements with a covering member to form the electrode layer and forming the electrode terminals,
The electrode layer and the electrode terminal are formed by connecting to the electrode posts of the plurality of light emitting elements.
After the step of forming the insulating member,
It has a step of cutting the covering member, the electrode layer, and the electrode terminal between the light emitting elements and separating them into a light emitting device.
Manufacturing method of light emitting device.
請求項13ないし17のいずれか一項に記載する発光装置の製造方法であって、
前記絶縁性部材を前記電極端子から露出する前記電極層及び前記被覆部材の表面全体に形成する発光装置の製造方法。
The method for manufacturing a light emitting device according to any one of claims 13 to 17 .
A method for manufacturing a light emitting device in which the insulating member is formed on the entire surface of the electrode layer and the covering member exposed from the electrode terminals.
請求項18に記載する発光装置の製造方法であって、
前記絶縁性部材と前記電極端子の表面を同一平面とする発光装置の製造方法。
The method for manufacturing a light emitting device according to claim 18 .
A method for manufacturing a light emitting device in which the surfaces of the insulating member and the electrode terminals are flush with each other.
請求項19に記載する発光装置の製造方法であって、
前記電極端子を埋設する状態で前記絶縁性部材を設けた後、
前記絶縁性部材の表面を研磨又は切削して前記絶縁性部材の表面を前記電極端子と同一平面とする発光装置の製造方法。
The method for manufacturing a light emitting device according to claim 19 .
After providing the insulating member with the electrode terminals embedded,
A method for manufacturing a light emitting device in which the surface of the insulating member is polished or cut so that the surface of the insulating member is flush with the electrode terminals.
請求項13ないし20のいずれか一項に記載する発光装置の製造方法であって、
前記絶縁性部材を、前記発光素子表面の前記被覆部材と、前記電極層と、前記電極端子とに接合する発光装置の製造方法。
The method for manufacturing a light emitting device according to any one of claims 13 to 20 .
A method for manufacturing a light emitting device in which the insulating member is bonded to the covering member on the surface of the light emitting element, the electrode layer, and the electrode terminal.
請求項13ないし21のいずれか一項に記載する発光装置の製造方法であって、
前記絶縁性部材として透光性の材料を準備し、
前記電極ポストを埋設する状態で前記絶縁性部材を接合して、前記電極ポストを前記絶縁性部材の内側に配置する発光装置の製造方法。
The method for manufacturing a light emitting device according to any one of claims 13 to 21 .
A translucent material is prepared as the insulating member, and the material is prepared.
A method for manufacturing a light emitting device in which the insulating member is joined in a state where the electrode post is embedded and the electrode post is arranged inside the insulating member.
請求項13ないし22のいずれか一項に記載する発光装置の製造方法であって、
前記電極端子の厚さを、前記電極層よりも厚くする発光装置の製造方法。
The method for manufacturing a light emitting device according to any one of claims 13 to 22 .
A method for manufacturing a light emitting device in which the thickness of the electrode terminal is made thicker than that of the electrode layer.
請求項13に記載する発光装置の製造方法であって、
前記電極層を金属の薄膜とし、前記電極層の表面に導電ペーストを塗布して前記電極端子を設ける発光装置の製造方法。
The method for manufacturing a light emitting device according to claim 13 .
A method for manufacturing a light emitting device in which the electrode layer is made of a metal thin film, a conductive paste is applied to the surface of the electrode layer, and the electrode terminals are provided.
請求項13ないし24のいずれか一項に記載する発光装置の製造方法であって、 The method for manufacturing a light emitting device according to any one of claims 13 to 24.
前記金属層の膜厚が、5nm以上100nm以下である発光装置の製造方法。 A method for manufacturing a light emitting device in which the film thickness of the metal layer is 5 nm or more and 100 nm or less.
請求項13ないし25のいずれか一項に記載する方法で製造した発光装置と、
発光面となる第1主面と、前記第1主面と反対側にあって凹部を設けてなる第2主面と
を備える導光板と、
を準備する工程と、
前記発光装置を前記凹部に固着する工程と、
前記導光板の前記第2主面に、前記発光装置を埋設する光反射性部材を設ける工程と、
前記光反射性部材を研磨して前記電極端子を露出し、該露出する電極端子の表面に導電膜を形成する工程と、
を含む発光モジュールの製造方法。
A light emitting device manufactured by the method according to any one of claims 13 to 25 .
A light guide plate including a first main surface serving as a light emitting surface and a second main surface on the opposite side of the first main surface and having a recess.
And the process of preparing
The step of fixing the light emitting device to the recess and
A step of providing a light reflecting member for embedding the light emitting device on the second main surface of the light guide plate, and
A step of polishing the light-reflecting member to expose the electrode terminals and forming a conductive film on the surface of the exposed electrode terminals.
A method of manufacturing a light emitting module including.
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