JP6780996B2 - Wiring boards, electronics and electronic modules - Google Patents

Description

The present invention relates to wiring boards, electronic devices and electronic modules.

Conventionally, wiring boards and electronic devices in which electronic components are mounted on the main surface of an insulating substrate made of ceramics are known (see, for example, Patent Document 1).

In such a wiring board, the insulating substrate has a recess on one main surface for accommodating and mounting electronic components, and has an external electrode on the other main surface.

The external electrodes are arranged so as to overlap the side walls of the recesses in plan perspective.

Japanese Unexamined Patent Publication No. 2001-68577

However, in recent years, electronic devices have become thinner and smaller, and the width of the side wall of the recess has become smaller. With the increasing functionality of electronic devices, when they are connected to an external circuit board and operated, the electronic components generate heat and heat is transferred to the wiring board, and stress is applied to the external electrodes due to the thermal expansion of the wiring board, resulting in a flat surface. The side wall of the recess that overlaps with the external electrode is likely to be distorted by fluoroscopy, and there is a concern that the sealing material sealed in the recess 12 or the lid placed on the side wall may be peeled off.

According to one aspect of the present invention, the wiring board has a recess including a mounting portion for mounting an electronic component on one main surface, and a frame-shaped region provided on the side wall of the recess on the one main surface. An insulating substrate having a rectangular shape in a plan view, a wiring conductor provided in the recess, and an external electrode provided in the other main surface facing the one main surface and connected to the wiring conductor, and the above in a plan view. has a stepped frame-shaped located on the inside of the frame-shaped region, in a plan perspective, the external electrodes and the inner edge of the inner edge and the stepped of the frame-like area so as not to overlap with the frame-like area It is located in between . Further, a insulating substrate having a concave portion including a mounting portion for mounting an electronic component on one main surface and a frame-shaped region provided on the side wall of the concave portion on the one main surface, and a rectangular insulating substrate in a plan view, and the above-mentioned It has a wiring conductor provided in the recess and an external electrode provided on the other main surface facing the one main surface and connected to the wiring conductor. In plan perspective, the external electrode has a frame shape. It is arranged inside the frame-shaped region so as not to overlap the region, and the inner region inside the frame-shaped region on the other main surface is concave on one main surface side.

According to one aspect of the present invention, the electronic device has a wiring board having the above configuration and electronic components mounted on the wiring board.

According to one aspect of the present invention, the electronic module has a module substrate having a connection pad and an electronic device having the above configuration connected to the connection pad via solder.

According to the wiring board according to one aspect of the present invention, the upper Symbol structure to connect the external electrodes to the external circuit board, when actuated, even stress is applied to the external electrodes, the frame-shaped region stress Is difficult to apply, and distortion of the side wall of the recess is suppressed, so that the sealing material sealed in the recess or the lid arranged on the side wall of the recess can be suppressed from peeling off.

According to the electronic device according to an embodiment of the present invention, the wiring board having the above structure, by having a mounting electronic components on the wiring board, and is excellent in excellent long-term reliability airtightness can do.

According to the electronic module according to one aspect of the present invention, a module substrate having a connection pad and an electronic device having the above configuration connected to the connection pad via solder are provided, thereby having excellent long-term reliability. Can be.

(A) is a top view showing an electronic device according to the first embodiment of the present invention, and (b) is a bottom view of (a). (A) is a vertical cross-sectional view of the electronic device shown in FIG. 1 (a) along the line AA, and (b) is an enlarged vertical cross-sectional view of a main part of the part B of (a). It is a vertical cross-sectional view which shows the electronic module which mounted the electronic device in FIG. 1 on a module board. (A) is a top view showing an electronic device according to a second embodiment of the present invention, and (b) is a bottom view of (a). It is a vertical cross-sectional view of the electronic device shown in FIG. 4A in line AA. It is a vertical sectional view of the electronic device in another example of the 2nd Embodiment of this invention. (A) is a top view showing an electronic device according to a third embodiment of the present invention, and (b) is a bottom view of (a). FIG. 7 is an internal top view of the wiring board in FIG. 7. (A) is a vertical cross-sectional view of the electronic device shown in FIG. 7 (a) along the line AA, and (b) is an enlarged vertical cross-sectional view of a main part of the part B of (a). (A) is a top view showing an electronic device according to a fourth embodiment of the present invention, and (b) is a bottom view of (a). (A) is a vertical cross-sectional view of the electronic device shown in FIG. 10 (a) along the line AA, and (b) is an enlarged vertical cross-sectional view of a main part of the part B of (a). (A) and (b) are bottom views of the electronic device in another example of the first embodiment of the present invention.

Some exemplary embodiments of the invention will be described with reference to the accompanying drawings.

(First Embodiment)
As shown in FIGS. 1 to 3, the electronic device according to the first embodiment of the present invention includes a wiring board 1 and an electronic component 2 mounted in a recess 12 of the wiring board 1. As shown in FIG. 3, the electronic device is connected to, for example, a module substrate 5 constituting an electronic module by using solder 6.

The wiring board 1 in the present embodiment has a recess 12 including a mounting portion for mounting the electronic component 2 on one main surface, and a frame-shaped region 11a provided on the side wall of the recess 12 on one main surface in a plan view. It has a rectangular insulating substrate 11, a wiring conductor 13 provided in a recess 12, and an external electrode 14 provided on one main surface facing the main surface and connected to the wiring conductor 13. The external electrode 14 is arranged inside the frame-shaped region 11a (inner region 11b) so as not to overlap the frame-shaped region in plan perspective. The wiring conductor 13 is provided on the main surface and inside of the insulating substrate 11. In FIGS. 1 to 3, the upward direction means the positive direction of the virtual z-axis. It should be noted that the distinction between the upper and lower parts in the following description is for convenience, and does not limit the upper and lower parts when the wiring board 1 and the like are actually used.

Further, in the example shown in FIG. 1B, the region serving as the inner edge of the frame-shaped region 11a is shown by a dotted line in the plan perspective. Further, in the example shown in FIG. 1 (b), the through conductor of the wiring conductor 13 overlapping with the external electrode 14 is shown by a dotted line in planar perspective.

The insulating substrate 11 has one main surface (upper surface in FIGS. 1 to 3), the other main surface (lower surface in FIGS. 1 to 3), and a side surface. The insulating substrate 11 is composed of a plurality of insulating layers 11c, has an opening on one main surface, and has a recess 12 including a mounting portion for mounting the electronic component 2. The insulating substrate 11 has a rectangular plate-like shape when viewed in a plan view, that is, when viewed from a direction perpendicular to the main surface. The insulating substrate 11 functions as a support for supporting the electronic component 2, and the electronic component 2 is a solder bump, a gold bump, or a conductive resin (anisometric conductive resin, etc.) on the mounting portion on the bottom surface of the recess 12. It is adhered and fixed via a connecting member 3 such as resin.

For the insulating substrate 11, for example, ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride material sintered body, a silicon nitride material sintered body, a mulite material sintered body, or a glass ceramics sintered body may be used. it can. In the case where the insulating substrate 11 is, for example, an aluminum oxide sintered body, raw material powders such as aluminum oxide (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), and calcium oxide (CaO) are used. An appropriate organic binder, solvent, etc. are added and mixed to prepare a muddy syrup. A ceramic green sheet is produced by molding this slurry into a sheet shape by adopting a conventionally known doctor blade method, calendar roll method, or the like. Next, the insulating substrate 11 is formed by subjecting the ceramic green sheet to an appropriate punching process, laminating a plurality of ceramic green sheets to form a product, and firing the product at a high temperature (about 1600 ° C.). It will be manufactured.

The recess 12 is provided on one main surface of the insulating substrate 11 in the examples shown in FIGS. 1 and 2. A frame-shaped region 11a is provided on the side wall of the recess 12 so as to surround the recess 12. The recess 12 is for mounting the electronic component 2 on the bottom surface. A wiring conductor 13 for electrically connecting to the electronic component 2 is led out in the recess 12. In the example shown in FIG. 1, the recess 12 has an arcuate rectangular shape at a corner in a plan view, and is provided at the center of the insulating substrate 11. In the examples shown in FIGS. 1 to 3, the insulating substrate 11 is formed of three layers of insulating layers 11c, and the recess 12 is provided in the first insulating layer 11c on the main surface side.

For the recess 12, for example, some of the ceramic green sheets for the insulating substrate 11 are formed with through holes to be recesses 12 by laser processing, punching with a die, or the like, and the ceramic green sheet is formed. , Can be formed by laminating on another ceramic green sheet that does not have through holes.

The wiring conductor 13 is provided on the surface and inside of the insulating substrate 11, and a part of the wiring conductor 13 extends into the recess 12. The external electrode 14 is provided on the other main surface of the insulating substrate 11 and is electrically connected to the wiring conductor 13. The wiring conductor 13 and the external electrode 14 are for electrically connecting the electronic component 2 mounted on the mounting portion of the recess 12 and the module substrate 5. The wiring conductor 13 is connected to the electrode of the electronic component 2 via the connecting member 3. The external electrode 14 is connected to the connection pad 51 of the module substrate 5 via the solder 6. The wiring conductor 13 electrically connects the wiring layer provided on the surface of the insulating layer 11c and the wiring layers located above and below the insulating layer 11c constituting the insulating substrate 11 or connects the wiring layer to the outside. It includes a through conductor that electrically connects to the electrode 14.

The external electrode 14 is arranged inside the frame-shaped region (inner region 11b) so as not to overlap the frame-shaped region 11a in planar fluoroscopy. That is, the external electrode 14 is not provided as an electrode for connecting to the module substrate 5 in the region overlapping the frame-shaped region 11a in planar perspective. For patterns other than those used for the external electrode 14, for example, patterns for electrical check, direction confirmation, product name, etc., which are not connected to the module substrate 5, the pattern overlaps with the frame-shaped region 11a in plan perspective. It does not matter if it is arranged.

The wiring conductor 13 and the external electrode 14 are metal powder metallized containing, for example, tungsten (W), molybdenum (Mo), manganese (Mn) and the like as main components. For example, when the insulating substrate 11 is made of an aluminum oxide sintered body, the metallized paste obtained by adding and mixing an appropriate organic binder and a solvent to a refractory metal powder such as W, Mo or Mn is insulated. The ceramic green sheet for the substrate 11 is pre-printed and coated in a predetermined pattern by a screen printing method, and fired at the same time as the ceramic green sheet for the insulating substrate 11 to be adhered and formed at a predetermined position on the insulating substrate 11. For the wiring conductor 13 and the external electrode 14, for example, a metallized paste for the wiring conductor 13 or the external electrode 14 is printed and applied to a ceramic green sheet for the insulating substrate 11 by a printing means such as a screen printing method, and the wiring conductor 13 and the external electrode 14 are used for the insulating substrate 11. It is formed by firing together with the ceramic green sheet of. When the wiring conductor 13 is a through conductor, for example, a through hole for the through conductor is formed in the ceramic green sheet for the insulating substrate 11 by a processing method such as punching or laser processing by a mold or punching, and the through hole is formed. The holes are filled with a metallized paste for a through conductor by the above printing means, and formed by firing together with a ceramic green sheet for the insulating substrate 11. The metallized paste is prepared by adding an appropriate solvent and a binder to the above-mentioned metal powder and kneading the paste to adjust the viscosity to an appropriate level. In addition, in order to increase the bonding strength with the insulating substrate 11, glass powder and ceramic powder may be contained.

A metal plating layer is adhered to the surfaces of the wiring conductor 13 and the external electrode 14 exposed from the insulating substrate 11 by an electroplating method or an electroless plating method. The metal plating layer is made of a metal such as nickel, copper, gold or silver, which has excellent corrosion resistance and connectivity with the connecting member 3. For example, a nickel plating layer having a thickness of about 0.5 to 5 μm and gold having a thickness of about 0.1 to 3 μm. The plating layer and the plating layer are sequentially adhered. As a result, corrosion of the wiring conductor and the external electrode 14 can be effectively suppressed, the wiring conductor 13 is joined to the connecting member 3 such as the bonding wire, and the external electrode 14 is connected to the module substrate 5. The connection with the connection pad 51 for use can be strengthened.

Further, the metal plating layer is not limited to the nickel plating layer / gold plating layer, and may be another metal plating layer including a nickel plating layer / palladium plating layer / gold plating layer and the like.

An electronic device can be manufactured by mounting an electronic component 2 on a mounting portion on the bottom surface of a recess 12 of a wiring board 1. The electronic component 2 mounted on the wiring board 1 is a semiconductor element such as an IC chip or an LSI chip, a light emitting element, a piezoelectric element such as a crystal oscillator or a piezoelectric vibrator, and various sensors. For example, when the electronic component 2 is a wire bonding type semiconductor element, the semiconductor element is fixed on the mounting portion by a bonding member such as a low melting point brazing material or a conductive resin, and then the bonding wire or the like is connected. The electrodes of the semiconductor element and the wiring conductor 15 are electrically connected via the member 3 to be mounted on the wiring board wiring board 1. As a result, the electronic component 2 is electrically connected to the wiring conductor 15. Further, for example, when the electronic component 2 is a flip-chip type semiconductor element, the semiconductor element is a semiconductor via a connecting member 3 such as a solder bump, a gold bump, or a conductive resin (anisometric conductive resin or the like). The electrode of the element and the wiring conductor 15 are electrically and mechanically connected to be mounted on the wiring substrate 1. Further, a plurality of electronic components 2 may be mounted on the wiring board 1, or small electronic components such as a resistance element or a capacitive element may be mounted as required. Further, the electronic component 2 is sealed with a sealing material 4 made of resin, glass or the like, or with a lid made of resin, glass, ceramics, metal or the like, if necessary.

As shown in FIG. 3, for example, the external electrode 14 of the electronic device of the present embodiment is connected to the connection pad 51 of the module substrate 5 via the solder 6 to form an electronic module. In the electronic device, for example, as shown in FIG. 3, an external electrode 14 arranged on the upper surface side of the wiring board 1 is connected to a connection pad 51 of the module board 5. When an optical element such as a light emitting element is used as the electronic component 2, as shown in FIG. 3, the module substrate 5 is provided with an opening 52 for transmitting light. Such an opening 52 is formed larger than the electronic component 2 in a plan view.

The wiring board 1 of the present invention has a recess 12 including a mounting portion for mounting an electronic component 2 on one main surface, and a frame-shaped region 11a provided on the side wall of the recess 12 on one main surface in a plan view. It has a rectangular insulating substrate 11, a wiring conductor 13 provided in a recess 12, and an external electrode 14 provided on one main surface and connected to the wiring conductor 13 on the other main surface, and is flat. In fluoroscopy, the external electrode 14 is arranged inside the frame-shaped region so as not to overlap the frame-shaped region 11a. With the above configuration, even if stress is applied to the external electrode 14 when the external electrode 14 is connected to the external circuit board 5 and operated, it is difficult for stress to be applied to the frame-shaped region 11a, and the side wall of the recess 12 is distorted. Is suppressed, so that the sealing material 4 sealed in the recess 12 or the lid arranged on the side wall of the recess 12 can be prevented from peeling off.

As in the example shown in FIG. 1, the recess 12 has a rectangular shape in a plan view, and in the plan view, a plurality of external electrodes 14 are provided along the inner wall surface of the recess 12, that is, the inner edge of the frame-shaped region 11a. If so, when the electronic device is operated, a large stress is applied to one external electrode 14, and the stress is suppressed from being applied to the surrounding frame-shaped region 11a, and the sealing material 4 or the concave portion sealed in the concave portion 12 is suppressed. It is possible to more effectively suppress the peeling of the lid arranged on the side wall of 12.

When the plurality of external electrodes 14 are provided in a band shape along the inner edge of the frame-shaped region 11a as in the example shown in FIG. 1, stress is applied to one external electrode 14 when the electronic device is operated. Suppresses the application of stress to the surrounding frame-shaped region 11a, and more effectively suppresses the sealing material 4 sealed in the recess 12 or the lid arranged on the side wall of the recess 12 from peeling off. can do. In addition, the fact that they are provided in a band shape indicates that a plurality of external electrodes 14 are arranged side by side along the inner edge of the frame-shaped region 11a as in the example shown in FIG.

The inner edge of the frame-shaped region 11a is rectangular in a plan view, and in the plan view, if the external electrodes 14 are provided along the four sides of the inner edge of the frame-shaped region 11a, when the electronic device is operated, 1 A large amount of stress is applied to one of the external electrodes 14, and the stress is suppressed from being applied to the surrounding frame-shaped region 11a, and the sealing material 4 sealed in the recess 12 or the lid arranged on the side wall of the recess 12 is peeled off. Can be suppressed more effectively. It is preferable that the plurality of external electrodes 14 provided along each side of the inner edge of the frame-shaped region 11a are provided in a strip shape in the same manner as described above.

The electronic device of the present embodiment can be an electronic device having excellent airtightness and excellent long-term reliability by having the wiring board 1 having the above configuration and the electronic component 2 mounted in the recess 12. it can.

The electronic module of the present embodiment has a module substrate 5 having a connection pad 51 and an electronic device having the above configuration connected to the connection pad 51 via a solder 6 to an external electrode 14 for a long period of time. It can be made highly reliable.

The wiring board 1 in the present embodiment can be suitably used in a small electronic device, particularly in an electronic device when the width of the side wall of the recess 12 is small, and the airtightness in the recess 12 in the wiring board 1 can be improved. ..

(Second Embodiment)
Next, the electronic device according to the second embodiment of the present invention will be described with reference to FIGS. 4 and 5. The electronic device according to the second embodiment of the present invention is different from the electronic device according to the first embodiment described above in that the other main surface metal layer 15 is provided on the other main surface of the insulating substrate 11. ..

Further, in the example shown in FIG. 4B, the region serving as the inner edge of the frame-shaped region 11a is shown by a dotted line in the plan perspective. Further, in the example shown in FIG. 4B, the through conductor of the wiring conductor 13 overlapping with the external electrode 14 is shown by a dotted line in planar perspective.

Similar to the wiring board 1 of the first embodiment, the wiring board 1 of the second embodiment of the present invention stresses the external electrode 14 when the external electrode 14 is connected to the external circuit board 5 and operated. Is applied, stress is unlikely to be applied to the frame-shaped region 11a, and distortion of the side wall of the recess 12 is suppressed, so that the sealing material 4 sealed in the recess 12 or the side wall of the recess 12 is arranged. It is possible to prevent the lid from peeling off.

Further, in a plan view, by having the other main surface metal layer 15 provided on the other main surface so as to be sandwiched between the plurality of external electrodes 14, the stress applied to each external electrode 14 is reduced, and the outside By suppressing the distortion of the side wall of the recess 12 around the electrode 14, it is possible to prevent the sealing material 4 sealed in the recess 12 or the lid arranged on the side wall of the recess 12 from peeling off. ..

On the other hand, the main surface metal layer 15 is formed wider than the external electrode 14 in a plan view, and is connected to the connection pad 51 of the module substrate 5 via the solder 6 in the same manner as the external electrode 14. On the other hand, the main surface metal side 15 can be manufactured by using the same manufacturing method as the wiring conductor 13 and the external electrode 14 described above. On the other hand, the main surface metal layer 15 may be a metal layer electrically connected to the wiring conductor 13 or the external electrode 14, or may be a metal layer electrically independent of the wiring conductor 13 or the external electrode 14. ..

On the other hand, when the main surface metal layer 15 is provided so as to be surrounded by a plurality of external electrodes 14 in a plan view as shown in the example shown in FIG. 4, the stress applied to each of the external electrodes 14 is reduced and the surroundings are reduced. It is possible to suppress the application of stress to the frame-shaped region 11a of the above, and to more effectively suppress the peeling of the sealing material 4 sealed in the recess 12 or the lid arranged on the side wall of the recess 12.

Further, as in the example shown in FIG. 6, the thickness of the other main surface metal layer 15 from the other main surface of the insulating substrate 11 of the other main surface metal layer 15 is the other main surface of the insulating substrate 11 of the external electrode 14. When it is larger than the thickness from the above, the stress applied to the external electrode 14 provided around the main surface metal layer 15 can be reduced, and the sealing material 4 sealed in the recess 12 or the side wall of the recess 12 can be used. It is possible to more effectively prevent the lid body arranged in the above from peeling off.

The wiring board 1 of the second embodiment can be manufactured by using the same manufacturing method as the wiring board 1 of the first embodiment described above.

(Third Embodiment)
Next, the electronic device according to the third embodiment of the present invention will be described with reference to FIGS. 7 to 9. The electronic device according to the second embodiment of the present invention is different from the electronic device according to the first embodiment described above in that the recess 12 is composed of a plurality of steps and has a step 12a. The wiring board 1 has a frame-shaped region 11a on the side wall of the recess 12, and the external electrode 14 is formed in an inner region 11b inside the frame-shaped region 11a so as not to overlap the frame-shaped region 11a in plan perspective. Have been placed.

Further, in the example shown in FIG. 7B, in the plan perspective, the region serving as the inner edge of the frame-shaped region 11a and the step 12 are shown by dotted lines. Further, in the example shown in FIG. 7B, the through conductor of the wiring conductor 13 overlapping with the external electrode 14 is shown by a dotted line in planar perspective.

Similar to the wiring board 1 of the first embodiment, the wiring board 1 of the third embodiment of the present invention stresses the external electrode 14 when the external electrode 14 is connected to the external circuit board 5 and operated. Is applied, stress is unlikely to be applied to the frame-shaped region 11a, and distortion of the side wall of the recess 12 is suppressed, so that the sealing material 4 sealed in the recess 12 or the side wall of the recess 12 is arranged. It is possible to prevent the lid from peeling off.

Further, as in the example shown in FIG. 7, when the wiring board 1 has the other main surface metal layer 15 on the other main surface of the insulating substrate 11, the other main surface metal layer 15 is larger than the step 12a in plan perspective. When it is located inside, stress is less likely to be applied to the frame-shaped region 11a, and distortion of the side wall of the recess 12 is suppressed, so that the sealing material 4 sealed in the recess 12 or the lid arranged on the side wall of the recess 12 It is possible to prevent the body from peeling off.

Further, the external electrode 14 may overlap with the step 12a in plan perspective, but is located between the inner edge of the frame-shaped region 11a and the inner edge of the step 12a as shown in FIG. 7. Then, the distortion due to the step 12a is reduced.

The wiring board 1 of the third embodiment can be manufactured by using the same manufacturing method as the wiring board 1 of the first embodiment described above.

(Fourth Embodiment)
Next, the electronic device according to the fourth embodiment of the present invention will be described with reference to FIGS. 10 and 11. The point is that the other main surface in the inner region 11b inside the frame-shaped region 11a is concave on the one main surface side.

Similar to the wiring board 1 of the first embodiment, the wiring board 1 of the fourth embodiment of the present invention stresses the external electrode 14 when the external electrode 14 is connected to the external circuit board 5 and operated. Is applied, stress is unlikely to be applied to the frame-shaped region 11a, and distortion of the side wall of the recess 12 is suppressed, so that the sealing material 4 sealed in the recess 12 or the side wall of the recess 12 is arranged. It is possible to prevent the lid from peeling off.

Further, since the external electrode 14 is provided on the other main surface which is concave on one main surface side, the solder 6 inside the inner region 11b is connected to the module substrate 5 via the solder 6. By increasing the amount, reducing the stress applied to each external electrode 14, and suppressing the distortion of the side wall of the recess 12 around the external electrode 14, the sealing material 4 or the recess sealed in the recess 12 It is possible to prevent the lids arranged on the side walls of 12 from peeling off. The wiring board 1 of the fourth embodiment can be manufactured by using the same manufacturing method as the wiring board 1 of the first embodiment described above.

The present invention is not limited to the examples of the above-described embodiments, and various modifications can be made. For example, the insulating substrate 11 may have a rectangular shape having a notch or a chamfered portion on a side surface or a corner portion in a plan view.

Further, as shown in the example of FIG. 12A, the external electrodes 14 may be eccentric in one direction and arranged in a band shape in a direction along the inner edge of the frame-shaped region 11a, and FIG. 12A. As shown in the example of (b), it may be provided in two rows along the inner edge of the frame-shaped region 11a.

Further, the recess 12 may have a circular shape in a plan view. In this case, the external electrode 14 is located in the inner region 11b inside the frame-shaped region 11a so as not to overlap with the frame-shaped region 11a in plan perspective. The circular recess 12 may have an elliptical shape in a plan view, or an elliptical shape such as a circular shape having two opposing inner walls arranged in parallel. Also in this case, it is preferable that the plurality of external electrodes 14 are provided along the inner edge of the frame-shaped region 11a.

Further, the wiring boards 1 of the first to fourth embodiments may be combined.

In the above-described embodiment, the insulating substrate 11 is composed of three layers of insulating layers 11c, but the insulating substrate 11 is composed of two layers or four or more layers of insulating layers 11c. It doesn't matter.

Further, the wiring board 1 may be manufactured in the form of a large number of wiring boards.

1 ... Wiring board
11 ... Insulation substrate
11a ・ ・ ・ Frame-shaped area
11b ・ ・ ・ Inner area
11c ・ ・ ・ Insulation layer
12 ... concave
12a ・ ・ ・ Step
13 ... Wiring conductor
14 ... External electrode
15 ... On the other hand, the main surface metal layer 2 ... Electronic component 3 ... Connecting member 4 ... Sealing material 5 ... Module substrate
51 ... Connection pad 6 ... Solder

Claims (9)

On the other hand, an insulating substrate having a concave portion including a mounting portion for mounting electronic components on the main surface and a frame-shaped region provided on the side wall of the concave portion on the one main surface and having a rectangular shape in a plan view.
The wiring conductor provided in the recess and
Provided on the one main surface that faces the other main surface, and an external electrode connected to the wiring conductor,
It has a frame-shaped step located inside the frame-shaped region in a plan view .
In a plan perspective, the external electrode wiring board, characterized in that positioned between the inner edge of the inner edge and the stepped of the frame-like area so as not to overlap with the frame-like area. On the other hand, an insulating substrate having a concave portion including a mounting portion for mounting electronic components on the main surface and a frame-shaped region provided on the side wall of the concave portion on the one main surface and having a rectangular shape in a plan view.
The wiring conductor provided in the recess and
It has an external electrode provided on the other main surface facing the one main surface and connected to the wiring conductor.
In planar fluoroscopy, the external electrodes are arranged inside the frame-shaped region so as not to overlap the frame-shaped region.
A wiring board characterized in that an inner region inside the frame-shaped region on the other main surface is concave on one main surface side. The wiring board according to claim 1 or 2 , wherein the external electrode is provided along the inner edge of the frame-shaped region in plan perspective. The wiring board according to claim 3 , wherein the external electrodes are provided in a band shape. The inner edge of the frame-shaped region is rectangular in a plan view.
The wiring board according to claim 3 or 4 , wherein the external electrodes are provided along four sides at the inner edge of the frame-shaped region in plan perspective. The wiring board according to any one of claims 1 to 5 , characterized in that it has a metal layer on the other main surface provided on the other main surface so as to be sandwiched between the external electrodes in a plan view. .. The wiring board according to claim 6 , wherein the other main surface metal layer is provided so as to be surrounded by the external electrodes in a plan view. The wiring board according to any one of claims 1 to 7 .
An electronic device having an electronic component mounted on the wiring board. Module board with connection pad and
The electronic module according to claim 8 , further comprising the electronic device according to claim 8 , which is connected to the connection pad via solder.