JP6774827B2 - Coating material for rolled aluminum alloy plates for small electronic equipment cases - Google Patents
Coating material for rolled aluminum alloy plates for small electronic equipment cases Download PDFInfo
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- JP6774827B2 JP6774827B2 JP2016180190A JP2016180190A JP6774827B2 JP 6774827 B2 JP6774827 B2 JP 6774827B2 JP 2016180190 A JP2016180190 A JP 2016180190A JP 2016180190 A JP2016180190 A JP 2016180190A JP 6774827 B2 JP6774827 B2 JP 6774827B2
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- 239000000463 material Substances 0.000 title claims description 193
- 229910000838 Al alloy Inorganic materials 0.000 title claims description 100
- 239000011248 coating agent Substances 0.000 title claims description 69
- 238000000576 coating method Methods 0.000 title claims description 69
- 238000000465 moulding Methods 0.000 claims description 35
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 32
- 239000010410 layer Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 239000012790 adhesive layer Substances 0.000 claims description 14
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- 229920003002 synthetic resin Polymers 0.000 claims description 12
- 239000000057 synthetic resin Substances 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 8
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- 238000000034 method Methods 0.000 description 10
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- 238000012545 processing Methods 0.000 description 6
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Images
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- Adhesives Or Adhesive Processes (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Casings For Electric Apparatus (AREA)
Description
この発明は、タブレット端末、携帯通信端末機器、ノート型パソコン、携帯電話、携帯音楽機器、デジタルカメラ等の小型電子機器のケースに関し、より詳細には、絞り加工によって小型電子機器ケースを成形するためのアルミニウム合金圧延板材の表面を覆うための被覆材に関する。 The present invention relates to a case of a small electronic device such as a tablet terminal, a mobile communication terminal device, a notebook computer, a mobile phone, a portable music device, and a digital camera, and more specifically, to form a small electronic device case by drawing. Regarding a covering material for covering the surface of an aluminum alloy rolled plate material.
従来、小型電子機器のケースとして、厚板状のアルミニウム合金押出材を切削加工（全面削り出し）することにより成形されたものが知られている（例えば、下記の特許文献１参照）。
上記のケースは、優れた外観、精密度および強度が得られるため、小型電子機器ケースとして好適に用いられている。
Conventionally, as a case of a small electronic device, a case formed by cutting (cutting out the entire surface) a thick plate-shaped aluminum alloy extruded material is known (see, for example, Patent Document 1 below).
The above case is preferably used as a small electronic device case because of its excellent appearance, precision and strength.
また、一般に、アルミニウム合金板材等の金属板材から所定形状の製品を成形する手段として、絞り加工も広く行われている。 Further, in general, drawing processing is widely performed as a means for molding a product having a predetermined shape from a metal plate material such as an aluminum alloy plate material.
しかしながら、切削加工によって成形された小型電子機器ケースの場合、材料を切削加工する時間が長くかかるため、製造効率が低く、また、加工に伴って切削屑が大量に発生し、これを回収処理するのに多くのエネルギーを必要とするため、結果的にコストが高くなるという問題があった。 However, in the case of a small electronic device case formed by cutting, it takes a long time to cut the material, so that the manufacturing efficiency is low, and a large amount of cutting chips are generated during the processing, which is collected and processed. However, since it requires a lot of energy, there is a problem that the cost becomes high as a result.
一方、絞り加工の場合、短時間で成形が行われるので、製造効率に優れており、また、加工に伴う屑の発生もないため、低コストで製造することができる。ただし、小型電子機器ケースの形態は、一般に、平面より見て略方形をした底壁と、底壁の周縁から立ち上がった側壁とを備えたものである。このような形態のケースを絞り加工により成形しようとすると、側壁のコーナー部分に割れが生じて、成形不良となるおそれが大きい。
加えて、絞り加工の場合、金属板材の表面が金型とすべり接触するため、それによって成形品の表面に傷が生じ、製品の外観が損なわれるおそれがある。さらに、成形後の成形品の表面も露出したままの状態であるため、他の物品等との接触により傷が付くおそれがある。
On the other hand, in the case of drawing processing, since molding is performed in a short time, the production efficiency is excellent, and since there is no generation of waste due to processing, it can be produced at low cost. However, the form of the small electronic device case generally includes a bottom wall that is substantially square when viewed from a plane, and a side wall that rises from the peripheral edge of the bottom wall. If a case having such a shape is to be molded by drawing, there is a high possibility that a corner portion of the side wall will be cracked, resulting in molding failure.
In addition, in the case of drawing, the surface of the metal plate material slides into contact with the mold, which may cause scratches on the surface of the molded product and impair the appearance of the product. Further, since the surface of the molded product after molding is also in an exposed state, there is a risk of being scratched by contact with other articles or the like.
この発明の目的は、アルミニウム合金圧延板材を絞り加工することによって小型電子機器ケースを成形するに当たり、成形不良が生じにくく、また、成形時および成形後に表面に傷が付かず優れた外観を有する小型電子機器ケースが得られるようにすることにある。 An object of the present invention is that when a small electronic device case is formed by drawing an aluminum alloy rolled plate material, molding defects are unlikely to occur, and the surface is not scratched during and after molding, and the small size has an excellent appearance. The purpose is to make the electronic device case available.
この発明は、上記の目的を達成するために、以下の態様からなる。 The present invention comprises the following aspects in order to achieve the above object.
１）絞り加工により小型電子機器ケースを成形するためのアルミニウム合金圧延板材の両面のうち少なくともいずれか一方の面に積層される被覆材であって、片面に粘着剤層が形成された合成樹脂フィルムよりなる、小型電子機器ケース用アルミニウム合金圧延板材の被覆材。 1) A synthetic resin film that is laminated on at least one of both sides of an aluminum alloy rolled plate material for forming a small electronic device case by drawing, and has an adhesive layer formed on one side. A coating material for rolled aluminum alloy plates for small electronic equipment cases.
２）アルミニウム合金圧延板材に対する粘着剤層の粘着力が１〜１５Ｎ／２５ｍｍである、上記１）の小型電子機器ケース用アルミニウム合金圧延板材の被覆材。 2) The coating material of the aluminum alloy rolled plate material for the small electronic device case of 1) above, wherein the adhesive force of the pressure-sensitive adhesive layer to the aluminum alloy rolled plate material is 1 to 15 N / 25 mm.
３）アルミニウム合金圧延板材の両面のうち小型電子機器ケースの外面となる面に積層される被覆材であって、片面に粘着剤層が形成された厚さ５０〜１００μｍのポリエステル樹脂フィルムまたはポリアミド樹脂フィルムよりなる、上記１）または２）の小型電子機器ケース用アルミニウム合金圧延板材の被覆材。 3) A coating material laminated on the outer surface of a small electronic device case among both sides of an aluminum alloy rolled plate material, and is a polyester resin film or polyamide resin having a thickness of 50 to 100 μm having an adhesive layer formed on one side. A coating material for an aluminum alloy rolled plate material for a small electronic device case according to 1) or 2) above, which is made of a film.
４）アルミニウム合金圧延板材の両面のうち小型電子機器ケースの内面となる面に積層される被覆材であって、片面に粘着剤層が形成された厚さ１０〜１００μｍのポリエチレン樹脂フィルム、ポリプロピレン樹脂フィルム、またはポリアミド樹脂フィルムよりなる、上記１）または２）の小型電子機器ケース用アルミニウム合金圧延板材の被覆材。 4) A coating material laminated on the inner surface of a small electronic device case among both sides of an aluminum alloy rolled plate material, and a polyethylene resin film or polypropylene resin having a thickness of 10 to 100 μm having an adhesive layer formed on one side. A coating material for an aluminum alloy rolled plate material for a small electronic device case according to 1) or 2) above, which is made of a film or a polyamide resin film.
５）絞り加工により小型電子機器ケースを成形するためのアルミニウム合金圧延板材の両面のうち少なくともいずれか一方の面に、上記１）または２）の被覆材が粘着剤層を介して積層されている、小型電子機器ケース用アルミニウム合金圧延積層板材。 5) The coating material of 1) or 2) above is laminated via an adhesive layer on at least one of both sides of the rolled aluminum alloy plate material for forming a small electronic device case by drawing. , Aluminum alloy rolled laminated board material for small electronic equipment cases.
６）上記５）の小型電子機器ケース用アルミニウム合金圧延積層板材を絞り加工してなり、内外両面のうち少なくともいずれか一方の面が被覆材で覆われている、被覆材付き小型電子機器ケース。 6) A small electronic device case with a covering material, which is obtained by drawing the aluminum alloy rolled laminated plate material for the small electronic device case of 5) above, and at least one of the inner and outer surfaces is covered with the covering material.
７）上記５）の小型電子機器ケース用アルミニウム合金圧延積層板材を絞り加工した後、内外両面のうち少なくともいずれか一方の面を覆っている被覆材を剥離除去してなる、小型電子機器ケース。 7) A small electronic device case obtained by drawing and processing the aluminum alloy rolled laminated plate material for the small electronic device case of 5) above, and then peeling off the covering material covering at least one of the inner and outer surfaces.
上記１）の小型電子機器ケース用アルミニウム合金圧延板材の被覆材によれば、アルミニウム合金圧延板材の両面のうち少なくともいずれか一方の面に、粘着剤層を介して積層することができ、それによってアルミニウム合金圧延板材の表面を摩擦抵抗の小さい合成樹脂フィルムによって覆うことができる。そして、被覆材が積層されたアルミニウム合金圧延板材を絞り加工することにより小型電子機器ケースを成形すれば、成形されたケースの側壁に皺が生じたり、側壁のコーナー部分に割れが生じたりせず、成形不良の発生が抑制される上、金型との接触によりケースの表面に傷が付くのが防止される。特に上記１）の被覆材の場合、粘着剤層によってアルミニウム合金圧延板材の表面に粘着されるため、成形時に不用意にずれたりせず、上記効果が確実に得られる。さらに、上記１）の被覆材によれば、成形後のケースの表面も覆っておくことができるので、後工程までの保管や運搬等の際にケースの表面に傷が付くのが回避される。
したがって、上記１）の被覆材によれば、これを用いてアルミニウム合金圧延板材の絞り加工を行うことにより、美しい外観の小型電子機器ケースが確実に得られる。
According to the coating material of the aluminum alloy rolled plate material for the small electronic device case described in 1) above, it can be laminated on at least one of both sides of the aluminum alloy rolled plate material via the pressure-sensitive adhesive layer. The surface of the rolled aluminum alloy plate can be covered with a synthetic resin film having low frictional resistance. Then, if a small electronic device case is formed by drawing an aluminum alloy rolled plate material on which a covering material is laminated, wrinkles do not occur on the side wall of the molded case and cracks do not occur at the corners of the side wall. In addition to suppressing the occurrence of molding defects, it is possible to prevent the surface of the case from being scratched by contact with the mold. In particular, in the case of the coating material of 1) above, since the adhesive layer adheres to the surface of the rolled aluminum alloy plate material, the coating material does not inadvertently shift during molding, and the above effect can be surely obtained. Further, according to the coating material of 1) above, the surface of the case after molding can be covered, so that the surface of the case is prevented from being scratched during storage and transportation until the subsequent process. ..
Therefore, according to the coating material of 1) above, by drawing the rolled aluminum alloy plate material using this material, a small electronic device case having a beautiful appearance can be surely obtained.
上記２）の小型電子機器ケース用アルミニウム合金圧延板材の被覆材によれば、アルミニウム合金圧延板材に対する粘着剤層の粘着力が１〜１５Ｎ／２５ｍｍであるので、以下のような問題が生じるのを回避することができる。すなわち、粘着剤層の粘着力が１Ｎ／２５ｍｍ未満であると、ケース成形前の取扱時などに、被覆材がアルミニウム合金圧延板材の表面から剥がれやすくなる。一方、粘着剤層の粘着力が１５Ｎ／２５ｍｍを超えると、ケース成形後に被覆材を剥離除去する際の作業性が低下する上、粘着剤の一部がケースの表面に付着したまま残り、後工程の研磨等において不具合が生じるおそれがある。 According to the coating material of the aluminum alloy rolled plate material for the small electronic device case in 2) above, the adhesive force of the pressure-sensitive adhesive layer to the aluminum alloy rolled plate material is 1 to 15 N / 25 mm, so that the following problems occur. It can be avoided. That is, when the adhesive strength of the pressure-sensitive adhesive layer is less than 1N / 25 mm, the coating material is likely to be peeled off from the surface of the rolled aluminum alloy plate material at the time of handling before molding the case. On the other hand, if the adhesive strength of the pressure-sensitive adhesive layer exceeds 15 N / 25 mm, the workability when peeling and removing the coating material after molding the case is lowered, and a part of the pressure-sensitive adhesive remains attached to the surface of the case. There is a risk of problems occurring in the polishing of the process.
上記３）の小型電子機器ケース用アルミニウム合金圧延板材の被覆材によれば、以下のような効果が奏される。すなわち、アルミニウム合金圧延板材の両面のうち小型電子機器ケースの外面となる面は、絞り加工時に部分的に金型によってしごかれるが、同面を覆う被覆材として、片面に粘着剤層が形成された厚さ５０〜１００μｍのポリエステル樹脂フィルムまたはポリアミド樹脂フィルムが用いられていれば、金型のしごきによって破断するおそれがないので成形品の表面に傷が付くのを確実に回避することができる上、フィルムの厚さが大きすぎることによるコストの増大が抑えられ、さらには、フィルムの剛性が大きすぎてケースの曲げ成形された部分から浮き上がったり剥がれたりするのを回避しうる。 According to the coating material of the aluminum alloy rolled plate material for the small electronic device case described in 3) above, the following effects are obtained. That is, of the two sides of the rolled aluminum alloy plate material, the outer surface of the small electronic device case is partially squeezed by the mold during drawing, but an adhesive layer is formed on one side as a covering material covering the same surface. If a polyester resin film or polyamide resin film having a thickness of 50 to 100 μm is used, there is no risk of breakage due to ironing of the mold, so that it is possible to reliably avoid scratching the surface of the molded product. In addition, the increase in cost due to the thickness of the film being too large can be suppressed, and further, the rigidity of the film can be prevented from being lifted or peeled off from the bent-formed portion of the case.
上記４）の小型電子機器ケース用アルミニウム合金圧延板材の被覆材によれば、以下のような効果が奏される。すなわち、アルミニウム合金圧延板材の両面のうち小型電子機器ケースの内面となる面は、絞り加工時に金型によってしごかれることはないが、凹方向に曲げ成形される部分が生じるため、同面を覆う被覆材として、片面に粘着剤層が形成された厚さ１０〜１００μｍのポリエチレン樹脂フィルム、ポリプロピレン樹脂フィルムまたはポリアミド樹脂フィルムが用いられていれば、フィルムの剛性が大きすぎてケースの曲げ成形された部分から浮き上がったり剥がれたりするのが回避され、また、ケースの曲げ成形された部分の曲率半径（Ｒ）が大きくなってシャープな形状が得られないという事態を回避しうる。 According to the coating material of the aluminum alloy rolled plate material for the small electronic device case described in 4) above, the following effects are obtained. That is, of the two sides of the rolled aluminum alloy plate, the inner surface of the small electronic device case is not squeezed by the mold during drawing, but there is a portion that is bent and molded in the concave direction. If a polyethylene resin film, polypropylene resin film or polyamide resin film having a thickness of 10 to 100 μm having an adhesive layer formed on one side is used as the covering material, the rigidity of the film is too high and the case is bent and molded. It is possible to prevent the case from being lifted or peeled off from the portion, and it is possible to avoid the situation where the radius of curvature (R) of the bent-formed portion of the case becomes large and a sharp shape cannot be obtained.
上記５）の小型電子機器ケース用アルミニウム合金圧延積層板材によれば、アルミニウム合金圧延板材の片面または両面に粘着剤層を介して積層された被覆材の存在により、同積層板材を絞り加工することにより成形された小型電子機器ケースの側壁に皺が生じたり、側壁のコーナー部分に割れが生じたりせず、成形不良の発生が抑制される上、金型との接触によりケースの表面に傷が付くのが防止され、さらには、成形後のケースの表面も被覆材で覆われるため、後工程までにケースの表面に傷が付くのが回避され、美しい外観の小型電子機器ケースが確実に得られる。 According to the aluminum alloy rolled laminated plate material for small electronic device cases in 5) above, the laminated plate material is drawn due to the presence of a coating material laminated on one side or both sides of the aluminum alloy rolled plate material via an adhesive layer. Wrinkles do not occur on the side wall of the small electronic device case molded by, and cracks do not occur at the corners of the side wall, the occurrence of molding defects is suppressed, and the surface of the case is scratched by contact with the mold. Since it is prevented from sticking and the surface of the case after molding is also covered with a coating material, it is possible to prevent the surface of the case from being scratched by the post-process, and a small electronic device case with a beautiful appearance is surely obtained. Be done.
上記６）の被覆材付き小型電子機器ケースによれば、絞り加工によるアルミニウム合金圧延板材の成形が良好に行われる上、成形時に表面に傷が付かないので、高い精密度および強度を有しかつ美しい外観のケースが得られる。しかも、上記６）の被覆材付き小型電子機器ケースによれば、ケースの表面が被覆材で覆われた状態であるので、後工程までに表面に傷が付くのが防止される。 According to the small electronic device case with a coating material described in 6) above, the rolled aluminum alloy plate material is satisfactorily molded by drawing, and the surface is not scratched during molding, so that it has high precision and strength. You will get a case with a beautiful appearance. Moreover, according to the small electronic device case with a coating material in 6) above, since the surface of the case is covered with the coating material, it is possible to prevent the surface from being scratched by the subsequent process.
上記７）の小型電子機器ケースによれば、絞り加工によるアルミニウム合金圧延板材の成形が良好に行われる上、成形時さらには成形後にも表面に傷が付かないので、高い精密度および強度を有しかつ美しい外観を呈するケースが得られる。 According to the small electronic device case of 7) above, the rolled aluminum alloy plate material is satisfactorily formed by drawing, and the surface is not scratched during or after molding, so that it has high precision and strength. A case with a beautiful appearance can be obtained.
以下、この発明の実施形態を、図１〜４を参照して説明する。 Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 4.
図１は、この発明による被覆材(3)(4)を、小型電子機器ケース用アルミニウム合金圧延板材(2)とともに示したものである。また、図２は、これらの被覆材(3)(4)をアルミニウム合金圧延板材(2)の両面に積層してなる小型電子機器ケース用アルミニウム合金圧延積層板材(1)を示したものである。
図示の通り、この実施形態では、被覆材は、アルミニウム合金圧延板材(2)の両面のうち小型電子機器ケースの外面となる面（図１では下面）を覆う第１の被覆材(3)と、アルミニウム合金圧延板材(2)の両面のうち小型電子機器ケースの内面となる面（図１では上面）を覆う第２の被覆材(4)とで構成されている。
第１の被覆材(3)および第２の被覆材(4)は、それぞれ、片面に粘着剤層(32)(42)が形成された合成樹脂フィルム(31)(41)よりなる。
FIG. 1 shows the coating materials (3) and (4) according to the present invention together with the aluminum alloy rolled plate material (2) for a small electronic device case. Further, FIG. 2 shows an aluminum alloy rolled laminated plate material (1) for a small electronic device case in which these covering materials (3) and (4) are laminated on both sides of the aluminum alloy rolled plate material (2). ..
As shown in the figure, in this embodiment, the covering material is the first covering material (3) that covers the outer surface (lower surface in FIG. 1) of the aluminum alloy rolled plate material (2) which is the outer surface of the small electronic device case. It is composed of a second covering material (4) that covers the inner surface (upper surface in FIG. 1) of the small electronic device case among both sides of the aluminum alloy rolled plate material (2).
The first coating material (3) and the second coating material (4) are made of synthetic resin films (31) and (41) having adhesive layers (32) and (42) formed on one side thereof, respectively.
アルミニウム合金圧延板材(2)としては、０．２％耐力が２００ＭＰａ以上、好ましくは２５０ＭＰａ以上、より好ましくは３００ＭＰａ以上のものが用いられる。これにより、所望のケースの強度が得られる。また、アルミニウム合金圧延板材(2)は、破断伸びが５％以上２０％以下のものが好適に用いられる。これにより絞り加工の成形性が向上する。ここで、「０．２％耐力」および「破断伸び」は、ＪＩＳ Ｚ２２４１−２０１１に規定された、５号試験片を使用した、圧延方向に並行方向の引張試験によるものである。
また、アルミニウム合金圧延板材(2)は、厚さ方向と直交する方向にのびた繊維状の結晶組織を有している。
前記繊維状の結晶組織は、均質化処理したアルミニウム合金鋳魂を、熱間圧延後、所定の条件で熱処理を行い、その後に冷間圧延を行うことによって形成される。前記熱処理は、２００〜４００℃で１時間以上保持することにより行う。前記熱処理によって、Ｍｇ２Ｓｉを微細かつ均一に析出させるとともに、圧延材料中に存在する加工歪を減少させることができる。その後の冷間加工によって加工硬化させ、その後の成形加工性を損なわない範囲で高強度のアルミニウム合金圧延板材を得ることができる。
アルミニウム合金鋳魂の均質化処理の条件は特に限定されず、常法に従って５００℃以上、２時間以上で行うのが好ましい。
熱間圧延では、任意のパス工程において所定の温度条件で圧延する間の温度降下により焼き入れと同等の効果を得る。従って、パス前の材料温度は、ＭｇおよびＳｉが固溶された状態を保持しうる温度が必要であり、３５０〜４４０℃とする。パス上がり温度を上記２００〜４００℃の温度範囲とするためには、熱間圧延上がりで、直ちに高圧シャワー水冷等の強制冷却を行っても良い。また、焼き入れ効果を得るために、パス間の冷却速度は５０℃／分以上、パス上がり温度は２５０〜３４０℃、また、パス圧延速度は５０ｍ／分以上、上り板厚が１０ｍｍ以下とする。
冷間圧延では、加工硬化により所定の強度を得るために圧下率３０％以上とする。好ましい圧下率は、５０％以上である。
更に、必要に応じて、冷間圧延した合金板を１３０〜１５０℃の温度で最終焼鈍することができる。低温での熱処理を行うことにより、時効硬化させて更に強度を向上させるとともに、伸びを向上させることができる。また、機械的諸物性を安定化させる効果もある。
アルミニウム合金圧延板材(2)としては、以下のいずれかのアルミニウム合金からなるものが好適に用いられる。
ｉ）Ｍｎ：０．２〜０．７質量％、Ｍｇ：２．０〜５．０質量％を含有し、残部Ａｌおよび不可避不純物からなるＡｌ−Ｍｎ−Ｍｇ系合金
ｉｉ）Ｓｉ：０．２〜０．８質量％、Ｍｇ：０．４〜１．２質量％を含有し、残部Ａｌおよび不可避不純物からなるＡｌ−Ｓｉ−Ｍｇ系合金
ｉｉｉ）Ｚｎ：４．０〜６．５質量％、Ｍｇ：０．５〜３．０質量％を含有し、残部Ａｌおよび不可避不純物からなるＡｌ−Ｚｎ−Ｍｇ系合金
上記ｉ）の合金としては、Ｓｉ：０．４質量％以下、Ｍｎ：０．４〜０．６質量％、Ｍｇ：４．０〜４．９質量％、Ｆｅ：０．４質量％以下、Ｃｒ：０．０５〜０．２５質量％、Ｚｎ：０．２５質量％以下を含有し、残部Ａｌおよび不可避不純物からなるアルミニウム合金が挙げられる。
上記ｉｉ）の合金としては、Ｓｉ：０．２〜０．６質量％、Ｍｇ：０．４５〜０．９質量％、Ｆｅ：０．３５質量％以下、Ｃｒ：０．１質量％以下、Ｚｎ：０．１質量％以下を含有し、残部Ａｌおよび不可避不純物からなるアルミニウム合金が挙げられる。
上記ｉｉｉ）の合金としては、Ｓｉ：０．４質量％以下、Ｍｇ：２．１〜２．９質量％、Ｆｅ：０．５質量％以下、Ｃｕ：１．２〜２．０質量％、Ｍｎ：０．３質量％以下、Ｃｒ：０．１８〜０．２８質量％、Ｚｎ：５．１〜６．１質量％を含有し、残部Ａｌおよび不可避不純物からなるアルミニウム合金が挙げられる。
これらの中でも、特に、Ｓｉ：０．２〜０．６質量％、Ｍｇ：０．４５〜０．９質量％、Ｆｅ：０．３５質量％以下、Ｃｒ：０．１質量％以下、Ｚｎ：０．１質量％以下を含有し、残部Ａｌおよび不可避不純物からなるアルミニウム合金よりなるアルミニウム合金圧延板材(2)が、小型電子機器ケースの成形材料として好適である。
また、使用するアルミニウム合金圧延板材(2)の厚さは、成形条件や成形品であるケースのサイズ等に応じて適宜設定されるが、好ましくは０．５〜３．５ｍｍ、より好ましくは０．８〜１．２ｍｍとなされる。
As the rolled aluminum alloy plate material (2), a material having a 0.2% proof stress of 200 MPa or more, preferably 250 MPa or more, and more preferably 300 MPa or more is used. This gives the desired case strength. Further, as the aluminum alloy rolled plate material (2), one having a breaking elongation of 5% or more and 20% or less is preferably used. This improves the moldability of drawing. Here, "0.2% proof stress" and "break elongation" are based on a tensile test in the direction parallel to the rolling direction using the No. 5 test piece specified in JIS Z2241-2011.
Further, the rolled aluminum alloy plate material (2) has a fibrous crystal structure extending in a direction orthogonal to the thickness direction.
The fibrous crystal structure is formed by hot-rolling the homogenized aluminum alloy cast soul, heat-treating it under predetermined conditions, and then cold-rolling it. The heat treatment is carried out by holding at 200 to 400 ° C. for 1 hour or more. By the heat treatment, Mg 2 Si can be finely and uniformly precipitated, and the processing strain existing in the rolled material can be reduced. It is possible to obtain a high-strength aluminum alloy rolled plate material as long as it is work-hardened by the subsequent cold working and the subsequent moldability is not impaired.
The conditions for the homogenization treatment of the aluminum alloy casting soul are not particularly limited, and it is preferably carried out at 500 ° C. or higher and 2 hours or longer according to a conventional method.
In hot rolling, the same effect as quenching is obtained by the temperature drop during rolling under a predetermined temperature condition in an arbitrary pass process. Therefore, the material temperature before the pass needs to be a temperature at which Mg and Si can be maintained in a solid solution state, and is set to 350 to 440 ° C. In order to set the pass rising temperature in the temperature range of 200 to 400 ° C., forced cooling such as high-pressure shower water cooling may be performed immediately after hot rolling. Further, in order to obtain the quenching effect, the cooling rate between passes is 50 ° C./min or more, the pass rising temperature is 250 to 340 ° C., the pass rolling speed is 50 m / min or more, and the rising plate thickness is 10 mm or less. ..
In cold rolling, the rolling reduction is set to 30% or more in order to obtain a predetermined strength by work hardening. The preferable reduction rate is 50% or more.
Further, if necessary, the cold-rolled alloy plate can be finally annealed at a temperature of 130 to 150 ° C. By performing the heat treatment at a low temperature, the age hardening can be performed to further improve the strength and the elongation. It also has the effect of stabilizing various mechanical properties.
As the rolled aluminum alloy plate material (2), one made of any of the following aluminum alloys is preferably used.
i) Al-Mn-Mg based alloy containing Mn: 0.2 to 0.7% by mass, Mg: 2.0 to 5.0% by mass, and the balance Al and unavoidable impurities ii) Si: 0.2 Al—Si—Mg-based alloy iii) Zn: 4.0 to 6.5% by mass, containing ~ 0.8% by mass, Mg: 0.4 to 1.2% by mass, and the balance Al and unavoidable impurities. Al-Zn-Mg-based alloy containing Mg: 0.5 to 3.0% by mass and composed of the balance Al and unavoidable impurities As the alloy of i) above, Si: 0.4% by mass or less, Mn: 0. 4 to 0.6% by mass, Mg: 4.0 to 4.9% by mass, Fe: 0.4% by mass or less, Cr: 0.05 to 0.25% by mass, Zn: 0.25% by mass or less Examples thereof include aluminum alloys containing the balance Al and unavoidable impurities.
Examples of the alloy of ii) include Si: 0.2 to 0.6% by mass, Mg: 0.45 to 0.9% by mass, Fe: 0.35% by mass or less, Cr: 0.1% by mass or less, Examples thereof include an aluminum alloy containing Zn: 0.1% by mass or less and composed of the balance Al and unavoidable impurities.
Examples of the alloy of iii) include Si: 0.4% by mass or less, Mg: 2.1 to 2.9% by mass, Fe: 0.5% by mass or less, Cu: 1.2 to 2.0% by mass, Examples thereof include aluminum alloys containing Mn: 0.3% by mass or less, Cr: 0.18 to 0.28% by mass, Zn: 5.1 to 6.1% by mass, and the balance Al and unavoidable impurities.
Among these, Si: 0.2 to 0.6% by mass, Mg: 0.45 to 0.9% by mass, Fe: 0.35% by mass or less, Cr: 0.1% by mass or less, Zn: An aluminum alloy rolled plate material (2) containing 0.1% by mass or less and made of an aluminum alloy composed of the balance Al and unavoidable impurities is suitable as a molding material for a small electronic device case.
The thickness of the rolled aluminum alloy plate material (2) to be used is appropriately set according to the molding conditions, the size of the case which is the molded product, and the like, but is preferably 0.5 to 3.5 mm, more preferably 0. It is made to be 0.8 to 1.2 mm.
各被覆材(3)(4)は、アルミニウム合金圧延板材(2)を絞り加工する際の成形性を向上させ、また、成形時の潤滑剤の使用を低減し、加えて、成形時に板材(2)表面に傷が付くのを防止し、さらには、ケース成形後、例えば後工程（切削、研磨等）前の保管時や運搬時等にケース表面を保護するためのものである。 Each of the coating materials (3) and (4) improves the moldability when drawing the rolled aluminum alloy plate material (2), reduces the use of a lubricant during molding, and in addition, the plate material (2) during molding. 2) The purpose is to prevent the surface from being scratched, and to protect the case surface after molding the case, for example, during storage or transportation before post-processes (cutting, polishing, etc.).
第１の被覆材(3)は、アルミニウム合金圧延板材(2)の両面のうち小型電子機器ケースの外面となる面（図１では下面）に積層されるものである。アルミニウム合金圧延板材(2)の下面は、絞り加工時に金型によってしごかれるため、同面を覆う被覆材としては、成形に追随しうる伸びが要求されるとともに、金型によるしごきに耐え得る強度がより多く要求される。そのため、第１の被覆材(3)を構成する合成樹脂フィルム(31)には、強度に優れたポリエステル樹脂フィルム、ポリアミド樹脂フィルムを用いることができる。特に、２軸延伸ポリエチレンテレフタレート樹脂フィルム（ＰＥＴ）、２軸延伸ポリエチレンナフタレート樹脂フィルム（ＰＥＮ）、２軸延伸６−ナイロン樹脂フィルム（ＯＮｙ）が好適に用いられ、また、その厚さは２５〜７５μｍであるのが好ましい。同フィルム(31)の厚さが２５μｍ未満であると、金型によるしごきによってフィルム(31)が破断し、成形品であるケースの外面に傷が付くおそれがある。一方、上記フィルム(31)の厚さが７５μｍを超えると、コストが高くなる上、フィルム(31)の剛性が大きすぎてケースの曲げ成形された部分から浮き上がったり剥がれたりするおそれがある。上記フィルム(31)には、引張強度１８０〜３３０ＭＰａ、引張破断伸び８０〜１８０％のものを適宜使用することができる。中でも、引張強度または引張破断伸びのＭＤ／ＴＤの比が０．８〜１．２の範囲のフィルムを好適に使用することができる。 The first coating material (3) is laminated on the outer surface (lower surface in FIG. 1) of the aluminum alloy rolled plate material (2) which is the outer surface of the small electronic device case. Since the lower surface of the rolled aluminum alloy plate (2) is squeezed by the mold during drawing, the coating material covering the same surface is required to have an elongation that can follow the molding and can withstand the squeezing by the mold. More strength is required. Therefore, a polyester resin film or a polyamide resin film having excellent strength can be used as the synthetic resin film (31) constituting the first coating material (3). In particular, biaxially stretched polyethylene terephthalate resin film (PET), biaxially stretched polyethylene naphthalate resin film (PEN), and biaxially stretched 6-nylon resin film (ONy) are preferably used, and the thickness thereof is 25 to 25 to. It is preferably 75 μm. If the thickness of the film (31) is less than 25 μm, the film (31) may be broken by ironing with a mold and the outer surface of the case, which is a molded product, may be scratched. On the other hand, if the thickness of the film (31) exceeds 75 μm, the cost increases and the rigidity of the film (31) is too high, which may cause the film (31) to float or peel off from the bent-molded portion of the case. As the film (31), a film having a tensile strength of 180 to 330 MPa and a tensile elongation at break of 80 to 180% can be appropriately used. Above all, a film having an MD / TD ratio of tensile strength or tensile elongation at break in the range of 0.8 to 1.2 can be preferably used.
第２の被覆材(4)は、アルミニウム合金圧延板材(2)の両面のうち小型電子機器ケースの内面となる面（図１では上面）に積層されるものである。アルミニウム合金圧延板材(2)の上面は、絞り加工時に金型によってしごかれることがなく、凹方向に曲げ成形される部分が生じるため、同面を覆う被覆材としては、強度よりも柔らかさが要求される。そのため、第２の被覆材(4)を構成する合成樹脂フィルム（41）には、柔軟性に優れたポリエチレン樹脂フィルム、ポリプロピレン樹脂フィルムまたはポリアミド樹脂フィルムが好適に用いられ、より好適には、未延伸ポリエチレン樹脂フィルム、未延伸ポリプロピレン樹脂フィルム（ＣＰＰ）、延伸ポリプロピレン樹脂フィルム（ＯＰＰ）、または延伸ナイロン樹脂フィルム（ＯＮｙ）が用いられる。また、同フィルム(41)の厚さは１０〜５０μｍであるのが好ましい。同フィルム(41)の厚さが１０μｍ未満であると、成形加工時や運搬時に、製造機器やケース等の突起部分と接触してフィルム(41)が破断し、成形品であるケースの内面に傷が付くおそれがある。一方、上記フィルム(41)の厚さが５０μｍを超えると、フィルム(41)の剛性が大きすぎてケースの曲げ成形された部分から浮き上がったり剥がれたりするおそれがあり、また、ケースの曲げ成形された部分の曲率半径（Ｒ）が大きくなってシャープな形状が得られないおそれがある。上記のフィルム（41）には、ヤング率が３０〜４００ＭＰａのものを好適に使用することができる。 The second coating material (4) is laminated on the inner surface (upper surface in FIG. 1) of the aluminum alloy rolled plate material (2) which is the inner surface of the small electronic device case. The upper surface of the rolled aluminum alloy plate (2) is not squeezed by the mold during drawing, and there is a part that is bent and molded in the concave direction. Therefore, it is softer than strength as a covering material that covers the same surface. Is required. Therefore, as the synthetic resin film (41) constituting the second coating material (4), a polyethylene resin film, a polypropylene resin film or a polyamide resin film having excellent flexibility is preferably used, and more preferably not. A stretched polyethylene resin film, an unstretched polypropylene resin film (CPP), a stretched polypropylene resin film (OPP), or a stretched nylon resin film (ONy) is used. The thickness of the film (41) is preferably 10 to 50 μm. If the thickness of the film (41) is less than 10 μm, the film (41) will break due to contact with protruding parts such as manufacturing equipment and cases during molding and transportation, and the inner surface of the case, which is a molded product, will be exposed. It may be scratched. On the other hand, if the thickness of the film (41) exceeds 50 μm, the rigidity of the film (41) is too large and may be lifted or peeled off from the bent-molded portion of the case, and the case is bent-molded. There is a possibility that the radius of curvature (R) of the formed portion becomes large and a sharp shape cannot be obtained. As the above film (41), a film having a Young's modulus of 30 to 400 MPa can be preferably used.
なお、被覆材は、アルミニウム合金圧延板材(2)の両面のうち少なくとも一方の面、より具体的には、ケースの外面を構成する面に積層されていればよいが、成形性の向上や成形時・成形後のケース表面の保護を考慮すると、この実施形態のように、アルミニウム合金圧延板材(2)の両面に積層されているのが好ましい。 The covering material may be laminated on at least one surface of both sides of the rolled aluminum alloy plate material (2), more specifically, on the surface constituting the outer surface of the case, but the formability can be improved and molding can be performed. Considering the protection of the case surface after time and molding, it is preferable that the aluminum alloy rolled plate material (2) is laminated on both sides as in this embodiment.
各被覆材(3)(4)を構成する合成樹脂フィルム(31)(41)の片面、より具体的には、これらのフィルム(31)(41)の両面のうちアルミニウム合金圧延板(2)に積層される側の面に、それぞれ粘着剤層(32)(42)が形成されている。これらの粘着剤層(32)(42)を介して、各被覆材(3)(4)がアルミニウム合金圧延板材(2)の面に剥離可能に積層されている。
粘着剤層(32)(42)には、例えば、ウレタン系粘着剤、アクリル系粘着剤、ゴム系粘着剤が用いられる。アルミニウム合金圧延板材(2)に対する粘着剤層(32)(42)の粘着力は、好ましくは１〜１０Ｎ／２５ｍｍとなされる。ここで、「粘着力」は、ＪＩＳ Ｚ ０２３７：２０００に準拠した１８０°引き剥がし粘着力によって表されたものである。粘着剤層(32)(42)の粘着力が１Ｎ／２５ｍｍ未満であると、ケース成形前のアルミニウム合金圧延積層板材(1)を取り扱う際等に、アルミニウム合金圧延板材(2)から被覆材(3)(4)が不用意に剥がれやすくなる一方、粘着剤層(32)(42)の粘着力が１０Ｎ／２５ｍｍを超えると、ケース成形後に被覆材(3)(4)を剥離除去する際の作業性が低下する上、粘着剤の一部がケースの表面に残って後工程の研磨等で不具合が生じるおそれがある。
One side of the synthetic resin films (31) (41) constituting each of the coating materials (3) (4), more specifically, the aluminum alloy rolled plate (2) of both sides of these films (31) (41). Adhesive layers (32) and (42) are formed on the surfaces to be laminated on the surface, respectively. Through these pressure-sensitive adhesive layers (32) and (42), the coating materials (3) and (4) are releasably laminated on the surface of the rolled aluminum alloy plate material (2).
For the pressure-sensitive adhesive layers (32) and (42), for example, a urethane-based pressure-sensitive adhesive, an acrylic-based pressure-sensitive adhesive, and a rubber-based pressure-sensitive adhesive are used. Adhesive strength of the pressure-sensitive adhesive layer to an aluminum alloy rolled sheet (2) (32) (42) is made with preferably 1 ~ 10 N / 25mm. Here, the "adhesive strength" is expressed by the 180 ° peeling adhesive strength according to JIS Z 0237: 2000. If the adhesive strength of the pressure-sensitive adhesive layers (32) and (42) is less than 1 N / 25 mm, the aluminum alloy rolled sheet metal (2) to the coating material (2) may be used when handling the aluminum alloy rolled laminated sheet metal (1) before case molding. 3) While (4) tends to peel off carelessly, if the adhesive strength of the pressure-sensitive adhesive layers (32) and (42) exceeds 10 N / 25 mm, the covering materials (3) and (4) are peeled off after case molding. In addition to lowering workability, a part of the adhesive may remain on the surface of the case, causing problems in post-process polishing and the like.
図３は、上記アルミニウム合金圧延積層板材(1)を絞り加工して、小型電子機器ケースを成形する工程を示したものである。
まず、所定寸法にカットされた略方形状のアルミニウム合金圧延積層板材(1)を、金型の下側の固定雌型（ダイ）(5)の上面にセットする（図３（ａ）参照）。ここで、アルミニウム合金圧延積層板材(1)の上下両面のうち少なくともケースの外側となる下面、即ち、下側の被覆材(3)の表面に、例えばシリコーン系潤滑剤、鉱油、合成石油系潤滑剤よりなる潤滑剤を塗布しておくのが好ましく、それによってさらに成形性が高められる。
そして、金型の上側の可動雄型（ポンチ）(6)を降下させると、アルミニウム合金圧延積層板材(1)のうち周縁部を除いた部分が雄型(6)の先端部で下向きに加圧され、それによって同周縁部の直線部分が上向きに曲げられるとともに、同周縁部のコーナー部分が絞り成形される（図３（ｂ）参照）。この際、アルミニウム合金圧延板材(2)は、その両面が被覆材(3)(4)で覆われているため、皺が生じるのが抑制され、結果的に割れも発生しない。また、アルミニウム合金圧延板材(2)の表面は、雌型(5)および雄型(6)とは直に接触しないので、擦れて傷が付くことがない。
こうして、被覆材(3)(4)付き小型電子機器ケース(20)が得られる。小型電子機器ケース(20)の表面は、被覆材(3)(4)で覆われているため、例えば後工程に置かれるまでの保管時や運搬時等に他の物品等と接触して傷が付くことがなく、美しい状態に保持される。
FIG. 3 shows a process of forming a small electronic device case by drawing the aluminum alloy rolled laminated plate material (1).
First, a substantially rectangular aluminum alloy rolled laminated plate material (1) cut to a predetermined size is set on the upper surface of the fixed female mold (die) (5) on the lower side of the mold (see FIG. 3 (a)). .. Here, on the lower surface of the aluminum alloy rolled laminated plate material (1), which is at least the outer side of the case, that is, the surface of the lower coating material (3), for example, silicone-based lubricant, mineral oil, synthetic petroleum-based lubricant. It is preferable to apply a lubricant composed of an agent, which further enhances moldability.
Then, when the movable male mold (punch) (6) on the upper side of the mold is lowered, the portion of the aluminum alloy rolled laminated plate material (1) excluding the peripheral portion is added downward at the tip of the male mold (6). The pressure is applied so that the straight portion of the peripheral edge portion is bent upward and the corner portion of the peripheral edge portion is drawn and formed (see FIG. 3B). At this time, since both sides of the rolled aluminum alloy plate material (2) are covered with the coating materials (3) and (4), wrinkles are suppressed, and as a result, cracks do not occur. Further, since the surface of the rolled aluminum alloy plate (2) does not come into direct contact with the female mold (5) and the male mold (6), it is not rubbed and scratched.
In this way, a small electronic device case (20) with covering materials (3) and (4) is obtained. Since the surface of the small electronic device case (20) is covered with the covering materials (3) and (4), it may be scratched by contact with other articles during storage or transportation until it is placed in a subsequent process, for example. It is kept in a beautiful state without sticking.
図４は、小型電子機器ケース(20)を示すものである。このケース(20)は、上記の被覆材(3)(4)付き小型電子機器ケース(20)の内外両面から被覆材(3)(4)を剥がして除去した後、部分的に切削加工等を施して仕上げ成形し、さらに表面をアルマイト処理することにより得られたものである。
小型電子機器ケース(20)は、平面より見て略方形状の底壁(21)と、底壁(21)の４辺からそれぞれ立ち上がった４つの側壁(22)とで構成されている。隣り合う側壁(22)の端部どうしは連続しており、４つの側壁(22)によって底壁(21)が囲繞されている。
側壁(22)の高さ（換言すれば、成形高さ）は、０．５〜２５ｍｍ、好ましくは１〜１５ｍｍ、さらに好ましくは２〜１０ｍｍである。
底壁(21)に対する側壁(22)の角度は、９０〜１５０°（図示のものは約９０°）、好ましくは９０〜１２０°、さらに好ましくは９０〜１００°である。
底壁(21)と側壁(22)との境界部にはアールが付けられており、また、側壁(22)のコーナー部(22a)にもアールが付けられている。これらアール部分においては、繊維状の結晶組織が、アールに沿うようにのびているのが好ましい。
FIG. 4 shows a small electronic device case (20). In this case (20), the covering materials (3) and (4) are peeled off from both the inner and outer sides of the small electronic device case (20) with the covering materials (3) and (4), and then partially cut. It was obtained by applying a finish molding to the surface and then anodizing the surface.
The small electronic device case (20) is composed of a bottom wall (21) which is substantially rectangular when viewed from a plane, and four side walls (22) which rise from four sides of the bottom wall (21). The ends of adjacent side walls (22) are continuous, and the bottom wall (21) is surrounded by four side walls (22).
The height of the side wall (22) (in other words, the molding height) is 0.5 to 25 mm, preferably 1 to 15 mm, and more preferably 2 to 10 mm.
The angle of the side wall (22) with respect to the bottom wall (21) is 90 to 150 ° (the one shown is about 90 °), preferably 90 to 120 °, and more preferably 90 to 100 °.
The boundary between the bottom wall (21) and the side wall (22) is rounded, and the corner (22a) of the side wall (22) is also rounded. In these rounded portions, it is preferable that the fibrous crystal structure extends along the rounded portion.
次に、この発明の具体的実施例について説明する。但し、この発明は、これらの実施例に限定されるものではない。 Next, specific examples of the present invention will be described. However, the present invention is not limited to these examples.
＜実施例１＞
Ｓｉ：０．２〜０．６質量％、Ｍｇ：０．４５〜０．９質量％、Ｆｅ：０．３５質量％以下、Ｃｒ：０．１質量％以下、Ｚｎ：０．１質量％以下を含有し、残部Ａｌおよび不可避不純物からなるアルミニウム合金鋳魂を５８０℃、１０時間で均質化処理した後に面削して、５００℃で予備加熱を行い、熱間圧延を開始した。熱間圧延の最終パス開始温度を４００℃とし、パス後、８０℃／分の速度で冷却した。その後、２４０℃、４時間の条件で熱処理を行った。その後、８６％の圧下率で冷間圧延を行った。こうして、０．２％耐力が３１０ＭＰａ、破断伸びが７％である厚さ１ｍｍのアルミニウム合金圧延板材を得た。
そして、小型電子機器ケースの外面を構成するアルミニウム合金圧延板材の下面に、第１の被覆材として、厚さ５０μｍの２軸延伸ポリエチレンテレフタレート樹脂フィルム（ＰＥＴ）を、厚さ３０μｍのアクリル系粘着剤よりなる粘着剤層を介して積層した。ここで、アルミニウム合金圧延板材に対する粘着剤層の粘着力は、５Ｎ／２５ｍｍとした。
こうして得られたアルミニウム合金圧延積層板材を、縦１５０ｍｍ、横８２ｍｍ、コーナー部アール１４．５ｍｍの略方形状にカットして、実施例１の成形材料を作製した。
<Example 1>
Si: 0.2 to 0.6% by mass, Mg: 0.45 to 0.9% by mass, Fe: 0.35% by mass or less, Cr: 0.1% by mass or less, Zn: 0.1% by mass or less The aluminum alloy casting soul containing the balance Al and unavoidable impurities was homogenized at 580 ° C. for 10 hours, then chamfered, preheated at 500 ° C., and hot rolling was started. The final pass start temperature of hot rolling was set to 400 ° C., and after the pass, cooling was performed at a rate of 80 ° C./min. Then, the heat treatment was performed under the conditions of 240 ° C. and 4 hours. Then, cold rolling was performed at a rolling reduction of 86%. In this way, an aluminum alloy rolled plate material having a thickness of 1 mm and a 0.2% proof stress of 310 MPa and a breaking elongation of 7% was obtained.
Then, as a first coating material, a biaxially stretched polyethylene terephthalate resin film (PET) having a thickness of 50 μm is applied to the lower surface of the rolled aluminum alloy plate material constituting the outer surface of the small electronic device case, and an acrylic pressure-sensitive adhesive having a thickness of 30 μm. It was laminated via an adhesive layer made of. Here, the adhesive strength of the pressure-sensitive adhesive layer to the rolled aluminum alloy plate material was set to 5 N / 25 mm.
The aluminum alloy rolled laminated plate material thus obtained was cut into a substantially rectangular shape having a length of 150 mm, a width of 82 mm, and a corner radius of 14.5 mm to prepare a molding material of Example 1.
＜実施例２＞
アルミニウム合金圧延板材と第１の被覆材とを積層する粘着剤層の粘着力を９Ｎ／２５ｍｍとした点を除いて、実施例１と同じ要領で、実施例２の成形材料を作製した。
<Example 2>
The molding material of Example 2 was produced in the same manner as in Example 1 except that the adhesive force of the pressure-sensitive adhesive layer in which the rolled aluminum alloy plate material and the first coating material were laminated was 9 N / 25 mm.
＜比較例１＞
アルミニウム合金圧延板材と第１の被覆材とを積層する粘着剤層の粘着力を１５Ｎ／２５ｍｍとした点を除いて、実施例１と同じ要領で、比較例１の成形材料を作製した。
< Comparative example 1 >
The molding material of Comparative Example 1 was produced in the same manner as in Example 1 except that the adhesive strength of the pressure-sensitive adhesive layer in which the rolled aluminum alloy plate material and the first coating material were laminated was 15 N / 25 mm.
＜比較例２＞
第１の被覆材を構成する２軸延伸ポリエチレンテレフタレート樹脂フィルム（ＰＥＴ）の厚さを１００μｍとし、アルミニウム合金圧延板材と第１の被覆材とを積層する粘着剤層の粘着力を１５Ｎ／２５ｍｍとした点を除いて、実施例１と同じ要領で、比較例２の成形材料を作製した。
< Comparative example 2 >
The thickness of the biaxially stretched polyethylene terephthalate resin film (PET) constituting the first coating material is 100 μm, and the adhesive strength of the pressure-sensitive adhesive layer for laminating the rolled aluminum alloy plate material and the first coating material is 15 N / 25 mm. The molding material of Comparative Example 2 was prepared in the same manner as in Example 1 except for the above points.
＜実施例３＞
第１の被覆材として厚さ５０μｍの延伸ナイロン樹脂フィルム（ＯＮｙ）を使用し、アルミニウム合金圧延板材と第１の被覆材とを積層する粘着剤層の粘着力を５Ｎ／２５ｍｍとした点を除いて、実施例１と同じ要領で、実施例３の成形材料を作製した。
<Example 3 >
Except for the fact that a stretched nylon resin film (ONy) having a thickness of 50 μm was used as the first coating material, and the adhesive strength of the pressure-sensitive adhesive layer for laminating the rolled aluminum alloy plate material and the first coating material was 5 N / 25 mm. Then, the molding material of Example 3 was prepared in the same manner as in Example 1.
＜実施例４＞
第１の被覆材を構成する２軸延伸ポリエチレンテレフタレート樹脂フィルム（ＰＥＴ）の厚さを２５μｍとした点を除いて、実施例１と同じ要領で、実施例４の成形材料を作製した。
<Example 4 >
The molding material of Example 4 was prepared in the same manner as in Example 1 except that the thickness of the biaxially stretched polyethylene terephthalate resin film (PET) constituting the first coating material was 25 μm.
＜比較例３＞
第１の被覆材として厚さ７０μｍの線状低密度ポリエチレン樹脂フィルム（ＬＬＤＰＥ）を使用し、アルミニウム合金圧延板材と第１の被覆材とを積層する粘着剤層の粘着力を２Ｎ／２５ｍｍとした点を除いて、実施例１と同じ要領で、比較例３の成形材料を作製した。
< Comparative example 3 >
Using the thickness of 70μm linear low density polyethylene resin film arm of (LLDPE) as the first coating material, and 2N / 25 mm the adhesion of the pressure-sensitive adhesive layer for laminating the aluminum alloy rolled sheet of the first covering member The molding material of Comparative Example 3 was prepared in the same manner as in Example 1 except for the above points.
＜比較例４＞
第１の被覆材を構成する２軸延伸ポリエチレンテレフタレート樹脂フィルム（ＰＥＴ）の厚さを７５μｍとし、アルミニウム合金圧延板材と第１の被覆材とを積層する粘着剤層の粘着力を２０Ｎ／２５ｍｍとした点を除いて、実施例１と同じ要領で、比較例４の成形材料を作製した。
< Comparative example 4 >
The thickness of the biaxially stretched polyethylene terephthalate resin film (PET) constituting the first coating material is 75 μm, and the adhesive strength of the pressure-sensitive adhesive layer for laminating the rolled aluminum alloy plate material and the first coating material is 20 N / 25 mm. The molding material of Comparative Example 4 was prepared in the same manner as in Example 1 except for the above points.
＜実施例５＞
実施例１で使用したものと同じアルミニウム合金圧延板材を用意した。
次いで、小型電子機器ケースの内面を構成するアルミニウム合金圧延板材の上面に、第２の被覆材として、厚さ５０μｍの線状低密度ポリエチレン樹脂フィルム（ＬＬＤＰＥ）を、厚さ３０μｍのアクリル系粘着剤よりなる粘着剤層を介して積層した。ここで、アルミニウム合金圧延板材に対する粘着剤層の粘着力は、５Ｎ／２５ｍｍとした。
こうして得られたアルミニウム合金圧延積層板材を、縦１５０ｍｍ、横８２ｍｍ、コーナー部アール１４．５ｍｍの略方形状にカットして、実施例５の成形材料を作製した。
<Example 5 >
The same rolled aluminum alloy plate material used in Example 1 was prepared.
Then, the upper surface of the aluminum alloy rolled sheet constituting the inner surface of the small-sized electronic apparatus case, as the second coating material,
The aluminum alloy rolled laminated plate material thus obtained was cut into a substantially rectangular shape having a length of 150 mm, a width of 82 mm, and a corner radius of 14.5 mm to prepare a molding material of Example 5 .
＜比較例５＞
第２の被覆材を構成する線状低密度ポリエチレン樹脂フィルム（ＬＬＤＰＥ）の厚さを７０μｍとし、アルミニウム合金圧延板材と第２の被覆材とを積層する粘着剤層の粘着力を２Ｎ／２５ｍｍとした点を除いて、実施例５と同じ要領で、比較例５の成形材料を作製した。
< Comparative example 5 >
The thickness of the linear low density polyethylene resin film arm constituting the second coating material (LLDPE) and 70 [mu] m, an aluminum alloy rolled sheet and the second coating material and 2N / 25 mm the adhesion of the pressure-sensitive adhesive layer for laminating the The molding material of Comparative Example 5 was prepared in the same manner as in Example 5 except for the above points.
＜参照例１＞
第２の被覆材として厚さ５０μｍの２軸延伸ポリエチレンテレフタレート樹脂フィルム（ＰＥＴ）を使用した点を除いて、実施例５と同じ要領で、参照例１の成形材料を作製した。
< Reference example 1 >
The molding material of Reference Example 1 was prepared in the same manner as in Example 5 except that a biaxially stretched polyethylene terephthalate resin film (PET) having a thickness of 50 μm was used as the second coating material.
＜実施例６＞
第２の被覆材を構成する線状低密度ポリエチレン樹脂フィルム（ＬＬＤＰＥ）の厚さを２５μｍとし、アルミニウム合金圧延板材と第２の被覆材とを積層する粘着剤層の粘着力を３Ｎ／２５ｍｍとした点を除いて、実施例５と同じ要領で、実施例６の成形材料を作製した。
<Example 6 >
The thickness of the linear low density polyethylene resin film arm constituting the second coating material (LLDPE) and 25 [mu] m, an aluminum alloy rolled sheet and the second coating material and 3N / 25 mm the adhesion of the pressure-sensitive adhesive layer for laminating the The molding material of Example 6 was prepared in the same manner as in Example 5 except for the above points.
＜比較例６＞
第２の被覆材として厚さ１００μｍの２軸延伸ポリエチレンテレフタレート樹脂フィルム（ＰＥＴ）を使用し、アルミニウム合金圧延板材と第２の被覆材とを積層する粘着剤層の粘着力を２Ｎ／２５ｍｍとした点を除いて、実施例５と同じ要領で、比較例６の成形材料を作製した。
< Comparative example 6 >
A biaxially stretched polyethylene terephthalate resin film (PET) having a thickness of 100 μm was used as the second coating material, and the adhesive strength of the pressure-sensitive adhesive layer for laminating the rolled aluminum alloy plate material and the second coating material was set to 2N / 25 mm. The molding material of Comparative Example 6 was prepared in the same manner as in Example 5 except for the points.
＜小型電子機器ケースの成形＞
実施例、比較例及び参照例の成形材料を、図３に示す絞り加工装置を用いて絞り加工することにより、縦１４０ｍｍ、横７０ｍｍ、側壁高さ（成形高さ）１０ｍｍ、側壁コーナー部アール２ｍｍである小型電子機器ケースを成形した。底壁に対する側壁の角度は９０°とした。
<Molding of small electronic device case>
By drawing the molding materials of Examples , Comparative Examples, and Reference Examples using the drawing apparatus shown in FIG. 3, the length is 140 mm, the width is 70 mm, the side wall height (molding height) is 10 mm, and the side wall corner portion is 2 mm. A small electronic device case was molded. The angle of the side wall with respect to the bottom wall was 90 °.
実施例１〜２，比較例１〜２，実施例３〜４，及び比較例３〜４の成形材料から成形された小型電子機器ケースを１０個ずつ用意し、これらのケースについて、成形による第１の被覆材の破断やケース外面への傷の発生の有無、および成形による第１の被覆材の剥がれ・浮きの発生の有無を目視により確認した。また、成形されたケースの外面から第１の被覆材を手で引き剥がし、その剥がしやすさを比較検証した。さらに、各成形材料のコストを検証した。
同様に、実施例５，比較例５，参照例１，実施例６及び比較例６の成形材料から成形された小型電子機器ケースを１０個ずつ用意し、これらのケースについて、成形による第２の被覆材の破断やケース内面への傷の発生の有無、および成形による第２の被覆材の剥がれ・浮きの発生の有無を目視により確認した。また、成形されたケースの内面から第２の被覆材を手で引き剥がし、その剥がしやすさを比較検証した。さらに、各成形材料のコストを検証した。
結果を以下の表１にまとめて示す。
10 small electronic device cases molded from the molding materials of Examples 1 to 2, Comparative Examples 1 to 2, Examples 3 to 4, and Comparative Examples 3 to 4 were prepared, and these cases were formed by molding. It was visually confirmed whether or not the covering material of No. 1 was broken or scratched on the outer surface of the case, and whether or not the first covering material was peeled off or floated due to molding. Further, the first covering material was manually peeled off from the outer surface of the molded case, and the ease of peeling off was compared and verified. Furthermore, the cost of each molding material was verified.
Similarly, 10 small electronic device cases molded from the molding materials of Example 5, Comparative Example 5, Reference Example 1, Example 6 and Comparative Example 6 were prepared, and for these cases, a second molding was performed. It was visually confirmed whether or not the covering material was broken or the inner surface of the case was scratched, and whether or not the second covering material was peeled off or floated due to molding. Further, the second covering material was manually peeled off from the inner surface of the molded case, and the ease of peeling off was compared and verified. Furthermore, the cost of each molding material was verified.
The results are summarized in Table 1 below.
実施例１〜２，比較例１〜２，実施例３〜４，及び比較例４の場合、第１の被覆材の破断やケース外面への傷の発生は全く見られなかった。比較例３では、第１の被覆材に金型のしごきによる破断が生じて、同箇所に対応するケース外面部分に擦り傷が付いているものが若干見られた。
実施例１〜２，比較例１，実施例３〜４，及び比較例３〜４では、第１の被覆材がケースの外面から剥離したり、ケースの折り曲げ部やコーナー部等において浮き上がったりするものは見られなかった。比較例２では、第１の被覆材について、ケースの外面からの剥離はないものの、ケースのコーナー部において若干の浮き上がりが生じていたものがあったが、いずれも実用上問題のないレベルであった。
実施例１〜４及び比較例３の場合、いずれも第１の被覆材をケースの外面からスムーズに剥がすことができた。比較例１〜２では、第１の被覆材をケース外面から剥がすのがやや難しいものがあった。また、比較例４では、第１の被覆材をケース外面から剥がすのが著しく困難であるものが多かった。
実施例１〜２，比較例１，実施例３〜４，比較例３の成形材料のコストは、比較的低く抑えられたが、比較例２の場合、第１の被覆材として使用したＰＥＴの厚さが７５μｍであるため、ややコストが高くなった。さらに、比較例２の場合、第１の被覆材として使用したＰＥＴの厚さが１００μｍであるため、かなりコストが高くなった。
実施例５，比較例５，参照例１，実施例６及び比較例６の場合、第２の被覆材の破断やケース内面への傷の発生は見られなかった。
実施例５，参照例１及び実施例６では、第２の被覆材がケースの内面から剥離したり、ケースの折り曲げ部やコーナー部等において浮き上がったりするものは見られなかった。比較例５では、第２の被覆材について、ケースの内面からの剥離はないものの、ケースのコーナー部において若干の浮き上がりが生じていたものがあったが、いずれも実用上問題のないレベルであった。比較例６の場合、第２の被覆材について、ケースの表面からの剥離や、ケースのコーナー部での浮き上がりが見られたものが多かった。
実施例５，比較例５，参照例１，実施例６及び比較例６の場合、いずれも第２の被覆材をケースの内面からスムーズに剥がすことができた。
実施例５，比較例５，参照例１及び実施例６の成形材料のコストは、比較的低く抑えられたが、比較例６の場合、第２の被覆材として使用したＰＥＴの厚さが１００μｍであるため、かなりコストが高くなった。
In the cases of Examples 1 and 2, Comparative Examples 1 and 2, Examples 3 and 4, and Comparative Example 4 , no breakage of the first coating material or damage to the outer surface of the case was observed. In Comparative Example 3 , the first coating material was broken due to the ironing of the mold, and the outer surface portion of the case corresponding to the same portion was slightly scratched.
In Examples 1 and 2, Comparative Example 1, Examples 3 to 4, and Comparative Examples 3 to 4 , the first coating material is peeled off from the outer surface of the case or lifted up at a bent portion or a corner portion of the case. Nothing was seen. In Comparative Example 2 , although the first covering material was not peeled off from the outer surface of the case, some of the first covering material was slightly lifted at the corners of the case, but all of them were at a level where there was no problem in practical use. It was.
In each of Examples 1 to 4 and Comparative Example 3 , the first covering material could be smoothly peeled off from the outer surface of the case. In Comparative Examples 1 and 2 , it was somewhat difficult to peel off the first covering material from the outer surface of the case. Further, in Comparative Example 4 , it was extremely difficult to peel off the first covering material from the outer surface of the case in many cases.
The cost of the molding material of Examples 1 and 2, Comparative Example 1, Examples 3 to 4, and Comparative Example 3 was kept relatively low, but in the case of Comparative Example 2 , the PET used as the first coating material was used. Since the thickness is 75 μm, the cost is slightly higher. Further, in the case of Comparative Example 2 , since the thickness of PET used as the first coating material was 100 μm, the cost was considerably high.
In the case of Example 5, Comparative Example 5, Reference Example 1, Example 6 and Comparative Example 6 , no breakage of the second coating material and no damage to the inner surface of the case were observed.
In Example 5, Reference Example 1 and Example 6 , no second covering material was found to be peeled off from the inner surface of the case or lifted at the bent portion or corner portion of the case. In Comparative Example 5 , although the second coating material was not peeled off from the inner surface of the case, there was a slight lift at the corner of the case, but all of them were at a level where there was no problem in practical use. It was. In the case of Comparative Example 6 , in many cases, the second covering material was peeled off from the surface of the case and lifted at the corners of the case.
In the cases of Example 5, Comparative Example 5, Reference Example 1, Example 6 and Comparative Example 6 , the second covering material could be smoothly peeled off from the inner surface of the case.
The cost of the molding material of Example 5, Comparative Example 5, Reference Example 1 and Example 6 was kept relatively low, but in the case of Comparative Example 6 , the thickness of PET used as the second coating material was 100 μm. Therefore, the cost was considerably high.
この発明は、タブレット端末、携帯通信端末機器、ノート型パソコン、携帯電話、携帯音楽機器、デジタルカメラ等の小型電子機器のケースを絞り加工によって成形するのに好適に利用することができる。 INDUSTRIAL APPLICABILITY The present invention can be suitably used for molding a case of a small electronic device such as a tablet terminal, a mobile communication terminal device, a notebook personal computer, a mobile phone, a portable music device, or a digital camera by drawing.
(1)：アルミニウム合金圧延積層板材
(2)：アルミニウム合金圧延板材
(3)：第１の被覆材
(31)：合成樹脂フィルム
(32)：粘着剤層
(4)：第２の被覆材
(41)：合成樹脂フィルム
(42)：粘着剤層
(5)：固定雌型
(6)：可動雄型
(20)：小型電子機器ケース
(21)：底壁
(22)：側壁
(22a)：（側壁の）コーナー部
(1): Aluminum alloy rolled laminated board material
(2): Aluminum alloy rolled plate material
(3): First covering material
(31): Synthetic resin film
(32): Adhesive layer
(4): Second covering material
(41): Synthetic resin film
(42): Adhesive layer
(5): Fixed female type
(6): Movable male type
(20): Small electronic device case
(21): Bottom wall
(22): Side wall
(22a): Corner (on the side wall)
Claims (4)
厚さ０．５〜３．５ｍｍのアルミニウム合金圧延板材と、
前記アルミニウム合金圧延板材の両面のうち小型電子機器ケースの外面となる面に剥離可能に積層させられた第１の被覆材と、
前記アルミニウム合金圧延板材の両面のうち小型電子機器ケースの内面となる面に剥離可能に積層させられた第２の被覆材とよりなり、
前記第１の被覆材は、ポリエステル樹脂フィルムまたはポリアミド樹脂フィルムよりなる厚さ２５〜７５μｍの合成樹脂フィルムと、その片面に形成された粘着剤層とよりなり、該合成樹脂フィルムは引張強度が１８０〜３３０ＭＰａであるとともに引張破断伸びが８０〜１８０％であり、かつ該粘着剤層は粘着力が１〜１０Ｎ／２５ｍｍであり、
前記第２の被覆材は、ポリエチレン樹脂フィルム、ポリプロピレン樹脂フィルムまたはポリアミド樹脂フィルムよりなる厚さ１０〜５０μｍの合成樹脂フィルムと、その片面に形成された粘着剤層とよりなり、該合成樹脂フィルムはヤング率が３０〜４００ＭＰａであり、かつ該粘着剤層は粘着力が１〜１０Ｎ／２５ｍｍであることを特徴とする、
アルミニウム合金圧延積層板材。 An aluminum alloy rolled laminated plate material for molding small electronic device cases by drawing .
Aluminum alloy rolled plate material with a thickness of 0.5 to 3.5 mm and
A first coating material that is detachably laminated on the outer surface of the small electronic device case among both sides of the rolled aluminum alloy plate material, and
It is composed of a second covering material that is detachably laminated on the inner surface of the small electronic device case on both sides of the rolled aluminum alloy plate material.
The first coating material comprises a synthetic resin film having a thickness of 25 to 75 μm made of a polyester resin film or a polyamide resin film, and an adhesive layer formed on one side thereof, and the synthetic resin film has a tensile strength of 180. The pressure is ~ 330 MPa, the tensile elongation at break is 80 to 180%, and the pressure-sensitive adhesive layer has a pressure of 1 to 10 N / 25 mm.
The second coating material comprises a synthetic resin film having a thickness of 10 to 50 μm made of a polyethylene resin film, a polypropylene resin film or a polyamide resin film, and a pressure-sensitive adhesive layer formed on one side thereof. The young ratio is 30 to 400 MPa, and the pressure-sensitive adhesive layer has a pressure-sensitive adhesive strength of 1 to 10 N / 25 mm.
Aluminum alloy rolled laminated board material.
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