JP6753105B2 - Identification device - Google Patents

Description

The present invention relates to a circuit board identification device.

Electronic devices such as in-vehicle products are required to have a traceability mechanism (hereinafter referred to as traceability) from the viewpoint of reliability. In the manufacturing line of electronic devices, traceability is realized by linking data related to manufacturing history to products for the purpose of improving quality and analyzing information related to equipment and inspections that make up the manufacturing line. In order to build a traceability mechanism at the production site, it is necessary to identify the product being manufactured.

When manufacturing and selling circuit boards such as printed wiring boards, traceability is required for the purposes of manufacturing process control, quality inspection, shipping inspection, sales control, etc. of board products. Therefore, individual identification information such as a product name, a product number, and a manufacturing date is set for each circuit board, and each circuit board is tracked based on the information.

In order to identify the circuit board, individual identification information for identifying each circuit board may be added to the circuit board. For example, in order to set individual identification information on a board, a label such as a barcode or QR code (registered trademark) on which individual identification information is printed or an RFID (Radio Frequency Identifier) storing individual identification information is directly placed on the circuit board. There is a way to paste it. In addition, there is a method of directly printing individual identification information on a substrate by using a laser marker, an inkjet or the like.

Patent Document 1 discloses an individual identification device that performs individual identification based on an arrangement pattern of fine substances given to an object. The apparatus of Patent Document 1 randomly applies a fine substance having polarization characteristics to an object, and uses feature quantity data obtained based on a polarized image obtained by photographing the object at a predetermined polarization angle to perform solid identification. Do.

By the way, when individual identification information is given to a substrate by a label or printing, a label for printing the individual identification information and a printing facility for printing the individual identification information on the substrate are required, so that the manufacturing cost is high. There is a problem. Further, when it is necessary to attach the individual identification information to the substrate or print it, there is a problem that the manufacturing time increases.

Patent Document 2 discloses a method of installing an individual identification display on a circuit board. In the method of Patent Document 2, a polyimide resin that forms an electrically insulating layer of an electric circuit of a circuit board is used to form a bar code that is an individual identification display on the substrate.

Patent Document 3 discloses an individual identification device that realizes traceability of a circuit board. The apparatus of Patent Document 3 measures the positions of a plurality of measurement targets on a substrate, acquires the difference between the design value and the measured value as position information for each measurement object, and obtains a combination of the acquired position information for each individual substrate. Used as identification information.

Japanese Unexamined Patent Publication No. 2013-30889 Japanese Unexamined Patent Publication No. 10-326050 Japanese Unexamined Patent Publication No. 2013-69838

According to the apparatus of Patent Document 1, the object can be verified with higher accuracy by applying a fine substance having polarization characteristics to the object. However, the device of Patent Document 1 requires a device for applying a fine substance, a device for capturing a polarized image, and the like, which causes a problem that the manufacturing cost increases.

According to the method of Patent Document 2, individual identification information can be added to the substrate in a normal manufacturing process. However, the method of Patent Document 2 has a problem that the traceability before forming the electric insulating layer of the electric circuit cannot be obtained because the solid identification information is not given to the substrate until the electric insulating layer of the electric circuit is formed. was there.

According to the apparatus of Patent Document 3, since the individual identification is performed based on the position information of the measurement target on the substrate, it is not necessary to give the individual identification information to the substrate by printing a barcode or the like. However, the apparatus of Patent Document 3 has a problem that the substrate at the stage before mounting the component to be measured cannot be identified.

An object of the present invention is to provide an identification device capable of identifying a substrate at an arbitrary point on a mounting line of a circuit board without impairing productivity.

The identification device of the present invention includes at least three of the front side surface and the rear side surface of the target substrate by a plurality of cameras that image the side surface of the target substrate being transported on the production line from either the front or the rear with respect to the transport direction. The feature amount is extracted from the image data of the target substrate imaged by the imaging unit and the image pickup unit that images the location, and the target substrate is registered by associating the extracted feature amount with the substrate information of the target substrate. It is provided with a substrate identification unit that identifies a target substrate by collating the feature amount extracted from the image data of the above with the registered feature amount.

According to the present invention, it is possible to provide an identification device capable of identifying a substrate at an arbitrary point on a mounting line of a circuit board without impairing productivity.

It is a block diagram which shows the structure of the identification device which concerns on 1st Embodiment of this invention. It is a block diagram which shows the structure of the substrate identification part of the identification apparatus which concerns on 1st Embodiment of this invention. It is a conceptual diagram which shows the arrangement example of a plurality of cameras which take a side image for registering and collating a substrate by the identification apparatus which concerns on 1st Embodiment of this invention. It is a conceptual diagram which shows the arrangement example of the camera which captures the side image for collating the substrate by the identification apparatus which concerns on 1st Embodiment of this invention. It is a conceptual diagram for demonstrating the state change when the identification device which concerns on 1st Embodiment of this invention turns over the substrate to be registered / collated. It is a flowchart for demonstrating the imaging process by the identification apparatus which concerns on 1st Embodiment of this invention. It is a flowchart for demonstrating the feature amount extraction process and the collation process by the identification apparatus which concerns on 1st Embodiment of this invention. It is a block diagram which shows the structure of the identification device which concerns on 2nd Embodiment of this invention. It is a block diagram which shows the structure of the drive control part of the identification device which concerns on 2nd Embodiment of this invention. It is a conceptual diagram for demonstrating the control example of the camera of the identification apparatus which concerns on 2nd Embodiment of this invention. It is a flowchart which shows an example of the operation of the identification apparatus which concerns on 2nd Embodiment of this invention. It is a conceptual diagram for demonstrating another control example of the camera of the identification apparatus which concerns on 2nd Embodiment of this invention. It is a conceptual diagram for demonstrating the control example of the substrate position of the identification apparatus which concerns on 2nd Embodiment of this invention. It is a conceptual diagram which shows the arrangement of a plurality of cameras which take a side image for registering and collating a substrate by the identification apparatus which concerns on 3rd Embodiment of this invention. It is a block diagram which shows the structure of the traceability system which concerns on 4th Embodiment of this invention. It is a flowchart for demonstrating the feature amount extraction process and the collation process by the traceability system which concerns on 4th Embodiment of this invention. It is a block diagram which shows an example of the hardware configuration for realizing the identification apparatus which concerns on embodiment of this embodiment.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, although the embodiments described below have technically preferable limitations for carrying out the present invention, the scope of the invention is not limited to the following. In all the drawings used in the following embodiments, the same reference numerals are given to the same parts unless there is a specific reason. Further, in the following embodiments, repeated explanations may be omitted for similar configurations and operations. Further, the direction of the arrow in the drawing shows an example, and does not limit the direction of the signal between blocks.

(First Embodiment)
(Constitution)
First, the configuration of the identification device 11 according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing a functional configuration of the identification device 11 of the present embodiment.

As shown in FIG. 1, the identification device 11 of the present embodiment includes an imaging unit 20 and a substrate identification unit 30. In the circuit board manufacturing line such as the SMT (Surface Mount Technology) line, the identification device 11 causes a camera arranged on the SMT line to image the side surface of the substrate, and identifies each substrate by using the feature amount extracted from the side surface of the substrate. To do.

The imaging unit 20 captures at least three locations included in the front side surface and the rear side surface of the target substrate by a plurality of cameras that image the side surface of the target substrate being transported on the production line from either the front or the rear with respect to the transport direction. Make an image. In the following, regarding the side surface of the substrate, the front side when viewed from the transport direction is described as the front side surface, and the rear side when viewed from the transport direction is described as the rear side surface.

The camera does not limit its form or function as long as it can image the side surface of the target substrate. For example, in the present embodiment, a general camera that captures a visible region can be used, and a digital camera that outputs image data as digital data is particularly preferable. Further, a device equipped with an image sensor such as a CCD (Charge-Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) may be used as the camera instead of the general shape of the camera. Further, a camera that detects light or electromagnetic waves having a wavelength outside the visible region, such as an infrared camera, an ultraviolet camera, an X-ray camera, or a terahertz camera, may be used.

Further, the camera may be a video camera that captures continuous frames to form a moving image. When a video camera is used, the substrate may be identified by a single frame constituting the moving image, or the substrate may be identified by combining a plurality of frames.

At the time of shooting, the camera is arranged at a position where at least one of the front side surface and the rear side surface is imaged. The camera is stored in a position that does not interfere with the transfer of the substrate during substrate transfer, and is moved to a position where the side surface of the substrate is imaged during imaging.

Near the entrance of the first step, a camera is arranged so as to image two locations equidistant from both side surfaces parallel to the substrate transport direction with respect to one of the front side surface and the rear side surface. That is, the cameras are arranged to face each other with respect to one of the front side surface and the rear side surface. Then, with respect to the other of the front side surface and the rear side surface, the camera is arranged so as to image a portion facing at least one of the two imaging locations on the opposite surface.

In the stage after the first step (hereinafter referred to as the second step), the cameras are arranged so as to capture at least one image pickup location of the camera arranged in the first step with respect to one of the front side surface and the rear side surface of the conveyed substrate. .. The cameras arranged in the subsequent process are arranged on the line connecting the two cameras arranged facing the first process.

The imaging unit 20 includes a registration imaging unit 21 for imaging both the front side surface and the rear side surface, and a collation imaging unit 22 for imaging one of the front side surface and the rear side surface.

The registration imaging unit 21 uses features extracted from a plurality of image data imaged by a plurality of cameras that image at least three locations including the front side surface and the rear side surface with respect to the target substrate transported to the leading process. Match and register the board. The registration imaging unit 21 causes one of a plurality of cameras to image three locations having an equal distance relationship from the left and right ends of the front side surface and the rear side surface of the target substrate.

For example, the registration imaging unit 21 controls the camera so as to image two front side surfaces and one rear side surface. The registration imaging unit 21 may control the camera so as to image one front side surface and two rear side surfaces, but in the following, the front side surface is imaged at one location and the rear side surface is imaged at two locations. An example will be described.

The registration imaging unit 21 acquires two images of the front side surface of the substrate to be conveyed and one image of the rear side surface. The registration imaging unit 21 transmits the acquired image to the substrate identification unit 30.

The collation imaging unit 22 is based on image data captured by one of the cameras that captures one location included in the front side surface and the rear side surface with respect to the target substrate transported to the subsequent stage (hereinafter, the subsequent stage process) from the first step. The target substrate is collated using the extracted feature amount. At least one of the two opposing locations included in the three locations on the front side surface and the rear side surface of the target substrate imaged by the registration imaging unit 21 is imaged by one of the plurality of cameras.

The collation imaging unit 22 acquires one image of the front side surface or the rear side surface of the conveyed substrate. The collation imaging unit 22 transmits the acquired image to the substrate identification unit 30.

The substrate identification unit 30 extracts a feature amount from the image data of the target substrate imaged by the image pickup unit 20, and registers the target substrate by associating the extracted feature amount with the substrate information of the target substrate. The substrate identification unit 30 collates and registers the target substrate using a plurality of feature amounts extracted from three image data of the front side surface and the rear side surface of the target substrate imaged by the registration imaging unit 21.

Further, the substrate identification unit 30 identifies the target substrate by collating the feature amount extracted from the image data of the target substrate with the registered feature amount. The substrate identification unit 30 collates the target substrate by using the feature amount extracted from the image data of any one of the front side surface and the rear side surface of the target substrate imaged by the collation imaging unit 22.

The substrate identification unit 30 extracts the feature amount from the image transmitted from the registration imaging unit 21. When the image transmitted from the registration imaging unit 21 is registered, the substrate identification unit 30 collates the substrate from which the feature amount has been extracted. Further, when the image transmitted from the registration imaging unit 21 is not registered, the substrate identification unit 30 registers the substrate from which the feature amount has been extracted.

The substrate identification unit 30 associates the extracted feature amount with the substrate and registers it. For example, the board identification unit 30 may set the identification symbol of the board, the time when the board has flown, etc. as an identifier (ID: Identifier), and manage the extracted feature amount in association with the identifier.

Similarly, the substrate identification unit 30 extracts the feature amount from the image transmitted from the collation imaging unit 22. The substrate identification unit 30 collates the substrate using the feature amount extracted from the image transmitted from the collation imaging unit 22.

[Board identification unit]
Next, the configuration of the substrate identification unit 30 will be described with reference to FIG. As shown in FIG. 2, the substrate identification unit 30 includes a feature amount extraction circuit 31, a storage circuit 33, and a collation determination circuit 35.

The feature amount extraction circuit 31 extracts the feature amount from the side image of the substrate imaged by the registration imaging unit 21 or the collation imaging unit 22. For example, the feature amount extraction circuit 31 extracts and collates the feature amount by using a general pattern matching method.

The storage circuit 33 stores the feature amount of the substrate (hereinafter, registered feature amount) that is not collated from the feature amount extracted from the image captured by the registration imaging unit 21 and the substrate information related to the substrate in association with each other. The storage circuit 33 associates the registered feature amount with the extracted substrate, and stores the substrate information such as the type and serial number of the substrate.

The product type information may be configured to be input by the user, or may be configured to be received from a higher-level system such as a manufacturing execution system (hereinafter, MES: Manufacturing Execution System) (hereinafter, not shown). Further, the serial number may be configured to be received from a higher-level system such as MES, or may be configured to be automatically generated by the board identification unit 30.

The collation determination circuit 35 collates the feature amount newly extracted from the substrate (hereinafter referred to as the collation feature amount) with the registered feature amount stored in the storage circuit 33.

Here, an example of imaging the side surface of the substrate carried on the SMT line will be described with reference to FIGS. 3 and 4.

FIG. 3 is a plan view of a stage in which the substrate 100 is put into the SMT device 101 in the first step of the SMT line in which the identification device 11 is installed. FIG. 3 is an example of capturing images at three locations on the front side surface and the rear side surface of the substrate 100. The camera of FIG. 3 is controlled by the registration imaging unit 21.

FIG. 4 is a plan view of a stage in which the substrate 100 is put into the SMT device 102 in the subsequent process of the SMT line in which the identification device 11 is installed. FIG. 4 is an example of photographing one part of the front side surface of the substrate 100. The camera of FIG. 4 is controlled by the collation imaging unit 22.

The SMT line includes an SMT device 101 in the first step, a plurality of SMT devices 102 in the second step, and a transport device 110 for transporting the substrate 100 to the SMT device 101 and the SMT device 102. The conveyor 110 includes at least a conveyor belt 111 for transporting the substrate 100 and a conveyor guide 112 for installing and operating the conveyor belt 111. The substrate 100 is conveyed on the SMT line by the transfer device 110.

When mounting components on both sides of the substrate 100, the substrate 100 passes through the SMT line at least twice in order to mount the components on both the front and back surfaces of the substrate 100. In order to identify the individual of the substrate 100, it is necessary to take an image of the same place on the substrate 100. However, if the position of the camera is fixed, when the front surface and the back surface of the substrate 100 are exchanged, the positional relationship of the imaging location changes between the front surface and the back surface of the substrate 100. Further, since the size of the substrate 100 differs depending on the product type, the change in the positional relationship of the imaging location also differs depending on the size. Therefore, the identification device 11 of the present embodiment photographs a plurality of locations on the side surface of the substrate 100 to identify each substrate 100.

In the example of FIG. 3, the camera 211 is arranged at the rear, and the cameras 212 and 213 are arranged at the front when viewed from the transport direction of the substrate 100. The camera 212 and the camera 213 that image the front side surface of the substrate 100 are arranged so as to image positions equidistant from the facing surfaces of the conveyor guide 112. Further, the camera 211 that images the rear side surface of the substrate 100 is arranged so as to image a position equidistant from the camera 212 from one of the facing surfaces of the conveyor guide 112.

The cameras 211 to 213 are retracted from the traveling path of the substrate when the substrate 100 has not reached the imaging position. The cameras 211 to 213 are moved on the traveling path of the substrate when the sensor or the like detects that the substrate 100 has reached the imaging position, and images the front side surface and the rear side surface of the stopped substrate 100. The imaging position is a position where the camera is in focus on the front side surface or the rear side surface of the substrate 100.

In the example of FIG. 4, the camera 221 is arranged in front of the substrate 100 when viewed from the transport direction. The camera 221 that images the front side surface of the substrate 100 is arranged so as to image the same position as the position where the camera 212 in FIG. 3 images. That is, the camera 221 is arranged on a line connecting the cameras 211 and the cameras 212 which are arranged opposite to each other.

Here, the reason for imaging at least three locations on the side surface of the substrate 100 when imaging the side surface of the substrate of the identification device 11 will be described with reference to FIG. In FIG. 5, the transport direction of the substrate 100 is set to the positive direction of the X-axis, the direction perpendicular to the transport direction of the substrate 100 is set to the Y-axis, and the normal direction of the main surface of the substrate 100 is set to the Z-axis. .. Further, in FIG. 5, in order to explain how the side surfaces are arranged by turning over the substrate 100, a mark asymmetrical with respect to the Z axis is shown on the side surface of the substrate.

In the SMT step of the substrate 100, the step of mounting the component on the front surface of the substrate 100 and the step of mounting the component on the back surface are separately performed. Therefore, there may be two states when the substrate 100 is turned over when the component is mounted on the back surface after the component is mounted on the front surface.

In FIG. 5, the upper left state is the state when mounting on the surface (hereinafter, state A). The lower left is a state in which the substrate 100 is rotated 180 degrees with the X axis as the rotation axis (hereinafter, state B). The upper right is a state in which the substrate 100 is rotated 180 degrees with the Y axis as the rotation axis (hereinafter, state C).

When the substrate 100 is registered, the image is taken in the state A. Therefore, the identification device 11 acquires images of three positions, a star-shaped position on the left side of the front side surface of the substrate 100, a triangular position on the right side, and a pentagonal position on the right side of the rear side surface of the substrate 100. The identification device 11 extracts a feature amount from each of the three images. Corresponding to FIG. 3, the star-shaped position is imaged by the camera 212, the triangular position is imaged by the camera 213, and the pentagonal position is imaged by the camera 211.

At the stage of mounting on the surface of the substrate 100, according to FIG. 4, the identification device 11 causes the camera 221 to image the star-shaped position in the subsequent step. Therefore, the identification device 11 can identify the substrate 100 by collating the collation feature amount extracted from the image of the star-shaped position with the registration feature amount.

Next, a case will be described in which the substrate 100 is turned over and mounted on the back surface after the mounting on the front surface of the substrate 100 is completed. As shown in FIG. 5, when mounting components on the back surface of the substrate 100, two cases are assumed: a case where the X-axis is rotated by 180 degrees and a case where the Y-axis is rotated by 180 degrees.

First, an example of rotating 180 degrees with the X axis as the rotation axis will be described. In FIG. 5, when the X-axis is rotated 180 degrees as a rotation axis for mounting on the back surface of the substrate 100, the positions of the marks on the side surface of the substrate 100 are exchanged as in the state B.

The substrate 100 reinserted into the SMT apparatus 101 (FIG. 3) in the first step in the state B is imaged by the camera 211, the camera 212, and the camera 213. At this time, the unmarked position is imaged by the camera 211, the triangular position is imaged by the camera 212, and the star-shaped position is imaged by the camera 213. The identification device 11 can identify the substrate 100 because the matching feature amount extracted from the two images of the triangular and star-shaped positions and the registered feature amount match.

When the substrate 100 re-injected into the SMT process in the state B is conveyed to the SMT device 102 (FIG. 4) in the subsequent process, it is imaged by the camera 221. At this time, the position of the triangle is imaged by the camera 221. The identification device 11 can identify the substrate 100 because the feature amount extracted from the image obtained by capturing the position of the triangle and the registered feature amount match.

Next, an example of rotating 180 degrees with the Y axis as the rotation axis will be described. In FIG. 5, when the Y-axis is rotated 180 degrees as the rotation axis for mounting on the back surface of the substrate 100, the positions of the marks on the side surface of the substrate 100 are exchanged as in the state C.

The substrate 100 reinserted into the SMT apparatus 101 (FIG. 3), which is the first step in the state C, is imaged by the camera 211, the camera 212, and the camera 213. At this time, the star-shaped position is imaged by the camera 211, the pentagonal position is imaged by the camera 212, and the unmarked position is imaged by the camera 213. The identification device 11 can identify the substrate 100 because the feature amount extracted from the two images of the pentagonal and star-shaped positions and the registered feature amount match.

When the substrate 100 re-injected into the SMT process in the state C is conveyed to the SMT device 102 (FIG. 4) in a process after the leading process, it is imaged by the camera 221. At this time, the position of the pentagon is imaged by the camera 221. The identification device 11 can identify the substrate 100 by collating the feature amount extracted from the image obtained by capturing the position of the pentagon with the registered feature amount.

〔motion〕
Here, the operation of the identification device 11 of the present embodiment will be described with reference to the drawings. FIG. 6 is a flowchart relating to the imaging process. FIG. 7 is a flowchart relating to a process of extracting a feature amount from an captured image and registering / collating the substrate 100. The identification device 11 can detect that the substrate 100 has reached the imaging location by a sensor (not shown) installed in the transport device 110.

In FIG. 6, when the identification device 11 detects the substrate (Yes in step S11), the identification device 11 causes the installed camera to take an image of two locations on the front side surface and one location on the rear side surface of the substrate 100 (step S12). If the board is not detected (No in step S11), the process waits until the board is detected.

The identification device 11 transfers the obtained image to the board identification unit 30 (step S13).

When continuing the process (Yes in step S14), the process returns to step S11. When the process is not continued (No in step S14), the process according to the flowchart of FIG. 6 is terminated.

In FIG. 7, the substrate identification unit 30 extracts a feature amount for each image (step S21).

The substrate identification unit 30 collates the extracted feature amount with the registered feature amount (step S22).

When there is no registered feature amount including the extracted feature amount (No in step S23), the identification device 11 stores the extracted feature amount in association with the substrate information of the substrate 100 (step S24). After step S24, the process returns to step S21.

When there is a registered feature amount including the extracted feature amount (Yes in step S23), the identification device 11 outputs a collation result (step S25). At this time, the identification device 11 may output the collation result to a host system, a display unit (not shown), or the like.

When continuing the process (Yes in step S26), the process returns to step S21. When the process is not continued (No in step S26), the process according to the flowchart of FIG. 7 is terminated.

As described above, according to the identification device according to the present embodiment, when mounting on both sides of a substrate, the substrate can be identified by using the side surface of the substrate at the stage of mounting on any surface of the substrate. Therefore, according to the identification device of the present embodiment, the substrate can be identified at an arbitrary point on the mounting line of the circuit board without impairing the productivity.

Further, since the identification device according to the present embodiment collates using two side surfaces at least in the first step when mounting the front surface and the back surface, it is robust against scratches, stains, and slight changes generated in manufacturing. It is possible to improve the sex.

(Second Embodiment)
Next, the configuration of the identification device 12 according to the second embodiment of the present invention will be described with reference to the drawings. FIG. 8 is a block diagram showing a functional configuration of the identification device 12 of the present embodiment. This embodiment is different from the first embodiment in that it includes a drive control unit 40 that controls the drive of the camera and the transport device arranged on the SMT line.

As shown in FIG. 2, the identification device 12 of the present embodiment includes a drive control unit 40 in addition to the image pickup unit 20 and the substrate identification unit 30. The drive control unit 40 is configured to realize driving of the camera and the transport device.

The identification device 12 is installed in a production line in which a plurality of cameras, a movable portion that supports the cameras, a transfer device 110 that conveys the substrate 100, and a detector that detects the substrate are arranged. A plurality of cameras, moving parts, a transport device 110, and a detector may be included in the configuration of the identification device 12.

The plurality of cameras include three cameras that move to positions for photographing three locations having an equal distance relationship from the left and right ends of the front side surface and the rear side surface of the substrate 100 that are transported to the leading process of the production line.

The movable portion movably supports each of the plurality of cameras at positions for photographing the front side surface and the rear side surface of the substrate 100.

The transport device 110 transports the substrate 100 and moves the substrate to the imaging position.

The detector detects the substrate 100 transported by the transport device 110 and outputs a detection signal. For example, the detector includes a non-contact sensor that detects the substrate 100 by light. For example, the detector includes a contact sensor that detects contact with the substrate 100. The detector may be configured by combining a non-contact type sensor and a contact type sensor.

The drive control unit 40 controls to drive and stop the transport device 110 in response to the detection signal, and also controls to expand and contract the movable unit so as to move the plurality of cameras to the imaging position and the storage position.

[Drive control unit]
Next, the configuration of the drive control unit 40 will be described with reference to FIG. As shown in FIG. 9, the drive control unit 40 includes a board detection circuit 41, a conveyor control circuit 43, and a camera position control circuit 45.

The board detection circuit 41 detects that the board has been transported by a detection signal from a detector installed in the transport device. The board detection circuit 41 outputs a detection signal indicating that the board has reached the imaging position to the conveyor control circuit 43.

In the present embodiment, the detector may detect that the substrate has approached the imaging position, or may detect that the substrate has reached the imaging position. When detecting that the substrate has approached the imaging position, the arrival time to the imaging position may be calculated and the transport device may be controlled according to the arrival time. Further, when detecting that the substrate has reached the imaging position, the transport device may be controlled when the substrate is detected.

For example, the detector can be realized by an optical sensor that detects an object using light, such as a photomicro sensor, a photoelectric sensor, a proximity sensor, a general camera, and an infrared camera. Further, for example, the detector may be composed of a sensor that detects an object by using sound waves, electromagnetic waves, magnetism, or the like. Further, for example, the detector may be composed of a contact detection sensor.

In the present embodiment, an example in which the presence or absence of the substrate is performed by a detector is given, but the substrate may be detected by image processing the image data captured by the camera instead of the detector.

The conveyor control circuit 43 controls the conveyor according to the detection signal received from the board detection circuit 41. When the conveyor control circuit 43 stops the conveyor in response to the detection signal, the conveyor control circuit 43 transmits a stop signal to the camera position control circuit 45. When the conveyor control circuit 43 acquires an imaging signal indicating that the imaging of the substrate is completed, the conveyor control circuit 43 controls to move the conveyor.

The camera position control circuit 45 moves the camera to the imaging position in response to the stop signal received from the conveyor control circuit 43. The camera position control circuit 45 returns the camera to the retracted position when the imaging is completed. When the image pickup process by the camera is not performed in one step, the camera position control circuit 45 moves the position of the camera in each step.

For example, the camera may be fixed to one end of a telescopic rod-shaped movable part. The other end of the movable portion is fixed below or above the imaging position, and the movable portion can be expanded or contracted according to the position of the substrate 100 to retract the camera or move it to the imaging position. For example, the movable portion may be driven by a cylinder drive system using air or a motor drive system.

Here, an example in which the substrate 100 is conveyed by the conveying device 110 will be described with reference to FIG. The example of FIG. 10 is an example in which the camera is stored below the substrate when the substrate 100 is conveyed in the leading process of the SMT line, and the camera is moved to a position where the side surface of the substrate is imaged at the time of imaging. In the latter step as well, the transfer device 110 and the camera may be controlled in the same manner as in the first step.

The plurality of cameras include a first camera (camera 212) and a second camera (camera 213) that move to positions for photographing two locations having an equal distance relationship from the left and right ends of the front side surface of the substrate 100. Further, the plurality of cameras include a third camera (camera 211) that moves to a position where the rear side surface of the substrate 100 is imaged at a position facing any of the two locations imaged by the first and second cameras. including.

The example of FIG. 10 is a side view seen from the position of the lower conveyor guide 112 in the same configuration as that of FIG. Although only the camera 211 and the camera 212 are shown in FIG. 10, the camera 213 is arranged on the other side of the camera 212. Here, the description of the camera 213 will be omitted. Hereinafter, when the camera 211 and the camera 212 are not distinguished, they are simply referred to as a camera.

The camera 211 is supported by a movable portion 215 that expands and contracts in the vertical direction. Further, the camera 212 is supported by a movable portion 216 that expands and contracts in the vertical direction. The movable portion 215 and the movable portion 216 expand and contract so that the camera 211 and the camera 212 are located at the retracted position or the imaging position according to the control of the camera position control circuit 45.

The sensor 241 is a sensor that detects the rear position of the substrate 100 when imaging the rear side surface of the substrate 100. The sensor 242 is a sensor that detects the front position of the substrate 100 when imaging the front side surface of the substrate 100. The sensor 241 and the sensor 242 are a form of a detector that outputs a detection signal to the image pickup unit 20 when the substrate 100 is detected.

The upper left A of FIG. 10 shows a state in which the camera arranged at the head process of the SMT line is stored below the traveling path of the substrate 100. At this time, the substrate 100 is not hindered by the camera. The camera 212 that images the front side surface of the substrate 100 may be moved to the imaging position before the substrate 100 reaches the imaging position on the front side surface.

When the sensor 241 detects that the substrate 100 is approaching, the sensor 241 may transmit a detection signal to the substrate detection circuit 41 when the substrate 100 is detected. The substrate detection circuit 41 may estimate the time for the substrate 100 to reach the imaging position on the front side surface using the time when the detection signal is received. At this time, the sensor 242 can be omitted. The sensor 241 may be set so as not to detect the approach of the substrate 100.

Further, the sensor 241 may transmit a detection signal notifying the passage of the substrate 100 to the substrate detection circuit 41 when the passage behind the substrate 100 has passed. At this stage, a signal may be transmitted from the board detection circuit 41 to the camera position control circuit 45, and the signal may be used as a trigger to control the camera position control circuit 45 to move the camera to the imaging position.

The lower left B of FIG. 10 shows a state in which the camera is moved to a position where the front side surface of the substrate 100 is imaged when the substrate 100 reaches the imaging position.

When the substrate 100 reaches the imaging position on the front side surface, the conveyor control circuit 43 controls to stop the conveyor belt 111. At this stage, the camera position control circuit 45 moves the camera to the imaging position. When the camera has already been moved to the imaging position on the front side surface of the substrate 100, the camera position control circuit 45 does not need to move the camera. When the substrate 100 reaches the imaging position on the front side surface, the camera position control circuit 45 transmits an instruction signal for imaging the front side surface of the substrate 100 to the imaging unit 20. The imaging unit 20 controls the camera 212 so as to image the front side surface of the substrate 100.

When the imaging of the front side surface of the substrate 100 is completed, the imaging unit 20 outputs a signal for moving the rear side surface to the imaging position to the conveyor control circuit 43. The conveyor control circuit 43 controls the conveyor belt 111 to move backward in response to a signal from the imaging unit 20. At this stage, the camera 212 that captures the front side surface of the substrate 100 may be controlled to move to the storage position.

The lower right C of FIG. 10 shows a state in which the substrate 100 is moved to the imaging position on the rear side surface after imaging the front side surface of the substrate.

When the substrate 100 reaches the imaging position on the rear side surface, the conveyor control circuit 43 controls to stop the conveyor belt 111. The stop of the conveyor belt 111 may be controlled based on the detection signal by the sensor 241 or may be controlled based on the elapsed time from the time when the conveyor belt 111 starts to move backward.

When the substrate 100 reaches the imaging position on the rear side surface, the conveyor control circuit 43 controls to stop the conveyor belt 111. When the substrate 100 reaches the imaging position on the rear side surface, the camera position control circuit 45 transmits an instruction signal for imaging the rear side surface of the substrate 100 to the imaging unit 20. The imaging unit 20 controls the camera 211 so as to image the rear side surface of the substrate 100.

When the imaging of the rear side surface of the substrate 100 is completed, the imaging unit 20 outputs a signal for moving the camera to the storage position to the camera position control circuit 45. The camera position control circuit 45 moves the camera to the retracted position in response to a signal from the imaging unit 20. At this time, the camera is stored in the state of the upper left A of FIG.

When the camera is retracted, the camera position control circuit 45 outputs a signal to the conveyor control circuit 43 to drive the conveyor belt 111 in the transport direction of the substrate 100. The conveyor control circuit 43 controls the conveyor belt 111 to move in the transport direction in response to a signal from the camera position control circuit 45.

The above is a description of driving the transport device 110 and the camera. The transport device 110 and the camera may be driven by a method different from the above. For example, the rear side surface of the substrate 100 may be imaged and then the front side surface may be imaged.

(motion)
Next, the transfer device 110 and the camera driven by the identification device 12 of the present embodiment will be described with reference to the flowchart of FIG. The operation of the substrate identification unit 30 may be performed in the same manner as in the example of FIG. FIG. 11 is an operation corresponding to FIG. In the following, the imaging unit 20 and the drive control unit 40 will be mainly described.

In FIG. 11, when the front of the substrate 100 approaches the position of the sensor 242, a detection signal is output from the sensor 242 to the drive control unit 40, and the drive control unit 40 detects the substrate 100 (step S41).

Upon receiving the detection signal, the drive control unit 40 stops the conveyor belt 111 (step S42).

The drive control unit 40 moves the camera to an imaging position for imaging the front side surface of the substrate 100 (step S43). Here, the drive control unit 40 notifies the imaging unit that the camera has moved to the imaging position.

After the camera moves to the imaging position, the imaging unit 20 causes the camera to image the front side surface of the substrate 100 (step S44). Here, the imaging unit 20 notifies the drive control unit 40 that the imaging has been completed.

When the imaging is completed, the drive control unit 40 drives the conveyor belt 111 in the direction opposite to the transport direction (step S45).

When the rear of the board 100 approaches the position of the sensor 241, a detection signal is output from the sensor 241 to the drive control unit 40, and the drive control unit 40 detects the board 100 (step 46).

Upon receiving the detection signal, the drive control unit 40 stops the conveyor belt 111 (step S47).

The imaging unit 20 causes the camera to image the rear side surface of the substrate 100 (step S48). Here, the imaging unit 20 notifies the drive control unit 40 that the imaging has been completed.

When the imaging is completed, the drive control unit 40 moves the camera to the retracted position (step S49).

When the camera moves from the traveling path of the substrate 100, the drive control unit 40 drives the conveyor belt 111 in the transport direction (step S50).

The above is a description of driving the transport device 110 and the camera by the identification device 12. The stop of the substrate 100, the movement of the camera, the timing and order of imaging, and the like may be arbitrarily replaced.

As described above, according to the identification device of the present embodiment, it is possible to autonomously control the transfer device and the camera position of the substrate.

[Modification example]
The camera may be stored above the traveling path of the substrate 100 as shown in FIG. 12 instead of below the traveling path of the substrate 100 as shown in FIG.

When the camera is stored upward as shown in FIG. 12, as in the example of FIG. 10, when the substrate 100 passes through the camera position (upper left A), when the front side surface is imaged (lower left B), and rearward. The camera may be moved according to the time of imaging (lower left C) for imaging the side surface.

Further, the substrate 100 may be detected by a stopper as shown in FIG. 13 instead of the non-contact type sensor as shown in FIGS. 10 and 12.

In the case of the example of FIG. 13, the stopper 245 that contacts the front of the substrate 100 is connected to the movable portion 232, and the stopper 246 that contacts the rear of the substrate 100 is connected to the movable portion 231. The stopper 245 is adjusted so that the front side surface of the substrate 100 stops at a position where the camera 212 is in focus. Similarly, the stopper 246 is adjusted so that the rear side surface of the substrate 100 stops at a position where the camera 211 is in focus. The stopper 245 and the stopper 246 are a form of a detector.

In the state of waiting for the arrival of the substrate 100 as shown in the upper left A of FIG. 13, the camera 212 is moved to the imaging position before the substrate 100 images the front side surface.

The lower left B of FIG. 13 is a state in which the front side surface of the substrate 100 is in contact with the stopper 245. At this time, the stopper 245 stops the progress of the substrate 100. In this state, the imaging unit 20 causes the camera 212 to image the front side surface of the substrate 100. It is preferable to stop the conveyor belt 111 when the substrate 100 comes into contact with the stopper 245, but the conveyor belt 111 may not be stopped if there is no problem in imaging. However, since it is possible to suppress blurring due to vibration during imaging by stopping the substrate 100, it is better to stop the conveyor belt when it is detected that the substrate 100 has come into contact with the stopper 245. Further, a sensor for detecting the arrival of the substrate immediately before hitting the stopper may be provided to reduce the transport speed before hitting the stopper.

The lower right C of FIG. 13 is a state in which the rear side surface of the substrate 100 is in contact with the stopper 246. At this time, the stopper 246 stops the progress of the substrate 100. In this state, the imaging unit 20 causes the camera 211 to image the rear side surface of the substrate 100. It is preferable to stop the conveyor belt 111 when the substrate 100 comes into contact with the stopper 246, but the conveyor belt 111 may not be stopped if there is no problem in imaging.

The upper right D of FIG. 13 shows a state in which the camera is returned to the storage position after the imaging of the rear side surface of the substrate 100 is completed. In this state, since the camera is not located on the traveling path of the substrate 100, the substrate 100 is transported to the SMT.

According to the modified example of FIG. 13, since the substrate can be mechanically stopped by the stopper, even if some obstacle suddenly occurs between the substrate being conveyed and the sensor, the substrate can be reliably identified. It can be performed. Further, by mechanically determining the distance between the camera and the substrate by using the stopper, the existing equipment control such as deceleration and stop timing of the substrate transfer can be minimized, and the substrate can be identified.

In the present embodiment, an example in which three cameras for imaging the substrate 100 are configured in the first step has been described, but two cameras may be configured as shown in FIG.

In the example of FIG. 14, the plurality of cameras are two cameras (2 cameras) that move to positions for photographing three locations having an equal distance relationship from the left and right ends of the front side surface and the rear side surface of the substrate 100 that are transported to the leading process of the production line. The camera 211 and the camera 212) are included. A movable portion (movable portion 216) that supports at least one of the two cameras (camera 212) is connected to a mechanism that slides in a direction perpendicular to the transport direction of the substrate 100. The camera (camera 212) connected to the slide mechanism captures two of the three locations having the same distance from the left and right ends of the front side surface and the rear side surface of the substrate 100.

In the example of FIG. 14, the camera 212 that images the front side surface of the substrate 100 can be moved in a direction perpendicular to the transport direction of the substrate 100. For example, in the case of the configuration as shown in FIG. 10, the other end of the movable portion 216 connected to the camera 212 at one end may be connected to a slide mechanism that moves in a direction perpendicular to the transport direction. Although the details of the slide mechanism will be omitted, the slide mechanism may be configured to operate according to the control of the drive control unit 40. The camera 212 that captures the rear side surface of the substrate 100 may be provided with a slide mechanism. Further, a slide mechanism may be provided in the camera installed in the subsequent process.

In the example of FIG. 14, first, the left side of the front side surface of the substrate 100 is imaged by the camera 212. Next, the camera 212 is slid to a position where the right side of the front side surface of the substrate 100 is imaged, and the right side of the front side surface is imaged by the camera 212. After that, the conveyor belt 111 for imaging the rear side surface of the substrate 100 is driven in the direction opposite to the transport direction, the substrate 100 is moved to the imaging position on the rear side surface, and the rear side surface is imaged by the camera 211.

According to the modification of FIG. 14, the number of cameras installed in the leading process can be reduced.

(Third Embodiment)
Next, the traceability system according to this embodiment will be described. FIG. 15 is a block diagram showing a configuration of the traceability system of the present embodiment.

As shown in FIG. 15, the traceability system of the present embodiment includes the identification device 11 of the first embodiment and the production history server 13. The traceability system of the present embodiment may include the identification device 12 of the second embodiment instead of the identification device 11.

The identification device 11 and the production history server 13 are connected via a local area network or the Internet. The identification device 11 and the production history server 13 may be connected by wire or wirelessly.

The production history server 13 is a server that manages information such as traceability regarding the substrate 100. The production history server 13 registers the passage history when the board 100 passes through any of the manufacturing devices on the manufacturing line and the operation history of the manufacturing device in association with the board information of the board 100. The production history server 3 may be configured by a general server.

(motion)
Next, the operation of the traceability system according to the present embodiment will be described with reference to the flowchart of FIG. FIG. 16 is a flowchart relating to a process in which the identification device 11 is the main operation, the feature amount is extracted from the captured image, and the substrate 100 is registered / collated.

In FIG. 16, first, the substrate identification unit 30 extracts a feature amount for each image (step S51).

The substrate identification unit 30 collates the extracted feature amount with the registered feature amount (step S52).

When there is no registered feature amount including the extracted feature amount (No in step S53), the identification device 11 links the extracted feature amount with the board information of the board 100 and transmits the extracted feature amount to the production history server (step S54). .. After step S54, the process returns to step S51.

When there is a registered feature amount including the extracted feature amount (Yes in step S53), the identification device 11 outputs the collation result to the production history server 13 (step S55).

When continuing the process (Yes in step S56), the process returns to step S51. When the process is not continued (No in step S56), the process according to the flowchart of FIG. 16 is terminated.

As described above, according to the traceability system of the present embodiment, the history of the transfer state and the production status of the substrate can be managed by the production history server. Therefore, according to the present embodiment, it is possible to collectively manage the manufacturing process of the circuit board. Further, when a defect is found in the circuit board, the cause of the defect can be known by verifying the history information accumulated in the production history server.

(hardware)
Here, the hardware configuration of the control system that enables the identification device according to the present embodiment will be described. FIG. 17 is a block diagram of a control board 90 which is an example of a control system for realizing the identification device according to each embodiment. The control board 90 of FIG. 17 has a hardware configuration in which a processor 91, a converter 93, a main storage device 95, an input / output interface 96, an image processing circuit 97, and a storage medium 98 are connected by a bus 99. Note that FIG. 17 is a configuration example for realizing the identification device according to each embodiment, and any device or circuit may be added or deleted according to the specifications and configuration of the device.

The processor 91 is an arithmetic unit that expands a program stored in a storage medium 98 or the like to a main storage device 95 or the like and executes the expanded program. The processor 91 may be configured by a general central processing unit (CPU).

The converter 93 is a circuit having a function of digitally converting analog data input from the outside. The converter 93 has an A / D (Analog / Digital) conversion converter that digitally converts analog data. The converter 93 may have a function of converting internally generated digital data into analog data.

The main storage device 95 is a device having a storage area for temporarily expanding programs and data handled by the processor 91. For example, a random access memory (RAM: Random Access Memory) can be configured as the main storage device 95.

The input / output interface 96 is an interface for exchanging data with an external or internal input / output device. For example, the input / output interface 96 is connected to a camera or a sensor. Further, the input / output interface 96 may be connected to an input device such as a keyboard or mouse (not shown), an output device such as a display or printer (not shown), or a network connected to an external computer or server.

The image processing circuit 97 is a circuit that performs various image processing on image data. The image processing circuit 97 is an integrated circuit that executes image processing such as dark current correction, interpolation calculation, color space conversion, gamma correction, aberration correction, noise reduction, and image compression on the imaged data, for example. The image processing circuit 97 may be configured so that processing other than the above-mentioned image moat can be executed.

The storage medium 98 is a medium for storing programs and data. For example, a hard disk or the like can be used as the storage medium 98. Further, the ROM (Read Only Memory) may be configured as the storage medium 98. The storage medium 98 may be realized by, for example, a semiconductor recording medium such as an SD (Secure Digital) card or a USB (Universal Serial Bus) memory. Further, the storage medium 98 may be realized by a magnetic recording medium such as a flexible disk, an optical recording medium such as a CD (Compact Disc) or a DVD (Digital Versatile Disc), or a recording medium using other principles.

The above is an example of the hardware configuration for enabling the identification device according to the embodiment of the present invention. The control board 90 of FIG. 17 is an example of a hardware configuration for enabling the identification device according to the present embodiment, and does not limit the scope of the present invention. Further, a processing program for causing a computer to execute processing by the identification device according to the present embodiment is also included in the scope of the present invention. Further, a program recording medium on which a processing program according to an embodiment of the present invention is recorded is also included in the scope of the present invention.

Although the present invention has been described above with reference to the embodiments, the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the structure and details of the present invention within the scope of the present invention.

11, 12 Identification device 13 Production history server 20 Imaging unit 21 Registration imaging unit 22 Verification imaging unit 30 Board identification unit 31 Feature extraction circuit 33 Storage circuit 35 Verification judgment circuit 40 Drive control unit 100 Board 101, 102 SMT device 110 Conveyor device 111 Conveyor belt 112 Conveyor guide 211, 212, 213, 221 Cameras 231 and 232 Moving parts 241 and 242 Sensors

Claims (9)

An imaging unit that captures at least three locations included in the front side surface and the rear side surface of the target substrate by a plurality of cameras that image the side surface of the target substrate being transported on the production line from either the front or the rear with respect to the transport direction. When,
A feature amount is extracted from the image data of the target substrate imaged by the imaging unit, the target substrate is registered by associating the extracted feature amount with the substrate information of the target substrate, and the image data of the target substrate is registered. A substrate identification unit for identifying the target substrate by collating the feature amount extracted from the above with the registered feature amount is provided .
The imaging unit
With respect to the target substrate transported to the first step, the target substrate is collated and the target substrate is collated using the feature amounts extracted from the plurality of image data captured by the plurality of cameras that image at least three locations including the front side surface and the rear side surface. The registration imaging unit for registration and
With respect to the target substrate transported to a stage after the first step, the target substrate uses features extracted from image data captured by any of the cameras that image one location included in the front side surface and the rear side surface. An identification device having a collation imaging unit for collating the above . The registration imaging unit
Three locations having an equal distance relationship from the left and right ends of the front side surface and the rear side surface of the target substrate are imaged by one of the plurality of cameras.
The collation imaging unit
At least one of the two opposing locations included in the three locations on the front side surface and the rear side surface of the target substrate imaged by the registration imaging unit is imaged by one of the plurality of cameras.
The board identification unit is
The target substrate is collated and registered using a plurality of feature amounts extracted from three image data of the front side surface and the rear side surface of the target substrate imaged by the registration imaging unit.
The identification device according to claim 1 , wherein the target substrate is collated using a feature amount extracted from image data of any one of the front side surface and the rear side surface of the target substrate imaged by the collation imaging unit. .. With the multiple cameras
A movable portion that movably supports each of the plurality of cameras at a position for photographing the front side surface and the rear side surface of the target substrate, and
A transport device that transports the target substrate and moves the target substrate to the imaging position.
A detector that detects the target substrate conveyed by the transfer device and outputs a detection signal,
A claim including a drive control unit that controls driving and stopping of the transport device in response to the detection signal and controls expansion and contraction of the movable unit so as to move the plurality of cameras to an imaging position and a storage position. The identification device according to 1 or 2 . The plurality of cameras
Identification of claim 3 comprising three cameras to move to a position for imaging the three positions on the front side and the equal distance relationship from left and right ends of the rear side surface of the target substrate to be transported to the beginning step of the production line apparatus. The plurality of cameras
A first and second camera that moves to a position where two locations having an equal distance relationship from the left and right ends of the front side surface of the target substrate are imaged.
3. The third aspect of claim 3 or 4 , wherein the rear side surface of the target substrate includes a third camera that moves to a position where the portion facing any of the two locations imaged by the first and second cameras is imaged. Identification device. The plurality of cameras
Includes two cameras to move to a position for imaging the three positions on the front side and the equal distance relationship from left and right ends of the rear side surface of the target substrate to be transported to the beginning step of the production line,
The moving part that supports at least one of the two cameras
3. Claim 3 for imaging two of three locations connected to a mechanism that slides in a direction perpendicular to the transport direction of the target substrate and having an equal distance relationship from the left and right ends of the front side surface and the rear side surface of the target substrate. The identification device described in. It said analyzing intellectual instrument,
The identification device according to any one of claims 3 to 6 , further comprising a non-contact type sensor that detects the target substrate by light. It said analyzing intellectual instrument,
The identification device according to any one of claims 3 to 7 , further comprising a contact-type sensor that detects contact with the target substrate. The identification device according to any one of claims 1 to 8 .
A traceability system including a production history server that registers a passage history when the target board passes through any of the manufacturing devices on the manufacturing line and an operation history of the manufacturing device in association with the board information of the target board.

Images