JP6752191B2 - Soldering equipment - Google Patents

Description

The present invention relates to a soldering apparatus that automatically solders to a predetermined soldering position.

Various soldering devices have been developed that automatically perform soldering at a predetermined soldering position (see Patent Document 1). According to Patent Document 1, the operator can input the coordinate values of the soldering position into the personal computer and set the soldering position (so-called teaching work). The soldering device can perform soldering at the input soldering position.

Japanese Unexamined Patent Publication No. 2000-75912

A large soldered electronic board may be cut into multiple smaller electronic boards. These small electronic boards are incorporated into multiple electrical devices. In this case, the arrangement patterns of the plurality of soldering positions formed on the plurality of small electronic substrates are common. There are a large number of soldering positions on a large electronic board corresponding to the product of the number of soldering positions set on the electronic board incorporated in the electric device and the number of divisions of the large electronic board.

Under the soldering position setting technique described above, the operator needs to make the soldering apparatus remember all of the large number of soldering positions on a large electronic board. Therefore, the above-mentioned soldering position setting technique requires a great deal of labor for the operator who performs the teaching operation to make the soldering apparatus remember the soldering position.

An object of the present invention is to provide a soldering apparatus that enables an operator to easily set a soldering position.

The soldering apparatus according to one aspect of the present invention includes a base region having at least one soldering position and an arrangement pattern common to the arrangement pattern of the at least one soldering position in the base region, and said A soldering iron for soldering to the surface of an electronic board including a plurality of soldering regions having a plurality of duplication regions existing at positions different from the base region, a drive unit for moving the soldering iron, and the above-mentioned A display window configured to display a plurality of soldering routes indicating the order in which the plurality of soldering areas are to be soldered, and a position representing the positional relationship between the base area and the plurality of duplication areas. In the soldering work , the relational data , the base pattern data representing the arrangement pattern of the at least one soldering position in the base region, the input unit that accepts the input of the soldering route selected from the plurality of soldering routes , and the soldering operation. A control unit that controls the drive unit based on the base pattern data and the positional relationship data is provided. Based on (i) the base pattern data, the control unit determines a movement pattern for moving the soldering iron to at least one soldering position in the base region, and (ii) the soldering iron. Controls the drive unit so that the soldering iron moves in the base region in the determined movement pattern, and (iii) the soldering iron sequentially moves through the plurality of duplication regions based on the input soldering route. The driving unit is controlled so as to move, and ( iv ) the driving is performed so that the soldering iron is moved in the plurality of duplication regions based on the positional relationship data and the determined movement pattern. Control the part.

According to the above configuration, since the base area is used as an area for storing at least one soldering position, the operator can use the base pattern data representing the arrangement pattern of at least one soldering position in the base area. Enter in the input section. As a result, the control unit can grasp the soldering position in the base region. Therefore, the control unit can determine a movement pattern for moving the soldering iron to at least one soldering position in the base region based on the base pattern data. Since the control unit controls the drive unit so that the soldering iron moves in the base region in the determined movement pattern, the soldering iron moves in the determined movement pattern in the soldering operation and moves in the base region. Soldering can be performed at at least one of the soldering positions.

Since the positional relationship data input to the input unit represents the positional relationship between the base area and a plurality of replication areas existing at different positions from the base area, the control unit that refers to the positional relationship data refers to the base area. It is possible to grasp the relative positions of a plurality of replication areas. Therefore, the control unit moves the soldering iron according to the movement pattern determined for the base area based on the positional relationship data representing the positional relationship between the base area and the plurality of replication areas in the plurality of replication areas. As you can see, the drive unit can be controlled. As a result, in the soldering work after the teaching work, the soldering iron can move in a movement pattern determined with respect to the base region and can be soldered to a plurality of duplication regions. Since the duplication area includes an arrangement pattern common to the arrangement pattern of at least one soldering position in the base area, a soldering iron that moves according to a movement pattern determined with respect to the base area is soldered in the duplication area. Soldering can be performed according to the position pattern.

As described above, even if the soldering positions corresponding to the plurality of duplication regions are not input to the input unit, the soldering apparatus can perform the soldering at the soldering positions in the plurality of duplication regions. Therefore, the soldering device can effectively reduce the labor of the operator for inputting the soldering position.

With respect to the above configuration, the control unit includes (i) a pattern determining unit that determines the movement pattern within the base region based on the base pattern data, and (ii) the determined movement of the soldering iron. The soldering iron moves to the plurality of duplication regions based on the base drive signal for operating the drive unit so as to move in the base region according to the pattern, the positional relationship data, and the determined movement pattern. In addition, a signal generation unit that generates a replication drive signal that operates the drive unit so as to move in the plurality of replication regions according to the determined movement pattern may be included. The driving unit may move the soldering iron in response to the base driving signal and the duplication driving signal.

According to the above configuration, as described above, since the operator inputs the base pattern data to the input unit, the pattern determination unit of the control unit can grasp the soldering position in the base region. Therefore, the pattern determination unit can determine a movement pattern for moving the soldering iron to at least one soldering position in the base region based on the base pattern data. Since the signal generation unit generates a base drive signal so that the soldering iron moves according to the determined movement pattern, the drive unit can move the soldering iron according to the base drive signal. As a result, the soldering iron can be soldered at at least one soldering position in the base region.

Since the positional relationship data input to the input unit represents the positional relationship between the base area and a plurality of duplicated areas that are virtually duplicated at positions different from the base area, the control unit that refers to the positional relationship data The signal generation unit can grasp the relative positions of the plurality of replication regions with respect to the base region. Therefore, the signal generation unit can generate a replication drive signal so that the soldering iron moves to a plurality of replication regions, and can control the drive unit. Since the signal generation unit generates a replication drive signal so that the soldering iron operates in a movement pattern determined with respect to the base region even in a plurality of replication regions, the drive unit operates in response to the replication drive signal. Can cause the soldering iron to perform a moving operation similar to the moving operation in the base region even for a plurality of duplication regions. Therefore, a soldering operation similar to the soldering operation performed in the base region can be performed on a plurality of replication regions.

With respect to the above configuration, the positional relationship data includes region number data representing the number of a plurality of regions including the base region and the plurality of replication regions aligned along a predetermined axis from the base region, and the plurality of region number data. It may include offset data representing the amount of deviation between two adjacent regions in the region. The signal generation unit refers to the region number data and the offset data, and the base drive signal and the duplication drive so that the soldering iron moves in each of the plurality of regions according to the determined movement pattern. It may generate a signal.

According to the above configuration, the number of regions of the positional relationship data data represents the number of a plurality of first regions including the base region and a plurality of replication regions aligned along a predetermined axis from the base region. The signal generation unit that refers to the data can grasp how many times the replication drive signal should be generated. Since the offset data represents the amount of deviation between two adjacent regions in a plurality of regions, the signal generator referring to the positional relationship data grasps the positions of the plurality of regions aligned along a predetermined axis. can do. Therefore, the signal generation unit can refer to the region number data and the offset data, and generate a replication drive signal so that the movement pattern determined for the base region is applied to each of the plurality of regions. As a result, a soldering operation similar to the soldering operation performed in the base region can be performed in a plurality of replication regions aligned along a predetermined axis with respect to the base region. Since the common soldering operation is performed on the plurality of regions aligned along the predetermined axis even if the teaching work is not performed on all the plurality of regions aligned along the predetermined axis, the above-mentioned soldering is performed. The soldering device can effectively reduce the labor of the operator who performs the teaching work.

With respect to the above configuration, the positional relationship data is the number of first regions representing the number of plurality of first regions including the base region and the plurality of replication regions aligned from the base region along a predetermined first axis. The data and the first offset data representing the amount of deviation between two adjacent regions in the plurality of first regions may be included. The signal generation unit refers to the first region number data and the first offset data, and the base so that the soldering iron moves in each of the plurality of first regions according to the determined movement pattern. The drive signal and the duplicate drive signal may be generated.

According to the above configuration, the number of first regions data of the positional relationship data represents the number of a plurality of first regions including the base region and a plurality of replication regions aligned along a predetermined first axis from the base region. Therefore, the signal generation unit that refers to the positional relationship data can grasp how many times the replication drive signal should be generated. Since the first offset data represents the amount of deviation between two adjacent regions in the plurality of first regions, the signal generation unit that refers to the positional relationship data is a plurality of first regions that are aligned along the first axis. The position of each area can be grasped. Therefore, the signal generation unit refers to the first region number data and the first offset data, and generates a replication drive signal so that the movement pattern determined for the base region is applied to each of the plurality of first regions. can do. As a result, a soldering operation similar to the soldering operation performed in the base region can be performed in a plurality of replication regions aligned along the first axis with respect to the base region. Even if the teaching work is not performed on all of the plurality of first regions aligned along the first axis, the common soldering operation is performed on the plurality of first regions aligned along the first axis. The soldering device described above can effectively reduce the labor of the operator who performs the teaching work.

With respect to the above configuration, the positional relationship data includes the number of a plurality of second regions including the base region and the plurality of replicating regions aligned from the base region along a second axis orthogonal to the first axis. The second region number data to be represented and the second offset data to represent the amount of deviation between two adjacent regions in the plurality of second regions may be included. The signal generation unit refers to the second region number data and the second offset data, and the base so that the soldering iron moves in each of the plurality of second regions according to the determined movement pattern. The drive signal and the duplicate drive signal may be generated.

According to the above configuration, the number of second regions data of the positional relationship data includes a base region and a plurality of second regions including a plurality of replication regions aligned along the second axis orthogonal to the first axis from the base region. Since it represents the number of, the signal generation unit referring to the positional relationship data can grasp how many times the replication drive signal should be generated. Since the second offset data represents the amount of deviation between two adjacent regions in the plurality of second regions, the signal generator that refers to the positional relationship data is a plurality of second regions that are aligned along the second axis. The position of each area can be grasped. Therefore, the signal generation unit refers to the second region number data and the second offset data, and generates a replication drive signal so that the movement pattern determined for the base region is applied to each of the plurality of second regions. can do. As a result, a soldering operation similar to the soldering operation performed in the base region can be performed in a plurality of replication regions aligned along the second axis with respect to the base region. Since the common soldering operation is performed on the plurality of second regions aligned along the second axis even if the teaching work is not performed on all the plurality of second regions aligned along the second axis. The soldering device described above can effectively reduce the labor of the operator who performs the teaching work.

With respect to the above configuration, the input unit is the soldering iron when the soldering iron after soldering to at least one soldering position in the base region moves upward from the surface of the electronic substrate. You may accept the input of the movement amount data which represents the movement amount of. The pattern determination unit may determine the movement pattern in which the soldering iron moves upward for each soldering with reference to the movement amount data. The duplication drive signal generated by the signal generation unit operates the drive unit so as to move in the plurality of duplication regions according to the determined movement pattern, and solders the soldering iron in the plurality of duplication regions. It may be moved upward for each soldering.

According to the above configuration, the movement amount data represents the movement amount when the soldering iron after soldering moves upward from the surface of the electronic substrate. Therefore, the pattern determination unit referring to the movement amount data is soldered. The drive pattern of the drive unit can be determined so that the subsequent soldering iron is separated from the surface of the electronic substrate upward. The soldering iron can move up and down toward the soldering position in the base region to allow point-shaped solder to adhere to the surface of the electronic substrate.

Since the duplication drive signal generated by the signal generation unit operates the drive unit so as to move in a plurality of duplication regions according to the determined movement pattern, the soldering iron is moved upward for each soldering even in the plurality of duplication regions. You can move to. The soldering iron can move up and down toward the soldering position in the duplication region to adhere point-shaped solder to the surface of the electronic substrate.

With respect to the above configuration, the base pattern data sets the first soldering position and the second soldering position different from the first soldering position as coordinate values representing at least one soldering position. When a plurality of coordinate values to be represented are included, the input unit may accept input of a plurality of values different from each other with respect to the first soldering position and the second soldering position as the movement amount data.

According to the above configuration, the input unit accepts input of a plurality of values different from each other between the first soldering position and the second soldering position as the movement amount data, so that the operator can perform the first soldering. The amount of movement required at the position and the amount of movement required at the second soldering position can be individually input. Since the soldering iron does not move unnecessarily large upwards, the period for moving the soldering iron is shortened and the soldering work is made more efficient.

With respect to the above configuration, the base pattern data sets the first soldering position and the second soldering position different from the first soldering position as coordinate values representing at least one soldering position. When a plurality of coordinate values to be represented are included, the input unit may collectively accept input of values common to the first soldering position and the second soldering position as the movement amount data.

According to the above configuration, the input unit collectively receives the input of the value common to the first soldering position and the second soldering position as the movement amount data, so that the operator can move the soldering iron. Does not have to be set individually for the first soldering position and the second soldering position. Therefore, the operator can set the moving amount of the soldering iron in a short time.

The soldering device described above allows the operator to easily set the soldering position.

It is a schematic block diagram of an exemplary soldering apparatus. It is a flow chart of the exemplary movement pattern determined by the pattern determination part of the soldering apparatus shown in FIG. FIG. 5 is a flow chart showing a movement pattern changed by the pattern analysis unit of the soldering apparatus shown in FIG. 1 using an offset amount. FIG. 5 is a flow chart showing a movement pattern changed by the pattern analysis unit of the soldering apparatus shown in FIG. 1 using an offset amount. FIG. 5 is a flow chart showing a movement pattern changed by the pattern analysis unit of the soldering apparatus shown in FIG. 1 using an offset amount. It is a schematic flowchart which shows the exemplary operation of the control part of the soldering apparatus shown in FIG. It is a schematic plan view of an exemplary electronic substrate. It is an exemplary image displayed by the input interface of the soldering apparatus shown in FIG. It is a schematic perspective view of the soldering apparatus shown in FIG. It is a schematic plan view of an exemplary electronic substrate.

<Soldering device developed by the present inventors>
FIG. 7 is a schematic perspective view of the soldering apparatus 100 developed by the present inventors. The schematic structure of the soldering apparatus 100 will be described with reference to FIG.

FIG. 7 shows Cartesian coordinates defined by the x-axis, y-axis and z-axis. For the following description, the positive direction of the x-axis is defined as "right". The negative direction of the x-axis is defined as "left". The positive direction of the y-axis is defined as "front". The negative direction of the y-axis is defined as "after". The positive direction of the z-axis is defined as "up". The negative direction of the z-axis is defined as "down". The terms "clockwise" and "counterclockwise" refer to rotation about a rotation axis parallel to the z-axis. These directional terms are used solely for clarity of explanation. Therefore, the principles of this embodiment are not limited to these directional terms.

The soldering device 100 includes a soldering mechanism 110, a support 120, an operation unit 130, a heating control unit 140, an input interface 150, and a drive unit (not shown). The soldering mechanism 110 solders to an electronic board (not shown). The heating control unit 140 is used for temperature control of the soldering mechanism 110. The support 120 supports the soldering mechanism 110, the operation unit 130, and the drive unit. The plurality of motors used as the drive unit are attached to the support 120 and the soldering mechanism 110. The operation unit 130 can be suitably used for teaching work for storing the coordinate values of the soldering positions on the electronic board in the soldering device 100. When the operator performing the teaching operation operates the operation unit 130, the drive unit moves or rotates the soldering mechanism 110 in the direction determined by the operation on the operation unit 130. The input interface 150 is used for inputting various operating parameters of the soldering apparatus 100.

The support 120 includes a base 121, two columns 122 and 123, a support bridge 124, and an installation base 125. The base 121 is a substantially rectangular plate-shaped portion. The support column 122 is erected upward from the left edge of the base 121. The support column 123 is erected above the right edge of the base 121. The columns 122 and 123 are aligned in the x-axis direction. The support bridge 124 is bridged from the left column 122 to the right column 123. Therefore, the support bridge 124 extends in the x-axis direction. The soldering mechanism 110 is attached to the support bridge 124. When the operator operates the operation unit 130, one of the plurality of motors used as the drive unit can move the soldering mechanism 110 along the support bridge 124.

The installation base 125 is a substantially rectangular plate-shaped portion installed on the upper surface of the base 121. The operator can fix the electronic board on the installation table 125. The operator can operate the operation unit 130 to move the soldering mechanism 110 on the installation base 125 in the x-axis direction and the z-axis direction, or rotate the soldering mechanism 110 around a rotation axis parallel to the z-axis. it can. As shown in FIG. 7, a slot 126 extending in the y-axis direction is formed on the upper surface of the base 121. When the operator operates the operation unit 130, one of the plurality of motors used as the drive unit can move the installation base 125 along the slot 126. The relative positional relationship between the electronic board on the installation table 125 and the soldering mechanism 110 is adjusted by the movement of the soldering mechanism 110 in the x-axis direction and the z-axis direction. The relative positional relationship between the electronic board on the installation base 125 and the soldering mechanism 110 is adjusted by the movement of the installation base 125 in the y-axis direction.

The soldering mechanism 110 includes a horizontally movable column 111, a vertically movable column 112, a thread solder 113, a solder delivery unit 114, a soldering iron 115, and a holding unit 116. The horizontally movable column 111 holds the vertically movable column 112, the thread solder 113, the solder delivery unit 114, the soldering iron 115, and the holding unit 116, and moves in the x-axis direction under the operation of the driving unit. The vertically movable column 112 holds the thread solder 113, the solder delivery section 114, the soldering iron 115, and the holding section 116, and moves in the z-axis direction under the operation of the drive section. The holding unit 116 holds the solder feeding unit 114 and the soldering iron 115, and orbits them around a rotation axis substantially coincide with the vertical central axis of the vertically movable column 112. The solder delivery unit 114 sends the thread solder 113 to the tip of the soldering iron 115 by forming the tip thereof. The soldering iron 115 melts the thread solder 113 sent out from the solder delivery unit 114 under the temperature control of the heating control unit 140.

The horizontally movable column 111 is a columnar member long in the z-axis direction. The horizontally movable column 111, the support bridge 124, and the drive unit are designed so that when one of the plurality of motors forming the drive unit is activated, the horizontally movable column 111 moves substantially horizontally along the support bridge 124. Known soldering equipment structures may be applied to the design of horizontally movable columns 111, support bridges 124 and drives. Therefore, the principle of this embodiment is not limited to a specific connecting structure between the horizontally movable column 111, the support bridge 124 and the drive unit.

Like the horizontally movable column 111, the vertically movable column 112 is a columnar member long in the z-axis direction. The vertically movable column 112, the horizontally movable column 111, and the driving unit are designed so that the vertically movable column 112 moves substantially vertically along the horizontally movable column 111 when one of the plurality of motors forming the drive unit is operated. To Known soldering equipment structures may be applied to the design of vertically movable columns 112, horizontally movable columns 111 and drives. Therefore, the principle of the present embodiment is not limited to a specific connecting structure between the vertically movable column 112, the horizontally movable column 111, and the driving unit.

The holding unit 116 is used to hold the solder feeding unit 114 and the soldering iron 115. The holding portion 116 is connected to the lower end of the vertically movable column 112. Therefore, the holding portion 116, the solder feeding portion 114, and the soldering iron 115 can move upward, downward, leftward, and rightward together with the vertically movable column 112. When one of the plurality of motors forming the drive unit is activated, the holding unit 116, the vertically movable column 112, and the vertically movable column 112 are rotated so that the holding unit 116 rotates around a rotation axis substantially coincide with the vertical central axis of the vertically movable column 112. The drive unit is designed. The operator can operate the operation unit 130 and rotate the holding portion 116 to prevent the soldering iron 115 from coming into contact with the electronic components on the electronic substrate. Since both the solder delivery section 114 and the soldering iron 115 are attached to the holding section 116, the relative positional relationship between them does not change during the rotation of the holding section 116. The structure of the known soldering device may be applied to the design of the holding portion 116, the vertically movable column 112 and the driving portion. Therefore, the principle of the present embodiment is not limited to a specific connecting structure between the holding portion 116, the vertically movable column 112, and the driving portion.

The holding portion 116 includes an arc-shaped plate 117 to which the soldering iron 115 is attached. The arc-shaped slot 118 is formed in the arc-shaped plate 117. The operator can change the mounting position of the soldering iron 115 along the slot 118 and adjust the inclination angle of the soldering iron 115 with respect to the upper surface of the electronic board on the installation base 125. A scale (not shown) may be provided along slot 118. In this case, the operator can numerically grasp the inclination angle of the soldering iron 115.

The heating control unit 140 is used to control the temperature of the tip of the soldering iron 115. The feedback control technique used in known soldering equipment can be applied to the temperature control performed between the heating control unit 140 and the soldering iron 115. Therefore, the principle of the present embodiment is not limited to the specific temperature control technique performed between the heating control unit 140 and the soldering iron 115.

The solder bobbin 119 around which the thread solder 113 is wound is attached to the upper end of the vertically movable column 112. The thread solder 113 extends from the solder bobbin 119 to the solder delivery section 114. When soldering is performed, the solder delivery unit 114 supplies solder to the tip of the soldering iron 115 (or in the vicinity of the tip) by the amount set by the operator. As a result, the solder is melted at the tip of the soldering iron 115 (or near the tip). The structure of the solder delivery mechanism of a known soldering apparatus can be applied to the solder delivery unit 114. Therefore, the principle of this embodiment is not limited to the specific structure of the solder delivery unit 114.

The operation unit 130 includes a housing 131, a left lever 132, a right lever 133, and a coordinate input unit 134. The operator can tilt the left lever 132 and the right lever 133 protruding from the upper surface of the housing 131 to move the soldering iron 115 and the installation base 125. The coordinate input unit 134 is used to store the coordinates of the tip of the soldering iron 115 in the soldering device 100. When the tip of the soldering iron 115 reaches a predetermined soldering position on the electronic board fixed on the installation base 125, the operator operates the coordinate input unit 134 and the soldering device 100 executes the operation. The coordinate value of the position of the tip in the coordinate space set for the arithmetic processing can be stored in the soldering device 100 as the soldering position. Various electronic components that generate electric signals indicating that the tilt amount of the left lever 132 and the right lever 133 and the operation of the coordinate input unit 134 have been performed are arranged in the housing 131.

The operator tilts the left lever 132 and the right lever 133 protruding from the upper surface of the housing 131 to specify the direction of changing the relative position between the electronic board on the installation base 125 and the tip of the soldering iron 115. can do. The left lever 132 moves the tip of the soldering iron 115 in the z-axis direction (that is, moves the tip upward and downward) and rotates the holding portion 116 (that is, around the rotation axis of the holding portion 116). It is used for the orbital movement of the tip of the soldering iron 115). The right lever 133 moves the tip of the soldering iron 115 in the x-axis direction (that is, the movement of the tip to the left and right) and the installation base 125 in the y-axis direction (that is, the installation base). Used for the relative movement of the tip forward and backward with respect to the electronic substrate on 125). The table below shows an exemplary correspondence of the operation of the soldering apparatus 100 to the operation of the left lever 132 and the right lever 133.

When the tip reaches the soldering position defined on the electronic board on the bench 125 during the teaching operation, the operator places it between the left and right levers 132 aligned in the x-axis direction. By operating the coordinate input unit 134, it is possible to input the coordinate position of the tip in the coordinate space set for the arithmetic processing executed by the soldering apparatus 100. As a result, the soldering device 100 can remember the input coordinate position as the soldering position. During the subsequent soldering operation, the soldering apparatus 100 can refer to the stored coordinate position of the soldering position and automatically perform the soldering. With respect to this embodiment, the coordinate input unit 134 is designed as a general pressing button. Therefore, the operator can perceive the reaction force received from the pressing button with his or her fingertips and determine whether or not the pressing button has been operated.

The input interface 150 is used for inputting other operation parameters related to the operation of the soldering apparatus 100 (for example, the supply amount of the above-mentioned thread solder 113). A touch panel may be used as the input interface 150. In this case, the input interface 150 can display the coordinate values (that is, the soldering positions) input during the teaching operation described above. Therefore, the operator can numerically grasp the result of the teaching work.

As a result of the common arrangement pattern (hereinafter referred to as "common pattern") regarding the soldering position being formed at different positions on one electronic substrate, the electronic substrate may have a large number of soldering positions. The present inventors have worked on reducing the load of teaching work on an electronic substrate having a plurality of common patterns.

FIG. 8 is a schematic plan view of an exemplary electronic substrate 900. With reference to FIGS. 7 and 8, a large load of teaching work on the electronic substrate 900 having a plurality of common patterns will be described.

The dotted line DLx shown in FIG. 8 is a virtual line extending parallel to the x-axis. The dotted line DLy shown in FIG. 8 is a virtual line extending parallel to the y-axis. The electronic substrate 900 is equally divided into four regions by the dotted lines DLx and DLy. After the soldering work, the electronic substrate 900 is cut along the dotted lines DLx and DLy to form four small substrates.

There are 16 soldering positions P01 to P16 on the electronic board 900. There are four sets of four soldering positions P01 to P04, four sets of soldering positions P05 to P08, four sets of soldering positions P09 to P12, and four sets of four soldering positions P13 to P16. Corresponds to each of the areas of. The set of 4 soldering positions P01 to P04, the set of 4 soldering positions P05 to P08, the set of 4 soldering positions P09 to P12, and the set of 4 soldering positions P13 to P16 are common. Has an arrangement pattern of (ie, these pairs are common patterns). Therefore, each of the four regions virtually divided by the dotted lines DLx and DLy is a soldering region where the soldering operation using the soldering iron 115 is performed.

The present inventors have incorporated into the soldering apparatus 100 a palletizing function that performs teaching work on one of the four regions and eliminates the need for teaching work on the remaining three regions. The palletizing function applies the operation pattern of the soldering iron 115 obtained as a result of the teaching work performed on one area to the other areas, and the area where the teaching work is performed on the other areas as well. Allows for the same soldering as. As a result of the palletizing function, the teaching work for the electronic substrate 900 will be performed only for one of the four regions. Soldering to soldering positions on the other regions is performed based on the results of the teaching work performed on one of the four regions, without the teaching work on these regions. On the other hand, if there is no palletizing function, the operator needs to perform teaching work on all 16 soldering positions on the electronic board 900. Therefore, the palletizing function can contribute to greatly improving the efficiency of the teaching work.

<Soldering equipment with palletizing function>
FIG. 1 is a schematic block diagram of the soldering apparatus 100. The soldering apparatus 100 will be described with reference to FIGS. 1, 7, and 8.

FIG. 1 shows the operation unit 130 and the input interface 150 described with reference to FIG. 7 as the input unit 190. The input unit 190 is used for inputting data required for the palletizing function.

The soldering device 100 includes a storage unit 160 and a control unit 170. These are incorporated in the soldering apparatus 100 for the palletizing function. The storage unit 160 stores the input data from the input unit 190. The control unit 170 refers to the data stored in the input unit 190 and controls the drive unit 180.

The operator sets one of the four regions described with reference to FIG. 8 as the base region 911 where the teaching work for storing the soldering positions P01 to P04 in the soldering apparatus 100 is performed. Can be done. Regarding the present embodiment, the operator sets the left front area as the base area 911. The choice of base region 911 is solely dependent on the operator. Therefore, the principle of the present embodiment is not limited to which region is set as the base region 911.

The remaining regions of the four regions described with reference to FIG. 8 are set as three replication regions 912,913,914. The teaching operation may not be performed on these replication areas 912,913,914. Instead, soldering to soldering positions P05-P16 within these replication regions 912,913,914 is performed by the palletizing function. The replication area 912 is located to the right of the base area 911. The replication area 913 is located after the base area 911. The duplication region 914 is aligned diagonally with respect to the base region 911 of the rectangular electronic substrate 900. These replication areas 912, 913, 914 are treated as replication of the base region 911 in the palletizing process of the control unit 170. That is, the movement locus of the soldering iron 115 set with respect to the base region 911 is duplicated in the duplication region 912,913,914 by the palletizing function, and is duplicated on the duplication region 912,913,914 during the soldering operation. The soldering iron to be soldered will move along the duplicated movement locus.

The operator who performs the teaching operation operates the operation unit 130 and inputs the coordinate value of the soldering position in the base area 911. In this embodiment, the left front corner of the electronic board 900 is set as the coordinate origin. The coordinate value is set with reference to the coordinate origin. The table below shows the coordinate values of the soldering positions P01 to P04 in the base region 911. The input coordinate values are stored in the storage unit 160 as base pattern data representing the arrangement patterns of the soldering positions P01 to P04 in the base area 911. With respect to this embodiment, the first soldering position is one of the soldering positions P01 to P04. The second soldering position is the other one of the soldering positions P01 to P04.

As shown in FIG. 8, the soldering positions P05 to P08 on the duplication region 912 exist at positions deviated from the soldering positions P01 to P04 on the base region 911 by "xa" in the positive direction on the x-axis. ing. The soldering positions P09 to P12 on the duplication region 913 exist at positions shifted in the negative direction by "ya" from the soldering positions P01 to P04 on the base region 911 in the negative direction. The soldering positions P13 to P16 on the duplication region 914 deviate from the soldering positions P01 to P04 on the base region 911 by "xa" in the positive direction on the x-axis and "ya" in the negative direction on the y-axis. Exists in position. Therefore, the soldering positions P05 to P16 on the duplication region 912, 913, 914 can have the coordinate values shown in the table below.

As shown in "Table 3", the soldering positions of the duplication regions 912, 913, 914 can be expressed using the coordinate values of the soldering positions of the base region 911. The positional relationship between the base area 911 and the replication area 912,913,914 (that is, the amount of deviation of each of the replication areas 912, 913, 914 from the base area 911) is represented by the offset amounts "xa" and "ya". Can be done. The operator can input the offset amounts "xa" and "ya" to the input interface 150. The input offset amounts "xa" and "ya" are stored in the storage unit 160 as positional relationship data representing the positional relationship between the base area 911 and the replication area 912,913,914.

The operator can input the movement amount data representing the movement amount when the tip of the soldering iron 115 moves up and down in the base area 911 to the input interface 150. The movement amount data is a point soldering operation to prevent the tip of the soldering iron 115 from coming into contact with the electronic components mounted on the electronic board 900, or to attach point-shaped solder to the upper surface of the electronic board 900. It is set to determine the amount of movement of the soldering iron upward and / or downward. Immediately before the soldering is performed, the tip of the soldering iron 115 is arranged above the soldering position and at a position separated from the upper surface of the electronic substrate 900 by the value of the movement amount data. After that, the tip of the soldering iron 115 is lowered by the value of the movement amount data, and soldering is performed at the soldering position. After soldering, the tip of the soldering iron 115 is increased by the value of the movement amount data. Since the tip of the soldering iron 115 is separated from the upper surface of the electronic board 900 by the value of the movement amount data, even if the tip of the soldering iron 115 moves horizontally thereafter, the electronic board 900 Do not touch the mounted electronic components. The amount of movement of the tip of the soldering iron 115 may be set individually for each soldering position. In this case, the operator can set the amount of movement so that the tip of the soldering iron 115 does not move an unnecessary distance in the z-axis direction. For example, if a short electronic component is present at a position overlapping the movement locus of the tip of the soldering iron 115, the operator can set a small value as the movement amount. On the other hand, if a tall electronic component is present, the operator can set a large value as the movement amount. Since the soldering iron 115 does not travel an unnecessarily long distance in the z-axis direction, soldering to the electronic substrate 900 can be completed in a short time. Alternatively, the amount of movement of the tip of the soldering iron 115 may be a common value for all soldering positions. For example, the operator can set a value larger than the height of the electronic component as the movement amount so that the tip does not hit the tallest electronic component among the electronic components on the electronic board 900. In this case, the work of inputting the movement amount is simplified. In this embodiment, one of the x-axis and the y-axis is used as the first axis. The other of the x-axis and the y-axis is used as the second axis.

The control unit 170 includes a pattern determination unit 171 and a signal generation unit 172. The pattern determination unit 171 refers to the base pattern data and the movement amount data, and how to move the tip of the soldering iron 115 in the base region 911 (that is, how to drive the drive unit 180). ) Is determined. When the drive unit 180 moves the tip of the soldering iron 115 within the base region 911, the signal generation unit 172 generates a base drive signal for moving the soldering iron 115 according to a determined movement pattern. To do. When the drive unit 180 moves the tip of the soldering iron 115 within the duplication area 912, 913, 914, the signal generation unit 172 refers to the positional relationship data in the storage unit 160. The signal generation unit 172 duplicates the movement pattern of the tip on the base area 911 to the duplication area 912, 913, 914 based on the positional relationship data and the movement pattern determined for the base area 911. To generate a replication drive signal. The base drive signal and the duplicate drive signal are output from the signal generation unit 172 to the drive unit 180. The drive unit 180 moves the soldering iron 115 and the installation base 125 according to the base drive signal and the duplication drive signal, and solders the soldering irons to the soldering positions P01 to P16 on the base area 911 and the duplication area 912,913,914. Reach the tip of 115.

FIG. 2 is a flow chart of an exemplary movement pattern determined by the pattern determination unit 171. The pattern determination unit 171 will be described with reference to FIGS. 1, 2, 7, and 8.

The series of operations shown in FIG. 2 represents the movement pattern of the soldering iron 115 in the soldering operation after the teaching operation. The soldering iron 115 is moved over the base region 911 according to a series of operations shown in FIG. The pattern determination unit 171 uses a predetermined algorithm designed to move the tip of the soldering iron 115 to the coordinate values when the coordinate values of the soldering positions obtained as a result of the teaching work are given. The series of operations shown in FIG. 2 can be determined.

With respect to the soldering iron 100 described with reference to FIG. 7, the soldering iron 115 moves in the x-axis direction and the z-axis direction, and the soldering iron 115 goes around the rotation axis of the holding portion 116. 115 actually moves. On the other hand, the soldering iron 115 does not actually move in the y-axis direction, but instead the installation base 125 moves in the y-axis direction. While the installation table 125 is moving in the y-axis direction, the soldering iron 115 can be displaced relative to the electronic substrate 900 in the y-axis direction. In the following description, the term "moving pattern" means not only the actual movement of the soldering iron 115, but also the relative movement of the soldering iron 115 with respect to the surface of the electronic substrate 900.

“Operation 1” to “operation 4” shown in FIG. 2 represent movement patterns for the soldering position P01. “Operation 5” to “operation 8” represent movement patterns for the soldering position P02. “Operation 9” to “operation 12” represent movement patterns for the soldering position P03. “Operation 13” to “operation 16” represent movement patterns for the soldering position P04. "Operation 1" to "operation 16" are sequentially executed by the drive unit 180. The coordinate values (x01, y01, z01, θ01) to the coordinate values (x04, y04, z04, θ04) shown in FIG. 2 are obtained as a result of the teaching operation using the operation unit 130.

Regarding "operation 1", "operation 5", "operation 9", and "operation 13", the pattern determination unit 171 positions the tip of the soldering iron 115 above the soldering positions P01 to P04. Specifies the behavior of. Regarding "operation 2", "operation 6", "operation 10" and "operation 14", the pattern determination unit 171 operates the drive unit 180 that lowers the tip of the soldering iron 115 to the soldering positions P01 to P04. To specify. Regarding "operation 3", "operation 7", "operation 11", and "operation 15", the pattern determination unit 171 specifies an operation in which the drive unit 180 is stopped until soldering at the soldering positions P01 to P04 is completed. To do. Regarding "operation 4", "operation 8", "operation 12", and "operation 16", the pattern determination unit 171 positions the tip of the soldering iron 115 above the soldering positions P01 to P04. Specifies the behavior of.

As shown in FIG. 1, the signal generation unit 172 includes a first generation unit 271, a second generation unit 272, a third generation unit 273, a fourth generation unit 274, a pattern analysis unit 275, and an offset command. Includes part 276 and. The first generation unit 271 generates a drive signal for rotating the tip of the soldering iron 115 counterclockwise or clockwise. The second generation unit 272 generates a drive signal for lowering or raising the tip of the soldering iron 115. The third generation unit 273 generates a drive signal for moving the tip of the soldering iron 115 to the left or right. The fourth generation unit 274 generates a drive signal for moving the installation table 125 forward or backward. The pattern analysis unit 275 analyzes the movement pattern shown in FIG. 2 and determines which of the first generation unit 271 to the fourth generation unit 274 is given a drive signal generation instruction. The pattern analysis unit 275 instructs the selected generation unit (that is, any one of the first generation unit 271 to the fourth generation unit 274) to generate a drive signal and information (for example,) required for generating the drive signal. The coordinate value of the target position) is given. The first generation unit 271 to the fourth generation unit 274 generate the above-mentioned drive signal in response to the generation instruction. The offset command unit 276 refers to the positional relationship data stored in the storage unit 160, and notifies the pattern analysis unit 275 of the position of the replication area 912, 913, 914. The pattern analysis unit 275 receives the movement pattern shown in FIG. 2 (that is, the movement pattern for the base region 911) and the positional relationship information (that is, the offset amounts “xa” and “ya”) received from the offset command unit 276. Use to change. The pattern analysis unit 275 is the target of the drive signal generation instruction (that is, the first generation unit 271 to the fourth generation unit) based on the changed movement pattern (that is, the movement pattern for the replication area 912, 913, 914). One of 274) is determined.

With respect to "operation 1", "operation 5", "operation 9" and "operation 13" shown in FIG. 2, the pattern analysis unit 275 outputs a generation command to the third generation unit 273 and / or the fourth generation unit 274. Determined as the destination. At this time, if it is necessary to change the angle of the tip of the soldering iron 115 around the rotation axis of the holding unit 116, the pattern analysis unit 275 also includes the first generation unit 271 in the output destination of the generation command. .. Regarding "operation 2", "operation 4", "operation 6", "operation 8", "operation 10", "operation 12", "operation 14" and "operation 16", the pattern analysis unit 275 generates a second. Section 272 is set as the output destination of the generation command.

With respect to the movement pattern shown in FIG. 2, soldering in the base region 911 is performed in the order of soldering positions P01, P02, P03, P04. However, the soldering order may be determined by the operator. For example, the order of soldering may be determined according to the order of teaching operations. Alternatively, the operator may rank the coordinate values obtained from the teaching operation after the teaching operation. Therefore, the principles of this embodiment are not limited to a particular order of soldering within the base region 911.

3A to 3C are flow charts showing movement patterns changed by the pattern analysis unit 275 using the offset amounts “xa” and “ya”. The process of changing the movement pattern will be described with reference to FIGS. 1 to 3C, 7 and 8.

The movement pattern described with reference to FIG. 2 is applied to the base region 911, whereas the movement pattern of the soldering iron 115 shown in FIGS. 3A to 3C is the replication region 912,913,914. Applies to each. That is, in the soldering operation after the teaching operation, the soldering iron 115 is moved on the duplication region 912, 913, 914 according to a series of operations shown in FIGS. 3A to 3C.

“Operation 17” to “operation 32” shown in FIG. 3A correspond to “operation 1” to “operation 16” described with reference to FIG. Of the coordinate values of "motion 17" to "motion 32", only the x coordinate value is changed from the coordinate values of "motion 1" to "motion 16". That is, the x-coordinate value of the coordinate values of "operation 17" to "operation 32" is offset by the offset amount "xa" in the positive direction of the x-axis from the coordinate values of "operation 1" to "operation 16". There is. Since the duplication region 912 is offset from the base region 911 in the positive direction of the x-axis by an offset amount "xa", when the drive unit 180 operates according to the movement pattern shown in FIG. 3A, the tip becomes the base. It is possible to move on the duplication region 912 by following the movement locus of the same pattern as the movement locus drawn by the tip on the region 911.

“Operation 33” to “operation 48” shown in FIG. 3B correspond to “operation 1” to “operation 16” described with reference to FIG. Of the coordinate values of "motion 33" to "motion 48", only the y coordinate value is changed from the coordinate values of "motion 1" to "motion 16". That is, the y coordinate value among the coordinate values of "operation 33" to "operation 48" is offset by the offset amount "ya" in the negative direction of the y axis from the coordinate values of "operation 1" to "operation 16". There is. Since the duplication region 913 is offset from the base region 911 in the negative direction of the y-axis by an offset amount “ya”, when the drive unit 180 operates according to the movement pattern shown in FIG. 3B, the tip becomes the base. It is possible to move on the duplication region 913 by following the movement locus of the same pattern as the movement locus drawn by the tip on the region 911.

“Operation 49” to “operation 64” shown in FIG. 3C correspond to “operation 1” to “operation 16” described with reference to FIG. Of the coordinate values of "operation 49" to "operation 64", only the x coordinate value and the y coordinate value are changed from the coordinate values of "operation 1" to "operation 16". That is, among the coordinate values of "operation 49" to "operation 64", the x-coordinate value and the y-coordinate value have an offset amount "xa" in the positive direction of the x-axis from the coordinate values of "operation 1" to "operation 16". It is shifted by the offset amount "ya" in the negative direction of the y-axis. Since the duplication region 914 is offset from the base region 911 by the offset amount “xa” in the positive direction of the x-axis and the offset amount “ya” in the negative direction of the y-axis, the drive unit 180 is shown in FIG. 3C. When operating according to the movement pattern, the tip can move on the duplication area 914 by following the movement locus of the same pattern as the movement locus drawn by the tip on the base area 911.

The drive unit 180 includes a first motor 181, a second motor 182, a third motor 183, a fourth motor 184, a first encoder 185, a second encoder 186, a third encoder 187, and a fourth encoder. 188 and. The first motor 181 to the fourth motor 184 receive drive signals from the first generation unit 271 to the fourth generation unit 274, respectively. The first motor 181 rotates the holding unit 116 so that the tip of the soldering iron 115 orbits counterclockwise or clockwise in response to the drive signal from the first generation unit 271. The second motor 182 lowers or raises the vertically movable column 112 in response to a drive signal from the second generation unit 272. As a result, the tip of the soldering iron 115 attached to the vertically movable column 112 via the holding portion 116 also descends or rises. The third motor 183 moves the horizontally movable pillar 111 to the left or right in response to a drive signal from the third generation unit 273. Since the soldering iron 115 is attached to the horizontally movable column 111 via the holding portion 116 and the vertically movable column 112, the tip of the soldering iron 115 also moves to the left or right together with the horizontally movable column 111. can do. The fourth motor 184 moves the installation base 125 forward or backward in response to a drive signal from the fourth generation unit 274. As a result, the relative position of the tip of the soldering iron 115 with respect to the electronic board 900 on the installation table 125 changes forward or backward.

The first encoder 185 to the fourth encoder 188 are attached to the first motor 181 to the fourth motor 184, and detect their respective rotation amounts. The electric signal representing the detected rotation amount is output from the first encoder 185 to the fourth encoder 188 to the first generation unit 271 to the fourth generation unit 274. The first generation unit 271 to the fourth generation unit 274 refer to the electric signal from the first encoder 185 to the fourth encoder 188 and perform feedback control to the first motor 181 to the fourth motor 184.

Regarding the above-described embodiment, the tip of the soldering iron 115 is moving along the z-axis according to the movement amount data. However, the movement amount data may represent the start point and the end point of the point solder operation for adhering the point-shaped solder to the surface of the electronic substrate 900. That is, if the coordinates representing the start point above the soldering position corresponding to the soldering position (that is, the end point) on the surface of the electronic board 900 are specified in the movement amount data, the soldering iron is specified. It is possible to reciprocate from the start point to the end point and then from the end point to the start point.

FIG. 4 is a schematic flowchart showing an exemplary operation of the control unit 170. The operation of the control unit 170 will be described with reference to FIGS. 1 to 4, 7 and 8.

(Step S105)
Step S105 is performed after the teaching work for the base region 911 is completed. Therefore, the base pattern data, the movement amount data, and the positional relationship data are stored in the storage unit 160. When the soldering operation is started, the pattern determination unit 171 reads the base pattern data and the movement amount data from the storage unit 160. After that, step S110 is executed.

(Step S110)
The pattern determination unit 171 refers to the base pattern data and the movement amount data, and determines the movement pattern (see FIG. 2) for the base region 911. The determined movement pattern is output from the pattern determination unit 171 to the pattern analysis unit 275. After that, step S115 is executed.

(Step S115)
The pattern analysis unit 275 analyzes the determined movement pattern and determines the output destination of the generation command. If it is necessary to change the angular position of the tip of the soldering iron 115 with respect to the movement pattern “operation 1” shown in FIG. 2, the pattern analysis unit 275 issues a generation command to the first generation unit 271. Determine the output destination. If it is necessary to adjust the amount of movement of the tip of the soldering iron 115 (that is, the distance between the upper surface of the electronic board 900 and the tip), the pattern analysis unit 275 may perform the second generation unit 272. Determine the output destination of the generation command. If the tip of the soldering iron 115 needs to be moved in the x-axis direction, the pattern analysis unit 275 determines the third generation unit 273 as the output destination of the generation command. If the installation table 125 needs to be moved in the y-axis direction, the pattern analysis unit 275 determines the fourth generation unit 274 as the output destination of the generation command. The generation command is output together with the target coordinate values to the output destination (at least one of the first generation unit 271 to the fourth generation unit 274) determined by the pattern analysis unit 275. After that, step S120 is executed.

(Step S120)
If the first generation unit 271 receives the generation command, the tip of the soldering iron 115 corresponds to the target value of the angular position (angle coordinate value “θ01” with respect to “operation 1” in FIG. 2). Generate a base drive signal to reach the angular position. If the second generation unit 272 receives the generation command, the tip of the soldering iron 115 corresponds to the target value of the z coordinate (angle coordinate value "z01 + z" with respect to "operation 1" in FIG. 2). Generate a base drive signal to reach the position. If the third generation unit 273 has received the generation command, the tip of the soldering iron 115 corresponds to the target value of the x coordinate (angle coordinate value "x01" with respect to "operation 1" in FIG. 2). Generate a base drive signal to reach the position. If the fourth generation unit 274 receives the generation command, the tip of the soldering iron 115 corresponds to the target value of the y coordinate (angle coordinate value "y01" with respect to "operation 1" in FIG. 2). Generate a base drive signal to reach the position. These base drive signals are output to the first motor 181 to the fourth motor 184, respectively. The first motor 181 to the fourth motor 184 operate in response to these base drive signals. Regarding "operation 1" in FIG. 2, the tip of the soldering iron 115 is the result of the operation of the first motor 181 to the fourth motor 184 in response to the base drive signal, and the target coordinate values (x01, y01, z01 + za, Reach the position corresponding to θ01). The pattern analysis unit 275 monitors the signal generation processing of the first generation unit 271 to the fourth generation unit 274, and the first generation unit 271 to the fourth generation unit 274 set the tip of the soldering iron 115 as the target coordinate value. It is possible to determine whether or not the operation for reaching the position corresponding to is completed. When the pattern analysis unit 275 determines that the tip of the soldering iron 115 has reached the target coordinate value, step S125 is executed.

(Step S125)
The pattern analysis unit 275 determines whether or not a series of operations (“operation 1” to “operation 4” with respect to the soldering position P01 shown in FIG. 8) determined for the target soldering position has been completed. To do. If a series of operations defined for the target soldering position has been completed, step S130 is executed. In other cases, step S115 is executed.

With respect to the soldering position P01 shown in FIG. 8, the processing loop consisting of steps S115 to S125 is repeated until "operation 4" is completed. That is, after the above-mentioned processing for "operation 1" (see step S115 and step S120 above), the processing for "operation 2", "operation 3", and "operation 4" is sequentially executed.

Regarding "operation 2", the pattern analysis unit 275 determines the second generation unit 272 as the output destination of the generation command, and sets the tip of the soldering iron 115 from the position corresponding to the z coordinate value "z01 + z" to the z coordinate value. Create a generation command instructing to lower to the position corresponding to "z01". The generation command is output from the pattern analysis unit 275 to the second generation unit 272. The second generation unit 272 is a base drive signal that lowers the tip from the position corresponding to the z coordinate value "z01 + z" to the position corresponding to the z coordinate value "z01" in response to the generation command from the pattern analysis unit 275. To generate. The second motor 182 lowers the tip of the soldering iron 115 to a position corresponding to the z coordinate value "z01" in response to the base drive signal from the second generation unit 272.

Regarding "operation 3", the pattern analysis unit 275 stops the output of the generation command for a predetermined period and waits for the completion of soldering at the soldering position P01. The pattern analysis unit 275 may refer to the signal from the solder delivery unit 114 to determine the completion of soldering, or may stop the output of the generation command for a predetermined period based on the signal from the timer element. ..

Regarding "operation 4", the pattern analysis unit 275 determines the second generation unit 272 as the output destination of the generation command, and sets the tip of the soldering iron 115 from the position corresponding to the z coordinate value "z01" to the z coordinate value. Create a generation command instructing to raise to the position corresponding to "z01 + za". The generation command is output from the pattern analysis unit 275 to the second generation unit 272. The second generation unit 272 is a base drive signal that raises the tip from the position corresponding to the z coordinate value "z01" to the position corresponding to the z coordinate value "z01 + z" in response to the generation command from the pattern analysis unit 275. To generate. The second motor 182 raises the tip of the soldering iron 115 to a position corresponding to the z-coordinate value "z01 + z" in response to the base drive signal from the second generation unit 272.

(Step S130)
The pattern analysis unit 275 determines whether or not soldering to all the soldering positions of the base region (soldering positions P01 to P04 on the base region 911 shown in FIG. 8) has been completed. If the execution of the movement pattern determined in step S110 is completed, step S135 is executed. In other cases, step S115 is executed.

With respect to the base region 911 shown in FIG. 8, the processing loop consisting of steps S115 to S130 is repeated until soldering to the soldering position P04 is complete. When the soldering is changed from the soldering position P01 to the soldering position P02 (that is, at the time of transition from "operation 4" to "operation 5"), the pattern analysis unit 275 sets the setting for "operation 4". It is confirmed whether or not the z-coordinate value "z01 + za" and the angular coordinate value "θ01" are equal to the z-coordinate value "z02 + zb" and the angular coordinate value "θ02" set for the "operation 5", respectively. If these z-coordinate values do not match, the pattern analysis unit 275 determines the output destination of the generation command to the second generation unit 272. After that, the second motor 182 displaces the tip of the soldering iron 115 in the z-axis direction in response to the base drive signal generated by the second generation unit 272. If the angular coordinate value "θ01" is not equal to the angular coordinate value "θ02", the pattern analysis unit 275 determines the output destination of the generation command to the first generation unit 271. The first motor 181 orbits the tip of the soldering iron 115 around the rotation axis of the holding unit 116 in response to the base drive signal generated by the first generation unit 271.

The z-coordinate value "z01 + za" and the angular coordinate value "θ01" set for the "motion 4" are set to the z-coordinate value "z02 + zb" and the angular coordinate value "θ02" set for the "motion 5", respectively. If they are equal, the process of horizontally moving the tip of the soldering iron 115 without causing displacement of the tip of the soldering iron 115 along the z-axis and orbital movement of the holding portion 116 around the rotation axis is performed. It is said. At this time, the pattern analysis unit 275 designates the third generation unit 273 and the fourth generation unit 274 as output destinations of the generation command. The third generation unit 273 generates and outputs a base drive signal for moving the tip of the soldering iron 115 in the positive direction on the x-axis in response to the generation command. As a result, the third motor 183 moves the tip of the soldering iron 115 to the right, and the tip reaches the position corresponding to the x-coordinate value "x02". The fourth generation unit 274 generates and outputs a base drive signal for moving the installation table 125 in the positive direction of the y-axis. Since the fourth motor 184 moves the installation base 125 forward in response to the base drive signal generated by the fourth generation unit 274, the tip of the soldering iron 115 is attached to the electronic board 900 on the installation base 125. It moves relatively backward (that is, in the negative direction of the y-axis). As a result, the tip reaches the position corresponding to the y coordinate value "y02".

The same processing is performed when the soldering is changed from the soldering position P02 to the soldering position P03 (that is, when the transition from "operation 8" to "operation 9"), and when the soldering is performed at the soldering position. It is also performed when the soldering position is changed from P03 to P04 (that is, at the time of transition from "operation 12" to "operation 13"). After these soldering position change processes, the "tip descent", "tip pause", and "tip rise" described in connection with the process loop consisting of steps S115 to S125. The process for "is executed.

(Step S135)
The pattern analysis unit 275 notifies the offset command unit 276 that the soldering to the base region 911 is completed. The offset command unit 276 and the pattern analysis unit 275 are used for processing for counting the processed replication areas (replication areas 912,913,914 shown in FIG. 8) in response to the notification from the pattern analysis unit 275. Set the count value "n" to "1". After that, step S140 is executed.

(Step S140)
The offset command unit 276 reads the position data from the storage unit 160. After that, step S145 is executed.

(Step S145)
The offset command unit 276 calculates the offset amount for the nth replication area. With respect to the electronic substrate 900 described with reference to FIG. 8, soldering is performed in the order of duplication regions 912, 913, 914. Therefore, when the count value "n" is "1", the soldering is performed on the duplication region 912. When the count value "n" is "2", the soldering is performed on the duplication region 913. When the count value "n" is "3", soldering is performed on the duplication region 914.

As shown in FIG. 8, the deviation of the replication region 912 from the base region 911 is “xa” in the x-axis direction, whereas it is “0” in the y-axis direction. Therefore, when the count value "n" is "1" (that is, when soldering is performed in the duplication region 912), the offset command unit 276 has an offset amount in the x-axis direction of "xa" and , Notifies that the offset amount in the y-axis direction is "0". The deviation of the duplication region 913 from the base region 911 is "0" in the x-axis direction, whereas it is "ya" in the y-axis direction. Therefore, when the count value "n" is "2" (that is, when soldering is performed in the duplication region 913), the offset command unit 276 has an offset amount in the x-axis direction of "0" and , Notifies that the offset amount in the y-axis direction is "ya". The deviation of the replication region 914 from the base region 911 is "xa" and "ya" in the x-axis direction and the y-axis direction. Therefore, when the count value "n" is "3" (that is, when soldering is performed in the replication region 913), the offset command unit 276 has an offset amount of "xa" in the x-axis direction and the y-axis direction. And notify that it is "ya". When the offset amount with respect to the replication area to be processed (that is, the nth replication area) is output from the offset command unit 276 to the pattern analysis unit 275, step S150 is executed.

(Step S150)
The pattern analysis unit 275 changes the movement pattern determined in step S110 based on the offset amount notified from the offset command unit 276. As a result, when the count value “n” is “1”, the movement pattern described with reference to FIG. 3A is obtained. When the count value “n” is “2”, the movement pattern described with reference to FIG. 3B is obtained. When the count value “n” is “3”, the movement pattern described with reference to FIG. 3C is obtained. After changing the movement pattern, a processing loop consisting of steps S155 to S170 is executed.

(Processing loop consisting of steps S155 to S170)
The processing loop including steps S155 to S170 is the same as the processing loop for steps S115 to S130. Therefore, the tip of the soldering iron 115 has a movement locus of the same pattern as the movement locus drawn by the tip of the soldering iron 115 in the base region 911 at a position deviated by the offset amount obtained in step S145. You can move by following. The coordinate data (that is, the base pattern data) obtained from the teaching work performed on the base region 911 is for setting the movement locus of the tip of the soldering iron 115 with respect to the replication region 912, 913, 914. As it is used, no teaching work is required for the replication area 912,913,914. Therefore, the soldering device 100 can significantly reduce the load of the teaching work as compared with the conventional soldering device that requires the teaching work for all the soldering positions. After the end of the processing loop consisting of steps S155 to S170 (that is, after the soldering is completed at all the soldering positions of the nth replication region), step S175 is executed.

(Step S175)
The pattern analysis unit 275 confirms whether or not the count value "n" is equal to the total number of replication regions "N" (N = 3 with respect to the electronic substrate 900 shown in FIG. 2). If the count value "n" is equal to the total number "N", the soldering process is complete (ie, soldering is performed at all soldering positions on the electronic board 900). In other cases, step S180 is executed.

(Step S180)
The pattern analysis unit 275 and the offset command unit 276 increment the count value “n” by “1”. After that, step S145 is executed. As a result, soldering to the next replication area is started.

<Other features>
The designer can give various features to the soldering apparatus 100 described above. The features described below do not limit the design principle of the soldering apparatus 100 in any way.

(Various division patterns of electronic boards)
The electronic board 900 described with reference to FIG. 8 is divided into two rows and two columns. However, the principles of the above-described embodiment can be applied to various division patterns of the electronic substrate 900.

FIG. 5 is a schematic plan view of the electronic substrate 900. Other division patterns for the electronic substrate 900 will be described with reference to FIGS. 1, 4, 5, 7, and 8.

The electronic substrate 900 shown in FIG. 5 is divided by a division pattern of Ny rows and Nx columns. That is, the electronic substrate 900 includes (Nx × Ny) divided regions. One of these divided regions is set as a base region. Similar to FIG. 8, the base region shown in FIG. 5 is a rectangular region forming the left front corner of the electronic substrate 900. The operator can input the items shown in the following table as positional relationship data before the soldering operation.

The offset command unit 276 creates a coefficient matrix for calculating the offset amount of each of the plurality of replication areas with respect to the base area based on the data representing the "total number of columns" and the "total number of rows" shown in "Table 4". decide. The following formula shows the coefficient matrix.

The offset command unit 276 sets the coefficient “Cx” of the replication region belonging to the column closest to the base region in the x-axis direction to “1” (that is, nx = 1). The offset command unit 276 sets the coefficient “Cx” of the replication region belonging to the second closest column to the base region in the x-axis direction to “2” (that is, nx = 2). Similarly, the offset command unit 276 sets the coefficient "Cx" of the replication region belonging to the column closest to the base region (Nx-1) in the x-axis direction to "Nx-1" (that is, nx = Nx−). 1). The offset command unit 276 sets the coefficient “Cy” of the replication region belonging to the column closest to the base region in the y-axis direction to “1” (that is, ny = 1). The offset command unit 276 sets the coefficient “Cy” of the replication region belonging to the second closest column to the base region in the y-axis direction to “2” (that is, ny = 2). Similarly, the offset command unit 276 sets the coefficient "Cy" of the replication region belonging to the column closest to the base region (Ny-1) in the y-axis direction to "Ny-1" (that is, ny = Ny−). 1). Regarding the present embodiment, the first region number data is one of the “total number of columns” and the “total number of rows” in “Table 4”. The second area number data is the other of the "total number of columns" and the "total number of rows" in "Table 4". The first offset data is one of the offset amounts “xa” and “ya” in “Table 4”. The second offset data is the other of the offset amounts “xa” and “ya” in “Table 4”.

The offset command unit 276 calculates the offset amounts “xb” and “yb” output to the pattern analysis unit 275 using the offset amounts “xa” and “ya” and the coefficient matrix. The following matrix is a formula for calculating the offset amounts “xb” and “yb” from the base region.

Since "nx" and "ny" of "Equation 2" are natural numbers for specifying the positions of a plurality of replication regions divided in a matrix, a set of offset amounts "xb" and "yb" from the base region. Is different in each of the plurality of replication areas.

In step S140 shown in FIG. 4, the offset command unit 276 reads the positional relationship data (see “Table 4”) from the storage unit 160. The offset command unit 276 can grasp the division pattern and the soldering order of the electronic board 900 from the "total number of columns" and "total number of rows" of the positional relationship data (see FIG. 5).

The count value “n” described with reference to FIG. 4 corresponds to the soldering sequence. Therefore, in step S145 described with reference to FIG. 4, the offset command unit 276 can find the replication area to be processed by referring to the count value “n” and the “soldering order” of the positional relationship data. .. That is, with respect to the divided area shown in FIG. 5, if the count value “n” is “1”, the offset command unit 276 recognizes the copy area belonging to the 0th column and the 1st row as the target copy area. be able to. If the count value "n" is "(Nx-3) x Ny", the duplication area belonging to the (Nx-3) column and the (Ny-1) row can be recognized as the target duplication area. .. The offset command unit 276 can determine the set of (nx, ny) based on the column and row to which the replication area to be processed belongs. After determining the set of (nx, ny) corresponding to the replication area to be processed, the offset command unit 276 calculates the set of (xb, yb) based on the matrix of "Equation 2". The set of (xb, yb) is output from the offset command unit 276 to the pattern analysis unit 275.

In step S150 shown in FIG. 4, the pattern analysis unit 275 sets the movement locus of the tip of the soldering iron 115 set in the base region by "xb" in the x-axis direction and "xb" in the y-axis direction. A movement pattern that realizes the movement of the tip along the movement locus drawn by translating only "yb" is determined. In the processing loop consisting of steps S155 to S170, a replication drive signal for the determined movement pattern is generated. The drive unit 180 moves the soldering iron 115 and the installation base 125 in response to the duplication drive signal. As a result, the tip of the soldering iron 115 can move along the movement locus in which the movement locus set on the base region is translated. As a result of executing the processing loop including steps S140 to S180 shown in FIG. 4, soldering to the plurality of duplication regions set on the electronic board 900 is sequentially completed according to the soldering order set by the operator. In step S175, when the count value “n” becomes equal to “Nx × Ny-1”, the soldering to all the duplication regions set on the electronic board 900 is completed, and the processing of the control unit 170 is completed.

FIG. 6 is an exemplary image displayed by the input interface 150 for inputting the input items shown in “Table 4”. The input image displayed by the input interface 150 will be described with reference to FIGS. 1, 5 and 6.

FIG. 6 shows four input windows 151, 152, 153, 154 and one display window 155. The operator can input the "total number of columns" shown in "Table 4" into the input window 151. The operator can input the "total number of rows" shown in "Table 4" into the input window 152. The operator can input the value of the offset amount “xa” shown in “Table 4” into the input window 153. The operator can input the value of the offset amount “ya” shown in “Table 4” into the input window 154.

The display window 155 represents the soldering route and is associated with the soldering sequence shown in “Table 4”. According to the soldering route shown in FIG. 6, soldering is first performed on a plurality of split regions (see FIG. 5) aligned in row "0". The soldering is then performed on the plurality of divided regions aligned in the first "1" row. Soldering is performed row by row, and the row to be soldered is changed backwards. Finally, soldering is performed on a plurality of split regions aligned in the (Ny-1) row.

Since the offset command unit 276 automatically determines the soldering order based on the soldering route, the operator does not need to set the soldering order individually for the plurality of divided regions. Therefore, the soldering order setting is not excessively complicated.

The operator can operate the input interface 150 to change the pattern of the soldering route displayed on the display window 155. That is, a plurality of patterns different from each other are prepared in advance as soldering routes. Since the operator can select the pattern most suitable for the soldering work as the soldering route, appropriate soldering is performed. For example, the operator can select as a soldering route a pattern in which a soldering order suitable for the mounting order of electronic components can be set.

Regarding the above-described embodiment, there are four soldering positions P01 to P04 in the base region 911. However, there may be one soldering position in the base region 911. Therefore, the principle of the above-described embodiment is not limited by how many soldering positions exist in the base region 911.

Regarding the above-described embodiment, the point soldering operation of adhering the point-shaped solder on the electronic substrate 900 is performed at each of the soldering positions P01 to P16. However, the above-mentioned palletizing function can also be applied to the wire soldering operation of adhering the linear solder to the electronic substrate 900. Therefore, the principle of the above-described embodiment is not limited to a specific soldering operation to the electronic substrate 900.

With respect to the above-described embodiment, the soldering device 100 includes an operation unit 130. Since the operator can grasp how the operation unit is operated based on the tactile sensation received from the operation unit 130, the operator moves the soldering iron 115 while looking at the tip of the soldering iron 115. Can be made to. Since the soldering device 100 enables the operator to confirm the position of the tip and to operate the soldering iron 115 at the same time, the operator can efficiently perform the teaching operation. However, the above-mentioned palletizing function can be incorporated into a general soldering apparatus that does not have the operation unit 130. Therefore, the principle of the above-described embodiment is not limited to the specific structure of the soldering apparatus 100.

Regarding the above-described embodiment, the electronic substrate 900 is divided into a matrix. However, the palletizing feature is also available under other split patterns. That is, if the arrangement pattern of the soldering position to be the target of the teaching work and the arrangement pattern same as this arrangement pattern exist at different positions on the electronic board 900, the operator can perform the above-mentioned palletizing function. Can be used to perform teaching work on a smaller number of soldering positions than conventional teaching work. Therefore, the principle of the above-described embodiment is not limited to a specific division pattern virtually set on the electronic substrate 900.

The principle of the above-described embodiment is suitably used in various work sites where solder melting work is performed.

100 ... Soldering device 115 ... Soldering Soldering iron 170 ... Control unit 171 ... Pattern determination unit 172 ... Signal generation unit 180 ...・ ・ Drive unit 190 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Input unit 900 ・ ・ ・ ・ ・ ・ ・ ・ ・・ ・ Electronic board 911 ・ ・ ・ ・ ・ ・ ・ ・ ・ Base area 912-914 ・ ・ ・ ・ ・ ・ ・ ・ ・Duplication area P01 to P16 ... Soldering position

Claims (8)

A plurality of replicas that include a base region having at least one soldering position and an arrangement pattern common to the arrangement pattern of the at least one soldering position in the base region and exist at a position different from the base region. A soldering iron that solders to the surface of an electronic board that includes regions and multiple soldering regions.
The drive unit that moves the soldering iron and
A display window configured to display a plurality of soldering routes indicating the order in which the plurality of soldering areas are to be soldered, and a display window.
Positional relationship data representing the positional relationship between the base region and the plurality of replication region, displayed on said base pattern data and the display window representing at least one of the arrangement pattern of soldering positions of the base region An input unit that accepts the input of the soldering route selected from the plurality of soldering routes , and
In the soldering work, a control unit that controls the drive unit based on the base pattern data and the positional relationship data is provided.
The control unit
(I) Based on the base pattern data, a movement pattern for moving the soldering iron to at least one soldering position in the base region is determined.
(Ii) The driving unit is controlled so that the soldering iron moves in the base region in the determined movement pattern .
(Iii) Based on the input soldering route, the driving unit is controlled so that the soldering iron moves in the plurality of duplication regions in order.
( Iv ) A soldering device that controls the driving unit so that the soldering iron moves in the plurality of duplication regions based on the positional relationship data and the determined movement pattern. The control unit
(I) A pattern determination unit that determines the movement pattern within the base region based on the base pattern data.
(Ii) Based on the base drive signal for operating the drive unit so that the soldering iron moves in the base region according to the determined movement pattern, the positional relationship data, and the determined movement pattern. , A signal generation that generates a replication drive signal that moves the soldering iron to the plurality of replication regions and operates the drive unit so as to move in the plurality of replication regions according to the determined movement pattern. Including part and
The soldering device according to claim 1, wherein the driving unit moves the soldering iron in response to the base driving signal and the duplication driving signal. The positional relationship data includes region number data representing the number of a plurality of regions including the base region and the plurality of replication regions aligned along a predetermined axis from the base region, and adjacent to the plurality of regions. Includes offset data representing the amount of deviation between two matching regions,
The signal generation unit refers to the region number data and the offset data, and the base drive signal and the duplication drive so that the soldering iron moves in each of the plurality of regions according to the determined movement pattern. The soldering apparatus according to claim 2, which generates a signal. The positional relationship data includes the first region number data representing the number of a plurality of first regions including the base region and the plurality of replication regions aligned along a predetermined first axis from the base region, and the plurality of first region data. Includes first offset data representing the amount of deviation between two adjacent regions in the first region of
The signal generation unit refers to the first region number data and the first offset data, and the base so that the soldering iron moves in each of the plurality of first regions according to the determined movement pattern. The soldering apparatus according to claim 2 or 3, which generates a drive signal and the duplicate drive signal. The positional relationship data is the number of second regions representing the number of a plurality of second regions including the base region and the plurality of replication regions aligned along a second axis orthogonal to the first axis from the base region. Includes data and second offset data representing the amount of deviation between two adjacent regions in the plurality of second regions.
The signal generation unit refers to the second region number data and the second offset data, and the base is such that the soldering iron moves in each of the plurality of second regions according to the determined movement pattern. The soldering apparatus according to claim 4, wherein the drive signal and the duplicate drive signal are generated. The input unit represents the amount of movement of the soldering iron when the soldering iron is moved upward from the surface of the electronic substrate after being soldered to at least one soldering position in the base region. Accepts input of movement amount data,
The pattern determination unit determines the movement pattern in which the soldering iron moves upward for each soldering with reference to the movement amount data.
The duplication drive signal generated by the signal generation unit operates the drive unit so as to move in the plurality of duplication regions according to the determined movement pattern, and solders the soldering iron in the plurality of duplication regions. The soldering apparatus according to any one of claims 2 to 5, which is moved upward for each soldering. As coordinate values representing at least one soldering position, the base pattern data is a plurality of coordinate values representing a first soldering position and a second soldering position existing at a position different from the first soldering position. The soldering apparatus according to claim 6, wherein the input unit receives input of a plurality of values different from each other with respect to the first soldering position and the second soldering position as the movement amount data. .. As coordinate values representing at least one soldering position, the base pattern data is a plurality of coordinate values representing a first soldering position and a second soldering position existing at a position different from the first soldering position. The soldering apparatus according to claim 6, wherein the input unit collectively receives input of a common value for the first soldering position and the second soldering position as the movement amount data. ..

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