JP6617481B2 - Light emitting module - Google Patents

Description

  The present invention relates to a light emitting module.

  Conventionally, a light-emitting device using a semiconductor light-emitting element such as an LED (Light Emitting Diode) as a light source, an illumination device including the light-emitting device, and the like are known. For example, Patent Document 1 discloses that a semiconductor layer is crystal-grown using a sapphire substrate on which irregularities are formed in order to increase the light extraction efficiency of an LED.

JP 2012-114277 A

  However, when the sapphire substrate is processed as in the conventional technique, the sapphire substrate is hard and difficult to process, and there is a risk of damaging the crystal growth.

  Although it is conceivable to increase the light extraction efficiency of the LED by using a lens or a reflecting member (reflector), there are problems such as an increase in the number of parts and a complicated structure and an increase in size.

  Therefore, an object of the present invention is to provide a light emitting module that is small and has a simple configuration and high light extraction efficiency.

  In order to achieve the above object, a light emitting module according to an aspect of the present invention includes a substrate, an LED chip provided on the substrate, and a light-transmitting sealing member that covers the LED chip, and the sealing A nano-order uneven pattern having a predetermined shape is provided on the upper surface of the member.

  ADVANTAGE OF THE INVENTION According to this invention, the light emitting module which has high light extraction efficiency with a small and simple structure can be provided.

2 is a schematic plan view of the light emitting module according to Embodiment 1. FIG. 1 is a schematic cross-sectional view of a light emitting module according to Embodiment 1. FIG. 3 is a schematic cross-sectional view of a concavo-convex pattern provided on the upper surface of the sealing member according to Embodiment 1. FIG. 3 is a schematic plan view of a concavo-convex pattern provided on the upper surface of the sealing member according to Embodiment 1. FIG. It is a figure which shows the total luminous flux ratio of the LED chip with respect to the area ratio of the upper surface of the LED chip which concerns on Embodiment 1, and an uneven | corrugated pattern. It is a figure which shows the radiation pattern of the emitted light from the light emitting module in the case where the uneven | corrugated pattern which concerns on Embodiment 1 is provided (Example), and the case where the uneven | corrugated pattern is not provided (comparative example). FIG. 6 is a schematic cross-sectional view of a light emitting module according to Modification 1 of Embodiment 1. FIG. 6 is a schematic cross-sectional view of a light emitting module according to Modification 2 of Embodiment 1. 6 is a schematic plan view of a light emitting module according to Embodiment 2. FIG. 6 is a schematic cross-sectional view of a light emitting module according to Embodiment 2. FIG. FIG. 10 is a schematic cross-sectional view of a light emitting module according to a modification of the second embodiment. 6 is a schematic cross-sectional view of a light emitting module according to Embodiment 3. FIG. FIG. 10 is a schematic cross-sectional view of a light emitting module according to a modification of the third embodiment. 6 is a schematic cross-sectional view of a light emitting module according to Embodiment 4. FIG. FIG. 10 is a schematic cross-sectional view of a light emitting module according to a modification of the fourth embodiment.

  Below, the light emitting module which concerns on embodiment of this invention is demonstrated in detail using drawing. Note that each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangements, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a mimetic diagram and is not necessarily illustrated strictly. Moreover, in each figure, the same code | symbol is attached | subjected about the same structural member. In the following embodiments, expressions such as substantially the same or substantially the same are used. For example, approximately matching not only means that they are completely matched, but also means that they are substantially matched, that is, includes an error of, for example, several percent. The same applies to expressions using other “abbreviations”.

(Embodiment 1)
[Configuration of light emitting module]
First, the structure of the light emitting module according to Embodiment 1 will be described with reference to the drawings.

  FIG. 1 is a schematic plan view showing a light emitting module 1 according to the present embodiment. FIG. 2 is a schematic cross-sectional view of the light emitting module 1 according to the present embodiment. Specifically, FIG. 2 shows a cross section taken along line II-II in FIG.

  As shown in FIGS. 1 and 2, the light emitting module 1 according to the present embodiment includes a substrate 10, an LED chip 20, and a sealing member 30. The light emitting module 1 is an LED module having a so-called COB (Chip On Board) structure in which an LED chip 20 is directly mounted on a substrate 10.

  The substrate 10 is an LED mounting substrate for mounting the LED chip 20. The substrate 10 is an insulating substrate such as a ceramic substrate made of ceramic, a resin substrate made of resin, or a glass substrate. Alternatively, the substrate 10 may be a metal base substrate (metal substrate) in which a metal plate is covered with an insulating film.

  As the substrate 10, a white substrate having a high light reflectance (for example, a light reflectance of 90% or more) may be used. By using the white substrate, the light emitted from the LED chip 20 can be reflected on the surface of the substrate 10, so that the light extraction efficiency can be increased. For example, as the substrate 10, a white ceramic substrate (white alumina substrate) made of alumina can be used.

  The planar view shape of the board | substrate 10 is not specifically limited, For example, it is circular or a rectangle.

  The LED chip 20 is an example of a light emitting element, and is an LED chip provided on the substrate 10. Specifically, as shown in FIG. 2, the LED chip 20 is directly mounted on the substrate 10.

  The LED chip 20 is, for example, a blue LED chip that emits blue light. As the LED chip 20, for example, an LED chip formed of an InGaN-based semiconductor material and having a center wavelength (emission spectrum peak wavelength) of 430 nm or more and 480 nm or less can be used.

  In the present embodiment, as shown in FIG. 1, the LED chip 20 has a substantially rectangular parallelepiped shape with an upper surface 21 being substantially rectangular. The upper surface 21 of the LED chip 20 is a main light emitting surface (light emitting surface), which is a surface opposite to the mounting surface 11 of the substrate 10. That is, the upper surface 21 of the LED chip 20 is a surface located on the upper side when the substrate 10 is placed on a horizontal surface with the mounting surface 11 facing upward. The same applies to the upper surface 31 of the sealing member 30 described later.

  In the present embodiment, as shown in FIG. 2, the upper surface 21 of the LED chip 20 is flat. Specifically, the upper surface 21 of the LED chip 20 is a flat surface parallel to the mounting surface 11 of the substrate 10.

  1 and 2 show an example in which only one LED chip 20 is mounted on the substrate 10, a plurality of LED chips 20 may be mounted on the substrate 10. That is, the light emitting module 1 may include a plurality of LED chips 20, and the sealing member 30 may individually seal the plurality of LED chips 20.

  The sealing member 30 is a translucent sealing member that covers the LED chip 20. Specifically, the sealing member 30 seals the LED chip 20 so that the LED chip 20 is not exposed to the outside.

  The sealing member 30 is formed from, for example, a translucent resin material containing yellow phosphor particles as a wavelength conversion material. As the translucent resin material, for example, a silicone resin is used, but an epoxy resin or a urea resin may be used. As yellow phosphor particles, for example, YAG (yttrium, aluminum, garnet) phosphor particles can be used.

The yellow phosphor particles are excited by blue light emitted from the LED chip 20 to emit yellow light. For this reason, white light is emitted from the sealing member 30 as mixed light of the excited yellow light and the blue light emitted from the LED chip 20. The sealing member 30 may contain a light diffusing agent such as silica (SiO ₂ ). The sealing member 30 also has a function of protecting the LED chip 20 from dust, moisture, external force, and the like.

  Although the shape of the sealing member 30 is not specifically limited, For example, as shown in FIG.1 and FIG.2, it is a truncated pyramid shape. That is, the planar view shape of the sealing member 30 is substantially rectangular.

  In the present embodiment, the upper surface 31 of the sealing member 30 is flat. Specifically, the upper surface 31 of the sealing member 30 is parallel to the mounting surface 11 of the substrate 10 and the upper surface 21 of the LED chip 20.

  On the upper surface 31 of the sealing member 30, a nano-order uneven pattern 40 having a predetermined shape is provided. Specifically, the concave / convex pattern 40 is formed by forming a plurality of concave portions 41 recessed from the flat upper surface 31. In FIG. 2, a portion where the uneven pattern 40 is provided is indicated by a thick solid line. The same applies to other sectional views (FIG. 7 and the like) described later.

  In the present embodiment, the nano-order is included in the range of 1 nm or more and less than 1 μm (1000 nm). For example, at least one of the diameter (width), depth (height), and pitch (interval) of the plurality of recesses 41 included in the uneven pattern 40 is nano-order.

  In the present embodiment, the concavo-convex pattern 40 is provided in a range of a predetermined shape on the top surface 31 of the sealing member 30 (shown by dense dot shading in FIG. 1) in a top view. Specifically, the range of the predetermined shape is a range of substantially the same shape as the upper surface 21 of the LED chip 20. In the present embodiment, since the upper surface 21 of the LED chip 20 is substantially rectangular, the range in which the uneven pattern 40 is provided is also substantially rectangular. For example, when the upper surface 21 is a rectangle of horizontal A and vertical B, if the range in which the uneven pattern 40 is provided is a rectangle of horizontal C and vertical D, A: B = C: D is satisfied.

  Moreover, the range of the predetermined shape in which the uneven pattern 40 is provided is a range that overlaps the entire upper surface 21 of the LED chip 20. In other words, the upper surface 21 of the LED chip 20 is completely covered with the concavo-convex pattern 40 in a top view. For example, as shown in FIG. 1, the center of gravity of the upper surface 21 of the LED chip 20 substantially coincides with the center of gravity of the range in which the uneven pattern 40 is provided.

  The range in which the concave / convex pattern 40 is provided is an area having an area that is 1.7 times or more the area of the upper surface 21 of the LED chip 20. For example, in the example illustrated in FIG. 1, C × D ≧ 1.7 × A × B is satisfied.

  FIG. 3 is a schematic cross-sectional view of the concavo-convex pattern 40 provided on the upper surface 31 of the sealing member 30 according to the present embodiment. FIG. 4 is a schematic plan view of the concavo-convex pattern 40 provided on the upper surface 31 of the sealing member 30 according to the present embodiment. 3 corresponds to a diagram in which a part of the cross section shown in FIG. 2 (a region including a part of the uneven pattern 40) is sufficiently enlarged.

  As shown in FIGS. 3 and 4, the concavo-convex pattern 40 includes a plurality of recesses 41 that are recessed from the upper surface 31 of the sealing member 30. In addition, the uneven | corrugated pattern 40 is formed by the nanoimprint method etc., for example.

  Each of the plurality of recesses 41 has a substantially truncated cone shape in which the opening width becomes narrower toward the bottom. Specifically, each of the plurality of recesses 41 has substantially the same shape. When viewed from above, the opening 41a and the bottom 41b of the recess 41 have a substantially circular shape. The diameter R1 of the opening 41a is, for example, 100 nm or more and 300 nm or less, and the diameter R2 of the bottom 41b is smaller than R1, for example, 90 nm or more and 290 nm or less. The depth H of the recess 41 is, for example, not less than 250 nm and not more than 350 nm.

  As shown in FIG. 4, the plurality of recesses 41 are periodically arranged at a nano-order pitch P. The pitch P is a distance between the centers of the adjacent recesses 41 in the top view, and is, for example, not less than 400 nm and not more than 450 nm. In the present embodiment, the plurality of recesses 41 are arranged such that three adjacent recesses 41 are located at the apexes of an equilateral triangle. That is, with the one concave portion 41 as the center (center of gravity), the six concave portions 41 are arranged at the pitch P distance so as to be located at the apex of the regular hexagon.

  In addition, the uneven | corrugated pattern 40 which concerns on this Embodiment is not restricted to arrangement | positioning of the recessed part 41 shown in FIG. For example, the plurality of recesses 41 may be two-dimensionally arranged in the upper surface 31. For example, the four concave portions 41 may be arranged at the apex of the square at a distance of the pitch P with the single concave portion 41 as the center. That is, the plurality of recesses 41 may be arranged two-dimensionally along two directions orthogonal to each other.

  Further, the shape of the recess 41 is not particularly limited. For example, the concave portion 41 may have a substantially cylindrical shape or a substantially prismatic shape. Alternatively, the recess 41 may have a pyramid or conical shape. Alternatively, the recess 41 may be a recess having a line shape or a lattice shape in plan view. Each of the plurality of recesses 41 may have the same shape and size, or may be different.

[Effects, etc.]
As described above, the light emitting module 1 according to the present embodiment includes the substrate 10, the LED chip 20 provided on the substrate 10, and the translucent sealing member 30 that covers the LED chip 20. On the upper surface 31 of the member 30, a nano-order uneven pattern 40 having a predetermined shape is provided.

  Thus, by providing the nano-order uneven pattern 40 on the upper surface 31 of the sealing member 30, the uneven pattern 40 causes a diffraction phenomenon. Thereby, light distribution becomes narrow and light extraction efficiency is improved. Moreover, the uneven | corrugated pattern 40 is formed in the upper surface 31 of the sealing member 30 provided for the purpose of protection of the LED chip 20, wavelength conversion, etc. That is, since the concave / convex pattern 40 can be provided without increasing the number of components, the light extraction efficiency can be increased with a small and simple configuration.

  For example, the concave / convex pattern 40 includes a plurality of concave portions 41 that are recessed from the upper surface 31 of the sealing member 30, and the plurality of concave portions 41 are periodically arranged at a nano-order pitch.

  As described above, since the plurality of concave portions 41 are periodically arranged, a diffraction phenomenon due to the concave / convex pattern 40 easily occurs. Therefore, the light extraction efficiency can be further increased.

  Further, for example, the concave / convex pattern 40 is in a range having substantially the same shape as the upper surface 21 of the LED chip 20 in a top view, and in a range that overlaps the entire upper surface 21 of the LED chip 20, and on the upper surface 21 of the LED chip 20. It is provided in an area range of 1.7 times or more of the area.

  FIG. 5 is a diagram showing the total luminous flux ratio of the LED chip 20 with respect to the area ratio between the upper surface 21 of the LED chip 20 and the uneven pattern 40 according to the present embodiment.

  In FIG. 5, the horizontal axis indicates the ratio of the area of the range in which the uneven pattern 40 is provided to the area of the upper surface 21. The vertical axis represents the ratio of the emitted light to the luminous flux when the area of the upper surface 21 is equal to the area of the range where the uneven pattern 40 is provided. The luminous flux of the emitted light indicates the amount of light emitted through the sealing member 30.

  As shown in FIG. 5, the luminous flux ratio is 1 or more in the range where the area ratio is 1.7 or more, that is, the light extraction efficiency is enhanced. Specifically, it can be seen that as the area ratio increases, the luminous flux ratio increases and the light extraction efficiency increases.

  FIG. 6 shows radiation patterns of emitted light from the light emitting module 1 when the uneven pattern 40 according to this embodiment is provided (Example) and when the uneven pattern 40 is not provided (Comparative Example). FIG.

  In FIG. 6, the radiation pattern of the emitted light from the light emitting module 1 when the uneven pattern 40 is not provided is indicated by a thick broken line as a comparative example. As shown in FIG. 1 and FIG. 2, the radiation pattern of the emitted light from the light emitting module 1 when the concave / convex pattern 40 is provided is shown by a thick solid line as an example. The area ratio in the example is 10.

  In FIG. 6, the vertical axis indicates the luminous flux in the direction along the optical axis of the LED chip 20, and specifically shows the normal luminous flux passing through the center of gravity of the upper surface of the LED chip 20. The position where the light emitting module 1 is arranged corresponds to the position of the scale “0”.

  As shown in FIG. 6, in the direction along the optical axis (on the vertical axis), it can be seen that approximately 1.2 times as much light flux as that obtained when the uneven pattern 40 is not provided is obtained. In other words, it can be seen that the provision of the concave / convex pattern 40 increases the light extraction efficiency particularly in the direction along the optical axis. Moreover, in the Example, it turns out that the light beam to the side is falling slightly compared with the comparative example, and is distributed in the direction along an optical axis.

  Thus, according to the light emitting module 1 which concerns on this Embodiment, light distribution can be narrowed and light extraction efficiency can be improved. For this reason, for example, even when a light-emitting device in which a condensing lens or a light guide rod is provided on the light emission side, an increase in size of the light-emitting device can be suppressed.

  For example, the upper surface 31 of the sealing member 30 and the upper surface 21 of the LED chip 20 are flat.

  Thereby, since the upper surface 31 is flat, the uneven | corrugated pattern 40 can be formed easily. For example, a nanoimprint method or the like can be used.

  For example, each of the plurality of recesses 41 has a substantially truncated cone shape in which the opening width becomes narrower toward the bottom 41b.

  Thus, since the shape of the plurality of recesses 41 is substantially the same in the shape of a truncated cone, the diffraction phenomenon due to the uneven pattern 40 is likely to occur. Therefore, the light extraction efficiency can be further increased.

[Modification 1]
Here, the light emitting module 1a according to the first modification of the present embodiment will be described with reference to the drawings.

  FIG. 7 is a schematic cross-sectional view of a light emitting module 1a according to this modification. The cross section shown in FIG. 7 corresponds to the cross section taken along the line II-II of FIG.

  As shown in FIG. 7, the light emitting module 1a according to the present modification is different from the light emitting module 1 according to the present embodiment in that a concave / convex pattern 40a is provided instead of the concave / convex pattern 40. . Below, it demonstrates focusing on a different point from Embodiment 1. FIG.

  As shown in FIG. 7, the uneven pattern 40 a is provided on the entire upper surface 31 of the sealing member 30. The specific shape of the concavo-convex pattern 40 a is the same as that of the concavo-convex pattern 40.

  Thereby, since it is not necessary to align the concave / convex pattern 40a and the LED chip 20 in a top view, the concave / convex pattern 40a can be easily formed. Further, since the uneven pattern 40 a is formed on the entire upper surface 31, the area of the uneven pattern 40 can be made sufficiently larger than the area of the upper surface 21 of the LED chip 20. Therefore, the light extraction efficiency can be increased.

[Modification 2]
Next, the light emitting module 1b according to the second modification of the present embodiment will be described with reference to the drawings.

  FIG. 8 is a schematic cross-sectional view of a light emitting module 1b according to this modification. The cross section shown in FIG. 8 corresponds to the cross section taken along the line II-II in FIG.

  As shown in FIG. 8, the light emitting module 1 b according to the present modification is different from the light emitting module 1 a according to the first modification in that a sealing member 30 b is provided instead of the sealing member 30. Below, it demonstrates centering on a different point from the modification 1. FIG.

  The sealing member 30 b includes a translucent adhesive layer 32 that covers the LED chip 20 and a translucent sheet 33 laminated on the adhesive layer 32. An uneven pattern 40 a is provided on the upper surface of the sheet 33.

  The adhesive layer 32 seals the LED chip 20 so that the LED chip 20 is not exposed to the outside. Similar to the sealing member 30 according to the first embodiment, the adhesive layer 32 is formed of, for example, a translucent resin material containing yellow phosphor particles.

  The sheet 33 is formed from a light-transmitting resin material such as silicone resin, for example. The refractive index of the adhesive layer 32 and the refractive index of the sheet 33 may be the same or different. When the refractive index of the sheet 33 is equal to or higher than the refractive index of the adhesive layer 32, total reflection at the interface between the adhesive layer 32 and the sheet 33 can be suppressed.

  As described above, for example, the sealing member 30 b includes the light-transmitting adhesive layer 32 that covers the LED chip 20, and the light-transmitting sheet 33 that is laminated on the adhesive layer 32 and has the uneven pattern 40 provided on the upper surface. Is provided.

  As described above, the sealing member 30 b is formed of two members, that is, the adhesive layer 32 and the sheet 33. For this reason, for example, after the LED chip 20 is sealed with a translucent resin material, the sheet 33 provided with the uneven pattern 40 is placed on the translucent resin material, and then the translucent resin material is cured. Thereby, the sealing member 30b is formed. That is, the concave / convex pattern 40a can be formed separately from the substrate 10 on which the LED chip 20 is provided.

  For this reason, since it is not necessary to consider the influence which it has on LED chip 20 at the time of formation of concavo-convex pattern 40a, concavo-convex pattern 40a can be formed more accurately. Therefore, the light extraction efficiency can be increased.

(Embodiment 2)
[Configuration of light emitting module]
Below, the light emitting module which concerns on Embodiment 2 is demonstrated using drawing.

  FIG. 9 is a schematic plan view of the light emitting module 100 according to the present embodiment. FIG. 10 is a schematic cross-sectional view of the light emitting module 100 according to the present embodiment. FIG. 10 shows a cross section taken along line XX of FIG.

  As shown in FIGS. 9 and 10, the light emitting module 100 according to the present embodiment includes a plurality of LED chips 20. The light emitting module 100 is different from the light emitting module 1 according to Embodiment 1 in that a sealing member 130 is provided instead of the sealing member 30. Below, it demonstrates focusing on a different point from Embodiment 1. FIG.

  The plurality of LED chips 20 are mounted on the mounting surface 11 of the substrate 10. In the present embodiment, the plurality of LED chips 20 are two-dimensionally arranged in a first range having a predetermined shape in a top view. Specifically, the first range is a minimum range in which all of the plurality of LED chips 20 are included.

  In the example shown in FIG. 9, nine LED chips 20 are mounted on the mounting surface 11 of the substrate 10. Specifically, the nine LED chips 20 are arranged at regular intervals (for example, distance d) in a matrix of 3 rows and 3 columns.

  At this time, the first range is a rectangular range of horizontal X and vertical Y as shown in FIG. The horizontal X is the total (= 3A + 2d) of the horizontal lengths of the three LED chips 20 and the two intervals between the LED chips 20. The vertical Y is the total (= 3B × 2d) of the vertical length of the three LED chips 20 and the distance between the two LED chips 20.

  The sealing member 130 collectively seals the plurality of LED chips 20. The shape, material, function, and the like of the sealing member 130 are the same as those of the sealing member 30 according to the first embodiment.

  On the upper surface 131 of the sealing member 130, a nano-order uneven pattern 140 having a predetermined shape is provided. The shape of the uneven pattern 140 is the same as that of the uneven pattern 40 according to the first embodiment.

  The concave / convex pattern 140 is provided in a second range of a predetermined shape on the upper surface 131 of the sealing member 130 when viewed from above. Specifically, the second range is a range having the same shape as the first range. In the present embodiment, since the first range is substantially rectangular, the second range is also substantially rectangular. For example, when the first range is a rectangle of horizontal X and vertical Y, and the second range is a rectangle of horizontal Z and vertical W, X: Y = Z: W is satisfied.

  The second range is a range that overlaps the entire first range. In other words, the upper surfaces 21 of the plurality of LED chips 20 are completely covered with the concavo-convex pattern 140 in a top view. For example, as shown in FIG. 1, the center of gravity of the first range and the center of gravity of the second range substantially match.

  Further, the second range is a range of an area that is 1.7 times or more the area of the first range. For example, in the example illustrated in FIG. 9, Z × W ≧ 1.7 × X × Y is satisfied.

[Effects, etc.]
As described above, the light emitting module 100 according to the present embodiment includes a plurality of LED chips 20, and the sealing member 130 collectively seals the plurality of LED chips 20.

  Thus, since the light emitting module 100 includes the plurality of LED chips 20, the luminous flux can be increased. Moreover, since the sealing member 130 collectively seals the plurality of LED chips 20, it is possible to reduce the feeling of light collapse. Further, since the concave / convex pattern 140 is provided on the upper surface 131 of the sealing member 130 that is collectively sealed, the light extraction efficiency can be increased as in the first embodiment.

  Further, for example, the plurality of LED chips 20 are two-dimensionally arranged in a first range having a predetermined shape in a top view, and the uneven pattern 140 is a second range having the same shape as the first range in the top view. The second range is an area that overlaps the entire first range and has an area that is 1.7 times or more the area of the first range.

  Thereby, the light extraction efficiency can be increased as in the first embodiment.

[Modification]
Here, a light emitting module 100a according to a modification of the present embodiment will be described with reference to the drawings.

  FIG. 11 is a schematic cross-sectional view of a light emitting module 100a according to this modification. The cross section shown in FIG. 11 corresponds to the cross section taken along the line XX of FIG.

  As shown in FIG. 11, the light emitting module 100 a according to the present modification is different from the light emitting module 100 according to the present embodiment in that a sealing member 130 a is provided instead of the sealing member 130. Below, it demonstrates centering on a different point from Embodiment 2. FIG.

  The sealing member 130 a includes a translucent adhesive layer 132 that covers the plurality of LED chips 20, and a translucent sheet 133 laminated on the adhesive layer 132. An uneven pattern 140 is provided on the upper surface of the sheet 133.

  The adhesive layer 132 collectively seals the plurality of LED chips 20 so that the plurality of LED chips 20 are not exposed to the outside. For example, the adhesive layer 132 is formed of a translucent resin material containing yellow phosphor particles.

  The sheet 133 is formed from a translucent resin material such as silicone resin, for example. The sheet 133 is different from the sheet 33 according to the second modification of the first embodiment in that the uneven pattern 140 is provided on the upper surface 131 instead of the uneven pattern 40a, and the other points are the same.

  Thus, according to the light emitting module 100a according to the present modification, the sealing member 130a is formed of the two members of the adhesive layer 132 and the sheet 133. For this reason, similarly to the second modification of the first embodiment, it is not necessary to consider the influence on the plurality of LED chips 20, so that the uneven pattern 140 can be formed with higher accuracy. Therefore, the light extraction efficiency can be increased.

(Embodiment 3)
[Configuration of light emitting module]
Below, the light emitting module which concerns on Embodiment 3 is demonstrated using drawing.

  FIG. 12 is a schematic cross-sectional view of the light emitting module 200 according to the present embodiment. The cross section shown in FIG. 12 corresponds to the cross section taken along the line II-II in FIG.

  As shown in FIG. 12, the light emitting module 200 according to the present embodiment includes a sealing member 230 instead of the sealing member 30 as compared with the light emitting module 1 according to the first embodiment. The light emitting module 200 further includes a lens 250.

  The shape of the sealing member 230 is different from that of the sealing member 30. Specifically, the upper surface of the sealing member 230 includes an inclined surface 231 and a flat surface 232.

  The inclined surface 231 is inclined with respect to the upper surface of the LED chip 20. In the present embodiment, the inclined surface 231 is annularly provided along the circumference of the flat surface 232 and is inclined downward from the outer periphery toward the center. Specifically, the inclined surface 231 is disposed so that the normal line intersects the optical axis of the LED chip 20 on the light emitting side of the LED chip 20.

  The inclination angle of the inclined surface 231 is not particularly limited, but is, for example, 20 degrees or more and 30 degrees or less. The inclination angle of the inclined surface 231 is constant, for example. Alternatively, the inclination angle of the inclined surface 231 may gradually change so as to increase from the center toward the outer periphery. That is, the inclined surface 231 may be a curved surface in which the inclination is gentler as it is closer to the plane 232 and becomes steeper as it is farther from the plane 232.

  The plane 232 is a plane parallel to the upper surface of the LED chip 20. The flat surface 232 is provided at the center of the upper surface of the sealing member 230.

  Thus, the upper surface of the sealing member 230 is formed in a mortar shape. Specifically, the inclined surface 231 and the flat surface 232 of the sealing member 230 correspond to the side surface and the bottom surface of a substantially inverted truncated cone shape, respectively.

  In the present embodiment, the concave / convex pattern 40 is provided on the inclined surface 231 and the flat surface 232. The detailed shape of the concavo-convex pattern 40 is the same as that of the first embodiment.

  The inclined surface 231 and the flat surface 232 may be smoothly connected. That is, the inclination angle may gradually change at the connection portion between the inclined surface 231 and the flat surface 232.

  The lens 250 is an optical element that controls the light distribution of the light emitted from the LED chip 20. Specifically, the lens 250 transmits the light emitted from the LED chip 20 and emits it in a predetermined direction.

  The lens 250 is disposed at a position that intersects the optical axis of the LED chip 20. Specifically, the lens 250 is arranged such that the center of gravity thereof passes through the optical axis of the LED chip 20 in a top view.

  The lens 250 is made of a resin material such as acrylic (PMMA) or polycarbonate (PC).

[Effects, etc.]
As described above, in the light emitting module 200 according to the present embodiment, the upper surface of the sealing member 230 includes the inclined surface 231 that is inclined with respect to the upper surface 21 of the LED chip 20, and the uneven pattern 40 is formed on the inclined surface 231. Is provided.

  Thus, since the upper surface of the sealing member 230 includes the inclined surface 231, the light emission direction can be changed according to the inclination angle of the inclined surface 231. In addition, since the concave / convex pattern 40 is provided on the inclined surface 231, the extraction efficiency of light emitted from the inclined surface 231 can be increased.

  Further, for example, the upper surface of the sealing member 230 further includes a flat surface 232 parallel to the upper surface 21 of the LED chip 20 in the central portion, and the inclined surface 231 is provided in an annular shape along the circumference of the flat surface 232. It inclines downward from the outer periphery toward the center.

  Thus, on the light emitting side of the LED chip 20, the inclined surface 231 is inclined so that the normal line direction faces the center. For this reason, the light emitted from the inclined surface 231 among the light emitted from the LED chip 20 proceeds toward the central direction. For this reason, the incident efficiency to the lens 250 can be improved.

  Since the light emitted from the inclined surface 231 is emitted so as to approach the optical axis of the LED chip 20, the incident area to the lens 250 is reduced. Therefore, since the lens 250 can be made small, the light emitting module 200 can be reduced in size.

[Modification]
Here, a light emitting module 200a according to a modification of the present embodiment will be described with reference to the drawings.

  FIG. 13 is a schematic cross-sectional view of a light emitting module 200a according to this modification. The cross section shown in FIG. 13 corresponds to the cross section taken along the line II-II in FIG.

  As shown in FIG. 13, the light emitting module 200 a according to the present modification is different from the light emitting module 200 according to the present embodiment in that a sealing member 230 a is provided instead of the sealing member 230. Below, it demonstrates focusing on a different point from Embodiment 3. FIG.

  The sealing member 230 a includes a translucent adhesive layer 32 that covers the LED chip 20 and a translucent sheet 234 laminated on the adhesive layer 32. An uneven pattern 40 is provided on the upper surface of the sheet 234. The adhesive layer 32 is the same as that of the second modification of the first embodiment.

  The sheet 234 is formed from a light-transmitting resin material such as silicone resin, for example. As shown in FIG. 13, the upper surface of the sheet 234 includes an inclined surface 231 and a flat surface 232.

  As described above, the sealing member 230 a is formed of two members, that is, the adhesive layer 32 and the sheet 234. For this reason, the concave / convex pattern 40 can be formed separately from the substrate 10 on which the LED chip 20 is provided.

  For example, the sheet 234 having the inclined surface 231 can be formed by injection molding using a mold and a translucent resin material. Thereby, for example, the sheet 234 having the inclined surface 231 having a desired inclination angle can be easily formed. Therefore, the accuracy of the concavo-convex pattern 40 can be increased, and the light extraction efficiency can be increased.

(Embodiment 4)
[Configuration of light emitting module]
Below, the light emitting module which concerns on Embodiment 4 is demonstrated using drawing.

  FIG. 14 is a schematic cross-sectional view of the light emitting module 300 according to the present embodiment. The cross section shown in FIG. 14 corresponds to the cross section taken along line XX of FIG.

  As shown in FIG. 14, the light emitting module 300 according to the present embodiment includes a plurality of LED chips 20. The light emitting module 300 is different from the light emitting module 200 according to Embodiment 3 in that a sealing member 330 is provided instead of the sealing member 230. Below, it demonstrates focusing on a different point from Embodiment 3. FIG.

  The plurality of LED chips 20 are mounted on the mounting surface 11 of the substrate 10. The arrangement of the plurality of LED chips 20 is, for example, the same as the arrangement of the plurality of LED chips 20 shown in FIG.

  The sealing member 330 seals the plurality of LED chips 20 individually. The material and function of the sealing member 330 are the same as those of the sealing member 230.

  The sealing member 330 includes a peripheral part 331a and a central part 332a. Each of the peripheral part 331a and the central part 332a seals the LED chip 20 one by one. Specifically, the peripheral portion 331a seals the LED chip 20 disposed at a position away from the center (center of gravity) of the plurality of LED chips 20 in plan view. The center part 332a seals the LED chip 20 arranged at a position close to the center (center of gravity) of the plurality of LED chips 20 in plan view.

  The upper surface of the peripheral portion 331a is an inclined surface 331. The inclined surface 331 is inclined with respect to the upper surface of the LED chip 20. In the present embodiment, the inclined surface 331 is inclined downward from the outer periphery toward the center. Specifically, the inclined surface 331 is disposed such that the normal line extends upward from the central portion 332a. An uneven pattern 40 is provided on the inclined surface 331.

  The inclination angle of the inclined surface 331 is not particularly limited, but is, for example, 20 degrees or more and 30 degrees or less. The inclination angle of the inclined surface 331 is, for example, constant. Alternatively, the inclination angle of the inclined surface 331 may gradually change so as to increase from the center toward the outer periphery. In other words, the inclined surface 331 may be a curved surface that has a gentler inclination as it is closer to the central part 332a and a sharper inclination as it is farther from the central part 332a.

  The upper surface of the central portion 332 a is a flat surface 332. The plane 332 is a plane parallel to the upper surface of the LED chip 20. An uneven pattern 40 is provided on the plane 332.

  As described above, the sealing member 330 is divided according to each of the plurality of LED chips 20, but as a whole, the sealing member 330 has a substantially truncated cone shape with a mortar-shaped upper surface.

[Effects, etc.]
As described above, the light emitting module 300 according to the present embodiment includes a plurality of LED chips 20, and the sealing member 330 individually seals the plurality of LED chips 20.

  Thus, even when the sealing member 330 individually seals the plurality of LED chips 20, for example, by tilting the upper surface of the peripheral portion 331 a located above the peripheral LED chip 20, it is directed toward the center. Light can be emitted. For this reason, the incident efficiency of the light to the lens 250 can be improved.

  Since the emitted light from the peripheral part 331a is emitted so as to approach the optical axis of the LED chip 20 in the central part 332a, the incident area to the lens 250 becomes small. Therefore, since the lens 250 can be reduced in size, the light emitting module 300 can be reduced in size.

[Modification]
Here, a light emitting module 300a according to a modification of the present embodiment will be described with reference to the drawings.

  FIG. 15 is a schematic cross-sectional view of a light emitting module 300a according to this modification. As shown in FIG. 15, the light emitting module 300a according to the present modification is different from the light emitting module 300 according to the present embodiment in that a sealing member 330a is provided instead of the sealing member 330. . Below, it demonstrates focusing on a different point from Embodiment 4. FIG.

  The sealing member 330a collectively seals the plurality of LED chips 20. The material and function of the sealing member 330a are the same as those of the sealing member 330 according to the fourth embodiment.

  The sealing member 330a is different from the sealing member 330 according to Embodiment 4 in that the sealing member 330a is integrally formed without being divided individually. Specifically, the upper surface of the sealing member 330 includes an inclined surface 331 and a flat surface 332, and the flat surface 332 and the inclined surface 331 are continuous. The uneven pattern 140 is also formed in one continuous range across the flat surface 332 and the inclined surface 331.

  Thus, since the light emitting module 300 according to this modification includes the plurality of LED chips 20, the luminous flux can be increased. Moreover, since the sealing member 330a collectively seals the plurality of LED chips 20, a feeling of light collapse can be reduced. Furthermore, since the concave / convex pattern 140 is provided on the upper surface of the collectively sealed sealing member 330a, the light extraction efficiency can be increased as in the first embodiment.

(Other)
Although the light emitting module according to the present invention has been described based on the above embodiment and its modifications, the present invention is not limited to the above embodiment.

  For example, in the above-described embodiment, an example in which the concave / convex pattern 40 includes a plurality of concave portions 41 that are recessed from the upper surface of the sealing member 30 is shown, but the present invention is not limited thereto. The uneven pattern 40 may include a plurality of protrusions protruding from the upper surface of the sealing member 30. At this time, in the above embodiment, the height from the mounting surface 11 of the tips of the plurality of convex portions may be substantially constant in the portion where the upper surface of the sealing member is flat.

  For example, in the present embodiment, an example in which the LED chip 20 is directly mounted on the substrate 10 has been described, but the present invention is not limited thereto. The LED chip 20 may be provided on the substrate 10 via a package. That is, the light emitting module according to the present embodiment may be an SMD (Surface Mounted Device) type light source module. In this case, the LED chip 20 is provided in the recess of the package, and the sealing member 30 is provided so as to fill the recess. An uneven pattern 40 may be formed on the upper surface of the sealing member 30 filling the recess.

  Note that the light-emitting module according to this embodiment can be used as a light source for various lighting fixtures and lighting devices. For example, it can be used for lighting fixtures such as a bulb-type LED lamp, a straight tube LED lamp, a downlight, a spotlight, a ceiling light, and a stand type light.

  In addition, it is realized by arbitrarily combining the components and functions in each embodiment without departing from the scope of the present invention, or forms obtained by subjecting each embodiment to various modifications conceived by those skilled in the art. Forms are also included in the present invention.

1, 1a, 1b, 100, 100a, 200, 200a, 300, 300a Light emitting module 10 Substrate 20 LED chip 21 Upper surface 30, 30b, 130, 130a, 230, 230a, 330, 330a Sealing member 31, 131 Upper surface 32, 132 Adhesive layers 33, 133, 234 Sheets 40, 40a, 140 Uneven pattern 41 Recesses 231, 331 Inclined surfaces 232, 332 Plane

Claims (10)

A substrate,
An LED (Light Emitting Diode) chip provided on the substrate;
A translucent sealing member covering the LED chip,
On the upper surface of the sealing member, a nano-order uneven pattern of a predetermined shape is provided,
The concavo-convex pattern includes a plurality of recesses recessed from the upper surface of the sealing member,
The plurality of recesses are periodically arranged at a pitch of 400 nm or more and 450 nm or less ,
Each of the plurality of recesses has a substantially truncated cone shape in which the opening width becomes narrower from the opening toward the bottom,
The diameter of the opening is 100 nm or more and 300 nm or less,
The diameter of the bottom is 90 nm or more and 290 nm or less,
The depth of the recess is 250 nm or more and 350 nm or less. The concavo-convex pattern is a range having substantially the same shape as the top surface of the LED chip in a top view, a range that overlaps with the entire top surface of the LED chip, and at least 1.7 times the area of the top surface of the LED chip. The light emitting module according to claim 1, wherein the light emitting module is provided in a range of an area of. The light emitting module according to claim 1, wherein an upper surface of the sealing member and an upper surface of the LED chip are flat. The upper surface of the sealing member includes an inclined surface inclined with respect to the upper surface of the LED chip,
The light emitting module according to claim 1, wherein the uneven pattern is provided on the inclined surface. The upper surface of the sealing member further includes a plane parallel to the upper surface of the LED chip in the central portion,
The light emitting module according to claim 4, wherein the inclined surface is provided in an annular shape along the periphery of the plane, and is inclined downward from the outer periphery toward the center. The light emitting module includes a plurality of the LED chips,
The light emitting module according to claim 1, wherein the sealing member individually seals the plurality of LED chips. The light emitting module includes a plurality of the LED chips,
The light emitting module according to claim 1, wherein the sealing member collectively seals the plurality of LED chips. The plurality of LED chips are two-dimensionally arranged in a first range of a predetermined shape in a top view,
The concavo-convex pattern is a second range having the same shape as the first range in a top view, a range that overlaps the entire first range, and an area that is 1.7 times or more the area of the first range. The light emitting module according to claim 7, wherein the light emitting module is provided in the second range. The sealing member is
A translucent adhesive layer covering the LED chip;
The light emitting module of any one of Claims 1-8 provided with the translucent sheet | seat laminated | stacked on the said contact bonding layer, and the said uneven | corrugated pattern was provided in the upper surface.   Each of the plurality of recesses is located at each vertex of a plurality of equilateral triangles arranged in a plane.
  The light emitting module of any one of Claims 1-9.

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