JP6609448B2 - Sample transport device - Google Patents

Description

  The present invention relates to a sample transport device, and more particularly to a sample transport mechanism for transporting a sample in a state where the sample is gripped by a sample gripping mechanism in an air cleaning space provided with a fan filter unit.

  In semiconductor factories, semiconductor wafers are housed in dedicated storage boxes in order to prevent foreign matter from adhering to the semiconductor substrate. After the storage box is installed in a manufacturing apparatus, an inspection apparatus or the like, the storage box is opened by a substrate storage box opening / closing device provided in the manufacturing apparatus or the like, and the stored semiconductor wafer is taken out by a transfer robot. The transfer robot is a mechanism for transferring a semiconductor wafer toward the processing chamber of the semiconductor wafer in the air cleaning space. The transfer robot takes out the substrate with a handling arm and delivers the substrate to the semiconductor device.

  An apparatus for manufacturing, measuring, inspecting, or the like of a semiconductor processes a substrate transported by a transport robot mounted on a locally cleaned transport apparatus. After the processing is completed, the substrate is returned to the substrate storage box by the transfer robot of the local cleaning transfer device, and proceeds to the next step. Thus, in order to prevent a foreign material from adhering to the semiconductor substrate, it is automated.

  The transfer robot installed in the local clean transfer device needs to grip the substrate so that no foreign matter adheres to the substrate when transferring the substrate. The method of vacuum-adsorbing the back side of the substrate or the edge, side or edge of the substrate ( Edge) or the like. Patent Documents 1 and 2 disclose a transfer robot having a suction hole for sucking the back surface of a sample.

JP 2014-036175 A JP 2013-069914 A

  When a semiconductor wafer is transported using a handling arm, the two are in physical contact with each other, and foreign matter may be generated from the contact portion. Furthermore, if the semiconductor wafer is transported more than once, the foreign matter may accumulate on the sample support part of the handling arm, causing the deposit to adhere to the semiconductor wafer and to reduce the cleanliness of the air cleaning space. There is. Patent Documents 1 and 2 do not discuss how to deal with foreign matters generated when the handling arm contacts the sample.

  In the following, a sample transport mechanism having a hand for holding a sample, which is intended to remove foreign matter generated by holding the sample, is proposed.

  As one aspect for achieving the above object, a sample transport apparatus comprising a handling arm for supporting a substrate and a transport apparatus for transporting the handling arm, wherein the handling arm is at a position different from a contact portion of the substrate. A sample transport device including at least one of a suction port for sucking gas and a discharge port for discharging gas is proposed.

  Further, as another aspect for achieving the above object, a sample transfer device including a handling arm that supports a substrate and a transfer device that transfers the handling arm, an opening provided in the handling arm, A gas suction / release mechanism for sucking or releasing gas from the opening and a control device for controlling the gas suction / release mechanism are provided, and the control device discharges the gas from the opening after the sample is conveyed by the handling arm. A sample transport device for controlling the gas suction / release mechanism so as to perform suction or discharge is proposed.

  Since it has a suction port for sucking gas or a discharge port for releasing gas at a position different from the substrate contact part of the handling arm, foreign substances generated in the vicinity of the substrate contact part can be removed. It becomes possible to suppress adhesion of foreign matters to the substrate and a decrease in cleanliness of the air cleaning space.

  Further, by sucking and releasing the gas after transporting the substrate, it is possible to remove the foreign matter adhering to the handling arm without adhering the foreign matter generated by supporting the substrate on the substrate.

The figure which shows the outline | summary of a sample conveyance apparatus. The figure explaining operation | movement of a board | substrate conveyance robot. The figure of the handling arm of the system which grasps the end of the board, the side, and the edge (edge). The figure of the handling arm of the system which grasps the end of the board, the side, and the edge (edge). The figure which shows an example of the handling arm provided with the foreign material adsorption opening. The figure which shows an example of the handling arm provided with the foreign material adsorption opening. The figure which shows an example of the handling arm provided with the foreign material adsorption opening. The figure which shows an example of the handling arm provided with the foreign material adsorption opening. The flowchart which shows the foreign material suction process including the judgment process of the timing which attracts the foreign material deposited on the handling arm board | substrate contact part. The flowchart which shows the foreign material removal process including the judgment process of the timing which wipes off the foreign material accumulated on the handling arm board | substrate contact part.

  Hereinafter, an outline of a sample transport apparatus (local cleaning transport apparatus) provided with a handling arm will be described with reference to FIG. The transfer robot 103 mounted on the local cleaning transfer apparatus 101 transfers the sample (substrate) in the space pressurized by the fan filter unit 102. More specifically, the clean air from the fan filter unit 102 installed on the upper part of the local cleaning and conveying apparatus 101 increases the internal pressure in the apparatus, thereby blocking the intrusion of air from the outside, thereby obtaining a clean space. Holding. Moreover, the clean air supplied by the fan filter unit 102 is exhausted by the exhaust port 104 installed on the lower surface of the local cleaning and conveying apparatus 101, and a downflow is formed. The transfer robot 103 includes a drive mechanism (transfer device) for operating the handling arm, and transfers the substrate in the clean space as described above.

  As shown in FIG. 2, the transfer robot 103 includes substrate storage box opening / closing devices 204, 205, and 206 that open and close a substrate storage box in which substrates are stored. The transfer robot 103 is configured to be able to move to the transfer robot standby positions 201, 202, and 203, and the substrate can be taken into and out of the substrate storage box at each position. The taken-out substrate 208 is transferred to a semiconductor manufacturing apparatus or an inspection apparatus.

  When the transfer robot 103 mounted on the local cleaning apparatus 101 takes out the substrate 208 from the substrate storage box, it is necessary to grip the substrate 208. Therefore, the back surface of the substrate 208, the edge of the substrate, the side surface, and the edge. Etc., and carry it. When the transfer robot 103 grips the substrate, a handling arm 207 mounted on the transfer robot comes into contact with the substrate, so that foreign matter may be generated.

  There are cases where the back surface of the substrate is vacuum-sucked by the handling arm 207 and there are cases where it is transported by just supporting it. Further, even in the case of support only, foreign matter may be generated on the contact surface.

  In order to reduce foreign matter, as illustrated in FIGS. 3 and 4, there is a method of carrying by the handling arms 301 and 401 that grip the edge, side surface, edge, or the like of the substrate 208. However, foreign matter may be generated in the contact portions 302, 303, 304, 402, and 403 with the substrate 208. The generated foreign matter adheres to the substrate 208 or accumulates on the contact portions 302, 303, 304, 402, and 403. The accumulated foreign matter adheres to the substrate 208 while repeating the operation of gripping the substrate 208, which causes substrate contamination.

  The embodiment described below relates to a sample transport apparatus capable of suppressing foreign matter generated when a substrate is gripped by a handling arm of a transport robot.

  In this embodiment, a sample transport mechanism provided with a foreign substance suction port is mainly provided in the contact portion of the handling arms 301 and 401 for gripping the end, side surface, and edge (edge) of the substrate 208 and in the vicinity of the contact portion. explain. By providing the foreign matter suction port, fine foreign matter generated by the contact between the substrate and the handling arm can be sucked and discharged to the outside of the apparatus. As a result, it is possible to prevent the fine foreign matter generated from the contact portion between the substrate and the handling arm from contaminating the substrate.

  According to the above configuration, the foreign matter generated on the contact surfaces 302, 303, 304, 402, and 403 with the substrate 208 is in contact with the handling arms 301 and 401 that grip the edge, side surface, and edge (edge) of the substrate 208. It is possible to prevent the substrate from being contaminated with foreign substances because it does not accumulate on the surface.

  Next, an outline of a handling arm having a foreign matter suction port will be described with reference to FIG. As described above, the local cleaning and transporting apparatus 101 has the fan filter unit 102 that blows clean air at the top, is blown from the fan filter unit 102, and is exhausted from the exhaust port 104 provided on the lower surface of the local cleaning apparatus 101. As a result, a down flow is formed, and the substrate 208 is transferred by the transfer robot 103 in a state where the inside of the apparatus is kept at a positive pressure and a clean environment is maintained. The substrate 208 is stored in a substrate storage box that can store a plurality of the substrates, and one to a plurality of substrate storage box opening / closing devices 204, 205, and 206 mounted on the local cleaning transfer device 101 are transferred by the transfer robot 103. It is taken out and conveyed to a predetermined position.

  The transfer robot 103 is equipped with handling arms 301 and 401 for gripping the edge and side surfaces / edges of the substrate 208. The contact surfaces 302, 303, 304, 402, and 403 between the substrate 208 and the handling arms 301 and 401 are mounted. In the vicinity of the contact portion, a foreign matter suction port 501 for sucking foreign matter that is generated when gripping is provided.

  The transfer robot 103 holds the substrate 208 with the handling arms 301 and 401 in order to take out the substrate from the substrate storage box. As shown in FIG. 5, when gripping the substrate 208, in order to prevent the adhesion of foreign matter, the end, side surface, and edge (edge) of the substrate 208 are gripped from the foreign matter suction port 501 provided near the contact surface with the substrate. By sucking, the foreign matter generated when gripping is sucked and discharged to the outside of the apparatus. Further, when the substrate is not being transported, the foreign matter accumulated on the contact surface is sucked by suction from the foreign matter suction port 501, and the substrate contact surface of the handling arm is kept clean. It is necessary to monitor the state of the transfer robot 103 in the BOX 209 (control device).

  A suction pump (suction mechanism) (not shown) is connected to the suction port via a gas flow path built in the handling arms 301 and 401. The suction mechanism performs gas suction at a predetermined timing and a predetermined suction amount under the control of the control device. Specific control contents will be described later.

  FIG. 1 is a plan view of the local cleaning and conveying apparatus 101 as viewed from above, and FIG. 2 is a side view showing the side surface of the local cleaning and conveying apparatus 101. FIG. 5 is an enlarged cross-sectional view of the handling arms 301 and 401 and the substrate contact portions 302, 303, 304, 402, and 403.

  The substrate transfer robot 103 installed in the local cleaning transfer device 101 moves to the position of the substrate storage box storing a plurality of substrates 208 and the substrate storage box opening / closing devices 204, 205, 206 for opening and closing the box. . The transfer robot 103 grips the edge, side surface, and edge (edge) of the substrate 208 from the substrate storage box, and at the same time, from the foreign substance suction port 501 provided in the substrate contact portions 302, 303, 304, 402, and 403 of the handling arms 301 and 401. Suction. By sucking from the foreign substance suction port 501 provided on the upper side of the substrate, it is possible to suppress and transport the foreign substance that occurs when gripping and wraps around the upper side of the substrate 208.

  Note that the opening of the foreign substance suction port 501 is provided at a position different from the substrate contact portion that is not blocked by the flat surface of the substrate 208. In the case of the example in FIG. 5, an opening for the foreign substance suction port 501 is provided at a position separated from the substrate 208 (above the substrate). If the opening is blocked by the flat surface of the substrate 208, the substrate 208 is adsorbed by the suction of the foreign matter suction port 501, and foreign matter around the suction port cannot be removed. A gap is provided between the two without completely covering the flat surface of the substrate. By providing the foreign matter suction port 501 so as to satisfy such an arrangement condition, the gas in the vicinity of the contact portion between the substrate and the handling arm is sucked, and the foreign matter can be removed over a wide range. Further, by providing a gap between the two, foreign matter suction during conveyance (during substrate support) can be performed.

  Moreover, when removing a foreign material after conveyance (a state where the substrate is not supported by the handling arm), it is not necessary to satisfy the above arrangement condition. In this case, the control device does not perform gas suction using the foreign material suction port 501 when the substrate is transported, and attaches foreign material or the like on the substrate by selectively performing gas suction when the substrate and the handling arm are separated. The foreign matter adhering to the handling arm can be removed without causing it. Even when the foreign matter is removed after the conveyance, it is desirable that an opening of the foreign matter suction port 501 is provided toward the portion where the foreign matter is generated. In the example of FIG. 5, foreign matter may adhere to the outer peripheral surface of the substrate 208, the lower surface end portion of the substrate 208, and the contact portion of the handling arm, and an opening is provided toward that portion. Therefore, it is possible to efficiently perform foreign substance suction.

  Even in the case of a handling arm provided with a mechanism for vacuum-sucking the substrate, it is possible to efficiently remove foreign matter by providing a foreign-suction port separately from the vacuum suction mechanism.

  In the case of an apparatus that requires high throughput, such as a semiconductor measurement apparatus or a semiconductor inspection apparatus, the throughput of the apparatus is reduced by performing a foreign substance removal process after the substrate is transferred and before the next substrate is supported. Therefore, it is possible to remove the foreign matter without any trouble.

  FIG. 9 is a flowchart showing a foreign matter adsorption processing step including a foreign matter adsorption timing determination step. The control BOX 209 that controls the local cleaning transfer apparatus 101 monitors the number of operations of the transfer robot, and when the number of operations reaches a specified number, foreign matter adsorption processing is performed. According to such a configuration, it is possible to remove foreign matters with high efficiency.

  FIG. 10 is a flowchart illustrating a foreign matter removal process including a determination process of timing for removing foreign matter by discharging compressed air from an opening. The number of operations of the transfer robot is monitored by a control BOX 209 that controls the local cleaning transfer apparatus 101. After the substrate 208 is transferred by the substrate transfer robot 103, the foreign matter suction port 501 provided in the handling arms 301 and 401 (in this embodiment). In this case, compressed air is allowed to flow from the gas discharge port, and foreign substances generated when the substrate 208 is gripped are blown off from the substrate contact portions 302, 303, 304, 402, and 403 of the handling arms 301 and 401. As a result, it is possible to maintain a clean state without depositing foreign matters on the substrate contact portions 302, 303, 304, 402, and 403 of the handling arms 301 and 401.

  In addition to the foreign matter suction port 501 shown in the first embodiment, by providing the foreign matter suction port 601 on the side surface of the substrate 208 as shown in FIG. , 402, 403 can be sucked out and the foreign matter can be suppressed. Even in this case, the handling arm is formed so that the flat surface of the substrate 208 does not directly touch the opening of the foreign matter suction port 601. More specifically, a non-contact portion between the substrate 208 and the handling arm is provided between a contact portion between the outermost peripheral surface of the substrate 208 and the handling arm and a contact portion between the lower surface of the substrate 208 and the handling arm. Further, the foreign substance suction port 601 is formed under an arrangement condition for sucking the gas in the space formed by non-contact. In this embodiment, since the edge of the substrate 208 is formed in a wedge shape, the space is secured by forming the contact surface of the handling arm at an angle shallower than the inclined surface of the wedge. According to such a configuration, the foreign matter around the foreign matter suction port 601 can be removed.

  Furthermore, according to the configuration illustrated in FIG. 6, the space formed between the substrate 208 and the handling arm extends long in the circumferential direction of the substrate 208. The space extending in this way serves as a guide and can suck not only the foreign matter suction port 601 but also a wide range of foreign matters in the circumferential direction.

  Moreover, when removing a foreign material after conveyance (a state where the substrate is not supported by the handling arm), it is not necessary to satisfy the above arrangement condition. In this case, the control device does not perform gas suction using the foreign material suction port 601 when the substrate is transported, and attaches foreign material or the like on the substrate by selectively performing gas suction when the substrate and the handling arm are separated. The foreign matter adhering to the handling arm can be removed without causing it.

  FIG. 7 is a diagram illustrating a modification of the embodiment illustrated in FIG. 6. As shown in FIG. 7, by providing a foreign matter suction port 701 on the lower surface of the substrate 208, when gripping the substrate 208, the foreign matter scraped by the substrate from the substrate contact surface and adhering to the lower side of the substrate is sucked to suppress the foreign matter. It becomes possible.

  As illustrated in FIG. 8, a plurality of foreign matter suction ports illustrated in FIGS. 5, 6, and 7 may be provided together. According to such a configuration, it is possible to remove each foreign substance in each space partitioned by the substrate contact portion.

  The suction and the blown-off with compressed air after the conveyance shown in the second and third embodiments may be performed by controlling the suction amount and the compressed air amount by the control BOX 209 that controls the local cleaning and conveying apparatus 101. In addition, by controlling the suction amount and the compressed air discharge amount according to the number of operations and time, it is possible to efficiently clean the substrate contact portions 302, 303, 304, 402, and 403 of the handling arms 301 and 401 without accumulating foreign matters. It is possible to maintain a stable state.

  When performing the blow-off with the compressed air after the conveyance shown in the third and seventh embodiments, the air volume of the fan filter unit 102 mounted on the local cleaning conveyance device 101 is controlled by the control BOX 209, and the fan filter unit 102 By increasing the air volume, the blown-out foreign matter can be discharged outside the apparatus without being wound up in the apparatus.

  In the case where the handling arms 301 and 401 grip the end, side, and edge of the substrate in the transfer robot 103 of the local cleaning transfer apparatus 101, the pre-alignment device 203 mounted on the apparatus is also the end, side, and edge of the substrate. It will be a method to grip. Even when the substrate 208 is gripped by the pre-alignment apparatus 203, foreign substances adhering to the substrate 208 can be suppressed by performing the same method as in the first to eighth embodiments.

DESCRIPTION OF SYMBOLS 101 ... Local cleaning conveyance apparatus, 102 ... Fan filter unit, 103 ... Substrate conveyance robot, 104 ... Exhaust port, 201 ... Moving position of substrate conveyance robot, 202 ... Substrate conveyance Movement position of robot, 203 ... Pre-alignment device, 204 to 206 ... A box capable of storing a plurality of substrates and a device for opening and closing the box, 207 ... A handling arm for gripping the substrate, 208 ... Substrate 209 ... Control BOX for controlling the local cleaning and conveying apparatus 301 ... Handling arm for gripping the edge, side surface / edge (edge) of the substrate 302-304 ... Substrate contact portion 401 ..Handling arm for gripping edges, side surfaces and edges of the substrate, 402 to 403... Substrate contact portion, 501. 1 ... foreign matter suction port, 701 ... foreign matter suction port

Claims (11)

In a sample transport device comprising a handling arm that grips an edge or side surface or edge of a substrate and a transport device that transports the handling arm,
A suction port for sucking gas at a position different from the contact portion of the substrate of the handling arm;
The sample is characterized in that the suction port is provided toward any one of an outer peripheral surface portion of the substrate, a lower surface end portion of the substrate, and a contact portion between the substrate and the handling arm. Conveying device. In claim 1,
The sample transport device according to claim 1, wherein the suction port is provided on at least one of an upper side and a lower side of the substrate. In a sample transport device including a handling arm that supports a substrate and a transport device that transports the handling arm,
At least one of a suction port for sucking gas and a discharge port for discharging gas is provided at a position different from the contact portion of the substrate of the handling arm.
A gas suction / release mechanism for sucking or releasing gas from the suction port or the discharge port, and a control device for controlling the gas suction / release mechanism are provided. The control device defines the number of operations of the handling arm. The gas suction / release mechanism is controlled so that gas is sucked or discharged from the suction port or the discharge port when the number of times has been reached or when the handling arm has been used for a predetermined time. A sample transport device characterized by the above. In a sample transport device including a handling arm that supports a substrate and a transport device that transports the handling arm,
At least one of a suction port for sucking gas and a discharge port for discharging gas is provided at a position different from the contact portion of the substrate of the handling arm.
A fan filter unit that pressurizes a space in which the handling arm is built, a gas suction / release mechanism that sucks or discharges gas from the suction port or the discharge port, the gas suction / release mechanism, and the fan filter A control unit that controls the unit and the gas suction / release mechanism, and the control device increases the air volume of the fan filter unit when the gas is sucked or discharged from the suction port or the discharge port. A sample transport mechanism. In a sample transport device comprising a handling arm that grips an edge or side surface or edge of a substrate and a transport device that transports the handling arm,
An opening provided in the handling arm, a gas suction mechanism for sucking gas from the opening, and a control device for controlling the gas suction mechanism;
The opening is provided toward any one of an outer peripheral surface portion of the substrate, a lower surface end portion of the substrate, and a contact portion of the substrate and the handling arm,
The control apparatus controls the gas suction mechanism so as to suck the gas from the opening after the sample is transported by the handling arm. In claim 5,
Before SL aperture, the sample transport apparatus, characterized in that provided above the substrate, and at least one lower. In a sample transport device including a handling arm that supports a substrate and a transport device that transports the handling arm,
An opening provided in the handling arm, a gas suction / release mechanism for sucking or releasing gas from the opening, and a control device for controlling the gas suction / release mechanism are provided. Control the gas suction / release mechanism so that the gas is sucked or released from the opening after sample transport,
Wherein the controller, when the number of operations of the handling arm has reached a predetermined number of times, or when the use time of the handling arm has reached the predetermined time, the suction gas from the pre-Symbol opening, or to release, the gas A sample transport device that controls a suction / release mechanism. In a sample transport device including a handling arm that supports a substrate and a transport device that transports the handling arm,
An opening provided in the handling arm, a gas suction / release mechanism for sucking or releasing gas from the opening, and a control device for controlling the gas suction / release mechanism are provided. Control the gas suction / release mechanism so that the gas is sucked or released from the opening after sample transport,
Comprising a fan filter unit for pressurizing the space in which the handling arm is built, the control device, suction the gas from the front Symbol opening, or when releasing a feature that increases the air volume of the fan filter unit Sample transport mechanism. In claim 1,
The sample transporting device according to claim 1, wherein the suction port is a suction port for sucking foreign matter generated from the contact portion by the grip together with the gas. In claim 1,
A first contact portion where the outermost peripheral surface of the substrate and the handling arm come into contact;
A second contact portion where the lower surface of the substrate contacts the handling arm;
A space provided between the first contact portion and the second contact portion and in which the substrate and the handling arm are not in contact with each other,
The sample transport device, wherein the suction port communicates with the space. In claim 10,
The sample transport apparatus according to claim 1, wherein the substrate is a substrate in which the end, the side surface, or the edge is formed in a wedge shape.

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