JP6681578B2 - Lighting equipment - Google Patents

Description

  The present invention relates to a lighting device used for downlights and the like.

  Solid-state light-emitting devices such as LEDs are expected to be light sources for various products because they are small, highly efficient, and have a long life. Among them, in recent years, research and development of a lighting device using an LED have been advanced.

  For example, an LED unit (LED lamp) having a flat thin structure has been proposed as an illumination device used for a downlight or a spotlight (see, for example, Patent Documents 1 and 2).

JP 2012-22994 A JP 2012-109156 A

  By the way, in a lighting device including a light emitting module (hereinafter, also referred to as a light emitting device) and a substrate on which a circuit component for supplying power to the light emitting module is mounted, not only the heat dissipation of the light emitting device but also the circuit component It is necessary to improve the heat dissipation of.

  The present invention provides a lighting device capable of improving the heat dissipation of both the light emitting device and the circuit component.

  An illumination device according to one embodiment of the present invention includes a light emitting device, a substrate having an opening through which an optical axis of the light emitting device passes, and a circuit component mounted on the light emitting device, the substrate being mounted on the substrate. A first surface to which the light emitting device is thermally connected, and the substrate is thermally connected to the substrate side. It has one surface and a second surface having a different height.

  According to the present invention, it is possible to enhance the heat dissipation of both the light emitting device and the circuit component.

FIG. 1 is an external perspective view of the lighting device according to the first embodiment. FIG. 2 is a partially exploded perspective view of the lighting device according to the first embodiment. FIG. 3 is a cross-sectional view of the lighting device according to the first embodiment taken along the YZ plane. FIG. 4 is a cross-sectional view of the illumination device according to the first modification taken along the YZ plane. FIG. 5: is sectional drawing which cut | disconnected the illuminating device which concerns on the modification 2 by the YZ plane. FIG. 6 is a perspective view of the downlight according to the second embodiment. FIG. 7 is a perspective view of the spotlight according to the second embodiment.

  Hereinafter, embodiments will be specifically described with reference to the drawings. It should be noted that each of the embodiments described below shows a comprehensive or specific example. Numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of constituent elements, steps, order of steps, and the like shown in the following embodiments are examples, and are not intended to limit the present invention. Further, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept are described as arbitrary constituent elements.

  It should be noted that each drawing is a schematic diagram and is not necessarily strictly illustrated. Further, in each drawing, substantially the same configurations are denoted by the same reference numerals, and overlapping description may be omitted or simplified.

(Embodiment 1)
[Constitution]
Hereinafter, the configuration of the lighting device according to the first embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is an external perspective view of the lighting device according to the first embodiment. FIG. 2 is a partially exploded perspective view of the lighting device according to the first embodiment. FIG. 3 is a cross-sectional view of the lighting device shown in FIG. 1 taken along the YZ plane.

  The lighting device 10 shown in FIGS. 1 to 3 is a lighting device used as, for example, a downlight or a spotlight. The lighting device 10 includes a translucent panel 11, a housing 12, a base 13, a reflecting member 14, a sealing member 15, a substrate 16, a light emitting module 17, a cable sealing member 18a, and an inspection device. The seal member 18b, the seal member 19, the insulating sheet 20, and the screw 21 (not shown in FIG. 2) are provided.

  1 and 2, the central axis of the lighting device 10 (hereinafter also simply referred to as the axis J) is also shown. The axis J is an axis that coincides with the optical axis of the light emitting module 17. Further, in FIG. 3, the circuit components 16b mounted on the substrate 16, the power cable 16c, and the like are omitted from the illustration.

  In addition, in FIGS. 1 and 2, the Z-axis direction is, for example, the vertical direction, and the Z-axis + side may be described as the upper side or the light emission side. Moreover, the Z-axis-side may be described as the lower side or the installation surface side. The X-axis direction and the Y-axis direction are directions orthogonal to each other on a plane (horizontal plane) perpendicular to the Z-axis. Hereinafter, each component of the lighting device 10 will be described.

<Translucent panel>
The translucent panel 11 is an optical member made of a translucent material for extracting light emitted from the light emitting module 17 to the outside. Specifically, the translucent panel 11 is a cap-shaped (lid-shaped) optical member, and has a plan view shape (a shape viewed from the direction of the axis J) in which a part is cut out from the outer peripheral side. The shape (substantially circular).

  The translucent panel 11 may have specific optical characteristics such as functioning as a Fresnel lens. Further, the translucent panel 11 may be provided with dimples for suppressing unevenness of light emitted from the translucent panel 11. In this case, the dimples are provided, for example, on the surface on the light emission side of the translucent panel 11 (light emission surface).

  Three screw insertion holes 11b are provided in the peripheral portion of the translucent panel 11. The screw 21 is inserted through the screw insertion hole 11b. Further, on the side surface (side portion) of the translucent panel 11, three groove portions 11d are provided. The groove 11d forms a groove extending in the Z-axis direction together with a groove 12f described later. The formed groove is a groove for connecting the lighting device 10 to a heat sink (apparatus body) separate from the lighting device 10 by a connection screw (not shown).

  The translucent panel 11 is arranged on the light emission side of the housing 12 so as to close the emission port of the reflection member 14. Further, the translucent panel 11 is arranged in a direction in which the light emitting module 17 emits light, and the translucent panel 11 and the light emitting portion 17b face each other. The translucent panel 11 is made of, for example, a resin material such as acrylic (PMMA) or polycarbonate (PC).

  The translucent panel 11 may have a transparent structure having no light diffusing property or a diffusing structure having light diffusing property. For example, a translucent panel having a light diffusing function is formed by applying a resin containing a light diffusing material such as silica or calcium carbonate or a white pigment to the inner surface of the translucent panel 11 to form a milky white light diffusing film. 11 can be configured. Further, by forming minute irregularities on the translucent panel 11, the translucent panel 11 having a light diffusing function can be constructed.

<Case>
The housing 12 is a tubular (more specifically, substantially cylindrical) member that laterally surrounds the light emitting module 17, the substrate 16, and the base 13. The housing 12 has a first opening formed on the light emitting side and a second opening formed on the side opposite to the light emitting side. The exit opening portion of the reflecting member 14 is arranged in the first opening, and the entrance opening portion of the reflecting member 14 is arranged in the second opening.

  Three fixing portions 12a (bosses) having screw insertion holes 12b are provided on the inner surface of the housing 12. The screw 21 is inserted into the screw insertion hole 12b. Further, the outer surface of the housing 12 is provided with three groove portions 12f that form a groove together with the above-described groove portion 11d.

  Three notches 12h for positioning, into which the fixing portion 13a of the base 13 is fitted, are provided at the lower (Z-axis-side) end of the side portion of the housing 12. The notch 12h is a positioning structure provided on the housing 12 for positioning the base 13 with respect to the housing 12. In addition, a cutout 12i for passing a power cable 16c that electrically connects the substrate 16 and the external power supply device is also provided at the end.

  The housing 12 is made of, for example, an insulating resin material such as PBT (polybutylene terephthalate). The housing 12 may be made of metal.

  The external shape of each of the reflection member 14, the sealing member 15, and the substrate 16 described below in plan view is a shape cut out in accordance with the fixing portion 12a and the groove portion 12f.

<Base>
The base 13 is a member that supports the light emitting module 17 and also functions as a heat sink (heat conducting member) for the light emitting module 17 and the substrate 16. Specifically, the base 13 includes a bottom portion 13f and an annular convex portion 13d.

  The bottom portion 13f is a substantially circular plate-shaped portion located below the base 13 and covers the second opening of the housing 12 from below.

  Three fixing portions 13a having screw holes 13b are provided on the peripheral portion of the bottom portion 13f. The inner peripheral surface of the screw hole 13b is threaded corresponding to the screw 21. The fixed portion 13a is a convex portion that protrudes above the bottom portion 13f (Z axis + side), and is fitted into the notch 12h.

  Further, three connection holes 13c into which the connection screws are inserted are provided in the peripheral portion of the bottom portion 13f. Further, a cutout 13e for passing a power supply cable 16c for electrically connecting the substrate 16 and an external power supply is provided at an end of the bottom 13f.

  The annular convex portion 13d is a portion of the base 13 that annularly protrudes upward from the bottom portion 13f. The lower surface of the substrate 16 is connected to the second surface 13h, which is the upper surface of the annular convex portion 13d, via the heat dissipation member 16d and the insulating sheet 20. The second surface 13h is a flat surface, but may be a curved surface.

  Further, a concave portion 13k, which is a space surrounded by the annular convex portion 13d, is provided in the upper center portion of the base 13. The recess 13k is a space for housing the light emitting module 17. The lower surface of the light emitting module 17 (substrate 17a) is directly connected to the first surface 13g which is the bottom surface of the recess 13k (the surface of the base 13 forming the bottom of the recess 13k). The first surface 13g is a flat surface, but may be a curved surface.

  The base 13 as described above is specifically formed of a metal material such as aluminum, but may be formed of a resin material or the like having high thermal conductivity.

<Reflecting member>
The reflecting member 14 is a member having a reflecting function, and has an entrance that is an opening through which the light of the light emitting module 17 enters, and an exit that is an opening through which the light incident from the entrance exits. The reflecting member 14 has a truncated cone shape whose inner diameter gradually increases from the entrance to the exit. Specifically, the reflecting member 14 has a trumpet shape (funnel shape).

  The entrance portion of the reflecting member 14 surrounds the light emitting portion 17b of the light emitting module 17. The inner surface of the reflecting member 14 is a reflecting surface that reflects the light emitted by the light emitting module 17. The reflecting surface is configured to reflect the light that has entered from the entrance and emit it from the exit. That is, the light emitted from the light emitting module 17 is guided to the translucent panel 11 by the reflecting member 14.

  The reflecting member 14 can be made of, for example, a hard white resin material having an insulating property. In addition, in order to improve the appearance of the reflection surface and to control the light distribution of the lighting device 10, the inner surface of the reflection member 14 is formed of a metal vapor deposition film (metal reflection film) made of a metal material such as silver or aluminum. It may be coated. Further, the reflecting member 14 may be formed using a metal material such as aluminum having a higher reflectance than a resin material.

<Substrate>
The substrate 16 is a substantially annular (doughnut-shaped) substrate on which a circuit component 16b for supplying electric power to the light emitting module 17 is mounted. The substrate 16 has an opening at the center through which the optical axis (axis J) of the light emitting module 17 passes. The substrate 16 is partially cut away from the outer peripheral side. The substrate 16 is arranged inside the housing 12 and outside the reflection member 14. The substrate 16 may be formed in a substantially C shape.

  The board 16 is a so-called printed board on which metal wiring is patterned. As the board 16, a ceramic board, a resin board, a metal base board, or the like is used.

  A circuit component 16b for supplying electric power to the light emitting module 17 (light emitting unit 17b) is provided on the upper surface of the substrate 16, and the circuit component 16b constitutes a drive circuit. The drive circuit converts electric power supplied from the outside through the power cable 16c into electric power suitable for light emission of the light emitting module 17 and outputs the electric power. The power supplied from the outside to the drive circuit may be DC power or AC power. In the first embodiment, AC power is supplied to the drive circuit, and the drive circuit includes a power supply circuit that converts AC power supplied from an external power supply into DC power.

  The circuit component 16b constituting the drive circuit is, for example, a capacitive element such as an electrolytic capacitor or a ceramic capacitor, a resistance element, a coil element, a choke coil (choke transformer), a noise filter, and a semiconductor element such as a diode or an integrated circuit element. Is.

  On the lower surface of the substrate 16, a plurality of heat dissipation members 16d are provided in addition to a part of the circuit component 16b forming the drive circuit. The heat dissipation member 16d is a sheet having a rectangular shape in a plan view, and is a member for releasing heat generated in the substrate 16 (driving circuit) to the base 13. The heat dissipation member 16d is specifically a resin sheet having a high thermal conductivity, and is, for example, a silicon sheet or an acrylic sheet. The heat dissipation member 16d may be heat dissipation grease or a potting material.

<Light emitting module>
The light emitting module 17 is an example of a light emitting device, and emits light of a predetermined color (wavelength) such as white. The light emitting module 17 is screwed to the base 13 and emits light by the electric power supplied from the drive circuit mounted on the substrate 16. The light emitted from the light emitting module 17 passes through the translucent panel 11 and is emitted to the outside of the lighting device 10. The drive circuit (board 16) and the light emitting module 17 are electrically connected by a cable (not shown) having a connector provided at an end thereof.

  The light emitting module 17 includes a substrate 17a, a light emitting portion 17b, and a mounting member 17c. The light emitting module 17 has a COB (Chip On Board) structure in which LEDs (light emitting elements) are directly mounted on the upper surface of the substrate 17a. Although not shown, on the substrate 17a, metal wiring of a predetermined shape for electrically connecting the LEDs to each other, terminals for receiving electric power for causing the LEDs to emit light, and the like are provided.

  A ceramic substrate, a resin substrate, or a metal base substrate can be used as the substrate 17a. The plan-view shape of the substrate 17a is rectangular, but may be polygonal such as hexagonal or octagonal or circular. The lower surface of the board 17a is directly connected to the first surface 13g of the base 13.

  The light emitting unit 17b is provided on the upper surface of the substrate 17a by sealing a plurality of LEDs with a sealing member. The attachment member 17c is a resin connection member for attaching the light emitting module 17 to the base 13. The mounting member 17c also has a function of connecting the end portion of the reflection member 14 on the incident port side and the light emitting module 17.

<Seal member>
The lighting device 10 includes various sealing members described below in order to enhance waterproofness or dustproofness.

  The seal member 15 is a deformable ring-shaped resin member having elasticity. The seal member 15 is sandwiched between the translucent panel 11 and the housing 12. Specifically, the sealing member 15 has the end face of the translucent panel 11 and the first opening side of the casing 12 when the translucent panel 11 and the casing 12 are fixed by tightening the screws 21. It is sandwiched between the end face of and. That is, the seal member 15 seals between the end surface of the translucent panel 11 and the end surface of the housing 12 on the first opening side.

  The cable seal member 18a is a resin member having elasticity. A power supply cable 16c for receiving power from the external power supply to the substrate 16 (driving circuit) is inserted into the cable sealing member 18a to seal the inside of the case. Specifically, the power cable 16c is inserted into the cable seal member 18a through the gap formed by the notches 12i and 13e and is connected to the substrate 16.

  The inspection sealing member 18b is a resin member that closes a hole for injecting air for inspecting the airtightness of the lighting device 10 after the inspection.

  The seal member 19 is a so-called O-ring and is an annular resin member having elasticity. The seal member 19 is sandwiched between the base 13 and the housing 12, and seals between the base 13 and the housing 12. More specifically, the seal member 19 is sandwiched between the outer surface of the annular protrusion 13d and the inner surface of the housing 12 by utilizing the annular protrusion 13d.

  The seal member 15, the cable seal member 18a, the inspection seal member 18b, and the seal member 19 as described above are specifically made of rubber, elastomer, or the like.

<Insulation sheet>
The insulating sheet 20 is a member that is provided between the substrate 16 and the base 13 to ensure the insulating property of the substrate 16. As described above, in the first embodiment, some circuit components 16b are also provided on the lower surface of the substrate 16, and the base 13 facing the lower surface of the substrate 16 is made of metal. Therefore, in the lighting device 10, the insulating sheet 20 is provided between the substrate 16 and the base 13. The insulating sheet 20 is, for example, a resin sheet having an insulating property. The insulating sheet 20 may not be provided if the insulation between the substrate 16 and the base 13 can be ensured.

[Characteristic composition]
The lighting device 10 is characterized by the structure of the base 13. Such a characteristic structure will be described with reference to FIGS. 2 and 3.

  As described above, the lighting device 10 includes the light emitting module 17, the board 16 having the opening through which the optical axis of the light emitting module 17 passes, and the circuit component 16b for supplying electric power to the light emitting module 17, and the board 16. 16 and a base 13 arranged so as to face each other.

  Here, the lighting device 10 employs a heat dissipation structure that allows the heat generated in the substrate 16 (circuit component 16b) and the heat generated in the light emitting module 17 to escape to the outside through the base 13. That is, the substrate 16 and the light emitting module 17 are thermally connected to the base 13.

  Specifically, the base 13 includes a first surface 13g to which the lower surface of the light emitting module 17 is connected and a second surface 13h to which the lower surface of the substrate 16 is connected via the heat dissipation member 16d and the insulating sheet 20. On the substrate 16 side. According to such a heat dissipation structure, since the substrate 16 and the light emitting module 17 are thermally connected to the base 13 having a high thermal conductivity, the heat dissipation properties of both the light emitting module 17 and the circuit component 16b (the substrate 16). And effective heat dissipation is realized. Further, by connecting the base 13 to a heat sink (apparatus body) having a larger heat capacity, the heat of the circuit component 16b and the light emitting module 17 can be radiated to the heat sink.

  By the way, in such a heat dissipation structure, there are cases where restrictions on the arrangement of components are increased and the size of the lighting device 10 is increased. The details will be described below.

  In the lighting device 10, the width of the light emitting module 17 in the X axis direction is longer than the width of the opening of the substrate 16 in the X axis direction. In other words, when viewed from the direction of the optical axis (axis J), part of the light emitting module 17 overlaps the substrate 16. Therefore, if the height from the lower surface 13i (shown in FIG. 3) of the base 13 to the first surface 13g and the height from the lower surface 13i to the second surface 13h are the same, the substrate 16 and the light emission are It interferes with the module 17. As a countermeasure against this, when the opening of the board 16 is widened, the outer shape of the board 16 becomes large in order to secure the mounting area of the circuit component 16b, and the illuminating device 10 becomes large.

  In view of the above points, in the lighting device 10, the height of the first surface 13g is different from the height of the second surface 13h. Specifically, the second surface 13h is located closer to the substrate 16 than the first surface 13g is. Therefore, in the illuminating device 10, the board 16 and the light emitting module 17 can be three-dimensionally crossed, and the degree of freedom in component arrangement is secured. Then, by miniaturizing the board 16 and the light emitting module 17, the lighting device 10 can be downsized.

  As described above, in the lighting device 10, the heat dissipation is enhanced and the degree of freedom in component arrangement is secured.

  The light emitting module 17 may be connected to the first surface 13g directly or via another member. For example, a heat conductive sheet or heat dissipation grease may be provided between the light emitting module 17 and the first surface 13g. A heat dissipation member such as may be interposed. Similarly, the substrate 16 may be directly connected to the second surface 13h.

[Modification 1]
In the illumination device 10, the second surface 13h is located closer to the substrate 16 side than the first surface 13g, but the first surface 13g is located closer to the substrate 16 side than the second surface 13h. May be.

  Hereinafter, the illumination device 10 according to the first modification will be described. FIG. 4 is a cross-sectional view of the illumination device according to the first modification taken along the YZ plane. Note that, in FIG. 4, constituent elements that are substantially the same as those of the above-described lighting device 10 are denoted by the same reference numerals, and description of such constituent elements is omitted in the description of Modification 1 below.

  The pedestal 113a included in the lighting device 10a shown in FIG. 4 includes a pedestal main body 113f and a convex portion 113d protruding from the central portion of the pedestal main body 113f toward the substrate 16 side. The light emitting module 17 is directly connected to the first surface 113g which is the upper surface of the convex portion 113d.

  Further, the upper surface of the base body 113f is the second surface 113h, and the substrate 16 is connected via the heat dissipation member 16d and the insulating sheet 20. The second surface 113h is an annular surface that surrounds the convex portion 113d in plan view.

  In this way, the first surface 113g may be located closer to the substrate 16 than the second surface 113h is. Even in such a configuration, since the substrate 16 and the light emitting module 17 can cross each other, the degree of freedom in arranging components can be secured and the heat dissipation can be improved.

  In addition, as in the above-described illumination device 10, the configuration in which the second surface 13h is located closer to the substrate 16 than the first surface 13g is when the distance from the light emitting module 17 to the translucent panel 11 (optical path (Length) is easily secured, and there is an advantage that optically good characteristics can be obtained.

  On the other hand, in the configuration in which the first surface 113g is located closer to the substrate 16 than the second surface 113h is, like the lighting device 10a, a component having a small bottom area and a high height is arranged on the substrate 16. Therefore, there is an advantage that the area of the substrate 16 can be reduced and the outer diameter of the lighting device 10a can be reduced.

  In addition, in the lighting device 10a, the convex portion 113d may have a size that can support at least the loading portion of the substrate 17a and the mounting portion (screw portion or the like) of the mounting member 17c. For example, the area of the convex portion 113d in plan view can be made smaller than the area of the light emitting module 17. As a result, the opening of the substrate 16 can be made smaller, so that the effective area of the substrate 16 can be made wider and the outer diameter of the lighting device 10a can be made smaller.

[Modification 2]
The base 13 of the lighting device 10 may be provided with a groove for dividing the heat radiation path from the light emitting module 17 to the base 13 and the heat radiation path from the substrate 16 to the base 13. FIG. 5: is sectional drawing which cut | disconnected the illuminating device which concerns on the modification 2 by the YZ plane. Note that, in FIG. 5, constituent elements that are substantially the same as those of the above-described illumination device 10 are denoted by the same reference numerals, and description of such constituent elements is omitted in the following description of Modification Example 2.

  In the base 113b included in the lighting device 10b shown in FIG. 5, a groove 13j is provided on the first surface 13g so as to surround the light emitting module 17. That is, the shape of the groove 13 j when viewed from the direction of the optical axis (axis J) is an annular shape along the outer shape of the light emitting module 17. By providing such a groove 13j, the heat radiation path from the light emitting module 17 to the base 13 and the heat radiation path from the substrate 16 to the base 13 can be separated.

  Such a configuration is useful when heat generated by one of the substrate 16 and the light emitting module 17 deteriorates heat dissipation of the other.

(Embodiment 2)
In the second embodiment, a specific configuration when the lighting device (lighting devices 10, 10a, and 10b) according to the first embodiment is used as a downlight will be described. FIG. 6 is a perspective view of the downlight according to the second embodiment.

  As shown in FIG. 6, the downlight 100 is an embedded lighting device that illuminates light downward (corridor, wall, or the like) by being embedded in the ceiling of a house or the like. The lighting device according to the first embodiment is housed in the fixture body 110 of the downlight 100. At this time, the Z axis + side in the first embodiment is the main emission direction of the light of the downlight 100. It should be noted that the connection hole 13c and the connection screw described in the first embodiment are used to attach the lighting device to the fixture body 110.

  The fixture main body 110 is a mounting base to which the base of the lighting device is attached by the connection screw, and is a heat sink that radiates heat generated in the lighting device. The instrument body 110 is made of, for example, aluminum die casting. A plurality of radiating fins are provided on the upper portion (ceiling side portion) of the appliance body 110.

  The terminal block 160 is attached to a mounting plate 170 that is separate from the instrument body 110. The mounting plate 170 is a rectangular plate-shaped member made of a metal material, and the terminal block 160 is mounted on the lower surface thereof. The attachment plate 170 is connected to the top plate 180 attached to the upper portion of the instrument body 110.

  Thus, the lighting device according to the first embodiment can be used as a downlight, but may be used as another lighting device. For example, the lighting device according to the first embodiment may be used as a spotlight. FIG. 7 is a perspective view of the spotlight according to the second embodiment.

  As shown in FIG. 7, the spotlight 200 includes a cover 210, a lamp 220, and an arm 230.

  The lighting device according to the first embodiment is housed inside the lamp 220, and light emitted from the lighting device passes through the cover 210 and is emitted to the outside of the spotlight 200. The lamp 220 and the arm 230 are fixed by a fixing member such as a screw.

  As described above, the lighting device according to the first embodiment can be used as a spotlight. The lighting device according to the first embodiment can also be used as a lighting device other than the downlight and the spotlight. Since the lighting device according to the first embodiment includes the seal member, it is particularly useful as an outdoor lighting device such as a lighting attached to a low pole or a buried light.

(Other embodiments)
Although the illumination device according to the embodiment has been described above, the present invention is not limited to such an embodiment.

  Further, in the above-described embodiment, the light emitting module is a light emitting module having a COB structure, but it may be an SMD (Surface Mount Device) type.

  Further, in the above embodiment, the LED is used as the light emitting element in the light emitting module, but a semiconductor light emitting element such as a semiconductor laser, a solid light emitting element such as an organic EL (Electro Luminescence) or an inorganic EL may be used. Good.

  Although the lighting device according to one or more aspects has been described above based on the embodiment, the present invention is not limited to this embodiment. As long as it does not depart from the gist of the present invention, various modifications that a person skilled in the art can think of in the present embodiment, and forms constructed by combining the components in different embodiments are also within the scope of one or more aspects. May be included within.

10, 10a, 10b Illumination device 12 Housing 13, 113a, 113b Base 13g, 113g First surface 13h, 113h Second surface 13j Groove 19 Seal member 16 Substrate 16b Circuit component 16d Heat dissipation member 17 Light emitting module (light emitting device )

Claims (6)

A light emitting device,
A substrate having an opening through which an optical axis of the light emitting device passes, and a circuit component for supplying electric power to the light emitting device mounted thereon;
A base arranged to face the substrate,
The base is on the substrate side,
A first surface to which the light emitting device is thermally connected;
The substrate is thermally connected, having a second surface having a height different from the first surface,
The second surface is located closer to the substrate than the first surface,
The second surface surrounds the first surface when viewed from the direction of the optical axis. The first surface is connected to the light emitting device directly or via another member,
Wherein the second surface, the illumination device according to claim 1, wherein the substrate is connected directly or via other members. The light emitting device is directly connected to the first surface,
The substrate may lighting device according to claim 1 or 2 is connected via the heat dissipation member to the second surface. further,
A cylindrical casing that surrounds the light emitting device, the substrate, and the base from the side;
A seal member sandwiched between the base and the housing,
Lighting device according to any one of claims 1-3. When viewed from the direction of the optical axis, a portion of the light emitting device, the lighting device according to any one of claims 1-4 overlapping with the substrate. Wherein the first surface, the lighting device according to claim 1 in which the groove is provided to surround the light emitting device.

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