JP6673452B2 - Break device - Google Patents

Description

The present invention, breaking apparatus, in particular, on one surface of the substrate body made of a brittle material as glass or ceramic, to BREAK equipment of composite substrate resin layer such as a silicone resin was formed by way of the adhesive layer.

  Conventionally, a plurality of scribe lines are formed in advance on a composite substrate using a cutter wheel (also referred to as a scribing wheel) or a dicing saw, and thereafter, an external force is applied to bend the substrate to scribe lines. A method of taking out a unit product such as a chip by breaking along the line is known, for example, disclosed in Patent Document 1 and Patent Document 2.

FIG. 1 shows a composite substrate W in which a resin layer 3 such as a silicone resin is formed via an adhesive layer 2 on one surface of a substrate body 1 made of a brittle material such as glass or ceramic having a circuit pattern formed on the surface or inside. It is a figure for explaining a general break method.
As shown in FIG. 1B, the scribe line S composed of cracks having a finite depth is formed by rolling the cutter wheel 4 against the substrate body 1 of the composite substrate W along the scheduled scribe line. Process. Then, as shown in FIG. 1C, the composite substrate W is attached to an elastic adhesive tape 5 supported by a dicing ring 10 (see FIG. 2) with the substrate main body 1 facing downward. And placed on the stage 6.
The stage 6 is formed with a pair of receiving blades 7, 7 that receive the lower surface of the composite substrate W at the left and right positions across the scribe line S, and a sharp edge is formed above a portion of the substrate W facing the scribe line S. A break bar 8 having an appropriate cutting edge is arranged.
As shown in FIG. 1D, the break bar 8 is pushed into the resin layer 3 while being cut, so that the resin layer 3 and the adhesive layer 2 are first separated. 1 is also separated from the scribe line S.

  Further, as shown in FIG. 1F, when the groove 9 is formed in the resin layer 3 with a dicing saw or the like, the break bar 8 is pushed into the groove 9 to divide the adhesive layer 2 and at the same time. By bending the composite substrate W, the substrate body 1 is also separated from the scribe line S.

JP 2012-131216 A JP 2011-212963 A

The break bar 8 used for separating the resin layer 3 and the adhesive layer 2 requires a sharp cutting edge having a sharpened tip to cut these layers. However, the break bar 8 not only divides the resin layer 3 and the adhesive layer 2 but also presses and deflects the substrate body 1 after these divisions, and divides the substrate body 1 along the scribe line S that has been processed earlier. Therefore, a large load is applied when the substrate is cut. Therefore, if the blade edge angle is too small, damage such as blade spillage or breakage occurs, and the blade edge angle is limited to about 10 degrees.
However, since the adhesive layer 2 of the composite substrate W has ductility even though the layer itself is thin, even if the angle of the blade edge of the break bar 8 is formed as sharp as the limit of 10 degrees, the pressing of the break bar 8 is not performed. May not be broken. In some cases, except for cutting with a dicing saw, a part of the resin layer 3 may be left uncut. If partial separation remains as described above, harm is caused in the next step that is continuous in the flow operation, and causes trouble.

  Therefore, an object of the present invention is to solve the above-mentioned conventional problems and to provide a novel breaking method that can surely and efficiently break a composite substrate without any remaining.

In order to achieve the above object, the present invention takes the following technical measures. That is, the breaker of the present invention is a table on which a substrate is placed, a gate-shaped beam provided so as to straddle the table, and provided on both sides of the table, and in a plane including the surface of the table. A rail extending in the Y direction perpendicular to the X direction when the extending direction of the beam is the X direction, and a rail for regulating a relative movement direction of the beam with respect to the table; A driving mechanism that drives to relatively move along the rail, a roller that extends in the X-axis direction, and a roller that is rotatably held by the beam with an axis that extends in the X-axis direction as a rotation axis; Adjusting means for adjusting the vertical position of the roller with respect to the beam, and suppressing the upward movement of the roller by urging the roller at an intermediate position of the roller It may comprise a vertically adjustable pressing member because.
The breaking device of the present invention can be used, for example, in the second breaking step of the following breaking method: a resin layer such as a silicone resin is formed on one surface of a substrate body made of a brittle material via an adhesive layer; A method of breaking a composite substrate in which a plurality of scribe lines are formed at a predetermined pitch on a surface of a substrate main body, wherein the composite substrate is elastically adhered while the substrate main body of the composite substrate is on the lower side. Attached to the tape, by pressing a break bar having an acute edge from the upper surface of the resin layer of the composite substrate toward the scribe line, while cutting and pushing the edge of the break bar into the resin layer and the adhesive layer, A first method of bending the substrate body downward to penetrate cracks in the scribe line in a thickness direction to break the substrate body; Breaking step, by rolling while pressing the roller over the entire width of the upper surface of the composite substrate in a state where the adhesive tape is on the upper side, the dividing line broken in the first breaking step is bent again, and the part where the division remains And a second breaking step of breaking.

In the breaking method, it is preferable that the angle of the cutting edge of the break bar used in the first breaking step is 10 to 50 degrees. Further, the present invention is suitable for breaking a composite substrate in which the substrate main body of the composite substrate is glass or ceramic and the resin layer is a laminated material of silicone or a solder resist and silicone.

  According to the present invention, in the second scribing step, by the pressing and rolling of the roller, the remaining part of the adhesive layer or the resin layer that has occurred in the first breaking step can be surely separated, and can be continuously separated in the next step. Trouble can be avoided. Further, even if the adhesive layer and the resin layer are not completely separated in the preceding first break step, they are broken again by the pressing and rolling of the rollers in the second break step, so that they are used in the first break step. It is not necessary to sharpen the cutting edge of the break bar so sharply, which not only ensures the strength of the break bar but also extends the service life.

  Further, in the second breaking step, by rolling while pressing the roller over the entire width of the upper surface of the composite substrate, the divided portion of the composite substrate is continuously bent to break, so that the tact time can be reduced. There is also an advantage that it can be done.

Explanatory drawing which shows the breaking method of the composite board | substrate to be divided. FIG. 3 is a perspective view showing a state in which a composite substrate is attached to an adhesive tape of a dicing ring. Sectional drawing of FIG. The whole perspective view showing the 2nd break device. FIG. 6 is a partially enlarged cross-sectional view illustrating a roller pressing member in the second break device. Sectional drawing which shows the table mounting state of the composite board | substrate in a 2nd break process. FIG. 7 is a partially enlarged sectional view of FIG. 6. Sectional drawing which shows operation | movement of a 2nd break process. FIG. 4 is a schematic diagram illustrating a relationship between a roller diameter and the quality of a divided section. FIG. 4 is an explanatory diagram of an opening angle θ in a depth direction in a dividing line caused by bending of a substrate.

Hereinafter, a break method and a break device according to the present invention will be described in detail with reference to the drawings showing an embodiment.
The configuration of the composite substrate W to be broken according to the present invention is the same as that of the composite substrate W shown in FIG. 1A, and is made of glass, ceramic, or the like having an electronic circuit pattern (not shown) formed on the upper surface or inside. And a resin layer 3 made of silicone or the like via an adhesive layer 2. The resin layer 3 may be a laminate of silicone and solder resist. The total thickness of the composite substrate W is about 0.1 to 1.0 mm. As shown in FIG. 1B, a plurality of scribe lines S are formed on the surface of the substrate main body 1 at a predetermined pitch by a cutter wheel 4 in a preceding scribe step.

In the breaking method of the present invention, first, the same breaking step (first breaking step) as the procedure shown in FIGS. 1C to 1F is applied to the composite substrate W in which the scribe lines S are formed in the substrate body 1. I do.
That is, as shown in FIG. 1C and FIGS. 2 and 3, the composite substrate W on which the scribe line S has been processed is elastically supported by the dicing ring 10 with the substrate main body 1 facing downward. It is affixed to a certain adhesive tape 5 and placed on the stage 6 of the first breaker.
On the stage 6 of the first breaking device, a pair of receiving blades 7, 7 that receive the lower surface of the composite substrate W at the left and right positions across the scribe line S are arranged, and face the scribe line S of the composite substrate W. Above the part, a break bar 8 having a sharp edge of 10 to 50 degrees, preferably 15 to 25 degrees, for example, 20 degrees is arranged. As shown in FIG. 1 (d), the break bar 8 is pushed into the resin layer 3 and the adhesive layer 2 while being cut, and the substrate body 1 is bent downward, so that the cracks of the scribe lines S penetrate in the thickness direction, and Break the body 1. Note that a cushion sheet (not shown) may be used instead of the pair of receiving blades 7 and 7.
In the first breaking step, the composite substrate W is broken along the scribe line S. As described above, in the first breaking step, the composite substrate W is partially applied to the adhesive layer 2 and, in some cases, the resin layer 3. An undivided portion as shown in FIG.

In the present invention, following the first break step, a second break step described below is performed to completely break the above-mentioned remaining part.
FIG. 4 is a perspective view showing an example of a second breaking device for performing the second breaking step. The second breaking device A includes a table 11 on which the composite substrate W supported by the dicing ring 10 is placed, and a portal beam 12 is provided so as to straddle the table 11. The beam 12 is installed so as to be movable along left and right rails 18 extending in the Y direction, and is driven by a driving mechanism (not shown).

  Although the beam 12 is moved by the driving mechanism in the above embodiment, the beam may be fixed to the pedestal and the table may be moved along the rail.

  Further, a roller 13 extending horizontally in the X direction is rotatably held on the beam 12. The roller 13 is formed of a hard resin having a diameter of 5 to 20 mm, such as iron, aluminum, or acrylic, and has a length capable of pressing at least the entire width of the composite substrate W to be divided. In this embodiment, an iron material having a diameter of 10 mm is used. As will be described later, it is desirable that the diameter of the roller 13 be selected in accordance with the distance between the adjacent scribe lines S (that is, the width of the unit substrate) and the thickness of the composite substrate W.

  The roller 13 is held at both left and right ends of the beam 12 via adjustment screws 14, and is mounted so that the vertical position of the roller 13 with respect to the beam 12 can be adjusted by the adjustment screws 14. Further, as shown in FIG. 5, the roller 13 is restrained from being lifted upward by a pressing member 15 which can be adjusted up and down at an intermediate position. The pressing member 15 is formed so that the vertical adjustment of the pressing member 15 can be performed by the adjusting screw 16.

Following the first breaking step, as shown in FIGS. 6 and 7, the composite substrate W is placed on the table 11 of the second breaking device A with the adhesive tape 5 of the dicing ring 10 to which the composite substrate W is attached facing upward. Place on. At this time, an elastic cushion sheet 17 is laid on the lower surface of the composite substrate W. The cushion sheet 17 is preferably made of foamed resin such as rubber or sponge.
Next, by rolling while pressing the roller 13 against the upper surface of the composite substrate W, as shown in FIG. 8, the dividing line L previously broken in the first breaking step is bent again, and the adhesive layer 2 The remaining part of the resin layer 3 is completely divided. The relative position and pressing force of the roller 13 against the composite substrate W can be adjusted by adjusting screws 14 according to the thickness and the composition of the composite substrate W. Then, the individually divided unit substrates are taken out while being attached to the adhesive tape 5.

  As described above, according to the present invention, in the second scribing step, the remaining portion of the adhesive layer 2 and the resin layer 3 remaining in the first breaking step can be reliably broken by the pressing and rolling of the roller 13, Troubles in the subsequent next process can be avoided beforehand. Further, even if the adhesive layer 2 and the resin layer 3 are not completely separated in the preceding first breaking step, they are broken again by the pressing and rolling of the roller 13 in the second breaking step. It is not necessary to sharpen the cutting edge of the break bar 8 used in the breaking step too much, which has the advantage that the strength of the break bar 8 can be ensured and the service life can be extended.

(Selection of roller diameter)
In the above-described embodiment, the composite substrate W on which the scribe lines S are formed for each product chip on the substrate is formed using the roller 13 having a diameter of 10 mm.
However, when a break process is performed by the same roller 13 on a plurality of types of composite substrates W having different distances between adjacent scribe lines S (that is, the width of the unit substrate) or different substrate thicknesses, the break after the break is performed. There was a composite substrate W in which the substrate body (glass) 1 was damaged. Then, as a result of conducting an experiment for investigating a solution for preventing the substrate body 1 from being damaged, the inventors have found that the selection of the roller diameter is important.

  That is, the roller 13 having a diameter of 5 mm to 20 mm is prepared, the width of the adjacent scribe line S (that is, the size of the product chip) is 1 mm to 3.5 mm, and the plate thickness is 0.8 mm to 1 mm (glass substrate 0). An experiment was performed to break a composite substrate W having a thickness of 0.5 mm and a resin layer of 0.3 mm to 0.5 mm).

  For example, when a composite substrate having an adjacent scribe line having a width of 1.5 mm, a glass substrate having a thickness of 0.5 mm, and a resin layer having a thickness of 0.45 mm is broken, the glass substrate is damaged with a roller diameter of 10 mm. However, when the roller diameter was 15 mm, it could be appropriately divided. On the other hand, when the roller diameter was set to 20 mm, the glass substrate was not damaged, but remained uncut (the resin layer was not separated).

FIG. 9 is a schematic diagram for explaining the relationship between the roller diameter and the quality of the divided section.
As a result of examining the cause of the above-described inconvenience, the glass substrate main body which became a separated piece after being separated due to the large deformation of the composite substrate W during rolling at a roller diameter where the curvature of the roller 13 is too small (FIG. 9A). It was found that one of them collided and was damaged. On the other hand, it was found that the resin layer 3 could not be separated if the roller diameter had too large a curvature (FIG. 9C), because the amount of bending of the composite substrate W during rolling was insufficient. Therefore, if an appropriate roller diameter in the middle of these (FIG. 9B) is used, the separated glass substrate bodies 1 do not come into contact with each other and the resin layer 3 can be separated. I understood.

  Therefore, the value of the diameter of the roller 13 is selected to be smaller than the diameter at which an unseparated dividing line occurs after rolling, and larger than the diameter at which breakage due to collision between separated pieces after rolling occurs. As a result, it has become possible to perform high-quality and reproducible division.

  Since the appropriate range of the roller diameter varies depending on the distance between adjacent scribe lines and the substrate thickness, in advance, perform an experiment for each substrate to be processed and confirm the range of the roller diameter that can be appropriately processed. It is desirable to keep. The normal size of the product chip is 1 mm to 3.5 mm, and a composite substrate having a plate thickness of 0.8 mm to 1 mm (glass substrate 0.5 mm, resin layer 0.3 mm to 0.5 mm) is used. Within this range, a roller having a roller diameter of 12 mm to 18 mm could be used for high quality cutting.

The inventors have conducted further experiments in order to be able to objectively determine the range of the roller diameter at which high-quality cutting can be performed. That is, a moving image is taken of the degree of bending of the substrate when the roller is rolled and passes through the scribe line, and as shown in FIG. 10, the opening angle in the depth direction at the dividing line L caused by bending of the composite substrate W, as shown in FIG. The maximum angle of θ was measured from the image.
As a result, it was found that when the opening angle θ was set to 5 ° <θ <15 °, high-quality cutting without breakage of the substrate and unseparated resin layer (residual separation) was possible.

  As described above, the representative embodiments of the present invention have been described. However, the present invention is not necessarily limited to the above-described embodiment structures, but may achieve the object of the present invention and may be within the scope of the claims. It can be modified and changed as appropriate.

  INDUSTRIAL APPLICABILITY The present invention is suitably used for cutting a composite substrate in which a resin layer such as a silicone resin is formed on one surface of a substrate body made of a brittle material such as glass or ceramic via an adhesive layer.

A second breaker L cutting line S scribe line W composite board 1 board body 2 adhesive layer 3 resin layer 4 cutter wheel 5 adhesive tape 8 break bar 10 dicing ring 11 table 12 beam 13 roller

Claims (1)

A table on which the substrate is placed,
A gate-shaped beam provided to straddle the table,
The table is provided on both sides of the table and extends in a Y direction perpendicular to the X direction when an extending direction of the beam is an X direction in a plane including a surface of the table. A rail that regulates the direction of movement relative to
A drive mechanism that drives the beam to move relative to the table along the rails;
A roller extending in the X-axis direction and rotatably held by the beam around an axis extending in the X-axis direction as a rotation axis;
Adjusting means for adjusting the vertical position of the roller with respect to the beam,
A pressing member that can be adjusted up and down to suppress the upward lifting of the roller by urging the roller at an intermediate position of the roller,
Breaking device equipped with.

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