JP6648681B2 - Chip parts transfer device - Google Patents

Description

  The present invention relates to a chip component transport device.

  While rotating the transfer rotor holding the chip components in the cavities provided in a plurality of rows concentrically, inspect the electrical characteristics and the like of the chip components, classify the inspected chip components into non-defective and defective products and collect them. 2. Description of the Related Art A chip component transport device is known (for example, see Patent Document 1). The collection box for collecting a plurality of types of chip components such as non-defective products and defective products is set to have a size capable of accommodating a large number of chip components. For this reason, the collection box is connected to the transport rotor by a hose. The chip component transporter collects the inspected chip components from the transport rotor via a hose into a collection box.

JP 2014-152021 A

  By the way, in a chip component transporting device that transports minute chip components, there is a possibility that the chip components remain in the hose. Such a residue of chip components may cause mixing of chip components between different lots. In order to prevent such mixing of chip components between different lots, measures are taken to clean hoses between lots. However, since the presence or absence of a chip component in the hose is visually checked by an operator, it is difficult to confirm the presence of the chip component in the hose if the chip component is too small to be visually recognized. In addition, in the hose cleaning operation, the hose is cleaned while checking for the presence of chip components in the hose, so that the hose cleaning operation takes time.

  SUMMARY OF THE INVENTION It is an object of the present invention to provide a chip component transport device that can easily suppress the mixing of chip components between different lots.

A chip component transport device that solves the above-described problems includes a transport body that transports the chip component, an inspection unit that inspects whether the chip component transported by the transport unit is a non-defective product or a defective product, and an inspection result of the inspection unit. A discharge device that discharges the non-defective chip components from the transport body based on the non-defective chip components discharged from the transport body by the discharge device based on an inspection result of the inspection unit; A box holder for detachably holding the non-defective product collection box, wherein the carrier is disposed along a transport direction of the chip component, and has a plurality of holding portions capable of holding the chip component. , Each of the plurality of holding units is arranged side by side along a direction intersecting with the transport direction, and has a plurality of accommodation holes for accommodating the chip component, and the good product collection box is provided with the plurality of holding units. My little Least one opposite to the plurality of the accommodation hole of the holding portion has a recovery port that directly recovered chip components of the non-defective discharged from the accommodation hole by the discharge device.
According to this configuration, the non-defective chip components discharged from the accommodation hole are directly collected in the non-defective product collection box. This eliminates the need for a hose that is connected to the non-defective product collection box and that constitutes a discharge path between the non-defective product collection box and the accommodation hole. Therefore, there is no accumulation of chip components, and mixing of chip components between different lots can be easily suppressed. .

In the above chip component transporting apparatus, when viewed from the transport direction, the size of the recovery port is a line extending at an inclination angle of 45 ° or more and less than 90 ° from the edge of the storage hole in a state facing the storage hole Minutes.
According to this configuration, the non-defective chip components discharged from the holding unit are easily discharged into the collection port of the non-defective product collection box. Therefore, it is possible to suppress the non-defective chip components discharged from the holding unit from being discharged to the outside of the non-defective product collection box.

In the above-mentioned chip component transport device, it is preferable that the collection port is formed so as to straddle the plurality of accommodation holes.
According to this configuration, the non-defective chip components discharged from the storage hole are easily discharged into the collection port of the non-defective product collection box. Therefore, it is possible to suppress the non-defective chip component discharged from the accommodation hole from being discharged to the outside of the non-defective product collection box.

In the chip component transport device, the discharging device discharges the chip component from the storage hole by ejecting compressed air toward each of the plurality of storage holes, and the non-defective product collection box includes a chip component. It is preferable to have an exhaust port for discharging the air in the non-defective product collection box without discharging.
When the non-defective chip component is discharged to the non-defective product collection box by the discharge device, the compressed air flows into the non-defective product collection box together with the non-defective chip component, so that the pressure in the non-defective product collection box is likely to increase. If the pressure in the non-defective product collection box is excessively increased, there is a possibility that non-defective chip components may not easily enter the non-defective product collection box due to the pressure.
In this regard, in the present chip component transport device, since the good product collection box has the exhaust port, it is possible to suppress the pressure in the good product collection box from excessively increasing due to the air in the good product collection box flowing out through the exhaust port to the outside. . Therefore, it is easy for non-defective chip components to enter the non-defective product collection box.

In the above-mentioned chip component transport device, it is preferable that the exhaust port is provided in a portion of the non-defective product collection box that does not face the collection port.
According to this configuration, the accumulation of chip components in the exhaust port is suppressed, so that the flow of air between the exhaust port and the outside of the non-defective product collection box is prevented by the chip components accumulated in the exhaust port. For this reason, it becomes easy to suppress that the pressure of the good product collection box is excessively increased.

In the above-mentioned chip component transport device, it is preferable that the exhaust port is provided at an upper end portion in the vertical direction in the good product collection box.
According to this configuration, since the exhaust port is provided at a position where the chip components hardly accumulate in the non-defective product collection box, it is easy to suppress that the air flow between the exhaust port and the outside of the non-defective product collection box is obstructed by the chip components. Become.

In the above-mentioned chip component transport device, it is not possible to collect the defective chip component which is disposed corresponding to one of the holding units and which is ejected from the accommodation hole by the ejection device based on an inspection result of the inspection unit. A non-defective product recovery box, wherein the defective product recovery box has a recovery port facing the storage hole and directly recovering the defective chip component discharged from the storage hole by the discharge device; The good product collection box and the defective product collection box are preferably arranged in the transport direction.
According to this configuration, it is possible to arrange the non-defective product collection box and the defective product collection box so that chip components can be collected without excessively reducing the size of the non-defective product collection box and the defective product collection box. Therefore, the number of chip components that can be accommodated in the non-defective product collection box and the defective product collection box can be increased, so that the number of chip components in a lot can be increased.

In the above chip component transport apparatus, it is preferable that the non-defective product recovery box is located downstream of the defective product recovery box in the transport direction.
According to this configuration, since the defective chip components are discharged from the holding unit before the holding unit is transported to the position corresponding to the non-defective product collection box, the defective chip components may be collected in the non-defective product collection box. Can be reduced.

In the above chip component transport device, the non-defective product collection box and the box holder are provided with a mounting restricting portion capable of mounting the non-defective product collection box only at a predetermined position with respect to the box holder. Is preferred.
If the non-defective product collection box is used as a collection box for collecting defective chip components in a different lot, if the non-defective chip components in the non-defective product collection box remain in that lot, the non-defective product collection box is When used for collecting chip components, non-defective chip components and defective chip components are mixed in the non-defective product collection box.
In this regard, according to the present chip component transport device, the non-defective product collection box can be a collection box dedicated to non-defective chip components. For this reason, since the non-defective product collection box is not disposed at the position where the non-defective chip components are collected, the mixing of non-defective and defective chip components into the non-defective product collection box can be suppressed.

The chip component transport device further includes a control device that controls an operation of the chip component transport device, wherein the control device is arranged such that the non-defective product collection box is located at a position other than a predetermined position with respect to the box holder. In this case, it is preferable that the operation of the chip component transfer device is not started.
According to this configuration, when the non-defective product collection box is arranged at a position for collecting the defective chip components, the control device does not operate the chip component transport device, and thus the defective chip components are collected in the non-defective product collection box. Is suppressed. Therefore, mixing of good and defective chip components into the good product collection box can be suppressed.

It is preferable that the chip component transport device further includes a notifying unit for notifying when the non-defective product collection box is arranged at a position other than a predetermined position with respect to the box holder.
If the non-defective product collection box is placed at the position where the defective chip components are collected, the notification unit notifies the worker that the position of the non-defective product collection box is incorrect. Can be reduced.

In the chip component transport device, in the transport direction, the non-defective product collection box is located downstream from a position at which the defective component is recovered, and a control device that controls the operation of the chip component transport device; A detecting unit that detects whether or not the chip component is accommodated in the accommodation hole, on the upstream side of the non-defective product collection box and downstream of the position where the defective chip component is collected in the transport direction. The control device may further include: the detection unit stores the defective chip component in the storage hole in a state where the defective chip component based on the inspection result of the inspection unit is stored in the storage hole. When it is detected, it is preferable to stop the operation of the chip component transport device.
According to this configuration, since the defective chip components held by the holding unit are prevented from facing the collection port of the non-defective product collection box, the possibility that the defective chip components are collected in the non-defective product collection box is reduced. it can.

  ADVANTAGE OF THE INVENTION According to the chip component transfer apparatus of this invention, mixing of chip components between different lots can be suppressed easily.

1 is a schematic front view of a first embodiment of a chip component transport device. FIG. 1 is a schematic sectional view of a first embodiment of a chip component transport device. FIG. 3 is a perspective view of a chip component. (A) is a schematic front view of the chip component transport device when the chip component is supplied from the supply unit to the holding unit, and (b) is a schematic front view of the chip component transport device when the chip component is inspected by the inspection unit. (C) is a schematic front view of the chip component transport device when the chip component is discharged to the collection unit. The perspective view of the front side of a collection unit. FIG. 5 is an exploded perspective view of a good product collection box in the collection unit. FIG. 4 is a perspective view of the back side of the collection unit. FIG. 5 is a perspective view when the collection unit is at a take-out position. FIG. 4 is an exploded perspective view of a non-defective product collection box and a box holder in the collection unit. FIG. 3 is a schematic sectional view of a collection unit and a transfer rotor. FIG. 7 is an exploded perspective view of a part of a collection unit in a second embodiment of the chip component transport device. The front view which shows the positional relationship between the holding plate in the collection unit, the good product collection box, and the defective product collection box. In the third embodiment of the chip component transport device, (a) is a schematic front view of a transport rotor and a recovery unit, and (b) is a schematic cross-sectional view of the transport rotor and a recovery unit. FIG. 13 is a schematic cross-sectional view of a collection unit in a modified example of the chip component transport device. FIG. 13 is a schematic cross-sectional view of a collection unit in a modified example of the chip component transport device. The schematic perspective view of the conveyance part in the modification of a chip component conveyance device. The schematic perspective view of the conveyance part in the modification of a chip component conveyance device. FIG. 9 is a schematic plan view of a transport unit in a modified example of the chip component transport device.

  Hereinafter, embodiments of the chip component transport device will be described with reference to the drawings. In addition, the accompanying drawings may show components in an enlarged manner for easy understanding. Also, the dimensional ratios of the components may be different from actual ones or from those in another drawing.

(1st Embodiment)
A first embodiment of a chip component transport device will be described with reference to FIGS.
As shown in FIG. 1, the chip component transport device 1 includes a transport unit 10, a supply unit 20, an inspection unit 30, a collection unit 40, and a control device 50. The transport unit 10 transports the chip component 100. The supply unit 20 supplies the chip component 100 to the transport unit 10. As the supply unit 20, a hopper, a feeder, and an appropriate electronic component supply device can be used. The inspection unit 30 inspects whether the chip component 100 is good or defective on the transport path of the chip component 100 by the transport unit 10. The inspection unit 30 has terminals for inspecting the electrical characteristics of the chip component 100. The inspection items of the electric characteristics include electric capacity, electric resistance, and the like, and are set according to the type of the chip component. The inspection unit 30 may include an imaging unit for inspecting the appearance of the chip component 100. Inspection items for appearance include the presence or absence of cracks and chips, the presence or absence of scratches, dimensions, and the like.

  The collection unit 40 includes a good product collection box 41A and five defective product collection boxes 41B to 41F. The number of defective product collection boxes is set according to the number of classification items of defective products of the chip component 100. In the present embodiment, since the number of inspection items is five as described above, the number of defective items of the chip component 100 is five. The defective product collection box 41B is a box for collecting the chip component 100 determined to be defective with respect to the electric capacity. The defective product collection box 41C is a box for collecting the chip component 100 determined to be defective in electrical resistance. The defective product collection box 41D is a box for collecting the chip component 100 in which cracks or chips have been detected. The defective product collection box 41E is a box for collecting the chip component 100 in which the flaw is detected. The defective product collection box 41F is a box for collecting chip components 100 having dimensions outside the range of the regulated dimensions. Note that the collection unit 40 may include a plurality of good product collection boxes 41A.

  The control device 50 controls the transport unit 10. The control device 50 collects the chip components 100 corresponding to the non-defective product collection box 41A and the defective product collection boxes 41B to 41F of the collection unit 40 based on the inspection result of the inspection unit 30.

  The transport unit 10 has a transport base 11. The transport base 11 is installed on a floor surface, for example, and extends in the vertical direction. Note that the transport base 11 may extend in a direction inclined with respect to the vertical direction, or may extend in a horizontal direction orthogonal to the vertical direction.

  A disk-shaped transfer support 12 is attached to the front surface of the transfer base 11. On the front surface of the transport support 12, a disk-shaped transport rotor 13 as an example of the transport is disposed. The transport rotor 13 transports the chip component 100. A rotary shaft 14 is attached to the transport rotor 13. The transport rotor 13 rotates integrally with the rotating shaft 14 with respect to the transport support 12. The transport rotor 13 is provided with a plurality of holding portions 15 that can hold the chip components 100 at intervals in the transport direction of the chip components 100 by the transport rotor 13. The holders 15 are arranged at equal angular intervals in the circumferential direction (transport direction) of the transport rotor 13. In FIG. 1, the number of the holding portions 15 is reduced for convenience. The holding unit 15 has a plurality of receiving holes 15a for receiving the chip components 100, which are arranged side by side in a direction intersecting with the transport direction. The plurality of receiving holes 15a of the present embodiment are arranged radially about the center axis C of the rotating shaft 14. It is preferable that the number of the receiving holes 15a in one holding portion 15 is in a range of 2 or more and 30 or less. The number of the accommodation holes 15a in one holding part 15 of the present embodiment is four.

  The transport unit 10 further includes a driving device 16, a holding device 17, and a discharging device 18. The driving device 16, the holding device 17, and the discharging device 18 are controlled by the control device 50. The driving device 16 rotates the rotating shaft 14 in a clockwise direction, for example. The control device 50 causes the driving device 16 to rotate the transport rotor 13 continuously or intermittently. The driving device 16 includes an electric motor and a speed reducer connected to an output shaft of the electric motor. The holding device 17 causes the holding unit 15 of the transport rotor 13 to hold the chip component 100. The holding device 17 includes a suction pump that sucks air, and a pipe that connects the suction pump and the transport support 12. The discharging device 18 discharges the chip component 100 from the holding unit 15. The discharge device 18 includes a fan that discharges air, and a pipe that connects the fan and the transport support 12. In addition, the discharging device 18 may include, instead of the fan and the pipe, an ejector pin for pushing out the chip component 100 from the holding unit 15 and an electric actuator for operating the ejector pin.

  As shown in FIG. 2, the holding portion 15 of the transport rotor 13 has a first suction groove 15b communicating with each accommodation hole 15a. The first suction groove 15b is formed concentrically about the center axis C. The first suction grooves 15b are preferably formed in accordance with the number of the receiving holes 15a in one holding portion 15. The first suction groove 15b communicates with the accommodation hole 15a provided at the same position in the radial direction of the transport rotor 13 in the circumferential direction.

  The transport support 12 has a second suction groove 12a facing the first suction groove 15b and communicating with the first suction groove 15b. The second suction groove 12a is formed concentrically about the center axis C. The second suction grooves 12a are preferably formed according to the number of the first suction grooves 15b. For example, two suction holes 12b are formed at intervals in the circumferential direction per one second suction groove 12a. The two suction holes 12b are connected to piping of the holding device 17 (see FIG. 1). The circumferential positions of the two suction holes 12b may be different for each second suction groove 12a.

  The chip component 100 accommodated in the accommodation hole 15a is an electronic component such as a multilayer ceramic capacitor, a thermistor, and a coil component. As shown in FIG. 3, the chip component 100 of the present embodiment is a multilayer ceramic capacitor in which external electrodes 102 are formed at both ends of a substantially rectangular parallelepiped or substantially cubic base 101, for example. The length L of the chip component 100 is larger than 0.1 mm and smaller than 5 mm (0.1 mm <L <5 mm). The width W of the chip component 100 is larger than 0.05 mm and smaller than 4 mm (0.05 mm <W <4 mm). The thickness t of the chip component 100 is larger than 0.01 mm and smaller than 4 mm (0.01 mm <t <4 mm). As shown in FIG. 2, in the present embodiment, the Wt surface 103 (see FIG. 3) of the chip component 100 is accommodated in the accommodation hole 15a. The opening of the receiving hole 15a is rectangular in plan view, and the length of one side thereof is larger than the width W of the chip component 100 by a range of 0.01 mm or more and 0.5 mm or less, and the length of the other side is Is larger than the thickness t of the chip component 100 by a range of 0.01 mm or more and 0.5 mm or less. The depth of the receiving hole 15a may be shallower or deeper than the length L of the chip component 100, and is in a range of 0.6 times or more and 1.2 times or less of the length L. It is preferable that the distance between adjacent accommodation holes 15a in the plurality of accommodation holes 15a is 0.9 times or more the depth of the accommodation holes 15a. The LW surface 104 or the Lt surface 105 of the chip component 100 may be accommodated in the accommodation hole 15a.

  According to such a configuration of the transport unit 10, when the chip component 100 is housed in each of the housing holes 15a, the suction pump of the holding device 17 (see FIG. 1) is driven, so that the pipe and the second suction groove are formed. The inside of each accommodation hole 15a enters a negative pressure state through 12a and the first suction groove 15b. As a result, a suction force is applied to the chip component 100 toward the first suction groove 15b via each of the receiving holes 15a, so that the chip component 100 is held in each of the receiving holes 15a.

  Further, the transport support 12 has an ejection hole 12c that communicates with the accommodation hole 15a and faces the chip component 100 when the chip component 100 is accommodated in the accommodation hole 15a. It is preferable that the ejection holes 12c are formed in accordance with the number of the accommodation holes 15a. Each ejection hole 12c is connected to a pipe of the discharge device 18 (see FIG. 1). Thus, in a state where the chip component 100 is accommodated in each accommodation hole 15a, the fan of the discharge device 18 is driven, so that compressed air is jetted toward the chip component 100 through the pipe and the ejection hole 12c. As a result, the chip component 100 is ejected from the accommodation hole 15a. The discharge device 18 can individually control the supply of compressed air to each ejection hole 12c. For this reason, the discharging device 18 discharges the chip component 100 from each of the receiving holes 15a by ejecting compressed air toward each of the receiving holes 15a.

  The outline of the operation of the chip component transport device 1 will be described with reference to FIG. In FIG. 4, for convenience of description, only one of the plurality of holding portions 15 is illustrated as three receiving holes 15 a in an enlarged manner, and illustration of the other holding portions 15 is omitted. .

  As shown in FIG. 4A, when the transport rotor 13 rotates clockwise and the receiving hole 15 a of the holding unit 15 moves to a position facing the supply unit 20, the transport rotor 13 is temporarily stopped and the supply is stopped. The chip component 100 is supplied from the unit 20 to the accommodation hole 15a. After the chip component 100 is supplied to the receiving hole 15a, the transport rotor 13 rotates clockwise again.

  As shown in FIG. 4B, when the chip component 100 accommodated in the accommodation hole 15 a moves to a position facing the inspection unit 30, the transport rotor 13 is temporarily stopped, and the inspection unit 30 controls the electric power of the chip component 100. Characteristics and the like are inspected. In the inspection unit 30, the control device 50 classifies the chip component 100 into non-defective products and defective products, and classifies the defective products into defective items. After the inspection of the chip component 100 is completed, the transport rotor 13 rotates clockwise again.

  As shown in FIG. 4C, when the chip component 100 accommodated in the accommodation hole 15 a moves to a position facing the collection unit 40, the control device 50 controls the ejection device 18 based on the inspection result of the inspection unit 30. Thereby, the chip component 100 is collected in the corresponding non-defective product collection box 41A or defective product collection boxes 41B to 41F. More specifically, when the transport rotor 13 is rotated to a position corresponding to the defective product collection box 41B, the control device 50 determines that there is a chip component 100 (defective product) determined to be defective with respect to the electric capacity. The defective chip component 100 is discharged to the defective product collection box 41B by the discharge device 18. On the other hand, when there is no defective product, the discharging device 18 does not operate, and the chip component 100 is not discharged. The control device 50 similarly discharges the chip component 100 to the defective product collection boxes 41C to 41F by the discharge device 18 when there is a corresponding defective product in the defective product collection boxes 41C to 41F. When the transport rotor 13 is rotated to a position corresponding to the non-defective product collection box 41A, if there is a non-defective chip component 100 for all the inspection items, the control device 50 discharges the non-defective product. By 18, it is discharged from the transport rotor 13 (holding unit 15) to the good product collection box 41 </ b> A. On the other hand, when there is no non-defective product, the discharging device 18 does not operate, and the chip component 100 is not discharged from the transport rotor 13 (the holding unit 15). The transport rotor 13 may maintain the clockwise rotation when the chip component 100 is supplied from the supply unit 20 to the receiving hole 15a and when the chip unit 100 is inspected by the inspection unit 30. .

Next, a detailed configuration of the collection unit 40 will be described with reference to FIGS. In FIGS. 5 and 8, the transport rotor 13 is shown in a simplified manner for convenience of description.
As shown in FIG. 5, the collection unit 40 is close to and faces the front surface 13a of the transport rotor 13. The collection unit 40 includes a box holder 70 that detachably holds the non-defective item collection box 41A and the five defective item collection boxes 41B to 41F, a turning mechanism 42 that turns the box holder 70, and a turning operation of the box holder 70. And a turning restriction mechanism 43 for restricting the rotation. The collection unit 40 is placed on a support base 44.

  The good product collection box 41A and the defective product collection boxes 41B to 41F have the same structure. Each of the collection boxes 41A to 41F is provided corresponding to one holding unit 15 (see FIG. 1). That is, each of the collection boxes 41A to 41F is disposed so as to face the plurality of accommodation holes 15a of the holding unit 15. In the present embodiment, although not shown, the collection boxes 41A to 41F are arranged at the same pitch interval as the arrangement pitch of the holding units 15. The collection boxes 41 </ b> A to 41 </ b> F are arranged in the transport direction of the transport unit 10, that is, in the rotation direction of the transport rotor 13. The non-defective product collection box 41A is disposed downstream of the defective product collection boxes 41B to 41F in the transport direction. Note that the collection boxes 41A to 41F may be arranged at a pitch interval that is an integral multiple of the arrangement pitch of the holding units 15. When the collection unit 40 includes a plurality of non-defective product collection boxes 41A, the plurality of non-defective product collection boxes 41A are disposed so as to face the plurality of storage holes 15a of the plurality of holding units 15, respectively.

  As shown in FIG. 6, the non-defective product collection box 41A includes a box body 60 capable of storing the chip component 100 (see FIG. 3), and a lid 64 covering one end of the box body 60. The box main body 60 has a substantially rectangular shape in a side view. The box main body 60 includes a storage section 61, a collection section 62, and a grip section 63. The storage section 61 has a space in which the chip component 100 discharged from the transport rotor 13 can be stored. The end of the housing portion 61 on the side of the lid 64 is open. The collection unit 62 has a first opening 62a that is opened so that the housing 61 and the outside communicate with each other in order to house the chip component 100 in the housing 61. The first opening 62 a is open so as to be continuous with the opening on the lid 64 side of the housing 61. The collecting portion 62 is provided at one end of the box body 60 in the longitudinal direction, and on the lid 64 side in a direction orthogonal to the longitudinal direction when the box body 60 is viewed from the side. The collection part 62 has a protruding wall 62b that protrudes from the storage part 61 and has a first opening 62a formed therein. The holding portion 63 is provided at an end of the housing portion 61 on the opposite side to the collection portion 62 in the longitudinal direction of the box main body 60. A conductive alumite treatment is applied to the surface of the side wall of the box main body 60 where the collection unit 62 is provided. This suppresses the charging of the side wall of the box main body 60 where the collection unit 62 is provided, so that the box main body 60 is prevented from sticking to the box holder 70 due to static electricity.

  The cover 64 extends in the longitudinal direction of the box main body 60 so as to cover the opening of the first opening 62 a on the side of the cover 64 and the opening of the housing portion 61. The end wall 64a of the lid 64 covers the first opening 62a. The end wall 64a has a second opening 64b formed in a curved shape so as to be away from the first opening 62a. The first opening 62a and the second opening 64b form a collecting port 65 for collecting the chip component 100 into the housing 61.

  The good product collection box 41A has an exhaust port 66 for discharging the air in the housing 61 without discharging the chip component 100 in the housing 61. The exhaust port 66 is provided at a position not facing the collection port 65 in the good product collection box 41A. Specifically, the exhaust port 66 is provided at the upper end in the vertical direction in the non-defective product collection box 41A. More specifically, the exhaust port 66 is provided in a portion of the lid 64 corresponding to the opening of the housing 61. The exhaust port 66 is formed by a plurality of minute holes that permit the flow of air between the inside and the outside of the housing portion 61 but do not permit the flow of the chip component 100. Note that a plurality of exhaust ports 66 may be provided in the lid 64. Further, the shape of the exhaust port 66 in plan view can be arbitrarily changed. Further, a plurality of holes of the exhaust port 66 may be formed in a mesh shape.

  As shown in FIG. 5, the box holder 70 includes a holding plate 71 and a support plate 72. The holding plate 71 holds the collection boxes 41A to 41F. The holding plate 71 faces the front surface 13a of the transport rotor 13 and is parallel to the front surface 13a. That is, the holding plate 71 extends in the vertical direction. The support plate 72 is fixed to the holding plate 71 with bolts. The support plate 72 supports the holding plate 71. The support plate 72 has a horizontal portion 72a extending from the lower end of the holding plate 71 in a horizontal direction orthogonal to the vertical direction. A lever 72b is fixed to the horizontal portion 72a with a bolt.

  The holding plate 71 is provided with six box support portions 73 for supporting the respective collection boxes 41A to 41F. The box support portions 73 are attached to the holding plate 71 at positions corresponding to the collection boxes 41A to 41F, respectively. Each of the collection boxes 41A to 41F is held by the holding plate 71 by being sandwiched between the plunger 74 (see FIG. 6) and the box support portion 73. As shown in FIG. 6, the plunger 74 is attached to an attachment portion 75 attached to the holding plate 71. The box support portion 73 is provided with guide walls 73a for guiding both sides of the collection boxes 41A to 41F in the transport direction.

  As shown in FIG. 7, the holding plate 71 has six insertion holes 71a. The six insertion holes 71a are formed so as to be at equal pitches around the center axis C of the transport rotor 13 (see FIG. 1). The pitch of the six insertion holes 71a is equal to the arrangement pitch of the holding portions 15 of the transport rotor 13. The insertion hole 71a extends radially around the center axis C.

  As shown in FIG. 5, the turning mechanism 42 includes a column 76 and a turning portion 77. The support 76 is provided upright on the right end of the support base 44. The turning portion 77 is attached to the right end of the holding plate 71, and is attached to the column 76 so as to be able to turn around the turning axis R. Thereby, the box holder 70 can be turned around the turning axis R. When the operator operates the lever 72b, the turning mechanism 42 changes the position of the box holder 70 between the collection position shown in FIG. 5 and the removal position shown in FIG. The operator loosens the plunger 74 (see FIG. 6) at the removal position and removes each of the collection boxes 41A to 41F from the box holder 70. At this time, since the operator takes out the collection boxes 41A to 41F from the box holder 70 by holding the grip 63, it is easy to take out the collection boxes 41A to 41F.

  As shown in FIG. 5, the turning control mechanism 43 includes a control plate 78 and a holding portion 79. The regulating plate 78 is provided upright on the left end of the support base 44. The holding portion 79 is attached to the regulating plate 78, and sandwiches the left end of the holding plate 71 with the regulating plate 78. When the box holding member 70 is at the collecting position, the turning restricting mechanism 43 restricts the box holding member 70 from moving from the collecting position by sandwiching the left end of the holding plate 71 with the restricting plate 78 and the holding portion 79.

  As shown in FIG. 9, the non-defective product collection box 41A is inserted into the box support portion 73. At this time, since the non-defective product collection box 41A is guided by the pair of guide walls 73a of the box support portion 73, it is positioned with respect to the holding plate 71 in the conveyance direction of the conveyance rotor 13 (see FIG. 8). Thus, when the good product collection box 41A comes into contact with the holding plate 71, the protruding wall 62b of the good product collection box 41A is accurately inserted into the insertion hole 71a of the holding plate 71 (see FIG. 7). With the protruding wall 62b inserted into the insertion hole 71a, the plunger 74 (see FIG. 6) attached to the attachment portion 75 is tightened, so that the plunger 74 presses the lid 64. Thereby, the good product collection box 41A is sandwiched between the box support portion 73 and the plunger 74. Note that the defective product collection boxes 41B to 41F are also attached to the box holding body 70 by the box support portion 73 and the plunger 74 similarly to the good product collection box 41A.

  As shown in FIG. 10, when the box holder 70 is at the collection position, the holding plate 71 and the transport rotor 13 face each other with a slight gap. For this reason, in a state where the good product collection box 41A is attached to the box holder 70, the collection port 65 of the good product collection box 41A faces the transport rotor 13 with a slight gap. In other words, no other member is interposed between the plurality of holding portions 15 of the transport rotor 13 and the collection port 65 of the good product collection box 41A in the horizontal direction. The distance between the front surface 13a of the transport rotor 13 and the collection port 65 is preferably 0.5 mm or more and 30 mm or less.

  The size of the recovery port 65 is preferably larger than the size of the accommodation hole 15a. More specifically, the size of the recovery port 65 extends toward the edge of the recovery port 65 at an inclination angle of 45 ° or more and less than 90 ° from the edge of the storage hole 15a in a state facing the storage hole 15a. It is preferably within the range of the line segment. Thus, the recovery port 65 may be formed across a plurality (two or more) of the receiving holes 15a. In the present embodiment, as shown in FIG. 10, the collection port 65 is formed across the four accommodation holes 15a. The edge of the recovery port 65 extends from the radial ends of the storage holes 15a at both ends of the four storage holes 15a of one holding portion 15 in the radial direction of the transport rotor 13 toward the recovery port 65. It is preferable that the distance be within a range of 45 ° or more and less than 90 ° with respect to the center axis C.

  When the transport rotor 13 is temporarily stopped, the receiving hole 65a of the non-defective product collection box 41A faces the collection hole 65 of the non-defective product collection box 41A. It is stored in the storage section 61 through the recovery port 65. That is, the recovery port 65 directly recovers the chip component 100 discharged from the storage hole 15a by the discharge device 18. At this time, the compressed air ejected from the discharge device 18 also flows into the housing 61, while the air in the housing 61 flows out of the housing 61 through the exhaust port 66. In addition, also about the defective product collection boxes 41B to 41F, similarly to the non-defective product collection box 41A, when the transport rotor 13 is temporarily stopped, the accommodation hole 15a and each of the collection ports 65 of the defective product collection boxes 41B to 41F face each other. The chip components 100 are directly collected from the transport rotor 13 through the respective collection ports 65.

As described above, according to the present embodiment, the following effects can be obtained.
(1-1) The chip component 100 discharged from the holding unit 15 is directly collected in the non-defective product collection box 41A and the defective product collection boxes 41B to 41F. That is, when the collection ports 65 of the non-defective product collection box 41A and the defective product collection boxes 41B to 41F face the holding unit 15, the collection ports 65 and the holding unit 15 are close to each other, and in the discharge path of the chip component 100, No other member exists between each collection port 65 and the holding unit 15. This eliminates the need for a hose that connects each of the collection boxes 41A to 41F and the holding unit 15, and thus suppresses an increase in operation time due to the hose cleaning operation. In addition, it is possible to prevent the chip components 100 and other types of chip components from being mixed between different lots due to the chip components 100 remaining in the hose.

(1-2) When chip components are collected in a collection box via a hose, the chip parts are displaced due to variations in dimensions and positions of the receiving holes of the transfer rotor, and positional deviations of the receiving holes due to thermal expansion of the transfer rotor. In addition, the hose and the housing hole do not accurately face each other, and the chip components discharged from the housing hole cannot pass through the inside of the hose, which may cause a collection error.
In this regard, in the present embodiment, the size of the recovery port 65 is, when viewed from the transport direction of the transport rotor 13, a center that is 45 ° or more and less than 90 ° from the edge of the storage hole 15 a in a state facing the storage hole 15 a. Since it is within the range of the line segment extending at an inclination angle with respect to the axis C, the chip component 100 discharged from the holding unit 15 is easily discharged into the collection port 65 and is easily stored in the storage unit 61. Therefore, it is possible to suppress the chip components 100 discharged from the holding unit 15 from being discharged to the outside of the collection boxes 41A to 41F.

  In addition, a line segment in which the edge of the recovery port 65 extends from the radial ends of the storage holes 15a at both ends toward the recovery port 65 in the radial direction of the transport rotor 13 among the plurality of storage holes 15a corresponds to the central axis C. On the other hand, since the chip component 100 is located in a range of 45 ° or more and less than 90 °, the chip component 100 discharged from the plurality of accommodation holes 15a is easily discharged into the collection port 65. Therefore, it is possible to further suppress the chip components 100 discharged from the storage holes 15a from being discharged to the outside of the collection boxes 41A to 41F.

  (1-3) Since the collection port 65 of each of the collection boxes 41A to 41F is formed across the plurality of storage holes 15a, the chip component 100 discharged from the storage hole 15a is collected by each of the collection boxes 41A to 41F. Through 65, it becomes easy to be collected in each of the collection boxes 41A to 41F. Therefore, it is possible to suppress the chip components 100 discharged from the storage holes 15a from being discharged to the outside of each of the collection boxes 41A to 41F.

  (1-4) Since each of the collection boxes 41A to 41F is provided with an exhaust port 66 for discharging the air in each of the collection boxes 41A to 41F without discharging the chip component 100, the collection boxes 41A to 41F are accommodated. It is possible to suppress the pressure inside the portion 61 from becoming excessively high. Therefore, the chip components 100 can easily enter the collection boxes 41A to 41F.

  (1-5) Since the exhaust port 66 is provided at a location that does not face the collection port 65, the accumulation of the chip components 100 in the exhaust port 66 can be suppressed. Therefore, it is possible to prevent the flow of the air from the exhaust port 66 to the outside of the housing portion 61 due to the accumulation of the chip components 100 in the exhaust port 66. Therefore, it is possible to suppress the pressure inside the storage portion 61 of each of the collection boxes 41A to 41F from becoming excessively high, and it becomes easy for the chip component 100 to enter the collection boxes 41A to 41F.

  (1-6) The chip components 100 collected in each of the collection boxes 41A to 41F are deposited on the bottom of the housing portion 61 by gravity. Therefore, in a state where each of the collection boxes 41A to 41F is attached to the box holder 70, the exhaust port 66 is provided so as to be the upper end in the vertical direction of each of the collection boxes 41A to 41F. Buried by the chip component 100 can be further suppressed. Therefore, it is possible to further suppress the flow of the air from the exhaust port 66 to the outside of the housing portion 61 by the chip component 100.

  (1-7) Since the recovery boxes 41A to 41F are arranged in the transport direction of the transport rotor 13, the chip components 100 can be recovered without excessively reducing the size of the recovery boxes 41A to 41F. Each of the collection boxes 41A to 41F can be arranged. Therefore, the number of chip components 100 in a lot can be increased.

  (1-8) Since the non-defective product collection box 41A is located on the downstream side of the non-defective product collection boxes 41B to 41F in the conveyance direction of the conveyance rotor 13, the chips of the non-defective product until the holding unit 15 faces the non-defective product collection box 41A. The component 100 is collected in the defective product collection boxes 41B to 41F. Therefore, it is possible to suppress the defective chip component 100 from being mixed into the non-defective product collection box 41A.

  (1-9) Since the collection unit 40 includes the turning mechanism 42 that changes the position of the box holder 70 between the collection position shown in FIG. 5 and the take-out position shown in FIG. 8, the operator can collect the collection boxes 41A to 41F. Can be removed from the box holder 70 after the box holder 70 is located at a position where it can be easily removed from the box holder 70.

  (1-10) Since the collection unit 40 includes the rotation restricting mechanism 43 for restricting the movement of the box holder 70 from the collection position, the positions of the collection boxes 41A to 41F with respect to the transport rotor 13 can be accurately positioned.

(2nd Embodiment)
A second embodiment of the chip component transport device 1 will be described with reference to FIGS. The chip component transport device 1 of the present embodiment is different from the chip component transport device 1 of the first embodiment in the mounting structure of the box holder 70 and the collection boxes 41A to 41F. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate. Also, the description of the relationship between the same components will be omitted as appropriate.

  As shown in FIG. 11, the collection unit 40 includes an attachment restricting portion 45 that allows the non-defective product collection box 41A to be attached to the holding plate 71 of the box holder 70 only at a predetermined position. The attachment restricting portion 45 has a plurality of protrusions 45a and a plurality of fitting holes 45b. The plurality of projections 45a are provided at portions of the box main body 60 of the non-defective product collection box 41A that come into contact with the holding plate 71. The plurality of fitting holes 45b are provided in portions of the holding plate 71 that come into contact with the box main body 60. As shown in FIG. 12, the collection unit 40 has a plurality of protrusions 45a and a plurality of fitting holes 45b in the defective product collection boxes 41B to 41F, as in the non-defective product collection box 41A. In the present embodiment, two projections 45a are provided on the box body 60 of each of the good product collection box 41A and the defective product collection boxes 41B to 41F. The distance P1 between the two protrusions 45a of the good product collection box 41A, the distance P2 between the two protrusions 45a of the bad product collection box 41B, the distance P3 between the two protrusions 45a of the bad product collection box 41C, and the distance P1 of the bad product collection box 41D. The distance P4 between the two projections 45a, the distance P5 between the two projections 45a of the defective product collection box 41E, and the distance between the two projections 45a of the defective product collection box 41F are different from each other. A distance H1 between the fitting holes 45b corresponding to the non-defective product collection box 41A, a distance H2 between the fitting holes 45b corresponding to the defective product collection box 41B, a distance H3 between the fitting holes 45b corresponding to the defective product collection box 41C, Distance H4 between fitting holes 45b corresponding to defective product collection box 41D, distance H5 between fitting holes 45b corresponding to defective product collection box 41E, and distance H6 between fitting holes 45b corresponding to defective product collection box 41F. Are different from each other. Distance H1 is equal to distance P1, distance H2 is equal to distance P2, distance H3 is equal to distance P3, distance H4 is equal to distance P4, distance H5 is equal to distance P5, and distance H6 is equal to distance P6.

  According to such a configuration, for example, when the non-defective product collection box 41A is mounted at a position where the non-defective product collection box 41B is mounted, the distance P1 between the two protrusions 45a of the non-defective product collection box 41A is set between the two fitting holes 45b. Since it is different from the distance H2, the two protrusions 45a are not inserted into the two fitting holes 45b. For this reason, the non-defective product collection box 41A cannot be mounted at a position other than the preset position on the box holder 70. Thereby, the worker can recognize that the mounting position of the non-defective product collection box 41A is different. Similarly, the defective product collection boxes 41B to 41F cannot be mounted at positions other than the preset positions on the box holder 70.

  The number of the projections 45a and the number of the fitting holes 45b can be arbitrarily changed. For example, each of the protrusion 45a and the fitting hole 45b may be one. Further, the protrusion 45a may be provided on the holding plate 71, and the fitting hole 45b may be provided on the non-defective product collection box 41A and the defective product collection boxes 41B to 41F. The position of the projection 45a and the position of the fitting hole 45b can be arbitrarily changed. In short, it is only necessary that the collection boxes 41A to 41F have a relationship between the projection 45a and the fitting hole 45b that can be attached to the box holder 70 (holding plate 71) only at a preset position. .

As described above, according to the present embodiment, the following effects are obtained in addition to the same effects as those of the first embodiment.
(2-1) Since the collection boxes 41A to 41F are attached to the box holder 70 only at predetermined positions by the attachment restricting portion 45, the non-defective product collection box 41A is a good chip component even if the lot is different. 100, and the defective product collection boxes 41B to 41F are dedicated collection boxes for collecting the chip components 100 for each defective item. Therefore, even if the chip components 100 remain in the respective collection boxes 41A to 41F in the previous lot, it is possible to suppress the chip components 100 having different inspection results from being mixed into the respective collection boxes 41A to 41F.

(Third embodiment)
A third embodiment of the chip component transport device 1 will be described with reference to FIG. The chip component transport device 1 of the present embodiment is different from the chip component transport device 1 of the first embodiment in that a mechanism for suppressing the collection of defective chip components 100 in the non-defective product collection box 41A is added. different. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate. Also, the description of the relationship between the same components will be omitted as appropriate. For convenience of explanation, FIG. 13 (a) shows only one holding part 15, and FIG. 13 (b) omits the chip component 100 held by the holding part 15 in FIG. 13 (a). I have.

  As shown in FIG. 13A, a gap is formed between the non-defective product collection box 41A and the defective product collection box 41F in the conveyance direction of the conveyance rotor 13. In a portion of the holding plate 71 corresponding to the portion between the non-defective product collection box 41A and the defective product collection box 41F, a through hole 71b extending radially about the central axis C is formed.

  The chip component transport device 1 includes a detection unit 80 that detects a defective chip component 100 between the non-defective product recovery box 41A and the defective product recovery box 41F in the transport direction of the transport rotor 13. The detection unit 80 is, for example, a transmission type fiber sensor or a laser sensor. As shown in FIG. 13B, the detection unit 80 includes a plurality of light emitting units 81 and a plurality of light receiving units 82. The plurality of light emitting units 81 are arranged on the opposite side (left side in the figure) of the transport rotor 13 from the collection unit 40. The plurality of light receiving sections 82 are arranged on the collection unit 40 side (right side in the drawing) with respect to the transport rotor 13. Each of the light emitting unit 81 and the light receiving unit 82 of the present embodiment is four. The light emitting unit 81 and the light receiving unit 82 are arranged at the same position as the accommodation hole 15 a in the radial direction of the transport rotor 13. The light emitting section 81 is mounted on the board 83. The substrate 83 is attached to, for example, the transport base 11. The light receiving section 82 is mounted on a substrate 84. The light receiving unit 82 and the substrate 84 are housed in a case 85. The case 85 is attached to the holding plate 71.

  Note that the detection unit 80 may use an inductive proximity sensor instead of a photoelectric sensor such as a fiber sensor or a laser sensor. The light emitting unit 81 and the light receiving unit 82 can be changed according to the number of the holding units 15 of the transport rotor 13. Further, the light emitting unit 81 may be arranged on the collection unit 40 side with respect to the transport rotor 13, and the light receiving unit 82 may be arranged on the opposite side of the collection unit 40 with respect to the transport rotor 13.

  The light emitting unit 81 and the light receiving unit 82 are electrically connected to the control device 50 through the boards 83 and 84. The control device 50 causes the light emitting unit 81 to emit light when the accommodation hole 15 a of the transport rotor 13 is located at the same position as the light emitting unit 81 in the transport direction of the transport rotor 13. The light receiving unit 82 transmits a reception signal to the control device 50 when receiving the light of the light emitting unit 81. Control device 50 determines whether or not chip component 100 is accommodated in accommodation hole 15a based on the received signal. More specifically, control device 50 determines that chip component 100 is accommodated in accommodation hole 15a corresponding to light receiving portion 82 that does not receive a reception signal. When the control device 50 determines that the chip component 100 is housed in the housing hole 15a, the electric motor of the driving device 16 is stopped, and the defective chip component 100 housed in the housing hole 15a is collected as a good product. It should not be opposed to the collection port 65 of the box 41A.

  The chip component 100 determined to be defective in each inspection item, when the receiving hole 15a holding the chip component 100 faces the defective product collection boxes 41B to 41F corresponding to the inspection item (defective classification item), It is collected by the discharge device 18 into the defective product collection boxes 41B to 41F. However, there is a case where the chip component 100 remains in the receiving hole 15a due to some state (for example, a nozzle that injects compressed air does not operate). When the receiving hole 15a in which the defective chip component 100 remains thus faces the recovery port of the good product recovery box 41A, the remaining chip component 100 may fall into the good product recovery box 41A. Therefore, by stopping the chip component transport device 1, the defective chip component 100 does not fall into the non-defective product collection box 41A.

  When the control device 50 determines that the chip component 100 is housed in the housing hole 15a, it stops the ejection of the compressed air by the discharging device 18 so that the chip component 100 is not discharged from the housing hole 15a. Is also good.

As described above, according to the present embodiment, the following effects are obtained in addition to the same effects as those of the first embodiment.
(3-1) Detecting that the defective chip component 100 remains in the holding unit 15 by the detection unit 80 disposed between the defective product collection box 41D and the good product collection box 41A in the transport direction of the transport rotor 13. By stopping the chip component transport device 1 at that time, it is possible to prevent the defective chip component 100 from being collected in the non-defective product collection box 41A.

(Modification)
The description of each of the above embodiments is an example of a form that the chip component transport device of the present invention can take, and is not intended to limit the form. The chip component transporting apparatus of the present invention can take a form in which, for example, a modification of each of the above-described embodiments described below and at least two modifications that do not contradict each other are combined.

The detection unit 80 of the chip component transport device 1 of the third embodiment can be added to the chip component transport device 1 of the second embodiment.
In the second embodiment, at least one of the collection boxes 41 </ b> A to 41 </ b> F and the holding plate 71 of the attachment restricting portion 45 may be provided with a hole for attaching a screw or a pin constituting the protrusion 45 a.

  In the second embodiment, the attachment restricting portion 45 may be provided only in the non-defective product collection box 41A and the holding plate 71 where the non-defective product collection box 41A is mounted. In this case, at least the non-defective product collection box 41A can be attached to the box holder 70 at a preset position.

  In the above-described second embodiment, the collection unit 40 is replaced by the control device 50 when the non-defective product collection box 41A is attached to the transport rotor 13 at a position other than the predetermined position, instead of the attachment regulating portion 45. Control may be performed so that the operation of the chip component transport device 1 is not started. Further, the control device 50 controls the chip component transfer device 1 so that the operation of the chip component transfer device 1 does not start when at least one of the defective product collection boxes 41B to 41F is attached to a position other than the predetermined position with respect to the transfer rotor 13. May be.

  As an example of the configuration controlled by the control device 50 in this way, as shown in FIG. 14, position detection for detecting whether or not the non-defective product collection box 41A and the defective product collection boxes 41B to 41F are mounted at predetermined positions. A part 46 is provided. Six position detectors 46 are provided corresponding to the respective collection boxes 41A to 41F. The position detection unit 46 includes, for example, an IC tag 46a attached to the box main body 60 and a reading unit 46b attached to the box holder 70. When the protruding wall 62b of each of the collection boxes 41A to 41F is inserted into the insertion hole 71a of the holding plate 71, the reading unit 46b has a positional relationship in which the identification information of the IC tag 46a can be read. The IC tag 46a includes information for identifying each of the collection boxes 41A to 41F. The reading unit 46b is electrically connected to the control device 50 and outputs the read information to the control device 50. The control device 50 determines whether or not the non-defective product collection box 41A and the defective product collection boxes 41B to 41F are at preset positions based on the information read by the reading unit 46b. The control device 50 prohibits the driving device 16 from driving when at least one of the non-defective product collection box 41A and the defective product collection boxes 41B to 41F is different from the preset position. Then, the control device 50 prohibits the driving of the driving device 16 until, for example, all of the good product collection box 41A and the defective product collection boxes 41B to 41F reach the preset positions. Note that the position detection unit 46 may have a barcode instead of the IC tag 46a. In short, the position detection unit 46 only needs to be configured to be able to read the identification information of each of the collection boxes 41A to 41F.

  According to the configuration shown in FIG. 14, when the non-defective product collection box 41A is arranged at any position of the defective product collection boxes 41B to 41F, the operation of the chip component transport device 1 is stopped. The collection of the defective chip component 100 (see FIG. 3) is suppressed. Therefore, it is possible to suppress mixing of non-defective and defective chip components 100. If any of the defective product collection boxes 41B to 41F is arranged at a position different from the predetermined position, the operation of the chip component transport device 1 is stopped. The entry of the chip component 100 of the item can be suppressed.

  The chip component transport device 1 including the collection unit 40 according to the modified example of FIG. 14 may further include a notification unit 90 as illustrated in FIG. The notification unit 90 includes an audio device such as a buzzer or a display unit. The notification unit 90 is electrically connected to the control device 50. When at least one of the non-defective product collection box 41A and the defective product collection boxes 41B to 41F is different from the preset position, the control unit 50 notifies the worker of the non-defective product collection box 41A and the defective product collection boxes 41B to 41F by the notification unit 90. Is notified by voice or displaying an error message on a display unit that at least one of the positions is different from the preset position. The control device 50 may also prohibit the driving of the driving device 16 (see FIG. 14) in conjunction with the notification to the worker by the notification unit 90.

  According to the configuration illustrated in FIG. 15, when the non-defective product collection box 41 </ b> A is arranged at any one of the defective product collection boxes 41 </ b> B to 41 </ b> F, the notification unit 90 informs the operator of the position of the non-defective product collection box 41 </ b> A. Therefore, the possibility that the defective chip component 100 (see FIG. 3) is collected in the non-defective product collection box 41A can be reduced. When any of the defective product collection boxes 41B to 41F is disposed at a position different from the predetermined position, the notification unit 90 notifies the operator that the position of the defective product collection box is incorrect. Therefore, it is possible to reduce the possibility that the chip components 100 having different defective items are collected in the defective product collection boxes 41B to 41F.

  In the chip component conveying device 1 of the modified example shown in FIGS. 14 and 15, the position detecting section 46 may be provided only at a position corresponding to the non-defective product collection box 41A in the non-defective product collection box 41A and the holding plate 71. In this case, the control device 50 does not start the operation of the chip component transport device 1 when the non-defective product collection box 41A is disposed at a position other than the predetermined position with respect to the box holder 70. Alternatively, when the non-defective product collection box 41A is arranged at a position other than the predetermined position with respect to the box holder 70, the control device 50 notifies the worker by the notification unit 90.

  In the above embodiments, the configuration of the transport unit 10 may be changed to the following configurations (A) to (C). Although FIGS. 16 to 18 show two defective product collection boxes 41B and 41C for convenience of description, the type and number of the defective product collection boxes can be arbitrarily changed.

  (A) As shown in FIG. 16, the transport unit 10A includes a first roller 91, a second roller 92, and an endless transport belt 93 that is an example of a transport body. The first roller 91 is a driving roller connected to the driving device 16, and the second roller 92 is a driven roller that rotates following the first roller 91. The transport belt 93 has a holding unit 15. When the first roller 91 is rotated by the driving device 16, the transport belt 93 is rotated, for example, in the direction of a white arrow. The non-defective product collection box 41A and the defective product collection boxes 41B and 41C are arranged so as to be able to face the holding unit 15 at predetermined positions on the conveyance path of the conveyance belt 93.

  (B) As shown in FIG. 17, the transport unit 10B includes a roller 94 which is an example of a transport body. The roller 94 is connected to the driving device 16. The roller 94 has the holding unit 15. The good product collection box 41A and the defective product collection boxes 41B and 41C are arranged so as to be able to face the holding portion 15 of the roller 94 in the radial direction of the roller 94.

  (C) As illustrated in FIG. 18, the transfer unit 10C includes a transfer table 95 that is an example of a transfer body. The carriage 95 is connected to a driving device 96. The driving device 96 has an electric motor and a conversion mechanism that is connected to the output shaft of the electric motor and converts the rotation of the output shaft into a reciprocating motion along the axial direction. The transfer table 95 is attached to the conversion mechanism. Thus, the transfer table 95 can be moved in the direction of the white arrow in FIG. The transfer table 95 has a holding unit 15. The non-defective product collection box 41A and the defective product collection boxes 41B and 41C are arranged so as to be able to face the holding unit 15 on the conveyance path of the conveyance table 95.

  In the above embodiments, the size and number of the collection ports 65 of the collection boxes 41A to 41F can be arbitrarily changed. For example, the recovery ports 65 may be provided in accordance with the number of the receiving holes 15a (both refer to FIG. 1) of one holding unit 15. In this case, the size of the recovery port 65 is a line extending from the edge of the storage hole 15a at an angle of 45 ° or more and less than 90 ° from the edge of the storage hole 15a in a state where the recovery port 65 is viewed from the transfer direction of the transfer rotor 13. Minutes. Further, the recovery port 65 may be formed across two to five receiving holes 15 a in one holding part 15. In short, the collection port 65 may be formed across a plurality of storage holes 15a in one holding unit 15.

  In the above embodiments, the transport rotor 13 is a disk having a uniform thickness, but the shape of the transport rotor 13 is not limited to this. For example, the transport rotor 13 may be formed so that a portion radially outside the accommodation hole 15a at the outermost position is thicker than other portions.

  In each of the above embodiments, at least one of the defective product collection boxes 41B to 41F may be configured to collect the chip component 100 via a hose corresponding to each of the storage holes 15a. According to this configuration, at least for the non-defective product collection box 41A, the cleaning of the hose can be omitted, and the mixing of chip components between different lots can be suppressed.

  In each of the above embodiments, the collection port 65 of the non-defective product collection box 41A may face the plurality of storage holes 15a of the plurality of holding units 15. For example, the collection port 65 of the non-defective product collection box 41A may have such a size as to face all four accommodation holes 15a of the two holding portions 15 adjacent to each other in the transport direction.

  DESCRIPTION OF SYMBOLS 1 ... Chip component conveyance apparatus, 13 ... Conveyance rotor (conveyance body), 15 ... Holding part, 15a ... Accommodation hole, 18 ... Ejection device, 30 ... Inspection part, 41A ... Good goods collection box, 41B-41F ... Defective goods collection box Reference numerals 45, mounting control unit 50 control device 65 collection port 66 exhaust port 70 box holder 80 detection unit 90 notification unit 100 chip component.

Claims (10)

A carrier for transporting chip components;
An inspection unit that inspects whether the chip component transported by the transport body is a good product or a defective product;
A discharge device configured to discharge the non-defective chip components from the carrier based on a test result of the test unit;
A non-defective product collection box for retrieving the non-defective chip components discharged from the carrier by the discharge device based on a test result of the test unit;
A box holder for detachably holding the good product collection box,
With
The carrier is disposed along a transport direction of the chip component, and has a plurality of holding units capable of holding the chip component,
Each of the plurality of holding units is arranged side by side along a direction intersecting with the transport direction, and has a plurality of accommodation holes for accommodating the chip component,
The ejection device ejects the chip component from the accommodation hole by ejecting compressed air toward each of the plurality of accommodation holes,
The non-defective product recovery box has a recovery port facing the plurality of storage holes of at least one of the plurality of storage sections, and the recovery port faces the plurality of storage holes and discharges the storage section. Directly collecting the non-defective chip components discharged from the accommodation hole by the device ,
The good recovery box, the chip component is a chip component transfer device for perforated exhaust port is a plurality of microvoids to exhaust the air in the good collection box without discharge. The chip component transport device according to claim 1 , wherein the collection port is formed across the plurality of storage holes. 3. The chip component transport device according to claim 1, wherein the exhaust port is provided in a portion of the non-defective product collection box that does not face the collection port. The chip component transport device according to claim 3 , wherein the exhaust port is provided at an upper end portion in the vertical direction in the good product collection box. A defective product collection box disposed to correspond to one of the holding units and configured to collect the defective chip components discharged from the accommodation hole by the discharge device based on an inspection result of the inspection unit;
The defective product collection box has a recovery port facing the storage hole and directly recovering the defective chip component discharged from the storage hole by the discharge device,
The good recovery box and the defective collection boxes, chip parts conveying apparatus according to any one of claim 1 to 4 are arranged in the transport direction. The chip component transport device according to claim 5 , wherein the non-defective product recovery box is located downstream of the defective product recovery box in the transport direction. Wherein the good collection box and the box holding member, claim 1-6, wherein the non-defective recovering box can be installed only in a predetermined position of the mounting restricting portion is provided for the box holder The chip component transport device according to claim 1. A control device that controls the operation of the chip component transport device,
Wherein the control device, any one of claims 1-7, wherein not start the operation of the chip component conveying device when the good recovery box to the box holder is placed in a position other than the position determined in advance Item 3. The chip component transport device according to item 1. The chip component transport device according to any one of claims 1 to 8 , further comprising a notification unit that notifies when the non-defective product collection box is disposed at a position other than a predetermined position with respect to the box holder. . In the transport direction, the non-defective product collection box is located downstream from a position at which the defective chip component is collected,
A control device that controls the operation of the chip component transport device, and the chip is provided in the accommodation hole on the upstream side of the non-defective product collection box and downstream of the position where the defective chip component is recovered in the transport direction. A detection unit that detects whether or not the component is accommodated,
The control device, when the detecting unit detects the accommodation of the defective chip component in the accommodation hole in a state where the defective chip component based on the inspection result of the inspection unit is accommodated in the accommodation hole, The chip component transport device according to any one of claims 1 to 9 , wherein the operation of the chip component transport device is stopped.

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