JP6521221B2 - Vibrating piece, vibrator, oscillator, real time clock, electronic device, and moving body - Google Patents

Description

  The present invention relates to a vibrating reed, a vibrator, an oscillator, a real time clock, an electronic device, and a moving body.

  Electronic devices such as vibrators and oscillators are used in small information devices such as HDDs (hard disk drives), mobile computers, or IC cards, and in mobile communication devices such as mobile phones, car phones, or paging systems. It is widely used. In recent years, with the miniaturization and thinning of electronic devices, further miniaturization and thinning of vibrators have been achieved. With such miniaturization and thinning of the vibrator, impact resistance has become a problem.

  For example, Patent Document 1 discloses a vibrating reed in which a supporting portion (supporting arm) is provided between a pair of vibrating arms in order to miniaturize the vibrator. Two terminals (electrode pads) are provided on the surface of the support portion, one of the terminals is provided on the root side of the support portion, and the other terminal is provided on the tip end side of the support portion.

JP 2002-141770 A

  In the vibrator described in Patent Document 1, the terminal (electrode pad) on the tip end side of the support portion (support arm) is electrically connected to the excitation electrode provided in the vibration portion through the wiring provided on the back surface of the support portion. Connected. However, if the vibrator is miniaturized without thinning the electrode wires so that the electrical resistance does not significantly increase, the wires provided on the back surface of the support portion and the terminals provided on the root side of the support portion ( There is a problem that the electrostatic capacitance (equivalent parallel electrostatic capacitance) C0 of the vibrating reed becomes large because the electrode pad is overlapped with the electrode pad in plan view. As the capacitance C0 increases, the effective resistance Re (Re = R1 × (1 + C0 / CL), R1: equivalent series resistance, CL: load capacity) increases, and the power consumption when the vibrating reed operates as an oscillator increases. There was a problem that you

  One of the objects in accordance with some aspects of the present invention is to provide a vibrating reed that can reduce the capacitance C0. Another object of some aspects of the present invention is to provide a vibrator, an oscillator, a real time clock, an electronic device, and a movable body including the above-described vibrator element.

  The present invention has been made to solve at least a part of the above-mentioned problems, and can be realized as the following aspects or application examples.

Application Example 1
The vibrator element according to this application example is
The base,
A pair of vibrating arms extending from the base;
A support arm extending from the base in a first direction;
First and second excitation electrodes provided on the vibrating arm;
A first electrode pad provided on a first main surface of the support arm;
A second electrode pad provided on the first main surface of the support arm and positioned closer to the tip end of the support arm than the first electrode pad;
A first lead-out electrode electrically connecting the first electrode pad and the first excitation electrode;
A second lead-out electrode electrically connecting the second electrode pad and the second excitation electrode;
Including
A first imaginary straight line extending in a second direction orthogonal to the first direction, passing through a first end on the first direction side of the first electrode pad, and a first end of the first electrode pad in plan view In the region of the support arm between the second virtual straight line extending in the second direction through the second end opposite to the portion, the second lead electrode has a relationship between the first main surface and the front and back Provided on the second main surface side of the support arm at the
In the area of the support arm, at least a portion of the second lead-out electrode does not overlap the first electrode pad in plan view.

  In such a vibrating reed, in the region of the support arm, at least a part of the second lead-out electrode does not overlap with the first electrode pad in plan view, so for example, all of the second lead-out electrode in the region of the support arm The capacitance between the second lead-out electrode and the first electrode pad can be reduced, and the capacitance C0 of the vibrating reed can be reduced, as compared with the case where the second electrode overlaps the first electrode pad. Therefore, in such a vibrating reed, the effective resistance Re can be reduced, and power consumption when the vibrating reed operates as an oscillator can be reduced.

Application Example 2
In the vibrating reed according to this application example,
A notch is provided in the first electrode pad,
In the area of the support arm, at least a portion of the second lead-out electrode may overlap with the notch in a plan view.

  In such a vibrating reed, at least a part of the second lead-out electrode overlaps the notch, so at least a part of the second lead-out electrode does not overlap with the first electrode pad. Therefore, the electrostatic capacitance between the second extraction electrode and the first electrode pad can be reduced, and the electrostatic capacitance C0 of the vibrating reed can be reduced.

Application Example 3
In the vibrating reed according to this application example,
The center of the first electrode pad is located on one side of a virtual center line extending in the first direction of the support arm in plan view,
In the area of the support arm, the second lead electrode may be located on the other side of the imaginary center line in plan view.

  In such a vibrating reed, the center of the first electrode pad is located on one side of a first imaginary center line extending in the first direction of the support arm, and the second lead-out electrode is the first support pad of the support arm in the region of the support arm. By being located on the other side of the 1 virtual center line, at least a part of the second lead-out electrode does not overlap with the first electrode pad. Therefore, the electrostatic capacitance between the second extraction electrode and the first electrode pad can be reduced, and the electrostatic capacitance C0 of the vibrating reed can be reduced.

Application Example 4
In the vibrating reed according to this application example,
The support arm has a constriction connected to the base and a wide part connected to the constriction;
In the narrowed portion, at least a part of the second lead electrode may not overlap with the first lead electrode in plan view.

  In such a vibrating reed, at least a part of the second lead-out electrode does not overlap with the first lead-out electrode in plan view in the narrowed portion of the support arm, and therefore, the static contact between the second lead-out electrode and the first lead-out electrode The capacitance can be reduced, and the capacitance C0 of the vibrating reed can be further reduced.

Application Example 5
In the vibrating reed according to this application example,
The vibrating arm may have an arm connected to the base and a weight connected to the arm.

  With such a vibrating reed, thermoelastic loss can be reduced.

Application Example 6
In the vibrating reed according to this application example,
The width of the weight may be greater than the width of the arm.

  With such a vibrating reed, thermoelastic loss can be reduced.

Application Example 7
In the vibrating reed according to this application example,
The vibrating arm may be provided with a groove.

  In such a vibrating reed, diffusion (heat conduction) of heat generated by flexural vibration can be suppressed, and thermoelastic loss can be reduced.

Application Example 8
The vibrator according to this application example is
Any of the above vibrating pieces,
A package in which the vibrating reed is accommodated;
Is equipped.

  Such a vibrator is provided with any of the above-described vibrating bars, so power consumption can be reduced.

Application Example 9
The oscillator according to this application example is
The vibrating reed according to any of the above,
An oscillating circuit electrically connected to the vibrating reed;
Is equipped.

  Such an oscillator is provided with any of the above-described vibrating bars, so power consumption can be reduced.

Application Example 10
The real time clock according to this application example is
Any of the above vibrating pieces,
An oscillating circuit electrically connected to the vibrating reed;
A clock circuit generating date / time data based on a signal output from the oscillation circuit;
Is equipped.

  With such a real-time clock, since any of the above-described vibrating bars are provided, power consumption can be reduced.

Application Example 11
The electronic device according to this application example is
It is equipped with any of the above-mentioned vibrating bars.

  Such an electronic device includes any of the above-described vibrating reeds, so power consumption can be reduced.

Application Example 12
The mobile unit according to this application example is
It is equipped with any of the above-mentioned vibrating bars.

  Such a movable body is provided with any of the above-described vibrating reeds, so that power consumption can be reduced.

FIG. 2 is a plan view schematically showing a vibrating reed according to the present embodiment. FIG. 2 is a plan view schematically showing a vibrating reed according to the present embodiment. FIG. 2 is a cross-sectional view schematically showing a vibrating reed according to the present embodiment. FIG. 2 is a plan view schematically showing a part of a support arm of the vibrator element according to the embodiment. FIG. 10 is a plan view schematically showing a vibrator according to a first modification. FIG. 10 is a plan view schematically showing a vibrator according to a first modification. The top view which shows typically a part of support arm of the vibration piece which concerns on a 1st modification. FIG. 10 is a plan view schematically showing a resonator element according to a second modification. FIG. 10 is a plan view schematically showing a resonator element according to a second modification. The top view which shows typically a part of support arm of the vibration piece which concerns on a 2nd modification. FIG. 14 is a plan view schematically showing a resonator element according to a third modification. FIG. 14 is a plan view schematically showing a resonator element according to a third modification. Sectional drawing which shows typically the resonator element which concerns on a 4th modification. FIG. 2 is a plan view schematically showing a vibrator according to the present embodiment. FIG. 2 is a cross-sectional view schematically showing a vibrator according to the present embodiment. FIG. 2 is a cross-sectional view schematically showing an oscillator according to the present embodiment. FIG. 2 is a functional block diagram of a real time clock according to the present embodiment. FIG. 2 is a plan view schematically showing the electronic device according to the embodiment. FIG. 1 is a perspective view schematically showing an electronic device according to the present embodiment. FIG. 1 is a perspective view schematically showing an electronic device according to the present embodiment. FIG. 1 is a perspective view schematically showing an electronic device according to the present embodiment. FIG. 2 is a plan view schematically showing a mobile unit according to the present embodiment.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Note that the embodiments described below do not unduly limit the contents of the present invention described in the claims. Further, not all of the configurations described below are necessarily essential configuration requirements of the present invention.

1. Vibrating Reed First, the vibrating reed according to the present embodiment will be described with reference to the drawings. 1 and 2 are plan views schematically showing a vibrating reed 100 according to the present embodiment. FIG. 3 is a cross-sectional view taken along line III-III of FIG. 1 schematically showing the vibrating reed 100 according to the present embodiment.

  Note that, in FIGS. 1 to 3 and FIGS. 4 to 13 described below, an X axis, a Y ′ axis, and a Z ′ axis are illustrated as three axes orthogonal to each other. Here, assuming that the electric axis is the crystal axis of quartz, the electric axis is the X axis, the machine axis is the Y axis, the optical axis is the Z axis, and the X axis is the rotation axis, the Y 'axis is the Y axis and the + Y side. The Z ′ axis is an axis formed by rotating the Z axis so that the + Z side is inclined to the − side of the Y axis. The inclination to be rotated is performed in the range of -5 degrees or more and 15 degrees or less from the viewpoint of reducing the change in resonance frequency due to the temperature change.

  The vibrating reed 100 includes a quartz crystal substrate (piezoelectric substrate) 101 having principal surfaces (principal surfaces in a relationship of front and back) 101a and 101b orthogonal to the Z ′ axis, as shown in FIGS. FIG. 1 is a view of the vibrating reed 100 seen from the main surface 101 a side, and is a view for explaining the configuration of the main surface 101 a of the vibrating reed 100. FIG. 2 is a view of the vibrating reed 100 seen from the main surface 101 a side, and is a view for explaining the configuration of the main surface 101 b of the vibrating reed 100.

  As shown in FIGS. 1 to 3, the vibrating reed 100 includes a base 10, a pair of vibrating arms 20a and 20b, a support arm 30, excitation electrodes 40a and 40b, extraction electrodes 50a and 50b, and an electrode pad 60a. , 60b, and. The base 10, the vibrating arms 20a and 20b, and the support arm 30 constitute a quartz substrate 101.

  The base 10 has a substantially flat shape. The length of the base 10 along the Y ′ axis direction is, for example, 50 μm or more and 300 μm or less.

  The vibrating arms 20a and 20b extend from the base 10 in the -Y 'axis direction side by side with each other. In the illustrated example, the first vibrating arm 20 a is provided on the + X axial direction side of the support arm 30, and the second vibrating arm 20 b is provided on the −X axial direction side of the support arm 30. The vibrating arms 20 a and 20 b have an arm 22 connected to the base 10 and a weight 24 connected to the arm 22.

  A groove 23 with a bottom is provided on the main surfaces 101a and 101b of the arm 22 of the vibrating arms 20a and 20b. The groove 23 extends along the Y ′ axis in a plan view (as viewed in the Z ′ axis direction). In the illustrated example, the tip of the groove 23 is located at the boundary between the arm 22 and the weight 24, and the base end of the groove 23 is located at the boundary between the base 10 and the arm 22. The arm portion 22 has a substantially H-shaped cross-sectional shape as shown in FIG. The distance W between the groove portion 23 and the side surfaces 22a and 22b (inner side surface 22a and outer side surface 22b) of the vibrating arms 20a and 20b is preferably 6 μm or less. Furthermore, when the maximum depth of the groove 23 is t and the thickness of the vibrating arms 20a and 20b (the length along the Z 'axis) is T, η represented by 2t / T is 0.6 or more. Is preferred. As a result, the equivalent series resistance and the CI (Crystal Impedance) value of the vibrating reed 100 can be reduced, and power consumption can be reduced. In the example shown in FIG. 3, the side surfaces 22a and 22b are inclined with respect to the main surfaces 101a and 101b, but may be perpendicular.

  The length of the groove 23 along the Y ′ axis is not particularly limited. For example, the groove 23 may be provided in the weight 24 or in the base 10.

The weight portion 24 of the vibrating arms 20a and 20b has a substantially flat plate shape as shown in FIGS. In the illustrated example, the width W1 of the weight portion 24 in the X-axis direction is larger than the width W2 of the arm portion 22 in the X-axis direction. The ratio (W1 / W2) of the width W2 to the width W1 is 2 or more and 10 or less, preferably 5 or more and 7 or less. Thereby, while reducing thermoelastic loss (loss of vibration energy generated by heat conduction generated between the compression part and the extension part of the vibrating reed), vibration leak due to the weight 24 being twisted is suppressed. can do.

  The width W1 of the weight portion 24 of the vibrating arms 20a and 20b is, for example, not less than 100 μm and not more than 400 μm. The length along the Y ′ axis of the weight portion 24 is, for example, 50 μm or more and 600 μm or less. The distance between the weight portion 24 of the first vibrating arm 20a and the weight portion 24 of the second vibrating arm 20b is, for example, 20 μm or more and 200 μm or less. The width W2 of the arm 22 is, for example, not less than 20 μm and not more than 150 μm. The length along the Y ′ axis of the weight portion 24 is, for example, 300 μm or more and 1000 μm or less.

  The shape of the weight according to the present invention is not particularly limited as long as the weight per unit length is larger than that of the arm. For example, the weight may have a width that is the same size as the width of the arm and may be thicker than the arm. The weight portion may be configured by forming a surface of the vibrating arm corresponding to the weight portion or a recess and providing a metal such as gold thereon. Furthermore, the weight portion may be made of a substance having a mass density higher than that of the arm portion. That is, when the mass per unit length (length in the Y ′ axial direction) in the arm and the weight is Ma and Mb, respectively, the relationship of Ma <Mb is satisfied in all the arms or all the weights. It suffices to meet the requirements.

  The support arm 30 is provided between the pair of vibrating arms 20a and 20b. The support arm 30 extends in the -Y 'axial direction (first direction) from the side surface 10a (facing in the -Y' axial direction in plan view) on the -Y 'axial direction side of the base 10. That is, the support arm 30 extends from the base 10 in the same direction as the vibrating arms 20a and 20b. The length along the Y ′ axis of the support arm 30 is smaller than the length along the Y ′ axis of the vibrating arms 20 a and 20 b. The tip of the support arm 30 is located closer to the base 10 than the tips of the vibrating arms 20a and 20b in plan view. In the illustrated example, the support arm 30 is not provided between the weight portion 24 of the first vibrating arm 20 a and the weight portion 24 of the second vibrating arm 20 b.

  The distance Lg between the support arm 30 and the weight portion 24 satisfies, for example, the relationship of T × 50/130 ≦ Lg ≦ 200 μm, where T (μm) is the thickness of the vibrating arms 20a and 20b. Preferably, the relationship of T × 70/130 ≦ Lg ≦ 100 μm is satisfied. When the distance Lg is smaller than T × 50/130, the conductive bonding member (not shown) provided on the second electrode pad 60b comes into contact with the excitation electrodes 40a and 40b provided on the weight portion 24. There is. Furthermore, since the plane orthogonal to the Y 'axis in plan view is inclined with respect to the main surfaces 101a and 101b, if the distance Lg is smaller than T × 50/130, the vibrating arms 20a and 20b and the support arms are wet etched. When forming the outer shape of 30, the weight part 24 and the support arm 30 may be connected. If the distance Lg is larger than 200 μm, it may be difficult to miniaturize the vibrating reed.

  The distance between the support arm 30 and the arm 22 is, for example, 10 μm or more and 200 μm or less, and preferably 50 μm or more and 100 μm or less. If the distance between the support arm 30 and the arm 22 is smaller than 10 μm, the conductive bonding members (not shown) provided on the electrode pads 60a and 60b contact the arm 22 and the vibration of the arm 22 is inhibited May be In particular, when a resin bump is used as the conductive bonding member, the distance between the support arm 30 and the arm 22 is preferably 50 μm or more. If the distance between the support arm 30 and the arm 22 is greater than 200 μm, it may be difficult to miniaturize the vibrating reed.

The support arm 30 has, for example, a constricted portion 32 connected to the base 10 and a wide portion 34 connected to the constricted portion 32. The narrow portion 32 is a portion provided between the base 10 and the wide portion 34 and having a smaller width than the width of the wide portion 34 along the X axis. In the vibrating piece 100, the in-phase bending vibration mode in the X axis direction (a bending vibration mode in which a pair of vibrating arms is simultaneously displaced in the + X axis direction and then sequentially displaced in the -X axis direction) Resonance frequency and the opposite phase in the X axis direction (the one of the pair of vibrating arms is displaced in the + X axis direction, the other is displaced in the −X axis direction, and then one is displaced in the −X axis direction) And the resonant frequency of the bending vibration mode in which the other is sequentially displaced in the + X axis direction can be separated. Thereby, the coupling between the in-phase flexural vibration mode and the reverse-phase flexural vibration mode is suppressed to reduce the mixing of the in-phase flexural vibration mode with the in-phase flexural vibration mode. Vibration leakage can be reduced.

  If the Young's modulus of the conductive bonding members provided on the electrode pads 60a and 60b is small, etc., the support arm 30 may not be provided with the constricted portion 32, but the Young's modulus of the conductive bonding members is 1 GPa or more In the case where the conductive bonding member is a metal bump made of gold (the Young's modulus of gold is 80 GPa), for example, the support arm 30 is preferably provided with the constricted portion 32. When the Young's modulus of the conductive bonding member is 1 GPa or more, the coupling between the in-phase flexural vibration mode and the reverse-phase flexural vibration mode described above is strong. The Young's modulus of the conductive bonding member is preferably 300 GPa or less. When the Young's modulus of the conductive bonding member is larger than 300 GPa, when an impact is applied to the vibrating reed due to a drop or the like, a large stress is applied to the vibrating reed.

  The wide portion 34 of the support arm 30 is, for example, rectangular in plan view. The wide portion 34 has a side surface on the −X axis direction side (surface facing the −X axis direction in plan view) 34 a and a side surface on the + X axis direction side (surface facing the + X axis direction in plan view) 34 b. ing. In the example shown in FIG. 3, the side surfaces 34a and 34b are inclined with respect to the main surfaces 101a and 101b, but may be perpendicular. The length along the Y ′ axis of the wide portion 34 of the support arm 30 is, for example, 100 μm or more and 900 μm or less. The width (width along the X axis) of the wide portion 34 is, for example, 30 μm or more and 300 μm or less.

  The base 10 of the vibrating piece 100, the vibrating arms 20a and 20b, and the support arm 30 (hereinafter, also referred to as "vibrating arms 20a and 20b and the like") are integrally provided. Specifically, the vibrating arms 20a, 20b, etc. are cut at a predetermined angle from a raw stone of quartz (Lumbard) (for example, a Z plate having a Z axis (optical axis) of quartz as a thickness direction, an X axis It is formed on a single quartz wafer using a technique such as photolithography or etching, for example, by rotating within a range of 0 degrees to 15 degrees with respect to (electrical axis).

The vibrating arms 20a and 20b and the like are not limited to quartz wafers, and for example, aluminum nitride (AlN), lithium niobate (LiNbO ₃ ), lithium tantalate (LiTaO ₃ ), lead zirconate titanate (PZT) Oxide substrates such as lithium tetraborate (Li ₂ B ₄ O ₇ ) and langasite (La ₃ Ga ₅ SiO ₁₄ ), and piezoelectrics such as aluminum nitride and tantalum pentoxide (Ta ₂ O ₅ ) on a glass substrate You may form from the lamination | stacking piezoelectric material board | substrate which laminated | stacked the body material, or a piezoelectric ceramic board | substrate. Alternatively, the vibrating arms 20a and 20b may be formed using a silicon semiconductor material or the like.

  The first excitation electrode 40a and the second excitation electrode 40b are provided on the vibrating arms 20a and 20b, as shown in FIGS. 1 and 2. Specifically, the first excitation electrode 40a is a groove provided on the side surfaces 22a and 22b of the first vibrating arm 20a, the weight 24 of the first vibrating arm 20a, and the main surfaces 101a and 101b of the second vibrating arm 20b. It is provided in 23. The second excitation electrode 40b is provided in the groove 23 provided on the main surfaces 101a and 101b of the first vibrating arm 20a, the side surfaces 22a and 22b of the second vibrating arm 20b, and the weight 24 of the second vibrating arm 20b. There is.

In FIGS. 1 and 2, the first excitation electrode 40a, the first extraction electrode 50a, and the first electrode pad 60a are indicated by oblique lines, and the second excitation electrode 40b, the second extraction electrode 50b, and the second electrode pad 60b. Is shown by a horizontal line. In FIGS. 1 and 2, the base 10, the vibrating arms 20a and 20b, and the excitation electrodes 40a and 40b provided on the side surfaces of the support arm 30, the lead-out electrodes 50a and 50b, and the second electrode pad 60b are indicated by thick lines. It shows.

  The first extraction electrode 50 a and the second extraction electrode 50 b are provided on the base 10 and the support arm 30. The first lead-out electrode 50a connects a first excitation electrode 40a provided on the first vibrating arm 20a and a first excitation electrode 40a provided on the second vibrating arm 20b. Furthermore, the first lead-out electrode 50a connects the first excitation electrode 40a and the first electrode pad 60a. The second lead-out electrode 50b connects a second excitation electrode 40b provided on the first vibrating arm 20a and a second excitation electrode 40b provided on the second vibrating arm 20b. Furthermore, the second lead-out electrode 50b connects the second excitation electrode 40b and the second electrode pad 60b.

  In the support arm 30, the first lead electrode 50a is provided on the side of the first main surface 101a, and the second lead electrode 50b is provided on the side of the second main surface 101b. In the support arm 30, the first extraction electrode 50a and the second extraction electrode 50b are provided linearly in the extension direction of the support arm 30 (along the Y ′ axis).

  The first electrode pad 60a and the second electrode pad 60b are provided on the first main surface 101a of the support arm 30, as shown in FIG. Although not illustrated, at least one non-through hole (concave portion) may be formed on the surface of the first main surface 101a on which the electrode pads 60a and 60b are provided. Thereby, the bonding area with the conductive bonding member can be increased, and bonding strength can be improved. When the conductive bonding member has a conductive filler, the number of the conductive fillers electrically connected to the electrode pads 60a and 60b by the thermal expansion of the conductive bonding member accompanying the rise of the environmental temperature Since the predetermined number or more can be maintained, it is possible to reduce the possibility that the electrical resistance of the vibrating reed will increase even if the environmental temperature rises.

  The first electrode pad 60 a and the second electrode pad 60 b are aligned along the Y ′ axis. The first electrode pad 60a is positioned closer to the base end (the base 10 side) of the support arm 30 than the second electrode pad 60b, and the second electrode pad 60b is closer to the tip end of the support arm 30 than the first electrode pad 60a. It is located in The first electrode pad 60a is electrically connected to the first excitation electrode 40a via the first lead electrode 50a. The second electrode pad 60b is electrically connected to the second excitation electrode 40b via the second lead electrode 50b. Drive signals having different applied potentials are applied from the outside to the first electrode pad 60a and the second electrode pad 60b.

  The distance between the first electrode pad 60a and the second electrode pad 60b is, for example, 5 μm or more and 400 μm or less. When the distance between the first electrode pad 60a and the second electrode pad 60b is less than 5 μm, a conductive bonding member (not shown) provided on each electrode pad 60a, 60b straddles between the electrode pads 60a, 60b, There is a large possibility that the first electrode pad 60a and the second electrode pad 60b may be electrically short-circuited. When the distance between the first electrode pad 60a and the second electrode pad 60b is more than 400 μm, it may be difficult to miniaturize the vibrating reed. Here, although the distance between the electrode pads 60a and 60b has been described, for example, when the electrode pad and the lead-out electrode are provided on the same main surface of the support arm, the distance between the electrode pad and the lead-out electrode is provided. The same applies to the distance.

  FIG. 4 is a plan view schematically showing a part of the support arm 30 of the vibrating reed 100 according to the present embodiment.

  The notch part 62 is provided in the 1st electrode pad 60a. The first electrode pad 60 a has a shape in which a rectangle is cut off by the notch 62 in plan view. The notched portion 62 is provided on a side on the -Y 'axial direction side that constitutes the outer edge of the first electrode pad 60a in plan view. The planar shape of the notch 62 is, for example, a rectangle having a long side along the Y ′ axis.

  The position and the shape of the notch 62 are not limited as long as the notch 62 overlaps the second lead electrode 50 b in plan view. For example, although not shown, the notch 62 may be provided on the other side that constitutes the outer edge of the first electrode pad 60a in a plan view. The planar shape of the notch 62 may be, for example, semicircular, triangular or the like.

  The first electrode pad 60a extends in a plan view from a first extending portion 64a extending along the X axis and a second extending from the end on the + X axis direction side of the first extending portion 64a along the −Y ′ axis. An extending portion 64 b and a third extending portion 64 c extending along the −Y ′ axis from an end on the −X axis direction side of the first extending portion 64 a are provided. The first extending portion 64a is connected to the first lead electrode 50a. The notch 62 is located between the second extension 64 b and the third extension 64 c. That is, the notch portion 62 is sandwiched between the second extending portion 64 b and the third extending portion 64 c. The first electrode pad 60a has, for example, a shape symmetrical to a virtual center line C30 of the support arm 30 (wide portion 34) extending in the -Y 'axis direction (the extension direction of the support arm 30) in plan view. ing. The imaginary center line C30 of the support arm 30 is an imaginary straight line passing through the center of the support arm 30 in a plan view, and is an imaginary straight line extending in the extension direction of the support arm 30.

  The width W3 along the X axis of the extension parts 64b and 64c is, for example, 5 μm or more and 50 μm or less. The width W4 along the X axis of the notch 62 is, for example, not less than 3 μm and not more than 40 μm. The width W5 along the Y ′ axis of the first extending portion 64a is, for example, 5 μm or more and 50 μm or less. The length L along the Y ′ axis of the first electrode pad 60 a (the portion where the notch 62 is not provided) is, for example, 70 μm or more and 200 μm or less.

  The support arm 30 passes through the first end 65a of the first electrode pad 60a in the -Y 'axis direction in plan view, and a virtual straight line D1 extending in a direction orthogonal to the extension direction of the support arm 30, and a first electrode pad A region P is provided between a virtual straight line D2 extending in a direction perpendicular to the extending direction of the support arm 30 through the second end 65b opposite to the first end 65a of the 60a. The virtual straight line D1 and the virtual straight line D2 are virtual straight lines extending along the X axis in the illustrated example.

  In the region P of the support arm 30, the first lead electrode 50a is provided on the main surface 101a side, and the second lead electrode 50b is provided on the main surface 101b side. In the region P of the support arm 30, at least a part of the second lead electrode 50b does not overlap with the first electrode pad 60a. In the illustrated example, in the region P of the support arm 30, a portion of the second lead electrode 50b overlaps the notch 62 in plan view, so that a portion of the second lead electrode 50b is first in plan view. It does not overlap with the electrode pad 60a.

  In the region P of the support arm 30, the second lead electrode 50b is provided on the virtual center line C30 of the support arm 30 in a plan view. Similarly, in the region P of the support arm 30, the notch 62 is provided on the virtual center line C30 of the support arm 30 in plan view. Therefore, in the area P of the support arm 30, the second lead electrode 50b overlaps the notch 62 in plan view.

  The planar shape of the second electrode pad 60b is, for example, rectangular. The planar shape of the second electrode pad 60b is not particularly limited. The width along the X-axis direction of the second electrode pad 60 b is, for example, 30 μm or more and 300 μm or less.

  As the excitation electrodes 40a and 40b, the extraction electrodes 50a and 50b, and the electrode pads 60a and 60b, for example, chromium or nickel is used as a base layer, and a metal layer such as gold or silver is laminated on the base layer. .

  Next, the operation of the vibrating reed 100 will be described.

  An electric field is generated in the vibrating reed 100 by a drive signal (alternating voltage) applied to the excitation electrodes 40a and 40b from the outside through the electrode pads 60a and 60b. Then, due to the inverse piezoelectric effect of quartz, the arrow A direction (the direction in which the vibrating arms 20a and 20b are away from each other) and the arrow B direction (the vibrating arm 20a, shown in FIGS. 1 and 2) Bending vibration which displaces so as to bend alternately in the direction in which 20b approaches each other) is generated (the vibrating arms 20a and 20b vibrate in the bending vibration mode of the opposite phase in the X-axis direction).

  The vibration (drive) method of the vibrating reed according to the present invention is not limited to the piezoelectric drive. For example, the vibrating reed according to the present invention may be a vibrating reed such as an electrostatic drive type using electrostatic force or a Lorentz drive type using magnetic force other than the piezoelectric drive type using a piezoelectric substrate. .

  The vibrating reed 100 has, for example, the following features.

  In the vibrating piece 100, at least a part of the second lead electrode 50b does not overlap the first electrode pad 60a in a plan view in the region P of the support arm 30. Therefore, in the vibrating reed 100, for example, compared with the case where the entire second lead electrode overlaps the first electrode pad in the region P of the support arm, the second lead electrode 50b and the first electrode pad 60a sandwich the quartz substrate 101. Can reduce the area where the Thereby, it is possible to reduce the capacitance generated as a result of the space between the second lead electrode 50b and the first electrode pad 60a being a dielectric, and to reduce the capacitance C0 of the vibrating reed. can do. Therefore, in the vibrating reed 100, the effective resistance Re can be reduced, and the power consumption when the vibrating reed operates as an oscillator can be reduced. In addition, it is possible to suppress the decrease in the oscillation margin.

  In the vibrating piece 100, the ratio of A1 to A2 (A1 / A2), where A1 denotes the area where the second lead electrode 50b and the first electrode pad 60a overlap in plan view, and A2 denotes the area of the first electrode pad 60a. Satisfies the relation of 0% ≦ A1 / A2 ≦ 50%, and preferably satisfies the relation of 0% ≦ A1 / A2 ≦ 10%. Thereby, an increase in the capacitance C0 of the vibrating reed can be suppressed. In particular, when the thickness of the vibrator is required to be reduced and the thickness (length in the Z′-axis direction) of the vibrating reed 100 becomes 70 μm or less, the effect of suppressing the increase in the capacitance C0 of the vibrating reed is large. When the thickness of the vibrating reed 100 is 50 μm or less, the effect of suppressing the increase in the capacitance C0 of the vibrating reed is even greater.

  In the vibrating piece 100, the first electrode pad 60a is provided with the notch 62, and at least a part of the second lead electrode 50b overlaps the notch 62 in plan view in the region P of the support arm 30. There is. Therefore, in the vibrating reed 100, at least a part of the second lead-out electrode 50b and the first electrode pad 60a do not overlap. Therefore, as described above, the capacitance C0 of the vibrating reed can be reduced.

  As described above, in the vibrating reed 100, since the second lead-out electrode 50b is not overlapped with the first electrode pad 60a by providing the notch 62, for example, as shown in FIG. The two lead-out electrodes 50b can be provided linearly along the Y ′ axis. Thus, for example, the total length of the second lead-out electrode 50b in the support arm 30 can be shortened as compared with the case where the second lead-out electrode is bent in the support arm 30, and the electric resistance can be reduced. it can.

The vibrating reed 100 has a weight 24 connected to the arm 22. Therefore, the width (length in the X-axis direction) of the arm portion 22 can be widened without increasing the resonance frequency of the reverse phase bending vibration mode, which is caused due to bending deformation during bending vibration. The path of heat conduction in the width direction in the arm portion 22 can be lengthened. Therefore, in the vibrating reed 100, thermoelastic loss can be reduced in the adiabatic region.

  In the vibrating piece 100, the groove portions 23 are provided in the vibrating arms 20a and 20b. Therefore, in the vibrating reed 100, since the path of heat generated by the bending vibration is narrowed, it is possible to suppress heat diffusion (heat conduction). Thereby, in the vibrating reed 100, thermoelastic loss can be reduced in the adiabatic region.

2. Modified Example of Vibrating Reed Next, a modified example of the vibrating reed according to the present embodiment will be described. Hereinafter, in the resonator element according to each modification of the present embodiment, members having the same functions as the constituent members of the resonator element 100 according to the present embodiment have the same reference numerals and the detailed description thereof will be omitted.

(1) First Modification First, a resonator element according to a first modification of the present embodiment will be described with reference to the drawings. 5 and 6 are plan views schematically showing a resonator element 200 according to a first modification of the present embodiment. FIG. 7 is a plan view schematically showing a part of the support arm 30 of the vibrating reed 200 according to the first modification of the present embodiment. FIG. 5 is a view of the vibrating reed 200 as seen from the main surface 101 a side, and FIG. 6 is a view of the vibrating reed 200 as seen through the main surface 101 a.

  In the vibrating reed 100 described above, as shown in FIGS. 1 to 4, the second lead electrode 50 b is formed in the region P of the support arm 30 by overlapping a part of the second lead electrode 50 b with the notch 62 in plan view. Part of the first electrode pad 60a did not overlap the first electrode pad 60a.

  On the other hand, in the case of the vibrating reed 200, as shown in FIG. 5 to FIG. 7, the center O of the first electrode pad 60a is one side of the virtual center line C30 of the support arm 30 in the plan view In the region P, the second lead electrode 50 b is located on the other side (the −X axis direction side) of the virtual center line C <b> 30 of the support arm 30. Thus, at least a part of the second lead electrode 50b does not overlap with the first electrode pad 60a. In other words, in the region P of the support arm 30, a non-electrode region (a region in which the first electrode pad 60a is not provided) Q is provided on the -X axial direction side of the first electrode pad 60a. 50b overlaps the non-electrode area Q in plan view.

  The second lead-out electrode 50 b is connected to the second electrode pad 60 b on the tip side of the support arm 30 through a region overlapping with the narrow portion 32 and the non-electrode region Q. The second lead-out electrode 50b is bent between the constricted portion 32 and the non-electrode area Q so as to avoid an area overlapping with the first electrode pad 60a in a plan view.

  In the vibrating reed 200, as described above, at least a part of the second lead-out electrode 50b does not overlap the first electrode pad 60a. Therefore, in the vibrating reed 200, as in the case of the vibrating reed 100 described above, the electrostatic capacitance between the second lead electrode 50b and the first electrode pad 60a can be reduced, and the electrostatic capacitance C0 of the vibrating reed is reduced. can do.

(2) Second Modified Example Next, a resonator element according to a second modified example of the present embodiment will be described with reference to the drawings. FIG. 8 and FIG. 9 are plan views schematically showing a vibrating reed 300 according to a second modification of the present embodiment. FIG. 10 is a plan view schematically showing a part of a support arm 30 of a vibrating reed 300 according to a second modification of the present embodiment. 8 is a view of the vibrating reed 300 as viewed from the main surface 101a side, and FIG. 9 is a view of the vibrating reed 300 as viewed through the main surface 101a.

In the vibrating piece 100 described above, in the narrowed portion 32 of the support arm 30, the second lead-out electrode 50b overlaps the first lead-out electrode 50a in plan view.

  On the other hand, in the vibrating reed 300, as shown in FIGS. 8 to 10, at least a part of the second lead-out electrode 50b and the first lead-out electrode 50a in plan view in the narrowed portion 32 of the support arm 30. It does not overlap. In the illustrated example, in the constricted portion 32, all of the second lead-out electrodes 50b do not overlap with the first lead-out electrodes 50a in plan view.

  In the vibrating piece 300, for example, the width of the narrowed portion 32 in the X-axis direction is increased to prevent the second lead electrode 50b from overlapping with the first lead electrode 50a in a plan view. Since the second lead-out electrode 50b does not overlap the first lead-out electrode 50a in plan view, the capacitance between the second lead-out electrode 50b and the first lead-out electrode 50a can be reduced.

  The cut portion 33 is provided only on the side on the + X axis direction side in plan view, and the cut portion is not provided on the side on the −X axis direction side in plan view. Therefore, the constricted portion 32 has an asymmetrical shape with respect to an axis parallel to the Y 'axis. Further, an imaginary center line C32 extending in the Y ′ axis direction of the narrowed portion 32 is opposite to the −X axis direction side of the imaginary center line C30 of the support arm 30, ie, the center O of the first electrode pad 60a in plan view. Located on the side. That is, the constricted portion 32 is provided on the non-electrode area Q side. Therefore, for example, the second lead-out electrode 50b can be provided linearly between the root of the support arm 30 and the second electrode pad 60b. Thereby, the electrical resistance of the vibrating reed can be reduced as compared with the case where the second lead electrode 50b is bent. The imaginary center line C32 of the constricted part 32 is an imaginary straight line passing through the center of the constricted part 32 in a plan view, and is an imaginary straight line extending in the extension direction of the support arm 30.

  In the vibrating piece 300, the constricted portion 32 is asymmetrical, but has the above-described effect as the constricted portion 32 (reduction of vibration leakage).

  Although not shown, the conductive bonding member provided on the electrode pads 60a and 60b is a conductive resin, and the Young's modulus is 0.05 GPa to 1 GPa, particularly 0.05 GPa to 0.5 GPa. The support arm 30 may not have the constriction 32. When the Young's modulus of the conductive bonding member is in the above range, the coupling between the in-phase flexural vibration mode and the reverse-phase flexural vibration mode is weak, and the vibration leakage is small even when there is no constriction. When the Young's modulus of the conductive bonding member is smaller than 0.05 GPa, the vibrating reed may come in contact with the package when an impact is applied to the vibrating reed due to dropping or the like. By thus not providing the support arm 30 with the constricted portion 32, the width along the X axis of the lead-out electrodes 50a, 50b can be increased, and the electrical resistance of the vibrating reed can be further reduced. Since the stress concentration due to the shape of the portion 32 is eliminated, the impact resistance is also improved.

(3) Third Modified Example Next, a resonator element according to a third modified example of the present embodiment will be described with reference to the drawings. 11 and 12 are plan views schematically showing a resonator element 400 according to a third modification of the present embodiment. FIG. 11 is a view of the vibrating reed 400 as seen from the main surface 101 a side, and FIG. 12 is a view of the vibrating reed 400 as seen through the main surface 101 a.

  In the vibrating reed 400, as shown in FIGS. 11 and 12, the outer edge of the first electrode pad 60a and the outer edge of the second electrode pad 60b are curves that do not include corners in plan view. The corner means a place where two sides (line segments) intersect. In the example shown in FIG. 11, the electrode pads 60a and 60b have a shape in which the corner portions of the electrode pads 60a and 60b of the vibrating reed 100 shown in FIG. 1 are chamfered in plan view. Although not shown, the shape may be such that the corner portions of the electrode pads 60a and 60b of the vibrating reed 200 shown in FIG. 5 are chamfered.

  Further, in the vibrating reed 400, as shown in FIG. 12, the outer edge of the second lead-out electrode 50b located on the tip end side of the support arm 30 is also configured by a curve not including a corner.

  In the vibrating reed 400, the outer edges of the electrode pads 60a and 60b in a plan view are formed by curves that do not include the corner, so the possibility of static electricity discharging from the corner can be reduced, and the static of the vibrating reed can be reduced. Power tolerance can be improved.

(4) Fourth Modified Example Next, a resonator element according to a fourth modified example of the present embodiment will be described with reference to the drawings. FIG. 13 is a cross-sectional view schematically showing a vibrating reed 500 according to a fourth modification of the present embodiment, and shows the same cross section as FIG. 3 schematically showing the vibrating reed 100. For convenience, in FIG. 13, illustration of members other than the vibrating arms 20 a and 20 b is omitted.

  In the vibrating reed 100 described above, as shown in FIG. 3, one groove portion 23 is provided on each of the main surfaces 101 a and 101 b of the vibrating arms 20 a and 20 b. On the other hand, in the vibrating reed 500, as shown in FIG. 13, two groove portions 23 are provided on the main surfaces 101a and 101b. The two groove portions 23 provided in each of the main surfaces 101a and 101b are provided side by side along the X axis. Although not shown, three or more groove portions 23 may be provided on each of the main surfaces 101a and 101b.

3. Vibrator Next, a vibrator according to the present embodiment will be described with reference to the drawings. FIG. 14 is a plan view schematically showing a vibrator 800 according to the present embodiment. FIG. 15 is a cross-sectional view taken along line XV-XV in FIG. 14 schematically showing a vibrator 800 according to the present embodiment. For the sake of convenience, the lid 814 is omitted in FIG. Moreover, in FIG. 14 and FIG. 15, the vibrating reed 100 is simplified and shown in figure.

  The vibrator 800 includes the vibrator element according to the present invention. Hereinafter, a vibrator 800 including the vibrating reed 100 as the vibrating reed according to the present invention will be described. The vibrator 800 includes a vibrating reed 100 and a package (container) 810 as shown in FIGS. 14 and 15.

  The package 810 has a box-like base 812 having a recess 811 opened on the top surface, and a plate-like lid 814 joined to the base 812 so as to close the opening of the recess 811. Such a package 810 has a storage space formed by the recess 811 being closed by the lid 814, and the vibrating reed 100 is airtightly stored and installed in the storage space. That is, the vibrating reed 100 is accommodated in the package 810.

  The inside of the storage space (concave portion 811) in which the vibrating reed 100 is stored may be in a reduced pressure (vacuum) state, for example, or may be filled with an inert gas such as nitrogen, helium, or argon. . Thereby, the vibration characteristic of the vibrating reed 100 is improved.

  The material of the base 812 is, for example, an aluminum oxide-based sintered body, a mullite-based sintered body, an aluminum nitride-based sintered body, a silicon carbide-based sintered body, and a glass ceramic sintered body obtained by forming, laminating and firing ceramic green sheets. Insulating materials based on ceramics such as body, quartz, glass, silicon (high resistance silicon), etc. The material of the lid 814 is the same as that of the base 812, or a metal such as Kovar or 42 alloy.

The base 812 and the lid 814 are joined by providing a seal ring 813 on the base 812 and placing the lid 814 on the seal ring 813. For example, using a resistance welder, the base 8
This is done by welding the seal ring 813 to 12. The bonding of the base 812 and the lid 814 is not particularly limited, and may be performed using an adhesive or may be performed by seam welding.

  Internal terminals 816 a and 816 b are provided on the inner bottom surface (inner bottom surface) 815 of the recess 811 of the base 812 at positions facing the electrode pads 60 a and 60 b of the vibrating reed 100. The first electrode pad 60a is bonded to the internal terminal 816a via the first conductive bonding member 90a, and the second electrode pad 60b is bonded to the internal terminal 816b via the second conductive bonding member 90b.

  The conductive bonding members 90a and 90b may be made of, for example, epoxy, silicone, polyimide, acrylic or bismaleimide conductive adhesive mixed with a conductive material such as a metal filler, gold, or the like. They are metal bumps such as aluminum and solder bumps, and resin bumps in which metal wiring is formed on a metal layer or a core made of resin.

  Electrode terminals 818 a and 818 b are provided on an outer bottom surface (outside bottom surface) 817 opposite to the inner bottom surface 815 of the base 812. The electrode terminals 818a and 818b are electrically connected to the internal terminals 816a and 816b by internal wiring (not shown). Specifically, the electrode terminal 818a is electrically connected to the internal terminal 816a, and the electrode terminal 818b is electrically connected to the internal terminal 816b. The internal terminals 816a and 816b and the electrode terminals 818a and 818b are metal films in which a film such as nickel or gold is laminated on a metallized layer such as tungsten or molybdenum by plating or the like.

  Although not shown, the package 810 may have a flat base 812 and a lid 814 having a recess. In addition, the package 810 may have a recess in both the base 812 and the lid 814.

  In the vibrator 800, for example, the vibration piece 100 is excited by bending vibration by a drive signal applied through the electrode terminals 818a and 818b from an oscillation circuit integrated in an IC chip of the electronic device, and thus the predetermined frequency is obtained. And resonate (oscillate), and output resonant signals (oscillation signals) from the electrode terminals 818a and 818b.

  Since the vibrator 800 includes the vibrating reed 100, power consumption can be reduced.

4. Oscillator Next, the oscillator according to the present embodiment will be described with reference to the drawings. FIG. 16 is a cross-sectional view schematically showing an oscillator 900 according to the present embodiment.

  Hereinafter, in the oscillator 900 according to the present embodiment, members having the same functions as the constituent members of the vibrator 800 according to the present embodiment are denoted by the same reference numerals, and the detailed description thereof is omitted.

  The oscillator 900 includes the vibrating reed according to the present invention. Hereinafter, an oscillator 900 including the vibrating reed 100 as the vibrating reed according to the present invention will be described. The oscillator 900 includes a vibrating reed 100, a package 810, and an IC chip 910, as shown in FIG.

The inner bottom surface 815 of the base 812 is provided with a recessed storage portion 912. The IC chip 910 is housed in the housing portion 912. The IC chip 910 incorporates an oscillation circuit. The IC chip 910 is fixed to the bottom of the housing 912 by an adhesive or the like (not shown).

  The IC chip 910 is connected to internal connection terminals 916 a and 916 b provided on the bottom surface of the housing portion 912 by a wire 914 such as gold or aluminum. The internal connection terminals 916a and 916b are metal films in which a film such as nickel or gold is laminated on a metallized layer such as tungsten or molybdenum by plating or the like. The internal connection terminals 916a and 916b are connected to the electrode terminals 818a and 818b and the internal terminals 816a and 816b via internal wiring (not shown). That is, the IC chip (oscillation circuit) 910 is electrically connected to the vibrating reed 100.

  Although not shown, the connection between the IC chip 910 and the internal connection terminals 916a and 916b is performed by flipping the IC chip 910 and flipping the chip in addition to the connection direction by wire bonding using the wire 914. May be used. The IC chip 910 may be mounted in a recess provided on the outer bottom surface 817 of the base 812 and sealed by a molding material.

  In the oscillator 900, the vibrating reed 100 is excited by bending vibration and resonates (oscillates) at a predetermined frequency by drive signals applied from the IC chip 910 via the internal connection terminals 916a and 916b and the internal terminals 816a and 816b. . Then, the oscillator 900 outputs an oscillation signal generated along with the oscillation to the outside through the IC chip 910, the electrode terminals 818a and 818b, and the like.

  Since the oscillator 900 includes the vibrating reed 100, power consumption can be reduced.

5. Real Time Clock Next, a real time clock according to the present embodiment will be described with reference to the drawings. FIG. 17 is a functional block diagram of the real time clock 1000 according to the present embodiment.

  The real time clock 1000 comprises an oscillator according to the invention. Hereinafter, a real time clock 1000 including an oscillator 900 will be described as an oscillator according to the present invention. As shown in FIG. 17, the real time clock 1000 includes an oscillator 900, a clock circuit 1010, an event detection circuit 1020, a memory 1030, and a control circuit 1040.

  The oscillator 900 includes the vibrating reed 100 and an oscillating circuit (IC chip) 910 electrically connected to the vibrating reed 100. The vibrating reed 100 receives an electric signal through the oscillation circuit 910. It vibrates at a predetermined frequency. Then, the oscillation circuit 910 amplifies and outputs the signal output from the vibrating reed 100.

  Oscillator 900 is connected to clock circuit 1010, and when the frequency of 1 [Hz] is obtained by dividing the signal output from oscillator 900, the year, month using the 1 [Hz] signal The clock of day, hour, minute, and second is performed by each time register (not shown). That is, the timer circuit 1010 generates date and time data based on the signal output from the oscillator circuit 910 of the oscillator 900. By having such a clock circuit 1010, time data can be obtained, and it becomes possible to record, in the memory 1030, the date and time etc. when an event occurs (every event detection cycle). In addition to the year, month, day, hour, minute, and second, the time-counting circuit 1010 can store data on the day of the week depending on the setting.

  The event detection circuit 1020 is connected to an event input terminal 1022 which is an external terminal of the real time clock 1000. The event detection circuit 1020 is configured to set an event occurrence flag when an electrical signal indicating that an event has occurred is input to the event input terminal 1022. As described above, by indicating the occurrence of an event by a flag, it is possible to determine the presence or absence of an event based on the flag.

  The memory 1030 is a storage unit that records the above-described time data and data related to the occurrence of an event.

  The control circuit 1040 is connected to the above-described clock circuit 1010, event detection circuit 1020, memory 1030, and interrupt output terminal 1042 as an external terminal. The control circuit 1040 is configured to be able to read out from the clock circuit 1010 time data when it is detected that the flag is set based on the flag information input from the event detection circuit 1020.

  Note that the interrupt output terminal 1042 plays a role of causing the CPU to interrupt and output a signal at the same time as recording of time data and data relating to the occurrence of an event when an arbitrary event input occurs.

  Since the real-time clock 1000 includes the vibrating reed 100, power consumption can be reduced.

6. Electronic Device Next, an electronic device according to the present embodiment will be described with reference to the drawings. An electronic device according to the present embodiment includes the vibrating reed according to the present invention. Hereinafter, an electronic device including the vibrating reed 100 as the vibrating reed according to the present invention will be described.

  FIG. 18 is a plan view schematically showing a smartphone 1300 as an electronic device according to the present embodiment. The smartphone 1300 includes an oscillator 900 having a vibrating reed 100 as shown in FIG.

  The smartphone 1300 uses the oscillator 900 as, for example, a timing device such as a reference clock oscillation source. The smartphone 1300 can further include a display unit (a liquid crystal display, an organic EL display, or the like) 1310, an operation unit 1320, and a sound output unit 1330 (a microphone, or the like). The smartphone 1300 may use the display unit 1310 as an operation unit by providing a contact detection mechanism for the display unit 1310.

  Note that the electronic device typified by the smartphone 1300 preferably includes an oscillation circuit that drives the vibrating reed 100 and a temperature compensation circuit that corrects the frequency fluctuation associated with the temperature change of the vibrating reed 100.

  According to this, since the electronic device represented by the smartphone 1300 includes the oscillation circuit that drives the vibrating reed 100 and the temperature compensation circuit that corrects the frequency fluctuation caused by the temperature change of the vibrating reed 100, the oscillation circuit Thus, it is possible to temperature compensate for the resonant frequency at which C. oscillates, and to provide an electronic device excellent in temperature characteristics.

FIG. 19 is a perspective view schematically showing a mobile (or notebook) personal computer 1400 as an electronic apparatus according to this embodiment. The personal computer 1400, as shown in FIG. 19, includes a main unit 1404 having a keyboard 1402 and a display unit 1406 having a display unit 1405. The display unit 1406 is
The main body 1404 is rotatably supported via a hinge structure. Such a personal computer 1400 incorporates a vibrating reed 100 that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 20 is a perspective view schematically showing a cellular phone (including PHS) 1500 as the electronic device according to the present embodiment. The cellular phone 1500 includes a plurality of operation buttons 1502, an earpiece 1504, and a mouthpiece 1506. A display unit 1508 is disposed between the operation button 1502 and the earpiece 1504. Such a cellular phone 1500 incorporates the vibrating reed 100 which functions as a filter, a resonator, or the like.

  FIG. 21 is a perspective view schematically showing a digital still camera 1600 as an electronic apparatus according to the present embodiment. Note that FIG. 21 also schematically shows the connection with an external device. Here, a normal camera sensitizes a silver halide photographic film with a light image of an object, whereas the digital still camera 1600 photoelectrically converts the light image of the object with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1603 is provided on the back of a case (body) 1602 in the digital still camera 1600, and is configured to perform display based on an imaging signal by a CCD, and the display unit 1603 displays an object as an electronic image. It functions as a finder. A light receiving unit 1604 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the rear side in the drawing) of the case 1602.

  When the photographer confirms the subject image displayed on the display unit and depresses the shutter button 1606, the imaging signal of the CCD at that time is transferred and stored in the memory 1608. In the digital still camera 1600, a video signal output terminal 1612 and an input / output terminal 1614 for data communication are provided on the side of the case 1602. As shown, a television monitor 1630 is connected to the video signal output terminal 1612, and a personal computer 1640 is connected to the data communication input / output terminal 1614 as necessary. Further, the imaging signal stored in the memory 1608 is configured to be output to the television monitor 1630 or the personal computer 1640 by a predetermined operation. Such a digital still camera 1600 incorporates a vibrating reed 100 that functions as a filter, a resonator, and the like.

  Since the electronic devices 1300, 1400, 1500, and 1600 include the vibrating reed 100, power consumption can be reduced.

  Note that the electronic device provided with the vibrating reed of the present invention is not limited to the above example, and for example, an ink jet discharge device (for example, ink jet printer), laptop personal computer, television, video camera, video tape recorder, Car navigation devices, pagers, electronic notebooks (including communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, video phones, television monitors for crime prevention, electronic binoculars, POS terminals, medical devices (such as electronic thermometers) , Blood pressure monitor, blood glucose meter, electrocardiogram measurement device, ultrasound diagnostic device, electronic endoscope), fish finder, various measuring instruments, instruments (for example, instruments of vehicles, aircrafts, ships), flight simulators, etc. can do.

7. Mobile Body Next, a mobile body according to the present embodiment will be described with reference to the drawings. FIG. 22 is a plan view schematically showing an automobile as a mobile unit 1700 according to the present embodiment.

  The movable body according to the present embodiment includes the vibrating reed according to the present invention. Hereinafter, a movable body provided with the vibrating reed 100 as the vibrating reed according to the present invention will be described.

  The moving body 1700 according to this embodiment further includes a controller 1720 that performs various controls such as an engine system, a brake system, and a keyless entry system, a controller 1730, a controller 1740, a battery 1750, and a backup battery 1760. ing. Note that the mobile unit 1700 according to the present embodiment may omit or change part of the components (each part) shown in FIG. 22 or may be configured to have other components added.

  As such a mobile body 1700, various mobile bodies can be considered. For example, a car (including an electric car), an aircraft such as a jet plane or a helicopter, a ship, a rocket, a satellite, etc. can be mentioned.

  Since the mobile unit 1700 includes the vibrating reed 100, power consumption can be reduced.

  The above-mentioned embodiment and modification are an example, and are not necessarily limited to these. For example, it is also possible to combine each embodiment and each modification suitably.

  The present invention includes configurations substantially the same as the configurations described in the embodiments (for example, configurations having the same function, method and result, or configurations having the same purpose and effect). Further, the present invention includes a configuration in which a nonessential part of the configuration described in the embodiment is replaced. The present invention also includes configurations that can achieve the same effects as the configurations described in the embodiments or that can achieve the same purpose. Further, the present invention includes a configuration in which a known technology is added to the configuration described in the embodiment.

DESCRIPTION OF SYMBOLS 10 ... Base, 10a ... Side, 20a ... 1st vibrating arm, 20b ... 2nd vibrating arm, 22 ... Arm part, 22a ... Inner side, 22b ... Outer surface, 23 ... Groove part, 24 ... Weight part, 30 ... Support arm , 32: narrow part, 33: cut part, 34: wide part, 34a: side surface, 34b: side surface, 40a: first excitation electrode, 40b: second excitation electrode, 50a: first extraction electrode, 50b: second extraction Electrode 60a first electrode pad 60b second electrode pad 62 notched portion 64a first extending portion 64b second extending portion 64c third extending portion 65a first End portion 65b second end portion 90a first conductive bonding member 90b second conductive bonding member 100 vibrating piece 101 crystal substrate 101a first main surface 101b second main Surface 200, vibrating piece 300, vibrating piece 400, vibrating piece 500, vibrating piece 8 DESCRIPTION OF SYMBOLS 0 ... Vibrator, 810 ... Package, 811 ... Concave part, 812 ... Base, 813 ... Seal ring, 814 ... Lid, 815 ... Inner bottom, 816a, 816b ... Internal terminal, 817 ... Outer bottom, 818a, 818b ... Electrode terminal, 900: Oscillator, 910: IC chip, 912: housing portion, 914: wire, 916a, 916b: internal connection terminal, 1000: real time clock, 1010: clock circuit, 1020: event detection circuit, 1022: event input terminal, 1030: Memory, 1040: control circuit, 1042: interrupt output terminal, 1300: smartphone, 1310: display unit, 1320: operation unit, 1330: sound output unit, 1400: personal computer, 1402: keyboard, 1404: main unit, 1405: display Department, 1406 ... display 150, an operation button, 1504, an earpiece, 1506, a mouthpiece, 1508, a display portion, 1600, a digital still camera, 1602, a case, 1603, a display portion, 1604, a light receiving unit, 1606 ... Shutter button, 1608 ... Memory, 1612 ... Video signal output terminal, 1614 ... Input / output terminal, 1630 ... Television monitor, 1640 ... Personal computer, 1700 ... Moving body, 1720 ... Controller, 1730 ... Controller, 1740 ... Controller, 1750 ... Battery, 1760 ... Battery for backup

Claims (11)

The base,
A pair of vibrating arms extending from the base;
A support arm extending from the base in a first direction;
First and second excitation electrodes provided on the vibrating arm;
A first electrode pad provided on a first main surface of the support arm;
A second electrode pad provided on the first main surface of the support arm and positioned closer to the tip end of the support arm than the first electrode pad;
A first lead-out electrode electrically connecting the first electrode pad and the first excitation electrode;
A second lead-out electrode electrically connecting the second electrode pad and the second excitation electrode;
Including
A first imaginary straight line extending in a second direction orthogonal to the first direction, passing through a first end on the first direction side of the first electrode pad, and a first end of the first electrode pad in plan view In the region of the support arm between the second virtual straight line extending in the second direction through the second end opposite to the portion, the second lead electrode has a relationship between the first main surface and the front and back Provided on the second main surface side of the support arm at the
In the area of the support arm, at least a portion of the second lead-out electrode does not overlap the first electrode pad in plan view ,
A notch is provided in the first electrode pad,
In the area of the support arm, at least a part of the second lead-out electrode overlaps the notch in a plan view . The base,
A pair of vibrating arms extending from the base;
A support arm extending from the base in a first direction;
First and second excitation electrodes provided on the vibrating arm;
A first electrode pad provided on a first main surface of the support arm;
A second electrode pad provided on the first main surface of the support arm and positioned closer to the tip end of the support arm than the first electrode pad;
A first lead-out electrode electrically connecting the first electrode pad and the first excitation electrode;
A second lead-out electrode electrically connecting the second electrode pad and the second excitation electrode;
Including
A first imaginary straight line extending in a second direction orthogonal to the first direction, passing through a first end on the first direction side of the first electrode pad, and a first end of the first electrode pad in plan view In the region of the support arm between the second virtual straight line extending in the second direction through the second end opposite to the portion, the second lead electrode has a relationship between the first main surface and the front and back Provided on the second main surface side of the support arm at the
In the area of the support arm, at least a portion of the second lead-out electrode does not overlap the first electrode pad in plan view ,
The center of the first electrode pad is located on one side of a virtual center line extending in the first direction of the support arm in plan view,
In the area of the support arm, the second lead-out electrode is located on the other side of the imaginary center line in a plan view . In claim 2 ,
The support arm has a constriction connected to the base and a wide part connected to the constriction;
In the narrowed portion, at least a part of the second lead-out electrode does not overlap with the first lead-out electrode in a plan view. In any one of claims 1 to 3 ,
The vibrating reed in which the vibrating arm includes an arm connected to the base and a weight connected to the arm. In claim 4 ,
The vibrating reed, wherein a width of the weight portion is larger than a width of the arm portion. In any one of claims 1 to 5 ,
The vibrating arm is provided with a groove portion. A vibrating reed according to any one of claims 1 to 6 ;
A package in which the vibrating reed is accommodated;
Is equipped with a vibrator. A vibrating reed according to any one of claims 1 to 6 ;
An oscillating circuit electrically connected to the vibrating reed;
It has an oscillator. A vibrating reed according to any one of claims 1 to 6 ;
An oscillating circuit electrically connected to the vibrating reed;
A clock circuit generating date / time data based on a signal output from the oscillation circuit;
Has a real time clock. An electronic device comprising the vibrator element according to any one of claims 1 to 6 . A moving body comprising the vibrator element according to any one of claims 1 to 6 .

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