JP6513125B2 - Stage apparatus, lithographic apparatus, and method of manufacturing article - Google Patents

Description

  The present invention relates to a stage apparatus, a lithographic apparatus and a method of manufacturing an article.

  As a technique related to the stage device, in order to achieve both the high rigidity and the weight reduction of the stage top plate, a technique of making the stage top plate a hollow rib structure has been proposed (see Patent Document 1). Patent Document 1 discloses performing negative pressure suction in order to hold a substrate on a chuck placed on a stage top plate. In the case of performing negative pressure suction, it is necessary to connect the hole formed in the chuck and the outside (negative pressure pump) using piping etc. However, Patent Document 1 discloses such a configuration specifically. Not disclosed.

  In addition, a technology has also been proposed in which a refrigerant flow path is formed on the bonding surface inside the stage top plate to reduce the influence of thermal deformation of the stage top plate (see Patent Document 2). Also in Patent Document 2, when performing negative pressure suction in order to hold the chuck, it is necessary to form a hole in the gap of the refrigerant flow path and communicate from the lower surface of the stage top plate to the upper surface of the chuck using piping etc. is there. However, Patent Document 2 does not specifically disclose such a configuration.

  In recent years, there has been a demand for improvement in productivity of lithography apparatuses such as exposure apparatuses and imprint apparatuses, and a stage apparatus capable of positioning a substrate at high speed and with high accuracy in the apparatus is required. Therefore, in order to improve the control performance of the stage device, the rigidity and weight of the movable stage have been increased. In addition, in the imprint apparatus, a configuration has been proposed in which a plurality of suction holes are formed in a chuck provided on the stage device, and suction can be turned ON / OFF for each area of the substrate. The number of required piping tends to be larger than before.

Unexamined-Japanese-Patent No. 2003-163257 JP, 2006-211812, A

  However, in patent document 1, since the stage top plate of a thick hollow rib structure is provided directly under the chuck, it is difficult to arrange piping inside the stage top plate. Further, if the thick portion of the stage movable portion is increased to form a through hole communicating with the suction hole of the chuck, the lightness is impaired.

  In the case where the coolant channel is formed on the bonding surface of the stage top plate of the hollow rib structure, a through hole (negative pressure path) for communicating from the lower surface of the stage top plate to the upper surface of the chuck is provided It is necessary to form so as not to interfere with the rib. Therefore, the negative pressure path is complicated due to the layout restrictions such as the hollow rib structure and the mounting in the stage top plate, and the overall rigidity and lightness of the movable stage portion are impaired.

  The present invention is made in view of such problems of the prior art, and an exemplary object of the present invention is to provide a stage device that is advantageous for achieving high rigidity and light weight.

  In order to achieve the above object, a stage apparatus as one aspect of the present invention is a stage apparatus for holding the substrate through a chuck having suction holes for suctioning the substrate, the chuck being a support surface It has a top plate to support, and the top plate includes a first plate-like member, a second plate-like member and a third plate-like member in the thickness direction from the side of the support surface, and the first plate-like member At least one of the first surface on the second plate-like member side and the second surface on the first plate-like member side of the second plate-like member extends in the direction along the surface A third concave surface on the side of the third plate-like member of the second plate-like member, and a second plate-like member of the third plate-like member, including a first recess that forms a first flow path that extends At least one surface of the fourth surfaces on the side of the member includes a second recess that forms a second flow path extending in a direction along the surface. , The one flow path of the first flow path and the second flow path, characterized in that it communicates with the suction holes.

  Further objects or other aspects of the present invention will be made clear by the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, it is possible to provide, for example, a stage device that is advantageous for achieving high rigidity and light weight.

FIG. 1 is a schematic view showing the configuration of an imprint apparatus as one aspect of the present invention. It is a figure which shows the structure of the stage apparatus of the imprint apparatus shown in FIG. It is sectional drawing of the stage top plate of the stage apparatus shown in FIG. It is a figure which shows the chuck | zipper and stage top plate of the stage apparatus shown in FIG. It is sectional drawing of the stage top plate of the stage apparatus shown in FIG. It is a figure for demonstrating the manufacturing method of articles | goods. It is sectional drawing of the stage top plate of the stage apparatus shown in FIG. It is sectional drawing of the stage top plate of the stage apparatus shown in FIG.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In each of the drawings, the same members are denoted by the same reference numerals, and redundant description will be omitted.

  FIG. 1 is a schematic view showing the configuration of an imprint apparatus 100 according to one aspect of the present invention. The imprint apparatus 100 is a lithography apparatus that is used to manufacture a semiconductor device or the like and that forms a pattern on a substrate. The imprint apparatus 100 performs an imprint process of forming a pattern on the imprint material 1 on the substrate using the mold 4. In the present embodiment, the imprint apparatus 100 brings the imprint material 1 supplied on the substrate into contact with the mold 4 and applies energy for curing to the imprint material 1 to transfer the uneven pattern of the mold 4. Form a cured product pattern.

  For the imprint material 1, a curable composition (sometimes referred to as an uncured resin) that is cured by the application of energy for curing is used. As energy for curing, electromagnetic waves, heat, etc. are used. As the electromagnetic wave, for example, light such as infrared light, visible light, ultraviolet light or the like whose wavelength is selected from the range of 10 nm or more and 1 mm or less is used.

  The curable composition is a composition which is cured by irradiation of light or by heating. The photocurable composition which is cured by irradiation of light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a nonpolymerizable compound or a solvent, as required. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component and the like.

  The imprint material 1 may be applied in a film form on a substrate by a spin coater or a slit coater. In addition, the imprint material 1 may be applied onto the substrate in the form of droplets, or in the form of islands or a film formed by connecting a plurality of droplets by a liquid jet head. The viscosity (the viscosity at 25 ° C.) of the imprint material 1 is, for example, 1 mPa · s or more and 100 mPa · s or less.

  The imprint apparatus 100 includes a stage device 3, a supply unit 5, an imprint head 6, a curing unit 7, a measurement unit 8, a structure 9, a control unit 10, and a transport unit 11. The supply unit 5, the imprint head 6, the curing unit 7, and the measurement unit 8 are supported by the structure 9. The stage device 3 is configured to be movable on the surface plate. Further, the control unit 10 includes, for example, a CPU, a memory, and the like, and controls each unit of the imprint apparatus 100 to perform an imprint process.

  The mold 4 is made of a material capable of transmitting light (for example, ultraviolet light) for curing the imprint material 1, such as quartz. In a partial region of the surface of the mold 4 on the substrate side, a concavo-convex pattern for forming the imprint material 1 on the substrate is formed. The substrate 2 includes, for example, a single crystal silicon substrate or a glass substrate.

  The supply unit 5 supplies (applies) the imprint material 1 to the surface of the substrate 2. The imprint head 6 includes, for example, a mold chuck that holds the mold 4 by a vacuum suction force or an electrostatic force, and a mold drive unit that drives the mold chuck in the Z-axis direction.

  The curing unit 7 applies light for curing the imprint material 1 to the imprint material 1 on the substrate via the mold 4 in the imprint process, and cures the imprint material 1. The measuring unit 8 detects an alignment mark provided on (the pattern area of) the mold 4 and an alignment mark provided on (the shot area of the substrate 2), and detects the relative position (positional deviation between the mold 4 and the substrate 2). Measure).

  The transport unit 11 includes the robot hand 11 a and transports the substrate 2. The transport unit 11 carries the substrate 2 into the interior of the imprint apparatus 100 and delivers the substrate 2 to the stage device 3. Further, the transport unit 11 receives the substrate 2 from the stage device 3, and carries the substrate 2 out of the imprint apparatus 100.

  The stage device 3 holds the substrate 2 via a chuck 301 which holds the substrate 2 by a vacuum suction force. The stage device 3 includes a movable portion 302 configured to support the chuck 301 and move on the surface plate, and position the substrate 2 in the X-axis direction and the Y-axis direction. In addition, the stage device 3 may have a function of adjusting the position of the substrate 2 in the Z-axis direction or the θ direction, or a function of correcting the tilt of the substrate 2.

  The configuration of the stage device 3 will be described with reference to FIGS. 2 (a) and 2 (b). FIG. 2A is a plan view showing the stage device 3 from the Z-axis direction. FIG.2 (b) is A-A 'sectional drawing of the stage apparatus 3 shown to Fig.2 (a). The stage device 3 has a movable unit 302 including, for example, an X stage 303 and a Y stage 304. The X stage 303 is configured to be movable along the X axis direction on the surface plate 309. The Y stage 304 holds the chuck 301 and is configured to be movable in the Y-axis direction via a static pressure guide (not shown).

  The movable unit 302 configured as described above can move the Y stage 304 and the chuck 301 in the X axis direction by moving the X stage 303 along the X axis direction. In addition, the movable unit 302 can move the chuck 301 in the Y axis direction by moving the Y stage 304 along the Y axis direction. Therefore, the stage device 3 can move the substrate 2 in the X axis direction and the Y axis direction.

  The X stage 303 is positioned by the static pressure guide so that a predetermined amount of clearance is formed with respect to the surface plate 309. The X stage 303 is driven by the X driving unit 303c along the X axis direction on the surface plate. The X drive unit 303c includes, for example, a linear motor having a mover including a plurality of coils, and a stator 305 including a permanent magnet arranged along the X-axis direction. A cooling unit for cooling the coil is mounted on the X driving unit 303c.

  The position of the X stage 303 in the X direction is measured by, for example, a measurement unit including an encoder, an interferometer, and the like. In the present embodiment, an encoder including an X scale 306 and an X head 303 d is provided as a measurement unit that measures the position of the X stage 303 in the X direction.

  The Y stage 304 is positioned by the static pressure guide so that a predetermined amount of clearance is formed with respect to the X stage 303. The Y stage 304 is driven by the Y drive unit 304 a along the Y axis direction on the X beam 303 a. The Y drive unit 304a includes a linear motor as in the X drive unit 303c. Further, a cooling unit for cooling the coil is mounted on the Y driving unit 304a.

  The position of the Y stage 304 in the Y direction is measured by, for example, a measurement unit including an encoder, an interferometer, and the like. In this embodiment, an encoder including a Y scale 303 b and a Y head 304 b disposed in the X beam 303 a is provided as a measurement unit that measures the position of the Y stage 304 in the Y direction.

  For power supply and power supply to the stage device 3, for example, a power / power equipment 12 installed inside or outside the imprint apparatus 100 is used. First, the power supply / power equipment 12 supplies power to the stage device 3, supplies refrigerant to the cooling mounting 304 g, and exhausts and negative pressure (vacuum) suction to the suction mounting 304 f and the pressure adjustment unit 304 i. The power / utility facility 12 is connected to the X movable mount 307 movable in the X-axis direction, and supplies power and power to the X stage 303. In addition, the power / utility facility 12 is connected to the Y movable mounting 308 movable in the Y-axis direction via the X movable mounting 307, and supplies power and power to the Y stage 304. Communication (for example, transmission and reception of detection signals and control signals) between the measurement unit arranged on the X stage 303 and the Y stage 304, for example, the X head 303d and the Y head 304b, and the control unit 10 It takes place via the same route.

  Here, the configuration of the Y stage 304 will be described in detail. The Y stage 304 mainly includes two structures, specifically, a Y slider 304 d including a static pressure guide (not shown) and a stage top plate 304 c fixed on the Y slider 304 d. There is. The stage top plate 304 c is made of a material capable of increasing the control zone as well as achieving high rigidity and lightening of the entire movable part, and generally, ceramics such as alumina, silicon carbide, silicon nitride, cordierite, etc. It is configured. The stage top plate 304 c includes at least three plate-like members, and these plate-like members are joined in their thickness direction (Z-axis direction).

  FIG. 3 is a cross-sectional view of the stage top plate 304 c. FIG. 4A is a view three-dimensionally showing the chuck 301 and the stage top plate 304c, and FIG. 4B is a view showing an internal structure by developing the stage top plate 304c. The stage top plate 304 c supports a chuck 301 having suction holes 310 for suctioning the substrate 2 on a support surface SS. In the present embodiment, the stage top plate 304 c includes a first plate member 322, a second plate member 324, and a third plate member 326 sequentially stacked in the thickness direction from the side of the support surface SS. On the lower surface or side of the stage top plate 304c, a lift unit 304e for moving the substrate 2 up and down, a Y head 304b (measurement unit), a cooling mounting 304g, a suction mounting 304f, a pressure adjusting unit 304i, etc. are fixed. .

  Before the imprinting process, the substrate 2 carried into the interior of the imprint apparatus 100 by the transport unit 11 (robot hand 11a) is placed on the elevation unit 304e (elevation pin) moved upward with respect to the chuck 301. Be done. The lifting unit 304 e holds the substrate 2 by vacuum suction or electrostatic force. Then, the lift unit 304e holding the substrate 2 is lowered, and the substrate 2 is delivered to the chuck 301. After the imprint process, the lift unit 304 e is lifted to lift (release) the substrate 2 from the chuck 301. In such a state, the elevation unit 304e holds the substrate 2 by vacuum suction or electrostatic force. Then, the transport unit 11 collects the substrate 2 held by the elevating unit 304 e and carries the substrate 2 out of the imprint apparatus 100.

  The mounting of a cable, a piping tube, and the like regarding power supply and supply of power to the elevation unit 304e used for transporting the substrate 2 is fixed to the lower surface or the side surface of the stage top plate 304c. In other words, such a mounting is fixed to a surface different from the support surface SS of the stage top plate 304 c. In addition, the mounting of the signal cable, the signal substrate, and the like regarding the Y head 304 b is similarly fixed to the lower surface or the side surface of the stage top plate 304 c. These implementations are connected to the power and utility equipment 12 and the control unit 10 via the Y movable implementation 308.

  In the imprint process, as described above, the light for curing the imprint material 1 is applied to the imprint material 1 on the substrate through the mold 4. Therefore, since the heat from the light irradiated to the imprint material 1 on the substrate is absorbed by the substrate 2, the substrate 2 may be thermally deformed and the relative position between the mold 4 and the substrate 2 may be shifted. . Therefore, in order to reduce the thermal deformation of the substrate 2 due to the irradiation of light for curing the imprint material 1, it is preferable to cool the substrate 2 from the stage top plate 304 c via the chuck 301.

  Further, in the imprint apparatus 100, the mold 4 and the substrate 2 are attached to each other in an imprinting step of bringing the mold 4 and the imprint material 1 on the substrate into contact with each other and a release step of separating the mold 4 from the cured imprint material 1 on the substrate It is necessary to reduce the occurrence of deviation in the relative position of Therefore, a plurality of adsorption regions 201 for adsorbing the substrate 2 are provided, and the adsorption of each adsorption region is suppressed so as to suppress the positional deviation between the mold 4 and the substrate 2 according to the process of the sealing step and the mold release step. The pressure (pressure of each suction hole) may be adjusted to forcibly deform the substrate 2.

  In the present embodiment, the chuck 301 includes, as the plurality of suction areas 201, three suction areas 201a, 201b and 201c. Suction holes 310a, 310b and 310c are formed in the suction regions 201a, 201b and 201c, respectively. The adsorption regions 201a to 201c are connected to the pressure adjustment unit 304i connected to the power / utility facility 12 via the adsorption holes 310a to 310c, respectively. The pressure adjustment unit 304i adjusts the pressure of the space between the back surface of the substrate 2 and the front surface of the chuck 301 corresponding to the region including the shot region to be imprinted, thereby (the shot region of the substrate 2). Force to transform. In the present embodiment, the pressure adjustment unit 304i independently adjusts (controls) the adsorption pressure of each of the adsorption regions 201a to 201c.

  For example, when the pressure adjustment unit 304i decompresses the adsorption area 201b to a negative pressure, the area of the substrate 2 corresponding to the adsorption area 201b can be deformed into a concave shape while the substrate 2 is held by the chuck 301. On the other hand, when the pressure adjustment unit 304i presses the adsorption area 201b to a positive pressure state, the area of the substrate 2 corresponding to the adsorption area 201b is deformed into a convex shape while adsorbing the substrate 2 by the adsorption areas 201a and 201c. Can.

  As described above, by changing the suction pressure of the suction regions 201 a to 201 c of the chuck 301 to locally deform the substrate 2, the shape of (the shot region of) the substrate 2 can be changed in the process of the sealing process and the mold release process. The shape of the mold 4 can be matched. In the present embodiment, in order to correct the flatness of the substrate 2, the suction pressure of the suction regions 201 a to 201 c of the chuck 301 is variable. For example, the substrate 2 is out of the range of correction of the flatness of the substrate 2. Does not deform in the Z-axis direction.

  Here, in the state where the chuck 301 is supported by the stage top plate 304 c, in order to change the suction pressure of each of the suction regions 201 a to 201 c, the configuration described below is required. For example, the pressure adjustment portion 304i is made to independently communicate each of the suction holes 310a to 310b formed in the suction regions 201a to 201c from the lower side of the support surface SS of the stage top plate 304c to the back surface of the stage top plate 304c. It is configured to be connected to In order to realize such a configuration, a plurality of through holes are formed on the stage top plate 304 c while avoiding interference with the flow path formed to cool the chuck 301, and these through holes are formed. And the suction holes 310a to 310c.

  A flow path for cooling the chuck 301 is generally formed in a direction along the XY plane, and a supply port and a recovery port of the refrigerant flowed to the flow path are peripheral portions close to the outer edge of the stage top plate 304c. Is formed. In addition, the coolant supply port and the recovery port are connected to a tube drawn around from the Y movable mounting 308. Furthermore, as described above, the elevation unit 304e, the Y head 304b (measurement unit), the cooling mounting 304g, the suction mounting 304f, the pressure adjusting unit 304i, and the like are fixed to the lower surface or the side surface of the stage top plate 304c. . Therefore, the space which can mount piping etc. for performing negative pressure (vacuum) suction in the perpendicular direction (Z-axis direction) of stage top plate 304c is limited. In addition, even if a plurality of pipes can be mounted in a slight gap of the stage top plate 304c, since it is necessary to fix many mountings, the thickness of the stage top plate 304c increases and the weight of the entire movable portion increases. Invite you. In addition, with the increase in mounting, there is a large design restriction such that the rib structure required to secure the rigidity of the stage top plate 304 c can not be disposed, and the degree of freedom in layout is significantly reduced.

  Therefore, the piping for performing negative pressure suction is not disposed at the central portion of the stage top plate 304 c, and the stage top plate is similar to the supply port and recovery port of the refrigerant flowing in the flow path for cooling the chuck 301. It is good to arrange collectively in the peripheral part near the outer edge of 304c. Further, similar to the flow path for cooling the chuck 301, the flow path for performing negative pressure suction is formed in the direction along the XY plane, thereby simplifying the structure of the stage top plate 304c and designing it. It is possible to improve the degree of freedom.

  Therefore, in the present embodiment, the stage top plate 304 c is configured as follows. The surface on the side of the second plate member 324 of the first plate member 322 is referred to as a first surface 322 a. The surface of the second plate member 324 on the side of the first plate member 322 is referred to as a second surface 324 a, and the surface of the second plate member 324 on the side of the third plate member 326 is referred to as a third surface 324 b. The surface on the side of the second plate member 324 of the third plate member 326 is referred to as a fourth surface 326 a.

  With regard to the first plate member 322 and the second plate member 324, the first surface 322a is a flat surface, and the first recess 324d is formed in the second surface 324a. As a result, a first flow path 362 extending in the direction along the XY plane is formed between the first plate member 322 and the second plate member 324 (bonding surface) 304 h. In the first flow path 362, a refrigerant for cooling the chuck 301 is caused to flow. In other words, the first flow path 362 functions as a coolant flow path for cooling the chuck 301. The first flow path 362 may be configured to include a plurality of flow paths, and the flow rate and temperature setting value of each flow path may be independently controlled. Further, the first flow passage 362 communicates with a through hole (fourth through hole) 324f formed in the peripheral portion of the second plate member 324 so as to penetrate in the thickness direction, via the through hole 324f It is connected to a cooling mounting 304 g for supplying a refrigerant to flow in the first flow path 362. When the cooling mounting 304g is mounted on the lower surface of the third plate member 326, the through hole (fifth through hole) penetrating in the thickness direction corresponding to the through hole 324f is a third plate shape It may be formed in the member 326, and the through holes and the first flow path 362 may be communicated.

  In addition, regarding the second plate member 324 and the third plate member 326, the third surface 324b is a flat surface, and the second recess 326d is formed in the fourth surface 326a. Thereby, a second flow path 364 extending in the direction along the XY plane is formed between the second plate member 324 and the third plate member 326 (bonding surface) 304k. Further, the second plate member 324 includes a through hole (first through hole) 324g formed to penetrate in the thickness direction in a portion different from the portion where the first flow path 362 is formed. By providing the through hole 324g in a portion different from the portion where the first flow path 362 is formed, the suction function by the pressure adjusting portion 304i connected to the through hole 324g does not interfere with the cooling function in the first flow path 362 It is like that. The first plate member 322 includes a through hole (second through hole) 322 g formed to penetrate in the thickness direction corresponding to the through hole 324 g. The third plate member 326 includes a through hole (third through hole) 326 g formed in the peripheral portion of the third plate member 326 so as to penetrate in the thickness direction. The second flow path 364 communicates with the suction hole 310 via the through holes 324g and 322g, and also communicates with the through hole 326g and is connected to the suction mounting 304f and the pressure adjustment unit 304i. Therefore, the second flow path 364 functions as a suction flow path for performing negative pressure (vacuum) suction on the adsorption area 201 for adsorbing the substrate 2 and the adsorption holes 310. When the suction mounting 304f or the pressure adjusting portion 304i is mounted on the side surface of the third plate member 326, the communication path connecting the fourth surface 326a and the side surface is formed in the third plate member 326. The communication passage and the second flow passage 364 may be communicated with each other.

  Thus, the second flow path 364 communicates with the upper surface (chuck 301) of the stage top plate 304c from the gap of the first flow path 362 without interfering with the first flow path 362, and the substrate 2 and the chuck 301 are It can be adsorbed. In addition, the second flow path 364 may be configured to include a plurality of flow paths, and the flow rate and pressure setting value of each flow path may be independently controlled. For example, by forming the second flow path 364 corresponding to each of the adsorption regions 201a to 201c, the adsorption pressure of each of the adsorption regions 201a to 201c can be adjusted independently.

  As in the present embodiment, it is preferable that the first flow path 362 be a cooling flow path and the second flow path 364 be a suction flow path. Thereby, the cooling efficiency with respect to the chuck 301 can be enhanced as compared with the case where the first flow path 362 is a suction flow path and the second flow path 364 is a cooling flow path. However, the first flow path 362 may be a suction flow path, and the second flow path 364 may be a cooling flow path. In other words, one of the first flow path 362 and the second flow path 364 may be in communication with the adsorption holes 310. Even when the first flow path 362 is a suction flow path and the second flow path 364 is a cooling flow path, the flow paths may be configured independently without interference.

  In the present embodiment, the first recess 324d is formed in the second surface 324a and the second recess 326d is formed in the fourth surface 326a. However, the first recess 324d is formed in the first surface 322a. You may form 2nd recessed part 326d in 3 surface 324b. Thus, the first recess 324d is formed in one of the first surface 322a and the second surface 324a, and the second recess 326d is formed in one of the third surface 324b and the fourth surface 326a. do it. Then, the other surface of the first surface 322a and the second surface 324a may be a flat surface, and the other surface of the third surface 324b and the fourth surface 326a may be a flat surface. Also in this case, the first flow path 362 is formed between the first plate member 322 and the second plate member 324, and the second plate member 324 and the third plate member 326 The second flow path 364 can be formed in 304 k during the

  By forming the first recess 324d and the second recess 326d in the second surface 324a and the third surface 324b, and making the first surface 322a and the fourth surface 326a flat, the first flow path 362 and the second flow can be obtained. It is also possible to form the passage 364. However, in this case, the concave portions are formed on both sides in the thickness direction of the second plate member 324, which may be disadvantageous in terms of the manufacture. Therefore, it is preferable to form only one of the first recess 324 d and the second recess 326 d in the second plate member 324.

  In the present embodiment, in the stage device 3, the volume of mounting that is an obstacle to the layout of the stage top plate 304 c can be reduced, and an increase in the thickness of the stage top plate 304 c for forming piping and flow paths can be suppressed. . Therefore, it is possible to provide the stage device 3 that is advantageous for achieving both high rigidity and light weight.

  In the imprint process in which the mold 4, the mold 4, and the imprint material 1 on the substrate are brought into contact in the imprint apparatus 100, the imprinting force is directed downward (in the negative direction along the Z axis) with respect to the stage top plate 304 c. I will head towards you. Further, in the mold release step of separating the mold 4 from the hardened imprint material 1 on the substrate, a mold release force is applied upward (plus direction along the Z axis) to the stage top plate 304 c.

  The stage top plate 304 c may be deformed due to the pressing force and the releasing force, and the relative position between the mold 4 and the substrate 2 may be deviated. In order to suppress the deformation of the stage top plate 304c, the stage top plate 304c may be thickened to be highly rigid. On the other hand, when the stage top plate 304 c is thickened, the weight of the movable portion 302 is increased, which hinders weight reduction. The stage top plate 304 c is required to have both high rigidity and light weight.

  Therefore, as shown in FIG. 5, the lowermost surface of the stage top plate 304c, specifically, the surface 326b on the side opposite to the fourth surface 326a of the third plate member 326 constituting the stage top plate 304c, The rib structure 370 may be formed to thicken the stage top plate 304c. As described above, the elevating unit 304e, the Y head 304b (measurement unit), the cooling mounting 304g, the suction mounting 304f, the pressure adjusting unit 304i, and the like are fixed to the lower surface or the side surface of the stage top plate 304c. However, since the rib structure 370 is formed between them (gap), it does not become an obstacle of the layout. In the present embodiment, the rib structure 370 is formed along the outer edge of the third plate-like member 326. Thus, the stage device 3 having the stage top plate 304 c shown in FIG. 5 can ensure higher rigidity while minimizing an increase in weight due to the rib structure 370.

  Further, as shown in FIG. 7, the stage top plate 304 c includes a second plate member 324 and a third plate member in addition to the first plate member 322, the second plate member 324, and the third plate member 326. It may further include a fourth plate member 702 between the member 326 and the plate. The first plate member 322, the second plate member 324, the fourth plate member 702, and the third plate member 326 are sequentially stacked in the thickness direction from the side of the support surface SS. In FIG. 7, regarding the third plate member 326 and the fourth plate member 702, the surface 702 a on the side of the second plate member 324 of the fourth plate member 702 and the surface 702 b on the side of the third plate member 326 The second recess 326 d is formed on the fourth surface 326 a in a plane. Thereby, a second flow path 364 extending in the direction along the XY plane is formed between the fourth plate member 702 and the third plate member 326 (joining surface) 704. The fourth plate member 702 includes a through hole 706 formed to penetrate in the thickness direction corresponding to the through hole 324g (the second recess 326d). Accordingly, the second flow path 364 is in communication with the suction hole 310 via the through holes 706, 324g and 322g, and in communication with the through hole 326g to be connected to the suction mounting 304f and the pressure adjustment portion 304i. Further, the fourth plate member 702 includes a through hole 708 formed to penetrate in the thickness direction corresponding to the through hole 324f. Therefore, the first flow path 362 communicates with the through holes 324 f and 708 and is connected to the refrigerant mounting 304 g via the through holes 324 f and 708.

  In FIG. 7, the case where the stage top plate 304 c includes one fourth plate member 702 between the second plate member 324 and the third plate member 326 has been described as an example. However, the stage top plate 304 c may include two or more fourth plate members between the second plate member 324 and the third plate member 326. In this case, the second recess 326d is formed between the second flow passage 326 and the third plate member 326 and a fourth plate member overlapping the third plate member 326 among two or more fourth plate members. To form. On the other hand, when the second recess 326 d is formed on the third surface 324 b, the second recess 326 d is formed by the second flow path 326, the second plate member 324, and two or more fourth plate members. The second plate member 324 is formed between the second plate member 324 and the fourth plate member. Even in the case where two or more fourth plate members are included, the first flow path 362 is connected to the refrigerant mounting 304g, and the second flow path 364 is the suction hole 310, the suction mounting 304f, and the pressure adjusting portion 304i. The through holes are formed in each of the fourth plate-like members so that they can be connected to each other.

  Further, as shown in FIG. 8, the stage top plate 304 c includes a first plate member 322 and a second plate member in addition to the first plate member 322, the second plate member 324 and the third plate member 326. It may further include a fifth plate-like member 802 between the member 324 and it. The first plate member 322, the fifth plate member 802, the second plate member 324, and the third plate member 326 are sequentially stacked in the thickness direction from the side of the support surface SS. In FIG. 8, with respect to the second plate member 324 and the fifth plate member 802, the surface 802 a of the fifth plate member 702 on the side of the first plate member 322 and the surface 802 b of the side of the second plate member 324 are The first recess 324 d is formed on the second surface 324 a, which is a flat surface. As a result, a first flow path 362 extending in the direction along the XY plane is formed between the fifth plate member 802 and the second plate member 324 (joining surface) 804. The fifth plate member 802 includes a through hole 806 formed to penetrate in the thickness direction corresponding to the through hole 324g (through hole 322g). Accordingly, the second flow path 364 is in communication with the suction hole 310 via the through holes 324g, 806 and 322g, and in communication with the through hole 326g to be connected to the suction mounting 304f and the pressure adjustment portion 304i.

  In FIG. 8, the example in which the stage top plate 304 c includes the single fifth plate member 802 between the first plate member 322 and the second plate member 324 has been described. However, the stage top plate 304 c may include two or more fifth plate members between the first plate member 322 and the second plate member 324. In this case, the first recess 324d is formed between the second flow path 362 and the second plate member 324 and the fifth plate member overlapping the second plate member 324 among the two or more fifth plate members. To form. On the other hand, when the first concave portion 324d is formed in the first surface 322a, the first concave portion 324d is formed of the first plate member 322 and two or more fifth plate members. The first plate member 322 is formed between the first plate member 322 and the fifth plate member. In addition, even in the case where two or more fifth plate members are included, each of the fifth plate members can be connected to the second flow path 364 so that the second flow path 364 can be connected to the suction holes 310 and the mounting 304f for suction and the pressure adjustment portion 304i. Form a through hole.

  The pattern of the cured product formed by using the imprint apparatus 100 is used permanently on at least a part of various articles or temporarily for manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit element include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. The mold may, for example, be a mold for imprinting.

  The pattern of the cured product is used as it is as a component of at least a part of the above-mentioned article, or temporarily used as a resist mask. After etching or ion implantation is performed in the substrate processing step, the resist mask is removed.

  Next, a specific method of manufacturing an article will be described. As shown in FIG. 6A, a substrate 2 such as a silicon wafer on which a workpiece such as an insulator is formed is prepared, and subsequently, an imprint material is formed on the surface of the workpiece by an inkjet method or the like. Give one. Here, a state is shown in which a plurality of droplet-shaped imprint materials 1 are applied onto a substrate.

  As shown in FIG. 6B, the mold 4 for imprint is faced with the side on which the concavo-convex pattern is formed facing the imprint material 1 on the substrate. As shown in FIG. 6C, the substrate 2 on which the imprint material 1 is applied is brought into contact with the mold 4 and pressure is applied. The imprint material 1 is filled in the gap between the mold 4 and the workpiece. When light is irradiated through the mold 4 as energy for curing in this state, the imprint material 1 cures.

  As shown in FIG. 6D, when the mold 4 and the substrate 2 are separated after curing the imprint material 1, a pattern of a cured product of the imprint material 1 is formed on the substrate. In the pattern of the cured product, the concave portions of the mold 4 correspond to the convex portions of the cured product, and the convex portions of the mold 4 correspond to the concave portions of the cured product. Was transferred.

  As shown in FIG. 6 (e), when etching is performed using the pattern of the cured product as an etching resistant mask, a portion of the surface of the work material which has no cured product or remains thin is removed, and Become. As shown in FIG. 6 (f), when the pattern of the cured product is removed, an article having a groove formed on the surface of the workpiece can be obtained. Although the pattern of the cured product is removed here, it may be used, for example, as a film for interlayer insulation included in a semiconductor element or the like, that is, a component of an article without removing it even after processing.

  Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the present invention. For example, the present invention does not limit the lithography apparatus to the imprint apparatus, and can be applied to a lithography apparatus such as an exposure apparatus and a drawing apparatus. Here, the exposure apparatus is a lithography apparatus that forms a pattern (latent image pattern) on a substrate by exposing the substrate via a mask or a reticle (original plate) and a projection optical system. Moreover, a drawing apparatus is a lithography apparatus which forms a pattern (latent image pattern) on a board | substrate by drawing on a board | substrate with a charged particle beam (electron beam). The production of the various articles described above may be performed using these lithographic apparatus.

100: Imprint device 2: Substrate 3: Stage device 301: Chuck 304c: Stage top plate 322: First plate member 324: Second plate member 326: Third plate member

Claims (19)

A stage apparatus for holding the substrate via a chuck having suction holes for suctioning the substrate,
A top plate for supporting the chuck on a support surface;
The top plate includes a first plate member, a second plate member, and a third plate member in the thickness direction from the side of the support surface,
At least one of the first surface on the second plate-like member side of the first plate-like member and the second surface on the first plate-like member side of the second plate-like member Including a first recess forming a first flow path extending in a direction along the surface;
At least one of the third surface of the second plate member on the side of the third plate member and the fourth surface of the third plate member on the side of the second plate member is Including a second recess forming a second flow path extending in a direction along the surface;
One of the first flow path and the second flow path is in communication with the suction hole. The first plate member, the second plate member, and the third plate member are sequentially stacked in the thickness direction from the side of the support surface,
The first recess forms the first flow path between the first plate member and the second plate member,
The stage device according to claim 1, wherein the second recess forms the second flow path between the second plate-like member and the third plate-like member. The first recess is formed on only one of the first surface and the second surface,
The stage device according to claim 2, wherein the second concave portion is formed on only one of the third surface and the fourth surface. The other surface of the first surface and the second surface is a plane,
The stage device according to claim 3, wherein the other surface of the third surface and the fourth surface is a flat surface.   The stage according to any one of claims 2 to 4, wherein only one recess of the first recess and the second recess is formed in the second plate-like member. apparatus. The first recess is formed on the second surface,
The second recess is formed on the fourth surface,
The stage device according to any one of claims 2 to 5, wherein the first surface and the third surface are flat surfaces. The second plate member includes a first through hole formed to penetrate in the thickness direction at a portion different from the portion where the first flow path is formed,
The first plate-like member includes a second through hole formed to penetrate in the thickness direction corresponding to the first through hole,
The stage device according to any one of claims 2 to 6, wherein the second flow path communicates with the suction hole via the first through hole and the second through hole. .   The stage device according to claim 7, wherein a refrigerant for cooling the chuck is caused to flow through the first flow path. The chuck includes a plurality of suction areas for suctioning the substrate,
The suction holes are formed in each of the plurality of suction regions,
The stage device according to claim 7, wherein the second flow path is formed corresponding to each of the plurality of adsorption regions. The third plate member includes a third through hole formed in the peripheral portion of the third plate member so as to penetrate in the thickness direction,
The stage device according to any one of claims 7 to 9, wherein the second flow path is in communication with the third through hole. The third plate-like member includes a communication passage communicating the fourth surface and the side surface of the third plate-like member,
The stage device according to any one of claims 7 to 9, wherein the second flow path communicates with the communication path. The second plate-like member includes a fourth through hole formed in the peripheral portion of the second plate-like member so as to penetrate in the thickness direction,
The stage device according to any one of claims 7 to 11, wherein the first flow path is in communication with the fourth through hole. The third plate-like member includes a fifth through hole formed to penetrate in the thickness direction corresponding to the fourth through hole,
The stage device according to claim 12, wherein the first flow path communicates with the fourth through hole and the fifth through hole. The third plate member includes a rib structure formed on a surface opposite to the fourth surface,
The stage device according to any one of claims 1 to 13, wherein the rib structure is formed along the outer edge of the third plate-like member. The top plate further includes one or more fourth plate-like members between the second plate-like member and the third plate-like member,
The first plate member, the second plate member, the one or more fourth plate members, and the third plate member are sequentially stacked in the thickness direction from the side of the support surface,
The first recess forms the first flow path between the first plate member and the second plate member,
The second concave portion is disposed between the second flow path and the fourth plate-like member overlapped with the second plate-like member among the second plate-like member and the one or more fourth plate-like members. And at least one of the third plate-like member and the fourth plate-like member overlapping the third plate-like member among the one or more fourth plate-like members. The stage apparatus according to 1. The top plate further includes one or more fifth plate-like members between the first plate-like member and the second plate-like member,
The first plate member, the one or more fifth plate members, the second plate member, and the third plate member are sequentially stacked in the thickness direction from the side of the support surface,
The first concave portion is disposed between the first flow path and the fifth plate-like member overlapping the first plate-like member among the first plate-like member and the one or more fifth plate-like members. And at least one of the second plate member and the fifth plate member overlapping the second plate member among the one or more fifth plate members;
The stage device according to claim 1, wherein the second recess forms the second flow path between the second plate-like member and the third plate-like member. A lithographic apparatus for forming a pattern on a substrate, comprising
A lithographic apparatus comprising the stage apparatus according to any one of the preceding claims, which holds the substrate.   The lithography apparatus according to claim 17, wherein an imprint process is performed to form a pattern on the imprint material on the substrate held by the stage apparatus using a mold. Forming a pattern on a substrate using the lithographic apparatus of claim 17 or 18;
Processing the substrate having the pattern formed in the step;
Manufacturing an article from the processed substrate;
A method for producing an article, comprising:

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