JP6505486B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

  The present invention includes a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magnetooptical disk, a glass substrate for a photomask, a substrate for a solar cell, etc. The present invention relates to a substrate processing technique for processing a substrate (hereinafter simply referred to as "substrate").

  As a substrate processing apparatus for performing such processing, Patent Document 1 discloses an apparatus including a holding member for holding a substrate horizontally from below and a disk-shaped nozzle provided between the holding member and the substrate. It is disclosed. The disk-shaped nozzle faces the central portion of the lower surface of the substrate W. The said apparatus discharges a process liquid towards the center part of the lower surface of a board | substrate from a disk shaped nozzle, rotating a holding member. The discharged processing liquid moves from the central portion of the lower surface to the peripheral portion and is discharged from the peripheral portion to the outside of the substrate so as to cover the entire lower surface of the substrate by centrifugal force. This processes the entire lower surface of the substrate.

Unexamined-Japanese-Patent No. 2011-211094

  However, in the apparatus of Patent Document 1, there is a problem that a part of the processing liquid discharged onto the lower surface of the substrate drops from the lower surface of the substrate, adheres to the upper surface of the holding member, and remains as it is.

  The present invention has been made to solve these problems, and prevents the treatment liquid supplied to the lower surface of the substrate held and rotated by the holding member from falling and adhering onto the holding member and remaining as it is. It aims to provide technology that can

In order to solve the above problems, the substrate processing method according to the first aspect holds the substrate substantially horizontally from the lower side, has an upper surface facing the lower surface of the substrate with a gap, and has a predetermined rotation axis. Rotating the holding member rotatably provided around the rotation axis with the substrate, and from below the central portion of the lower surface of the substrate held and rotated by the holding member to the central portion Between the central portion of the substrate held and rotated by the holding member and the central portion of the holding member so as to discharge the treatment liquid so that the treatment liquid is spread toward the lower surface of the substrate; And a cleaning liquid discharge step of discharging the cleaning liquid toward the radial outside of the holding member along the upper surface of the holding member, and the processing liquid discharge step and the cleaning liquid discharge step are performed in parallel.

In the substrate processing method according to the second aspect, a holding member which holds a substrate substantially horizontally from below, has an upper surface facing the lower surface of the substrate with a gap, and is rotatably provided around a predetermined rotation axis. And rotating the substrate and the substrate about the rotation axis, and discharging the chemical solution as the processing liquid from below the central portion of the lower surface of the substrate held and rotated by the holding member. A treatment liquid discharge step, from the center portion of the substrate held and rotated by the holding member to the central portion of the holding member and directed radially outward of the holding member along the upper surface of the holding member And a cleaning liquid discharge step of discharging the cleaning liquid, and the processing liquid discharge step and the cleaning liquid discharge step are performed in parallel.

  The substrate processing method according to the third aspect is the substrate processing method according to the first or second aspect, wherein the processing liquid discharging step includes both the central portion of the lower surface of the substrate and the upper surface of the holding member. And the step of discharging the processing liquid toward the central portion of the lower surface from the processing liquid discharge port provided on the upper surface of the plate-like member of the nozzle provided with the plate-like member facing the gap The diameter of the holding member along the surfaces of both the upper surface or the lower surface of the plate member and the upper surface of the holding member from the cleaning solution discharge port provided on the upper surface or the lower surface of the plate member of the nozzle It is a step of discharging the cleaning liquid outward in the direction.

  A substrate processing method according to a fourth aspect is the substrate processing method according to the first or second aspect, wherein the processing liquid discharging step includes both the central portion of the lower surface of the substrate and the upper surface of the holding member. And the step of discharging the processing liquid toward the central portion of the lower surface of the substrate from the processing liquid discharge port provided on the upper surface of the plate-like member of the nozzle provided with the plate-like member facing the gap The discharging step is a step of discharging the washing solution from the washing solution discharge port provided on the side surface of the plate-like member of the nozzle along the upper surface of the holding member toward the radially outer side of the holding member.

A substrate processing apparatus according to a fifth aspect of the present invention is a holding member that holds a substrate substantially horizontally from below, has an upper surface facing the lower surface of the substrate with a gap, and is rotatably provided around a predetermined rotation axis. And a rotation mechanism for rotating the holding member around the rotation axis, and discharging the processing liquid so that the processing liquid spreads on the lower surface of the substrate from below the central portion of the lower surface of the substrate toward the central portion A processing liquid discharge port, and a cleaning liquid discharge port for discharging a cleaning liquid radially outward of the holding member along the upper surface of the holding member from between the central portion of the substrate and the central portion of the holding member; And a nozzle provided , wherein the processing liquid discharge step and the cleaning liquid discharge step are performed in parallel.
A substrate processing apparatus according to a sixth aspect holds a substrate substantially horizontally from the lower side, has an upper surface facing the lower surface of the substrate with a gap, and is provided rotatably around a predetermined rotation axis. A rotation mechanism for rotating the holding member around the rotation axis, a treatment liquid discharge port for discharging a chemical solution as a treatment liquid from below the central portion of the lower surface of the substrate toward the central portion, and the substrate And a nozzle provided with a cleaning liquid discharge port for discharging a cleaning liquid from the central portion of the holding member to the radial outer side of the holding member along the upper surface of the holding member from between the central portion of the holding member And performing the processing liquid discharge step and the cleaning liquid discharge step in parallel.

A substrate processing apparatus according to a seventh aspect is the substrate processing apparatus according to the fifth or sixth aspect, wherein the nozzle has a gap between both the central portion of the lower surface of the substrate and the upper surface of the holding member. The processing liquid discharge port is provided on the upper surface of the plate-like member and discharges the processing liquid toward the central portion of the lower surface of the substrate, and the cleaning liquid discharge port is provided with the processing liquid discharge port. It is provided on the upper surface or the lower surface of the plate-like member, and the cleaning solution is discharged radially outward of the holding member along both the upper surface or the lower surface of the plate-like member and the upper surface of the holding member.

A substrate processing apparatus according to an eighth aspect is the substrate processing apparatus according to the fifth or sixth aspect, wherein the nozzle has a gap between both the central portion of the lower surface of the substrate and the upper surface of the holding member. The processing liquid discharge port is provided on the upper surface of the plate-like member and discharges the processing liquid toward the central portion of the lower surface of the substrate, and the cleaning liquid discharge port is provided with the processing liquid discharge port. It is provided on the side surface of the plate-like member, and discharges the cleaning solution radially outward of the holding member along the upper surface of the holding member.

In the invention according to any of the first, second, fifth, and sixth aspects, the cleaning liquid is discharged toward the radially outer side of the holding member along the upper surface of the holding member. As a result, it is possible to clean the upper surface of the holding member by the cleaning liquid while suppressing the cleaning liquid from being mixed with the processing liquid adhering to the lower surface by hitting the lower surface of the substrate, and the processing liquid dropped from the lower surface of the substrate It can be washed away with the cleaning solution before it adheres to the top surface. Therefore, it is possible to suppress that the processing liquid supplied to the lower surface of the substrate drops and adheres onto the holding member and remains as it is.

According to the invention of the first and second aspects, the processing liquid discharge step and the cleaning liquid discharge step are performed in parallel, so that the processing liquid discharged on the back surface of the substrate adheres to the upper surface of the holding member. It can be efficiently suppressed. Also in the fifth and sixth aspects, adhesion of the processing liquid discharged on the back surface of the substrate to the top surface of the holding member can be efficiently suppressed.

In the invention according to any of the third and seventh aspects, the cleaning solution is directed radially outward of the holding member along both the upper surface or the lower surface of the plate member of the nozzle and the upper surface of the holding member. Since the discharge is performed, the nozzle can also be cleaned during the cleaning of the holding member.

Also in the invention according to the fourth and eighth aspects, the cleaning liquid is discharged radially outward of the holding member along the upper surface of the holding member from the cleaning liquid discharge port provided on the side surface of the plate member of the nozzle Be done. Therefore, the shape of the cleaning liquid discharge port can be elongated in the circumferential direction of the plate-like member, and the discharged cleaning liquid can be easily spread.

It is a schematic diagram for demonstrating the structure of the substrate processing apparatus which concerns on embodiment. FIG. 2 is a perspective view showing the blocking plate and the spin base of FIG. 1 disposed at a processing position. It is a perspective view which shows the spin base of FIG. It is a perspective view which shows the blocking plate of FIG. It is a perspective view which shows the spin base of FIG. It is a longitudinal cross-sectional view which shows the shielding plate of FIG. 2, and the peripheral part of spin base. FIG. 3 is another longitudinal cross-sectional view showing the blocking plate of FIG. 2 and the peripheral portion of the spin base. It is a cross-sectional view of the control part of FIG. It is sectional drawing which shows the state by which the control part of FIG. 8 was covered by the elastic member. It is a perspective view which shows the other structural example of the blocking plate which concerns on embodiment, and a spin base. It is a perspective view which shows the state in which the shielding plate of FIG. 10 was arrange | positioned in the process position. It is a longitudinal cross-sectional view of the other structural example of the blocking plate which concerns on embodiment, and a spin base. FIG. 13 is a longitudinal cross-sectional view showing another cross section of the blocking plate and the spin base of FIG. 12; It is a cross-sectional view which shows the other structural example of the control part which concerns on embodiment. It is a cross-sectional view which shows the other state of the control part of FIG. It is a cross-sectional view which shows the other state of the control part of FIG. It is a cross-sectional view which shows the other state of the control part of FIG. It is sectional drawing which shows the other structural example of the control part which concerns on embodiment. It is sectional drawing which shows the other structural example of the control part which concerns on embodiment. It is a schematic diagram for demonstrating the structure of the nozzle of FIG. It is a flowchart which shows an example of operation | movement of the substrate processing apparatus which concerns on embodiment.

  Hereinafter, embodiments will be described with reference to the drawings. The following embodiment is an example embodying the present invention, and is not an example limiting the technical scope of the present invention. Further, in each of the drawings referred to below, the dimensions and the number of each part may be exaggerated or simplified for ease of understanding. The vertical direction is the vertical direction, and the substrate side is above the spin base.

<About the embodiment>
<1. Configuration of Substrate Processing Apparatus 1>
The configuration of the substrate processing apparatus 1 will be described with reference to FIGS. 1 to 5. FIG. 1 is a schematic view for explaining the configuration of the substrate processing apparatus 1. FIG. 1 shows a state in which the blocking plate 90 is disposed at the retracted position. Also, the blocking plate 90 disposed at the processing position is shown by a phantom line. FIG. 2 is a schematic perspective view showing the blocking plate 90 and the spin base 21 which rotate around the rotation axis a1 in a state where the blocking plate 90 is disposed at the processing position. FIG. 3 is a schematic perspective view of the spin base 21 holding the substrate 9 and rotating around the rotation axis a1, as viewed obliquely from above. The description of the shield plate 90 is omitted. The surface shape of the substrate 9 is substantially circular. The loading and unloading of the substrate 9 to and from the substrate processing apparatus 1 is performed by a robot or the like in a state where the shielding plate 90 is disposed at the retreat position. The substrate 9 carried into the substrate processing apparatus 1 is detachably held by the spin base 21. FIG. 4 is a schematic perspective view of the blocking plate 90 as viewed obliquely from below. FIG. 5 is a schematic perspective view of the spin base 21 as viewed obliquely from above.

  In the following description, the term "treatment liquid" includes "chemical solution" used for chemical solution treatment and "rinse solution (also referred to as" cleaning fluid ") used for rinse treatment to rinse out the chemical solution. Be

  The substrate processing apparatus 1 includes a spin chuck 2, a scattering prevention unit 3, a surface protection unit 4, a processing unit 5, and a control unit 130. These units 2 to 5 are electrically connected to the control unit 130, and operate according to an instruction from the control unit 130. As the control unit 130, for example, the same one as a general computer can be adopted. That is, for example, the control unit 130 stores a CPU that performs various arithmetic processing, a ROM that is a read only memory that stores basic programs, a RAM that is a readable and writable memory that stores various information, and stores control software and data. It has a magnetic disk, etc. In the control unit 130, the CPU as the main control unit performs arithmetic processing in accordance with the procedure described in the program to control each unit of the substrate processing apparatus 1.

<Spin chuck 2>
The spin chuck 2 is a substrate holding unit that holds the substrate 9 in a substantially horizontal posture with the one main surface directed upward, and is a vertical rotation passing the center c1 of the main surface. Rotate around axis a1.

  The spin chuck 2 includes a spin base (“holding member”) 21 which is a disk-shaped member slightly larger than the substrate 9. The spin base 21 is formed with cylindrical through holes 21a respectively opened at the centers of the upper and lower surfaces thereof such that the central axes thereof coincide with the rotation axis a1. A cylindrical rotary shaft 22 is connected to the lower opening of the through hole 21a. As a result, the through hole 21 a and the hollow portion of the rotary shaft portion 22 communicate with each other. The rotating shaft portion 22 is disposed in such a posture as to follow the axis in the vertical direction. Further, a rotary drive unit (for example, a motor) 23 is connected to the rotary shaft unit 22. The rotation drive unit 23 rotationally drives the rotation shaft unit 22 around its axis. The axis of the rotation shaft 22 coincides with the rotation axis a1. Accordingly, the spin base 21 can rotate around the rotation axis a1 together with the rotation shaft portion 22. The rotary shaft portion 22 and the rotary drive portion 23 are accommodated in a cylindrical casing 24.

  In addition, a plurality of (for example, six) chuck pins 25 are provided in the vicinity of the peripheral portion of the upper surface of the spin base 21 at appropriate intervals. Each chuck pin 25 is attached to the spin base 21 at a plurality of openings 21 b provided on the top surface of the spin base 21. The chuck pin 25 abuts on the end face of the substrate 9 to position the substrate 9 in the horizontal direction, and at a position slightly higher than the upper surface of the spin base 21 (that is, spaced apart from the upper surface of the spin base 21 And hold the substrate 9 in a substantially horizontal posture. That is, the spin base 21 holds the substrate 9 substantially horizontally from below via the chuck pins 25. The upper surface of the spin base 21 faces the lower surface of the substrate 9 with a gap, for example, substantially in parallel. Two protrusions 26 are provided at equal intervals along the circumferential direction on the cylindrical side portion of the spin base 21. At least one protrusion 26 may be provided, and a large number of protrusions 26 may be provided.

  In this configuration, with the spin base 21 holding the substrate 9 by the chuck pins 25 thereabove, when the rotary drive unit 23 rotates the rotary shaft portion 22, the spin base 21 rotates around an axis along the vertical direction. Thus, the substrate 9 held on the spin base 21 is rotated about a vertical rotation axis a1 passing through the center c1 in the plane. In the surface protection unit 4 described later, a blocking plate 90 is provided rotatably in a circumferential direction around the rotation axis a1. The relative position of the spin base 21 and the shield plate 90 in the circumferential direction can be regulated. In the state where the relative position is restricted, when the rotation drive unit 23 rotates the rotation shaft portion 22, the spin base 21, the substrate 9, and the shield plate 90 rotate in the same rotation direction at the same rotation speed. The rotation drive unit 23, the protrusion 26, and the restriction structure 94 are rotation mechanisms 231 that rotate the spin base 21 and the blocking plate 90 in the same direction around the rotation axis a1.

  In addition, the other rotation drive part which rotates the blocking plate 90 centering | focusing on the rotating shaft a1 in the state by which the said relative position was restrict | limited may be replaced with the rotation drive part 23, and may be provided. In this case, the other rotation drive unit is one of the components of the rotation mechanism 231 instead of the rotation drive unit 23. Moreover, both the rotation drive part 23 and the said other rotation drive part may be provided. That is, the rotation mechanism 231 rotates at least one of the spin base 21 and the shield plate 90 about the rotation axis a1 in a state where the relative position between the spin base 21 and the shield plate 90 in the circumferential direction is restricted. When the rotation mechanism 231 rotates the spin base 21 and the blocking plate 90 at the same speed in the same direction, an air flow toward the center c1 of the substrate 9 is generated between the upper surface of the substrate 9 and the lower surface of the blocking plate 90. Can be suppressed. This can suppress the suction of the processing solution from the upper surface of the substrate.

  In the case where both the rotation drive unit 23 and the other rotation drive unit are provided, the restriction structure 94 and the protrusion 26 may not be provided. In this case, the speed at which the rotation drive unit 23 rotates the spin base 21 may be different from the speed at which the other rotation drive unit rotates the blocking plate 90 in the same direction as the spin base 21. Further, in the case where both the rotation drive unit 23 and the other rotation mechanism are provided, the tip end of the extended portion 92 may be located slightly above the upper surface of the spin base 21.

  The chuck pin 25 and the rotational drive unit 23 are electrically connected to the control unit 130, and operate under the control of the control unit 130. That is, the timing of holding the substrate 9 on the spin base 21, the timing of opening the held substrate 9, and the rotation mode of the spin base 21 (specifically, the rotation start timing, the rotation end timing, the rotation number , Rotational speed), etc. are controlled by the control unit 130.

Scattering prevention unit 3
The scattering prevention unit 3 receives the processing liquid etc. scattered from the substrate 9 rotated with the spin base 21.

  The scattering prevention unit 3 includes a splash guard 31. The splash guard 31 is a cylindrical member having an open upper end, and is provided to surround the spin chuck 2. In this embodiment, the splash guard 31 is, for example, three of a bottom member 311, an inner member (also referred to as "inner guard" or simply "guard") 312, and an outer member (also referred to as "outer guard") 313. It is comprised including each member. The outer member 313 may not be provided, and conversely, a guard may be provided outside the outer member 313 so as to surround the spin chuck 2.

  The bottom member 311 is a cylindrical member having an open upper end, and a circular bottom, a cylindrical inner side wall extending upward from the inner edge of the bottom, and a cylinder extending upward from the outer edge of the bottom And an outer wall portion of At least near the tip of the inner wall portion is accommodated in the inner space of a bowl-shaped member 241 provided on the casing 24 of the spin chuck 2.

  At the bottom, a drainage groove (not shown) communicating with the space between the inner side wall and the outer side wall is formed. The drainage groove is connected to the drainage line of the factory. Further, an exhaust liquid mechanism is connected to the drainage groove for forcibly exhausting the inside of the groove to make the space between the inner side wall portion and the outer side wall portion a negative pressure state. A space between the inner side wall portion and the outer side wall portion is a space for collecting and draining the treatment liquid used for the treatment of the substrate 9, and the treatment liquid collected in this space is Be drained.

  The inner member 312 is a cylindrical member having an open upper end, and the upper portion ("upper end portion", "upper end portion") of the inner member 312 extends inward and upward. That is, the upper portion extends obliquely upward toward the rotation axis a1. The lower portion of the inner member 312 is formed with a cylindrical inner peripheral wall extending downward along the upper inner peripheral surface and a cylindrical outer peripheral wall extending downward along the upper outer peripheral surface. In a state where the bottom member 311 and the inner member 312 are close to each other (the state shown in FIG. 1), the outer wall of the bottom member 311 is accommodated between the inner circumferential wall and the outer circumferential wall of the inner member 312. The treatment liquid and the like received by the upper portion of the inner member 312 are discharged through the bottom member 311.

  The outer member 313 is a tubular member whose upper end is opened, and is provided outside the inner member 312. An upper portion ("upper end portion", "upper end portion") of the outer member 313 extends inward and upward. That is, the upper portion extends obliquely upward toward the rotation axis a1. The lower portion extends downward along the outer peripheral wall of the inner member 312. The treatment liquid and the like received by the upper portion of the outer member 313 are discharged from the gap between the outer peripheral wall portion of the inner member 312 and the lower portion of the outer member 313.

  The splash guard 31 is provided with a guard drive mechanism ("lifting drive unit") 32 that moves the splash guard 31 up and down. The guard drive mechanism 32 is configured by, for example, a stepping motor. In this embodiment, the guard drive mechanism 32 raises and lowers the three members 311, 312 and 313 provided in the splash guard 31 independently.

  Each of the inner member 312 and the outer member 313 is moved between the upper position and the lower position under the drive of the guard drive mechanism 32. Here, the upper positions of the members 312 and 313 are positions where the upper end edges of the members 312 and 313 are disposed on the side and upper side of the substrate 9 held on the spin base 21. On the other hand, the lower positions of the members 312 and 313 are positions where the upper end edges of the members 312 and 313 are disposed lower than the upper surface of the spin base 21. The upper position (lower position) of the outer member 313 is located slightly above the upper position (lower position) of the inner member 312. The inner member 312 and the outer member 313 are raised or lowered simultaneously or sequentially so as not to collide with each other. The bottom member 311 is driven by the guard drive mechanism 32 between a position where the inner side wall portion thereof is accommodated in the inner space of the bowl-like member 241 provided in the casing 24 and a position below it. However, the guard drive mechanism 32 is electrically connected to the control unit 130, and operates under the control of the control unit 130. In other words, the position of the splash guard 31 (specifically, the positions of the bottom member 311, the inner member 312, and the outer member 313) is controlled by the control unit 130.

<Surface protection unit 4>
The surface protection unit 4 supplies a gas (cover gas) to the vicinity of the center of the upper surface of the substrate 9 held on the spin base 21 to make the upper surface of the substrate 9 the atmosphere of the processing liquid supplied to the lower surface. Protect from etc.

  The surface protection unit 4 includes a cylindrical cover gas nozzle 41 that discharges gas toward the vicinity of the center of the upper surface of the substrate 9 held on the spin base 21. The cover gas nozzle 41 is attached to a portion near the tip of the horizontally extending arm 42 and penetrates the arm 42 in the vertical direction. The central axis of the cover gas nozzle 41 coincides with the rotation axis a1. The lower end portion of the cover gas nozzle 41 extends further downward from the lower end surface of the arm 42. A disc-shaped rotating portion 93 is attached to the lower end portion of the cover gas nozzle 41 via a bearing. The central axis of the rotating portion 93 coincides with the rotation axis a1. Thus, the rotating portion 93 can rotate in the circumferential direction around the cover gas nozzle 41 about the rotation axis a1.

  A disc-shaped blocking plate (“opposite member”) 90 is rotatably attached to the lower portion of the rotating portion 93 together with the rotating portion 93. The upper surface of the blocking plate 90 is provided so as to be substantially horizontal, and its shape is a circle slightly larger than the spin base 21, and the rotation axis a1 passes through the center thereof. Thus, the blocking plate 90 can rotate in the circumferential direction about the rotation axis a1. The blocking plate 90 includes a disc-shaped main body 91 having the rotation axis a1 as a central axis, and an extending portion 92 provided on the peripheral edge of the main body 91. A through hole 91 a communicating with the cover gas nozzle 41 is provided at the center of the main body 91. The extending portion 92 is a cylindrical wall portion (annular wall portion) extended downward from the peripheral edge portion of the main body portion 91, and is provided along the circumferential direction of the peripheral edge portion. The extending portion 92 is a cylindrical member extending from the peripheral edge of the main body 91 to the spin base 21 so as to surround the end face of the substrate 9. The extending portion 92 crosses the plane including the substrate 9 at the outside of the end face of the substrate 9 and protrudes toward the spin base 21 more than the substrate 9.

  The proximal end of the arm 42 is connected to the nozzle base 43. The nozzle base 43 is disposed in such a posture as to align its axis in the vertical direction, and is configured to be extensible and contractible in the vertical direction. The proximal end of the arm 42 is connected to the upper end of the nozzle base 43. The nozzle base 43 is provided with a drive portion ("moving portion") 44 which extends and retracts the nozzle base 43 along its axis. The drive unit 44 includes, for example, a stepping motor.

  The drive unit 44 rotates the blocking plate 90 between the processing position ("first position") and the retracted position ("second position") above the processing position by extending and retracting the nozzle base 43. It moves relative to the spin base 21 along the a1 direction. The processing position of the blocking plate 90 is a position above the substrate 9 held on the spin base 21 and the lower surface of the blocking plate 90 approaches the upper surface of the substrate 9 in a non-contact state while facing the upper surface It is a position. The retracted position of the blocking plate 90 is a position at which the blocking plate 90 does not interfere with the transport path of the substrate 9, for example, a position above the upper edge of the splash guard 31. When the blocking plate 90 is disposed at the processing position, the main body 91 faces the upper surface of the substrate 9 held by the spin base 21 with a gap, for example, substantially in parallel. The drive unit 44 is electrically connected to the control unit 130, and operates under the control of the control unit 130. That is, the position of the blocking plate 90 is controlled by the control unit 130.

  Two restricting structures 94 are provided at the tip end portion of the extending portion 92. As the restriction structure 94, for example, as shown in FIG. 4, a recessed portion which is open from the tip end surface of the extending portion 92 to the inner peripheral surface of the extending portion 92 is employed. At least a part of the protrusion 26 is accommodated in the recess.

  Initial positions (initial rotation angles) in the circumferential direction of the spin base 21 and the shield plate 90 are set in advance. When the blocking plate 90 is disposed at the retracted position above the processing position, the spin base 21 and the blocking plate 90 are disposed at initial positions in the circumferential direction. In this state, the two restricting structures 94 are on the tip end side of the extending portion 92 so as to respectively overlap with the two projecting portions 26 provided on the side surface portion of the spin base 21 when viewed from above the blocking plate 90. It is provided in each part.

  As shown in FIG. 6, at least a part of the protrusion 26 is accommodated in the restriction structure 94 in a state where the blocking plate 90 is disposed at the processing position. In this case, the restriction structure 94 is disposed to face the protrusion 26 from the front and rear in the circumferential direction around the rotation axis a1, and restricts the relative movement of the protrusion 26 in the circumferential direction. Further, in the state where the blocking plate 90 is disposed at the processing position, the extending portion 92 extends from the peripheral edge portion of the main body portion 91 to the side of the spin base 21. The restricting structure 94 is disposed below the upper surface of the spin base 21. That is, both the protrusion 26 and the restriction structure 94 are disposed below the upper surface of the spin base 21. The relative movement between the spin base 21 and the shield plate 90 in the circumferential direction about the rotation axis a1 is mutually restricted via the projection 26 and the restriction structure 94. That is, the restricting structure 94 and the protrusion 26 are the restricting portion 201 which restricts the relative movement of the spin base 21 and the blocking plate 90 in the circumferential direction. In other words, the restricting portion 201 restricts the relative position of the blocking plate 90 to the spin base 21 in the circumferential direction around the rotation axis a1.

  When the blocking plate 90 is disposed at the retracted position, the circumferential rotational positions of the restricting structure 94 and the protrusion 26 centering on the rotation axis a1 are aligned with each other. The restricting structure 94 is disposed so as to avoid the movement path of the projection 26 relative to the restricting structure 94 in the process of moving the blocking plate 90 from the retracted position to the processing position. Thereby, the collision with the regulation structure 94 and the protrusion part 26 in the said movement process can be avoided. When the blocking plate 90 is disposed at the processing position, the regulating structure 94 is disposed to face the protrusion 26 from the front and rear in the circumferential direction centering on the rotation axis a1. More specifically, immediately after the restricting structure 94 is disposed at the processing position, when the spin base 21 is stopped, the restricting structure 94 protrudes from the front and back of the circumferential direction without contacting the protrusion 26. It is disposed to face the portion 26. Thereby, the relative position of the blocking plate 90 to the spin base 21 is restricted in the circumferential direction. In addition, when the blocking plate 90 is disposed at the retracted position, the restriction structure 94 is disposed relatively away from the protrusion 26 along the direction of the rotation axis a1.

  When the rotation drive unit 23 rotates the rotation shaft portion 22 in a state where the blocking plate 90 is disposed at the processing position and the relative position in the circumferential direction of the blocking plate 90 with respect to the spin base 21 is regulated by the regulating portion 201, The spin base 21 rotates with the substrate 9. As a result, the protrusion 26 abuts on the portion of the restriction structure 94 on the downstream side in the rotational direction with respect to the protrusion 26. Thereafter, the blocking plate 90 is driven to rotate at the same rotational speed in the same rotational direction as the spin base 21.

  Here, for example, it is assumed that the emergency stop operation is performed while the substrate processing apparatus 1 is processing while rotating the substrate. For example, in this case, it is assumed that the substrate processing apparatus 1 moves the blocking plate 90 to the retreat position. Thus, even when the blocking plate 90 and the spin base 21 are not at the initial position (initial rotation angle), it is necessary to automatically restart the process. The spin base 21 is rotatable by being driven by the rotation drive unit 23, while the blocking plate 90 is driven to rotate by the rotation of the spin base 21. Therefore, the following operation is required. The control unit 130 controls the drive unit 44 to move the blocking plate 90 in the vertical direction, for example, so that the blocking plate 90 slightly contacts the spin base 21. Thereafter, the control unit 130 controls the rotation drive unit 23 to rotate the spin base 21 at a low speed, thereby rotating the blocking plate 90 in the circumferential direction around the rotation axis a1.

  The blocking plate 90 includes a sensor capable of detecting an initial position of the blocking plate 90 in the circumferential direction. The control unit 130 controls the rotation drive unit 23 to stop the rotation of the shielding plate 90 when the shielding plate 90 reaches the initial position based on the output of the sensor.

  Thereafter, the control unit 130 controls the drive unit 44 to move the blocking plate 90 to the upper retraction position, and controls the rotation drive unit 23 to rotate the spin base 21 to the initial position in the circumferential direction. Thus, in a state where the blocking plate 90 is disposed at the retracted position, the blocking plate 90 and the spin base 21 are disposed at initial positions in the circumferential direction. When the blocking plate 90 moves relative to the spin base 21 between the retracted position and the processing position, it is preferable that the blocking plate 90 not deviate from the initial position in the circumferential direction. For this reason, the surface protection unit 4 preferably includes a lock mechanism for fixing the circumferential position of the rotating portion 93 and the blocking plate 90 with respect to the arm 42 in a state where the blocking plate 90 is disposed at the initial position in the circumferential direction. . When the blocking plate 90 is in the processing position, the locking mechanism is released.

  In the example of FIGS. 4 and 5, the restricting structure 94 is provided on the tip end portion (lower end side portion) of the extending portion 92, and the protrusion 26 is provided on the side surface portion of the spin base 21. The protrusion portion 26 may be provided on the tip end side portion of the extending portion 92 while the side surface portion 94 of the spin base 21 is provided. That is, the projecting portion 26 is provided on one of the tip end side portion of the extending portion 92 of the blocking plate 90 and the side surface portion of the spin base 21, and the restricting structure 94 is provided on the other portion.

  As the restriction structure 94, for example, a pair of projecting portions may be employed, which are disposed to face the projecting portion 26 from the front and rear in the circumferential direction about the rotation axis a1, instead of the recess. Also in this case, the relative movement of the protrusion 26 in the circumferential direction can be restricted by the restriction structure, so the usefulness of the present invention is not impaired. As shown in FIG. 4, when the recess capable of accommodating at least a part of the protrusion 26 is employed as the restricting structure, the distance between the spin base 21 and the extending portion 92 of the blocking plate 90 is narrower. Since it is possible, the blocking plate 90 can be made smaller in diameter.

  In addition, although the extending portion 92 shown in FIG. 4 is a cylindrical member, a plurality of wall portions which are dispersed in the circumferential direction in the peripheral portion of the main body 91 as the extending portion and extend downward from the peripheral portion Or, a column may be used. The extension portion extends laterally from the spin base 21 from at least a part of the peripheral portion of the main body portion 91. If the extending portion is a cylindrical member, the flow of the processing liquid supplied to the substrate 9 and discharged to the outside from the substrate 9 is not traversed, so that the amount of processing liquid rebounding from the extending portion toward the substrate 9 may be reduced. it can.

The cover gas nozzle 41 is connected to a cover gas supply unit 45 which is a piping system for supplying a gas (here, for example, nitrogen (N ₂ ) gas) thereto. Specifically, in the cover gas supply unit 45, for example, a nitrogen gas supply source 451, which is a supply source for supplying nitrogen gas, is connected to the cover gas nozzle 41 via a pipe 452 in which an on-off valve 453 is inserted. It has the following configuration. In this configuration, when the on-off valve 453 is opened, nitrogen gas supplied from the nitrogen gas supply source 451 is discharged from the through hole 91 a provided at the center of the blocking plate 90 through the cover gas nozzle 41. The gas supplied to the cover gas nozzle 41 may be a gas other than nitrogen gas (for example, various inert gases other than nitrogen gas, dry air, etc.).

  When gas is supplied from the cover gas supply unit 45 to the cover gas nozzle 41 in the state where the blocking plate 90 is disposed at the processing position, the center of the upper surface of the substrate 9 held on the spin base 21 from the cover gas nozzle 41 A gas (cover gas) is discharged toward the upper surface of the substrate 9 toward the vicinity. However, the on-off valve 453 of the cover gas supply unit 45 is electrically connected to the control unit 130, and is opened and closed under the control of the control unit 130. That is, the control unit 130 controls the discharge mode of the gas from the cover gas nozzle 41 (specifically, discharge start timing, discharge end timing, discharge flow rate, and the like).

<Processing unit 5>
The processing unit 5 performs processing on the processing surface (the lower surface in the example of FIG. 1) of the substrate 9 held on the spin base 21. Specifically, the processing unit 5 supplies the processing liquid to the processing surface of the substrate 9 held on the spin base 21, that is, the lower surface. Further, the processing unit 5 supplies a rinse liquid along the upper surface of the spin base 21 to clean the upper surface.

  As shown in FIG. 1, the processing unit 5 includes, for example, a supply pipe 81 disposed through the hollow portion of the rotation shaft portion 22 of the spin chuck 2 and the through hole 21 a. A nozzle 50A is connected to the tip of the supply pipe 81 (the end on the substrate 9 side). The treatment liquid supply pipe 811 and the rinse liquid supply pipe 812 are inserted through the supply pipe 81. The treatment liquid supply pipe 83 is connected to a treatment liquid supply unit 83 which is a piping system for supplying the treatment liquid thereto. The rinse liquid supply pipe 812 is connected to a rinse liquid supply unit 84 which is a piping system for supplying a rinse liquid thereto.

  FIG. 20 is a schematic view for explaining the configuration of the nozzle 50A. The nozzle 50A is provided with a circular plate-like member 51 opposed substantially parallel to the central portion of the lower surface of the substrate 9 and the upper surface of the spin base 21 with a gap therebetween. The central axis of the plate-like member 51 is the rotation axis a1, as with the rotation shaft portion 22. The diameter of the plate-like member 51 is set, for example, to the same size as or slightly larger than the diameter of the rotary shaft portion 22.

  The upper surface 52 of the plate-like member 51 faces substantially parallel to the lower surface of the substrate 9, and the lower surface 53 faces substantially central portion of the upper surface of the spin base 21. The central portion of the upper surface 52 has a convex shape closer to the substrate 9 than the peripheral portion of the upper surface 52, and the central portion of the lower surface 53 has a convex shape closer to the upper surface of the spin base 21 than the central portion of the lower surface 53. Have. In the example of FIG. 20, the central portion of the upper surface 52 is formed in a truncated cone shape, and the central portion of the lower surface 53 is formed in a disk shape.

  At a central portion of the upper surface 52 of the plate-like member 51, a treatment liquid discharge port 54 having an opening facing the center of the substrate 9 is provided. The treatment liquid discharge port 54 is connected to the treatment liquid supply pipe 811. The treatment liquid discharge port 54 is directed in the substantially vertical direction from the lower side of the central portion of the substrate 9 toward the central portion of the lower surface of the substrate 9 from the lower portion of the central portion of the substrate 9. Discharge. Further, a rinse liquid discharge port ("washing liquid discharge port") 55 is provided on the side surface of the central portion of the upper surface 52, and a rinse liquid discharge port 56 is provided on the side surface of the central portion of the lower surface 53. . The rinse liquid discharge ports 55 and 56 are connected to the rinse liquid supply pipe 812 respectively. The rinse liquid discharge ports 55 and 56 respectively discharge the rinse liquid supplied from the rinse liquid supply unit 84 through the rinse liquid supply pipe 812 along the upper surface of the spin base 21 radially outward of the spin base 21. . More specifically, the rinse liquid discharge port 55 discharges the rinse liquid outward in the radial direction of the spin base 21 along the upper surface 52 and the upper surface of the spin base 21, and the rinse liquid discharge port 56. The discharge liquid is discharged outward in the radial direction of the spin base 21 along the lower surface 53 and the upper surface of the spin base 21.

  The nozzle 50A may have only one of the rinse liquid discharge ports 55 and 56. Further, side discharge ports formed on the outer peripheral surface (side surface) of the plate-like member 51 and discharging the rinse liquid to the radially outer side of the spin base 21 along the upper surface of the spin base 21 are rinse liquid discharge ports 55, 56. Alternatively, it may be provided in addition to at least one of the rinse liquid discharge ports 55, 56.

  The substrate processing apparatus 1 may further be provided with a nozzle capable of supplying the processing liquid to the upper surface of the substrate 9 (more specifically, the entire upper surface or the peripheral portion thereof). Such a nozzle is provided, for example, on the blocking plate 90.

  Specifically, the treatment liquid supply unit 83 includes an SC-1 supply source 831a, a DHF supply source 831b, an SC-2 supply source 831c, a rinse liquid supply source 831d, a plurality of pipes 832a, 832b, 832c, 832d, and A plurality of on-off valves 833a, 833b, 833c, and 833d are configured in combination. Specifically, the rinse liquid supply unit 84 is configured to include a rinse liquid supply source 841 d, a pipe 842 d, and an on-off valve 843 d.

  The SC-1 source 831a is a source for supplying SC-1. The SC-1 supply source 831a is connected to the supply pipe 81 via a pipe 832a in which an on-off valve 833a is interposed. Therefore, when the on-off valve 833a is opened, SC-1 supplied from the SC-1 supply source 831a is discharged from the nozzle 50A.

  The DHF source 831 b is a source that supplies DHF. The DHF supply source 831 b is connected to the supply pipe 81 via a pipe 832 b in which an on-off valve 833 b is interposed. Therefore, when the on-off valve 833b is opened, DHF supplied from the DHF supply source 831b is discharged from the nozzle 50A.

  The SC-2 source 831 c is a source that supplies SC-2. The SC-2 supply source 831c is connected to the supply pipe 81 via a pipe 832c in which an on-off valve 833c is interposed. Therefore, when the on-off valve 833c is opened, SC-2 supplied from the SC-2 supply source 831c is discharged from the nozzle 50A.

  The rinse liquid supply sources 831 d and 841 d are supply sources for supplying the rinse liquid. Here, the rinse liquid supply sources (“washing liquid supply sources”) 831 d and 841 d supply, for example, pure water as the rinse liquid. The rinse liquid supply source 831 d is connected to the processing liquid supply pipe 811 via a pipe 832 d in which an on-off valve 833 d is interposed. Therefore, when the open / close valve 833d is opened, the rinse liquid supplied from the rinse liquid supply source 831d is discharged from the processing liquid discharge port 54 of the nozzle 50A. Further, the rinse liquid supply source 841 d is connected to the rinse liquid supply pipe 812 via a pipe 842 d in which an on-off valve 843 d is interposed. Therefore, when the open / close valve 843d is opened, the rinse liquid supplied from the rinse liquid supply source 841d is discharged from the rinse liquid discharge ports 55, 56 of the nozzle 50A. In addition, pure water, warm water, ozone water, magnetic water, reduced water (hydrogen water), various organic solvents (ion water, IPA (isopropyl alcohol), functional water (CO 2 water etc.), etc. are used as the rinse liquid. May be

  When the processing liquid (SC-1, DHF, SC-2, or rinse liquid) is supplied from the processing liquid supply unit 83 to the processing liquid supply pipe 811, the processing liquid discharge port 54 of the nozzle 50A is on the spin base 21. The processing liquid is discharged toward the vicinity of the center of the processing surface of the substrate 9 held on the substrate. In addition, when the rinse liquid is supplied from the rinse liquid supply unit 84 to the rinse liquid supply pipe 812, the rinse liquid discharge ports 55 and 56 of the nozzle 50 A move radially outward of the spin base 21 along the upper surface of the spin base 21. The rinse liquid is discharged toward the head. However, each of the on-off valves 833a, 833b, 833c, and 833d included in the treatment liquid supply unit 83 and the on-off valve 843d included in the rinse solution supply unit 84 are electrically connected to the control unit 130. It is opened and closed under control of That is, the discharge mode (specifically, the type of the processing liquid to be discharged, the discharge start timing, the discharge end timing, the discharge flow rate, etc.) of the processing liquid (that is, the processing liquid and the rinse liquid) from the nozzle 50A is controlled It is controlled by the unit 130.

  The nozzle 50A can perform the discharge of the treatment liquid from the treatment liquid discharge port 54 and the discharge of the rinse liquid from the rinse liquid discharge ports 55 and 56 in parallel. The nozzle 50A, the supply pipe 81, and the processing liquid supply unit 83, which can selectively perform the discharge of the rinse liquid, discharge the processing liquid onto the processing surface of the substrate 9 under the control of the control unit 130. It is 83A. The nozzle 50A, the supply pipe 81, and the rinse solution supply unit 84 are a rinse solution discharge unit 84A that discharges the rinse solution radially outward of the spin base 21 along the upper surface of the spin base 21.

<2. Barrier plate and spin-based configuration>
FIG. 6 and FIG. 7 are longitudinal sectional views showing the configurations of the peripheral portion of the blocking plate 90 and the spin base 21 when the blocking plate 90 is disposed at the processing position. 6 shows a cross section of the restricting portion 201, and FIG. 7 shows a cross section of a portion other than the restricting portion 201. As shown in FIG. In the example of FIGS. 6 and 7, the outer member 313 of the splash guard 31 is disposed at the upper position, and the inner member 312 is disposed at the lower position. FIG. 8 is a cross-sectional view showing the restricting portion 201. As shown in FIG. FIG. 9 is a cross-sectional view showing another restricting portion 201F according to the embodiment.

  The spin base 21 has an annular flange portion projecting radially outward from a position slightly below the upper surface of the base 28 at a disk-shaped base 28 whose upper surface shape is a circular shape and a peripheral edge (side surface) of the base 28 It has 29 and. The base portion 28 and the flange portion 29 are integrally formed of, for example, vinyl chloride. The upper surface and the lower surface of the flange portion 29 (more specifically, the lower surface of a portion other than the base end portion of the flange portion 29, that is, the lower surface of the distal end portion of the flange portion 29) are formed along a horizontal surface. The side of the is a vertical plane. An annular curved surface (“curved surface portion”) 211 along the circumferential direction of the spin base 21 is formed at the base end portion of the flange portion 29. The curved surface 211 has, for example, a cross-sectional shape of a 1⁄4 arc shape that is convex obliquely upward toward the rotation axis a1. The radius of the said circular arc is set, for example to 5 mm-10 mm. The lower surface of the tip end portion of the flange portion 29 and the portion of the side surface of the base portion 28 below the flange portion 29 are smoothly connected by a curved surface 211.

  An annular recess is formed by the upper surface of the flange portion 29 and the upper portion of the side surface of the base portion 28. A draining portion 27 which is an annular plate member is fixed to the recess by a bolt. The draining portion 27 is preferably made of, for example, a fluorine resin or the like, which is higher in heat resistance than the base portion 28. The outer peripheral edge portion of the draining portion 27 extends outside the outer peripheral edge of the flange portion 29 in the radial direction of the base portion 28. The diameter of the outer peripheral edge of the drainage portion 27, that is, the diameter of the outer peripheral edge of the spin base 21 is larger than the diameter of the substrate 9. The upper surface of the portion other than the outer peripheral edge portion (“tip portion”) of the draining portion 27 forms a horizontal plane identical to the upper surface of the base portion 28. The upper surface of the outer peripheral edge portion of the water draining portion 27 is a curved surface that protrudes and curves diagonally upward and outward. The outer peripheral portion gradually decreases in thickness as it approaches the outer peripheral edge. The two projecting portions 26 described above are respectively protruded from the tip end (outer edge) of the outer peripheral edge portion of the water draining portion 27 outward in the radial direction of the blocking plate 90. The protrusion 26 is formed in, for example, a quadrangular prism shape as shown in FIG. 5, FIG. 6, and FIG. The upper surface 261 of the protrusion 26 is a rectangular horizontal surface. The tip end surface 262 of the protrusion 26 is a rectangular vertical surface orthogonal to the upper surface 261 and whose normal passing through the center intersects the rotation axis a1. The side surfaces 263 and 264 of the protrusion 26 are rectangular vertical surfaces orthogonal to both the upper surface 261 and the tip surface 262. The upper surface 261 is located below the upper surface of the base 28. As a result, the entire protrusion 26 is positioned below the upper surface of the base 28.

  The main body 91 of the blocking plate 90 is, for example, a disk-shaped member formed of vinyl chloride. A lower surface 911 other than the peripheral edge of the lower surface of the main body 91 faces the upper surface of the substrate 9 held by the chuck pins 25 of the spin base 21 with a gap therebetween. The distance D2 between the lower surface 911 and the upper surface of the substrate 9 is, for example, about 1 mm. An annular recess is formed in the peripheral edge portion of the lower surface of the main body portion 91 along the peripheral edge. Thus, the thickness of the peripheral portion of the main body portion 91 is about half that of the other portion. The extending portion 92 has an annular shape that can be fitted in the recess. The extending portion 92 is fitted to the recess and fixed to the main body 91 by a bolt. The extension portion 92 is preferably made of, for example, a material such as a fluorine resin, which is more heat resistant than the main portion 91. The annular inner circumferential surface 921 of the extension portion 92 is erected upward from the lower end, and then extends to the upper side of the peripheral portion of the substrate 9 toward the rotation axis a1 side. An annular peripheral edge of the inner circumferential surface 921 on the side of the rotation axis a 1 is gently connected to the lower surface 911 of the main body 91, and forms an opposing surface facing the upper surface of the substrate 9 together with the lower surface 911. The extending portion 92 is a cylindrical wall portion extended downward from the peripheral edge portion of the main body portion 91, and the tip end portion extends to the side portion of the spin base 21. A portion on the tip end side (lower end side) of the extending portion 92 in the inner peripheral surface 921 of the extending portion 92 is a curved surface that is curved so as to protrude obliquely upward and outward with respect to the top surface of the spin base 21. Thereby, the width of the tip end side portion of the extending portion 92 in the radial direction of the blocking plate 90 is gradually narrowed toward the lower side, that is, the side portion of the spin base 21. As described above, the inner circumferential surface 921 is continuous with the lower surface of the blocking plate 90, and is expanded and curved so as to protrude obliquely upward and outward with respect to the upper surface of the spin base 21.

  A restricting structure 94 is formed on the distal end side portion of the extending portion 92. For example, as shown in FIGS. 4, 6, and 8, the restriction structure 94 is a recess that opens from the tip end surface of the extending portion 92 to the inner circumferential surface of the extending portion 92. The restriction structure 94 is formed to be able to accommodate at least a part of the protrusion 26 when the blocking plate 90 is disposed at the processing position. The upper surface 941 of the restriction structure 94 is a rectangular horizontal surface. The bottom surface 942 of the restriction structure 94 is a rectangular vertical surface perpendicular to the top surface 941 and whose normal passing through the center intersects the rotation axis a1. The side surfaces 943 and 944 of the restriction structure 94 are rectangular vertical surfaces orthogonal to both the top surface 941 and the bottom surface 942. The upper surface 941 is located below the upper surface of the base 28 and above the upper surface 261 of the protrusion 26. As a result, the entire restriction structure 94 is located below the upper surface of the base 28.

  When the blocking plate 90 is placed in the processing position, one of the two restricting structures 94 accommodates at least a portion of one of the two protrusions 26 and the other restricting structure 94 of the other protrusion 26. Accommodate at least a part.

  When the spin base 21 is stopped immediately after the protrusion 26 is accommodated in the restriction structure 94, the upper surface 941 of the restriction structure 94 and the upper surface 261 of the protrusion 26 face each other with a gap. In addition, the bottom surface 942 of the restriction structure 94 and the tip end surface 262 of the protrusion 26 face each other with a gap. The side surface 943 of the restriction structure 94 faces the side surface 263 of the protrusion 26, and the side surface 944 of the restriction structure 94 faces the side surface 264 of the protrusion 26. Thus, the restricting structure 94 is disposed to face the protrusion 26 from the front and rear in the circumferential direction centering on the rotation axis a1, so that relative movement of the protrusion 26 in the circumferential direction can be restricted. The restricting structure 94 and the protruding portion 26 are restricting portions 201 that restrict relative movement between the spin base 21 and the blocking plate 90 along the circumferential direction centering on the rotation axis a1.

  As shown in FIG. 7, with the blocking plate 90 disposed at the processing position, the tip end portion of the extending portion 92 and the side portion of the spin base 21, more specifically, the tip portion of the drainage portion 27 And a gap G1 is formed in a portion other than the regulation portion 201. The width D1 of the gap G1 is, for example, about 1 mm to 5 mm. The processing liquid discharged from the nozzle 50A of the processing unit 5 to the lower surface of the substrate 9 is discharged to the outside of the substrate 9 along the lower surface, and further discharged from the peripheral portion of the spin base 21 through the gap G1. If the tip portion of the extending portion 92 of the inner circumferential surface 921 of the extending portion 92 and the upper surface of the tip portion of the draining portion 27 are curved with each other as described above, the processing liquid flows in the gap G1. Smoothly discharged to the outside.

  The upper end portion of the inner circumferential surface 921 of the extending portion 92 is above the opposing surface (more specifically, the peripheral portion of the opposing surface) of the lower surface of the blocking plate 90 facing the substrate 9, It is located higher than the opposing surface with respect to the upper surface. Thus, an annular recessed portion 922 is formed in the upper end side portion of the inner circumferential surface 921. The recess 922 is formed along the circumferential direction centering on the rotation axis a1. The recessed portion 922 is formed between the tip end portion of the extending portion 92 and the portion of the blocking plate 90 facing the substrate 9. That is, the recess 922 is formed in the portion of the inner side surface 901 of the blocking plate 90 between the tip end portion of the extending portion 92 and the opposing portion facing the substrate 9. The inner side surface 901 is a surface surrounding the upper surface and the end surface of the substrate 9. The inner side surface 901 includes the lower surface 911 of the main body portion 91 and the inner peripheral surface 921 of the extending portion 92. The recess 922 is recessed above the peripheral edge of the opposing portion of the blocking plate 90 that faces the upper surface of the substrate 9. Between the recess 922 and the top surface of the spin base 21, an annular bulging space (“bulging space”) 923 is formed. The space 923 bulges above the facing surface of the blocking plate 90 facing the substrate 9. The distance D3 between the most depressed portion of the recess 922 and the upper surface of the substrate 9 is longer than the distance D2. The width D4 of the recess 922 in the radial direction of the blocking plate 90 is preferably set to, for example, 20 mm or more.

  Of the inner surface 901 of the blocking plate 90 (more specifically, the inner circumferential surface 921 of the extending portion 92), a portion outside the recessed portion 922 with respect to the lower surface 911 (radially outside of the blocking plate 90) As described above, a curved surface is formed which bulges outward and diagonally with respect to the upper surface of the spin base 21 and curves. In the illustrated example, the lower surface 911 is parallel to the upper surface of the substrate 9. However, the entire lower surface 911 may not be parallel to the upper surface of the substrate 9, for example, the portion of the lower surface 911 excluding the peripheral edge becomes higher from the upper surface of the substrate 9 toward the center of the lower surface 911.

  Although the processing liquid discharged from the gap G1 may stay in the space between the extended portion 92 and the draining portion 27 depending on the amount of processing liquid and the width of the gap G1, it is formed by the recessed portion 922 The space 923 becomes a buffer. As a result, it is possible to suppress that the processing liquid bounces back and adheres to the non-processing surface (the upper surface in the example of FIG. 1) of the substrate 9 due to the processing liquid that has stagnated.

  Further, a part of the processing liquid discharged from the tip end portion of the draining portion 27 strikes the restricting structure 94 and the projecting portion 26 and bounces back. However, when the blocking plate 90 is disposed at the processing position, both the restricting structure 94 of the blocking plate 90 and the projecting portion 26 of the spin base 21 are below the upper surface of the spin base 21 so that they are rebounded. It is suppressed that a process liquid adheres to main surfaces ("non-processing surface") other than the processing surface of the board | substrate 9. As shown in FIG.

  If the extending portion 92 and the draining portion 27 are formed of a fluorine resin or the like excellent in heat resistance, even if the processing liquid has a high temperature, the damage to the blocking plate 90 and the spin base 21 due to the high temperature can be suppressed. it can. However, for example, a fluorine resin is superior in heat resistance to vinyl chloride, but has a low hardness. When the rotation drive unit 23 rotates the spin base 21 via the rotation shaft 22 with the blocking plate 90 disposed at the processing position, the protrusion 26 and the restriction structure 94 are in contact with each other during acceleration and deceleration. Contact. As a result, the restriction structure 94 and the protrusions 26 may collide with each other, that is, members made of fluorine resin may collide with each other to generate dust. When the dust adheres to the substrate 9, it becomes a defect. The extension 92 and the spin base 21 may be integrally formed of the same material.

  In the configuration example of FIG. 9, the protruding portion 26 of the spin base 21 is covered with an O-ring or the like formed of an elastic member such as EPDM, of the outer peripheral surface other than the tip end surface 262. Even when the restriction structure 94 and the protrusion 26 abut each other at the time of acceleration of the spin base 21 or the like, generation of dust can be suppressed. Dust generation can be suppressed if at least one of the protrusion 26 and the restricting structure 94 is covered with the elastic member at a portion facing the other. Even if neither the protrusion 26 nor the restricting structure 94 is covered by the elastic member, the usefulness of the present invention is not impaired.

  12 and 13 are longitudinal sectional views showing a blocking plate 90B and a spin base 21B as another configuration example of the blocking plate and the spin base of the substrate processing apparatus according to the embodiment. In FIG. 12 and FIG. 13, peripheral portions of the blocking plate 90B and the spin base 21B are shown. In FIG. 12, the cross section in the control part 201 is shown, and in FIG. 13, the cross section in parts other than the control part 201 is shown. The blocking plate 90B has the same configuration as the blocking plate 90 except that the extending portion 92B is provided instead of the extending portion 92 of the blocking plate 90. The spin base 21B has a configuration similar to that of the spin base 21 except that a draining portion 27B is provided instead of the draining portion 27 of the spin base 21.

  An inner peripheral surface (lower surface) 921 B of the extended portion 92 B is smoothly connected to the lower surface of a portion of the main body portion 91 other than the thin peripheral portion. The recessed portion 922 of the extending portion 92 is not formed on the inner circumferential surface 921B. Moreover, the curved surface provided in the upper surface of the front-end | tip part of the drainage part 27 is not formed in the drainage part 27B, but the front end surface of the drainage part 27B is a vertical surface. The processing liquid is discharged to the outside from the gap G2 between the extended portion 92B and the draining portion 27B through the peripheral surface of the processing surface of the substrate 9 and the top surface of the spin base 21B. In the portion where the restricting portion 201 is provided, the processing liquid is repelled by the restricting portion 201 (the restricting structure 94, the protruding portion 26).

  However, the tip end portion of the draining portion 27B, that is, the projecting portion 26 provided on the side surface portion of the spin base 21B and the restricting structure 94 provided on the tip side portion of the extending portion 92B are more than the top surface of the spin base 21B. It is located below. Thereby, the penetration and adhesion to the non-processing surface of the board | substrate 9 of the process liquid which rebounded are suppressed. Therefore, even if the shield plate 90B is replaced by the shield plate 90B and the spin base 21 is replaced by the spin base 21B, the usefulness of the present invention is not impaired. Also, the blocking plate 90B may be combined with the spin base 21, and the blocking plate 90 may be combined with the spin base 21B.

<3. About operation of substrate processing equipment>
FIG. 21 is a flowchart showing an example of the operation of the substrate processing apparatus 1. The operation of the substrate processing apparatus 1 will be described below based on the flowchart of FIG. In this flowchart, from the state where the spin base 21 already holds the substrate 9, the substrate processing apparatus 1 processes the lower surface of the substrate 9 using the processing liquid and cleans the upper surface of the spin base 21 using the rinse liquid. Show the action of

  The substrate processing apparatus 1 first performs processing of the lower surface of the substrate 9 by the processing liquid supplied by the processing liquid supply unit 83 and cleaning of the upper surface of the spin base 21 by the rinse liquid supplied by the rinse liquid supply unit 84. The control unit 130 drives the rotation drive unit 23 to rotate the spin base 21 holding the substrate 9 to start the rotation of the substrate 9 (step S10).

  While the substrate 9 is rotating, the substrate processing apparatus 1 controls the processing liquid supply unit 83 and the rinse liquid supply unit 84 to start discharging the processing liquid and the rinse liquid (step S20). Specifically, the control unit 130, for example, selectively opens the on-off valves 833a to 833d to allow the treatment liquid supply unit 83 to treat the treatment liquid (SC-1, DHF, SC-2, or rinse liquid). Start the supply of The processing liquid is supplied to the processing liquid discharge port 54 of the nozzle 50A through the processing liquid supply pipe 811, and the processing liquid discharge port 54 starts discharging the processing liquid toward the lower surface of the substrate 9. The processing liquid discharged to the lower surface contacts only the lower surface of the substrate 9 among the lower surface of the substrate 9 and the spin base 21, and does not contact the spin base 21, and the lower surface of the substrate 9 is rotated. Spread to the edge.

  The control unit 130 opens the on-off valve 843d in parallel with the start of the supply of the processing liquid to cause the rinse liquid supply unit 84 to start the supply of the rinse liquid. The rinse liquid is supplied to the rinse liquid discharge ports 55 and 56 of the nozzle 50A through the rinse liquid supply pipe 812, and the rinse liquid discharge ports 55 and 56 extend radially outward of the spin base 21 along the upper surface of the spin base 21. Start discharging the rinse solution.

  The discharged rinse liquid contacts only the top surface of the spin base 21 out of the bottom surface of the substrate 9 and the top surface of the spin base 21 and does not contact the bottom surface of the substrate 9 and rotates the top surface of the spin base 21 rotating. To the peripheral side. Thereby, the substrate processing apparatus 1 performs the processing of the lower surface of the substrate 9 with the processing liquid and the cleaning processing of the upper surface of the spin base 21 in parallel. The rotation speed of the substrate W during processing is set to, for example, 300 rpm. The processing time is set to, for example, 30 seconds.

  When the processing of the lower surface of the substrate 9 is completed, the substrate processing apparatus 1 controls the processing liquid supply unit 83 and the rinse liquid supply unit 84 while the substrate 9 is rotating to discharge the processing liquid and the rinse liquid. It stops (step S30). Specifically, the control unit 130 causes the treatment liquid supply unit 83 to stop the supply of the treatment liquid, for example, by closing the on-off valves 833a to 833d. As a result, the discharge of the processing liquid with the processing liquid discharge port 54 directed to the lower surface of the substrate 9 is stopped. The control unit 130 causes the rinse liquid supply unit 84 to stop the supply of the rinse liquid by closing the on-off valve 843d in parallel with the stop of the discharge of the processing liquid. Thereby, the rinse liquid discharge ports 55 and 56 stop the discharge of the rinse liquid.

  The processing of the lower surface of the substrate 9 by the discharge of the processing liquid and the processing of the upper surface of the spin base 21 by the discharge of the rinse liquid may be performed in parallel as described above or may be performed sequentially.

  When the processing of the lower surface of the substrate 9 and the cleaning processing of the upper surface of the spin base 21 by the cleaning liquid are completed, the control unit 130 controls the rotation drive unit 23 to rotate the spin base 21 at high speed. A shake-off process ("liquid shake-off process") is performed to shake off the liquid such as the processing liquid and the rinse liquid adhering to the substrate 9 and the nozzle 50A to dry the substrate 9 and the nozzle 50A (step S40).

  When the liquid shaking-off processing is completed, the control unit 130 of the substrate processing apparatus 1 controls the rotation driving unit 23 to stop the rotation of the spin base 21 (step S60), and a series of substrate processing is ended.

<4. About other embodiments>
10 and 11 are perspective views showing a blocking plate 90A and a spin base 21A as another configuration example of the blocking plate and the spin base of the substrate processing apparatus according to the embodiment. FIG. 11 is a perspective view showing the blocking plate 90A and the spin base 21A when the blocking plate 90A is disposed at the processing position.

  The blocking plate 90A is configured in the same manner as the blocking plate 90 except that the extending portion 92A is provided instead of the extending portion 92 of the blocking plate 90. Similar to the extending portion 92, the extending portion 92A is extended from the peripheral portion of the disk-shaped main body portion 91 to the side of the spin base 21A, and extends along the circumferential direction centering on the rotation axis a1. It is a cylindrical wall extending annularly. The difference between the extending portion 92A and the extending portion 92 is that the blocking portion 90 is provided with the two restricting structures 94 at its tip end portion, while the extending portion 92A has a plurality of tip end portions. A regulation structure 94A is provided.

  Further, the spin base 21A is configured in the same manner as the spin base 21 except that a protrusion 26A is provided at the tip of the draining portion 27 of the spin base 21 instead of the protrusion 26. The restricting structure 94A and the projecting portion 26A are restricting portions 201A that restrict the relative movement of the spin base 21A and the blocking plate 90A in the circumferential direction centering on the rotation axis a1.

  The plurality of restricting structures 94A are provided continuously over the entire circumferential direction of the tip end portion of the extending portion 92A. Each restriction structure 94A is a recess formed in a shape that can accommodate at least a part of the protrusion 26A. Each restricting structure 94A penetrates the tip end portion of the extending portion 92A along the radial direction of the blocking plate 90A, and also opens below the tip end portion. That is, the restricting structure 94A opens in a direction toward the protrusion 26A protruding from the side surface portion of the spin base 21A in the direction along the rotation axis a1. Even if the restricting structure 94A does not penetrate the end portion of the extending portion 92A along the radial direction of the shield plate 90A as in the restricting structure 94 shown in FIG. 6, the usefulness of the present invention is impaired. It is not a thing. In this case, the sealing property of the substrate 9 by the blocking plate 90A can be improved.

  The width W1 along the circumferential direction of at least the lower opening of the restriction structure 94A is wider as the opening is approached. Specifically, the restricting structure 94A includes side surfaces (inclined surfaces) 943A and 944A that obliquely face each other along the circumferential direction around the rotation axis a1. The width W1 along the circumferential direction between the side surface 943A and the side surface 944A becomes wider as approaching downward.

  The protruding portion 26A is formed in, for example, a pentagonal pillar shape, and the axial direction thereof is along the radial direction of the spin base 21A. The protrusion 26A has a rectangular horizontal bottom surface 267A, and rectangular side surfaces 265A and 266A erected upward from each end of the bottom 267A in the circumferential direction of the spin base 21A, that is, on the opening side of the regulation structure 94A. Equipped with Sides 265A, 266A are vertical planes. Slopes 263A and 264A are connected to the upper ends of the side surfaces 265A and 266A. The slopes 263A and the slopes 264A form the tip portion (upper end portion) of the protrusion 26A. The inclined surface 263A and the side surface 943A of the restriction structure 94A are substantially parallel to each other, and the inclined surface 264A and the side surface 944A are also substantially parallel to each other. The width W2 in the circumferential direction centering on the rotation axis a1 of the slope 263A and the slope 264A narrows toward the upper side. That is, at least the tip of the protrusion 26A faces the restriction structure 94A at the tip of the extension 92A, and the width W2 of the tip along the circumferential direction about the rotation axis a1 is the restriction It becomes narrower as it approaches 94. Further, preferably, at least the tip end portion of the projecting portion 26A is formed to be able to be fitted to at least an opening portion on the projecting portion 26A side of the regulating structure 94A. .

  Here, at least one of the spin base 21A and the shield plate 90A is not disposed at the initial position in the circumferential direction, and either one is not locked in the circumferential direction, and the other is not A case where the blocking plate 90A is moved from the stand-by position to the processing position in the locked state will be examined.

  The plurality of restricting structures 94A are provided continuously over the entire circumferential direction of the tip end portion of the extending portion 92A. Therefore, during the movement of the blocking plate 90A to the processing position, the tip end of the protrusion 26A abuts on any one of the plurality of restricting structures 94A. In most cases, as shown in FIG. 10, the side surface 944A of the restriction structure 94 abuts on the slope 264A of the protrusion 26A, or the side surface 943A of the restriction structure 94 and the slope 263A of the protrusion 26A Will abut. That is, slopes having substantially the same inclination abut each other.

  From this state, when the blocking plate 90A is further moved to the processing position, in the process, the extending portion 92A extends in such a manner that the top of the restriction structure 94A and the tip of the protruding portion 26A approach each other in the circumferential direction. While rotating relative to the spin base 21A in the circumferential direction, it is moved to the processing position. Then, as shown in FIG. 11, when the blocking plate 90A is disposed at the processing position, the tip end side portion of the protrusion 26A is accommodated in the restriction structure 94A. Thus, the blocking plate 90A is restricted from moving relative to the spin base 21A in the circumferential direction.

  Further, when the blocking plate 90A is disposed at the processing position, the upper end of each restriction structure 94A and the upper end of the protrusion 26A are provided below the upper surface of the spin base 21A. Therefore, even when the processing liquid discharged from the processing surface of the substrate 9 strikes the regulating portion 201A and bounces back, it is possible to suppress the adhesion of the processing liquid which has bounced to the non-processing surface of the substrate 9.

  A plurality of restricting structures 94A may be provided along the circumferential direction on the side surface portion of the spin base 21A, and the protruding portion 26A may be provided on the tip end portion of the extending portion 92A.

  14 to 17 are cross-sectional views showing a regulating portion 201C of a blocking plate 90C and a spin base 21C as another configuration example of the blocking plate and the spin-based regulating portion of the substrate processing apparatus according to the embodiment. The blocking plate 90C is disposed at the processing position. FIG. 14 shows the restricting portion 201 in a state in which the spin base 21 is at rest, and FIG. 15 shows the restricting portion 201C when the spin base 21C is accelerating and rotating. FIG. 16 shows the restricting portion 201C when the spin base 21C rotates at a constant speed, and FIG. 17 shows the restricting portion 201C when the spin base 21C rotates while decelerating.

  The spin base 21C is configured in the same manner as the spin base 21 except that a protrusion 26C is provided instead of the protrusion 26 of the spin base 21. The protrusion 26C is configured the same as the protrusion 26 except that the magnet 101a is provided inside. The N pole of the magnet 101 a is disposed on the side surface 263 side, and the S pole is disposed on the side surface 264 side. The magnet 101a is provided on the protrusion 26C such that the N pole and the S pole are sequentially arranged substantially along the circumferential direction centering on the rotation axis a1.

  The blocking plate 90C is configured in the same manner as the blocking plate 90 except that the extending portion 92C is provided instead of the extending portion 92 of the blocking plate 90. The extending portion 92C is configured the same as the extending portion 92 except that the magnets 101b and 101c are provided inside. In the magnet 101b, the N pole and the S pole are sequentially arranged substantially along the circumferential direction around the rotation axis a1, and the N pole is regulated to be closer to the side surface 943 of the regulating structure 94 than the S pole. It is provided upstream of the structure 94 in the rotational direction of the spin base 21C. In the magnet 101c, the N pole and the S pole are sequentially arranged substantially along the circumferential direction centering on the rotation axis a1, and the S pole is regulated to be closer to the side surface 944 of the regulating structure 94 than the N pole. It is provided downstream of the structure 94 in the rotational direction of the spin base 21C.

  Thus, the magnets 101a to 101c are arranged such that the N pole of the magnet 101b and the N pole of the magnet 101a face each other, and the S pole of the magnet 101a and the S pole of the magnet 101c face each other. And, magnetic repulsion works between the north poles and between the south poles. In addition, it is preferable that the magnets 101a to 101c generate magnetic fields having substantially the same strength.

  That is, the magnets 101a to 101c increase the distance between the projecting portion 26C and the side surfaces 943 and 944 disposed in the front and rear in the circumferential direction centering on the rotation axis a1 with respect to the projecting portion 26C in the regulating structure 94. Exert a magnetic repulsive force on the The magnetic repulsion regulates the relative movement of the protrusion 26C in the circumferential direction with respect to the restriction structure 94. In addition, magnets 101a to 101c may be provided such that the respective N poles and S poles of the magnets 101a to 101c are mutually inverted.

  As shown in FIG. 14, when the spin base 21 is at rest, the force acting to widen the distance between the side 943 and the side 263 and the force acting to widen the distance between the side 944 and the side 264 Are approximately equal to one another, and their intervals are approximately equal. As shown in FIG. 16, even when the spin base 21 is rotating at a constant speed, these intervals are substantially equal.

  As shown in FIG. 15, when the spin base 21 is accelerating, in addition to the magnetic repulsion between the magnets, the acceleration of the spin base 21 narrows the distance between the side surface 944 and the side surface 264 and A force that further increases the distance between 943 and the side surface 263 further acts. Therefore, the distance between the side 944 and the side 264 is larger than the distance between the side 943 and the side 263.

  As shown in FIG. 17, when the spin base 21 is decelerating, in addition to the magnetic repulsion between the magnets, the decelerating of the spin base 21 enlarges the distance between the side 944 and the side 264, and Further, a force to narrow the distance between the side face 263 and the side face 263 acts. Therefore, the distance between the side surface 944 and the side surface 264 is smaller than the distance between the side surface 943 and the side surface 263.

  Each magnet 101a to 101c, the regulation structure 94, and the protrusion 26C regulate the relative movement (position) of the shield plate 90C with respect to the spin base 21C in the circumferential direction around the rotation axis a1. It is.

  As shown in FIGS. 14 to 17, when the blocking plate 90C is disposed at the processing position, the protrusion 26C and the restricting structure 94 of the extending portion 92C, including during deceleration of the spin base 21, are included. Preferably, in the non-contact state, it is preferable to restrict the circumferential movement about the rotation axis a1. In this case, it is possible to completely prevent dust generation due to the contact between the protruding portion 26C and the restriction structure 94 of the extended portion 92C. Temporarily, due to the magnitude of the repulsive force exerted by each magnet and the magnitude of the acceleration of the spin base 21C, the protrusion 26C and the restriction structure 94 of the extended portion 92C are in motion during deceleration of the spin base 21. Even when they are in contact, the impact at the time of contact can be significantly reduced as compared with the case where the magnets 101a to 101c are not provided. Therefore, the contact between the projection 26C and the restriction structure 94 of the extended portion 92C during deceleration of the spin base 21 does not impair the usefulness of the present invention.

  FIG. 18 is a cross-sectional view showing a restricting portion 201D of the extending portion 92D and the spin base 21C as another configuration example of the shield plate and the spin base restricting portion of the substrate processing apparatus according to the embodiment. FIG. 19 is a cross-sectional view showing a restricting portion 201E of the extending portion 92E and the spin base 21C as another configuration example of the shield plate and the spin base restricting portion of the substrate processing apparatus according to the embodiment. FIGS. 18 and 19 are cross-sectional views in which the portions of the regulation portions 201D and 201E are respectively cut by a cylinder whose center is the rotation axis a1.

  The spin base 21C shown in FIGS. 18 and 19 has the same configuration as the spin base 21C shown in FIG. The blocking plate 90D of FIG. 18 is configured in the same manner as the blocking plate 90C, except that the extending portion 92D is provided instead of the extending portion 92C of the blocking plate 90C of FIG. The extending portion 92D is configured in the same manner as the extending portion 92C except for further including a magnet 101d inside. Each of the magnets 101a to 101e preferably generates a magnetic field of approximately the same strength. The magnet 101 d is provided along the upper surface 941 of the restriction structure 94 so that the N pole and the S pole are sequentially arranged substantially along the circumferential direction centering on the rotation axis a 1. The north pole of the magnet 101d faces the north pole of the magnet 101a, and the south pole of the magnet 101d faces the south pole of the magnet 101a. Thereby, a magnetic repulsive force works between the magnets 101a and 101d. As a result, a force acts to expand the distance between the upper surface 941 and the upper surface 261.

  The magnets 101a to 101c exert magnetic repulsion to widen the distance between the side surfaces 943 and 944 of the restriction structure 94 and the protrusion 26C in the circumferential direction around the rotation axis a1. Furthermore, the magnets 101a and 101d exert a magnetic repulsive force so as to increase the distance between the upper surface 941 of the restriction structure 94 and the upper surface 261 of the protrusion 26C in the direction of the rotation axis a1 (vertical direction). As a result, the movement in which the upper surface 941 and the upper surface 261 approach each other is restricted, and the mutual contact is also suppressed, so that the generation of dust due to the contact between the restriction structure 94 and the protrusion 26C can be further suppressed.

  Each of the magnets 101a to 101d, the restriction structure 94, and the protrusion 26C move relative to the spin plate 21C relative to the spin base 21C in both the circumferential direction about the rotation axis a1 and the vertical direction (position ), And the regulation unit 201D.

  The shield plate 90E of FIG. 19 is configured in the same manner as the shield plate 90C except that an extension portion 92E is provided instead of the extension portion 92C of the shield plate 90C of FIG. The extending portion 92E is configured in the same manner as the extending portion 92C except that the magnets 101e and 101f are further provided inside. Each of the magnets 101a to 101c, 101e, and 101f preferably generates a magnetic field having substantially the same strength. The magnet 101 e is provided above the upper surface 941 of the restriction structure 94 such that the N pole is close to the upper surface 941 and the S pole is positioned above the upper surface 941. Further, the N pole of the magnet 101 d and the N pole of the magnet 101 a face each other. The magnet 101 f is provided above the top surface 941 of the restriction structure 94 such that the south pole thereof is close to the top surface 941 and the north pole thereof is positioned above it. Further, the S pole of the magnet 101 d and the S pole of the magnet 101 a face each other.

  As a result, a magnetic repulsion works between the magnets 101a and 101e, and a magnetic repulsion works between the magnets 101a and 101f. As a result, a force acts to expand the distance between the upper surface 941 and the upper surface 261.

  The magnets 101a to 101e exert magnetic repulsion to widen the distance between the side surfaces 943 and 944 of the restriction structure 94 and the protrusion 26C in the circumferential direction about the rotation axis a1. Furthermore, the magnets 101a, 101e, and 101f exert a magnetic repulsive force so as to increase the distance between the upper surface 941 of the restriction structure 94 and the upper surface 261 of the protrusion 26C in the direction of the rotation axis a1 (vertical direction). As a result, the movement in which the upper surface 941 and the upper surface 261 approach each other is restricted, and the mutual contact is also suppressed, so the generation of dust due to the contact between the restriction structure 94 and the protrusion 26C can be further suppressed.

  Each of the magnets 101a to 101c, 101e, and 101f, the restriction structure 94, and the protrusion 26C are relative to the shield base 90C with respect to the spin base 21C in both the circumferential direction about the rotation axis a1 and the vertical direction. Control unit 201E that restricts the movement (position).

  Even if the substrate processing apparatus 1 does not include the blocking plates 90 and 90A to 90E, the usefulness of the present invention is not impaired. In this case, the processing positions of the inner member 312 and the outer member 313 are set to a position above, for example, a position above the upper surface of the substrate 9, as compared with the case where the blocking plate 90 or the like is provided. Further, in the case where the blocking plates 90 and 90A to 90E are provided, the present invention is provided even if the restricting portions 201 and 201C to 201E are provided at the same height as the upper surface of the spin base 21 or above the upper surface. It does not impair the usefulness of

  In either of the substrate processing method according to the present embodiment as described above and the substrate processing apparatus according to the present embodiment configured as described above, the cleaning liquid is formed along the upper surface of the spin base 21 in the radial direction of the spin base 21. It is discharged toward the outside. Thus, the upper surface of the spin base 21 can be cleaned by the cleaning liquid while suppressing the cleaning liquid from being mixed with the processing liquid adhering to the lower surface of the lower surface of the substrate 9, and the processing liquid dropped from the lower surface of the substrate 9 It can be washed away with a cleaning solution before adhering to the top surface of the spin base 21. Therefore, the processing liquid supplied to the lower surface of the substrate 9 can be prevented from dropping and adhering onto the spin base 21 and remaining as it is.

  Further, the discharge of the processing liquid onto the lower surface of the substrate 9 and the spin base 21 can be performed by any of the substrate processing method according to the present embodiment as described above and the substrate processing apparatus according to the present embodiment configured as described above. Since the discharge of the cleaning liquid along the upper surface is performed in parallel, adhesion of the processing liquid discharged to the back surface of the substrate 9 to the upper surface of the spin base 21 can be efficiently suppressed.

  Further, in any of the substrate processing method according to the present embodiment as described above and the substrate processing apparatus according to the present embodiment configured as described above, the cleaning liquid is the upper surface or the lower surface of the plate member 51 of the nozzle 50A. The nozzle 50A can be cleaned during the cleaning of the spin base 21 because the ink is discharged radially outward of the spin base 21 along the upper surface of the spin base 21.

  Further, the cleaning liquid is provided on the side surface of the plate-like member 51 of the nozzle 50A by any of the substrate processing method according to the present embodiment as described above and the substrate processing apparatus according to the present embodiment configured as described above. The solution is discharged from the rinse solution discharge ports 55 and 56 radially outward of the spin base 21 along the upper surface of the spin base 21. Therefore, it becomes easy to extend the shape of the rinse liquid discharge ports 55 and 56 in the circumferential direction of the plate-like member 51 and to spread the discharged cleaning liquid.

  Although the present invention has been shown and described in detail, the above description is illustrative and not restrictive in all aspects. Therefore, in the present invention, within the scope of the invention, the embodiment can be appropriately modified or omitted.

1 substrate processing apparatus 21 spin base (holding member)
23 rotation drive unit 231 rotation mechanism 26 protrusion 44 drive unit 50A nozzle 83 treatment liquid supply unit 83A treatment liquid discharge unit 90 shield plate (opposite member)
91 main part 92 extension part 94 restriction structure 312 inner member (guard)
313 External material (outside guard)

Claims (8)

A holding member which holds a substrate substantially horizontally from below and which has an upper surface facing the lower surface of the substrate with a gap therebetween and which is rotatably provided about a predetermined rotation axis is rotated about the rotation axis with the substrate. Rotation step to make
A treatment liquid discharge step of discharging the treatment liquid so that the treatment liquid spreads on the lower surface of the substrate from below the central portion of the lower surface of the substrate held and rotated by the holding member toward the central portion;
A cleaning solution for discharging a cleaning solution from the central portion of the substrate held and rotated by the holding member to the radial direction outer side of the holding member along the upper surface of the holding member from between the central portion of the substrate and the central portion of the holding member Discharge step,
Equipped with
The substrate processing method which performs the said process liquid discharge step and the said washing | cleaning liquid discharge step in parallel . A holding member which holds a substrate substantially horizontally from below and which has an upper surface facing the lower surface of the substrate with a gap therebetween and which is rotatably provided about a predetermined rotation axis is rotated about the rotation axis with the substrate. Rotation step to make
A process liquid discharge step of discharging a chemical solution as a process liquid from below the center of the lower surface of the substrate held and rotated by the holding member toward the center;
A cleaning solution for discharging a cleaning solution from the central portion of the substrate held and rotated by the holding member to the radial direction outer side of the holding member along the upper surface of the holding member from between the central portion of the substrate and the central portion of the holding member Discharge step,
Equipped with
The substrate processing method which performs the said process liquid discharge step and the said washing | cleaning liquid discharge step in parallel. The substrate processing method according to claim 1 or 2, wherein
The treatment liquid discharge step is
The center of the lower surface from the processing liquid discharge port provided on the upper surface of the plate-like member of the nozzle provided with a plate-like member facing the central portion of the lower surface of the substrate and the upper surface of the holding member with a gap therebetween Discharging the processing solution to the
In the cleaning solution discharging step,
The radially outer side of the holding member along the surfaces of both the upper surface or the lower surface of the plate member and the upper surface of the holding member from the cleaning solution discharge port provided on the upper surface or the lower surface of the plate member of the nozzle The substrate processing method which is a step which discharges a washing | cleaning liquid towards. The substrate processing method according to claim 1 or 2, wherein
The treatment liquid discharge step is
The lower surface of the substrate from the processing liquid discharge port provided on the upper surface of the plate-like member of the nozzle provided with the plate-like member facing the central portion of the lower surface of the substrate and the upper surface of the holding member with a gap therebetween Discharging the processing solution toward the center of the
In the cleaning solution discharging step,
A substrate processing method, wherein the cleaning solution is discharged from the cleaning solution discharge port provided on the side surface of the plate-like member of the nozzle along the upper surface of the holding member radially outward of the holding member. A holding member that holds the substrate substantially horizontally from below, has an upper surface facing the lower surface of the substrate with a gap, and is rotatably provided about a predetermined rotation axis;
A rotation mechanism for rotating the holding member around the rotation axis;
A processing liquid discharge port for discharging the processing liquid so that the processing liquid spreads from the lower side of the central portion of the lower surface of the substrate toward the central portion toward the central portion, a central portion of the substrate and a central portion of the holding member A nozzle provided with a cleaning solution discharge port for discharging a cleaning solution toward the radially outer side of the holding member along the upper surface of the holding member from between
Equipped with
The substrate processing apparatus which performs the said process liquid discharge step and the said washing | cleaning liquid discharge step in parallel .   A holding member that holds the substrate substantially horizontally from below, has an upper surface facing the lower surface of the substrate with a gap, and is rotatably provided about a predetermined rotation axis;
  A rotation mechanism for rotating the holding member around the rotation axis;
  A processing liquid discharge port for discharging a chemical solution as a processing liquid from below the central portion of the lower surface of the substrate toward the central portion, and an upper surface of the holding member from between the central portion of the substrate and the central portion of the holding member A nozzle provided with a cleaning solution outlet for discharging the cleaning solution radially outward of the holding member along the
Equipped with
  The substrate processing apparatus which performs the said process liquid discharge step and the said washing | cleaning liquid discharge step in parallel. A substrate processing apparatus according to claim 5 or 6 , wherein
The nozzle is
And a plate-like member facing the central portion of the lower surface of the substrate and the upper surface of the holding member with a gap therebetween.
The processing liquid discharge port is provided on the upper surface of the plate-like member and discharges the processing liquid toward the central portion of the lower surface of the substrate.
The cleaning solution discharge port is provided on the upper surface or the lower surface of the plate-like member and directed radially outward of the holding member along both the upper surface or the lower surface of the plate-like member and the upper surface of the holding member. Substrate processing apparatus that discharges the cleaning solution. A substrate processing apparatus according to claim 5 or 6 , wherein
The nozzle is
And a plate-like member facing the central portion of the lower surface of the substrate and the upper surface of the holding member with a gap therebetween.
The processing liquid discharge port is provided on the upper surface of the plate-like member and discharges the processing liquid toward the central portion of the lower surface of the substrate.
The cleaning solution discharge port is provided on a side surface of the plate-like member and discharges the cleaning solution radially outward of the holding member along the upper surface of the holding member.

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