JP6585797B2 - Surface treatment equipment - Google Patents

Description

  The present invention relates to a technique for performing surface treatment such as plating on a workpiece such as a thin plate.

  When performing surface treatment such as plating on a substrate or the like, a method of immersing the substrate in a plating tank filled with a plating solution has been common. This method requires a lifting mechanism for moving the substrate up and down, and there is a problem that the apparatus becomes complicated and large. Moreover, the plating bath must be filled with a plating solution, and there is a problem that a large amount of plating solution is required. Such a problem was not only for plating but also for general surface treatment.

  In order to solve such a problem, the inventors have invented an apparatus that discharges the processing liquid to the substrate holding the upper portion, collects the processing liquid dropped from the substrate, and discharges it again ( Patent Documents 1 and 2).

  In FIG. 23, the cross section of the surface treatment apparatus described in patent document 1 is shown. The upper part of the board | substrate 2 is pinched | interposed by the hanger 6 which is a holding member. Roller receiving members 40 and 42 are provided outside the tank 4. The moving body 14 holding the hanger 6 is held by a roller 16 and moved in a direction perpendicular to the paper surface.

  The substrate 2 is introduced into the tank 4. In the tank 4, a treatment liquid discharge portion 8 having a treatment liquid ejection port 10 is provided on both sides of the substrate 2. A processing liquid is ejected from the processing liquid ejection port 10 toward the substrate 2. The processing liquid that has reached the substrate 2 flows down along the surface of the substrate 2. In this way, the surface of the substrate 2 is treated with the treatment liquid.

  The treatment liquid that has flowed down is collected in the lower part of the tank 4, and is again discharged from the treatment liquid discharge unit 8 by the pump 12.

  FIG. 24 shows a plan view. The substrate 2 held by the hanger 6 is loaded from the load section 22 to the first water washing section 24, the desmear section 26, the second water washing section 28, the pretreatment section 30, the third water washing section 32, the electroless copper plating section 34, the first 4 The water washing part 36 is transferred in this order, and is removed from the hanger 6 by the unloading part 38.

  Although the cross section in each tank is the same as that of FIG. 23, the process liquid ejected from the process liquid ejection port 10 is different depending on each tank. In addition, as shown in FIG. 24, the upper part of each tank is in the open state.

  In this way, it is possible to reduce the amount of processing liquid used without increasing the size and complexity of the apparatus.

JP2014-88600 JP2014-43613 JP2012-41590

  In the prior art described above, the roller receiving members 40 and 42 are provided on the outside of the tank 4, and there is a problem that the apparatus is increased in size. However, when the roller receiving members 40 and 42 are provided inside the tank 4, dust generated by movable parts such as the roller 16 and a gear (not shown) for driving the roller 16 falls into the tank 4. Will do. When an extremely fine pattern (such as a pattern having a width of several μm) is formed on a substrate by plating, even if dust of about several μm adheres to the surface of the substrate, it may cause a defect. Therefore, it was difficult to provide the roller receiving member 40 inside the tank 4.

  Moreover, even if the roller receiving members 40 and 42 are provided outside the tank 4 as in the prior art, the generated dust may float and enter the tank 4.

  Furthermore, Patent Document 3 discloses a system that removes fine foreign matters mixed in the processing liquid. However, it did not present a fundamental solution to prevent the minute foreign matter from being mixed into the processing liquid.

  The problem as described above has occurred not only in a processing tank having a structure as shown in FIG. 23 but also in a processing tank in which a surface treatment is performed by immersing a substrate in a processing solution.

  An object of the present invention is to provide a surface treatment apparatus that can solve any of the above problems and reduce the occurrence of defects due to dust.

  Some features that can be independently applied to the surface treatment apparatus according to the present invention are listed below.

(1) A surface treatment apparatus according to the present invention includes a holding member that holds an upper portion of a processing target, and a processing liquid that is discharged to the holding member or the processing target and is held by the holding member. A treatment liquid discharge portion for flowing a treatment liquid to the surface; an upper support member for supporting the holding member from above; a transport mechanism for moving the upper support member; and a protection member provided at least on the lower side of the transport mechanism In the surface treatment apparatus provided, the upper support member supports the holding member through a portion where no protective member is provided.

  Therefore, it is possible to regulate the movement of the dust to the treatment target by the protective wall member, and it is possible to reduce the surface treatment failure caused by the dust.

(2) The surface treatment apparatus according to the present invention is characterized in that a protective member is also provided on a side surface of the transport mechanism.

  Therefore, it is possible to further restrict the movement of the dust to the processing target by the protective member provided on the side surface.

(3) The surface treatment apparatus according to the present invention is characterized in that a liquid is stretched so as to immerse at least a part of the lower side of the transport mechanism or the transport mechanism in a portion surrounded by the protective member.

  Therefore, it is possible to restrict the dust from being captured by the liquid and moving to the processing target.

(4) The surface treatment apparatus according to the present invention is characterized in that a water supply port and a drain port are provided in a portion surrounded by the protective member, and the liquid is replaced.

  Therefore, the liquid containing dust can always be replaced, and the dust capturing effect can be maintained.

(5) The surface treatment apparatus according to the present invention is characterized in that the transport mechanism is formed of stainless steel, titanium, carbon steel, brass or plastic.

  Therefore, the possibility that the transport mechanism is corroded by the liquid can be reduced.

(6) A surface treatment apparatus according to the present invention includes a holding member that holds an upper portion of a processing target, a treatment tank for immersing the processing target held by the holding member in a processing liquid, and the holding member from above. A surface treatment apparatus comprising a supporting upper support member, a transport mechanism for moving the upper support member, and a protective wall provided at least on the lower side of the transport mechanism, wherein the upper support member The holding member is supported through a portion that is not provided.

  Therefore, it is possible to regulate the movement of the dust to the treatment target by the protective wall member, and it is possible to reduce the surface treatment failure caused by the dust.

  In the present invention, the “holding member” means a member having a function of holding at least the upper part of the processing target, and in the embodiment, the processing liquid receiving member 82 corresponds to this.

  The “processing liquid discharge part” refers to a part having a function of discharging a processing liquid directly or indirectly to a processing target. In the embodiment, the pipe 56 and the inclined plate 53 correspond to this.

  The “upper support member” means a member having a function of holding at least the holding member from above. In the embodiment, the top plate 62, the hanging plate 64, the clip holding member 74, and the clip 52 correspond to this.

  The “conveying mechanism” means at least a function of moving the upper support member. In the embodiment, the roller 40, the roller guide 66, the pinion 70, and the rack 68 correspond to this.

  The “protective member” refers to a member having a function of preventing at least dust that has been generated or soared by the transport mechanism from reaching the object to be treated. In the embodiment, the lower protective wall 47 and the lateral protective wall 49 are provided. This is the case.

1 is an overall configuration diagram of a surface treatment system according to an embodiment of the present invention. It is a side view of the surface treatment system of FIG. It is a cross-sectional view of a surface treatment apparatus. It is detail drawing of the hanger 50 vicinity. It is a figure which shows the roller guide 66 and the rack 68 of the top plate 62. FIG. It is a figure which shows the hanger 50. FIG. It is a figure which shows the clip 52. FIG. FIG. 6 is a diagram showing a state in which processing liquid is discharged from a pipe. FIG. 6 is a diagram illustrating a flow of processing liquid in a processing liquid receiving member. FIG. 10 is a diagram showing another shape of the treatment liquid receiving member 82. FIG. 10 is a diagram showing another shape of the treatment liquid receiving member 82. FIG. 6 is a view showing a structure inside a processing liquid receiving member 82. It is a figure which shows the structure of the process liquid discharge | release part by another example. It is a figure which shows the continuous hanger 50 and the board | substrate 54 hold | maintained. It is a figure which shows the flow of the liquid in FIG. It is a figure which shows the flow of the process liquid when the hanger 50 is made to protrude. It is a figure which shows the state which provided the guide 79. FIG. It is a figure which shows the detail of the guide. It is a figure for demonstrating the function of the guide. It is a figure which shows the structure of the process liquid receiving member 82 by another example. It is a figure which shows the structure of the process liquid receiving member 82 by another example. It is a figure which shows the structure of the process liquid receiving member 82 by another example. It is a figure which shows the structure of a discharge port. It is a figure which shows the example of the conventional surface treatment apparatus. It is a figure which shows the example of the conventional surface treatment apparatus.

1. First Embodiment FIG. 1 is a plan view of a surface treatment system 20 according to an embodiment of the present invention. The surface treatment system 20 includes a plurality of surface treatment units. That is, the first water-washing part 24, the desmear part 26, the second water-washing part 28, the pretreatment part 30, the third water-washing part 32, the electroless copper plating part 34, and the fourth water-washing part 36 are provided. Each processing unit is provided with an inlet 44 and an outlet 46, through which the substrate is moved in the X direction.

  FIG. 2 shows a view from the α direction of FIG. About the board | substrate 54 hold | maintained at the clip 52 of the hanger 50, the 1st water washing part 24, the desmear part 26, the 2nd water washing part 28, the pretreatment part 30, the 3rd water washing part 32, the electroless copper plating part 34, the 4th water washing Surface treatment is performed in the order of the part 36.

  FIG. 3 shows a β-β cross-sectional view of FIG. The upper end portion of the substrate 54 is sandwiched and held by the clip 52 of the hanger 50. On both sides of the substrate 54 held by the hanger 50, pipes 56 that are processing liquid discharge portions are provided. The pipe 56 is provided with a hole 58 so as to discharge the processing liquid obliquely upward. The discharged processing liquid flows on the surface of the substrate 54 and reaches the lower part, is circulated by the pump 60, and is discharged from the pipe 56 again.

  FIG. 4 shows details of the vicinity of the hanger 50. The hanger 50 includes a top plate 62, a hanging plate 64 extending downward from the top plate 62, and a clip holding member 74 fixed to the hanging plate 64. The clip holding member 74 is provided with a clip 52. In this embodiment, the top support member is constituted by the top plate 62, the hanging plate 64, the clip holding member 74, and the clip 52.

  As shown in FIG. 5, roller guides 66 are provided at both ends on the lower side of the back surface of the top plate 62. Further, a rack 68 is provided on one side. The roller 40 is rotatably fitted in the recess of the roller guide 66. A pinion 70 is provided on the same rotating shaft 72 as the roller 40 and meshes with the rack 68. The pinion 70 is rotationally driven by a motor (not shown), and moves the top board 50 in the direction of arrow X. As a result, the substrate 54 held on the hanger 50 is sequentially moved through the processing units. A plurality of rollers 40 and pinions 68 are provided at predetermined intervals.

  As shown in FIG. 4, the roller 40 and the pinion 70 are fixed to a rotation shaft 72 provided so as to protrude from the lateral protection wall 49 (protection member), and rotate with the rotation of the rotation shaft 72. . The lateral protective wall 49 is fixed vertically to a lower protective wall 47 (protective member) fixed to the outer wall 39. The hanging plate 64 of the hanger 50 supports the clip 52 through the space 43 between the lower protective walls 47 on both sides.

  In this embodiment, a lower protective wall 47 is provided under a conveyance mechanism (a portion where two or more parts meet) composed of a roller 40 and a roller guide 66, and a pinion 70 and a rack 68, and a lateral protective wall 49 is located sideways. Is provided. Therefore, it is possible to prevent the dust generated by the transport mechanism from moving toward the substrate 54 held by the clip 52.

  Further, in this embodiment, a liquid 41 such as water is stretched in a space formed by the lateral protective wall 49, the lower protective wall 47, and the outer wall 39. The liquid 41 is stretched so as to cover the rotating shaft 72 about half. Therefore, the fine dust generated by the transport mechanism can be captured by the liquid 41 and can be prevented from drifting from the space 43 toward the substrate 54 in the air.

  In this embodiment, in order to prevent corrosion due to the liquid 41 (water), plastic is used for the roller 40 that is less affected by dimensional variation due to wear, and the pinion 70 that needs to reduce the effect of dimensional variation due to wear is used. Uses stainless steel. Note that a metal such as titanium, carbon steel, or brass may be used instead of or in combination with stainless steel.

  In this embodiment, the liquid 41 is stretched from the first water washing section 24 to the fourth water washing section 36 (see FIG. 1). A water supply port (not shown) is provided on the inlet side of the first flush unit 24, and a drain port (not shown) is provided on the outlet side of the fourth flush unit 36. The configuration of the drain outlet is shown in FIG. The base pipe 112 is fixed to the lower protective wall 47 and connected to the drain pipe 114. An adjustment pipe 110 that can move up and down and adjust its height is inserted into the base pipe 112. By changing the height of the adjustment pipe 110, the water surface of the liquid 41 can be raised or lowered.

  In this embodiment, the lower protective wall 47 in the vicinity of the water supply port is made higher than the lower protective wall 47 in the vicinity of the water outlet so that the old liquid 41 (liquid 41 containing dust) is quickly discharged. ing.

  FIG. 6 shows a perspective view of the hanger 50. A hanging plate 64 extends downward from the top plate 62. A clip holding member 74 is fixed to the hanging plate 64 in the lateral direction. Clips 52 are provided at both ends and the center of the clip holding member 74.

  Details of the clip 52 are shown in FIG. The clip 52 is urged by a spring 76 in a direction in which the tip end is closed. FIG. 7 shows a state in which the spring 76 is pressed against the spring 76 to open the tip. As shown in FIG. 6, a treatment liquid receiving member 82 (holding member) is provided at the tip of the clip 52 over the entire width of the hanger 50. As shown in FIG. 7, the base portion of the treatment liquid receiving member 82 is a flat plate 80, and the tip portion is a convex portion 78 having a semicircular shape (preferably a radius of 20 mm to 40 mm) toward the outside. Yes. A gripping protrusion 75 for sandwiching and gripping the substrate 54 is provided on the inner lower end of the convex portion 78.

  A view of the treatment liquid receiving member 82 as seen from the inside is shown in FIG. 11A. In this embodiment, the gripping protrusions 75 are provided at three locations, the left and right ends and the center. Further, an adhesion preventing projection 77 is provided between the gripping projections 75. FIG. 11B is a bottom view of FIG. 11A. As is clear from this figure, the adhesion preventing projection 77 is formed lower than the gripping projection 75. Therefore, the upper end of the substrate 54 is held by the gripping protrusion 75 and held.

  The adhesion prevention protrusion 77 is for preventing the substrate 54 from being bent (easily bent in the case of a thin substrate) and not coming into close contact with the processing liquid receiving member 82 in a portion where the grip protrusion 75 is not provided. This is because if the substrate 54 is in close contact with the processing liquid receiving member 82 and the contact area is large, the substrate 54 remains in close contact even when the processing liquid flows, and surface treatment cannot be performed at the close contact portion.

  Returning to FIG. 4, the processing liquid is supplied to the pipe 56 by the pump 60 of FIG. 3. This processing liquid differs depending on each processing unit. In this embodiment, the first water washing unit 24, the second water washing unit 28, the third water washing unit 32, and the fourth water washing unit 36 use a cleaning liquid. In the desmear portion 26, desmear liquid is used. In the pretreatment unit 30, a pretreatment liquid is used. In the electroless copper plating part 34, a plating solution is used.

  The hole 58 of the pipe 56 is provided facing upward by a predetermined angle (for example, 45 degrees). Therefore, the processing liquid is discharged obliquely upward from the pipe 56 and reaches the clip 52. In addition, it is preferable to provide the hole 58 in the direction in the range of 5 to 85 degrees with respect to the horizontal direction. The holes 58 of the pipe 56 are provided in a direction perpendicular to the paper surface at a predetermined interval (for example, an interval of 10 cm).

  As shown in FIG. 8 a, the processing liquid ejected from the hole 58 of the pipe 56 contacts the flat plate 80 of the processing liquid receiving member 82 and flows downward. The water flow at this time is shown in FIG. 8b. The processing liquid in contact with the flat plate 80 flows in the direction of arrow A (downward) on the surface of the flat plate 80 while spreading left and right. As described above, the processing liquid is discharged from the pipe 56 at a predetermined interval, but the processing liquid in contact with the flat plate 80 spreads left and right, so that the processing liquid is downward in the entire width direction of the flat plate 80. Will flow.

  As shown by the arrow B, the treatment liquid that has flowed down the surface of the flat plate 80 flows along the surface of the convex part 78 having a semicircular cross-sectional shape. The processing liquid that has reached the lower end of the convex portion 78 flows down along the substrate 54. Accordingly, the treatment liquid flows along the entire surface of the substrate 54, and the surface treatment is performed.

  When the processing liquid flows from the processing liquid receiving member 82 to the substrate 54, it is preferable that the processing liquid flows at an angle close to perpendicular to the surface as shown in FIG. 8b. As shown in FIG. 9A, when it is made to flow at an angle close to the horizontal with respect to the surface, the agent (for example, vanadium at the time of plating) applied to the surface of the substrate 54 is washed away, This is because the surface treatment becomes impossible.

  Therefore, as shown in FIG. 9B, it is preferable to provide a convex portion 78 and allow the processing liquid to flow at an angle close to perpendicular to the surface of the substrate 54. However, in the case of the structure as shown in FIG. 9B, the processing liquid does not sufficiently wrap around the upper portion of the substrate 54, and unevenness may occur. Therefore, in the above-described embodiment, the shape of the convex portion 78 is an R shape (curved surface shape), and the flow of the processing liquid is ensured and the flow is made to flow at an angle close to the vertical.

  For example, the same effect may be obtained by providing R outside the lower end of the convex portion 78 in FIG. 9B. Further, as shown in FIG. 10A, the flat plate 80 may be formed thick (preferably 20 mm to 40 mm), and R (R is preferably 10 mm or more) may be provided outside the tip.

  Furthermore, a flow guide 81 may be provided as shown in FIG. 10B. The flow guide 81 ensures that the processing liquid is directed toward the substrate 54. If the flow guide 81 is used, the processing liquid can be reliably directed toward the substrate 54 even in the structure as shown in FIG. 9B.

  Further, in the vicinity of the lower end of the convex portion 78, the processing liquid that has flowed in moves slightly upward, so that the processing liquid reaches the upper end of the substrate 54. At this time, as shown in FIG. 11B, since the adhesion prevention protrusion 77 is provided, even if the substrate 54 is bent, it does not adhere to the treatment liquid receiving member 82 but comes into contact only with the adhesion prevention protrusion 77. Therefore, the processing liquid that has flowed up causes the substrate 54 to float from the adhesion prevention protrusion 77, and the surface treatment can be performed evenly to the upper end of the substrate 54.

  Note that the adhesion prevention structure shown in FIG. 11 is not limited to a method in which the treatment liquid is brought into contact with the hanger 50 and the treatment liquid is caused to flow through the substrate 54, but the treatment liquid is brought into contact with the vicinity of the upper end of the substrate 54. It can also be applied to the flow method.

  In addition, as shown in FIG. 1, a water washing process is performed before (after) a desmear process, a pre-process, and an electroless copper plating process. Also in the water washing process, the surface of the substrate 54 is washed by flowing the washing water as the treatment liquid in the same manner as described above. However, in the water washing process, the position where the treatment liquid discharged from the pipe 56 is brought into contact is made higher (higher) than the contact position in the desmear treatment, pretreatment, and electroless copper plating treatment. By doing in this way, it is because the desmear process liquid, the pre-processing liquid, and the electroless copper plating process liquid which adhered to the flat plate 80 can be wash | cleaned more appropriately by the water washing process.

  Further, in the above embodiment, the processing liquid is discharged obliquely upward from the pipe 56, but the processing liquid may be discharged diagonally downward from the inclined plate 53 as shown in FIG. The storage tank 55 stores the processing liquid pumped up by the pump 60. When the liquid level becomes higher than the end of the inclined plate 53, the processing liquid overflows the inclined plate 53. The processing liquid overflowing the inclined plate 53 comes into contact with the processing liquid receiving member 82 and flows down to the substrate 54. In this case, the inclined plate 53 corresponds to the processing liquid discharge portion.

  Further, in the above-described embodiment, the case where the present invention is applied to a processing tank that discharges the processing liquid to the substrate 54 has been described. However, the present invention can also be applied to a processing tank in which the substrate 54 is immersed in a processing solution. In this case as well, it is possible to prevent dust from being mixed into the processing liquid and causing defects.

  In the above embodiment, the hanger 50 moves with respect to the pipe 56 and the storage tank 55. However, the hanger 50 may be fixed and the pipe 56 and the storage tank 55 may be moved.

  In the above-described embodiment, the liquid 41 is poured to such an extent that the rotating shaft 72 is half immersed. However, a sufficient effect can be obtained as long as at least the liquid 41 that touches the roller 40 is contained. Further, if possible, the entire transport mechanism may be inserted until it is immersed in the liquid 41. Furthermore, even if only the liquid 41 that does not touch the roller 40 is added, dust that has come out of the transport mechanism and dropped down can be supplemented, and an effect can be expected.

  In the above embodiment, the liquid 41 is put. However, the liquid 41 may not be added. If the liquid 41 is not added, the dust prevention effect is reduced. However, the dust generated by the transport mechanism (swelled) by the lateral protective wall 49 and the lower protective wall 47 still moves toward the substrate 54. Can be prevented. Further, the lateral protective wall 49 may be eliminated and only the lower protective wall 47 may be provided. Even in this case, a certain dustproof effect can be expected.

  In the above embodiment, the roller 40 and the pinion 70 are supported by the lateral protection wall 49. However, it may be supported by the lower protective wall 47 and the outer wall 39.

  In the above embodiment, in the hanger 50, the roller guide 66 is provided on the top plate 62 side, and the roller 40 is provided on the side protection wall 49 side. However, the roller 40 may be provided on the top plate 62 side, and the roller guide 66 may be provided on the side protection wall 49 side.

  In the above embodiment, in the hanger 50, the rack 68 is provided on the top plate 62 side, and the pinion 70 is provided on the side protection wall 49 side. However, the pinion 70 may be provided on the top plate 62 side, and the rack 68 may be provided on the side protection wall 49 side.

  In the above embodiment, water is used as the liquid, but lubricating oil or the like may be used.

In the above embodiment, a protective wall is used as the protective member to physically prevent the movement of dust. However, the movement of the dust may be prevented by generating ions and the like so as to adsorb the dust electrically and magnetically. Further, the dust may be repelled so that the dust does not move toward the substrate 54. Furthermore, a mechanism for sucking dust may be provided.

2. Second Embodiment In the first embodiment, the structure in which the treatment liquid is appropriately flowed to the substrate 54 for one hanger 50 is shown. The second embodiment to be described below relates to a case in which the substrate 54 is held on a plurality of hangers 50 and the processing liquid is flowed in a series of these.

  Hereinafter, for ease of explanation, a case where the present invention is applied to the surface treatment apparatus according to the first embodiment will be described. .

  FIG. 13 shows a state in which a plurality of substrates 54 held on the hanger 50 are arranged. A substrate 54 is held across the width of the hanger 50. The processing capability increases when the space between adjacent substrates 54 is as narrow as possible. In this embodiment, a gap between 5 mm and 15 mm is opened. However, it is difficult to set the distance between the substrates 54 to 0 mm. This is because, when an error occurs in the transport speed of each hanger 50, the adjacent substrates 54 overlap and come into close contact with each other, and are twisted and torn.

  In addition, the hanger 50 and the hanger 50 are spaced 5 to 15 mm apart. This is because, when the feeding speeds of the hangers 50 do not completely match, the hangers 50 come into contact with each other, the hangers 50 are inclined, and the adjacent substrates 54 may come into contact with each other. Of course, if the feeding speed of each hanger 50 is kept constant precisely, this interval can be reduced, but a complicated and expensive mechanism is required.

  Thus, the adjacent hanger 50 and the board | substrate 54 need to leave a predetermined space | interval. Originally, it is not necessary to flow the processing liquid between the substrate 54 and the substrate 54. This is because there is no substrate 54 in that portion, and surface treatment with a treatment liquid is unnecessary.

  However, as schematically shown in FIG. 14, since the processing liquid does not flow into the space 51 between the hangers 50, the processing liquid flowing to the end portion of the lower portion L of the substrate 54 is reduced due to surface tension. End up. For this reason, there has been a problem that the surface treatment on the substrate 54 is uneven.

  Therefore, in the second embodiment, a structure in which the processing liquid flows also in the space outside the left and right ends of the substrate 54 is adopted. An example is shown in FIG. In this example, the treatment liquid receiving member 82 of the hanger 50 is wider than the substrate 54. Therefore, as shown by the arrows in the figure, the processing liquid flows also outside the substrate 54. The layer of the processing solution approaches the end of the substrate 54 as it goes down, and is finally absorbed by the flow in the substrate 54. However, by sufficiently increasing the degree of protrusion F of the processing liquid receiving member 82, a layer of processing liquid can be formed outside the left and right ends until the lower end of the substrate 54 is reached (see broken line).

  However, in the structure shown in FIG. 15, the gap between the substrates 54 is widened, and the number of substrates 54 that can be processed per unit time is reduced. In this way, when the processing yield becomes a problem, the processing liquid receiving member 82 may be structured as shown in FIG.

  In FIG. 16, a guide member 79 is provided on one side of the convex portion 78 of the treatment liquid receiving member 82. FIG. 17A shows the front view, FIG. 17B shows the bottom view, and FIG. 17C shows the side view.

  The guide member 79 is provided on the outer side so as to follow the outer shape of the convex portion 78. In this embodiment, it is provided along the R portion of the lower half of the convex portion 78. The guide member 79 does not completely cover the lower side of the convex part 78 but is provided so that a space 89 is formed at the lower end part. Further, the guide member 79 is provided so as to protrude by W from the width of the convex portion 78.

  FIG. 18 shows a state of the adjacent processing liquid receiving member 82 when a plurality of hangers 50 are conveyed. The front end of the rear (right side) processing liquid receiving member 82 enters the guide member 79 provided at the rear end of the front (left side) processing liquid receiving member 82. Further, the front end of the rear (right side) substrate 54 enters the space 81 (see FIG. 17C) of the front (left side) guide member 79. As a result, the front end of the rear (right) substrate 54 overlaps a part of the adjacent front (left) guide member 79. At this time, the treatment liquid receiving member 82 and the substrate 54 of the hanger 50 are transported with a predetermined distance D (in this embodiment, 5 mm to 15 mm). At this time, the processing liquid discharged from the pipe 56 is received by the guide member 79 and dropped from the space 81 (see FIG. 17C) toward the interval D. Accordingly, a film of the treatment liquid can be formed even at the interval D, and the surface treatment with less unevenness can be realized while suppressing the problem as shown in FIG.

  As described above, in the embodiment shown in FIG. 18, surface treatment with less unevenness can be performed without increasing the interval between the substrates 54. In the above description, the guide member 79 is provided only on one side of the treatment liquid receiving member 82. However, the hanger 50 provided with the guide member 79 on both sides and the hanger 50 not provided with the guide member 79 are used alternately. May be.

  Moreover, as shown in FIG. 19, it is good also considering the convex part 78a which sharpened the one side of the process liquid receiving member 82 (convex part 78) as the taper, and the recessed part 78b corresponding to this. FIG. 19A shows the front view, FIG. 19B shows the bottom view, and FIG. 19C shows the side view. In this case, the substrate 54 may be mounted over the length L in FIG. 19B. The convex part 78a of the hanger 50 enters into the concave part 78b of the adjacent hanger 50 (however, an interval of 5 mm to 15 mm is opened so as not to contact). Therefore, a layer of the treatment liquid flow can be formed also between the substrate 54 and the substrate 54.

  In FIG. 19, a convex portion 78a that is tapered and a concave portion 78b having a shape corresponding thereto are provided. However, any shape may be used as long as the convex portion and the concave portion are shaped so that one enters the other. For example, a cylindrical convex portion 78a and a concave portion 78b having a corresponding shape can be used.

  Further, as shown in FIG. 20, both ends of the treatment liquid receiving member 82 (convex portion 78) may be formed obliquely. FIG. 20A shows the front view, FIG. 20B shows the bottom view, and FIG. 20C shows the side view.

  Furthermore, as shown in FIG. 21, protrusions 78d for drift may be provided at both ends of the treatment liquid receiving member 82 (convex portion 78). FIG. 21A shows the front view, FIG. 21B shows the bottom view, and FIG. 21C shows the side view. As a result, the processing liquid is drifted outward at both ends, and the processing liquid can also flow into the space between the substrate 54 and the substrate 54.

  In the above-described embodiment, a thin substrate (thickness of several tens of μm) that cannot be self-supported in a natural state has been described as a processing target. However, thick plates can also be processed.

The second embodiment can be implemented in combination with the first embodiment, but can also be implemented independently from the first embodiment.

Claims (4)

A holding member for holding the upper part of the processing target;
A treatment tank for immersing the treatment object held by the holding member in a treatment liquid;
An upper support member for supporting the holding member from above;
A transport mechanism for moving the upper support member;
A protective member provided at least on the lower side of the transport mechanism;
A surface treatment apparatus comprising:
In the surface treatment apparatus, the upper support member supports the holding member through a portion where no protective member is provided.
A surface treatment apparatus characterized in that in a portion surrounded by the protective member, a liquid is stretched so as to immerse at least a part of the lower side of the transport mechanism or the transport mechanism. In the surface treatment apparatus of Claim 1,
The surface treatment apparatus, wherein the protection member is also provided on a side surface of the transport mechanism. In the surface treatment apparatus of Claim 2,
A surface treatment apparatus characterized in that a water supply port and a drain port are provided in a portion surrounded by the protective member, and the liquid is exchanged. In the surface treatment apparatus of Claim 2 or 3,
The surface treatment apparatus, wherein the transport mechanism is made of stainless steel, titanium, carbon steel, brass or plastic.

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