JP6571379B2 - Cutting equipment - Google Patents

Description

  The present invention relates to a cutting apparatus for cutting a workpiece such as a semiconductor wafer.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by division lines arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and devices such as ICs and LSIs are formed in the partitioned regions. . Then, the semiconductor wafer is cut along the planned division line to divide the region where the device is formed to manufacture individual semiconductor devices.

  A cutting apparatus for cutting a workpiece such as a semiconductor wafer along a division line, a cassette placing means for placing a cassette containing a plurality of workpieces, and placed on the cassette placing means An unloading / loading means for unloading and loading the workpiece from the cassette, a temporary placing means for temporarily placing the workpiece unloaded by the unloading / loading means, and a workpiece temporarily placed on the temporary placing means. A holding table for holding, a first cutting means and a second cutting means for cutting a workpiece held on the holding table, a processing feeding means for processing and feeding the holding table in the processing feed direction, A first indexing means and a second indexing means for indexing and feeding the first cutting means and the second cutting means in an indexing feed direction perpendicular to the machining feed direction, such as a semiconductor wafer Cut efficiently along the dividing lines a workpiece can be divided into individual devices (e.g., see Patent Document 1).

JP-A-11-26402

  However, in the cutting apparatus described above, the first indexing feeding means and the second indexing feeding means for processing and feeding the first cutting means and the second cutting means in the machining feeding direction are constituted by a ball screw mechanism. Therefore, there are problems that the number of parts is large and the manufacturing cost is high, and the configuration of the entire apparatus is complicated and large.

  The present invention has been made in view of the above-mentioned facts, and the main technical problem thereof is that the first index feeding means and the first index feeding means for machining and feeding the first cutting means and the second cutting means in the machining feed direction. Another object of the present invention is to provide a cutting apparatus that can simplify the structure of the indexing and feeding means 2 and reduce the manufacturing cost by reducing the number of parts.

In order to solve the main technical problem, according to the present invention, a cassette mounting mechanism on which a cassette containing a plurality of workpieces is mounted, and a workpiece from the cassette mounted on the cassette mounting mechanism. An unloading / loading mechanism for unloading and unloading, a temporary placing mechanism for temporarily placing the workpiece unloaded by the unloading / loading mechanism, and a holding table for holding the workpiece temporarily placed on the temporary placing mechanism; A machining feed mechanism for moving the holding table in the machining feed direction (X-axis direction), a first cutting means and a second cutting means for cutting a workpiece held on the holding table, A cutting apparatus comprising: an index feed mechanism that moves the first cutting means and the second cutting means in an index feed direction (Y-axis direction) orthogonal to the X-axis direction, wherein the first cutting means And second The cutting means 2 includes a moving base and cutting blades disposed on the moving base and on the same axis, respectively, and the moving base of the first cutting means and the second The moving base of the cutting means is movably supported on a Y-axis guide rail disposed along the Y-axis direction,
The indexing and feeding means is mounted on a common base of the first cutting means and a common Y-axis linear rail arranged along the Y-axis guide rail and movably fitted on the Y-axis linear rail. A first coil mover, and a second coil mover that is movably inserted into the Y-axis linear rail and is mounted on the moving base of the second cutting means,
The processing-feed mechanism, and the workpiece detaching area mechanism placed provisional movement base on which the holding table is disposed is disposed, said first cutting means and the second cutting means is arranged An X-axis guide rail that is movably supported between the machining area, an X-axis linear rail disposed along the X-axis guide rail, and a movement that is inserted into the X-axis linear rail so as to be movable. An X-axis coil mover mounted on the base,
The cassette placement mechanism and the temporary placement mechanism are disposed adjacent to each other in the Y-axis direction,
The unloading / carrying-in mechanism includes a support base, a gripping member that grips the workpiece disposed in the support base and accommodated in a cassette, and a pair of regulation pins that regulate the workpiece to a predetermined position; Transport movement means for moving the support base in the Y-axis direction,
The temporary placement mechanism includes a pair of support rails extending in the Y-axis direction and having bottom and side portions that support both side portions of the workpiece, the bottom portions being configured to be openable and closable, and the pair of support rails An opening / closing means for opening and closing the bottom of the base plate and an elevating means for moving the pair of support rails in the vertical direction, and when the holding table is positioned in the workpiece attaching / detaching area, -The workpiece stored in the cassette is unloaded by the loading mechanism, temporarily placed on the pair of support rails constituting the temporary placement mechanism, and the workpiece is lowered by lowering the pair of support rails by the lifting means. There is provided a cutting device which is placed on the holding table and holds the workpiece on the holding table by opening the bottom by the opening / closing means.

A cleaning mechanism having a spinner table for cleaning the workpiece adjacent to the temporary placement mechanism and on the opposite side of the cassette mounting mechanism in the Y-axis direction is disposed, and the temporary placement mechanism is directly above the cleaning mechanism. An auxiliary temporary placement mechanism that is configured to communicate with the temporary placement of the workpiece is disposed,
The auxiliary temporary placement mechanism includes a pair of auxiliary support rails that extend in the Y-axis direction and have a bottom portion and a side portion that support both side portions of the workpiece, and the bottom portion can be opened and closed, and the pair of auxiliary support rails. Opening / closing means for opening and closing the bottom of the rail and auxiliary lifting means for moving the pair of auxiliary support rails in the vertical direction are provided.

The carry-out / carry-in mechanism includes an auxiliary gripping member that grips a region opposite to a region gripped by a gripping member on a workpiece that is disposed on a support base and supported by a pair of auxiliary support rails, and a pair of auxiliary members. A pair of auxiliary restricting pins for restricting the work piece supported by the support rail to a predetermined position;
When the holding table holding the cut workpiece is positioned in the workpiece attachment / detachment area, the pair of support rails are lowered with the bottoms of the pair of support rails constituting the temporary placement mechanism open. The bottom portion is positioned below the cut workpiece, and then the bottom portion is closed to lift the pair of support rails while supporting the cut workpiece,
Next, the workpiece accommodated in the cassette is gripped by the gripping member of the unloading / loading mechanism, and the pair of auxiliary regulating pins provided on the support base are gripped by the gripping member on the cut workpiece. By positioning the support base on the end surface of the region opposite to the region and moving the support base to the auxiliary temporary placement mechanism side, the workpiece stored in the cassette is positioned on the temporary placement mechanism and the cut workpiece is placed on the auxiliary temporary placement mechanism. Positioned in the place mechanism,
Next, the auxiliary lifting means constituting the auxiliary temporary placing mechanism temporarily places the pair of auxiliary supporting rails, the lifting means lowers the pair of auxiliary supporting rails, and the workpiece is placed on the spinner table of the cleaning mechanism, The cut workpiece is held on the spinner table by opening the bottom by the opening / closing means.

  The cleaning mechanism includes a spray nozzle that sprays cleaning water disposed above the spinner table, and the spray nozzle is disposed on a support base that constitutes a carry-out / load-in mechanism and is selectively engaged. The joint means moves in the Y-axis direction along with the movement of the support base, and the cleaning water is jetted at least in the region from the outer periphery to the center of the workpiece.

The spray nozzle of the cleaning mechanism is configured such that the other end of a wire having a weight connected to one end is connected via a pulley and moves in the Y-axis direction by the gravity of the weight.
The engagement means includes an engagement rod disposed on the support base so as to be able to advance and retreat, and makes the contact from the direction of movement due to the gravity of the weight in the injection nozzle in the state where the engagement rod is advanced.

The cutting device according to the present invention is configured as described above, and the index feed means for moving the first cutting means and the second cutting means in the index feed direction perpendicular to the machining feed direction is provided along the Y-axis guide rail. A common Y-axis linear rail, a first coil mover that is movably fitted on the Y-axis linear rail and is mounted on the moving base of the first cutting means, and a Y-axis linear rail And a second coil mover that is movably inserted into the moving base of the second cutting means, and the machining feed mechanism moves the temporary base on which the holding table is disposed to the temporary base. and the workpiece detaching area mechanism is disposed placed, an X-axis guide rails for movably supporting between the said first cutting means and the second cutting means disposed processability region, wherein said X X arranged along the shaft guide rail A linear rail, and an X-axis coil mover that is movably inserted into the X-axis linear rail and is mounted on the moving base. The cassette mounting mechanism and the temporary placement mechanism are adjacent to each other in the Y-axis direction. The unloading / carrying-in mechanism regulates the workpiece to a predetermined position, a supporting member, a gripping member for gripping the workpiece disposed in the cassette and accommodated in the cassette. A temporary moving mechanism that moves the support base in the Y-axis direction, and the temporary placement mechanism extends in the Y-axis direction and supports both sides of the workpiece. A pair of support rails configured to be openable and closable, opening and closing means for opening and closing the bottom parts of the pair of support rails, and elevating means for moving the pair of support rails in the vertical direction. And the holding table is positioned in the workpiece attaching / detaching region. Then, the workpieces accommodated in the cassette are unloaded by the unloading / loading mechanism, temporarily placed on the pair of support rails constituting the temporary placement mechanism, and the pair of support rails are lowered by the lifting means. Since the work piece is placed on the holding table and the work piece is held on the holding table by opening the bottom by the opening / closing means, the ball screw mechanism is not used, so the number of parts can be reduced. The manufacturing cost can be reduced and the apparatus can be miniaturized.

The perspective view of the cutting device comprised according to this invention. The principal part perspective view of the cutting device shown in FIG. The perspective view which shows the cutting mechanism with which the cutting apparatus shown in FIG. 1 is equipped. FIG. 2 is a cross-sectional view taken along line AA in FIG. The perspective view of the carrying-out / carry-in mechanism which comprises the cutting apparatus shown in FIG. Front view of essential parts of the carry-out / carry-in mechanism 7 shown in FIG. The perspective view of the temporary placement mechanism and auxiliary temporary placement mechanism which comprise the cutting device shown in FIG. The side view of the temporary placement mechanism shown in FIG. The perspective view of the washing | cleaning mechanism which comprises the cutting device shown in FIG. The perspective view which shows the state which positioned the holding member of a carrying out and carrying-in mechanism, and a pair of control pin in a standby position. The perspective view which shows the state which hold | grips the cyclic | annular flame | frame which supported the to-be-processed object accommodated in the cassette mounted in the cassette mounting mechanism with the holding member of a carrying out / carry-in mechanism. The perspective view which shows the state which conveys the workpiece supported by the cyclic | annular flame | frame by the carrying-out / carry-in mechanism to a pair of support rail of a temporary placement mechanism. The perspective view which shows the state which mounted the to-be-processed object supported through the dicing tape on the upper surface of the holding table. The perspective view which shows the state which raised a pair of support rail of the temporary placement mechanism, and was located in the upper position. The perspective view which shows the state which moved the holding | maintenance table which hold | maintained the workpiece to the suction to the process area | region where the cutting mechanism was arrange | positioned. The perspective view which shows the state located in the holding table workpiece attachment or detachment position which sucked and held the cut workpiece. FIG. 16 is a perspective view illustrating a state in which the pair of support rails of the temporary placement mechanism is positioned at a lower position from the state illustrated in FIG. 15. FIG. 17 is a perspective view showing a state in which the pair of support rails of the temporary placement mechanism are positioned at an intermediate position slightly below the upper position from the state shown in FIG. 16. The perspective view which shows the state which hold | gripped the to-be-processed object accommodated in the cassette mounted in the cassette mounting mechanism by the holding part of the carrying out / carry-in mechanism. A perspective view showing a state in which a new workpiece is positioned on the pair of support rails of the temporary placement mechanism by the grip portion of the unloading / loading mechanism and the cut workpiece is positioned on the pair of auxiliary support rails of the auxiliary temporary placement mechanism. . The perspective view which shows the state located in a pair of auxiliary | assistant support rail lower position of the auxiliary temporary placement mechanism from the state of FIG. FIG. 21 is a perspective view illustrating a state in which the pair of support rails of the temporary placement mechanism and the pair of auxiliary support rails of the auxiliary temporary placement mechanism are positioned at the upper positions from the state illustrated in FIG. FIG. 22 is a perspective view showing a state where the carry-out / carry-in mechanism 7 is positioned at the standby position from the state shown in FIG. 21 and the pair of auxiliary support rails constituting the auxiliary temporary placement mechanism are positioned at the lower position. The perspective view which shows the state which positioned the pair of auxiliary | assistant support rail of the auxiliary | assistant temporary placement mechanism which supported the workpiece after washing | cleaning supported by the cyclic | annular flame | frame at the upper position. The perspective view which shows the state which moved the workpiece after washing | cleaning supported by the cyclic | annular flame | frame from the state of FIG. 23 from a pair of auxiliary support rail of an auxiliary temporary placement mechanism to a pair of support rail of a temporary placement mechanism. FIG. 25 is a perspective view showing a state in which the pair of support rails of the temporary placement mechanism are positioned at an intermediate position from the state of FIG. 24 and the gripping member and the pair of regulation pins of the unloading / loading mechanism are positioned at the standby position. The perspective view which shows the state which act | operates a carrying out and carrying-in mechanism from the state of FIG.

  Hereinafter, a preferred embodiment of a cutting device configured according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 shows a perspective view of one embodiment of a cutting device constructed in accordance with the present invention.
The cutting apparatus in the illustrated embodiment includes a stationary base 2, a holding table mechanism 3 that is disposed on the stationary base 2 and holds a workpiece, and a workpiece held by the holding table mechanism 3. And a cutting mechanism 4 for cutting.

  As shown in FIG. 2, the holding table mechanism 3 includes two X-axis guide rails 31, 31 disposed on the stationary base 2 along the processing feed direction (X-axis direction) indicated by an arrow X, A movable base 32 slidably disposed on the two X-axis guide rails 31, 31 and a cylindrical support member 33 disposed on the movable base 32 are rotatably supported. In order to move the holding table 34 that holds the workpiece and the moving base 32 on which the holding table 34 is disposed along the two X-axis guide rails 31 and 31 in the processing feed direction (X-axis direction). The processing feed means 35 is provided. The holding table 34 includes a table main body 341 that is rotatably supported by a cylindrical support member 33, and a suction chuck 342 disposed on the upper surface of the table main body 341. The table main body 341 is formed to have an outer diameter larger than an outer diameter of a wafer as a workpiece to be described later and smaller than an inner diameter of an annular frame that supports the wafer via a dicing tape. The suction chuck 342 is made of porous ceramics and is connected to suction means (not shown) so that a negative pressure is appropriately applied. Therefore, the workpiece placed on the suction chuck 342 is sucked and held on the suction chuck 342 by operating a suction means (not shown). The holding table 34 can be rotated by a pulse motor (not shown) disposed in a cylindrical support member 33.

  The machining feed means 35 is disposed between the two X-axis guide rails 31 and 31 and extends in the X-axis direction, and is inserted into the X-axis linear rail 351 so as to be movable. It consists of an X-axis coil mover 352 mounted on a moving base 32 on which a holding table 34 is disposed. For example, the X-axis linear rail 351 is formed into a shaft shape by alternately joining N poles and S poles of a plurality of columnar permanent magnets, and the plurality of columnar permanent magnets configured in this shaft shape are made of stainless steel. It is configured by being disposed in a cylindrical case made of a nonmagnetic material such as steel. As shown in FIG. 2, the X-axis linear rail 351 configured in this manner is provided with support members 353 and 353 at both ends, and the support base pedestal 2 is connected to the support bases 353 and 353 via the support members 353 and 353. Mounted. The machining feed means 35 comprising the X-axis linear rail 351 and the X-axis coil mover 352 constitutes a so-called linear shaft motor, and when an electric current flows through the X-axis coil mover 352, an attractive force and a repulsive force are generated. Thrust is generated repeatedly. Accordingly, the direction in which the X-axis coil mover 352 moves along the X-axis linear rail 351 can be changed by changing the direction of the current applied to the X-axis coil mover 352. Thus, the machining feed means 35 constituted by a so-called linear shaft motor has a configuration in which the X-axis coil movable element 352 is slidably fitted to the X-axis linear rail 351, and thus the configuration is simple and non-contact. Because it is driven by the motor, it is not worn out and the maintenance becomes extremely simple. Further, since the machining feed means 35 constituted by a so-called linear shaft motor does not use a ball screw mechanism unlike the conventional feed mechanism, the number of parts can be reduced, the manufacturing cost can be reduced, and the apparatus can be downsized. In addition, the yawing is suppressed when the holding table 34 holding the workpiece is cut and fed by the cutting mechanism 4 described later, so that the cutting accuracy can be improved. The processing feeding means 35 configured as described above moves the moving base 32 provided with the holding table 34 between the workpiece attaching / detaching region shown in FIG. 2 and the processing region provided with the cutting mechanism 4. Let me.

Next, the cutting mechanism 4 will be described.
The cutting mechanism 4 includes a gate-shaped support frame 41 fixed on the stationary base 2. The gate-shaped support frame 41 connects the first pillar part 411 and the second pillar part 412 that are arranged at intervals, and the upper ends of the first pillar part 411 and the second pillar part 412. And a support portion 413 disposed along an index feed direction (Y-axis direction) indicated by an arrow Y orthogonal to the machining feed direction indicated by an arrow X, and straddling the two X-axis guide rails 31 It is arranged.

  A first cutting means 5a and a second cutting means 5b are disposed on the back side of the support portion 413 constituting the portal-type support frame 41 in FIGS. The 1st cutting means 5a and the 2nd cutting means 5b are demonstrated with reference to FIG. 3 and FIG. The first cutting means 5 a and the second cutting means 5 b include an indexing movement base 51, a cutting movement base 52 and a spindle unit 53, respectively. The index movement base 51 of the first cutting means 5a and the index movement base 51 of the second cutting means 5b are respectively two Y-axis guides provided on the left side surface of the support portion 413 in FIG. Guided grooves 511 and 511 that are fitted to the rails 413a and 413a are provided. By fitting the guided grooves 511 and 511 to the two Y-axis guide rails 413a and 413a, the index moving base 51 Is configured to be movable along two Y-axis guide rails 413a and 413a. A concave portion 513 in which an index feeding means to be described later is provided is formed on one surface of the index movement base 51 of the first cutting means 5a and the index movement base 51 of the second cutting means 5b. ing. Further, the other surfaces of the indexing movement base 51 of the first cutting means 5a and the indexing movement base 51 of the second cutting means 5b are respectively along the cutting feed direction indicated by the arrow Z as shown in FIG. A pair of guide rails 512 and 512 (only one guide rail is shown in FIG. 4) is provided.

  The incision moving base 52 of the first cutting means 5a and the incision movement base 52 of the second cutting means 5b are horizontally supported at a right angle from the supported portion 521 extending in the vertical direction and the lower end of the supported portion 521, respectively. And a mounting portion 522 extending in the direction. As shown in FIG. 4, a guided groove 523 fitted to a pair of Z-axis guide rails 512 and 512 provided on the other surface of the indexing movement base 51 is provided on the surface of the supported portion 521 on the mounting portion 522 side. 523 (only one guided groove is shown in FIG. 4), and by fitting the guided grooves 523 and 523 to the two Z-axis guide rails 512 and 512, The cutting base 52 is configured to be movable in the cutting feed direction indicated by the arrow Z along the two Z-axis guide rails 512 and 512. In the cutting movement base 52 mounted on the indexing movement base 51 in this way, the mounting portion 522 protrudes below the support portion 413 constituting the portal-type support frame 41 as shown in FIGS. Arranged.

  The spindle unit 53 is mounted on the lower surface of the mounting portion 522 that forms the cutting movement base 52 of the first cutting means 5a and the second cutting means 5b. The spindle unit 53 of the first cutting means 5a and the spindle unit 53 of the second cutting means 5b are rotatably supported by the spindle housing 531 and the spindle housing 531 as shown in FIGS. The rotary spindle 532, a cutting blade 533 attached to one end of the rotary spindle 532, a cutting water supply pipe 534 for supplying cutting water, and a servo motor (not shown) for rotationally driving the rotary spindle 532 are provided. The axial direction of 532 is arranged along the index feed direction indicated by the arrow Y. The cutting blade 533 constituting the spindle unit 53 of the first cutting means 5a and the cutting blade 533 constituting the spindle unit 53 of the second cutting means 5b are arranged to face each other.

  As shown in FIG. 3, the first cutting means 5a and the second cutting means 5b in the illustrated embodiment are arranged such that the index moving bases 51 and 51 are moved along the two Y-axis guide rails 413a and 413a by the arrow Y. The index feeding means 54 for moving in the index feeding direction (Y-axis direction) shown in FIG. The index feeding means 54 is a common Y-axis linear rail 540 disposed along the two Y-axis guide rails 413a and 413a, and is movably fitted and inserted into the common Y-axis linear rail 540. The index movement base of the second cutting means 5b is movably fitted to the first Y-axis coil mover 544a mounted on the index movement base 51 of the cutting means 5a and the common Y-axis linear rail 540. 51 and a second Y-axis coil mover 544b attached to the main body 51. The common Y-axis linear rail 540 is formed into a shaft shape by alternately joining N poles and S poles of a plurality of columnar permanent magnets, for example, and a plurality of columnar permanent magnets configured in this shaft shape. Are arranged in a cylindrical case made of a nonmagnetic material such as stainless steel. As shown in FIG. 3, the common Y-axis linear rail 540 configured in this manner is mounted with support members 543 and 543 as shown in FIG. 3, and the support frame 41 of the support frame 41 is interposed via the support members 543 and 543. It is attached to the support portion 413. The first coil mover 544a and the second coil mover 544b that are movably fitted in the common Y-axis linear rail 540 are respectively the index moving base 51 and the second coil mover 51a of the first cutting means 5a. It is disposed in a recess 513 provided in the indexing movement base 51 of the cutting means 5b and is mounted on one surface of the indexing movement base 51, respectively.

  As described above, the index feeding means 54 including the common Y-axis linear rail 540, the first coil mover 544a, and the second coil mover 544b includes the X-axis linear rail 361, the X-axis coil mover 362, and the like. A so-called shaft motor is formed in the same manner as the machining feed means 35, and when an electric current flows through the first coil movable element 544a and the second coil movable element 544b, a thrust is generated by repeating an attractive force and a repulsive force. Occur. Therefore, by changing the direction of the current applied to the first coil mover 544a and the second coil mover 544b, the first coil mover 544a and the second coil mover 544b can be shared by the Y-axis linear rail. The direction of movement along 540 can be changed. Thus, the index feeding means 54 configured by a so-called shaft motor has a configuration in which the first coil movable element 544a and the second coil movable element 544b are slidably fitted to the common Y-axis linear rail 540. Therefore, the structure is simple, and since it is driven in a non-contact manner, there is no wear and the maintenance becomes extremely simple. Further, since the indexing feeding means 54 constituted by a so-called linear shaft motor does not use a ball screw mechanism unlike the conventional feeding mechanism, the number of parts can be reduced and the manufacturing cost is reduced.

  Further, the first cutting means 5a and the second cutting means 5b in the illustrated embodiment have the above-mentioned cutting movement bases 52, 52 as two Z-axis guide rails 512, 512, as shown in FIGS. Are provided with cutting feed means 55, 55 for moving in the cutting feed direction (Z-axis direction) indicated by the arrow Z. The cut-in feeding means 55 and 55 include a male screw rod 551 disposed in parallel with the two Z-axis guide rails 512 and 512, a bearing 552 that rotatably supports one end of the male screw rod 551, and a male screw rod 551. And a pulse motor 553 that is connected to the other end of the motor and drives the male screw rod 551 to rotate forward or backward. In the cutting feed means 55 and 55 configured as described above, the male screw rod 551 is screwed into a female screw 521 a formed on the supported portion 521 of the cutting moving base 52. Accordingly, the cutting feed means 55 and 55 drive the pulse motor 553 to drive the male screw rod 551 in the normal direction or the reverse direction, thereby moving the cutting base 52 along the two Z-axis guide rails 512 and 512. In FIG. 3, it can move in the cutting feed direction (Z-axis direction) indicated by an arrow Z.

  The description will be continued with reference to FIG. 1. On the stationary base 2, a cassette mounting mechanism 6 on which a cassette 60 for storing a plurality of workpieces such as semiconductor wafers is mounted, and the cassette mounting mechanism. The work piece is carried out from the cassette 60 placed on the work piece 6 and the cut work piece is carried into the cassette 60, and the work piece carried out by the carry-out / carry-in mechanism 7 is temporarily A temporary placement mechanism 8 to be placed, an auxiliary temporary placement mechanism 9 disposed adjacent to the temporary placement mechanism 8, and a cleaning mechanism 10 for cleaning a workpiece after cutting are provided. The cassette mounting mechanism 6 is configured such that a cassette 60 is mounted on a cassette table 61 that is lifted and lowered by a lifting means (not shown). The cassette 60 accommodates a semiconductor wafer W attached to the surface of a dicing tape T attached to an annular frame F. In addition, on the outer periphery of the annular frame F, a notch F-1 and a flat surface F-2 that engage with a regulation pin described later are provided.

  As shown in FIG. 1, the carry-out / carry-in mechanism 7 includes a transfer movement means 71 disposed on the surface side of the support portion 413 constituting the portal-type support frame 41, and the transfer movement means 71 moves in the Y-axis direction. It comprises a support base 72 to be fastened, and a connecting member 73 that connects the support base 72 and the transport movement means 71. The transport moving means 71 is composed of a belt mechanism that moves the connecting member 73 connected to the support base 72 in the Y-axis direction. The description will be continued with reference to FIGS. 5 and 6. The support base 72 constituting the carry-out / carry-in mechanism 7 is accommodated in a cassette 60 disposed on the lower side and placed on the cassette placement mechanism 6. A gripping member 74 (see FIG. 6) for gripping the annular frame F that supports the semiconductor wafer W via the dicing tape T, an air cylinder 740 that moves the gripping member 74 in the vertical direction, and a gripping member 74 A pair of restricting pins 75 are attached to restrict the annular frame F to a predetermined position by engaging with the notches F-1 and the flat surface F-2 provided on the annular frame F. Yes. The carry-out / carry-in mechanism 7 configured as described above moves the support base 72 toward the cassette 60 placed on the cassette placement mechanism 6, and the semiconductor wafer in which the pair of regulation pins 75 are accommodated in the cassette 60. By engaging W with a notch F-1 and a flat surface F-2 provided on an annular frame F that supports a dicing tape T, the position of the semiconductor wafer W is regulated at a predetermined position. Then, the annular frame F is gripped between the support base 72 and the gripping member 74 by moving the gripping member 74 upward by the air cylinder 740.

  Further, the support base 72 constituting the carry-out / carry-in mechanism 7 has an auxiliary for gripping an annular frame F that is disposed on the lower side and supports a cut semiconductor wafer W, which will be described later, via a dicing tape T. A gripping member 76 (see FIG. 6), an air cylinder 760 that moves the auxiliary gripping member 76 in the vertical direction, and an annular frame F that is disposed on both sides of the auxiliary gripping member 76 and engages with the annular frame F. A pair of auxiliary restricting pins 77 are attached to restrict the position to a predetermined position. Further, the support base 72 constituting the carry-out / carry-in mechanism 7 is provided with an engaging means 78 that selectively engages with an ejection nozzle of a cleaning mechanism described later. The engaging means 78 includes an engaging rod 781 disposed so as to be able to advance and retract downward from the lower surface of the support base 72, and an air cylinder 782 for moving the engaging rod 781 forward and backward.

  The temporary placement mechanism 8 will be described with reference to FIGS. 1, 7 and 8. The temporary placement mechanism 8 is disposed immediately above the workpiece attachment / detachment area of the holding table 34 adjacent to the cassette placement mechanism 6 in the Y-axis direction. The temporary placement mechanism 8 includes a pair of bottom portions 81a and 81b and side portions 82a and 82b that extend in the Y-axis direction and support both side portions of the annular frame F, and the bottom portions 81a and 81b are configured to be openable and closable. Support rails 80, opening / closing means 85 a and 85 b for opening and closing the bottom portions 81 a and 81 b of the pair of support rails 80, and elevating means 86 for moving the pair of support rails 80 in the vertical direction. In addition, flange portions 83a and 83b projecting inward from each other are provided at the upper ends of the side portions 82a and 82b constituting the pair of support rails 80, and one end portions of the flange portions 83a and 83b are connected to each other by the connecting portion 84. It is connected. The opening / closing means 85a and 85b are air motors in the illustrated embodiment, and the bottom portions 81a and 81b of the pair of support rails 80 are indicated by a closed position and a two-dot chain line which are horizontal positions indicated by solid lines in FIG. Operate each to the open position, which is the vertical position. The elevating means 86 includes an air cylinder 861 attached to a fixing member (not shown), and a piston rod 862 of the air cylinder 861 is connected to the connecting portion 84 of the pair of support rails 80.

  The auxiliary temporary placement mechanism 9 is adjacent to the temporary placement mechanism 8 in the Y-axis direction and is disposed immediately above a cleaning mechanism 10 described later on the opposite side of the cassette placement mechanism 6 in the Y-axis direction. The auxiliary temporary placement mechanism 9 has the same configuration as the temporary placement mechanism 8, and includes bottom portions 91a and 91b and side portions that extend in the Y-axis direction and support both side portions of the annular frame F as shown in FIG. A pair of auxiliary support rails 90 having bottom portions 91a and 91b configured to be openable and closable; opening and closing means 95a and 95b for opening and closing the bottom portions 91a and 91b of the pair of auxiliary support rails 90; Lifting / lowering means 96 for moving the auxiliary support rail 90 in the vertical direction. In addition, flange portions 93a and 93b projecting inward from each other are provided at the upper ends of the side portions 92a and 92b constituting the pair of auxiliary support rails 90, and one end portions of the flange portions 93a and 93b are connected to the connecting portion 94. Are connected by The opening / closing means 95a and 95b are air motors in the illustrated embodiment, and operate the bottom portions 91a and 91b of the pair of auxiliary support rails 90 to a closed position which is a horizontal position and an open position which is a vertical position, respectively. . The elevating means 96 includes an air cylinder 961 attached to a fixing member (not shown), and a piston rod 962 of the air cylinder 961 is connected to the connecting portion 94 of the pair of auxiliary support rails 90.

Next, the cleaning mechanism 10 will be described with reference to FIGS. 1 and 9.
The cleaning mechanism 10 in the illustrated embodiment is disposed adjacent to the temporary placement mechanism 8 and on the opposite side to the cassette mounting mechanism 6 in the Y-axis direction. The cleaning mechanism 10 includes a cleaning housing 11. The cleaning housing 11 includes a front wall 111, a rear wall 112, side walls 113 and 114, and a bottom wall (not shown), and an upper portion is released. A spinner table 12 is disposed in the cleaning housing 11 thus configured. The spinner table 12 includes a table main body 121, a suction chuck 122 disposed on the upper surface of the table main body 121, and a servo motor 123 that rotationally drives the table main body 121. The table body 121 is formed so that the outer diameter is larger than the outer diameter of the wafer W and smaller than the inner diameter of the annular frame F that supports the wafer W via the dicing tape T. The suction chuck 122 is made of porous ceramics and is connected to a suction means (not shown) so that a negative pressure is appropriately applied. Therefore, the workpiece placed on the suction chuck 122 is sucked and held on the suction chuck 122 by operating a suction means (not shown).

  1 and 9, the front wall 111 of the cleaning housing 11 is provided with a guide hole 111a formed along the Y-axis direction, and the spinner table is formed in the guide hole 111a. An injection nozzle 13 for injecting cleaning water onto the workpiece held by 12 is arranged to be movable in the Y-axis direction. The jet nozzle 13 is connected to the other end of a wire 15 having a weight 14 connected to one end via a pulley 16 and is moved in the direction indicated by the arrow Y1 by the gravity of the weight 14. The engaging means 78 disposed on the support base 72 constituting the carry-out / carry-in mechanism 7 is engaged with the injection nozzle 13 so as to be able to advance and retract downward from the lower surface of the support base 72. The rod 781 is brought into contact from the direction indicated by the arrow Y <b> 1 that moves due to the gravity of the weight 14 in the injection nozzle 13 in the advanced state. The injection nozzle 13 is connected to a cleaning water supply means (not shown).

The cutting apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
First, as shown in FIG. 10, the air cylinder 861 of the temporary placement mechanism 8 is operated to position the pair of support rails 80 at the upper position, and the gripping member 74 (see FIG. 6) of the unloading / loading mechanism 7 and the pair of restrictions. The support base 72 on which the pin 75 (see FIGS. 5 and 6) is disposed is positioned at the standby position shown.

  Next, the transport moving means 71 (see FIGS. 1 and 5) of the carry-out / carry-in mechanism 7 is operated, and the support base 72 in which the gripping member 74 and the pair of regulation pins 75 are disposed as shown in FIG. Is moved to the cassette mounting mechanism 6 side, and a pair of regulating pins 75 (see FIGS. 5 and 6) are provided on the annular frame F that supports the semiconductor wafer W accommodated in the cassette 60 via the dicing tape T. By engaging with the notch F-1 and the flat surface F-2 (see FIG. 1), the position of the semiconductor wafer W is regulated at a predetermined position. Then, by operating the air cylinder 740, the annular frame F is gripped between the support base 72 and the gripping member 74 (see FIG. 6).

  If the annular frame F is gripped by the support base 72 and the gripping member 74, the transport movement means 71 of the unloading / loading mechanism 7 is operated to move the support base 72 to the opposite side of the cassette mounting mechanism 6. As shown in FIG. 12, the annular frame F is transported to a pair of support rails 80 of the temporary placement mechanism 8 and temporarily placed.

  When the annular frame F is conveyed to the pair of support rails 80 of the temporary placement mechanism 8, as shown in FIG. 13, the air cylinder 861 is operated to lower the pair of support rails 80 and position them at the lower position. As a result, the dicing tape T attached to the annular frame F and having the semiconductor wafer W attached thereto is placed on the upper surface of the holding table 34 positioned at the workpiece attaching / detaching position in the holding table mechanism 3. Then, the opening / closing means 85a and 85b (see FIGS. 6 and 8) are operated so that the bottom portions 81a and 81b of the pair of support rails 80 are positioned in an open market indicated by a two-dot chain line shown in practice in FIG.

  Next, by operating a suction means (not shown), the semiconductor wafer W is sucked and held on the upper surface of the holding table 34 via the dicing tape T as shown in FIG. Then, the air cylinder 851 of the temporary placement mechanism 8 is operated to raise the pair of support rails 80 and position them at the upper position.

  As shown in FIG. 14, when the semiconductor wafer W is sucked and held on the upper surface of the holding table 34 via the dicing tape T, the processing feed means 35 constituting the holding table mechanism 3 is operated to suck and hold the semiconductor wafer W. As shown in FIG. 15, the holding table 34 is moved to the machining area where the cutting mechanism 4 is disposed. A predetermined cutting process is performed on the semiconductor wafer W held on the holding table 34 by the first cutting means 5a and the second cutting means 5b. As described above, the holding table 34 is formed so that the outer diameter is larger than the outer diameter of the semiconductor wafer W and smaller than the inner diameter of the annular frame F. There is no interference with the cutting blade 533 of the first cutting means 5a and the second cutting means 5b, and the frame pressing mechanism is not required, thereby reducing the cost.

  When the semiconductor wafer W held on the holding table 34 is subjected to predetermined cutting as described above, the holding table 34 that sucks and holds the cut semiconductor wafer W by operating the processing feeding means 35 is shown in FIG. Position it at the workpiece attachment / detachment position shown. In this state, the cut semiconductor wafer W held on the holding table 34 is positioned directly below the temporary placement mechanism 8.

  If the cut semiconductor wafer W held on the holding table 34 is positioned immediately below the temporary placement mechanism 8, the air is applied with the bottom portions 81a and 81b of the pair of support rails 80 of the temporary placement mechanism 8 positioned at the open position. The cylinder 861 is operated, and the pair of support rails 80 are lowered and positioned at the lower position as shown in FIG. Then, the bottom portions 81a and 81b of the pair of support rails 80 are positioned at the closed position to support the annular frame F, and the suction holding of the semiconductor wafer W by the holding table 34 is released.

  Next, the air cylinder 861 of the temporary placement mechanism 8 is actuated to raise the pair of support rails 80 that support the annular frame F, and the carry-out / load-in mechanism 7 is slightly below the upper position as shown in FIG. The pair of support rails 80 are positioned at an intermediate position where the gripping member 74 and the pair of regulation pins 75 can move above the cut semiconductor wafer W supported by the pair of support rails 80.

  Then, the transport moving means 71 of the unloading / loading mechanism 7 is operated to move the support base 72 to the cassette mounting mechanism 6 side as shown in FIG. 19, and a pair of regulating pins 75 (see FIGS. 5 and 6). ) Is engaged with a notch F-1 and a flat surface F-2 (see FIG. 1) provided on an annular frame F that supports the semiconductor wafer W accommodated in the cassette 60 via the dicing tape T. The position of the semiconductor wafer W is regulated to a predetermined position. Then, by operating the air cylinder 740, the annular frame F supporting the new semiconductor wafer W is gripped between the support base 72 and the gripping member 74 (see FIG. 6). At this time, the gripping member 74 and the pair of regulating pins 75 move above the cut semiconductor wafer W.

  Next, the air cylinder 851 of the temporary placement mechanism 8 is operated to position the pair of support rails 80 that support the cut semiconductor wafer W at the upper position, and the cassette is mounted on the annular frame F that supports the cut semiconductor wafer W. The end surface on the placement mechanism 6 side is positioned at a position facing the pair of auxiliary regulating pins 77. Thereafter, the transport moving means 71 of the unloading / loading mechanism 7 is operated to move the support base 72 to the opposite side of the cassette mounting mechanism 6 as shown in FIG. The annular frame F supporting the new semiconductor wafer W held by the carrier is transported to the pair of support rails 80 of the temporary placement mechanism 8 and supports the semiconductor wafer W after being cut against which the pair of auxiliary regulating pins 77 abut. The annular frame F is conveyed to a pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9.

  When the annular frame F supporting the cut semiconductor wafer W is transferred to the pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9, the air cylinder 961 is operated as shown in FIG. Move down to the lower position. In this state, the dicing tape T attached to the annular frame F and having the semiconductor wafer W attached thereto contacts the upper surface of the spinner table 12 of the cleaning mechanism 10. Then, by positioning the bottom portions 91a and 91b of the pair of auxiliary support rails 90 from the closed position to the open position, the cut semiconductor wafer W is placed on the upper surface of the spinner table 12 via the dicing tape T. Then, by operating a suction means (not shown), the semiconductor wafer W that has been cut is sucked and held on the upper surface of the spinner table 12 via the dicing tape T.

  Next, as shown in FIG. 22A, the pair of support rails 80 of the temporary placement mechanism 8 and the pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9 are positioned at the upper position, and the spinner table 12 is rotated. As shown in FIG. 22B, the cleaning water 130 is sprayed from the spray nozzle 13 by operating the cleaning water supply means (not shown). At this time, the engaging rod 781 of the engaging means 78 disposed on the support base 72 of the carry-out / carry-in mechanism 7 is advanced to the position where it engages with the injection nozzle 13, and the transport moving means 71 is operated. The engagement rod 781 is reciprocated in the Y-axis direction. Therefore, the injection nozzle 13 is reciprocated in the Y-axis direction in cooperation with the gravity of the weight 14 connected to one end of the wire 15 connected to the injection nozzle 13. The reciprocating range of the injection nozzle 13 may be at least the range from the outer periphery to the center of the cut semiconductor wafer W. As a result, the cut semiconductor wafer W sucked and held on the spinner table 12 via the dicing tape T is subjected to spinner cleaning. In the reciprocating movement of the injection nozzle 13 in the Y-axis direction, the carry-out / carry-in mechanism 7 serves as a drive source, so that the size can be reduced and the cost can be reduced. Since the spinner table 12 is formed so that the outer diameter is larger than the outer diameter of the semiconductor wafer W and smaller than the inner diameter of the annular frame F as described above, the annular frame F slightly hangs down by its own weight. The supplied cleaning water is smoothly discharged to the outer periphery, and the frame pressing mechanism is unnecessary, thereby reducing the cost.

  When the cut semiconductor wafer W is cleaned as described above, the unloading / loading mechanism 7 is positioned at the standby position as shown in FIG. With the bottom portions 91a and 91b positioned at the open position, the bottom portions 91a and 91b are positioned at the lower position, and the bottom portions 91a and 91b are closed and the annular frame F that supports the cleaned semiconductor wafer W is supported. Then, the suction and holding of the semiconductor wafer W by the spinner table 12 is released.

  Next, as shown in FIG. 24, a pair of auxiliary support rails 90 constituting the auxiliary temporary placement mechanism 9 that supports the annular frame F that supports the cleaned semiconductor wafer W are positioned at the upper position. Then, the auxiliary gripping member 76 disposed on the support base 72 of the unloading / loading mechanism 7 is operated to grip the annular frame F.

  Then, the transport movement means 71 of the carry-out / carry-in mechanism 7 is operated, and the annular frame F that supports the cleaned semiconductor wafer W is moved from the pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9 as shown in FIG. It moves to the pair of support rails 80 of the temporary placement mechanism 8.

  Next, as shown in FIG. 26, the pair of support rails 80 of the temporary placement mechanism 8 are positioned at an intermediate position, and the gripping member 74 and the pair of restriction pins 75 disposed on the support base 72 of the carry-out / load-in mechanism 7. At the standby position.

  Then, the transport moving means 71 of the carry-out / carry-in mechanism 7 is operated to move the support base 72 toward the cassette mounting mechanism 6 as shown in FIG. 27 so that the gripping member 74 and the pair of regulating pins 75 are moved to the standby position. To the cassette 60 mounted on the cassette mounting mechanism 6, the annular frame F that supports the cleaned semiconductor wafer W is accommodated in the cassette 60.

  As described above, a new semiconductor carried out from the cassette 60 to the pair of support rails 80 of the temporary placement mechanism 8 when the cleaned semiconductor wafer W is cleaned and accommodated in the cassette 60 is implemented. As described above, the wafer W is conveyed to the holding table 34 constituting the holding table mechanism 3 and sucked and held. Then, the new semiconductor wafer W sucked and held by the holding table 34 is moved to the machining area where the cutting mechanism 4 is disposed by the machining feed means 35, and the first cutting means 5a and the second cutting means 5b. A predetermined cutting process is performed.

  As described above, the cutting apparatus in the illustrated embodiment is configured such that the semiconductor housed in the cassette 60 by the carry-out / carry-in mechanism 7 when the holding table 34 that holds the workpiece is positioned in the workpiece attachment / detachment region. The annular frame F that supports the wafer W via the dicing tape T is unloaded and temporarily placed on a pair of support rails 80 constituting the temporary placement mechanism 8. The semiconductor wafer W supported on the frame F via the dicing tape T is placed on the holding table 34, and the semiconductor wafer W is held via the dicing tape T by opening the bottom portions 81a and 81b by the opening / closing means 85a and 85b. Since it is held on the table 34, it conveys an annular frame F that supports a semiconductor wafer W as a workpiece through a dicing tape T. Since the carrying means for carrying out is substantially only the carry-out / carry-in mechanism 7, the number of parts can be reduced, the cost can be reduced, and the apparatus can be downsized. Further, the carry-out / carry-in mechanism 7 also has an annular frame F that supports the cut semiconductor wafer W via the dicing tape T also in the auxiliary temporary placement mechanism 9 disposed immediately above the spinner table 12 of the cleaning mechanism 10. Since it has the function to convey, the apparatus can be further miniaturized.

2: Stationary base 3: Holding table mechanism 32: Moving base 34: Holding table 35: Processing feed means 351: X-axis linear rail 352: X-axis coil mover 4: Cutting mechanism 5a: First cutting means 5b: Second cutting means 54: Index feeding means 540: Common Y-axis linear rail 544a: First Y-axis coil mover 544b: Second coil mover 6: Cassette mounting mechanism 60: Cassette 7: Unloading / loading Mechanism 71: Transport moving means 72: Support base 74: Holding member 75: A pair of restricting pins 76: Auxiliary holding member 77: A pair of auxiliary restricting pins 8: Temporary placement mechanism 80: A pair of support rails 9: Auxiliary temporary placement mechanism 90: A pair of auxiliary support rails 10: Cleaning mechanism 11: Cleaning housing 12: Spinner table 13: Injection nozzle 14: Weight 15: Wire 16: Pulley
F: Ring frame
T: Dicing tape
W: Semiconductor wafer

Claims (5)

A cassette mounting mechanism on which a cassette containing a plurality of workpieces is mounted, a carry-out / carry-in mechanism for carrying out and carrying in the workpieces from the cassette placed on the cassette mounting mechanism, and the carry-out / carry-in Temporary placement mechanism for temporarily placing the workpiece unloaded by the mechanism, holding table for holding the workpiece temporarily placed on the temporary placement mechanism, and moving the holding table in the machining feed direction (X-axis direction) The cutting feed mechanism, the first cutting means and the second cutting means for cutting the workpiece held on the holding table, and the first cutting means and the second cutting means in the X-axis direction. A cutting apparatus comprising: an indexing feed mechanism that moves each in an indexing feed direction (Y-axis direction) orthogonal to
Each of the first cutting means and the second cutting means includes a moving base, and cutting blades disposed on the moving base and arranged on the same axis, respectively. The moving base and the moving base of the second cutting means are supported movably on a Y-axis guide rail disposed along the Y-axis direction,
The indexing and feeding means is mounted on a common base of the first cutting means and a common Y-axis linear rail arranged along the Y-axis guide rail and movably fitted on the Y-axis linear rail. A first coil mover, and a second coil mover that is movably inserted into the Y-axis linear rail and is mounted on the moving base of the second cutting means,
The processing-feed mechanism, and the workpiece detaching area mechanism placed provisional movement base on which the holding table is disposed is disposed, said first cutting means and the second cutting means is arranged An X-axis guide rail that is movably supported between the machining area, an X-axis linear rail disposed along the X-axis guide rail, and a movement that is inserted into the X-axis linear rail so as to be movable. An X-axis coil mover mounted on the base,
The cassette placement mechanism and the temporary placement mechanism are disposed adjacent to each other in the Y-axis direction,
The unloading / carrying-in mechanism includes a support base, a gripping member that grips the workpiece disposed in the support base and accommodated in a cassette, and a pair of regulation pins that regulate the workpiece to a predetermined position; Transport movement means for moving the support base in the Y-axis direction,
The temporary placement mechanism includes a pair of support rails extending in the Y-axis direction and having bottom and side portions that support both side portions of the workpiece, the bottom portions being configured to be openable and closable, and the pair of support rails An opening / closing means for opening and closing the bottom of the base plate and an elevating means for moving the pair of support rails in the vertical direction, and when the holding table is positioned in the workpiece attaching / detaching area, -The workpiece stored in the cassette is unloaded by the loading mechanism, temporarily placed on the pair of support rails constituting the temporary placement mechanism, and the workpiece is lowered by lowering the pair of support rails by the lifting means. A cutting apparatus that is placed on the holding table and holds the workpiece on the holding table by opening the bottom by the opening / closing means. A cleaning mechanism provided with a spinner table for cleaning a workpiece adjacent to the temporary placement mechanism and on the opposite side to the cassette mounting mechanism in the Y-axis direction is disposed, and the cleaning mechanism is disposed immediately above the cleaning mechanism. An auxiliary temporary placement mechanism that is configured to communicate with the temporary placement mechanism and temporarily places the workpiece is disposed,
The auxiliary temporary placement mechanism includes a pair of auxiliary support rails that extend in the Y-axis direction and have a bottom portion and a side portion that support both side portions of the workpiece, and the bottom portions are configured to be openable and closable. The cutting apparatus according to claim 1, further comprising: an opening / closing means for opening and closing the bottom portion of the auxiliary support rail; and an auxiliary lifting means for moving the pair of auxiliary support rails in the vertical direction . The carry-in / carry-in mechanism includes an auxiliary gripping member that grips a region opposite to a region gripped by the gripping member in a workpiece that is disposed on the support base and supported by the pair of auxiliary support rails; A pair of auxiliary restriction pins for restricting the workpiece supported by the pair of auxiliary support rails to a predetermined position;
When the holding table holding the cut workpiece is positioned in the workpiece attaching / detaching region, the pair of support rails constituting the temporary placement mechanism are opened with the bottom portions open. The pair of support rails are raised in a state where the bottom is closed and the cut workpiece is supported after the bottom is positioned below the cut workpiece and the bottom is closed.
Next, the workpiece stored in the cassette is gripped by the gripping member of the unloading / loading mechanism, and the pair of auxiliary regulating pins provided on the support base are gripped on the workpiece after cutting. Positioned on the end surface of the region opposite to the region gripped by the member, and moves the support base to the auxiliary temporary placement mechanism side, thereby positioning the workpiece contained in the cassette to the temporary placement mechanism and cutting Positioning the finished workpiece on the auxiliary temporary placement mechanism,
Next, the auxiliary lifting means constituting the auxiliary temporary placing mechanism temporarily places the pair of auxiliary supporting rails, and the lifting means lowers the pair of auxiliary supporting rails to remove the workpiece from the cleaning mechanism. The cutting apparatus according to claim 2, wherein the workpiece is mounted on the spinner table, and the cut workpiece is held on the spinner table by opening the bottom by the opening / closing means . The cleaning mechanism includes a spray nozzle that sprays cleaning water disposed above the spinner table, and the spray nozzle is disposed on the support base that constitutes the carry-out / load-in mechanism and selectively. The cutting apparatus according to claim 2 or 3 , wherein the engaging means moves in the Y-axis direction with the movement of the support base and injects cleaning water at least in a region from the outer periphery to the center of the workpiece. . The spray nozzle of the cleaning mechanism is connected to the other end of a wire having a weight connected to one end via a pulley, and is configured to move in the Y-axis direction by the gravity of the weight.
The engagement means includes an engagement rod disposed on the support base so as to be capable of advancing and retreating, and makes the contact from the direction of movement by the gravity of the weight in the injection nozzle in the advanced state. Item 5. The cutting device according to Item 4.