JP6567437B2 - Underwater plating apparatus and underwater plating method - Google Patents

Description

  Embodiments described herein relate generally to an underwater plating apparatus and an underwater plating method.

  There is a repair technique in which repair is performed by plating when stress corrosion cracking (SCC) or the like occurs in the reactor internal structure and the reactor pressure vessel (RPV) and repair work becomes necessary. In the conventional repair technology that performs plating in the reactor, it is necessary to drain all the reactor water and fill the plating solution instead. Plating solution may be required.

For this reason, if repair work is performed during the periodic inspection, problems such as a prolonged work period for the periodic inspection occur. Therefore, in order to repair a part to be repaired partially, a processing method has been proposed in which the plating process surface is covered with a chamber and only the inside of the chamber is filled with a plating solution. In this processing method, since the plating process can be performed without draining the reactor water, the work period in the periodic inspection can be shortened and the plating solution necessary for the plating process can be reduced in a small amount.
A plating method for filling a plating solution in a nuclear reactor, a plating method using a chamber, and the like have been proposed.

JP 2002-40190 A JP-A-8-176881

  By the way, in the plating process method using a chamber, depending on the type of plating solution involved in the plating process, if the plating solution leaks from the chamber into the reactor water, the water quality in the reactor may be affected. In addition, if a chemical reaction during the plating process generates bubbles such as hydrogen or oxygen on the plated surface, and the generated bubbles remain attached to the plated surface, the plating process may be hindered. is there.

  Embodiments according to the present invention are made to solve the above-described problems, and can prevent the plating solution from leaking from the chamber in the plating process using the chamber, and air bubbles generated during the plating process can be prevented. It is an object of the present invention to provide an underwater plating apparatus and an underwater plating method that can prevent the plating treatment surface from remaining attached.

In order to achieve the above-described object, an underwater plating apparatus according to an embodiment of the present invention includes an underwater plating apparatus for covering a plating surface in water in a reactor internal structure and a reactor pressure vessel with a chamber and performing the plating process. A sealing member provided in the chamber and covering the periphery of the plating surface in a liquid-tight state; and a liquid injection into a space portion of the chamber and a liquid discharge from the space portion of the chamber . A pipe, a second pipe for discharging compressed air into the space and discharging bubbles generated by plating to discharge the liquid from the space of the chamber, and agitation for stirring the liquid filled in the chamber An apparatus, an electrode that generates a potential on the plating surface, and a pressing mechanism that presses the seal member against the plating surface. To.

  In addition, the underwater plating method according to the embodiment of the present invention is characterized in that the underwater plating processing apparatus according to the present embodiment is used to perform plating in a liquid-tight state on the plating surface in water.

  According to the embodiments of the underwater plating apparatus and the underwater plating method according to the present invention, it is possible to prevent the plating solution from leaking from the chamber in the plating process using the chamber, and the bubbles generated during the plating process are plated. It can be prevented that the surface remains attached to the surface.

It is a typical layout drawing of the underwater plating processing apparatus at the time of plating processing. (Embodiment 1) It is the longitudinal cross-sectional view (a) of a submerged-plating processing apparatus, a cross-sectional view (b), and sectional drawing (c) cut | disconnected in parallel with the surface of a front view. (Embodiment 1) It is a figure explaining the system configuration | structure of an underwater plating processing apparatus. (Embodiments 1 to 3) It is a flowchart explaining the underwater plating processing method. (Embodiments 1 to 3) It is the longitudinal cross-sectional view (a) of another underwater plating processing apparatus, a cross-sectional view (b), and sectional drawing (c) cut | disconnected in parallel with the surface of a front view. (Embodiment 2) It is a longitudinal cross-sectional view of another underwater plating processing apparatus. (Embodiment 3) It is a block diagram explaining the other system of an underwater plating processing apparatus. (Embodiment 4)

  Hereinafter, embodiments of an underwater plating apparatus and an underwater plating method according to the present invention will be described with reference to the drawings. In each figure, common members are given the same reference numerals, and overlapping descriptions are omitted as appropriate.

[Embodiment 1]
(Schematic layout of plating equipment)
An arrangement configuration of the underwater plating apparatus 1 in the reactor pressure vessel 20 will be schematically described with reference to FIG. Stress corrosion cracking (SCC) refers to a phenomenon in which tensile stress and corrosive action interact with each other due to residual stress caused by welding or cold working or external stress applied during use.

  Therefore, an arrangement configuration of the underwater plating apparatus 1 in the reactor pressure vessel 20 will be described with reference to FIG. 1, taking as an example the case where SCC occurs in the weld line 16. 2, FIG. 5, and FIG. 6, taking as an example the case where SCC occurs on the cold processed surface, the processed surface where the SCC occurs, that is, the plating surface 17 and the chamber 4. The arrangement configuration will be described.

  In FIG. 1, it has been discovered that stress corrosion cracking (SCC) has occurred in the weld line 16, which is the weld location of the baffle plate 23 that supports the jet pump 24 within the reactor pressure vessel 20. The case where the plating process is performed is given as an example, and a cross-sectional view of the main part in the reactor pressure vessel 20 in the arrangement configuration of the underwater plating apparatus 1 is shown.

  Note that the underwater plating apparatus and the underwater plating method according to the embodiment of the present invention are not limited to the plating process on the weld line 16 of the baffle plate 23 in which SCC has occurred or the cold-worked processed surface. Plating can be performed on the plating surface in the water in the reactor internal structure and the reactor pressure vessel.

  The baffle plate 23 is suspended between the core shroud 21 and the inner wall of the reactor pressure vessel 20 and is arranged in an annular shape. The core shroud 21 and the inner wall of the reactor pressure vessel 20 are welded to each other. An area surrounded by the core shroud 21, the inner wall of the reactor pressure vessel 20 and the baffle plate 23 is configured as an annulus portion 25. The baffle plate 23 in which the jet pump 24 is installed is connected to a discharge port ( (Not shown) is formed.

  The underwater plating apparatus 1 includes a chamber 4 that covers the periphery of the weld line 16 at the tip, and the chamber 4 can cover the periphery of the weld line 16 in a liquid-tight state by the pressing mechanism 3. A seal member 5 (see FIG. 2) is provided on the front surface of the chamber 4 as described later.

  The pressing mechanism 3 includes a cylinder 3a and a piston 3b. A pressing plate 3c provided at the tip of the piston 3b is brought into contact with the core shroud 21, and a chamber 4 provided at the other end of the cylinder 3a is connected to a reactor pressure vessel. The inner wall 20 is pressed against the bottom surface of the baffle plate 23. The cylinder 3 a and the chamber 4 are connected via a support member 9.

  In addition, as a structure of the pressing mechanism 3, instead of the structure composed of the cylinder 3a and the piston 3b, a structure in which the chamber 4 is pressed against the plating surface 17 by screw drive may be used. The chamber 4 may be configured to be pressed against the plating surface 17.

  The disposition positions of the pressing mechanism 3 and the chamber 4 disposed on the support member 9 are configured to be positioned by the access device 2. The access device 2 includes a guide rod 2a in which one end portion is inserted and supported in a CDR housing from which a hollow piston (not shown) is removed in a control rod drive mechanism (CDR) for driving the control rod, and a longitudinal direction of the guide rod 2a. The support rod 2b is configured to be slidable in the vertical direction along the direction and can be positioned and fixed at an arbitrary position.

  One end portion of the guide rod 2a is provided with a fitting support portion 2c that is fitted into the opening portion of the CDR housing 22 from which the hollow piston is removed. The support rod 2b can be fixed at an arbitrary position with respect to the guide rod 2a, and the position of the support member 9 can be adjusted with multiple degrees of freedom. Thereby, the arrangement | positioning position and direction of the chamber 4 can be adjusted freely.

  Note that the configuration of the access device 2 is not limited to the above-described configuration, and an appropriate configuration can be adopted as necessary according to the shape, location, and the like of the plating surface 17. For example, as a configuration of the access device 2, a configuration using a manipulator having a function of multiple degrees of freedom can be used instead of the configuration using the guide rod 2a and the support rod 2b.

  In the case of a configuration using a manipulator, the base end portion of the manipulator is fixed to the CDR housing 22 or the base end portion of the manipulator is fixed to an appropriate fixing member in the reactor pressure vessel 20. Can do. And it can be set as the structure which provided the chamber 4 and the press mechanism 3 in the front-end | tip part of the manipulator.

(Main components of underwater plating equipment)
FIG. 1 shows a configuration in which the welding line 16 at the boundary between the inner wall of the reactor pressure vessel 20 and the bottom surface of the baffle plate 23 is covered with the chamber 4 and the inside of the chamber 4 is sealed in a liquid-tight state. The plating processing surface 17 is covered with the chamber 4, and the inside of the chamber 4, that is, the space 4b is sealed in a liquid-tight state. Since the configuration of the chamber 4 in FIG. 1 has the same configuration as the configuration of the chamber 4 described below, a duplicate description is omitted.

  Hereinafter, the configuration of the main part of the chamber 4 will be described by taking as an example the case where the plating process 17 is performed on the plating process surface 17 as shown in FIG. In FIG. 2, the configuration of the access device 2 is omitted, and the configuration when the underwater plating apparatus 1 is disposed in a lateral orientation is shown.

  In the underwater plating apparatus 1 shown in FIG. 2, a seal member 5 is annularly disposed around the front edge side of the main body portion 4 a constituting the chamber 4. The amount of protrusion of the seal member 5 from the main body 4 a is configured corresponding to the shape of the plating surface 17. As the seal member 5, a member made of a material that can prevent liquid from leaking from the inside of the chamber 4 to the outside of the chamber 4, and can prevent reactor water from entering the inside of the chamber 4 from the outside of the chamber 4. Can be used. For example, it can be configured using a rubber material, a resin material, or the like.

  A region surrounded by the main body 4 a, the seal member 5, and the plating surface 17 is configured as a space 4 b of the chamber 4. A bubble chamber 12 for collecting bubbles generated during the plating process is formed on the upper surface of the space 4b. The bubble chamber 12 is configured in a concave shape that expands downward and is recessed upward to facilitate collection of bubbles. In the configuration example shown in FIG. 2A, it is formed on the inner surface of the seal member 5. However, if it is a configuration that makes it easy to collect bubbles, it may be formed on the main body 4a side as shown in FIG. it can.

  Into the chamber 4, liquid is injected into the space portion 4 b, gas is injected into the first piping 6 that discharges the liquid from the space portion 4 b and the space portion 4 b, and gas and excess liquid are discharged from the space portion 4 b. Second pipes 7 are connected to each other. The second pipe 7 is connected to the bubble chamber 12, and the bubbles collected in the bubble chamber 12 can be discharged to the outside.

  Further, in the space 4b, a first electrode 8a that generates a potential difference with the plating surface 17 in the plating solution, a stirring blade 10b that stirs the plating solution, and a thermocouple that measures the temperature of the plating solution. 13 is provided, and the first electrode 8a, the stirring blade 10b, and the thermocouple 13 are provided in the main body 4a. Furthermore, the potential difference generated between the first electrode 8a and the plating surface 17 is caused by bringing the second electrode 8b provided at the site of the main body portion 4a extending outside the space portion 4b into contact with the plating surface 17. It can be generated by conducting.

  On the back side of the main body 4a, there are provided a drive motor 10a for rotating the stirring blade 10b and a pressing mechanism 3 for pressing the chamber 4 toward the plating surface 17 side. The pressing mechanism 3 includes a cylinder 3a, a piston 3b, and a pressing plate 3c provided at the tip of the piston 3b. The cylinder 3a of the pressing mechanism 3 is supported by a support member 9 (not shown) as shown in FIG. The support is fixed.

  A support member 9 (not shown) that supports and fixes the cylinder 3a of the pressing mechanism 3 is fixed at a desired position, and the chamber 4 is placed on the plating surface 17 by controlling the piston 3b to protrude from the cylinder 3a. On the other hand, it can be pressed with a desired pressing force.

  In FIG. 2, wiring for supplying power to the first electrode 8a and the second electrode 8b, wiring for supplying an electrode to the drive motor 10a, wiring connected to the thermocouple 13, control device for controlling the pressing mechanism 3, etc. Illustration is omitted.

(System configuration of underwater plating equipment)
A system for injecting and discharging liquid / gas in the space 4b will be described with reference to FIG.
Examples of the liquid used for the plating process include pure water, a plating solution, and a pretreatment solution. Moreover, as compressed gas injected into the space portion 4b in order to discharge the liquid from the space portion 4b of the chamber 4, a gas such as air that does not affect even if it remains in the reactor pressure vessel 20 can be used. .

  As tanks for storing liquid, a pure water tank 35, a plating solution tank 36, a pretreatment solution tank 37, and a waste liquid tank 38 for storing waste liquid discharged from the chamber 4 are provided. In the pretreatment solution tank 37, a pretreatment solution for performing a surface treatment of the plating treatment surface 17 or cleaning it before the plating treatment is stored. As the pretreatment solution, for example, an etching solution can be used.

Further, the waste liquid tank 38 may be configured to have a plurality of tanks so that the liquid discharged from the chamber 4 can be stored, respectively, so that the plating solution as the waste liquid can be stored separately from other liquids. It can also be configured, and an appropriate configuration can be adopted as necessary.
Although not shown in FIG. 3, as the system configuration of the underwater plating apparatus 1, each member described below can be controlled by a control command from a control apparatus (not shown).

  As shown in FIG. 3, in order to inject the liquid in each tank of the pure water tank 35, the plating solution tank 36, and the pretreatment solution tank 37 into the chamber 4, compressed gas for increasing the internal pressure in each of the tanks 35 to 37 is used. A compressed gas supply source 30 is provided.

  As the compressed gas supply source 30, for example, a compressor can be used. A first line pipe 41 and a second line pipe 42 are connected to the compressed gas supply source 30, and the first line pipe 41 is connected to a second switching valve 33 described later. The second line pipe 42 is connected to the pressure adjustment valve 31, and the pressure adjustment valve 31 can adjust the pressure of the compressed gas discharged from the compressed gas supply source 30 to a desired pressure.

  As pressure adjustment in the pressure adjustment valve 31, it can adjust so that compressed gas may become a pressure of 0.3 Mpa or more. The pressure adjusted by the pressure adjusting valve 31 is not limited to a pressure of 0.3 MPa or more, and can be adjusted to an appropriate pressure as necessary.

  The compressed gas whose pressure is adjusted by the pressure adjusting valve 31 is supplied to the first switching valve 32 through the third line pipe 43. When the first switching valve 32 is operated, the third line pipe 43 is connected to any of the fourth line pipe 44 to the seventh line pipe 47, or the first switching valve 32 is switched to the supply stop position. If so, the connection will be blocked.

The fourth line pipe 44 is connected to the second switching valve 33. The fifth line pipe 45 is connected to the second switching valve 33 from the eighth line pipe 48 via the pure water tank 35. The sixth line pipe 46 is connected to the second switching valve 33 from the ninth line pipe 49 via the plating solution tank 36. The seventh line pipe 47 is connected to the second switching valve 33 from the tenth line pipe 50 via the pretreatment solution tank 37.

  And when compressed gas is supplied to either of the 5th line pipe 45-the 7th line pipe 47, the internal pressure of each tank 35-37 can be raised, respectively. Then, the liquid stored in the tank whose internal pressure is increased is led out to any one of the eighth line pipe 48 to the tenth line pipe 50 connected to each tank, and the chamber 4 is supplied from the second switching valve 33. Can be supplied to.

The eleventh line pipe 53 connected to the second switching valve 33 is connected to the third switching valve 34, and the liquid or gas discharged from the chamber 4 through the eleventh line pipe 53 is supplied to the third switching valve 34. It can be discharged to the switching valve 34 side. Further, for example, when the pretreatment solution injected into the chamber 4 is in a reusable state, the pretreatment solution is returned to the pretreatment solution tank 37 via the tenth line pipe 50 without being led out to the eleventh line pipe 53. It can also be configured. A first pipe 6 and a second pipe 7 are connected between the second switching valve 33 and the chamber 4.
Note that the first pipe 6 and the second pipe 7 are not limited to the above-described configuration, and may be configured to allow an appropriate liquid or gas to flow as necessary.

  A twelfth line pipe 54 and a thirteenth line pipe 55 are connected to the third switching valve 34, and the twelfth line pipe 54 is connected to the waste liquid tank 38. The thirteenth line pipe 55 is configured as a drain pipe for discharging the reactor water discharged from the chamber 4 into the reactor pressure vessel 20 as it is.

(Plating procedure)
The procedure of the plating method will be described with reference to FIG. The plating method described below is executed by a control device (not shown), but a description of the control device is omitted.

  In step S1, the access device 2 is operated to install the chamber 4 toward the plating surface 17 in the reactor pressure vessel 20 filled with reactor water. Then, by operating the pressing mechanism 3, the space 4 b formed between the plating surface 17 and the sealing member 5 is sealed in a liquid-tight state. When the installation of the chamber 4 is completed, the process proceeds to step S2.

  In step S <b> 2, compressed gas whose pressure is adjusted by the pressure adjustment valve 31 is injected into the chamber 4 in order to discharge the reactor water confined in the chamber 4 covering the plating surface 17. At the same time, the reactor water in the chamber 4 is discharged through the first pipe 6. The reactor water discharged from the chamber 4 can be returned from the eleventh line pipe 53 to the reactor pressure vessel 20 through the thirteenth line pipe 55. When the reactor water is discharged from the chamber 4, the process proceeds to step S3.

  In step S3, in order to confirm leakage in the chamber 4, it is confirmed whether or not the compressed gas injected into the chamber 4 leaks from the chamber 4 into the reactor water of the reactor pressure vessel 20 as bubbles. To do. This leakage confirmation work can be confirmed using a camera thrown into the reactor pressure vessel 20.

  The camera introduced into the reactor pressure vessel 20 can also be used for confirming the repair location where plating is performed or for confirming whether the chamber 4 is installed at the correct position with respect to the plating surface 17. You can also use a dedicated camera.

In addition, the compressed gas introduced into the first line pipe 41 can be used for the operation of confirming leakage from the seal member 5. When it is confirmed that there is no leakage from the seal member 5, the process proceeds to step S4.
In step S <b> 4, a pretreatment solution is injected into the chamber 4 in order to treat the plating surface 17. When the injection of the pretreatment solution into the chamber 4 is completed, the process proceeds to step S5.

  In step S5, a pretreatment is performed on the plating surface 17 with a pretreatment solution. The pretreatment can be configured such that the pretreatment is performed while injecting the pretreatment solution from the first pipe 6. Alternatively, when the pretreatment liquid is injected into the chamber 4 in order to reduce the amount of waste liquid when managing the injection amount of the pretreatment solution to be injected into the chamber 4 and reducing the amount of waste liquid when the pretreatment solution subjected to the pretreatment is pretreated, It can also be configured to stop the injection of the solution.

  The injection amount of the pretreatment solution into the chamber 4 can also be controlled by providing a flow meter, a flow control valve, etc. in the tenth line pipe 50. When the pretreatment in the chamber 4 is completed, the process proceeds to step S6.

In step S <b> 6, in order to recover the pretreatment solution from the chamber 4, compressed gas whose pressure is adjusted by the pressure adjustment valve 31 is injected into the chamber 4, and the pretreatment solution is discharged from the first pipe 6.
The used pretreatment solution discharged from the first pipe 6 is returned to the pretreatment solution tank 37 and reused when it is confirmed in advance that the degree of contamination is low even after execution of the pretreatment by experiments or the like. It can also be configured as follows. Alternatively, the used pretreatment solution can be discharged to the waste liquid tank 38. When the collection of the pretreatment solution from the chamber 4 is completed, the process proceeds to step S7.

  In step S7, in order to remove the pretreatment solution remaining in the system, pure water in the pure water tank 35 is injected into the chamber 4, the inside of the chamber 4 is washed with the injected pure water, and then the compressed gas is supplied to the chamber. The pure water after being poured into the chamber 4 is discharged from the chamber 4 and collected. At this time, even if the pretreatment solution remains in the first pipe 6, it is discharged together with the discharged pure water. The discharged pure water is discharged to the waste liquid tank 38 and collected together with the remaining pretreatment solution.

  In addition, the injection | pouring and collection | recovery work into the chamber 4 of a pure water can also be abbreviate | omitted if the pretreatment solution does not affect the water quality management of the reactor water. When recovery of pure water from the chamber 4 is completed, the process proceeds to step S8.

  In step S <b> 8, the compressed gas whose pressure is adjusted by the pressure adjustment valve 31 is supplied to the plating solution tank 36 in order to inject the plating solution into the chamber 4. Then, the plating solution is injected into the chamber 4 from the plating solution tank 36 whose internal pressure is increased.

  At this time, as the plating solution in the plating solution tank 36, the minimum necessary amount that can sufficiently fill the chamber 4 is stored. If the plating solution leaks from the chamber 4 into the reactor pressure vessel 20, it will affect the quality of the reactor water. Therefore, the plating solution is not circulated and each time the plating process is performed. An amount necessary to fill the chamber 4 can be stored in the plating solution tank 36. Thus, the plating process can be performed with a minimum amount necessary for performing the plating process.

  Instead of storing the minimum amount of plating solution in the plating solution tank 36, a configuration in which a flow meter and a flow control valve are provided in the ninth line pipe may be used. When the injection of the plating solution into the chamber 4 is completed, the process proceeds to step S9.

  In step S9, since a plating process is performed, a potential difference is generated between the first electrode 8a and the second electrode 8b shown in FIG. And the drive motor 10a of the stirring apparatus 10 is driven, and the stirring blade 10b is rotated.

By rotating the stirring blade 10 b, the plating solution in the chamber 4 can be stirred, and bubbles generated on the plating surface 17 are separated from the plating surface 17. Bubbles separated from the plating surface 17 are collected in the bubble chamber 12 in the chamber 4. The bubbles collected in the bubble chamber 12 can be stored in the bubble chamber 12 as they are, or can be discharged to the outside of the chamber 4 through the second pipe 7.
During the plating process, the plating process can be executed while measuring the temperature of the plating solution by the thermocouple 13. When the plating process is completed, the process proceeds to step S10.

  In step S <b> 10, the compressed gas whose pressure is adjusted by the pressure adjustment valve 31 is injected into the chamber 4 in order to recover the plating solution after completion of the plating process from the chamber 4. At the same time, the plating solution in the chamber 4 is discharged through the first pipe 6 and collected in the waste liquid tank 38.

  By providing a measuring instrument for measuring the amount of the plating solution recovered in the waste liquid tank 38, it can be confirmed that a plating solution of a predetermined amount or more set in advance is recovered in the waste liquid tank 38. When the collection of the plating solution is completed, the process proceeds to step S11.

  In step S11, pure water for discharging a trace amount of plating solution remaining in the system is injected, the chamber 4 is cleaned with pure water, and then the pure water used for cleaning is discharged from the chamber 4 to be a waste liquid tank. Recover to 38. The pure water injection and discharge procedures can be performed by removing the plating solution instead of the removal of the pretreatment solution in step S7 described above, and thus the description thereof is omitted here.

(effect)
By using the underwater plating apparatus and the underwater plating method according to the first embodiment, plating in water can be performed in the reactor internal structure and the reactor pressure vessel 20.
In addition, bubbles adhering to the plating surface that are generated during the plating process can be forcibly removed from the plating surface 17 by the circulation caused by the stirring device 10.

  The bubbles removed from the plating surface 17 rise and move to the bubble chamber 12 formed on the inner surface of the seal member 5 to be stored. In addition, since the bubble chamber 12 is configured in a concave shape that expands downward and is recessed upward, it is easy to collect the bubbles in the bubble chamber 12.

  Further, since the air bubbles collected in the air bubble chamber 12 can be discharged to the outside through the second pipe 7, the air bubbles collected in the air bubble chamber 12 by the recirculation caused by the stirring device 10 are again in the plating solution. It can be prevented from spreading.

  With this configuration, it is possible to prevent air bubbles from adhering to the plating surface 17, so that the plating operation can be performed stably. Further, the plating process speed can be stabilized by stirring the plating solution in the chamber 4.

  Although the stirring blade 10b has been described to be operated when the plating solution is stirred, the stirring blade 10b is stirred even when the pretreatment solution is injected into the chamber 4 or when pure water is injected into the chamber 4. The blade 10b can be actuated. In this case, the pretreatment solution and pure water can be evenly distributed in the chamber 4.

[Embodiment 2]
The principal part structure of the underwater plating processing apparatus 1 which concerns on Embodiment 2 of this invention is demonstrated using FIG. In addition, the same code | symbol is attached | subjected to the structure same as Embodiment 1, and the overlapping description is abbreviate | omitted. Moreover, regarding the arrangement configuration, system configuration, and underwater plating method for the plating surface 17 of the underwater plating apparatus 1 according to Embodiment 2, the configurations shown in FIGS. 1, 3, and 4 can be used.

(Main components of underwater plating equipment)
As shown in FIG. 5A to FIG. 5C, in the second embodiment, the configuration in which the ultrasonic vibrator 11 is provided as the stirring device 10 in addition to the configuration in which the stirring blade 10 b is provided in the chamber 4. It has become. Other configurations are the same as those in the first embodiment.

(effect)
By further providing the ultrasonic vibrator 11 on the main body 4a, the plating solution can be largely stirred during the plating process, and the bubbles generated on the plating surface 17 can be efficiently removed. Moreover, the plating solution can be sufficiently infiltrated into the cracked portion of the SCC to be repaired, and the plating treatment for the cracked portion can be performed efficiently.

  Further, since the bubbles and dirt generated in the crack during the plating process can be discharged from the crack, the efficiency of the plating process can be improved. Furthermore, the ultrasonic vibrator 11 can be operated also when the chamber 4 is filled with a pretreatment solution or pure water and the plating surface 17 is pretreated or cleaned. By comprising in this way, a plating solution and a pretreatment solution can be efficiently discharged | emitted from the pretreatment with respect to the inside of a crack, or a crack.

[Embodiment 3]
The principal part structure of the underwater plating processing apparatus 1 which concerns on Embodiment 3 of this invention is demonstrated using FIG. In addition, the same code | symbol is attached | subjected to the structure same as Embodiment 1, and the overlapping description is abbreviate | omitted. Moreover, regarding the arrangement configuration, system configuration, and underwater plating method for the plating surface 17 of the underwater plating apparatus 1 according to the third embodiment, the configurations shown in FIGS. 1, 3, and 4 can be used.

(Main components of underwater plating equipment)
As shown in FIG. 6, in the third embodiment, the seal member 5 is detachable from the main body 4 a of the chamber 4. Other configurations are the same as those in the first embodiment.

  The main body 4a is configured in a bowl shape with an annular peripheral edge protruding forward, and an annular seal member 5 is bonded to the front end surface of the peripheral edge protruding forward at the joint surface 14. It is joined detachably by joining means such as an agent and double-sided tape. In the illustrated example, the first pipe 6 and the second pipe 7 are formed at the peripheral edge protruding forward, but the first pipe 6 and the second pipe 7 are arranged on the side of the main body 4a to which the drive motor 10a is fixed. The pipe 6 and the second pipe 7 can also be formed.

  As a joining means for detachably joining the seal member 5 to the front end surface of the peripheral edge protruding to the front side, a conventionally known joining means may be adopted as long as it is a joining means capable of maintaining liquid tightness in the chamber 4. Can do.

(effect)
In the case of the first and second embodiments, a plurality of chambers 4 provided with the sealing member 5 must be prepared corresponding to the shape of the plating surface 17. In the third embodiment, only the sealing member 5 is provided. Since it can be detachably coupled to the main body 4a, it is possible to correspond to the shape of the plating surface 17 by preparing a plurality of seal members 5.

[Embodiment 4]
The configuration of the underwater plating apparatus 1 according to Embodiment 4 of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the structure same as Embodiment 1, and the overlapping description is abbreviate | omitted. The arrangement shown in FIGS. 1 and 4 can be used for the arrangement and the underwater plating method for the plating surface 17 of the underwater plating apparatus 1 according to the fourth embodiment.

(System configuration of underwater plating equipment)
The system configuration of the underwater plating apparatus 1 according to Embodiment 4 is the configuration shown in FIG. As shown in FIG. 7, in the system configuration in the fourth embodiment, instead of using the pressure regulating valve 31 and the first switching valve 32 used in the system configuration in the first embodiment, the second switching valve 33 and the chamber 4 are provided. The tube pump 39 is used in between.

  Other configurations are the same as those in the first embodiment. In addition to the configuration in the first embodiment, the configuration in the second and third embodiments can also be used as the configuration of the chamber 4.

  Injection and discharge of pure water into the chamber 4, injection and discharge of the plating treatment solution, injection and discharge of the pretreatment solution, and injection and discharge of compressed gas can be performed by operating the tube pump 39.

  The tube pump 39 is configured to continuously transfer a liquid or gas quantitatively by utilizing the elasticity of a rubber or flexible tube, so the number of rotations when the tube pump 39 is rotated is controlled. By doing so, the pressures of various liquids and gases injected into the chamber 4 can be adjusted.

(effect)
Since the flow rate of the liquid or gas injected into or discharged from the chamber 4 can be controlled by using a tube pump, the underwater plating apparatus 1 is configured with a reduced number of parts compared to the case of the first embodiment. can do.

  Further, by forming a port for connecting the first pipe 6 and the second pipe 7 to the second switching valve 33, the pretreatment solution can be circulated, and the waste liquid of the used pretreatment solution can be circulated. The amount can be reduced. If necessary, the configuration may be such that pure water is circulated between the second switching valve 33 and the chamber 4, or the plating solution is circulated between the second switching valve 33 and the chamber 4. You can also keep it.

  As mentioned above, although several embodiment which concerns on this invention was described, these embodiment was shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, combinations, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 1 ... Underwater plating processing apparatus, 2 ... Access apparatus, 3 ... Press mechanism, 4 ... Chamber, 4a ... Main part, 4b ... Space part, 5 ... Seal member, 6 ... 1st piping, 7 ... 2nd piping, 10 ... Stirrer, 10b ... Stirrer blade, 11 ... Ultrasonic vibrator, 12 ... Bubble chamber, 13 ... Thermocouple, 16 ... Welding wire, 17 ... Plated surface, 20 ... Reactor pressure vessel, 21 ... Core shroud, 22 ... CDR housing, 23 ... baffle plate, 30 ... compressed gas supply source, 31 ... pressure regulating valve, 35 ... pure water tank, 36 ... plating solution tank, 37 ... pretreatment solution tank, 38 ... waste solution tank, 39 ... tube pump

Claims (8)

An underwater plating apparatus that performs plating in water by covering the plating surface of a reactor internal structure with a chamber,
The chamber includes a sealing member that covers the periphery of the plating surface in a liquid-tight state;
A first pipe for injecting liquid into the space of the chamber and discharging liquid from the space of the chamber ;
A second pipe for discharging compressed air into the space and discharging bubbles generated by the plating process in order to discharge the liquid from the space of the chamber ;
A stirring device for stirring the liquid filled in the chamber;
An electrode for generating a potential on the plating surface;
A pressing mechanism that presses the seal member against the plating surface;
An underwater plating apparatus characterized by comprising:   2. The underwater plating according to claim 1, wherein a bubble chamber for collecting bubbles generated on the plating surface during plating is formed in the chamber, and the bubble chamber communicates with the second pipe. Processing equipment. The underwater plating apparatus according to claim 2 , wherein the bubble chamber is configured to have a concave shape that expands downward and is recessed upward. The underwater plating apparatus according to claim 2 , wherein the bubble chamber is formed in the seal member.   The underwater plating apparatus according to any one of claims 1 to 4, wherein the stirrer includes a stirring blade and / or an ultrasonic vibrator.   The underwater plating apparatus according to any one of claims 1 to 5, wherein the chamber is provided with a thermocouple for measuring the temperature of the plating solution injected into the chamber. The pressing mechanism is positioned by an access device, and the access device has a guide rod in which one end portion is fitted and fixed in a control rod drive mechanism housing disposed in the reactor pressure vessel, and a longitudinal direction of the guide rod The underwater plating apparatus according to any one of claims 1 to 6, further comprising a support rod configured to be slidable in the vertical direction along the axis and capable of being positioned and fixed at an arbitrary position .   An underwater plating method, wherein the plating process surface of the reactor internal structure is covered with a chamber using the underwater plating apparatus according to any one of claims 1 to 7, and the plating process is performed in water.

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