JP6542608B2 - Charged particle beam device - Google Patents

Description

  The present invention relates to a charged particle beam device that performs automatic sampling.

Conventionally, a sample piece prepared by irradiating a sample with a charged particle beam consisting of electrons or ions is extracted, and has a shape suitable for various processes such as observation, analysis and measurement with a scanning electron microscope and transmission electron microscope. An apparatus for processing a sample piece is known (see, for example, Patent Documents 1 and 2).
Conventionally, a sample piece produced by irradiating a sample with a focused ion beam is extracted using a needle installed in the apparatus, and various types of observation, analysis, measurement, etc. using a scanning electron microscope and a transmission electron microscope, etc. A device is known that uses an image (also referred to as absorbed current image or inflow current image) from ion beam current flowing into the needle to clarify the needle tip position when processing a sample piece into a shape suitable for the process. (See, for example, Patent Document 3). In this device, when the sample surface has a complicated shape such as a semiconductor device pattern, the secondary electron image is often influenced by the shape of the sample surface and can not recognize the needle tip position. It can be used.

Japanese Patent Application Laid-Open No. 5-052721 JP, 2008-153239, A JP, 2000-171364, A

In this specification, “sampling” refers to extracting a sample piece produced by irradiating a sample with a charged particle beam, and processing the sample piece into a shape suitable for various processes such as observation, analysis, and measurement. More specifically, it refers to transferring a sample piece formed by processing with a focused ion beam from a sample to a sample piece holder.
Conventionally, it can not be said that the technology capable of automatically performing the sampling operation of the sample piece has been sufficiently realized.
The reason why the sampling can not be performed automatically is that the needle used for extracting and transporting the sample piece can not be automatically recognized as an image, and the needle tip is deformed to require processing of the needle tip or replacement of the needle itself. ,and so on.
The reason why the needle can not automatically recognize the image is that when the needle tip position is confirmed by the electron beam, the needle tip member is indistinguishable from the background image in the secondary electron image (or reflection electron image) and the needle tip is image recognized It is impossible to extract an incorrect image or to stop the image recognition process.

In addition, when the needle tip position is confirmed by the absorption current image of the charged particle beam (for example, electrons or negative ions), the secondary electron yield (yield) of the needle tip material is close to 1 to distinguish it from the background image. Not attached, needle tip can not be confirmed. For example, a tungsten needle can be confirmed by an absorption current image, but when the carbon deposition film remains at the tip, the carbon deposition film can not be easily recognized in the absorption current image. Essentially, the tip of the remaining carbon deposition film should be judged to be the tip of the needle, but since the carbon deposition film can not be recognized as an image, the tip of the tungsten needle may be erroneously recognized as a true tip. In such a state, when the needle is made to approach a delicate sample piece, when it is desired to stop the needle when contacting the sample piece, the residue of the carbon deposition film remaining at the tip of the needle collides with the delicate sample piece I will.
The absorption current image used in the flow according to the present invention is obtained by a charged particle beam of a focused ion beam of electron beam or negative ion, but in the present specification, an image obtained by an electron beam is described as a representative.
Thus, the true tip of the needle, including the carbon deposition film, can not be moved to the desired position using the image. In the worst case, the needle collides with the sample piece to break the sample piece, causing a problem of losing valuable sample. In addition, when the needle collides with the sample piece, the needle is deformed and the needle needs to be replaced. Such a situation can not be realized by the intended automatic sampling.

  The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a charged particle beam apparatus capable of automatically executing an operation of extracting a sample piece formed by processing a sample with an ion beam and transferring it to a sample piece holder. It is intended to be provided.

In order to solve the above problems and achieve the object, the present invention adopts the following aspects.
(1) A charged particle beam apparatus according to an aspect of the present invention is a charged particle beam apparatus for automatically producing a sample piece from a sample, the charged particle beam irradiation optical system for irradiating a charged particle beam, and the sample A sample stage for placing and moving, a sample piece transfer means for holding and transporting the sample piece to be separated and extracted from the sample, and a holder fixing base for holding a sample piece holder to which the sample piece is to be transferred A computer configured to perform position control on the object based on a template created based on an image of the object acquired by irradiation of the charged particle beam, and position information obtained from the image of the object; Prepare.

(2) In the charged particle beam apparatus according to (1), the sample piece transfer means includes a needle for holding and transporting the sample piece to be separated and extracted from the sample, and a needle drive mechanism for driving the needle And the computer controls the needle drive mechanism to control the position of the needle as the object with respect to the sample piece.

(3) The charged particle beam apparatus according to (2), further comprising: a gas supply unit that irradiates a gas that forms a deposition film by the irradiation of the charged particle beam; and the computer includes the needle and the sample piece The gap between the needle and the sample piece is controlled by the deposition film to control the charged particle beam irradiation optical system, the needle drive mechanism, and the gas supply unit.

(4) In the charged particle beam apparatus according to (2), the computer is configured to form the needle in a template formed by an absorption current image obtained by irradiating the needle with the charged particle beam, and the charged particle The needle drive mechanism is controlled to approach the sample piece using the tip coordinates of the needle acquired from the secondary electron image obtained by irradiating the needle with the beam.

(5) In the charged particle beam apparatus according to (3), the gap between the needle on which the deposition film is formed and the sample piece is 1 μm or less.

(6) In the charged particle beam apparatus according to (5), the gap between the needle on which the deposition film is formed and the sample piece is 100 nm or more and 400 nm or less.

(7) In the charged particle beam apparatus according to (1), the sample piece transfer means includes a needle for holding and transporting the sample piece to be separated and extracted from the sample, and a needle drive mechanism for driving the needle. And the sample piece holder has a columnar part to which the sample piece is transferred, and the computer controls the needle so as to control the position of the sample piece relative to the columnar part which is the object. Control the drive mechanism.

  According to the charged particle beam apparatus of the present invention, since the tip of the needle can be accurately image-recognized, accurate position control of the needle becomes possible, and a sample piece formed by processing of the sample by the ion beam is extracted The sampling operation to be transferred to the sample piece holder can be performed automatically and continuously.

It is a block diagram of the charged particle beam apparatus which concerns on embodiment of this invention. It is a top view showing a sample piece formed in a sample of a charged particle beam device concerning an embodiment of the present invention. It is a top view which shows the sample piece holder of the charged particle beam apparatus which concerns on embodiment of this invention. It is a side view showing the sample piece holder of the charged particle beam device concerning the embodiment of the present invention. Among the flowcharts showing the operation of the charged particle beam apparatus according to the embodiment of the present invention, in particular, it is a flowchart of an initial setting step. In the charged particle beam device concerning the embodiment of the present invention, it is a mimetic diagram for explaining the true tip of the needle used repeatedly. It is a schematic diagram of the secondary electron image by electron beam irradiation in the needle tip of the charged particle beam device concerning the embodiment of the present invention. It is a schematic diagram of the absorption current image by electron beam irradiation in the needle tip of the charged particle beam device concerning the embodiment of the present invention. Among the flowcharts showing the operation of the charged particle beam apparatus according to the embodiment of the present invention, in particular, it is a flowchart of the sample piece pickup process. In the charged particle beam device concerning the embodiment of the present invention, it is a mimetic diagram for explaining the stop position of the needle at the time of connecting a needle to a sample piece. FIG. 2 is a view showing a tip of a needle and a specimen in an image obtained by a focused ion beam of a charged particle beam apparatus according to an embodiment of the present invention. It is a figure which shows the front-end | tip and sample piece of a needle in the image acquired by the electron beam of the charged particle beam apparatus which concerns on embodiment of this invention. It is a figure which shows the processing frame containing the connection processing position of the needle and sample piece in the image acquired by the focused ion beam of the charged particle beam apparatus which concerns on embodiment of this invention. It is a schematic diagram for demonstrating the positional relationship of a needle and a sample piece, and a deposition film | membrane formation area when connecting a needle to a sample piece in the charged particle beam apparatus which concerns on embodiment of this invention. It is a figure which shows the cutting process position T1 of the support part of the sample and sample piece in the image acquired by the focused ion beam of the charged particle beam apparatus which concerns on embodiment of this invention. It is a figure which shows the state which has retracted | saved the needle to which the sample piece in the image acquired by the electron beam of the charged particle beam apparatus which concerns on embodiment of this invention was connected. It is a figure which shows the state which retracted | saved the stage with respect to the needle to which the sample piece in the image obtained by the electron beam of the charged particle beam apparatus concerning embodiment of this invention was connected. It is a figure which shows the attachment position of the sample piece of the columnar part in the image acquired by the focused ion beam of the charged particle beam apparatus which concerns on embodiment of this invention. It is a figure which shows the attachment position of the sample piece of the columnar part in the image acquired by the electron beam of the charged particle beam apparatus which concerns on embodiment of this invention. Among the flowcharts showing the operation of the charged particle beam apparatus according to the embodiment of the present invention, in particular, it is a flowchart of the sample piece mounting process. It is a figure which shows the needle which stopped moving around the attachment position of the sample piece of the sample stand in the image acquired by the focused ion beam of the charged particle beam apparatus which concerns on embodiment of this invention. It is a figure which shows the needle which stopped moving around the attachment position of the sample piece in the sample stand in the image acquired by the electron beam of the charged particle beam apparatus which concerns on embodiment of this invention. It is a figure which shows the processing frame for connecting the sample piece connected to the needle in the image obtained by the focused ion beam of the charged particle beam apparatus which concerns on embodiment of this invention to a sample stand. It is a figure which shows the cutting position for cutting the deposition film which connects the needle and a sample piece in the image acquired by the focused ion beam of the charged particle beam apparatus which concerns on embodiment of this invention. It is a figure which shows the state which retracted | saved the needle in the image data obtained by the focused ion beam of the charged particle beam apparatus which concerns on embodiment of this invention. It is a figure which shows the state which retracted | saved the needle in the image acquired by the electron beam of the charged particle beam apparatus which concerns on embodiment of this invention. The charged particle beam apparatus which concerns on embodiment of this invention WHEREIN: It is explanatory drawing which shows the positional relationship of the columnar part and sample piece based on the image obtained by focused ion beam irradiation. The charged particle beam apparatus which concerns on embodiment of this invention WHEREIN: It is explanatory drawing which shows the positional relationship of the columnar part and sample piece based on the image obtained by electron beam irradiation. In the charged particle beam apparatus which concerns on embodiment of this invention, it is explanatory drawing which shows the template using the edge of the columnar part and sample piece based on the image obtained by electron beam irradiation. In the charged particle beam device concerning the embodiment of the present invention, it is an explanatory view explaining the template which shows the physical relationship at the time of connecting a pillar part and a sample piece. It is a figure which shows the state of the approach mode in 0 degree of rotation angles of the needle to which the sample piece was connected in the image data acquired by the focused ion beam of the charged particle beam apparatus which concerns on embodiment of this invention. It is a figure which shows the state of the approach mode in 0 degree of rotation angles of the needle to which the sample piece in the image acquired by the electron beam of the charged particle beam apparatus concerning embodiment of this invention was connected. It is a figure which shows the state of the approach mode in 90 degrees of rotation angles of the needle to which the sample piece was connected in the image acquired by the focused ion beam of the charged particle beam apparatus which concerns on embodiment of this invention. It is a figure which shows the state of the approach mode in 90 degrees of rotation angles of the needle to which the sample piece was connected in the image acquired by the electron beam of the charged particle beam apparatus which concerns on embodiment of this invention. It is a figure which shows the state of approach mode in 180 degrees of rotation angles of the needle to which the sample piece was connected in the image acquired by the focused ion beam of the charged particle beam apparatus which concerns on embodiment of this invention. It is a figure which shows the state of the approach mode in 180 degrees of rotation angles of the needle to which the sample piece was connected in the image acquired by the electron beam of the charged particle beam apparatus which concerns on embodiment of this invention.

  Hereinafter, a charged particle beam apparatus capable of automatically producing a sample piece according to an embodiment of the present invention will be described with reference to the attached drawings.

FIG. 1 is a block diagram of a charged particle beam device 10 according to an embodiment of the present invention. As shown in FIG. 1, the charged particle beam device 10 according to the embodiment of the present invention can fix the sample S and the sample piece holder P inside the sample chamber 11, and the sample chamber 11 capable of maintaining the inside in a vacuum state. Stage 12 and a stage drive mechanism 13 for driving the stage 12. The charged particle beam apparatus 10 includes a focused ion beam irradiation optical system 14 which irradiates a focused ion beam (FIB) to an irradiation target in a predetermined irradiation area (that is, a scanning area) inside the sample chamber 11. The charged particle beam apparatus 10 includes an electron beam irradiation optical system 15 which irradiates an electron beam (EB) to an irradiation target in a predetermined irradiation area inside the sample chamber 11. The charged particle beam device 10 includes a detector 16 that detects secondary charged particles (secondary electrons, secondary ions) R generated from an irradiation target by irradiation of a focused ion beam or an electron beam. The charged particle beam device 10 includes a gas supply unit 17 that supplies a gas G to the surface to be irradiated. Specifically, the gas supply unit 17 is a nozzle 17a having an outer diameter of about 200 μm. The charged particle beam device 10 takes out a minute sample piece Q from the sample S fixed on the stage 12 and holds the sample piece Q and transfers it to the sample piece holder P, and drives the needle 18 to make the sample piece A needle drive mechanism 19 for transporting Q, and an absorption current detector 20 for detecting an inflow current (also referred to as an absorption current) of the charged particle beam flowing into the needle 18 and for transmitting the image to the computer. ing.
The needle 18 and the needle drive mechanism 19 may be collectively referred to as sample piece transfer means. The charged particle beam device 10 includes a display device 21 that displays image data and the like based on the secondary charged particles R detected by the detector 16, a computer 22, and an input device 23.
The irradiation targets of the focused ion beam irradiation optical system 14 and the electron beam irradiation optical system 15 are the sample S fixed on the stage 12, the sample piece Q, and the needle 18 or sample piece holder P existing in the irradiation area. is there.

The charged particle beam device 10 according to this embodiment scans and irradiates the surface of the irradiation target with a focused ion beam, thereby performing various kinds of processing (such as digging and trimming) by imaging the portion to be irradiated and sputtering. The formation of a deposition film can be performed. The charged particle beam device 10 can execute processing for forming a sample piece Q (for example, a thin sample, a needle-like sample, etc.) for transmission observation by a transmission electron microscope from a sample S or an analysis sample piece using electron beam. The charged particle beam device 10 can process the sample piece Q transferred to the sample piece holder P into a thin film of a desired thickness (for example, 5 to 100 nm, etc.) suitable for transmission observation with a transmission electron microscope. is there.
The charged particle beam apparatus 10 can not only form a sample piece Q for transmission observation or analysis sample from a sample S, but can also give a process for obtaining a three-dimensional structure of the sample piece Q. . In the processing for obtaining the three-dimensional structure of the sample piece Q, the side surface of the taken-out sample piece Q is thinly cut by a focused ion beam, and secondary electrons can be obtained by irradiating the cut surface with a focused ion beam or an electron beam Store the image. Furthermore, the sample piece Q is thinly cut by a focused ion beam, and a secondary electron image of the cutting surface is stored. The three-dimensional structure of the sample piece Q can be obtained by repeating the cutting and the storage of the secondary electron image.
The charged particle beam device 10 can also perform processing for obtaining a three-dimensional elemental structure of the sample piece Q by repeating cutting and storing the element distribution image of the cutting surface.
The charged particle beam apparatus 10 can perform observation of the surface of the irradiation target by irradiating the surface of the irradiation target such as the sample piece Q and the needle 18 while scanning a focused ion beam or an electron beam.
The absorbed current detector 20 includes a preamplifier, which amplifies the inflow current of the needle and sends it to the computer 22. The needle-shaped absorption current image can be displayed on the display unit 21 by the signal synchronized with the needle inflow current detected by the absorption current detector 20 and the scanning of the charged particle beam, and the needle shape and the tip position can be specified.

  FIG. 2 shows a sample piece Q before being extracted from the sample S, which is formed by irradiating the surface of the sample S (hatched portion) with the focused ion beam in the charged particle beam apparatus 10 according to the embodiment of the present invention It is a top view. The symbol F indicates a processing frame by a focused ion beam, that is, a scanning range of the focused ion beam, and the inside (white portion) thereof indicates a processing region H which is sputtered and excavated by the focused ion beam irradiation. Reference symbol Ref is a reference mark (reference point) indicating the position where the sample piece Q is to be formed (retained without being excavated), for example, the diameter by the focused ion beam on a deposition film (for example, 1 μm side) described later It has a shape with a minute hole of 30 nm or the like, and can be recognized with high contrast in an image by a focused ion beam or an electron beam. The deposition film is used to know the approximate position of the sample piece Q, and the fine holes are used for precise alignment. In the sample S, the sample piece Q is etched so that the peripheral portions on the side and bottom sides are scraped off and removed except for the support portion Qa connected to the sample S, and the sample portion Qa It is cantilevered by S. The dimension of the sample piece Q in the longitudinal direction is, for example, about 10 μm, 15 μm, or 20 μm, and the width (thickness) is a minute sample piece of, for example, about 500 nm, 1 μm, 2 μm, or 3 μm.

The sample chamber 11 is configured to be able to evacuate the inside to a desired vacuum state by an exhaust device (not shown), and is configured to be able to maintain the desired vacuum state.
The stage 12 holds the sample S. The stage 12 includes a holder fixing base 12 a that holds the sample piece holder P. The holder fixing base 12a may have a structure on which a plurality of sample piece holders P can be mounted.
FIG. 3 is a plan view of the sample piece holder P, and FIG. 4 is a side view. The sample piece holder P includes a substantially semicircular plate-like base 32 having a notch 31 and a sample table 33 fixed to the notch 31. The base 32 is formed of, for example, a circular plate shape having a diameter of 3 mm and a thickness of 50 μm by metal. The sample table 33 is formed of, for example, a silicon wafer by a semiconductor manufacturing process, and is attached to the notch 31 by a conductive adhesive. The sample table 33 has a comb-like shape, and a plurality of (for example, five, ten, fifteen, twenty, etc.) spaced apart and projected (columns (hereinafter also referred to as pillars) to which the sample piece Q is transferred. ) Has 34. By making the width of each columnar portion 34 different, the image of the sample piece Q transferred to each columnar portion 34 and the image of the columnar portion 34 are associated with each other and further stored in the computer 22 in association with the corresponding sample segment holder P. By setting it, even when a large number of sample pieces Q are produced from one sample S, it can be recognized without mistake, and subsequent analysis such as a transmission electron microscope is on the corresponding sample pieces Q and samples S. Correspondence with the extraction site can also be done without a doubt. Each columnar portion 34 has, for example, a thickness of 10 μm or less and 5 μm or less at the tip end, and holds the sample piece Q attached to the tip.
The base 32 is not limited to a circular plate having a diameter of 3 mm and a thickness of 50 μm as described above, and may be, for example, a rectangular plate having a length of 5 mm, a height of 2 mm, and a thickness of 50 μm. Good. In short, the shape of the base 32 is such that it can be mounted on the stage 12 to be introduced to the subsequent transmission electron microscope, and that all the sample pieces Q mounted on the sample table 33 are located within the movable range of the stage 12 If it is According to the base 32 of such a shape, all the sample pieces Q mounted on the sample stand 33 can be observed with a transmission electron microscope.

  The stage driving mechanism 13 is accommodated in the sample chamber 11 in a state of being connected to the stage 12 and displaces the stage 12 with respect to a predetermined axis in accordance with a control signal output from the computer 22. The stage driving mechanism 13 includes a moving mechanism 13a for moving the stage 12 in parallel along at least an X axis and a Y axis parallel to and orthogonal to the horizontal plane and a vertical Z axis perpendicular to the X axis and the Y axis. ing. The stage drive mechanism 13 includes an inclination mechanism 13 b which inclines the stage 12 around the X axis or Y axis, and a rotation mechanism 13 c which rotates the stage 12 around the Z axis.

The focused ion beam irradiation optical system 14 faces the stage 12 at a position above the stage 12 in the irradiation area in the vertical direction in the irradiation area, and the optical axis is oriented in the vertical direction. It is fixed to the sample chamber 11 in parallel. Thus, it is possible to irradiate the focused ion beam downward from above in the vertical direction on the irradiation target such as the sample S mounted on the stage 12, the sample piece Q, and the needle 18 present in the irradiation area. In addition, the charged particle beam device 10 may include another ion beam irradiation optical system instead of the above-described focused ion beam irradiation optical system 14. The ion beam irradiation optical system is not limited to the optical system for forming a focused beam as described above. The ion beam irradiation optical system may be, for example, a projection type ion beam irradiation optical system in which a stencil mask having a fixed opening is installed in the optical system to form a shaped beam of the opening shape of the stencil mask. According to such a projection type ion beam irradiation optical system, a forming beam having a shape corresponding to a processing area around the sample piece Q can be accurately formed, and the processing time is shortened.
The focused ion beam irradiation optical system 14 includes an ion source 14a for generating ions, and an ion optical system 14b for focusing and deflecting the ions extracted from the ion source 14a. The ion source 14 a and the ion optical system 14 b are controlled according to a control signal output from the computer 22, and the irradiation position and irradiation conditions of the focused ion beam are controlled by the computer 22. The ion source 14a is, for example, a liquid metal ion source, a plasma type ion source, a gas field ion type ion source or the like using liquid gallium or the like. The ion optical system 14 b includes, for example, a first electrostatic lens such as a condenser lens, an electrostatic deflector, and a second electrostatic lens such as an objective lens. When a plasma type ion source is used as the ion source 14a, high-speed processing with a large current beam can be realized, which is suitable for extraction of a large sample S.

The electron beam irradiation optical system 15 sets the beam emitting unit (not shown) inside the sample chamber 11 to the stage 12 with an inclination direction inclined at a predetermined angle (for example, 60 °) with respect to the vertical direction of the stage 12 in the irradiation area. It is fixed to the sample chamber 11 with the optical axis parallel to the tilt direction as well as facing. By this, it is possible to irradiate the electron beam from the upper side to the lower side of the tilt direction to the irradiation target such as the sample S fixed to the stage 12, the sample piece Q, and the needle 18 present in the irradiation area.
The electron beam irradiation optical system 15 includes an electron source 15a for generating electrons, and an electron optical system 15b for focusing and deflecting the electrons emitted from the electron source 15a. The electron source 15 a and the electron optical system 15 b are controlled according to a control signal output from the computer 22, and the irradiation position and irradiation condition of the electron beam are controlled by the computer 22. The electron optical system 15 b includes, for example, an electromagnetic lens and a deflector.

  Note that the arrangement of the electron beam irradiation optical system 15 and the focused ion beam irradiation optical system 14 is interchanged and the electron beam irradiation optical system 15 is inclined in the vertical direction and the focused ion beam irradiation optical system 14 is inclined at a predetermined angle in the vertical direction. It may be located at

  The detector 16 detects the intensity (that is, the intensity of secondary charged particles (secondary electrons and secondary ions) R emitted from the irradiation target when the irradiation target such as the sample S and the needle 18 is irradiated with the focused ion beam or the electron beam. , The amount of secondary charged particles), and outputs information on the detected amount of secondary charged particles R. The detector 16 is disposed at a position at which the amount of the secondary charged particles R can be detected inside the sample chamber 11, for example, at a position obliquely above the irradiation target such as the sample S in the irradiation area. It is fixed to

  The gas supply unit 17 is fixed to the sample chamber 11, has a gas injection unit (also referred to as a nozzle) inside the sample chamber 11, and is disposed facing the stage 12. The gas supply unit 17 includes an etching gas for selectively promoting etching of the sample S by the focused ion beam according to the material of the sample S, and deposition of a deposit of a metal or insulator on the surface of the sample S. A deposition gas or the like for forming a film can be supplied to the sample S. For example, etching can be selectively promoted by supplying etching gas such as xenon fluoride to silicon-based sample S and water to organic-based sample S to the sample S together with irradiation of a focused ion beam. Let Also, for example, a solid component decomposed from the deposition gas is supplied to the surface of the sample S by supplying the deposition gas containing platinum, carbon, tungsten or the like to the sample S together with the irradiation of the focused ion beam. It can be deposited. Specific examples of the deposition gas include phenanthrene, naphthalene and pyrene as carbon-containing gas, trimethyl ethyl cyclopentadienyl platinum as platinum-containing gas, and tungsten hexacarbonyl as tungsten-containing gas. . Further, depending on the supplied gas, etching and deposition can also be performed by electron beam irradiation. However, the deposition gas in the charged particle beam apparatus 10 of the present invention is a deposition gas containing carbon, such as phenanthrene, from the viewpoint of deposition speed and reliable adhesion of the deposition film between the sample piece Q and the needle 18. Naphthalene, pyrene and the like are optimum, and any one of these is used.

  The needle drive mechanism 19 is accommodated in the sample chamber 11 with the needle 18 connected, and displaces the needle 18 in accordance with a control signal output from the computer 22. The needle drive mechanism 19 is provided integrally with the stage 12 and, for example, moves integrally with the stage 12 when the stage 12 is rotated about the tilt axis (that is, the X axis or Y axis) by the tilt mechanism 13 b. The needle drive mechanism 19 includes a movement mechanism (not shown) for moving the needle 18 in parallel along each of the three-dimensional coordinate axes, and a rotation mechanism (not shown) for rotating the needle 18 around the central axis of the needle 18. Have. The three-dimensional coordinate axes are independent of the orthogonal three-axis coordinate system of the sample stage, and the orthogonal three-axis coordinate system is a two-dimensional coordinate axis parallel to the surface of the stage 12, with the surface of the stage 12 inclined. When in rotation, this coordinate system tilts and rotates.

The computer 22 controls at least the stage drive mechanism 13, the focused ion beam irradiation optical system 14, the electron beam irradiation optical system 15, the gas supply unit 17, and the needle drive mechanism 19.
The computer 22 is disposed outside the sample chamber 11, and is connected to a display device 21 and an input device 23 such as a mouse or a keyboard that outputs a signal corresponding to an input operation of the operator.
The computer 22 integrally controls the operation of the charged particle beam device 10 by a signal output from the input device 23 or a signal generated by a preset automatic operation control process.

  The computer 22 converts the detection amount of the secondary charged particle R detected by the detector 16 into a luminance signal corresponding to the irradiation position while scanning the irradiation position of the charged particle beam, Image data indicating the shape of the irradiation target is generated by the two-dimensional position distribution of the detection amount. In the absorption current image mode, the computer 22 detects the absorption current flowing through the needle 18 while scanning the irradiation position of the charged particle beam, thereby the shape of the needle 18 is determined by the two-dimensional position distribution (absorption current image) of the absorption current. Generate absorbed current image data as shown. The computer 22 causes the display device 21 to display a screen for executing operations such as enlargement, reduction, movement, rotation, and the like of each image data together with the generated image data. The computer 22 causes the display device 21 to display a screen for performing various settings such as mode selection and processing setting in automatic sequence control.

  The charged particle beam device 10 according to the embodiment of the present invention has the above-described configuration, and the operation of the charged particle beam device 10 will now be described.

  In the following, an initial setting step is carried out for an operation of automatic sampling performed by the computer 22, that is, an operation for automatically transferring the sample piece Q formed by processing the sample S by the charged particle beam (focused ion beam) to the sample piece holder P. The sample piece pick-up step and the sample piece mount step are roughly divided and sequentially described.

<Initial setting process>
FIG. 5 is a flow chart showing the flow of the initial setting step in the operation of the automatic sampling by the charged particle beam device 10 according to the embodiment of the present invention. First, the computer 22 selects a mode such as presence / absence of a posture control mode described later according to the input of the operator at the start of the automatic sequence, observation conditions for template matching, and setting processing conditions (processing position, size, number Setting), confirmation of needle tip shape, etc. (step S010).

Next, the computer 22 creates a template for the columnar section 34 (steps S020 to S027). In the template creation, first, the computer 22 performs a position registration process of the sample piece holder P installed on the holder fixing base 12 a of the stage 12 by the operator (step S 020). The computer 22 creates a template of the column 34 at the beginning of the sampling process. The computer 22 creates a template for each columnar section 34. The computer 22 performs stage coordinate acquisition and template creation of each columnar portion 34, stores them as a set, and later uses them when determining the shape of the columnar portion 34 by template matching (superimposition of template and image). The computer 22 stores, for example, the image itself, edge information extracted from the image, and the like as a template of the columnar section 34 used for template matching. The computer 22 performs template matching after the movement of the stage 12 in a later process, and can determine the correct position of the columnar part 34 by determining the shape of the columnar part 34 based on the template matching score. Note that it is desirable to use the same viewing conditions such as the same contrast and magnification as those for creating a template as the viewing conditions for template matching because accurate template matching can be performed.
When a plurality of sample piece holders P are installed on the holder fixing base 12 a and a plurality of columnar portions 34 are provided in each sample piece holder P, a recognition code unique to each sample piece holder P and the corresponding sample piece holder P A recognition code unique to each column 34 may be determined in advance, and the computer 22 may store the recognition code in association with the coordinates of each column 34 and template information.
In addition, the computer 22 sets the coordinates of the portion (extraction portion) of the sample S from which the sample piece Q is extracted and the image information of the peripheral sample surface, together with the recognition code, the coordinates of each columnar portion 34, and the template information. It may be stored in
Further, in the case of an irregular sample such as a rock, a mineral, and a biological sample, for example, the computer 22 sets low-magnification wide-field images, position coordinates of the excising part, images, etc. It may be stored as This recognition information may be recorded in association with the sliced sample S, or in association with the transmission electron microscopic image and the extraction position of the sample S.

The computer 22 confirms in advance that the sample table 33 having an appropriate shape actually exists by performing the position registration process of the sample piece holder P prior to the movement of the sample piece Q described later. Can.
In this position registration process, first, the computer 22 moves the stage 12 by the stage drive mechanism 13 as a rough adjustment operation, and aligns the irradiation area at the position where the sample table 33 is attached in the sample piece holder P. Next, the computer 22 prepares in advance from the design shape (CAD information) of the sample table 33 from each image data generated by irradiation of a charged particle beam (each of a focused ion beam and an electron beam) as a fine adjustment operation. The positions of the plurality of columnar parts 34 constituting the sample table 33 are extracted using the template thus obtained. Then, the computer 22 registers (stores) the position coordinates and the image of each of the extracted columnar portions 34 as the attachment position of the sample piece Q (step S023). At this time, the image of each columnar portion 34 is deformed, chipped, or missing in each columnar portion 34 in comparison with the design drawing of the columnar portion, the CAD diagram, or the image of a standard product of the columnar portion 34 prepared in advance. If there is a defect, the computer 22 stores the defect as well as the coordinate position of the columnar part and the image.
Next, it is determined whether there is no columnar portion 34 to be registered in the sample piece holder P currently in execution of the registration process (step S025). If the determination result is "NO", that is, if the remaining number m of columnar portions 34 to be registered is 1 or more, the process returns to step S023 described above and step S023 until the remaining number m of columnar portions 34 disappears. And repeat S025. On the other hand, if the determination result is "YES", that is, if the remaining number m of the columnar portions 34 to be registered is zero, the process proceeds to step S027.

When a plurality of sample piece holders P are installed on the holder fixing base 12a, position coordinates of each sample piece holder P and image data of the corresponding sample piece holder P are recorded together with a code number for each sample piece holder P, Furthermore, the code number corresponding to the position coordinate of each columnar portion 34 of each sample piece holder P and the image data are stored (registration process). The computer 22 may perform this position registration process sequentially for the number of sample pieces Q on which automatic sampling is performed.
Then, the computer 22 determines whether there is no sample piece holder P to be registered (step S027). If the determination result is "NO", that is, if the remaining number n of the sample piece holder P to be registered is 1 or more, the process returns to step S020 described above and the remaining number n of the sample piece holder P is lost Steps S020 to S027 are repeated. On the other hand, if the determination result is "YES", that is, if the remaining number n of the sample piece holders P to be registered is zero, the process proceeds to step S030.
Thereby, when automatically producing several tens of sample pieces Q from one sample S, the positions of the plurality of sample piece holders P are registered in the holder fixing base 12a, and the positions of the respective columnar parts 34 are registered as images. Therefore, it is possible to immediately recall a specific sample piece holder P to which several tens of sample pieces Q should be attached and a specific columnar part 34 in the field of view of the charged particle beam.
In the position registration process (steps S020 and S023), if the sample piece holder P itself or the columnar part 34 is deformed or broken and the sample piece Q can not be attached, the above-described process is performed. Along with the position coordinates, the image data, and the code number, "unusable" (notation indicating that the sample piece Q can not be attached) and the like are registered correspondingly. Thereby, the computer 22 skips the “unusable” sample piece holder P or the columnar part 34 when transferring the sample piece Q described later, and the next normal sample piece holder P or the columnar part 34 It can be moved into the field of view.

Next, the computer 22 creates a template for the needle 18 (steps S030 to S050). The template is used for image matching when the needle described later is brought close to the sample piece.
In the template creating process, first, the computer 22 causes the stage driving mechanism 13 to move the stage 12 once. Subsequently, the computer 22 causes the needle drive mechanism 19 to move the needle 18 to the initial setting position (step S030). The initial setting position is a point at which the focused ion beam and the electron beam can be irradiated almost at the same point and the two beams are in focus (coincidence point) There is no complicated structure that may be mistaken for the needle 18 or the like, which is a predetermined position. The coincidence point is a position where the same object can be observed from different angles by focused ion beam irradiation and electron beam irradiation.

Next, the computer 22 recognizes the position of the needle 18 by the secondary electron image mode by electron beam irradiation (step S040).
The computer 22 detects secondary electrons generated from the needle 18 by irradiating the needle 18 while scanning the electron beam, and generates secondary electron (SEM) image data. At this time, since there is no background in the secondary electron image that is misidentified as the needle 18, only the needle 18 can be reliably recognized. The computer 22 acquires secondary electron image data by electron beam irradiation.
Here, the computer 22 determines the shape of the needle 18 (step S045).
If the tip shape of the needle 18 is not in a state where the sample piece Q can be attached due to deformation, breakage or the like, the process jumps to step S280 in FIG. 20 and the operation of automatic sampling is not performed. End the That is, if the shape of the needle tip is defective, further work can not be performed, and the operator of the apparatus starts work for needle replacement. In the judgment of the needle shape in step S045, for example, when the needle tip position deviates from the predetermined position by 100 μm or more in the observation visual field of 200 μm on one side, it is judged as a defective product. If it is determined in step S045 that the needle shape is defective, “needle defect” or the like is displayed on the display device 21 (step S046) to warn the operator of the device. The needle 18 judged to be a defective product may be replaced with a new needle 18, or in the case of a minor defect, the needle tip may be shaped by focused ion beam irradiation.
In step S045, if the needle 18 has a predetermined normal shape, the process proceeds to the next step S047.
In step S047, a process of extracting the shape of the edge (end) of the needle 18 is performed on the acquired secondary electron image to acquire the coordinates of the tip (needle tip) of the needle 18 in the SEM image. The secondary electron image can be clearly grasped up to the deposition film attached to the tip of the needle, and the coordinates are obtained by the tip of the deposition film.

Here, the state of the tip of the needle will be described.
FIG. 6 is an enlarged schematic view of the tip of the tungsten needle 18 for explaining the state of the probe tip subjected to repetitive sampling. When the needle 18 is repeatedly used a plurality of sampling operations so that its tip is cut off and not deformed, a part of the carbon deposition film DM holding the sample piece Q adheres as a residue to the needle tip . That is, the shape slightly protrudes from the tip end position of the tungsten needle 18. Therefore, the true tip coordinates of the needle 18 are not the tip W of tungsten which originally constitutes the needle 18, but the tip C of the residue of the carbon deposition film.
FIG. 7 is a schematic view of a secondary electron image by electron beam irradiation of the tungsten needle 18 to which the residue of the carbon deposition film DM is attached. In the secondary electron image, since the carbon deposition film DM can be clearly confirmed, the coordinates of the tip C of the carbon deposition film DM are determined as the true tip coordinates of the needle from the secondary electron image.
FIG. 8 is a schematic view of an absorption current image by electron beam irradiation of the tungsten needle 18 to which the residue of the carbon deposition film DM is attached. Since the tip of the needle 18 is enlarged, the tip is shown as being highlighted in a circle. The absorbed current image of the needle 18 is not influenced by the background, and only the needle 18 can be imaged. However, depending on the irradiation condition of the electron beam, the carbon deposition film DM can not be clearly confirmed in the absorption current image because the charge flowing in by the irradiation and the charge emitted by the secondary electrons cancel each other. That is, since the absorption current image can not recognize the true needle position including the carbon deposition film DM, there is a high risk that the tip of the needle collides with the sample piece Q when the needle 18 is moved only by the absorption current image. .

Following step S047, a template of the needle tip is created (step S050).
After switching to the absorption current mode of the electron beam and acquiring the absorption current image at the tip of the needle as a reference image in the same observation visual field as at step S047, the needle with reference to the needle tip coordinates obtained at step S047 in the reference image data What extracted a part of area | region containing a tip part is made into a template. The template and the reference coordinates of the needle tip obtained in step S047 are associated with each other and registered in the computer 22.
The reason for creating a template using the absorbed current image is that when the needle 18 approaches the sample piece Q, a shape that is misidentified as the needle 18 exists in the background of the needle 18, such as the processed shape of the sample piece Q and the pattern on the sample surface. In many cases, use an absorption current image that is not affected by the background to prevent false positives. As described above, the secondary electronic image is susceptible to the background and is not suitable as a template image because there is a high risk of misidentification. As described above, since the deposition film at the tip of the needle can not be recognized in the absorption current image, the true needle tip can not be known, but the absorption current image is suitable from the viewpoint of pattern matching with the template.
Although the observation field of view is limited to the same observation field in step S050, the present invention is not limited to this, and is not limited to the same field of view as long as the beam scanning reference can be managed. Further, although the template includes the needle tip end in the description of step S050, an area not including the tip may be used as the template as long as reference coordinates and even coordinates are associated. Further, although a secondary electron image is taken as an example in FIG. 7, a backscattered electron image can also be used to identify the coordinates of the tip C of the carbon deposition film DM.

  The computer 22 uses, as reference image data, image data that is actually acquired in advance of moving the needle 18, so pattern matching with high accuracy can be performed regardless of the difference in the shape of each needle 18. Furthermore, since the computer 22 acquires each image data without a complicated structure in the background, it is possible to obtain accurate true needle tip coordinates. In addition, it is possible to obtain a template from which the shape of the needle 18 excluding the influence of the background can be clearly grasped.

In addition, when acquiring each image data, the computer 22 uses image acquisition conditions such as suitable magnification, brightness, and contrast stored in advance in order to increase the recognition accuracy of the object.
In addition, the steps (S020 to S027) of creating the template of the columnar portion 34 and the steps (S030 to S050) of creating the template of the needle 18 may be reversed. However, when the process (S030 to S050) of creating the template of the needle 18 precedes, the flow (E) returning from step S280 described later is also interlocked.

<Sample piece pickup process>
FIG. 9 is a flow chart showing a flow of a process of picking up the sample piece Q from the sample S in the operation of the automatic sampling by the charged particle beam device 10 according to the embodiment of the present invention. Here, the term “pickup” refers to separation and extraction of the sample piece Q from the sample S by processing with a focused ion beam or a needle.
First, the computer 22 moves the stage 12 by the stage drive mechanism 13 in order to bring the target sample piece Q into the field of view of the charged particle beam. The stage drive mechanism 13 may be operated using position coordinates of the target reference mark Ref.
Next, the computer 22 recognizes the reference mark Ref formed in advance on the sample S using the image data of the charged particle beam. The computer 22 recognizes the position of the sample piece Q from the relative positional relationship between the known reference mark Ref and the sample piece Q by using the recognized reference mark Ref so that the position of the sample piece Q can be brought into the observation field of view The stage is moved to (step S060).
Next, the computer 22 corresponds to the attitude control mode so that the stage drive mechanism 13 drives the stage 12 so that the attitude of the sample piece Q becomes a predetermined attitude (for example, an attitude suitable for taking out by the needle 18). The stage 12 is rotated about the Z axis by an angle (step S 070).
Next, the computer 22 recognizes the reference mark Ref using the image data of the charged particle beam, recognizes the position of the sample piece Q from the relative positional relationship between the reference mark Ref and the sample piece Q which are known, Alignment of the piece Q is performed (step S 080). Next, the computer 22 performs the following processing as processing for causing the needle 18 to approach the sample piece Q.

The computer 22 executes needle movement (rough adjustment) for moving the needle 18 by means of the needle drive mechanism 19 (step S090). The computer 22 recognizes the reference mark Ref (see FIG. 2 described above) using the image data of the focused ion beam and the electron beam for the sample S. The computer 22 sets the movement target position AP of the needle 18 using the recognized reference mark Ref.
Here, the movement target position AP is a position close to the sample piece Q. The movement target position AP is, for example, a position close to the opposite side of the support Qa of the sample piece Q. The computer 22 associates the movement target position AP with a predetermined positional relationship with the processing frame F when the sample piece Q is formed. The computer 22 stores information on the relative positional relationship between the processing frame F and the reference mark Ref when forming the sample piece Q on the sample S by irradiation of the focused ion beam. The computer 22 moves the tip position of the needle 18 to the target position using the relative position relation between the reference mark Ref, the processing frame F and the movement target position AP (see FIG. 2) using the recognized reference mark Ref. Move toward the AP in 3D space. When moving the needle 18 three-dimensionally, for example, the computer 22 first moves the needle 18 in the X direction and the Y direction, and then moves it in the Z direction.
When moving the needle 18, the computer 22 observes from different directions by the electron beam and the focused ion beam using the reference mark Ref formed on the sample S at the time of execution of the automatic processing for forming the sample piece Q. The three-dimensional positional relationship between the needle 18 and the sample piece Q can be accurately grasped, and can be moved appropriately.

  In the above-described process, the computer 22 moves the tip position of the needle 18 to the target position using the reference mark Ref and the relative positional relationship between the reference mark Ref, the processing frame F, and the movement target position AP. Although it is said that it moves in the three-dimensional space toward the AP, it is not limited to this. The computer 22 moves the tip position of the needle 18 toward the movement target position AP in a three-dimensional space using the relative positional relationship between the reference mark Ref and the movement target position AP without using the processing frame F. You may

  Next, the computer 22 executes needle movement (fine adjustment) for moving the needle 18 by the needle drive mechanism 19 (step S100). The computer 22 repeats the pattern matching using the template created in step S050, and includes the movement target position AP using the needle tip coordinates obtained in step S047 as the tip position of the needle 18 in the SEM image The needle 18 is moved from the movement target position AP to the connection processing position in the three-dimensional space in a state where the irradiation region is irradiated with the charged particle beam.

Next, the computer 22 performs a process of stopping the movement of the needle 18 (step S110).
FIG. 10 is a view for explaining the positional relationship when connecting the needle to the sample piece, and is an enlarged view of the end of the sample piece Q. FIG. In FIG. 10, the end (cross section) of the sample piece Q to which the needle 18 is to be connected is disposed at the SIM image center 35 and is separated by a predetermined distance L1 from the SIM image center 35. For example, the central position of the width of the sample piece Q As a connection processing position 36. The connection processing position may be a position on the extension of the end face of the sample piece Q (reference numeral 36a in FIG. 10). In this case, it is convenient that the deposition film is easily attached. The computer 22 sets the upper limit of the predetermined interval L1 to 1 μm, and preferably sets the predetermined interval to 100 nm or more and 400 nm or less. If the predetermined interval is less than 100 nm, only the deposition film connected when separating the needle 18 and the sample piece Q can not be cut in a later step, and there is a high risk that the needle 18 may be cut away. The excision of the needle 18 shortens the needle 18 and the tip of the needle is deformed thickly. If this is repeated, the needle 18 has to be replaced, and the object of the present invention is to perform sampling repeatedly and automatically. Go against. Also, conversely, if the predetermined interval exceeds 400 nm, the connection by the deposition film becomes insufficient, the risk of failure to extract the sample piece Q increases, and repetitive sampling is prevented.
Further, although the position in the depth direction can not be seen from FIG. However, this depth direction is also not limited to this position. The three-dimensional coordinates of the connection processing position 36 are stored in the computer 22.
The computer 22 designates a connection processing position 36 set in advance. The computer 22 operates the needle drive mechanism 19 to move the needle 18 to a predetermined connection processing position 36 based on three-dimensional coordinates of the tip of the needle 18 and the connection processing position 36 in the same SIM image or SEM image. The computer 22 stops the needle drive mechanism 19 when the needle tip coincides with the connection processing position 36.
11 and 12 show how the needle 18 approaches the sample piece Q, showing an image obtained by the focused ion beam of the charged particle beam device 10 according to the embodiment of the present invention (FIG. 11). FIG. 12 is a diagram (FIG. 12) showing an image obtained by an electron beam. FIG. 12 shows the state before and after the fine adjustment of the needle, and the needle 18 a in FIG. 12 shows the needle 18 at the movement target position, and the needle 18 b is moved to the connection processing position 36 after the fine adjustment of the needle 18. 18 is shown, which is the same needle 18. 11 and 12 have different observation magnifications in addition to different observation directions for the focused ion beam and the electron beam, but the observation object and the needle 18 are the same.
By such a method of moving the needle 18, the needle 18 can be quickly brought into close proximity to the connection processing position 36 precisely at the connection processing position near the sample piece Q, and can be stopped.

Next, the computer 22 performs a process of connecting the needle 18 to the sample piece Q (step S120). The computer 22 supplies the processing frame R1 set at the connection processing position 36 while supplying the carbon-based gas, which is a deposition gas, to the sample piece Q and the tip surface of the needle 18 by the gas supply unit 17 for a predetermined time. The focused ion beam is irradiated to the irradiation area including the light. Thereby, the computer 22 connects the sample piece Q and the needle 18 by the deposition film.
In this step S120, the computer 22 connects the needle 18 with the deposition film at a spaced apart position without directly contacting the sample piece Q. Therefore, in a later step, the needle 18 and the sample piece Q are focused ion beams The needle 18 is not cut when it is separated by irradiation cutting. In addition, it has an advantage of being able to prevent the occurrence of a defect such as damage due to the direct contact of the needle 18 with the sample piece Q. Furthermore, even if the needle 18 vibrates, transmission of this vibration to the sample piece Q can be suppressed. Furthermore, even when movement of the sample piece Q occurs due to the creep phenomenon of the sample S, generation of excessive strain between the needle 18 and the sample piece Q can be suppressed. FIG. 13 shows this situation, and a processing frame R1 including the connection processing position of the needle 18 and the sample piece Q in the image data obtained by the focused ion beam of the charged particle beam device 10 according to the embodiment of the present invention. 14 is a view showing a deposition film formation region, and FIG. 14 is an enlarged explanatory view of FIG. 13 to make it easy to understand the positional relationship between the needle 18 and the sample piece Q and the deposition film formation region (for example, processing frame R1) ing. The needle 18 approaches and stops at a position having a distance of a predetermined distance L1 from the sample piece Q as a connection processing position. The needle 18, the sample piece Q, and the deposition film formation region (for example, the processing frame R1) are set to cross the needle 18 and the sample piece Q. The deposition film is also formed at an interval of a predetermined distance L1, and the needle 18 and the sample piece Q are connected by the deposition film.

  When connecting the needle 18 to the sample piece Q, the computer 22 later transfers the sample piece Q connected to the needle 18 to the sample piece holder P according to each approach mode selected in step S010 in advance. Take a connected attitude. The computer 22 takes a relative connection posture between the needle 18 and the sample piece Q corresponding to each of a plurality of (for example, three) different approach modes described later.

  The computer 22 may determine the connection state by the deposition film by detecting a change in the absorption current of the needle 18. The computer 22 determines that the sample piece Q and the needle 18 are connected by the deposition film when the absorption current of the needle 18 reaches a predetermined current value, and the de-loading operation is performed regardless of whether or not a predetermined deposition time has elapsed. The formation of the position film may be stopped.

Next, the computer 22 performs a process of cutting the support Qa between the sample piece Q and the sample S (step S130). The computer 22 uses the reference mark Ref formed on the sample S to designate the cutting position T1 of the support portion Qa set in advance.
The computer 22 separates the sample piece Q from the sample S by irradiating the cutting position T1 with the focused ion beam for a predetermined time. FIG. 15 shows this situation, and shows the cutting position T1 of the support portion Qa of the sample S and the sample piece Q in the image data obtained by the focused ion beam of the charged particle beam device 10 according to the embodiment of the present invention. FIG.
The computer 22 detects conduction between the sample S and the needle 18 to determine whether the sample piece Q is separated from the sample S (step S133).
When the computer 22 does not detect the conduction between the sample S and the needle 18, the computer 22 determines that the sample piece Q is separated from the sample S (OK), and continues the execution of the subsequent processing. On the other hand, the computer 22 detected the conduction between the sample S and the needle 18 after the end of the cutting process, that is, after the cutting of the support Qa between the sample piece Q and the sample S at the cutting process position T1 is completed. In the case, it is determined that the sample piece Q is not separated from the sample S (NG). When it is determined that the sample piece Q is not separated from the sample S (NG), the computer 22 displays or warns on the display device 21 that the separation of the sample piece Q and the sample S is not completed. Notification is made by sound or the like (step S136). Then, the execution of the subsequent processing is stopped. In this case, the computer 22, the deposition film DM 2 connecting specimen Q and the needle 18 is cut by a focused ion beam irradiation, to separate the specimen Q and the needle 18, the needle 18 initial position (Step S060) You may go back. The needle 18 returned to the initial position. The next sample piece Q is sampled.

Next, the computer 22 performs needle retraction processing (step S140). The computer 22 causes the needle drive mechanism 19 to raise the needle 18 vertically upward (that is, in the positive direction of the Z direction) by a predetermined distance (for example, 5 μm). FIG. 16 shows this state, and is a view showing a state in which the needle 18 to which the sample piece Q is connected in the image data obtained by the electron beam of the charged particle beam device 10 according to the embodiment of the present invention is retracted. is there.
Next, the computer 22 performs stage evacuation processing (step S150). The computer 22 moves the stage 12 by a predetermined distance by means of the stage drive mechanism 13 as shown in FIG. For example, it is lowered vertically downward (that is, in the negative direction of the Z direction) by 1 mm, 3 mm, and 5 mm. After lowering the stage 12 by a predetermined distance, the computer 22 moves the nozzle 17 a of the gas supply unit 17 away from the stage 12. For example, it is raised to the standby position above the vertical direction. FIG. 17 shows this situation, and the stage 12 is retracted with respect to the needle 18 to which the sample piece Q is connected in the image data obtained by the electron beam of the charged particle beam device 10 according to the embodiment of the present invention It is a figure which shows a state.

Next, the computer 22 operates the stage drive mechanism 13 so that there is no structure in the background of the needle 18 and the sample piece Q connected to each other. This is the edge of the needle 18 and the sample piece Q from the image data of the sample piece Q obtained by each of the focused ion beam and the electron beam when forming the template of the needle 18 and the sample piece Q in the subsequent processing (step S170 ). Contour) in order to be recognized reliably. The computer 22 moves the stage 12 by a predetermined distance. If the background of the sample piece Q is judged (step S160) and the background is not a problem, the process proceeds to the next step S170, and if there is a problem in the background, the stage 12 is moved again by a predetermined amount (step S165). (Step S160), and the process is repeated until there is no problem in the background.

The computer 22 executes template creation of the needle and the sample piece (step S170). The computer 22 rotates the needle 18 to which the sample piece Q is fixed according to need (that is, the posture for connecting the sample piece Q to the columnar portion 34 of the sample table 33) and the sample piece Q. Create a template Thus, the computer 22 three-dimensionally recognizes the edges (contours) of the needle 18 and the sample piece Q from the image data obtained by each of the focused ion beam and the electron beam according to the rotation of the needle 18. In the approach mode at a rotation angle of 0 ° of the needle 18, the computer 22 recognizes the edges (contours) of the needle 18 and the sample piece Q from the image data obtained by the focused ion beam without requiring the electron beam. You may
When the computer 22 instructs the stage drive mechanism 13 or the needle drive mechanism 19 to move the stage 12 to a position where there is no structure in the background of the needle 18 and the sample piece Q, the needle 18 is actually instructed. If not reached, the observation magnification is lowered to search for the needle 18, and if not found, the position coordinates of the needle 18 are initialized and the needle 18 is moved to the initial position.

In the template preparation (step S170), first, the computer 22 acquires a template (reference image data) for template matching with respect to the tip shape of the sample piece Q and the needle 18 to which the sample piece Q is connected. The computer 22 irradiates the needle 18 with a charged particle beam (each of a focused ion beam and an electron beam) while scanning the irradiation position. The computer 22 acquires image data of secondary charged particles R (such as secondary electrons) emitted from the needle 18 by irradiation of the charged particle beam from a plurality of different directions. The computer 22 acquires each image data by focused ion beam irradiation and electron beam irradiation. The computer 22 stores each image data acquired from two different directions as a template (reference image data).
The computer 22 uses the image data actually acquired for the sample piece Q actually processed by the focused ion beam and the needle 18 to which the sample piece Q is connected as reference image data. Highly accurate pattern matching can be performed regardless of the shape.
In addition, when acquiring each image data, the computer 22 preferably stores the suitable magnification, brightness, contrast, etc. stored in advance to increase the recognition accuracy of the shape of the sample piece Q and the needle 18 to which the sample piece Q is connected. Use image acquisition conditions.

  Next, the computer 22 performs needle retraction processing (step S180). This is to prevent unintended contact with the stage during subsequent stage movement. The computer 22 causes the needle drive mechanism 19 to move the needle 18 by a predetermined distance. For example, it is raised vertically upward (that is, in the positive direction of the Z direction). Conversely, the needle 18 is stopped in place and the stage 12 is moved by a predetermined distance. For example, it may be lowered vertically downward (that is, in the negative direction of the Z direction). The needle retraction direction is not limited to the vertical direction described above, and may be the needle axial direction or any other predetermined retraction position, and the sample piece Q attached to the tip of the needle contacts the structure in the sample chamber, It may be at a predetermined position which is not irradiated by the focused ion beam.

Next, the computer 22 moves the stage 12 by the stage drive mechanism 13 so that the specific sample piece holder P registered in the above-mentioned step S020 enters the observation visual field area by the charged particle beam (step S190). FIGS. 18 and 19 show this state, and in particular, FIG. 18 is a schematic view of an image obtained by the focused ion beam of the charged particle beam device 10 according to the embodiment of the present invention. FIG. 19 is a schematic view of an image obtained by the electron beam, showing the mounting position U of the sample piece Q of the columnar section 34.
Here, it is determined whether or not the columnar section 34 of the desired sample piece holder P falls within the observation visual field area (step S195), and if the desired columnar section 34 falls within the observation visual field area, the process proceeds to the next step S200. move on. If the desired columnar section 34 does not fall within the observation visual field area, that is, if the stage drive does not operate correctly with respect to the designated coordinates, the stage coordinates designated immediately before are initialized, and the origin position of the stage 12 is obtained. (Step S197). Then, the coordinates of the desired columnar section 34 registered in advance are designated again, the stage 12 is driven (step S190), and the process is repeated until the columnar section 34 enters the observation visual field area.

Next, the computer 22 moves the stage 12 by the stage drive mechanism 13 to adjust the horizontal position of the sample piece holder P, and corresponds to the posture control mode so that the posture of the sample piece holder P becomes a predetermined posture. The stage 12 is rotated and inclined by an angle (step S200).
By this step S200, the attitude of the sample piece Q and the sample piece holder P can be adjusted so that the end face of the original sample S surface is parallel or perpendicular to the end face of the columnar part 34. In particular, on the assumption that the sample piece Q fixed to the columnar part 34 is subjected to thinning processing with a focused ion beam, the sample piece Q so that the surface end face of the original sample S and the focused ion beam irradiation axis are in a vertical relationship. It is preferable to adjust the attitude of the sample piece holder P and the sample piece holder P. Further, the sample piece Q and the sample piece holder P are so fixed that the sample piece Q fixed to the columnar part 34 is on the downstream side in the incident direction of the focused ion beam with the surface end face of the original sample S perpendicular to the columnar part 34. It is also preferable to adjust the attitude.
Here, the quality of the shape of the columnar portion 34 of the sample piece holder P is determined (step S205). Although the image of the columnar part 34 is registered in step S 023, whether the columnar part 34 designated by unexpected contact or the like is deformed, damaged, missing, or the like in the subsequent steps, whether the shape of the columnar part 34 is good or not It is this step S205 to judge. In this step S205, if it is judged that the shape of the corresponding columnar part 34 is good without any problem, the process proceeds to the next step S210, and if it is judged as defective, the stage movement of the next columnar part 34 so as to be within the observation visual field area S190 Return to
When the computer 22 instructs the stage drive mechanism 13 to move the stage 12 to place the designated columnar part 34 in the observation visual field area, the designated columnar part 34 is actually in the observation visual field area. If it does not enter, the position coordinates of the stage 12 are initialized, and the stage 12 is moved to the initial position.
Then, the computer 22 moves the nozzle 17a of the gas supply unit 17 near the focused ion beam irradiation position. For example, it is lowered from the standby position vertically above the stage 12 toward the processing position.

<Sample piece mounting process>
The “specimen piece mounting step” referred to here is a step of transferring the extracted sample piece Q to the sample piece holder P.
FIG. 20 shows a step of mounting (transferring) the sample piece Q to a predetermined columnar portion 34 of a predetermined sample piece holder P in the operation of the automatic sampling by the charged particle beam device 10 according to the embodiment of the present invention It is a flowchart which shows a flow.
The computer 22 recognizes the transfer position of the sample piece Q stored in step S020 described above, using each image data obtained by the focused ion beam and the electron beam irradiation (step S210). The computer 22 executes template matching of the columnar section 34. The computer 22 performs template matching in order to confirm that among the plurality of columnar portions 34 of the comb-tooth-shaped sample base 33, the columnar portions 34 appearing in the observation visual field area are the columnar portions 34 designated in advance. Do. The computer 22 performs template matching for each image data obtained by irradiation of each of the focused ion beam and the electron beam using the template for each columnar portion 34 created in the step of creating the template of the columnar portion 34 in advance (step S020). Conduct.

Further, the computer 22 determines whether or not a problem such as a drop in the columnar part 34 is recognized in the template matching for each columnar part 34 performed after moving the stage 12 (step S215). If a problem is found in the shape of the columnar part 34 (NG), the columnar part 34 to which the sample piece Q is transferred is changed to the columnar part 34 next to the columnar part 34 where the problem is recognized, and the columnar part The template matching is performed also for 34, and the columnar part 34 to be relocated is determined. If there is no problem in the shape of the columnar portion 34, the process proceeds to the next step S220.
Further, the computer 22 may extract an edge (outline) from image data of a predetermined area (area including at least the columnar portion 34) and use this edge pattern as a template. When the computer 22 can not extract an edge (outline) from image data of a predetermined area (area including at least the columnar portion 34), the computer 22 acquires the image data again. The extracted edge may be displayed on the display device 21 and template-matched with the image by the focused ion beam or the image by the electron beam in the observation view area.

  The computer 22 drives the stage 12 by the stage drive mechanism 13 so that the mounting position recognized by the irradiation of the electron beam coincides with the mounting position recognized by the irradiation of the focused ion beam. The computer 22 drives the stage 12 by the stage drive mechanism 13 so that the mounting position U of the sample piece Q coincides with the view center (processing position) of the view area.

Next, the computer 22 performs the process of the following steps S220 to S250 as a process of bringing the sample piece Q connected to the needle 18 into contact with the sample piece holder P.
First, the computer 22 recognizes the position of the needle 18 (step S220). The computer 22 detects the absorbed current flowing into the needle 18 by irradiating the needle 18 with the charged particle beam, and generates absorbed current image data. The computer 22 acquires each image data by focused ion beam irradiation and electron beam irradiation. The computer 22 detects the tip position of the needle 18 in a three-dimensional space using each of the absorbed current image data from two different directions.
The computer 22 drives the stage 12 by the stage drive mechanism 13 using the detected tip end position of the needle 18 to set the tip end of the needle 18 at the center position (center of view) of the preset visual field area. It may be set.

Next, the computer 22 executes a sample piece mounting process. First, the computer 22 performs template matching in order to accurately recognize the position of the sample piece Q connected to the needle 18. The computer 22 uses the template of the needle 18 and the sample piece Q connected to each other in the needle and the sample piece template forming process in advance, in each image data obtained by irradiation of each of the focused ion beam and the electron beam. Implement template matching.
When extracting an edge (outline) from a predetermined area (area including at least the needle 18 and the sample piece Q) of the image data in the template matching, the computer 22 displays the extracted edge on the display device 21. . Further, when the edge (outline) can not be extracted from a predetermined area (area including at least the needle 18 and the sample piece Q) of the image data in the template matching, the computer 22 acquires the image data again.
Then, in each image data obtained by each irradiation of the focused ion beam and the electron beam, the computer 22 generates a template of the needle 18 and the sample piece Q connected to each other and a columnar portion 34 to which the sample piece Q is attached. The distance between the sample piece Q and the columnar part 34 is measured based on template matching using the template
Then, the computer 22 finally transfers the sample piece Q to the columnar part 34 to which the sample piece Q is to be attached, by only movement in a plane parallel to the stage 12.

  In the sample piece mounting step, first, the computer 22 executes needle movement for moving the needle 18 by the needle drive mechanism 19 (step S230). In each image data obtained by irradiation of each of the focused ion beam and the electron beam, the computer 22 performs sample matching with the sample piece Q based on template matching using the template of the needle 18 and the sample piece Q and the template of the columnar part 34. The distance to the columnar part 34 is measured. The computer 22 moves the needle 18 in the three-dimensional space toward the mounting position of the sample piece Q according to the measured distance.

Next, the computer 22 leaves a predetermined air gap L2 between the columnar part 34 and the sample piece Q to stop the needle 18 (step S240). The computer 22 sets the gap L2 to 1 μm or less, and preferably, sets the gap L2 to 100 nm or more and 500 nm or less. Even if the gap L2 is 500 nm or more, connection is possible, but the time required for connection between the columnar part 34 and the sample piece Q by the deposition film becomes longer than a predetermined value, and 1 μm is not preferable. As the gap L2 becomes smaller, the time required for connection of the columnar section 34 and the sample piece Q by the deposition film becomes shorter, but it is important not to make contact.
In addition, when providing the air gap L2, the computer 22 may provide the air gap by detecting the absorption current image of the columnar portion 34 and the needle 18.
After transferring the sample piece Q to the columnar part 34 by detecting the conduction between the columnar part 34 and the needle 18 or the absorption current image of the columnar part 34 and the needle 18, the computer 22 The presence or absence of disconnection with the needle 18 is detected.
When the computer 22 can not detect the conduction between the columnar portion 34 and the needle 18, the computer 22 switches the processing so as to detect the absorption current image of the columnar portion 34 and the needle 18.
Further, when the computer 22 can not detect the conduction between the columnar portion 34 and the needle 18, the transfer of the sample piece Q is stopped, the sample piece Q is separated from the needle 18, and a needle described later A trimming process may be performed.

  Next, the computer 22 performs a process of connecting the sample piece Q connected to the needle 18 to the columnar part 34 (step S250). 21 and 22 are schematic views of images in which the observation magnification in FIGS. 18 and 19 is increased, respectively. The computer 22 is such that one side of the sample piece Q and one side of the columnar portion 34 are in a straight line as shown in FIG. 21, and the upper end face of the sample piece Q and the upper end face of the columnar portion 34 are the same as shown in FIG. The needle drive mechanism 19 is stopped when the gap L2 reaches a predetermined value. The computer 22 has the air gap L2 and is stopped at the attachment position of the sample piece Q, the processing frame R2 for deposition is included so as to include the end of the columnar portion 34 in the image by the focused ion beam of FIG. Set The computer 22 supplies the focused ion beam to the irradiation area including the processing frame R2 for a predetermined time while supplying the gas to the surfaces of the sample piece Q and the columnar part 34 by the gas supply unit 17. By this operation, a deposition film is formed on the focused ion beam irradiation part, the air gap L2 is filled, and the sample piece Q is connected to the columnar part 34. In the process of fixing the sample piece Q to the columnar part 34 by deposition, the computer 22 ends the deposition when the conduction between the columnar part 34 and the needle 18 is detected.

The computer 22 determines that the connection between the sample piece Q and the columnar part 34 is completed (step S255). Step S255 is performed as follows, for example. A resistance meter is previously installed between the needle 18 and the stage 12 to detect conduction between the two. When the two are separated (there is the air gap L2), the electrical resistance is infinite, but both are covered with the conductive deposition film, and as the air gap L2 fills up, the electrical resistance value between both becomes gradually It is determined that the electric connection is established by confirming that the resistance value is lowered to a predetermined resistance value or less. Also, based on preliminary studies, it is determined that the deposition film has sufficient mechanical strength when the resistance value between the both reaches a predetermined resistance value, and the sample piece Q is sufficiently connected to the columnar portion 34 it can.
In addition, what is to be detected is not limited to the above-described electric resistance, as long as the electric characteristic between the columnar portion and the sample piece Q such as current or voltage can be measured. In addition, the computer 22 extends the formation time of the deposition film if it does not satisfy the predetermined electric characteristics (electric resistance value, current value, potential, etc.) within the predetermined time. Further, the computer 22 previously determines the time for forming an optimum deposition film for the air gap L2 between the columnar part 34 and the sample piece Q, the irradiation beam condition, and the gas type for the deposition film, and this deposition formation time is It is possible to store and to stop the formation of the deposition film at a predetermined time.
The computer 22 stops the gas supply and the focused ion beam irradiation when the connection between the sample piece Q and the columnar part 34 is confirmed. FIG. 23 shows this state, and image data by the focused ion beam of the charged particle beam device 10 according to the embodiment of the present invention, which is a deposition for connecting the sample piece Q connected to the needle 18 to the columnar part 34 It is a figure showing membrane DM1.

  In step S255, the computer 22 may determine the connection state by the deposition film DM1 by detecting a change in the absorption current of the needle 18. When the computer 22 determines that the sample piece Q and the columnar portion 34 are connected by the deposition film DM1 according to the change in the absorption current of the needle 18, the deposition film DM1 is formed regardless of whether or not the predetermined time has elapsed. The formation may be stopped. If the connection completion is confirmed, the process proceeds to the next step S260. If the connection is not completed, the focused ion beam irradiation and the gas supply are stopped at a predetermined time to connect the sample piece Q and the needle 18 by the focused ion beam. The position film DM2 is cut, and the sample piece Q at the tip of the needle is discarded. The operation moves on to retract the needle (step S270).

Next, the computer 22 cuts the deposition film DM2 connecting the needle 18 and the sample piece Q to separate the sample piece Q and the needle 18 (step S260). FIG. 23 shows this situation, and cuts the deposition film DM2 connecting the needle 18 and the sample piece Q in the image data obtained by the focused ion beam of the charged particle beam device 10 according to the embodiment of the present invention It is a figure which shows the cutting process position T2 for doing. The computer 22 calculates a predetermined distance from the side surface of the columnar portion 34 (that is, the sum of the space L2 from the side surface of the columnar portion 34 to the sample piece Q and the size L3 of the sample piece Q) L, the needle 18 and the sample piece Q A position separated by a sum (L + L1 / 2) with a half of the predetermined distance L1 (see FIG. 23) of the air gap is set as the cutting position T2. Further, the cutting position T2 may be a position separated by the sum of the predetermined distance L and the predetermined distance L1 of the gap between the needle 18 and the sample piece Q (L + L1). In this case, the carbon deposition film DM2 remaining at the tip of the needle becomes smaller, and the opportunity for cleaning (described later) of the needle 18 is reduced, which is preferable for continuous automatic sampling.
The computer 22 can separate the needle 18 from the sample piece Q by irradiating the cutting position T2 with the focused ion beam for a predetermined time. The computer 22 cuts only the deposition film DM2 by irradiating the focused ion beam to the cutting position T2 for a predetermined time, and separates the needle 18 from the sample piece Q without cutting the needle 18 . In step S260, it is important to cut only the deposition film DM2. As a result, since the needle 18 once set can be used repeatedly without replacement for a long time, automatic sampling can be repeated continuously and unattended. FIG. 24 shows this state, and is a view showing a state in which the needle 18 is separated from the sample piece Q by the image data of the focused ion beam in the charged particle beam device 10 according to the embodiment of the present invention. The needle tip has a residue of the deposition film DM2.

  The computer 22 determines whether the needle 18 has been separated from the sample piece Q by detecting conduction between the sample piece holder P and the needle 18 (step S265). After completion of the cutting process, that is, after the focused ion beam irradiation has been performed for a predetermined time, in order to cut the deposition film DM2 between the needle 18 and the sample piece Q at the cutting process position T2. Also in the case where the conduction between the sample piece holder P and the needle 18 is detected, it is determined that the needle 18 is not separated from the sample table 33. When the computer 22 determines that the needle 18 is not separated from the sample piece holder P, it displays on the display device 21 that separation of the needle 18 and the sample piece Q is not completed, or an alarm The operator is notified by sound. Then, the execution of the subsequent processing is stopped. On the other hand, when the computer 22 does not detect the conduction between the sample piece holder P and the needle 18, it determines that the needle 18 has been separated from the sample piece Q, and continues the execution of the subsequent processing.

  Next, the computer 22 performs needle retraction processing (step S270). The computer 22 causes the needle drive mechanism 19 to move the needle 18 away from the sample piece Q by a predetermined distance. For example, it is raised in the vertical direction upper direction, such as 2 mm and 3 mm, that is, in the positive direction of the Z direction. FIG. 25 and FIG. 26 show this situation, and each state in which the needle 18 is retracted upward from the sample piece Q is an image of the focused ion beam of the charged particle beam device 10 according to the embodiment of the present invention. FIG. 26 is a schematic view (FIG. 25) and a schematic view (FIG. 26) of an image by an electron beam.

  Next, it is determined whether to continue sampling from different places of the same sample S (step S280). Since the setting of the number to be sampled is registered in advance in step S010, the computer 22 confirms this data and determines the next step. If sampling is to be continued, the process returns to step S 030, continues the subsequent steps as described above, and executes the sampling operation, and if sampling is not to be continued, the series of flow ends.

The needle template creation in step S050 may be performed immediately after step S280. As a result, in the step for preparing for the next sampling, it is not necessary to carry out in step S050 for the next sampling, and the process can be simplified. In addition, since the sample S is not in the background of the needle 18, the sample S is not irradiated with the charged particle beam meaninglessly.
Thus, a series of automatic sampling operations are completed.
Note that the flow from the start to the end described above is merely an example, and steps may be replaced or skipped if the overall flow is not impaired.
The computer 22 can execute the sampling operation unattended by continuously operating the above-described start to end. According to the above-described method, since the sample sampling can be repeated without replacing the needle 18, a large number of sample pieces Q can be sampled continuously using the same needle 18.
Thereby, the charged particle beam device 10 can be repeatedly used without forming the same needle 18 when separating and extracting the sample piece Q from the sample S, and further without replacing the needle 18 itself, from one sample S. A large number of sample pieces Q can be produced automatically. Sampling can be performed without performing a manual operation of an operator as in the past.

As mentioned above, according to the charged particle beam device 10 according to the embodiment of the present invention, the computer 22 is a focused ion beam based on at least the sample piece holder P, the needle 18 and the template obtained directly from the sample piece Q. Since the irradiation optical system 14, the electron beam irradiation optical system 15, the stage drive mechanism 13, the needle drive mechanism 19 and the gas supply unit 17 are controlled, the operation of transferring the sample piece Q to the sample piece holder P can be appropriately automated. Can.
Furthermore, since a template is created from a secondary electron image obtained by irradiation of a charged particle beam or an absorption current image in the absence of a structure at least in the background of the sample piece holder P, the needle 18 and the sample piece Q, Reliability can be improved. Thereby, the accuracy of template matching using a template can be improved, and the sample piece Q can be transferred to the sample piece holder P with high accuracy based on the positional information obtained by the template matching.

Furthermore, when it is instructed that there is no structure in the background of at least the sample piece holder P, the needle 18, and the sample piece Q, at least the sample piece holder P if the instruction does not actually follow. Since the positions of the needle 18 and the sample piece Q are initialized, the drive mechanisms 13 and 19 can be returned to the normal state.
Furthermore, since the template corresponding to the posture at the time of transferring the sample piece Q to the sample piece holder P is created, the positional accuracy at the time of transferring can be improved.
Furthermore, since the distance between each other is measured based on template matching using at least the sample piece holder P, the needle 18, and the sample piece Q, the positional accuracy at the time of transfer can be further improved.
Furthermore, when an edge can not be extracted with respect to a predetermined region in at least the image data of each of the sample piece holder P, the needle 18, and the sample piece Q, the image data is acquired again, so that a template is accurately generated. be able to.
Furthermore, finally, since the sample piece Q is transferred to the predetermined position of the sample piece holder P only by movement in a plane parallel to the stage 12, the sample piece Q can be properly transferred.
Furthermore, since the sample piece Q held by the needle 18 is shaped before the template is formed, the accuracy of edge extraction at the time of template formation can be improved, and the shape of the sample piece Q suitable for finishing to be performed later Can be secured. Furthermore, since the position of the shaping process is set according to the distance from the needle 18, the shaping process can be performed with high accuracy.
Furthermore, when the needle 18 holding the sample piece Q is rotated so as to be in a predetermined posture, the positional deviation of the needle 18 can be corrected by eccentricity correction.

Further, according to the charged particle beam device 10 according to the embodiment of the present invention, the computer 22 detects the relative position of the needle 18 with respect to the reference mark Ref when the sample piece Q is formed. The relative positional relationship of 18 can be grasped. The computer 22 drives the needle 18 appropriately (that is, without contacting other members, instruments, etc.) in the three-dimensional space by sequentially detecting the relative position of the needle 18 with respect to the position of the sample piece Q. be able to.
Furthermore, the computer 22 can accurately grasp the position of the needle 18 in the three-dimensional space by using the image data acquired from at least two different directions. Thus, the computer 22 can properly drive the needle 18 three-dimensionally.

  Furthermore, since the computer 22 previously uses the image data actually generated immediately before moving the needle 18 as a template (reference image data), template matching with high matching accuracy can be performed regardless of the shape of the needle 18 it can. Thus, the computer 22 can accurately grasp the position of the needle 18 in the three-dimensional space, and can properly drive the needle 18 in the three-dimensional space. Furthermore, since the computer 22 retracts the stage 12 and acquires each image data or absorption current image data in the absence of a complicated structure in the background of the needle 18, the influence of the background (background) is eliminated. It is possible to obtain a template that allows the shape of the needle 18 to be clearly understood.

  Furthermore, since the computer 22 connects the needle 18 and the sample piece Q without contacting them by the deposition film, the needle 18 is cut when the needle 18 and the sample piece Q are separated in a later step. Can be prevented. Furthermore, even when vibration of the needle 18 occurs, transmission of the vibration to the sample piece Q can be suppressed. Furthermore, even in the case where movement of the sample piece Q occurs due to the creep phenomenon of the sample S, generation of excessive strain between the needle 18 and the sample piece Q can be suppressed.

Furthermore, when the connection between the sample S and the sample piece Q is cut by the sputtering process by focused ion beam irradiation, the computer 22 determines whether the cutting is actually completed or not between the sample S and the needle 18. This can be confirmed by detecting the presence or absence of conduction.
Furthermore, since the computer 22 informs that the actual separation of the sample S and the sample piece Q is not completed, the execution of a series of steps automatically performed following this step may be interrupted. Even if this is the case, the cause of the interruption can be easily recognized by the operator of the apparatus.
Furthermore, when the conduction between the sample S and the needle 18 is detected, the computer 22 determines that the disconnection between the sample S and the sample piece Q is not actually completed, and In preparation for the subsequent drive such as withdrawal of the needle 18, the connection between the sample piece Q and the needle 18 is cut off. As a result, the computer 22 can prevent occurrence of a defect such as displacement of the sample S or damage to the needle 18 caused by driving of the needle 18.
Furthermore, the computer 22 detects the presence or absence of conduction between the sample piece Q and the needle 18, and drives the needle 18 after confirming that the disconnection between the sample S and the sample piece Q is actually completed. can do. As a result, the computer 22 can prevent occurrence of a defect such as displacement of the sample piece Q or damage to the needle 18 or the sample piece Q caused by driving of the needle 18.

  Furthermore, since the computer 22 uses actual image data as a template for the needle 18 to which the sample piece Q is connected, template matching with high matching accuracy is achieved regardless of the shape of the needle 18 connected to the sample piece Q. Can do. Thereby, the computer 22 can accurately grasp the position in the three-dimensional space of the needle 18 connected to the sample piece Q, and can properly drive the needle 18 and the sample piece Q in the three-dimensional space .

Furthermore, since the computer 22 extracts the positions of the plurality of columnar portions 34 constituting the sample table 33 using the template of the known sample table 33, it is determined whether the sample table 33 in the appropriate state exists or not. Prior to driving of the needle 18, confirmation can be made.
Furthermore, the computer 22 indirectly indicates that the needle 18 and the sample piece Q have reached the vicinity of the movement target position according to the change in absorption current before and after the needle 18 to which the sample piece Q is connected reaches the irradiation area. Can be accurately grasped. As a result, the computer 22 can stop the needle 18 and the sample piece Q without contacting other members such as the sample table 33 present at the movement target position, and a failure such as damage due to the contact occurs. Can be prevented.

Furthermore, since the computer 22 detects the presence or absence of conduction between the sample stage 33 and the needle 18 when the sample piece Q and the sample stage 33 are connected by the deposition film, the connection of the sample piece Q and the sample stage 33 is actually performed. Can accurately check whether or not
Further, the computer 22 detects the presence or absence of conduction between the sample stage 33 and the needle 18, and confirms that the connection between the sample stage 33 and the sample piece Q is actually completed. The connection with the needle 18 can be disconnected.

  Furthermore, the computer 22 can easily recognize the needle 18 by pattern matching, for example, when driving the needle 18 in a three-dimensional space by matching the actual shape of the needle 18 with the ideal reference shape. The position of the needle 18 in the three-dimensional space can be accurately detected.

Hereinafter, a first modified example of the above-described embodiment will be described.
In the embodiment described above, the needle 18 is not subjected to focused ion beam irradiation and is not shrunk or deformed, so the needle tip is not shaped or the needle 18 is not replaced. However, the computer 22 repeatedly executes the operation of automatic sampling. Removal of the carbon deposition film at the tip of the needle (referred to as cleaning of the needle 18 in this specification) may be performed at appropriate timing in the case where the number of repetitions is predetermined, for example . For example, cleaning is performed once every ten automatic samplings. Hereinafter, the determination method for cleaning the needle 18 will be described.

As a first method, a secondary electron image of the needle tip by electron beam irradiation is first acquired immediately before performing automatic sampling or periodically at a position without a complicated structure in the background. The secondary electron image can be clearly identified up to the carbon deposition film attached to the tip of the needle. The secondary electron image is stored in the computer 22.
Next, without moving the needle 18, an absorption current image of the needle 18 is acquired with the same field of view and the same observation magnification. The carbon deposition film can be confirmed in the absorption current image, and only the shape of the needle 18 can be recognized. This absorbed current image is also stored in the computer 22.
Here, the needle 18 is eliminated by subtracting the absorption current image from the secondary electron image, and the shape of the carbon deposition film protruding from the tip of the needle becomes apparent. When the area of the revealed carbon deposition film exceeds the predetermined area, the carbon deposition film is cleaned by focused ion beam irradiation so that the needle 18 is not cut. At this time, the carbon deposition film may remain as long as it has the above-mentioned predetermined area or less.

Next, as a second method, when the length of the carbon deposition film in the axial direction (longitudinal direction) of the needle 18 does not exceed the predetermined length, not the area of the carbon deposition film that has been made apparent May be determined as the cleaning time of the needle 18.
Further, as a third method, the coordinates on the image of the tip of the carbon deposition film in the secondary electron image stored in the above computer are recorded. Further, the coordinates on the image of the needle tip in the absorption current image stored in the computer 22 described above are stored. Here, the length of the carbon deposition film can be calculated from the tip coordinates of the carbon deposition film and the tip coordinates of the needle 18. When this length exceeds a predetermined value, it may be determined as the cleaning time of the needle 18.
Furthermore, as a fourth method, a template of needle tip shape including a carbon deposition film which seems to be optimum is prepared in advance, and sampling is repeated several times to overlap the secondary electron image of the needle tip. In addition, the portion which has been out of this template may be deleted by the focused ion beam.
Furthermore, as a fifth method, the cleaning time of the needle 18 is not when the thickness of the carbon deposition film at the tip of the needle 18 exceeds a predetermined thickness, not the area of the carbon deposition film that has been realized. It may be determined that
These cleaning methods may be performed, for example, immediately after step S280 in FIG.
The cleaning is carried out by the above-mentioned method, etc., but if the shape does not become predetermined by cleaning, if the cleaning can not be performed within a predetermined time, or the needle 18 is replaced every predetermined period It is also good. Even after the needle 18 is replaced, the process flow described above is not changed, and steps such as preserving the needle tip shape are performed as described above.

Hereinafter, a second modification of the above-described embodiment will be described.
Although the needle drive mechanism 19 is provided integrally with the stage 12 in the embodiment described above, the present invention is not limited thereto. The needle drive mechanism 19 may be provided independently of the stage 12. The needle drive mechanism 19 may be provided independently of, for example, tilting drive of the stage 12 by being fixed to the sample chamber 11 or the like.

Hereinafter, a third modification of the above-described embodiment will be described.
In the embodiment described above, the focused ion beam irradiation optical system 14 has the optical axis in the vertical direction, and the electron beam irradiation optical system 15 has the optical axis inclined in the direction to the vertical, but the present invention is not limited thereto. For example, the focused ion beam irradiation optical system 14 may set the optical axis in a direction inclined with respect to the vertical, and the electron beam irradiation optical system 15 may set the optical axis in the vertical direction.

Hereinafter, a fourth modification of the above-described embodiment will be described.
In the embodiment described above, although the charged particle beam irradiation optical system is configured to be able to irradiate two types of beams of the focused ion beam irradiation optical system 14 and the electron beam irradiation optical system 15, it is not limited thereto. For example, the configuration may be such that only the focused ion beam irradiation optical system 14 installed in the vertical direction does not have the electron beam irradiation optical system 15. Ions used in this case are ions of negative charge.
In the above-described embodiment, the electron beam and the focused ion beam are irradiated from different directions to the sample piece holder P, the needle 18, the sample piece Q, etc. in the above-described several steps, and the image by the electron beam and the focused ion Although the image by the beam was acquired and the position and positional relationship of the sample piece holder P, the needle 18, the sample piece Q, etc. were grasped, only the focused ion beam irradiation optical system 14 is mounted and only the focused ion beam image You may do it. Hereinafter, this embodiment will be described.
For example, in the case where the positional relationship between the sample piece holder P and the sample piece Q is grasped in step S220, the inclination of the stage 12 is horizontal and when it is inclined from the horizontal at a certain inclination angle. The image by the focused ion beam is acquired so that both the sample piece holder P and the sample piece Q are in the same field of view, and the three-dimensional positional relationship between the sample piece holder P and the sample piece Q can be grasped from these two images. As described above, since the needle drive mechanism 19 can be moved horizontally and vertically integrally with the stage 12, the relative positional relationship between the sample piece holder P and the sample piece Q is maintained regardless of whether the stage 12 is horizontal or inclined. . Therefore, even if only one charged ion beam irradiation optical system is used as the charged particle beam irradiation optical system, the sample piece Q can be observed and processed from two different directions.
Similarly, registration of image data of the sample piece holder P in step S020, recognition of the needle position in step S040, acquisition of a template (reference image) of the needle in step S050, reference of the needle 18 to which the sample piece Q is connected in step S170. The same may be applied to acquisition of an image, recognition of the attachment position of the sample piece Q in step S210, and stop of needle movement in step S250.
Further, also in the connection between the sample piece Q and the sample piece holder P in step S250, a deposition film is formed and connected from the upper end surfaces of the sample piece holder P and the sample piece Q in the horizontal state with the stage 12 The stage 12 can be inclined to form a deposition film from different directions, and a reliable connection can be made.

Hereinafter, a fifth modification of the above-described embodiment will be described.
In the above-described embodiment, the computer 22 automatically executes the series of processes from step S010 to step S280 as the operation of automatic sampling, but is not limited to this. The computer 22 may switch to execute at least one of the processes in step S010 to step S280 by manual operation of the operator.
In addition, when performing the operation of automatic sampling of a plurality of sample pieces Q, the computer 22 immediately before any one of a plurality of sample pieces Q immediately before extraction is formed on the sample S The operation of automatic sampling may be performed on the sample piece Q. In addition, after all of the plurality of sample pieces Q immediately before extraction are formed on the sample S, the computer 22 executes the automatic sampling operation continuously for each of the plurality of sample pieces Q immediately before extraction. Good.

Hereinafter, a sixth modified example of the above-described embodiment will be described.
In the above-described embodiment, the computer 22 extracts the position of the columnar portion 34 using a template of the known columnar portion 34. However, as the template, a reference pattern created in advance from image data of the actual columnar portion 34 May be used. Further, the computer 22 may use a pattern created at the time of execution of automatic processing for forming the sample table 33 as a template.
Further, in the embodiment described above, the computer 22 grasps the relative relationship of the position of the needle 18 with respect to the position of the sample table 33 using the reference mark Ref formed by the irradiation of the charged particle beam at the time of forming the columnar portion 34 May be The computer 22 drives the needle 18 appropriately (that is, without contacting other members, instruments, etc.) in the three-dimensional space by sequentially detecting the relative position of the needle 18 to the position of the sample table 33. be able to.

Hereinafter, a seventh modified example of the embodiment described above will be described.
In the embodiment described above, the process from step S220 to step S250 of connecting the sample piece Q to the sample piece holder P may be performed as follows. That is, the positional relationship (distance between each other) is obtained from the columnar portion 34 of the sample piece holder P and the sample piece Q and the image, and the needle drive mechanism 19 is operated so that the distance becomes the target value. is there.
In step S220, the computer 22 recognizes their positional relationship from the secondary particle image data or absorption current image data of the needle 18, the sample piece Q, and the columnar portion 34 by the electron beam and the focused ion beam. 27 and 28 are diagrams schematically showing the positional relationship between the columnar part 34 and the sample piece Q, and FIG. 27 is based on an image obtained by focused ion beam irradiation and FIG. 28 is based on an electron beam irradiation. There is. The relative positional relationship between the columnar part 34 and the sample piece Q is measured from these figures. As shown in FIG. 27, orthogonal triaxial coordinates (coordinates different from the three-axis coordinates of the stage 12) are defined with one corner of the columnar portion 34 as the origin 34a, and the distance between the origin 34a of the columnar portion 34 and the reference point Qc of the sample piece Q The distances DX and DY are measured from FIG.
On the other hand, the distance DZ can be obtained from FIG. However, assuming that the electron beam optical axis and the focused ion beam axis (vertical) are inclined by an angle θ (where 0 ° <θ ≦ 90 °), the columnar portion 34 and the sample piece Q in the Z-axis direction The actual distance is DZ / sin θ.
Next, the movement stop position relationship of the sample piece Q with respect to the columnar part 34 will be described with reference to FIGS.
The upper end surface 34b of the columnar portion 34 and the upper end surface Qb of the sample piece Q are in the same plane, and the side surface of the columnar portion 34 and the cross section of the sample piece Q are in the same plane, and between the columnar portion 34 and the sample piece Q Have an air gap of about 0.5 μm. That is, by operating the needle drive mechanism 19 so that DX = 0, DY = 0.5 μm, and DZ = 0, the sample piece Q can reach the target stop position.
In the configuration in which the electron beam optical axis and the focused ion beam optical axis are in a vertical (θ = 90 °) relationship, the distance DZ between the columnar portion 34 measured by the electron beam and the sample piece Q is a measured value that is both actual. The distance of

Hereinafter, an eighth modified example of the above-described embodiment will be described.
In step S230 in the above-described embodiment, the needle drive mechanism 19 is operated so that the distance between the columnar portion 34 obtained by measuring the needle 18 from the image and the sample piece Q becomes a target value.
In the embodiment described above, the process from step S220 to step S250 of connecting the sample piece Q to the sample piece holder P may be performed as follows. That is, the attachment position of the sample piece Q to the columnar part 34 of the sample piece holder P is determined in advance as a template, and the image of the sample piece Q is pattern-matched at that position to operate the needle drive mechanism 19. .
The template which shows the movement stop position relationship of the sample piece Q with respect to the columnar part 34 is demonstrated. The upper end surface 34b of the columnar portion 34 and the upper end surface Qb of the sample piece Q are in the same plane, and the side surface of the columnar portion 34 and the cross section of the sample piece Q are in the same plane, and between the columnar portion 34 and the sample piece Q There is an air gap of about 0.5 μm in Such a template may create a line drawing by extracting an outline (edge) portion from the secondary particle image and absorption current image data of the needle 18 to which the actual sample piece holder P and the sample piece Q are fixed. You may create as a line drawing from a design drawing and a CAD drawing.
The sample piece Q is displayed on the template by superimposing the columnar part 34 of the created template on the image of the columnar part 34 by the electron beam and the focused ion beam in real time and instructing the needle drive mechanism 19 to operate. It moves toward the stop position of the sample piece Q (steps S230 and S240). After confirming that the image by the electron beam and the focused ion beam in real time has overlapped with the stop position of the sample piece Q on the predetermined template, stop processing of the needle drive mechanism 19 is performed (step S250). In this manner, the sample piece Q can be accurately moved to the predetermined stop position relationship with respect to the columnar section 34.

Further, as another mode of the process from step S230 to step S250 described above, it may be as follows. The line drawing of the edge portion extracted from the secondary particle image and the absorption current image data is limited to only the portion necessary for the alignment of both. FIG. 29 shows an example, in which the columnar part 34, the sample piece Q, the outline (indicated by dotted lines), and the extracted edge (indicated by thick solid lines) are shown. The notable edges of the columnar portion 34 and the sample piece Q are the facing edges 34s and Qs and portions of the edges 34t and Qt of the upper end surfaces 34b and Qb of the columnar portion 34 and the sample piece Q, respectively. For the columnar part 34, the line segments 35a and 35b, and for the sample piece Q, the line segments 36a and 36b, each line segment is sufficient for part of each edge. For example, a T-shaped template is used from such line segments. The corresponding template is moved by operating the stage drive mechanism 13 and the needle drive mechanism 19. These templates 35a, 35b and 36a, 36b can grasp the distance between the columnar part 34 and the sample piece Q, the degree of parallelism, and the height of the two from the mutual positional relationship, and both can be easily aligned. FIG. 30 shows the positional relationship of the template corresponding to the predetermined positional relationship between the columnar part 34 and the sample piece Q. The line segments 35a and 36a are parallel to a predetermined interval, and the line segments 35b and 36b are on a straight line. It is in the relative position. By operating at least one of the stage drive mechanism 13 and the needle drive mechanism 19, the drive mechanism being operated is stopped when the template is in the positional relationship of FIG.
Thus, after confirming that the sample piece Q is approaching the predetermined columnar portion 34, it can be used for precise alignment.

Next, as a ninth modification of the above-described embodiment, another embodiment at steps S220 to S250 described above will be described.
In step S230 in the above-described embodiment, the needle 18 is moved. If the sample piece Q after step S230 is in a positional relationship largely deviated from the target position, the following operation may be performed.
In step S220, it is desirable that the position of the sample piece Q before movement is in the region of Y> 0 and Z> 0 in the orthogonal triaxial coordinate system which is the origin of each columnar portion 34. This is because the risk of collision of the sample piece Q against the columnar part 34 during movement of the needle 18 is extremely small, and the X, Y, and Z drive parts of the needle drive mechanism 19 are simultaneously operated to safely and quickly. The destination position can be reached. On the other hand, when the position of the sample piece Q before movement is in the region of Y <0, the columnar portion 34 is moved when the X, Y, and Z drive units of the needle drive mechanism 19 are simultaneously operated with the sample piece Q directed to the stop position. There is a high risk of collision. For this reason, when the sample piece Q is in the region of Y <0 in step S220, the needle 18 is caused to reach the target position along a path avoiding the columnar portion 34. Specifically, first, only the Y axis of the needle drive mechanism 19 is driven to move the sample piece Q to a region of Y> 0, and the sample piece Q is moved to a predetermined position (for example, twice the width of the columnar portion 34 being focused, It is moved to a position such as three times, five times, ten times, etc., and then moved to the final stop position by simultaneous operation of the X, Y and Z driving units. By such a step, the sample piece Q can be moved safely and quickly without colliding with the columnar part 34. In addition, if the X coordinate of the sample piece Q and the columnar part 34 is the same and the Z coordinate is lower than the upper end of the columnar part (Z <0), the electron beam image or / and the focused ion beam image First, move the sample piece Q to the Z> 0 region (for example, Z = 2 μm, 3 μm, 5 μm, 10 μm position), and then move it to the predetermined position in the Y> 0 region. , And then move towards the final stop position by simultaneous operation of the X, Y, Z drives. By moving in this manner, the sample piece Q can reach the target position without collision between the sample piece Q and the columnar part 34.

Next, a tenth modification of the above-described embodiment will be described.
In the charged particle beam device 10 according to the present invention, the needle 18 can be pivoted by a needle drive mechanism 19. In the above embodiment, the most basic sampling procedure without the axial rotation of the needle 18 was described except for the needle trimming, but in the twelfth modification, an embodiment using the axial rotation of the needle 18 will be described. .
The computer 22 can rotate the needle 18 by operating the needle drive mechanism 19 and can execute attitude control of the sample piece Q as needed. The computer 22 rotates the sample piece Q taken out of the sample S, and fixes the sample piece Q in a state in which the top and bottom or the left and right of the sample piece Q are changed to the sample piece holder P. The computer 22 fixes the sample piece Q so that the surface of the original sample S in the sample piece Q is in a vertical relationship or in a parallel relationship with the end face of the columnar part 34. Thereby, the computer 22 secures, for example, the posture of the sample piece Q suitable for finish processing to be performed later, and also has a curtain effect (processed stripe pattern generated in the focused ion beam irradiation direction) generated at the time of exfoliation finish processing of the sample piece Q. When the sample piece after completion is observed with an electron microscope, the influence of misinterpretation etc. can be reduced. The computer 22 corrects the rotation so that the sample piece Q does not deviate from the real field of view by performing eccentricity correction when the needle 18 is rotated.

Furthermore, the computer 22 performs shaping of the sample piece Q by focused ion beam irradiation as needed. In particular, it is desirable that the shaped sample piece Q be shaped such that the end face in contact with the columnar portion 34 is substantially parallel to the end face of the columnar portion 34. The computer 22 performs shaping processing such as cutting a part of the sample piece Q before creating a template described later. The computer 22 sets the processing position of this shaping processing on the basis of the distance from the needle 18. Thereby, the computer 22 facilitates edge extraction from the template described later, and secures the shape of the sample piece Q suitable for finishing to be performed later.
Subsequent to step S150 described above, in this posture control, first, the computer 22 drives the needle 18 by the needle drive mechanism 19 so that the posture of the sample piece Q becomes a predetermined posture, an angle corresponding to the posture control mode The needle 18 is rotated by a minute. Here, the posture control mode is a mode in which the sample piece Q is controlled to a predetermined posture, the needle 18 is approached to the sample piece Q at a predetermined angle, and the needle 18 to which the sample piece Q is connected is set to a predetermined angle The attitude of the sample piece Q is controlled by rotating to. The computer 22 performs eccentricity correction when rotating the needle 18. FIGS. 31 to 36 illustrate this state, and illustrate the state of the needle 18 to which the sample piece Q is connected in each of a plurality of (for example, three) different approach modes.

31 and 32 show the needle with the sample piece Q connected in the image data obtained by the focused ion beam of the charged particle beam device 10 according to the embodiment of the present invention in the approach mode at the rotation angle of 0 ° of the needle 18 FIG. 31 is a view showing a state 18 (FIG. 31) and a state (FIG. 32) of the needle 18 to which the sample piece Q is connected in the image data obtained by the electron beam. The computer 22 sets an attitude state suitable for transferring the sample piece Q to the sample piece holder P without rotating the needle 18 in the approach mode in which the rotation angle of the needle 18 is 0 °.
33 and 34 show a needle connected with a sample piece Q in the image data obtained by the focused ion beam of the charged particle beam device 10 according to the embodiment of the present invention in the approach mode at a rotation angle of 90 ° of the needle 18 FIG. 33 is a view showing a state in which 18 is rotated by 90 ° (FIG. 33) and a state in which the needle 18 to which the sample piece Q is connected in image data obtained by the electron beam is rotated by 90 ° (FIG. 34). The computer 22 sets an attitude state suitable for transferring the sample piece Q to the sample piece holder P while the needle 18 is rotated by 90 ° in the approach mode at a rotation angle of 90 ° of the needle 18 There is.
35 and 36 show a needle connected with a sample piece Q in the image data obtained by the focused ion beam of the charged particle beam device 10 according to the embodiment of the present invention in the approach mode with the rotation angle 180 of the needle 18 FIG. 35 is a view showing a state in which 18 is rotated by 180 ° (FIG. 35) and a state in which a needle 18 to which a sample piece Q in image data obtained by an electron beam is connected is rotated by 180 ° (FIG. 36). In the approach mode in which the rotation angle of the needle 18 is 180 °, the computer 22 sets the posture state suitable for transferring the sample piece Q to the sample piece holder P while rotating the needle 18 by 180 °. There is.
The relative connection posture between the needle 18 and the sample piece Q is set to a connection posture suitable for each approach mode when connecting the needle 18 to the sample piece Q in the sample piece pickup step described above in advance. .

Hereinafter, other embodiments will be described.
(A1) The charged particle beam apparatus
A charged particle beam apparatus for automatically producing a sample piece from a sample, comprising:
at least,
A plurality of charged particle beam irradiation optical systems (beam irradiation optical systems) for irradiating charged particle beams;
A sample stage on which the sample is placed and moved;
Sample piece transfer means for conveying the sample piece, having a needle connected to the sample piece to be separated and extracted from the sample;
A holder fixing base for holding a sample piece holder having a columnar portion to which the sample piece is transferred;
A gas supply unit for supplying a gas for forming a deposition film by irradiation of the charged particle beam;
The electrical characteristics between the sample piece and the columnar portion are measured, and the deposition film is made to have a predetermined electrical characteristic value across the sample piece and the columnar portion with the air gap provided in the columnar portion and made to stand still. A computer for controlling at least the charged particle beam irradiation optical system, the sample piece transfer means, and the gas supply unit so as to form them until reaching;
Equipped with

(A2) The charged particle beam device
A charged particle beam apparatus for automatically producing a sample piece from a sample, comprising:
at least,
A plurality of charged particle beam irradiation optical systems (beam irradiation optical systems) for irradiating charged particle beams;
A sample stage on which the sample is placed and moved;
Sample piece transfer means for conveying the sample piece, having a needle connected to the sample piece to be separated and extracted from the sample;
A holder fixing base for holding a sample piece holder having a columnar portion to which the sample piece is transferred;
A gas supply unit for supplying a gas for forming a deposition film by irradiation of the charged particle beam;
The electrical characteristics between the sample piece and the columnar part are measured, and a void is provided in the columnar part for a predetermined time, and the deposition film is formed across the sample part and the columnar part which are made to stand still. As described above, at least the charged particle beam irradiation optical system, the sample piece transfer means, and a computer for controlling the gas supply unit;
Equipped with

(A3) The charged particle beam apparatus
A charged particle beam apparatus for automatically producing a sample piece from a sample, comprising:
at least,
A focused ion beam irradiation optical system (beam irradiation optical system) for irradiating a focused ion beam;
A sample stage on which the sample is placed and moved;
Sample piece transfer means for conveying the sample piece, having a needle connected to the sample piece to be separated and extracted from the sample;
A holder fixing base for holding a sample piece holder having a columnar portion to which the sample piece is transferred;
A gas supply unit for supplying a gas that forms a deposition film by the irradiation of the focused ion beam;
The electrical characteristics between the sample piece and the columnar portion are measured, and the deposition film is set to a predetermined electrical characteristic value across the sample piece and the columnar portion with the air gap provided in the columnar portion and kept stationary. A computer for controlling at least the focused ion beam irradiation optical system, the sample piece transfer means, and the gas supply unit so as to form them until reaching;
Equipped with

(A4) The charged particle beam apparatus
A charged particle beam apparatus for automatically producing a sample piece from a sample, comprising:
at least,
A focused ion beam irradiation optical system (beam irradiation optical system) for irradiating a focused ion beam;
A sample stage on which the sample is placed and moved;
Sample piece transfer means for conveying the sample piece, having a needle connected to the sample piece to be separated and extracted from the sample;
A holder fixing base for holding a sample piece holder having a columnar portion to which the sample piece is transferred;
A gas supply unit for supplying a gas that forms a deposition film by the irradiation of the focused ion beam;
The electrical characteristics between the sample piece and the columnar part are measured, and a void is provided in the columnar part for a predetermined time, and the deposition film is formed across the sample part and the columnar part which are made to stand still. As described above, at least the focused ion beam irradiation optical system, the sample piece transfer means, and a computer for controlling the gas supply unit;
Equipped with

(A5) In the charged particle beam device according to (a1) or (a2),
The charged particle beam is
It contains at least a focused ion beam and an electron beam.

(A6) In the charged particle beam apparatus according to any one of (a1) to (a4),
The electrical property is at least one of an electrical resistance, a current, and a potential.

(A7) In the charged particle beam apparatus according to any one of (a1) to (a6),
When the electrical characteristic between the sample piece and the columnar portion does not satisfy a predetermined electrical characteristic value within a predetermined formation time of the deposition film, the computer determines that the columnar portion and the specimen piece The sample piece is moved such that the air gap is further reduced, and at least the beam irradiation optical system and the sample piece transfer are arranged so as to form the deposition film straddling the stationary sample piece and the columnar portion. Means for controlling the gas supply unit.

(A8) In the charged particle beam apparatus according to any one of (a1) to (a6),
The computer is configured to form the deposition film when the electrical characteristics between the sample piece and the columnar portion satisfy a predetermined electrical characteristic value within a predetermined formation time of the deposition film. At least the beam irradiation optical system and the gas supply unit are controlled to stop.

(A9) In the charged particle beam apparatus according to (a1) or (a3),
The air gap is 1 μm or less.

(A10) In the charged particle beam apparatus according to (a9),
The air gap is 100 nm or more and 200 nm or less.

(B1) The charged particle beam apparatus
A charged particle beam apparatus for automatically producing a sample piece from a sample, comprising:
A charged particle beam irradiation optical system for irradiating a charged particle beam;
A sample stage on which the sample is placed and moved;
Sample piece transferring means for holding and transporting the sample piece separated and extracted from the sample;
A holder fixing base for holding a sample piece holder having a columnar portion to which the sample piece is transferred;
Based on the image of the columnar part obtained by the irradiation of the charged particle beam, a template of the columnar part is created, and the sample piece is selected based on positional information obtained by template matching using the template. And a computer for controlling the charged particle beam irradiation optical system and the sample piece transfer means so as to be transferred to a columnar part.

(B2) In the charged particle beam apparatus described in (b1),
The sample piece holder is provided with a plurality of the columnar parts spaced apart, and the computer creates a template of each of the plurality of columnar parts based on an image of each of the plurality of the columnar parts. .

(B3) In the charged particle beam apparatus described in (b2) above,
The computer determines whether or not the shape of the columnar portion to be targeted among the plurality of columnar portions matches a predetermined shape registered in advance by template matching using the template of each of the plurality of columnar portions. When the determination processing is performed and the shape of the target columnar portion does not match the predetermined shape, the target columnar portion is newly switched to another target columnar portion to perform the determination processing. When the shape of the target columnar portion matches the predetermined shape, the charged particle beam irradiation optical system and the movement of the sample piece transfer means or the sample stage are controlled so as to transfer the sample piece to the columnar portion Do.

(B4) In the charged particle beam apparatus according to any one of (b2) and (b3) above,
When the computer controls the movement of the sample stage such that the target columnar portion among the plurality of columnar portions is disposed at a predetermined position, the target columnar portion is disposed at the predetermined position. If not, initialize the position of the sample stage.

(B5) In the charged particle beam apparatus described in (b4) above,
The computer controls the movement of the sample stage so as to position the target columnar part of the plurality of columnar parts at a predetermined position, the columnar part to be the target after the movement of the sample stage Shape determination processing to determine whether or not there is a problem in the shape of the column, and if there is a problem in the shape of the target column portion, the target column portion is newly switched to another target column portion In addition, the movement of the sample stage is controlled so that the columnar portion is disposed at the predetermined position, and the shape determination process is performed.

(B6) In the charged particle beam device according to any one of (b1) to (b5),
The computer creates a template of the columnar part prior to separating and extracting the sample piece from the sample.

(B7) In the charged particle beam apparatus described in (b3) above,
The computer stores, as the template, an image of each of the plurality of columnar parts, edge information extracted from the image, or design information of each of the plurality of columnar parts, and the template matching is performed using the template. Based on the score, it is determined whether the shape of the target columnar part matches the predetermined shape.

(B8) In the charged particle beam device according to any one of (b1) to (b7) above,
The computer stores an image acquired by the irradiation of the charged particle beam to the columnar part to which the sample piece is transferred, and position information of the columnar part to which the sample piece is transferred.

(C1) The charged particle beam device
A charged particle beam apparatus for automatically producing a sample piece from a sample, comprising:
A charged particle beam irradiation optical system for irradiating a charged particle beam;
A sample stage on which the sample is placed and moved;
Sample piece transferring means for holding and transporting the sample piece separated and extracted from the sample;
A holder fixing base for holding a sample piece holder having a columnar portion to which the sample piece is transferred;
A gas supply unit for supplying a gas for forming a deposition film by irradiation of the charged particle beam;
The charged particle beam irradiation optical system and the sample piece transfer means for irradiating the charged particle beam onto the deposition film attached to the sample piece transfer means after separating the sample piece transfer means from the sample piece And a computer for controlling the

(C2) In the charged particle beam apparatus described in (c1) above,
The sample piece transfer means holds and transports the sample piece separated and extracted from the sample repeatedly a plurality of times.

(C3) In the charged particle beam device according to (c1) or (c2),
The computer is
The charged particle beam is applied to the deposition film attached to the sample piece transfer means by repeating the sample piece transfer means at a predetermined timing including at least timing every time the sample piece is separated from the sample piece The particle beam irradiation optical system and the sample piece transfer means are controlled.

(C4) In the charged particle beam device according to any one of (c1) to (c3),
The computer controls the movement of the sample piece transfer means so that the sample piece transfer means separated from the sample piece is disposed at a predetermined position when the sample piece transfer means is not disposed at the predetermined position. The position of the sample piece transfer means is initialized.

(C5) In the charged particle beam apparatus described in (c4) above,
Even if the computer controls the movement of the sample piece transfer means after initializing the position of the sample piece transfer means, if the sample piece transfer means is not disposed at the predetermined position, control of the sample piece transfer means is performed. Stop.

(C6) In the charged particle beam device according to any one of (c1) to (c5),
The computer creates a template of the sample piece transfer means based on the image acquired by the irradiation of the charged particle beam to the sample piece transfer means before connecting to the sample piece, and a template using the template The charged particle beam irradiation optical system and the sample piece transfer means are controlled to irradiate the charged particle beam onto the deposition film attached to the sample piece transfer means based on the contour information obtained by matching. .

(C7) In the charged particle beam apparatus described in (c6) above,
A display device is provided to display the contour information.

(C8) In the charged particle beam apparatus according to any one of (c1) to (c7) above,
The computer performs eccentricity correction when rotating the sample piece transfer means about a central axis so that the sample piece transfer means is in a predetermined posture.

(C9) In the charged particle beam device according to any one of (c1) to (c8),
The sample piece transfer means includes a needle or tweezers connected to the sample piece.

In the embodiment described above, the computer 22 also includes a software function unit or a hardware function unit such as an LSI.
Further, in the embodiment described above, the needle 18 has been described as an example of a sharpened needle-like member, but the tip may have a flat-like shape or the like.

  The present invention is also applicable to the case where at least the sample piece Q to be extracted is made of carbon. The template according to the present invention and tip position coordinates can be used to move to a desired position. That is, in the state where the extracted sample piece Q is fixed to the tip of the needle 18, when transferring the sample piece holder P, the true needle obtained with the sample piece Q is obtained from the secondary electron image by charged particle beam irradiation. The sample piece Q has a predetermined gap in the sample piece holder P using the template of the needle 18 formed from the tip coordinates of the sample piece (tip coordinates of the sample piece) and the absorbed current image of the needle 18 with the sample piece Q It can be controlled to approach and stop.

  The present invention can also be applied to other devices. For example, a charged particle beam device that measures the electrical characteristics of a minute part by bringing a probe into contact, in particular, a device equipped with a metal probe in a sample chamber of a scanning electron microscope with an electron beam among charged particle beams In a charged particle beam apparatus that measures using a probe provided with a carbon nanotube at the tip of a tungsten probe in order to make contact with the conductive portion of a tungsten, a normal secondary electron image uses tungsten as a background such as a wiring pattern Probe tip can not be recognized. Therefore, the tungsten probe can be easily recognized by the absorption current image, but the tip of the carbon nanotube can be recognized, and the carbon nanotube can not be brought into contact with the important measurement point. Therefore, according to the present invention, by using the method of identifying the true tip coordinates of the needle 18 by the secondary electron image and creating the template by the absorbed current image, the probe with the carbon nanotube is moved to a specific measurement position. It can be made to come in contact with it.

  The sample piece Q produced by the charged particle beam apparatus 10 according to the present invention described above is introduced into another focused ion beam apparatus and carefully operated by the apparatus operator until the thinness appropriate for transmission electron microscope analysis, You may process it. As described above, by coordinating the charged particle beam device 10 according to the present invention and the focused ion beam device, a large number of sample pieces Q are fixed to the sample piece holder P unmanned at night, and the operator of the device It can be carefully made into ultrathin transmission electron microscopy samples. For this reason, compared with conventionally relied on the operation of the device operator with a single device, the physical and mental burden on the device operator is greatly reduced, as compared with the conventional device relied on the operation of the device operator with a single device. Efficiency is improved.

The above embodiments are presented as examples, and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and the gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof.
For example, in the charged particle beam device 10 according to the present invention, the needle 18 has been described as a means for extracting the sample piece Q. However, the present invention is not limited to this, and tweezers that operate finely may be used. By using the tweezers, the sample piece Q can be extracted without performing deposition, and there is no concern such as wear and tear on the tip. Even when the needle 18 is used, the connection with the sample piece Q is not limited to the deposition, and the needle 18 is brought into contact with the sample piece Q in a state where the electrostatic force is applied to the needle 18 The sample piece Q and the needle 18 may be connected.

  10: charged particle beam apparatus, 11: sample chamber, 12: stage (sample stage), 13: stage drive mechanism, 14: focused ion beam irradiation optical system (charged particle beam irradiation optical system), 15: electron beam irradiation optical system (Charged particle beam irradiation optical system), 16: detector, 17: gas supply unit, 18: needle, 19: needle drive mechanism, 20: absorption current detector, 21: display device, 22: computer, 23: input device 33: Sample stand, 34: Columnar portion, P: Sample piece holder, Q: Sample piece, R: Secondary charged particles, S: Sample

Claims (4)

A charged particle beam apparatus for automatically producing a sample piece from a sample, comprising:
A charged particle beam irradiation optical system for irradiating a charged particle beam;
A sample stage on which the sample is placed and moved;
Sample piece transferring means for holding and transporting the sample piece to be separated and extracted from the sample;
A holder fixing base for holding a sample piece holder to which the sample piece is transferred;
And a computer configured to perform position control on the object based on a template created on the basis of the image of the object acquired by the irradiation of the charged particle beam, and position information obtained from the image of the object. Huh,
The sample piece transfer means comprises a needle for holding and transporting the sample piece to be separated and extracted from the sample, and a needle drive mechanism for driving the needle.
The computer controls the needle drive mechanism to control the position of the needle, which is the object, with respect to the sample piece,
The computer is a template formed by the absorption current image obtained by irradiating the needle with the charged particle beam.
The needle drive mechanism is controlled to approach the sample piece using the tip coordinates of the needle acquired from the secondary electron image obtained by irradiating the charged particle beam to the needle.
Charged particle beam apparatus characterized in that. A charged particle beam apparatus for automatically producing a sample piece from a sample, comprising:
A charged particle beam irradiation optical system for irradiating a charged particle beam;
A sample stage on which the sample is placed and moved;
Sample piece transferring means for holding and transporting the sample piece to be separated and extracted from the sample;
A holder fixing base for holding a sample piece holder to which the sample piece is transferred;
The computer comprises: a template created on the basis of an image of an object acquired by the irradiation of the charged particle beam; and a computer for performing position control on the object based on position information obtained from the image of the object. ,
The sample piece transfer means comprises a needle for holding and transporting the sample piece to be separated and extracted from the sample, and a needle drive mechanism for driving the needle.
The computer controls the needle drive mechanism to control the position of the needle, which is the object, with respect to the sample piece,
A gas supply unit for irradiating a gas that forms a deposition film by the irradiation of the charged particle beam;
The computer sets the gap between the needle and the sample piece and brings the needle and the sample piece into contact with the deposition film after the gap is provided between the needle and the sample piece. and controlling the gas supply unit, the load electrostatic particle beam device you wherein a. The space between the needle on which the deposition film is formed and the sample piece is 1 μm or less.
The charged particle beam device according to claim 2 , characterized in that: The space between the needle on which the deposition film is formed and the sample piece is 100 nm or more and 400 nm or less.
The charged particle beam device according to claim 3 , characterized in that:

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