JP6497644B2 - Photoelectric conversion device and signal transmission device using the same - Google Patents

Description

  The present invention generally relates to a photoelectric conversion device and a signal transmission device using the photoelectric conversion device. More specifically, the present invention relates to a photoelectric conversion device including an optical element that performs photoelectric conversion on a mount substrate, and a signal transmission device using the photoelectric conversion device. .

  2. Description of the Related Art Conventionally, as a photoelectric conversion device, a device including a light emitting element that converts an electrical signal into an optical signal or a light receiving element that converts an optical signal into an electrical signal is provided as an optical element (for example, see Patent Document 1).

  In this photoelectric conversion device, an electrical contact portion (electric connector) is provided on the lower surface of a rigid mount substrate, and an optical coupling member (submount substrate) on which an optical element is mounted is provided on the upper surface of the mount substrate. Yes. The optical coupling member optically couples the optical element and the optical waveguide member (internal waveguide, external waveguide). Therefore, the optical element can perform photoelectric conversion between the optical waveguide member and the electrical contact portion.

  The photoelectric conversion device configured as described above is configured such that the electrical contact portion provided on the lower surface of the mounting substrate is fitted to the mating connector (electrical connector) provided on the wiring substrate from above. Mounted on the board.

JP 2009-260227 A

  In the above photoelectric conversion device, the electrical contact portion that fits in the thickness direction of the mount substrate with respect to the mating connector is provided on one surface (lower surface) of the mount substrate in the thickness direction. It is difficult to reduce the size (height dimension) of the electrical conversion device.

  Further, in the photoelectric conversion device, the optical waveguide member optically coupled to the optical element is held only by the optical coupling member. Therefore, when an external force is applied to, for example, a flexible optical waveguide member (external waveguide), the photoelectric conversion device has a bending radius at the base portion of the optical waveguide member that is lower than the allowable bending radius of the optical waveguide member, and the desired performance. You may not be able to get.

  The present invention has been made in view of the above reasons, and provides a photoelectric conversion device that can be reduced in height and is not easily affected by an external force acting on an optical waveguide member, and a signal transmission device using the photoelectric conversion device. The purpose is to do.

The photoelectric conversion apparatus according to the present invention includes a mount substrate, an electrical contact portion provided at one end of the mount substrate, and an electrical connection to the electrical contact portion, and an optical waveguide member and the electrical contact portion. An optical element that performs photoelectric conversion between the optical element, an optical coupling member that is provided on one surface of the mount substrate and optically couples the optical element and the optical waveguide member, and has elasticity and holds the optical waveguide member A holding member that is attached to the mount substrate so that the holding member is sandwiched between the holding member and the mount substrate, and the fixing member that fixes the holding member to the mount substrate. By being inserted into the connector in the insertion direction perpendicular to the thickness direction of the mount substrate, the connector is electrically connected and mechanically coupled. Made is which, the optical waveguide member, said the penetrations direction you perpendicular to the thickness direction of the mounting substrate is configured to be held by the holding member by penetrating the holding member, the holding The member is positioned with respect to both the mount substrate and the fixture .

  In this photoelectric conversion device, the holding member is in contact with at least one of the fixture and the mount substrate, so that the first member extends in the first direction orthogonal to the thickness direction of the mount substrate and orthogonal to the penetration direction. It is desirable to have the 1st control part which controls the movement of a holding member.

  In this photoelectric conversion device, the holding member is in contact with at least one of the fixture and the mount substrate, thereby restricting movement of the holding member in the second direction along the penetration direction. It is more desirable to have a part.

  Alternatively, in this photoelectric conversion device, a first recess is formed on a surface of the mount substrate facing the fixture, and a second recess is formed on the surface of the fixture facing the mount substrate. The holding member preferably has a first convex portion that fits into the first concave portion and a second convex portion that fits into the second concave portion.

  In this photoelectric conversion apparatus, it is more preferable that the fixture has conductivity and is fixed to the mount substrate so as to cover at least the optical element.

  In this photoelectric conversion device, the mount substrate includes a first region and a second region having a higher bending rigidity than the first region, and the optical coupling member is disposed in the second region, More preferably, the electrical contact portion is disposed in the first region.

  The signal transmission device of the present invention includes a first connector using the photoelectric conversion device, a second connector using the photoelectric conversion device, the optical element of the first connector, and the second connector. And an optical cable for optically coupling the optical element.

  In the present invention, the electrical contact portion provided at one end of the mount board is electrically connected to the mating connector by being inserted in the insertion direction perpendicular to the thickness direction of the mount board with respect to the mating connector. And configured to be mechanically coupled. Further, a holding member that has elasticity and is fixed to the mount substrate by a fixture is provided, and the optical waveguide member is held by the holding member by penetrating the holding member in a penetrating direction perpendicular to the thickness direction of the mount substrate. ing. Therefore, according to the present invention, there is an advantage that the photoelectric conversion device can be reduced in height as compared with the conventional configuration and is not easily affected by the external force acting on the optical waveguide member.

It is sectional drawing of the photoelectric conversion apparatus which concerns on Embodiment 1. FIG. 1 is a side view of a signal transmission device using the photoelectric conversion device according to Embodiment 1. FIG. 3A is a side view of the photoelectric conversion apparatus according to Embodiment 1, FIG. 3B is a plan view of the photoelectric conversion apparatus according to Embodiment 1, and FIG. 3C is a bottom view of the photoelectric conversion apparatus according to Embodiment 1. FIG. 1 is an exploded perspective view of a photoelectric conversion apparatus according to Embodiment 1. FIG. 5A is a cross-sectional view of the main part of the photoelectric conversion apparatus according to Embodiment 1, FIG. 5B is a perspective view of the main part of the photoelectric conversion apparatus according to Embodiment 1, and FIG. 5C is the photoelectric conversion apparatus according to Embodiment 1. It is a perspective view of this optical coupling member. 6A is a cross-sectional view of the mating connector of the connection device according to Embodiment 1 in an unlocked state, and FIG. 6B is a cross-sectional view of the mating connector of the connection device according to Embodiment 1 in a locked state. 7A is a cross-sectional view of a main part of a first modification of the first embodiment, and FIG. 7B is a cross-sectional view of a main part of a second modification of the first embodiment. FIG. 8A is a rear view of the first configuration example of the second embodiment, and FIG. 8B is an exploded perspective view of the first configuration example of the second embodiment. FIG. 9A is a rear view of the second configuration example of the second embodiment, and FIG. 9B is an exploded perspective view of the second configuration example of the second embodiment. 10A is a rear view of the third configuration example of the second embodiment, and FIG. 10B is an exploded perspective view of the third configuration example of the second embodiment. FIG. 11A is a rear view of the fourth configuration example of the second embodiment, and FIG. 10B is an exploded perspective view of the fourth configuration example of the second embodiment. 10 is a cross-sectional view of a first configuration example of Embodiment 3. FIG. 10 is a cross-sectional view of a main part of a second configuration example of Embodiment 3. FIG.

(Embodiment 1)
As shown in FIG. 1, the photoelectric conversion apparatus 1 of this embodiment includes a mount substrate 2, an electrical contact portion 3, an optical element 4, an optical coupling member 5, a holding member 400, and a fixture 300. I have.

  The electrical contact portion 3 is provided at one end portion of the mount substrate 2. The optical element 4 is electrically connected to the electrical contact portion 3 and performs photoelectric conversion between the optical waveguide member 6 and the electrical contact portion 3. The optical coupling member 5 is provided on one surface of the mount substrate 2 and optically couples the optical element 4 and the optical waveguide member 6.

  The holding member 400 has elasticity and is configured to hold the optical waveguide member 6. The fixture 300 is attached to the mount substrate 2 so as to sandwich the holding member 400 between itself and the mount substrate 2, and fixes the holding member 400 to the mount substrate 2.

  Here, the electrical contact portion 3 is electrically connected to the mating connector 9 and mechanically coupled to the mating connector 9 by being inserted in the insertion direction orthogonal to the thickness direction of the mount substrate 2. It is configured to be.

  The optical waveguide member 6 is configured to be held by the holding member 400 by penetrating the holding member 400 in a penetration direction perpendicular to the thickness direction of the mount substrate 2.

  The optical element 4 may be either a light emitting element that converts an electrical signal into an optical signal (photoelectric conversion) or a light receiving element that converts an optical signal into an electrical signal (photoelectric conversion). In addition, the term “orthogonal” here includes not only the state of intersecting exactly 90 degrees but also the state that can be regarded as substantially orthogonal, and the “insertion direction” is the thickness direction of the mount substrate 2. It may be slightly inclined with respect to the vertical plane. In the present embodiment, the “insertion direction” and the “penetration direction” are the same direction, but the present invention is not limited to this example, and the “insertion direction” and the “penetration direction” may be different directions.

  According to this configuration, the electrical contact portion 3 provided at one end of the mount substrate 2 is inserted in the insertion direction perpendicular to the thickness direction of the mount substrate 2 with respect to the counterpart connector 9, whereby the counterpart side The connector 9 is electrically connected and mechanically coupled. Therefore, the dimension (height dimension) of the photoelectric conversion device 1 in the thickness direction of the mount substrate 2 can be reduced as compared with the conventional photoelectric conversion device, and the photoelectric conversion device 1 can be reduced in height. There is an advantage that you can.

  Furthermore, according to this configuration, the fixture 300 is attached to the mount substrate 2 so that the holding member 400 is sandwiched between the fixture 300 and the mounting substrate 2, and fixes the holding member 400 to the mount substrate 2. The optical waveguide member 6 has elasticity, and is held by the holding member 400 by penetrating the holding member 400 in the penetrating direction perpendicular to the thickness direction of the mount substrate 2. That is, since the photoelectric conversion apparatus 1 holds the optical waveguide member 6 with the holding member 400 fixed to the mount substrate 2, even if an external force is applied to the optical waveguide member 6, the photoelectric conversion device 1 is guided by the elasticity of the holding member 400. The force acting on the wave member 6 can be reduced. Therefore, the photoelectric conversion apparatus 1 is configured such that even when an external force is applied to the flexible optical waveguide member 6, for example, the bending radius of the base portion of the optical waveguide member 6 is less than the allowable bending radius of the optical waveguide member 6. There is an advantage that it is difficult to be influenced by external force acting on 6.

<Configuration of signal transmission device>
In the present embodiment, as shown in FIG. 2, a case where the photoelectric conversion apparatus 1 is used for a signal transmission apparatus 100 that transmits signals between the first connector 101 and the second connector 102 will be described as an example. The signal transmission device 100 includes a first connector 101 using the photoelectric conversion device 1, a second connector 102 using the photoelectric conversion device 1, and an optical cable 103. The optical cable 103 is a cable (optical fiber cable) in which an optical fiber is covered (not shown), for example, and optically couples the optical element 4 of the first connector 101 and the optical element 4 of the second connector 102. To do. Here, although the optical cable 103 also serves as the optical waveguide member 6, the optical cable 103 and the optical waveguide member 6 may be provided separately and optically coupled.

  Here, the first connector 101 includes a light emitting element such as a semiconductor laser such as a VCSEL (Vertical Cavity Surface Emitting LASER) or a light emitting diode (LED) as the optical element 4. On the other hand, the second connector 102 includes a light receiving element such as a photodiode as the optical element 4. That is, the signal transmission device 100 converts an electrical signal into an optical signal with the first connector 101, transmits the optical signal to the second connector 102 via the optical cable 103, and converts the optical signal into an electrical signal with the second connector 102. Convert. As a result, the signal transmission device 100 transmits the signal input as the electrical signal to the electrical contact portion 3 of the first connector 101 to the second connector 102 using the optical signal, and the electrical contact portion of the second connector 102. 3 can be output as an electrical signal.

  The signal transmission device 100 can reduce the height of the first connector 101 and the second connector 102 by using the photoelectric conversion device 1 of the present embodiment for each of the first connector 101 and the second connector 102. There is an advantage that you can.

  Note that it is arbitrary which of the first connector 101 and the second connector 102 is a signal transmission source. For example, the first connector 101 is a light receiving element, and the second connector 102 is a light emitting element as the optical element 4, respectively. It may be provided. Moreover, both the light emitting element and the light receiving element may be provided as the optical element 4 in each of the first connector 101 and the second connector 102. In this case, the signal transmission device 100 is connected to the first connector 101 and the second connector 102. Bidirectional signal transmission between the two connectors 102 becomes possible. Furthermore, each of the first connector 101 and the second connector 102 may be provided with a plurality of light emitting elements or light receiving elements. In this case, the signal transmission device 100 can transmit multi-channel signals. .

<Configuration of photoelectric conversion device>
Hereinafter, the photoelectric conversion apparatus 1 of the present embodiment will be described in detail. The photoelectric conversion device 1 described below is merely an example of the present invention, and the present invention is not limited to the following embodiment, and the technical idea according to the present invention is not limited to this embodiment. As long as it does not deviate from the above, various changes can be made according to the design and the like.

  Hereinafter, a specific configuration of the photoelectric conversion apparatus 1 will be described by focusing on the photoelectric conversion apparatus 1 used as the first connector 101 in the signal transmission apparatus 100. Unless otherwise specified, the second connector 102 is described. The photoelectric conversion device 1 used as is also the same configuration.

  As shown in FIG. 1, the photoelectric conversion apparatus 1 according to the present embodiment includes a reinforcing member in addition to the mount substrate 2, the electrical contact portion 3, the optical element 4, the optical coupling member 5, the holding member 400, and the fixture 300. 7 and a signal processing circuit 8 are provided. Here, the optical waveguide member 6 will be described as being included in the constituent requirements of the photoelectric conversion device 1. However, the optical waveguide member 6 may not be included in the constituent requirements of the photoelectric conversion device 1, and in this case, the photoelectric conversion device 1 is used in a state of being connected (optically coupled) to the optical waveguide member 6. Will be.

  In the present embodiment, as shown in FIGS. 3A to 3C, the mount substrate 2 is formed in a rectangular shape that is long in one direction in plan view, and the electrical contact portion 3 is at one end in the longitudinal direction of the mount substrate 2. Is provided. 3A to 3C show the photoelectric conversion apparatus 1 with the fixture and the holding member removed. In FIGS. 3A and 3B, the fixture and the holding member are shown by imaginary lines (two-dot chain lines). Show.

  Hereinafter, for the sake of explanation, the thickness direction of the mount substrate 2 is defined as the vertical direction, and the optical coupling member 5 side is defined as the upper side when viewed from the mount substrate 2. Furthermore, the longitudinal direction of the mount substrate 2 is defined as the front-rear direction, and the electrical contact portion 3 side is defined as the front. That is, in the following description, the upper and lower sides in FIG. In addition, a direction orthogonal to both the vertical direction and the front-rear direction (a direction orthogonal to the paper surface of FIG. 3A) is defined as a horizontal direction. However, these directions are not intended to limit the usage pattern of the photoelectric conversion device 1.

  The mount substrate 2 includes a first substrate 21 and a second substrate 22 that is coupled to the first substrate 21 so as to overlap a part of the first substrate 21. That is, the first substrate 21 and the second substrate 22 are combined and integrated so that at least the first substrate 21 protrudes from the second substrate 22 so as to overlap each other in the thickness direction (vertical direction).

  Here, a portion of the first substrate 21 that protrudes from the second substrate 22 constitutes a first region 210. A portion of the first substrate 21 that overlaps the second substrate 22 constitutes a second region 220. In other words, the portion of the mount substrate 2 where the first substrate 21 and the second substrate 22 overlap is the second region 220, and the portion of the first substrate 21 only is the first region 210. As described above, the mount substrate 2 can be divided into two regions, the first region 210 and the second region 220.

  In the present embodiment, the first substrate 21 is set to have the same size in the left-right direction as the second substrate 22 and the size in the front-rear direction is larger than that of the second substrate 22. The first substrate 21 and the second substrate 22 have the same rear end edge (right end edge in FIG. 3A). Therefore, the first substrate 21 protrudes only forward (leftward in FIG. 3A) from the second substrate 22, and this protruding portion constitutes the first region 210.

  Here, the bending rigidity of the mount substrate 2 is configured to be higher in the second region 220 than in the first region 210. That is, the bending rigidity of the mount substrate 2 varies depending on the part, and the mount substrate 2 is configured to be less likely to bend in the thickness direction in the second region 220 than in the first region 210. In other words, the flexural rigidity of the mount substrate 2 is lower in the first region 210 than in the second region 220, and the mount substrate 2 is configured to bend more easily in the thickness direction in the first region 210 than in the second region 220. In other words, the mount substrate 2 has a different elastic modulus (Young's modulus) between the first region 210 and the second region 220, and the second region 220 has a different elastic modulus (Young's modulus) than the first region 210. growing.

  As an example, the first substrate 21 is a flexible printed circuit (FPC). The second substrate 22 is a rigid substrate such as a glass epoxy substrate or a silicon substrate. By superimposing two substrates (first substrate 21 and second substrate 22) having different elastic coefficients in this way, the mount substrate 2 can be separated from only the first substrate 21 (the first region 210) and other parts. The bending rigidity differs from the part.

  A connection hole 23 is formed in the mount substrate 2 so as to penetrate the mount substrate 2 in the thickness direction (vertical direction). Here, connection holes 23 are formed in the left and right end portions of the rear end portion of the second region 220 in the mount substrate 2, and each connection hole 23 is formed in an elliptical shape having a long cross-sectional shape in the front-rear direction. A land 311 is provided around the connection hole 23 on the lower surface of the mount substrate 2 as shown in FIG. 3C, and the connection hole 23 is used to fix the fixture 300 to the mount substrate 2. A specific configuration for fixing the fixture 300 to the mount substrate 2 will be described later.

  Note that the configuration in which the mount substrate 2 includes the first substrate 21 and the second substrate 22 as in the present embodiment is not an essential configuration, and whether or not to adopt this configuration is arbitrary. The first substrate 21 and the second substrate 22 may not be separated.

  The reinforcing member 7 is provided in a portion (here, the front end portion) of the mount substrate 2 where the electrical contact portion 3 is provided, and is disposed on one surface in the thickness direction of the first substrate 21 to bend the rigidity of the first substrate 21. Is increasing. In the present embodiment, as shown in FIG. 3C, the reinforcing member 7 is disposed on the lower surface of the first substrate 21, that is, on the surface opposite to the upper surface on which the optical coupling member 5 is provided. Among these, it is provided in substantially the entire range corresponding to the electrical contact portion 3. For example, the reinforcing member 7 is formed in a plate shape or a sheet shape using a resin material such as polyimide, epoxy, or glass epoxy, and is attached to the first substrate 21. The reinforcing member 7 is not limited to this example, and may be formed by coating (applying) a resin material on the first substrate 21.

  Thereby, compared with the site | part in which the reinforcement member 7 is not provided, the 1st board | substrate 21 which consists of a flexible printed circuit board becomes high in the bending rigidity of the site | part in which the reinforcement member 7 was provided. However, even the bending rigidity of the portion of the first substrate 21 where the reinforcing member 7 is provided is set lower than the bending rigidity of the second substrate 22. Therefore, the flexural rigidity of the mount substrate 2 is the highest in the second region 220, and the portion of the first region 210 where the reinforcing member 7 is provided and the portion of the first region 210 where the reinforcing member 7 is not provided. Lower in order. The reinforcing member 7 is not limited to a material having a smaller elastic modulus (Young's modulus) than the second substrate 22, and may be made of a material having a larger elastic modulus (Young's modulus) than the second substrate 22.

  The electrical contact portion 3 is provided in a portion of the first substrate 21 that protrudes from the second substrate 22, that is, in the first region 210 of the mount substrate 2. In other words, the electrical contact portion 3 is provided at the front end portion (left end portion in FIG. 3B) of the mount substrate 2 having relatively low bending rigidity.

  The electrical contact portion 3 includes a contact 31 that is formed using a conductive material and is electrically connected to the mating connector 9. As shown in FIGS. 3A and 3B, the contact 31 is formed on the surface opposite to the reinforcing member 7 in the thickness direction of the mount substrate 2. In the present embodiment, since the reinforcing member 7 is provided on the lower surface of the mount substrate 2, the contact 31 is formed on the upper surface of the mount substrate 2 that is the back surface of the reinforcing member 7. The contacts 31 are strip-shaped conductor patterns formed on the first substrate 21 and are formed in a predetermined number (eight here) as shown in FIG. 3B.

  The electrical contact portion 3 configured in this manner is inserted into the mating connector 9 (see FIG. 1) so as to be insertable / removable in the insertion direction (front / rear direction) perpendicular to the thickness direction (vertical direction) of the mount substrate 2. It is. Specifically, an opening is formed on one surface of the mating connector 9 (the surface facing the electrical contact portion 3 in FIG. 1), and the electrical contact portion 3 is inserted into the mating connector 9 from this opening. When the electrical contact portion 3 is inserted into the mating connector 9, the contact 91 (see FIG. 6B) of the mating connector 9 is brought into contact with the contact 31, and is electrically connected to the mating connector 9 and mechanically. Combined with

  The optical coupling member 5 is mounted on one surface of the mount substrate 2. Here, as shown in FIG. 3B, the optical coupling member 5 is disposed on the upper surface of the mount substrate (first substrate 21) 2 at a position closer to the rear than the center portion. Thereby, the optical coupling member 5 is provided in a portion of the first substrate 21 that overlaps the second substrate 22, that is, in the second region 220 of the mount substrate 2. In other words, the optical coupling member 5 is provided in a portion of the mount substrate 2 having a relatively high bending rigidity.

  The optical coupling member 5 only needs to have a structure having a function of optically coupling the optical element 4 and the optical waveguide member 6, and as an example in FIG. 3B, the optical coupling member 5 is optically coupled by a submount substrate on which the optical element 4 is mounted. A member 5 is configured. However, the optical coupling member 5 is not limited to the configuration of FIG.

  The optical waveguide member 6 is an optical fiber, for example, and guides light output from a light emitting element as the optical element 4 or light input to a light receiving element as the optical element 4. The optical coupling member 5 holds the tip of the optical waveguide member 6 and fixes the relative positional relationship between the optical element 4 and the optical waveguide member 6, thereby optically coupling the optical element 4 and the optical waveguide member 6. To join. A specific configuration of the optical coupling member 5 will be described later.

  The signal processing circuit 8 is a packaged integrated circuit (IC) and is mounted on one surface of the mount substrate 2. Here, as shown in FIG. 3B, the signal processing circuit 8 is disposed on the upper surface of the first substrate 21, that is, on the same surface as the optical coupling member 5. The signal processing circuit 8 is disposed in the vicinity of the central portion on the upper surface of the first substrate 21 so as to be positioned in the second region 220 of the mount substrate 2. In other words, the signal processing circuit 8 is disposed on the upper surface of the mount substrate 2 between the electrical contact portion 3 and the optical coupling member 5.

  In the present embodiment, the electrical contact portion 3 and the optical element 4 are electrically connected to the signal processing circuit 8 so that the optical device 4 is electrically connected to the electrical contact portion 3 via the signal processing circuit 8. Has been. In the first connector 101 (see FIG. 2), the signal processing circuit 8 has a function of driving (light-emitting) a light emitting element as the optical element 4 in accordance with at least an electric signal input from the electric contact portion 3. Yes. In the second connector 102 (see FIG. 2), the signal processing circuit 8 performs signal processing such as amplification on at least an electric signal output in accordance with light received from the light receiving element as the optical element 4, and an electric contact portion. 3 is output.

  As shown in FIG. 3A, the signal processing circuit 8 is connected to a conductor pattern 83 formed on the upper surface of the first substrate 21 by a bonding wire 81, and a conductor pattern 84 formed on the upper surface of the optical coupling member 5. Are connected by a bonding wire 82. However, not limited to this configuration, the signal processing circuit 8 may be flip-chip mounted on the mount substrate 2.

  The contact 31 is connected to the conductor pattern 83 of the first substrate 21, whereby the signal processing circuit 8 is electrically connected to the contact 31 of the electrical contact portion 3. The optical element 4 is connected to the conductor pattern 84 of the optical coupling member 5, whereby the signal processing circuit 8 is electrically connected to the optical element 4. In FIG. 3B, the conductor patterns 83 and 84 are not shown. Further, in the drawings other than FIG. 3B, the illustration of a plurality of bonding wires 81 is omitted as appropriate.

  Next, the configuration of the holding member 400 and the fixture 300 will be described with reference to FIG. In FIG. 4, illustration of the optical element 4, the optical coupling member 5, the signal processing circuit 8, and the conductor pattern 83 provided on the upper surface of the mount substrate 2 is omitted.

  The holding member 400 is formed using an elastic material, for example, an elastomer. The holding member 400 functions to hold the optical waveguide member 6 made of an optical fiber while being fixed to the mount substrate 2. Here, the holding member 400 is formed with a holding hole 401 (see FIG. 1) having a circular cross section and penetrating in the front-rear direction. The inner diameter of the holding hole 401 is approximately the same as the outer diameter of the optical waveguide member 6, and the optical waveguide member 6 is held by the holding member 400 by being inserted through the holding hole 401. However, the holding member 400 is not limited to being made of elastomer, and may be made of a rubber material other than the elastomer, or other elastic material.

  Further, a step 402 is formed on the lower surface of the holding member 400 so that the vertical dimension of the holding member 400 becomes smaller on the front end side. As a result, the holding member 400 is mounted on the mount substrate 2 with the step 402 in contact with the rear edge of the mount substrate 2, and is fixed to the mount substrate 2 by being pressed from above by the fixture 300.

  In this embodiment, the fixture 300 not only fixes the holding member 400 but also serves as a shield that reduces at least the influence of noise on the optical element 4. Therefore, the fixture 300 is made of a conductive metal in the present embodiment, and is formed in a hollow rectangular parallelepiped shape that is long in the front-rear direction and has an open bottom surface. The fixture 300 is disposed on the upper surface of the mount substrate (first substrate 21) 2, that is, on the same surface as the optical coupling member 5. Fixing device 300 only needs to have conductivity, and is not limited to metal, and may be configured by, for example, attaching a conductive thin film or applying conductive plating to a resin molded product. The conductive resin material may be used.

  The fixture 300 is configured to cover at least the optical element 4 while being fixed to the mount substrate 2. In the present embodiment, the fixture 300 houses a part of the optical waveguide member 6, the optical element 4, the optical coupling member 5, and the signal processing circuit 8 between the mount substrate 2. Furthermore, the fixture 300 also accommodates the bonding wires 81 and 82, part of the conductor pattern 83, and the conductor pattern 84 between the mount substrate 2.

  The fixture 300 has a terminal piece 301 that is inserted into a connection hole 23 formed in the mount substrate 2. In the present embodiment, two terminal pieces 301 are provided so as to correspond to the two connection holes 23. Specifically, as shown in FIG. 4, one terminal piece 301 is provided on each of a pair of side walls facing the left-right direction of the fixture 300, and each terminal piece 301 protrudes downward from the lower edge of the side wall. It is formed into a shape.

  The fixture 300 is mounted on the mount board 2 by joining the terminal piece 301 to the land 311 (see FIG. 3C) in a state where the terminal piece 301 is attached to the mount board 2 so that the terminal pieces 301 are inserted into the corresponding connection holes 23. 2 is fixed. In other words, the fixture 300 has a solder 312 (FIG. 1) as a conductive member with respect to the land 311 where the terminal piece 301 is provided on the surface (lower surface) opposite to the optical coupling member 5 in the thickness direction of the mount substrate 2. For example). In other words, the fixture 300 is through-hole mounted (inserted mounted) on the mount substrate 2.

  The land 311 to which the terminal piece 301 is joined is a reference potential point that becomes a reference potential (here, referred to as a ground potential) of the electrical contact portion 3. That is, the land 311 is electrically connected to the electrical contact portion 3 by a conductor pattern (not shown) formed on the mount substrate 2.

  In addition, the fixture 300 includes an opening 302 for fixing the holding member 400, and a notch 303 (see FIG. 1) for passing the conductor pattern 83 (see FIG. 3A) formed on the upper surface of the mount substrate 2. have. That is, since the conductor pattern 83 is disposed across the space surrounded by the fixture 300, the fixture 300 has a configuration for allowing the conductor pattern 83 to pass therethrough.

  The opening 302 is provided on the rear wall of the fixture 300 and is formed in a shape in which the lower end is opened. Here, the opening 302 is formed to have the same size in the left-right direction and slightly smaller in the vertical direction than the portion of the holding member 400 closer to the front end than the step 402. Accordingly, when the fixture 300 is mounted on the mount substrate 2, the holding member 400 is sandwiched between the mounting substrate 2 so that the holding member 400 is fitted in the opening 302, and the holding member 400 is fixed. In addition, the fixing tool 300 can introduce the front-end | tip part of the optical waveguide member 6 into the inside through the holding hole 401 (refer FIG. 1) of the holding member 400. FIG.

  The notch 303 is formed at the lower end portion of the front wall of the fixture 300, and is formed in a shape that is long in the left-right direction and the lower end is opened. As a result, the fixture 300 forms a gap between the lower end edge of the front wall and the upper surface of the mount substrate 2 in a state of being fixed to the mount substrate 2, and the conductor pattern 83 is formed through the gap (notch 303). Can pass through. Here, the lower end edge of the front wall of the fixture 300 and the conductor pattern 83 are separated from each other, and electrical insulation between the fixture 300 and the conductor pattern 83 is ensured.

  Here, since the connection hole 23 is formed in the second region 220 of the mount substrate 2, the connection hole 23 is formed across both the first substrate 21 and the second substrate 22. It may be formed on at least one of the substrate 21 and the second substrate 22. For example, when the connection hole 23 is formed in the first region 210 of the mount substrate 2, the connection hole 23 is formed only in the first substrate 21, and the terminal piece 301 is formed on the lower surface of the first substrate 21. It will be joined to the land.

  In the present embodiment, the inner peripheral surface of the connection hole 23 is covered with through-hole plating made of a conductive material, and the land 311 is electrically connected to the through-hole plating. Furthermore, the conductive member used for joining the terminal piece 301 and the land 311 is not limited to solder, and may be, for example, a conductive adhesive.

  Next, a specific configuration of the optical coupling member 5 will be described with reference to FIGS. 5A to 5C.

  The optical coupling member 5 is, for example, a silicon substrate or a resin molded substrate, and the optical element 4 is mounted on the upper surface as shown in FIGS. 5A and 5B. The optical element 4 is flip-chip mounted on the optical coupling member 5 via bumps 41 with the light emitting surface (light receiving surface in the second connector 102) facing downward (on the optical coupling member 5 side). 5A to 5C, illustration of the conductor pattern 84 (see FIG. 3A) formed on the upper surface of the optical coupling member 5 is omitted.

  As shown in FIG. 5C, a groove 52 having a V-shaped cross section that is long in the front-rear direction is formed on the upper surface of the optical coupling member 5. The groove 52 is formed from the rear edge to the mounting position of the optical element 4 on the upper surface of the optical coupling member 5 so that the optical waveguide member 6 introduced from the rear into the optical coupling member 5 is accommodated. On the upper surface of the optical coupling member 5, for example, a glass pressing member 51 is attached so as to straddle both sides of the groove 52 in the left-right direction, and the distal end portion of the optical waveguide member 6 is fixed by the pressing member 51.

  The optical waveguide member 6 may be divided into an external waveguide (such as an optical fiber) introduced from the outside into the optical coupling member 5 and an internal waveguide provided in the groove 52 in advance. In this case, the external waveguide is extended by the amount of the internal waveguide in the groove 52 by optically coupling the front end surface of the external waveguide to the end surface of the internal waveguide.

  Here, a portion (front end surface of the groove 52) of the inner surface of the groove 52 that faces the front end surface of the optical waveguide member 6 reflects light emitted from the optical element 4 toward the front end surface of the optical waveguide member 6. Thus, the mirror 53 inclined at an angle of 45 degrees with respect to the upper surface of the optical coupling member 5 is configured. The mirror 53 is formed by metal plating, for example. However, when the optical coupling member 5 is a silicon substrate, the mirror 53 may be formed by mirror-finishing the surface. In the second connector 102, the mirror 53 reflects the light emitted from the distal end surface of the optical waveguide member 6 toward the light receiving surface of the optical element 4.

  In the drawings other than FIGS. 5A to 5C, the illustration of the pressing member 51 and the groove 52 is omitted, and the optical coupling member 5 is simplified.

<Effect>
According to the photoelectric conversion apparatus 1 described above, the electrical contact portion 3 provided at one end portion of the mount substrate 2 is inserted into the mating connector 9 in the insertion direction orthogonal to the thickness direction of the mount substrate 2. Thus, the mating connector 9 is electrically connected and mechanically coupled. Therefore, according to the present embodiment, the thickness direction of the mount substrate 2 compared to the conventional configuration in which the electrical contact portion that fits in the thickness direction of the mount substrate with respect to the mating connector is provided on one surface in the thickness direction of the mount substrate. The dimension (height dimension) of the photoelectric conversion apparatus 1 can be reduced. As a result, according to the configuration of the present embodiment, the height dimension can be suppressed smaller than that of the conventional photoelectric conversion device, and the photoelectric conversion device 1 can be reduced in height. is there.

  Moreover, the photoelectric conversion apparatus 1 of the present embodiment is provided with a holding member 400 that has elasticity and is fixed to the mount substrate 2 by the fixture 300. The optical waveguide member 6 is held by the holding member 400 by penetrating the holding member 400 in a penetration direction (front-rear direction) orthogonal to the thickness direction of the mount substrate 2. That is, since the photoelectric conversion apparatus 1 holds the optical waveguide member 6 with the holding member 400 fixed to the mount substrate 2, even if an external force is applied to the optical waveguide member 6, the photoelectric conversion device 1 is guided by the elasticity of the holding member 400. The force acting on the wave member 6 can be reduced.

  In other words, even if the optical waveguide member 6 is swung in a direction (vertical direction, left-right direction) orthogonal to the longitudinal direction of the optical waveguide member 6, the holding member 400 as a bushing protects the optical waveguide member 6, thereby It is possible to prevent the wave member 6 from being bent or broken suddenly from the base. For this reason, the photoelectric conversion apparatus 1 has an optical waveguide member in which the bending radius of the base portion of the optical waveguide member 6 is less than the allowable bending radius of the optical waveguide member 6 even when an external force is applied to the flexible optical waveguide member 6, for example. There is an advantage that it is difficult to be influenced by external force acting on 6.

  Further, since the mount substrate 2 has a restriction that the degree of freedom in shape is lower than that of a box-shaped case or housing, it is difficult to have a configuration in which the holding member 400 is fixed by the mount substrate 2 alone. The photoelectric conversion apparatus 1 of the present embodiment performs complicated processing on the mount substrate 2 because the holding member 400 is fixed using the fixture 300 that sandwiches the holding member 400 with the mount substrate 2. In addition, the holding member 400 can be fixed to the mount substrate 2.

  Therefore, according to the configuration of the present embodiment, the photoelectric conversion device 1 can be reduced in height as compared with the conventional configuration, and is less susceptible to the external force acting on the optical waveguide member 6. There is.

  In addition, the mount substrate 2 preferably includes a first region 210 and a second region 220 having higher bending rigidity than the first region 210 as in the present embodiment. In this case, the optical coupling member 5 is disposed in the second region 220 of the mount substrate 2, and the electrical contact portion 3 is disposed in the first region 210 of the mount substrate 2.

  According to this configuration, the mounting substrate 2 has the optical coupling member 5 disposed in the second region 220 and the electrical contact portion 3 disposed in the first region 210 having relatively low bending rigidity. Stress is less likely to act on the optical coupling member 5 when 3 is inserted and removed. Therefore, according to this photoelectric conversion apparatus 1, it is difficult for position shift to occur between the optical element 4 and the optical waveguide member 6, and optical coupling loss (loss) can be reduced. However, this configuration is not an essential configuration, and whether or not this configuration is adopted is arbitrary.

  Here, in order to explain the effect of the photoelectric conversion apparatus 1 according to the present embodiment, for example, the invention described in Patent Document 2 (Japanese Patent Laid-Open No. 2011-40764) will be described as a comparative example.

  The photoelectric conversion device (optical module) of the comparative example includes an electrical contact portion (connection terminal) to be inserted into a mating connector (socket) at one end portion of the mount substrate (package). An optical coupling member (substrate) is provided inside the mount substrate, and the side surface of the optical coupling member is configured to face the mount substrate. The optical coupling member holds the optical element and the optical waveguide member (optical waveguide), and optically couples the optical element and the optical waveguide member.

  In the photoelectric conversion device according to the comparative example, the electrical contact portion provided at one end of the mount substrate is inserted into the mating connector in the insertion direction orthogonal to the thickness direction of the mount substrate. This is the same as the embodiment.

  However, in the configuration of the comparative example, when the electrical contact portion is inserted into and removed from the mating connector (especially when it is inserted), stress acts on the entire mount substrate, so that stress also acts on the optical coupling member. There is a possibility that a positional shift between the optical element and the optical waveguide member occurs. Therefore, in the photoelectric conversion device of the comparative example, the optical coupling degree between the optical element and the optical waveguide member is caused by the stress acting when the electrical contact portion is inserted and removed from the mating connector. The optical coupling loss (loss) may occur.

  On the other hand, in the photoelectric conversion apparatus 1 of the present embodiment, when the electrical contact portion 3 is inserted and removed from the mating connector 9, the stress acting on the electrical contact portion 3 is the electrical contact portion 3 of the mount substrate 2. And is absorbed by the first region 210 interposed between the optical coupling member 5. For this reason, the stress acting on the optical coupling member 5 disposed in the second region 220 of the mount substrate 2 is reduced, and the positional deviation between the optical element 4 and the optical waveguide member 6 hardly occurs. Therefore, in the photoelectric conversion apparatus 1 of the present embodiment, the optical coupling degree between the optical element 4 and the optical waveguide member 6 is less likely to be lower than in the comparative example described above, and the optical coupling loss (loss) is reduced. There is an advantage that it can be reduced.

  Moreover, in the comparative example, the height dimension (thickness dimension) of the mount substrate is set large so that the mount substrate and the side surface of the optical coupling member face each other, and it is difficult to reduce the height. On the other hand, according to the photoelectric conversion apparatus 1 according to the present embodiment, there is no portion facing the side surface of the optical coupling member on the mount substrate, so that the height can be reduced as compared with the comparative example.

  Moreover, it is preferable that the fixing device 300 has conductivity and is fixed to the mount substrate 2 so as to cover at least the optical element 4 as in the present embodiment. According to this configuration, the photoelectric conversion apparatus 1 can reduce the influence of noise from the surroundings on the optical element 4 with the fixture 300, and the optical element 4 that handles an electrical signal is less affected by the noise. There is an advantage that noise resistance can be improved. Moreover, since the photoelectric conversion apparatus 1 can reduce the radiation of noise from the optical element 4 to the surroundings with the fixture 300, the noise is less likely to be emitted from the optical element 4 that handles electrical signals, and the radiation noise is suppressed. There is an advantage that you can. However, this configuration is not an essential configuration, and whether or not this configuration is adopted is arbitrary.

  Note that although the fixture 300 has an effect of reducing noise simply by covering the optical element 4, the shielding effect becomes remarkable by being connected to a stable reference potential (here, ground potential) point. .

  Moreover, it is preferable that the fixture 300 has the terminal piece 301 inserted in the connection hole 23 which penetrates the mount board | substrate 2 in the thickness direction like this embodiment. In this case, the terminal piece 301 is joined to the land 311 provided on the surface opposite to the optical coupling member 5 in the thickness direction of the mount substrate 2 using a conductive member (solder 312). According to this configuration, the fixture 300 is attached to the mount substrate 2 relatively firmly by through-hole mounting, and as a result, the holding member 400 can be reliably fixed. However, this configuration is not an essential configuration, and the fixture 300 may be surface-mounted on the upper surface of the mount substrate 2.

<Configuration of connection device>
The photoelectric conversion apparatus 1 of the present embodiment constitutes a connection device 10 (see FIG. 1) together with the mating connector 9. As described above, the photoelectric conversion device 1 is electrically connected and mechanically coupled to the mating connector 9 by inserting the electrical contact portion 3 into the mating connector 9.

  That is, the connection device 10 includes the photoelectric conversion device 1 and a mating connector 9 that is electrically connected to the electrical contact portion 3 and mechanically coupled. The mating connector 9 is configured to be electrically connected and mechanically coupled to the electrical contact portion 3 by sandwiching the electrical contact portion 3 from both sides in the thickness direction of the mount substrate 2. According to this configuration, the connection device 10 includes a mechanism for electrically connecting the mating connector 9 and the electrical contact portion 3 and a mechanism for mechanically coupling the mating connector 9 and the electrical contact portion 3. Since it is not necessary, the structure can be simplified.

  As shown in FIGS. 6A and 6B, the mating connector 9 is a socket (female connector) configured to allow insertion of an electrical contact portion 3 as a plug (male connector), and is mounted on a wiring board (not shown), for example. The The photoelectric conversion device 1 is inserted so that the electrical contact portion 3 can be inserted into and removed from the mating connector 9 and is electrically and mechanically connected to the mating connector 9 in a state of being inserted into the mating connector 9. . Thereby, the photoelectric conversion apparatus 1 and the wiring board are electrically connected.

  Specifically, the mating connector 9 includes a contact 91 formed using a conductive material and a housing 92 formed using an insulating material and holding the contact 91 as shown in FIG. 6A. Yes. The housing 92 has an open back surface (right end surface in FIG. 6A) so that the electrical contact portion 3 can be inserted from the rear. The contact 91 is shaped so as to sandwich the electrical contact portion 3 inserted into the housing 92 from both sides in the vertical direction, and the contact portion (contact point) with the electrical contact portion 3 contacts the contact 31 of the electrical contact portion 3. By doing so, it is electrically connected to the photoelectric conversion apparatus 1.

  In the present embodiment, the mating connector 9 has a lever 93 that is rotatably held with respect to the housing 92. The lever 93 is configured to push up a part of the contact 91 as shown in FIG. 6B by rotating in the direction of the arrow (counterclockwise) from the state shown in FIG. 6A. 6B, in the state shown in FIG. 6B, the vertical distance at the rear end portion of the contact 91 is narrowed, the force with which the contact 91 sandwiches the electrical contact portion 3 is increased, and the mating connector 9 locks the electrical contact portion 3. (Retain). That is, the mating connector 9 has a lock mechanism that changes the magnitude of the force for pinching the electrical contact portion 3, such as a lever 93, for example, so that the electrical contact portion 3 is locked by operation of the lock mechanism; The state of releasing the lock can be switched.

  By using the mating connector 9 having such a locking mechanism, the stress applied to the electrical contact portion 3 when the electrical contact portion 3 is inserted into and removed from the mating connector 9 becomes relatively small. That is, in the case of the mating connector 9 having no locking mechanism, the force to pinch the electrical contact portion 3 to mechanically connect with the electrical contact portion 3 inevitably increases, and when the electrical contact portion 3 is inserted and removed The stress applied to the electrical contact portion 3 is relatively large. On the other hand, in the case of the mating connector 9 having a lock mechanism, when the electrical contact portion 3 is inserted and removed from the mating connector 9, the electric contact portion 3 is reduced to reduce the force. The stress applied to the portion 3 is relatively small.

  Therefore, it is preferable that the mating connector 9 constituting the connection device 10 together with the photoelectric conversion device 1 of the present embodiment has a lock mechanism. However, the lock mechanism is not an essential configuration and can be omitted as appropriate.

<Modification>
FIG. 7A shows a main part of a first modification of the present embodiment. In the first modification, the contacts of the electrical contact portion 3 are formed on both surfaces in the thickness direction (vertical direction) of the mount substrate 2. Here, a contact 31 is formed on the surface (upper surface) of the mount substrate 2 opposite to the reinforcement member 7, and a contact 32 is formed on the surface (lower surface) of the mount substrate 2 on the reinforcement member 7 side. The contacts 31 and 32 are electrically connected by through-hole plating 33. According to this configuration, the photoelectric conversion device 1 has a double-sided contact structure in which the electrical contact unit 3 contacts the mating connector 9 on both sides. That is, the photoelectric conversion apparatus 1 can secure electrical connection between the electrical contact portion 3 and the mating connector 9 on both sides in the thickness direction of the mount substrate 2, so that it is connected as compared with the case where the connection is made only on one side. Reliability is improved.

  The photoelectric conversion apparatus 1 can be expected to have the following effects by adopting such a double-sided contact structure. For example, if the contact 31 on the upper surface side of the mount substrate 2 is a signal line and the contact 32 on the lower surface side of the mount substrate 2 is a ground (GND) layer, the photoelectric conversion device 1 has an electrical contact portion 3 with a microstrip. The structure can be expected to improve the high-frequency characteristics. Furthermore, on the upper surface side of the mounting substrate 2, if a configuration is such that a part of the contact 31 is a ground line and a ground line is disposed between a pair of (differential pair) signal lines for two channels, The photoelectric conversion apparatus 1 can be expected to reduce crosstalk.

  FIG. 7B shows a main part of a second modification of the present embodiment. In the second modification, the contact of the electrical contact portion 3 is formed on the surface on the reinforcing member 7 side in the thickness direction (vertical direction) of the mount substrate 2. Here, the contact 32 is formed on the surface (lower surface) of the mount substrate 2 on the reinforcing member 7 side, and the conductor pattern 83 and the contact 32 are electrically connected by the through-hole plating 33. According to this configuration, the photoelectric conversion device 1 performs electrical connection between the electrical contact portion 3 and the mating connector 9 on the surface of the mounting substrate 2 on the side of the reinforcing member 7. It can correspond to the mating connector 9 having a contact.

  In addition, the photoelectric conversion apparatus 1 of the present embodiment is not limited to the configuration described above, and can be appropriately changed. For example, the second substrate 22 may be provided on the upper surface of the first substrate 21. In this configuration, the optical coupling member 5 and the signal processing circuit 8 are mounted on the second substrate 22, and the fixture 300 is attached to the surface of the mount substrate 2 on the second substrate 22 side.

  In the photoelectric conversion device 1, the reinforcing member 7 (see FIG. 1) may be omitted. According to this configuration, the photoelectric conversion apparatus 1 can reduce the thickness of the electrical contact portion 3 by the amount corresponding to the reinforcing member. Moreover, in this structure, a contactor can be provided on both surfaces of the 1st board | substrate 21 with the conductor pattern directly formed in the 1st board | substrate 21, As a result, the photoelectric conversion apparatus 1 is the same as that of the example of FIG. 7A. It has a double-sided contact structure.

  Furthermore, in the photoelectric conversion device 1, the reinforcing member 7 may be disposed on the upper surface of the first substrate 21, that is, on the same surface as the optical coupling member 5. The signal processing circuit 8 may be divided into a plurality of parts, and the signal processing circuit 8 may be omitted.

(Embodiment 2)
The photoelectric conversion apparatus 1 according to the present embodiment is different from the photoelectric conversion apparatus 1 of the first embodiment in at least the configuration of the holding member 400. Since the basic configuration is the same as that of the first embodiment, the same configuration as that of the first embodiment will be denoted by the same reference numeral, and the description thereof will be omitted as appropriate. In FIG. 8B, FIG. 9B, FIG. 10B, and FIG. 11B, illustration of the optical element 4, the optical coupling member 5, the signal processing circuit 8, and the conductor pattern 83 provided on the upper surface of the mount substrate 2 is omitted.

  In this embodiment, the 1st-4th structural example from which the structure of the holding member 400 differs is illustrated.

  8A and 8B show a first configuration example. In the first configuration example, the holding member 400 includes a first restricting portion 403 that restricts the relative movement of the holding member 400 with respect to the mount substrate 2. The first restricting portion 403 is in contact with at least one of the fixture 300 and the mount substrate 2, thereby being perpendicular to the thickness direction (vertical direction) of the mount substrate 2 and perpendicular to the penetrating direction (front-rear direction) ( The movement of the holding member 400 in the left-right direction) is restricted.

  In the example of FIGS. 8A and 8B, a restriction hole 24 opened rearward is formed between the pair of connection holes 23 in the mount substrate 2. The holding member 400 forms a first restricting portion 403 with a central portion in the left-right direction on the lower surface protruding downward. The holding member 400 is fixed to the mount substrate 2 so that the first restricting portion 403 is fitted into the restricting hole 24 of the mount substrate 2, and the first restricting portion 403 contacts the mount substrate 2, thereby ) Is restricted. Here, although the regulation hole 24 penetrates the mount substrate 2 in the thickness direction, it is not essential that the regulation hole 24 penetrates.

  According to this configuration, since the holding member 400 is restricted from moving in the first direction (left-right direction), the position of the holding member 400 relative to the mount substrate 2 even if the optical waveguide member 6 is swung in the first direction. A shift can be prevented from occurring. Therefore, the photoelectric conversion apparatus 1 is less likely to be displaced between the optical element 4 and the optical waveguide member 6, and the optical coupling degree between the optical element 4 and the optical waveguide member 6 is difficult to decrease. There is an advantage that the optical coupling loss can be reduced.

  9A and 9B show a second configuration example. In the second configuration example, the holding member 400 includes a second restricting portion 404 that restricts the relative movement of the holding member 400 with respect to the mount substrate 2. The second restricting unit 404 restricts the movement of the holding member 400 in the second direction (front-rear direction) along the penetrating direction (front-rear direction) by contacting at least one of the fixture 300 and the mount substrate 2.

  9A and 9B, two pairs of connection holes 23 arranged in the left-right direction are provided at the rear end portion of the mount substrate 2. In this example, four terminal pieces 301 of the fixture 300 are provided so as to correspond to the four connection holes 23. Specifically, as shown in FIG. 9B, two terminal pieces 301 are provided on each of a pair of side walls facing the left-right direction of the fixture 300, and respectively project downward from the lower edge of the side walls. It is formed into a shape. Further, in the fixture 300, a slit 304 opened downward is formed between the two terminal pieces 301 on each side wall.

  The holding member 400 constitutes a second restricting portion 404 by projecting rear end portions on both side surfaces in the left-right direction. The holding member 400 is combined with the fixture 300 so that the pair of second restricting portions 404 are fitted into the slits 304 of the fixture 300, and the second restricting portion 404 comes into contact with the fixture 300, thereby Direction) is restricted. Although the slit 304 is formed between the two terminal pieces 301 here, it is not essential that two terminal pieces 301 are provided on each of the pair of side walls.

  According to this configuration, since the holding member 400 is restricted from moving in the second direction (front-rear direction), the position of the holding member 400 with respect to the mount substrate 2 even when the optical waveguide member 6 is pulled in the second direction. A shift can be prevented from occurring. Therefore, the photoelectric conversion apparatus 1 is less likely to be displaced between the optical element 4 and the optical waveguide member 6, and the optical coupling degree between the optical element 4 and the optical waveguide member 6 is difficult to decrease. There is an advantage that the optical coupling loss can be reduced.

  10A and 10B show a third configuration example. The third configuration example is a configuration in which the first configuration example and the second configuration example are combined, and the holding member 400 has both the first restriction portion 403 and the second restriction portion 404. . In this example, the mounting substrate 2 is formed with a restriction hole 24 into which the first restriction portion 403 is fitted, and the fixture 300 is formed with a slit 304 into which the second restriction portion 404 is fitted.

  According to this configuration, the holding member 400 is restricted from moving in both the first direction (left-right direction) and the second direction (front-rear direction), and thus the positional displacement of the holding member 400 with respect to the mount substrate 2 occurs. Can be prevented. Therefore, the photoelectric conversion apparatus 1 is less likely to be displaced between the optical element 4 and the optical waveguide member 6, and the optical coupling degree between the optical element 4 and the optical waveguide member 6 is difficult to decrease. There is an advantage that the optical coupling loss can be reduced.

  11A and 11B show a fourth configuration example. In the fourth configuration example, the first recess 25 is formed on the surface (upper surface) of the mount substrate 2 facing the fixture 300, and the second recess 305 is formed on the surface of the fixture 300 facing the mount substrate 2. Is formed. The holding member 400 has a first convex portion 405 that fits into the first concave portion 25 and a second convex portion 406 that fits into the second concave portion 305.

  In the example of FIGS. 11A and 11B, two pairs of connection holes 23 arranged in the left-right direction are provided at the rear end of the mount substrate 2 as in the second configuration example. In this example, four terminal pieces 301 of the fixture 300 are provided so as to correspond to the four connection holes 23. Specifically, as shown in FIG. 11B, two terminal pieces 301 are provided on each of the pair of side walls facing the left and right direction of the fixture 300, and respectively protrude downward from the lower edge of the side wall. It is formed into a shape. Further, a first concave portion 25 having a rectangular shape is formed at a position surrounded by the four connection holes 23 in the mount substrate 2. A second recess 305 having a rectangular shape is formed at a position facing the first recess 25 on the upper wall of the fixture 300.

  In the holding member 400, the central portion in the front-rear direction on the lower surface protrudes downward to form the first convex portion 405, and the central portion in the front-rear direction on the upper surface protrudes upward to form the second convex portion 406. The holding member 400 is sandwiched between the fixture 300 and the mount substrate 2 so that the first convex portion 405 is fitted into the first concave portion 25 and the second convex portion 406 is fitted into the second concave portion 305. 2 is fixed. Here, the first recess 25 penetrates the mount substrate 2 in the thickness direction, and the second recess 305 penetrates the upper wall of the fixture 300 in the thickness direction. Not required.

  According to this configuration, the holding member 400 is restricted from moving in both the first direction (left-right direction) and the second direction (front-rear direction), and thus the positional displacement of the holding member 400 with respect to the mount substrate 2 occurs. Can be prevented. Therefore, the photoelectric conversion apparatus 1 is less likely to be displaced between the optical element 4 and the optical waveguide member 6, and the optical coupling degree between the optical element 4 and the optical waveguide member 6 is difficult to decrease. There is an advantage that the optical coupling loss can be reduced.

  Other configurations and functions are the same as those of the first embodiment.

(Embodiment 3)
The photoelectric conversion apparatus 1 according to the present embodiment is different from the photoelectric conversion apparatus 1 according to the first embodiment in the configuration of the optical coupling member as shown in FIGS. 12 and 13. Since the configuration other than the optical coupling member is the same as that of the first embodiment, the same configuration as that of the first embodiment will be denoted by the same reference numeral, and the description thereof will be omitted as appropriate.

  In this embodiment, the 1st and 2nd structural example from which the structure of an optical coupling member differs is illustrated.

  FIG. 12 shows a first configuration example. In the first configuration example, the optical coupling member 510 is a rectangular parallelepiped silicon or resin molded product. The optical coupling member 510 is formed with a through hole 511 penetrating in the front-rear direction (left-right direction in FIG. 12). The through-hole 511 is circular in cross section, and has a larger inner diameter on the rear side than the middle part so that the front side is a small diameter part 512 and the rear side is a large diameter part 513 with respect to the middle part in the front-rear direction. ing.

The optical element 4 is mounted at a position corresponding to the through hole 511 on the front surface of the optical coupling member 510. The optical element 4 is flip-chip mounted on the optical coupling member 510 via the bumps 41 with the light emitting surface (light receiving surface in the second connector 102) facing rearward (the optical coupling member 510 side). The conductor pattern 84 is formed from the front surface of the optical coupling member 510 to the upper surface of the first substrate 21, and the optical element 4 is electrically connected to the signal processing circuit 8 via the conductor pattern 84 and the bonding wire 82. The optical coupling member 510 configured as described above introduces the optical waveguide member 6 into the through-hole 511 from behind, and holds the optical waveguide member 6 within the large-diameter portion 513. In this state, in the optical waveguide member 6 made of an optical fiber, the tip surface of the core 61 faces the light emitting surface of the optical element 4 (light receiving surface in the second connector 102) through the small diameter portion 512. Therefore, the optical element 4 and the optical waveguide member 6 are optically coupled by the optical coupling member 510.

  FIG. 13 shows a second configuration example. In the second configuration example, the optical coupling member 520 is formed of a translucent resin. In the second configuration example, the optical element 4 is directly mounted (wire bonding mounted) on the mount substrate (first substrate 21) 2 with the light emitting surface (light receiving surface in the second connector 102) facing upward. The optical coupling member 520 includes a holding block 521 that holds the optical waveguide member 6 and a lens block 522 that is disposed above the optical element 4.

  The holding block 521 is formed with a through-hole 523 having a circular cross section that penetrates in the front-rear direction (left-right direction in FIG. 13). The optical coupling member 520 introduces the optical waveguide member 6 into the through hole 523 from behind, and holds the optical waveguide member 6 in the through hole 523.

  The lens block 522 includes a first lens 524 that converts light from the optical element 4 into parallel light, a mirror 525, and a second lens 526 that condenses the light reflected by the mirror 525 onto the optical waveguide member 6. doing. The mirror 525 is inclined at an angle of 45 degrees with respect to the upper surface of the mount substrate 2 so as to reflect the light (parallel light) from the first lens 524 toward the second lens 526. The mirror 525 is formed by, for example, metal plating. Alternatively, since the refractive index of the lens block 522 made of a translucent resin is larger than the refractive index of air, total reflection occurs at the interface between the lens block 522 and air. Therefore, the mirror 525 uses this total reflection to generate light. The structure which reflects may be sufficient. That is, the mirror 525 may be the air interface itself in the lens block 522.

  The thus configured optical coupling member 520 converts (collimates) light from the light emitting surface of the optical element 4 into parallel light by the first lens 524, reflects the parallel light by the mirror 525, and reflects the second lens 526. Thus, the light is condensed on the tip surface of the core 61 of the optical waveguide member 6. In the second connector 102, the optical coupling member 520 converts (collimates) the light from the optical waveguide member 6 into parallel light by the second lens 526, reflects the parallel light by the mirror 525, and reflects the first lens. The light is condensed on the light receiving surface of the optical element 4 by 524. Therefore, the optical element 4 and the optical waveguide member 6 are optically coupled by the optical coupling member 520.

  As described above, the photoelectric conversion apparatus 1 can appropriately employ optical coupling members having various configurations. Even with such a configuration, the photoelectric conversion apparatus 1 can be reduced in height as compared with the conventional photoelectric conversion apparatus, and the photoelectric conversion apparatus 1 can be reduced in height. There is an advantage.

  Other configurations and functions are the same as those of the first embodiment.

  Note that the configuration of the third embodiment may be applied in combination with the configuration of the second embodiment, and each of the above-described configurations (including modifications and configuration examples) can be employed in appropriate combination.

DESCRIPTION OF SYMBOLS 1 Photoelectric conversion apparatus 2 Mount board | substrate 25 1st recessed part 210 1st area | region 220 2nd area | region 3 Electrical contact part 4 Optical element 5,510,520 Optical coupling member 6 Optical waveguide member 9 Opposite side connector 100 Signal transmission apparatus 101 1st Connector 102 Second connector 103 Optical cable 300 Fixing tool 305 Second concave portion 400 Holding member 403 First restricting portion 404 Second restricting portion 405 First convex portion 406 Second convex portion

Claims (7)

A mounting substrate;
An electrical contact portion provided at one end of the mount substrate;
An optical element that is electrically connected to the electrical contact portion and performs photoelectric conversion between an optical waveguide member and the electrical contact portion;
An optical coupling member provided on one surface of the mount substrate for optically coupling the optical element and the optical waveguide member;
A holding member that has elasticity and holds the optical waveguide member;
A fixture that is attached to the mount substrate so as to sandwich the holding member between the mount substrate and fixes the holding member to the mount substrate;
The electrical contact part is electrically connected to the mating connector and mechanically coupled to the mating connector by being inserted in the insertion direction orthogonal to the thickness direction of the mount substrate. Configured,
The optical waveguide member, said the penetrations direction you perpendicular to the thickness direction of the mounting substrate is configured to be held by the holding member by penetrating the holding member,
The photoelectric conversion apparatus according to claim 1, wherein the holding member is positioned with respect to both the mount substrate and the fixture . The holding member regulates movement of the holding member in a first direction orthogonal to the thickness direction of the mount substrate and orthogonal to the penetration direction by contacting at least one of the fixture and the mount substrate. It has a 1st control part. The photoelectric conversion apparatus of Claim 1 characterized by the above-mentioned. The holding member has a second restricting portion that restricts movement of the holding member in a second direction along the penetrating direction by contacting at least one of the fixture and the mount substrate. The photoelectric conversion apparatus according to claim 1 or 2. A first recess is formed on a surface of the mount substrate facing the fixture,
A second recess is formed on the surface of the fixture facing the mount substrate,
2. The photoelectric conversion apparatus according to claim 1, wherein the holding member includes a first convex portion that fits in the first concave portion and a second convex portion that fits in the second concave portion. 5. The photoelectric conversion apparatus according to claim 1, wherein the fixture has conductivity and is fixed to the mount substrate so as to cover at least the optical element. The mount substrate includes a first region and a second region having higher bending rigidity than the first region, the optical coupling member is disposed in the second region, and the electric region is disposed in the first region. The contact part is arrange | positioned. The photoelectric conversion apparatus of any one of Claims 1-5 characterized by the above-mentioned. The 1st connector using the photoelectric conversion apparatus of any one of Claims 1-6,
The 2nd connector using the photoelectric conversion apparatus of any one of Claims 1-6,
An optical cable that optically couples the optical element of the first connector and the optical element of the second connector.

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