JP6497196B2 - Resin composition, resin sheet, cured resin and resin substrate - Google Patents

Description

  The present invention relates to a resin composition containing an epoxy compound, and a resin sheet, a cured resin product, and a resin substrate using the resin composition.

  Various electronic components tend to be widely used for high temperature environment applications such as automobiles. For this reason, research and development are actively conducted on the thermal characteristics of resin substrates used in electronic components.

  In the manufacturing process of the resin substrate, after the resin composition is formed into a sheet shape, the sheet-shaped resin composition (resin sheet) is subjected to a curing reaction. Thereby, the resin substrate containing the cured reaction product (resin cured product) of the resin composition is produced.

  Various proposals have already been made regarding the composition of the resin composition. Specifically, in order to produce a resin substrate having excellent heat resistance and thermal conductivity, an epoxy resin varnish containing an epoxy compound and a curing agent is used to crosslink the epoxy compound ( For example, see Patent Document 1.)

JP 2008-195835 A

  However, there is still room for improvement because sufficient thermal characteristics have not yet been obtained for the resin substrate.

  The present invention has been made in view of such problems, and an object thereof is to provide a resin composition, a resin sheet, a resin cured product, and a resin substrate capable of obtaining excellent thermal characteristics.

The resin composition of the present invention includes an epoxy compound containing two or more epoxy groups in one molecule and having an epoxy equivalent of 370 or less, a triphenylbenzene compound represented by the following formula (1) , Inorganic particles are included.

（Ｒ１〜Ｒ１５のそれぞれは、水素基（−Ｈ）および反応基のうちのいずれかであり、その反応基は、水酸基（−ＯＨ）およびアミノ基（−ＮＨ₂ ）のうちのいずれかである。ただし、Ｒ１〜Ｒ５のうちの少なくとも１つは、反応基である。Ｒ６〜Ｒ１０のうちの少なくとも１つは、反応基である。Ｒ１１〜Ｒ１５のうちの少なくとも１つは、反応基である。）

(Each of R1 to R15 is a hydrogen group (—H) or a reactive group, and the reactive group is either a hydroxyl group (—OH) or an amino group (—NH ₂ )). Provided that at least one of R1 to R5 is a reactive group, at least one of R6 to R10 is a reactive group, and at least one of R11 to R15 is a reactive group. .)

  The above “epoxy equivalent” is a value (molecular weight per one epoxy group) obtained by dividing the molecular weight of the epoxy compound by the number of functional groups (epoxy groups).

  The resin sheet of the present invention includes a resin composition, and the resin composition has the same configuration as the above-described resin composition of the present invention.

  The cured resin product of the present invention includes a cured reaction product of the resin composition, and the resin composition has the same configuration as the above-described resin composition of the present invention.

  The resin substrate of the present invention includes a cured reaction product of one or more resin sheets, the resin sheet includes a resin composition, and the resin composition has the same configuration as the above-described resin composition of the present invention. Is.

According to the resin composition of the present invention, an epoxy compound containing two or more epoxy groups in one molecule and having an epoxy equivalent of 370 or less, a triphenylbenzene compound represented by the formula (1), an inorganic compound Since it contains particles , excellent thermal characteristics can be obtained. Moreover, the same effect can be acquired also in the resin sheet of this invention, resin cured material, and a resin substrate.

It is sectional drawing showing the structure of the resin sheet using the resin composition of this invention. It is sectional drawing showing the other structure of the resin sheet using the resin composition of this invention. It is sectional drawing showing the further another structure of the resin sheet using the resin composition of this invention. It is sectional drawing showing the structure of the resin substrate using the resin cured material of this invention. It is sectional drawing showing the other structure of the resin substrate using the resin cured material of this invention. It is sectional drawing showing the further another structure of the resin substrate using the resin cured material of this invention. It is sectional drawing showing the further another structure of the resin substrate using the resin cured material of this invention. It is sectional drawing for demonstrating the manufacturing method of the resin substrate shown in FIG.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The order of explanation is as follows.

1. 1. Resin composition 1-1. Configuration 1-2. Manufacturing method 1-3. Action and effect Resin sheet 2-1. Configuration 2-2. Manufacturing method 2-3. 2. Action and effect 3. Resin cured product 3-1. Configuration 3-2. Manufacturing method 3-3. Action and effect Resin substrate 4-1. Configuration 4-2. Manufacturing method 4-3. Action and effect

  One embodiment of the present invention described below is an example for explaining the present invention. Thus, the present invention is not limited to only one embodiment described herein. One embodiment of the present invention can be changed to various embodiments without departing from the gist of the present invention.

<1. Resin composition>
First, the resin composition of one embodiment of the present invention will be described.

  The resin composition is used for producing a resin sheet, a resin cured product, a resin substrate, and the like, which will be described later. However, the use of the resin composition may be other uses.

<1-1. Configuration>
The resin composition includes one or more epoxy groups and an epoxy compound having an epoxy equivalent of 370 or less (hereinafter referred to as “low equivalent epoxy compound”) and the following formula (1). And a triphenylbenzene compound.

（Ｒ１〜Ｒ１５のそれぞれは、水素基および反応基のうちのいずれかであり、その反応基は、水酸基およびアミノ基のうちのいずれかである。ただし、Ｒ１〜Ｒ１５のうちの少なくとも１つは、反応基である。）

(Each of R1 to R15 is either a hydrogen group or a reactive group, and the reactive group is either a hydroxyl group or an amino group, provided that at least one of R1 to R15 is , Reactive group.)

  As described above, the resin composition described here is used for producing an intermediate product such as a resin sheet and also producing a final product (resin cured product) such as a resin substrate. The “intermediate product” means a substance in a state where the curing reaction (crosslinking reaction) of the resin composition is not substantially completed, as will be described later. The “final product” means a substance in a state where the curing reaction of the resin composition is substantially completed, as will be described later.

  The low equivalent epoxy compound which is a thermosetting resin is a so-called main agent. On the other hand, a triphenylbenzene compound used together with a low equivalent epoxy compound and containing a reactive group is a so-called curing agent. This curing agent is used to advance the crosslinking reaction of the low equivalent epoxy compound using the reactive group.

  The reason why the resin composition contains the triphenylbenzene compound together with the low-equivalent epoxy compound is that the heat resistance and thermal conductivity of the cured resin are improved. Hereinafter, an epoxy compound containing one or more epoxy groups and having an epoxy equivalent greater than 370 is referred to as a “high equivalent epoxy compound”.

  Specifically, when a high equivalent epoxy compound is used as the main agent and a triphenylbenzene compound is used as the curing agent, the proportion of the triphenylbenzene compound in the resin composition becomes relatively small. In this case, since the ratio of the skeleton (1,3,5-triphenylbenzene) of the triphenylbenzene compound in the resin composition is relatively small, the crosslinking density is lowered during the curing reaction. Thereby, the glass transition point of the resin cured product does not become sufficiently high, and sufficient thermal conductivity cannot be obtained in the resin cured product.

  When a low-equivalent epoxy compound is used as the main agent and another compound other than the triphenylbenzene compound is used as the curing agent, the skeleton of the triphenylbenzene compound (1,3,5-triphenylbenzene) in the resin composition Will not be included. Thereby, since a crosslinking density falls significantly, in a resin cured material, both a glass transition point and thermal conductivity fall fundamentally.

  On the other hand, when a low equivalent epoxy compound is used as the main agent and a triphenylbenzene compound is used as the curing agent, the proportion of the triphenylbenzene compound in the resin composition becomes relatively large. In this case, since the ratio of the skeleton (1,3,5-triphenylbenzene) of the triphenylbenzene compound in the resin composition is relatively large, the crosslinking density is increased during the curing reaction. Thereby, while the glass transition point of resin cured material becomes high, high heat conductivity is obtained in the resin cured material.

  This resin composition may be in a solid form such as a powder form or a lump form, in a liquid form, or in a state where both are mixed. The state of this resin composition is appropriately determined according to the application.

  In addition, the mixing ratio of the low equivalent epoxy compound and the triphenylbenzene compound is not particularly limited. However, when a low-equivalent epoxy compound containing an epoxy group and a triphenylbenzene compound containing a reactive group undergo a crosslinking reaction, generally one epoxy group reacts with one active hydrogen in the reactive group. Therefore, in order to increase the reaction efficiency between the low equivalent weight epoxy compound and the triphenylbenzene compound, the total number of epoxy groups contained in the low equivalent weight epoxy compound and the total number of active hydrogen contained in the triphenylbenzene compound Is preferably set so that the ratio is 1: 1.

[Low equivalent epoxy compound]
The low-equivalent epoxy compound as the main agent is one or more of compounds having one or more epoxy groups as functional groups in one molecule and having an epoxy equivalent of 370 or less. As described above, the “epoxy equivalent” is a value obtained by dividing the molecular weight of a low equivalent epoxy compound by the number of functional groups (epoxy groups), and is a so-called molecular weight per one epoxy group. Especially, it is preferable that the low equivalent epoxy compound contains two or more epoxy groups in one molecule. This is because the low-equivalent epoxy compound and the triphenylbenzene compound easily react.

  The kind of the low equivalent epoxy compound is not particularly limited as long as it is a compound containing one or more epoxy groups and having an epoxy equivalent of 370 or less as described above. When the low equivalent weight epoxy compound includes a skeleton and one or more substituents introduced into the skeleton, the epoxy group may be introduced into the skeleton or may be introduced into the substituent. It may be introduced into both the skeleton and the substituent.

  Moreover, it is preferable that the low-equivalent epoxy compound contains a mesogen skeleton as a skeleton in one molecule. The reason is as follows.

  1stly, in low equivalent epoxy compounds, since benzene rings become easy to overlap, the distance between the benzene rings becomes small. Thereby, in a resin composition, the density of a low equivalent epoxy compound improves. In addition, in the cured resin, it is difficult to scatter the lattice vibration of the molecule, so that high thermal conductivity can be obtained.

  In particular, the scattering phenomenon of the lattice vibration of the molecule described above is a major factor that lowers the thermal conductivity. Therefore, the scattering phenomenon of the lattice vibration of the molecule is suppressed, so that the decrease of the thermal conductivity is remarkably suppressed. .

  Second, low-equivalent epoxy compounds and triphenylbenzene compounds are included in the benzene ring contained in the mesogen skeleton of the low-equivalent epoxy compound and the skeleton of the triphenylbenzene compound (1,3,5-triphenylbenzene). It becomes easy to overlap with the benzene ring. Therefore, high thermal conductivity is obtained for the same reason as the case where the benzene rings easily overlap each other in the low equivalent epoxy compounds described above.

  The “mesogenic skeleton” is a general term for an atomic group including two or more aromatic rings and having rigidity and orientation. Specifically, the mesogenic skeleton is, for example, a skeleton that includes two or more benzene rings and in which the benzene rings are bonded to each other through either a single bond or a non-single bond.

  When three or more benzene rings are bonded, the direction of bonding is not particularly limited. That is, three or more benzene rings may be bonded so as to be linear, or may be bonded so as to be bent one or more times in the middle, or bonded so as to branch in two or more directions. May be.

  A “single bond” is a so-called carbon-carbon bond. On the other hand, “non-single bond” is a general term for a divalent group containing one or more constituent elements and one or more multiple bonds. Specifically, the non-single bond includes, for example, any one or more of constituent elements such as carbon (C), nitrogen (N), oxygen (O), and hydrogen (H). . Non-single bonds include one or both of double bonds and triple bonds as multiple bonds.

  The mesogen skeleton may contain only a single bond, may contain only a non-single bond, or may contain both a single bond and a non-single bond as the type of bond between benzene rings. . Further, the number of non-single bonds may be only one, or two or more.

  Specific examples of the non-single bond include bonds represented by the following formulas (2-1) to (2-10). In addition, the arrow shown to each of Formula (2-6) and Formula (2-10) represents the coordinate bond.

  Specific examples of the mesogenic skeleton include biphenyl and terphenyl. The terphenyl may be o-terphenyl, m-terphenyl, or p-terphenyl.

[Triphenylbenzene compound]
The triphenylbenzene compound that is a curing agent is any one or two or more of compounds containing a skeleton (1,3,5-triphenylbenzene) and a reactive group. That is, in the triphenylbenzene compound, 1,3,5-triphenylbenzene is included as a skeleton in one molecule, and a reactive group is introduced into the skeleton.

  This skeleton (1,3,5-triphenylbenzene) has one benzene ring (central benzene ring) located in the center and three benzene rings (peripheral benzene rings) located around the central benzene ring. Contains.

  In the following, the peripheral benzene ring in which R1 to R5 are introduced is referred to as “first peripheral benzene ring”, the peripheral benzene ring in which R6 to R10 is introduced is referred to as “second peripheral benzene ring”, and R11 to R15 are introduced. The surrounding benzene ring is called “third peripheral benzene ring”.

  Each type of R1 to R15 is not particularly limited as long as it is any one of a hydrogen group and a reactive group. That is, each of R1 to R15 may be a hydrogen group or a reactive group.

  This reactive group is either a hydroxyl group or an amino group. That is, the triphenylbenzene compound may contain only a hydroxyl group as a reactive group, may contain only an amino group, or may contain both a hydroxyl group and an amino group.

  However, one or more of R1 to R15 are reactive groups. This is because the triphenylbenzene compound must contain one or more reactive groups for the triphenylbenzene compound to function as a curing agent. As long as this condition is satisfied, the number of reactive groups and the introduction position are not particularly limited. Especially, it is preferable that two or more of R1-R15 are reactive groups. This is because the low-equivalent epoxy compound and the triphenylbenzene compound easily react.

  In particular, regarding the types of R1 to R15, it is preferable that one or more of the following three conditions are satisfied.

  As the first condition, one or more of R1 to R5 are reactive groups, one or more of R6 to R10 are reactive groups, and one or more of R11 to R15 are reactive groups. Is preferred. When the total number of reactive groups is three or more, the introduction positions of the three or more reactive groups are dispersed in the first to third peripheral benzene rings, so that the low equivalent epoxy compound and the triphenylbenzene compound react with each other. It is easy to do.

  As the second condition, it is preferable that one of R1 to R5 is a reactive group, one of R6 to R10 is a reactive group, and one of R11 to R15 is a reactive group. When the total number of reactive groups is 3, the introduction positions of the three reactive groups are dispersed in the first to third peripheral benzene rings, so that the low-equivalent epoxy compound and the triphenylbenzene compound are easily reacted. Because.

  As the third condition, it is preferable that each of R1 to R15 is any one of a hydrogen group and a hydroxyl group, or each of R1 to R15 is any one of a hydrogen group and an amino group. That is, the triphenylbenzene compound preferably contains only a hydroxyl group as a reactive group or contains only an amino group as a reactive group. This is because sufficient reactivity is obtained in the triphenylbenzene compound, and the triphenylbenzene compound is easily synthesized.

  Specific examples of the triphenylbenzene compound include compounds represented by the following formula (1-1) and formula (1-2). This is because the above first to third conditions are satisfied.

  The compound represented by Formula (1-1) is 1,3,5-tris (4-hydroxyphenyl) benzene. This compound contains only hydroxyl groups as reactive groups, and the number of hydroxyl groups is three. The compound shown in Formula (1-2) is 1,3,5-tris (4-aminophenyl) benzene. This compound contains only amino groups as reactive groups, and the number of amino groups is three.

[Other materials]
This resin composition may contain any one kind or two or more kinds of other materials together with the above-described low equivalent epoxy compound and triphenylbenzene compound.

  The type of the other material is not particularly limited, and examples thereof include additives, solvents, other epoxy compounds, other curing agents, and inorganic particles.

  Examples of the additive include a curing catalyst and a coupling agent. Specific examples of the curing catalyst include phosphine, imidazole, and derivatives thereof, and examples of the imidazole derivative include 2-ethyl-4-methylimidazole. Specific examples of the coupling agent include a silane coupling agent and a titanate coupling agent.

  The solvent is used for dispersing or dissolving the low-equivalent epoxy compound and the triphenylbenzene compound in the liquid resin composition. This solvent is one or more of organic solvents, and specific examples of the organic solvent include methyl ethyl ketone, methyl cellosolve, methyl isobutyl ketone, dimethylformamide, propylene glycol monomethyl ether, toluene, xylene, Acetone, 1,3-dioxolane, N-methylpyrrolidone and γ-butyrolactone.

  Other epoxy compounds are high equivalent epoxy compounds as described above. Specific examples of the other epoxy compounds include glycidyl ether type epoxy compounds, glycidyl ester type epoxy compounds, glycidyl amine type epoxy compounds, novolac type epoxy compounds, cyclic aliphatic type epoxy compounds, and long chain aliphatic type epoxy compounds. . Examples of the glycidyl ether type epoxy compound include a bisphenol A type epoxy compound and a bisphenol F type epoxy compound. The novolac type epoxy compound includes, for example, a cresol novolac type epoxy compound and a phenol novolac type epoxy compound. In addition, the epoxy compound may be a flame retardant epoxy compound, a hydantoin epoxy resin, an isocyanurate epoxy compound, or the like.

  In addition, the specific example of a glycidyl ether type epoxy compound will not be specifically limited if it is a compound containing the structure (group) of a glycidyl ether type. As described above, the type is not limited as long as it includes a specific structure, and the same applies to specific examples of other epoxy compounds such as a glycidyl ester type epoxy compound.

  Other curing agents are compounds that do not contain 1,3,5-triphenylbenzene as a skeleton, but contain one or more reactive groups. Specific examples of the other curing agent include phenol, amine and acid anhydride.

The inorganic particles are one kind or two or more kinds of particulate inorganic materials. Specific examples of the inorganic particles include magnesium oxide (MgO), aluminum oxide (Al ₂ O ₃ ), and boron nitride (BN).

<1-2. Manufacturing method>
This resin composition is manufactured, for example, by the following procedure.

  When obtaining a solid resin composition, a low-equivalent epoxy compound and a triphenylbenzene compound are mixed. When using a low equivalent epoxy compound such as a lump, the low equivalent epoxy compound may be pulverized before mixing. As described above, the triphenylbenzene compound may be pulverized before mixing. Thereby, the solid resin composition containing a low equivalent epoxy compound and a triphenylbenzene compound is obtained.

  In addition, after obtaining a solid resin composition, you may shape | mold a resin composition using a metal mold | die etc. as needed.

  When obtaining a liquid resin composition, after adding a solvent to the mixture of the low equivalent epoxy compound and the triphenylbenzene compound, the solvent is stirred using a stirring device such as a mixer. Thereby, the low equivalent epoxy compound and the triphenylbenzene compound are dispersed or dissolved in the solvent. Therefore, a liquid resin composition containing a low equivalent epoxy compound and a triphenylbenzene compound is obtained.

  In addition, when obtaining a liquid resin composition, the solid resin composition may be heated to melt the resin composition. In this case, if necessary, after molding a melt of the resin composition using a mold or the like, the melt may be cooled.

  In addition, as epoxy compounds, such as a low equivalent epoxy compound, solid compounds, such as a powder form and a lump, may be used, a liquid compound may be used, and both may be used together. Similarly, as a curing agent such as a triphenylbenzene compound, a solid compound such as powder and lump may be used, a liquid compound may be used, or both may be used in combination. . What has been described here also applies to the other materials described above.

<1-3. Action and Effect>
According to this resin composition, the low-equivalent epoxy compound and the triphenylbenzene compound represented by the formula (1) are included. In this case, as described above, since the crosslinking density is increased during the curing reaction, the glass transition point of the cured resin is increased, and high thermal conductivity is obtained in the cured resin. Therefore, excellent thermal characteristics can be obtained.

  In particular, in formula (1), one or more of R1 to R5 are reactive groups, one or more of R6 to R10 are reactive groups, and one or more of R11 to R15 are reactive groups. If it is, since a low equivalent epoxy compound and a triphenylbenzene compound will become easy to react, a higher effect can be acquired. In this case, if one of R1 to R5 is a reactive group, one of R6 to R10 is a reactive group, and one of R11 to R15 is a reactive group, the same effect can be obtained. Can be obtained.

  In Formula (1), if each of R1 to R15 is any one of a hydrogen group and a hydroxyl group, or each of R1 to R15 is any one of a hydrogen group and an amino group, a higher effect is obtained. Can be obtained.

  Moreover, if the triphenylbenzene compound contains one or both of the compounds represented by formula (1-1) and formula (1-2), higher effects can be obtained.

<2. Resin sheet>
Next, the resin sheet of one embodiment of the present invention will be described. Below, the resin composition already demonstrated is called "resin composition of this invention."

  The resin sheet contains the resin composition of the present invention. The structure of this resin sheet will not be specifically limited if the resin composition of this invention is included. That is, the resin sheet may not include other components together with the resin composition, or may include other components together with the resin composition.

<2-1. Configuration>
FIG. 1 shows a cross-sectional configuration of the resin sheet 10. The resin sheet 10 is a resin composition (resin composition layer 1) formed into a sheet shape, and more specifically, is a single-layer body including one resin composition layer 1. The thickness of the resin sheet 10 is not particularly limited. The configuration of the resin composition layer 1 is the same as the configuration of the resin composition of the present invention except that it is formed into a sheet shape.

  FIG. 2 shows a cross-sectional configuration of the resin sheet 20. The resin sheet 20 is a laminate in which a plurality of resin composition layers 1 are laminated. In the resin sheet 20, the number of laminated resin composition layers 1 (the number of laminated layers) is not particularly limited as long as it is two or more. In FIG. 2, the case where the number of lamination | stacking of the resin composition layer 1 is 3 layers is shown, for example. In addition, in the resin sheet 20, the structure of each resin composition layer 1 is not specifically limited. That is, the structure of the resin composition in each resin composition layer 1 may be the same or different. Of course, the structure of the resin composition in some resin composition layers 1 among the plurality of resin composition layers 1 may be the same.

  FIG. 3 illustrates a cross-sectional configuration of the resin sheet 30. The resin sheet 30 includes a core material 2 together with a resin composition (resin composition layer 1) formed into a sheet shape. For example, the resin sheet 30 has three layers in which the core material 2 is sandwiched between two resin composition layers 1 It has a structure.

  The core material 2 includes, for example, one or more of a fibrous substance and a non-fibrous substance, and is formed into a sheet shape. Examples of the fibrous material include glass fiber, carbon fiber, metal fiber, natural fiber, and synthetic fiber, and examples of the fibrous material formed into a sheet include a woven fabric and a non-woven fabric. Specific examples of the synthetic fiber include polyester fiber and polyamide fiber. The non-fibrous substance is, for example, a polymer compound, and the non-fibrous substance formed into a sheet is, for example, a polymer film. Specific examples of the polymer compound include polyethylene terephthalate (PET).

  The thickness of the core material 2 is not particularly limited, but is preferably 0.03 mm to 0.2 mm, for example, from the viewpoints of mechanical strength and dimensional stability.

  In addition, the resin composition layer 1 used for the resin sheet 30 may be only one layer, or two or more layers. It is the same for the core material 2 that one layer or two or more layers may be used.

  The resin sheet 30 is not limited to a three-layer structure in which the core material 2 is sandwiched between the two resin composition layers 1 but has a two-layer structure in which the resin composition layer 1 and the core material 2 are laminated. May be. Two or more resin sheets 30 may be laminated.

<2-2. Manufacturing method>
When manufacturing the resin sheet 10, the procedure similar to the manufacturing method of the resin composition of this invention is used, for example.

  Specifically, in the case of using a solid resin composition, the resin composition is molded so as to be in a sheet shape, and the resin composition layer 1 is formed. In this case, the solid resin composition may be molded as it is, or a melt of the solid resin composition may be molded. When molding the melt, first, the solid resin composition is heated to melt the resin composition. Subsequently, after molding a melt of the resin composition, the molded product is cooled.

  In the case of using a liquid resin composition, the liquid resin composition is applied to the surface of a support such as a polymer film, and then the liquid resin composition is dried. Thereby, since the solvent contained in the liquid resin composition is volatilized, the resin composition is formed into a sheet shape on the surface of the support. That is, the resin composition forms a film on the surface of the support. Therefore, the resin composition layer 1 is formed. After that, the resin composition layer 1 is peeled from the support.

  When manufacturing the resin sheet 20, the formation procedure of the above-mentioned resin composition layer 1 is repeated, and the several resin composition layer 1 is laminated | stacked. In this case, after forming the laminated body in which the plurality of resin composition layers 1 are laminated, the laminated body may be pressurized while heating the laminated body as necessary. Thereby, the resin composition layers 1 adhere to each other.

  When manufacturing the resin sheet 30 having a three-layer structure, for example, after applying a liquid resin composition to both surfaces of the core material 2, the liquid resin composition is dried. Thereby, the two resin composition layers 1 are formed so as to sandwich the core material 2. In the application step of the liquid resin composition, when the core material 2 contains a fibrous substance, the surface of the core material 2 is covered with the liquid resin composition, and the liquid resin composition A part of the resin composition is impregnated into the core material 2. When the core material 2 contains a non-fibrous substance, the surface of the core material 2 is covered with the liquid resin composition.

  Of course, when the resin sheet 30 having a two-layer structure is manufactured, the liquid resin composition may be applied only to one side of the core material 2.

  In addition, when manufacturing the resin sheet 30, you may immerse the core material 2 in a liquid resin composition, for example. In this case, after taking out the core material 2 from the liquid resin composition, the core material 2 is dried. Thereby, the resin composition layer 1 is formed on both surfaces of the core material 2.

  Alternatively, the solid resin composition may be heated to melt the resin composition, and then the core material 2 may be immersed in the melt. In this case, after the core material 2 is taken out from the melt, the core material 2 is cooled. Thereby, the resin composition layer 1 is formed on both surfaces of the core material 2.

  Here, when using a liquid resin composition in order to manufacture the resin sheets 10-30, as mentioned above, a liquid resin composition film-forms (solidifies) in a drying process. However, “filming (solidification)” described here means that a substance in a fluid state (liquid state) changes to a self-sustainable state (solid state), so-called semi-curing. Including state. That is, when the liquid resin composition forms a film, since the curing reaction is not substantially completed, the resin composition is substantially in an uncured state. For this reason, it is preferable that the drying conditions when forming the liquid resin composition into a film are conditions that do not substantially complete the curing reaction. Specifically, the drying temperature is 60 ° C. to 150 ° C. and the drying time is preferably 1 minute to 120 minutes. The drying temperature is 70 ° C. to 120 ° C. and the drying time is 3 minutes to 90 minutes. More preferably.

  The conditions that do not substantially complete the curing reaction are preferable in the case of using a solid resin composition melt to produce the resin sheets 10 to 30. That is, it is preferable that the heating conditions (heating temperature and heating time) for melting the solid resin composition are conditions that do not substantially complete the curing reaction.

<2-3. Action and Effect>
According to this resin sheet, since the above-described resin composition of the present invention is included, excellent thermal characteristics can be obtained for the same reason as that of the resin composition. Other operations and effects are the same as those of the resin composition of the present invention.

<3. Cured resin>
Next, the cured resin according to an embodiment of the present invention will be described.

<3-1. Configuration>
The resin cured product includes a curing reaction product of the resin composition described above, and more specifically includes a curing reaction product of a low equivalent epoxy compound and a triphenylbenzene compound. In this cured reaction product, since the epoxy group contained in the low equivalent weight epoxy compound and the reactive group contained in the triphenylbenzene compound undergo a crosslinking reaction, a so-called crosslinked network is formed.

<3-2. Manufacturing method>
In producing this cured resin, the resin composition is heated. Thereby, since the resin composition undergoes a curing reaction, a cured resin product that is a cured reaction product is obtained.

  The heating conditions such as the heating temperature and the heating time are not particularly limited. However, unlike the above-described method for producing a resin sheet, it is preferable that the curing reaction is substantially advanced.

<3-3. Action and Effect>
According to the cured resin, since the cured reaction product of the resin composition of the present invention described above is included, excellent thermal characteristics can be obtained for the same reason as that of the resin composition. Other operations and effects are the same as those of the resin composition of the present invention.

<4. Resin substrate>
Next, the resin substrate of one embodiment of the present invention will be described. Hereinafter, the already explained resin sheet is referred to as “resin sheet of the present invention” and the cured resin product is referred to as “resin cured product of the present invention”.

  The resin substrate is one of the application examples of the above-described cured resin, and the resin substrate described here is, for example, a cured reaction product of the resin sheet of the present invention. The structure of the resin substrate is not particularly limited as long as it includes one or two or more resin sheet curing reaction products.

<4-1. Configuration>
FIG. 4 illustrates a cross-sectional configuration of the resin substrate 40. The resin substrate 40 is a cured reaction product of the resin sheet 10 shown in FIG. That is, the resin substrate 40 is a cured reaction product (resin cured product layer 3) of the resin composition layer 1, and more specifically, a single-layer body including one resin cured product layer 3.

  FIG. 5 illustrates a cross-sectional configuration of the resin substrate 50. The resin substrate 50 is a cured reaction product of the resin sheet 20 shown in FIG. 2, and more specifically, a laminate in which a plurality of cured reaction products (resin cured product layers 3) of the resin composition layer 1 are laminated. Is the body. The number of laminated resin cured product layers 3 (the number of laminated layers) is not particularly limited as long as it is two or more. In FIG. 5, the case where the number of lamination | stacking of the resin cured material layer 3 is 3 layers is shown, for example.

  FIG. 6 illustrates a cross-sectional configuration of the resin substrate 60. This resin substrate 60 is a cured reaction product of the resin sheet 30 shown in FIG. 3, and more specifically has a three-layer structure in which one core material 2 is sandwiched between two resin cured product layers 3. ing.

  FIG. 7 shows a cross-sectional configuration of the resin substrate 70. In this resin substrate 70, two or more cured reaction products of the resin sheet 30 are laminated. Here, for example, the cured reaction products of three resin sheets 30 are laminated. That is, a three-layer structure in which one core material 2 is sandwiched between two resin cured product layers 3 is formed, and the three-layer structure is stacked in three stages.

  Note that the number of stacked three-layer structures (the number of stages) is not limited to three, but may be two or four or more. The number of steps can be appropriately set based on conditions such as the thickness and strength of the resin substrate 70.

  Although not shown here, the resin substrate 70 may include a metal layer. For example, the metal layer is provided on the surface of the uppermost resin cured product layer 3 and also on the surface of the lowermost resin cured product layer 3.

  The metal layer includes, for example, any one or more of copper, nickel, aluminum, and the like. In addition, the metal layer includes, for example, any one or two or more of metal foil and metal plate, and may be a single layer or a multilayer. Although the thickness of a metal layer is not specifically limited, For example, they are 3 micrometers-150 micrometers. The resin substrate 70 provided with this metal layer is a so-called metal-clad substrate.

  The metal layer may be provided only on the surface of the uppermost resin cured product layer 3, or may be provided only on the surface of the lowermost resin cured product layer 3.

  The resin substrate 70 provided with this metal layer may be subjected to any one type or two or more types of various processes such as an etching process and a drilling process as necessary. In this case, it is good also as a multilayer board | substrate by overlapping the resin substrate 70, the metal layer to which the above-mentioned various processes were performed, and any 1 type or 2 types or more of the resin sheets 10-30.

  As described above, the metal layer may be provided or a multilayer substrate may be used, not only for the resin substrate 70 but also for the resin substrates 40 to 60 described above.

<4-2. Manufacturing method>
When manufacturing the resin substrate 40, the resin sheet 10 is heated. Thereby, as described above, since the curing reaction of the resin composition is substantially completed in the resin composition layer 1, as shown in FIG. 4, the resin curing that is a curing reaction product of the resin composition layer 1. The physical layer 3 is formed.

  When manufacturing the resin substrate 50, the resin sheet 20 is heated. Thereby, as described above, since the curing reaction of the resin composition is substantially completed in each resin composition layer 1, the cured reaction products of the plurality of resin composition layers 1 are used as shown in FIG. 5. A plurality of cured resin layers 3 are formed.

  When manufacturing the resin substrate 60, the resin sheet 30 is heated. Thereby, as described above, the curing reaction of the resin composition is substantially completed in each resin composition layer 1, and therefore, as shown in FIG. 6, the resin composition layer 1 is formed on both surfaces of the core material 2. A cured resin layer 3 that is a cured reaction product is formed.

  FIG. 8 illustrates a cross-sectional configuration corresponding to FIG. 7 in order to describe a method for manufacturing the resin substrate 70. When manufacturing this resin substrate 70, first, as shown in FIG. 8, three resin sheets 30 are laminated. Thereby, the laminated body of the three resin sheets 30 is obtained. Thereafter, the laminate is heated. Thereby, in each resin sheet 30, since the curing reaction of the resin composition is substantially completed in each resin composition layer 1, the resin composition is formed on both surfaces of each core material 2 as shown in FIG. A cured resin layer 3 that is a cured reaction product of the layer 1 is formed.

  Here, when using the melt of a resin composition in order to manufacture the resin sheets 10-30, as mentioned above, it avoids that a curing reaction is substantially completed at the time of the melting of a resin composition. For this reason, it is preferable to lower the temperature at which the resin composition is heated to obtain a melt than the temperature at which the curing reaction of the resin composition is substantially completed. In other words, the melting temperature of the resin composition is preferably lower than the temperature at which the curing reaction of the resin composition is substantially completed.

  For example, in a molding process using a mold, generally, the maximum heating temperature (maximum temperature) during molding is about 250 ° C. For this reason, it is preferable that the melting temperature of a resin composition is a temperature lower than 250 degreeC, and it is more preferable that it is 200 degrees C or less.

  The “melting temperature” described here is a temperature at which the resin composition changes from a solid state to a fluidized (melted) state while avoiding that the curing reaction of the resin composition is substantially completed. In order to specify the melting temperature, for example, the state of the resin composition is visually observed while heating the resin composition using a heating tool such as a hot plate. In this case, the heating temperature is gradually increased while mixing the resin composition using a spatula or the like. Thereby, the temperature at which the resin composition starts to melt is defined as the melting temperature.

  As described above, when the maximum temperature at the time of molding is about 250 ° C., for example, the heating temperature at the time of molding is 50 ° C. or more higher than the melting temperature of the resin composition, specifically 100 ° C. to While being 250 degreeC, heating time shall be about 1 minute-300 minutes. Thereby, since the resin composition is sufficiently heated at a temperature at which the curing reaction is substantially completed, the curing reaction proceeds uniformly.

  In the molding process using a mold, the resin composition may be pressurized using a press or the like, or the pressure in the environment where the resin composition exists may be increased or decreased as necessary. .

  In particular, when the resin substrate 70 is manufactured, it is preferable to heat the laminate while pressing the laminate in the lamination direction of the resin sheets 30. This is because the adhesion between the resin sheets 30 is improved. The heating conditions and pressurizing conditions in this case are not particularly limited. For example, the heating temperature is 100 ° C. to 250 ° C., the heating time is 1 minute to 300 minutes, and the pressing pressure is 0.5 MPa to 8 MPa.

<4-3. Action and Effect>
According to this resin substrate, since the cured resin of the present invention is included, excellent thermal characteristics can be obtained for the same reason as that of the cured resin. Other operations and effects are the same as those of the cured resin product of the present invention.

  Embodiments of the present invention will be described in detail.

(Experimental Examples 1-9)
By the procedure described below, as shown in FIG. 5, a resin substrate 50 made of a laminate in which a plurality of cured resin layers 3 were laminated was manufactured. In addition, content (mass part) demonstrated below is the value converted into solid content.

  When manufacturing the resin substrate 50, the epoxy compound, the hardening | curing agent, and the additive (curing catalyst) were mixed first. In this case, the mixing ratio of the epoxy compound and the curing agent is set so that the ratio of the number of epoxy groups contained in the epoxy compound to the number of active hydrogens contained in the curing agent is 1: 1. It was adjusted.

  Each type of epoxy compound and curing agent and the content (parts by mass) in the mixture are as shown in Table 1. As epoxy compounds, YH-434L (Chemical A) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., BREN-105 (Chemical B) manufactured by Nippon Kayaku Co., Ltd., EPICLON152 (Chemical C) manufactured by DIC Corporation, and Mitsubishi Chemical Corporation 1001 (Chemical D) and 1003 (Chemical E) were used. The epoxy equivalents of these epoxy compounds are as shown in Table 1. As the curing agent, the compound (THPB) represented by the formula (1-1), the compound (TAPB) represented by the formula (1-2), and HE-200 (BA) manufactured by Air Water Co., Ltd. were used. . While using 2-ethyl-4-methylimidazole as a curing catalyst, the addition amount of the curing catalyst was 1% by mass with respect to the total of the epoxy compound and the curing agent. The presence or absence of the “TPB skeleton” shown in Table 1 indicates whether or not the curing agent contains 1,3,5-triphenylbenzene as the skeleton.

  Subsequently, the mixture was added to a solvent (methyl ethyl ketone), and then the solvent was stirred. Thereby, since the epoxy compound and the hardening | curing agent were melt | dissolved in the solvent, the liquid resin composition was obtained. In this case, the concentration of the solid content (epoxy compound and curing agent) was 65% by mass.

  Subsequently, after a liquid resin composition was applied to the surface of the support (PET film, thickness = 0.05 mm), the liquid resin composition was dried (temperature = 100 ° C.). Thereby, since the resin composition layer 1 was formed on the surface of the support, the resin sheet 10 (thickness = 0.1 mm) which was a single layer body shown in FIG. 1 was obtained. After that, the resin sheet 10 was peeled from the support.

  Subsequently, ten resin sheets 10 were stacked to produce a resin sheet 20 (the number of laminated resin composition layers 1 = 10 layers), which is the laminate shown in FIG. Finally, the laminate is heated (temperature = 170 ° C.) and pressurized (pressure = 1 MPa, time = 20 minutes) using a flat plate press, and then the laminate is further heated (temperature = 200 ° C.) and pressurized ( Pressure = 4 MPa, time = 1 hour). In this heating step, since the curing reaction of the resin composition was substantially completed in each resin composition layer 1, the cured resin layer 3 including the cured reaction product of the resin composition was formed. Thus, the resin substrate 50 (the number of laminated resin cured product layers 3 = 10 layers, thickness = 0.9 mm) was completed.

  When the thermal characteristics of the resin substrate 50 (resin cured product layer 3) were examined, the results shown in Table 1 were obtained. Here, heat resistance and thermal conductivity were examined.

  When examining the heat resistance, the glass transition point (° C.) of the resin substrate 50 was measured using a dynamic viscoelasticity measuring device (DMA). Specifically, first, the resin substrate 50 was cut to produce a rectangular measurement sample (3 mm × 25 mm). Subsequently, the storage elastic modulus was measured using a dynamic viscoelasticity measuring apparatus (DVE-V4 type manufactured by Rheology Co., Ltd.) while heating the measurement sample. In this case, the heating temperature was increased from 25 ° C. to 300 ° C. with a temperature increase rate of 5 ° C./min. Finally, the heating temperature corresponding to the inflection point of the storage modulus was taken as the glass transition point.

When examining thermal conductivity, the thermal conductivity (W / (m · K)) of the resin substrate 50 was measured. Specifically, first, the resin substrate 50 was cut to produce a circular measurement sample (diameter = 10 mm, thickness = 0.9 mm). Subsequently, the measurement sample was analyzed using a thermal conductivity measuring device (TC series manufactured by Advance Riko Co., Ltd. (formerly ULVAC Riko Co., Ltd.)), and the thermal diffusion coefficient α (m ² / s) was measured. Further, the specific heat Cp of the measurement sample was measured using differential scanning calorimetry (DSC) using sapphire as a standard sample. Furthermore, the density r of the measurement sample was measured using the Archimedes method. Finally, thermal conductivity λ (W / (m · K)) was calculated based on the following mathematical formula (A).

λ = α × Cp × r (A)
(Λ is thermal conductivity (W / (m · K)), α is thermal diffusivity (m ² / s), Cp is specific heat (J / kg · K), and r is density (kg / m ³ ). .)

  The glass transition point and the thermal conductivity varied greatly depending on the composition of the resin composition.

  Specifically, a triphenylbenzene compound was used as a curing agent, but when a low equivalent epoxy compound was not used as an epoxy compound (Experimental Examples 7 and 8), both the glass transition point and the thermal conductivity were low. It was.

  Moreover, although the low equivalent epoxy compound was used as an epoxy compound, when a triphenylbenzene compound was not used as a hardening | curing agent (Experimental example 9), both the glass transition point and the heat conductivity became low again.

  On the other hand, when a low equivalent epoxy compound is used as an epoxy compound and a triphenylbenzene compound is used as a curing agent (Experimental Examples 1 to 6), both the glass transition point and the thermal conductivity are remarkably increased. It was.

  From the results shown in Table 1, when the resin composition contains the low equivalent epoxy compound and the triphenylbenzene compound represented by the formula (1), the heat resistance and thermal conductivity of the cured resin were improved. Therefore, excellent thermal characteristics were obtained.

  While the present invention has been described above with reference to the embodiments and examples, the present invention is not limited to the modes described in the embodiments and examples, and various modifications can be made.

  DESCRIPTION OF SYMBOLS 1 ... Resin composition layer, 2 ... Core material, 3 ... Resin hardened | cured material layer 10, 20, 30 ... Resin sheet, 40, 50, 60, 70 ... Resin board | substrate.

Claims (9)

An epoxy compound containing two or more epoxy groups in one molecule and having an epoxy equivalent of 370 or less;
A triphenylbenzene compound represented by the following formula (1) ;
A resin composition comprising inorganic particles .

(Each of R1 to R15 is a hydrogen group (—H) or a reactive group, and the reactive group is either a hydroxyl group (—OH) or an amino group (—NH ₂ )). Provided that at least one of R1 to R5 is a reactive group, at least one of R6 to R10 is a reactive group, and at least one of R11 to R15 is a reactive group. .) The inorganic particles include magnesium oxide (MgO), aluminum oxide (Al ₂ O _Three ) And boron nitride (BN),
The resin composition according to claim 1. One of R1 to R5 is the reactive group;
One of R6 to R10 is the reactive group;
One of R11 to R15 is the reactive group.
The resin composition according to claim 1 or claim 2. Each of R1 to R15 is either a hydrogen group or a hydroxyl group,
Alternatively, each of R1 to R15 is any one of a hydrogen group and an amino group.
The resin composition according to any one of claims 1 to 3. The triphenylbenzene compound includes at least one of the compounds represented by each of the following formulas (1-1) and (1-2).
The resin composition according to any one of claims 1 to 4.

Including the resin composition according to any one of claims 1 to 5, the resin sheet. Curing reaction including a resin cured product of the resin composition according to any one of claims 1 to 5. Including one or more resin sheet curing reaction products,
The resin sheet, including the resin composition according to any one of claims 1 to 5, the resin substrate. The cured reaction product of the two or more resin sheets is laminated,
The resin substrate according to claim 8.

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