JP6490233B2 - Portable cooling system - Google Patents

Description

  The present invention relates to a portable cooling device including a Peltier element module.

  Conventionally, there have been various proposals related to cooling devices using Peltier elements. For example, a method of using a can or a cup as an object to be cooled on a heat absorbing surface (cooling surface) of a plate-shaped Peltier element module is conceivable.

  Patent Document 1 includes a container with a lid that is provided in a housing and stores a can containing a beverage, a Peltier element attached to the outer surface of the bottom (bottom plate) of the container, and a heat dissipation mechanism. A can temperature control device is proposed.

Japanese Unexamined Patent Publication No. 2000-231667 (for example, claim 5, paragraph 0025, FIG. 7)

  However, when the object to be cooled is simply placed on the heat absorption surface of the Peltier element module, there has been a problem that the object to be cooled moves and the cooling efficiency decreases. Moreover, since the apparatus described in Patent Document 1 includes a container with a lid in which an object to be cooled is accommodated, and a casing that accommodates the container, a heat insulating material, a Peltier element, and a heat dissipation mechanism, a cooling device Has a problem of being large and complicated.

  The present invention has been made to solve the above-described problems of the prior art, and an object thereof is to provide a portable cooling device capable of efficiently cooling an object to be cooled with a small and simple configuration. To do.

The portable cooling device according to the present invention includes a support member, a Peltier element module supported by the support member, and attached to the support member so that an object to be cooled is in contact with the heat absorption surface of the Peltier element module. A holding part that holds the object to be cooled in contact with the endothermic surface, and a surface that holds the object to be cooled in contact with the endothermic surface. And a fastener member .

  According to the present invention, since the object to be cooled is held by the holding unit, the apparatus can be reduced in size and simplified. In addition, according to the present invention, the object to be cooled is held in contact with the heat absorbing surface of the Peltier element module, so that the object to be cooled can be efficiently cooled.

It is a perspective view which shows roughly the structure of the portable cooling device which concerns on Embodiment 1 of this invention. It is a top view which shows roughly the structure of the portable cooling device which concerns on Embodiment 1 of this invention. It is an enlarged top view which shows a mode that the heat conductive sheet of the portable cooling device which concerns on Embodiment 1 of this invention has deform | transformed. It is a top view which shows roughly the state which made the to-be-cooled object adsorb | sucked to the portable cooling device which concerns on Embodiment 1 of this invention. It is a top view which shows roughly the structure of the portable cooling device which concerns on Embodiment 2 of this invention. It is a top view which shows roughly the structure of the portable cooling device which concerns on Embodiment 3 of this invention. It is a perspective view which shows roughly the structure of the portable cooling device which concerns on Embodiment 4 of this invention. It is a top view which shows roughly the structure of the portable cooling device which concerns on Embodiment 4 of this invention. It is a top view which shows roughly the structure of the portable cooling device which concerns on Embodiment 5 of this invention. It is a top view which shows roughly the structure of the portable cooling device which concerns on Embodiment 6 of this invention.

  Below, the portable cooling device which concerns on embodiment of this invention is demonstrated, referring a figure. In the figure, an XYZ orthogonal coordinate system is shown for easy understanding of the relationship between the figures. In the figure, the Z axis indicates a vertically upward direction, the X axis indicates a horizontal direction orthogonal to the Z axis, and the Y axis indicates a horizontal direction orthogonal to both the X axis and the Z axis. In the drawings other than FIG. 9, generally, the Z-axis direction is the height direction of the portable cooling device, the Y-axis direction is the width direction of the portable cooling device, and the X-axis direction is the thickness direction of the portable cooling device. is there. However, the installation method (posture) of the portable cooling device may be freely selected by the user, and is not limited to the illustrated one.

<< 1 >> Embodiment 1
<< 1-1 >> Configuration FIG. 1 is a perspective view schematically showing the structure of a portable cooling device 1 according to the first embodiment. FIG. 2 is a top view schematically showing the structure of the portable cooling device 1 according to the first embodiment. FIG. 3 is an enlarged top view showing a state where the heat conductive sheet 3 of the portable cooling device 1 according to the first embodiment is deformed.

  As shown in FIGS. 1 and 2, the portable cooling device 1 includes a Peltier element module 2 as a cooling element module, and a heat conduction member provided on a heat absorption surface (cooling surface) 2 a of the Peltier element module 2. It has a heat conductive sheet (cooling surface) 3 and a heat radiator 4 (heat radiating plate 41 and heat radiating fins 42) provided on the heat radiating surface 2 b of the Peltier element module 2. In addition, the portable cooling device 1 includes a support member 5 as a base portion on which each component of the portable cooling device 1 is supported, a holding portion (holder) 6 that holds an object to be cooled, and air toward the radiator 4. And a fan 7 as an air blower that creates a flow of In addition, although it is desirable to form the heat absorption surface 2a of the Peltier element module 2 with the heat conductive sheet 3, or a heat conductive member is affixed on the heat absorption surface 2a, it is also possible not to provide the heat conductive sheet 3. . Moreover, although it is possible not to provide the heat radiator 4 in the heat radiating surface 2b, it is desirable to provide the heat radiator 4 in order to improve cooling efficiency. Moreover, although it is possible not to provide the fan 7 which blows air toward the radiator 4, it is desirable to provide the fan 7 in order to improve the cooling efficiency. 1 shows a plate-like member having a first surface 5a on the heat absorbing surface 2a side and a second surface 5b on the heat radiating surface 2b side as the supporting member 5, but the shape of the supporting member 5 is shown. Is not limited to the illustrated shape.

  The portable cooling device 1 includes a power supply unit 12 that is a power supply circuit that supplies power to the support member 5 through the power cable 11, wiring 13 for supplying power from the power supply unit 12 to the Peltier element module 2, Wiring 14 for supplying power from the section 12 to the motor of the fan 7.

  The Peltier element module 2 is, for example, a plate-shaped thermoelectric element module having a Peltier element that utilizes the Peltier effect that heat is transferred from one metal to the other when an electric current is passed through a joint between two kinds of metals. It is. The Peltier element module 2 has an endothermic surface 2a and a heat radiating surface 2b. The endothermic surface 2a absorbs the heat of the object to be cooled 20 (cools the object to be cooled 20) and releases heat from the heat radiating surface 2b. The heat absorbing surface 2a of the Peltier element module 2 is a surface facing the + X direction of the Peltier element module 2 in FIG. The heat dissipation surface 2b of the Peltier element module 2 is a surface facing the -X direction of the Peltier element module 2 in FIG.

  In general, the object 20 to be cooled by the Peltier element module 2 is cooled by bringing the heat absorption surface 2a of the Peltier element module 2 into contact with the object 20 to be cooled directly or indirectly through a heat conductive sheet or the like. Thereby, it is possible to cool the to-be-cooled object 20 to below the outside temperature. The Peltier element module 2 is driven by power supplied through the power cable 11, the power supply unit 12, and the wiring 13. The fan 7 is driven by supplying power through the power supply unit 12 and the wiring 14. The power cable 11 is connected to any one of an outlet, a battery, a solar panel, and the like, for example, and receives power supply.

  It is desirable that the heat-absorbing surface 2a of the Peltier element module 2 is provided with the heat conductive sheet 3 with, for example, a heat conductive adhesive. The heat conductive sheet 3 preferably has elasticity to increase the contact area with the object to be cooled 20 and is deformed according to the shape of the contact surface of the object to be cooled 20 as shown in FIG. . As described above, the deformation of the heat conductive sheet 3 increases the contact area with the object to be cooled 20 and improves the cooling efficiency.

  The material of the heat conductive sheet 3 can be any of silicon resin, acrylic resin, polyolefin resin, and the like, for example. The thickness and shape of the heat conductive sheet 3 are preferably selected according to the shape of the surface to be cooled of the object 20 to be cooled. Moreover, it is desirable that the heat conductive sheet 3 can be exchanged according to the surface shape of the object 20 to be cooled. For example, when the surface to be cooled 20 is a flat surface, a thin sheet is used as the heat conductive sheet 3, and when the surface to be cooled 20 is a convex surface, Cooling efficiency can be improved by using a thick conductive sheet 3. In this case, it is desirable to employ a detachable adhesive as the adhesive.

  A radiator 4 is fixed to the heat radiation surface 2b of the Peltier element module 2 by a heat conductive adhesive. In the radiator 4, for example, a plurality of thin radiator plates 42 are connected to a radiator plate 41. By connecting the heat radiating fins 42 to the heat radiating plate 41, the heat generated on the heat radiating surface 2 b is transmitted to the heat radiating fins 42 via the heat radiating plates 41 and is radiated from the heat radiating fins 42. Further, a fan 7 is provided for creating a flow of air toward the heat radiating fins 42 in order to cool the heat radiating fins 42. Power is supplied to the fan 7 from a power source. The position of the fan 7 is not limited to the position shown in FIG.

  The radiator 4 is fixed to the support member 5 of the portable cooling device 1. The support member 5 can be composed of, for example, any of a polystyrene foam member, a plastic member, a synthetic resin, a ceramic, and a metal member. The support member 5 is, for example, a plate-like member, and each component member of the portable cooling device 1 is supported by the support member 5. The support member 5 has a through hole (including a cutout portion as a through hole connected to one side of the support member 5), and the Peltier element module 2 is attached to the through hole.

  The support member 5 functions as a heat insulating material that partitions the heat absorbing surface 2a side and the heat radiating surface 2b side of the Peltier element module 2. That is, the support member 5 separates the space on the first surface 5a (surface facing + X direction) side of the support member 5 and the space on the second surface 5b (surface facing −X direction) side of the support member 5. can do. Thereby, the heat moved from the heat radiation surface 2b of the Peltier element module 2 to the heat radiator 4 is transferred to the heat absorption surface 2a of the Peltier element module 2 or the periphery of the heat conductive sheet 3 through the air around the heat radiator 4. Can be prevented, and a decrease in cooling efficiency can be prevented.

  Four magnets 61 as the holding portion 6 are fixed to the first surface 5 a of the support member 5. By having the magnet 61, the to-be-cooled object 20 having a magnetic material can be held by a magnetic attractive force. The number and arrangement of the magnets 61 are not limited to the example shown in FIG. The number of magnets 61 may be 1 to 3, 5 or more. If the magnet 61 is replaceable, the height of the magnet 61 in the X-axis direction can be adjusted by replacing the magnet 61. Moreover, the height of the magnet 61 in the X-axis direction can be adjusted by configuring the magnet 61 so that a plurality of magnet members are stacked in the X-axis direction.

  FIG. 4 is a top view showing a state in which the object to be cooled 20 is adsorbed to the portable cooling device 1 according to the first embodiment. As shown in FIG. 4, when the pan as the object to be cooled 20 has a magnetic body, the object to be cooled 20 is placed on the heat absorption surface 2 a of the Peltier element module 2 by the magnet 61 as the holding unit 6. It is held in a state where it is adhered with the intervening. By driving the portable cooling device 1 in this state, the object to be cooled 20 is locally cooled, and a decrease in temperature can be transmitted to dishes, beverages and the like housed in the object to be cooled 20. Although FIG. 4 shows the case where the heat radiating surface 2b is in contact with the side surface of the object 20 to be cooled, the user can freely place the heat radiating surface 2b at a desired position of the object 20 to be cooled. Can be contacted.

<< 1-2 >> Effect (1) According to the portable cooling device 1 according to the first embodiment, the heat absorption surface 2a of the Peltier element module 2 is brought into contact with the object to be cooled 20 via the heat conductive sheet 3, and the air is supplied. Cool directly without intervention. Thus, since the portable cooling device 1 does not require a volume for interposing air, there is no need to form a box-like structure, the device can be miniaturized, and the structure of the device is simplified. be able to. For this reason, the portable cooling device 1 is suitable for carrying around.

(2) According to the portable cooling device 1 according to the first embodiment, the object to be cooled 20 is brought into contact with the heat absorption surface 2a of the Peltier element module 2 via the heat conductive sheet 3 and directly cooled without passing through air. Therefore, it is possible to cool only the object to be cooled 20 without cooling anything other than the object to be cooled 20 (for example, the storage container). For this reason, it can cool efficiently compared with the case where it cools via air.

(3) According to the portable cooling device 1 according to Embodiment 1, the holding unit 6 is provided, and the object to be cooled 20 is held by the holding unit 6. Thereby, any surface (side surface or upper surface or bottom surface) of the object to be cooled 20 can be brought into contact with the heat absorbing surface 2a, and the object to be cooled 20 can be efficiently cooled.

(4) According to the portable cooling device 1 according to the first embodiment, the number of components can be minimized, and the overall weight can be reduced by using a lightweight material, so that it is easy to carry. It is. For this reason, the portable cooling device 1 is suitable as a cooling device used in a narrow place such as in a car, on a work desk, on a table in a table, or outdoors.

(5) According to the portable cooling device 1 according to Embodiment 1, the manufacturing cost can be reduced by using a simple structure and using an inexpensive component.

(6) Moreover, when the contact area with the to-be-cooled object 20 is enlarged by the heat conductive sheet 3, the cooling efficiency of the portable cooling device 1 is improved.

(7) When the fan 7 for cooling the heat radiation fins 42 is provided, the cooling efficiency of the portable cooling device 1 can be improved.

(8) Further, when the support member 5 is made sufficiently large to partition the heat absorbing surface 2a side and the heat radiating surface 2b side of the Peltier element module 2, the cooling efficiency can be improved.

(9) When the magnet 61 can be replaced by the user, the height of the magnet 61 in the X-axis direction can be adjusted by replacing the magnet 61. Can be selected, and the cooling efficiency can be improved.

<< 2 >> Embodiment 2
<< 2-1 >> Configuration In the first embodiment, the holding unit 6 that holds the object to be cooled 20 has been described as the magnet 61. On the other hand, in the second embodiment, a suction cup (suction cup) 62 is used for the holding portion 6 that holds the object to be cooled. Except for this point, the second embodiment is the same as the first embodiment. Therefore, the description of the second embodiment will focus on the differences from the first embodiment.

  FIG. 5 is a top view schematically showing the structure of the portable cooling device 1a according to the second embodiment. 5, components that are the same as or correspond to the components shown in FIG. 2 are assigned the same reference numerals as those in FIG. As shown in FIG. 5, the holding unit 6 of the portable cooling device 1 a according to the second embodiment is a suction cup (suction cup) 62. In the example of FIG. 5, the suction cups 62 are installed at four places on the support member 5. However, the arrangement and the number of the suction cups 62 are not limited to the example of FIG. The sucker 62 sucks the object to be cooled 20 to hold the object to be cooled 20 in contact with the portable cooling device 1a.

<< 2-2 >> Effect According to the portable cooling device 1a according to the second embodiment, the same effects as the effects (1) to (8) in the first embodiment can be obtained.

  Moreover, according to the portable cooling device 1a which concerns on Embodiment 2, the to-be-cooled object 20 other than a magnetic body can be hold | maintained by using the suction cup 62 (adsorption board) for the holding | maintenance part 6. FIG.

  Moreover, since the portable cooling device 1a uses the suction cup 62 as a holding part, the manufacturing cost of the portable cooling device 1a can be reduced.

  Moreover, since the suction cup 62 can be used in combination with one or more of the holding units of the other embodiments, the object to be cooled 20a can be reliably held by the combination of the holding units.

<< 3 >> Embodiment 3
<< 3-1 >> Configuration In the first embodiment, the holding unit 6 that holds the object to be cooled 20 has been described as the magnet 61. On the other hand, in Embodiment 3, the hook-and-loop fastener 63 and the belt 64 are used as the holding portion 6 that holds the object to be cooled 20. Except for this point, the third embodiment is the same as the first embodiment. Therefore, the description of the third embodiment will focus on the differences from the first embodiment.

  FIG. 6 is a top view schematically showing the structure of the portable cooling device 1b according to the third embodiment. 6, components that are the same as or correspond to the components shown in FIG. 2 are given the same reference numerals as those in FIG. As shown in FIG. 6, the holding unit 6 of the portable cooling device 1 b according to Embodiment 3 includes a hook-and-loop fastener 63 and a belt 64 connected to the support member 5 by the hook-and-loop fastener 63. The hook-and-loop fastener 63 has a first surface raised in a hook shape and a second surface densely raised in a loop shape. When the user presses the second surface against the first surface, the two surfaces are pasted, and the second surface can be separated from the first surface to be peeled off by the user. For example, the second surface is fixed to the support member 5 and the first surface is attached to the belt 64. With such a structure, the object to be cooled can be fixed in a state where the object to be cooled is pressed toward the heat absorbing surface 2a of the Peltier element module 2. As the hook-and-loop fastener 63, there is a type that does not distinguish between the hook surface and the loop surface (the hook surface and the loop surface are not mistakenly attached), a click type that is raised in a mushroom shape and has a strong binding force, and a saw tooth. There are variations such as a shark bite type. In FIG. 6, the connection part of the hook_and_loop | surface fastener 63 is installed in two places on the surface which faced the + X direction in FIG. However, the position and the number of connection portions are not limited to the example of FIG.

  The belt 64 is wound around the object 20 to be cooled, and the belt 64 is fixed to the support member 5 with the hook-and-loop fastener 63, whereby the object 20 to be cooled is held in contact with the portable cooling device 1b.

<< 3-2 >> Effect According to the portable cooling device 1b according to the third embodiment, the same effects as the effects (1) to (8) in the first embodiment can be obtained.

  According to the portable cooling device 1b according to the third embodiment, the belt 64 is fixed to the support member 5 with the hook-and-loop fastener 63 as the holding portion. Therefore, the object to be cooled that cannot be attracted by the magnet and attracted by the suction cup Even if the object cannot be cooled, the object to be cooled 20c can be held so as to be in contact with the Peltier element module 2 (placed in a contact position). The portable cooling device 1b is particularly suitable for holding and cooling a cylindrical object to be cooled (for example, a plastic bottle).

  Moreover, the manufacturing cost of the portable cooling device 1b can be reduced by using the inexpensive hook-and-loop fastener 63 and the belt 64.

  Further, since the hook-and-loop fastener 63 and the belt 64 can be used in combination with one or more of the holding portions 6 of the first or second embodiment, the object to be cooled 20c is reliably held by the combination of the holding portions 6. Is possible.

<< 4 >> Embodiment 4
<< 4-1 >> Configuration In the first embodiment, the case where the holding unit 6 that holds the object to be cooled 20 is the magnet 61 has been described. On the other hand, in the fourth embodiment, the mounting table 65 is employed as the holding unit 6 that holds the object to be cooled 20. Except for this point, the fourth embodiment is the same as the first embodiment. Therefore, in the description of the fourth embodiment, the difference from the first embodiment will be mainly described.

  FIG. 7 is a perspective view schematically showing the structure of the portable cooling device 1c according to the fourth embodiment. FIG. 8 is a top view schematically showing the structure of the portable cooling device 1c according to the fourth embodiment. 7 and 8, the same or corresponding components as those shown in FIGS. 1 and 2 are denoted by the same reference numerals as those in FIGS. 1 and 2. As shown in FIGS. 7 and 8, the holding unit 6 of the portable cooling device 1 c is a mounting table 65. The mounting table 65 is provided on the support member 5.

  The mounting table 65 is desirably large enough to accommodate the object to be cooled 20. The mounting table 65 may be replaceable depending on the type of the object to be cooled 20. When the portable cooling device 1c is placed on a horizontal plane, the mounting surface of the mounting table 65 becomes a horizontal plane. A heat absorption surface 2 a may be provided on the mounting surface of the mounting table 65. As the material of the mounting table 65, various materials such as metal, plastic, and wood can be used as long as the material to be cooled 20 can be mounted.

<< 4-2 >> Effects According to the portable cooling device 1c according to the fourth embodiment, the same effects as the effects (1) to (8) in the first embodiment can be obtained.

  According to the portable cooling device 1c according to the fourth embodiment, since the mounting table 65 having a horizontal mounting surface is adopted as the holding unit 6, the object to be cooled 20c and the suction cup 62 cannot be attracted by the magnet 61. Even the object 20c that cannot be cooled can be held so as to be in contact with the Peltier element module 2 (placed in a contact position).

  Further, since the mounting table 65 having a horizontal mounting surface can be used in combination with one or more of the holding units 6 according to the first to third embodiments, the combination of the holding units 6 ensures the object 20c to be cooled. It is possible to hold it.

<< 5 >> Embodiment 5
<< 5-1 >> Configuration In the fourth embodiment, the mounting surface on which the object to be cooled 20c of the mounting table 65 is mounted is disposed in parallel with the horizontal direction. On the other hand, in the fifth embodiment, the mounting surface of the mounting table 66 is a lower inclined surface as it is closer to the heat absorbing surface 2 a of the Peltier element module 2. Except for this point, the fifth embodiment is the same as the fourth embodiment. Accordingly, in the description of the fifth embodiment, differences from the fourth embodiment will be mainly described.

  FIG. 9 is a side view schematically showing the structure of the portable cooling device 1d according to the fifth embodiment. 9, components that are the same as or correspond to the components shown in FIG. 1 are given the same reference numerals as those in FIG. As shown in FIG. 9, the support member 5 and the mounting table 66 are provided with leg portions 51 and 52 in contact with each other on a plane, and the mounting surface on which the object to be cooled 20 is mounted is a Peltier element. The closer to the endothermic surface 2a of the module 2, the lower the inclined surface. Due to the inclined mounting surface, the object to be cooled 20d placed on the mounting surface of the mounting table 66 has a biasing force (a component parallel to the inclined surface of gravity) directed toward the heat absorbing surface 2a of the Peltier element module 2. The object to be cooled 20 d comes into contact with the heat absorbing surface 2 a of the Peltier element module 2 through the heat conductive sheet 3.

<< 5-2 >> Effect According to the portable cooling device 1d according to the fifth embodiment, the same effects as the effects (1) to (8) in the first embodiment can be obtained.

  According to the portable cooling device 1d according to the fifth embodiment, since the mounting table 66 having an inclined mounting surface is used as the holding unit, the object to be cooled 20d that cannot be attracted by the magnet and the cooling target that cannot be attracted by the suction cup. Even the object 20d can be held in contact with the Peltier element module 2.

  Moreover, since the mounting table 66 having the inclined mounting surface can be used in combination with one or more of the holding units of the first to third embodiments, the object to be cooled 20d can be reliably held.

<< 6 >> Embodiment 6
<< 6-1 >> Configuration In the first embodiment, the example in which the fan 7 (air cooling system) is used as the mechanism for cooling the radiator 4 has been described. On the other hand, in the sixth embodiment, a water cooling mechanism 9 as a water cooling device for cooling the radiator 4 is provided. Except for this point, the sixth embodiment is the same as the first embodiment. Therefore, the description of the sixth embodiment will focus on the differences from the first embodiment.

  FIG. 10 is a top view schematically showing the structure of the portable cooling device 1e according to the sixth embodiment. 10, components that are the same as or correspond to the components shown in FIG. 2 are given the same reference numerals as those in FIG. As shown in FIG. 10, the portable cooling device 1 e according to the sixth embodiment includes a water cooling mechanism 9 for cooling the radiator 4 instead of the fan 7 in the first embodiment. The water cooling mechanism 9 is a mechanism that cools the radiator 4 with water. The water cooling mechanism 9 includes a cooling water container 91 such as a flow path such as a cooling water pipe for flowing flowing water around the radiator 4 or a tank for storing water in which the radiator 4 is immersed. The water cooling mechanism 9 in FIG. 10 has a cooling water container 91, a water supply port 92 to which cooling water is supplied, and a drainage port 93 through which the cooling water that has passed through the cooling water container 91 and has risen in temperature is discharged. ing. For example, it is possible to efficiently dissipate heat from the radiator 4 by connecting the water supply port 92 with a tap and a hose, or by pouring water into the water supply port 92. As a result, the cooling efficiency by the Peltier element module 2 is improved.

  FIG. 10 shows a magnet 61 as a holding unit that holds an object to be cooled. However, the portable cooling device 1e may include any one or more holding portions according to the second to fifth embodiments instead of the magnet 61 or in addition to the magnet 61.

<< 6-2 >> Effects According to the portable cooling device 1e according to the sixth embodiment, the same effects as the effects (1) to (6) in the first embodiment can be obtained.

  According to the portable cooling device 1e according to the sixth embodiment, since the water cooling mechanism 9 is provided, the cooling efficiency can be improved as compared with the case of the air cooling system.

  Moreover, according to the portable cooling device 1e which concerns on Embodiment 6, since it is not necessary to use the fan 7 for air cooling, generation | occurrence | production of the noise by the fan 7 can be prevented.

  Moreover, since the water cooling mechanism 9 of the portable cooling device 1e according to Embodiment 6 does not require power, the power consumption of the portable cooling device 1e can be reduced.

  Further, since the water cooling mechanism 9 of the portable cooling device 1e according to the sixth embodiment can be configured by a cooling water pipe or a cooling water container having no movable part, the manufacturing cost of the portable cooling device 1e is reduced. be able to.

  Furthermore, since the portable cooling device 1e according to Embodiment 6 employs the water cooling mechanism 9, the heat insulation effect between the space on the first surface 5a side and the space on the second surface 5b side by the support member 5 is important. is not. For this reason, even if the supporting member 5 is made small, the cooling efficiency does not decrease. Therefore, the support member 5 can be formed small, and the apparatus can be miniaturized.

<< 7 >> Modifications As described above, the portable cooling device according to the present invention has been described with reference to the first to sixth embodiments. However, within the scope of the present invention, the embodiments may be combined or the embodiments may be combined. It is possible to deform appropriately.

  In the portable cooling devices 1, 1 a, 1 b, 1 c, 1 d, and 1 e according to the above embodiment, the heat radiating surface 2 b and the radiator 4 of the Peltier element module 2 are fixed with a heat conductive adhesive. It may be fixed by screwing.

  In the portable cooling devices 1, 1 a, 1 b, 1 c, 1 d, and 1 e according to the above embodiments, the case where the support member 5 is a flat plate has been described, but the shape of the support member 5 is not limited to this. The support member 5 may have another shape such as a curved surface or an L shape, for example.

  The portable cooling devices 1, 1 a, 1 b, 1 c, 1 d, and 1 e according to the above embodiment have one Peltier element module 2, but further have another Peltier element module supported by the support member 5. May be. In this case, it is desirable that the endothermic surface 2a of the Peltier element module 2 and the endothermic surface of the other Peltier element module be arranged so as to be in contact with different surfaces of the object to be cooled 20, respectively.

1, 1 a, 1 b, 1 c, 1 d, 1 e Portable cooling device, 2 Peltier element module, 2 a heat absorbing surface, 2 b heat radiating surface, 3 heat conduction sheet, 4 heat radiator, 5 support member, 5 a first surface, 5 b second Surface, 6 holding part, 7 fan, 9 water cooling mechanism, 11 power cable, 12 power supply part, 13, 14 wiring, 20, 20a, 20b, 20c, 20d object to be cooled, 41 heat radiating plate, 42 heat radiating fin, 51, 52 Legs, 61 magnets, 62 suckers, 63 hook-and-loop fasteners, 64 belts, 65 and 66 mounting tables, 91 cooling water containers, 92 water supply ports, and 93 drainage ports.

Claims (16)

A support member;
A Peltier element module supported by the support member;
A holding unit attached to the support member and holding the object to be cooled in contact with the heat absorbing surface of the Peltier element module;
Have
The holding portion includes a suction cup that holds the object to be cooled in contact with the heat absorbing surface, and a hook-and-loop fastener member that holds the object to be cooled in contact with the heat absorbing surface. A portable cooling device.   The portable cooling device according to claim 1, wherein the holding unit includes a magnet that holds the object to be cooled in contact with the endothermic surface. 3. The portable cooling according to claim 1, wherein the holding unit includes a mounting table on which the object to be cooled is mounted and holds the object to be cooled in contact with the heat absorbing surface. apparatus. A support member;
A Peltier element module supported by the support member;
A holding unit attached to the support member and holding the object to be cooled in contact with the heat absorbing surface of the Peltier element module;
Have
The holding unit includes a suction cup that holds the object to be cooled in contact with the endothermic surface, and a mounting that holds the object to be cooled in contact with the endothermic surface. With a pedestal
A portable cooling device characterized by that. The portable cooling device according to claim 4, wherein the holding unit includes a magnet that holds the object to be cooled in contact with the endothermic surface. The portable cooling device according to any one of claims 3 to 5 , wherein a mounting surface on which the object to be cooled of the mounting table is mounted has the heat absorbing surface. The transportable cooling according to any one of claims 3 to 5 , wherein the mounting surface on which the object to be cooled of the mounting table is mounted is an inclined surface that is lower as it is closer to the endothermic surface. apparatus. A heat conductive sheet is provided on the endothermic surface,
The portable cooling device according to any one of claims 1 to 7 , wherein the object to be cooled is absorbed by the heat absorbing surface via the heat conductive sheet. The portable cooling device according to claim 8 , wherein the heat conductive sheet is a member that deforms according to a shape of the object to be cooled. The portable cooling device according to any one of claims 1 to 9 , further comprising a radiator that contacts a heat radiation surface of the Peltier element module. The support member is a plate having a first surface, a second surface, and a through hole in which the Peltier element module is provided,
The endothermic surface is on the first surface side;
The portable cooling device according to claim 10 , wherein the heat radiation surface is on the second surface side. The portable cooling device according to claim 11 , further comprising a fan that creates an air flow toward the radiator. The portable cooling device according to claim 11 , further comprising a water cooling mechanism for cooling a heat radiation surface of the Peltier element module. Wherein the support member, a portable cooling device according to any one of claims 1 to 13, characterized in that it comprises at least one of a synthetic resin plate and the ceramic plate. When the portable cooling apparatus is installed on a horizontal surface, the heat absorbing surface is the upper surface of the object to be cooled, the lower surface, and from the claims 1, characterized in that in contact with at least one of the side surfaces 14 of the The portable cooling device according to any one of the preceding claims. Further comprising another Peltier element module supported by the support member,
The heat absorbing surface and the heat absorbing surface and the other Peltier element module of the Peltier element module, according the any one of claims 1 to 15, characterized in that respectively contact the different surfaces of the object to be cooled Portable cooling device.

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