JP6468856B2 - Transfer equipment - Google Patents

Description

The present invention also relates to the transfer NoSo location.

  2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) is taken out from a cassette, and the transferred wafer is placed at a specified position at a transfer destination (for example, a patent). Reference 1).

JP 2003-218183 A

  However, in the conventional method as described in Patent Document 1, since positioning is performed while the wafer is gripped, there is a disadvantage that the wafer is damaged if the wafer is very fragile.

An object of the present invention is to provide a transfer NoSo location can be positioned without damaging the plate-shaped member in the conveyance of the plate-like member.

In order to achieve the above object, the transfer device of the present invention is provided in the conveying means that supports and takes out the plate-like member from the accommodating means in which the plate-like member is accommodated, and the plate-like member. Detecting means capable of detecting the position of the plate, and the conveying means includes rotating means capable of rotating the supported plate-like member within a supporting surface thereof, and the detecting means is plate-like supported by the conveying means. The plate-like member is provided so that the position in the surface direction of the plate-like member can be detected by relative movement with respect to the member, and the plate-like member supported by the conveying means is rotated within the support surface. The configuration in which the position in the surface direction is provided so as to be redetectable is employed.

  In the transfer apparatus of the present invention, the transport means is provided so as to be able to take out the plate-like member from the storage means by a take-out operation that moves in a predetermined linear direction along the surface direction of the plate-like member, and the detection means Is preferably provided so as to be able to detect the position in the surface direction of the plate-like member by moving relative to the plate-like member taken out from the storage means by the take-out operation.

According to the present invention as described above, the detecting means provided in the conveying means moves relative to the plate-like member supported by the conveying means so that the position in the surface direction of the plate-like member can be detected. Therefore, positioning can be performed without damaging the plate-like member during conveyance of the plate-like member.
Further, since the detection means is provided relative to the plate-like member taken out from the storage means by the take-out operation so that the position of the plate-like member can be detected, among the operations of transferring the plate-like member, The plate-like member can be positioned when the necessary minimum operation of taking out the plate-like member from the storage means is performed.

The front view which shows the transfer apparatus which concerns on one Embodiment of this invention. Operation | movement explanatory drawing of the transfer apparatus of FIG. The double view which shows the front and the plane of the principal part of the transfer apparatus which concern on the modification of this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the D1 direction parallel to the Y axis, the direction is indicated by “up” being the arrow direction of the Z axis, “down” being the opposite direction, and “left” being In the arrow direction of the X axis and in the near direction orthogonal to the paper surface in FIG. 1, “right” is the opposite direction, “front” is the arrow direction of the Y axis, and “rear” is the opposite direction.

  1 and 2, the transfer apparatus 10 is provided in the transfer means 20 that supports and takes out the wafer WF from a cassette CT as a storage means in which the wafer WF is stored as a plate-like member. And a detecting means 30 capable of detecting the position of the wafer WF. The wafer WF is taken out from the cassette CT mounted on the mounting table 40 disposed at a predetermined position with respect to the transfer apparatus 10, and the transfer is performed. The center position WC of the wafer WF is aligned with the center position TC of the work table 50 arranged at a predetermined position with respect to the apparatus 10 and moved. The cassette CT includes an opening CT1 and a plurality of ribs CT2 that support the left and right sides of the wafer WF from below and can stack the wafers WF in the vertical direction.

  The transfer means 20 is supported by an articulated robot 21 as a driving device and a support arm 21E of the articulated robot 21 and can hold the wafer WF by suction means (not shown) such as a decompression pump or a vacuum ejector. And a holding arm 22 provided with a suction port that does not. The articulated robot 21 includes a lifting arm 21A, a first arm 21B rotatably supported by the lifting arm 21A, a second arm 21C rotatably supported by the first arm 21B, and a second arm 21C. This is a so-called five-axis robot including a third arm 21D that is supported and a support arm 21E that is rotatably supported by the third arm 21D.

  The detecting means 30 includes a linear motion motor 31 as a driving device supported on the lower surface of the third arm 21D of the articulated robot 21, a bracket 32 supported on the output shaft 31A, and a left and right direction on the upper surface 32A of the bracket 32. Are supported by a surface direction detection means 33 such as an optical sensor or an imaging means that can detect the position in the surface direction on the wafer WF, and the rear surface 32B of the bracket 32, and are accommodated in the cassette CT. A stacking direction detecting unit 34 such as an optical sensor or an imaging unit capable of detecting the position in the stacking direction of the wafers WF is provided.

  The work table 50 includes a support table 51 and a lifter 52 that moves up and down with respect to the upper surface of the support table 51 by a driving device (not shown).

A procedure for transferring the wafer WF using the above transfer apparatus 10 will be described.
First, with respect to the transfer apparatus 10 in the state indicated by the solid line in FIG. 1 in which each member is arranged at the initial position, the operator can change the circumference of the wafer WF via input means (not shown) such as an operation panel or a personal computer. After entering the diameter dimension, the automatic operation start signal is input. Thereafter, an operator (not shown) such as an articulated robot or a belt conveyor places the cassette CT in which the wafer WF is stored on the mounting table 40. Then, the detection means 30 drives the linear motion motor 31 and brings the stacking direction detection means 34 closer to the opening CT1 of the cassette CT as shown in FIG. Then, the conveying means 20 drives the articulated robot 21 to move the stacking direction detecting means 34 to the upper part of the cassette CT as indicated by a two-dot chain line in FIG. 34 detects the position of the wafers WF in the stacking direction.

  Next, the transfer means 20 drives the articulated robot 21 based on the detection result of the stacking direction detection means 34, and inserts the holding arm 22 below the wafer WF located at the top as shown in FIG. The wafer WF is separated from the rib CT2. Next, the conveying unit 20 drives a suction unit (not shown), and the holding arm 22 sucks and holds the wafer WF.

Thereafter, the transfer means 20 drives the articulated robot 21 to move the wafer WF only in the forward direction at a predetermined speed in the complete extraction section EA (see FIG. 2D) and take out the wafer WF from the cassette CT. Perform take-out operation.
Here, the complete extraction section EA is a minimum operation range necessary for extracting the wafer WF from the cassette CT. As shown in FIG. 2D, the complete take-out section EA in the present embodiment is from the opening CT1 of the cassette CT to the end opposite to the opening CT1 in the wafer WF accommodated in the cassette CT. , The maximum distance interval EW in the surface direction of the wafer WF (the diameter of the circumferential portion of the wafer WF), and any of the wafers WF taken out from the cassette CT that do not include backward components such as up, down, left, and right. Even if the wafer WF is moved in the direction, a distance interval obtained by adding a safety distance EM in which the wafer WF does not contact the cassette CT is set. The safety distance EM is preferably within 30% of the maximum distance in the surface direction of the wafer WF in consideration of the play of the wafer WF in the cassette CT, and more preferably within 20% of the maximum distance of the wafer WF. There is no particular limitation.

  That is, when the transfer unit 20 drives the articulated robot 21 and performs the take-out operation, the detection unit 30 drives the linear motion motor 31 and detects the surface direction at the same speed as the transfer unit 20 moves the wafer WF. The means 33 is relatively moved. By this operation, the surface direction detection means 33 does not move with respect to the cassette CT. At this time, when the front side in the transport direction of the wafer WF passes over the surface direction detection unit 33, the surface direction detection unit 33 detects the positions P1 and P2 of the circumferential portion of the wafer WF, and these positions P1 and P2 The transfer means 20 stores the position of the center position WC (WC1 (not shown)) of the wafer WF obtained based on the above. Next, when the rear side in the transport direction of the wafer WF passes over the surface direction detection unit 33, the detection unit 30 detects the positions P3 and P4 of the circumferential portion of the wafer WF, and based on these positions P3 and P4. The transfer means 20 stores the required position of the center position WC (WC2 (not shown)) of the wafer WF.

  Thereafter, the center positions WC1 and WC2 of the wafer WF stored by the transfer means 20 are verified, and when the positions are confirmed to match, the position is determined as the position of the center position WC of the wafer WF. Then, the transfer means 20 drives the articulated robot 21 to displace the wafer WF from the end of the complete extraction section EA, and the wafer WF stored in the transfer means 20 as indicated by a two-dot chain line in FIG. The center position WC of the work table 50 is placed so as to coincide with the center position TC of the work table 50 which is the center of the lifter 52 being lifted up. Next, after the transfer means 20 stops driving the suction means (not shown), the articulated robot 21 is driven, and the holding arm 22 is extracted from below the wafer WF to prepare for the transfer of the next wafer WF in the cassette CT. In the work table 50, the lifter 52 is lowered, a processing apparatus (not shown) performs a predetermined process on the wafer WF, and a transfer means (not shown) transfers the wafer WF to another process. Thereafter, the same operation as described above is sequentially repeated from the upper side to the lower side with respect to the wafer WF accommodated in the cassette CT. If the center positions WC1 and WC2 of the wafer WF are different from each other as a result of the verification by the transfer unit 20 (when the verification is NG), the operations shown in FIGS. 2C and 2D are performed once or a plurality of times. It is possible to determine the center position WC of the wafer WF as the center position WC. At this time, after the transfer means 20 drives the articulated robot 21 and once places the wafer WF on the rib CT2, the wafer WF may be held by the holding arm 22 at a position or angle different from the previous time. Thereby, the positioning accuracy of the wafer WF can be improved.

  According to the present embodiment as described above, the detection unit 30 provided in the transfer unit 20 moves relative to the wafer WF supported by the transfer unit 20 and can detect the position in the surface direction on the wafer WF. Therefore, positioning can be performed without damaging the wafer WF during transfer of the wafer WF.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

For example, as shown in FIG. 3, the transfer unit 20 may include a rotation unit 70 that can rotate the supported wafer WF within the support surface. The rotation means 70 is supported by an extension arm 71 supported by the support arm 21 </ b> E of the articulated robot 21, a rotation motor 72 as a driving device supported by the extension arm 71, and an output shaft 72 </ b> A of the rotation motor 72. And a holding plate 73 provided with a suction port (not shown) capable of sucking and holding the wafer WF by a suction means (not shown) such as a decompression pump or a vacuum ejector.
Such a rotating means 70 is a result of verification by the conveying means 20 based on P1 to P4,
In the case of verification NG, the relative movement between the wafer WF and the detection unit 30 can be performed again after rotating the wafer WF by a predetermined angle. Thereby, the positioning accuracy of the wafer WF can be improved. In addition, if the verification can be performed a plurality of times during the transfer of the wafer WF, the transfer apparatus 10 can prevent the processing capability of transferring the wafer WF within a predetermined time from being deteriorated, and the positioning of the wafer WF can be prevented. Accuracy can be improved.
At this time, the angle at which the wafer WF is rotated is not limited to 120 degrees, 100 degrees, 30 degrees, 5 degrees, 1 degree, or the like, and the direction in which the wafer WF is rotated is arbitrary.

The holding arm 22 and the holding plate 73 may be configured to hold the wafer WF by magnetic adhesion, adhesion, electrostatic chuck, or the like.
The shape of the holding arm 22 or the holding plate 73 is not limited to the shape of any embodiment such as I type, Y type, and round type.
The transfer means 20 may take out the wafer WF from the bottom to the top with respect to the cassette CT, or may take out the wafer WF from a random position of the cassette CT.
The transfer means 20 may determine either one as the position of the center position WC of the wafer WF without verifying the center positions WC1 and WC2 of the wafer WF.
If the result of verification of the center position of the wafer WF is NG as a result of the verification, the transfer means 20 may stop the transfer of the wafer WF or notify the operator by a notification means such as sound or light.

The detection unit 30 may detect only the front side of the wafer WF in the transfer direction, or may detect only the rear side of the wafer WF in the transfer direction. The wafer WF may be positioned by detecting the distance up to.
The detection unit 30 moves relative to the wafer WF to detect the position of the wafer WF, for example, by moving in a direction crossing the X-axis direction or the Y-axis direction regardless of the transfer direction of the wafer WF. It may be.
For example, the detection unit 30 may be supported by the elevating arm 21 </ b> A or may be provided at any position of the transport unit 20.
The detection unit 30 may detect the position of the wafer WF during an operation other than the extraction operation of the transfer unit 20, or may detect the position of the wafer WF outside the complete extraction section EA.
The detection means 30 may position the wafer WF as in the above embodiment while moving relative to the cassette CT.
The detection means 30 can employ a light emitting / receiving sensor, a reflection sensor, a contact type sensor acoustic wave sensor such as a limit switch, an electromagnetic wave sensor, or the like, and is not limited in any way.
The detection unit 30 may detect the position of the wafer WF by detecting the position of the outer edge of the wafer WF rotated by the rotation unit 70 at a plurality of locations, or imaging the outer edge of the wafer WF with a camera or the like. . In this case, even if the wafer WF has an irregular portion such as an orientation flat (hereinafter simply referred to as “orientation flat”) or a notch, the position of the wafer WF can be accurately detected and positioned.
The stacking direction detecting means 34 may be omitted.

The wafer WF may have irregular portions such as orientation flats, notches, other notches, and cracks.
An irregular part detection unit such as an optical sensor or an imaging unit capable of detecting an irregular part formed on the wafer WF is provided, and the detection unit 30 does not detect the irregular part detected by the irregular part detection unit. The transfer unit 20 and the rotation unit 70 may drive the articulated robot 21 and the rotation motor 72 to rotate the wafer WF by a predetermined angle. If the articulated robot 21 rotates the wafer WF by a predetermined angle without the rotating means 70, the holding arm 22 lifts the wafer WF from the rib CT2 and rotates it by a predetermined angle, and the wafer WF is placed on the rib CT2 again. After the placement, the wafer WF may be held again by the holding arm 22 at a position different from the position where the wafer was previously supported. Further, the conveying means 20 may repeat this operation a plurality of times.
The safety distance EM may be 20% or more or 20% or less of the maximum distance in the surface direction of the wafer WF.
The storage means may be configured such that the plate-like member is stored vertically so that the front and back surfaces thereof are along the Z axis, or may be stored inclined with respect to the Z axis.
The storage means may store only one wafer WF or may store a plurality of wafers.
The storage means may be other containers such as cardboard boxes and wooden boxes, and is not limited at all.
The transfer apparatus 10 may position and place the wafer WF taken out from the cassette CT at a position other than the work table 50, or the cassette CT may not be placed on the placement table 40.

The plate-like member is not limited in material, type, shape, etc., for example, food, resin container, semiconductor wafer such as silicon semiconductor wafer or compound semiconductor wafer, circuit board, information recording substrate such as optical disk, glass plate Further, members and articles in any form such as steel plates, earthenware, wood plates, or resin plates can be targeted.
The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, if the conveying means is provided so that the plate-like member can be taken out from the storage means by the taking-out operation that moves in a predetermined linear direction along the surface direction of the plate-like member, it is in light of the common general technical knowledge at the time of filing. In addition, there is no limitation as long as it is within the technical range (the description of other means and steps is omitted).

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to the above, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 Transfer apparatus 20 Conveyance means 30 Detection means CT cassette (storage means)
WF wafer (plate-like member)

Claims (1)

Conveying means for supporting and taking out the plate-shaped member from the storage means in which the plate-shaped member is stored;
A detecting means provided on the conveying means and capable of detecting the position of the plate-like member;
The conveying means includes a rotating means capable of rotating the supported plate-like member within the supporting surface,
The detection means is provided so as to detect a position in the surface direction of the plate-like member by moving relative to the plate-like member supported by the conveyance means, and the plate-like member supported by the conveyance means is provided. A transfer apparatus characterized in that, after being rotated within the support surface, the position in the surface direction of the plate-like member is provided so as to be redetectable.

Images