JP6458949B2 - 硬化膜形成組成物、配向材および位相差材 - Google Patents
硬化膜形成組成物、配向材および位相差材 Download PDFInfo
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- JP6458949B2 JP6458949B2 JP2015512455A JP2015512455A JP6458949B2 JP 6458949 B2 JP6458949 B2 JP 6458949B2 JP 2015512455 A JP2015512455 A JP 2015512455A JP 2015512455 A JP2015512455 A JP 2015512455A JP 6458949 B2 JP6458949 B2 JP 6458949B2
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- ODLHGICHYURWBS-LKONHMLTSA-N trappsol cyclo Chemical compound CC(O)COC[C@H]([C@H]([C@@H]([C@H]1O)O)O[C@H]2O[C@@H]([C@@H](O[C@H]3O[C@H](COCC(C)O)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](COCC(C)O)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](COCC(C)O)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](COCC(C)O)[C@H]([C@@H]([C@H]3O)O)O3)[C@H](O)[C@H]2O)COCC(O)C)O[C@@H]1O[C@H]1[C@H](O)[C@@H](O)[C@@H]3O[C@@H]1COCC(C)O ODLHGICHYURWBS-LKONHMLTSA-N 0.000 description 1
- FOQJQXVUMYLJSU-UHFFFAOYSA-N triethoxy(1-triethoxysilylethyl)silane Chemical compound CCO[Si](OCC)(OCC)C(C)[Si](OCC)(OCC)OCC FOQJQXVUMYLJSU-UHFFFAOYSA-N 0.000 description 1
- NIINUVYELHEORX-UHFFFAOYSA-N triethoxy(triethoxysilylmethyl)silane Chemical compound CCO[Si](OCC)(OCC)C[Si](OCC)(OCC)OCC NIINUVYELHEORX-UHFFFAOYSA-N 0.000 description 1
- YYJNCOSWWOMZHX-UHFFFAOYSA-N triethoxy-(4-triethoxysilylphenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=C([Si](OCC)(OCC)OCC)C=C1 YYJNCOSWWOMZHX-UHFFFAOYSA-N 0.000 description 1
- KENDGHJJHKCUNB-UHFFFAOYSA-N triethoxy-[4-(4-triethoxysilylphenyl)phenyl]silane Chemical group C1=CC([Si](OCC)(OCC)OCC)=CC=C1C1=CC=C([Si](OCC)(OCC)OCC)C=C1 KENDGHJJHKCUNB-UHFFFAOYSA-N 0.000 description 1
- FTXGNVFQZMEDAS-UHFFFAOYSA-N triethoxy-[[4-(triethoxysilylmethyl)phenyl]methyl]silane Chemical compound CCO[Si](OCC)(OCC)CC1=CC=C(C[Si](OCC)(OCC)OCC)C=C1 FTXGNVFQZMEDAS-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- DJYGUVIGOGFJOF-UHFFFAOYSA-N trimethoxy(trimethoxysilylmethyl)silane Chemical compound CO[Si](OC)(OC)C[Si](OC)(OC)OC DJYGUVIGOGFJOF-UHFFFAOYSA-N 0.000 description 1
- YIRZROVNUPFFNZ-UHFFFAOYSA-N trimethoxy-(4-trimethoxysilylphenyl)silane Chemical group CO[Si](OC)(OC)C1=CC=C([Si](OC)(OC)OC)C=C1 YIRZROVNUPFFNZ-UHFFFAOYSA-N 0.000 description 1
- GKMJIVDFRBQRTH-UHFFFAOYSA-N trimethoxy-[[4-(trimethoxysilylmethyl)phenyl]methyl]silane Chemical compound CO[Si](OC)(OC)CC1=CC=C(C[Si](OC)(OC)OC)C=C1 GKMJIVDFRBQRTH-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- ORHBXUUXSCNDEV-UHFFFAOYSA-N umbelliferone Chemical compound C1=CC(=O)OC2=CC(O)=CC=C21 ORHBXUUXSCNDEV-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
- G02B5/3083—Birefringent or phase retarding elements
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/41—Compounds containing sulfur bound to oxygen
- C08K5/42—Sulfonic acids; Derivatives thereof
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
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Description
そして、観察者がメガネを着用して3D画像を観察するディスプレイの方式の1つとしては、円偏光メガネ方式等が知られている(例えば、特許文献1を参照。)。
(A)光配向性基と、ヒドロキシ基、カルボキシル基、トリアルコキシシリル基、およびアミノ基から選ばれる1種または2種以上の置換基とを有する化合物、
(B)ヒドロキシ基、カルボキシル基およびアミノ基から選ばれる1種または2種以上の置換基を有する親水性ポリマー、
(C)トリアルコキシシリル基を2個以上有する化合物、並びに
(D)架橋触媒を含有することを特徴とする硬化膜形成組成物に関する。
本実施の形態の硬化膜形成組成物は、(A)低分子の光配向成分と、(B)成分である親水性ポリマー、(C)成分であるトリアルコキシシリル基を2個以上有する化合物、並びに(D)成分である架橋触媒とを含有する。本実施の形態の硬化膜形成組成物は、(A)成分、(B)成分、(C)成分並びに(D)成分に加えて、本発明の効果を損なわない限りにおいて、その他の添加剤を含有することができる。
<(A)成分>
本実施の形態の硬化膜形成組成物に含有される(A)成分は、光配向性基と、ヒドロキシ基、カルボキシル基、トリアルコキシシリル基およびアミノ基から選ばれる1種または2種以上の置換基とを有する化合物である。
尚、本発明において、光配向性基としては光二量化または光異性化する構造部位の官能基を言う。
なお、これらの置換基において、フェニル基とビフェニル基は、炭素原子数1乃至4のアルキル基、炭素原子数1乃至4のアルコキシ基、ハロゲン原子、トリフルオロメチル基およびシアノ基から選ばれる同一または相異なる1または複数の置換基によって置換されていてもよい。
また、上記式中、A1は水素原子またはメチル基を表す。A2は水素原子またはメチル基を表す。
光配向性基とカルボキシル基およびアミノ基とを有する化合物の具体例としてはメチル−4−アミノけい皮酸、エチル−4−アミノけい皮酸、メチル−3−アミノけい皮酸、エチル−3−アミノけい皮酸等が挙げられる。
本実施の形態の硬化膜形成組成物に含有される(B)成分は、親水性のポリマーである。
そして、(B)成分である親水性ポリマーは、ヒドロキシ基、カルボキシル基およびアミノ基から選ばれる1種または2種以上の置換基を有するポリマー(以下、特定重合体とも言う。)とすることができる。
カルボキシル基およびフェノール性ヒドロキシ基のうち少なくとも一方を有する構造単位として、好ましい構造単位は下記式[B2]で表される。
上述したフェノール性ヒドロキシ基を有するモノマーとしては、例えば、p−ヒドロキシスチレン、m−ヒドロキシスチレン、o−ヒドロキシスチレンが挙げられる。
他方、b2モノマーとしてフェノール性ヒドロキシ基のみを有するモノマーを用いる場合、b1モノマーが2モル%乃至80モル%、b2モノマーが20モル%乃至98モル%であることが好ましい。b2モノマーが過小の場合は液晶配向性が不充分となり易く、過大の場合は(A)成分との相溶性が低下し易い。
(B)成分のメラミンホルムアルデヒド樹脂は、保存安定性の観点からメラミンとホルムアルデヒドの重縮合の際に生成したメチロール基がアルキル化されていることが好ましい。
本実施の形態の硬化膜形成組成物に含有される(C)成分は、トリアルコキシシリル基を2個以上有する化合物である。トリアルコキシシリル基を有するポリマーでもよい。
本実施の形態の硬化膜形成組成物は、上述した(A)成分、(B)成分および(C)成分に加え、(D)成分として架橋触媒を含有する。
(D)成分である架橋触媒としては、例えば、酸または熱酸発生剤とすることができる。この(D)成分は、本実施形態の硬化膜形成組成物を用いた硬化膜の形成において、熱硬化反応の促進に有効となる。
本実施の形態の硬化膜形成組成物は、主として溶剤に溶解した溶液状態で用いられる。その際に使用する溶剤は、(A)成分、(B)成分、(C)成分および(D)成分、および/または、後述するその他添加剤を溶解できればよく、その種類および構造などは特に限定されるものでない。
さらに、本実施の形態の硬化膜形成組成物は、本発明の効果を損なわない限りにおいて、必要に応じて、重合開始剤、増感剤、シランカップリング剤、界面活性剤、レオロジー調整剤、顔料、染料、保存安定剤、消泡剤、酸化防止剤等を含有することができる。
本実施の形態の硬化膜形成組成物は、(A)成分である低分子の光配向成分と、(B)成分である、(A)成分の光配向性成分より親水性であるポリマーと、(C)成分であるトリアルコキシシリル基を2個以上有する化合物と、(D)成分である架橋触媒とを含有する。そして、本発明の効果を損なわない限りにおいて、その他の添加剤を含有することができる。
[1]:(A)成分と(B)成分との配合比が質量比で5:95乃至65:35であり、(A)成分と(B)成分との合計量の100質量部に基づいて、10質量部乃至100質量部の(C)成分と、0.5乃至20質量部の(D)成分とを含有する硬化膜形成組成物。
本実施の形態の硬化膜形成組成物における固形分の割合は、各成分が均一に溶剤に溶解している限り、特に限定されるものではないが、1質量%乃至80質量%であり、好ましくは3質量%乃至60質量%であり、より好ましくは5質量%乃至40質量%である。ここで、固形分とは、硬化膜形成組成物の全成分から溶剤を除いたものをいう。
本実施の形態の硬化膜形成組成物の溶液を基板(例えば、シリコン/二酸化シリコン被覆基板、シリコンナイトライド基板、金属、例えば、アルミニウム、モリブデン、クロムなどが被覆された基板、ガラス基板、石英基板、ITO基板等)やフィルム(例えば、トリアセチルセルロース(TAC)フィルム、シクロオレフィンポリマーフィルム、ポリエチレンテレフタレートフィルム、アクリルフィルム等の樹脂フィルム)等の上に、バーコート、回転塗布、流し塗布、ロール塗布、スリット塗布、スリットに続いた回転塗布、インクジェット塗布、印刷などによって塗布して塗膜を形成し、その後、ホットプレートまたはオーブン等で加熱乾燥することにより、硬化膜を形成することができる。
そのため、本実施の形態の硬化膜形成組成物は、各種位相差材(位相差フィルム)や液晶表示素子等の製造に好適に用いることができる。
以下の実施例で用いる略記号の意味は、次のとおりである。
<光配向性基とヒドロキシ基とを有する化合物>
CIN1:4−(6−ヒドロキシヘキシルオキシ)けい皮酸メチルエステル
CIN2:3−メトキシ−4−(6−ドロキシヘキシルオキシ)けい皮酸メチルエステル
MAA:メタクリル酸
MMA:メタクリル酸メチル
HEMA:2−ヒドロキシエチルメタクリレート
AIBN:α、α’−アゾビスイソブチロニトリル
HPCEL:ヒドロキシプロピルセルロース
AADEG:ポリエステル(アジピン酸/ジエチレングリコール)
TTMSI:トリス(3−トリメトキシシリルプロピル)イソシアヌレート
BTMSE:ビス(トリメトキシシリル)エタン
PTSA:パラトルエンスルホン酸・1水和物
PPTS:パラトルエンスルホン酸ピリジン塩
PM:プロピレングリコールモノメチルエーテル
MAA 2.5g、MMA 9.2g、HEMA 5.0g、重合触媒としてAIBN 0.2gをPM 50.7gに溶解し、70℃にて20時間反応させることによりアクリル共重合体溶液(固形分濃度25質量%)(P1)を得た。得られたアクリル共重合体のMnは19,600、Mwは45,200であった。
表1に示す組成にて実施例および比較例の各硬化膜形成組成物を調製し、それぞれについて、密着性、配向感度、パターン形成性、透過率の評価を行った。
実施例および比較例の各硬化膜形成組成物を無アルカリガラス上にスピンコータを用いて2000rpmで30秒間回転塗布した後、温度130℃で120秒間、熱循環式オーブン中で加熱乾燥を行い硬化膜を形成した。この硬化膜に313nmの直線偏光を垂直に50mJ/cm2照射した。露光後の基板上に形成された硬化膜表面にメルク株式会社製の水平配向用重合性液晶溶液RMS03−013Cを、スピンコータを用いて塗布し、次いで、60℃で60秒間ホットプレート上においてプリベークを行い、膜厚1.0μmの塗膜を形成した。この塗膜を1000mJ/cm2で露光し、硬化膜上に重合性液晶層を有する位相差材を作製した。得られた基板上の位相差材表面にカッターナイフを用いてクロスカット(1mm×1mm×100マス)を入れ、その後、粘着テープを貼り付け、次いで、その粘着テープを剥がした時に基板上の位相差材(硬化膜および重合性液晶層)が剥がれず残っているマス目の個数をカウントした。位相差材が剥がれず残っているマス目が90個以上残っているものを密着性が良好と判断した。
実施例および比較例の各硬化膜形成組成物を無アルカリガラス上にスピンコータを用いて2000rpmで30秒間回転塗布した後、温度130℃で120秒間、熱循環式オーブン中で加熱乾燥を行い、硬化膜を形成した。この硬化膜に313nmの直線偏光を垂直に照射し、配向材を形成した。基板上の配向材表面に、メルク株式会社製の水平配向用重合性液晶溶液RMS03−013Cを、スピンコータを用いて塗布し、次いで、60℃で60秒間ホットプレート上においてプリベークを行い、膜厚1.0μmの塗膜を形成した。この塗膜を1000mJ/cm2で露光し、配向材上に重合性液晶層を有する位相差材を作製した。作製した基板上の位相差材を一対の偏光板で挟み込み、位相差材における位相差特性の発現状況を観察し、配向材が液晶配向性を示すのに必要な偏光UVの露光量を測定した。高い配向感度を有する配向材の方が、低い露光量で配向材上の重合性液晶層に配向性を示すことができる。
実施例および比較例の各硬化膜形成組成物を無アルカリガラス上にスピンコータを用いて2000rpmで30秒間回転塗布した後、温度130℃で120秒間、熱循環式オーブン中で加熱乾燥を行い硬化膜を形成した。この硬化膜に100μmのラインアンドスペースマスクを介し313nmの直線偏光を30mJ/cm2垂直に照射した。マスクを取り外し、基板を90度回転させた後、313nmの直線偏光を15mJ/cm2垂直に照射し、液晶の配向制御方向が90度異なる2種類の液晶配向領域が形成された配向材を得た。この基板上の配向材の上に、メルク株式会社製の水平配向用重合性液晶溶液RMS03−013Cを、スピンコータを用いて塗布し、次いで、60℃で60秒間ホットプレート上においてプリベークを行い、膜厚1.0μmの塗膜を形成した。この塗膜を1000mJ/cm2で露光し、重合性液晶を重合させて、異なる位相差特性を有する2種類の領域が規則的に配列されたパターン化位相差材を作製した。作製した基板上のパターン化位相差材を、偏光顕微鏡を用いて観察し、配向欠陥なく位相差パターンが形成されているものを○、配向欠陥が見られるものを×として評価した。
実施例および比較例の各硬化膜形成組成物を石英基板上にスピンコータを用いて2000rpmで30秒間回塗布した後、温度130℃で120秒間ホットプレート上において加熱乾燥ベークを行い膜厚300nmの硬化膜を形成した。膜厚はFILMETRICS社製 F20を用いて測定した。この硬化膜を紫外線可視分光光度計((株)島津製作所製SHIMADZU UV−2550型番)を用いて波長400nmの光に対する透過率を測定した。
以上の評価を行った結果を、表2に示す。
Claims (15)
- (A)光配向性基と、ヒドロキシ基、カルボキシル基およびアミノ基から選ばれる1種または2種以上の置換基とを有する化合物、
(B)ヒドロキシ基、カルボキシル基およびアミノ基から選ばれる1種または2種以上の置換基を有する親水性ポリマー、
(C)トリアルコキシシリル基を2個以上有する化合物、並びに
(D)架橋触媒
を含有することを特徴とする硬化膜形成組成物。 - 前記(A)成分の光配向性基が光二量化または光異性化する構造の官能基であることを特徴とする請求項1に記載の硬化膜形成組成物。
- 前記(A)成分の光配向性基がシンナモイル基であることを特徴とする請求項1または2に記載の硬化膜形成組成物。
- 前記(A)成分の光配向性基がアゾベンゼン構造の基であることを特徴とする請求項1または請求項2に記載の硬化膜形成組成物。
- 前記(A)成分の化合物が2個以上のヒドロキシ基を有することを特徴とする請求項1乃至請求項4のいずれか1項に記載の硬化膜形成組成物。
- 前記(B)成分が、ポリエーテルポリオール、ポリエステルポリオール、ポリカーボネートポリオールおよびポリカプロラクトンポリオールよりなる群から選ばれた少なくとも1種のポリマーであることを特徴とする請求項1乃至請求項5のいずれか1項に記載の硬化膜形成組成物。
- 前記(B)成分がセルロースまたはその誘導体であることを特徴とする請求項1乃至請求項5のいずれか1項に記載の硬化膜形成組成物。
- 前記(B)成分が、ポリエチレングリコールエステル基および炭素原子数2乃至5のヒドロキシアルキルエステル基のうちの少なくとも一方と、カルボキシル基およびフェノール性ヒドロキシ基のうちの少なくとも一方とを有するアクリル重合体であることを特徴とする請求項1乃至請求項5のいずれか1項に記載の硬化膜形成組成物。
- 前記(B)成分がシクロデキストリンまたはその誘導体であることを特徴とする請求項1乃至請求項5のいずれか1項に記載の硬化膜形成組成物。
- 前記(D)成分が酸または熱酸発生剤であることを特徴とする請求項1乃至請求項9のいずれか1項に記載の硬化膜形成組成物。
- 前記(A)成分と(B)成分との比率が質量比で5:95乃至65:35であることを特徴とする請求項1乃至請求項10のいずれか1項に記載の硬化膜形成組成物。
- 前記(A)成分と(B)成分との合計量の100質量部に基づいて、10質量部乃至100質量部の(C)成分を含有することを特徴とする請求項1乃至請求項11のいずれか1項に記載の硬化膜形成組成物。
- 前記(A)成分と(B)成分との合計量の100質量部に基づいて、0.5質量部乃至20質量部の(D)成分を含有することを特徴とする請求項1乃至12のいずれか1項に記載の硬化膜形成組成物。
- 請求項1乃至請求項13のいずれか1項に記載の硬化膜形成組成物より作られることを特徴とする配向材。
- 請求項1乃至請求項13のいずれか1項に記載の硬化膜形成組成物から得られる硬化膜を使用して形成されることを特徴とする位相差材。
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