JP6331290B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device.

An operation button provided on the rear cover, a switch board on which a contact group facing the operation button is disposed, and a switch board holding plate that presses the switch board are fixed to the rear cover with screws. A camera that waterproofs the main board portion in the rear cover by pressing the switch board against the rear cover is known (for example, see Patent Document 1).
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2003-132758

  When a frame ground is provided in the casing of the electronic device, if a dedicated conductor for the frame ground is provided, the number of parts constituting the electronic device increases. Further, the conductor used for the frame ground occupies a large internal space of the electronic device.

  In the first aspect, the electronic device includes a first exterior portion that provides at least a part of the appearance, a display surface having a first surface that is a display surface and a second surface opposite to the first surface. A conductive pressing plate that presses the display portion against the first exterior portion from the second surface of the display portion, and fixes the display portion to the first exterior portion; And a substrate having a ground conductor connected thereto.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

2 is a schematic cross-sectional view of the imaging apparatus 2000. FIG. A state in which the mirror unit 2042 enters the optical path of the subject luminous flux is shown. 12 is an exploded perspective view of a rear unit 1910. FIG. 4 is an exploded perspective view of a power supply unit 2500 and a holding plate 1700. FIG. It is a perspective view which shows the state with which the power supply unit 2500 and the pressing plate 1700 were assembled | attached. A state where the power supply substrate 2520, the processing unit substrate 2420, and the pressing plate 1700 are connected is shown. FIG. 11 is a perspective view showing an imaging unit 2100, a mounting member 2150, a power supply board 2520, and an imaging unit side ground conductor 1800. Sectional drawing of the imaging unit 2100, the attachment member 2150, the processing unit board | substrate 2420, the pressing plate 1700, and the display unit 2024 is shown. It is sectional drawing which expands and shows the B section of FIG. FIG. 10 is a perspective view mainly showing a positional relationship among an imaging unit side ground conductor 1800, a pressing plate 1700, and a power supply board 2520.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a schematic cross-sectional view of the imaging apparatus 2000. The imaging device 2000 is a single lens reflex camera. The imaging apparatus 2000 includes a lens unit 2010 and a camera body 2020. The lens unit 2010 is an interchangeable lens. The lens unit 2010 can be attached to and detached from the camera body 2020. FIG. 1 shows a state where the lens unit 2010 is attached to the camera body 2020 as an imaging device 2000.

  The camera body 2020 includes a body side mount 2022, a cover portion 2030, a body portion 2040, a mirror unit 2042, a shutter unit 2023, an imaging unit 2100, a processing unit substrate 2420, a display unit 2024, and a display unit cover. 1610, a finder unit 2060, a finder window 2064, a lens driving unit 2025, and a focus detection unit 2026. The lens unit 2010 is attached to the body side mount 2022.

  The cover unit 2030 provides the appearance of the imaging device 2000. The cover unit 2030 includes a front cover 2031, an upper cover 2032, and a rear cover 2033. The body portion 2040, the mirror unit 2042, the shutter unit 2023, the imaging unit 2100, the processing unit substrate 2420, the finder unit 2060, the lens driving unit 2025, and the focus detection unit 2026 are a front cover 2031 and an upper cover. 2032 and rear cover 2033 are substantially covered.

  When the configuration related to the imaging apparatus 2000 is described, the direction along the optical axis X of the lens unit 2010 is defined as the z-axis direction. That is, the direction in which the subject luminous flux is incident is determined as the z-axis direction. The direction in which the subject luminous flux is incident is defined as the z-axis minus direction, and the opposite direction is defined as the z-axis plus direction. Further, the x-axis direction and the y-axis direction are defined in the direction shown in FIG. The x-axis, y-axis, and z-axis are right-handed orthogonal coordinate systems. Further, the z-axis plus direction may be referred to as the front side, the front side, or the like. Further, the z-axis minus direction may be referred to as rear, rear, or the like. Further, the y-axis plus direction may be referred to as “upper”, “upper”, “upper”, or the like. The y-axis plus direction may be referred to as “downward”, “lower”, “lower”, or the like.

  The lens unit 2010 includes a lens side mount 2012 and an optical system 2014. The optical system 2014 includes a lens group 2015 and a lens group 2016. The lens group 2015 and the lens group 2016 are provided along the optical axis X in the order of the lens group 2015 and the lens group 2016 along the minus z-axis direction. The lens side mount 2012 is provided on the rear side of the optical system 2014. The lens side mount 2012 is attached to the camera body 2020 by fitting the lens side mount 2012 with the body side mount 2022 disposed on the front surface of the camera body 2020.

  The lens group 2016 is provided to be movable along the optical axis X. As the lens group 2016 moves along the optical axis X, the focal length and focus position of the optical system 2014 change. The lens group 2016 moves along the optical axis X under the control of the lens driving unit 2025. The lens unit 2010 emits the subject luminous flux that has passed through the lens group 2015 and the lens group 2016.

  In the camera body 2020, a finder unit 2060 is fixed above the body portion 2040. The finder unit 2060 includes a focusing screen 2061, a pentaprism 2062, a finder lens system 2063, and a photometric unit 2067. The photometric unit 2067 includes a photometric optical system 2068 and a photometric sensor 2069.

  A mirror unit 2042 is provided in the body portion 2040. The mirror unit 2042 includes a main mirror 2043 and a sub mirror 2044.

  The mirror unit 2042 takes a state of entering into the optical path of the subject light beam emitted from the lens unit 2010 and a state of retracting from the optical path of the subject light beam. FIG. 2 shows a state in which the mirror unit 2042 has entered the optical path of the subject luminous flux. Specifically, the main mirror 2043 is rotatably supported between an entry position where it enters the optical path of the subject light beam emitted from the lens unit 2010 and a retreat position where it is retracted from the optical path of the subject light beam. The sub mirror 2044 is rotatably supported with respect to the main mirror 2043. The sub mirror 2044 enters the subject light beam together with the main mirror 2043, and retreats from the subject light beam together with the main mirror 2043.

  When the main mirror 2043 is at the entry position, a part of the subject light beam incident on the main mirror 2043 is reflected by the main mirror 2043 and guided to the focusing screen 2061. The focusing screen 2061 is arranged at a position conjugate with the imaging surface of the imaging device 2130 included in the imaging unit 2100, and visualizes the subject image formed by the optical system 2014 included in the lens unit 2010. The light beam of the subject image formed on the focusing screen 2061 is guided to the pentaprism 2062. A part of the light beam guided to the pentaprism 2062 can be emitted from the finder window 2064 through the pentaprism 2062 and the finder lens system 2063 and observed as a subject. The finder window 2064 is fixed to the rear cover 2033.

  When the main mirror 2043 is in the approach position, light beams other than the subject light beam reflected by the main mirror 2043 out of the subject light beam incident on the main mirror 2043 enter the sub mirror 2044. Specifically, the main mirror 2043 has a half mirror area, and a subject light beam that has passed through the half mirror area of the main mirror 2043 enters the sub mirror 2044. The subject light flux that has been transmitted through the half mirror region and reflected by the sub mirror 2044 enters the focus detection unit 2026.

  The focus detection unit 2026 includes a focus detection sensor unit 2027 that detects an incident light beam and outputs information indicating a focus state with respect to the subject. The focus detection sensor unit 2027 outputs the detection result of the focus state to the processing unit substrate 2420. An output signal from the focus detection sensor unit 2027 is output to the processing unit substrate 2420 via the flexible printed circuit board. The processing circuit provided on the processing unit substrate 2420 performs focus adjustment based on the detection result of the focus state indicated by h in the output signal from the focus detection sensor unit 2027. For example, the processing circuit provided on the processing unit substrate 2420 controls the lens driving unit 2025 based on the focus state detection result to move the lens group 2016.

  A part of the light beam guided to the pentaprism 2062 enters the photometric sensor 2069 through the photometric optical system 2068. The photometric sensor 2069 receives the incident light beam and detects the amount of light of the subject. The photometric sensor 2069 outputs the detection result of the light amount of the subject to the processing unit substrate 2420. An output signal from the photometric sensor 2069 is output to the processing unit substrate 2420 via the flexible printed circuit board. The processing circuit provided on the processing unit substrate 2420 performs exposure adjustment based on the detection result of the light amount of the subject indicated by the output signal from the photometric sensor 2069. For example, the processing circuit provided on the processing unit substrate 2420 controls at least one of the aperture of the lens unit 2010, the exposure time, and the sensitivity of the image sensor 2130 based on the detection result of the light amount of the subject.

  When the mirror unit 2042 is retracted from the subject light beam and the front curtain and rear curtain of the shutter unit 2023 are opened, the subject light beam transmitted through the lens unit 2010 enters the imaging unit 2100 disposed behind the shutter unit 2023. Then, it reaches the imaging surface of the imaging device 2130.

  A processing unit substrate 2420, a pressing plate 1700, a display unit 2024, and a display unit cover 1610 are sequentially arranged behind the imaging unit 2100. The pressing plate 1700 presses the display unit 2024 against the rear cover 2033 and fixes the display unit 2024 to the rear cover 2033.

  The display unit 2024 displays an image generated from the output signal from the image sensor 2130. An image on the display surface of the display unit 2024 is displayed from the back surface of the camera body 2020 through the opening 2039 of the cover unit 2030 and the display unit cover 1610. A liquid crystal panel can be applied to the display unit 2024. The display unit 2024 may include a liquid crystal panel and a backlight panel located in the z-axis plus direction with respect to the liquid crystal panel. The display unit 2024 may include a touch panel positioned in the negative z-axis direction with respect to the liquid crystal panel.

  Electronic circuits including processing circuits such as MPU and ASIC are mounted on the processing unit substrate 2420. The MPU is responsible for overall control of the imaging apparatus 2000. An output signal from the image sensor 2130 is output to the ASIC via a flexible printed circuit board that connects the image capture unit 2100 and the processing unit substrate 2420. The ASIC processes the output signal output from the image sensor 2130.

  The ASIC generates image data for display based on an output signal from the image sensor 2130. The display unit 2024 displays an image based on display image data generated by the ASIC. The ASIC generates image data for recording based on an output signal from the image sensor 2130. A recording medium 1680 described later is detachably provided on the camera body 2020. The recording image data generated by the ASIC is recorded on a recording medium 1680 mounted on the camera body 2020.

  The front cover 2031, the upper cover 2032, and the rear cover 2033 are made of resin. The front cover 2031, the upper cover 2032, and the rear cover 2033 are formed of a resin having conductivity. The front cover 2031, the upper cover 2032, and the rear cover 2033 are formed by resin molding. The body side mount 2022 is made of metal. The body side mount 2022 is a mount ring having a ring shape. Body portion 2040 is formed of resin. The body side mount 2022 has rigidity higher than that of the body portion 2040.

  In the cover part 2030, the front cover 2031 is fixed to the body part 2040 in the vicinity of the body side mount 2022. The front cover 2031 is fastened to at least one of a portion of the body portion 2040 where the body side mount 2022 is fastened and the body side mount 2022. For example, the front cover 2031 may be fastened to the body side mount 2022. More specifically, the front cover 2031 is fastened together with the body side mount 2022 and the body portion 2040. The front cover 2031 has a portion sandwiched between the body side mount 2022 and the body portion 2040, and the portion may be fastened together with the body side mount 2022 and the body portion 2040. The front cover 2031 may be fastened together with the body side mount 2022 and the body part 2040 by screws that fasten the body side mount 2022 to the body part 2040.

  The cover part 2030 has a monocoque structure. The upper cover 2032 is fastened to the front cover 2031 and the rear cover 2033. The rear cover 2033 is fastened to the front cover 2031 and the upper cover 2032. The front cover 2031, the upper cover 2032, and the rear cover 2033 are fastened to other covers so that the cover portion 2030 formed by the front cover 2031, the upper cover 2032, and the rear cover 2033 has a monocoque structure.

  The cover portion 2030 is fastened to the body portion 2040 at a portion in the vicinity of the body side mount 2022. Body part 2040 is not fastened to any of front cover 2031, upper cover 2032, and rear cover 2033 at other parts. For example, the front cover 2031 is not fastened to the body portion 2040 at a portion other than the vicinity of the body side mount 2022. Further, the front cover 2031 is not fastened to other members fastened to the body portion 2040 except for the body side mount 2022. The upper cover 2032 and the rear cover 2033 are not fastened to the body portion 2040. The upper cover 2032 and the rear cover 2033 are not fastened to other members fastened to the body portion 2040 except for the front cover 2031. Therefore, the cover portion 2030 is fastened to the body portion 2040 only at a portion in the vicinity of the body side mount 2022.

  By fastening the body side mount 2022 to the body part 2040, the rigidity of the part where the body side mount 2022 is fastened in the body part 2040 and the part in the vicinity thereof are increased. Accordingly, the cover portion 2030 is fastened to a portion having high rigidity in the body portion 2040.

  Further, since the cover portion 2030 has a monocoque structure, stress applied to any of the front cover 2031, the upper cover 2032, and the rear cover 2033 can be handled by the entire front cover 2031, upper cover 2032, and rear cover 2033. At the same time, the stress applied to any of the front cover 2031, the upper cover 2032, and the rear cover 2033 is intensively transmitted to a portion where rigidity is increased by fixing the body side mount 2022 in the body portion 2040. Therefore, compared with the case where the stress applied to any of the front cover 2031, the upper cover 2032, and the rear cover 2033 is transmitted to other parts of the body portion 2040, the stress has an effect on the positioning accuracy of the imaging unit 2100. Can be reduced.

  The shutter unit 2023 is connected to the processing unit substrate 2420 via a flexible printed circuit board. The output signal of the photometric sensor 2069 is connected to the processing unit substrate 2420 via a flexible printed circuit board. The imaging unit 2100 is connected to the processing unit substrate 2420 via a flexible printed circuit board. Similarly, the shutter unit 2023 is connected to the processing unit substrate 2420 via a flexible substrate. Further, the operation member provided on the upper cover 2032 is connected to the processing unit substrate 2420 via a flexible substrate. Therefore, for example, stress applied to the rear cover 2033 and the upper cover 2032 is not substantially transmitted to the body portion 2040 via the processing unit substrate 2420 and the flexible printed circuit board. Therefore, the part to which the stress applied to the cover part 2030 is transmitted is limited to the vicinity of the part where the body side mount 2022 is fixed in the body part 2040.

  FIG. 2 is an exploded perspective view of the front unit 1900. The front unit 1900 includes a front cover 2031, an upper cover 2032, and a body part set 2050. The body part set 2050 includes a body part 2040, a body side mount 2022, an imaging unit 2100, a mounting member 2150, an imaging unit side ground conductor 1800, a shutter unit 2023, and a focus detection unit 2026.

  The body-side mount 2022, the imaging unit 2100, the mounting member 2150, the imaging unit-side ground conductor 1800, the shutter unit 2023, and the focus detection unit 2026 are fastened directly or indirectly to the body portion 2040. The imaging unit 2100 is attached to the body portion 2040 via an attachment member 2150 that is fastened to the body portion 2040. The attachment member 2150 is formed of a material having rigidity. The material forming the attachment member 2150 may be a metal. The imaging unit 2100 is indirectly fastened to the body portion 2040 via the attachment member 2150.

  In the front unit 1900, the front cover 2031 is fastened to the body portion 2040. The upper cover 2032 is fastened to the front cover 2031. The upper cover 2032 is fastened to the rear cover 2033 shown in FIG.

  FIG. 3 is an exploded perspective view of the rear unit 1910. The rear unit 1910 includes a display unit cover 1610, a rear cover 2033, a display unit 2024, a pressing plate 1700, a processing unit substrate 2420, and a power supply unit 2500. The processing unit substrate 2420 is provided with electronic circuits such as a device connection connector 1691 and a recording medium connector 1692. The power supply unit 2500 includes a power supply board 2520 and a battery box 2510. When the rear unit 1910 is viewed along a line passing through the center of the display unit 2024, the processing unit substrate 2420, the pressing plate 1700, the display unit 2024, and the display unit cover 1610 are sequentially arranged in the z-axis minus direction.

  The display unit cover 1610 is attached to the rear cover 2033 from the z-axis minus direction. The display unit 2024 includes a second main surface 1622 that is a display surface, and a first main surface 1621 opposite to the second main surface 1622. The display unit 2024 is pressed against the rear cover 2033 from the position in the plus direction of the z axis by the pressing plate 1700 and fixed. The pressing plate 1700 presses the display unit 2024 against the rear cover 2033 from the first main surface 1621 of the display unit 2024 and fixes the display unit 2024 to the rear cover 2033. The display unit 2024 is pressed against the pressing plate 1700 in a state where the display unit 2024 is supported by the display unit support 1650 included in the rear cover 2033. The image displayed on the second main surface 1622 of the display unit 2024 is presented to the outside through the opening 2039 of the rear cover 2033.

  The holding plate 1700 is fastened to the rear cover 2033 with screws. The display unit 2024 is pressed against the rear cover 2033 and fixed to the rear cover 2033 by a force in the negative z-axis direction applied from the pressing plate 1700 fastened to the rear cover 2033.

  The holding plate 1700 is made of metal. The material forming the presser plate 1700 may be copper. The pressing plate 1700 not only functions as a member that presses the display unit 2024, but also functions as at least a part of the frame ground conductor in the imaging device 2000. The rigidity of the pressing plate 1700 is lower than the rigidity of the rear cover 2033. For example, the bending elastic modulus of the pressing plate 1700 is lower than the bending elastic modulus of the rear cover 2033. The bending elastic modulus of the pressing plate 1700 is lower than the bending elastic modulus of the front cover 2031. The bending elastic modulus of the pressing plate 1700 is lower than the bending elastic modulus of the upper cover 2032.

  FIG. 4 is an exploded perspective view of the power supply unit 2500 and the pressing plate 1700. FIG. 4 is an exploded perspective view seen from a different direction from the exploded perspective view shown in FIG. 3. FIG. 5 is a perspective view showing a state where the power supply unit 2500 and the pressing plate 1700 are assembled. As shown in FIG. 5, a power supply unit 2500 is attached to the pressing plate 1700. The power supply unit 2500 is attached to an attachment portion 1790 included in the holding plate 1700.

  The power supply board 2520 has a hole 2531 for attaching the power supply board 2520 to the holding plate 1700. The holding plate 1700 has a hole 1731 in the attachment portion 1790 for attaching the power supply substrate 2520. The hole 1731 is a hole penetrating from the first main surface 1791 to the second main surface 1792 in the attachment portion 1790. The power supply board 2520 is fastened to the holding plate 1700 by inserting screws into holes 2531 provided in the power supply board 2520 and holes 1731 provided in the mounting portion 1790. Power supply board 2520 is fastened to mounting portion 1790 in a state where it contacts second main surface 1792 of mounting portion 1790.

  The power supply board 2520 has a first main surface 2521 provided with a plurality of battery connection terminals 2330 and a second main surface 2522 opposite to the first main surface 2521. A battery is attached to the battery box 2510. The second main surface 2522 is provided with a plurality of battery connection terminals 2330 corresponding to the plurality of terminals included in the battery attached to the battery box 2510. When a battery is attached to the battery box 2510, each of the plurality of battery connection terminals 2330 comes into contact with a corresponding terminal included in the battery.

  The power supply board 2520 is fixed with the second main surface 2522 of the power supply board 2520 in contact with the mounting portion 1790. Of the plurality of battery connection terminals 2330, the holding plate 1700 is electrically connected to the battery connection terminal 2330 that contacts the negative electrode terminal of the battery mounted in the battery box 2510. The holding plate 1700 is in contact with the ground conductor connected to the battery connection terminal 2330 that is in contact with the negative electrode terminal of the battery. The ground conductor provides a reference potential for the power supply circuit. The holding plate 1700 is connected to the ground conductor at a plurality of different positions of the ground conductor. Since the pressing plate 1700 is electrically connected to the ground conductor of the power supply substrate 2520, the potential of the pressing plate 1700 becomes the ground potential. The holding plate 1700 provides at least a part of the frame ground conductor in the imaging apparatus 2000.

  As described above, the cover portion 2030 has a monocoque structure. The imaging apparatus 2000 does not have a structure that provides the strength of the entire imaging apparatus 2000 in the cover portion 2030. The imaging device 2000 does not have a metal structure in the cover portion 2030. In the imaging apparatus 2000, since the pressing plate 1700 is used as a frame ground conductor, the number of parts can be reduced as compared with a case where a conductor dedicated to the frame ground is provided. Further, since the pressing plate 1700 is used as a frame ground conductor, the space occupied by the frame ground conductor can be reduced as compared with a case where a structure that provides the strength of the entire imaging apparatus 2000 is used as the frame ground conductor.

  In the imaging apparatus 2000, the power supply board 2520 is brought into contact with and fastened to the mounting portion 1790 of the pressing plate 1700. Since the power supply substrate 2520 is provided in contact with the pressing plate 1700, the impedance between the negative electrode terminal of the battery and the pressing plate 1700 can be reduced. As shown in FIG. 2, the attachment portion 1790 is provided with an opening 1795. From the second main surface 2522 of the power supply substrate 2520, a tip end portion 2331 of the battery connection terminal 2330 on the negative side in the z-axis direction protrudes. When power supply board 2520 is attached to attachment portion 1790, tip portion 2331 is accommodated in opening 1795. Therefore, it is possible to prevent the distal end portion 2331 from contacting the pressing plate 1700. In addition, the power supply board 2520 and the attachment portion 1790 can be tightly fastened. Further, the power supply board 2520 and the attachment portion 1790 can be connected to each other at a short distance. Therefore, the impedance between the negative electrode terminal of the battery and the pressing plate 1700 can be further reduced.

  FIG. 6 shows a state where the power supply substrate 2520, the processing unit substrate 2420, and the pressing plate 1700 are connected. In FIG. 6, the device connection connector 1691, the recording medium connector 1692, and the recording medium 1680 are omitted. The processing unit substrate 2420 is fastened to the pressing plate 1700.

  The holding plate 1700 includes a flat plate portion 1710, a first extending portion 1720, a second extending portion 1730, and an attaching portion 1790. The flat plate portion 1710 has a first main surface 1711 and a second main surface 1712 opposite to the first main surface 1711. The first main surface 1711 and the second main surface 1712 are surfaces substantially parallel to the xy plane. The second major surface 1712 is a surface that presses the display unit 2024 in the negative z-axis direction. The flat plate portion 1710 has a rectangular shape on the xy plane. In the xy plane, the area of the flat plate portion 1710 is larger than the area of the display unit 2024.

  The processing unit substrate 2420 has a hole 2432, a hole 2433, and a hole 2434 for attaching the processing unit substrate 2420 to the holding plate 1700. The holes 2432, 2433, and 2434 of the processing unit substrate 2420 are holes that penetrate from the first main surface 2421 to the second main surface 2422 of the processing unit substrate 2420. The holding plate 1700 has a hole 1732, a hole 1733, and a hole 1734 for attaching the processing unit substrate 2420 in the flat plate portion 1710.

  The processing unit substrate 2420 is fastened to the pressing plate 1700 by inserting screws into the holes 2432 of the processing unit substrate 2420 and the holes 1732 of the flat plate portion 1710 of the pressing plate 1700. Further, the processing unit substrate 2420 is fastened to the holding plate 1700 by inserting screws into the hole 2433 of the processing unit substrate 2420 and the hole 1733 of the flat plate portion 1710 of the holding plate 1700. Further, the processing unit substrate 2420 is fastened to the holding plate 1700 by inserting screws into the hole 2434 of the processing unit substrate 2420 and the hole 1734 of the flat plate portion 1710 of the holding plate 1700.

  The first extending portion 1720 extends from the first main surface 1711 in the z-axis plus direction. The first extending portion 1720 extends in the z-axis plus direction from the end portion of the flat plate portion 1710 in the y-axis plus direction. The first extending portion 1720 has a plate shape substantially parallel to the xy plane. Second extending portion 1730 extends in the z-axis plus direction from first main surface 1711. Second extending portion 1730 extends in the z-axis plus direction from the end portion of flat plate portion 1710 in the y-axis minus direction. The second extending portion 1730 has a plate shape substantially parallel to the xy plane.

The attaching portion 1790 extends in the y-axis minus direction from the end portion of the first extending portion 1720 in the z-axis plus direction. The attachment portion 1790 has a first main surface 1791 substantially perpendicular to the z-axis and a second main surface 1792 substantially perpendicular to the z-axis. The attachment portion 1790 has a plate shape substantially parallel to the xy plane. In the z-axis direction, the processing unit substrate 2420 is provided between the first main surface 1791 of the attachment portion 1790 and the first main surface 1711 of the pressing plate 1700.

  When the processing unit substrate 2420 is fastened to the pressing plate 1700, the pressing plate 1700 comes into contact with a ground conductor provided on the processing unit substrate 2420. The ground conductor provided on the processing unit substrate 2420 is electrically connected to the holding plate 1700 at a plurality of points. The ground conductor provided on the processing unit substrate 2420 is electrically connected to the holding plate 1700 to provide a signal ground in the processing unit substrate 2420. The ground conductor provided on the processing unit substrate 2420 provides a signal ground in an ASIC and MPU provided on the processing unit substrate 2420 and electronic circuits such as a device connection connector 1691 and a recording medium connector 1692 described later.

  In addition, the 1st extending | stretching part 1720 is not provided with the hole. Further, the flat plate portion 1710 has no holes or openings other than the holes for inserting screws. Therefore, the cross-sectional area of the electrical path between the portion of the holding plate 1700 that is in contact with the ground conductor of the power supply substrate 2520 and the portion of the holding plate 1700 that is in contact with the ground conductor of the processing unit substrate 2420 is increased. Can do. Therefore, the ground conductor of the power supply substrate 2520 and the ground conductor of the processing unit substrate 2420 can be electrically connected with low impedance. In addition, noise generated in the electrical path between the ground conductor of the power supply substrate 2520 and the ground conductor of the processing unit substrate 2420 can be reduced.

  As shown mainly in FIG. 3, the processing unit substrate 2420 is provided with a device connection connector 1691 to which other devices are connected and a recording medium connector 1692. The device connection connector 1691 and the recording medium connector 1692 are provided on the first main surface 2421 of the processing unit substrate 2420. The ASIC, MPU, and the like described above are provided on the second main surface 2422 of the processing unit substrate 2420.

  The recording image data generated by the ASIC provided on the processing unit substrate 2420 is recorded on the recording medium 1680 attached to the recording medium connector 1692. As the recording medium 1680, a semiconductor memory card such as an SD card can be exemplified. The recording image data generated by the ASIC provided on the processing unit substrate 2420 and the image data read from the memory card attached to the recording medium connector 1692 are transferred to another device via the device connection connector 1691. Is output. Examples of the device connection connector 1691 include a USB connector and an HDMI (registered trademark) connector.

  FIG. 7 is a perspective view showing the imaging unit 2100, the mounting member 2150, the power supply board 2520, and the imaging unit-side ground conductor 1800. FIG. 8 is a cross-sectional view of the imaging unit 2100, the mounting member 2150, the processing unit substrate 2420, the pressing plate 1700, and the display unit 2024. FIG. 8 is a cut surface of the yz plane and shows the AA cross section shown in FIG.

  As shown in FIG. 8, the first extending portion 1720 extends from the second main surface 2422 of the processing unit substrate 2420 to a position in the z-axis plus direction. The second extending portion 1730 extends from the second main surface 2422 of the processing unit substrate 2420 to a position in the z-axis plus direction. Therefore, the pressing plate 1700 also functions as a member that shields the processing unit substrate 2420. For example, the pressing plate 1700 functions as a member that electromagnetically shields the processing unit substrate 2420.

  The second main surface 2422 of the processing unit substrate 2420 is provided with the above-described electronic circuit such as ASIC or MPU. Therefore, electronic circuits such as ASIC and MPU are shielded by the pressing plate 1700. When the processing unit substrate 2420 is provided with a circuit such as an electronic circuit for processing a high-frequency signal or a pattern with high-frequency oscillation, these circuits are preferably provided on the second main surface 2422 of the processing unit substrate 2420. More preferably, the first main surface 2421 of the processing unit substrate 2420 is not provided with a circuit such as an electronic circuit for processing a high-frequency signal or a pattern accompanied by high-frequency oscillation.

  In addition, the 1st extending | stretching part 1720 and the 2nd extending | stretching part 1730 may be extended | stretched from the 1st main surface 2421 of the process unit board | substrate 2420 to the position of a z-axis plus direction. Only one of the first extending portion 1720 and the second extending portion 1730 may extend from the first main surface 2421 of the processing unit substrate 2420 to a position in the z-axis plus direction.

  FIG. 9 is an enlarged cross-sectional view of a portion B in FIG. FIG. 10 is a perspective view mainly showing the positional relationship among the imaging unit side ground conductor 1800, the pressing plate 1700, and the power supply board 2520.

  As mainly shown in FIG. 8, the imaging unit 2100 includes a first substrate 2120, a second substrate 2122, an imaging element 2130, a surrounding member 2140, a cover glass 2142, an optical element 2144, a mask rubber 2146, and the like. And a pressing plate 2148.

  The image sensor 2130 is mounted on the first substrate 2120. The second substrate 2122 is located in the negative z-axis direction from the first substrate 2120. The second substrate 2122 is attached to the first substrate 2120. A signal output from the image sensor 2130 is transmitted to the second substrate 2122 via the first substrate 2120, and is transmitted from the second substrate 2122 to the processing unit substrate 2420 via the flexible printed circuit board.

  The surrounding member 2140 is provided on the first substrate 2120 and surrounds the imaging element 2130. A cover glass 2142 is provided on the upper surface of the surrounding member 2140 in the z-axis plus direction. The image sensor 2130 is provided in a closed space formed by the first substrate 2120, the surrounding member 2140, and the cover glass 2142.

  The optical element 2144 may include an optical low-pass filter and an infrared cut filter. The subject luminous flux incident on the optical element 2144 passes through the optical element 2144 and the cover glass 2142 and enters the image sensor 2130. The holding plate 2148 is fastened to the mounting member 2150. The pressing plate 2148 presses the optical element 2144 in the negative z-axis direction via the mask rubber 2146 to press the optical element 2144 against the cover glass 2142.

  The imaging unit-side ground conductor 1800 includes a main portion 1810, a first side wall portion 1821, a second side wall portion 1822, and a third side wall portion that are provided along the main surface 2128 on the z-axis negative direction side of the second substrate 2122. 1823, a fourth side wall 1824, a fifth side wall 1825, a sixth side wall 1826, a seventh side wall 1827, an eighth side wall 1828, a ninth side wall 1829, and a first mounting portion 1830. And a second attachment portion 1840 and a ground connection portion 1850.

  The main portion 1810 has a shape along the main surface 2128 of the second substrate 2122 on the negative z-axis direction side. In a portion where an electronic circuit is provided on the main surface 2128, the main portion 1810 has a shape that follows the outline of the electronic circuit. The main portion 1810 has an undulating shape along the electronic component provided on the main surface 2128 and the main surface 2128. The first sidewall portion 1821, the second sidewall portion 1822, the third sidewall portion 1823, and the ninth sidewall portion 1829 extend from the main portion 1810 in the z-axis plus direction and have a flat plate shape substantially parallel to the xy plane.

  The first side wall portion 1821 extends in the z-axis plus direction from the end portion of the main portion 1810 in the y-axis plus direction. The second sidewall portion 1822, the third sidewall portion 1823, and the ninth sidewall portion 1829 extend in the z-axis plus direction from the end portion of the main portion 1810 in the y-axis minus direction. The second side wall portion 1822 is positioned in the x-axis plus direction from the third side wall portion 1823. The third side wall portion 1823 is positioned in the x-axis plus direction from the ninth side wall portion 1829. The second side wall portion 1822 is located in the negative y-axis direction from the third side wall portion 1823. The third side wall portion 1823 is located in the negative y-axis direction with respect to the ninth side wall portion 1829. The first side wall portion 1821 and the second side wall portion 1822 extend in the z-axis plus direction to the vicinity of the mounting member 2150.

  The fourth sidewall portion 1824, the fifth sidewall portion 1825, the sixth sidewall portion 1826, the seventh sidewall portion 1827, the eighth sidewall portion 1828, and the ninth sidewall portion 1829 extend from the main portion 1810 in the z-axis plus direction. The fourth sidewall portion 1824, the fifth sidewall portion 1825, the sixth sidewall portion 1826, the seventh sidewall portion 1827, and the eighth sidewall portion 1828 have a flat plate shape substantially parallel to the yz plane. At least by the first side wall 1821, the second side wall 1822, the third side wall 1823, the fourth side wall 1824, the fifth side wall 1825, the sixth side wall 1826, the seventh side wall 1827 and the eighth side wall 1828. The second substrate 2122 is substantially surrounded.

  The first attachment portion 1830 extends in the y-axis plus direction from the end portion of the first side wall portion 1821 in the z-axis plus direction. The first attachment portion 1830 has a flat plate shape substantially parallel to the xy plane. The first attachment portion 1830 has a hole 1831 and a hole 1832 for attaching the imaging unit side ground conductor 1800 to the attachment member 2150.

  The second attachment portion 1840 extends in the y-axis minus direction from the end portion in the z-axis plus direction of the second side wall portion 1822. The second attachment portion 1840 has a flat plate shape substantially parallel to the xy plane. The second attachment portion 1840 has a hole 1841 for attaching the imaging unit side ground conductor 1800 to the attachment member 2150.

  The attachment member 2150 has a hole 1951 and a hole 1952 for attaching the imaging unit side ground conductor 1800. The imaging unit side ground conductor 1800 is fastened to the mounting member 2150 by inserting screws into the hole 1831 of the first mounting portion 1830 and the hole 1951 of the mounting member 2150. The imaging unit side ground conductor 1800 is fastened to the mounting member 2150 by inserting screws into the hole 1832 of the first mounting portion 1830 and the hole 1952 of the mounting member 2150. The imaging unit side ground conductor 1800 is fastened to the mounting member 2150 by inserting screws into the hole 1841 of the second mounting portion 1840 and the hole 1953 of the mounting member 2150.

  The ground connection portion 1850 extends mainly in the z-axis minus direction from the end portion of the second attachment portion 1840 in the y-axis minus direction. As shown mainly in FIG. 9, the ground connection portion 1850 includes a first extending portion 1851 and a second extending portion 1852 extending substantially parallel to the xz plane, and between the first extending portion 1851 and the second extending portion 1852. And a connector portion 1860 that comes into contact with the presser plate 1700.

  The connector portion 1860 is supported by the pressing plate 1700 in a state where the edge portion in the z-axis plus direction of the second extending portion 1730 of the pressing plate 1700 is sandwiched. The imaging unit side ground conductor 1800 is electrically connected to the holding plate 1700 at the connector portion 1860.

  The bent portion 1853 is an example of a stress absorbing portion. The bent portion 1853 absorbs the stress by being deformed with respect to the stress. The bent portion 1853 absorbs the stress transmitted from the first extending portion 1851 and suppresses the stress transmitted from the first extending portion 1851 from being transmitted to the second extending portion 1852. The bent portion 1853 absorbs the stress transmitted from the second extending portion 1852 and suppresses the stress transmitted from the second extending portion 1852 from being transmitted to the first extending portion 1851.

  When stress is applied to the rear cover 2033, the stress transmitted from the rear cover 2033 to the connector unit 1860 of the imaging unit side ground conductor 1800 via the pressing plate 1700 is absorbed by the bent portion 1853. Therefore, the stress applied to the rear cover 2033 is suppressed from being transmitted to the body part set 2050.

  Note that the shape of the bent portion 1853 is not limited to the illustrated shape. The bent portion 1853 may have various shapes such as an S shape and a U shape. It is preferable that the bending stress generated in the bent portion 1853 is low. The bent portion 1853 preferably has a flexible property with respect to stress.

  In the imaging apparatus 2000 of the present embodiment, the processing unit substrate 2420 is located in the z-axis minus direction from the power supply substrate 2520. However, the processing unit substrate 2420 may be disposed at the same position as the power supply substrate 2520 in the z-axis direction. The processing unit substrate 2420 may be arranged side by side with the power supply substrate 2520 in the xy plane.

  Note that the output signal of the photometric sensor 2069 may be connected to the processing unit substrate 2420 via a flexible printed circuit board that connects the shutter unit 2023 and the processing unit substrate 2420. Further, the output signal of the focus detection sensor unit 2027 may be connected to the processing unit substrate 2420 via a flexible printed circuit board that connects the shutter unit 2023 and the processing unit substrate 2420. As described above, the connections between the photometric sensor 2069 and the focus detection sensor unit 2027 and the processing unit substrate 2420 may be integrated into a flexible printed circuit board that connects the shutter unit 2023 and the processing unit substrate 2420.

  Here, the flexible printed circuit board connecting the shutter unit 2023 and the processing unit substrate 2420 may be connected to the processing unit substrate 2420 through the position in the y-axis plus direction from the imaging unit 2100. Similarly, the flexible printed circuit board that connects the imaging unit 2100 and the processing unit substrate 2420 is connected to the processing unit substrate 2420 from the position in the y-axis plus direction. Similarly, the flexible substrate that connects the operation member provided on the upper cover 2032 and the processing unit substrate 2420 is connected to the processing unit substrate 2420 from a position in the y-axis plus direction. Thereby, in the process of assembling the rear unit 1910 to the front unit 1900, the workability of the process of connecting each flexible substrate to the processing unit substrate 2420 is enhanced. Note that the upper cover 2032 and the processing unit substrate 2420 may be connected by a rigid connector such as a board-to-board connector.

  In the present embodiment, the configuration of the imaging apparatus 2000 has been described by taking up the camera body as a lens unit. However, the imaging device is a concept including a camera body that does not have a lens unit. Further, the imaging device is a concept including various types of cameras such as a non-lens-replaceable camera, in addition to a single-lens reflex camera which is an example of an interchangeable lens camera.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the description of the scope of claims that embodiments with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operation, procedure, step, and stage in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the specification, and the drawings, even if it is described using “first”, “next”, etc. for the sake of convenience, it means that it is essential to carry out in this order. It is not a thing.

1610 Display unit cover, 1621 First main surface, 1622 Second main surface, 1650 Display unit support unit, 1680 Recording medium, 1691 Device connection connector, 1692 Recording medium connector 1700 Press plate, 1710 Flat plate unit, 1711 First main Surface, 1712 second main surface, 1720 first extending portion, 1730 second extending portion, 1731, 1732, 1733, 1734 hole, 1790 mounting portion, 1791 first main surface, 1792 second main surface, 1795 aperture 1800 imaging unit Side ground conductor, 1810 main part, 1821 first side wall part, 1822 second side wall part, 1823 third side wall part, 1824 fourth side wall part, 1825 fifth side wall part, 1826 sixth side wall part, 1827 seventh side wall part, 1828 8th side wall part, 1829 9th side wall part, 1830 1st attachment part, 1831, 1832, 841 hole, 1840 second attachment portion, 1850 ground connection portion, 1851 first extension portion, 1852 second extension portion, 1853 bent portion, 1860 connector portion 1900 front unit, 1910 rear unit 1951, 1952, 1953 hole 2000 imaging device , 2010 lens unit, 2012 lens side mount, 2014 optical system, 2015 lens group, 2016 lens group, 2020 camera body, 2022 body side mount, 2023 shutter unit, 2024 display unit, 2025 lens drive unit, 2026 focus detection unit, 2027 Focus detection sensor unit, 2030 cover unit, 2031 front cover, 2032 upper cover, 2033 rear cover, 2039 opening, 2040 body unit, 2042 mirror unit, 2043 main mirror, 20 4 Sub-mirror, 2050 Body unit, 2060 Viewfinder unit 2061 Focusing screen, 2062 Penta prism, 2063 Viewfinder lens system, 2064 Viewfinder window, 2067 Photometric unit, 2068 Photometric optical system, 2069 Photometric sensor 2100 Imaging unit, 2148 Holding plate, 2120 1 substrate, 2122 2nd substrate, 2128 main surface, 2130 imaging device, 2140 surrounding member, 2142 cover glass, 2144 optical element, 2146 mask rubber, 2150 mounting member 2330 battery connection terminal, 2331 tip 2420 processing unit substrate, 2421 first 1 main surface, 2422 2nd main surface, 2432, 2433, 2434, 2531 hole 2500 power supply unit, 2510 battery box, 2520 power supply board, 2521 first main surface , 2522 the second major surface

Claims (9)

A first exterior part that provides at least part of the appearance;
A display unit having a first surface that is a display surface and a second surface opposite to the first surface;
A substrate having a ground conductor;
A conductive pressing plate that is electrically connected to a conductor serving as a reference potential of the power supply circuit and presses the display unit against the first exterior unit from the second surface of the display unit;
Connected to said holding plate, and a connection conductor for electrically connecting the pressing plate and the ground conductor of the substrate,
The said connection conductor is an electronic device provided with the stress absorption part which absorbs the stress added to the said connection conductor . The electronic device according to claim 1, wherein the pressing plate functions as a frame ground conductor of the electronic device with respect to the plurality of substrates. The power supply circuit generates power for driving the electronic device from power supplied from a battery,
The electronic device according to claim 1, wherein the pressing plate is electrically connected to a negative electrode terminal of the battery. Providing a part of the exterior, a second exterior part fastened to the first exterior part;
A body portion fastened to the second exterior portion;
The pressing plate is fastened to the first exterior part,
The substrate, the electronic device according to any one of claims 1 to 3 attached to the body portion. The connection conductor is
A first attachment portion attached to the body portion;
A second attachment portion attached to the pressing plate;
The stress absorbing portion is located between the first mounting portion and the second mounting portion, and has a bent portion that bends in response to a stress applied from the pressing plate via the second mounting portion. Item 5. The electronic device according to Item 4 . The connection conductor is
The electronic device according to any one of claims 1 to 5, having a shield part for shielding circuit of at least a portion covering at least a portion of a circuit of a circuit provided in the substrate. Further comprising an image sensor provided on the substrate,
Wherein the display unit, the electronic device according to any one of claims 1 to 6 for displaying an image based on the signal generated by the imaging device. The pressing plate, the substrate over at least a portion of the circuit included in the electronic device according to any one of claims 1 to 5, wherein the shield at least a part of the circuit. The holding plate is
A flat plate portion for pressing the display portion;
An extending portion extending from the flat plate portion toward the position where the substrate is provided;
Said plate, said has a generally parallel major surface to the surface on which at least a part of the circuit is provided in the substrate, according to claim 8, wherein the shielding circuit of at least a portion covering at least a portion of the circuit The electronic device as described in.