JP6301353B2 - 改善された内部アウトカップリングを備える発光装置、及び前記発光装置を供給する方法 - Google Patents
改善された内部アウトカップリングを備える発光装置、及び前記発光装置を供給する方法 Download PDFInfo
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- JP6301353B2 JP6301353B2 JP2015541260A JP2015541260A JP6301353B2 JP 6301353 B2 JP6301353 B2 JP 6301353B2 JP 2015541260 A JP2015541260 A JP 2015541260A JP 2015541260 A JP2015541260 A JP 2015541260A JP 6301353 B2 JP6301353 B2 JP 6301353B2
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- 230000012010 growth Effects 0.000 claims description 34
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- 238000005530 etching Methods 0.000 claims description 14
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- 239000000203 mixture Substances 0.000 claims description 11
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- 239000005329 float glass Substances 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 4
- 230000009036 growth inhibition Effects 0.000 claims description 4
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910020286 SiOxNy Inorganic materials 0.000 claims description 3
- 229910017107 AlOx Inorganic materials 0.000 claims description 2
- 229910004205 SiNX Inorganic materials 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims description 2
- 229910003437 indium oxide Inorganic materials 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 2
- 238000009738 saturating Methods 0.000 claims 2
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- 238000005229 chemical vapour deposition Methods 0.000 description 20
- 239000000243 solution Substances 0.000 description 7
- 238000004770 highest occupied molecular orbital Methods 0.000 description 5
- 239000002105 nanoparticle Substances 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000005357 flat glass Substances 0.000 description 4
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- 230000008901 benefit Effects 0.000 description 3
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- 238000000227 grinding Methods 0.000 description 3
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- 239000002356 single layer Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
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- 150000004767 nitrides Chemical class 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
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- 230000004044 response Effects 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
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- 239000007789 gas Substances 0.000 description 1
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- 230000009548 growth disturbance Effects 0.000 description 1
- 238000004050 hot filament vapor deposition Methods 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/813—Anodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/816—Multilayers, e.g. transparent multilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/10—Transparent electrodes, e.g. using graphene
- H10K2102/101—Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO]
- H10K2102/103—Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO] comprising indium oxides, e.g. ITO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Description
Claims (14)
- 発光装置であり、
a) 平らな表面を備えるガラス基板と、
b) 前記平らな表面上に堆積させられる高屈折率層と、
c) 前記高屈折率層上に堆積させられる透明な電極層を備える発光層構造とを有する発光装置であって、
d) 前記高屈折率層の上面に隆起が設けられ、前記隆起が、前記ガラス基板の前記平らな表面上の層成長の局所的な乱れによる前記高屈折率層の円錐形柱状成長によってもたらされる発光装置。 - 前記ガラス基板の前記平らな表面が、超微粒子を有する請求項1に記載の装置。
- 前記平らな表面が、前記ガラス基板の化学表面組成における局所的な変化を有する請求項1に記載の装置。
- 前記ガラス基板の前記化学表面組成が、局所的に、より高い付着係数を供給し、前記高屈折率層のより強い成長を供給することによって、初期成長阻害を改善する、異なる酸化状態を持つ元素を備える材料を有する請求項3に記載の装置。
- 前記高屈折率層が、SiNx、SiOx、SiOxNy、AlOx又はAl2O3:Nを有する請求項1に記載の装置。
- 前記透明な電極層が、インジウムスズ酸化物又はスズをドープしたインジウム酸化物を有する請求項1に記載の装置。
- 前記隆起が、0.5乃至4μmの範囲内の断面寸法を持つ請求項1に記載の装置。
- 前記ガラス基板が、フロートガラスを有する請求項1に記載の装置。
- 発光装置を製造する方法であって、前記方法が、
a) ガラス基板を、前記ガラス基板の平らな表面上の層成長の局所的な乱れを引き起こすよう、前処理するステップと、
b) 前記平らな表面上に高屈折率層を堆積させるステップであって、前記局所的な乱れによる前記高屈折率層の円錐形柱状成長が、堆積させられる前記高屈折率層の上面に隆起を生成するように、堆積させるステップと、
c) 前記高屈折率層の前記上面の上に発光層構造の透明な電極層を堆積させるステップとを有する方法。 - 前記平らな表面上に超微粒子を堆積させるステップを更に有する請求項9に記載の方法。
- 前記超微粒子を堆積させるよう、前記平らな表面を飽和エッチング液にさらし、前記エッチング液を除去するステップを更に有する請求項10に記載の方法。
- 犠牲基板をエッチングすることによって前記エッチング液を飽和させるステップを更に有する請求項11に記載の方法。
- シード粒子をエッチング液に添加することによって前記エッチング液を飽和させるステップを更に有する請求項11に記載の方法。
- 異なる酸化状態を持つ材料を付加し、局所的により強い成長により初期成長阻害を改善することによって、前記ガラス基板の化学表面組成に局所的な変化を与えるステップを更に有する請求項9に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261724353P | 2012-11-09 | 2012-11-09 | |
US61/724,353 | 2012-11-09 | ||
PCT/IB2013/059658 WO2014072868A1 (en) | 2012-11-09 | 2013-10-25 | Light emitting device with improved internal out-coupling and method of providing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015534250A JP2015534250A (ja) | 2015-11-26 |
JP6301353B2 true JP6301353B2 (ja) | 2018-03-28 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015541260A Expired - Fee Related JP6301353B2 (ja) | 2012-11-09 | 2013-10-25 | 改善された内部アウトカップリングを備える発光装置、及び前記発光装置を供給する方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9349994B2 (ja) |
EP (1) | EP2917949A1 (ja) |
JP (1) | JP6301353B2 (ja) |
CN (1) | CN104823296B (ja) |
WO (1) | WO2014072868A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6788935B2 (ja) * | 2016-08-16 | 2020-11-25 | 株式会社日本製鋼所 | 有機el素子用の保護膜の形成方法および表示装置の製造方法 |
CN107808917B (zh) * | 2017-10-31 | 2019-06-04 | 扬州乾照光电有限公司 | 一种四元系透明衬底发光二极管及其制作方法 |
CN110335956B (zh) * | 2019-04-25 | 2021-11-30 | 昆山工研院新型平板显示技术中心有限公司 | 显示面板及显示装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4136799B2 (ja) | 2002-07-24 | 2008-08-20 | 富士フイルム株式会社 | El表示素子の形成方法 |
KR100858802B1 (ko) * | 2002-07-31 | 2008-09-17 | 삼성에스디아이 주식회사 | 전자 발광 소자의 제조방법 |
KR20110008191A (ko) | 2008-03-28 | 2011-01-26 | 스미또모 가가꾸 가부시키가이샤 | 유기 전계발광 소자 |
US7957621B2 (en) | 2008-12-17 | 2011-06-07 | 3M Innovative Properties Company | Light extraction film with nanoparticle coatings |
FR2944145B1 (fr) | 2009-04-02 | 2011-08-26 | Saint Gobain | Procede de fabrication d'une structure a surface texturee pour dispositif a diode electroluminescente organique et structure a surface texturee |
FR2944148B1 (fr) * | 2009-04-02 | 2012-03-02 | Saint Gobain | Procede de fabrication d'une structure a surface texturee pour dispositif a diode electroluminescente organique et structure a surface texturee obtenue par ce procede |
JP2011204377A (ja) * | 2010-03-24 | 2011-10-13 | Sony Corp | 光学機能膜およびその製造方法、並びに表示装置およびその製造方法 |
KR20120024358A (ko) | 2010-09-06 | 2012-03-14 | 주식회사 엘지화학 | 유기전자소자용 기판 및 그 제조방법 |
CN103221850B (zh) * | 2010-11-22 | 2015-05-13 | 富士胶片株式会社 | 热射线屏蔽材料 |
CN102623647A (zh) * | 2012-04-05 | 2012-08-01 | 四川虹视显示技术有限公司 | 有机电致发光器件的制造方法及基板 |
-
2013
- 2013-10-25 US US14/441,683 patent/US9349994B2/en not_active Expired - Fee Related
- 2013-10-25 EP EP13821162.8A patent/EP2917949A1/en not_active Withdrawn
- 2013-10-25 WO PCT/IB2013/059658 patent/WO2014072868A1/en active Application Filing
- 2013-10-25 JP JP2015541260A patent/JP6301353B2/ja not_active Expired - Fee Related
- 2013-10-25 CN CN201380058571.4A patent/CN104823296B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2015534250A (ja) | 2015-11-26 |
WO2014072868A1 (en) | 2014-05-15 |
US9349994B2 (en) | 2016-05-24 |
US20150311476A1 (en) | 2015-10-29 |
CN104823296B (zh) | 2017-05-17 |
EP2917949A1 (en) | 2015-09-16 |
CN104823296A (zh) | 2015-08-05 |
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