JP6300668B2 - Magnetic head manufacturing apparatus and magnetic head manufacturing method - Google Patents
Magnetic head manufacturing apparatus and magnetic head manufacturing method Download PDFInfo
- Publication number
- JP6300668B2 JP6300668B2 JP2014138218A JP2014138218A JP6300668B2 JP 6300668 B2 JP6300668 B2 JP 6300668B2 JP 2014138218 A JP2014138218 A JP 2014138218A JP 2014138218 A JP2014138218 A JP 2014138218A JP 6300668 B2 JP6300668 B2 JP 6300668B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- slider
- laser chip
- magnetic head
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 229910000679 solder Inorganic materials 0.000 claims description 43
- 238000010438 heat treatment Methods 0.000 claims description 21
- 238000002844 melting Methods 0.000 claims description 17
- 230000008018 melting Effects 0.000 claims description 17
- 230000001678 irradiating effect Effects 0.000 claims description 13
- 238000005304 joining Methods 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims 2
- 238000002788 crimping Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 3
- 230000005415 magnetization Effects 0.000 description 3
- 238000004220 aggregation Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Images
Landscapes
- Recording Or Reproducing By Magnetic Means (AREA)
- Magnetic Heads (AREA)
Description
本発明は、磁気記録媒体を加熱した部分の異方性磁界を低下させて書き込みを行う熱アシスト磁気記録に用いるレーザ光源を備えた熱アシスト型の磁気ヘッドを製造する磁気ヘッド製造装置及び磁気ヘッド製造方法に係り、特にレーザ光源をスライダに高精度に接合することができる磁気ヘッド製造装置及び磁気ヘッド製造方法に関する。 The present invention relates to a magnetic head manufacturing apparatus and a magnetic head for manufacturing a heat-assisted magnetic head having a laser light source used for heat-assisted magnetic recording in which writing is performed by reducing an anisotropic magnetic field in a heated portion of a magnetic recording medium. The present invention relates to a manufacturing method, and more particularly to a magnetic head manufacturing apparatus and a magnetic head manufacturing method capable of bonding a laser light source to a slider with high accuracy.
近年の磁気記録技術は、高記録密度を達成するために微小な記録ビットを書き込む垂直磁化成分を記録ビットとする垂直磁気記録技術が実用化されると共に、磁化の熱安定性が高い磁気記録媒体を使用とする熱アシスト磁気記録技術が採用されている。この熱アシスト磁気記録技術は、記録ビットを形成する磁化がより安定するように磁気異方性エネルギの大きな磁性材料で形成された磁気記録媒体を用いると共に、この磁気記録媒体の書き込み部分をレーザ光源によって加熱することによって異方性磁界を低下させ、その直後に書き込み磁界を印加して書き込みを行うものである。 As a recent magnetic recording technology, a perpendicular magnetic recording technology using a perpendicular magnetization component for writing a minute recording bit to achieve a high recording density as a recording bit is put into practical use, and a magnetic recording medium having high thermal stability of magnetization Thermally assisted magnetic recording technology that uses is used. This heat-assisted magnetic recording technology uses a magnetic recording medium made of a magnetic material having a large magnetic anisotropy energy so that the magnetization forming the recording bit is more stable, and the writing portion of this magnetic recording medium is used as a laser light source. The anisotropic magnetic field is reduced by heating with the above, and writing is performed by applying a writing magnetic field immediately thereafter.
この熱熱アシスト磁気記録に用いるレーザ光源を備えた熱アシスト型磁気ヘッドの製造に関する技術が記載された文献としては、下記の特許文献１が挙げられ、この特許文献１には、背当て治具に吸着させたレーザ光源の発光中心とスライダのスライダ背面の受光端面とのスライダ背面内の方向における位置合わせを行う工程と、背当て治具の吸着面をスライダ背面に対して垂直な位置から傾けた状態でレーザ光源をスライダのスライダ背面に接触させ、加重手段を用いてユニット基板のスライダと接合する接合面と反対側の被加重面に荷重を加える工程と、光源ユニットの接合面をスライダのスライダ背面に倣わせ、光源ユニットとスライダとを接合する工程を行うことによって、光源ユニットとスライダとの接合の際に両者の接合面の間の「倣い」を極めて高い状態にする技術が記載されている。 The following Patent Document 1 is cited as a document describing a technique relating to the manufacture of a thermally assisted magnetic head provided with a laser light source used for this thermally assisted magnetic recording. This Patent Document 1 includes a back jig. Aligning the light emission center of the laser light source adsorbed on the slider and the light receiving end surface of the slider back in the direction of the slider back surface, and tilting the suction surface of the back jig from a position perpendicular to the slider back surface In this state, the laser light source is brought into contact with the slider back surface of the slider and a load is applied to the surface to be loaded opposite to the joint surface to be joined to the slider of the unit substrate using the weighting means. By following the back of the slider and joining the light source unit and the slider, when joining the light source unit and the slider, Technique of the "copying" to the very high state is described.
前記の特許文献１に記載された技術は、光源ユニットとスライダとを接合する工程における光源ユニットとスライダとの接合を光源ユニットとスライダ間の接合層である半田層を波長１０６４ｎｍのＮｄ−ＹＡＧレーザ光により溶融することが記載されているものの、半田層溶融用のレーザ照射における光源ユニット及びスライダの熱膨張及び収縮を考慮しておらず、光源ユニットとスライダの接合時の位置合わせが高精度なものであっとしても半田層溶融用のレーザ照射による熱の影響によって接合冷却後の膨張乃至収縮については考慮されておらず、接合後の光源ユニットとスライダの位置ずれが生じる可能性が大きいという課題があった。 In the technique described in Patent Document 1, the light source unit and the slider in the step of joining the light source unit and the slider are bonded to a solder layer which is a bonding layer between the light source unit and the slider with an Nd-YAG laser having a wavelength of 1064 nm. Although it is described that it melts by light, the thermal expansion and contraction of the light source unit and the slider in laser irradiation for melting the solder layer is not taken into consideration, and the alignment at the time of joining the light source unit and the slider is highly accurate. Even if it is a thing, the expansion | swelling thru | or shrinkage | contraction after joining cooling is not considered by the influence of the heat by the laser irradiation for solder layer melting, but the subject that the position shift of the light source unit and slider after joining is large will arise. was there.
本発明の目的は、前述の従来技術による課題しようとするものであり、接合後の光源ユニットであるレーザチップとスライダの位置ずれを防止することができる熱アシスト型磁気ヘッドの磁気ヘッド製造装置及び磁気ヘッド製造方法を提供することである。 SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described conventional technology, and a magnetic head manufacturing apparatus for a thermally assisted magnetic head capable of preventing a positional deviation between a laser chip as a light source unit after bonding and a slider, and A method of manufacturing a magnetic head is provided.
前記の目的を達成するために請求項１記載の発明は、第１のサブマウントに保持され、磁気記録媒体を加熱するためのレーザ光源を内蔵したレーザチップと、第２のサブマウントに保持され、該レーザチップのレーザ光源位置に対応してレーザ光が貫通する貫通孔が開口された磁気ヘッドのスライダと、該スライダの貫通孔とレーザチップのレーザ光源位置を位置合わせした状態で圧着し、該圧着状態においてレーザスポットを照射することによってレーザチップとスライダを接合する熱アシスト型磁気ヘッドの磁気ヘッド製造装置であって、断面がレーザチップの幅方向に延びる横長尺状のレーザスポットを、半田に近接したレーザチップ位置にレーザ照射することによって半田を溶解してレーザチップとスライダを接合することを特徴とする。 In order to achieve the above object, the invention according to claim 1 is held by the first submount and held by the second submount and a laser chip incorporating a laser light source for heating the magnetic recording medium. A magnetic head slider having a through-hole through which laser light passes corresponding to the laser light source position of the laser chip, and a pressure bonding in a state where the through-hole of the slider and the laser light source position of the laser chip are aligned, A magnetic head manufacturing apparatus for a thermally assisted magnetic head that joins a laser chip and a slider by irradiating a laser spot in the crimped state, wherein a transversely long laser spot whose cross section extends in the width direction of the laser chip is soldered. The laser chip position close to the laser is irradiated with laser to melt the solder and join the laser chip and the slider. That.
請求項２に記載の発明は、第１のサブマウントに保持され、磁気記録媒体を加熱するためのレーザ光源を内蔵したレーザチップと、第２のサブマウントに保持され、該レーザチップのレーザ光源位置に対応してレーザ光が貫通する貫通孔が開口された磁気ヘッドのスライダと、該スライダの貫通孔とレーザチップのレーザ光源位置を位置合わせした状態で圧着し、該圧着状態においてレーザスポットを照射することによってレーザチップとスライダを接合する熱アシスト型磁気ヘッドの磁気ヘッド製造方法であって、前記レーザチップを第１のサブマウントに保持する第１工程と、前記スライダを第１のサブマウントに保持する第２工程と、該第１工程により保持されたスライダの貫通孔とレーザチップのレーザ光源位置を位置合わせした状態で半田を介して圧着する第３工程と、断面がレーザチップの幅方向に延びる横長尺状のレーザスポットを、半田に近接したレーザチップ位置にレーザ照射することによって半田を溶解してレーザチップとスライダを接合することを特徴とする。 According to a second aspect of the present invention, there is provided a laser chip that is held by the first submount and includes a laser light source for heating the magnetic recording medium, and a laser light source of the laser chip that is held by the second submount. A magnetic head slider having a through-hole through which laser light passes corresponding to the position is bonded to the slider and the laser light source position of the laser chip is aligned with the slider. A method of manufacturing a magnetic head of a thermally-assisted magnetic head for joining a laser chip and a slider by irradiating, wherein the first step of holding the laser chip on a first submount, and the slider on a first submount The second step of holding the slider, and the through hole of the slider held by the first step and the laser light source position of the laser chip are aligned. In the third step of pressure bonding via solder, a laser beam is melted by irradiating a laser beam at a laser chip position close to the solder with a horizontally long laser spot whose cross section extends in the width direction of the laser chip. The slider is joined.
本発明による熱アシスト型磁気ヘッドの磁気ヘッド製造装置及び磁気ヘッド製造方法は、断面がレーザチップの幅方向に延びる横長尺状のレーザスポットを、半田に近接したレーザチップ位置にレーザ照射することによって半田を溶解してレーザチップとスライダを接合することによって、レーザ熱が幅広くレーザチップの奥方向に均等に伝わると共に、冷却時においてレーザチップの奥方向から均等に凝集（凝縮）するため、スライダとレーザチップの相対的位置が変化するような力が発生することを防止し、レーザチップのレーザ光源から発せられたレーザ光がスライダの貫通孔を高精度に位置決めした状態を保ち、接合後のレーザチップとスライダの位置ずれを防止することができる。 A magnetic head manufacturing apparatus and a magnetic head manufacturing method of a heat-assisted magnetic head according to the present invention are configured by irradiating a laser chip at a laser chip position close to solder with a horizontally long laser spot whose cross section extends in the width direction of the laser chip. By melting the solder and joining the laser chip and the slider, the laser heat is uniformly transmitted in the depth direction of the laser chip and is also condensed (condensed) from the depth direction of the laser chip during cooling. Prevents the generation of a force that changes the relative position of the laser chip, and the laser light emitted from the laser light source of the laser chip keeps the through hole of the slider positioned with high precision, and the laser after bonding It is possible to prevent positional deviation between the chip and the slider.
以下、本発明による熱アシスト型磁気ヘッドの磁気ヘッド製造装置及び磁気ヘッド製造方法の一実施形態を図１から図４を参照して説明するが、まず、比較対象である従来技術による熱アシスト型磁気ヘッドの磁気ヘッド製造装置及び磁気ヘッド製造方法を図５から図８を参照して説明する。 Hereinafter, an embodiment of a magnetic head manufacturing apparatus and a magnetic head manufacturing method for a heat-assisted magnetic head according to the present invention will be described with reference to FIGS. 1 to 4. A magnetic head manufacturing apparatus and a magnetic head manufacturing method for a magnetic head will be described with reference to FIGS.
この従来技術による熱アシスト型磁気ヘッドの磁気ヘッド製造装置は、半田溶融時のレーザ照射において、図５に示す如く、第１サブマウント２０に保持され、磁気記録媒体を加熱するためのレーザ光源を内蔵した光源ユニットであるレーザチップ１１と、第２サブマウント２１に保持され、該レーザチップ１１のレーザ光源位置に対応してレーザ光が貫通する貫通孔（導波路）が開口された磁気ヘッドのスライダ１２と、該スライダ１２のレーザチップ１１の対向面に配置された、例えば０.０５μｍ〜２μｍ程度の厚みの半田１４とを位置合わせした状態で圧着した状態で円形状の円形レーザスポット９１をレーザチップ１１と半田１４とスライダ１２の接合箇所にレーザ照射することによって、半田１４を溶解し、レーザチップ１１とスライダ１２を接合するように構成されている。前記半田１４のサイズは、例えば、３００μｍ×５００μｍ程度であり、円形レーザスポット９１の径は約２００μｍである。なお、本明細書では図示を容易にするために図中のレーザチップ１１を上側とし、スライダ１２を下側としているが、実際の製造装置においては両者の上下関係は逆である。 This prior art magnetic head manufacturing apparatus for a heat-assisted magnetic head has a laser light source for heating a magnetic recording medium held by a first submount 20 as shown in FIG. A laser chip 11 that is a built-in light source unit, and a magnetic head that is held by the second submount 21 and has a through hole (waveguide) through which a laser beam passes corresponding to the laser light source position of the laser chip 11. A circular circular laser spot 91 is formed in a state in which the slider 12 and a solder 14 having a thickness of, for example, about 0.05 μm to 2 μm, which are disposed on the surface of the slider 12 facing the laser chip 11, are crimped. By irradiating the laser chip 11, the solder 14, and the slider 12 with a laser, the solder 14 is melted and the laser chip 11 and the slider 12 are bonded. It is configured to join the Ida 12. The size of the solder 14 is, for example, about 300 μm × 500 μm, and the diameter of the circular laser spot 91 is about 200 μm. In the present specification, for ease of illustration, the laser chip 11 in the figure is on the upper side and the slider 12 is on the lower side. However, in an actual manufacturing apparatus, the vertical relationship between them is reversed.
前記レーザチップ１１とスライダ１２の位置合わせは、レーザダイオード等の光源と導波路等の光学系とを相対的に移動させている間にレーザ光源を作動させ、該レーザ光源から放射されて光学系の受光端に入射した光を光学系の発光端側でリアルタイムに監視し、この監視位置での光強度が最大となる状態を、光源と光学系との所望の相対位置とする位置合わせを行うアクティブアラインメント法が採用されている。 The alignment of the laser chip 11 and the slider 12 is performed by operating the laser light source while relatively moving the light source such as a laser diode and the optical system such as the waveguide, and radiating from the laser light source. The light incident on the light receiving end of the optical system is monitored in real time on the light emitting end side of the optical system, and the position where the light intensity at the monitoring position is maximized is set to a desired relative position between the light source and the optical system. The active alignment method is adopted.
この従来技術による半田溶融のためのレーザスポットの照射は、図５の上側から見た図６と、正面（レーザ照射側）及び側面から見た図７（ａ）に示す如く、断面が円形且つ先端に向かって細くなる断面円形状の円形状レーザスポット９１がレーザチップ１１の中央近傍のみに照射され、特に図７（ｂ）に示す如く、円形状レーザスポット９１のスライダ１２側のレーザスポットの一部がスライダ１２に遮られて照射され、このレーザ照射によって半田１４を溶解し、レーザチップ１１とスライダ１２を接合するように構成されている。 The laser spot irradiation for solder melting according to this prior art has a circular cross section as shown in FIG. 6 seen from the upper side of FIG. 5 and FIG. 7A seen from the front (laser irradiation side) and side. A circular laser spot 91 having a circular cross-section that narrows toward the tip is irradiated only in the vicinity of the center of the laser chip 11, and particularly as shown in FIG. 7B, the laser spot on the slider 12 side of the circular laser spot 91. A part is shielded and irradiated by the slider 12, the solder 14 is melted by this laser irradiation, and the laser chip 11 and the slider 12 are joined.
この従来技術による円形状レーザスポット照射による加熱は、加熱時においては図８（ａ）に示す如く、レーザチップ１１の中央近傍のみにレーザ照射されるため、熱が符号Ｘで示す如く半円状の外周から外方に放射状に延びる溶融方向の力が発生すると共に、冷却時においては図８（ｂ）に示す如く、符号Ｙに示す如く当初の半円状加熱部に向かって逆放射状に凝集（凝縮）方向の力が発生する。 In the heating by the circular laser spot irradiation according to this conventional technique, the laser is irradiated only near the center of the laser chip 11 as shown in FIG. As shown in FIG. 8 (b), during the cooling, a force in the melting direction extending radially outward from the outer periphery of the steel is aggregated in a reverse radial direction toward the original semicircular heating portion. A force in the (condensation) direction is generated.
この加熱時及び冷却時の半円状加熱部から放射状に溶融及び逆放射状に凝集（凝縮）する力が発生することによって、従来技術による製造方法は、アクティブアラインメント法を用いてスライダ１２の貫通孔を通過したレーザ光を観察した図８（ｃ）に示す如く中央位置おいて最も照度の高い真円形状となり、レーザチップ１１のレーザ光源から発せられたレーザ光がスライダ１２の貫通孔を高精度に位置決めした状態からレーザ照射して加熱後に冷却した場合、前述の符号ＸＹで示した半田の溶融及び凝集による力によって当初のスライダ１２とレーザチップ１１の相対的位置が移動してスライダ１２の貫通孔を通過したレーザ光を観察した図８（ｄ）に示す如く位置ずれが生じるという課題が生じていた。 When a force that melts radially and condenses (condenses) in a radial direction is generated from the semicircular heating portion during heating and cooling, the manufacturing method according to the related art uses the through-hole of the slider 12 using the active alignment method. As shown in FIG. 8C, when the laser beam that has passed through is observed, it becomes a perfect circle shape with the highest illuminance at the center position, and the laser beam emitted from the laser light source of the laser chip 11 passes through the through-hole of the slider 12 with high accuracy. When the laser beam is irradiated from the position positioned in this position and cooled after heating, the relative position between the initial slider 12 and the laser chip 11 is moved by the force due to melting and agglomeration of the solder indicated by the reference symbol XY, and the slider 12 penetrates. As shown in FIG. 8D in which the laser beam that has passed through the hole is observed, there has been a problem that positional displacement occurs.
すなわち、従来技術による熱アシスト型磁気ヘッドの磁気ヘッド製造装置は、レーザチップ１１の中央近傍のみに円形状のレーザ照射を行っていたため、レーザチップ１１から半田１４に円放射状に熱が半田１４に伝わって半円状加熱部の加熱温度が４５０℃とするとその他の加熱温度は３８０℃となり、この加熱温度の違いはレーザ照射後の冷却速度にも影響し、温度差が大きいほどハンダの融解の仕方が異なり、予め塗布された半田面積領域内での温度差が大きいほど、融解と硬化のタイミングが異なって接合前後のワークの位置ズレが生じ、接合前の調芯精度が優れていても接合時にワークの位置ズレが生じるという課題があった。 That is, since the magnetic head manufacturing apparatus for the heat-assisted magnetic head according to the prior art performs circular laser irradiation only in the vicinity of the center of the laser chip 11, heat is emitted from the laser chip 11 to the solder 14 in a circular radial manner. If the heating temperature of the semicircular heating part is 450 ° C., the other heating temperature becomes 380 ° C. This difference in heating temperature also affects the cooling rate after laser irradiation. The difference is in the way, the larger the temperature difference in the pre-applied solder area area, the different the timing of melting and curing, causing the positional deviation of the workpiece before and after joining, even if the alignment accuracy before joining is excellent There was a problem that positional displacement of the work sometimes occurred.
また、従来技術による円形状レーザスポット照射による加熱は、実際の製造装置においては、半田を溶融するためのレーザ光を照射するための空間が狭く、図７に示した例においても金属部品によるレーザ光のケラレが発生し、実質的にレーザチップ及び半田に到達する熱量が不足し、この熱量を補うためにレーザ出力を上げた場合、周囲の金属部材が熱膨張を起こして位置決め精度に悪影響を与えると共にスライダにも熱ダメージを与える可能性があるため、大径の円形状レーザスポット照射を行うことが困難であった。 Further, the heating by the circular laser spot irradiation according to the conventional technique has a narrow space for irradiating the laser beam for melting the solder in an actual manufacturing apparatus, and the laser shown in FIG. If light vignetting occurs, the amount of heat that reaches the laser chip and solder is substantially insufficient, and if the laser output is increased to compensate for this amount of heat, the surrounding metal members cause thermal expansion, which adversely affects positioning accuracy. It is difficult to irradiate a large-diameter circular laser spot because it may cause thermal damage to the slider.
これに対して本実施形態による磁気ヘッド製造装置は、半田溶融時のレーザ照射を行うとき、図１に示す如く、第１サブマウント２０に保持され、磁気記録媒体を加熱するためのレーザ光源を内蔵した光源ユニットであるレーザチップ１１と、第２サブマウント２１に保持され、該レーザチップ１１のレーザ光源位置に対応してレーザ光が貫通する貫通孔が開口された磁気ヘッドのスライダ１２と、該スライダ１２のレーザチップ１１の対向面に配置された、例えば０.０５μｍ〜２μｍ程度の厚みの半田１４と該スライダの貫通孔とをアクティブアラインメント法によって位置合わせした状態で圧着し、この圧着状態で断面が横長尺状且つレーザチップ１１の幅方向に延びる横長尺状レーザスポット９０をスライダ１２と半田１４を介した接合箇所に近いレーザチップ１１にレーザ照射することによって、レーザチップ１１に与えた熱を半田１４に熱伝導して半田１４を溶解し、レーザチップ１１とスライダ１２を接合する。前記横長尺状レーザスポット９０は、照射面において５０μｍ×４００μｍ程度の横長尺状又は横長楕円状が好ましい。 On the other hand, the magnetic head manufacturing apparatus according to the present embodiment uses a laser light source for heating the magnetic recording medium held by the first submount 20 as shown in FIG. A laser chip 11 that is a built-in light source unit, a slider 12 of a magnetic head that is held by the second submount 21 and has a through-hole through which laser light passes corresponding to the laser light source position of the laser chip 11; For example, the solder 14 disposed on the surface of the slider 12 facing the laser chip 11 and having a thickness of about 0.05 μm to 2 μm and the through hole of the slider are pressure-bonded in an aligned state by the active alignment method. In this case, a horizontally long laser spot 90 having a cross-sectionally long cross section and extending in the width direction of the laser chip 11 is contacted with the slider 12 and the solder 14. The laser chip 11 by laser irradiation close to the location, to dissolve the solder 14 heat given to the laser chip 11 and heat conduction to the solder 14, bonding the laser chip 11 and the slider 12. The horizontally long laser spot 90 preferably has a horizontally long shape or a horizontally long elliptical shape of about 50 μm × 400 μm on the irradiation surface.
たとえば、本実施形態による磁気ヘッド製造方法は、磁気ヘッド製造装置が、レーザチップ１１を第１サブマウント２０に保持する第１工程と、スライダ１２を第２サブマウント２１に保持する第２工程と、該第１工程により保持されたスライダ１２の貫通孔とレーザチップ１１のレーザ光源位置を位置合わせした状態で半田１４を介して圧着する第３工程と、断面がレーザチップの幅方向に延びる横長尺状レーザスポット９０を、スライダ１２と半田１４を介した接合箇所に近いレーザチップ１１にレーザ照射し、半田１４を溶解してレーザチップとスライダを接合することによって、レーザチップ１１とスライダ１２を接合する。 For example, in the magnetic head manufacturing method according to the present embodiment, the magnetic head manufacturing apparatus has a first step of holding the laser chip 11 on the first submount 20 and a second step of holding the slider 12 on the second submount 21. A third step in which the through hole of the slider 12 held by the first step and the laser light source position of the laser chip 11 are aligned and bonded via the solder 14 and a horizontally long cross section extending in the width direction of the laser chip The laser chip 11 is irradiated with a laser beam having a long laser spot 90 close to the joining portion through the slider 12 and the solder 14, and the solder 14 is melted to join the laser chip and the slider, thereby attaching the laser chip 11 and the slider 12 to each other. Join.
本実施形態による横長尺状レーザスポット照射による加熱は、加熱時においては図４（ａ）に示す如く、レーザチップ１１の幅のほぼ全幅にわたってレーザ照射されるため、熱が符号Ｘで示す如く幅広くレーザチップ１１の奥方向に均等に伝わると共に、冷却時においても図４（ｂ）に示す如く、符号Ｙに示す如くレーザチップ１１の奥方向から均等に凝集（凝縮）するため、スライダ１２とレーザチップ１１の相対的位置が変化するような力が発生することを防止することができ、このため図４（ｃ）に示す如く、冷却後においても中央位置が最も照度の高い真円形状となる状態を維持し、レーザチップ１１のレーザ光源から発せられたレーザ光がスライダ１２の貫通孔を高精度に位置決めした状態を保ことができる。即ち、本実施形態によるレーザスポット照射は、半田１４に近接したレーザチップ１１の幅方向にわたって加熱し、該レーザチップ１１からの熱を半田１４に伝えることによって半田を溶解するため、熱が半田に均等に伝わると共に冷却されるため、冷却後の位置ずれを抑制することができる。 In the heating by the horizontally long laser spot irradiation according to the present embodiment, as shown in FIG. 4A, the laser irradiation is performed over almost the entire width of the laser chip 11 at the time of heating. As shown in FIG. 4B, the laser chip 11 is uniformly transmitted from the back direction of the laser chip 11 as shown in FIG. It is possible to prevent a force that changes the relative position of the chip 11 from occurring, and as a result, as shown in FIG. 4C, the center position has a perfect circular shape with the highest illuminance even after cooling. The state can be maintained, and the state in which the laser light emitted from the laser light source of the laser chip 11 positions the through hole of the slider 12 with high accuracy can be maintained. That is, the laser spot irradiation according to the present embodiment heats the laser chip 11 close to the solder 14 in the width direction and transfers the heat from the laser chip 11 to the solder 14 to melt the solder. Since it is transmitted evenly and cooled, the positional deviation after cooling can be suppressed.
このように本実施形態は、第１サブマウント２０に保持され、磁気記録媒体を加熱するためのレーザ光源を内蔵したレーザチップ１１と、第２サブマウント２１に保持され、該レーザチップ１１のレーザ光源位置に対応してレーザ光が貫通する貫通孔が開口された磁気ヘッドのスライダ１２と、該スライダ１２のレーザチップ１１の対向面に配置された所定厚みの半田１４とをアクティブアラインメント法によって位置合わせした状態で圧着し、この圧着状態において横長尺状レーザスポット９０を照射することによってレーザチップ１１とスライダ１２を接合する熱アシスト型磁気ヘッドの磁気ヘッド製造装置において、断面がレーザチップ１１の幅方向に延びる横長尺状レーザスポット９０をレーザチップ１１の半田１４に近接する位置にレーザ照射して半田１４を溶解してレーザチップ１１とスライダ１２を接合することによって、照射場所による加熱温度の差が小さく、ハンダの融解と硬化をほぼ同じタイミングで均等に行うことにより接合時の位置ズレを抑制することができる。 As described above, in the present embodiment, the laser chip 11 that is held by the first submount 20 and incorporates the laser light source for heating the magnetic recording medium, and the second submount 21 that holds the laser light source of the laser chip 11. A magnetic head slider 12 having a through-hole through which laser light passes corresponding to the light source position and a solder 14 having a predetermined thickness disposed on the opposite surface of the laser chip 11 of the slider 12 are positioned by an active alignment method. In a magnetic head manufacturing apparatus of a thermally assisted magnetic head that joins the laser chip 11 and the slider 12 by irradiating a horizontally long laser spot 90 in this pressed state, the cross section is the width of the laser chip 11. A position where a horizontally elongated laser spot 90 extending in the direction is close to the solder 14 of the laser chip 11 By joining the laser chip 11 and the slider 12 by irradiating the laser and irradiating the laser, the difference in the heating temperature depending on the irradiation place is small. Misalignment can be suppressed.
１１ レーザチップ、１２ スライダ、１４ 半田、２０ 第１サブマウント、
２１ 第２サブマウント、９０ 横長尺状レーザスポット、
９１ 円形状レーザスポット
11 Laser chip, 12 Slider, 14 Solder, 20 First submount,
21 second submount, 90 horizontally long laser spot,
91 Circular laser spot
Claims (2)
断面がレーザチップの幅方向に延びる横長尺状のレーザスポットを、半田に近接したレーザチップ位置にレーザ照射することによって半田を溶解してレーザチップとスライダを接合することを特徴とする熱アシスト型磁気ヘッドの磁気ヘッド製造装置。 A laser chip with a built-in laser light source for heating the magnetic recording medium held by the first submount, and a laser light penetrating through the second submount corresponding to the laser light source position of the laser chip. The magnetic head slider having a through-hole opened, and the laser chip and the slider are attached to each other by irradiating a laser spot in the pressure-bonded state with the through-hole of the slider aligned with the laser light source position of the laser chip. A magnetic head manufacturing apparatus for a thermally assisted magnetic head to be joined,
A thermally assisted type characterized in that a laser chip is melted by irradiating a laser beam at a laser chip position close to the solder with a horizontally long laser spot whose cross section extends in the width direction of the laser chip, thereby joining the laser chip and the slider. Magnetic head manufacturing equipment for magnetic heads.
前記レーザチップを第１のサブマウントに保持する第１工程と、前記スライダを第１のサブマウントに保持する第２工程と、該第１工程により保持されたスライダの貫通孔とレーザチップのレーザ光源位置を位置合わせした状態で半田を介して圧着する第３工程と、断面がレーザチップの幅方向に延びる横長尺状のレーザスポットを、半田に近接したレーザチップ位置にレーザ照射することによって半田を溶解してレーザチップとスライダを接合することを特徴とする熱アシスト型磁気ヘッドの磁気ヘッド製造方法。
A laser chip with a built-in laser light source for heating the magnetic recording medium held by the first submount, and a laser light penetrating through the second submount corresponding to the laser light source position of the laser chip. The magnetic head slider having a through-hole opened, and the laser chip and the slider are attached to each other by irradiating a laser spot in the pressure-bonded state with the through-hole of the slider aligned with the laser light source position of the laser chip. A method of manufacturing a magnetic head of a thermally assisted magnetic head to be joined,
A first step of holding the laser chip on a first submount; a second step of holding the slider on the first submount; a through-hole of the slider held by the first step; The third step of crimping via the solder in the state where the light source position is aligned, and soldering by irradiating the laser chip position near the solder with a laser beam having a horizontally long cross section extending in the width direction of the laser chip. A method of manufacturing a magnetic head for a thermally assisted magnetic head, wherein a laser chip and a slider are bonded by melting
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014138218A JP6300668B2 (en) | 2014-07-04 | 2014-07-04 | Magnetic head manufacturing apparatus and magnetic head manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014138218A JP6300668B2 (en) | 2014-07-04 | 2014-07-04 | Magnetic head manufacturing apparatus and magnetic head manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016018568A JP2016018568A (en) | 2016-02-01 |
| JP6300668B2 true JP6300668B2 (en) | 2018-03-28 |
Family
ID=55233684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014138218A Active JP6300668B2 (en) | 2014-07-04 | 2014-07-04 | Magnetic head manufacturing apparatus and magnetic head manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6300668B2 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6475169A (en) * | 1987-09-14 | 1989-03-20 | Sony Corp | Soldering method |
| JPH1094892A (en) * | 1996-09-25 | 1998-04-14 | Shimadzu Corp | Laser beam heating device |
| JP4880561B2 (en) * | 2007-10-03 | 2012-02-22 | 新光電気工業株式会社 | Flip chip mounting device |
| JP5495574B2 (en) * | 2009-01-16 | 2014-05-21 | パナソニック株式会社 | Laser soldering method |
| US8250737B2 (en) * | 2010-10-14 | 2012-08-28 | Tdk Corporation | Method for manufacturing head including light source unit for thermal assist |
-
2014
- 2014-07-04 JP JP2014138218A patent/JP6300668B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016018568A (en) | 2016-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8987052B2 (en) | Attachment of microelectronic components | |
| JP5030871B2 (en) | Resin welding method | |
| US20130228322A1 (en) | Brazing method and brazed structure | |
| JPWO2018147283A1 (en) | Vapor chamber | |
| JP5649090B2 (en) | Semiconductor laser module and manufacturing method thereof | |
| JP5030872B2 (en) | Resin welding method | |
| US20130142478A1 (en) | Method and apparatus for aligning a laser diode on a slider structure | |
| JP6300668B2 (en) | Magnetic head manufacturing apparatus and magnetic head manufacturing method | |
| KR20160003270A (en) | Method for soldering a sandwich metal sheet to a solid metal sheet using a laser beam | |
| JP2008194707A (en) | Laser welding tool, and method of manufacturing semiconductor device by using the same | |
| JP2007258480A (en) | Semiconductor laser module | |
| JP2013103264A (en) | Laser soldering apparatus and method | |
| JP2007289980A (en) | Laser soldering equipment and laser soldering method | |
| JP2001247321A (en) | Method and apparatus for junction of glass by laser beam | |
| WO2011074072A1 (en) | Method of welding resin | |
| US11534864B2 (en) | Method for connecting two components and component composite | |
| JP2019115911A (en) | Laser welding method and laser welding device | |
| JP6536842B2 (en) | Laser device | |
| JP2016516295A (en) | Integration of submount assembly | |
| JP2011040688A (en) | Circuit board and method of manufacturing the same | |
| JP2020093285A (en) | Method of joining dissimilar metals | |
| WO2012169275A1 (en) | Method for fixing optical fiber, and method for manufacturing laser module | |
| JP7566212B2 (en) | Joining Method | |
| JP6684548B2 (en) | Chip joining method | |
| JP4685366B2 (en) | Bonding method of optical components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170608 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180129 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180221 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180227 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6300668 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |