JP6378327B2 - Low particle gas enclosure system and method - Google Patents

Description

(Cross-reference to related applications)
This application claims the benefit of US Provisional Application No. 61 / 833,398, filed June 10, 2013. This application claims the benefit of US Provisional Application No. 61 / 911,934, filed Dec. 4, 2013. This application claims the benefit of US Provisional Application No. 61 / 925,578, filed Jan. 9, 2014. This application claims the benefit of US Provisional Application No. 61 / 983,417, filed April 23, 2014. This application is a continuation-in-part of US application Ser. No. 14 / 205,340, filed Mar. 11, 2014. U.S. Application No. 14 / 205,340, filed March 11, 2014, is filed with U.S. Application No. 13 / 802,304, filed Mar. 13, 2013 (US2013 / 15, Aug. 15, 2013). (Published as 02006058). US Application No. 13 / 802,304 is a continuation of US Application No. 13 / 720,830, filed December 19, 2012 (published as US 2013/0252533 on September 26, 2013) It is. US Application No. 13 / 720,830 claims the benefit of US Provisional Application No. 61 / 579,233, filed December 22, 2011. US Application No. 13 / 720,830, filed December 19, 2012, is filed with US Application No. 12 / 652,040, filed January 5, 2010 (US 8, Registered as 383,202). US Application No. 12 / 652,040 is a continuation of US Application No. 12 / 139,391 filed June 13, 2008 (published as US 2008/0311307 on December 18, 2008). It is. US Application No. 12 / 652,040 also claims the benefit of US Provisional Application No. 61 / 142,575, filed January 5, 2009. All cross-reference applications listed herein are incorporated by reference in their entirety.

(Field)
The present teachings relate to various embodiments of gas enclosure systems having an inert, substantially low particle environment for processing OLED panels on various substrate sizes and substrate materials.

(Overview)
An interest in the potential of organic light emitting diode (OLED) display technology includes the demonstration of display panels that have highly saturated colors and are high contrast, ultra-thin, fast responsiveness, and energy efficient Driven by display technology attributes. In addition, various substrate materials, including flexible polymer materials, can be used in the processing of OLED display technology. Demonstration of displays for small screen applications, primarily mobile phones, has helped to highlight the potential of the technology, but challenges remain in expanding mass production across a range of substrate formats with high yields. Yes.

  With respect to format expansion, the Gen 5.5 substrate has dimensions of about 130 cm × 150 cm and can yield about eight 26-inch flat panel displays. In comparison, larger types of substrates include the use of Gen 7.5 and Gen 8.5 mother glass substrate sizes. Gen 7.5 mother glass has dimensions of about 195 cm × 225 cm and can be cut into eight 42 inch or six 47 inch flat panel displays per substrate. The mother glass used in Gen 8.5 is approximately 220 cm x 250 cm and can be cut into six 55 inch or eight 46 inch flat panel displays per substrate. One of the remaining challenges in expanding the production of OLED displays to larger formats is that mass production of OLED displays in high yields on substrates larger than Gen 5.5 substrates is substantially difficult. Is known.

  In principle, OLED devices may be manufactured by printing various organic thin films as well as other materials on a substrate using an OLED printing system. Such organic materials can be susceptible to damage by oxidation and other chemical processes. Housing the OLED printing system in a manner that can be scaled for various substrate sizes and performed in an inert, substantially low particle printing environment presents various technical challenges. obtain. For example, production tools for high-throughput large format substrate printing, such as printing Gen 7.5 and Gen 8.5 substrates, require substantially large equipment. Therefore, maintaining a large facility under an inert atmosphere that requires gas purification to remove reactive atmospheric species such as water vapor and oxygen, and organic solvent vapors, and a substantially low particle printing environment. Maintaining presents significant challenges.

Thus, there remains a challenge in expanding mass production of OLED display technology over a range of substrate formats in high yield. Thus, for various embodiments, the OLED printing system can be housed in an inert, substantially low particle environment, and easily to provide processing of OLED panels on various substrate sizes and substrate materials. There is a need for a gas enclosure system of the present teachings that can be expanded. In addition, the various gas enclosure systems of the present teachings can provide immediate access to the OLED printing system from the outside during processing and the inside for maintenance with minimal downtime.
This specification also provides the following items, for example.
(Item 1)
A gas enclosure system,
A gas enclosure assembly defining an interior containing gas;
A business printing system housed in the gas enclosure assembly, the business printing system comprising:
A printhead assembly comprising at least one printhead;
A substrate support device;
A service bundle housing for storing a service bundle, wherein the service bundle is operatively connected to the printing system;
A commercial printing system comprising:
A service bundle housing discharge system for discharging gas proximal to the service bundle housing away from the substrate support device;
A gas enclosure system comprising:
(Item 2)
The gas enclosure assembly further includes
A printing system enclosure for housing the printing system;
An auxiliary enclosure, wherein the auxiliary enclosure is configured to be sealably isolated from the printing system; and
The gas enclosure system according to item 1, comprising:
(Item 3)
The gas enclosure system according to item 1, wherein the gas is an inert gas.
(Item 4)
4. The gas enclosure system according to item 3, wherein the inert gas is selected from nitrogen, a rare gas, and combinations thereof.
(Item 5)
The gas enclosure system according to item 1, wherein the gas is clean dry air (CDA).
(Item 6)
The gas enclosure system of item 1, further comprising a gas purification system.
(Item 7)
7. The gas enclosure system of item 6, wherein the gas purification system maintains the gas at less than 100 ppm of each of the reactive species.
(Item 8)
Item 8. The gas enclosure system of item 7, wherein the reactive species is selected from water vapor and oxygen.
(Item 9)
A gas enclosure system,
A gas enclosure assembly defining an interior containing gas;
A business printing system housed in the gas enclosure assembly, the business printing system comprising:
A printhead assembly comprising at least one printhead;
A substrate support device;
A motion system for precise positioning of the printhead assembly relative to a substrate supported on the substrate support device;
A service bundle housing for storing a service bundle, wherein the service bundle is operatively connected to the printing system;
A commercial printing system comprising:
A service bundle housing discharge system for discharging gas proximal to the service bundle housing away from the substrate;
With
A low particle environment that provides an average particle distribution on the substrate that meets the deposition rate specification on the substrate of particles less than or equal to about 100 per square meter of substrate per minute for particles greater than or equal to 2 μm in size, A gas enclosure system maintained within a gas enclosure system.
(Item 10)
10. The average particle distribution on the substrate meets a deposition rate specification on a substrate of particles less than or equal to about 1000 per square meter of substrate per minute for particles having a size greater than or equal to 0.3 μm. Gas enclosure system.
(Item 11)
10. A gas enclosure system according to item 1 or item 9, wherein the service bundle housing discharge system is in fluid communication with a gas circulation and filtration system.
(Item 12)
Item 10. The gas enclosure system of item 1 or item 9, further comprising a printhead assembly exhaust system for exhausting gas proximal to the printhead assembly away from the substrate support device.
(Item 13)
The gas enclosure system of claim 12, wherein the printhead assembly exhaust system is in fluid communication with a gas circulation and filtration system.
(Item 14)
Item 10. The gas enclosure system of item 1 or item 9, wherein the motion system is a split axis motion system.
(Item 15)
15. A gas enclosure system according to item 14, wherein the split axis motion system comprises an air bearing motion system.
(Item 16)
Item 10. The gas enclosure system according to Item 1 or Item 9, wherein the substrate support device comprises a floating table.
(Item 17)
10. A gas enclosure system according to item 1 or item 9, wherein the motion system for moving the substrate through the printing system is an air bearing motion system.
(Item 18)
Item 10. The gas enclosure system according to Item 1 or Item 9, wherein the substrate support device can support a substrate having a size ranging from about 3.5 generations to about 10 generations.
(Item 19)
19. A gas enclosure system according to item 18, wherein the gas is an inert gas.
(Item 20)
20. A gas enclosure system according to item 19, further comprising a gas purification system.
(Item 21)
21. A gas enclosure system according to item 20, wherein the gas purification system maintains the gas at less than 100 ppm of each of the reactive species.

  A better understanding of the features and advantages of the present disclosure will be obtained by reference to the accompanying drawings that are intended to illustrate but not limit the present teachings.

FIG. 1 is a right front perspective view of a gas enclosure assembly in accordance with various embodiments of the present teachings. FIG. 1 is a right front perspective view of a gas enclosure assembly in accordance with various embodiments of the present teachings. FIG. 2 depicts an exploded view of a gas enclosure assembly, according to various embodiments of the present teachings. FIG. 3 is an exploded front perspective view of a frame member assembly depicting various panel frame sections and section panels in accordance with various embodiments of the present teachings. 4A, 4B, and 4C are top schematic views of various embodiments of gasket seals for forming a joint. 5A and 5B are various perspective views depicting the sealing of a frame member according to various embodiments of the gas enclosure assembly of the present teachings. 5A and 5B are various perspective views depicting the sealing of a frame member according to various embodiments of the gas enclosure assembly of the present teachings. FIGS. 6A and 6B are various views relating to the sealing of a section panel to receive a readily removable inspection window, according to various embodiments of the gas enclosure assembly of the present teachings. FIGS. 6A and 6B are various views relating to the sealing of a section panel to receive a readily removable inspection window, according to various embodiments of the gas enclosure assembly of the present teachings. 7A and 7B are enlarged perspective cross-sectional views relating to sealing a section panel for receiving an inset panel or window panel according to various embodiments of the present teachings.

FIG. 8 is a ceiling view including a lighting system for various embodiments of a gas enclosure system according to the present teachings. FIG. 9 is a front perspective view of a gas enclosure assembly in accordance with various embodiments of the present teachings. FIG. 10A depicts an exploded view of various embodiments of a gas enclosure assembly and associated printing as depicted in FIG. 9, according to various embodiments of the present teachings. FIG. 10B depicts an enlarged isometric perspective view of the printing system depicted in FIG. 10A. FIG. 10C shows an enlarged isometric perspective view of the auxiliary enclosure depicted in FIG. 10A. FIG. 11 depicts a perspective view of a floating table according to various embodiments of the present teachings.

FIG. 12 is a schematic diagram of various embodiments of a gas enclosure assembly and related system components of the present teachings. FIG. 13 is a schematic diagram of various embodiments of a gas enclosure assembly and related system components of the present teachings. FIG. 14 is a schematic diagram of a gas enclosure system in accordance with various embodiments of the present teachings. FIG. 15 is a schematic diagram of a gas enclosure system in accordance with various embodiments of the present teachings. FIG. 16 is a perspective front perspective view of a gas enclosure assembly depicting piping installed within the gas enclosure assembly in accordance with various embodiments of the present teachings. FIG. 17 is a perspective top perspective view of a gas enclosure assembly depicting piping installed within the gas enclosure assembly, according to various embodiments of the present teachings. FIG. 18 is a perspective bottom perspective view of a gas enclosure assembly depicting piping installed within the gas enclosure assembly in accordance with various embodiments of the present teachings. FIG. 19A is a schematic diagram illustrating a service bundle, according to various embodiments of the present teachings. FIG. 19B depicts gas passing through a service bundle delivered through various embodiments of piping in accordance with the present teachings. FIG. 20 shows how reactive species (A) blocked in the dead space of the service bundle are actively purged from the inert gas (B) passing through the duct through which the bundle is routed. FIG. FIG. 21A is a perspective perspective view of cables and tubing routed through piping according to various embodiments of a gas enclosure system of the present teachings. FIG. 21B is an enlarged view of the opening shown in FIG. 21A showing details of a cover for closure covering the opening according to various embodiments of the gas enclosure system of the present teachings. FIG. 22 is a schematic side cross-sectional view of a gas enclosure system depicting an embodiment of gas circulation through a gas enclosure assembly in accordance with various embodiments of the present teachings. FIG. 23 is a schematic side cross-sectional view of a gas enclosure system depicting an embodiment of gas circulation through a gas enclosure assembly in accordance with various embodiments of the present teachings. FIG. 24 is a schematic front cross-sectional view of a gas enclosure depicting an embodiment of gas circulation through the gas enclosure assembly in accordance with various embodiments of the present teachings. FIG. 25 is a cross-sectional schematic view of a gas enclosure assembly with system components, according to various embodiments of the present teachings. FIG. 26 is a perspective view of a printing system depicting various embodiments of a particle control system of the present teachings that can include a low particle X-axis motion system and a service bundle housing ejection system. 27A and 27B are cross-sectional views of low particle X-axis motion systems, according to various embodiments of the present teachings. 27A and 27B are cross-sectional views of low particle X-axis motion systems, according to various embodiments of the present teachings. 28A and 28B are various perspective views of a service bundle housing ejection system for a printing system, according to various embodiments of the present teachings. 28A and 28B are various perspective views of a service bundle housing ejection system for a printing system, according to various embodiments of the present teachings. FIG. 29A is a schematic diagram of a service bundle housing ejection system, according to various embodiments of the present teachings. 29B, 29C, and 29D are schematic views of various embodiments of venting a service bundle housing, according to various embodiments of the present teachings. 29B, 29C, and 29D are schematic views of various embodiments of venting a service bundle housing, according to various embodiments of the present teachings. 29B, 29C, and 29D are schematic views of various embodiments of venting a service bundle housing, according to various embodiments of the present teachings. 30A and 30B are schematic views of a gas enclosure system depicting embodiments of gas circulation and particle collection around a printhead assembly in a gas enclosure assembly, according to various embodiments of the present teachings. 31A and 31B are schematic views of a gas enclosure system depicting embodiments of gas circulation and particle collection around a printhead assembly within a gas enclosure assembly, according to various embodiments of the present teachings. 32A and 32B are schematic views of a gas enclosure system depicting embodiments of gas circulation and particle collection around a printhead assembly in a gas enclosure assembly, according to various embodiments of the present teachings. FIG. 33 is an embodiment of a portable suspended particle counting device according to the present teachings. FIG. 34 is a schematic diagram of the principle of operation of various portable suspended particle counting devices based on the scattering of electromagnetic radiation. FIG. 35 is a schematic diagram depicting various regions where a portable suspended particle counting device can be located in various printing systems of the present teachings. FIG. 36 is an isometric view of a portable suspended particle counting device located proximal to a substrate support apparatus, according to various embodiments of the present teachings. FIGS. 37A and 37B are graphs depicting long term test results of particle counts in various embodiments of a gas enclosure system of the present teachings. FIGS. 37A and 37B are graphs depicting long term test results of particle counts in various embodiments of a gas enclosure system of the present teachings. FIG. 38 is a graph depicting particle number recovery test results before and after opening the gas enclosure system window. FIG. 39 is a schematic diagram of the principle of operation of various particle detection devices for particle detection on a substrate based on the scattering of electromagnetic radiation. FIG. 40 is an isometric perspective view of the placement of a test substrate proximal to a print area, according to various embodiments of the present teachings. FIG. 41 is an isometric perspective view of the placement of a substrate proximal to a printing area in a printing system equipped with a camera, according to various embodiments of the present teachings.

  The present teachings disclose various embodiments of a gas enclosure assembly that can accommodate an OLED printing system. Various embodiments of the gas enclosure assembly form various embodiments of gas enclosure systems that can sustain such an environment for processes that require an inert gas environment that is substantially low in particle size. As such, it can be sealably constructed and integrated with various components to provide particle control systems, gas circulation and filtration systems, gas purification systems, and the like.

  In principle, manufacturing tools that can enable printing of various substrate sizes, including large format substrate sizes, may require substantially large equipment to accommodate such OLED manufacturing tools. Therefore, maintaining the entire large facility under an inert atmosphere presents technical challenges such as continuous purification of a large amount of inert gas. According to the present teachings, the inert gas may be any gas that does not undergo a chemical reaction under a defined set of conditions. Some commonly used non-limiting examples of inert gases can include nitrogen, any of the noble gases, and any combination thereof. In addition, providing a large facility that is inherently sealed to prevent contamination of various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapors generated from various printing processes is technically Raise challenges. According to the present teachings, OLED printing equipment can produce various levels of various reactive species, including various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapor, at or below 100 ppm, such as 10 ppm or less. Will be kept lower, 1.0 ppm or lower, or 0.1 ppm or lower.

  Continuous maintenance of large facilities that require an inert environment still presents additional challenges. For example, a manufacturing facility operably connects from various systems and assemblies to provide, for example, but not limited to, the optical, electrical, mechanical, and fluidic connections required to operate the printing system. Can require a significant length of various service bundles. In accordance with the present teachings, service bundles can include optical cables, electrical cables, wires and tubing, and the like as non-limiting examples. Various embodiments of service bundles in accordance with the present teachings result in significant overall results as a result of a substantial number of gaps created by bundling together various cables, wires and tubing, and the like in the service bundle. May have a dead volume. Due to a significant number of gaps in the service bundle, the total dead volume can result in the retention of a significant amount of reactive gas species occluded therein. Such significant amounts of occluded reactive gas species may present challenges to effectively bring the gas enclosure to specifications with respect to reactive atmospheric components such as oxygen and water vapor, and organic vapor levels. Also, such service bundles used in the operation of the printing system can be a continuous source of particulate matter.

  In that regard, providing and maintaining a substantially inert, low particle environment in an OLED manufacturing facility is for example a process that can be performed at atmospheric conditions under an open high fluidized laminar filtration hood. Provides additional challenges not presented in. Accordingly, various embodiments of the systems and methods of the present teachings address the challenges presented in OLED printing of OED substrates of various sizes and materials in an inert, substantially low particle environment.

  With respect to maintaining a substantially low particle environment, various embodiments of gas circulation and filtration systems are described in International Standards Organization Standard (ISO) 14644-1: 1999, “ It can be designed to provide a low particle inert gas environment for suspended particulate matter that meets the standards of Cleanrooms and associated controlled envelopments-Part 1: Classification of air cleanliness. However, because particles generated proximate to the substrate during such a process can accumulate on the substrate surface before being able to pass through the gas circulation and filtration system, controlling suspended particulate matter Alone, for example, but not limited to, is not sufficient to provide a low particle environment proximal to the substrate during the printing process.

  Accordingly, various embodiments of the gas enclosure system of the present teachings include components that can provide a low particle zone proximal to the substrate during processing in a printing step, in addition to a gas circulation and filtration system. Can have a particle control system. In accordance with various embodiments of the gas enclosure system of the present teachings, the particle control system for the various embodiments of the gas enclosure system of the present teachings moves the printhead assembly relative to the gas circulation and filtration system and the substrate. A low particle generation X-axis linear bearing system, a service bundle housing ejection system, and a printhead assembly ejection system. In that regard, in addition to a circulation and filtration system to maintain a substantially low particle specification for suspended particulate matter, various embodiments of the gas enclosure system of the present teachings are deposited on a substrate. It is possible to have a particle control system that can include additional components to maintain a substantially low particle specification for particulate matter.

  Various embodiments of the systems and methods of the present teachings maintain a substantially low particle environment that provides an average on-substrate distribution of particles of a particular size range of interest that does not exceed a deposition rate specification on the substrate. be able to. The on-substrate deposition rate specification can be set for each of the target particle size ranges of about 0.1 μm and larger to 10 μm and larger. In various embodiments of the systems and methods of the present teachings, the particle deposition rate specification on the substrate may be expressed as a limit on the number of particles deposited per square meter of substrate per minute for each large particle size range. it can.

Various embodiments of on-substrate particle deposition rate specifications provide for particles deposited per substrate per minute from a limit on the number of particles deposited per square meter of substrate per minute for each target particle size range. Can easily be converted to the limit of the number of Such a conversion can be easily performed, for example, through a known relationship between a substrate of a specific generation size and a corresponding area of the substrate generation. For example, Table 1 below summarizes the aspect ratios and areas of several known generation size substrates. It should be understood that some manufacturers may see slight variations in aspect ratio and thus size. However, in spite of such variations, the conversion factor and area in square meters of a specific generation size substrate can be obtained with any of various generation size substrates.

  In addition, the on-substrate particle deposition rate specification, expressed as a limit on the number of particles deposited per square meter of substrate per minute, can easily be converted to any of a variety of unit time representations. it can. It is easy to understand that particle deposition rate specifications normalized to fractions can be easily converted to any other representation of time, such as, but not limited to, time, day, etc., through known time relationships. Will be done. In addition, units of time that are specific to processing can be used. For example, a print cycle can be associated with a unit of time. For various embodiments of a gas enclosure system according to the present teachings, the printing cycle is the period during which the substrate is moved into the gas enclosure system for printing and then removed from the gas enclosure system after printing is complete. It can be. For various embodiments of the gas enclosure system according to the present teachings, the print cycle may be the period from the start of alignment of the substrate to the printhead assembly until delivery of the last ejected ink droplet onto the substrate. . In the processing arts, the total average cycle time or TACT may be a representation of a unit of time for a particular process cycle. According to various embodiments of the systems and methods of the present teachings, the TACT for a print cycle can be about 30 seconds. For various embodiments of the systems and methods of the present teachings, the TACT for a print cycle can be about 60 seconds. In various embodiments of the systems and methods of the present teachings, the TACT for a print cycle can be about 90 seconds. For various embodiments of the systems and methods of the present teachings, the TACT for a print cycle can be about 120 seconds. In various embodiments of the systems and methods of the present teachings, the TACT for a print cycle can be about 300 seconds.

  With respect to suspended particulate matter and particle deposition in the system, a considerable number of variables can appropriately calculate an approximation of the value of the particle drop rate on a surface such as a substrate, for example, for any particular manufacturing system. It can affect the development of general models. Variables such as the size of the particles, the distribution of particles of a particular size, the surface area of the substrate, and the time of exposure of the substrate within the system can vary depending on the various manufacturing systems. For example, the size of the particles, and the distribution of particles of a particular size, can be substantially affected by the source and location of the particle generating components within the various manufacturing systems. Calculations according to various embodiments of the gas enclosure system of the present teachings indicate that without the various particle control systems of the present teachings, the deposition of particulate matter on a substrate per printing cycle per square meter of substrate is 0.1 μm and It suggests that for particles in the larger size range, there can be more than about 1 million to more than about 10 million particles. Such calculations show that without the various particle control systems of the present teachings, the deposition on the substrate of particulate matter per printing cycle per square meter of substrate is about 2 μm and larger for particles in the size range and larger. It suggests that there can be more than 1000 to more than about 10,000 particles.

  Various embodiments of the low particle gas enclosure system of the present teachings meet on-substrate deposition rate specifications for particles of less than or equal to about 100 per square meter of substrate per minute for particles of size greater than or equal to 10 μm. A low particle environment can be maintained that provides an average particle distribution on the substrate. Various embodiments of the low particle gas enclosure system of the present teachings meet on-substrate deposition rate specifications for particles less than or equal to about 100 per square meter of substrate per minute for particles of size greater than or equal to 5 μm. A low particle environment can be maintained that provides an average particle distribution on the substrate. In various embodiments of the gas enclosure system of the present teachings, for particles larger than or equal to 2 μm in size, on an average substrate that meets a deposition rate on the substrate of particles less than or equal to about 100 per square meter of substrate per minute A low particle environment can be maintained that provides particle distribution. In various embodiments of the gas enclosure system of the present teachings, on average substrates that meet a deposition rate on the substrate of particles less than or equal to about 100 per square meter of substrate per minute for particles larger than or equal to 1 μm in size. A low particle environment can be maintained that provides particle distribution. Various embodiments of the low particle gas enclosure system of the present teachings meet a deposition rate on the substrate of particles less than or equal to about 1000 per square meter of substrate per minute for particles of size greater than or equal to 0.5 μm. A low particle environment can be maintained, providing an average particle distribution on the substrate. For various embodiments of the gas enclosure system of the present teachings, for particles greater than or equal to 0.3 μm in size, meet a deposition rate on the substrate of particles less than or equal to about 1000 per square meter of substrate per minute. A low particle environment can be maintained that provides an average particle distribution on the substrate. Various embodiments of the low particle gas enclosure system of the present teachings meet a deposition rate on the substrate of particles less than or equal to about 1000 per square meter of substrate per minute for particles of size greater than or equal to 0.1 μm. A low particle environment can be maintained, providing an average particle distribution on the substrate.

  As previously discussed herein, mass production of high yield OLED displays on substrates larger than Gen 5.5 substrates has proven to be substantially difficult. For a clearer view of the substrate sizes that can be used in the production of various OLED devices, generations of mother glass substrate sizes have been developed for flat panel displays that have been processed by other than OLED printing since the early 1990s. It has evolved. The first generation mother glass substrate, designated Gen 1, was approximately 30 cm × 40 cm, and therefore could produce a 15 inch panel. Around the mid-1990s, existing technology for producing flat panel displays evolved to a Gen 3.5 mother glass substrate size with dimensions of about 60 cm × 72 cm. In comparison, the Gen 5.5 substrate has dimensions of about 130 cm × 150 cm.

  As generations advance, Gen 7.5 and Gen 8.5 mother glass sizes are being produced outside of the OLED printing process. The Gen 7.5 mother glass size has dimensions of about 195 cm x 225 cm and can be cut into eight 42 inch or six 47 inch flat panels per substrate. The mother glass used in Gen 8.5 is approximately 220 x 250 cm and can be cut into six 55 inch or eight 46 inch flat panels per substrate. While OLED manufacturing is practically limited to G 3.5 and smaller, more authentic colors, higher contrast, thinness, flexibility, transparency, energy efficiency, etc. The promise of OLED flat panel displays for quality has been realized. Currently, OLED printing overcomes this limitation, not only the mother glass sizes of Gen 3.5 and smaller, but also the maximum mother glass sizes such as Gen 5.5, Gen 7.5, and Gen 8.5. It is considered that this is an optimal manufacturing technology that enables OLED panel manufacturing. One of the features of OLED panel display technology can be used, including but not limited to various substrate materials, such as various glass substrate materials, as well as various polymer substrate materials. In that regard, the sizes described derived from the terms resulting from the use of glass-based substrates can be applied to substrates of any material suitable for use in OLED printing.

  It is contemplated that a wide variety of ink formulations can be printed within the inert, substantially low particle environment of various embodiments of the gas enclosure system of the present teachings. During manufacture of an OLED display, an OLED pixel can be formed to include an OLED film stack that can emit light of a particular peak wavelength when a voltage is applied. The OLED film stack structure between the anode and the cathode comprises a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EL), an electron transport layer (ETL), and an electron injection layer (EIL). Can be included. In some embodiments of the OLED film stack structure, an electron transport layer (ETL) can be combined with an electron injection layer (EIL) to form an ETL / EIL layer. In accordance with the present teachings, inkjet printing can be used to print various ink formulations for EL for various color pixel EL films of an OLED film stack. In addition, for example, but not limited to, HIL, HTL, EML, and ETL / EIL layers can have ink formulations that can be printed using inkjet printing.

  Furthermore, it is contemplated that an organic encapsulation layer can be printed on an OLED panel using inkjet printing. It is contemplated that inkjet printing can be used to print an organic encapsulated layer because inkjet printing can provide several advantages. First, since such inkjet-based processing can be performed at atmospheric pressure, a series of vacuum processing operations can be eliminated. In addition, during the ink jet printing process, the organic encapsulation layer so as to effectively encapsulate the active region, including the outer edge of the active region, covering the portion of the OLED substrate that spans and is proximal to the active region. Can be limited. Target patterning using ink jet printing results in eliminating material waste as well as additional processing typically required to achieve organic layer patterning. Encapsulated inks can be cured using, for example, polymers including but not limited to acrylates, methacrylates, urethanes, or other materials, and heat treatment (eg, baking), ultraviolet radiation, and combinations thereof. The copolymers and mixtures thereof can be included.

  With respect to OLED printing, according to the present teachings, maintaining substantially low levels of reactive species such as, but not limited to, atmospheric components such as oxygen and water vapor, and various organic solvent vapors used in OLED inks It has been found to correlate with providing OLED flat panel displays that meet the required life specification. This is particularly important for OLED panel technology because the lifetime specification, which is a product specification for all panel technologies that OLED panel technology is difficult to meet, directly correlates with the lifetime of the display product. In order to provide a panel that meets the required life specification, each level of reactive species such as water vapor, oxygen, and organic solvent vapor is 100 ppm or lower using various embodiments of the gas enclosure system of the present teachings. For example, 10 ppm or lower, 1.0 ppm or lower, or 0.1 ppm or lower.

  Maintain the respective levels of reactive species such as water vapor, oxygen, and organic solvent vapor at 100 ppm or lower, such as 10 ppm or lower, 1.0 ppm or lower, or 0.1 ppm or lower. The need to print OLED panels in the facility can be illustrated by reviewing the information summarized in Table 2. The data summarized in Table 2 came from the inspection of each of the test coupons, including organic thin film compositions for each of red, green, and blue, processed in a large pixel spin-coated device format. is there. Such test coupons are substantially easier to manufacture and test for the purpose of rapid evaluation of various formulations and processes. The test coupon test should not be confused with the printed panel life test, but can show the effect of various formulations and processes on the service life. The results shown in the table below were processed in a nitrogen environment that was processed similarly but had less than 1 ppm reactive species compared to a test coupon processed in air instead of the nitrogen environment. It represents the process step variation in the processing of the test coupon where only the spin coating environment has changed for the test coupon.

Through an examination of the data in Table 2 of test coupons processed under different processing environments, particularly in the case of red and blue, printing in the environment that effectively reduces the exposure of the organic thin film composition to the reactive species is It is clear that the stability of various ELs, and therefore the lifetime, can be significantly affected.

  In addition, maintaining a substantially low particle environment for OLED printing is particularly important since even very small particles can lead to visible defects on the OLED panel. In that regard, the systems and methods of the present teachings maintain sufficiently low levels of each of reactive species such as water vapor, oxygen, and organic solvent vapors, in addition to sufficiently low particle size for high quality OLED panel manufacturing. Provide to maintain the environment. Various embodiments of a gas enclosure system can include components to provide a low particle zone proximal to the substrate during processing in a printing step, in addition to a gas circulation and filtration system. Can have.

  Various embodiments of the gas enclosure system of the present teachings may contain and discharge various particle generating components proximal to the substrate to prevent particles from accumulating on the substrate during the printing process. It is possible to have a particle control system that provides a low particle zone proximal to the substrate. In various embodiments of the gas enclosure system, the particle control system is an International Standards Organization Standard (ISO) 14644-1 as specified by Class 1 to Class 5, both within the gas enclosure system and proximal to the substrate. A gas circulation and filtration system to maintain suspended particulate matter levels that meet 1999 standards can be included. Various embodiments of the particle control system provide gas circulation in fluid communication with the contained particle generation component such that such particle-containing component can be discharged into the gas circulation and filtration system. And a filtration system. For various embodiments of the particle control system, the contained particle generation components can be discharged into the dead space and such particulate matter is not accessible for recirculation within the gas enclosure system. to enable. Various embodiments of the gas enclosure system of the present teachings are particle control systems in which various components can be essentially low particle generation, thereby preventing particles from accumulating on the substrate during the printing process. Can have. The various components of the particle control system of the present teachings include the inclusion and ejection of particle generation components and the selection of components that are inherently low particle generation to provide a low particle zone proximal to the substrate. Can be used.

  For various embodiments of the low particle gas enclosure system of the present teachings, maintaining a substantially low particle environment within an encapsulating system, eg, an encapsulated OLED printing system, is under the open high fluid laminar flow hood. It provides additional challenges not presented by particle reduction for processes that can be performed at atmospheric conditions such as. Various embodiments of the gas enclosure system include, but are not limited to, 1) through the elimination of the proximal region of the substrate where particulate matter can collect, and 2) various embodiments of the particle control system of the present teachings. Utilize particle generation components such as service bundles, which can include bundled cables, wires and tubing, and the like, as well as components such as fans or linear motion systems using friction bearings, for example By containing and discharging various devices, assemblies, and systems, and 3) various intrinsically low particles such as, but not limited to, substrate floating tables, air bearings, pneumatically operated robots, and the like By using the pneumatically actuated components of production, a substantially low particle environment can be provided . According to various embodiments of the gas enclosure system of the present teachings, the substantially low particle environment includes a particle control system that includes components for providing a low particle zone proximal to the substrate during printing. Can do.

  As will be discussed in more detail later herein, direct control of particle generation proximal to the substrate to provide a low particle zone proximal to the substrate is achieved through the inclusion of particle generating elements. It can be implemented by the use of elements and by a combination of the inclusion of particle generation and the use of particle generation components. Accordingly, various embodiments of a gas enclosure system are in fluid communication with a substrate, a service bundle housing ejection system, and a low particle generation X-axis linear bearing system for moving the printhead assembly relative to the printhead assembly ejection system. A particle control system can be included that can include a gas circulation and filtration system. For various embodiments of the service bundle housing discharge system and the printhead assembly discharge system, particles contained in such a system can be discharged into a gas circulation and filtration system. In various embodiments of the service bundle housing ejection system and the printhead assembly ejection system, particles contained in such a system can be ejected into the dead space, thereby being ejected into the dead space. Such particulate matter is rendered inaccessible for circulation within the gas enclosure system.

  In addition, system verification and ongoing system monitoring can be performed for both floating and on-substrate particle monitoring. The determination of suspended particulate matter can be made to various embodiments of the gas enclosure system prior to the printing process as a quality check using, for example, a portable particle counting device. In various embodiments of the gas enclosure system, the determination of suspended particulate matter can be performed as an ongoing quality check while the substrate is being printed. For various embodiments of the gas enclosure system, the determination of suspended particulate matter can be made as a quality check before the substrate is printed and in addition while the substrate is being printed. Determination of the on-substrate distribution of particulate matter on the substrate can be made to various embodiments of the gas enclosure system using, for example, a test substrate before the substrate is printed for system verification. In various embodiments of the gas enclosure system, for example, determining the distribution of particulate matter on the substrate can be performed in situ while the substrate is being printed using a camera assembly mounted on an X-axis carriage assembly. Can be done as an ongoing quality check. For various embodiments of the gas enclosure system, the determination of the distribution of particulate matter on the substrate can be performed before the substrate is printed, in addition, while the substrate is being printed, in-situ for system verification. It can be carried out.

  Various embodiments of the gas enclosure system can maintain a substantially low particle environment that provides on-substrate particle specifications for particles from about 0.1 μm or greater to about 10 μm or greater. Can have a particle control system. Various embodiments of particle-on-substrate specifications easily convert from an average particle-on-substrate distribution per square meter of substrate per minute to an average particle-on-substrate distribution per substrate per minute for each target particle size range. can do. As previously discussed herein, such conversion can be easily performed, for example, through a known relationship between a substrate of a specific generation size and a corresponding area of the substrate generation. . In addition, the average particle distribution on the substrate per square meter of substrate per minute can be easily converted to any of a variety of unit time representations. For example, in addition to standard time units, eg, conversion between seconds, minutes, and days, units of time that are specific to the process can be used. For example, a print cycle can be associated with a unit of time, as previously discussed herein.

  Various embodiments of the low particle gas enclosure system of the present teachings meet on-substrate deposition rate specifications for particles of less than or equal to about 100 per square meter of substrate per minute for particles of size greater than or equal to 10 μm. A low particle environment can be maintained that provides an average particle distribution on the substrate. Various embodiments of the low particle gas enclosure system of the present teachings meet on-substrate deposition rate specifications for particles less than or equal to about 100 per square meter of substrate per minute for particles of size greater than or equal to 5 μm. A low particle environment can be maintained that provides an average particle distribution on the substrate. In various embodiments of the gas enclosure system of the present teachings, an average substrate that meets a deposition rate specification on a substrate of particles less than or equal to about 100 per square meter of substrate per minute for particles larger than or equal to 2 μm in size A low particle environment providing an upper particle distribution can be maintained. In various embodiments of the gas enclosure system of the present teachings, an average substrate that meets a deposition rate specification on a substrate of particles less than or equal to about 100 per square meter of substrate per minute for particles larger than or equal to 1 μm in size A low particle environment providing an upper particle distribution can be maintained. Various embodiments of the low particle gas enclosure system of the present teachings provide on-substrate deposition rate specifications for particles less than or equal to about 1000 per square meter of substrate per minute for particles larger than or equal to 0.5 μm in size. A low particle environment can be maintained that provides an average particle distribution on the substrate that meets. For various embodiments of the gas enclosure system of the present teachings, meet on-substrate deposition rate specifications for particles less than or equal to about 1000 per square meter of substrate per minute for particles of size greater than or equal to 0.3 μm. A low particle environment can be maintained, providing an average particle distribution on the substrate. Various embodiments of the low particle gas enclosure system of the present teachings provide on-substrate deposition rate specifications for particles less than or equal to about 1000 per square meter of substrate per minute for particles of size greater than or equal to 0.1 μm. A low particle environment can be maintained that provides an average particle distribution on the substrate that meets.

  In addition, the gas enclosure system can be easily expanded to provide an optimized work space for an OLED printing system, for example, while providing a minimized inert gas volume. Including, but not limited to, a gas enclosure assembly assembly that provides immediate access to the OLED printing system from the outside during processing while providing access to the interior for maintenance with minimal downtime , Are considered to have attributes. In that regard, various embodiments of a gas enclosure assembly that have utility for various air-sensitive processes that require an inert environment include multiple wall frames and ceiling frame members that can be sealed together. be able to. In some embodiments, the plurality of wall frames and ceiling frame members can be fastened together using reusable fasteners, such as bolts and threaded holes. For various embodiments of gas enclosure assemblies according to the present teachings, a plurality of frame members, each frame member comprising a plurality of panel frame sections, can be constructed to define a gas enclosure frame assembly. Various embodiments of the gas enclosure assembly can include an auxiliary enclosure constructed as a section of the gas enclosure assembly that can be sealably isolated from a working volume of a gas enclosure system, such as a printing system enclosure. For example, such physical isolation of the auxiliary enclosure from the printing system enclosure can be accomplished by various procedures, such as, but not limited to, various maintenance procedures on the printhead assembly with little or no interruption in the printing process. Can be performed, thereby minimizing or eliminating downtime of the gas enclosure system.

  The gas enclosure assembly of the present teachings can be designed to accommodate printing systems, such as OLED printing systems, in a manner that can minimize the volume of the enclosure surrounding the system. Various embodiments of the gas enclosure assembly are constructed in a manner that minimizes the internal volume of the gas enclosure assembly and at the same time optimizes the working space to accommodate different footprints of different OLED printing systems. Can do. In accordance with various embodiments of the gas enclosure system of the present teachings, an OLED printing system includes a pressurized inert gas recirculation system such as a granite base, a movable bridge capable of supporting an OLED printing device, a substrate floating table, and the like. Inkjet for depositing OLED film-forming material on a substrate, including one or more devices and apparatus extending from various embodiments, air bearings, tracks, rails, OLED ink supply subsystem and inkjet printhead A printer system, one or more robots, and the like can be provided. Considering the various components that can comprise an OLED printing system, various embodiments of the OLED printing system can have various footprints and form factors. Various embodiments of gas enclosure assemblies so constructed additionally provide immediate access to the interior of the gas enclosure assembly from the outside during processing, for maintenance while minimizing downtime Immediate access to the interior. In that regard, various embodiments of a gas enclosure assembly according to the present teachings can be profiled for various footprints of various OLED printing systems. According to various embodiments, once the contour frame member is constructed to form the gas enclosure frame assembly, the various types of panels comprise a plurality of frame members so as to complete the installation of the gas enclosure assembly. It may be installed in the panel section so that it can be sealed. Various embodiments of the gas enclosure assembly include, for example, a plurality of frame members, and a plurality for installation in a panel frame section, including but not limited to a plurality of wall frame members and at least one ceiling frame member. Panels may be fabricated at one or more locations and then built at another location. Also, considering the transportable nature of the components used to construct the gas enclosure assembly of the present teachings, various embodiments of the gas enclosure assembly may be repeatedly installed and removed throughout the construction and destruction cycle. it can.

  In order to ensure that the gas enclosure is sealed, various embodiments of the gas enclosure assembly of the present teachings provide for joining each frame member to provide a frame seal. The interior can be sufficiently sealed, for example by tight fitting intersections between various frame members, including gaskets or other seals. Once fully constructed, the sealed gas enclosure assembly can include an interior and a plurality of interior corner edges, at least one interior corner edge being provided at the intersection of each frame member with an adjacent frame member. One or more of the frame members, for example, at least half of the frame members have one or more compressible gaskets secured along their respective one or more edges. Can be provided. One or more compressible gaskets can be configured to create a sealed gas enclosure assembly once the frame members are joined together and the hermetic panel is installed. A sealed gas enclosure assembly can be formed having an inner edge of the frame member that is sealed by a plurality of compressible gaskets. For each frame member, for example, but not limited to, providing one or more compressible gaskets on the inner wall frame surface, top wall frame surface, vertical sidewall frame surface, bottom wall frame surface, and combinations thereof Can do.

  For various embodiments of the gas enclosure assembly, each frame member receives any of a variety of panel types that can be hermetically installed within each section to provide a hermetic panel for each panel. A plurality of sections can be provided that are framed and machined. In various embodiments of the gas enclosure assembly of the present teachings, each segment frame is constructed using a selected fastener so that each panel installed in each segment frame is for each panel and is therefore fully constructed. A segmented frame gasket can be provided to ensure that a hermetic seal for the gas enclosure can be provided. In various embodiments, the gas enclosure assembly can have one or more of the window panels or inspection windows in each of the wall panels, each window panel or inspection window having at least one Can have a glove port. Each glove port can be fitted with a glove so that the glove can extend into the interior during assembly of the gas enclosure assembly. According to various embodiments, each glove port can have hardware for mounting the glove, such hardware to minimize leakage or molecular diffusion through the glove port. Utilize a gasket seal around each glove port that provides a hermetic seal. For the various embodiments of the gas enclosure assembly of the present teachings, the hardware is further designed to provide the end user with ease of glove port cap attachment and removal.

  Various embodiments of a gas enclosure system according to the present teachings can include a gas enclosure assembly formed from a plurality of frame members and panel sections, and gas circulation, filtration, and purification components. For various embodiments of the gas enclosure system, piping may be installed during the assembly process. According to various embodiments of the present teachings, the tubing can be installed in a gas enclosure frame assembly constructed from a plurality of frame members. In various embodiments, the tubing can be installed on multiple frame members before being joined to form a gas enclosure frame assembly. The piping for the various embodiments of the gas enclosure system is such that substantially all gas drawn into the piping from one or more piping inlets removes particulate matter inside the gas enclosure system. The gas filtration loop can be configured to be moved through various embodiments. In addition, the piping of various embodiments of the gas enclosure system may be configured to separate the inlet and outlet of the gas purification loop external to the gas enclosure assembly from the gas filtration loop internal to the gas enclosure assembly. it can. According to various embodiments of the gas enclosure system of the present teachings, the gas circulation and filtration system can be in fluid communication with, for example, but not limited to, components of the particle control system. For various embodiments of the gas enclosure assembly, the gas circulation and filtration system can be in fluid communication with the service bundle housing exhaust system. For various embodiments of the gas enclosure assembly, the gas circulation and filtration system can be in fluid communication with the printhead assembly exhaust system. In various embodiments of the gas enclosure system, the various components of the particle control system in fluid communication with the gas circulation and filtration system provide a low particle zone proximal to the substrate positioned in the printing system. be able to.

  For example, a gas enclosure system can have a gas circulation and filtration system within the gas enclosure assembly. Such an internal filtration system can have a plurality of fan filter units within the interior and can be configured to provide a laminar flow of gas within the interior. The laminar flow can be in the direction from the top of the interior to the bottom of the interior, or in any other direction. The gas flow produced by the circulation system need not be laminar, but laminar flow of gas can be used to ensure a thorough and complete gas turnover inside. A laminar flow of gas can also be used to minimize turbulence, which causes particles in the environment to collect in the region of such turbulence, and the filtration system This is undesirable because it can hinder the removal of these particles from the environment. Furthermore, in order to maintain the desired temperature internally, for example, a heat regulation system utilizing a plurality of heat exchangers operating with, adjacent to or in conjunction with a fan or another gas circulation device. Can be provided. The gas purification loop may be configured to circulate gas from within the interior of the gas enclosure assembly through at least one gas purification component external to the enclosure. In that regard, the internal circulation and filtration system of the gas enclosure assembly, in conjunction with the gas purification loop external to the gas enclosure assembly, has a substantially low level of reactive species throughout the gas enclosure system. A continuous circulation of the inert gas of the particles can be provided.

  In addition to providing gas circulation, filtration and purification components, the tubing can be sized and shaped to accommodate at least one service bundle therein. According to the present teachings, service bundles can include, but are not limited to, for example, optical cables, electrical cables, wires, and various fluid-containing tubing and the like. Various embodiments of the service bundle of the present teachings may have a significant dead volume created by gaps formed between the various components of the service bundle. The massive dead volume that can be created in bundling various optical cables, electrical cables, wires, and fluid-containing tubing voids a significant amount of reactive atmospheric species such as water, water vapor, oxygen, and the like Can be trapped in. Such significant amounts of occluded reactive atmospheric species can be difficult to remove rapidly by a purification system. In addition, such service bundles are identified particulate matter sources. In some embodiments, any combination of cables, wires and wire bundles, and fluid-containing tubing can be disposed substantially within the piping, each housed within a gas enclosure system. Operatively associated with at least one of an optical system, an electrical system, a mechanical system, and a cooling system. The gas circulation, filtration, and purification components can be configured so that essentially all circulated inert gas is drawn through the piping, so that the bundled components are substantially piping. By including within, it is possible to effectively remove both particulate matter arising from such bundles as well as atmospheric components confined in the dead volume of various bundled materials.

  Various embodiments of gas enclosure systems in accordance with the present teachings include gas enclosure assemblies formed from a plurality of frame members and panel sections, as well as particle control systems, gas circulation, filtration, and purification components, as well as non-pressurized Various embodiments of the active gas recirculation system can be included. Such a pressurized inert gas recirculation system can be utilized in the operation of an OLED printing system for a variety of pneumatically driven devices and apparatus, substantially as discussed in more detail herein. it can.

  In accordance with the present teachings, several engineering challenges have been addressed to provide various embodiments of a pressurized inert gas recirculation system in a gas enclosure system. First, under typical operation of a gas enclosure system without a pressurized inert gas recirculation system, external gas or air enters the interior when any leak occurs in the gas enclosure system. To protect against this, the gas enclosure system can be maintained at a slightly positive internal pressure relative to the external pressure. For example, under typical operation, for various embodiments of the gas enclosure system of the present teachings, the interior of the gas enclosure system is, for example, at least 2 mbarg of pressure to the ambient atmosphere outside the enclosure system, for example, at least 4 mbarg. The pressure can be maintained at a pressure of at least 6 mbarg, at a pressure of at least 8 mbarg, or higher. Maintaining a pressurized inert gas recirculation system within a gas enclosure system simultaneously maintains a slight positive internal pressure of the gas enclosure system while continuously introducing pressurized gas into the gas enclosure system Can be difficult because it presents a dynamic and continuous balancing effect. Further, the variable requirements of various devices and apparatuses can create irregular pressure profiles for various gas enclosure assemblies and systems of the present teachings. Maintaining the dynamic pressure balance of the gas enclosure system maintained at a slight positive pressure relative to the external environment under such conditions can provide the integrity of a continuous OLED printing process.

  For various embodiments of a gas enclosure system, a pressurized inert gas recirculation system according to the present teachings may utilize a pressurized, at least one of a compressor, an accumulator, and a blower, and combinations thereof. Various embodiments of inert gas loops can be included. Various embodiments of the pressurized inert gas recirculation system, including various embodiments of the pressurized inert gas loop, provide the internal pressure of the inert gas within the gas enclosure system of the present teachings at a stable specified value. You can have a specially designed pressure control bypass loop that you can do. In various embodiments of the gas enclosure system, the pressurized inert gas recirculation system includes a pressure control bypass loop when the pressure of the inert gas in the accumulator of the pressurized inert gas loop exceeds a preset threshold pressure. The pressurized inert gas can be recirculated through the air. The threshold pressure is, for example, in the range between about 25 psig to about 200 psig, or more specifically in the range between about 75 psig to about 125 psig, or more specifically, between about 90 psig to about 95 psig. Can be in range. In that regard, a gas enclosure system of the present teachings having a pressurized inert gas recirculation system with various embodiments of specially designed pressure control bypass loops can be used in a pressurized inert gas recycle within an airtight gas enclosure. The balance of having a circulation system can be maintained.

  According to the present teachings, various devices and apparatuses can be disposed therein, and various pressurized gas sources such as at least one of a compressor, a blower, and combinations thereof can be utilized. Can be in fluid communication with various embodiments of a pressurized inert gas recirculation system having multiple pressurized inert gas loops. For various embodiments of the gas enclosure and system of the present teachings, the use of various pneumatically operated devices and apparatus can provide low particle generation performance and is less cumbersome to maintain. Exemplary devices and apparatus that can be placed within a gas enclosure system and in fluid communication with various pressurized inert gas loops include, for example, pneumatic robots, substrate floating tables, air bearings, air bushings, compressed gas This can include, but is not limited to, one or more of tools, pneumatic actuators, and combinations thereof. Substrate floating tables, as well as air bearings, can be used for various aspects of operating an OLED printing system in accordance with various embodiments of the gas enclosure system of the present teachings. For example, a substrate floating table that utilizes air bearing technology can be used to transport the substrate to a fixed position in the printhead chamber as well as to support the substrate during the OLED printing process.

  FIG. 1A is a right front perspective view of a gas enclosure assembly 100 in accordance with various embodiments of the present teachings. The gas enclosure assembly 100 can be integrated with various components to provide various embodiments of the gas enclosure system of the present teachings. The gas enclosure system of the present teachings may contain one or more gases for maintaining an inert environment within the gas enclosure assembly, as well as components for maintaining a substantially low particle environment. it can. As a non-limiting example, various embodiments of a gas enclosure system can include a gas circulation and filtration system and a purification component for removing reactive species from the recycled inert gas, It can have a control system and can have various embodiments of a pressurized inert gas recirculation system. Accordingly, various embodiments of the gas enclosure system of the present teachings can be useful in maintaining an inert, substantially low particle gas atmosphere therein.

  For example, FIG. 1B is a left front perspective view of various embodiments of a gas enclosure system 500. FIG. 1B depicts a gas enclosure system 500 that can include various embodiments of the gas enclosure assembly 100. The gas enclosure system 500 can have a load lock inlet chamber 1110, which can have an inlet gate 1112. The gas enclosure system 500 of FIG. 1B provides a constant supply of inert gas to the gas enclosure assembly 100 having reactive atmospheric species such as water vapor and oxygen, and substantially lower levels of organic solvent vapor resulting from the OLED printing process. A gas purification system 3130 for providing may be included. According to the present teachings, the inert gas may be any gas that does not undergo a chemical reaction under a defined set of conditions. Some commonly used non-limiting examples of inert gases can include nitrogen, any of the noble gases, and any combination thereof. Various embodiments of gas purification systems according to the present teachings, such as purification system 3130 of FIG. 1B, provide various levels of various reactive species, including various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapors. , 100 ppm or lower, such as 10 ppm or lower, 1.0 ppm or lower, or 0.1 ppm or lower.

  The gas enclosure system 500 of FIG. 1B can also have a controller system 1130 for system control functions. For example, the system controller 1130 can include one or more processor circuits (not shown) in communication with one or more memory circuits (not shown). The system controller 1130 can also communicate with a loadlock inlet chamber 1110, an outlet chamber (not shown), and finally a printing nozzle of an OLED printing system that can be housed in the gas enclosure system 500. In this way, the system controller 1130 can adjust, for example, the opening of the gate 1112 in the load lock inlet chamber 1110 to allow entry of the substrate into the gas enclosure system 500. The system controller 1130 can control various system functions such as controlling ink dispensing to the print nozzles of the OLED printing system. The gas enclosure system 500 of FIG. 1B is configured to include and protect an air sensitive process such as printing various inks useful for creating an OLED stack using a commercial printing system. Examples of atmospheric gases that react to OLED inks include water vapor and oxygen, and various organic vapors from, for example, organic solvents used as carriers for various OLED inks. As previously discussed herein, while the gas enclosure assembly 100 can be configured to maintain a sealed atmosphere and allow the component or printing system to operate effectively, The gas enclosure system 500 can provide all the components necessary to maintain an inert environment. In addition, the gas enclosure 500 includes, as non-limiting examples, a gas circulation and filtration system, a low particle generation X-axis linear bearing system for moving the printhead assembly relative to the substrate, a service bundle housing discharge system, and There may be a particle control system that provides a low particle zone proximal to the substrate, which may include components such as a printhead assembly ejection system.

  As depicted in FIG. 1A, various embodiments of the gas enclosure assembly 100 include a front or first wall panel 210 ′, a left or second wall panel (not shown), a right or third wall panel. 230 ′, a rear or fourth wall panel (not shown), and a component part including a ceiling panel 250 ′, the gas enclosure assembly can rest on a base (not shown). Can be attached to pan 204. As discussed in more detail later herein, various embodiments of the gas enclosure assembly 100 of FIG. 1A include a front or first wall frame 210, a left or second wall frame (not shown), It can be constructed from a right or third wall frame 230, a rear or fourth wall panel (not shown), and a ceiling frame 250. Various embodiments of the ceiling frame 250 can include a fan filter unit cover 103, a first ceiling frame duct 105, and a first ceiling frame duct 107. According to embodiments of the present teachings, various types of section panels may be installed in any of a plurality of panel sections that include a frame member. In various embodiments of the gas enclosure 100 of FIG. 1, the sheet metal panel section 109 can be welded into the frame member during frame construction. For various embodiments of the gas enclosure assembly 100, the type of section panel that can be repeatedly installed and removed through the gas enclosure assembly build and break cycle is an inset panel as shown for the wall panel 210 '. 110, as well as a window panel 120 and an easily removable inspection window 130 as shown for wall panel 230 '.

  An easily removable inspection window 130 can provide immediate access to the interior of the enclosure 100, but can be used to provide access to the interior of the gas enclosure system for repair and routine inspection purposes. Any panel that is retractable can be used. Such access for inspection or repair can provide end-user glove access from outside the gas enclosure assembly to the inside of the gas enclosure assembly during use, and easily removable. Differentiated from access provided by a panel such as inspection window 130. For example, as shown in FIG. 1A for panel 230, any of the gloves, such as a globe 142 attached to the globe port 140, can provide end user access to the interior during use of the gas enclosure system. .

  FIG. 2 depicts an exploded view of various embodiments of the gas enclosure assembly depicted in FIG. 1A. Various embodiments of the gas enclosure assembly can be attached to a pan 204 that rests on the base 202, as shown in FIG. There can be multiple wall panels including a perspective view, an internal perspective view of the right wall panel 230 ', an internal perspective view of the rear wall panel 240', and a top perspective view of the ceiling panel 250 '. The OLED printing system can be placed on the pan 204 and the printing process is known to be sensitive to atmospheric conditions. In accordance with the present teachings, the gas enclosure assembly includes frame members, such as wall frame 210 of wall panel 210 ', wall frame 220 of wall panel 220', wall frame 230 of wall panel 230 ', wall frame 240 of wall panel 240'. , And the ceiling frame 250 of the ceiling panel 250 ', and then a plurality of section panels can be installed therein. In that regard, it may be desirable to streamline the design of the partition panel that can be repeatedly installed and removed through the cycle of construction and destruction of various embodiments of the gas enclosure assembly of the present teachings. Also, the gas enclosure assembly 100 can be contoured to accommodate the footprint of various embodiments of the OLED printing system to minimize the amount of inert gas required in the gas enclosure assembly. And provides immediate access to the end user both during use and maintenance of the gas enclosure assembly.

  Using the front wall panel 210 'and the left wall panel 220' by way of example, various embodiments of the frame member can have a sheet metal panel section 109 that is welded into the frame member during frame member construction. The snap-in panel 110, the window panel 120, and the easily removable inspection window 130 can be installed in each of the wall frame members and are repeated throughout the construction and disassembly cycle of the gas enclosure assembly 100 of FIG. Can be installed and removed. As shown, in the wall panel 210 ′ and wall panel 220 ′ embodiments, the wall panel can have a window panel 120 proximal to the easily removable inspection window 130. Similarly, as depicted by exemplary back wall panel 240 ′, the wall panel can have a window panel, such as window panel 125, having two adjacent globe ports 140. As seen for various embodiments of wall frame members in accordance with the present teachings, and for the gas enclosure assembly 100 of FIG. 1A, such an arrangement of gloves facilitates the exterior of the gas enclosure to component parts within the enclosure system. Provide secure access. Thus, various embodiments of the gas enclosure allow the end user to expand the left and right globes into the interior and move one or more in the interior without disturbing the composition of the gas atmosphere within the interior. Two or more glove ports can be provided so that more items can be manipulated. For example, either the window panel 120 or the inspection window 130 can be positioned to facilitate easy access from outside the gas enclosure assembly to adjustable components inside the gas enclosure assembly. According to various embodiments of window panels, such as window panel 120 and inspection window 130, such windows may not include the glove port and glove port assembly when no end-user access through the glove port glove is indicated. Good.

  Various embodiments of wall and ceiling panels as depicted in FIG. 2 can have multiple fit panels 110. As can be seen in FIG. 2, the inset panel can have various shapes and aspect ratios. In addition to the fitted panel, the ceiling panel 250 ′ is mounted on the fan filter unit cover 103 as well as the ceiling frame 250, and is bolted, screwed, fixed, or otherwise fixed first. There may be a ceiling frame duct 105 and a second ceiling frame duct 107. As discussed in more detail later herein, the piping in fluid communication with the duct 107 of the ceiling panel 250 'can be installed within the interior of the gas enclosure assembly. In accordance with the present teachings, such piping may be part of a gas circulation system internal to the gas enclosure assembly and gas for circulation through at least one gas purification component external to the gas enclosure assembly. Separating the flow exiting the enclosure assembly is provided.

  FIG. 3 is an exploded front perspective view of a frame member assembly 200 in which the wall frame 220 can be constructed to include a complete complement of panels. While not limited to the design shown, as an illustration of various embodiments of a frame member assembly according to the present teachings, a frame member assembly 200 using a wall frame 220 can be used. Various embodiments of the frame member assembly may consist of various frame members and section panels installed in various frame panel sections of the various frame members in accordance with the present teachings.

  In accordance with various embodiments of various frame member assemblies of the present teachings, the frame member assembly 200 can comprise a frame member, such as a wall frame 220. For various embodiments of gas enclosure assemblies, such as the gas enclosure assembly 100 of FIG. 1A, processes that may utilize equipment contained in such gas enclosure assemblies include not only sealed enclosures that provide an inert environment, but also particles. An environment that is substantially free of particulate matter may also be required. In that regard, frame members according to the present teachings may utilize variously sized metal tube materials for the construction of various embodiments of the frame. Such metal tube materials address the desired material attributes, including, but not limited to, high integrity materials that will not decompose to produce particulate matter, and high strength as well as optimal Produces heavy weight frame members and provides for immediate transport, construction, and destruction of gas enclosure assemblies from one site to another with various frame members and panel sections. In accordance with the present teachings, any material that meets these requirements can be utilized to make the various frame members according to the teachings.

  For example, various embodiments of frame members according to the present teachings, such as frame member assembly 200, can be constructed from extruded metal tubing. According to various embodiments of the frame member, aluminum, steel, and various metal composites may be utilized to construct the frame member. In various embodiments, for example, but not limited to, 2 inches wide × 2 inches high, 4 inches wide × 2 inches high, and 4 inches wide to construct various embodiments of the frame members of the present teachings. X Metal tubing having a height of 4 inches and a wall thickness of 1/8 inch to 1/4 inch can be used. In addition, producing frame members that have material attributes, including but not limited to high integrity materials that will not decompose to produce particulate matter, and that have high strength and optimal weight In addition, various tubes or other forms of various reinforcing fiber polymer composites are available that provide immediate transport, construction, and breakage from one site to another.

  With regard to the construction of various frame members from variously sized metal tube materials, it is contemplated that welding can be performed to create various embodiments of frame welds. In addition, the construction of various frame members from variously sized building materials can be performed using a suitable industrial adhesive. It is contemplated that the construction of the various frame members should take place in a manner that would essentially create no leakage path through the frame members. In that regard, the construction of the various frame members can be performed using any approach that essentially does not create a leak path through the frame members of the various embodiments of the gas enclosure assembly. Further, various embodiments of frame members according to the present teachings, such as the wall frame 220 of FIG. 2, may be painted or coated. A coating or coating that prevents the formation of particulate matter for various embodiments of a frame member made of a metal tubing material, for example, where the material formed on the surface can create particulate matter, which is susceptible to oxidation Or other surface treatments such as anodization can be performed.

  A frame member assembly, such as the frame member assembly 200 of FIG. 3, can have a frame member, such as a wall frame 220. The wall frame 220 can have a top 226 on which the top wall frame spacer plate 227 can be fastened, as well as a bottom 228 on which the bottom wall frame spacer plate 229 can be fastened. As will be discussed in more detail later in this specification, the spacer plate mounted on the surface of the frame member is combined with the gasket seal of the panel mounted in the frame member section in conjunction with the gas according to the present teachings. FIG. 5 is a part of a gasket sealing system that provides a seal for various embodiments of an enclosure assembly. FIG. A frame member, such as the wall frame 220 of the frame member assembly 200 of FIG. 3, can have a number of panel frame sections, each of which includes, but is not limited to, a mating panel 110, a window panel 120, and easily removable. Various types of panels, such as sex inspection windows 130, may be processed. Various types of panel sections can be formed by construction of the frame members. The types of panel sections may be, for example, an inset panel section 10 for receiving an inset panel 110, a window panel section 20 for receiving a window panel 120, and an inspection for receiving an easily removable inspection window 130. A window panel section 30 can be included, but is not limited thereto.

  Each type of panel section can have a panel section frame that receives the panel, resulting in each panel being sealably fastened into each panel section in accordance with the present teachings to construct a sealed gas enclosure assembly. be able to. For example, in FIG. 3 depicting a frame assembly according to the present teachings, the inset panel section 10 is shown having a frame 12, the window panel section 20 is shown having a frame 22, and the inspection window panel section 30 is , Frame 32 is shown. For various embodiments of the wall frame assembly of the present teachings, the various panel section frames may be sheet metal material that is welded into the panel section with a continuous weld bead to provide a seal. For the various embodiments of the wall frame assembly, the various panel section frames are selected from reinforcing fiber polymer composites that can be mounted in the panel section using a suitable industrial adhesive. Can be made from a variety of sheet materials. As discussed in further detail in the subsequent teachings on sealing, each panel section frame is designed to ensure that an airtight seal can be formed for each panel installed and fastened in each panel section. It can have a compressible gasket disposed thereon. In addition to the panel section frame, each frame member section may have hardware related to positioning the panel and securing the panel within the panel section.

  Various embodiments of the panel frame 122 for the snap-in panel 110 and the window panel 120 can be constructed from sheet metal materials such as, but not limited to, various alloys of aluminum, aluminum and stainless steel. The attributes for the panel material may be the same as the attributes for the structural material making up the various embodiments of the frame member. In that regard, materials having attributes for various panel members include, but are not limited to, high integrity materials that will not decompose to produce particulate matter and from one site to another. Produce panels with high strength as well as optimal weight to provide immediate transport, construction, and breakage. For example, various embodiments of the honeycomb core sheet material may have the necessary attributes for use as a panel material for the construction of a panel frame 122 for an inset panel 110 and a window panel 120. The honeycomb core sheet material can be made of various materials, both metals, and metal composite materials and polymers, and polymer composite honeycomb core sheet materials. Various embodiments of the removable panel when fabricated from metal material have a ground connection included in the panel to ensure that the entire structure is grounded when the gas enclosure assembly is constructed. Can have.

  In view of the transportable nature of the components used to construct the gas enclosure assembly of the present teachings, various embodiments of the partition panel of the present teachings provide for access to the interior of the gas enclosure assembly. Any of them can be repeatedly installed and removed during use of the gas enclosure system.

  For example, the panel section 30 for receiving an easily removable inspection window panel 130 can have a set of four spacers, one of which is shown as a window guide spacer 34. In addition, the panel section 30 constructed to receive the easily removable inspection window panel 130 was mounted on the inspection window frame 132 for each of the easily removable inspection windows 130. A set of four counteracting toggle clamps 136 can be used to have a set of four clamping cleats 36 that can be used to clamp the inspection window 130 into the inspection window panel section 30. Further, each two of the window handles 138 can be easily mounted on the removable inspection window frame 132 to provide the end user with ease of removal and installation of the inspection window 130. The number, type, and arrangement of removable inspection window handles can be varied. In addition, inspection window panel sections 30 for receiving easily removable inspection window panels 130 have at least two window clamps 35 that are selectively installed within each inspection window panel section 30. Can do. Although depicted as being in the top and bottom of each of the inspection window panel sections 30, the at least two window clamps are in any manner that acts to secure the inspection window 130 within the panel section frame 32. Can be installed at. A tool can be used to remove and install the window clamp 35 to allow the inspection window 130 to be removed and reinstalled.

  The hardware installed on the panel section 30, including the counter-acting toggle clamp 136 of the inspection window 130, and the clamping cleat 36, the window guide spacer 34, and the window clamp 35, can be any suitable material and combination of materials. Can be built. For example, one or more such elements can include at least one metal, at least one ceramic, at least one plastic, and combinations thereof. The removable inspection window handle 138 can be constructed of any suitable material, as well as combinations of materials. For example, one or more such elements can include at least one metal, at least one ceramic, at least one plastic, at least one rubber, and combinations thereof. The enclosure window, such as window 124 of window panel 120 or window 134 of inspection window 130, can include any suitable material, as well as combinations of materials. According to various embodiments of the gas enclosure assembly of the present teachings, the enclosure window can include transparent and translucent materials. In various embodiments of the gas enclosure assembly, the enclosure window can be, for example, but not limited to, silica-based materials such as glass and quartz, and various types such as, but not limited to, various classes of polycarbonate, acrylic, and vinyl. Types of polymeric materials can be included. In accordance with the systems and methods of the present teachings, the transparent and translucent properties of various composite materials and combinations thereof are desirable attributes for exemplary window materials.

  As discussed in the following teachings with respect to FIGS. 8A-9B, both wall and ceiling frame member seals in conjunction with hermetic section panel frame seals are used in sealed gas enclosure assemblies for air sensitive processes that require an inert environment. Various embodiments are provided. Contributing to providing a substantially low concentration of reactive species, as well as a substantially low particle environment, the components of the gas enclosure system include highly effective gas circulation and sealing gas enclosure assemblies, and piping. A particle filtration system can be included, but is not limited thereto. Providing an effective seal for a gas enclosure assembly can be difficult, especially when the three frame members are mated together to form a three-sided joint. Thus, the three side joint seal presents a particularly difficult challenge with regard to providing an easily installable seal for a gas enclosure assembly that can be assembled and disassembled through a build and break cycle.

  In that regard, various embodiments of gas enclosure assemblies in accordance with the present teachings provide a fully constructed gas enclosure system seal through an effective gasket seal of the joints, as well as of load bearing building components. Provide an effective gasket seal around. Unlike conventional joint seals, joint seals according to the present teachings are: 1) Uniform of adjacent gasket sections from orthogonally oriented gasket lengths in top and bottom end frame joint connections where three frame members are joined. Includes parallel alignment, thereby avoiding angular seam alignment and sealing, 2) providing for forming adjacent lengths across the entire width of the joint, thereby reducing the sealing contact area in a three-sided joint connection 3) Designed with spacer plates that provide uniform compressive force across all vertical and horizontal, and top and bottom three side bonded gasket seals. In addition, the choice of gasket material can affect the effectiveness of providing a seal, which will be discussed later.

4A-4C are top schematic views depicting a comparison of a conventional three side bonded seal with a three side bonded seal according to the present teachings. According to various embodiments of the gas enclosure assembly of the present teachings, for example, but not limited to, a plurality of vertical, horizontal, and three side joints that can be joined to form a gas enclosure assembly and that require sealing. There may be at least four wall frame members, ceiling frame members, and pans that create In FIG. 4A, there is a top schematic view of a conventional three side gasket seal formed from a first gasket I that is oriented orthogonally to gasket II in the XY plane. As shown in FIG. 4A, the seam formed from orthogonal orientations in the XY plane has a contact length W ₁ between the two compartments defined by the width dimension of the gasket. In addition, the end portion of gasket III, which is a gasket oriented perpendicular to both gasket I and gasket II in the vertical direction, can be adjacent to gasket I and gasket II, as indicated by the hatched lines. In FIG. 4B, a conventional three side bonded gasket seal formed from the first gasket length I having a seam that is perpendicular to the second gasket length II and joins the 45 ° faces of both lengths. There is schematic top view, seam has a contact length W ₂ between the width is greater than two sections of the gasket material. Similar to the configuration of FIG. 4A, the end portion of gasket III that is perpendicular to both gasket I and gasket II in the vertical direction can be adjacent to gasket I and gasket II, as indicated by the diagonal lines. . When the gasket width is assumed to be the same in FIGS. 4A and 4B, the contact length _{W 2} of FIG. 4B is larger than the contact length _{W 1} in FIG. 4A.

FIG. 4C is a top schematic view of a three side bonded gasket seal in accordance with the present teachings. The first gasket length I can have a gasket section I ′ formed at right angles to the direction of the gasket length I, which includes the various wall frame members of the gas enclosure assembly of the present teachings. Having a length, which may be the size of the width of the substantially joined structural components, such as a metal tube 4 inches wide x 2 inches high or 4 inches wide x 4 inches high used to form . The gasket II has a gasket section II ′ that is perpendicular to the gasket I in the XY plane and has an overlap length with the gasket section I ′ that is the width of the structural components that are approximately joined. The width of the gasket sections I ′ and II ′ is the width of the compressible gasket material selected. Gasket III is orthogonally oriented with respect to both gasket I and gasket II in the vertical direction. Gasket section III ′ is the end portion of gasket III. Gasket section III ′ is formed from the orthogonal orientation of gasket section III ′ with respect to the vertical length of gasket III. The gasket section III ′ can be formed to have a length that is approximately the same length as the gasket sections I ′ and II ′ and the thickness of the compressible gasket material selected. In that regard, the contact length W ₃ of the three matching section shown in Figure 4C, respectively, have a contact length W ₁ and W _2, a conventional triangular joint seal shown in one of FIGS. 4A or FIG. 4B Bigger than.

  In that regard, a three-sided joint gasket seal according to the present teachings, as shown in FIG. 4A or FIG. 4B, would otherwise be an orthogonally matched gasket, and a uniform parallel of the gasket sections at the end joint connection. Create alignment. Such a uniform parallel alignment of the three side bonded gasket sealed compartments promotes a uniform lateral sealing force across the compartments to promote a sealed three side bonded seal at the top and bottom corners of the joint formed from the wall frame member. Is provided. In addition, each section of the uniformly aligned gasket section for each three-sided joint seal is selected to be approximately the width of the structural component being joined, and the maximum contact length of the uniformly aligned section is maximized. provide. Also, joint seals according to the present teachings are designed with spacer plates that provide uniform compressive forces across all vertical, horizontal, and three side gasket seals of building joints. It can be argued that the width of the gasket material selected for the conventional three-sided seal given for the embodiment of FIG. 6A or 6B can be at least the width of the structural components being joined.

  The exploded perspective view of FIG. 5A depicts a sealing assembly 300 according to the present teachings before all the frame members are joined such that the gasket is depicted in an uncompressed state. In FIG. 5A, a plurality of wall frame members, such as wall frame 310, wall frame 350, and ceiling frame 370, are sealably joined in a first step of building a gas enclosure from various components of the gas enclosure assembly. be able to. A frame member seal according to the present teachings provides for a seal that can be implemented through a cycle of construction and destruction of the gas enclosure assembly, while providing a fully constructed gas enclosure assembly to be sealed. is there. The embodiments listed in the following teachings for FIGS. 5A-5B are for sealing a portion of a gas enclosure assembly, but such teachings are generally incorporated in any of the gas enclosure assemblies of the present teachings. Applied.

  The first wall frame 310 depicted in FIG. 5A has an inner side 311 on which the spacer plate 312 is placed, a vertical side surface 314, and a top surface 315 on which the spacer plate 316 is placed. Can have. The first wall frame 310 can have a first gasket 320 disposed in and bonded to the space formed from the spacer plate 312. The gap 302 remaining after the first gasket 320 is placed in and bonded to the space formed by the spacer plate 312 extends over the vertical length of the first gasket 320 as shown in FIG. 5A. Can do. As depicted in FIG. 5A, the flexible gasket 320 can be placed in and bonded to the space formed from the spacer plate 312, the vertical gasket length 321, the curved gasket length 323, and the inner frame member 311. There may be a gasket length 325 formed at 90 ° in-plane with respect to the vertical gasket length 321 above and terminating at the vertical side 314 of the wall frame 310. In FIG. 5A, the first wall frame 310 can have a top surface 315 on which the spacer plate 316 rests, whereby a second gasket 340 is disposed on the wall frame 310. Forming a space on the surface 315 that is bonded proximal to the inner edge 317 of the surface. The gap 304 remaining after the second gasket 340 is placed in and bonded to the space formed from the spacer plate 316 extends over the horizontal length of the second gasket 340 as shown in FIG. 5A. Can do. Further, as indicated by the diagonal lines, the length 345 of the gasket 340 is uniformly parallel to the length 325 of the gasket 320 and is aligned adjacently.

  The second wall frame 350 depicted in FIG. 5A can have an outer frame side 353, a vertical side 354, and a top surface 355 on which the spacer plate 356 rests. The second wall frame 350 can have a first gasket 360 disposed in and bonded to the first gasket space formed from the spacer plate 356. The gap 306 remaining after the first gasket 360 is placed in and bonded to the space formed from the spacer plate 356 extends the horizontal length of the first gasket 360, as shown in FIG. 5A. Can do. As depicted in FIG. 5A, the flexible gasket 360 has a vertical length 361, a curved length 363, and a length 365 that is formed at 90 ° in-plane on the top surface 355 and terminates at the outer frame member 353. be able to.

  As shown in the exploded perspective view of FIG. 5A, the inner frame member 311 of the wall frame 310 may be joined to the vertical side 354 of the wall frame 350 to form one architectural joint of the gas enclosure frame assembly. it can. With respect to the sealing of the building joint so formed, various embodiments of gasket sealing in the end-joining connection of wall frame members according to the present teachings depicted in FIG. 5A include gasket 320 length 325, gasket 360 length. 365 and length 345 of gasket 340 are all aligned adjacently and uniformly. In addition, as discussed in more detail later in this specification, various embodiments of the spacer plate of the present teachings are compressible used to seal various embodiments of the gas enclosure assembly of the present teachings. A uniform compression of between about 20% to about 40% of the deflection gasket material can be provided.

  FIG. 5B depicts a sealing assembly 300 according to the present teachings after all frame members have been joined such that the gasket is depicted in a compressed state. FIG. 5B shows details of a three side joint angular seal formed in a top end joint connection between the first wall frame 310, the second wall frame 350, and the ceiling frame 370, shown in perspective. It is a perspective view shown. As shown in FIG. 5B, the gasket space defined by the spacer plate provides vertical, horizontal, and three side gasket seals when joining the wall frame 310, wall frame 350, and ceiling frame 370, shown in perspective. Uniform compression of deflection between about 20% to about 40% of the compressible gasket material to form ensures that the gasket seal at all surfaces sealed at the joints of the wall frame members can provide a seal. It can be determined that the width is as follows. In addition, gasket gaps 302, 304, and 306 (not shown) may be used when the gasket 340 and gasket of FIG. Dimensioned to be able to fill the gasket gap as shown for 360. Thus, in addition to providing uniform compression by defining a space in which each gasket is placed and bonded, various embodiments of spacer plates that are designed to provide a gap also include: Each compressed gasket can be matched within the space defined by the spacer plate without creating wrinkles or bumps, or otherwise irregularly forming in a compressed state, in a manner that can form a leak path Also make sure.

  According to various embodiments of the gas enclosure assembly of the present teachings, compressible gasket material disposed on each of the panel segment frames can be used to seal various types of segment panels. In conjunction with the frame member gasket seal, the location and material of the compressible gasket used to form a seal between the various segment panels and the panel segment frame can be used to seal gas with little or no gas leakage. An enclosure assembly can be provided. In addition, hermetic designs for all types of panels, such as the snap-in panel 110, window panel 120, and easily removable inspection window 130 of FIG. 3, can be used, for example, inside a gas enclosure assembly for maintenance. A durable panel seal can be provided after repeated removal and installation of such panels, which may be required with respect to access.

  For example, FIG. 6A is an exploded view depicting the inspection window panel section 30 and the easily removable inspection window 130. As previously discussed herein, the inspection window panel section 30 can be easily machined to accept a removable inspection window 130. For various embodiments of the gas enclosure assembly, a panel section, such as the removable inspection panel section 30, can have a panel section frame 32 and a compressible gasket 38 disposed on the panel section frame 32. In various embodiments, the hardware involved in fastening the removable inspection window 130 in the removable inspection window panel section 30 provides ease of installation and re-installation to the end user. At the same time, an airtight seal when the easily removable inspection window 130 is installed and reinstalled in the panel section 30 as required by the end user who requires direct access to the interior of the gas enclosure assembly. Can be ensured to be maintained. The easily removable inspection window 130 is a rigid window frame that can be constructed from, for example, but not limited to, a metal tube material as described to construct any of the frame members of the present teachings. 132 can be included. The inspection window 130 can utilize quick action fastening hardware, such as, but not limited to, a reverse action toggle clamp 136 to provide the end user with immediate removal and replacement of the inspection window 130.

  As shown in the front view of the removable inspection window panel section 30 of FIG. 6A, the easily removable inspection window 130 may have a set of four toggle clamps 136 secured on the window frame 132. it can. The inspection window 130 can be positioned in the panel section frame 30 at a specified distance to ensure proper compression force on the gasket 38. As shown in FIG. 6B, a set of four window guide spacers 34 can be used to position the inspection window 130 within the panel section 30 and install it at each corner of the panel section 30. Each of the set of tightening cleats 36 can be provided to receive a counteracting toggle clamp 136 for an easily removable inspection window 130. According to various embodiments for sealing the inspection window 130 through the installation and removal cycle, the inspection in conjunction with the defined position of the inspection window 130 provided by the set of window guide spacers 34 with respect to the compressible gasket 38. The combination of mechanical strength of the window frame 132 is, for example, without limitation, once the inspection window 130 is secured in place using a counter-acting toggle clamp 136 fastened in each fastening cleat 36. It can be ensured that the inspection window frame 132 can provide an even pressure across the panel section frame 32 by a defined compression as set by a set of window guide spacers 34. The set of window guide spacers 34 is positioned such that the compressive force of the window 130 on the gasket 38 deflects the compressible gasket 38 between about 20% and about 40%. In that regard, the construction of the inspection window 130 as well as the processing of the panel section 30 provides a hermetic seal of the inspection window 130 in the panel section 30. As previously discussed herein, after the inspection window 130 is fastened into the panel section 30 and removed when the inspection window 130 needs to be removed, the window clamp 35 is attached to the panel section 30. Can be installed inside.

  The counteracting toggle clamp 136 can be easily secured to the removable inspection window frame 132 using any suitable means, as well as a combination of means. Examples of suitable fastening means that can be used include at least one adhesive, such as but not limited to epoxy or cement, at least one bolt, at least one screw, at least one other fastener, at least one One slot, at least one path, at least one weld, and combinations thereof may be included. The counter-acting toggle clamp 136 can be connected directly to the removable inspection window frame 132 or indirectly through an adapter plate. The counter-acting toggle clamp 136, clamping cleat 36, window guide spacer 34, and window clamp 35 can be constructed of any suitable material and combination of materials. For example, one or more such elements can include at least one metal, at least one ceramic, at least one plastic, and combinations thereof.

  In addition to sealing easily removable inspection windows, a hermetic seal can also be provided for inset panels and window panels. Other types of section panels that can be repeatedly installed and removed within the panel section include, but are not limited to, a fit panel 110 and a window panel 120 as shown in FIG. 3, for example. As can be seen in FIG. 3, the panel frame 122 of the window panel 120 is constructed similarly to the fitted panel 110. As such, according to various embodiments of the gas enclosure assembly, the processing of the panel sections to receive the inset panel and the window panel may be the same. In that respect, the sealing of the fitting panel and the window panel can be implemented using the same principle.

  With reference to FIGS. 7A and 7B, according to various embodiments of the present teachings, any of the panels of the gas enclosure, such as the gas enclosure assembly 100 of FIG. 1, is adapted to receive a respective inset panel 110. One or more inset panel sections 10 can be included that can have a frame 12 configured. FIG. 7A is a perspective view showing an enlarged portion shown in FIG. 7B. In FIG. 7A, the fit panel 110 is depicted as being positioned with respect to the fit frame 12. As can be seen in FIG. 7B, the inset panel 110 is affixed to the frame 12, which can be constructed of metal, for example. In some embodiments, the metal can include aluminum, steel, copper, stainless steel, chromium, alloys, and combinations thereof, and the like. A plurality of blind screw holes 14 can be fitted into the panel section frame 12. The panel section frame 12 is constructed with a gasket 16 between the fitted panel 110 and the frame 12 in which a compressible gasket 18 can be placed. The blind screw hole 14 may be of the M5 variety. The screw 15 can be received by a blind screw hole 14 with a gasket 16 between the fitting panel 110 and the frame 12. Once fastened in place relative to the gasket 16, the fit panel 110 forms an air tight seal within the fit panel section 10. As previously discussed herein, such panel seals are implemented for a variety of segmented panels, including but not limited to a snap-in panel 110 and a window panel 120 as shown in FIG. can do.

  According to various embodiments of compressible gaskets in accordance with the present teachings, compressible gasket materials for frame member sealing and panel sealing may be various compressible polymer materials, such as, but not limited to, expanded rubber materials or expanded. It can be selected from any of the classes of closed cell polymeric materials, also referred to in the art as polymeric materials. Briefly, closed cell polymers are prepared in a manner that gas is encapsulated in discrete cells, with each discrete cell encapsulated by a polymer material. The properties of compressible closed cell polymer gasket materials desirable for use in hermetic sealing of frame and panel components make them robust against chemical attack across a wide range of chemical species and possess excellent moisture barrier properties Including, but not limited to, being elastic over a wide temperature range and resistant to permanent compression strain. In general, closed cell polymeric materials have higher dimensional stability, lower moisture absorption coefficient, and higher strength compared to polymeric materials with open cell structures. Various types of polymeric materials that can make closed cell polymeric materials are made using, for example, silicone, neoprene, ethylene propylene diene terpolymer (EPT), ethylene propylene diene monomer (EPDM). Polymers and composites, vinyl nitriles, styrene butadiene rubber (SBR), and various copolymers and mixtures thereof.

  The desired material properties of the closed cell polymer are maintained only if the cell containing the bulk material remains intact during use. In that regard, by using such materials in a manner that exceeds the material specifications set for the closed cell polymer, eg, exceeding the specifications for use within a specified temperature or compression range, It may cause deterioration of. In various embodiments of closed cell polymer gaskets used to seal frame members and section panels within a frame panel section, compression of such material causes a deflection of between about 50% and about 70%. It should not exceed and can be between about 20% and about 40% deflection for optimal performance.

  In addition to a closed cell compressible gasket material, another example of a class of compressible gasket materials having desirable attributes for use in constructing embodiments of gas enclosure assemblies according to the present teachings is: Includes a class of hollow extruded compressible gasket materials. Hollow extruded gasket materials as a class of materials, they are robust to chemical attack across a wide range of chemical species, possess excellent moisture barrier properties, are elastic over a wide temperature range, and are resistant to permanent compression strain It has desirable attributes, including but not limited to. Such hollow extruded compressible gasket materials include, but are not limited to, U-shaped cells, D-shaped cells, square cells, rectangular cells, and various custom form factor hollow extruded gasket materials. It can be supplied in a wide variety of form factors, such as any. Various hollow extruded gasket materials can be fabricated from polymeric materials used in closed cell compressible gasket processing. For example, without limitation, various embodiments of hollow extrusion gaskets include polymers and composites made using silicone, neoprene, ethylene propylene diene terpolymer (EPT), ethylene propylene diene monomer (EPDM). , Vinyl nitrile, styrene butadiene rubber (SBR), and various copolymers and mixtures thereof. The compression of such hollow cell gasket material should not exceed about 50% deflection in order to maintain the desired attributes. Although a class of closed cell compressible gasket materials and a class of hollow extruded compressible gasket materials are given as examples, as defined by the present teachings, various wall and ceiling frame members, etc. Any compressible gasket material with the desired attributes can be used to seal the structural components as well as to seal the various panels within the panel section frame.

  FIG. 8 is a bottom view of various embodiments of a ceiling panel of the present teachings, such as, for example, the ceiling panel 250 'of the gas enclosure assembly 100 of FIG. 1A. According to various embodiments of the present teachings for assembly of gas enclosures, lighting can be installed on the interior top surface of a ceiling panel, such as ceiling panel 250 'of gas enclosure assembly 100 of FIG. 1A. As depicted in FIG. 8, a ceiling frame 250 having an interior 251 can have lighting installed on the interior of various frame members. For example, the ceiling frame 250 can have two ceiling frame sections 40 having two ceiling frame beams 42 and 44 in common. Each ceiling frame section 40 may have a first side surface 41 positioned toward the inside of the ceiling frame 250 and a second side surface 43 positioned toward the outside of the ceiling frame 250. For various embodiments in accordance with the present teachings of providing lighting for a gas enclosure, multiple pairs of lighting elements 46 can be installed. Each pair of lighting elements 46 may include a first lighting element 45 proximal to the first side 41 and a second lighting element 47 proximal to the second side 43 of the ceiling frame section 40. it can. The number, positioning, and grouping of lighting elements shown in FIG. 8 are exemplary. The number and grouping of lighting elements can be varied in any desired or suitable manner. In various embodiments, the lighting element can be mounted flat, while in other embodiments it can be mounted so that it can be moved to various positions and angles. The placement of the lighting elements is not limited to the top panel ceiling 433, but additionally or alternatively is located on any other inner surface, outer surface, and combination of surfaces of the gas enclosure assembly 100 shown in FIG. 1A. Can do.

  The various lighting elements can comprise any number, type, or combination of light, such as halogen lamps, white lamps, incandescent lamps, arc lamps, or light emitting diodes or devices (LEDs). For example, each lighting element can comprise 1 LED to about 100 LEDs, about 10 LEDs to about 50 LEDs, or 100 or more LEDs. An LED or other lighting device can emit any color or color combination within the color spectrum, outside the color spectrum, or a combination thereof. According to various embodiments of the gas enclosure assembly used for inkjet printing of OLED material, the light of the lighting device installed in the gas enclosure assembly because some materials are sensitive to some light wavelengths The wavelength can be specifically selected to avoid material degradation during processing. For example, a 4X cold white LED can be used as a 4X yellow LED or any combination thereof. An example of a 4X cold white LED is LF1B-D4S-2THWW4 available from IDEC Corporation (Sunnyvale, Calif.). An example of a 4X yellow LED that can be used is LF1B-D4S-2SHY6, also available from IDEC Corporation. LEDs or other lighting elements can be positioned or suspended from any location on the interior 251 of the ceiling frame 250 or on another surface of the gas enclosure assembly. The lighting elements are not limited to LEDs. Any suitable lighting element or combination of lighting elements can be used. FIG. 9 is a graph of the IDEC LED light spectrum, showing the X axis corresponding to the intensity when the peak intensity is 100% and the Y axis corresponding to the wavelength in nanometer units. The spectra of LF1B yellow type, yellow fluorescent lamp, LF1B white type LED, LF1B cold white type LED, and LF1B red type LED are shown. Other light spectra and combinations of light spectra can be used in accordance with various embodiments of the present teachings.

  Various embodiments of a gas enclosure assembly constructed in a manner minimize the internal volume of the gas enclosure assembly while at the same time optimizing the workspace to accommodate different footprints of different OLED printing systems. I want to recall that. Various embodiments of gas enclosure assemblies so constructed additionally provide an internal view of the gas enclosure assembly from the outside during processing to provide immediate access to the interior for maintenance while minimizing downtime. Provides immediate access to In that regard, various embodiments of the gas enclosure assembly according to the present teachings can be profiled for various footprints of various OLED printing systems.

According to the systems and methods of the present teachings, frame member structures, panel structures, frame and panel seals, and structures of gas enclosures such as the gas enclosure 100 of FIG. 1A can be applied to gas enclosures of various sizes and designs. . Various embodiments of the gas enclosure assembly can have various frame members that are constructed to provide the contour of the gas enclosure assembly. Various embodiments of the gas enclosure assembly of the present teachings optimize the working space to minimize the volume of inert gas and also allow immediate access to the OLED printing system from the outside during processing, while providing OLED A printing system can be accommodated. In that regard, the various gas enclosure assemblies of the present teachings may differ in the contoured local structure and volume. By way of non-limiting example, various embodiments of a contoured gas enclosure according to the present teachings contain various embodiments of a printing system capable of printing substrate sizes of Gen 3.5 to Gen 10. to can have a gas enclosure volume for about 6 m ³ ~ about 95 m ^3. As a further non-limiting example, various embodiments of a contoured gas enclosure in accordance with the present teachings may be used in various printing systems capable of printing, for example, Gen 5.5 to Gen 8.5 substrate sizes. To accommodate the embodiments, it can have a gas enclosure volume of about 15 m ³ to about 30 m ³ . Such an embodiment of a contoured gas enclosure saves about 30% to about 70% in volume compared to a non-contoured enclosure having non-contoured dimensions of width, length, and height. obtain.

  The gas enclosure assembly 1000 of FIG. 9 can have all the features described in the present teachings for the exemplary gas enclosure assembly 100 of FIG. 1A. For example, but not limited to, the gas enclosure assembly 1000 can utilize a seal according to the present teachings that provides a sealed enclosure through a build and debuild cycle. Various embodiments of gas enclosure systems based on the gas enclosure assembly 1000 provide various levels of various reactive species, including various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapor, at or below 100 ppm. For example, it may have a gas purification system that can be maintained at or below 10 ppm, at or below 1.0 ppm, or at or below 0.1 ppm.

  In addition, as discussed in more detail later herein, various embodiments of a gas enclosure system, such as, but not limited to, the gas enclosure assembly 100 of FIG. 1A and the gas enclosure assembly 1000 of FIG. Can provide a laminar flow environment that can minimize turbulence, and meets the standards of International Standards Organization Standard (ISO) 146444-1: 1999, as specified by Class 1 to Class 5. By maintaining a suspended particulate level, one can have a circulation and filtration system that can create a substantially low particle environment. The determination of suspended particulate matter can be made to various embodiments of the gas enclosure system prior to the printing process for system verification, for example, using a portable particle counting device. In various embodiments of the gas enclosure system, the determination of suspended particulate matter can be performed as an ongoing quality check while the substrate is being printed. For various embodiments of the gas enclosure system, the determination of suspended particulate matter may be performed for system verification before the substrate is printed, and in addition while the substrate is being printed. it can.

  In addition, for various embodiments of the gas enclosure system of the present teachings, the substantially low particle environment can provide a substantially low particle substrate surface. Modeling based on various embodiments of the gas enclosure system of the present teachings indicates that without the various particle control systems of the present teachings, the deposition on the substrate per square meter of printing substrate is 0.1 μm and larger in size per print cycle It suggests that for particles in the range, there can be more than about 1 million to more than about 10 million particles. Such calculations show that without the various particle control systems of the present teachings, deposition on the substrate per print cycle per square meter of substrate is greater than about 1000 for particles in the size range of about 2 μm and larger. Suggests that there can be more than about 10,000 particles. Determination of the on-substrate distribution of particulate matter on the substrate can be made to various embodiments of the gas enclosure system using, for example, a test substrate before the substrate is printed for system verification. In various embodiments of the gas enclosure system, the determination of the on-substrate distribution of particulate matter can be performed as an ongoing quality check while the substrate is being printed. For various embodiments of the gas enclosure system, the determination of the distribution of particulate matter on the substrate can be performed before the substrate is printed, in addition, while the substrate is being printed, in-situ for system verification. It can be carried out.

  Various embodiments of a gas enclosure system can maintain a substantially low particle environment that provides on-substrate particle specifications for particles of about 0.1 μm or larger to about 10 μm or larger. You can have a control system. Various embodiments of particle-on-substrate specifications easily convert from an average particle-on-substrate distribution per square meter of substrate per minute to an average particle-on-substrate distribution per substrate per minute for each target particle size range. can do. As previously discussed herein, such conversion can be easily performed, for example, through a known relationship between a substrate of a specific generation size and a corresponding area of the substrate generation. . In addition, the average particle distribution on the substrate per square meter of substrate per minute can be easily converted to any of a variety of unit time representations. For example, in addition to standard time units, eg, conversion between seconds, minutes, days, units of time that are specific to the process can be used. For example, a print cycle can be associated with a unit of time, as previously discussed herein.

  Various embodiments of the low particle gas enclosure system of the present teachings meet on-substrate deposition rate specifications for particles of less than or equal to about 100 per square meter of substrate per minute for particles of size greater than or equal to 10 μm. A low particle environment can be maintained that provides an average particle distribution on the substrate. Various embodiments of the low particle gas enclosure system of the present teachings meet on-substrate deposition rate specifications for particles less than or equal to about 100 per square meter of substrate per minute for particles of size greater than or equal to 5 μm. A low particle environment can be maintained that provides an average particle distribution on the substrate. In various embodiments of the gas enclosure system of the present teachings, an average substrate that meets a deposition rate specification on a substrate of particles less than or equal to about 100 per square meter of substrate per minute for particles larger than or equal to 2 μm in size A low particle environment providing an upper particle distribution can be maintained. In various embodiments of the gas enclosure system of the present teachings, an average substrate that meets a deposition rate specification on a substrate of particles less than or equal to about 100 per square meter of substrate per minute for particles larger than or equal to 1 μm in size A low particle environment providing an upper particle distribution can be maintained. Various embodiments of the low particle gas enclosure system of the present teachings provide on-substrate deposition rate specifications for particles less than or equal to about 1000 per square meter of substrate per minute for particles larger than or equal to 0.5 μm in size. A low particle environment can be maintained that provides an average particle distribution on the substrate that meets. For various embodiments of the gas enclosure system of the present teachings, meet on-substrate deposition rate specifications for particles less than or equal to about 1000 per square meter of substrate per minute for particles of size greater than or equal to 0.3 μm. A low particle environment can be maintained, providing an average particle distribution on the substrate. Various embodiments of the low particle gas enclosure system of the present teachings provide on-substrate deposition rate specifications for particles less than or equal to about 1000 per square meter of substrate per minute for particles of size greater than or equal to 0.1 μm. A low particle environment can be maintained that provides an average particle distribution on the substrate that meets.

  FIG. 9 depicts a perspective view of a gas enclosure assembly 1000 in accordance with various embodiments of the gas enclosure assembly of the present teachings. The gas enclosure assembly 1000 can include a front panel assembly 1200 ', a center panel assembly 1300', and a rear panel assembly 1400 '. The front panel assembly 1200 'can include a front ceiling panel assembly 1260', a front wall panel assembly 1240 'that can have an opening 1242 for receiving a substrate, and a front foundation panel assembly 1220'. The rear panel assembly 1400 'can include a rear ceiling panel assembly 1460', a rear wall panel assembly 1440 ', and a rear foundation panel assembly 1420'. The central panel assembly 1300 'can include a first central enclosure panel assembly 1340', a central wall and ceiling panel assembly 1360 ', and a second central enclosure panel assembly 1380', and a central foundation panel assembly 1320 '.

  In addition, the central panel assembly 1300 'can include a first printhead management system auxiliary panel assembly 1330', as well as a second printhead management system auxiliary panel assembly (not shown). As previously discussed herein, various embodiments of the auxiliary enclosure constructed as part of the gas enclosure assembly can be sealably isolated from the working volume of the gas enclosure system. For example, such physical isolation of the auxiliary enclosure from the printing system enclosure can be performed in various procedures, such as, but not limited to, various maintenance procedures on the printhead assembly with little or no interruption in the printing process. Can be performed, thereby minimizing or eliminating downtime of the gas enclosure system.

  As depicted in FIG. 10A, the gas enclosure assembly 1000, when fully constructed, forms a front base panel assembly 1220 ′ that forms an adjacent base or pan on which the OLED printing system 2000 can rest. A central foundation panel assembly 1320 ′ and a rear foundation panel assembly 1420 ′. Similarly, as described for the gas enclosure assembly 100 of FIG. 1A, the various frame members and panels comprising the front panel assembly 1200 ′, the center panel assembly 1300 ′, and the rear panel assembly 1400 ′ of the gas enclosure assembly 1000 are: Bonded around the OLED printing system 2000 can form a printing system enclosure. Thus, a fully constructed gas enclosure assembly, such as the gas enclosure assembly 1000, when integrated with various environmental control systems, includes various embodiments of the gas enclosure system, including various embodiments of the OLED printing system 2000. Can be formed. According to various embodiments of the gas enclosure system of the present teachings as previously described, the environmental control of the internal volume defined by the gas enclosure assembly can be controlled by, for example, the number and arrangement of lights of a particular wavelength. Control, control of particulate matter using various embodiments of particle control system, control of reactive gas species using various embodiments of gas purification system, and gas using various embodiments of thermal control system Enclosure assembly temperature control may be included.

  An OLED inkjet printing system, such as the OLED printing system 2000 of FIG. 10A, shown in the enlarged view of FIG. And can consist of devices. These devices and apparatus include a printhead assembly, an ink delivery system, a motion system that provides relative motion between the printhead assembly and the substrate, a substrate support device, a substrate loading and unloading system, and a printhead management system. Can, but is not limited to.

  The printhead assembly can include at least one inkjet head with at least one orifice capable of ejecting ink droplets at a controlled rate, speed, and size. The ink jet head is fed by an ink supply system that provides ink to the ink jet head. As shown in the enlarged view of FIG. 10B, the OLED inkjet printing system 2000 includes a chuck, such as, but not limited to, a vacuum chuck, a substrate floating chuck with pressure ports, and a substrate floating chuck with vacuum and pressure ports. A substrate such as a substrate 2050 that can be supported by the substrate support apparatus. In various embodiments of the systems and methods of the present teachings, the substrate support apparatus can be a substrate floating table. As discussed in more detail later herein, the substrate floating table 2200 of FIG. 10B can be used to support the substrate 2050 and, in conjunction with the Y-axis motion system, the frictionless substrate 2050. It can be part of a substrate transport system that provides transport. The Y-axis motion system of the present teachings can include a first Y-axis track 2351 and a second Y-axis track 2352 that can include a gripper system (not shown) for holding a substrate. Y-axis motion can be provided by either a linear air bearing or a linear mechanical system. The substrate floating table 2200 of the OLED inkjet printing system 2000 shown in FIGS. 10A and 10B can define the movement of the substrate 2050 through the gas enclosure assembly 1000 of FIG. 9 during the printing process.

  Printing requires relative movement between the printhead assembly and the substrate. This is accomplished using a motion system, typically a gantry or split axis XYZ system. Either the printhead assembly can move across a stationary substrate (gantry type) or, in the case of a split axis configuration, both the printhead and the substrate can move. In another embodiment, the printhead assembly can be substantially stationary, for example, in the X and Y axes, the substrate can move in the X and Y axes relative to the printhead, and the Z axis motion is Provided either by a substrate support device or by a Z-axis motion system associated with the printhead assembly. As the printhead moves relative to the substrate, ink droplets are ejected at the correct time so that they are deposited at the desired location on the substrate. A substrate loading and unloading system can be used to insert and remove substrates from the printer. Depending on the printer configuration, this can be accomplished using a machine conveyor, a substrate floating table with a transport assembly, or a substrate transfer robot with an end effector. The printhead management system checks nozzle firing and measurement tasks such as measurement of droplet volume, velocity, and trajectory from all nozzles in the printhead, and wipes excess ink off the inkjet nozzle surface; Or several, allowing maintenance tasks such as blotting, preparing and cleaning the printhead by draining ink from the ink supply through the printhead and into the waste bowl, and replacing the printhead Subsystems can consist of Considering the various components that can comprise an OLED printing system, various embodiments of the OLED printing system can have various footprints and form factors.

  With reference to FIG. 10B, the printing system base 2100 can include a first riser (not visible) and a second riser 2122 on which the bridge 2130 is mounted. For various embodiments of the OLED printing system 2000, the bridge 2130 can control the movement of the first printhead assembly 2501 and the second printhead assembly 2502 across the bridge 2130, respectively. One X-axis carriage assembly 2301 and second X-axis carriage assembly 2302 can be supported. For various embodiments of the printing system 2000, the first X-axis carriage assembly 2301 and the second X-axis carriage assembly 2302 can utilize a linear air bearing motion system that is inherently low particle generation. . According to various embodiments of the printing system of the present teachings, the X-axis carriage can have a Z-axis moving plate mounted thereon. In FIG. 10B, a first X-axis carriage assembly 2301 is depicted with a first Z-axis movement plate 2310, while a second X-axis carriage assembly 2302 includes a second Z-axis movement plate 2312. Depicted with it. Although FIG. 10B depicts two carriage assemblies and two printhead assemblies, for various embodiments of the OLED inkjet printing system 2000, there can be a single carriage assembly and a single printhead assembly. For example, either a first printhead assembly 2501 or a second printhead assembly 2502 can be mounted on an X, Z axis carriage assembly while a camera system for inspecting the characteristics of a substrate 2050 is provided. It can be mounted on a second X, Z axis carriage assembly. Various embodiments of the OLED inkjet printing system 2000 can have a single printhead assembly, for example, one of the first printhead assembly 2501 and the second printhead assembly 2502 can be an X, Z axis carriage. An ultraviolet lamp for curing the encapsulated layer printed on the substrate 2050 can be mounted on the second X, Z axis carriage assembly while it can be mounted on the assembly. For various embodiments of the OLED inkjet printing system 2000, a first printhead assembly 2501 and a second printhead assembly 2502 mounted on a single printhead assembly, eg, an X, Z axis carriage assembly. While either can be present, a heat source for curing the encapsulated layer printed on the substrate 2050 can be placed on the second carriage assembly.

  In FIG. 10B, the first X- and Z-axis carriage assembly 2301 can be placed on the first Z-axis moving plate 2310, covering the substrate 2050 shown supported on the substrate floating table 2200. Can be used to position the first printhead assembly 2501. A second X, Z axis carriage assembly 2302 with a second Z axis movement plate 2312 is similarly configured to control the XZ axis movement of the second printhead assembly 2502 relative to the substrate 2050. it can. Each printhead assembly, such as the first printhead assembly 2501 and the second printhead assembly 2502 of FIG. 10B, is depicted in a partial view of the first printhead assembly 2501 depicting a plurality of printheads 2505. A plurality of printheads mounted in at least one printhead device. Printhead devices can include, for example, but are not limited to, fluid and electronic connections to at least one printhead, each printhead capable of ejecting ink at a controlled rate, speed, and size. A plurality of nozzles or orifices. For various embodiments of the printing system 2000, the printhead assembly can include about 1 to about 60 printhead devices, each printhead device being about 1 to about 1 in each printhead device. It can have 30 printheads. Printheads, such as industrial inkjet heads, can have from about 16 to about 2048 nozzles that can emit droplet volumes from about 0.1 pL to about 200 pL.

  According to various embodiments of the gas enclosure system of the present teachings, considering a large number of printhead devices and printheads, the first printhead management system 2701 and the second printhead management system 2702 It can be housed in an auxiliary enclosure that can be isolated from the printing system enclosure during the printing process to perform various measurement and maintenance tasks with little or no interruption. As can be seen in FIG. 10B, the first printhead management system 2701 for immediate implementation of various measurement and maintenance procedures that can be performed by the first printhead management system devices 2707, 2709, and 2711. The first printhead assembly 2501 can be seen positioned relative to. Devices 2707, 2709, and 2011 can be any of various subsystems or modules for performing various printhead management functions. For example, devices 2707, 2709, and 2011 can be any of a droplet measurement module, a printhead change module, a purge bowl module, and a blotter module.

  FIG. 10C depicts an enlarged view of the first printhead management system 2701 housed within the first printhead management system auxiliary panel assembly 1330 ′, according to various embodiments of the gas enclosure assembly and system of the present teachings. . As depicted in FIG. 10C, the auxiliary panel assembly 1330 'is shown in a cutaway view that more clearly shows details of the first printhead management system 2701. Various embodiments of a printhead management system according to the present teachings, such as the first printhead management system 2701, devices 2707, 2709, and 2011 of FIG. 10C, are various subsystems or modules for performing various functions. obtain. For example, devices 2707, 2709, and 2011 can be a drop measurement module, a printhead purge bowl module, and a blotter module. As depicted in FIG. 10C, the printhead replacement module 2713 can provide a location for docking at least one printhead device 2505. In various embodiments of the first printhead management system 2701, the first printhead management system auxiliary panel assembly 1330 ′ may be maintained in the same environment in which the gas enclosure assembly 1000 (see FIG. 19) is maintained. it can. The first printhead management system auxiliary panel assembly 1330 'can have a handler 2530 positioned to perform tasks associated with various printhead management procedures. For example, each subsystem is inherently consumable and may have various components that require replacement, such as replacement of blotter paper, ink, and waste reservoir. Various consumable parts can be packaged for immediate insertion, for example, in a fully automatic mode using a handler. As a non-limiting example, blotting paper can be packaged in a cartridge format that can be easily inserted into the blotting module for use. As another non-limiting example, the ink can be packaged in a replaceable reservoir as well as a cartridge format for use in a printing system. Various embodiments of the waste reservoir can be packaged in a cartridge format that can be easily inserted into the purge bowl module for use. In addition, the components of the various components of the printing system that are subject to continued use may require periodic replacement. During the printing process, convenient management of the printhead assembly may be desirable, such as, but not limited to, printhead device or printhead replacement. The printhead replacement module can have components such as a printhead device or printhead that can be easily inserted into the printhead assembly for use. Droplet measurement system, used for checking nozzle firing and measurements based on optical detection of drop volume, velocity, and trajectory from all nozzles, sources and detections that may require periodic replacement after use Can have a container. A variety of consumable, high-use parts can be packaged for immediate insertion, for example, in a fully automatic mode using a handler. The handler 2530 can have an end effector 2536 mounted on an arm 2534. Various embodiments of end effector configurations may be used, for example, blade type end effectors, clamp type end effectors, and gripper type end effectors. Various embodiments of the end effector provide mechanical gripping and clamping to either actuate portions of the end effector or otherwise hold the print head device or the print head from the print head device differently. As well as pneumatic or vacuum assist assemblies.

  Regarding the printhead device or printhead placement, the printhead replacement module 2713 of the printhead management system 2701 of FIG. 10C includes a docking station for a printhead device having at least one printhead, and a storage container for the printhead. Can be included. Each printhead assembly (see FIG. 10B) can include from about 1 to about 60 printhead devices, and each printhead device can have from about 1 to about 30 printheads. As such, various embodiments of the printing system of the present teachings can then have from about 1 to about 1800 printheads. In various embodiments of the printhead replacement module 2713, while the printhead device is docked, each printhead mounted on the printhead device is ready to operate while not in use in the printing system. Can be maintained. For example, when placed in a docking station, each printhead on each printhead device can be connected to an ink supply and an electrical connection. To ensure that the nozzles remain prepared and do not clog, power is applied to each print so that a periodic firing pulse can be applied to each nozzle on each printhead while docked. It can be provided to each print head on the head device. The handler 2530 of FIG. 10C can be positioned proximal to the printhead assembly 2500. The printhead assembly 2500 can be docked over the first printhead management system auxiliary panel assembly 1330 ', as depicted in FIG. 10C. During a procedure for replacing a printhead, the handler 2530 can remove a target component from the printhead assembly 2500, either the printhead or a printhead device having at least one printhead. The handler 2530 can collect replacement parts, such as a printhead device or printhead, from the printhead replacement module 2713 and complete the replacement process. The removed parts can be placed in the printhead replacement module 2713 for retrieval.

  Referring again to FIG. 10A for various embodiments of a gas enclosure assembly having an auxiliary enclosure that can be closed and sealably isolated from a first working volume, eg, a printing system enclosure. As depicted in FIG. 10B, a first isolator set 2110 (second shown on the opposite side) that supports four isolators on the OLED printing system 2000, ie, the substrate floating table 2200 of the OLED printing system 2000. Not), and a second isolator set 2112 (second not shown on the opposite side). For the gas enclosure assembly 1000 of FIG. 10A, the first isolator set 2110 and the second isolator set 2112 are the first isolator wall panel 1325 ′ and the second isolator wall panel 1327 ′ of the central foundation panel assembly 1320 ′, etc. Can be mounted in each of the respective isolator wall panels. For the gas enclosure assembly 1000 of FIG. 10A, the central foundation assembly 1320 'can include a first printhead management system auxiliary panel assembly 1330', as well as a second printhead management system auxiliary panel assembly 1370 '. FIG. 10A of the gas enclosure assembly 1000 depicts a first printhead management system auxiliary panel assembly 1330 'that may include a first rear wall panel assembly 1338'. Similarly, a second printhead management system auxiliary panel assembly 1370 'that can include a second rear wall panel assembly 1378' is also depicted. The first back wall panel assembly 1338 'of the first printhead management system auxiliary panel assembly 1330' can be similarly constructed as shown for the second back wall panel assembly 1378 '. The second rear wall panel assembly 1378 ′ of the second printhead management system auxiliary panel assembly 1370 ′ has a second seal support panel 1375 sealably mounted on the second rear wall frame assembly 1378, It can be constructed from a second rear wall frame assembly 1378. Second seal support panel 1375 can have a second passage 1365 proximal to a second end (not shown) of base 2100. A second seal 1367 can be placed on the second seal support panel 1375 around the second passage 1365. The first seal can similarly be positioned and placed around the first passage for the first printhead management system auxiliary panel assembly 1330 '. Each passage in auxiliary panel assembly 1330 ′ and auxiliary panel assembly 1370 ′ may be adapted to pass each maintenance system platform, such as first and second maintenance system platforms 2703 and 2704 of FIG. 10B, through the passage. it can. In order to sealably isolate the auxiliary panel assembly 1330 ′ and the auxiliary panel assembly 1370 ′, as will be discussed in more detail later herein, passages such as the second passage 1365 of FIG. 10A can be sealed. There must be. It is contemplated that various seals such as inflatable seals, bellows seals, and lip seals can be used to seal passages such as the second passage 1365 of FIG. 10A around a maintenance platform attached to the printing system base. The

  The first printhead management system auxiliary panel assembly 1330 ′ and the second printhead management system auxiliary panel assembly 1370 ′ include a first printhead assembly opening 1342 and a first printhead assembly opening 1342 of the first floor panel assembly 1341 ′, respectively. A second printhead assembly opening 1382 of the second floor panel assembly 1381 ′ may be included. The first floor panel assembly 1341 'is depicted in FIG. 10A as part of the first central enclosure panel assembly 1340' of the central panel assembly 1300 '. The first floor panel assembly 1341 'is a panel assembly that is common to both the first central enclosure panel assembly 1340' and the first printhead management system auxiliary panel assembly 1330 '. The second floor panel assembly 1381 'is depicted in FIG. 10A as part of the second center enclosure panel assembly 1380' of the center panel assembly 1300 '. The second floor panel assembly 1381 'is a panel assembly that is common to both the second central enclosure panel assembly 1380' and the second printhead management system auxiliary panel assembly 1370 '.

  As previously discussed herein, the first printhead assembly 2501 can be housed in a first printhead assembly enclosure 2503 and the second printhead assembly 2502 can be a second printhead. It can be housed in an assembly enclosure 2504. In accordance with the systems and methods of the present teachings, the first printhead assembly enclosure 2503 and the second printhead assembly enclosure 2504 can be positioned so that various printhead assemblies can be positioned for printing during the printing process. There can be an opening in the bottom that can have (not shown). In addition, the portions of the first printhead assembly enclosure 2503 and the second printhead assembly enclosure 2504 that form the housing can have various configurations so that the frame assembly members and panels can provide a sealed enclosure. It can be constructed as described previously for the panel assembly.

  A compressible gasket, as previously described for sealing the various frame members, may be provided around each of the first printhead assembly opening 1342 and the second printhead assembly opening 1382, or alternatively, the first The printhead assembly enclosure 2503 and the second printhead assembly enclosure 2504 can be attached around the periphery.

  As depicted in FIG. 10A, the first printhead assembly docking gasket 1345 and the second printhead assembly docking gasket 1385 are respectively a first printhead assembly opening 1342 and a second printhead assembly opening. 1382 can be attached around. During various printhead measurement and maintenance procedures, the first printhead assembly 2501 and the second printhead assembly 2502 are respectively a first X, Z axis carriage assembly 2301 and a second X, Z axis carriage assembly. 2302 can be positioned over the first printhead assembly opening 1342 of the first floor panel assembly 1341 ′ and the second printhead assembly opening 1382 of the second floor panel assembly 1381 ′, respectively. . In that regard, for various printhead measurement and maintenance procedures, the first printhead assembly 2501 and the second printhead assembly 2502 have a first printhead assembly opening 1342 and a second printhead assembly opening 1382. Covering the first printhead assembly opening 1342 of the first floor panel assembly 1341 ′ and the second printhead assembly opening 1382 of the second floor panel assembly 1381 ′ without covering or sealing. Can be positioned. The first X, Z-axis carriage assembly 2301 and the second X, Z-axis carriage assembly 2302 respectively include the first print head assembly enclosure 2503 and the second print head assembly enclosure 2504, respectively, for the first print. It can be docked with a head management system auxiliary panel assembly 1330 'and a second printhead management system auxiliary panel assembly 1370'. In various printhead measurement and maintenance procedures, such docking does not require sealing the first printhead assembly opening 1342 and the second printhead assembly opening 1382, and the first printhead assembly opening 1342. And the second printhead assembly opening 1382 may be effectively closed. For various printhead measurement and maintenance procedures, docking can include the formation of a gasket seal between each of the printhead assembly enclosure and the printhead management system panel assembly. The first printhead assembly enclosure 2503 and the second printhead assembly enclosure 2504 in conjunction with the sealably closing passages such as the second passage 1365 and the complementary first passage of FIG. The first printhead management system auxiliary panel assembly 1330 ′ and the second printhead management system auxiliary panel assembly so as to sealably close the one printhead assembly opening 1342 and the second printhead assembly opening 1382. When docked with 1370 ', the composite structure so formed is sealed.

  In addition, according to the present teachings, by using a structural closure to sealably close passages such as the first printhead assembly opening 1342 and the second printhead assembly opening 1382 of FIG. 10A. The auxiliary enclosure can be isolated from another internal enclosure volume, such as a printing system enclosure, as well as from the outside of the gas enclosure assembly. According to the present teachings, the structural closure can include various sealable covers for the openings or passages, such openings or passages being non-limiting examples of enclosure panel openings or passages. Including. In accordance with the systems and methods of the present teachings, the gate can reversibly cover or reversibly sealably close any opening or passage using pneumatic, hydraulic, electrical, or manual actuation. It can be any structural closure that can be used. Thus, the gate can be used to reversibly cover or reversibly sealably close the first printhead assembly opening 1342 and the second printhead assembly opening 1382 of FIG. 10A.

  In an enlarged view of the OLED printing system 2000 of FIG. 10B, various embodiments of the printing system can include a substrate floating table 2200 supported by a substrate floating table base 2220. The substrate floating table base 2220 can be mounted on the printing system base 2100. The substrate floating table 2200 of the OLED printing system can support the substrate 2050 and define movement that can move the substrate 2050 through the gas enclosure assembly 1000 during printing of the OLED substrate. The Y-axis motion system of the present teachings can include a first Y-axis track 2351 and a second Y-axis track 2352 that can include a gripper system (not shown) for holding a substrate. Y-axis motion can be provided by either a linear air bearing or a linear mechanical system. In that regard, in conjunction with a motion system, ie, a Y-axis motion system, as depicted in FIG. 10B, the substrate floating table 2200 can provide frictionless transport of the substrate 2050 through the printing system.

  FIG. 11 depicts a stable transport of a load, such as the substrate 2050 of FIG. 10B, in conjunction with a floating table according to various embodiments of the present teachings for frictionless support and a transport system. Various embodiments of the floating table can be used in any of the various embodiments of the gas enclosure system of the present teachings. As previously discussed, various embodiments of the gas enclosure system of the present teachings include a series of size OLED flat panel display substrates from substrates smaller than Gen 3.5 having dimensions of about 61 cm × 72 cm, and A series of larger generation sizes can be handled. Various embodiments of the gas enclosure system can process Gen 5.5 substrate sizes having dimensions of about 130 cm × 150 cm, as well as Gen 7.5 substrates having dimensions of about 195 cm × 225 cm, 8 per substrate. It is contemplated that it can be cut into one 42 inch or six 47 inch flat panel and larger panels. The Gen 8.5 substrate is approximately 220 cm x 250 cm and can be cut into six 55 inch or eight 46 inch flat panels per substrate. However, the substrate generation size continues to advance so that the currently available Gen 10 substrate with dimensions of about 285 cm × 305 cm is not considered the final generation of substrate size. In addition, the sizes described derived from the terms resulting from the use of glass-based substrates can be applied to substrates of any material suitable for use in OLED printing. For various embodiments of the OLED inkjet printing system, various substrate materials may be used for the substrate 2050, including, but not limited to, various glass substrate materials, as well as various polymer substrate materials. Thus, in various embodiments of the gas enclosure system of the present teachings, there are a variety of substrate sizes and materials that require stable transport during printing.

  As depicted in FIG. 11, a substrate floating table 2200 according to various embodiments of the present teachings can have a floating table base 2220 for supporting a plurality of floating table zones. The substrate floating table 2200 can have a zone 2210 that can apply both pressure and vacuum through multiple ports. Such a zone, having both pressure and vacuum control, can effectively provide a fluid spring between zone 2210 and the substrate (not shown). Zone 2210 with both pressure and vacuum control is a fluid spring with bi-directional stiffness. The gap that exists between the load and the floating table surface is called fly height. A zone such as zone 2210 of substrate floating table 2200 of FIG. 11 where a fluid spring having bidirectional stiffness is created using multiple pressure and vacuum ports is a controllable flight for loads such as the substrate. Can provide high.

  Proximal to zone 2210 are first and second transition zones 2211 and 2212, respectively, and then proximal to first and second transition zones 2211 and 2212 are respectively pressure-only zones 2213 and 2213, respectively. 2214. In the transition zone, the pressure ratio to the vacuum nozzle gradually increases toward the pressure alone zone to provide a gradual transition from zone 2210 to zones 2213 and 2214. For example, for various embodiments of the substrate floating table as depicted in FIG. 11, the pressure only zones 2213, 2214 are depicted as comprising a rail structure. For various embodiments of the floating substrate table, the pressure only zone such as the pressure only zone 2213, 2214 of FIG. 11 may consist of a continuous plate such as that depicted for the pressure and vacuum zone 2210 of FIG.

  For various embodiments of the floating table as depicted in FIG. 11, within tolerance, the pressure and vacuum are such that the three zones are essentially in one plane and the length can vary. There can be an essentially uniform height between the zone, the transition zone, and the pressure alone zone. For example, without limitation, for various embodiments of the floating table of the present teachings to provide a sense of scale and proportion, the transition zone may be about 400 mm while the pressure alone zone is about 2.5 m. And the pressure-vacuum zone can be about 800 mm. In FIG. 11, pressure alone zones 2213 and 2214 do not provide a fluid spring with bi-directional stiffness, and therefore do not provide the control that zone 2210 can provide. Therefore, to allow sufficient height so that the load does not collide with the floating table in the pressure alone zone, the fly height of the load is typically greater than the fly height of the substrate across the pressure / vacuum zone. Can also be large across the pressure alone zone. For example, but not limited to having a fly height of about 150 μ to about 300 μ above the pressure alone zone such as zones 2213 and 2214 and then about 30 μ to about 50 μ above the pressure and vacuum zone such as zone 2210 It may be desirable to process the OLED panel substrate.

  Various embodiments of the gas enclosure system of the present teachings can utilize various devices, apparatuses, and systems in addition to gas circulation and filtration systems to maintain a controlled gas enclosure environment. For example, utilizing multiple heat exchangers to maintain the desired temperature inside the gas enclosure in addition to a gas circulation and filtration system to provide thorough and complete conversion of the gas inside the gas enclosure A heat regulation system can be provided. For example, a plurality of heat exchangers can be provided that operate with, adjacent to, or used in conjunction with a fan or another gas circulation device. The gas purification loop may be configured to circulate gas from within the gas enclosure assembly through at least one gas purification component external to the enclosure. In that regard, the internal circulation and filtration system of the gas enclosure assembly, in conjunction with the gas purification loop external to the gas enclosure assembly, has a substantially low level of reactive species throughout the gas enclosure system. A continuous circulation of an inert gas of particulate matter can be provided. According to the present teachings, the inert gas may be any gas that does not undergo a chemical reaction under a defined set of conditions. Some commonly used non-limiting examples of inert gases can include nitrogen, any of the noble gases, and any combination thereof. Various embodiments of a gas enclosure system having a gas purification system are configured to maintain very low levels of undesirable components, such as organic solvents and their vapors, and water, water vapor, oxygen, and the like. be able to. Such an embodiment of a gas enclosure system can provide various levels of various reactive species, including various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapor, at or below 100 ppm, such as 10 ppm or It can be kept lower, 1.0 ppm or lower, or 0.1 ppm or lower.

  FIG. 12 is a schematic diagram illustrating a gas enclosure system 501. Various embodiments of a gas enclosure system 501 in accordance with the present teachings include a gas enclosure assembly 1101 for housing a printing system, a gas purification loop 3130 in fluid communication with the gas enclosure assembly 1101, and at least one thermal conditioning system. 3140. In addition, various embodiments of the gas enclosure system 501 can provide a pressurized inert gas recirculation that can provide an inert gas for operating various devices such as a substrate floating table for an OLED printing system. A system 3000 can be included. Various embodiments of the pressurized inert gas recirculation system 3000 may be compressed as a source for the various embodiments of the pressurized inert gas recirculation system 3000, as will be discussed in more detail later herein. A machine, blower, and a combination of the two are available. In addition, the gas enclosure system 501 can have a circulation and filtration system within the gas enclosure system 501 (not shown).

  As depicted in FIG. 12, for various embodiments of the gas enclosure assembly according to the present teachings, the piping design is continuously filtered and circulated internally for the various embodiments of the gas enclosure assembly. From the active gas, the inert gas circulated through the gas purification loop 3130 can be separated. The gas purification loop 3130 includes an outlet line 3131 from the gas enclosure assembly 1101 to the solvent removal component 3132 and then to the gas purification system 3134. The inert gas, purified from the solvent and other reactive gas species such as oxygen and water vapor, is then returned to the gas enclosure assembly 1101 through the inlet line 3133. The gas purification loop 3130 may also include appropriate ducts and connections and sensors, such as oxygen, water vapor, and solvent vapor sensors. Gas circulation units such as fans, blowers, or motors, and the like can be provided separately or incorporated into the gas purification system 3134 to circulate gas through the gas purification loop 3130, for example. According to various embodiments of the gas enclosure assembly, the solvent removal system 3132 and the gas purification system 3134 are shown as separate units in the schematic diagram shown in FIG. Can be stored together as a single purification unit.

  The gas purification loop 3130 of FIG. 12 includes a solvent removal located upstream of the gas purification system 3134 such that the inert gas circulated from the gas enclosure assembly 1101 passes through the solvent removal system 3132 via the outlet line 3131. A system 3132 can be included. According to various embodiments, the solvent removal system 3132 may be a solvent confinement system based on adsorbing solvent vapor from an inert gas passing through the solvent removal system 3132 of FIG. For example, but not limited to, one or more adsorbent layers such as activated carbon, molecular sieves, and the like may effectively remove a wide variety of organic solvent vapors. For various embodiments of the gas enclosure system, cold trap technology may be employed to remove solvent vapor in the solvent removal system 3132. As previously discussed herein, various embodiments of gas enclosure assemblies in accordance with the present teachings can be derived from inert gas continuously circulating through a gas enclosure system, such as gas enclosure system 501 of FIG. Sensors such as oxygen, water vapor, and solvent vapor sensors may be used to monitor such effective removal. Various embodiments of the solvent removal system may indicate when an adsorbent, such as activated carbon, molecular sieve, and the like, has reached capacity so that one or more adsorbent layers can be regenerated or replaced. it can. The regeneration of the molecular sieve can involve heating the molecular sieve, contacting the molecular sieve with a forming gas, combinations thereof, and the like. Molecular sieves configured to confine various species, including oxygen, water vapor, and solvents, are heated and exposed to a forming gas containing hydrogen, for example, a forming gas containing about 96% nitrogen and 4% hydrogen. Can be regenerated and the proportion is by volume or weight. Physical regeneration of the activated carbon can be performed using an analogous heating procedure in an inert environment.

Any suitable gas purification system can be used for the gas purification system 3134 of the gas purification loop 3130 of FIG. For example, MBRAUN Inc. Gas purification systems available from (Statham, New Hampshire) or Innovative Technology (Amesbury, Massachusetts) may be useful for incorporation into various embodiments of gas enclosure assemblies according to the present teachings. The gas purification system 3134 can be used to purify one or more inert gases within the gas enclosure system 501, for example, to purify the entire gas atmosphere within the gas enclosure assembly. As described above, to circulate gas through the gas purification loop 3130, the gas purification system 3134 can have a gas circulation unit such as a fan, blower, or motor, and the like. In that regard, a gas purification system can be selected depending on the volume of the enclosure that can define a volume flow rate for moving the inert gas through the gas purification system. For various embodiments of a gas enclosure system having a gas enclosure assembly with a maximum volume of about 4 m ^3, a gas purification system that can travel at about 84 m ³ / hour can be used. For various embodiments of a gas enclosure system having a gas enclosure assembly with a volume of up to about 10 m ^3, a gas purification system that can travel at about 155 m ³ / hour can be used. For various embodiments of gas enclosure assemblies having a volume of about 52-114 m ³ , more than one gas purification system may be used.

  Any suitable gas filter or purification device can be included in the gas purification system 3134 of the present teachings. In some embodiments, the gas purification system can remove one of the devices from the line for maintenance and use the other device to continue system operation without interruption. Can be equipped with two parallel purification devices. In some embodiments, for example, a gas purification system can comprise one or more molecular sieves. In some embodiments, the gas purification system is saturated or inefficient when one of the molecular sieves is saturated with impurities or otherwise considered not operating sufficiently efficiently. At least a first molecular sieve and a second molecular sieve can be provided so that the system can switch to the other molecular sieve while regenerating the molecular sieve. A control unit can be provided to determine the operational efficiency of each molecular sieve, switch the operation of different molecular sieves, regenerate one or more molecular sieves, or a combination thereof. As previously discussed herein, molecular sieves may be regenerated and reused.

  The thermal conditioning system 3140 of FIG. 12 has at least one cooling device having a fluid outlet line 3141 for circulating the coolant into the gas enclosure assembly and a fluid inlet line 3143 for returning the coolant to the cooling device. 3142 may be included. At least one fluid cooling device 3142 may be provided to cool the gas atmosphere within the gas enclosure system 501. For various embodiments of the gas enclosure system of the present teachings, the fluid cooling device 3142 delivers the cooled fluid to a heat exchanger within the enclosure where the inert gas is passed to a filtration system within the enclosure. At least one fluid cooling device may also be provided to the gas enclosure system 501 to cool the heat generated from the device enclosed within the gas enclosure system 501. For example, but not limited to, at least one fluid cooling device can also be provided to the gas enclosure system 501 to cool the heat generated from the OLED printing system. The thermal conditioning system 3140 can comprise a heat exchange or Peltier device and can have various cooling capabilities. For example, for various embodiments of a gas enclosure system, the cooling device can provide a cooling capacity of about 2 kW to about 20 kW. Various embodiments of the gas enclosure system can have multiple fluid cooling devices that can cool one or more fluids. In some embodiments, the fluid cooling device may utilize several fluids as coolants, such as, but not limited to, water, antifreeze agents, refrigerants, and combinations thereof as heat exchange fluids. Appropriate non-leaking locking connections can be used in connecting associated conduits and system components.

  As previously discussed, the present teachings disclose various embodiments of a gas enclosure system that can include a printing system enclosure that defines a first volume and an auxiliary enclosure that defines a second volume. To do. Various embodiments of the gas enclosure system can have an auxiliary enclosure that can be hermetically constructed as a section of the gas enclosure assembly. In accordance with the systems and methods of the present teachings, the auxiliary enclosure can be sealably isolated from the printing system enclosure and is open to the environment outside the gas enclosure assembly without exposing the printing system enclosure to the outside environment. be able to. For example, without limitation, such physical isolation of auxiliary enclosures for performing various printhead management procedures may include contamination of printing system enclosures to contamination such as air and water vapor and various organic vapors, as well as particulate matter contamination. This can be done to eliminate or minimize exposure. Various printhead management procedures, which can include measurement and maintenance procedures on the printhead assembly, can be performed with little or no interruption in the printing process, thereby minimizing downtime of the gas enclosure system Limit or eliminate.

  For various embodiments of the systems and methods of the present teachings, the auxiliary enclosure may be less than or equal to about 1% of the enclosure volume of the gas enclosure system. In various embodiments of the systems and methods of the present teachings, the auxiliary enclosure can be less than or equal to about 2% of the enclosure volume of the gas enclosure system. For various embodiments of the systems and methods of the present teachings, the auxiliary enclosure may be less than or equal to about 5% of the enclosure volume of the gas enclosure system. In various embodiments of the systems and methods of the present teachings, the auxiliary enclosure may be less than or equal to about 10% of the enclosure volume of the gas enclosure system. In various embodiments of the systems and methods of the present teachings, the auxiliary enclosure may be less than or equal to about 20% of the enclosure volume of the gas enclosure system. For example, isolating the auxiliary enclosure from the working volume of the gas enclosure may cause contamination of the entire volume of the gas enclosure when directed to open the auxiliary enclosure to an ambient environment containing reactive gases to perform maintenance procedures. Can be prevented. Further, when considering the relatively small volume of the auxiliary enclosure, the recovery time of the auxiliary enclosure may require significantly less time than the recovery time of the entire printing system enclosure as compared to the printing system enclosure portion of the gas enclosure.

  A gas enclosure system having a printing system enclosure defining a first volume and an auxiliary enclosure defining a second volume is inert and substantially low with little or no interruption of the printing process. Both volumes can be easily integrated with gas circulation, filtration and purification components to form a gas enclosure system that can sustain such an environment for processes that require a particulate environment it can. According to various systems and methods of the present teachings, a printing system enclosure may be introduced at a level of contamination that is sufficiently low so that the purification system can remove the contamination before it can affect the printing process. Good. Various embodiments of the auxiliary enclosure can be a volume that is substantially smaller than the total volume of the gas enclosure assembly, and can quickly recover an inert, low particle environment after exposure to the external environment, thereby printing It can be easily integrated with gas circulation, filtration and purification components to form an auxiliary enclosure system that provides little or no process interruption.

In accordance with the systems and methods of the present teachings, various embodiments of printing system enclosures and auxiliary enclosures constructed as sections of gas enclosure assemblies can be constructed in a manner that provides separately recurring frame member assembly sections. As a non-limiting example, in addition to having all the elements disclosed for the gas enclosure systems 500 and 501, the gas enclosure system 502 of FIG. 13 includes a first of the gas enclosure assembly 1101 that defines a first volume. There may be one gas enclosure assembly section 1101-S1 and a second gas enclosure assembly section 1101-S2 of the gas enclosure assembly 1101 that defines a second volume. If all valves V ₁ , V ₂ , V ₃ , and V ₄ are opened, the gas purification loop 3130 operates essentially as previously described for the gas enclosure assembly and system 1101 of FIG. To do. Due to the closure of V ₃ and V ₄ , only the first gas enclosure assembly section 1101 -S 1 is in fluid communication with the gas purification loop 3130. This valve condition may be, for example, without limitation, the second gas enclosure assembly section 1101-S2 being hermetically closed, thereby opening the second gas enclosure assembly section 1101-S2 to the atmosphere. May be used when isolated from the first gas enclosure assembly section 1101-S1 during various measurement and maintenance procedures that require Due to the closure of V ₁ and V ₂ , only the second gas enclosure assembly section 1101 -S 2 is in fluid communication with the gas purification loop 3130. This valve condition may be used during recovery of the second gas enclosure assembly section 1101-S2, for example, but not limited to, after the section has been opened to the atmosphere. As previously discussed for the present teachings related to FIG. 12, the requirements for the gas purification loop 3130 are specified with respect to the total volume of the gas enclosure assembly 1101. Accordingly, a gas purification system for recovery of a gas enclosure assembly section, such as the second gas enclosure assembly section 1101-S2, depicted for the gas enclosure system 502 of FIG. 13 that the volume is significantly less than the total volume of the gas enclosure 1101. By dedicating resources, recovery time can be substantially reduced.

  In addition, the various embodiments of the auxiliary enclosure can be easily integrated with a dedicated set of environmental conditioning system components such as lighting, gas circulation and filtration, gas purification, and temperature auto-regulation components. In that regard, various embodiments of a gas enclosure system, including an auxiliary enclosure that can be hermetically isolated as part of the gas enclosure assembly, are defined by a gas enclosure assembly that houses a printing system. You can have a controlled environment that is set to be uniform with the volume. Further, various embodiments of a gas enclosure system, including an auxiliary enclosure that can be hermetically isolated as part of a gas enclosure assembly, include a first volume defined by the gas enclosure assembly that houses the printing system. It is possible to have a controlled environment that is set differently than the controlled environment.

Various embodiments of the gas enclosure assembly utilized in the gas enclosure system embodiments of the present teachings minimize the internal volume of the gas enclosure assembly while at the same time adapting to different footprints of the OLED printing system design. Recall that it can be constructed in a contoured fashion that optimizes the working volume. For example, various embodiments of the contour gas enclosure assembly according to the present teachings may be from about 6 m ³ to about 6 for various embodiments of the gas enclosure assembly of the present teachings, for example, covering a substrate size of Gen 3.5 to Gen 10. It can have a gas enclosure volume of 95 m ³ . Various embodiments of a contour gas enclosure assembly according to the present teachings may be useful for, for example, Gen 5.5 to Gen 8.5 substrate size OLED printing, such as, but not limited to, about 15 m ³ to about 30 m ³ . It can have a gas enclosure volume. Various embodiments of the auxiliary enclosure are constructed as a section of a gas enclosure assembly that can sustain such an environment for processes that require an inert, substantially low-particle environment. Can be easily integrated with gas circulation and filtration, and purification components.

  As shown in FIGS. 12 and 13, various embodiments of the gas enclosure system can include a pressurized inert gas recirculation system 3000. Various embodiments of the pressurized inert gas recirculation loop may utilize a compressor, blower, and combinations thereof.

  For example, as shown in FIGS. 14 and 15, various embodiments of gas enclosure system 503 and gas enclosure system 504 are not suitable for use in various aspects of the operation of gas enclosure system 503 and gas enclosure system 504. An external gas loop 3200 for integrating and controlling the active gas source 3201 and the clean dry air (CDA) source 3203 can be provided. Gas enclosure system 503 and gas enclosure system 504 can also include various embodiments of internal particle filtration and gas circulation systems, as well as various embodiments of external gas purification systems, as previously described. Such embodiments of the gas enclosure system can include a gas purification system for purifying various reactive species from an inert gas. Some commonly used non-limiting examples of inert gases can include nitrogen, any of the noble gases, and any combination thereof. Various embodiments of gas purification systems according to the present teachings provide various levels of various reactive species, including various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapor, at or below 100 ppm, for example, It can be maintained at 10 ppm or lower, 1.0 ppm or lower, or 0.1 ppm or lower. In addition to the outer loop 3200 for integrating and controlling the inert gas source 3201 and the CDA source 3203, the gas enclosure assembly 503 and the gas enclosure system 504 are located within the gas enclosure system 503 and the gas enclosure system 504. Can have a compressor loop 3250 that can supply an inert gas for operating various devices and apparatus.

  The compressor loop 3250 of FIG. 14 can include a compressor 3262, a first accumulator 3264, and a second accumulator 3268 configured to be in fluid communication. The compressor 3262 can be configured to compress the inert gas drawn from the gas enclosure assembly 1101 to a desired pressure. The inlet side of the compressor loop 3250 can be in fluid communication with the gas enclosure assembly 1101 through the gas enclosure assembly outlet 3252 through a line 3254 having a valve 3256 and a check valve 3258. The compressor loop 3250 can be in fluid communication with the gas enclosure assembly 1101 at the outlet side of the compressor loop 3250 via the outer gas loop 3200. The accumulator 3264 can be positioned between the compressor 3262 and the junction of the compressor loop 3250 with the external gas loop 3200 and can be configured to generate a pressure of 5 psig or higher. A second accumulator 3268 may be in the compressor loop 3250 to provide a declining variation due to compressor piston circulation at about 60 Hz. For various embodiments of the compressor loop 3250, the first accumulator 3264 can have a capacity between about 80 gallons and about 160 gallons, while the second accumulator is about 30 gallons to about 60 gallons. You can have a capacity between. According to various embodiments of the gas enclosure system 503, the compressor 3262 may be a zero entry compressor. Various types of zero-entry compressors can operate without leaking atmospheric gas into various embodiments of the gas enclosure system of the present teachings. Various embodiments of the zero entry compressor can be performed continuously during the OLED printing process, for example, utilizing the use of various devices and apparatus that require a compressed inert gas.

  The accumulator 3264 can be configured to receive and accumulate compressed inert gas from the compressor 3262. The accumulator 3264 can supply a compressed inert gas as needed in the gas enclosure assembly 1101. For example, accumulator 3264 may include, but is not limited to, a gas enclosure assembly such as one or more of a pneumatic robot, a substrate floating table, an air bearing, an air bushing, a compressed gas tool, a pneumatic actuator, and combinations thereof. Gas can be provided to maintain pressure for the various components of 1101. As shown in FIG. 14 for the gas enclosure system 503, the gas enclosure assembly 1101 can have an OLED printing system 2000 enclosed therein. As schematically depicted in FIG. 14, the inkjet printing system 2000 can be supported by a printing system base 2100, which can be a granite stage. The printing system base 2100 can support substrate support devices such as chucks, such as, but not limited to, vacuum chucks, substrate floating chucks having pressure ports, and substrate floating chucks having vacuum and pressure ports. In various embodiments of the present teachings, the substrate support apparatus may be a substrate floating table, such as the substrate floating table 2200 depicted in FIG. The substrate floating table 2200 can be used for frictionless support of the substrate. In addition to the low particle generation floating table, the printing system 2000 can have a Y-axis motion system that utilizes air bushings for frictionless Y-axis transport of the substrate. In addition, the printing system 2000 can have at least one X, Z axis carriage assembly with motion control provided by the low particle generation X axis air bearing assembly. For example, various components of a low particle generation motion system such as an X-axis air bearing assembly can be used in place of various particle generation linear mechanical bearing systems. For various embodiments of the gas enclosures and systems of the present teachings, the use of various air-operated devices and apparatus can provide low particle generation performance and is less cumbersome to maintain. The compressor loop 3250 can be configured to continuously supply pressurized inert gas to various devices and apparatuses of the gas enclosure system 503. In addition to supplying a pressurized inert gas, the substrate floating table 2200 of the inkjet printing system 2000 utilizing air bearing technology is also in fluid communication with the gas enclosure assembly 1101 through line 3272 when the valve 3274 is in the open position. A vacuum system 3270 is also utilized.

  The pressurized inert gas recirculation system according to the present teachings acts to compensate for the variable demand for pressurized gas during use, thereby providing dynamic equilibrium for various embodiments of the gas enclosure system of the present teachings. There may be provided a pressure control bypass loop 3260 as shown in FIG. 14 for the compressor loop 3250. For various embodiments of a gas enclosure system according to the present teachings, a bypass loop can maintain a constant pressure in the accumulator 3264 without disturbing or changing the pressure in the enclosure 1101. The bypass loop 3260 can have a first bypass inlet valve 3261 on the inlet side of the bypass loop that is closed unless the bypass loop 3260 is used. The bypass loop 3260 can also have a back pressure regulator 3266 that can be used when the second valve 3263 is closed. The bypass loop 3260 can have a second accumulator 3268 disposed on the exit side of the bypass loop 3260. For an embodiment of a compressor loop 3250 that utilizes a zero entry compressor, the bypass loop 3260 can compensate for slight pressure deviations that may occur over time during use of the gas enclosure system. The bypass loop 3260 can be in fluid communication with the compressor loop 3250 on the inlet side of the bypass loop 3260 when the bypass inlet valve 3261 is in the open position. When the bypass inlet valve 3261 is opened, if the inert gas from the compressor loop 3250 is not required within the interior of the gas enclosure assembly 1101, the inert gas that is diverted through the bypass loop 3260 is recycled to the compressor. It can be circulated. The compressor loop 3250 is configured to divert the inert gas through the bypass loop 3260 when the pressure of the inert gas in the accumulator 3264 exceeds a preset threshold pressure. The preset threshold pressure of the accumulator 3264 is between about 25 psig to about 200 psig at a flow rate of at least about 1 cubic foot / minute (cfm), or about 50 psig to about 200 at a flow rate of at least about 1 cubic foot / minute (cfm). It can be between 150 psig, or between about 75 psig to about 125 psig at a flow rate of at least about 1 cubic foot per minute (cfm), or between about 90 psig to about 95 psig at a flow rate of at least about 1 cubic foot per minute (cfm). .

  Various embodiments of the compressor loop 3250 utilize a variety of compressors other than zero entry compressors, such as variable speed compressors or compressors that can be controlled to be either on or off. can do. As previously discussed, the zero entry compressor ensures that no atmospheric reactive species can be introduced into the gas enclosure system. Thus, any compressor configuration that prevents atmospheric reactive species from being introduced into the gas enclosure system can be utilized for the compressor loop 3250. According to various embodiments, the compressor 3262 of the gas enclosure system 503 can be housed in, for example, but not limited to, a sealed enclosure. The interior of the housing can be configured in fluid communication with an inert gas source, eg, the same inert gas that forms an inert gas atmosphere for the gas enclosure assembly 1101. For the various embodiments of the compressor loop 3250, the compressor 3262 can be controlled at a constant speed to maintain a constant pressure. In another embodiment of the compressor loop 3250 that does not utilize a zero entry compressor, the compressor 3262 can be turned off when the maximum threshold pressure is reached and turned on when the minimum threshold pressure is reached.

  In FIG. 15 of the gas enclosure system 504, a blower loop 3280 that utilizes a vacuum blower 3290 is shown for operation of the substrate floating table 2200 of the inkjet printing system 2000 housed in the gas enclosure assembly 1101. As previously discussed for the compressor loop 3250, the blower loop 3280 can be configured to continuously supply pressurized inert gas to the substrate floating table 2200 of the printing system 2000.

  Various embodiments of gas enclosure systems that can utilize a pressurized inert gas recirculation system utilize a variety of pressurized gas sources, such as at least one of a compressor, a blower, and combinations thereof. Can have various loops. In FIG. 15 of gas enclosure system 504, compressor loop 3250 can be in fluid communication with external gas loop 3200, which can be used to supply inert gas for high consumption manifold 3225 as well as low consumption manifold 3215. . According to various embodiments of a gas enclosure system according to the present teachings as shown in FIG. 15 for a gas enclosure system 504, including, but not limited to, a substrate floating table, a pneumatic robot, an air bearing, an air bushing, and a compressed gas tool, and A high consumption manifold 3225 can be used to supply inert gas to various devices and apparatus, such as one or more of their combinations. For various embodiments of gas enclosure systems according to the present teachings, low consumption 3215 can be applied to various apparatus and devices such as, but not limited to, isolators and pneumatic actuators, and one or more of a combination thereof. It can be used to supply an inert gas.

For various embodiments of the gas enclosure system 504 of FIG. 15, while the blower loop 3280 can be utilized to supply pressurized inert gas to the various embodiments of the floating substrate table 2200, for example, Although not in fluid communication with external gas loop 3200 to provide pressurized inert gas to one or more of pneumatic robots, air bearings, air bushings, and compressed gas tools, and combinations thereof A compressor loop 3250 can be used. In addition to supplying pressurized inert gas, the substrate floating table 2200 of the OLED inkjet printing system 2000, which utilizes air bearing technology, is also connected to the gas enclosure assembly 1101 through line 3292 when the valve 3294 is in the open position. A blower vacuum 3290 in communication is also used. The housing 3282 of the blower loop 3280 has a first blower 3284 for supplying a pressurized source of inert gas to the floating substrate table 2200, and a floating substrate housed in an inert gas environment within the gas enclosure assembly 1101. A second blower 3290 can be maintained that acts as a vacuum source for the formula table 2200. Attributes that can make a blower suitable for use as either a pressurized inert gas or a vacuum source for various embodiments of a substrate floating table are, for example, that they are highly reliable, It is possible to provide a flow rate between about 100 m ³ / hour to about 2500 m ³ / hour, with a wide range of flow rates, with variable speed control, making them less cumbersome to maintain Including but not limited to various embodiments. Various embodiments of the blower loop 3280 additionally include a first isolation valve 3283 at the inlet end of the compressor loop 3280 and a check valve 3285 and a second isolation valve 3287 at the outlet end of the blower loop 3280. Can have. Various embodiments of the blower loop 3280 may be, for example, without limitation, an adjustable valve 3286, which may be a gate, butterfly, needle, or ball valve, and the blower loop 3280 to the substrate floating table 2200 at a specified temperature. There may be a heat exchanger 3288 for maintaining the inert gas.

  15 integrates and controls an inert gas source 3201 and a clean dry air (CDA) source 3203 for use in various aspects of the operation of the gas enclosure system 503 of FIG. 14 and the gas enclosure system 504 of FIG. FIG. 14 depicts an external gas loop 3200 as also shown in FIG. The outer gas loop 3200 of FIGS. 14 and 15 can include at least four mechanical valves. These valves include a first mechanical valve 3202, a second mechanical valve 3204, a third mechanical valve 3206, and a fourth mechanical valve 3208. These various valves are located in various flow lines that allow control of both an inert gas and an air source such as clean dry air (CDA). According to the present teachings, the inert gas may be any gas that does not undergo a chemical reaction under a defined set of conditions. Some commonly used non-limiting examples of inert gases can include nitrogen, any of the noble gases, and any combination thereof. A built-in inert gas line 3210 extends from the built-in inert gas source 3201. The built-in inert gas line 3210 continues to extend linearly as a low consumption manifold line 3212 in fluid communication with the low consumption manifold 3215. The first section 3214 of the intersection line extends from a first flow junction 3216 located at the intersection of the built-in inert gas line 3210, the low consumption manifold line 3212, and the first section 3214 of the intersection line. The first section 3214 of the intersection line extends to the second fluid junction 3218. The compressor inert gas line 3220 extends from the accumulator 3264 of the compressor loop 3250 and terminates at a second flow junction 3218. CDA line 3222 continues as high consumption manifold line 3224 extending from CDA source 3203 and in fluid communication with high consumption manifold 3225. Third flow junction 3226 is located at the intersection of second section 3228 of crossing line, clean dry air line 3222, and high consumption manifold line 3224. A second section 3228 of the intersection line extends from the second fluid junction 3218 to the third fluid junction 3226. A high consumption manifold 3225 may be used to supply various components that are high consumption to the CDA during maintenance. By isolating the compressor using valves 3204, 3208, and 3230, reactive species such as oxygen and water vapor can be prevented from contaminating the inert gas in the compressor and accumulator.

  Various embodiments of continuous circulation and filtration of inert gas in a gas enclosure assembly can provide maintaining a substantially low particle environment within the various embodiments of the gas enclosure system. Is part of. Various embodiments of the gas circulation and filtration system are described in International Standards Organization (ISO) 1464-1: 1999, “Cleanrooms and associated controllants: Part 1 of the Standard Standards Class 1 to Class 5”. It can be designed to provide a low particle environment for suspended particulate matter that meets the " In addition, various components of the particle control system can discharge particulate matter into the gas circulation and filtration system to maintain a low particle zone proximal to the substrate. The determination of suspended particulate matter can be made to various embodiments of the gas enclosure system prior to the printing process for system verification, for example, using a portable particle counting device. In various embodiments of the gas enclosure system, the determination of suspended particulate matter can be performed as an ongoing quality check while the substrate is being printed. For various embodiments of the gas enclosure system, the determination of suspended particulate matter may be performed for system verification before the substrate is printed, and in addition while the substrate is being printed. it can.

  Various embodiments of the gas circulation and filtration system are depicted in FIGS. 16-18. According to various embodiments of the gas circulation and filtration system of the present teachings, piping can be installed in the interior formed by the joining of wall frame and ceiling frame members. For various embodiments of the gas enclosure assembly, piping may be installed during the build process. According to various embodiments of the present teachings, the tubing may be installed in a gas enclosure frame assembly that is constructed from a plurality of frame members. In various embodiments, the tubing can be installed on multiple frame members before being joined to form a gas enclosure frame assembly. The piping for the various embodiments of the gas enclosure system is such that substantially all the gas drawn into the piping from one or more piping inlets removes particulate matter inside the gas enclosure assembly. The gas filtration loop can be configured to be moved through various embodiments. In addition, the piping of the various embodiments of the gas enclosure system connects the gas purification loop inlet and outlet outside the gas enclosure assembly from the gas filtration loop for removing particulate matter inside the gas enclosure assembly. It can be configured to separate. Various embodiments of piping according to the present teachings can be fabricated from metal sheets, such as, but not limited to, aluminum sheets having a thickness of about 80 mils.

  FIG. 16 depicts a right front perspective view of a circulation and filtration system 1500 that can include a piping assembly 1501 and a fan filter unit assembly 1502 of the gas enclosure assembly 100. The enclosure piping assembly 1501 can have a front wall panel piping assembly 1510. As shown, the front wall panel plumbing assembly 1510 includes a front wall panel inlet duct 1512 and a first front wall panel riser 1514 and a second front wall, both in fluid communication with the front wall panel inlet duct 1512. A panel riser 1516. The first front wall panel riser 1514 is shown having an outlet 1515 that sealably engages the ceiling duct 1505 of the fan filter unit 103. Similarly, the second front wall panel riser 1516 is shown having an outlet 1517 that is sealingly engaged with the ceiling duct 1507 of the fan filter unit 103. In that regard, the front wall panel plumbing assembly 1510 circulates an inert gas in the gas enclosure system from the bottom, utilizes the front wall panel inlet duct 1512 through each front wall panel riser 1514 and 1516, and, for example, Air delivery is provided through outlets 1505 and 1507, respectively, so that air can be filtered by fan filter unit 1552 of fan filter unit assembly 1502. Proximal fan filter unit 1552 is a heat exchanger 1562 that can maintain an inert gas circulating through the gas enclosure assembly 100 at a desired temperature as part of a thermal conditioning system.

  The right wall panel piping assembly 1530 has a right wall panel inlet duct 1532 that is in fluid communication with the upper duct 1538 of the right wall panel through the first riser 1534 of the right wall panel and the second riser 1536 of the right wall panel. be able to. The upper duct 1538 of the right wall panel can have a first duct inlet end 1535 and a second duct outlet end 1537, which second duct outlet end 1537 is a rear wall piping assembly 1540. In fluid communication with the upper duct 1546 of the rear wall panel. The left wall panel piping assembly 1520 can have the same components as those described for the right wall panel assembly 1530, of which the left through the first left wall panel riser 1524 and the first left wall panel riser 1524. A left wall panel inlet duct 1522 in fluid communication with the upper duct (not shown) of the wall panel is visible in FIG. The rear wall panel piping assembly 1540 can have a rear wall panel inlet duct 1542 in fluid communication with the left wall panel assembly 1520 and the right wall panel assembly 1530. In addition, the rear wall panel piping assembly 1540 can have a rear wall panel bottom duct 1544 that can have a rear wall panel first inlet 1541 and a rear wall panel second inlet 1543. The bottom duct 1544 of the rear wall panel can be in fluid communication with the upper duct 1546 of the rear wall panel via a first bulkhead 1547 and a second bulkhead 1549, the bulkhead structure being, for example, limited Although not, it can be used to deliver services from the exterior of the gas enclosure assembly 100 into the interior. According to the present teachings, service bundles can include, for example, without limitation, optical cables, electrical cables, wires and tubing, and the like. A variety of service bundles that can be operatively connected from various systems and assemblies so that a manufacturing facility provides the optical, electrical, mechanical, and fluid connections needed to operate the printing system. Recall that a significant length may be required. The duct opening 1533 provides for moving at least one service bundle out of the rear wall panel upper duct 1546 that can be passed through the upper duct 1546 of the rear wall panel via the bulkhead 1549. Bulkhead 1547 and bulkhead 1549 can be sealed externally using a removable inset panel as previously described. The upper duct of the rear wall panel is in fluid communication with a fan filter unit 1554, for example, but not limited to, through a vent 545, the corner of which is shown in FIG. In that regard, the left wall panel piping assembly 1520, the right wall panel piping assembly 1530, and the rear wall panel piping assembly 1540 can be routed through various risers, ducts, bulkhead passages, and the like, as previously described. Utilizing wall panel inlet ducts 1522, 1532, and 1542, respectively, and rear panel lower duct 1544, which are in fluid communication with vents 1545, to circulate inert gas in the gas enclosure assembly from the bottom. provide. Thus, for example, air may be filtered by the fan filter unit 1554 of the fan filter unit assembly 1502 of the circulation and filtration system 1500. Proximal fan filter unit 1554 is a heat exchanger 1564 that can maintain an inert gas circulating through the gas enclosure assembly 100 at a desired temperature as part of a thermal conditioning system. Fan filter unit assembly 1502, etc., including fan filter units 1552 and 1554 of circulation and filtration system 1500 according to the physical location of the substrate in the printing system being processed, as will be discussed in more detail later herein The number, size, and shape of fan filter units for the fan filter unit assembly can be selected. The number, size, and shape of the fan filter units for the fan filter unit assembly, selected with respect to the physical movement of the substrate, can provide a low particle zone proximal to the substrate during the substrate manufacturing process. It can be an element of a particle gas enclosure system.

  In FIG. 16, cable feeding through opening 1533 is shown. As discussed in more detail later herein, various embodiments of the gas enclosure assembly of the present teachings provide for carrying a service bundle through piping. In order to eliminate leakage paths formed around such service bundles, various approaches are used to seal different sized cables, wires, and tubing in service bundles that use conformable materials be able to. Also shown in FIG. 16 are conduit I and conduit II shown as part of fan filter unit 103 for enclosure piping assembly 1501. Conduit I provides an inert gas outlet to an external gas purification system, while Conduit II provides a return of purified inert gas to the internal circulation and filtration loop of gas enclosure assembly 100.

  In FIG. 17, a top perspective view of the enclosure piping assembly 1501 is shown. The symmetry of the left wall panel piping assembly 1520 and the right wall panel piping assembly 1530 can be seen. For the right wall panel piping assembly 1530, the right wall panel inlet duct 1532 is in fluid communication with the upper duct 1538 of the right wall panel through the first riser 1534 of the right wall panel and the second riser 1536 of the right wall panel. The upper duct 1538 of the right wall panel can have a first duct inlet end 1535 and a second duct outlet end 1537, which second duct outlet end 1537 is a rear wall piping assembly 1540. In fluid communication with the upper duct 1546 of the rear wall panel. Similarly, the left wall panel piping assembly 1520 is in left wall panel inlet duct in fluid communication with the left wall panel upper duct 1528 through the left wall panel first riser 1524 and the left wall panel second riser 1526. 1522 may be included. The upper duct 1528 of the left wall panel can have a first duct inlet end 1525 and a second duct outlet end 1527 that is connected to the rear wall piping assembly 1540. In fluid communication with the upper duct 1546 of the rear wall panel. In addition, the rear wall panel piping assembly can have a rear wall panel inlet duct 1542 in fluid communication with the left wall panel assembly 1520 and the right wall panel assembly 1530. In addition, the rear wall panel piping assembly 1540 can have a rear wall panel bottom duct 1544 that can have a rear wall panel first inlet 1541 and a rear wall panel second inlet 1543. The bottom duct 1544 of the rear wall panel can be in fluid communication with the upper duct 1546 of the rear wall panel via the first bulkhead 1547 and the second bulkhead 1549. A piping assembly 1501 as shown in FIGS. 16 and 17 circulates inert gas from the front wall panel inlet duct 1512 to the ceiling panel ducts 1505 and 1507 via the front wall panel outlets 1515 and 1517, respectively. From wall panel piping assembly 1510 and from left wall panel assembly 1520, right wall panel assembly 1530, and rear wall panel piping assembly 1540 that circulate air from inlet ducts 1522, 1532, and 1542 to vents 1545, respectively. An effective circulation of inert gas can be provided. Once the inert gas is exhausted into the enclosure region under the fan filter unit 103 of the enclosure 100 via the ceiling panel ducts 1505 and 1507 and the vent 1545, the exhausted inert gas is exhausted. Can be filtered through fan filter units 1552 and 1554 of fan filter unit assembly 1502. In addition, the circulated inert gas can be maintained at a desired temperature by heat exchangers 1562 and 1564 that are part of the heat regulation system.

  FIG. 18 is a bottom perspective view of the enclosure piping assembly 1501. Inlet piping assembly 1509 includes a front wall panel inlet duct 1512, a left wall panel inlet duct 1522, a right wall panel inlet duct 1532, and a rear wall panel inlet duct 1542 that are in fluid communication with each other. As previously discussed herein, conduit I provides an inert gas outlet to an external gas purification system, while conduit II connects to the internal circulation and filtration loop of gas enclosure assembly 100. Provide return of purified inert gas.

  For each inlet duct included in the inlet piping assembly 1509, there is a clear opening evenly distributed across the bottom of each duct, the set includes the opening 1511 of the front wall panel inlet duct 1512, the left wall panel The opening 1521 of the inlet duct 1522, the opening 1531 of the right wall panel inlet duct 1532, and the opening 1541 of the right wall panel inlet duct 1542 are specifically highlighted for purposes of this teaching. Such openings, visible across the bottom of each inlet duct, provide effective entrapment of inert gas within the enclosure 100 for continuous circulation and filtration. The continuous circulation and filtration of inert gas in various embodiments of the gas enclosure assembly can provide for maintaining a substantially low particle environment within the various embodiments of the gas enclosure system. It is a part. Various embodiments of the gas circulation and filtration system to maintain suspended particulate matter levels that meet International Standards Standard (ISO) 146444-1: 1999 standards as specified by Class 1 to Class 5. Can be designed to provide a low particle environment. In addition, a service bundle that can include cables, wires and tubing, and the like bundled together, can serve as a particulate material source. Thus, having a service bundle delivered through the piping allows the particulate material to be discharged through the circulation and filtration system, containing the identified particle source in the piping.

  Various embodiments of the gas enclosure system can maintain a substantially low particle environment that provides on-substrate particle specifications for particles from about 0.1 μm or greater to about 10 μm or greater. Can have a particle control system. Various embodiments of particle-on-substrate specifications easily convert from an average particle-on-substrate distribution per square meter of substrate per minute to an average particle-on-substrate distribution per substrate per minute for each target particle size range. can do. As previously discussed herein, such conversion can be easily performed, for example, through a known relationship between a substrate of a specific generation size and a corresponding area of the substrate generation. . In addition, the average particle distribution on the substrate per square meter of substrate per minute can be easily converted to any of a variety of unit time representations. For example, in addition to standard time units, eg, conversion between seconds, minutes, days, units of time that are specific to the process can be used. For example, a print cycle can be associated with a unit of time, as previously discussed herein.

  Various embodiments of the low particle gas enclosure system of the present teachings meet on-substrate deposition rate specifications for particles of less than or equal to about 100 per square meter of substrate per minute for particles greater than or equal to 10 μm in size. A low particle environment can be maintained that provides an average particle distribution on the substrate. Various embodiments of the low particle gas enclosure system of the present teachings meet on-substrate deposition rate specifications for particles less than or equal to about 100 per square meter of substrate per minute for particles greater than or equal to 5 μm in size. A low particle environment can be maintained that provides an average particle distribution on the substrate. In various embodiments of the gas enclosure system of the present teachings, on particles with a size greater than or equal to 2 μm, on an average substrate that meets a deposition rate on the substrate of particles less than or equal to about 100 per square meter of substrate per minute A low particle environment can be maintained that provides particle distribution. In various embodiments of the gas enclosure system of the present teachings, on particles having a size greater than or equal to 1 μm and satisfying a deposition rate on the substrate of particles less than or equal to about 100 per square meter of substrate per minute A low particle environment can be maintained that provides particle distribution. Various embodiments of the low particle gas enclosure system of the present teachings satisfy a deposition rate on the substrate of particles less than or equal to about 1000 per square meter of substrate per minute for particles greater than or equal to 0.5 μm in size. A low particle environment can be maintained, providing an average particle distribution on the substrate. For various embodiments of the gas enclosure system of the present teachings, satisfy a deposition rate on the substrate of particles less than or equal to about 1000 per square meter of substrate per minute for particles greater than or equal to 0.3 μm in size. A low particle environment can be maintained that provides an average particle distribution on the substrate. Various embodiments of the low particle gas enclosure system of the present teachings satisfy a deposition rate on the substrate of particles less than or equal to about 1000 per square meter of substrate per minute for particles greater than or equal to 0.1 μm in size. A low particle environment can be maintained, providing an average particle distribution on the substrate.

  A manufacturing facility can be operatively connected from various devices and systems, for example, to provide the optical, electrical, mechanical, and fluidic connections required to operate the printing system. It can require a significant length of service bundle. According to the present teachings, service bundles can include, for example, without limitation, optical cables, electrical cables, wires and tubing, and the like. Various embodiments of service bundles in accordance with the present teachings result in significant overall results as a result of a substantial number of gaps created by bundling together various cables, wires and tubing, and the like in the service bundle. May have a dead volume. Due to a significant number of gaps in the service bundle, the total dead volume can result in the retention of a significant amount of reactive gas species occluded therein. Such a significant reactive atmospheric gas source can significantly increase the recovery time of the gas enclosure assembly, for example after maintenance.

  Thus, in addition to providing the particle control system components, delivering the service bundle through piping can reduce the recovery time of the gas enclosure assembly for the reactive species, thereby reducing the air sensitive process. Return the gas enclosure assembly more quickly to specifications to do. Various embodiments of the gas enclosure system of the present teachings useful for printing OLED devices include various reactive atmospheric gases such as water vapor and oxygen, and various levels of various reactive species, including organic solvent vapors. Can be maintained at 100 ppm or lower, such as 10 ppm or lower, 1.0 ppm or lower, or 0.1 ppm or lower.

  From the dead volume created by the gaps in the service bundle, where cable laying delivered through the piping is created as a result of bundling various optical cables, electrical cables, wires and fluid tubing, and the like To understand how a reduction in the time taken to purge the occluded reactive atmospheric gas can be provided, reference is made to FIGS. 19A, 19B, and 20. FIG. FIG. 19A is a bundle that can include tubing, such as tubing A, which can be, for example, for delivering various inks, solvents, and the like to a printing system, such as printing system 1050 of FIG. 13A. Depicts an enlarged view of a possible service bundle I. The service bundle 1 of FIG. 19A can additionally include cable laying such as electrical wiring, such as lead B, or cable C, which can be a coaxial or optical cable. Such tubing, wires, and cables included in the service bundle can be routed from outside to inside to be connected to various devices and apparatuses that comprise an OLED printing system. As seen in the shaded area of FIG. 19A, gaps in the service bundle can create a perceivable dead volume D. In the schematic perspective view of FIG. 19B, when the service bundle I is delivered through the duct II, the inert gas III can continuously pass through the tube. The enlarged cross-sectional view of FIG. 20 shows how effective the inert gas continuously passing through the bundled tubing, wires, and cables can effectively remove the occluded reactive species from the dead volume formed in the service bundle. Describe what can be increased. The diffusion rate of the reactive species A out of the dead volume, shown in FIG. 20 by the collecting area occupied by the species A, is the dead volume of the dead volume shown in FIG. 20 by the collecting region occupied by the inert gas species B. It is inversely proportional to the concentration of the outer reactive species. That is, if the concentration of reactive species is high in the volume just outside the dead volume, the diffusion rate is reduced. If the reactive species concentration in such a region is continuously reduced from the volume just outside the dead volume by the flow of inert gas and then by mass action, the rate at which the reactive species diffuses from the dead volume is increased. Increased. In addition, by the same principle, the inert gas can diffuse into the dead volume when the occluded reactive species are effectively removed out of these spaces.

  FIG. 21A is a perspective view of the rear corner of various embodiments of the gas enclosure assembly 101 with a perspective view through the return duct 1605 into the gas enclosure assembly 101. For various embodiments of the gas enclosure assembly 101, the back wall panel 1640 can have a mating panel 1610 that is configured to provide, for example, access to an electrical bulkhead. The service bundle, such as duct 1632 shown in the right wall panel 1630, has been removed with a removable inset panel to reveal the service bundle sent into the first service bundle duct inlet 636. It can be fed through the bulkhead into the cable routing duct. From there, the service bundle can be delivered into the interior of the gas enclosure assembly 101 and is shown in a perspective view through a return duct 1605 in the interior of the gas enclosure assembly 101. Various embodiments of a gas enclosure assembly for service bundle routing are illustrated in FIG. 21A depicting a first service bundle duct inlet 1634 and a second service bundle duct inlet 1636 for yet another service bundle. There can be more than one service bundle entry. FIG. 21B depicts an enlarged view of the first service bundle duct inlet 1634 for cables, wires, and tubing bundles. The first service bundle duct inlet 1634 can have an opening 1631 that is designed to form a seal with the sliding cover 1633. In various embodiments, the opening 1631 is provided by the Roxtec Company for cable entry seals that can accommodate various diameters of cables, wires and tubing, and the like in a service bundle. It can be applied to flexible sealing modules such as. Alternatively, the top 1635 of the sliding cover 1633 and the upper portion 1637 of the opening 1631 can be used to route cables, wires and wires in a service bundle in which conformable material is fed through an inlet, such as the first service bundle duct inlet 1634. Tubing, as well as equivalents, may have matching material disposed on each surface so that a seal can be formed around various sized diameters.

  As depicted in FIGS. 22 and 23, one or more fan filter units can be configured to provide a substantially laminar gas flow through the interior of the gas enclosure assembly. According to various embodiments of the circulation and filtration system for a gas enclosure assembly of the present teachings, one or more fan units are disposed adjacent to the first inner surface of the gas enclosure assembly and are one or more. Greater than the piping inlet is disposed adjacent to the second opposite inner surface of the gas enclosure assembly. For example, as shown in FIGS. 16-18, the gas enclosure assembly can include an interior ceiling and a bottom interior perimeter, and one or more fan units can be positioned adjacent to the interior ceiling. One or more piping inlets may comprise a plurality of inlet openings disposed adjacent to the bottom interior perimeter that is part of the piping system.

  FIG. 22 is a cross-sectional view taken along the length of the gas enclosure system 505 in accordance with various embodiments of the present teachings. The gas enclosure system 505 of FIG. 22 includes a gas enclosure assembly 1100 that can house an OLED inkjet printing system 2001, as well as a circulation and filtration system 1500, a gas purification system 3130 (FIGS. 12 and 13), and a thermal conditioning system 3140. Can be included. Circulation and filtration system 1500 can include a piping assembly 1501 and a fan filter unit assembly 1502. The thermal conditioning system 3140 can include a fluid cooling device 3142 in fluid communication with the cooling device outlet line 3141 and the cooling device inlet line 3143. The cooled fluid exits the fluid cooler 3142 and flows through the cooler outlet line 3141 and, as shown in FIG. 22, for each of the plurality of fan filter units for various embodiments of the gas enclosure system. To the heat exchanger, which can be located in the Fluid can be returned from the heat exchanger proximal to the fan filter unit through the cooling device inlet line 3143 to the cooling device 3142 so that it is maintained at a constant desired temperature. As previously discussed herein, the chiller outlet line 3141 and the chiller inlet line 3143 connect the first heat exchanger 1562, the second heat exchanger 1564, and the third heat exchanger 1566. In fluid communication with a plurality of heat exchangers. According to various embodiments of the gas enclosure system 505 as shown in FIG. 22, the first heat exchanger 1562, the second heat exchanger 1564, and the third heat exchanger 1566 are circulated and filtered, respectively. In thermal communication with the first fan filter unit 1552, the second fan filter unit 1554, and the third fan filter unit 1556 of the fan filter unit assembly 1502 of the system 1500.

  In FIG. 22, a number of arrows depict that the air flow in the circulation and filtration system 1500 provides low particle filtered air within the gas enclosure assembly 1100. In FIG. 22, the piping assembly 1501 can include a first piping conduit 1573 and a second piping conduit 1574, as depicted in the simplified schematic diagram of FIG. The first piping conduit 1573 can receive gas through the first piping inlet 1571 and can exit through the first piping outlet 1575. Similarly, the second piping conduit 1574 can receive gas exiting through the second piping outlet 1576 through the second piping inlet 1572. In addition, as shown in FIG. 22, the piping assembly 1501 effectively defines a space 1580 that can be in fluid communication with the gas purification system 3130 via the gas purification outlet line 3131 and the gas purification inlet line 3133. Thereby separating the inert gas recirculated internally through the fan filter unit assembly 1502. Such a circulation system, including various embodiments of the piping system as described with respect to FIGS. 16-18, provides substantially laminar flow, minimizes turbulence, and reduces the internal volume of the enclosure. Facilitates circulation, conversion, and filtration of particulate matter in the gas atmosphere and provides circulation through a gas purification system external to the gas enclosure assembly.

  FIG. 23 is a cross-sectional view taken along the length of a gas enclosure system 506 in accordance with various embodiments of a gas enclosure system according to the present teachings. Like the gas enclosure system 505 of FIG. 22, the gas enclosure system 506 of FIG. 23 includes a gas enclosure assembly 1100 that can house the OLED inkjet printing system 2001, as well as a circulation and filtration system 1500, a gas purification system 3130 (FIG. 15). ), And a thermal conditioning system 3140. Circulation and filtration system 1500 can include a piping assembly 1501 and a fan filter unit assembly 1502. For various embodiments of the gas enclosure system 506, a thermal conditioning system 3140, including a chiller outlet line 3141 and a fluid chiller 3142 in fluid communication with the chiller inlet line 3143, as depicted in FIG. A plurality of heat exchangers, for example, a first heat exchanger 1562 and a second heat exchanger 1564 can be in fluid communication. According to various embodiments of the gas enclosure system 506 as shown in FIG. 22, various heat exchangers, such as the first heat exchanger 1562 and the second heat exchanger 1564, may be connected to the first of the piping assembly 1501. By being positioned proximal to duct outlets such as pipe outlet 1575 and second pipe outlet 1576, thermal communication with the circulating inert gas can be achieved. In that regard, the inert gas being returned for filtration from duct inlets, such as duct inlets, such as the first pipe inlet 1571 and the second pipe inlet 1572, of the pipe assembly 1501, for example, is shown in FIG. Prior to being circulated through the first fan filter unit 1552, the second fan filter unit 1554, and the third fan filter unit 1556 of the fan filter unit assembly 1502, thermal adjustment can be made.

  As can be seen from the arrows indicating the direction of inert gas circulation through the enclosure of FIGS. 22 and 23, the fan filter unit is substantially laminar flow downward from the top of the enclosure to the bottom. Can be configured to provide. For example, fan filter units available from the Flanders Corporation (Washington, North Carolina) or Envirco Corporation (Sanford, North Carolina) may be useful for incorporation into various embodiments of gas enclosure assemblies according to the present teachings. Various embodiments of the fan filter unit can exchange from about 350 cubic feet per minute (CFM) to about 700 CFM of inert gas through each unit. As shown in FIGS. 22 and 23, since the fan filter units are in a parallel arrangement rather than in series, the amount of inert gas that can be replaced in a system with multiple fan filter units is the number of units used. Is proportional to

  Near the bottom of the enclosure, the gas flow is directed toward a plurality of pipe inlets, schematically shown in FIGS. 22 and 23 as first pipe inlet 1571 and second pipe inlet 1572 of pipe assembly 1501. As previously discussed herein with respect to FIGS. 16-18, the duct inlet is positioned substantially at the bottom of the enclosure to create a downward gas flow from the upper fan filter unit, thereby providing a better gas atmosphere within the enclosure. And facilitates thorough conversion and transfer of the entire gas atmosphere through the gas purification system used in conjunction with the enclosure. Circulation and filtration system 1500 is used to circulate the gas atmosphere through the piping, where the piping assembly 1501 separates the inert gas flow for circulation through the gas purification loop 3130, and the laminar flow of gas atmosphere within the enclosure. And by facilitating thorough conversion, each level of reactive species, such as water and oxygen, and each of the solvents, in various embodiments of the gas enclosure assembly is 100 ppm or lower, such as 1 ppm or less. It can be kept lower, for example 0.1 ppm or lower.

  FIG. 24 is a front schematic view of a gas enclosure system 507, which may be a front schematic view of the gas enclosure system 505 of FIG. In FIG. 24, further details of the printing system 2001 can be seen depicted encapsulated within the gas enclosure system 507. Various embodiments of the gas enclosure system of the present teachings having a particle control system may provide a low particle zone proximal to a substrate, such as the substrate 2050 of FIG. 24, that can be supported by the substrate support apparatus 2200. it can. The substrate support device 2200 of the printing system 2001 for various embodiments of the printing system can be a chuck or a floating table. As previously discussed herein, various embodiments of gas circulation and filtration systems in accordance with the present teachings include a piping assembly, such as piping assembly 1501 of FIG. 24, and a fan schematic unit 1552 in front of FIG. A fan filter unit assembly can be included that can have a plurality of fan filter units, such as the fan filter unit assembly 1502, shown in the figures. The gas flow indicated by the arrow depicts a laminar flow of filtered gas proximal to the substrate 2050. The laminar flow environment can minimize turbulent flow and achieve suspended particulate matter levels that meet the standards of International Standards Organization Standard (ISO) 146444-1: 1999 as specified by Class 1 to Class 5. Recall that a substantially low particle environment can be created that can be maintained.

  As will be discussed in more detail later herein, for various embodiments of the gas enclosure system of the present teachings, an effective gas circulation and filtration system may be part of the particle control system. However, various particle control systems of the present teachings can also prevent particle generation proximal to the substrate during the printing process. As depicted in FIG. 24 for gas enclosure assembly 1100 of gas enclosure system 507, substrate 2050 can be proximal to various components of printing system 2001 that can generate particles. For example, the X, Z carriage assembly 2300 can include components such as a linear bearing system that can generate particles. Service bundle housing 2410 may contain particle generation service bundles that are operatively connected from various devices and systems to gas enclosure systems including printing systems. Various embodiments of service bundles are bundled optical cables, electrical cables, to provide optical, electrical, mechanical, and fluid functions for various assemblies and systems disposed within a gas enclosure system. Wires and tubing, and the like can be included.

  The gas enclosure system of the present teachings can have various components that provide a particle control system. Various embodiments of the particle control system provide gas circulation in fluid communication with the contained particle generation component such that such particle-containing component can be discharged into the gas circulation and filtration system. And a filtration system. For various embodiments of the particle control system, the contained particle generation components can be discharged into the dead space and such particulate matter is not accessible for recirculation within the gas enclosure system. to enable. Various embodiments of the gas enclosure system of the present teachings are particle control systems in which various components can be essentially low particle generation, thereby preventing particles from accumulating on the substrate during the printing process. Can have. The various components of the particle control system of the present teachings include the inclusion and ejection of particle generation components and the selection of components that are inherently low particle generation to provide a low particle zone proximal to the substrate. Can be used.

  According to various embodiments of the gas enclosure system used in the OLED printing system, the number of fan filter units can be selected according to the physical location of the substrate in the printing system during processing. Thus, the number of fan filter units may vary according to the movement of the substrate through the gas enclosure system. For example, FIG. 25 is a cross-sectional view taken along the length of a gas enclosure system 508, which is a gas enclosure system similar to that depicted in FIG. The gas enclosure system 508 can include a gas enclosure assembly 1100 that houses an OLED inkjet printing system 2001 supported on a gas enclosure assembly base 1320. The substrate floating table 2200 of the OLED printing system defines movement that can move the substrate through the gas enclosure system 508 during processing of the substrate. Accordingly, the fan filter unit assembly 1502 of the gas enclosure system 508 has an appropriate number of fan filter units, indicated as 1551-1555, corresponding to the physical movement of the substrate through the inkjet printing system 2001 being processed. In addition, the schematic cross-sectional view of FIG. 25 effectively reduces the volume of inert gas required during the OLED printing process, while simultaneously using, for example, gloves installed in various glove ports, Various embodiments of the gas enclosure that can provide immediate access to the interior of the gas enclosure assembly 1100 either remotely during processing or directly by various removable panels in the case of maintenance operations. Delineate the contouring of

  FIG. 26 depicts a printing system 2002 according to various embodiments of a printing system of the present teachings. Printing system 2002 may have many of the features as previously described for printing system 2000 of FIG. 10B. Printing system 2002 can be supported by printing system base 2101. The first riser 2120 and the second riser 2122 on which the bridge 2130 can be mounted can be perpendicular to the printing system base 2101 and can be mounted thereon. For various embodiments of the inkjet printing system 2002, the bridge 2130 supports at least one X-axis carriage assembly 2300 that can move in the X-axis direction relative to the substrate support device 2250 through a service bundle carrier run 2401. can do. As discussed in greater detail later herein, for various embodiments of printing system 2002, X-axis carriage assembly 2300 may utilize a linear air bearing motion system that is inherently low particle generation. it can. According to various embodiments of the printing system of the present teachings, the X-axis carriage can have a Z-axis moving plate mounted thereon. In FIG. 26, an X-axis carriage assembly 2300 is depicted with a first Z-axis moving plate 2315. In various embodiments of the printing system 2002, the second X-axis carriage assembly can be mounted on a bridge 2130, which can also have a Z-axis moving plate mounted thereon. In that regard, similar to the printing system 2000 of FIG. 10B, for various embodiments of the OLED inkjet printing system 2002, respectively, a printhead assembly, eg, the printhead assembly 2500 of FIG. There may be two carriage assemblies with a second printhead assembly mounted on a carriage assembly (not shown). In various embodiments of the printing system 2002, a first printhead assembly, such as the printhead assembly 2500 of FIG. 26, can be mounted on a first X, Z-axis carriage assembly while the features of the substrate 2050. A camera system can be mounted on a second X, Z axis carriage assembly (not shown). In various embodiments of the printing system 2002 of FIG. 26, a printhead assembly, such as the printhead assembly 2500 of FIG. 26, can be mounted on an X, Z axis carriage assembly, while the capsules are printed on the substrate 2050. Either an ultraviolet lamp or a heat source for curing the layer can be mounted on a second X, Z axis carriage assembly (not shown).

  According to various embodiments of the printing system 2002, the substrate support device 2250 can contain substrates in the X, Y plane and can use a floating table to secure a stable Z-axis fly height. 10B may be a floating table similar to the floating table 2200 of the printing system 2000 of FIG. In various embodiments of the printing system 2002, the substrate support device 2250 may be a chuck. In various embodiments of the printing system 2002, the chuck can have a top surface 2252 for mounting a substrate. In various embodiments of the printing system 2002, the top surface 2252 can support the top plate, which can be interchangeable, allowing easy interchangeability between different substrate sizes and types. In various embodiments of the printing system 2002, the top plate can accommodate multiple substrates of different sizes and types. In various embodiments of a printing system 2002 that can utilize a chuck as a substrate support device, vacuum, magnetic, or mechanical means known in the art can be used to secure the substrate on the chuck during the printing process. And can be held. The precision XYZ motion system can include a Y-axis motion assembly 2355, as well as an X, Z carriage assembly 2300, for various purposes for positioning a substrate mounted on the substrate support apparatus 2250 relative to the printhead assembly 2500. Can have components. The substrate support device 2250 can be mounted on a Y-axis motion assembly 2355, such as, but not limited to, on a rail system 2360 using a linear bearing system that utilizes either mechanical bearings or air bearings. Can be moved. For various embodiments of the gas enclosure system, the air bearing motion system helps to promote frictionless conveyance of the substrate disposed on the substrate support device 2250 in the Y-axis direction. The Y-axis motion system 2355 can also optionally use double rail motion, again provided by a linear air bearing motion system or a linear mechanical bearing motion system. According to the present teachings, other precision XYZ motion systems can be used, such as, but not limited to, various embodiments of a three-axis gantry system. For example, various embodiments of a three-axis gantry system include an X, Z carriage assembly mounted on a gantry bridge for precision X, Z axis movement that can precisely move the gantry in the Y axis direction. Can have.

  In addition to the gas circulation and filtration system to maintain a low particle environment within the gas enclosure system, various embodiments of printing systems, such as printing system 2000 of FIG. 10B and printing system 2002 of FIG. There can be additional components incorporated into the gas enclosure system that prevent particle generation proximal to the substrate. For example, the printing system 2000 of FIG. 10B and the printing system 2002 of FIG. 26 can use an linear air bearing system 2320 to position and position the X, Z carriage assembly 2300 on the bridge 2130, essentially It can have a low particle production X-axis motion system. In addition, the printing system 2000 of FIG. 10B and the printing system 2002 of FIG. 26 can have a service bundle housing discharge system 2400 for containing and discharging particles generated from the service bundle.

  In accordance with the present teachings, service bundles can include optical cables, electrical cables, wires and tubing, and the like as non-limiting examples. Various embodiments of the service bundle of the present teachings provide, for example, but not limited to, optical, electrical, mechanical, and fluidic connections that are required for operation of various devices and apparatus associated with the printing system. Can be operatively connected to various systems and devices within the gas enclosure system. Given the size and complexity of various service bundles, various exercise systems often require a service bundle carrier to manage the service bundles when moved with the exercise system. For various embodiments of the gas enclosure system of the present teachings, the service bundle may be a flexible string for tying together cable laying, wires and tubing, and the like bundles at regular intervals. For various embodiments of the gas enclosure system of the present teachings, the service bundle carrier can be a sheath or jacket that can cover the cable laying of the service bundle, wires and tubing, and the like bundles. In various embodiments of the gas enclosure system of the present teachings, the service bundle carrier can mold together a bundle of service bundle cables, wires and tubing, and the like. In various embodiments, the service bundle carrier can be a segment or a flexible chain that can support and carry bundles of cable laying, wires and tubing, and the like.

  According to various embodiments of the gas enclosure system of the present teachings, a service bundle housing that can include a service bundle managed using a service bundle carrier is a service bundle within the service bundle housing and a service bundle carrier. It can contain the particulate matter that is produced. In addition, as discussed in greater detail later herein, movement of the service bundle carrier can compress the air volume in a piston-like manner as it moves within the service bundle housing, An internal service bundle housing and a service bundle housing that can allow particulate matter formed from the particle generating component associated with it to escape, for example, through an opening formed by a carrier run Generate a positive pressure difference with the surrounding environment outside. Such particulate matter just proximal to the substrate has significant potential to contaminate the substrate surface before it is passed into the circulation and filtration system. Accordingly, various embodiments of a particle control system of a gas enclosure system that can include and discharge a service bundle housing to ensure a substantially low particle printing environment. Can be a component of

  As shown in FIG. 26 and indicated by the dashed lines, for various embodiments of the service bundle housing discharge system 2400, the service bundle housing 2410 and the service bundle housing discharge plenum 2420 may be a unitary assembly. For such an embodiment, the service bundle housing discharge system 2400 may be configured in the gas circulation and filtration system through the first bundle 2422 of the service bundle housing discharge plenum and the second duct 2424 of the service bundle housing discharge plenum. In order to discharge particles generated in the service bundle housing 2410, it can be ensured that a positive pressure difference between the inlet and outlet portions of the service bundle housing can be maintained. Alternatively, for various embodiments, the service bundle housing discharge system 2400 can include a service bundle housing discharge plenum 2420 that can be mounted on and in fluid communication with the service bundle housing 2410. Service bundle housing 2410 can contain particles produced by service bundles that can include bundled optical cables, electrical cables, wires and tubing, and the like. Various embodiments of the service bundle of the present teachings include a printing system that includes at least one of optical, electrical, mechanical, and fluid functions for various assemblies and systems disposed within a gas enclosure. Can be provided in a gas enclosure system. For various embodiments of the printing system 2002, the service bundle housing discharge system 2400 is configured to discharge the particles contained in the service bundle housing 2410 into the service bundle housing discharge plenum 2420. It can be ensured that the positive pressure difference between the inlet part and the outlet part can be maintained. The service bundle housing discharge plenum 2420 may be in fluid communication with the gas circulation and filtration system through the service bundle housing discharge plenum first duct 2422 and the service bundle housing discharge plenum second duct 2424. Alternatively, the service bundle housing discharge plenum first duct 2422 and the service bundle housing discharge plenum second duct 2424 discharge particles contained by the service bundle housing through the service bundle housing discharge plenum. A flexible drain hose can be fitted so that it can be directed through a flexible drain tube leading into the target dead space.

  Further, in addition to maintaining a positive pressure difference between the inlet and outlet portions of the service bundle housing discharge system, various embodiments of the service bundle housing discharge system may have a relatively neutral or negative pressure differential. Can be further maintained between the interior of the service bundle housing discharge system and the surrounding environment. Such a relatively neutral or negative pressure differential that can be maintained between the interior of the service bundle housing discharge system and the surrounding environment is a service bundle housing discharge system through cracks, seams, and the like. Leakage of particles from can be prevented. Leakage of particles through cracks, seams, and the like just proximal to the substrate has a great potential to contaminate the substrate surface before it is passed into the circulation and filtration system.

  FIG. 27A depicts a side cross-sectional view of a low particle generation X-axis motion system 2320, according to various embodiments of the present teachings. In FIG. 27A, the low particle generation X-axis motion system 2320 can have a service bundle housing discharge system 2400 and a service bundle housing discharge plenum first as shown in FIG. 27A. A service bundle housing discharge plenum 2420 in fluid communication with one duct 2422 is depicted. The printing system 2002 can include a base 2101 on which a substrate support device 2250 can be placed. The X and Z carriage assembly 2300 can be mounted on the bridge 2130. As can be seen in the cross-sectional view presented in FIG. 27A, the X-axis motion system 2320 can be a linear air bearing motion system that is inherently low particle generation. X-axis motion system 2320 can include a plurality of air bearing packs 2330 and a brushless linear motor 2340. The service bundle carrier 2430 can be placed on the X, Z carriage assembly 2300 and housed in the service bundle housing 2410. As depicted in FIG. 27A, the service bundle housing discharge plenum 2420 is in fluid communication with the service bundle housing 2410 and through a piping such as the first duct 2422 of the service bundle housing discharge plenum, a gas circulation and filtration system. Fluid communication. In that regard, the service bundle housing 2410 can discharge particles generated from various embodiments of the service bundle. Service bundles according to the present teachings include, but are not limited to, optical cables, electrical cables, wires and tubing, and the like that can be managed using various embodiments of the service bundle carrier 2430. It can be a bunch that can. Various embodiments of the service bundle of the present teachings may be applied to a printing system to provide various optical, electrical, mechanical, and fluidic connections required to operate the printing system, for example and without limitation. Can be operably connected. For various embodiments of the gas enclosure of the present teachings, a service bundle carrier, such as service bundle carrier 2430, can be supported by the bottom side 2404 of the service bundle housing. For various embodiments of the gas enclosure of the present teachings, a service bundle carrier, such as service bundle carrier 2430, can be supported by trays or shelves.

  FIG. 27B is an enlarged view of FIG. 27A depicting the low particle generation X-axis motion system 2320 of the printing system 2002 in more detail. A plurality of air bearing packs 2330 may be mounted on the inner surface of the X and Z axis carriage assembly 2300. In that regard, various embodiments of the low particle generation X-axis motion system 2320 can provide frictionless movement of the X, Z axis carriage assembly 2300 across the bridge 2130. In FIG. 27A, a first pack 2332 and a second pack 2334 are shown proximal to the first side 2132 of the bridge 2130. The third pack 2336 of FIG. 27B can be proximal to the top surface 2133 of the bridge 2130, while the fourth pack 2338 can be proximal to the second side 2134 of the bridge 2130. The brushless linear motor may include an X and Z axis carriage assembly magnet track 2342 that can be mounted on the bridge 2130 and a linear motor winding 2344 that can be mounted on the X and Z axis carriage assembly 2300. it can. An encoder read head 2346 can be associated with the linear motor winding 2344 to position the linear motor 2340. In various embodiments of the brushless linear motor 2340, the encoder read head 2346 may be an optical encoder. As will be discussed in more detail later herein, various embodiments of a low particle X-axis motion system 2320 utilized on a frictionless air bearing pack will be shown and described with respect to FIGS. 33 and 34. And can be integrated with various embodiments of the compressor loop. Finally, as shown in FIG. 27B, the service bundle housing ejection system 2400 can include a service bundle housing 2410 that can house a service bundle carrier 2430. Service bundle housing discharge system 2400 contains particles discharged from service bundle housing 2410 that can be generated from a service bundle that can be managed using a service bundle carrier, such as service bundle carrier 2430. Can be discharged.

  FIG. 28A is a front perspective view of a printing system 2003 shown with a service bundle housing ejection system 2400 mounted on a bridge 2130. Various embodiments of the printing system 2003 may have many features as previously described for the printing system 2000 of FIG. 10B and the printing system 2002 of FIG. For example, the printing system 2003 can be supported by the printing system base 2101. The first riser 2120 and the second riser 2122 on which the bridge 2130 can be mounted can be perpendicular to the printing system base 2101 and can be mounted thereon. For various embodiments of the inkjet printing system 2003, the bridge 2130 supports at least one X-axis carriage assembly 2300 that can move in the X-axis direction relative to the substrate support device 2250 through a service bundle carrier run 2401. Can do. According to various embodiments of the printing system of the present teachings, the X-axis carriage 2300 can have a Z-axis moving plate 2310 mounted thereon. In that regard, various embodiments of the carriage assembly 2300 can provide precise X, Z positioning of the printhead assembly 2500 relative to the substrate support apparatus 2250. In various embodiments of the printing system 2003, the second X-axis carriage assembly rests on the bridge 2130, on which the second X-axis carriage can have a Z-axis moving plate resting thereon. be able to. For embodiments of printing system 2003 having two X-axis carriage assemblies, the printhead assembly can be mounted on each X- and Z-axis carriage, or printing system 2000 in FIG. 10B and 2002 in FIG. Various other devices can be mounted on the two X- and Z-axis carriage assemblies, for example, as a camera, an ultraviolet lamp, and a heat source. According to various embodiments of the printing system 2003, the substrate support apparatus 2250 for supporting the substrate can be a floating table similar to the floating table 2200 of the printing system 2000 of FIG. 10B or the printing of FIG. It can be a chuck as previously described for system 2002. The printing system 2003 of FIG. 28A is an essentially low particle generation X-axis motion system that can use an air bearing linear slider assembly to position and position the X, Z carriage assembly 2300 on the bridge 2130. Can have. For various printing systems of the present teachings, the air-bearing linear slider assembly can wrap around the entire bridge 2130, allowing frictionless movement of the X, Z carriage assembly 2300 over the bridge 2130, and the X, Z carriage assembly. It also provides a three-point placement that can maintain the accuracy of 2300 movement and resists skew.

  With respect to precise movement of the substrate relative to the printhead assembly, various embodiments of the printing system 2003 of FIG. 28A have a precision XYZ motion system that can include a Y-axis motion assembly 2355 in addition to the X, Z carriage assembly 2300. be able to. The substrate support device 2250 can be mounted on a Y-axis motion assembly 2355, such as, but not limited to, on a rail system 2360 using a linear bearing system that utilizes either mechanical bearings or air bearings. Can be moved. For various embodiments of the gas enclosure system, the air bearing motion system helps to promote frictionless conveyance of the substrate disposed on the substrate support device 2250 in the Y-axis direction. The Y-axis motion system 2355 can also optionally use double rail motion, again provided by a linear air bearing motion system or a linear mechanical bearing motion system. According to the present teachings, other precision XYZ motion systems can be used, such as, but not limited to, various embodiments of a three-axis gantry system. For example, various embodiments of a three-axis gantry system include an X, Z carriage assembly mounted on a gantry bridge for precision X, Z axis movement that can precisely move the gantry in the Y axis direction. Can have.

  As depicted in FIG. 28A, for various embodiments of the printing system 2003, the service bundle housing ejection system 2400 can be placed over the bridge 2130. The service bundle housing discharge system 2400 can include a service bundle housing discharge plenum 2420 that can be mounted on and in fluid communication with the service bundle housing 2410. The service bundle housing 2410 can contain particles generated by the service bundle, which can include bundled optical cables, electrical cables, wires, and tubing. Various embodiments of the service bundle of the present teachings may include a printing system that includes at least one of optical, electrical, mechanical, and fluid functions for various assemblies and systems disposed therein. Can be provided to the enclosure system. For various embodiments of the printing system 2003, the service bundle housing discharge system 2400 may service the service bundle housing discharge plenum 2420 to discharge particles contained in the service bundle housing 2410. It can be ensured that the positive pressure difference between the inlet and outlet portions of the bundle housing discharge system can be maintained. The service bundle housing discharge plenum 2420 may be in fluid communication with the gas circulation and filtration system through the service bundle housing discharge plenum first duct 2422 and the service bundle housing discharge plenum second duct 2424. Alternatively, the service bundle housing discharge plenum first duct 2422 and the service bundle housing discharge plenum second duct 2424 discharge particles contained by the service bundle housing through the service bundle housing discharge plenum. A flexible drain hose can be fitted so that it can be directed through a flexible drain tube leading into the target dead space.

  Further, for various embodiments of the service bundle housing discharge system, in addition to maintaining a positive pressure difference between the inlet and outlet portions of the service bundle housing discharge system, a relatively neutral or negative pressure difference is provided. Can be further maintained between the interior of the service bundle housing discharge system and the surrounding environment. Such a relatively neutral or negative pressure differential that can be maintained between the interior of the service bundle housing discharge system and the surrounding environment is a service bundle housing discharge system through cracks, seams, and the like. Leakage of particles from can be prevented. Leakage of particles through cracks, seams, and the like just proximal to the substrate has a great potential to contaminate the substrate surface before it is passed into the circulation and filtration system.

  FIG. 28B depicts an enlarged partial cutaway front perspective view of the printing system 2003. In FIG. 28B, the X, Z carriage assembly 2300 can utilize an air bearing linear slider assembly to position the X, Z carriage assembly 2300 carriage over the bridge 2130. The movement of the X, Z carriage assembly 2300 moves in the X-axis direction over the distance defined by the service bundle carrier run 2401. The service bundle carrier run 2401 is housed in a service bundle housing 2410, for example, but not limited to, optical cables, electrical cables, wires and tubes bundled into a service bundle that can be connected to the printhead assembly 2500. It is an opening that allows movement of the kind. Given the size and complexity of various service bundles, various exercise systems often require a service bundle carrier to manage the service bundles when moved with the exercise system. In that regard, the service bundle carrier 2430 is shown housed in the service bundle housing 2410 of FIG. 28B. During printing, the carriage assembly can include cables, wires and tubing, and the like as it moves to accurately position the printhead assembly in the X-axis direction relative to the substrate positioned below it. The movement of the service bundle, as well as the movement of the service bundle carrier itself, can generate particulate matter just proximal to the substrate positioned below the service bundle housing. Also, the movement of the service bundle carrier can compress the air volume in a piston-like manner as it moves within the service bundle housing, and the particulate matter formed from the particle generating components associated with the service bundle carrier For example, generating a positive pressure that can allow escape through the carrier run 2401. Such particulate matter just proximal to the substrate has significant potential to contaminate the substrate surface before it is passed into the circulation and filtration system. Thus, the service bundle housing discharge system can be a component of various embodiments of a particle control system of a gas enclosure system that can ensure a substantially low particle printing environment.

  In FIG. 28B, the service bundle housing top surface 2402 is shown having a set of slots 2414 that form a slotted top surface. For the various embodiments of the service bundle housing discharge system 2400 of FIG. 28B, ensure that particulate matter formed from the particle generation components associated with the service bundle carrier is passed into the circulation and filtration system. There are two requirements for such a system to: 1) As the exhaust flow through the service bundle housing discharge system moves through the service bundle housing, the gas compression side of the service bundle carrier There should be greater than the above volume change, and 2) there should be an even distribution of constant discharge flow that effectively wipes out the service bundle housing volume. Various embodiments of the service bundle housing ejection system of the present teachings ensure that these two requirements are met.

  For example, as depicted in FIG. 29A, various embodiments of a service bundle housing ejection system can include a service bundle housing 2410 that can be used to house a service bundle carrier 2430. In FIG. 29A, the service bundle carrier 2430 is depicted as a segmented flexible chain-type service bundle carrier, and various other types of service bundle carriers that can be used can behave similarly, thereby This requires the use of various embodiments of the service bundle housing ejection system of the present teachings. The service bundle carrier run 2401 causes particulate matter formed from the particle generation components associated with the service bundle carrier to escape from the service bundle housing, for example, as a result of the positive pressure generated by the movement of the service bundle carrier. An opening that can make that possible. The service bundle housing discharge system 2420 is associated with the service bundle carrier through the first duct 2422 of the service bundle housing discharge plenum and the second duct 2424 of the service bundle housing discharge plenum into the gas circulation and filtration system. It can be maintained at a positive pressure, which can ensure that the particle generating component can be discharged. A set of service bundle housing slots 2412 formed in the service bundle housing top surface 2402 as shown in FIG. 29A provides an even distribution of a constant discharge flow that effectively wipes out the volume of the service bundle housing 2410. Can be secured.

  A service bundle housing slot 2412 is formed over the top side 2402 of the service bundle housing and is shown in FIG. 29A, but as depicted in FIG. 29B, a set of slots is on various surfaces of the service bundle housing. Can understand that it can be located. As depicted in FIG. 29B, the set of slots includes a service bundle housing bottom side 2404 (Set I), a service bundle housing first side 2406 (Set II), and a service bundle housing second side. Can be located on side 2408 (set III). Also, as depicted in FIG. 29C, a slot can be a kind of opening to facilitate an even distribution of a constant exhaust flow so as to effectively wipe out the service bundle housing volume, Openings having various shapes, aspect ratios, and locations can be used. As depicted in FIG. 29C, depicted as being formed on the uppermost side 2402 of the service bundle housing to facilitate an even distribution of constant discharge flow so as to effectively wipe out the service bundle housing volume. Substantially circular openings such as the first service bundle housing opening 2411 and the second service bundle housing opening 2413 can be used. As depicted in FIG. 29C, an alternative arrangement of substantially circular openings may be on the end of the service bundle housing. In FIG. 29C, the first end 2415 of the service bundle housing and the service bundle housing of the service bundle housing, respectively, are facilitated to facilitate an even distribution of constant discharge flow so as to effectively wipe out the service bundle housing volume. The first service bundle housing opening 2411 and the second service bundle housing opening 2413 depicted as being formed at the second end 2417 may be used. In addition, various embodiments of the service bundle housing may include a first service bundle carrier 2401 and a second service bundle carrier run 2407. The service bundle housing top surface 2402 has a first set of slots 2412 and a second set of slots 2414 proximal to the first service bundle carrier 2401 and the second service bundle carrier run 2407, respectively. And can be used to facilitate an even distribution of a constant discharge flow so as to effectively wipe out the service bundle housing volume. Finally, as shown in FIG. 27B, when the service bundle enclosure exhaust system includes an enclosure that is a single part, by considering the effective exhaust gas flow, a uniform exhaust flow uniformity. Can help to improve distribution.

  30A / 30B—The various embodiments of the gas enclosure system of the present teachings as depicted in FIGS. 32A / 32B can facilitate laminar flow and exhaustive conversion of the gas atmosphere within the enclosure, which With respect to gas circulation and filtration systems that ensure that a substantially low particle environment for suspended particulate matter can be maintained, as previously discussed herein with respect to FIGS. It can have the following characteristics. As previously discussed herein, a circulation and filtration system for maintaining low particulate matter floating specifications is one of the particulate matter control systems for various embodiments of the gas enclosure system of the present teachings. Part. The particle control system of the present teachings can also include a low particle generation X-axis motion system that utilizes an air bearing and a service bundle housing discharge system. Various embodiments of low particle generation X-axis motion systems that utilize air bearings can substantially eliminate the generation of particulate matter. Furthermore, to ensure that it contains particulate matter generated just proximal to the substrate during the printing process and can then be passed through a circulation and filtration system for removal. Various embodiments of the body draining system can be utilized. In addition, particles formed by various devices, apparatus, service bundles, and the like that can be positioned proximal to the substrate during the printing process, as depicted in FIGS. 30A / 30B-32A / 32B. To control particulate matter, various embodiments of the particle control system of the present teachings can have a printhead assembly ejection system.

  30A / 30B depict gas enclosure system 509, while FIGS. 31A / 31B depict gas enclosure system 510, FIGS. 32A / 32B depict gas enclosure system 511, all of which are shown. As such, it can have features as previously described with respect to FIGS. The gas enclosure system 509-511 can include a circulation and filtration system 1500, a gas purification system 3130, and a thermal conditioning system 3140. Circulation and filtration system 1500 can include a piping assembly 1501 and a fan filter unit assembly 1502. The plumbing assembly 1501 is recirculated from the interior through the fan filter unit assembly 1502 to the exterior to the gas purification system 3130 by effectively defining a space 1580, which is a conduit that is effectively in fluid communication with the gas purification system 3130. The inert gas that is circulated can be separated. Space 1580 may be in fluid communication with gas purification system 3130 (FIGS. 12 and 13) through gas purification outlet line 3131 and gas purification inlet line 3133. Such a circulation system, including various embodiments of the piping system as described with respect to FIGS. 16-18, provides substantially laminar flow, minimizes turbulence, and reduces the internal volume of the enclosure. Facilitates circulation, conversion, and filtration of particulate matter in the gas atmosphere and provides circulation through a gas purification system external to the gas enclosure assembly.

  In addition, gas enclosure systems 509-511, depicted in FIGS. 30A / 30B-32A / 32B, respectively, contain and discharge particulate matter formed by various assemblies associated with printing system 2003. There can be a printhead assembly ejection system 2600 that can be utilized. For various embodiments of gas enclosure systems 509, 510, and 511, printhead assembly ejection system 2600 is depicted in, for example, but not limited to, FIGS. 30A / 30B, 31A / 31B, and 32A / 32B, respectively. As can be seen, a carriage assembly 2300 can be housed on which a printhead assembly 2500 can be affixed. Such moving plates can utilize friction bearings that can generate particles during operation of the OLED printing system, as previously discussed herein. In addition, as previously discussed herein, a carriage assembly can be used to mount a device such as an ultraviolet lamp assembly or a heat source assembly for curing the encapsulating layer. Either an ultraviolet lamp or a heat source may require cooling using a fan.

  Accordingly, the printhead assembly ejection system 2600 of the gas enclosure systems 509, 510, and 511 is formed by various devices, apparatus, service bundles, and the like that can be positioned proximal to the substrate during the printing process. It can be part of a particulate matter control system that is used to contain and discharge particulate matter. Various embodiments of a printhead assembly ejection system, such as the printhead assembly ejection system 2600 of the gas enclosure systems 509, 510, and 511, provide particles generated by various components of the printhead assembly for gas circulation and filtration systems. It can be ensured that a positive pressure difference can be maintained between the inlet and outlet portions of the printhead assembly discharge housing for discharge into the interior. For various embodiments of the printhead assembly ejection system, an inlet portion and an outlet portion of the printhead assembly ejection housing for ejecting particles produced by various components of the printhead assembly into the dead space; The positive pressure difference can be maintained between the two. Use of fans and other system components such as, but not limited to, providing fluid communication between the printhead assembly discharge housing and the circulation and filtration system, as discussed in more detail later herein. Can produce a positive pressure differential to eject particles produced by the various components of the printhead assembly.

  For various embodiments of the printhead assembly ejection system, in addition to maintaining a positive pressure difference between the inlet and outlet portions of the printhead ejection assembly, a relatively neutral or negative pressure differential is applied to the printhead ejection system. Further maintenance can be maintained between the interior of the assembly and the surrounding environment. Such relatively neutral or negative pressure differentials that can be maintained between the interior of the printhead discharge assembly and the surrounding environment can cause the particles from the printhead discharge assembly to pass through cracks, seams, and the like. Leakage can be prevented. Leakage of particles through cracks, seams, and the like just proximal to the substrate has a great potential to contaminate the substrate surface before it is passed into the circulation and filtration system.

  As depicted in FIGS. 30A and 30B, the service bundle housing 2410 can be supported on a bridge 2130 of the printing system 2003. As previously discussed herein with reference to printing system 2000 of FIG. 10B, carriage assembly 2300 includes a Z-axis moving plate on which printhead assembly 2500 can be affixed. There may be components for controlling the axial movement. The printhead assembly ejection system housing 2610 can be in fluid communication with a service bundle housing 2410, such as, but not limited to, a first conduit 2612 of the printhead assembly ejection system. The service bundle housing 2410 can be in fluid communication with the piping assembly 1501 through, for example, but not limited to, the second conduit 2614 of the printhead assembly ejection system, which can be in fluid communication with the second piping conduit 1574. . The printhead assembly ejection system 2600 of FIGS. 30A and 30B, which can contain components at risk of generating particles, such as moving plates, gas into the service bundle housing 2410 through the printhead assembly ejection system 2600 To facilitate movement, at least one fan, such as fan 2620, may be included. In that regard, the entire air contained in the printhead assembly ejection system 2600 and service bundle housing 2410 can be effectively filtered by the circulation and filtration system 1500, as depicted in FIG. 30A.

  In accordance with the present teachings, particulate matter that collects in the dead space away from the substrate mounted on the substrate support apparatus cannot be recirculated in the gas enclosure system. In that regard, the various embodiments of the gas enclosure system depicted in FIGS. 31A / 31B and 32A / 32B utilize directing particulate matter into the piping system and into the dead space. Can do. During routine gas enclosure system maintenance, such particulate matter can be removed from the dead space.

  In that regard, for various embodiments of a gas enclosure system, such as gas enclosure system 510 of FIGS. 31A and 31B, service bundle housing 2410 may be in fluid communication with circulation and filtration system 1500. As depicted in FIG. 31B, the printhead assembly ejection system housing 2610 can be in fluid communication with a service bundle housing 2410, such as, but not limited to, the first conduit 2612 of the printhead assembly ejection system. The service bundle housing 2410 can be in fluid communication with the second conduit 2614 of the printhead assembly ejection system, which can have an outlet end proximal to the second piping inlet 1572 of the piping assembly 1501. In that regard, the second conduit 2614 of the printhead assembly ejection system can be in fluid communication with the piping assembly via the second piping conduit 1574. The first conduit 2612 of the printhead assembly exhaust system can have a fan, such as a fan 2620, to facilitate gas movement through the first conduit 2612 of the printhead assembly exhaust system. In addition, the second conduit 2614 of the printhead assembly ejection system is effected by the circulation and filtration system 1500 with particles contained by the printhead assembly ejection system 2600 and service bundle housing 2410, as depicted in FIG. 31A. A fan 2622 can be provided to facilitate gas movement through the printhead assembly exhaust system 2614 so that it can be filtered. For various embodiments of a gas enclosure system, such as the gas enclosure system 510 of FIGS. 31A and 31B, any particulate matter that is not allowed to flow into the second piping inlet 1572 has a trajectory toward the dead space 1590. Will.

  As depicted for the gas enclosure system 511 of FIGS. 32A and 32B, the service bundle housing 2410 can be in fluid communication with the circulation and filtration system 1500. As depicted in FIG. 32B, the printhead assembly ejection system housing 2610 is configured to facilitate gas movement through a service bundle housing 2410, such as, but not limited to, the first conduit 2612 of the printhead assembly ejection system. Can be in fluid communication with the first conduit 2612 of the printhead assembly ejection system. The service bundle housing 2410 can be in fluid communication with a printhead assembly ejection system second conduit 2614, which can have a filter head 2616. Filter head 2616 filters particulate matter emanating from printhead assembly discharge system 2600 into service bundle housing 2410 and directs the low particle gas stream flowing from filter head 2616 directly into gas enclosure system 511. be able to. In that regard, the second conduit 2614 of the printhead assembly exhaust system can exhaust low particulate gas into the gas enclosure system 511, which in turn, as depicted in FIG. 32A, Circulation through system 511 and filtration system 1500 may be circulated.

  Various gas enclosure systems of the present teachings, such as the gas enclosure system 501 of FIG. 12 and the gas enclosure and gas enclosure system 502 of FIG. The gas enclosure 1000 can be used. Further, various gas enclosures, such as the gas enclosure 100 of FIG. 1A and the gas enclosure 1000 of FIG. 9, can include various printing systems such as the printing system 2000 of FIG. 10B, the printing system 2002 of FIG. 26, and the FIG. 2003 of FIG. Can be stored. For the gas enclosure system and method of the present teachings, monitoring the controlled environment of the gas enclosure is an important aspect of maintaining the controlled environment of the gas enclosure.

  One parameter of the controlled environment that can be monitored is the effectiveness of particulate matter control. System verification, as well as ongoing in-situ system monitoring, can be performed for both floating and on-substrate particle monitoring.

  The determination of suspended particulate matter can be made to various embodiments of the gas enclosure system prior to the printing process for system verification, for example, using a portable particle counting device. In various embodiments of the gas enclosure system, the determination of suspended particulate matter can be performed as an ongoing quality check while the substrate is being printed. For various embodiments of the gas enclosure system, the determination of suspended particulate matter may be performed for system verification before the substrate is printed, and in addition while the substrate is being printed. it can.

  FIG. 33 depicts a device for measuring suspended particulate matter. In accordance with the present teachings, various embodiments of the particle counter 800 of FIG. 33 can be handheld or otherwise portable. As depicted in FIG. 33, the particle counter 800 includes a power button 810 as well as a display 812 for real-time visual monitoring of various parameters such as the particle size being monitored, the current number of particulates of that size. Can have. The portable particle counter of the present teachings can have multiple channels for monitoring several particle size ranges during analysis. As a non-limiting example, the display 812 of the particle counter 800 is depicted by monitoring three distinct particle size ranges. For various embodiments of the systems and methods of the present teachings, particle spikes within a size range of about ≧ 0.3 μm can be an initial indicator of malfunction of, for example, a filtration system of a gas enclosure system, and thus within that range. Can be useful for monitoring system quality. Various embodiments of particle counters according to the present teachings can be provided by a cable or wireless connection to a computer that can provide ongoing collection and storage of data from a particle counter, as a non-limiting example, from a particle counter ( (Not shown). The particle counter 800 can have an inlet nozzle 814 for drawing an air sample into the particle counter 800. Various embodiments of a particle counter for measuring suspended particulate matter can reduce the sample flow rate and counting errors associated with the aerodynamics of particles, specifically small particles, FIG. There may be isokinetic sampling probes, such as sampling probe 816. In order to obtain accurate results for particulate matter in the flow rate, the sample flow through the sampling system should be such that the velocity at the sampling point inlet is the same as the velocity of the gas flow at that point. It is. An isokinetic sampling probe can have an inlet probe 815 that can be attached to the inlet nozzle 814 using a sampling probe connector 817. For various embodiments of the sampling probe 816, the sampling probe connector 817 may be a section of flexible tubing. For sampling in various embodiments of the gas enclosure system of the present teachings, the inlet probe 815 of the sampling probe 816 can face directly into the air stream.

  Various commercial particle counters can be based on various measurement principles, which can include light blocking, direct imaging, and light scattering, but measurements based on light scattering from particles include particle size, It is suitable for generating information. In principle, light scattering can be used to determine particle sizes up to about 1 nm.

  FIG. 34 is a schematic diagram of a particle counter detector 830 based on light scattering. A particle counter detector based on light scattering may have an electromagnetic radiation source in a known wavelength range of a known wavelength, such as a light source 820. For various embodiments of the particle counter detector 830, the light source 820 may be a laser source that emits light of a known wavelength. For various embodiments of the particle counter, particularly for a non-exclusive but handheld and portable particle counting device, the light source 820 emits light of a known wavelength from about 600 nm to about 850 nm, a light emitting diode (LED). It can be. The radiation source light 821 can be focused in the detection region 822 of the flow path 824, depicted in FIG. 34 as a top cross-sectional view. Any particles in the detection region 822 scatter light and scatter it in several angular directions, including forward scattered light 823, or perpendicular to the direction of the emitted source light 821 as depicted for the optical path 825. Generated light. The light scattered at right angles by the particles in the detection region 822 can be focused using a focusing lens 826, for example, a detector 828, which can be various types of photometric detectors based on photodiode technology. Can be filtered using at least one optical filter, for example, a spatial or optical bandpass filter, or a combination thereof. Calibrate various embodiments of the particle counter using a calibration standard such as aerosol, with particulate matter of defined distribution of particles within various size ranges, each size range having a defined concentration be able to.

  For example, various commercial particle counters based on light scattering detect airborne particle sizes in the range of about ≧ 0.3 μm to about ≧ 10 μm and are typically of a certain size per volume of air, such as cubic feet or cubic meters. The number of particles can be reported. Various commercial particle counters can count up to about 1 million to about 3 million particles of a particular size. In that regard, various commercial calibration standards include particle coverage distributions of about ≧ 0.3 μm to about ≧ 10 μm, for example, a detection limit for each population of particles up to about 1 million to about 3 million particles. It can have a bimodal or trimodal distribution of species covering the range with a defined concentration. As previously discussed herein, various particle counters for determining suspended particulate matter can have multiple channels for monitoring several particle size ranges. Although shown with one light source and one detector, various embodiments of a particle counter for determining suspended particulate matter monitor more than one light source and light scattered at various angles. It is possible to have multiple detectors at various positions for. Such suspended particle counters can be monitored and reported over a wide dynamic particle size range of suspended particulate matter from about ≧ 0.1 μm to about ≧ 10.0 μm.

  FIG. 35 is a schematic representation using particle counter icons 800A-800D, where the various embodiments of the particle counting device can be located relative to the low particle zone of the printing system proximal to the substrate. Is intended to convey. The gas enclosure system 512 of FIG. 35 can be integrated with, but is not limited to, a gas enclosure assembly 1100 and a circulation and filtration system as shown by the fan filter unit 1552 proximal to the heat exchanger 1562. 3140 can include components as previously described herein for gas enclosure system 500-511. The gas enclosure system 512 of FIG. 35 has an outlet line 3131 and an inlet line 3133 to a gas purification system (not shown) and can accommodate the printing system 2004. The printing system 2004 can have a base 2101 on which a substrate support device 2200 can be placed. The printing system 2004 can additionally have a bridge 2130, which can have a first carriage assembly 2300A and a second carriage assembly 2300B mounted thereon. The printing system 2004 can also include a service cable housing 2410 for housing a service cable (not shown).

  With reference to FIG. 35, at least one particle counter is positioned or resting on the service bundle housing 2410, for example, as shown by the particle counter icon 800A, depicted in laminar flow of the fan filter unit 1552. be able to. A particle counter so positioned in the laminar flow of gas from the fan filter unit can allow monitoring of the effectiveness of the filtration system of the gas enclosure system. In addition, the bridge 2130 of the printing system 2004 can support a first X, Z axis carriage assembly 2300A on which the printhead assembly 2500 can rest. The second X, Z axis carriage assembly 2300B can have at least one particle counter mounted thereon as indicated by the particle counter icon 800B. Monitoring in the proximal position of various printing devices and devices such as carriage assemblies can be useful for monitoring various particle generation sources such as service bundles. A particle counter mounted as depicted by the particle counter icon 800C may be useful for procedure development and gas enclosure system verification execution. A particle counter mounted as depicted by particle counter icon 800D may be useful for procedure development and gas enclosure system verification execution, and in situ monitoring of suspended particulate matter during the printing process.

  According to various systems and methods of the present teachings, a particle counting device is mounted on a substrate support apparatus so as to measure particles under defined conditions in adjacent areas where the substrate can be located during printing. Can be arranged. For example, as depicted in FIG. 35, the particle counter can be placed or placed on the substrate support apparatus 2200 as indicated by the position of the particle counter icon 800C. In various embodiments of the systems and methods of the present teachings, particulate matter monitoring using a particle counter placed or mounted on a substrate support apparatus can be used to develop various types of procedure development or gas enclosure system verification implementation studies. Can be done for. As another non-limiting example, the particle counter can be placed on the side of the substrate support device 2200 as indicated by the position of the particle counter icon 800D. By using a particle counter in conjunction with a sampling probe having a flexible connector, such as the particle counter 800 of FIG. 33 having a sampling probe 816, the particle counter mounted on the side of the substrate support apparatus is exactly at the height of the substrate. It can have a sampling probe arranged.

  A particle counter mounted on the side of the substrate support apparatus, as shown by particle counter icon 800D, is useful for procedure development and gas enclosure system verification execution, and in situ monitoring of suspended particulate matter during the printing process It can be. For example, in FIG. 36, a printing system 2003 as previously described with respect to FIGS. 26 and 28A may also include a Z-axis moving plate 2310 for Z-axis positioning of the printhead assembly 2500 on the bridge 2130. There may be a mounted X-axis carriage assembly 2300. In that regard, various embodiments of the carriage assembly 2300 can provide precise X, Z positioning of the printhead assembly 2500 relative to the substrate 2050. For various embodiments of the printing system 2003, the X-axis carriage assembly 2300 can utilize a linear air bearing motion system that is inherently low particle generation. The printing system 2003 of FIG. 36 includes a service bundle housing discharge system 2400 for containing and discharging particles generated from the service bundle, which can include a service bundle housing 2410 for housing the service bundle. be able to. In accordance with the present teachings, a service bundle can be a variety of devices and apparatuses within a gas enclosure system, such as, but not limited to, various opticals required to operate various devices and apparatuses associated with a printing system, It can be operably connected to the printing system to provide electrical, mechanical and fluid connections. The printing system 2003 of FIG. 36 can have a substrate support device 2250 for supporting the substrate 2050 that can be precisely positioned in the Y-axis direction using the Y-axis positioning system 2355. Both the substrate support device 2250 and the Y-axis positioning system 2355 are supported by the printing system base 2101.

  With respect to the printing system 2003 of FIG. 36, the precision XYZ motion system can include a Y-axis motion assembly 2355 as well as an X-axis carriage assembly 2300, which is mounted on a substrate support apparatus 2250 relative to the printhead assembly 2500. Can have various components for positioning. The substrate support device 2250 can be mounted on a Y-axis motion assembly 2355, such as, but not limited to, on a rail system 2360 using a linear bearing system that utilizes either mechanical bearings or air bearings. Can be moved. For various embodiments of the gas enclosure system, the air bearing motion system helps to promote frictionless conveyance of the substrate disposed on the substrate support device 2250 in the Y-axis direction. The Y-axis motion system 2355 can also optionally use double rail motion, again provided by a linear air bearing motion system or a linear mechanical bearing motion system. According to the present teachings, other precision XYZ motion systems can be used, such as, but not limited to, various embodiments of a three-axis gantry system. For example, various embodiments of a three-axis gantry system include an X, Z carriage assembly mounted on a gantry bridge for precision X, Z axis movement that can precisely move the gantry in the Y axis direction. Can have.

  In accordance with various systems and methods of the present teachings, the printing system 2003 of FIG. 36 uses particles mounted on the side of the substrate support apparatus 2250 such that the isokinetic sample probe 816 is approximately level with the substrate 2050. A counter 800 can be included. FIG. 36 depicts a particle counter 800 on the front of the substrate support apparatus, but one or more of them at various locations on the substrate support apparatus to effectively monitor suspended particulate matter proximal to the substrate. It is possible to mount more particle counters. In addition, for various embodiments of the system and method, additional particle counters can be placed or placed elsewhere as described in FIG.

  According to various embodiments of the gas circulation and filtration system contained in various embodiments of the gas enclosure system of the present teachings, continuous measurement of suspended particles can be performed in the gas enclosure system. In various embodiments of the gas enclosure system of the present teachings, such measurements can be made in a fully automatic mode and reported continuously to the end user, for example, through a graphical user interface (GUI). In various embodiments of the gas enclosure system of the present teachings, suspended particulate matter measurements can be made at the intended target location, as depicted in FIG. The output from each of the particle counters located in the gas enclosure can be reported to the end user, for example through a GUI. For example, the target area of interest can be suspended particulate material that is just proximal to the substrate over a substrate support device, such as a chuck or floating table, as depicted in FIG.

  In that regard, continuous monitoring of various embodiments of the gas enclosure system of the present teachings has confirmed that particles having a size of about ≧ 2 μm can be maintained with less than about 1 particle in its size range over a printing cycle. For various embodiments of the gas enclosure system of the present teachings, particles having a size of about ≧ 2 μm can be maintained with less than about 1 particle in that size range over a period of at least about 24 hours. For various embodiments of the gas enclosure system of the present teachings, particles having a size of about ≧ 0.3 μm can be maintained with less than about 3 particles in their size range over the printing cycle. For various embodiments of the gas enclosure system of the present teachings, particles with a size of about ≧ 0.3 μm can be maintained with less than about 3 particles in that size range over a period of at least about 24 hours. According to the present teachings, particulate matter measurements obtained from different locations in various embodiments of the gas enclosure system of the present teachings over a duration of a period of at least about 24 hours are 0.001 particles of ≧ 2 μm and Reported as an average of 0.02 particles ≧ 0.5 μm.

  For example, FIGS. 37A and 37B depict the results of long-term measurements made on various embodiments of the gas enclosure system of the present teachings. In FIG. 37A, two tests performed on different days are depicted. Such testing was performed in gas enclosure systems such as those shown in FIGS. 12 and 13 maintained in an inert nitrogen environment. Measurements were made proximal to a substrate support device such as a chuck or floating table, as depicted in FIG. During the test period, the gas enclosure system was in continuous use due to the sequence including printing, maintenance, and idle. In test 1, the duration of the real-time measurement was about 16 hours. In that time, a total of two particles of size ≧ 2 μm were measured, ie one at about 5 hours and one near the end of the test period. For Test 2, which had a duration of about 10 hours, particles in this size range were not measured. In FIG. 37B, Test 3 measurements made on the system on another day over a period of 8 hours or more are depicted for particles sized about ≧ 0.5 μm. During this test period, a gas enclosure assembly window, such as window 130 of FIG. 1A, is about 2 hours (reference number I.), about 6.5 hours (reference number II.), And about 7 hours (reference number III. ) Was released periodically. During these periods of transient gas enclosure system exposure to the surrounding environment, particulate matter measurements spiked and then rapidly rebounded to a baseline value of about ≦ 1 particle within its size range. It can be observed that it is established.

For various embodiments of the systems and methods of the present teachings, suspended particulate matter measured in a gas enclosure system is less than about ³ particles / ft ³ for particles of about ≧ 0.3 μm, about ≧ 0. It may be less than about 1 particle / ft ³ for 5 μm particles and less than about 0 particle / ft ³ for particles of about ≧ 1.0 μm. In that regard, various embodiments of gas circulation and filtration systems are described in International Standards Organization Standards (ISO) 1464-14-1, 1999, “Cleanrooms and associated controlled environments 1: Part 1 as specified by Class 1 to Class 5. It can be designed to provide a low particle inert gas environment for suspended particulate matter that meets the “Classification of Air Cleanliness” standard and meets or even exceeds the standards set by Class 1 Also good.

  Such rapid system recovery according to various embodiments of the circulation and filtration system of the present teachings as demonstrated in the data presented for FIG. 37B is additionally depicted in the graph of FIG. In FIG. 38, particles of size ≧ 2 μm were monitored proximal to a substrate support device such as a chuck or floating table. As can be seen in the graph of FIG. 38, recovery took place in less than 3 minutes to return to a baseline level of about ≦ 1 particle within that size range.

  Determination of the on-substrate distribution of particulate matter on the substrate can be made to various embodiments of the gas enclosure system using, for example, a test substrate before the substrate is printed for system verification. In various embodiments of the gas enclosure system, the determination of the on-substrate distribution of particulate matter can be performed as an ongoing quality check while the substrate is being printed. For various embodiments of the gas enclosure system, the determination of the distribution of particulate matter on the substrate can be performed before the substrate is printed, in addition, while the substrate is being printed, in-situ for system verification. It can be carried out.

  FIG. 39 is a light scattering based on-substrate detection that may have essentially the same components as previously described for the particle counter detector 830 of FIG. 34 with respect to a detection system for suspended particulate matter. Describe the method.

  In FIG. 39, the on-substrate particle counter detection system 860 based on light scattering can include an electromagnetic radiation source in a known wavelength range of a known wavelength, such as a light source 850. For various embodiments of on-substrate particle counter detection system 860, light source 850 can be a laser source that emits light of a known wavelength from about 600 nm to about 850 nm. Radiation source light 851 is depicted by ray tracing that it interacts with particles 852 on substrate 854. For various embodiments of the systems and methods of the present teachings, the substrate can be a test substrate such as a silicon wafer. Considering the history of particle determination on a substrate that has evolved from the semiconductor industry, particle determination on a silicon wafer is a widely accepted test method. Furthermore, silicon wafers can have attributes such as having a preferred reflective surface for on-substrate detection systems based on light scattering. In addition, the silicon wafer is a substantially conductive material so that it can be grounded. Having a substrate surface that is electrically neutral is important to obtain unbiased sampling of particle deposition on the substrate. It is not uncommon for particulate matter to carry a charge, which makes the charged surface false positive or false negative depending on whether the interaction between the charged particle and the charged surface is attractive or repulsive. Results can be shown.

  For a substrate having a reflective surface, such as a silicon wafer test substrate, the radiant source light 851 can be reflected, as shown by reflected light 853, which also reflects the scattered light, as depicted by scattered light 855. It can also interact with particles 852 on the substrate surface 854 to produce. As previously discussed herein for the case of suspended particle detection based on light scattering, such as particle counter detector 830 of FIG. 34, the light is depicted as scattered light 855 entering optical path I, as It can be scattered in several angular orientations, including a right angle to the direction of the radiation source light 851. A focusing lens 856 can focus the light scattered by the particles 852 at right angles to the direction of the radiation source light 851, as depicted by the optical path II towards at least one optical filter, such as the filter 857. . Optical filter 857 can be, for example, a spatial or optical bandpass filter, or additional filters can be added to provide a combination thereof. Finally, the light scattered at right angles to the direction of the radiation source light 851 can be detected by a detector 858, which can be various types of photometric detectors, for example, based on photodiode technology. According to various embodiments of the systems and methods of the present teachings, a particle counter detection system on a substrate, such as particle counter detection system 860 on substrate in FIG. A report can be provided to the end user, including the location of all particles to be played.

  For particle determination on the substrate, for example, but not limited to, a test protocol for system verification, analyzed with a report of the particle size and location determined for each test wafer, and then sealed the silicon test wafer. Can be obtained. Test wafers can be obtained as individually sealed or in cassettes. According to various systems and methods of the present teachings, a cassette of witness wafers can be sealed within the cassette housing, and then the cassette housing is sealed using a removable sealing material such as a sealed polymer pouch. Can do. For various test protocols for particle determination on a substrate for gas enclosure system verification, a cassette of witness wafers can be placed into the gas enclosure system, either by the end user or by a robot. . For example, the cassette can be placed in an auxiliary enclosure as previously described herein, either by an end user or with a robot, where the auxiliary environment is associated with a reactive gas. It can be deployed through the recovery process until it is within specification. The cassette can be transferred into the printing system enclosure either by the end user or by a robot. Once the sealed cassette enters the gas enclosure system, the witness wafer cassette can be unsealed and the cassette housing can be opened for easy access to the wafer.

  Referring to FIG. 40, the printing system 2003 depicted with the test wafer 854 has all of the elements previously described for the printing system 2002 of FIG. 26 and the printing system 2003 of FIGS. 28A and 36. Can do. For example, but not limited to, in FIG. 40, printing system 2003 also includes a Z-axis moving plate 2310 for Z-axis positioning of printhead assembly 2500, as previously depicted for FIGS. 26, 28A, and 36. An X-axis carriage assembly 2300 mounted on the bridge 2130 can be included. In that regard, various embodiments of the carriage assembly 2300 can provide a precise X, Z positioning of the printhead assembly 2500 relative to a substrate positioned on the substrate support 2250. For various embodiments of the printing system 2003, the X-axis carriage assembly 2300 can utilize a linear air bearing motion system that is inherently low particle generation. The printing system 2003 of FIG. 40 includes a service bundle housing discharge system 2400 for containing and discharging particles generated from the service bundle, which can include a service bundle housing 2410 for storing the service bundle. be able to. The printing system 2003 of FIG. 40 can have a substrate support device 2250 for supporting a substrate that can be precisely positioned in the Y-axis direction using the Y-axis positioning system 2355. Both the substrate support device 2250 and the Y-axis positioning system 2355 are supported by the printing system base 2101. The substrate support device 2250 can be mounted on a Y-axis motion assembly 2355, such as, but not limited to, on a rail system 2360 using a linear bearing system that utilizes either mechanical bearings or air bearings. Can be moved. For various embodiments of the gas enclosure system, the air bearing motion system helps to promote frictionless conveyance of the substrate disposed on the substrate support device 2250 in the Y-axis direction. The Y-axis motion system 2355 can also optionally use double rail motion, again provided by a linear air bearing motion system or a linear mechanical bearing motion system.

  The test wafer 854 of FIG. 40 can be placed on the substrate support device 2250 of the printing system 2003. The substrate support device 2250 can be positioned proximal to the bridge 2130 at various locations that can simulate where the substrate can be positioned during the printing process. The test wafer can have an edge exclusion zone where particle determination is not performed after testing because the edge exclusion zone is a zone where handling can occur that can introduce contamination at the wafer edge. According to various test protocols for particle determination on a substrate for gas enclosure system verification, the edge exclusion zone is about 1 cm to about 2 cm wide around the wafer and can be measured from the wafer edge. For various test protocols for determining particles on a substrate for gas enclosure system verification, a series of particle determinations on the substrate can be made to assess the state of the gas enclosure system that houses the printing system. First, a background test can be performed in which a statistical number of test wafers can be removed and then placed back into the cassette, just by handling the test substrate in the edge exclusion zone. In the next static test, a statistical number of test wafer statistics is taken just by handling the test substrate in the edge exclusion zone, and then the printing process without any operation of any equipment or devices in the gas enclosure system. Can be exposed to the tool environment for a set duration such as the duration of the tool. In that regard, the test wafers in the stationary set of test wafers are in a static printing environment. The set of test wafers for static testing can then be moved back into the cassette housing. In a print test, a statistical number of test wafer statistics is taken just by handling the test substrate in the edge exclusion zone, and then without any ink ejection activation, but full operation of the device or device in the gas enclosure system Can be exposed to the tool environment for the duration of the printing process. For example, the printhead assembly 2500 mounted on the carriage assembly 2300 moves relative to the test wafer 854 mounted on the substrate support device of the printing system 2003 depicted in FIG. 40 to perform a true print cycle. Can be simulated. In that regard, the test wafers in the printed set of test wafers are in a static printing environment. The set of test wafers for print testing can then be moved back into the cassette housing.

  Once the test protocol is completed, including background testing, static testing, and printing testing, the cassette housing can be resealed and the cassette can be removed from the printing system enclosure for testing. For example, a sealed cassette with a series of test wafers can be placed in the auxiliary enclosure. When the printing system enclosure is sealably isolated from the auxiliary enclosure as previously described herein, the auxiliary enclosure can be opened to the surrounding environment and the sealed cassette with the test wafer is analyzed. Can be taken out and sent for. All process steps for various embodiments of the particle determination test protocol on substrate of the present teachings can be performed either by the end user, by the robot, or a combination thereof. Finally, the auxiliary enclosure can be closed and placed through the recovery process until the gas environment is within specifications for the reactive gas.

  Various imaging systems and methods of the present teachings can be utilized for in situ particulate matter determination as well as for performing system verification procedures. Referring to FIG. 41, printing system 2004 may have all of the elements previously described for printing system 2002 of FIG. 26 and printing system 2003 of FIGS. 28A, 36, and 40. For example, without limitation, the printing system 2004 of FIG. 41 can include a service bundle housing discharge system 2400 for containing and discharging particles generated from the service bundle. The service bundle housing discharge system 2400 of the printing system 2004 can include a service bundle housing 2410 that can store service bundles. In accordance with the present teachings, a service bundle can be a variety of devices and apparatuses within a gas enclosure system, such as, but not limited to, various opticals required to operate various devices and apparatuses associated with a printing system, It can be operably connected to the printing system to provide electrical, mechanical and fluid connections. The printing system 2004 of FIG. 41 can have a substrate support device 2250 for supporting the substrate 2050 that can be precisely positioned in the Y-axis direction using the Y-axis positioning system 2355. Both the substrate support device 2250 and the Y-axis positioning system 2355 are supported by the printing system base 2101. The substrate support device 2250 can be mounted on a Y-axis motion assembly 2355, such as, but not limited to, on a rail system 2360 using a linear bearing system that utilizes either mechanical bearings or air bearings. Can be moved. For various embodiments of the gas enclosure system, the air bearing motion system helps to promote frictionless conveyance of the substrate disposed on the substrate support device 2250 in the Y-axis direction. The Y-axis motion system 2355 can also optionally use double rail motion, again provided by a linear air bearing motion system or a linear mechanical bearing motion system.

  With respect to the motion system supporting the various carriage assemblies, the printing system 2004 of FIG. 41 includes a first X-axis carriage assembly 2300A depicted thereon having a printhead assembly 2500 mounted thereon. And a second X-axis carriage assembly 2300B depicted with a mounted camera assembly 2550. The substrate 2050 overlying the substrate support device 2250 can be located at various locations proximal to the bridge 2130, for example, during the printing process. The substrate support device 2250 can be placed on the printing system base 2101. In FIG. 41, the printing system 2004 can have a first X-axis carriage assembly 2300A and a second X-axis carriage assembly 2300B mounted on a bridge 2130. The first X-axis carriage assembly 2300A may also include a first Z-axis movement plate 2310A for Z-axis positioning of the printhead assembly 2500, while the second X-axis carriage assembly 2300B includes a camera assembly. There may be a second Z-axis moving plate 2310B for 2550 Z-axis positioning. In that regard, the various embodiments of carriage assemblies 2300A and 2300B provide precise X, Z positioning with respect to the substrate positioned on substrate support 2250 for printhead assembly 2500 and camera assembly 2550, respectively. Can do. For various embodiments of the printing system 2004, the first X-axis carriage assembly 2300A and the second X-axis carriage assembly 2300B can utilize a linear air bearing motion system that is inherently low particle generation. .

  The camera assembly 2550 of FIG. 41 can be a high speed, high resolution camera. The camera assembly 2550 can include a camera 2552, a camera mount assembly 2554, and a lens assembly 2556. The camera assembly 2550 can be mounted on the motion system 2300B on the Z-axis moving plate 2310B via the camera mount assembly 2556. The camera 2552, as a non-limiting example, converts an optical image, such as a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS) device, or an N-type metal oxide semiconductor (NMOS) device, into an electrical signal. It can be any image sensor device. The various image sensor devices can be configured as an array of sensors for a surface scan camera or a single row of sensors for a line scan camera. The camera assembly 2550 can be connected to an image processing system that can include, for example, a computer for storing, processing, and providing results. As previously discussed herein with respect to the printing system 2004 of FIG. 41, the Z-axis moving plate 2310B can controllably adjust the Z-axis position of the camera assembly 2550 relative to the substrate 2050. For example, the X-axis motion system 2300B and the Y-axis motion system 2355 can be controllably positioned with respect to the camera assembly 2550 during various processes such as printing and data acquisition.

  Thus, the split-axis motion system of FIG. 41 provides a three-dimensional camera assembly 2550 and substrate 2050 with respect to each other in three dimensions to capture image data for any portion of the substrate 2050 at any desired focus and / or height. Precise positioning can be provided. Also, a precise XYZ motion of the camera relative to the substrate can be performed for either the surface scanning or line scanning process. As previously discussed herein, other motion systems, such as gantry motion systems, are also used, for example, to provide precision movement between the printhead assembly and / or camera assembly relative to the substrate in three dimensions. be able to. In addition, the illumination can be placed at various locations, either on the X-axis motion system or on the substrate support device proximal to the substrate, and combinations thereof. In that regard, the illumination can be positioned according to performing various bright and dark field analyzes, and combinations thereof. Various embodiments of the motion system may use a continuous or stepped motion, or a combination thereof, to capture the camera relative to the substrate 2050 to capture a series of one or more images of the surface of the substrate 2050. The assembly 2550 can be positioned. Each image can include areas associated with one or more pixel wells, associated electronic circuit components, and OLED substrate paths and connectors. By using image processing, an image of the particles can be obtained and the size of the particles and the number of particles of a particular size can be determined. In various embodiments of the systems and methods of the present teachings, a line scan camera having about 8192 pixels with a working height of about 190 mm and capable of scanning at about 34 kHz can be used. In addition, more than one camera can be mounted on the X-axis carriage assembly for various embodiments of the printing system board camera assembly, each camera having different specifications for field of view and resolution. it can. For example, one camera can be a line scan camera for in-situ particle inspection, while a second camera can be for regular navigation of a substrate in a gas enclosure system. Such cameras useful for regular navigation range from about 5.4 mm x 4 mm with a magnification of about 0.9 to about 10.6 mm x 8 mm with a magnification of about 0.45 times. It may be a surface scan camera with a field of view inside. In still other embodiments, one camera may be a line scan camera for in-situ particle inspection, while a second camera is used for substrate alignment in a gas enclosure system, eg, for substrate alignment. It can be for precise navigation. Such a camera that is useful for precision navigation can be a surface scanning camera with a field of view of about 0.7 mm × 0.5 mm using a magnification of about 7.2 ×.

  For in-situ inspection of the OLED substrate, a printing system substrate camera, such as the camera assembly 2550 of the printing system 2004 depicted in FIG. 41, to inspect the panel without significantly affecting the total average cycle time (TACT). Various embodiments of the assembly can be used. For example, a Gen 8.5 substrate can be scanned for particulate matter on the substrate in less than 70 seconds. In addition to in-situ inspection of the OLED substrate, prior to using the gas enclosure system for the printing process, to determine whether a sufficiently low particle environment for the gas enclosure system can be verified In addition, the printing system board camera assembly can be used for system verification testing by using a test board.

  With respect to suspended particulate matter and particle deposition in the system, a considerable number of variables can appropriately calculate an approximation of the value of the particle drop rate on a surface such as a substrate, for example, for any particular manufacturing system. It can affect the development of general models. Variables such as the size of the particles, the distribution of particles of a particular size, the surface area of the substrate, and the time of exposure of the substrate within the system can vary depending on the various manufacturing systems. For example, the size of the particles, and the distribution of particles of a particular size, can be substantially affected by the source and location of the particle generating components within the various manufacturing systems. Calculations based on various embodiments of the gas enclosure system of the present teachings show that without the various particle control systems of the present teachings, the deposition on the substrate per print cycle per square meter of substrate is 0.1 μm and larger sizes It suggests that for particles in the range, there can be more than about 1 million to more than about 10 million particles. Such calculations show that without the various particle control systems of the present teachings, deposition on the substrate per print cycle per square meter of substrate is greater than about 1000 for particles in the size range of about 2 μm and larger. Suggests that there can be more than about 10,000 particles.

  Using a test protocol as described for various embodiments of the particle on substrate test protocol of the present teachings, various embodiments of the low particle gas enclosure system of the present teachings are greater than or equal to 10 μm in size. For these particles, a low particle environment can be maintained that provides an average particle distribution on the substrate that meets the substrate deposition rate specification of less than or equal to about 100 particles per square meter of substrate per minute. Various embodiments of the low particle gas enclosure system of the present teachings meet on-substrate deposition rate specifications for particles less than or equal to about 100 per square meter of substrate per minute for particles of size greater than or equal to 5 μm. A low particle environment can be maintained that provides an average particle distribution on the substrate. In various embodiments of the gas enclosure system of the present teachings, for particles larger than or equal to 2 μm in size, on an average substrate that meets a deposition rate on the substrate of particles less than or equal to about 100 per square meter of substrate per minute A low particle environment can be maintained that provides particle distribution. In various embodiments of the gas enclosure system of the present teachings, on average substrates that meet a deposition rate on the substrate of particles less than or equal to about 100 per square meter of substrate per minute for particles larger than or equal to 1 μm in size. A low particle environment can be maintained that provides particle distribution. Various embodiments of the low particle gas enclosure system of the present teachings meet a deposition rate on the substrate of particles less than or equal to about 1000 per square meter of substrate per minute for particles of size greater than or equal to 0.5 μm. A low particle environment can be maintained, providing an average particle distribution on the substrate. For various embodiments of the gas enclosure system of the present teachings, for particles greater than or equal to 0.3 μm in size, meet a deposition rate on the substrate of particles less than or equal to about 1000 per square meter of substrate per minute. A low particle environment can be maintained that provides an average particle distribution on the substrate. Various embodiments of the low particle gas enclosure system of the present teachings meet a deposition rate on the substrate of particles less than or equal to about 1000 per square meter of substrate per minute for particles of size greater than or equal to 0.1 μm. A low particle environment can be maintained, providing an average particle distribution on the substrate.

  All publications, patents, and patent applications described in this specification are the same as if each individual publication, patent, or patent application was specifically and individually indicated to be incorporated by reference. Incorporated herein by reference.

While embodiments of the present disclosure have been shown and described herein, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Numerous variations, changes, and substitutions will now occur to those skilled in the art without departing from the disclosure.
It should be understood that various alternatives to the embodiments of the disclosure described herein may be employed in practicing the disclosure. For example, greatly different technical fields such as chemistry, biotechnology, advanced technology, and the pharmaceutical field may benefit from the present teachings. OLED printing is used to illustrate the utility of various embodiments of gas enclosure systems according to the present teachings. Various embodiments of a gas enclosure system that can accommodate an OLED printing system include, but are not limited to, providing a hermetically sealed enclosure through a build and debuild cycle, minimizing enclosure volume, and during processing In addition, features such as immediate access from outside to inside during maintenance can be provided. Such features of various embodiments of the gas enclosure system include, but are not limited to, structural integrity providing ease of maintaining low levels of reactive species during processing, as well as downtime during maintenance cycles. It can affect functionality such as minimizing rapid enclosure volume changes. Thus, various features and specifications that provide utility for OLED panel printing can also provide benefits to various technical fields. The following claims define the scope of the present disclosure, and methods and structures within the scope of these claims and their equivalents are intended to be covered thereby.

Claims (22)

A gas enclosure system,
A gas enclosure assembly defining an interior configured to contain a gas;
A printing system that is housed in the gas enclosure assembly, prior Kishirushi printing system,
A printhead assembly comprising at least one printhead;
A substrate support device;
A service bundle housing for storing a service bundle, wherein the service bundle includes a service bundle housing operatively connected to the printing system;
A service bundle housing discharge system operably coupled to the service bundle housing, wherein the service bundle housing discharge system creates a pressure difference between an inlet portion and an outlet portion of the service bundle housing. A service bundle housing exhaust system arranged to provide and wherein the pressure differential is sufficient to exhaust the gas through the service bundle housing from the inlet portion to the outlet portion ; Gas enclosure system. The gas enclosure assembly further includes
A printing system enclosure for housing the printing system;
The gas enclosure system of claim 1, comprising: an auxiliary enclosure, wherein the auxiliary enclosure is configured to be sealably isolated from the printing system.   The gas enclosure system of claim 1, wherein the gas is an inert gas. The gas enclosure system according to claim 3, wherein the inert gas is selected from at least one of nitrogen and a noble gas.   The gas enclosure system of claim 1, wherein the gas is clean dry air (CDA).   The gas enclosure system of claim 1, further comprising a gas purification system. The gas purification system, a plurality of reactive species contained in the gas is configured to maintain below 100 ppm, the gas enclosure system of claim 6.   The gas enclosure system of claim 7, wherein the reactive species is selected from water vapor and oxygen. A printhead assembly movement system capable of moving in so that in pairs the substrate supported on the substrate supporting device positioning the print head assembly,
And said service Tabakatami body discharge system, a particle control system including a gas circulation and filtration system, wherein the particle control system, the average substrate particle distribution, 1 minute with the particles is equal to that or greater than 2μm size to meet one square meter per Ri 1 00, or less than substrate deposition rate specifications it equal particles of the substrate per is operably coupled to maintain a low particle environment within the gas enclosure system, particle control System and
The gas enclosure system of claim 1, further comprising: The average substrate particle distribution, size meets the above or equal with the particles less than Ri 1 000 per 1 square meter substrate per minute or equal substrate of particle deposition rate specification 0.3 [mu] m, according to claim 9 Gas enclosure system as described in. The gas enclosure system of claim 1, wherein the service bundle enclosure discharge system is operably coupled to a gas circulation and filtration system.   The gas enclosure system of claim 1 or claim 9 further comprising a printhead assembly exhaust system for exhausting gas proximal to the printhead assembly away from the substrate support device. The gas enclosure system of claim 12, wherein the printhead assembly exhaust system is operably coupled with a gas circulation and filtration system. It said printhead assembly movement system is a split-axis motion system, the gas enclosure system of claim 9.   The gas enclosure system of claim 14, wherein the split axis motion system comprises an air bearing motion system.   The gas enclosure system according to claim 1, wherein the substrate support device includes a floating table. Further comprising a substrate movement system for moving the substrate through the printing system, the board exercise system includes an air bearing motion system, the gas enclosure system of claim 1. The substrate support device, that is configured to support the substrate having a size ranging up to 3.5 generations or al 1 0 generation, gas enclosure system of claim 9.   The gas enclosure system of claim 18, wherein the gas is an inert gas.   The gas enclosure system of claim 19 further comprising a gas purification system. The gas purification system, a plurality of reactive species contained in the gas is configured to maintain below 100 ppm, the gas enclosure system of claim 20.   The service bundle housing discharge system is further configured to maintain a comparative neutral or negative pressure difference between the interior of the service bundle housing discharge system and the environment surrounding the service bundle housing discharge system. The gas enclosure system of claim 1, wherein