JP6357667B2

JP6357667B2 - Ultrasonic bonding equipment

Info

Publication number: JP6357667B2
Application number: JP2013270877A
Authority: JP
Inventors: 良一細野
Original assignee: Seidensha Electronics Co Ltd
Current assignee: Seidensha Electronics Co Ltd
Priority date: 2013-12-27
Filing date: 2013-12-27
Publication date: 2018-07-18
Anticipated expiration: 2033-12-27
Also published as: JP2015123481A

Description

本発明は超音波接合装置に係り、詳しくは共振器のノーダルポイントを支持する支持手段を改良した超音波接合装置に関する。 The present invention relates to an ultrasonic bonding apparatus, and more particularly to an ultrasonic bonding apparatus with improved support means for supporting a nodal point of a resonator.

超音波振動を利用した装置は、一般的に振動子を有する共振器を備え、共振器の固有振動数に合わせた振動を振動子から発振し、その振動を共振器によって増幅して、対象物に効率よく超音波振動を印加するようにしている。
超音波振動を利用した装置の一つである超音波接合装置は、薄い金属板等の複数のワーク（接合対象物）を互いに重ね合わせた被接合部分に超音波振動を与えて接合する装置であり、超音波振動をワークに伝えるが、装置本体に伝えない工夫がされている。 An apparatus using ultrasonic vibration generally includes a resonator having a vibrator, oscillates from the vibrator in accordance with the natural frequency of the resonator, amplifies the vibration by the resonator, The ultrasonic vibration is efficiently applied to.
An ultrasonic bonding apparatus, which is one of the apparatuses using ultrasonic vibration, is an apparatus that applies ultrasonic vibration to a bonded portion in which a plurality of workpieces (joining objects) such as thin metal plates are superposed on each other to be bonded. Yes, there is a device that transmits ultrasonic vibrations to the work but not to the main body.

図１８に、従来の超音波接合装置の断面図を示したように、共振器ユニットＡの超音波振動子ＧとブースタＦとの継目と、ブースタＦと工具ホーンＣとの継目を、それぞれダイヤフラムＥ，Ｅで接続している。ダイヤフラムＥ，Ｅは、振動の伝達方向（図１８、紙面の水平方向）に撓んで、超音波振動子Ｇで発生した超音波振動をブースタＦ経由で工具ホーンＣに伝達する。一方、ダイヤフラムＥ，Ｅは、振動の伝達方向と直交する方向に剛性を有していて、装置本体のホルダー部Ｄへの超音波振動の伝達を阻止する。この状態で、工具ホーンＣを下降させて、アンビルＢ上に重ねて置かれたワークＷを押圧して、ワークＷに超音波振動を伝えて接合する（例えば、特許文献１参照）。 As shown in the cross-sectional view of the conventional ultrasonic bonding apparatus in FIG. 18, the joint between the ultrasonic transducer G and the booster F of the resonator unit A and the joint between the booster F and the tool horn C are respectively diaphragms. E and E are connected. The diaphragms E and E bend in the vibration transmission direction (FIG. 18, horizontal direction of the paper surface), and transmit the ultrasonic vibration generated by the ultrasonic vibrator G to the tool horn C via the booster F. On the other hand, the diaphragms E and E have rigidity in a direction orthogonal to the vibration transmission direction, and prevent transmission of ultrasonic vibration to the holder portion D of the apparatus main body. In this state, the tool horn C is lowered, the workpiece W placed on the anvil B is pressed, and ultrasonic vibration is transmitted to the workpiece W to join them (for example, see Patent Document 1).

また、図１８のように工具ホーンＣを片持ち支持している超音波接合装置では、ワークＷを押すと、反力による回転モーメントで工具ホーンＣの先端が撓むことがある。そこで、必要により工具ホーンＣのノーダルポイントを加圧治具で加圧している。ただ、ノーダルポイントでは半径方向に小さい膨張・収縮が生じるため、剛性の高い加圧治具で単純に加圧しただけではエネルギー損失を生じる。そこで、エネルギー損失を低減した状態で、高い加圧力を効果的に与える方法として、例えば図１９と図２０に示したように、加圧子Ｈを工具ホーンＣの共振周波数と同等程度の周波数で共振させ、撓み振動をなしうる振動共振体となし、その最大振幅点において工具ホーンＣのノーダルポイントを加圧する案が提案されている。詳しい説明は省略するが、図１９に、加圧子Ｈで工具ホーンＣのノーダルポイントを加圧している超音波接合装置の側面図を示し、図２０に正面図を示した。図２０の波線は加圧子Ｈの振幅の大きさを示している（例えば、特許文献２参照）。 In addition, in the ultrasonic bonding apparatus that cantilever-supports the tool horn C as shown in FIG. 18, when the workpiece W is pressed, the tip of the tool horn C may be bent by a rotational moment due to a reaction force. Therefore, the nodal point of the tool horn C is pressurized with a pressure jig as necessary. However, since a small expansion / contraction occurs in the radial direction at the nodal point, energy loss occurs simply by pressing with a highly rigid pressing jig. Therefore, as a method for effectively applying a high pressure with reduced energy loss, for example, as shown in FIGS. 19 and 20, the pressurizer H is resonated at a frequency equivalent to the resonance frequency of the tool horn C. Thus, there is proposed a vibration resonator that can generate flexural vibration, and pressurizes the nodal point of the tool horn C at the maximum amplitude point. Although a detailed description is omitted, FIG. 19 shows a side view of an ultrasonic bonding apparatus that pressurizes the nodal point of the tool horn C with the pressurizer H, and FIG. 20 shows a front view. The wavy line in FIG. 20 indicates the magnitude of the amplitude of the pressurizer H (see, for example, Patent Document 2).

また、超音波接合装置において、ワークの接合面積が大きくなると接合面積に比例した加圧力が必要になる。大きい加圧力を得るためには、図１８、１９、２０とは別に、図２１と図２２に示したように、共振器のノーダルポイントの断面上の外周に凹形状の溝を形成して、共振器の外周面より内側に埋没した外周面を有する被保持部分Ｉを形成し、装置本体のホルダー部Ｄ’に固定した保持手段Ｊと蓋Ｋを被保持部分Ｉの外周面に面接触させた状態で、固定ネジＬを締めてクランプする支持方法が提案されている。 Further, in the ultrasonic bonding apparatus, when the workpiece bonding area increases, a pressing force proportional to the bonding area is required. In order to obtain a large applied pressure, a concave groove is formed on the outer periphery of the resonator at the nodal point cross section as shown in FIGS. 21 and 22, in addition to FIGS. The held portion I having the outer peripheral surface buried inside the outer peripheral surface of the resonator is formed, and the holding means J and the lid K fixed to the holder portion D ′ of the apparatus main body are in surface contact with the outer peripheral surface of the held portion I. In this state, a support method has been proposed in which the fixing screw L is tightened and clamped.

この方法によれば、ノーダルポイントは共振器に発生する定在波の節にあたるところで、できるだけノーダルポイント自身となる中心部分に近い部分を保持手段により保持すると、振動も小さく、保持することによる振動ロスや異常振動が減少するという。
しかし、ノーダルポイントの断面で考えると中央部分は停止しているが、円周上へ広がるほど膨張収縮するため、外側では振動が発生している。そこで、上記の共振器の被保持部分Ｉ（八角形の外周面）の全周又は大部分に面接触してクランプする支持手段の材質を対数減衰率が０．０１より大きく１より小さいものとしたり、音速が５９００ｍ／ｓより大きい材質にしたり（例えば、特許文献３、４参照）、保持手段の押圧部にスプリング構造のような緩衝構造部を設けたりして、振動ロスや異常振動を減少させることが更に提案されている（例えば、特許文献５参照）。 According to this method, the nodal point corresponds to the node of the standing wave generated in the resonator, and if the portion as close to the central portion as the nodal point itself is held by the holding means, the vibration is also small and is held. It is said that vibration loss and abnormal vibration are reduced.
However, although the central portion is stopped when viewed from the cross section of the nodal point, the outer portion vibrates because it expands and contracts as it spreads on the circumference. Therefore, the material of the support means for clamping in contact with the entire circumference or most of the held portion I (octagonal outer circumferential surface) of the resonator is assumed to have a logarithmic attenuation ratio larger than 0.01 and smaller than 1. Reduce the vibration loss and abnormal vibration by using a material with a sound speed higher than 5900 m / s (for example, refer to Patent Documents 3 and 4) or providing a buffer structure such as a spring structure in the pressing part of the holding means. It has been further proposed (see, for example, Patent Document 5).

特開平９−２５３８６９号公報JP-A-9-253869 特開平１０−２０２７５２号公報Japanese Patent Laid-Open No. 10-202752 特開２００６−１５６９７０号公報JP 2006-156970 A 特開２００９−２７２５９９号公報JP 2009-272599 A 特開２０１２−１６１７６７号公報JP 2012-161767 A

本発明の超音波接合装置は、（１）超音波振動を接合対象物（ワーク）に伝えるが装置本体に伝えないように、超音波振動を効率よく対象物へ印加することを第一の課題としている。（２）工具ホーンの先端が、接合対象物（ワーク）を押圧する反力により撓まないようにすることを第二の課題としている。（３）共振器を強固に支持し、共振器の先端に取り付けた工具ホーンを比較的大きな加圧力で接合対象物（ワーク）に押圧できる超音波接合装置を実現することを第三の課題としている。 In the ultrasonic bonding apparatus of the present invention, (1) the first problem is to efficiently apply ultrasonic vibration to an object so that the ultrasonic vibration is transmitted to a bonding target (workpiece) but not to the apparatus main body. It is said. (2) The second problem is to prevent the tip of the tool horn from being bent by a reaction force that presses the object to be joined (workpiece). (3) Third object is to realize an ultrasonic bonding apparatus that firmly supports a resonator and can press a tool horn attached to the tip of the resonator against a workpiece (workpiece) with a relatively large pressure. Yes.

また本発明は、（４）共振器に発生する定在波の節にあたるノーダルポイントを支持する構造において、従来のように共振器の外周面より内側に埋没した外周面を設け、最大振幅点に比べ応力の高いノーダルポイントの断面を減らすことなく、つまり共振器の外周面に溝を掘らずに、振動ロスや異常振動を減少させる共振器の支持手段を実現することを第四の課題としている。 Further, the present invention provides (4) a structure that supports a nodal point corresponding to a node of a standing wave generated in the resonator, and provides a peripheral surface buried inside the peripheral surface of the resonator as in the prior art, and has a maximum amplitude point. A fourth problem is to realize a resonator support means that reduces vibration loss and abnormal vibration without reducing the cross section of the nodal point where stress is higher than that of the resonator, that is, without digging a groove in the outer peripheral surface of the resonator. It is said.

また本発明は、（５）共振器の外周面を保持する保持部材にスプリング構造のような特殊な緩衝構造部を設けずに、共振器を安定的に支持することを第五の課題としている。
また本発明は、（６）高価な制振金属を複雑な形状に加工して共振器の被保持部分の外周の全周をクランプすることなく、簡単な形状部品で支持手段を構成でき、コストダウンの実現や、硬度の高い材質など自由に支持手段の材質を選択できるようにすることを第六の課題としている。 The fifth object of the present invention is to (5) stably support the resonator without providing a special buffer structure such as a spring structure on the holding member that holds the outer peripheral surface of the resonator. .
In addition, the present invention can construct a supporting means with simple shaped parts without (6) processing expensive damping metal into a complicated shape and clamping the entire circumference of the held portion of the resonator. The sixth problem is to realize the down and allow the material of the supporting means to be freely selected such as a material having high hardness.

また本発明は、（７）樹脂チップ又は金属チップというチップ材の加圧方向と直交する方向にＯリングなどの緩衝部材を被せることにより、直接チップ材と部品、金属部品どうしの接触を防ぎ、装置側に伝わる超音波振動を減衰させることを第七の課題としている。 Further, the present invention (7) by covering a buffer member such as an O-ring in a direction perpendicular to the pressure direction of the chip material called resin chip or metal chip, directly preventing the chip material and the component, metal parts from contacting each other, A seventh problem is to attenuate the ultrasonic vibration transmitted to the apparatus side.

上記した目的を達成するために、本発明に係る超音波接合装置では、先端にチップ材を有する共振器支持手段を有し、前記チップ材の外周に緩衝部材を被せ、共振器支持手段のチップ材で、共振器のノーダルポイントの外周面の軸心に対して接合対象物の反対側を押圧支持している。
また本発明に係る超音波接合装置では、先端にチップ材を有する共振器支持手段を二以上有し、前記チップ材の外周に緩衝部材を被せ、前記共振器支持手段の一部のチップ材で、共振器のノーダルポイントの外周面の軸心に対して接合対象物の反対側を押圧支持し、前記共振器支持手段の他のチップ材で、前記共振器のノーダルポイントの外周面の軸心に対して接合対象物側を押圧支持している。 In order to achieve the above-described object, the ultrasonic bonding apparatus according to the present invention has a resonator support means having a tip material at the tip, and a buffer member is placed on the outer periphery of the tip material, so that the tip of the resonator support means is provided. The opposite side of the object to be joined is pressed and supported with respect to the axial center of the outer peripheral surface of the nodal point of the resonator.
Further, in the ultrasonic bonding apparatus according to the present invention, there are two or more resonator support means having a tip material at a tip , a buffer member is covered on the outer periphery of the tip material, and a part of the tip material of the resonator support means is used. , Pressing and supporting the opposite side of the object to be bonded to the axial center of the outer peripheral surface of the resonator nodal point, and using the other tip material of the resonator supporting means, the outer peripheral surface of the resonator nodal point The side to be joined is pressed and supported with respect to the shaft center.

また本発明に係る超音波接合装置では、接合対象物を押圧して接合する第一共振器（工具ホーン）と、当該第一共振器（工具ホーン）と接続された第二共振器（ブースタ）を有する超音波接合装置において、先端にチップ材を有する第一共振器（工具ホーン）支持手段と、第二共振器（ブースタ）支持手段と、を有し、前記チップ材の外周に緩衝部材を被せ、第一共振器（工具ホーン）の接合位置に最も近いノーダルポイントの外周面で、軸心に対して接合対象物の反対側を第一共振器（工具ホーン）支持手段のチップ材で押圧支持し、第二共振器（ブースタ）支持手段により、前記ノーダルポイントの隣に位置するノーダルポイントで第二共振器（ブースタ）を支持している。
また本発明に係る超音波接合装置では、先端にチップ材を有する共振器支持手段を有し、前記チップ材に制振材を重ね、前記共振器支持手段のチップ材で、共振器のノーダルポイントの外周面の軸心に対して接合対象物の反対側を押圧支持している。
また本発明に係る超音波接合装置では、先端にチップ材を有する共振器支持手段を二以上有し、前記チップ材に制振材を重ね、前記共振器支持手段の一部のチップ材で、共振器のノーダルポイントの外周面の軸心に対して接合対象物の反対側を押圧支持し、前記共振器支持手段の他のチップ材で、前記共振器のノーダルポイントの外周面の軸心に対して接合対象物側を押圧支持している。
また本発明に係る超音波接合装置では、接合対象物を押圧して接合する第一共振器（工具ホーン）と、当該第一共振器（工具ホーン）と接続された第二共振器（ブースタ）を有する超音波接合装置において、先端にチップ材を有する第一共振器（工具ホーン）支持手段と、第二共振器（ブースタ）支持手段と、を有し、前記チップ材に制振材を重ね、前記第一共振器（工具ホーン）の接合位置に最も近いノーダルポイントの外周面で、軸心に対して前記接合対象物の反対側を前記第一共振器（工具ホーン）支持手段のチップ材で押圧支持し、前記第二共振器（ブースタ）支持手段により、前記ノーダルポイントの隣に位置するノーダルポイントで第二共振器（ブースタ）を支持している。 Moreover, in the ultrasonic bonding apparatus according to the present invention, a first resonator (tool horn) that presses and bonds an object to be bonded, and a second resonator (booster) connected to the first resonator (tool horn). The first resonator (tool horn) support means having a tip material at the tip and the second resonator (booster) support means, and a buffer member on the outer periphery of the tip material Cover the outer surface of the nodal point closest to the joining position of the first resonator (tool horn) and the tip of the first resonator (tool horn) support means on the opposite side of the object to be joined with respect to the axis. The second resonator (booster) is supported by a nodal point located next to the nodal point by a second resonator (booster) support means.
The ultrasonic bonding apparatus according to the present invention further includes a resonator support means having a tip material at a tip thereof, and a damping material is stacked on the tip material, and the tip material of the resonator support means is used to connect the nodal of the resonator. The opposite side of the object to be joined is pressed and supported against the axis of the outer peripheral surface of the point.
Further, in the ultrasonic bonding apparatus according to the present invention, it has two or more resonator support means having a tip material at the tip, a damping material is stacked on the tip material, and a part of the tip material of the resonator support means, The opposite side of the object to be joined is pressed and supported with respect to the axial center of the outer peripheral surface of the resonator nodal point, and the tip of the outer peripheral surface of the nodal point of the resonator is supported by another chip material of the resonator supporting means. The object to be joined is pressed and supported against the heart.
Moreover, in the ultrasonic bonding apparatus according to the present invention, a first resonator (tool horn) that presses and bonds an object to be bonded, and a second resonator (booster) connected to the first resonator (tool horn). The first resonator (tool horn) support means having a tip material at the tip and the second resonator (booster) support means, and the damping material is stacked on the tip material. The tip of the first resonator (tool horn) supporting means is located on the outer peripheral surface of the nodal point closest to the joining position of the first resonator (tool horn) on the opposite side of the object to be joined with respect to the axis. The second resonator (booster) is supported by a material, and the second resonator (booster) is supported at a nodal point located next to the nodal point by the second resonator (booster) support means.

また本発明に係る超音波接合装置では、第一共振器（工具ホーン）支持手段のチップ材を、第一共振器（工具ホーン）の軸心に対して直角方向にスライド自在かつ固定自在に支持して、第一共振器（工具ホーン）の外周面を押す押圧力を調整可能に構成している。
本発明に係る超音波接合装置では、先端にチップ材を有する第一共振器（工具ホーン）支持手段を二以上有し、第一共振器（工具ホーン）支持手段の一部のチップ材で、第一共振器（工具ホーン）の接合位置に最も近いノーダルポイントの外周面の軸心に対して接合対象物の反対側を押圧支持し、第一共振器（工具ホーン）支持手段の他のチップ材で、前記第一共振器（工具ホーン）の前記ノーダルポイントの外周面の軸心に対して接合対象物側の外周面を押圧支持している。 Further, in the ultrasonic bonding apparatus according to the present invention, the tip material of the first resonator (tool horn) support means is slidably and fixedly supported in a direction perpendicular to the axis of the first resonator (tool horn). And it is comprised so that adjustment of the pressing force which pushes the outer peripheral surface of a 1st resonator (tool horn) is possible.
In the ultrasonic bonding apparatus according to the present invention, there are two or more first resonator (tool horn) support means having a tip material at the tip, and a part of the tip material of the first resonator (tool horn) support means, The other side of the object to be joined is pressed and supported against the axis of the outer peripheral surface of the nodal point closest to the joining position of the first resonator (tool horn), and the other means for supporting the first resonator (tool horn) A tip material presses and supports the outer peripheral surface of the first resonator (tool horn) on the side to be joined against the axis of the outer peripheral surface of the nodal point.

また本発明に係る超音波接合装置では、チップ材の外周に緩衝部材を被せている。 Moreover, in the ultrasonic bonding apparatus according to the present invention, a buffer member is placed on the outer periphery of the chip material .

また本発明に係る超音波接合装置では、制振材を、対数減衰率が０．０１より大きく１より小さいものとしている。 Further, in the ultrasonic bonding apparatus according to the present invention, the damping material has a logarithmic attenuation factor larger than 0.01 and smaller than 1.

また本発明に係る超音波接合装置では、接合対象物を押圧して接合する第一共振器（工具ホーン）と、当該第一共振器（工具ホーン）と接続された第二共振器（ブースタ）を有する超音波接合装置において、先端にチップ材を有する第一共振器（工具ホーン）支持手段と、第二共振器（ブースタ）支持手段と、を有し、第二共振器（ブースタ）支持手段は、第二共振器（ブースタ）のノーダルポイントにおいて半径方向に張り出したフランジの複数か所でフランジ取付板に固定するようにし、前記第一共振器（工具ホーン）の接合位置に最も近いノーダルポイントの外周面で、軸心に対して前記接合対象物の反対側を前記第一共振器（工具ホーン）支持手段のチップ材で押圧支持し、前記第二共振器（ブースタ）支持手段により、前記ノーダルポイントの隣に位置するノーダルポイントで第二共振器（ブースタ）を支持している。
また本発明に係る超音波接合装置では、前記フランジ取付板の材質を合成樹脂（プラスチック）または制振材としている。 Moreover, in the ultrasonic bonding apparatus according to the present invention, a first resonator (tool horn) that presses and bonds an object to be bonded, and a second resonator (booster) connected to the first resonator (tool horn). The first resonator (tool horn) support means having a tip material at the tip and the second resonator (booster) support means, and the second resonator (booster) support means Is fixed to the flange mounting plate at a plurality of radially projecting flanges at the nodal point of the second resonator (booster), and the nose closest to the joining position of the first resonator (tool horn). On the outer peripheral surface of the dull point, the opposite side of the object to be joined with respect to the axis is pressed and supported by the tip material of the first resonator (tool horn) support means, and the second resonator (booster) support means The noda It supports the second resonator in nodal points (booster) located next to the point.
In the ultrasonic bonding apparatus according to the present invention, the flange mounting plate is made of a synthetic resin (plastic) or a damping material.

また本発明に係る超音波接合装置では、第二共振器（ブースタ）支持手段は、前記第二共振器（ブースタ）のノーダルポイントにて半径方向に張り出したフランジの複数か所において、フランジ取付板との間に合成樹脂（プラスチック）または制振部材の座金（スペーサ）を入れて固定している。 In the ultrasonic bonding apparatus according to the present invention, the second resonator (booster) support means may be flange-attached at a plurality of flanges projecting radially at the nodal point of the second resonator (booster). A synthetic resin (plastic) or a washer (spacer) of a damping member is inserted between the plates and fixed.

また本発明に係る超音波接合装置では、第二共振器（ブースタ）支持手段は、第二共振器（ブースタ）のノーダルポイントにて半径方向に張り出したフランジの複数か所において、フランジ取付板に、合成樹脂（プラスチック）または制振材の締結部材で固定している。 In the ultrasonic bonding apparatus according to the present invention, the second resonator (booster) support means includes a flange mounting plate at a plurality of flanges projecting radially at the nodal point of the second resonator (booster). Further, it is fixed with a fastening member of a synthetic resin (plastic) or a damping material.

また本発明に係る超音波接合装置では、第二共振器（ブースタ）支持手段は、前記フランジ取付板を第二共振器（ブースタ）の振動方向にスライド自在に支持している。 In the ultrasonic bonding apparatus according to the present invention, the second resonator (booster) support means supports the flange mounting plate so as to be slidable in the vibration direction of the second resonator (booster) .

本発明に係る超音波接合装置によれば、（１）超音波振動を接合対象物（ワーク）に伝えるが装置本体に伝えないことができ、超音波振動を効率よく対象物へ印加することができる。（２）工具ホーンの先端が、接合対象物（ワーク）を押圧する反力により撓まない。（３）被接合部分が広い面積であっても接合に必要な加圧力で押圧することができる。 According to the ultrasonic bonding apparatus according to the present invention, (1) ultrasonic vibration can be transmitted to a bonding target (work) but not transmitted to the apparatus main body, and ultrasonic vibration can be efficiently applied to the target. it can. (2) The tip of the tool horn does not bend by the reaction force that presses the object to be joined (workpiece). (3) Even if a to-be-joined part is a wide area, it can press with the pressurization force required for joining.

また、（４）従来のように共振器の外周面に溝を掘らずに、振動ロスや異常振動を減少させることができる。（５）従来のように共振器の外周面を保持する保持部材に特殊な緩衝構造部を設けずに、共振器を安定的に支持することができる。（６）簡単な形状の部品で支持手段を構成することができ、コストダウンの実現や、硬度の高い材質など自由に支持手段の材質を選択できる。（７）直接金属部品どうしの接触を防ぎ、装置側に伝わる超音波振動を減衰させる、という効果がある。 Also, (4) vibration loss and abnormal vibration can be reduced without digging a groove in the outer peripheral surface of the resonator as in the prior art. (5) The resonator can be stably supported without providing a special buffer structure on the holding member that holds the outer peripheral surface of the resonator as in the prior art. (6) The support means can be configured with simple shaped parts, and the material of the support means can be freely selected such as cost reduction and a material with high hardness. (7) It has the effect of preventing direct contact between metal parts and attenuating ultrasonic vibration transmitted to the apparatus side.

本発明の第一の実施形態に係る超音波接合装置の共振器とその支持手段の構成と振幅について位置を対比して示した、一部を断面で示した側面図。The side view which showed a part with a cross section which showed the position of the structure and amplitude of the resonator of the ultrasonic bonding apparatus which concern on 1st embodiment of this invention, and its support means. 本発明の第一の実施形態に係る超音波接合装置の共振器とその支持手段の構成を、一部を断面で示した正面図。The front view which showed the structure of the resonator of the ultrasonic bonding apparatus which concerns on 1st embodiment of this invention, and its support means in part in cross section. （ａ）本発明の第一の実施形態に係る超音波接合装置の第一共振器（工具ホーン）の外周面を樹脂チップ又は金属チップというチップ材で押圧している状態を示した部分断面図、（ｂ）本発明の第一の実施形態に係る超音波接合装置の第一共振器（工具ホーン）の外周面を、制振材とチップ材で押圧している状態を示した部分断面図、（ｃ）本発明の第一の実施形態に係る超音波接合装置の外形の違う他の第一共振器（工具ホーン）の外周面をチップ材で押圧している状態を示した部分断面図。(A) The fragmentary sectional view which showed the state which has pressed the outer peripheral surface of the 1st resonator (tool horn) of the ultrasonic bonding apparatus which concerns on 1st embodiment of this invention with the chip material called a resin chip or a metal chip. (B) The fragmentary sectional view which showed the state which is pressing the outer peripheral surface of the 1st resonator (tool horn) of the ultrasonic bonding apparatus which concerns on 1st embodiment of this invention with the damping material and the chip material. (C) The fragmentary sectional view which showed the state which is pressing the outer peripheral surface of the other 1st resonator (tool horn) from which the external shape of the ultrasonic bonding apparatus which concerns on 1st embodiment of this invention differs in the chip material . 本発明の第一の実施形態の変形例として他の第二共振器（ブースタ）支持手段で第二共振器（ブースタ）を支持した状態を示す、一部を断面で示した側面図。The side view which showed the state which supported the 2nd resonator (booster) with the other 2nd resonator (booster) support means as a modification of 1st embodiment of this invention, and showed a part in cross section. 本発明の第一の実施形態の変形例として他の第二共振器（ブースタ）支持手段で第二共振器（ブースタ）を支持した状態を示す、一部を断面で示した拡大側面図。The expanded side view which showed the state which supported the 2nd resonator (booster) with the other 2nd resonator (booster) support means as a modification of 1st embodiment of this invention, and showed a part in cross section. 本発明の第一の実施形態の変形例として他の第一共振器（工具ホーン）支持手段で第一共振器（工具ホーン）を押圧した状態を示す、一部を断面で示した正面図。The front view which showed the state which pressed the 1st resonator (tool horn) with the other 1st resonator (tool horn) support means as a modification of 1st embodiment of this invention, and showed a part in cross section. 本発明の第一の実施形態の変形例の他の第一共振器（工具ホーン）支持手段を分解して示した図。The figure which decomposed | disassembled and showed the other 1st resonator (tool horn) support means of the modification of 1st embodiment of this invention. 本発明の第一の実施形態の変形例として更に他の第一共振器（工具ホーン）支持手段で第一共振器（工具ホーン）を押圧した状態を示す、一部を断面で示した正面図。The front view which showed the state which pressed the 1st resonator (tool horn) with the further other 1st resonator (tool horn) support means as a modification of 1st embodiment of this invention, and showed a part in cross section . 本発明の第二の実施形態に係る超音波接合装置の共振器とその支持手段の構成と振幅について位置を対比して示した側面図。The side view which showed the position and contrast of the structure and amplitude of the resonator of the ultrasonic bonding apparatus which concern on 2nd embodiment of this invention, and its support means. 本発明の第二の実施形態に係る超音波接合装置の第一共振器（工具ホーン）の支持手段による支持状態を、一部を断面で示した正面図。The front view which showed the support state by the support means of the 1st resonator (tool horn) of the ultrasonic bonding apparatus which concerns on 2nd embodiment of this invention in part in cross section. 本発明の第二の実施形態に係る超音波接合装置の変形例の第一共振器（工具ホーン）支持手段による支持状態を、一部を断面で示した正面図。The front view which showed the support state by the 1st resonator (tool horn) support means of the modification of the ultrasonic bonding apparatus which concerns on 2nd embodiment of this invention in part in cross section. 本発明の第二の実施形態に係る超音波接合装置の変形例の第一共振器（工具ホーン）支持手段を分解して示した図。The figure which decomposed | disassembled and showed the 1st resonator (tool horn) support means of the modification of the ultrasonic bonding apparatus which concerns on 2nd embodiment of this invention. 本発明の第二の実施形態に係る超音波接合装置の他の変形例の第一共振器（工具ホーン）支持手段による支持状態を、一部を断面で示した正面図。The front view which showed the support state by the 1st resonator (tool horn) support means of the other modification of the ultrasonic bonding apparatus which concerns on 2nd embodiment of this invention, and showed a part in cross section. 本発明の第二の実施形態に係る超音波接合装置の第二共振器（ブースタ）支持手段による支持状態を、一部を断面で示した側面図。The side view which showed the support state by the 2nd resonator (booster) support means of the ultrasonic bonding apparatus which concerns on 2nd embodiment of this invention in part in cross section. 本発明の第二の実施形態に係る超音波接合装置の第二共振器（ブースタ）支持手段を分解して示した側面図。The side view which decomposed | disassembled and showed the 2nd resonator (booster) support means of the ultrasonic bonding apparatus which concerns on 2nd embodiment of this invention. 本発明の第二の実施形態に係る超音波接合装置の他の共振器とその支持手段の側面図。The side view of the other resonator of the ultrasonic bonding apparatus which concerns on 2nd embodiment of this invention, and its support means. 本発明の第三の実施形態に係る超音波接合装置の共振器とその支持手段の構成と振幅について位置を対比して示した側面図。The side view which contrasted and showed the position and the structure and amplitude of the resonator of the ultrasonic bonding apparatus which concerns on 3rd embodiment of this invention, and its support means. 従来の超音波接合装置の共振器とその支持手段の構成と振幅について位置を対比して示した断面図。Sectional drawing which showed the position and contrast of the structure and amplitude of the resonator of the conventional ultrasonic bonding apparatus and its support means. 従来の他の超音波接合装置の共振器とその支持手段の側面図Side view of resonator and supporting means of other conventional ultrasonic bonding apparatus 従来の他の超音波接合装置の共振器とその支持手段の正面図。The front view of the resonator of the other conventional ultrasonic bonding apparatus and its support means. 従来の更に他の超音波接合装置の共振器の側面図と振幅について位置を対応して示した図。The figure which showed the position corresponding to the side view and amplitude of the resonator of other conventional ultrasonic bonding apparatus. （ａ）従来の更に他の超音波接合装置の共振器と支持手段の側面図（ｂ）従来の更に他の超音波接合装置の共振器と支持手段の正面図。(A) Side view of resonator and supporting means of still another conventional ultrasonic bonding apparatus (b) Front view of resonator and supporting means of still another conventional ultrasonic bonding apparatus.

（本発明の第一の実施形態）
以下、本発明の実施形態を図面に基づき説明する。まず、第一の実施形態について説明する。図１は、本発明の第一の実施形態に係る超音波接合装置の共振器とその支持手段近傍の構成を示した側面図であり、図２は、本発明の第一の実施形態に係る超音波接合装置の共振器とその支持手段近傍の構成を、一部を断面で示した正面図である。 (First embodiment of the present invention)
Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, the first embodiment will be described. FIG. 1 is a side view showing the configuration of the resonator of the ultrasonic bonding apparatus according to the first embodiment of the present invention and the vicinity of the supporting means, and FIG. 2 is related to the first embodiment of the present invention. It is the front view which showed the structure of the resonator of an ultrasonic bonding apparatus, and its support means vicinity, with a part in cross section.

本発明の第一の実施形態に係る超音波接合装置では、超音波振動子１ａにブースタ１ｂを一体に結合し、ブースタ１ｂに工具ホーン２をネジ２ａで結合している。超音波振動子１ａとブースタ１ｂはそれぞれ円柱状をなしており、工具ホーン２はブースタ１ｂと結合している根元側は円柱状をなし、中央部分から先端側に向かうにつれて上下方向に長い矩形断面をなしている。そして、先端の下面２ｂで接合対象物を押圧する。 In the ultrasonic bonding apparatus according to the first embodiment of the present invention, a booster 1b is integrally coupled to the ultrasonic transducer 1a, and a tool horn 2 is coupled to the booster 1b with a screw 2a. The ultrasonic transducer 1a and the booster 1b each have a cylindrical shape, and the tool horn 2 has a cylindrical shape at the base side coupled to the booster 1b, and has a rectangular cross section that is longer in the vertical direction from the central portion toward the tip side. I am doing. And a joining target object is pressed with the lower surface 2b of a front-end | tip.

超音波振動子１ａは軸方向に振動し、当該超音波振動子１ａの振動を増幅して接合対象物に効率よく印加するブースタ１ｂと工具ホーン２は共振器であり、本明細書では場合により、両者を総括して説明するときは共振器と称して説明し、個々に説明するときは、接合対象物から見て近い方から工具ホーン２を第一共振器、ブースタ１ｂを第二共振器と称して説明する。 The ultrasonic vibrator 1a vibrates in the axial direction, and the booster 1b and the tool horn 2 that amplify the vibration of the ultrasonic vibrator 1a and efficiently apply them to the object to be joined are resonators. When describing both of them together, they will be referred to as resonators, and when describing them individually, the tool horn 2 will be the first resonator and the booster 1b will be the second resonator as viewed from the object to be joined. Will be described.

本発明の第一の実施形態に係る超音波接合装置の共振器の支持手段３は超音波振動子１ａとブースタ１ｂの横に位置している。そして、当該支持手段３は、図１の紙面手前側に張出した形状のスリット付きアーム３ａ、３ｂを有していて、スリット付きアーム３ａ、３ｂで第二共振器（ブースタ）１ｂのノーダルポイントで外径を拡大したフランジ１ｃの外周を挟み、スリット付きアーム３ａ、３ｂの両先端をボルト３ｃで締め付けて、第二共振器（ブースタ）１ｂを支持している。スリット付きアーム３ａ、３ｂの材質は、後述する第一共振器（工具ホーン）支持手段のチップ材と同じ材料である合成樹脂（プラスチック）あるいは制振金属を用いている。 The resonator support means 3 of the ultrasonic bonding apparatus according to the first embodiment of the present invention is located beside the ultrasonic transducer 1a and the booster 1b. The support means 3 includes slit-equipped arms 3a and 3b projecting toward the front side in FIG. 1, and the nodal point of the second resonator (booster) 1b by the slit-equipped arms 3a and 3b. The second resonator (booster) 1b is supported by sandwiching the outer periphery of the flange 1c whose outer diameter has been increased by tightening both ends of the arms 3a and 3b with slits with bolts 3c. As the material of the arms with slits 3a and 3b, synthetic resin (plastic) or damping metal, which is the same material as the tip material of the first resonator (tool horn) support means described later, is used.

また支持手段３には複数のボルト４ａで固定され、共振器の軸方向と平行に延びるアーム４が張出している。アーム４の工具ホーン２側の先端付近にはアーム４の長手方向に長く上面から下面に向けて貫通した長孔４ｂを形成し、さらにアーム４の下面側には長孔４ｂの下端からさらに長手方向に長い長孔４ｃを形成している。この長孔４ｂ、４ｃにネジ部を有する押圧棒５を入れている。押圧棒５の工具ホーン２側の先端５ａの凹部に押圧棒５と同軸の円柱状をしたチップ材８を嵌めている。チップ材８は、工具ホーン２の接合位置である先端に最も近いノーダルポイントの外周面で、工具ホーン２の軸心に対して先端下面２ｂとは反対側の位置を押圧している。 An arm 4 that is fixed to the support means 3 by a plurality of bolts 4a and extends in parallel with the axial direction of the resonator projects. In the vicinity of the tip of the arm 4 on the tool horn 2 side, a long hole 4b that is long in the longitudinal direction of the arm 4 and penetrates from the upper surface to the lower surface is formed, and further on the lower surface side of the arm 4 from the lower end of the long hole 4b. A long hole 4c that is long in the direction is formed. A pressing rod 5 having a threaded portion is inserted into the long holes 4b and 4c. A tip material 8 having a columnar shape coaxial with the pressing rod 5 is fitted in a concave portion of the tip 5a of the pressing rod 5 on the tool horn 2 side. The tip material 8 presses the position opposite to the tip lower surface 2 b with respect to the axial center of the tool horn 2 on the outer peripheral surface of the nodal point closest to the tip, which is the joining position of the tool horn 2.

本発明を実施するための形態としては、チップ材８として樹脂チップを用いた場合を説明する。樹脂チップの材質としては、ガラスエポキシ、ガラス繊維強化ポリアミド（ＲＥＮＹ）、ポリエーテルエーテルケトン（ＰＥＥＫ）、ポリフェニレンサルファイド（ＰＰＳ）など、引張強度８５ＭＰａ以上、連続使用温度１５０℃以上の樹脂を用いるとよい。発明者は、引張強度８５ＭＰａ以上、連続使用温度１５０℃以上の樹脂であれば、問題なく継続使用できることを確認した。樹脂チップの材質にその他の制限は無く、耐摩耗性の高い材質や、硬度の硬い材質など、自由に共振子を固定、支持する材質を選択できる。またチップ材８としては、上記と同等の材料であれば他の材料に置き換えて用いても良く、チップ材８は制振金属などの金属チップを用いてもよい。チップ材８としては樹脂チップのみを用いても良いし、制振金属の金属チップのみを用いても良い。一般的な金属チップのときは、合成樹脂あるいは制振金属という制振材と重ねるなど同時に用いると良い。 As a form for implementing this invention, the case where a resin chip is used as the chip | tip material 8 is demonstrated. As a material of the resin chip, it is preferable to use a resin having a tensile strength of 85 MPa or more and a continuous use temperature of 150 ° C. or more, such as glass epoxy, glass fiber reinforced polyamide (RENY), polyether ether ketone (PEEK), polyphenylene sulfide (PPS). . The inventor confirmed that a resin having a tensile strength of 85 MPa or more and a continuous use temperature of 150 ° C. or more can be continuously used without any problem. There are no other restrictions on the material of the resin chip, and a material for fixing and supporting the resonator can be selected freely, such as a highly wear-resistant material or a hard material. The tip material 8 may be replaced with another material as long as it is the same material as described above, and the tip material 8 may be a metal tip such as a damping metal. As the chip material 8, only a resin chip may be used, or only a metal chip of a damping metal may be used. In the case of a general metal chip, it is preferable to use it simultaneously with a damping material called a synthetic resin or a damping metal.

なお、チップ材８の外周には緩衝部材としてＯリング９を被せてある。Ｏリング９を介して押圧棒先端５ａの凹部に嵌められていることで、チップ材８が自らの半径方向に膨張・収縮する振動動作をしてもその動きを吸収して押圧棒５に伝わらないようにしている。図１のようにチップ材８が工具ホーン２の外周面を押圧した状態で、長孔４ｂ上側の六角ナット６と長孔４ｃの長手方向に沿って摺動可能に設けられているスライドナット７により押圧棒５がアーム４に対して固定される。なお、チップ材８が工具ホーン２の外周面を押圧する押圧力は、六角ナット６とスライドナット７により微調整される。また、押圧棒５を長孔４ｂの長手方向に沿って移動させることで、チップ材８により工具ホーン２の外周面を押圧する位置を調整可能である。 The outer periphery of the chip material 8 is covered with an O-ring 9 as a buffer member. By being fitted in the concave portion of the tip 5a of the pressing rod via the O-ring 9, the tip material 8 absorbs the movement even if the tip member 8 expands / contracts in its radial direction and is transmitted to the pressing rod 5. I am trying not to. As shown in FIG. 1, the slide nut 7 is provided so as to be slidable along the longitudinal direction of the long hole 4 c and the hexagonal nut 6 on the upper side of the long hole 4 b in a state where the tip material 8 presses the outer peripheral surface of the tool horn 2. Thus, the pressing bar 5 is fixed to the arm 4. The pressing force with which the tip material 8 presses the outer peripheral surface of the tool horn 2 is finely adjusted by the hexagon nut 6 and the slide nut 7. Moreover, the position which presses the outer peripheral surface of the tool horn 2 with the chip | tip material 8 is adjustable by moving the press bar 5 along the longitudinal direction of the long hole 4b.

このように構成された超音波接合装置による超音波接合作業は、上記した工具ホーン２の外周面を、チップ材８を介して押圧棒５で押圧した状態で、共振器の支持手段３全体を下降させ、工具ホーン先端の下面２ｂで、アンビル１０上に重ねて置かれたワーク（接合対象物）１１ａ、１１ｂの接合位置を押圧し、超音波振動を伝えてワーク１１ａ、１１ｂを超音波接合する。 The ultrasonic bonding operation by the ultrasonic bonding apparatus configured as described above is performed by pressing the outer peripheral surface of the above-described tool horn 2 with the pressing rod 5 through the tip material 8, and the entire support means 3 of the resonator. The lower surface 2b at the tip of the tool horn is lowered, the joining positions of the workpieces (joining objects) 11a and 11b placed on the anvil 10 are pressed, ultrasonic vibration is transmitted, and the workpieces 11a and 11b are ultrasonically joined. To do.

図３（ａ）に、工具ホーン２の外周面を押圧棒５の先端のチップ材８で押圧している状態を拡大図にして示した。押圧棒５の先端５ａの凹部には円柱状の、チップ材８を嵌めている。チップ材８は、工具ホーン２のノーダルポイント、つまり軸方向に変位しない点（節）を押圧している。なお、チップ材８の外周には溝を設けて、その溝にＯリング９を被せている。 FIG. 3A is an enlarged view showing a state in which the outer peripheral surface of the tool horn 2 is pressed by the tip material 8 at the tip of the pressing bar 5. A cylindrical chip material 8 is fitted in the concave portion of the tip 5 a of the pressing bar 5. The tip material 8 presses a nodal point of the tool horn 2, that is, a point (node) that does not displace in the axial direction. In addition, a groove is provided on the outer periphery of the chip member 8, and an O-ring 9 is put on the groove.

工具ホーン２のノーダルポイントでは、超音波振動子１ａからの超音波振動エネルギーが伝わっても軸方向（振動方向）に変位しないが、半径方向に小さく膨張・収縮する。図３（ａ）では、工具ホーン２の外周面が半径方向に膨張・収縮するイメージを小さい矢印で示した。チップ材８は、工具ホーン２の外周面が半径方向に膨張すれば通常状態より圧縮され、工具ホーン２の外周面が半径方向に収縮すれば、圧縮された状態から元の通常状態に戻る。チップ材８は、工具ホーン２の円周面の半径方向の動きを吸収する。そのため、工具ホーン２のノーダルポイントに超音波振動エネルギーが伝わっても、超音波振動が押圧棒５を経由して押圧棒５を支持しているアーム４および支持手段３に伝わらないようにしている。 At the nodal point of the tool horn 2, even if ultrasonic vibration energy from the ultrasonic transducer 1a is transmitted, the tool horn 2 does not displace in the axial direction (vibration direction) but expands and contracts in the radial direction. In FIG. 3A, an image in which the outer peripheral surface of the tool horn 2 expands and contracts in the radial direction is indicated by small arrows. The tip material 8 is compressed from the normal state when the outer peripheral surface of the tool horn 2 expands in the radial direction, and returns from the compressed state to the original normal state when the outer peripheral surface of the tool horn 2 contracts in the radial direction. The tip material 8 absorbs the radial movement of the circumferential surface of the tool horn 2. Therefore, even if the ultrasonic vibration energy is transmitted to the nodal point of the tool horn 2, the ultrasonic vibration is not transmitted to the arm 4 supporting the pressing bar 5 and the support means 3 via the pressing bar 5. Yes.

また、工具ホーン２の外周面の膨張・収縮動作は、チップ材８が押圧している外周面ではある程度抑制されて減衰するが、チップ材８が押圧していない外周面では抑制されず、工具ホーン２の外周面の膨張・収縮動作は全体として許容される。
ここで、本発明の第一の実施形態の変形例について説明する。図３（ｂ）に示した本発明の第一の実施形態の第一変形例では、押圧棒５の先端５ａの凹部の底に制振材２０を入れ、その上にチップ材８を嵌めている。特にチップ材８が制振金属でない一般的な金属チップであるときにこの構成は有効である。制振材２０の材質は、対数減衰率が０．０１より大きく１より小さいものを用いる。また、先に説明した、ガラスエポキシ、ガラス繊維強化ポリアミド（ＲＥＮＹ）、ＰＥＥＫ、ＰＰＳなど、引張強度８５ＭＰａ以上、連続使用温度１５０℃以上の他の樹脂を制振材として用いてもよい。なお、チップ材８の形状と制振材２０の形状は、円柱状あるいは円板状といった簡単な形状として簡単に加工できる。 Further, the expansion / contraction operation of the outer peripheral surface of the tool horn 2 is suppressed and attenuated to some extent on the outer peripheral surface pressed by the tip material 8, but is not suppressed on the outer peripheral surface not pressed by the tip material 8. The expansion / contraction operation of the outer peripheral surface of the horn 2 is allowed as a whole.
Here, the modification of 1st embodiment of this invention is demonstrated. In the first modification of the first embodiment of the present invention shown in FIG. 3 (b), the damping material 20 is put into the bottom of the recess at the tip 5a of the pressing bar 5, and the chip material 8 is fitted thereon. Yes. This configuration is particularly effective when the tip material 8 is a general metal tip that is not a damping metal. As the material of the vibration damping material 20, a material having a logarithmic attenuation rate larger than 0.01 and smaller than 1. In addition, other resins such as glass epoxy, glass fiber reinforced polyamide (RENY), PEEK, and PPS described above, such as a tensile strength of 85 MPa or more and a continuous use temperature of 150 ° C. or more may be used as the vibration damping material. The shape of the chip material 8 and the shape of the damping material 20 can be easily processed as a simple shape such as a columnar shape or a disk shape.

図３（ｂ）のように押圧棒５とチップ材８の間に制振材２０を重ねた構成では、工具ホーン２の外周面の半径方向の動きを制振材２０で吸収する。そのため、超音波振動エネルギーがチップ材８に伝わっても超音波振動が押圧棒５を経由してアーム４と支持手段３に伝わらないようにできる。 In the configuration in which the damping material 20 is overlapped between the pressing bar 5 and the tip material 8 as shown in FIG. 3B, the damping material 20 absorbs the radial movement of the outer peripheral surface of the tool horn 2. Therefore, even if ultrasonic vibration energy is transmitted to the chip material 8, the ultrasonic vibration can be prevented from being transmitted to the arm 4 and the support means 3 via the pressing rod 5.

なお上記では、チップ材８で押圧する部分を円柱状の外周面とした場合を説明したが、チップ材８で押圧する部分を平面にしても良い。図３（ｃ）に、チップ材８で工具ホーン２’の外周に形成した平面を押圧したときの状態を示した。
本発明は上記のように、第一共振器（工具ホーン）の接合位置に最も近いノーダルポイントの外周面で、軸心に対して接合対象物の反対側を第一共振器（工具ホーン）支持手段のチップ材で押圧支持し、第二共振器（ブースタ）支持手段により、前記ノーダルポイントの隣に位置するノーダルポイントで第二共振器（ブースタ）を支持している。 In addition, although the case where the part pressed with the chip | tip material 8 was made into the cylindrical outer peripheral surface was demonstrated above, you may make the part pressed with the chip | tip material 8 a plane. FIG. 3 (c) shows a state when the flat surface formed on the outer periphery of the tool horn 2 ′ is pressed with the tip material 8.
In the present invention, as described above, the outer surface of the nodal point closest to the joining position of the first resonator (tool horn) is the first resonator (tool horn) on the opposite side of the object to be joined with respect to the axis. The second resonator (booster) is supported at the nodal point located next to the nodal point by the second resonator (booster) support means.

図４に、本発明の第一の実施形態の第二の変形例として他の第二共振器（ブースタ）支持手段で第二共振器（ブースタ）を支持した状態の側面図の一部を断面にして示し、図５で側面図を拡大して示した。図１、２では、第二共振器（ブースタ）のノーダルポイントで外径を拡大したフランジ１ｃの外周のほぼ全周を合成樹脂あるいは制振材でできたスリット付きアーム３ａ、３ｂで挟んでいたが、図４、５では、第二共振器（ブースタ）１ｂのノーダルポイントで外径を拡大したフランジ１ｃの端面の数か所において、スリット付アーム３ｄ、３ｅ内周に取り付けられたフランジ取付板９７に対して座金（スペーサ）９２を当てて皿ボルト３３と六角ナット３１で固定している。フランジ取付板９７と座金９２、皿ボルト３３の材質は、既に説明したチップ材と同じ材質を用いている。 FIG. 4 is a cross-sectional view of a part of a side view showing a state in which the second resonator (booster) is supported by another second resonator (booster) support means as a second modification of the first embodiment of the present invention. The enlarged side view is shown in FIG. In FIGS. 1 and 2, almost the entire circumference of the flange 1 c whose outer diameter is enlarged at the nodal point of the second resonator (booster) is sandwiched between arms 3 a and 3 b with slits made of synthetic resin or damping material. However, in FIGS. 4 and 5, the flanges attached to the inner circumferences of the arms 3d and 3e with slits at several places on the end face of the flange 1c whose outer diameter is enlarged at the nodal point of the second resonator (booster) 1b. A washer (spacer) 92 is applied to the mounting plate 97 and fixed with a countersunk bolt 33 and a hexagon nut 31. The flange mounting plate 97, the washer 92, and the countersunk bolt 33 are made of the same material as the chip material already described.

このことは、第二共振器（ブースタ）のフランジ１ｃを、振動を吸収するフランジ取付板９７に複数か所で固定したことになる。そのため、第二共振器（ブースタ）のフランジ１ｃを皿ボルト３３と六角ナット３１で固定した部分では、半径方向への膨張収縮がある程度抑制されて減衰するが、皿ボルト３３と六角ナット３１で固定していない部分は、半径方向への膨張収縮が抑制されず、半径方向へ膨張収縮動作が許容される。 This means that the flange 1c of the second resonator (booster) is fixed to the flange mounting plate 97 that absorbs vibration at a plurality of locations. For this reason, in the portion where the flange 1c of the second resonator (booster) is fixed by the countersunk bolt 33 and the hexagon nut 31, the expansion and contraction in the radial direction is suppressed to some extent and is attenuated, but fixed by the countersunk bolt 33 and the hexagon nut 31. In the portions that are not, the expansion and contraction in the radial direction is not suppressed, and the expansion and contraction operation in the radial direction is allowed.

また、皿ボルト３３と六角ナット３１で固定した第二共振器（ブースタ）のフランジ１ｃの部分の膨張収縮は、皿ボルト３３と六角ナット３１からフランジ取付板９７に伝わるが、フランジ取付板９７の材質を既に説明したチップ材あるいは制振材と同じにしたときは、第二共振器（ブースタ）のフランジ１ｃの部分の膨張収縮の動きを吸収して、支持手段３のスリット付きアーム３ｄ、３ｅに伝わりにくくなる。そのため、支持手段３のスリット付きアーム３ｄ、３ｅの材質として、すでに説明したチップ材や制振材と同じ材質を用いてもよいし、一般的な金属を用いてもよい。なお、六角ナット３１については、フランジ取付板９７に雌ネジを切って六角ナット３１を省略しても良い。 Further, the expansion and contraction of the flange 1c portion of the second resonator (booster) fixed by the countersunk bolt 33 and the hex nut 31 is transmitted from the countersunk bolt 33 and the hex nut 31 to the flange mounting plate 97. When the material is the same as the chip material or the vibration damping material already described, the movement of expansion and contraction of the flange 1c portion of the second resonator (booster) is absorbed, and the arms with slits 3d and 3e of the support means 3 are absorbed. It becomes difficult to be transmitted to. Therefore, as the material of the slit-equipped arms 3d and 3e of the support means 3, the same material as that of the chip material and the vibration damping material already described may be used, or a general metal may be used. As for the hexagon nut 31, the hexagon nut 31 may be omitted by cutting a female screw on the flange mounting plate 97.

図６に、本発明の第一の実施形態にかかる超音波接合装置の第一共振器（工具ホーン）支持手段の第三変形例の正面図を、図７には第三変形例の分解図を、それぞれ示した。図６では、工具ホーン２’の外周である円筒面を削って形成した平面をチップ材２８で押圧している状態を示している。 FIG. 6 is a front view of a third modification of the first resonator (tool horn) support means of the ultrasonic bonding apparatus according to the first embodiment of the present invention, and FIG. 7 is an exploded view of the third modification. Respectively. FIG. 6 shows a state in which the chip material 28 is pressing a plane formed by cutting the cylindrical surface that is the outer periphery of the tool horn 2 ′.

先に説明した図１、図２の構成では、六角ナット６とスライドナット７により押圧棒５の先端５ａの凹部に入れたチップ材８の押圧状態を微調整するが、微調整する作業に手間がかかる可能性がある。第三変形例は、簡単に微調整作業ができるように使い勝手を改良している。 1 and 2, the hex nut 6 and the slide nut 7 are used to finely adjust the pressing state of the tip material 8 placed in the recess at the tip 5a of the pressing bar 5, but it is troublesome to make fine adjustments. May take. In the third modified example, usability is improved so that fine adjustment work can be easily performed.

図６に示した第三変形例では、図１、図２、図４におけるアーム４を押圧ブロック（上）１４及び押圧ブロック（下）１８の上下一対のブロックで構成している。押圧ブロック（下）１８内に底付き孔であるスライド孔１８ａを設け、スライド孔１８ａに上下にスライドする押圧スライド１９を入れている。 In the third modification shown in FIG. 6, the arm 4 in FIGS. 1, 2, and 4 is configured by a pair of upper and lower blocks of a pressing block (upper) 14 and a pressing block (lower) 18. A slide hole 18a, which is a bottomed hole, is provided in the pressure block (lower) 18, and a pressure slide 19 that slides up and down is placed in the slide hole 18a.

押圧スライド１９は、上下にそれぞれ凹部を設けて、下方の凹部に外周にＯリング２７を被せたチップ材２８を嵌め、上方の凹部に制振材２２を嵌めている。
なお、押圧スライド１９の外周には２つのＯリング２１を巻き付け、押圧スライド１９と押圧ブロック（下）１８の間に振動が伝わらないようにしている。また、上下の凹部の間には、空気抜き孔１９ａをあけて、それぞれの凹部とチップ材２８、あるいは制振材２２との間に空気がたまらないようにしている。 The pressing slide 19 is provided with concave portions on the upper and lower sides, a chip material 28 with an O-ring 27 on the outer periphery is fitted in the lower concave portion, and a damping material 22 is fitted in the upper concave portion.
Two O-rings 21 are wound around the outer periphery of the pressure slide 19 so that vibration is not transmitted between the pressure slide 19 and the pressure block (lower) 18. Further, an air vent hole 19 a is formed between the upper and lower recesses so that air does not accumulate between the respective recesses and the chip material 28 or the vibration damping material 22.

そして、予め押圧ブロック（上）１４に設けた雌ネジ１４ｂに押圧ボルト１５を下からネジこみ、押圧ボルト１５が突きぬけた部分に座金１７と六角ナット１６を取り付け、押圧ボルト１５の先端に、回転棒１５ｂを取り付けている。
押圧ブロック（上）１４でスライド孔１８ａに蓋をし、回転棒１５ｂを手回しして押圧ブロック（上）１４とネジで係合する押圧ボルト１５で押圧スライド１９を所定位置まで押し下げ、六角ナット１６で位置決め固定するようにしている。 Then, a press bolt 15 is screwed into a female screw 14b provided in advance on the press block (upper) 14 from below, and a washer 17 and a hexagon nut 16 are attached to a portion where the press bolt 15 has been pushed. A rod 15b is attached.
The slide hole 18a is covered with the pressure block (upper) 14, the rotary rod 15b is turned by hand, and the pressure slide 19 is pushed down to a predetermined position by the pressure bolt 15 engaged with the pressure block (upper) 14 with a screw. The positioning is fixed with.

この構造であれば、押圧ブロック（上）１４とネジで係合する押圧ボルト１５の先端１５ａが押圧スライド１９を所定位置まで押し下げ、六角ナット１６で位置決め固定することができる。また、チップ材２８の他に制振材２２を設けているため、超音波振動エネルギーがチップ材２８に伝わっても超音波振動が押圧ブロック（上）１４に伝わらない。チップ材２８の材質、制振材２２の材質については、既に説明した通りである。 With this structure, the tip 15 a of the pressing bolt 15 that engages with the pressing block (upper) 14 with a screw can push down the pressing slide 19 to a predetermined position and can be positioned and fixed with the hexagon nut 16. Further, since the damping material 22 is provided in addition to the chip material 28, the ultrasonic vibration is not transmitted to the pressing block (upper) 14 even if the ultrasonic vibration energy is transmitted to the chip material 28. The material of the chip material 28 and the material of the vibration damping material 22 are as described above.

工具ホーン２、２’のノーダルポイントでは、超音波振動エネルギーが伝わっても軸方向に変位しないが、半径方向に小さく膨張・収縮する。本実施形態及び変形例では、工具ホーン２、２’の外周面に接している押圧手段にチップ材８、２８を用い、あるいはチップ材８、２８と制振材２０、２２を重ねて用いている。このことにより、工具ホーン２、２’のノーダルポイントに超音波振動エネルギーが伝わっても安定的に支持することができる。そして、接合対象物（ワーク）１１ａ、１１ｂを超音波接合するのに必要な加圧力を工具ホーン先端下面２ｂに与えることができる。 At the nodal point of the tool horn 2, 2 ', even if ultrasonic vibration energy is transmitted, it is not displaced in the axial direction, but expands and contracts in the radial direction. In the present embodiment and the modification, the tip materials 8 and 28 are used as the pressing means in contact with the outer peripheral surfaces of the tool horns 2 and 2 ′, or the tip materials 8 and 28 and the damping materials 20 and 22 are used in an overlapping manner. Yes. As a result, even if ultrasonic vibration energy is transmitted to the nodal point of the tool horn 2, 2 ', it can be stably supported. And the pressurization force required in order to ultrasonically join the objects (workpieces) 11a and 11b to be joined can be applied to the tool horn tip lower surface 2b.

また本実施形態は、従来のように工具ホーンのノーダルポイントの外周面に溝を加工して被保持部を形成していない。また、被保持部の外周面の全周又は大部分を制振材で把持していない。本実施形態及び各変形例ではチップ材８、２８に接していない工具ホーン２、２'の外周面では、半径方向の膨張収縮を可能にして、超音波振動を効率よく対象物へ印加することができる。 Further, in the present embodiment, the held portion is not formed by machining the groove on the outer peripheral surface of the nodal point of the tool horn as in the prior art. Further, the entire periphery or most of the outer peripheral surface of the held portion is not gripped by the damping material. In the present embodiment and each modified example, the outer peripheral surface of the tool horn 2, 2 'that is not in contact with the tip material 8, 28 is capable of expanding and contracting in the radial direction and efficiently applying ultrasonic vibration to the object. Can do.

なお、上記では、チップ材８、２８で押圧する共振器支持手段で、工具ホーン２、２’の接合位置に最も近いノーダルポイントの外周面で、工具ホーン２、２’の軸心に対して接合対象物の反対側だけを支持した例を示したが、これに加えて、例えば図８に想像線で示したように、接合対象物の反対側以外の他の外周面をチップ材２８’、２８''で支持してもよい。図８の例では、工具ホーン２’の水平方向のブレ（横ブレ）を防止できる。 In the above description, the resonator support means that presses with the tip materials 8 and 28, and the outer peripheral surface of the nodal point closest to the joining position of the tool horns 2 and 2 ′, with respect to the axis of the tool horns 2 and 2 ′. In this example, only the opposite side of the object to be joined is supported. In addition to this, for example, as shown by an imaginary line in FIG. ', 28' 'may be supported. In the example of FIG. 8, it is possible to prevent the tool horn 2 ′ from shaking in the horizontal direction (lateral shaking).

（本発明の第二の実施形態）
本発明の第一の実施形態では、工具ホーン２の接合対象物と反対側の外周面をチップ材８で支え、工具ホーン２が撓まないようにする構成を説明した。
本発明の第二の実施形態では、工具ホーン２の接合対象物と反対側の外周面をチップ材で支え、更に接合対象物側の外周面を、同じくチップ材で押圧して支持している。本発明の第二の実施形態でも第一の実施形態と同じく、チップ材として樹脂チップを用いた場合を説明するが、チップ材として制振金属などの金属を用いてもよいことは第一の実施形態と同じである。 (Second embodiment of the present invention)
In 1st embodiment of this invention, the structure which supports the outer peripheral surface on the opposite side to the joining target object of the tool horn 2 with the chip | tip material 8, and prevents the tool horn 2 from bending was demonstrated.
In 2nd embodiment of this invention, the outer peripheral surface on the opposite side to the joining target object of the tool horn 2 is supported by the tip material, and also the outer peripheral surface on the joining target side is pressed and supported by the tip material. . In the second embodiment of the present invention, as in the first embodiment, a case where a resin chip is used as a chip material will be described. However, the first material is that a metal such as a damping metal may be used as the chip material. This is the same as the embodiment.

本発明の第二の実施形態は、本発明の第一の実施形態と同様に、チップ材で押圧していない工具ホーンの外周面を膨張収縮可能にしたので、従来のように共振器のノーダルポイントの外周面の全周をクランプする場合に比べて、ノーダルポイントの軸心に近い部分を保持しなくても、保持による振動ロスや異常振動が減少する利点に加えて、被接合対象物を大きな力で押圧することができるという利点がある。 In the second embodiment of the present invention, as in the first embodiment of the present invention, the outer peripheral surface of the tool horn that is not pressed by the tip material can be expanded and contracted. Compared to clamping the entire circumference of the outer surface of the dull point, in addition to the advantage of reducing vibration loss and abnormal vibration due to holding without holding the portion close to the axis of the nodal point, the object to be joined There is an advantage that an object can be pressed with a large force.

図９に、本発明の第二の実施形態の超音波接合装置の共振器とその支持手段近傍の構成を、一部を断面とした側面図で示し、それぞれの位置における振幅を曲線グラフで示した。なお、第一の実施形態の工具ホーン２は小型の工具ホーンで、第二の実施の形態の工具ホーン３２は大型の工具ホーンであり、一部形状が異なっているが各部の機能は同じであり、先端部の下面３２ａで接合対象物（ワーク）を押圧して接合を行う。 FIG. 9 shows a side view of a section of the resonator of the ultrasonic bonding apparatus according to the second embodiment of the present invention and its supporting means in a side view partly in section, and shows the amplitude at each position in a curve graph. It was. The tool horn 2 of the first embodiment is a small tool horn, and the tool horn 32 of the second embodiment is a large tool horn. Although the shapes are partially different, the functions of each part are the same. Yes, the joining object (workpiece) is pressed by the lower surface 32a of the tip portion to perform joining.

本発明の第二の実施形態の共振器支持手段の支持板３４の下方には位置決め板３６を固定していて、位置決め板３６の面上に上側支持板３８と下側支持板３９を位置決め固定している。上側支持板３８にはチップ材２８を、下側支持板３９にはチップ材２９をそれぞれ設け、工具ホーン３２のノーダルポイントにおいて、工具ホーン３２の外周面の上をチップ材２８で、外周面の下をチップ材２９で、それぞれ支持している。なお第一の実施の形態で説明したのと同じく、チップ材２８、２９は円柱状をしており、外周にはＯリング２７を被せている。また、第一の実施形態の第三変形例と同様に、工具ホーン３２の外周面の上を支持するチップ材２８は、押圧スライド１９の下方の凹部に嵌めてあり、押圧ボルト１５で押圧スライド１９ごと押し下げ、六角ナット１６で位置決め固定する。一方、工具ホーン３２の外周面の下を支持するチップ材２９は下側支持板３９の凹部に嵌めている。 The positioning plate 36 is fixed below the support plate 34 of the resonator support means of the second embodiment of the present invention, and the upper support plate 38 and the lower support plate 39 are positioned and fixed on the surface of the positioning plate 36. doing. The upper support plate 38 is provided with a tip material 28, and the lower support plate 39 is provided with a tip material 29. At the nodal point of the tool horn 32, the tip material 28 overlies the outer peripheral surface of the tool horn 32, and the outer peripheral surface. Are supported by chip materials 29 respectively. As described in the first embodiment, the tip materials 28 and 29 have a columnar shape, and the outer periphery is covered with an O-ring 27. Further, as in the third modification of the first embodiment, the tip material 28 that supports the outer peripheral surface of the tool horn 32 is fitted in the concave portion below the pressing slide 19 and is pressed by the pressing bolt 15. It is pushed down with 19 and fixed with a hexagon nut 16. On the other hand, the tip material 29 that supports the bottom of the outer peripheral surface of the tool horn 32 is fitted in the concave portion of the lower support plate 39.

本発明の第二の実施の形態の共振器支持手段では、第二共振器（ブースタ）１２のフランジ１２ａをドーナッツ型のスライド板３７に皿ボルト３３で一体に固定し、スライド板３７の外周面を、支持板３４に一体に設けた円筒型スライド３５の内周面上で第二共振器（ブースタ）１２の軸方向にスライド自在に支持している。なお、スライド板３７の材質は軸方向にスライドしやすく振動を吸収する点では、いわゆるエンジニアプラスチックが好ましいが、実用上は、金属でもよい。 In the resonator support means of the second embodiment of the present invention, the flange 12a of the second resonator (booster) 12 is integrally fixed to the donut-shaped slide plate 37 with a flat bolt 33, and the outer peripheral surface of the slide plate 37 is fixed. Is supported so as to be slidable in the axial direction of the second resonator (booster) 12 on the inner peripheral surface of a cylindrical slide 35 provided integrally with the support plate 34. The material of the slide plate 37 is preferably so-called engineered plastic in that it is easy to slide in the axial direction and absorbs vibration, but in practice it may be metal.

従来の超音波接合装置であれば、第二共振器（ブースタ）１２のフランジ１２ａを装置本体部分である支持板３４に固定するのだが、本実施形態では、第二共振器（ブースタ）１２のフランジ１２ａを支持板３４にスライド自在に支持している。その代わり、工具ホーン３２の接合位置に最も近いノーダルポイントで、支持板３４に固定した上側支持板３８と下側支持板３９に設けたチップ材２８、２９で第一共振器（工具ホーン）３２を固定している。 In the conventional ultrasonic bonding apparatus, the flange 12a of the second resonator (booster) 12 is fixed to the support plate 34, which is the main body of the apparatus. In this embodiment, the second resonator (booster) 12 The flange 12a is slidably supported on the support plate. Instead, at the nodal point closest to the joining position of the tool horn 32, the first resonator (tool horn) is constituted by the upper support plate 38 fixed to the support plate 34 and the tip materials 28 and 29 provided on the lower support plate 39. 32 is fixed.

上記のように、第一共振器（工具ホーン）３２の固定位置を、接合対象物を押圧する接合位置に近づけたことにより、第一共振器（工具ホーン）３２の片持ち長さは短くなり、第一共振器（工具ホーン）３２の先端の撓みは小さくなる。
また、第二共振器（ブースタ）１２をスライド自在に支持したことにより、第二共振器（ブースタ）を製作する上で、フランジ１２ａの位置寸法がばらついても、円筒型スライド３５の内周面に対する位置が変動するだけであるため、超音波接合装置の支持板３４、円筒型スライド３５は、同じ部品をそのまま使えるという利点がある。 As described above, the cantilever length of the first resonator (tool horn) 32 is shortened by bringing the fixing position of the first resonator (tool horn) 32 closer to the joining position for pressing the object to be joined. The bending of the tip of the first resonator (tool horn) 32 is reduced.
In addition, since the second resonator (booster) 12 is slidably supported, the inner peripheral surface of the cylindrical slide 35 can be manufactured even when the position of the flange 12a varies in manufacturing the second resonator (booster). Therefore, the support plate 34 and the cylindrical slide 35 of the ultrasonic bonding apparatus have an advantage that the same parts can be used as they are.

図１０は、工具ホーン３２のノーダルポイントの支持手段の一部を断面とした正面図であり、工具ホーン３２の外周面の上をチップ材２８で、外周面の下をチップ材２９で、それぞれ支持している様子を示している。支持板３４には上側支持板３８をボルト３４ａで固定している。図１０で、３８ｂ、３９ａは位置決め孔であり、位置決め板３６に突設した位置決めピンに嵌合して、上側支持板３８と下側支持板３９を位置決め板３６に位置決めしている。 FIG. 10 is a front view in which a part of the support means for the nodal point of the tool horn 32 is taken as a cross section. The tool horn 32 has a tip material 28 on the outer peripheral surface and a tip material 29 below the outer peripheral surface. It shows how they support each other. An upper support plate 38 is fixed to the support plate 34 with bolts 34a. In FIG. 10, 38 b and 39 a are positioning holes, which are fitted to positioning pins protruding from the positioning plate 36, and position the upper support plate 38 and the lower support plate 39 on the positioning plate 36.

上側支持板３８の中央のスライド孔３８ａに押圧スライド１９を入れ、押圧ボルト１５で所定位置までチップ材２８を押し下げる構造は、第一の実施形態と同じである。第二の実施形態として特徴があるのは、上側支持板３８の下に下側支持板３９を設けて、工具ホーン３２の軸心を中心としてチップ材２８の反対側にチップ材２９を配置して、工具ホーン３２の外周面をチップ材２８とチップ材２９で挟持した点である。 The structure in which the pressing slide 19 is inserted into the central slide hole 38a of the upper support plate 38 and the tip material 28 is pushed down to a predetermined position by the pressing bolt 15 is the same as in the first embodiment. A feature of the second embodiment is that a lower support plate 39 is provided below the upper support plate 38, and a tip material 29 is arranged on the opposite side of the tip material 28 with the axis of the tool horn 32 as the center. Thus, the outer peripheral surface of the tool horn 32 is sandwiched between the tip material 28 and the tip material 29.

図１０では、チップ材２８の先端に段差のある凸部２８ａを形成し、工具ホーン３２の外周面には凸部２８ａと嵌合する穴３２ｂを予め形成している。凸部２８ａが穴３２ｂに嵌合することにより、工具ホーン３２の回り止めの役目を果たしている。なお図９と図１０では、工具ホーン３２の外周を穴３２ｂのある円筒面として示しているが、例えば外周面を複数方向から平面カットして、略八角形など多角形類似の断面を持つ工具ホーンとしてもよい。 In FIG. 10, a convex portion 28 a having a step is formed at the tip of the tip material 28, and a hole 32 b that fits the convex portion 28 a is formed in advance on the outer peripheral surface of the tool horn 32. The convex portion 28a fits into the hole 32b, thereby serving as a detent for the tool horn 32. 9 and 10, the outer periphery of the tool horn 32 is shown as a cylindrical surface having a hole 32b. However, for example, a tool having a polygonal cross section such as a substantially octagonal shape by cutting the outer peripheral surface from a plurality of directions. A horn may be used.

また図１６に本発明の第二の実施形態の変形例を示したように、予め工具ホーン８２のノーダルポイントの外周面にフランジ状に盛り上がった部分８２ｂを形成しておき、当該フランジ状部分の外周面を複数方向から平面カットして、その平面８２ｃをチップ材８８、８９で押圧するようにしてもよい。 Further, as shown in FIG. 16 as a modification of the second embodiment of the present invention, a flange-like portion 82b is formed in advance on the outer peripheral surface of the nodal point of the tool horn 82, and the flange-like portion. It is also possible to cut the outer peripheral surface of the flat plate from a plurality of directions and press the flat surface 82 c with the chip members 88 and 89.

図１０では、工具ホーン３２の外周面に当接するチップ材２９の表面はＶ字状にカットしたものを示している。チップ材２９の上面は平面であってもよいが、安定的に挟持するには、図１０のようにＶ字状にカットした表面にしてチップ材２９の２ケ所が当接するようにして、チップ材２８とチップ材２９とで３点支持している。図１０では、制振材２２を押圧スライド１９の上の凹部に入れているが、チップ材２８、２９には直接制振材を重ねて配置していない。必要により、超音波振動の大きさによっては制振材をチップ材２８、２９に重ねて配置してもよい。チップ材と制振材の大きさや厚さについては超音波振動の大きさに基づいた好ましい値に設定すればよい。 In FIG. 10, the surface of the tip material 29 that comes into contact with the outer peripheral surface of the tool horn 32 is cut into a V shape. The upper surface of the chip material 29 may be a flat surface. However, in order to stably hold the chip material 29, the chip material 29 is brought into contact with two points on the V-shaped surface as shown in FIG. The material 28 and the chip material 29 are supported at three points. In FIG. 10, the damping material 22 is placed in the recess on the pressing slide 19, but the damping materials are not directly stacked on the chip materials 28 and 29. If necessary, a damping material may be placed over the chip materials 28 and 29 depending on the magnitude of the ultrasonic vibration. The size and thickness of the chip material and damping material may be set to preferable values based on the magnitude of ultrasonic vibration.

ここで、第二の実施形態の変形例について説明する。図１１では、外周面を八方向から平面カットした工具ホーン４２を支持している状態を示し、図１２に、図１１に示した支持手段の分解図を示した。
当該変形例では、図１１に示すように、工具ホーン４２の外周面の上を支持するチップ材２８に加えて、下側支持板４９に一対のチップ材４０と４１を、間隔を開けて配置し、工具ホーン４２をより安定的に支持している。図１１のように、下方のチップ材４０と４１の間隔を開けて配置すれば、工具ホーン４２の軸心から下側支持板４９の下面までの距離ｈ₂を、図１０の場合の距離ｈ₁より小さくすることが出来る。このことは、超音波接合装置の共振器支持手段の下方の寸法が小さくなり、共振器支持手段の下方部分がワークに当たらないという実用上の利点がある。 Here, a modification of the second embodiment will be described. FIG. 11 shows a state in which the tool horn 42 whose outer peripheral surface is plane-cut from eight directions is supported, and FIG. 12 shows an exploded view of the support means shown in FIG.
In the modification, as shown in FIG. 11, in addition to the tip material 28 that supports the outer peripheral surface of the tool horn 42, a pair of tip materials 40 and 41 are arranged on the lower support plate 49 with a gap therebetween. Thus, the tool horn 42 is supported more stably. As shown in FIG. 11, if the lower tip members 40 and 41 are arranged with a space therebetween, the distance h ₂ from the axis of the tool horn 42 to the lower surface of the lower support plate 49 is the distance h in the case of FIG. Can be smaller than ₁ . This has a practical advantage that the dimension below the resonator support means of the ultrasonic bonding apparatus is reduced, and the lower portion of the resonator support means does not hit the workpiece.

また、更なる変形例を図１３に示しており、図１３のように、下側支持板を正面から視て右下側支持板６９、左下側支持板７０のように２つの部品に分割してもよい。このようにすれば、工具ホーン４２の直下に空間ができてワークに当たらないという実用上の利点が得られる。 Further, a further modification is shown in FIG. 13. As shown in FIG. 13, the lower support plate is divided into two parts such as a lower right support plate 69 and a lower left support plate 70 when viewed from the front. May be. In this way, there is a practical advantage that a space is formed immediately below the tool horn 42 and does not hit the work.

さらに図１３では、チップ材２８、４０、４１のそれぞれに制振材２３、５０、５１を重ねて、チップ材２８、４０、４１のそれぞれから本体側の支持板３４に伝わろうとする振動を制振材２３、５０、５１で吸収するよう構成した例を示した。
本発明の第二の実施の形態の共振器支持手段では、第二共振器（ブースタ）１２のフランジ１２ａをドーナッツ型のスライド板３７に皿ボルト３３で一体に固定し、合成樹脂又は金属円板の外周面を支持板３４に一体に設けた円筒型スライド３５の内周面上で第二共振器（ブースタ）１２の軸方向にスライド自在に支持している。 Further, in FIG. 13, damping materials 23, 50, 51 are stacked on the chip materials 28, 40, 41, respectively, to suppress vibrations that are transmitted from the chip materials 28, 40, 41 to the support plate 34 on the main body side. The example comprised so that it might absorb with the vibration materials 23, 50, and 51 was shown.
In the resonator support means of the second embodiment of the present invention, the flange 12a of the second resonator (booster) 12 is integrally fixed to the donut-shaped slide plate 37 with a flat bolt 33, and a synthetic resin or a metal disk is obtained. The second resonator (booster) 12 is slidably supported in the axial direction of the second resonator (booster) 12 on the inner peripheral surface of a cylindrical slide 35 provided integrally with the support plate 34.

図１４には、本発明の第二の実施形態に係る超音波接合装置の第二共振器（ブースタ）のフランジ近傍の構成を示した。図１５には、本発明の第二の実施形態に係る超音波接合装置の第二共振器（ブースタ）のフランジ近傍の構成を分解して示した。
本発明の第二の実施の形態の第二共振器（ブースタ）支持手段では、第二共振器（ブースタ）１２のフランジ１２ａとドーナッツ型のスライド板３７の間の複数か所に合成樹脂（プラスチック）または制振材の座金（スペーサ、又はワッシャ）９２を入れて、合成樹脂（プラスチック）または制振材の皿ボルト３３と六角ナット３１を締め付けて一体に固定し、スライド板３７の外周面３７ａを支持板３４に一体に設けた円筒型スライド３５の内周面３５ａ上で第二共振器（ブースタ）１２の軸方向にスライド自在に支持している。 In FIG. 14, the structure of the flange vicinity of the 2nd resonator (booster) of the ultrasonic bonding apparatus which concerns on 2nd embodiment of this invention was shown. FIG. 15 is an exploded view of the configuration near the flange of the second resonator (booster) of the ultrasonic bonding apparatus according to the second embodiment of the present invention.
In the second resonator (booster) support means of the second embodiment of the present invention, a synthetic resin (plastic) is provided at a plurality of locations between the flange 12a of the second resonator (booster) 12 and the donut-shaped slide plate 37. ) Or a washer (spacer or washer) 92 for damping material, and a synthetic resin (plastic) or damping material countersunk bolt 33 and hex nut 31 are tightened and fixed together, and the outer peripheral surface 37a of the slide plate 37 is fixed. Is supported so as to be slidable in the axial direction of the second resonator (booster) 12 on an inner peripheral surface 35a of a cylindrical slide 35 provided integrally with the support plate 34.

図１４と図１５では、第二共振器（ブースタ）１２のフランジ１２ａの上下２か所を固定する例を示したが、第二共振器（ブースタ）のフランジの上の３か所、４か所あるいはそれ以上の複数か所を固定するようにしてもよい。皿ボルト３３を用いたのは、位置決めのためであり、座金（スペーサ、又はワッシャ）９２を用いたのは緩み止めと制振のためである。なお、六角ナット３１については、スライド板３７に雌ネジを切って六角ナット３１を省略した構造としても良い。 14 and 15 show an example in which the upper and lower two portions of the flange 12a of the second resonator (booster) 12 are fixed. You may make it fix several places more than that. The countersunk bolt 33 is used for positioning, and the washer (spacer or washer) 92 is used for locking and damping. The hexagon nut 31 may have a structure in which a female screw is cut in the slide plate 37 and the hexagon nut 31 is omitted.

本発明の第二の実施形態に係る超音波接合装置では、第一共振器（工具ホーン）を、ワークの接合位置に最も近いノーダルポイントで、第一共振器（工具ホーン）の軸心に対して接合対象物の反対側と接合対象物側の両方を押圧して固定している。そのため、支持している工具ホーンの片持ち長さが短く、ワークを押圧したときの撓みが少ない。 In the ultrasonic bonding apparatus according to the second embodiment of the present invention, the first resonator (tool horn) is positioned at the nodal point closest to the workpiece bonding position, and the axis of the first resonator (tool horn). On the other hand, both the opposite side of the joining object and the joining object side are pressed and fixed. Therefore, the cantilever length of the supporting tool horn is short, and there is little bending when pressing a workpiece | work.

また、本発明の第二の実施形態に係る超音波接合装置では、第二共振器（ブースタ）支持手段により、前記ノーダルポイントの隣に位置するノーダルポイントで第二共振器（ブースタ）をスライド自在に支持している。
このことにより、第二共振器（ブースタ）支持手段における超音波振動エネルギー損失を抑制している。つまり、スライド板３７と第二共振器（ブースタ）の間に合成樹脂（プラスチック）又は制振金属のワッシャ９２を挟むことにより、合成樹脂（プラスチック）又は制振金属のワッシャ９２が超音波振動を吸収する。さらに、スライド板３７と共振器１２を直接固定するのに比べ、樹脂又は制振金属のワッシャ９２を間に挟むことにより接触面積が減り、超音波振動の伝達を抑制する。皿ボルト３３の材質を制振金属又は合成樹脂（プラスチック）にすることにより、さらに超音波振動の伝達が抑制できる。 Further, in the ultrasonic bonding apparatus according to the second embodiment of the present invention, the second resonator (booster) is supported at the nodal point located next to the nodal point by the second resonator (boost) support means. It is slidably supported.
This suppresses ultrasonic vibration energy loss in the second resonator (booster) support means. That is, by sandwiching a synthetic resin (plastic) or damping metal washer 92 between the slide plate 37 and the second resonator (booster), the synthetic resin (plastic) or damping metal washer 92 generates ultrasonic vibrations. Absorb. Further, as compared with the case where the slide plate 37 and the resonator 12 are directly fixed, the contact area is reduced by sandwiching a resin or damping metal washer 92 therebetween, thereby suppressing transmission of ultrasonic vibration. By making the material of the countersunk bolt 33 a damping metal or a synthetic resin (plastic), transmission of ultrasonic vibration can be further suppressed.

また、第二共振器（ブースタ）を製作する上でノーダルポイントの位置寸法がある程度変動しても、支持位置をスライド可能にしたことにより、同一の部品で支持することができるという実用的な効果がある。
その他、本発明の第二の実施形態に係る超音波接合装置では、第一の実施形態で説明した本発明の諸課題を解決している。 In addition, when manufacturing the second resonator (booster), even if the position of the nodal point fluctuates to some extent, the support position can be slid so that it can be supported by the same component. effective.
In addition, the ultrasonic bonding apparatus according to the second embodiment of the present invention solves the problems of the present invention described in the first embodiment.

（本発明の第三の実施形態）
上記本発明の第一、第二の実施形態では、本発明を片持ち支持の工具ホーンに適用した場合について説明した。
本発明の第三の実施形態では、本発明を両持ち支持の工具ホーンに適用した場合について説明する。図１７に、本発明の第三の実施形態に係る超音波接合装置の共振器とその支持手段の構成と振幅について、位置を対比して示した。図１７で、Ａは超音波振動子、Ｃは工具ホーンである。工具ホーンＣの中央下方には接合対象物の接合位置を押圧する接合用凸部Ｃａがあり、工具ホーンの接合用凸部Ｃａの両側のノーダルポイントのそれぞれの外周をチップ材２８、２９で押圧して支持している。チップ材２８、２９によるそれぞれの共振器支持手段の構造は、既に第二の実施形態で説明した図１０から図１３の構造と同じである。 (Third embodiment of the present invention)
In the first and second embodiments of the present invention, the case where the present invention is applied to a cantilever-supported tool horn has been described.
In the third embodiment of the present invention, a case where the present invention is applied to a tool horn that is supported on both ends will be described. FIG. 17 shows the position and comparison of the configuration and amplitude of the resonator of the ultrasonic bonding apparatus according to the third embodiment of the present invention and its supporting means. In FIG. 17, A is an ultrasonic transducer, and C is a tool horn. Below the center of the tool horn C is a bonding convex portion Ca that presses the bonding position of the object to be bonded, and the outer circumferences of the nodal points on both sides of the bonding ridge Ca of the tool horn are inserted by the tip members 28 and 29. Press to support. The structure of each resonator support means by the chip materials 28 and 29 is the same as the structure of FIGS. 10 to 13 already described in the second embodiment.

すなわち、本発明の第三の実施形態の支持手段の支持板９４の下方には位置決め板３６を固定していて、位置決め板３６の面上に上側支持板３８と下側支持板３９を位置決め固定している。上側支持板３８にはチップ材２８を、下側支持板３９にはチップ材２９をそれぞれ設け、工具ホーンＣのノーダルポイントにおいて、工具ホーンＣの外周面の上をチップ材２８で、外周面の下をチップ材２９で、それぞれ支持している。なお第一の実施の形態で説明したのと同じく、チップ材２８、２９は円柱状をしており、外周にはＯリング２７を被せている。また、チップ材２８は、押圧スライド１９の下方の凹部に嵌めてあり、押圧ボルト１５で押圧スライド１９ごと押し下げ、六角ナット１６で位置決め固定する。チップ材２９は下側支持板３９の凹部に嵌めている。 That is, the positioning plate 36 is fixed below the support plate 94 of the support means of the third embodiment of the present invention, and the upper support plate 38 and the lower support plate 39 are positioned and fixed on the surface of the positioning plate 36. doing. The upper support plate 38 is provided with a tip material 28, and the lower support plate 39 is provided with a tip material 29. At the nodal point of the tool horn C, the tip material 28 lies on the outer peripheral surface of the tool horn C, and the outer peripheral surface. Are supported by chip materials 29 respectively. As described in the first embodiment, the tip materials 28 and 29 have a columnar shape, and the outer periphery is covered with an O-ring 27. Further, the chip material 28 is fitted in a concave portion below the pressing slide 19, and is pressed down together with the pressing slide 19 with the pressing bolt 15, and positioned and fixed with the hexagon nut 16. The chip material 29 is fitted in the concave portion of the lower support plate 39.

本発明の第三の実施形態にかかる超音波接合装置による超音波接合作業は、上記した工具ホーンＣ全体を下降させ、工具ホーン中央の下面（接合用凸部）Ｃａで、図示していないワーク（接合対象物）の接合位置を押圧し、超音波振動を伝えてワークを超音波接合する。 In the ultrasonic bonding operation by the ultrasonic bonding apparatus according to the third embodiment of the present invention, the entire tool horn C is lowered, and the lower surface (bonding convex portion) Ca at the center of the tool horn is not shown. The workpiece is ultrasonically joined by pressing the joining position of the (joining object) and transmitting ultrasonic vibration.

工具ホーンＣのノーダルポイントでは、超音波振動エネルギーが伝わっても軸方向に変位しないが、半径方向に小さく膨張・収縮する。本実施形態では、工具ホーンＣの外周面に接している押圧手段にチップ材２８を用い、制振材２２を重ねて用いている。このことにより、工具ホーンＣの接合位置の両側のノーダルポイントのぞれぞれで、超音波振動エネルギーが伝わっても本体側に伝わらないように両もち支持している。両もち支持のため、接合用凸部Ｃａは、撓みにくい。そして、被接合物を超音波接合するのに必要な加圧力を工具ホーン先端に与えることができる。 At the nodal point of the tool horn C, even if ultrasonic vibration energy is transmitted, it is not displaced in the axial direction, but expands and contracts in the radial direction. In the present embodiment, the tip material 28 is used as the pressing means in contact with the outer peripheral surface of the tool horn C, and the vibration damping material 22 is used in an overlapping manner. As a result, both nodal points on both sides of the joining position of the tool horn C are supported so that even if ultrasonic vibration energy is transmitted, it is not transmitted to the main body side. Since both ends are supported, the bonding convex portion Ca is not easily bent. And the pressurization force required in order to ultrasonically join a to-be-joined object can be given to a tool horn tip.

本発明の第三の実施形態に係る超音波接合装置では、共振器の外周面に溝を掘らず、応力の高い部分の断面を減らさずに、振動ロスや異常振動を減少させることができる。また、被保持部の外周面の全周又は大部分を制振材で把持していない。本実施形態によれば、チップ材２８、２９に接していない工具ホーンＣの外周面では、半径方向の膨張収縮を可能にして、超音波振動を効率よく接合対象物へ印加することができる。本発明の第三の実施形態によるその他の効果は、第一、第二の実施形態と同じである。 In the ultrasonic bonding apparatus according to the third embodiment of the present invention, it is possible to reduce vibration loss and abnormal vibration without digging a groove in the outer peripheral surface of the resonator and without reducing the cross section of the portion with high stress. Further, the entire periphery or most of the outer peripheral surface of the held portion is not gripped by the damping material. According to the present embodiment, the outer peripheral surface of the tool horn C that is not in contact with the tip materials 28 and 29 can be expanded and contracted in the radial direction, and ultrasonic vibration can be efficiently applied to the objects to be joined. Other effects of the third embodiment of the present invention are the same as those of the first and second embodiments.

本発明は、金属を超音波振動で接合する超音波接合装置の他にプラスチックを溶着する超音波溶着装置にも適用することができる。 The present invention can also be applied to an ultrasonic welding apparatus for welding plastic in addition to an ultrasonic bonding apparatus for bonding metals by ultrasonic vibration.

１ａ超音波振動子
１ｂ第二共振器（ブースタ）
１ｃフランジ
２、３２、８２、Ｃ第一共振器（工具ホーン）
３支持手段
３ａ、３ｂ、３ｄ、３ｅスリット付きアーム
４アーム
５押圧棒
６六角ナット
７スライドナット
８、２８、２９チップ材
９、２７Ｏリング
１０アンビル
１１ａ、１１ｂワーク
２０、２１、２２制振材
３１六角ナット
３３皿ボルト
３４支持板
３５円筒型スライド
３６位置決め板
３７スライド板
３８上側支持板
３９下側支持板
９２座金（スペーサ、ワッシャ） 1a Ultrasonic vibrator 1b Second resonator (booster)
1c Flange 2, 32, 82, C First resonator (tool horn)
3 Support means 3a, 3b, 3d, 3e Slit arm 4 Arm 5 Press rod 6 Hex nut 7 Slide nut 8, 28, 29 Chip material 9, 27 O-ring 10 Anvil 11a, 11b Work 20, 21, 22 Damping material 31 Hexagon nut 33 Flat head bolt 34 Support plate 35 Cylindrical slide 36 Positioning plate 37 Slide plate 38 Upper support plate 39 Lower support plate 92 Washer (spacer, washer)

Claims

Resonator support means having a tip material at the tip,
Cover the outer periphery of the chip material with a buffer member,
An ultrasonic bonding apparatus characterized in that the tip of the resonator support means presses and supports the opposite side of the object to be bonded to the axial center of the outer peripheral surface of the nodal point of the resonator.

Having two or more resonator support means having a tip material at the tip,
Cover the outer periphery of the chip material with a buffer member,
With the tip material of a part of the resonator support means, pressing and supporting the opposite side of the object to be bonded to the axial center of the outer peripheral surface of the nodal point of the resonator,
An ultrasonic bonding apparatus characterized in that a bonding object side is pressed and supported with respect to an axis of an outer peripheral surface of a nodal point of the resonator by another chip material of the resonator supporting means.

In an ultrasonic bonding apparatus including a first resonator (tool horn) that presses and bonds an object to be bonded and a second resonator (booster) connected to the first resonator (tool horn),
A first resonator (tool horn) support means having a tip material at the tip;
A second resonator (booster) support means,
Cover the outer periphery of the chip material with a buffer member,
The tip material of the first resonator (tool horn) support means on the outer peripheral surface of the nodal point closest to the joining position of the first resonator (tool horn) on the opposite side of the object to be joined with respect to the axis Press and support
The ultrasonic bonding apparatus, wherein the second resonator (booster) is supported by a nodal point located next to the nodal point by the second resonator (booster) support means.

A tip material of the first resonator (tool horn) support means is slidably and fixedly supported in a direction perpendicular to the axis of the first resonator (tool horn), and the first resonator ( The ultrasonic bonding apparatus according to claim 3, wherein the pressing force pressing the outer peripheral surface of the tool horn is adjustable.

Two or more first resonator (tool horn) support means having a tip material at the tip,
The tip of the first resonator (tool horn) support means, and the object to be joined with respect to the axial center of the outer peripheral surface of the nodal point closest to the joining position of the first resonator (tool horn) Press and support the other side of
With the other tip material of the first resonator (tool horn) support means, the outer peripheral surface on the welding object side is pressed against the axial center of the outer surface of the nodal point of the first resonator (tool horn). The ultrasonic bonding apparatus according to claim 3 or 4, wherein the ultrasonic bonding apparatus is supported.

Resonator support means having a tip material at the tip,
A damping material is stacked on the chip material,
An ultrasonic bonding apparatus characterized in that the tip of the resonator support means presses and supports the opposite side of the object to be bonded to the axial center of the outer peripheral surface of the nodal point of the resonator.

Having two or more resonator support means having a tip material at the tip,
A damping material is stacked on the chip material,
With the tip material of a part of the resonator support means, pressing and supporting the opposite side of the object to be bonded to the axial center of the outer peripheral surface of the nodal point of the resonator,
An ultrasonic bonding apparatus characterized in that a bonding object side is pressed and supported with respect to an axis of an outer peripheral surface of a nodal point of the resonator by another chip material of the resonator supporting means.

In an ultrasonic bonding apparatus including a first resonator (tool horn) that presses and bonds an object to be bonded and a second resonator (booster) connected to the first resonator (tool horn),
A first resonator (tool horn) support means having a tip material at the tip;
A second resonator (booster) support means,
A damping material is stacked on the chip material,
The tip material of the first resonator (tool horn) support means on the outer peripheral surface of the nodal point closest to the joining position of the first resonator (tool horn) on the opposite side of the object to be joined with respect to the axis Press and support
The ultrasonic bonding apparatus, wherein the second resonator (booster) is supported by a nodal point located next to the nodal point by the second resonator (booster) support means.

A tip material of the first resonator (tool horn) support means is slidably and fixedly supported in a direction perpendicular to the axis of the first resonator (tool horn), and the first resonator ( The ultrasonic bonding apparatus according to claim 8 , wherein the pressing force pressing the outer peripheral surface of the tool horn is adjustable.

Two or more first resonator (tool horn) support means having a tip material at the tip,
The tip of the first resonator (tool horn) support means, and the object to be joined with respect to the axial center of the outer peripheral surface of the nodal point closest to the joining position of the first resonator (tool horn) Press and support the other side of
With the other tip material of the first resonator (tool horn) support means, the outer peripheral surface on the welding object side is pressed against the axial center of the outer surface of the nodal point of the first resonator (tool horn). The ultrasonic bonding apparatus according to claim 8 or 9 , wherein the ultrasonic bonding apparatus is supported.

11. The ultrasonic bonding apparatus according to claim 6 , wherein the vibration damping material has a logarithmic attenuation rate larger than 0.01 and smaller than 1. 11 .

The ultrasonic bonding apparatus according to claim 6, wherein a buffer member is placed on an outer periphery of the chip material.

In an ultrasonic bonding apparatus including a first resonator (tool horn) that presses and bonds an object to be bonded and a second resonator (booster) connected to the first resonator (tool horn),
A first resonator (tool horn) support means having a tip material at the tip;
A second resonator (booster) support means,
The second resonator (booster) support means is fixed to the flange mounting plate at a plurality of flanges projecting radially at the nodal point of the second resonator (booster),
The tip material of the first resonator (tool horn) support means on the outer peripheral surface of the nodal point closest to the joining position of the first resonator (tool horn) on the opposite side of the object to be joined with respect to the axis Press and support
The ultrasonic bonding apparatus, wherein the second resonator (booster) is supported by a nodal point located next to the nodal point by the second resonator (booster) support means.

A tip material of the first resonator (tool horn) support means is slidably and fixedly supported in a direction perpendicular to the axis of the first resonator (tool horn), and the first resonator ( The ultrasonic bonding apparatus according to claim 13 , wherein the pressing force pressing the outer peripheral surface of the tool horn is adjustable.

Two or more first resonator (tool horn) support means having a tip material at the tip,
The tip of the first resonator (tool horn) support means, and the object to be joined with respect to the axial center of the outer peripheral surface of the nodal point closest to the joining position of the first resonator (tool horn) Press and support the other side of
With the other tip material of the first resonator (tool horn) support means, the outer peripheral surface on the welding object side is pressed against the axial center of the outer surface of the nodal point of the first resonator (tool horn). The ultrasonic bonding apparatus according to claim 13 or 14 , wherein the ultrasonic bonding apparatus is supported.

The ultrasonic bonding apparatus according to any one of claims 13 to 15, wherein a material of the flange mounting plate is a synthetic resin (plastic) or a vibration damping material.

The second resonator (booster) support means includes a synthetic resin (plastic) between the flange mounting plate and a plurality of flanges projecting radially at the nodal point of the second resonator (booster). The ultrasonic bonding apparatus according to any one of claims 13 to 15, wherein a washer (spacer) of a damping member is inserted and fixed.

The second resonator (booster) support means is provided with synthetic resin (plastic) or plastic on the flange mounting plate at a plurality of flanges projecting radially at the nodal point of the second resonator (booster). The ultrasonic bonding apparatus according to any one of claims 13 to 15, wherein the ultrasonic bonding apparatus is fixed by a fastening member of a damping material.

Said second resonator (booster) support means, said flange mounting plate to one of said second resonator claim 15 claim 13, characterized in that the slidably supported in the vibration direction of the (booster) The ultrasonic bonding apparatus described.