JP6344792B2 - 光導波路用感光性樹脂組成物および光導波路コア層形成用光硬化性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板 - Google Patents
光導波路用感光性樹脂組成物および光導波路コア層形成用光硬化性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板Info
- Publication number
- JP6344792B2 JP6344792B2 JP2014023193A JP2014023193A JP6344792B2 JP 6344792 B2 JP6344792 B2 JP 6344792B2 JP 2014023193 A JP2014023193 A JP 2014023193A JP 2014023193 A JP2014023193 A JP 2014023193A JP 6344792 B2 JP6344792 B2 JP 6344792B2
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- Prior art keywords
- optical waveguide
- core layer
- optical
- resin composition
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
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- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 16
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- 230000000052 comparative effect Effects 0.000 description 6
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- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 4
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- 239000000654 additive Substances 0.000 description 3
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- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
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- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 2
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- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- OMFSJRHPFYVJSP-UHFFFAOYSA-N 2,3,4,5-tetramethylfuran Chemical compound CC=1OC(C)=C(C)C=1C OMFSJRHPFYVJSP-UHFFFAOYSA-N 0.000 description 2
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 2
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 2
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- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
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- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
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- 239000012528 membrane Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
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- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
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- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 2
- 239000012953 triphenylsulfonium Substances 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical class NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 1
- NPRYHWFMGPYJIY-UHFFFAOYSA-N 2-cyclohexyloxirane Chemical compound C1OC1C1CCCCC1 NPRYHWFMGPYJIY-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
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- ZGFPUTOTEJOSAY-UHFFFAOYSA-N FC1=C([Ti])C(F)=CC=C1N1C=CC=C1 Chemical compound FC1=C([Ti])C(F)=CC=C1N1C=CC=C1 ZGFPUTOTEJOSAY-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
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- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
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- 150000008062 acetophenones Chemical class 0.000 description 1
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- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
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- CZRKJHRIILZWRC-UHFFFAOYSA-N methyl acetate;propane-1,2-diol Chemical compound COC(C)=O.CC(O)CO CZRKJHRIILZWRC-UHFFFAOYSA-N 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
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- 239000001294 propane Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
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Description
本発明の光導波路用感光性樹脂組成物(以下、「感光性樹脂組成物」という場合がある。)は、FT−IR(フーリエ変換型赤外分光光度計)でのATR(Attenuated Total Reflection:全反射測定)法による2960cm-1の吸光度が0.03未満となる、重合性置換基含有樹脂を主成分とする特殊な樹脂成分、および、光重合開始剤を用いて得られるものである。上記ATR法とは、測定対象となる試料表面にて全反射する光を測定することによって、試料表面の吸収スペクトルを得る方法であって、本発明においては、樹脂成分として、重合性置換基含有樹脂を主成分として構成され、かつFT−IRでのATR法による2960cm-1の吸光度が0.03未満となる樹脂成分を用いることを特徴とする。また、本発明において、「液状」あるいは「固形」とは、それぞれ25℃の温度下において「液状」状態または「固形」状態を呈することを意味する。
以下、各種成分について順に説明する。
上記FT−IRでのATR法による2960cm-1の吸光度が0.03未満となるよう設定可能にするため、2,2−ビス(ヒドロキシメチル)−1−ブタノールの1,2−エポキシ−4−(2−オキシラニル)シクロヘキサン付加物とともに、水添ビスフェノールA型固形エポキシ樹脂、水添ビスフェノールA型液状エポキシ樹脂、ポリテトラメチレングリコールジグリシジルエーテル、トリメチロールプロパンポリグリシジルエーテル、3−エチル−3{[(3−エチルオキセタン−3−イル)メトキシ]メチル}オキセタンの少なくともいずれか一つを併用してなる態様とする。上記併用する態様において、2,2−ビス(ヒドロキシメチル)−1−ブタノールの1,2−エポキシ−4−(2−オキシラニル)シクロヘキサン付加物の占める割合を樹脂成分全体の50重量%以上に設定する。好ましくは、樹脂成分全体の70重量%以上が2,2−ビス(ヒドロキシメチル)−1−ブタノールの1,2−エポキシ−4−(2−オキシラニル)シクロヘキサン付加物である。
上記光重合開始剤は、感光性樹脂組成物に対して光照射による硬化性を付与するため、例えば、紫外線硬化性を付与するために用いられるものである。
つぎに、本発明の感光性樹脂組成物をコア層の形成材料として用いてなる光導波路について説明する。
下記のようにしてコア層形成材料となる感光性ワニスを調製した。
遮光条件下にて、固形多官能脂肪族エポキシ樹脂(EHPE3150、ダイセル社製)100部、光酸発生剤(WPI−116、和光純薬工業社製)1部、ヒンダードフェノール系酸化防止剤(Songnox1010、共同薬品社製)0.5部、リン系酸化防止剤(HCA、三光社製)0.5部を、乳酸エチル30部に混合し、85℃加熱下にて撹拌完溶させ、その後室温(25℃)まで冷却した後、直径1.0μmのメンブランフィルタを用い加熱加圧濾過を行なうことにより、コア層形成材料となる感光性ワニスを調製した。
コア層形成材料である感光性ワニスの調製において、樹脂成分(脂肪族系樹脂)の成分配合を、固形多官能脂肪族エポキシ樹脂(EHPE3150、ダイセル社製)50部、固形水添ビスフェノールA型エポキシ樹脂(YX―8040、三菱化学社製)50部とした。それ以外は参考例1と同様にしてコア層形成材料となる感光性ワニスを調製した。
コア層形成材料である感光性ワニスの調製において、樹脂成分(脂肪族系樹脂)の成分配合を、固形多官能脂肪族エポキシ樹脂(EHPE3150、ダイセル社製)50部、液状水添ビスフェノールA型エポキシ樹脂(EP−4080E、ADEKA社製)50部とした。それ以外は参考例1と同様にしてコア層形成材料となる感光性ワニスを調製した。
コア層形成材料である感光性ワニスの調製において、樹脂成分(脂肪族系樹脂)の成分配合を、固形多官能脂肪族エポキシ樹脂(EHPE3150、ダイセル社製)50部、液状長鎖二官能脂肪族エポキシ樹脂(エポゴーセーPT、四日市合成社製)50部とした。それ以外は参考例1と同様にしてコア層形成材料となる感光性ワニスを調製した。
コア層形成材料である感光性ワニスの調製において、樹脂成分(脂肪族系樹脂)の成分配合を、固形多官能脂肪族エポキシ樹脂(EHPE3150、ダイセル社製)50部、液状三官能脂肪族エポキシ樹脂(デナコールEX−321、ナガセケムテックス社製)50部とした。それ以外は参考例1と同様にしてコア層形成材料となる感光性ワニスを調製した。
コア層形成材料である感光性ワニスの調製において、樹脂成分(脂肪族系樹脂)の成分配合を、固形多官能脂肪族エポキシ樹脂(EHPE3150、ダイセル社製)50部、液状二官能脂肪族オキセタン樹脂(アロンオキセタンOXT−221、東亞合成社製)50部とした。それ以外は参考例1と同様にしてコア層形成材料となる感光性ワニスを調製した。
コア層形成材料である感光性ワニスの調製において、樹脂成分(脂肪族系樹脂)の成分配合を、固形多官能脂肪族エポキシ樹脂(EHPE3150、ダイセル社製)70部、液状二官能脂環式エポキシ樹脂(セロキサイド2021P、ダイセル社製)30部とした。それ以外は参考例1と同様にしてコア層形成材料となる感光性ワニスを調製した。
コア層形成材料である感光性ワニスの調製において、樹脂成分(脂肪族系樹脂)の成分配合を、固形多官能脂肪族エポキシ樹脂(EHPE3150、ダイセル社製)50部、液状二官能脂環式エポキシ樹脂(セロキサイド2021P、ダイセル社製)50部とした。それ以外は参考例1と同様にしてコア層形成材料となる感光性ワニスを調製した。
コア層形成材料である感光性ワニスの調製において、樹脂成分(脂肪族系樹脂)の成分配合を、液状二官能脂環式エポキシ樹脂(セロキサイド2021P、ダイセル社製)100部とし、有機溶剤である乳酸エチルを使用しなかった。それ以外は参考例1と同様にしてコア層形成材料となる感光性ワニスを調製した。
コア層形成材料である感光性ワニスの調製において、樹脂成分(脂肪族系樹脂)の成分配合を、液状二官能脂環式エポキシ樹脂(セロキサイド8000、ダイセル社製)100部とし、有機溶剤である乳酸エチルを使用しなかった。それ以外は参考例1と同様にしてコア層形成材料となる感光性ワニスを調製した。
上記実施例および比較例の成分配合において、光酸発生剤および酸化防止剤が未添加状態のワニスを調製し用いて、酸化膜付きのシリコン基板(厚み500μm)上に、スピンコート法により上記ワニスを厚み5〜10μm程度となるように塗工した。ついで、ホットプレート上にてプリベーク(130℃×5分間)の加熱を行ない、有機溶媒使用の場合これを乾燥除去することにより、未硬化薄膜(フィルム状)を形成した。上記フィルム状の未硬化薄膜の2960cm-1の吸光度を、FT−IR(サーモエレクトロンコーポレーション社製、NICOLET IR−200)を用いATR法により測定,評価した。上記吸光度については、3100cm-1と2600cm-1のスペクトル位置でベースラインを引き、そこから2960cm-1の吸光度を算出した。
酸化膜付きのシリコン基板(厚み500μm)上に、スピンコート法により上記実施例および比較例にて得られた感光性ワニスを厚み5〜10μm程度となるように塗工した。ついで、ホットプレート上にてプリベーク(130℃×5分間)した後、混線(ブロード光)にて5000mJ(波長365nm積算)の露光を行ない、後加熱(段階加熱80℃、120℃、140℃×各5分間)を行なうことにより薄膜を形成した。つぎに、上記薄膜中に波長850nmの光をプリズムカップリングにより入射させ、上記薄膜中を伝搬させた。そして、伝搬長を変えて、その長さにおける光強度を光計測システム(オプティカルマルチパワーメーターQ8221、アドバンテスト社製)にて測定し、伝搬長に対する光損失をプロットし、直線近似を行ない、その直線の傾きから各感光性ワニスにおける材料損失(dB)を算出し、下記の基準に基づき評価した(プリズムカップラー法)。
○:材料損失が0.02dB/cm未満であった。
×:材料損失が0.02dB/cm以上であった。
つぎに、上記実施例のコア層形成材料となる感光性ワニスを用いて光導波路を作製した。まず、光導波路の作製に先立って、クラッド層形成材料である感光性ワニスを調製した。
<クラッド層形成材料の調製>
遮光条件下にて、液状二官能フッ化アルキルエポキシ樹脂(H022、東ソーエフテック社製)50部、液状二官能脂環式エポキシ樹脂(セロキサイド2021P、ダイセル社製)50部、光酸発生剤(アデカオプトマーSP−170、ADEKA社製)4.0部、リン系酸化防止剤(HCA、三光社製)0.54部、シランカップリング剤(KBM−403、信越シリコーン社製)1部を混合し80℃加熱下にて撹拌完溶させ、その後室温(25℃)まで冷却した後、直径1.0μmのメンブランフィルタを用いて加熱加圧濾過を行なうことにより、クラッド層形成材料となる感光性ワニスを調製した。
スピンコーターを用いて、上記クラッド層形成材料である感光性ワニスを厚み約500μmのシリコンウェハ上に塗工した後、混線(ブロード光)にて5000mJ(波長365nm積算)の露光を行なった。その後、130℃×10分間の後加熱を行なうことによりアンダークラッド層(厚み20μm)を作製した。
形成されたアンダークラッド層上に、スピンコーターを用いて、コア層形成材料である感光性ワニス(実施例品)を塗工した後、ホットプレート上にて有機溶剤(乳酸エチル)を乾燥させる(130℃×5分間)ことにより、未硬化フィルム状態の未硬化層を形成した。形成された未硬化層に対して、混線(ブロード光)にて9000mJ(波長365nm積算)のマスクパターン露光〔パターン幅/パターン間隔(L/S)=50μm/200μm〕を行ない、後加熱(140℃×5分間)を行なった。その後、N,N−ジメチルアセトアミド(DMAc)中にて現像(25℃×3分間)を行ない、水洗し、ホットプレート上にて水分を乾燥(120℃×5分間)させることにより、所定パターンのコア層(厚み55μm)を作製した。
Claims (6)
- 樹脂成分および光重合開始剤を含有する光導波路用感光性樹脂組成物であって、上記樹脂成分のワニスを厚み5〜10μmとなるよう塗工し加熱して得られた未硬化薄膜に対するフーリエ変換型赤外分光光度計(FT−IR)での全反射測定(ATR)法による2960cm-1の吸光度が0.03未満であり、かつ上記樹脂成分が、上記樹脂成分全体の50重量%以上である2,2−ビス(ヒドロキシメチル)−1−ブタノールの1,2−エポキシ−4−(2−オキシラニル)シクロヘキサン付加物とともに、水添ビスフェノールA型固形エポキシ樹脂、水添ビスフェノールA型液状エポキシ樹脂、ポリテトラメチレングリコールジグリシジルエーテル、トリメチロールプロパンポリグリシジルエーテルおよび3−エチル−3{[(3−エチルオキセタン−3−イル)メトキシ]メチル}オキセタンからなる群から選ばれた少なくとも一つが併用されたものであることを特徴とする光導波路用感光性樹脂組成物。
- 光重合開始剤が、光酸発生剤である請求項1記載の光導波路用感光性樹脂組成物。
- 基材とその基材上にクラッド層が形成され、さらに上記クラッド層中に所定パターンで、光信号を伝搬するコア層が形成されてなる光導波路におけるコア層形成材料である請求項1または2記載の光導波路用感光性樹脂組成物。
- 請求項1〜3のいずれか一項に記載の光導波路用感光性樹脂組成物をフィルム状に形成してなる光導波路コア層形成用光硬化性フィルム。
- 基材とその基材上にクラッド層が形成され、さらに上記クラッド層中に所定パターンで、光信号を伝搬するコア層が形成されてなる光導波路であって、上記コア層が、請求項1〜3のいずれか一項に記載の光導波路用感光性樹脂組成物、または請求項4記載の光導波路コア層形成用光硬化性フィルムを硬化させることにより形成されてなることを特徴とする光導波路。
- 請求項5記載の光導波路を備えることを特徴とする光・電気伝送用混載フレキシブルプリント配線板。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014023193A JP6344792B2 (ja) | 2014-02-10 | 2014-02-10 | 光導波路用感光性樹脂組成物および光導波路コア層形成用光硬化性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板 |
CN201580003226.XA CN105829931B (zh) | 2014-02-10 | 2015-01-27 | 光波导用感光性树脂组合物、光波导芯层形成用光固化性薄膜、光波导及挠性印刷电路板 |
US15/108,804 US9963541B2 (en) | 2014-02-10 | 2015-01-27 | Photosensitive resin composition for optical waveguide, photocurable film for formation of optical waveguide core layer, optical waveguide produced by using the resin composition or the photocurable film, and hybrid flexible printed wiring board for optical/electrical transmission |
KR1020167016459A KR102267991B1 (ko) | 2014-02-10 | 2015-01-27 | 광도파로용 감광성 수지 조성물 및 광도파로 코어층 형성용 광경화성 필름과 상기 수지 조성물 또는 상기 광경화성 필름을 이용하여 제작한 광도파로, 광·전기 전송용 혼재 플렉시블 프린트 배선판 |
TW104102719A TWI661268B (zh) | 2014-02-10 | 2015-01-27 | 光波導用感光性樹脂組成物及光波導芯層形成用光硬化性薄膜、以及使用其之光波導、光電傳送用混合撓性印刷電路板 |
PCT/JP2015/052106 WO2015118989A1 (ja) | 2014-02-10 | 2015-01-27 | 光導波路用感光性樹脂組成物および光導波路コア層形成用光硬化性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板 |
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KR20160119057A (ko) | 2016-10-12 |
KR102267991B1 (ko) | 2021-06-21 |
US9963541B2 (en) | 2018-05-08 |
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