JP6224348B2 - Judgment device, surface mounter - Google Patents

Description

  The present invention relates to a determination device that determines the quality of flatness of an adhesion member that is adhered to a substrate, a surface mounter including the determination device, and a determination method.

  2. Description of the Related Art Conventionally, surface mounters that mount electronic components or the like on a printed circuit board by solder bonding or the like are known. In such an electronic component mounted on a printed circuit board, in order to prevent or suppress problems due to bonding failure, etc., the flatness is good at the bonding portion with the board, in other words, variations in the height direction. Is required to be low.

  Patent Document 1 discloses a component recognition device that determines the flatness of a bonding part with a substrate for an electronic component or the like mounted on a printed circuit board by solder bonding. In this component recognition apparatus, an accurate height at an arbitrary portion of the joint portion is calculated by capturing an image of a joint portion with a substrate such as an electronic component mounted on a printed circuit board by using a plurality of imaging devices. .

JP 2010-261965 A

  By the way, various adhesion members other than electronic components on the printed circuit board, for example, adhesion members such as shield components that cover the electronic components mounted on the printed circuit board and protect the electronic components are solder-bonded. To be attached. With such an adhesion member, it may be difficult to capture an image of the adhesion portion, which is a joint portion with the substrate, depending on the size, shape, and the like. In this case, in the component recognition apparatus of Patent Document 1, it is difficult to accurately capture the image of the attached portion with the imaging device, and it is difficult to measure the flatness at the attached portion.

  The technology disclosed in this specification has been created in view of the above problems. In this specification, it aims at providing the technique which can determine the quality of the flatness in the adhesion part of the adhesion member adhering to a board | substrate accurately.

  The technology disclosed in the present specification is the attachment member having an attachment portion attached to a substrate, and a flat portion provided along the plate surface of the substrate and provided with the attachment portion on an edge side. A determination device that determines whether the flatness of an attached portion is good or bad, and includes a measurement device and a control device, and the control device sets measurement marks at at least four positions spaced apart from each other on the flat surface portion. A reference plane that sets one plane passing through each of the measurement marks or each of the measurement marks as a virtual reference plane by measuring each position of the measurement mark by the mark setting process and the measurement device A setting process, and one direction along the virtual reference plane is defined as an X direction, a direction perpendicular to the X direction and along the virtual reference plane is defined as a Y direction, and each of the X direction and the Y direction A Z-direction coordinate calculation process for calculating a coordinate in the Z direction for each of the measurement marks in an XYZ coordinate system including the X direction, the Y direction, and the Z direction, wherein the orthogonal direction is a Z direction; The present invention relates to a determination device that executes a pass / fail determination process for determining pass / fail of flatness at the attached portion of the attached member based on the coordinate in the Z direction calculated by a direction coordinate calculating process.

  In the above determination device, the control device does not directly calculate the flatness at the attachment portion of the attachment member, but sets a plurality of measurement marks on the plane portion connected to the attachment portion, and sets the virtual mark set based on each measurement mark. The flatness of the plane portion is calculated from the reference plane. And a control apparatus determines the quality of the flatness of the adhesion part connected with the said plane part based on the calculated flatness of the plane part. For this reason, even if it is a case where the adhesion part of the adhesion member adhering to a board | substrate is a shape or a magnitude | size which it is difficult to measure the flatness, the quality of the flatness in the said adhesion part can be determined accurately.

  In the mark setting process, the control device uses, as the measurement mark, a through-hole formed in the flat portion of the adhesion member for the adhesion member including a shield member that covers the electronic component mounted on the substrate. It may be set.

  According to this configuration, the through hole as the measurement mark drilled in the flat portion of the attaching member can be used as the heat radiating through hole. For this reason, it is not necessary to make a through-hole for heat dissipation separately, and the processing cost of the adhering member can be reduced.

  In the reference plane setting process, the control device may calculate the virtual reference plane by using a least square method for each coordinate of the measurement mark.

  According to this configuration, by using the least square method, the virtual reference plane can be accurately calculated without being affected by the posture (tilt) of the adhering member, and the quality of the flatness at the adhering portion of the adhering member is more appropriate. Can be determined.

  In the pass / fail determination process, the controller determines that the difference between the coordinate having the maximum value and the coordinate having the minimum value among the coordinates in the Z direction of the measurement mark calculated in the Z direction coordinate calculation process is the first. You may determine the quality of the flatness in the said adhesion part of the said adhesion member by whether it exceeds a setting value.

  According to this configuration, it is possible to more appropriately determine the quality of the flatness at the adhesion portion of the adhesion member by setting a specific reference for determining the quality of the flatness.

  In the pass / fail determination process, the control device determines whether or not the adhering member depends on whether at least one of distances along the Z direction from each of the measurement marks to the virtual reference plane exceeds a second set value. You may determine the quality of the flatness in the said adhesion part.

  According to this configuration, it is possible to more appropriately determine the quality of the flatness at the adhesion portion of the adhesion member by setting a specific reference for determining the quality of the flatness.

  About the said adhesion member which has the raised surface part which makes a level | step difference in a part of said plane part, the memory | storage part which memorize | stores the amount of protrusion of this raised surface part is provided, The said control apparatus is about the said adhesion member which has the said raised surface part When the measurement mark is set in the raised surface portion, the reference plane setting process reads out the raised amount from the storage unit and subtracts the raised amount for the measurement mark set in the raised surface portion. The virtual reference plane is set as being set to a position, and in the Z-direction coordinate calculation process, the Z-direction coordinate of the measurement mark set in the raised surface portion is subtracted from the raised amount of the raised surface portion. Coordinates may be calculated.

  According to this configuration, even if the flat portion of the attachment member has a raised surface portion, the virtual reference plane is set based on the position where the amount of the protrusion is subtracted, and the Z-direction coordinates are calculated. The quality of the flatness at the adhered portion can be determined more appropriately.

  For the standard member in which the measurement mark is set at an accurate position corresponding to the normal position of the measurement mark set on the attachment member, the coordinates in the Z direction in each of the measurement marks of the standard member are stored. A storage unit, wherein the control device, in the pass / fail determination process, reads the Z-direction coordinates of each of the measurement marks of the standard member from the storage unit, and reads the read Z-direction coordinates and the standard Based on a difference between each of the measurement marks of the member and the coordinate in the Z direction of the measurement mark in the flat portion of the attachment member corresponding to each of the measurement marks, the quality of the flatness in the attachment portion of the attachment member is determined. Also good.

  According to this configuration, for example, even if the amount of protrusion of the raised surface portion of the attachment member having the raised surface portion is unknown, the attachment member having the raised surface portion can be obtained by using the Z-direction coordinates in the measurement mark of the standard member. Thus, it is possible to more appropriately determine the quality of the flatness at the adhered portion.

  In the mark setting process, the control device measures the pattern provided on the planar portion of the semiconductor wafer or the printed mark printed on the planar portion of the attachment member made of the semiconductor wafer fixed to the substrate. It may be set as a mark.

  According to this configuration, it is possible to appropriately determine whether the flatness of the attached portion of the attached member made of the semiconductor wafer is good.

  Another technique disclosed in this specification relates to a surface mounter including the determination device.

  Another technique disclosed in this specification includes an attachment member attached to a substrate, and a planar member provided along the plate surface of the substrate and provided with the attachment portion on an edge side. A determination method for determining whether or not the flatness of the attached portion is good, wherein a mark setting step for setting measurement marks at at least four positions spaced apart from each other on the plane portion, and each of the measurement marks or the A reference plane setting step for setting one plane passing through the vicinity of each of the measurement marks as a virtual reference plane, and one direction along the virtual reference plane is defined as an X direction, orthogonal to the X direction and the virtual reference plane In the XYZ coordinate system in which the direction along the plane is the Y direction and the direction orthogonal to each of the X direction and the Y direction is the Z direction, the coordinates in the Z direction are calculated for each of the measurement marks. A determination method comprising: a Z-direction coordinate calculation step; and a pass / fail determination step for determining pass / fail flatness at the attachment portion of the attachment member based on the Z-direction coordinate calculated in the Z-direction coordinate calculation process. .

  According to the technique disclosed in this specification, it is possible to accurately determine whether the flatness of the adhesion portion of the adhesion member adhered to the substrate is good or bad.

Plan view of surface mounter Enlarged front view of the head unit viewed from the front Enlarged front view of the imaging device viewed from the front Block diagram showing the electrical configuration of the surface mounter Side view of shield parts from the side Plan view of the shield part viewed from the back side The flowchart which shows the flow of the mounting process of Embodiment 1. Flow chart showing the flow of the reference plane setting process A plan view of the shield part of the modification viewed from the back side The flowchart which shows the flow of the mounting process of Embodiment 2. Plan view of the semiconductor wafer as seen from the back side The side view which looked at the shield component of Embodiment 3 from the side The top view which looked at the shield component of Embodiment 3 from the back side The flowchart which shows the flow of the reference plane setting process of Embodiment 3. The flowchart which shows the flow of the mounting process of Embodiment 4.

(Overall configuration of surface mounter)
Embodiments will be described with reference to the drawings. As shown in FIG. 1, the surface mounter 1 has a configuration in which various devices are arranged on a base 10 having a rectangular shape in plan view and a flat upper surface. In the following description, the long side direction (left-right direction in FIG. 1) of the base 10 is defined as the X-axis direction, and the short side direction (vertical direction in FIG. 1) of the base 10 is defined as the Y-axis direction. Is the Z-axis direction.

  In the center of the base 10, a conveyor 12 for transporting a printed board (an example of a board) P is disposed. The conveyor 12 includes a pair of conveying belts 14 that are circulated and driven in the X-axis direction. When the printed circuit board P is set so as to be installed on both the conveyor belts 14, the printed circuit board P placed on the upper surface of the conveyor belt 14 is driven by the friction with the conveyor belt 14 in the driving direction of the conveyor belt 14 (X axis). Direction).

  In the surface mounter 1, the right side shown in FIG. 1 is an entrance, and the printed board P is carried into the machine through the conveyor 12 from the right side shown in FIG. The printed circuit board P carried into the machine is carried by the conveyor 12 to the central work position of the base 10 (position surrounded by a two-dot chain line in FIG. 1) and stops there.

  A component supply unit 20 for supplying components 18 to be mounted on the printed circuit board P is provided around the work position (on the side in the conveyance direction of the printed circuit board P). The component supply unit 20 is provided at a total of four locations, two at two locations side by side in the X-axis direction on both sides of the conveyor 12 (upper and lower sides in FIG. 1). The component 18 mounted on the printed circuit board P includes an electronic component and a metal shield component that protects the electronic component by covering the electronic component mounted on the printed circuit board P.

  A plurality of feeders F are aligned and attached to these component supply units 20 in a side-by-side manner. Each feeder F is composed of a reel (not shown) around which a component supply tape is wound, an electric feeding device (not shown) for pulling out the component supply tape from the reel, and the like, and the components 18 are supplied one by one. It has become so.

  At the mounting position, the mounting apparatus 30 performs a mounting process for mounting the component 18 supplied through the feeder F on the printed circuit board P. The printed circuit board P that has been mounted is started to be transported again, and is conveyed to the left in FIG.

  Next, the mounting apparatus 30 for mounting the component 18 on the printed circuit board P will be described. The mounting device 30 includes an X-axis servo mechanism, a Y-axis servo mechanism, a Z-axis servo mechanism, and a head unit 40 that is moved and operated in the X-axis direction, the Y-axis direction, and the Z-axis direction by driving these servo mechanisms. It has.

  Specifically, as shown in FIG. 1, a pair of support legs 31 are installed on the base 10. Both support legs 31 are located on both sides of the working position in the X-axis direction, and both extend straight along the Y-axis direction.

  Both support legs 31 are provided with guide rails 32 extending along the Y-axis direction on the upper surfaces thereof. A head support 34 extending along the X-axis direction is attached to each guide rail 32 installed on both sides in the X-axis direction in a state where both ends in the long side direction are fitted.

  A Y-axis ball screw 35 extending along the Y-axis direction is attached to one support leg 31 (on the right side in FIG. 1). A ball nut (not shown) is screwed onto the Y-axis ball screw 35. A Y-axis servo motor 36 is attached to the Y-axis ball screw 35.

  When the Y-axis servo motor 36 is energized, the ball nut advances and retreats along the Y-axis ball screw 35. As a result, the head support 34 fixed to the ball nut and the head unit 40 described below are attached to the guide rail 32. Along the Y-axis.

  As shown in FIG. 2, the head support 34 is provided with a guide member 37 extending along the X-axis direction. A head unit 40 is movably attached to the guide member 37 along the axial direction of the guide member 37. The head support 34 is mounted with an X-axis ball screw 38 extending along the X-axis direction. A ball nut (not shown) is screwed to the X-axis ball screw 38.

  The X-axis ball screw 38 is provided with an X-axis servo motor 39. When the X-axis servo motor 39 is energized, the ball nut advances and retreats along the X-axis ball screw 38. As a result, the X-axis servo motor 39 is fixed to the ball nut. The head unit 40 thus moved moves in the X-axis direction along the guide member 37.

  As described above, the head unit 40 can be moved in the horizontal direction (XY plane direction) on the base 10 by controlling the X-axis servo mechanism and the Y-axis servo mechanism in combination. .

  In the head unit 40, a plurality of mounting heads 41 that perform a mounting operation are mounted in a row. The mounting head 41 protrudes downward from the lower surface of the head unit 40, and a suction nozzle 42 is provided at the tip thereof.

  Each mounting head 41 can rotate around its axis by driving an R-axis servomotor 70 (see FIG. 4). Each mounting head 41 is configured to be movable up and down with respect to the frame 43 of the head unit 40 by driving a Z-axis servo motor (see FIG. 4). Each suction nozzle 42 is configured to be supplied with a negative pressure from a suction device (not shown), and a suction force is generated at the tip of the suction nozzle 42.

  With such a configuration, the electronic component 18 supplied through the feeder F is sucked by the suction nozzle 42 of the mounting device 30 and mounted on the printed circuit board P stopped at the mounting position.

  Next, the imaging device (an example of a measuring device) 50 arranged on the base 10 will be described. An imaging device 50 is disposed between each of the two component supply units 20 arranged on both sides of the conveyor 12 (upper and lower sides in FIG. 1) and arranged in the X-axis direction. The lower surface of the component 18 sucked by the suction nozzle 42 is imaged by the imaging device 50.

  As illustrated in FIG. 3, the imaging device 50 includes a base plate 51 that is fixed to the base 10. At the upper end of the base plate 51, a vertical light L1 that irradiates imaging light from the vertical direction to the lower surface of the component 18 sucked by the suction nozzle 42, and imaging light from an oblique direction is irradiated to the lower surface of the component 18. The slanting direction light L2 is fixed.

  The vertical light L1 and the oblique light L2 are light sources in which a plurality of LEDs 52 are arranged, and are fixed to the base plate 51, respectively. The vertical light L1 is arranged so that its irradiation direction is perpendicular to the lower surface of the component 18, and the oblique light L2 has an angle of approximately 40 ° with respect to the lower surface of the component 18. It is arranged to make.

  In each of the vertical light L1 and the oblique light L2, a refractive lens 53 is provided on the irradiation path of the light from the LED 52. The refractive lens 53 refracts the light emitted from each LED 52 so as to become parallel light or substantially parallel light substantially orthogonal to a predetermined plane.

  The light emitted from each refracting lens 53 is bent while maintaining parallel or substantially parallel to the Y-axis direction, becomes planar bent light, and is condensed at a linear condensing position SI in the Y-axis direction. The Z-axis direction position of the suction head 42 is adjusted so that the lower surface of the component 18 coincides with the condensing position SI.

  Further, a diffuser 54 that diffuses the planar bending light H only in the Y-axis direction is disposed between the refractive lens 53 and the component 18. Each planar bent light H spreads in a fan shape in the Y-axis direction as it goes to the component 18 side by the diffuser 54, and has substantially uniform brightness in the Y-axis direction.

  The light from the vertical light L1 is reflected downward by the lower surface of the component. On the other hand, the planar bent light H emitted from the oblique light L2 to the condensing position SI is reflected to the left as the surface object of the YZ plane with the condensing position SI as a reference, and the reflected light R is reflected by the mirror 55. It will be reflected downward.

  Light from the vertical light L1 is reflected downward by the component 18 and then received by the vertical camera C1. The light reflected by the mirror 55 is received by the oblique camera C2. Each of the vertical camera C1 and the oblique camera C2 includes a line sensor in which a large number of CCD elements are arranged along the Y direction as a photoelectric conversion element.

(Electrical configuration of surface mounter)
Next, the electrical configuration of the surface mounter 1 will be described with reference to the block diagram of FIG. The main body of the surface mounter 1 is entirely controlled by the control device 60. The control device 60 includes a CPU and the like, and includes a transport system control unit 62, a mounting system control unit 64, and a component recognition unit 66.

  The transport system control unit 62 stores data for controlling the transport system such as the conveyor 12. The mounting system control unit 64 is electrically connected to the Z-axis servo motor 68, the R-axis servo motor 70, the Y-axis servo motor 36, and the X-axis servo motor 39, and each of these servo motors 68, The drive of 70,36,39 is controlled.

  The component recognition unit 66 captures an image of the component 18 sucked by the suction head 42 based on the mounting program, and specifies the coordinates of each part of the component 18 with respect to the captured image, thereby the component 18. Recognize the center position, suction posture, etc. Thereby, the component 18 sucked by the suction head 42 is positioned and mounted at an accurate position on the printed board P.

  In addition, the component recognition unit 66 operates the imaging device 50 based on processing shown in a flowchart described later. In the processing shown in this flowchart, measurement marks are set at a plurality of locations of the component 18 for the component 18 sucked by the suction head 42. Therefore, the component recognition unit 66 includes a storage unit 67 that stores component information related to the shape and the like of the component 18 as well as mark information that is information related to a measurement mark for each type of the component 18 described later. . The storage unit 67 may be provided at another location outside the component recognition unit 66.

  Specifically, the component information includes the shape of the component 18, the external dimensions of the component 18, coordinate information of the center position, and the like. The mark information includes information related to the shape of the measurement mark, information related to the relative position of each measurement mark from the center position of the component 18, and the like.

  The surface mounter 1 according to this embodiment is configured as described above. Of the configuration of the surface mounter 1, some devices including the imaging device 50 and the control device 60 are examples of a determination device.

(Implementation process)
Next, each embodiment regarding the mounting process in the surface mounter 1 will be described. Here, the mounting process in each embodiment is a process of mounting the component 18 on the printed circuit board P stopped at the work position of the surface mounter 1, and is a process executed by the control device 60 according to the mounting program.

(Embodiment 1)
In this embodiment, a shield component (an example of an adhesion member) 80 is illustrated as an example of the component 18 mounted on the printed circuit board P. Here, FIG. 5 shows the shield component 80 mounted on the printed circuit board P. FIG. FIG. 6 shows a plan view of the shield component 80.

  The shield component 80 is attached on the printed circuit board P by solder bonding so as to cover the electronic component mounted on the printed circuit board P. As shown in FIGS. 5 and 6, the shield component 80 is arranged along the plate surface of the printed circuit board P, and has a plane portion 80A having a substantially square shape in plan view, and the plane from each end of the plane portion 80A. An attachment portion 80B extending substantially perpendicular to the portion 80A and having the tip attached to the printed circuit board P.

  In addition, as shown in FIG. 6, a plurality of through holes 80 </ b> S whose openings have a perfect circular shape in plan view are formed in the flat portion 80 </ b> A of the shield component 80. By providing such a through hole 80S, the air permeability of the shield component 80 is enhanced, and the cooling efficiency of the electronic component covered by the shield component 80 is enhanced.

  Next, the mounting process of the first embodiment will be described with reference to the flowchart shown in FIG. When the mounting operation of the component 18 is started, the control device 60 first reads out component information regarding the shield component 80 sucked by the suction nozzle 42 from the storage unit 67 of the component recognition unit 66 (S2). Based on this component information, the coordinates of the center position 80O (see FIG. 6) of the shield component 80 are measured in a process described later. As shown in FIG. 6, in the shield component 80, the center of the flat portion 80 </ b> A is set as the center position 80 </ b> O of the shield component 80.

  Next, the control device 60 reads the mark information related to the shield component 80 from the storage unit 67 of the component recognition unit 66 (S4). Based on this mark information, the coordinates of the measurement mark M (see FIG. 6) of the shield component 80 are measured in a process described later. As shown in FIG. 6, in the shield part 80, among the plurality of through holes 80S drilled in the flat surface portion 80A, the through holes 80S drilled at the four corners of the flat surface portion 80A Is done. Thereby, the relative position from the center position 80O of the shield component 80 for each measurement mark M is set, and the shape of each measurement mark M is set to be a perfect circle.

  Next, the controller 60 causes the suction nozzle 42 to suck the component 18 supplied from the component supply unit 20 (S6). When the control device 60 sucks the component 18 to the suction nozzle 42, the control device 60 moves the component 18 above the imaging device 50.

  Next, the control device 60 captures an image of the shield component 80 by the vertical direction camera C1 of the imaging device 50. Then, the control device 60 sets an XYZ coordinate system (hereinafter referred to as a first XYZ coordinate system) for the captured image, and reads the component information and the mark read from the component recognition unit 66 in the processes of S6 and S8. Based on the information, the coordinates of the center position 80O of the shield part 80 and the coordinates of each measurement mark M in the first XYZ coordinate system are measured (S10).

  In the present embodiment, since the shape of the measurement mark M set on the shield component 80 is a perfect circle, the center position of the perfect circle that forms the measurement mark M is the position of the measurement mark M.

  Next, the control device 60 relates to the coordinates of each measurement mark M of the shield component 80 measured in the process of S10, that is, the XY coordinates of each measurement mark M of the shield component 80 based on the image captured by the vertical camera C1. Information is stored in the storage unit 67 of the component recognition unit 66 (S12).

  Next, the control device 60 captures an image of the shield component 80 by the oblique direction camera C <b> 2 of the imaging device 50. The control device 60 measures the XY coordinates of each measurement mark M of the shield component 80 in the first XYZ coordinate system based on the captured image and the mark information read from the component recognition unit 66 in the process of S8 ( S14).

  Next, the control device 60 relates to the coordinates of each measurement mark M of the shield component 80 measured in the process of S14, that is, the XY coordinates of each measurement mark M of the shield component 80 based on the image captured by the oblique camera C2. The information is stored in the storage unit 67 of the component recognition unit 66 (S16).

(Reference plane calculation process)
Next, the control device 60 executes a reference plane setting process described below (S20). Hereinafter, the reference plane setting process executed by the control device 60 in S20 will be described with reference to the flowchart shown in FIG.

  In the reference plane setting process, the control device 60 first reads information on the XY coordinates of each measurement mark M of the shield component 80 based on the image captured by the vertical camera C1 from the storage unit 67 of the component recognition unit 66 (S22). .

  Next, the control device 60 reads information on the XY coordinates of each measurement mark M of the shield component 80 based on the image captured by the oblique direction camera C2 from the storage unit 67 of the component recognition unit 66 (S24).

  Next, the control device 60 obtains a difference between the coordinates read in the process of S22 and the coordinates read in the process of S24, and thereby calculates the Z coordinate of each measurement mark M in the shield component 80 (S26). ).

  Here, a method of calculating the Z coordinate of each measurement mark M in the shield part 80 by the vertical camera C1 and the oblique camera C2 will be described. Since both the vertical direction camera C1 and the oblique direction camera C2 are arranged below the suction nozzle 42, it is only necessary to image the shield part 80 with either one of the cameras C1 and C2 in the first XYZ coordinate system. The Z-direction coordinates (coordinates in the height direction) at each measurement mark M of the shield component 80 cannot be calculated.

  Therefore, first, each measurement mark M of the shield component 80 is imaged by the vertical direction camera C1 and the oblique direction camera C2. Then, regarding these two captured images, with respect to the center position of the perfect circle forming each measurement mark M, the relative displacement amount between the two images and the tangent of the relative angle between the vertical camera C1 and the oblique camera C2 ( In the present embodiment, as described above, tan (90 ° -40 °)) can be used to calculate the Z-direction coordinates (coordinates in the height direction) of each measurement mark M. Thereby, in the first XYZ coordinate system, coordinates including the Z direction coordinates of each measurement mark M of the shield component 80 are calculated.

  Next, the control device 60 uses the least square method for each of the coordinates of each measurement mark M calculated in S26, sets the approximate plane calculated thereby as a virtual reference plane (S28), and performs reference plane setting processing. finish.

  The continuation of the mounting process will be described with reference to the flowchart shown in FIG. When the reference plane setting process (S20) ends, the control device 60 sets an XYZ coordinate system (hereinafter referred to as a second XYZ coordinate system) based on the virtual reference plane set in the reference plane setting process. Specifically, the control device 60 sets one direction along the virtual reference plane as the X direction, sets the direction orthogonal to the X direction and along the virtual reference plane as the Y direction, and the X direction and the Y direction. A second XYZ coordinate system is set in which the direction orthogonal to the Z direction is the Z direction.

  And the control apparatus 60 calculates the coordinate of a Z direction about each of each measurement mark M of the shield component 80 in a 2nd XYZ coordinate system (S30). The process executed by the control device 60 in S30 is an example of a Z-direction coordinate calculation process.

  Next, the control device 60 determines whether or not the difference between the coordinate having the maximum value and the coordinate having the minimum value among the coordinates in the Z direction calculated in S30 is larger than the first set value (S32). ). The first set value here can be set to an arbitrary value obtained from an empirical rule or the like.

  When the control device 60 determines that the value is equal to or smaller than the first set value in S32 (S32: NO), the control device 60 determines that the flatness of the shield component 80 sucked by the suction nozzle 42 is good, and the shield component 80 Is mounted at a predetermined position on the printed circuit board P (S34), and the mounting process is terminated.

  On the other hand, if the control device 60 determines in S32 that it is larger than the first set value (S32: YES), it determines that the flatness of the shield part 80 sucked by the suction nozzle 42 is not good and executes error processing. (S36), and the mounting process is terminated. The error processing here refers to processing to shift to mounting processing of the next component without mounting the shield component 80 on the printed circuit board P, processing to re-execute the mounting processing for the shield component 80, or the like. It is. Moreover, the process which the control apparatus 60 performs in S32, S34, and S36 is an example of a quality determination process.

  Here, the virtual reference plane is a flat approximate plane derived from the coordinates of each measurement mark M, and the second XYZ coordinate system is based on the virtual reference plane. The difference between the maximum value coordinate and the minimum value coordinate of the measurement mark M in the Z direction corresponds to the maximum shift amount of each measurement mark M in the Z direction (height direction). Further, the flatness of the planar portion 80A of the shield part 80 can be determined from the amount of deviation in the height direction for a plurality of portions of the planar portion 80A. Therefore, it is possible to determine whether the flatness of the flat surface portion 80A of the shield part 80 in which each measurement mark M is set is good or bad depending on whether the maximum deviation amount exceeds a predetermined value, that is, the first set value. .

  Each measurement mark M set on the flat surface portion 80A of the shield part 80 is located near each edge of the flat surface portion 80A, that is, in the vicinity of a portion of the flat surface portion 80A where the adhering portion 80B attached to the printed circuit board P extends. Since each is set, by measuring the amount of deviation in the height direction for each measurement mark M, it is almost the same as that for measuring the amount of deviation in the height direction of the adhering portion 80B, which is the part to be originally measured. Measurement results can be obtained. For this reason, based on the measurement result of the amount of deviation in the height direction at each measurement mark M, it is possible to relatively determine the quality of the flatness of the adhesion portion 80B.

(Effect of Embodiment 1)
As described above, in the surface mounter 1 according to the present embodiment, the control device 60 does not directly calculate the flatness at the attachment portion 80B of the shield component 80, and performs a plurality of measurements on the flat surface portion 80A connected to the attachment portion 80B. The mark M is set, and the flatness of the plane portion 80A is calculated from the virtual reference plane set based on each measurement mark M. And the control apparatus 60 determines the quality of the flatness of the adhesion part 80B connected with the said plane part 80A based on the calculated flatness of the plane part 80A. For this reason, even if the adhesion part 80B has a shape or size that makes it difficult to measure the flatness like the shield component 80 adhered to the printed circuit board P, the accuracy of the flatness in the adhesion part 80B is accurately determined. Can be judged well.

  In the present embodiment, the control device 60 is formed in the flat portion 80A of the shield component 80 with respect to the shield component 80 made of a shield member that covers the electronic component mounted on the printed circuit board P in the mounting process. The through hole 80S is set as the measurement mark M. For this reason, the through hole 80S as the measurement mark M drilled in the flat portion 80A of the shield component 80 can be used as the heat radiating through hole 80S. Thereby, it is not necessary to make a through-hole for heat dissipation separately, and the processing cost of the shield component 80 can be reduced.

  In the present embodiment, the control device 60 calculates the virtual reference plane by using the least square method for each coordinate of the measurement mark M in the reference plane setting process. By using the least square method in this way, the virtual reference plane can be accurately calculated without being affected by the posture (tilt) of the adhering member, and the flatness of the adhering portion 80B of the shield part 80 is more appropriate. Can be determined.

  In the present embodiment, the control device 60 determines the difference between the maximum coordinate value and the minimum coordinate value among the coordinates in the Z direction of the measurement mark M calculated by the Z direction coordinate calculation processing in the pass / fail determination processing. Whether the flatness of the adhesion part 80B of the shield part 80 is good or not is determined by whether or not the value exceeds the first set value. In this way, by setting a specific reference for determining whether the flatness is good or bad, it is possible to more appropriately determine whether the flatness of the attached portion 80B of the shield part 80 is good or bad.

(Modification of Embodiment 1)
Subsequently, a modification of the first embodiment will be described. In this modification, a shield part 81 (see FIG. 9) of a type different from the type exemplified in the first embodiment is illustrated as the part 18 sucked by the suction nozzle 42.

  As shown in FIG. 9, the shield part 81 has the same shape and configuration as the shield part 80 exemplified in the first embodiment in the plane part 81A and the adhesion part 81B. On the other hand, the flat part 81A of the shield part 81 is provided with through holes 81S only at the four corners. All of these four through-holes 81S have substantially L-shaped openings in plan view, and the bent portions of the substantially L-shaped shapes are respectively directed toward the corners of the planar portion 81A.

  In the shield component 81, as shown in FIG. 9, the through holes 81S provided at the four corners of the flat portion 81A are set as the measurement marks M and M1. In this case, in each through-hole 81S, a corner located outside among the corners formed in the bent portion can be set as the measurement mark M, and a corner located inside among the corners. Can also be set as the measurement mark M1 (see FIG. 9).

(Embodiment 2)
Next, the mounting process of the second embodiment will be described with reference to the flowchart shown in FIG. The mounting process of the second embodiment is different from that of the first embodiment in the flowchart (see FIG. 7) of the mounting process of the first embodiment, and the other processes are the same as those of the first embodiment. Therefore, description of the same processing as that of the first embodiment is omitted.

  Here, in this embodiment, a semiconductor wafer (an example of an adhesion member) 180 is illustrated as an example of the component 18 mounted on the printed circuit board P. As shown in FIG. 11, the semiconductor wafer 180 has a flat wafer portion (an example of a flat portion) 180A that is arranged along the plate surface of the printed board P and has a substantially square shape in plan view.

  A plurality of solder balls 180B arranged in a frame shape along the outer peripheral shape of the wafer part 180A are arranged on the outer peripheral side of the wafer part 180A in the semiconductor wafer 180 and on the side facing the printed circuit board P. These solder balls 180B constitute an electrode group, and the semiconductor wafer 180 is soldered onto the wiring pattern of the printed circuit board P by melting the plurality of solder balls 180B. The solder ball 180B is an example of an adhesion portion.

  Further, as shown in FIG. 11, a plurality of circular measurement marks M are provided on the outer peripheral side of the plurality of solder balls 180B arranged in a frame shape so as to surround the solder balls 180B. These measurement marks M are formed by the same method (for example, printing method) as the method of forming the wiring pattern.

  A mounting process according to the second embodiment will be described. In the mounting process according to the second embodiment, the control device 60 follows the Z direction from the coordinate position of each measurement mark M to the virtual reference plane in the second XYZ coordinate system based on the virtual reference plane after the process of S30. It is determined whether at least one of the distances is greater than the second set value (S132). The second set value here can be set to an arbitrary value obtained from an empirical rule or the like.

  When the control device 60 determines that the value is equal to or smaller than the second set value in S132 (S132: NO), the control device 60 determines that the flatness of the semiconductor wafer 180 adsorbed by the adsorption nozzle 42 is good, and the semiconductor wafer 180 concerned. Is mounted at a predetermined position on the printed circuit board P (S34), and the mounting process is terminated.

  On the other hand, if the control device 60 determines in S132 that it is larger than the second set value (S132: YES), it determines that the flatness of the semiconductor wafer 180 sucked by the suction nozzle 42 is not good and executes error processing. (S36), and the mounting process is terminated.

  Here, the distance along the Z direction from the coordinate position of each measurement mark M to the virtual reference plane in the second XYZ coordinate system is relative to the virtual reference plane which is a flat approximate plane derived from the coordinates of each measurement mark M. This corresponds to the amount of deviation of each measurement mark M in the height direction. Therefore, whether or not the flatness of the wafer portion 180A of the semiconductor wafer 180 in which each measurement mark M is set is determined according to whether or not the amount of deviation in the height direction exceeds a predetermined value, that is, the second set value. can do.

(Effect of Embodiment 2)
As described above, in this embodiment, the control device 60 determines whether at least one of the distances along the Z direction from each of the measurement marks M to the virtual reference plane exceeds the second set value in the pass / fail determination process. Whether the flatness of the solder ball 180B of the semiconductor wafer 180 is good or not is determined. In this way, by setting a specific reference for determining whether the flatness is good or not, it is possible to more appropriately determine the flatness of the solder balls 180B of the semiconductor wafer 180.

  Further, in the present embodiment, the control device 60 forms the adhesion member made of the semiconductor wafer 180 fixed to the printed circuit board P in the mark setting process on the wafer portion 180A of the semiconductor wafer 180 by the same method as the wiring pattern. The measured mark is set as the measurement mark M. By doing so, it is possible to appropriately determine whether or not the adhesion member made of the semiconductor wafer 180 is flat in the solder ball 180B as the adhesion portion.

(Embodiment 3)
Next, the mounting process of the third embodiment will be described. The mounting process of the second embodiment is different from the first embodiment in the reference plane setting process executed in S20 in the flowchart (see FIG. 7) of the mounting process of the first embodiment, and the other processes are the same as in the first embodiment. It is. Therefore, description of the same processing as that of the first embodiment is omitted.

  Here, in the present embodiment, a shield component (an example of an adhesion member) 280 of a type different from the shield component 80 illustrated in the first embodiment is illustrated. As shown in FIGS. 12 and 13, the shield component 280 is arranged along the plate surface of the printed circuit board P, and has a plane portion 280 </ b> A having a substantially square shape in a plan view in which one of the four corners is slightly chipped. An attachment portion 280B extending substantially perpendicular to the flat portion 280A from each edge of the 280A and having the tip attached to the printed circuit board P.

  Further, as shown in FIG. 13, a plurality of through holes 280 </ b> S whose openings form a perfect circle are formed in the flat portion 280 </ b> A of the shield component 280, similarly to the shield component 80 illustrated in the first embodiment. . Further, the flat surface portion 280A of the shield component 280 has a raised surface portion 280C that protrudes in a part of the flat surface portion 280A on the side opposite to the printed circuit board P side (see FIGS. 12 and 13).

  Note that such a raised surface portion 280C interferes with the protruding portion of the electronic component when, for example, the shield component 280 covers an electronic component whose height is higher than the height of another portion. It is provided so that it does not.

  In the shield component 280 exemplified in the present embodiment, as shown in FIG. 13, among the plurality of through holes 280 </ b> S drilled in the plane portion 280 </ b> A, the through holes 280 </ b> S drilled in the four corners of the plane portion 280 </ b> A are provided. The measurement mark M is used. In this case, as shown in FIG. 13, the measurement mark M may be a through hole 280 </ b> S located in the raised surface portion 280 </ b> C. Further, as shown in FIG. 13, another through-hole 280S located near the edge of the flat surface portion 280A can be used as the measurement mark M2, and thereby, five or more measurement marks M, M2 are formed on the flat surface portion 280A. Can also be set.

  In the present embodiment, regarding the shield component 280 having the raised surface portion 280C on the flat surface portion 280A, the raised amount information regarding the raised amount of the raised surface portion 280C (the relative height of the raised surface portion 280C with respect to the flat surface portion 280A) is one of the component information. Are stored in the storage unit 67 of the component recognition unit 66.

  The reference plane setting process of the third embodiment will be described with reference to the flowchart shown in FIG. In the reference plane setting process of the third embodiment, the process executed by the control device 60 in S22 and S24 is the same as the reference plane setting process of the first embodiment, and a description thereof will be omitted.

  When the process of S24 is completed in the reference plane setting process, the control device 60 reads the protruding amount information about the shield component 280 from the storage unit 67 of the component recognition unit 66 (S225).

  Next, the control device 60 calculates the Z coordinate for the measurement marks M other than the measurement mark M set in the raised surface portion 280C among the measurement marks M of the shield component 280. Further, the control device 60 calculates the Z coordinate for the measurement mark M set in the raised surface portion 280C, corrects the Z coordinate by subtracting the raised amount read in S225 from the calculated Z coordinate, Correction coordinates are calculated (S226).

  Next, the control device 60 uses the least square method for each of the coordinates and the corrected coordinates of each measurement mark M calculated in S226, sets the approximate plane calculated thereby as a virtual reference plane (S228), and sets the reference plane. The setting process ends.

(Effect of Embodiment 3)
As described above, in the surface mounter according to the present embodiment, for the shield component 280 and the like in which the flat portion 280A has the raised surface portion 280C, the raised amount of the raised surface portion 280C is stored in the storage unit 67 of the component recognition unit 66. Then, when determining whether the flatness of the shield component 280 having such a raised surface portion 280C is good or not, a virtual reference plane is set based on the position where the raised amount is subtracted, and the Z-direction coordinates of each measurement mark M are Calculated. For this reason, the quality of the flatness in the plane part 280A of the shield part 280 having the raised surface part 280C can be determined more appropriately.

(Embodiment 4)
Next, the mounting process of the fourth embodiment will be described with reference to the flowchart shown in FIG. The mounting process of the fourth embodiment is different from that of the first embodiment in the flowchart of the mounting process of the first embodiment (see FIG. 7), and the other processes are the same as those of the first embodiment. . Therefore, description of the same processing as that of the first embodiment is omitted.

  In the present embodiment, a shield component 80 similar to that illustrated in the first embodiment is illustrated as the component 18 sucked by the suction nozzle 42.

  In the present embodiment, the mark information related to the standard member is stored in the storage unit 67 of the component recognition unit 66 in advance. The standard member here is a member having a good flatness and a measurement mark set at an accurate position corresponding to the normal position of the measurement mark M set on the shield component 80. Further, the mark information related to the standard member includes the Z-direction coordinate of the measurement mark in the standard member.

  In the mounting process of the fourth embodiment, after the process of S30, the control device 60 reads the Z-direction coordinates of the measurement mark on the standard member from the storage unit 67 of the component recognition unit 66 (S331).

  Next, the control device 60 performs the Z direction in the second XYZ coordinate system based on the Z direction coordinates of the measurement marks in the standard member read out in S331 and the virtual reference plane of each measurement mark M of the shield component 80 corresponding to them. The difference between the coordinates is calculated, and it is calculated whether or not at least one of the calculated absolute values of the differences is larger than the third set value (S332). In addition, the 3rd setting value here can set the arbitrary values calculated | required from an empirical rule.

  When the control device 60 determines that the value is equal to or smaller than the third set value in S332 (S332: NO), the control device 60 determines that the flatness of the shield component 80 sucked by the suction nozzle 42 is good, and the shield component 80 Is mounted at a predetermined position on the printed circuit board P (S34), and the mounting process is terminated.

  On the other hand, if the control device 60 determines in S332 that it is larger than the third set value (S332: YES), it determines that the flatness of the shield component 80 sucked by the suction nozzle 42 is not good and executes error processing. (S36), and the mounting process is terminated.

  Here, since the Z-direction coordinate of the measurement mark M in the standard member is an index indicating the normal position of the measurement mark M, the amount of deviation from the Z-direction coordinate is the amount of deviation from the normal position. Equivalent to. Therefore, the absolute value of the difference between the Z-direction coordinates of the measurement mark M on the standard member and the Z-direction coordinates of each measurement mark M in the second XYZ coordinate system exceeds a predetermined value, that is, the third set value. Whether or not the flatness of the flat surface portion 80A of the shield part 80 in which each measurement mark M is set can be determined based on the standard member.

(Effect of Embodiment 4)
As described above, in the surface mounter according to the present embodiment, each of the measurement marks of the standard member is measured with respect to the standard member in which the measurement mark is set at an accurate position corresponding to the normal position of the measurement mark set on the adhesion member. Is stored in the storage unit 67 of the component recognition unit 66. And the quality of the flatness in the plane part 80A of the shield component 80 is determined using the Z direction coordinate of the measurement mark M in the standard member. For this reason, for example, even if the amount of protrusion of the raised surface portion of the attachment member having the raised surface portion as described in the third embodiment is unknown, the attachment member such as the shield component having the raised surface portion is flat in the attachment portion. The degree of quality can be determined more appropriately.

(Other embodiments)
The present invention is not limited to the embodiments described above and with reference to the drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In each of the above embodiments, an example in which the virtual reference plane is calculated by using the least square method has been described, but the method for calculating the virtual reference plane is not limited. For example, a third virtual plane that is intermediate between a first virtual plane that passes through three measurement marks and a second virtual plane that is parallel to the first virtual plane and passes through another measurement mark. The virtual plane may be calculated as a virtual reference plane. Even in this method, the virtual reference plane can be accurately calculated without being affected by the posture (tilt) of the adhering member, and the quality of the flatness at the adhering portion of the adhering member can be determined more appropriately.

(2) In the above embodiment, an example in which the Z-direction coordinate of each measurement mark is measured using an imaging device including a vertical camera and an oblique camera is described. However, the accurate coordinate of each measurement mark is measured. The measuring method is not limited. You may measure the Z direction coordinate of a measurement mark using a well-known flatness measuring apparatus.

(3) In addition to the above embodiments, the configuration and the like of the adhesion member can be changed as appropriate.

(4) In addition to the above embodiments, the shape, number, arrangement, etc. of measurement marks can be changed as appropriate.

(5) In addition to the above embodiments, the configuration of the surface mounter can be changed as appropriate.

  As mentioned above, although embodiment of this invention was described in detail, these are only illustrations and do not limit a claim. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

DESCRIPTION OF SYMBOLS 1 ... Surface mounter 10 ... Base 18 ... Component 20 ... Component supply part 30 ... Mounting apparatus 42 ... Adsorption nozzle 50 ... Imaging device 60 ... Control apparatus 80, 81, 280 ... Shield component 80A, 81A, 280A ... Plane part 80B , 81B, 280B ... Adhering part 80S, 81S, 280S ... Through-hole 180 ... Semiconductor wafer 180A ... Wafer part 180B ... Solder ball 280C ... Raised surface part C1 ... Vertical camera C2 ... Oblique camera M, M1, M2 ... Measurement mark P …Printed board

Claims (8)

Determining whether or not the flatness of the adhesion portion of the adhesion member having an adhesion portion attached to the substrate and a flat portion provided along the plate surface of the substrate and provided with the adhesion portion on the edge side is good. A determination device,
A measuring device;
A control device,
The controller is
Mark setting processing for setting measurement marks at at least four positions spaced apart from each other on the plane portion;
By measuring the position of each of the measurement marks by the measurement device, a reference plane setting process for setting one plane passing through each of the measurement marks or the vicinity of each of the measurement marks as a virtual reference plane;
One direction along the virtual reference plane is defined as an X direction, the direction perpendicular to the X direction and the direction along the virtual reference plane is defined as a Y direction, and a direction orthogonal to each of the X direction and the Y direction is defined as A Z-direction coordinate calculation process for calculating the Z-direction coordinate for each of the measurement marks in an XYZ coordinate system in the Z direction;
A pass / fail determination process for determining pass / fail of flatness in the attached portion of the attached member based on the Z-direction coordinate calculated in the Z-direction coordinate calculating process;
Run
The controller is
In the mark setting process, for the attachment member made of a shield member that covers an electronic component mounted on the substrate, a through hole formed in the flat portion of the attachment member is set as the measurement mark.
Judgment device. The determination device according to claim 1 ,
The controller is
In the reference plane setting process, the virtual reference plane is calculated by using a least square method for each coordinate of the measurement mark.
Judgment device. The determination apparatus according to claim 1 or 2 , wherein
The controller is
In the pass / fail determination process, of the coordinates in the Z direction of the measurement mark calculated in the Z-direction coordinate calculation process, does the difference between the maximum coordinate and the minimum coordinate exceed a first set value? It is determined whether the flatness in the adhesion portion of the adhesion member is good or not,
Judgment device. The determination device according to claim 2 ,
The controller is
In the pass / fail determination process, a flatness in the attachment portion of the attachment member depends on whether at least one of the distances along the Z direction from each of the measurement marks to the virtual reference plane exceeds a second set value. Judge the quality of the degree,
Judgment device. The determination apparatus according to claim 1 or 2 , wherein
A storage unit that stores a protruding amount of the raised surface portion with respect to the attachment member having a raised surface portion that rises with a step in a part of the flat surface portion,
The controller is
When the measurement mark is set in the raised surface portion of the attachment member having the raised surface portion,
In the reference plane setting process, the virtual reference plane is set on the assumption that the protruding amount is read from the storage unit and the measurement mark set in the protruding surface portion is set at a position obtained by subtracting the protruding amount. ,
In the Z-direction coordinate calculation process, the Z-direction coordinates of the position obtained by subtracting the raised amount of the raised surface portion for the measurement mark set in the raised surface portion are calculated.
Judgment device. The determination apparatus according to claim 1 or 2 , wherein
For the standard member in which the measurement mark is set at an accurate position corresponding to the normal position of the measurement mark set on the attachment member, the coordinates in the Z direction in each of the measurement marks of the standard member are stored. A storage unit,
The controller is
In the pass / fail determination process, the coordinates in the Z direction in each of the measurement marks of the standard member are read from the storage unit, and the read coordinates in the Z direction correspond to the measurement marks of the standard member. Determining whether the flatness of the adhesion portion of the adhesion member is good or not based on the difference between the Z-direction coordinates of the measurement mark in the flat surface portion of the adhesion member;
Judgment device. Determining whether or not the flatness of the adhesion portion of the adhesion member having an adhesion portion attached to the substrate and a flat portion provided along the plate surface of the substrate and provided with the adhesion portion on the edge side is good. A determination device,
A measuring device;
A control device,
The controller is
Mark setting processing for setting measurement marks at at least four positions spaced apart from each other on the plane portion;
By measuring the position of each of the measurement marks by the measurement device, a reference plane setting process for setting one plane passing through each of the measurement marks or the vicinity of each of the measurement marks as a virtual reference plane;
One direction along the virtual reference plane is defined as an X direction, the direction perpendicular to the X direction and the direction along the virtual reference plane is defined as a Y direction, and a direction orthogonal to each of the X direction and the Y direction is defined as A Z-direction coordinate calculation process for calculating the Z-direction coordinate for each of the measurement marks in an XYZ coordinate system in the Z direction;
A pass / fail determination process for determining pass / fail of flatness in the attached portion of the attached member based on the Z-direction coordinate calculated in the Z-direction coordinate calculating process;
Run
A storage unit that stores a protruding amount of the raised surface portion with respect to the attachment member having a raised surface portion that rises with a step in a part of the flat surface portion,
The controller is
When the measurement mark is set in the raised surface portion of the attachment member having the raised surface portion,
In the reference plane setting process, the virtual reference plane is set on the assumption that the protruding amount is read from the storage unit and the measurement mark set in the protruding surface portion is set at a position obtained by subtracting the protruding amount. ,
In the Z-direction coordinate calculation process, the Z-direction coordinates of the position obtained by subtracting the raised amount of the raised surface portion for the measurement mark set in the raised surface portion are calculated.
Judgment device. A surface mounter comprising the determination device according to claim 1 .

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