JP6204226B2 - 基板処理装置、基板処理方法 - Google Patents
基板処理装置、基板処理方法 Download PDFInfo
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- JP6204226B2 JP6204226B2 JP2014033015A JP2014033015A JP6204226B2 JP 6204226 B2 JP6204226 B2 JP 6204226B2 JP 2014033015 A JP2014033015 A JP 2014033015A JP 2014033015 A JP2014033015 A JP 2014033015A JP 6204226 B2 JP6204226 B2 JP 6204226B2
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- 239000000758 substrate Substances 0.000 title claims description 40
- 238000012545 processing Methods 0.000 title claims description 37
- 238000003672 processing method Methods 0.000 title claims description 13
- 238000005192 partition Methods 0.000 claims description 120
- 238000012546 transfer Methods 0.000 claims description 115
- 238000003825 pressing Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 8
- 238000000638 solvent extraction Methods 0.000 claims description 3
- 230000032258 transport Effects 0.000 description 299
- 235000012431 wafers Nutrition 0.000 description 62
- 238000010438 heat treatment Methods 0.000 description 57
- 238000003860 storage Methods 0.000 description 55
- 230000007246 mechanism Effects 0.000 description 30
- 230000007723 transport mechanism Effects 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 12
- 238000006073 displacement reaction Methods 0.000 description 12
- 239000007789 gas Substances 0.000 description 10
- 239000011261 inert gas Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000002397 field ionisation mass spectrometry Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
前記搬入領域とは別の雰囲気に維持された移載領域と、
前記搬入領域と、前記移載領域とを仕切り、開口部が設けられた隔壁と、
前記開口部を開閉する扉と、
前記取り出し口が前記隔壁の前記開口部と対向するようにして前記載置台上に載置された前記運搬容器を、前記隔壁に押し当てる運搬容器押し当て手段と、
前記運搬容器の上部側から前記凹部に対して挿入され、前記運搬容器を前記隔壁に押し当てる運搬容器保持手段と、
を有し、
前記運搬容器保持手段が前記運搬容器を前記隔壁に押し当てる力の大きさは、前記運搬容器押し当て手段が、前記運搬容器を前記隔壁に押し当てる力の大きさ以下である
基板処理装置を提供する。
[基板処理装置]
本実施の形態では、基板処理装置の一構成例について説明する。なお、本実施形態では基板処理装置として縦型熱処理装置を例に説明するが、係る形態に限定されるものではない。
(搬入搬出ユニット)
搬入搬出ユニット31は搬送保管ユニット32に隣接して配置することができ、ウエハを複数枚収納した運搬容器20を縦型熱処理装置30に搬入搬出するユニットとすることができる。
(搬送保管ユニット)
搬送保管ユニット32は、複数の運搬容器20を保管する第1保管部(第1キャリアステージ)321を有することができる。また、必要に応じて複数の運搬容器20を保管する第2保管部(第2キャリアステージ)322を設けることもできる。
(熱処理ユニット)
熱処理ユニット33は既述のように、多数枚のウエハを多段に保持した保持具3321を収納して、ウエハに熱処理を施す熱処理炉3311を有することができる。
(移載部及び移載部周辺の構成)
次に上述した移載部及び移載部の周辺の構成例について図4〜図6を用いて説明する。
[基板処理方法]
次に本実施形態の基板処理方法の一構成例について説明する。なお、本実施形態では縦型熱処理装置を用いた場合の基板処理方法を例に説明するが、係る形態に限定されるものではない。
21 取り出し口
24 フランジ
25 凹部
323a 載置台
41 隔壁
411 開口部
413 扉
42 搬入領域
43 移載領域
46 運搬容器保持手段
51 ローラー部
52 板状体
Claims (5)
- 複数の被処理体を収納することができ、前記被処理体を出し入れするための取り出し口と、前記取り出し口が設けられた面側の上部に形成されたフランジと、前記フランジの上面に形成された凹部と、を有する運搬容器を載置する載置台が設けられた搬入領域と、
前記搬入領域とは別の雰囲気に維持された移載領域と、
前記搬入領域と、前記移載領域とを仕切り、開口部が設けられた隔壁と、
前記開口部を開閉する扉と、
前記取り出し口が前記隔壁の前記開口部と対向するようにして前記載置台上に載置された前記運搬容器を、前記隔壁に押し当てる運搬容器押し当て手段と、
前記運搬容器の上部側から前記凹部に対して挿入され、前記運搬容器を前記隔壁に押し当てる運搬容器保持手段と、
を有し、
前記運搬容器保持手段が前記運搬容器を前記隔壁に押し当てる力の大きさは、前記運搬容器押し当て手段が、前記運搬容器を前記隔壁に押し当てる力の大きさ以下である
基板処理装置。 - 前記運搬容器保持手段は、
ローラー部と、
前記ローラー部と接続された板状体とを有し、
前記板状体は弾性体を含む請求項1に記載の基板処理装置。 - 前記運搬容器保持手段は、
ローラー部と、
前記ローラー部と接続された板状体とを有し、
前記ローラー部は弾性体を含む請求項1に記載の基板処理装置。 - 前記運搬容器保持手段を前記凹部に挿入する際、
前記凹部を構成する壁面のうち前記隔壁側の壁面に対して、前記運搬容器保持手段が斜めになるように挿入する請求項1乃至3いずれか一項に記載の基板処理装置。 - 複数の被処理体を収納することができ、前記被処理体を出し入れするための取り出し口と、前記取り出し口が設けられた面側の上部に形成されたフランジと、前記フランジの上面に形成された凹部と、を有する運搬容器を載置する載置台が設けられた搬入領域と、
前記搬入領域とは別の雰囲気に維持された移載領域と、
前記搬入領域と、前記移載領域とを仕切り、開口部が設けられた隔壁と、
前記開口部を開閉する扉と、を備え、
前記運搬容器の前記取り出し口が前記隔壁の前記開口部と対向するようにして、前記運搬容器を前記載置台上に載置し、運搬容器押し当て手段により前記運搬容器を前記隔壁に押し当て、前記扉を開いて前記運搬容器内の被処理体を前記移載領域に搬送して前記被処理体を処理する基板処理装置の基板処理方法において、
前記運搬容器を前記隔壁に押し当てた際、前記運搬容器の上部側から前記凹部に対して運搬容器保持手段を挿入し、前記運搬容器を前記隔壁に押し当てる工程を有し、
前記運搬容器保持手段が前記運搬容器を前記隔壁に押し当てる力の大きさは、前記運搬容器押し当て手段が、前記運搬容器を前記隔壁に押し当てる力の大きさ以下である
基板処理方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014033015A JP6204226B2 (ja) | 2014-02-24 | 2014-02-24 | 基板処理装置、基板処理方法 |
TW104105217A TWI606536B (zh) | 2014-02-24 | 2015-02-16 | 基板處理裝置及基板處理方法 |
US14/626,241 US9666464B2 (en) | 2014-02-24 | 2015-02-19 | Substrate processing apparatus and substrate processing method |
KR1020150025170A KR20150100533A (ko) | 2014-02-24 | 2015-02-23 | 기판 처리 장치, 기판 처리 방법 |
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JP2014033015A JP6204226B2 (ja) | 2014-02-24 | 2014-02-24 | 基板処理装置、基板処理方法 |
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JP2015159185A JP2015159185A (ja) | 2015-09-03 |
JP6204226B2 true JP6204226B2 (ja) | 2017-09-27 |
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Country Status (4)
Country | Link |
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US (1) | US9666464B2 (ja) |
JP (1) | JP6204226B2 (ja) |
KR (1) | KR20150100533A (ja) |
TW (1) | TWI606536B (ja) |
Families Citing this family (4)
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TWI839967B (zh) | 2015-08-04 | 2024-04-21 | 日商昕芙旎雅股份有限公司 | 門開閉系統及具備門開閉系統之載入埠 |
TWI727562B (zh) * | 2015-08-04 | 2021-05-11 | 日商昕芙旎雅股份有限公司 | 裝載埠 |
JP6939335B2 (ja) * | 2017-09-27 | 2021-09-22 | Tdk株式会社 | ロードポート装置、ロードポート装置の駆動方法 |
US10403514B1 (en) * | 2018-04-12 | 2019-09-03 | Asm Ip Holding B.V. | Substrate transporting system, storage medium and substrate transporting method |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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US5451131A (en) * | 1992-06-19 | 1995-09-19 | International Business Machines Corporation | Dockable interface airlock between process enclosure and interprocess transfer container |
SG47226A1 (en) * | 1996-07-12 | 1998-03-20 | Motorola Inc | Method and apparatus for transporting and using a semiconductor substrate carrier |
US6393716B1 (en) * | 2000-04-20 | 2002-05-28 | Ritek Display Technology Co. | Method and apparatus for transporting substrates in OLED process |
JP4328123B2 (ja) * | 2002-04-12 | 2009-09-09 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
KR100922051B1 (ko) * | 2002-04-12 | 2009-10-19 | 도쿄엘렉트론가부시키가이샤 | 반도체 처리 장치에 있어서의 포트 구조 |
JP2005311306A (ja) * | 2004-03-25 | 2005-11-04 | Tokyo Electron Ltd | 縦型熱処理装置及び被処理体移載方法 |
FR2874744B1 (fr) * | 2004-08-30 | 2006-11-24 | Cit Alcatel | Interface sous vide entre une boite de mini-environnement et un equipement |
JP2008060513A (ja) * | 2006-09-04 | 2008-03-13 | Tokyo Electron Ltd | 処理装置及び処理方法 |
US8190277B2 (en) * | 2007-11-30 | 2012-05-29 | Tokyo Electron Limited | Method for limiting expansion of earthquake damage and system for limiting expansion of earthquake damage for use in semiconductor manufacturing apparatus |
US8528947B2 (en) * | 2008-09-08 | 2013-09-10 | Tdk Corporation | Closed container and lid opening/closing system therefor |
JP4748816B2 (ja) * | 2008-11-28 | 2011-08-17 | Tdk株式会社 | 密閉容器の蓋開閉システム |
-
2014
- 2014-02-24 JP JP2014033015A patent/JP6204226B2/ja active Active
-
2015
- 2015-02-16 TW TW104105217A patent/TWI606536B/zh active
- 2015-02-19 US US14/626,241 patent/US9666464B2/en active Active
- 2015-02-23 KR KR1020150025170A patent/KR20150100533A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
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US20150243540A1 (en) | 2015-08-27 |
TWI606536B (zh) | 2017-11-21 |
JP2015159185A (ja) | 2015-09-03 |
US9666464B2 (en) | 2017-05-30 |
KR20150100533A (ko) | 2015-09-02 |
TW201543597A (zh) | 2015-11-16 |
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