JP6297240B1 - Electronic circuit unit, imaging unit and endoscope - Google Patents

Abstract

Provided are an electronic circuit unit, an imaging unit, and an endoscope that can be easily connected while being shortened and can prevent a short circuit or the like. The electronic circuit unit according to the present invention includes a composite cable 40 composed of a plurality of cables 41, a circuit board 20 electrically connected to the cables 41, and a diameter of the core wire 42 of the cable 41 at a position corresponding to the arrangement position of the cables 41. A through hole 31 having a smaller diameter is formed, and the relay board 30 is arranged between the composite cable 40 and the circuit board 20, and the cable 41 is relayed via the solder 50 supplied to the through hole 31. The circuit board 20 and the cable 41 are electrically connected while being end-face connected to the board 30.

Description

  The present invention relates to an electronic circuit unit, an imaging unit, and an endoscope.

  2. Description of the Related Art Conventionally, endoscopes that are inserted into a subject to observe a region to be examined are known and widely used in the medical field and the like. This endoscope is configured by incorporating an imaging unit including an electronic circuit unit in which an electronic component such as an imaging element is mounted at the distal end of a flexible elongated insertion tool. The distal end portion of the insertion portion is desired to be reduced in diameter and shortened in order to reduce the burden on the subject.

  A solid-state imaging device such as a CCD is disposed at the distal end portion of the insertion portion of the endoscope, and image data captured by the CCD is photoelectrically converted into an electric signal and transmitted to an information processing device through a signal cable. For signal transmission between the CCD and the information processing device, multiple cables are connected to the circuit board connected to the CCD in order to supply drive power to the CCD, transmit video signals, or transmit clock signals. (For example, refer to Patent Document 1).

JP 2006-94955 A

  In Patent Document 1, the overall covering of the end portion of the composite cable is removed, the outer sheaths of the plurality of cables are removed, and the core wire is connected to the connection electrode formed at the end portion of the circuit board. Therefore, it has been a hindrance to shortening the hard part of the endoscope. In addition, it takes time to align the cable having a small diameter, and there is a high possibility that a short circuit or the like may occur due to a reduction in the arrangement interval of the connection lands according to the miniaturization of the circuit board.

  The present invention has been made in view of the above, and provides an electronic circuit unit, an imaging unit, and an endoscope that can be easily connected while being shortened and can prevent a short circuit or the like. The purpose is to do.

  In order to solve the above-described problems and achieve the object, an electronic circuit unit according to the present invention includes a composite cable having a plurality of cables, a circuit board electrically connected to the composite cable, and the cable. A plurality of through holes each having a diameter smaller than the diameter of the conductor portion of the cable at a position corresponding to the arrangement position, and a relay board positioned between the composite cable and the circuit board. The cable is end-connected to the relay board via the solder supplied to the through hole, and the circuit board is electrically connected to the plurality of cables via the solder supplied to the through hole. It is characterized by.

  In the electronic circuit unit according to the present invention, in the above invention, the circuit board has a connection land formed at a position corresponding to the position of the through hole, and a surface to which the composite cable of the relay board is connected. It is connected to the surface which opposes.

  In the electronic circuit unit according to the present invention, in the above invention, the relay board is a flexible printed circuit board, and the plurality of cables are connected to one region bent from the center of the flexible printed circuit board, The connection land of the circuit board is connected to the region.

  In the electronic circuit unit according to the present invention, in the above invention, the composite cable has a plurality of cables at least partially different in diameter, and the diameter of the through hole is arranged at a corresponding position. It is the size according to the diameter of the conductor part of a cable.

  In the electronic circuit unit according to the present invention, in the above invention, the composite cable includes a plurality of cables at least partially different in diameter, and the diameter of the through hole is uniform, and the conductor portion of the cable The number of through-holes corresponding to the diameter of each is arranged.

  In the electronic circuit unit according to the present invention, in the above invention, the composite cable includes a coaxial cable, and the through hole has a diameter smaller than a diameter of a core wire of the coaxial cable, and serves as a shield for the coaxial cable. It is also characterized by being formed at corresponding positions.

  The electronic circuit unit according to the present invention includes a flexible printed board connecting the relay board and the circuit board in the above invention, wherein the plurality of cables and the circuit board are bent from a center. One area of the printed circuit board is connected to the relay board, and the other area is electrically connected by being connected to the connection land of the circuit board.

  An image pickup unit according to the present invention includes the electronic circuit unit according to any one of the above, and a semiconductor package having an image pickup element on a front surface and a sensor electrode formed on a back surface, The connection electrode provided on the surface side of the semiconductor package and the sensor electrode of the semiconductor package are connected via a bonding member, and the electronic circuit unit is located in the projection plane in the optical axis direction of the semiconductor package. It is characterized by that.

  In addition, an endoscope according to the present invention is characterized in that the imaging unit described above includes an insertion portion provided at a distal end.

  According to the present invention, the cable is end-face connected to the relay board via the solder supplied to the through hole of the relay board and electrically connected to the connection land of the circuit board. The length of the part can be shortened. In addition, it is easy to align the cables at the time of connection, and even if the arrangement interval of the connection lands is shortened, occurrence of a short circuit or the like can be reduced.

FIG. 1 is a diagram schematically illustrating the overall configuration of the endoscope system according to the first embodiment of the present invention. FIG. 2 is a side view of the imaging unit arranged at the distal end portion of the endoscope shown in FIG. FIG. 3 is a diagram for explaining the connection between the composite cable and the relay board. FIG. 4 is a diagram illustrating a manufacturing process of the imaging unit shown in FIG. FIG. 5 is a diagram illustrating a manufacturing process of the imaging unit shown in FIG. FIG. 6 is a diagram for explaining the connection between the composite cable and the relay board according to the first modification of the first embodiment of the present invention. FIG. 7 is a diagram for explaining the connection between the composite cable and the relay board according to the second modification of the first embodiment of the present invention. FIG. 8 is a side view of the imaging unit according to the second embodiment of the present invention. FIG. 9 is a side view of the imaging unit according to the third embodiment of the present invention.

  In the following description, an endoscope system including an imaging unit will be described as a mode for carrying out the present invention (hereinafter referred to as “embodiment”). Moreover, this invention is not limited by this embodiment. Furthermore, the same code | symbol is attached | subjected to the same part in description of drawing. Furthermore, the drawings are schematic, and it should be noted that the relationship between the thickness and width of each member, the ratio of each member, and the like are different from the actual ones. Moreover, the part from which a mutual dimension and ratio differ also in between drawings.

(Embodiment 1)
FIG. 1 is a diagram schematically illustrating the overall configuration of the endoscope system according to the first embodiment of the present invention. As shown in FIG. 1, an endoscope system 1 according to the present embodiment is introduced into a subject, an endoscope 2 that images the inside of the subject and generates an image signal in the subject, An information processing device 3 that performs predetermined image processing on an image signal captured by the endoscope 2 and controls each part of the endoscope system 1, a light source device 4 that generates illumination light of the endoscope 2, and information processing And a display device 5 that displays an image of an image signal after image processing by the device 3.

  The endoscope 2 includes an insertion unit 6 to be inserted into a subject, an operation unit 7 on the proximal end side of the insertion unit 6 and held by an operator, and a flexible universal extending from the operation unit 7. Code 8 is provided.

  The insertion portion 6 is realized using an illumination fiber (light guide cable), an electric cable, an optical fiber, and the like. The insertion portion 6 has a distal end portion 6a in which an imaging unit to be described later is incorporated, a bendable bending portion 6b constituted by a plurality of bending pieces, and a flexibility provided on the proximal end side of the bending portion 6b. Flexible tube portion 6c. The distal end portion 6a includes an illumination unit that illuminates the inside of the subject via an illumination lens, an observation unit that images the inside of the subject, an opening that communicates with the treatment instrument channel, and an air / water supply nozzle (not shown). Is provided.

  The operation unit 7 includes a bending knob 7a that bends the bending portion 6b in the vertical direction and the left-right direction, a treatment instrument insertion portion 7b in which a treatment instrument such as a biological forceps and a laser knife is inserted into the body cavity of the subject, and an information processing device 3. A plurality of switch units 7c for operating peripheral devices such as the light source device 4, the air supply device, the water supply device, and the gas supply device. The treatment instrument inserted from the treatment instrument insertion portion 7b is exposed from the opening at the distal end of the insertion portion 6 through a treatment instrument channel provided therein.

  The universal cord 8 is configured using an illumination fiber, a cable, or the like. The universal cord 8 is branched at the base end, one end of the branch is the connector 8a, and the other base end is the connector 8b. The connector 8a is detachable from the connector of the information processing apparatus 3. The connector 8b is detachable from the light source device 4. The universal cord 8 propagates the illumination light emitted from the light source device 4 to the distal end portion 6a via the connector 8b and the illumination fiber. Further, the universal code 8 transmits an image signal picked up by an image pickup unit described later to the information processing apparatus 3 via a cable and a connector 8a.

  The information processing device 3 performs predetermined image processing on the image signal output from the connector 8a and controls the entire endoscope system 1.

  The light source device 4 is configured using a light source that emits light, a condensing lens, and the like. The light source device 4 emits light from the light source under the control of the information processing device 3, and illuminates the inside of the subject, which is the subject, to the endoscope 2 connected via the connector 8b and the illumination fiber of the universal cord 8. Supply as light.

  The display device 5 is configured using a display or the like using liquid crystal or organic EL (Electro Luminescence). The display device 5 displays various types of information including images that have been subjected to predetermined image processing by the information processing device 3 via the video cable 5a. Thereby, the surgeon can observe and characterize a desired position in the subject by operating the endoscope 2 while viewing the image (in-vivo image) displayed on the display device 5.

  Next, the imaging unit used in the endoscope system 1 will be described in detail. FIG. 2 is a side view of the imaging unit arranged at the distal end portion of the endoscope shown in FIG. 3A and 3B are diagrams for explaining the connection between the composite cable and the relay board. FIG. 3A shows the end face of the composite cable 40 on the tip side, FIG. 3B shows the f5 face side of the relay board 30, and FIG. (C) is the figure seen from the f5 surface side of the relay board | substrate 30 in the state which accumulated the composite cable 40. FIG.

  The image pickup unit 100 has an image pickup device, and the semiconductor package 10 having the sensor electrode 13 formed on the f2 surface as the back surface, the connection electrode 21 on the f3 surface as the front surface, and the connection land 22 on the f4 surface as the back surface, respectively. A circuit board 20 that is formed and electrically and mechanically connected to the sensor electrode 13 of the semiconductor package 10 and the relay board 30 having a plurality of through holes 31 penetrating in the optical axis direction; A composite cable 40 composed of a plurality of cables 41.

  The semiconductor package 10 has a structure in which a glass 12 is attached to the image sensor 11. The light condensed by the lens unit is incident on the light receiving surface of the image pickup device 11 including the light receiving unit via the f1 surface which is the surface of the glass 12. A sensor electrode 13 and a joining member 14 made of a solder ball or the like are formed on the f2 surface (back surface) of the image sensor 11. In addition to the solder balls, the bonding member 14 may be a metal core solder ball, a resin core solder ball, an Au bump, or the like. The semiconductor package 10 is a CSP (Chip Size Package) in which an image pickup device chip in a wafer state is subjected to wiring, electrode formation, resin sealing, and dicing, and finally the size of the image pickup device chip becomes the size of the semiconductor package. ) Is preferable.

  The circuit board 20 is formed in a plate shape by laminating a plurality of substrates on which wiring is formed (a plurality of substrates parallel to the f3 surface and the f4 surface are laminated). As the substrate to be laminated, a ceramic substrate, a glass epoxy substrate, a flexible printed substrate, a glass substrate, a silicon substrate, or the like is used. A plurality of vias are formed in the circuit board 20 to conduct the wiring on the stacked boards. A connection electrode 21 is formed on the f3 surface of the circuit board 20, and is electrically and mechanically connected to the sensor electrode 13 of the semiconductor package 10 via the bonding member 14. The connection portion between the connection electrode 21 on the f3 surface and the sensor electrode 13 on the f2 surface may be sealed with a sealing resin.

  In the composite cable 40, a plurality of cables 41 are covered with an overall coating 44, and the end portion connected to the relay substrate 30 is partially removed from the overall coating 44 and the outer sheath 43 of the cable 41, thereby forming a core wire 42. Is exposed. The exposed end surface f7 of the core wire 42 is connected to the end surface f6, which is the back surface of the relay substrate 30 described later, via the solder 50.

  As the relay substrate 30, a ceramic substrate, glass epoxy substrate, glass substrate, silicon substrate, or the like is used. In the relay substrate 30, a through hole 31 having a diameter r <b> 2 smaller than the diameter r <b> 3 of the core wire 42 is formed at a position corresponding to the arrangement position of the core wire 42 of the cable 41 fixed by the total covering 44 of the composite cable 40. The positions where the through holes 31 are arranged overlap with each other in the projection plane of the core wire 42 in the optical axis direction, or most of them, for example, if they overlap at 60% or more of the cross-sectional area of the through holes 31, There may be. When connecting the relay substrate 30 and the plurality of cables 41, the relay substrate 30 is preferably made of a transparent material, for example, a glass substrate, from the viewpoint of being able to be visually aligned from the f5 surface side of the relay substrate 30. When an opaque material is used as the material of the relay substrate 30, a through hole may be formed in the relay substrate 30 in addition to the through hole 31 used for connection, and alignment may be performed via the through hole. . The periphery of the connection portion between the relay substrate 30 and the cable 41 is sealed with a sealing resin 60.

  The connection land 22 on the f4 surface of the circuit board 20 is formed at a position corresponding to the arrangement position of the through hole 31 and is connected to the solder 50 in the through hole 31 through the solder 51. The connection land 22 of the circuit board 20 is electrically connected to the cable 41 through the solder 51 and the solder 50 that connects the inside of the through hole 31 and the core wire 42 to the end face of the relay board 30. The periphery of the connection portion between the circuit board 20 and the relay board 30 is sealed with a sealing resin 60.

  In the imaging unit 100, the circuit board 20, the relay board 30, and the composite cable 40 are sized to fit within the projection plane of the semiconductor package 10 in the optical axis direction.

  Next, a method for manufacturing the imaging unit 100 will be described with reference to the drawings. 4 and 5 are diagrams illustrating a manufacturing process of the imaging unit 100 shown in FIG.

  First, a through hole 31 is formed at a predetermined position of the relay substrate 30 (FIG. 4A), and the through hole 31 is filled with solder 50 (FIG. 4B). After filling the through hole 31 with the solder 50, the solder 50 is further placed on the through hole 31 on the f6 surface of the relay substrate 30 to which the cable 41 is connected (FIG. 4C).

  After aligning the exposed core wire 42 of the cable 41 with the solder 50 on the through hole 31, the end surface f7 of the core wire 42 is pressed onto the solder 50 placed in a convex shape on the through hole 31 (FIG. 4D). ), The molten solder 50 is supplied from the f5 surface side of the relay substrate 30 to melt the solder 50 in the through hole 31 and on the through hole 31, and suck the molten solder 50 onto the core wire 42 (FIG. 4). (E)).

  After the solder 50 is cooled, the solder 50 on the f5 surface side of the relay substrate 30 is removed (FIG. 5A), and then the solder 51 is placed on the through hole 31 on the f5 surface of the relay substrate 30 to which the circuit board 20 is connected. It mounts and the periphery of the connection part of the relay board | substrate 30 and the cable 41 is sealed with the sealing resin 60 (FIG.5 (b)).

  The connection land 22 of the circuit board 20 is aligned with and brought into contact with the solder 51 on the through hole 31 and then heated to melt the solder 51, so that the circuit board 20 is connected to the relay board 30 and the solder via the solders 50 and 51. It connects with the cable 41 and the periphery of the connection part of the circuit board 20 and the relay board | substrate 30 is sealed with the sealing resin 60 (FIG.5 (c)).

  In the imaging unit 100 according to the first embodiment, the through hole 31 of the relay substrate 30 functions as a supply portion of the solder 50 that is a connection member and an alignment marker. Further, the diameter r2 of the through hole 31 is made smaller than the diameter r3 of the core wire 42, and the end surface f7 of the core wire 42 is end-connected to the f6 surface of the relay board 30. Since the through hole 31 is formed at a position corresponding to the arrangement position of the core wire 42 of the cable 41, it is not necessary to remove the total covering 44 and rearrange the cable 41 (core wire 42). Further, the core wire 42 of the cable 41 only needs to be positioned so that most of the cross-sectional area of the core wire 42 overlaps with the through hole 31, and it is not necessary to align the core wire 42 with the through hole 31. Connection work becomes easy. Furthermore, since the solder 50 to be melted is supplied and the solder 50 is sucked onto the core wire 42, sufficient connection strength between the relay substrate 30 and the cable 41 can be ensured.

  In the imaging unit 100, connection is performed in two steps, that is, connection between the cable 41 and the relay board 30 and connection between the relay board 30 and the circuit board 20. When the core wire 42 of the cable 41 is directly connected to the connection land 22 of the circuit board 20, it is necessary to use a large amount of solder 50 and connect it by heating for a long time. 1, the connection between the relay board 30 and the circuit board 20 can be made by using a small amount of solder 51 and heating in a short time, so that the occurrence of a short circuit can be suppressed. Further, the influence of heat on the semiconductor package 10 can be reduced. Furthermore, since the core wire 42 is connected to the end face, the rigid length of the imaging unit 100 can be shortened, and the circuit board 20, the relay board 30, and the composite cable 40 can fit within the projection plane in the optical axis direction of the semiconductor package 10. Therefore, the diameter of the imaging unit 100 can be reduced.

  In the first embodiment, the composite cable 40 is composed of the same type of cable 41, but a composite cable composed of cables having different diameters can also be used. 6A and 6B are diagrams for explaining the connection between the composite cable 40A and the relay board 30A according to the first modification of the first embodiment. FIG. 6A is an end surface of the composite cable 40A on the distal end side, and FIG. ) Is the f5 surface side of the relay substrate 30A, and FIG. 6C is a view as seen from the f5 surface side of the relay substrate 30A in a state where the composite cable 40A is overlapped.

  The composite cable 40A includes a cable 41a having a medium diameter, a large diameter cable 41b, and a small diameter cable 41c. The relay board 30A has a diameter of the core wire 42b at a position corresponding to the arrangement position of the through hole 31a having a diameter smaller than the diameter of the core wire 42a and the arrangement position of the core wire 42b of the cable 41b at a position corresponding to the arrangement position of the core wire 42a of the cable 41a. A through hole 31c having a diameter smaller than the diameter of the core wire 42c is formed at a position corresponding to the arrangement position of the core wire 42c of the through hole 31b having a smaller diameter and the cable 41c.

  In the imaging unit according to the first modification, the through holes 31a, 31b, and 31c of the relay substrate 30A function as a supply portion of the solder 50 that is a connecting member and an alignment marker, and the diameters of the through holes 31a, 31b, and 31c are set. The end surfaces f7 of the core wires 42a, 42b, 42c are connected to the end surface f6 of the relay board 30A by reducing the diameter of the core wires 42a, 42b, 42c. Since the through holes 31a, 31b, and 31c are formed at positions corresponding to the arrangement positions of the core wires 42a, 42b, and 42c, it is not necessary to rearrange the cables 41a, 41b, and 41c. Further, the core wires 42a, 42b, 42c of the cables 41a, 41b, 41c may be positioned so that most of the cross-sectional areas of the core wires 42a, 42b, 42c overlap with the through holes 31a, 31b, 31c, respectively. Since it is not necessary to align the positions 31a, 31b, and 31c so as to completely coincide with each other, connection work is facilitated. Furthermore, since the solder 50 to be melted is supplied and the solder 50 is sucked onto the core wires 42a, 42b, 42c, sufficient connection strength between the relay board 30A and the cables 41a, 41b, 41c can be ensured.

  In the first modification, as in the first embodiment, the connection is performed in two steps, that is, the connection between the cables 41a, 41b, and 41c and the relay board 30A and the connection between the relay board 30A and the circuit board 20; 30A and circuit board 20 can be connected by using a small amount of solder 51 and can be connected by heating in a short time, so that the occurrence of a short circuit can be suppressed. Further, the influence of heat on the semiconductor package 10 can be reduced. Further, since the core wires 42a, 42b, and 42c are connected to the end faces, the rigid length of the imaging unit can be shortened, and the circuit board 20, the relay board 30A, and the composite cable 40A are projected in the optical axis direction of the semiconductor package 10. Since the size is within the plane, the imaging unit can be reduced in diameter.

  In the first modification, the diameters of the through holes 31a, 31b, and 31c are changed so as to correspond to the diameters of the cables 41a, 41b, and 41c. If the through holes are provided, all the through holes may be the same through hole. FIG. 7 is a diagram for explaining the connection between the composite cable 40B and the relay board 30B according to the second modification of the first embodiment. FIG. 7A is an end surface of the composite cable 40B on the distal end side, and FIG. ) Is the f5 surface side of the relay substrate 30B, and FIG. 7C is a view as seen from the f5 surface side of the relay substrate 30B with the composite cable 40B being overlapped.

  The composite cable 40B includes a single wire cable 41d, a coaxial cable 45, and aggregate cables 60A and 60B. The collective cable 60A includes single-wire cables 41e and 41f and a coaxial cable 45A, and the collective cable 60B includes a single-wire cable 41g and a coaxial cable 45B. The coaxial cable 45 includes a core wire 46, an internal insulator 47 that covers the outer periphery of the core wire 46, a shield 48 that covers the outer periphery of the internal insulator 47, and an external insulator 49 that covers the outer periphery of the shield 48. . At the end of the coaxial cable 45 on the connection side of the relay board 30B, the overall coating 44 and the external insulator 49 are partially removed, and the shield 48 is exposed. Further, the internal insulator 47 between the exposed shield 48 and the core wire 46 is removed by a laser or the like.

  The relay board 30B has a through-hole 31B having a smaller diameter than the core wire 46a of the coaxial cable 45A having the smallest diameter among the core wires of the single-wire cables 41d, 41e, 41f, 41g and the coaxial cables 45, 45A, 45B in the composite cable 40B. It is formed at a position corresponding to the arrangement position of the single wire cables 41d, 41e, 41f, 41g and the coaxial cables 45, 45a, 45b. In the second modification, by forming the four through holes 31B at the arrangement position of the large-diameter core wire 42d, a large amount of molten solder 50 is supplied around the core wire 42d, and the connection strength is improved. A through hole 31B is also formed at a position corresponding to the arrangement position of the shields 48, 48a, 48b.

  The arrangement positions of the core wires 42d, 42e, 42f, 46, 46a, 46b of the single-wire cables 41d, 41e, 41f, 41g and the coaxial cables 45, 45A, 45B, and the shields 47, 47a, 47b of the coaxial cables 45, 45A, 45B Solder 50 is melted from the through hole 31B formed at a position corresponding to the arrangement position, and the core wires 42d, 42e, 42f, 46 of the single wire cables 41d, 41e, 41f, 41g and the coaxial cables 45, 45A, 45B, The shields 47, 47a, 47b of 46a, 46b and the coaxial cables 45, 45A, 45B are end-connected to the f6 surface of the relay board 30B.

  Since the through hole 31B is formed at a position corresponding to the arrangement position of the core wires 42d, 42e, 42f, 46, 46a, 46b and the shields 47, 47a, 47b, the single wire cables 41d, 41e, 41f and the coaxial cable 45 are formed. , 45A, 45B need not be rearranged. Further, in order to supply the solder 50 to be melted and suck the solder 50 onto the core wires 42d, 42e, 42f, 46, 46a, 46b, and the shields 47, 47a, 47b, the relay substrate 30B and the single wire cables 41d, 41e, Sufficient connection strength with 41f and the coaxial cables 45, 45A, 45B can be ensured.

  In the second modification, as in the first embodiment, the connection of the single-wire cables 41d, 41e, 41f, 41g and the coaxial cables 45, 45A, 45B to the relay board 30B, and the connection between the relay board 30B and the circuit board 20 are performed. Since the connection is performed in two steps, the relay substrate 30B and the circuit substrate 20 can be connected by using a small amount of solder 51 and heating in a short time, so that the occurrence of a short circuit can be suppressed. Further, the influence of heat on the semiconductor package 10 can be reduced. Furthermore, since the core wires 42d, 42e, 42f, 46, 46A, 46B and the shields 47, 47A, 47B are connected to the end faces, the rigid length of the imaging unit can be shortened, and the circuit board 20, the relay board 30B, and Since the composite cable 40B has a size that fits within the projection plane of the semiconductor package 10 in the optical axis direction, the imaging unit can be reduced in diameter.

(Embodiment 2)
FIG. 8 is a side view of the imaging unit according to the second embodiment of the present invention. An imaging unit 100D according to the second embodiment includes a semiconductor package 10 (not shown in FIG. 8), a circuit board 20, a relay board 30, a composite cable 40 including a plurality of cables 41, a circuit board 20, and a relay board. 30 and a flexible printed circuit board 70 disposed between them.

  A flexible printed circuit board 70 (hereinafter referred to as “FPC board 70”) includes an insulating base 71, a wiring pattern 72, a first connection pad connected to the connection land 22 of the circuit board 20 via a bonding member 53. 73 and a second connection pad 74 connected to the cable 41 via the solder 52 and the relay substrate 30. The FPC board 70 is bent from the center so that the wiring surface is outside. The first connection pads 73 and the second connection pads 74 are arranged at positions corresponding to the arrangement positions of the connection lands 22 of the circuit board 20 and the through holes 31 of the relay board 30.

  In the imaging unit 100D, as in the first embodiment, the diameter of the through hole 31 is made smaller than the diameter of the core wire 42, and the end face f7 of the core wire 42 is connected to the f6 face of the relay substrate 30 at the end face. Since the through hole 31 is formed at a position corresponding to the arrangement position of the core wire 42, there is no need to rearrange the cable 41. Further, the core wire 42 of the cable 41 only needs to be positioned so that most of the cross-sectional area of the core wire 42 overlaps with the through hole 31, and it is not necessary to align the core wire 42 with the through hole 31. Connection work becomes easy. Furthermore, since the solder 50 to be melted is supplied and the solder 50 is sucked onto the core wire 42, sufficient connection strength between the relay substrate 30 and the cable 41 can be ensured.

  Further, since the circuit board 20 and the FPC board 70 can be connected by using a small amount of the bonding member 53 and can be connected by heating in a short time, the occurrence of a short circuit can be suppressed and the influence of heat on the semiconductor package 10 can be reduced. can do. Furthermore, since the core wire 42 is connected to the end face, the rigid length of the imaging unit 100D can be shortened, and the circuit board 20, the relay board 30, the composite cable 40, and the FPC board 70 are projected in the optical axis direction of the semiconductor package 10. Since the size is within the plane, the imaging unit 100D can be reduced in diameter.

(Embodiment 3)
FIG. 9 is a side view of the imaging unit according to the third embodiment of the present invention. The imaging unit 100E according to the third embodiment includes a semiconductor package 10 (not shown in FIG. 9), a circuit board 20, a composite cable 40 including a plurality of cables 41, a flexible printed board 70E that functions as a relay board, Is provided.

  The FPC board 70E is formed by laminating a wiring pattern 72 and a second connection pad 74 with an insulating base material 71, and is connected to the connection land 22 of the circuit board 20 via the connection member 53. 73 and a through hole 75 for supplying the solder 50 is formed. The FPC board 70E is bent from the center so that the first connection pads 73 are outside. The diameter of the through hole 75 is smaller than the diameter of the core wire 42 of the cable 41. The first connection pads 73 and the through holes 75 (second connection pads 74) are arranged at positions corresponding to the arrangement positions of the connection lands 22 and the cables 41 of the circuit board 20.

  As in the first embodiment, the connection between the FPC board 70E and the cable 41 is filled with the solder 50 in the through hole 75 of the FPC board 70E, and further soldered on the through hole 75 of the FPC board 70E connecting the cable 41. 50 is placed, the end face f7 of the core wire 42 is pressed onto the solder 50 placed in a convex shape on the through hole 75, and the solder 50 melted from the back side of the FPC board 70E is supplied. The solder 50 in 75 and the through-hole 75 is melted, and the melted solder 50 is sucked onto the core wire 42 and connected.

  The connection land 22 of the circuit board 20 and the first connection pad 73 of the FPC board 70E are connected by the connection member 53.

  In the imaging unit 100E, as in the first embodiment, the diameter of the through hole 75 is made smaller than the diameter of the core wire 42, and the end surface f7 of the core wire 42 is connected to the FPC board 70E. Since the through hole 75 is formed at a position corresponding to the arrangement position of the core wire 42, there is no need to rearrange the cable 41. Further, the core wire 42 of the cable 41 only needs to be positioned so that most of the cross-sectional area of the core wire 42 overlaps with the through hole 75, and it is not necessary to align the core wire 42 with the through hole 75. Connection work becomes easy. Furthermore, since the solder 50 to be melted is supplied and the solder 50 is sucked onto the core wire 42, sufficient connection strength between the FPC board 70E and the cable 41 can be ensured.

  In addition, since the circuit board 20 and the FPC board 70E can be connected by using a small amount of the connection member 53 and heating in a short time, the occurrence of a short circuit can be suppressed and the influence of heat on the semiconductor package 10 can be reduced. can do. Further, since the core wire 42 is connected to the end face, the rigid length of the imaging unit 100E can be shortened, and the circuit board 20, the composite cable 40, and the FPC board 70E are within the projection plane in the optical axis direction of the semiconductor package 10. Due to the size, it is possible to reduce the diameter of the imaging unit 100E.

  INDUSTRIAL APPLICABILITY The electronic circuit unit, imaging unit, and endoscope of the present invention are useful for an endoscope system that requires a high-quality image and a reduction in the diameter and shortening of the tip.

DESCRIPTION OF SYMBOLS 1 Endoscope system 2 Endoscope 3 Information processing apparatus 4 Light source apparatus 5 Display apparatus 6 Insertion part 6a Tip part 6b Bending part 6c Flexible tube part 7 Operation part 7a Bending knob 7b Treatment tool insertion part 7c Switch part 8 Universal code 8a, 8b Connector 10 Semiconductor package 11 Imaging element 12 Glass 13 Sensor electrode 14, 53 Bonding member 20 Circuit board 21 Connection electrode 22 Connection land 30 Relay board 31 Through hole 40 Composite cable 41 Cable 42 Core wire 43 Outer sheath 44 Total coating 50, 51 Solder 60 Sealing resin 100 Imaging unit

Claims (8)

A composite cable having a plurality of cables;
A circuit board electrically connected to the composite cable;
A plurality of through holes each having a diameter smaller than the diameter of the conductor portion of the cable is formed at a position corresponding to the arrangement position of the cable, and a relay board positioned between the composite cable and the circuit board,
With
The plurality of cables are end-connected to the relay substrate via solder supplied to the through holes,
The circuit board is electrically connected to the plurality of cables via solder supplied to the through hole ,
The composite cable has a plurality of cables at least partially different in diameter,
The diameter of the through-hole is a size according to the diameter of the conductor portion of the cable arranged at a corresponding position . A composite cable having a plurality of cables;
  A circuit board electrically connected to the composite cable;
  A plurality of through holes each having a diameter smaller than the diameter of the conductor portion of the cable is formed at a position corresponding to the arrangement position of the cable, and a relay board positioned between the composite cable and the circuit board,
  With
  The plurality of cables are end-connected to the relay substrate via solder supplied to the through holes,
  The circuit board is electrically connected to the plurality of cables via solder supplied to the through hole,
  The composite cable has a plurality of cables at least partially different in diameter,
  The diameter of the said through-hole is uniform, The number of through-holes corresponding to the diameter of the conductor part of the said cable are arrange | positioned, The electronic circuit unit characterized by the above-mentioned. The circuit board has a connection land formed at a position corresponding to the position of the through hole, and is connected to a surface of the relay substrate facing a surface to which the composite cable is connected. Item 3. The electronic circuit unit according to Item 1 or 2 . The relay board is a flexible printed circuit board, the plurality of cables are connected to one area bent from the center of the flexible printed circuit board, and the connection land of the circuit board is connected to the other area. electronic circuit unit according to claim 1 or 2, characterized in that. The composite cable includes a coaxial cable,
3. The electronic circuit unit according to claim 1, wherein the through hole has a diameter smaller than a diameter of a core wire of the coaxial cable and is also formed at a position corresponding to a shield of the coaxial cable. . A flexible printed circuit board connecting the relay board and the circuit board;
The plurality of cables and the circuit board are electrically connected by connecting one area of the flexible printed board bent from the center to the relay board and connecting the other area to the connection land of the circuit board. electronic circuit unit according to claim 1 or 2, characterized in that it is connected. The electronic circuit unit according to claim 1 or 2 ,
A semiconductor package having an image sensor on the front surface and a sensor electrode formed on the back surface;
With
The connection electrode provided on the surface side of the circuit board and the sensor electrode of the semiconductor package are connected via a bonding member,
The image pickup unit, wherein the electronic circuit unit is located in a projection plane in the optical axis direction of the semiconductor package. An endoscope, wherein the imaging unit according to claim 7 includes an insertion portion provided at a distal end.

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