JP6288120B2 - Method for manufacturing resin-molded mold and resin molded part of electronic component - Google Patents

Description

  The present invention relates to a resin-sealed mold and a method for manufacturing a resin molded portion of an electronic component using the resin-sealed mold.

  2. Description of the Related Art Generally, a resin sealing device for manufacturing a resin molded part of an electronic component by resin-sealing an electronic component (for example, a discrete semiconductor element that is a single function element) mounted on a lead frame by transfer molding Are known. When manufacturing a resin molding part of an electronic component using a resin sealing device, first, the lead frame is clamped by an upper mold and a lower mold that constitute the resin sealing mold. Next, after filling the cavity formed between the upper mold and the lower mold with a molten resin, holding and curing the resin around the electronic components positioned in the cavity of the lead frame An intermediate product having a resin molded part is created. After the resin sealing step, the resin burrs formed on the surface of the intermediate product are removed using a deburring machine, and a product (for example, a semiconductor device) is obtained through processing of the lead frame and the like.

  FIG. 14 shows the intermediate product 300 after the step of resin-sealing an electronic component mounted on the lead frame 301 and before the step of processing the lead frame 301. In the intermediate product 300, a plurality of outer leads 303 of the lead frame 301 protrude from the resin molded portion 302 of the electronic component. The plurality of outer leads 303 are connected to each other by tie bars 305 provided between the frames 304 and 304 in order to prevent deformation thereof. The tie bar 305 is cut in the process of processing the lead frame 301. In the resin sealing process, the molten resin also flows into the region 306 formed by the cavity (part of the resin molding portion 302), the outer lead 303, and the tie bar 305, and a resin burr is formed in the region 306.

  As described above, the resin burrs are removed by the deburring machine. However, if a thick resin burr is formed in the region 306 of FIG. 14, it is difficult to remove it with a deburring machine. Therefore, conventionally, by providing a dam block protruding so as to fill the region 306 on the surface of the upper mold or the lower mold of the resin-sealed mold, the inflow of the molten resin into the region 306 is suppressed. Thereby, the resin burr | flash formed in the area | region 306 becomes thin to such an extent that it can be removed with a deburring machine.

  Conventionally, when the molten resin is injected into the cavity of the resin-sealed mold, the air in the cavity is compressed to prevent the injection of the molten resin, or the air is taken into the molten resin and the product resin. There was a problem that voids occurred in the molded part. In order to solve this problem, the resin-sealed mold has a groove (referred to as an air vent) communicating from the cavity to the outside of the mold so that air in the cavity is easily discharged to the outside when molten resin is injected. ) (For example, FIG. 9 of Patent Document 1). Further, FIG. 1 of Patent Document 1 describes that an air vent is provided in the lead frame itself.

JP 2002-1000064 A

  However, when an air vent is provided in the resin-sealed mold, when the molten resin is injected into the cavity of the resin-sealed mold, the molten resin flows into the air vent along with the air discharged from the cavity, and enters the air vent. A resin burr will be formed. If a thick resin burr is formed in the air vent communicating with the cavity, it is difficult to deburr using a deburring machine. In order to solve this problem, it is conceivable to narrow the air vent. However, in this case, it becomes difficult for air to be discharged from the cavity when the molten resin is injected, and further, when the resin-sealed mold is used repeatedly, the resin adhered in the air vent accumulates and closes the air vent. It is possible.

  As described in FIG. 1 of Patent Document 1, the problem of accumulation of the resin adhered in the air vent is considered to be solved by providing an air vent in the lead frame itself and removing the resin adhered in the air vent together with the product. However, this configuration has a new problem that the degree of freedom of the shape of the lead frame is limited.

  The first problem of the present invention is to make it possible to effectively discharge air from a cavity into which molten resin is injected and to make it easy to remove burrs from an intermediate product using a deburring machine. It is to provide a possible resin-sealed mold.

  A second problem of the present invention is a resin that can effectively discharge air from a cavity into which a molten resin is injected and make it easy to remove burrs from an intermediate product using a deburring machine. An object of the present invention is to provide a method for accurately manufacturing a resin molded portion of an electronic component mounted on a lead frame using a sealing mold.

In the first aspect of the present invention,
A first mold and a second mold;
Between the first main surface of the first mold and the second main surface of the second mold facing the first main surface, a mounting portion on which an electronic component is mounted and the other non-mounting portion In a cavity formed by clamping a non-mounting portion of a lead frame having a first cavity portion provided on the first main surface and a second cavity portion provided on the second main surface A resin-sealing mold for resin-sealing a mounting portion of the lead frame to be disposed,
When the lead frame is clamped along the opening edge of the first cavity portion, the first main surface of the first mold contacts the main surface of the lead frame on the second mold side. A dam block arranged so as not to touch,
The second main surface of the second mold is provided with an air vent that is separated from the second cavity portion and communicates with the outside of the second mold,
The height dimension of the dam block from the first main surface is smaller than the thickness dimension of the lead frame,
The air vent is provided at a position facing a predetermined portion of the non-mounting portion of the lead frame when the first die and the second die are overlapped,
The dam block has a first block that connects the air vent and the first cavity part in plan view,
The air vent has an overlap portion that overlaps the first block of the dam block when the first mold and the second mold are overlapped,
The overlap portion has a gap formed between the dam block and the second die when the first die and the second die are overlapped with each other so that a non-mounting portion of the lead frame is formed. have a dimension such as to communicate with the front side to the air vent predetermined portion of,
The height dimension of the gap formed between the dam block and the second mold is smaller than the depth dimension of the air vent,
The first block of the dam block has a rectangular shape composed of a long side that overlaps with the overlap portion of the air vent in a plan view and a short side that extends perpendicularly to the long side, and the opening edge of the first cavity portion Provided in a substantially U-shape in plan view formed by cutting out a part of the part side,
A resin-sealed mold is provided.

In the second aspect of the present invention,
A method for producing a resin molded part of an electronic component using the resin-sealed mold according to the first aspect ,
Placing the lead frame mounting portion in the cavity;
Clamping a non-mounting portion of the lead frame between the first main surface of the first mold and the second main surface of the second mold;
Injecting a resin into the cavity.
A method is provided.
In one embodiment according to the second aspect of the invention,
The height dimension of the dam block from the first main surface is such that when the non-mounting portion is compressed and thinned by a clamping force in the step of clamping the non-mounting portion of the lead frame, The size is such that the second mold does not contact.

In one embodiment according to the second aspect of the invention, the method comprises:
After the step of resin-sealing the mounting portion of the lead frame, the method further includes a step of removing a resin burr formed in a gap between the dam block of the first mold and the second mold with a deburring machine. .

  In the first aspect of the present invention, the dam block of the first mold is disposed so as not to contact the main surface of the lead frame on the second mold side when the lead frame is clamped, and Since the height dimension of the dam block from the first main surface is smaller than the thickness dimension of the lead frame, the first main surface of the first mold and the second main surface of the second mold are When the lead frame is clamped in between, a gap is formed between the dam block of the first mold and the second mold.

  The dam block and the air vent partially overlap. Therefore, according to the first aspect of the present invention, the cavity and the air vent communicate with each other when the lead frame is clamped due to the presence of the gap, so when the molten resin is injected into the cavity, Air in the cavity is effectively discharged from the air vent to the outside of the mold through the gap. In addition, since the height dimension of the dam block from the first main surface is smaller than the thickness dimension of the lead frame, it is formed in the gap portion as compared with the case where an air vent communicating with the cavity is provided. As a result, the resin burrs become thinner, which makes it possible to deburr the intermediate products accurately with a deburring machine.

Further, according to the first aspect, in the configuration in which the non-mounting portion of the lead frame is disposed in the first mold so as to face the air vent provided in the second mold, the dam block includes the Since the air vent partially overlaps, the gap formed between the dam block and the second mold communicates with the air vent. As a result, the exhaust path communicating from the cavity to the outside of the mold is not obstructed by the non-mounting portion of the lead frame, and the air in the cavity can be reliably discharged through the air vent.

  According to the second aspect of the present invention, as in the first aspect, the air in the cavity is effectively discharged from the air vent to the outside of the mold through the gap, and is also intermediated by a deburring machine. It is possible to deburr the product accurately. In this way, the resin molded part of the electronic component mounted on the lead frame mounting part can be accurately manufactured.

  Further, according to one embodiment of the second aspect, compared to a case where an air vent communicating with the cavity is provided, the gap is formed between the dam block of the first mold and the second mold. A thin resin burr is easily and reliably removed by a deburring machine.

It is a figure which shows the resin sealing apparatus provided with the resin sealing metal mold | die which concerns on embodiment of this invention. It is a perspective view which shows a part of resin sealing metal mold | die which concerns on embodiment of this invention. It is a perspective view which shows a part of lower cavity block. It is a top view which shows a part of lower cavity block. It is a perspective view which shows a part of lower cavity block in the state by which the lead frame is arrange | positioned. It is a top view which shows a part of lower cavity block in the state by which the lead frame is arrange | positioned. FIG. 7 is a perspective sectional view taken along line AA in FIG. 6. It is sectional drawing along the AA line of FIG. It is a flowchart which shows the manufacturing method of the resin molding part using the resin sealing metal mold | die which concerns on embodiment of this invention. It is a top view which shows the intermediate product after a resin sealing process and before a deburring process. It is a top view which shows the intermediate product after a deburring process and before a lead processing process. It is a perspective sectional view which followed the BB line of FIG. It is sectional drawing corresponding to FIG. 8 which shows the resin sealing metal mold | die of a comparative example. It is a top view for demonstrating a prior art.

  Hereinafter, a resin-sealed mold according to an embodiment of the present invention will be specifically described with reference to the drawings. In the following description, terms indicating a specific direction (such as “up” and “down”) are used as necessary, but these are used to facilitate understanding of the present invention and are within the scope of the present invention. Should not be used to limit

(Resin sealing device 100)
As shown in FIG. 1, the resin sealing device 100 is a resin molding of electronic parts by sealing the electronic parts mounted on the lead frame 40 (see FIGS. 5 to 8) by transfer molding. This is an apparatus for manufacturing the part 50 (package part, see FIGS. 10 to 12). The electronic component is, for example, a discrete semiconductor element that is a single function element.

  The resin sealing device 100 includes a base 10, a lower fixed platen 11 fixed on the base 10, four tie bars 12 fixed at corners of the lower fixed platen 11, and an upper end portion of the tie bar 12. The upper fixed platen 13 fixed to the lower platen 11, the lower fixed platen 11 and the upper fixed platen 13 are attached to the side of the base 10 via the tie bar 12 and the movable platen 14 provided to be movable up and down. Servo motor 15.

  The movable platen 14 moves up and down by the operation of a toggle mechanism 16 provided between the movable platen 14 and the lower fixed platen 11. The toggle mechanism 16 has a ball screw 17 and a crank 18. The lower end side of the ball screw 17 is rotatably supported by the lower fixed platen 11, and a pulley 17a is attached to the lower end portion thereof. A timing belt 19 is stretched between a pulley 17a of the ball screw 17 and a pulley 15a attached to the rotation shaft of the servo motor 15. Therefore, the rotation of the servo motor 15 is transmitted to the ball screw 17 via the timing belt 19. The ball screw 17 is provided with a nut 17b, and the nut 17b moves up and down as the ball screw 17 rotates. Then, the crank 18 bends and stretches in conjunction with the vertical movement of the nut 17b, whereby the movable platen 14 moves up and down.

(Resin sealing mold 1)
The resin sealing mold 1 is provided between the upper fixed platen 13 and the movable platen 14. The resin sealing mold 1 includes a lower mold 2 and an upper mold 3 for clamping the lead frame 40. The lower mold 2 includes a lower mold base 4 fixed on the movable platen 14 and a lower chess 20 provided in the lower mold base 4. The upper mold 3 includes an upper mold base 5 fixed under the upper fixed platen 13 and an upper chess 30 provided in the upper mold base 5.

  The lower chess 20 and the upper chess 30 of the resin-sealed mold 1 are shown in FIG. In FIG. 2, a schematic structure of the lower chess 20 and the upper chess 30 is shown. However, an ejector plate having ejector pins (extrusion pins) for extruding a product from a mold and taking it out is omitted. Hereinafter, in this specification, the X direction shown in FIG. 2 and the like will be referred to as a vertical direction, the Y direction as a horizontal direction, and the Z direction as a height direction. In the present specification, “upper” and “lower” indicating directions indicate the + Z direction and the −Z direction in the drawing, respectively.

(Lower chess 20)
As shown in FIG. 2, the lower chess 20 includes a housing 21, a pot block 22, and a lower cavity block 23. The pot block 22 and the lower cavity block 23 each have a rectangular parallelepiped shape, and both are provided in the housing 21. Two lower cavity blocks 23 are provided sandwiching the pot block 22 in the horizontal direction (Y direction). The upper surface of the pot block 22 is located slightly above the upper surface of the lower cavity block 23, so that a step is formed between the upper surface of the pot block 22 and the upper surface of the lower cavity block 23.

  The pot block 22 has a pot 24 that is a through hole into which a solid resin such as a tablet resin is charged. The pot 24 is circular in plan view. In the pot 24, a plunger (not shown) for pressurizing the solid resin and injecting it into a cavity 60 described later is provided. The plunger presses the solid resin against the cull portion 34 of the upper chess 30 and melts it while applying pressure. Note that a heater for heating and melting the solid resin may be provided in the pot block 22.

  As shown in FIG. 3, the lower cavity block 23 has a pair of lower cavities 25, 25 provided side by side in the vertical direction (X direction). The lower cavity 25 has a shape that tapers downward from the upper surface 23a of the lower cavity block 23 (see FIG. 8 and the like). The lower cavity 25 forms (defines) a cavity 60 in cooperation with the upper cavity 35 in the upper cavity block 33 described later when the lower chess 20 and the upper chess 30 are overlapped. A runner 26 is provided between the pair of lower cavities 25 as a groove extending in the lateral direction (Y direction) from the lower cavity block 23 toward the pot block 22. However, the runner 26 is not in communication with the pot 24.

  In FIG. 2, only one pot 24 is provided in the pot block 22 for easy viewing of the figure, but a plurality of pots 24 may be provided. When a plurality of pots 24 are provided, the lower cavity block 23 is also provided with the number of lower cavities 25 corresponding to the number of pots 24.

  The upper surface 23 a of the lower cavity block 23 is a main surface that clamps the lead frame 40 in cooperation with the lower surface 33 a of the upper cavity block 33. As shown in FIGS. 3 and 4, a dam block 27 is provided on the upper surface 23 a of the lower cavity block 23 along the opening edge of the lower cavity 25. The dam block 27 protrudes upward (+ Z direction) from the upper surface 23 a of the lower cavity block 23.

  The height dimension of the dam block 27 from the upper surface 23 a of the lower cavity block 23 is slightly smaller than the thickness of the lead frame 40. Specifically, as shown in FIG. 8, when the lead frame 40 is clamped by the lower chess 20 and the upper chess 30 and the lead frame 40 is compressed by the clamping force, the dam block 27 is still thin. The upper surface 27c of the dam block 27a and the lower surface 33a of the upper cavity block 33 are not in contact with each other.

  The shape of the dam block 27 is changed according to the shape of the lead frame 40. In the present embodiment, the dam block 27 has a first block 27a and a second block 27b that are separated from each other. The first block 27a is provided on the opposite side of the runner 26 with respect to the lower cavity 25, and has a substantially U shape (or a substantially U shape) in plan view. The pair of L-shaped second blocks 27 b and 27 b separated in the lateral direction (Y direction) is provided between the lower cavity 25 and the runner 26. Thus, the dam block 27 is disposed so as not to contact the upper surface 40a (the main surface on the upper mold 2 side) of the lead frame 40 when the lead frame 40 is clamped.

  A gate 28 that connects the lower cavity 25 and the runner 26 is provided between the pair of L-shaped second blocks 27b and 27b. The gate 28 is formed by notching the lower cavity 25 between the pair of L-shaped portions 27b and 27b, and has two opposing side walls and an inclined bottom surface.

(Upper chess 30)
As shown in FIG. 2, the upper chess 30 includes a housing 31, a cull block 32, and an upper cavity block 33. The cull block 32 and the upper cavity block 33 each have a rectangular parallelepiped shape and are both provided in the housing 31. Two upper cavity blocks 33 are provided in the lateral direction (Y direction) so as to sandwich the cull block 32 therebetween.

  The cull block 32 is provided with a cull portion 34 that is a concave portion for temporarily storing the molten resin supplied from the pot 24 of the lower chess 20. The cull portion 34 has a circular main portion 34a in plan view, and projecting portions 34b and 34b enlarged in the lateral direction (Y direction) with the main portion 34a interposed therebetween. When the lower chess 20 and the upper chess 30 are overlapped, the main portion 32 a of the cull portion 34 is overlapped with the pot 24, and the protruding portion 34 b of the cull portion 34 is overlapped with the runner 26. Thereby, the runner 26, the gate 28, and the cavity 60 are communicated from the pot 24 of the lower chess 20 through the cull portion 34, and a flow path of the molten resin is formed.

  The upper cavity block 33 has a pair of upper cavities 35 provided side by side in the vertical direction (X direction). The upper cavity 35 has a shape that tapers upward from the lower surface 33a of the upper cavity block 33 (see FIG. 8 and the like). As described above, the upper cavity 35 forms the cavity 60 in cooperation with the lower cavity 25 provided in the lower cavity block 23 when the lower chess 20 and the upper chess 30 are overlapped.

  FIG. 8 is a cross-sectional view taken along the line AA in FIG. FIG. 8 shows a cross section of the lower cavity block 23 and a cross section of the upper cavity block 33 in a state where the lead frame 40 is clamped by the lower chess 20 and the upper chess 30. The lower surface 33a of the upper cavity block 33 is a main surface that faces the upper surface 23a of the lower cavity block 23 and clamps the lead frame 40 in cooperation with the upper surface 23a.

  An air vent 36, which is a groove communicating with the outside of the upper chess 30, is provided on the lower surface 33 a of the upper cavity block 33. The air vent 36 is separated from the upper cavity 35 and extends in the vertical direction (X direction). Further, the air vent 36 has an overlap portion 36a that partially overlaps the dam block 27a of the lower chess 20 at the end portion in the vertical direction (X direction).

  In the present embodiment, as described above, when the height dimension of the dam block 27 from the upper surface 23a of the lower cavity block 23 is such that the lead frame 40 is clamped by the lower chess 20 and the upper chess 30, the lead frame 40 The dam block 27 and the upper cavity block 33 do not come into contact with each other even if they are compressed and thinned by the clamping force. For this reason, when the lead frame 40 is clamped, a gap 70 is formed between the upper surface 27 c of the dam block 27 a and the lower surface 33 a of the upper cavity block 33. Of course, the gap 70 is formed even when the lower mold 2 and the upper mold 3 are closed before the lead frame 40 is clamped. The upper cavity 35 and the air vent 36 that are separated from each other communicate with each other through the gap 70. The height dimension of the gap 70 is sufficiently smaller than the depth dimension of the air vent 36. However, as will be described later, the gap 70 secures a part of the exhaust function of the air vent 36 by connecting the cavity 60 and the air vent 36. For this reason, it is preferable that the gap 70 has a width (flow area) that does not hinder the exhaust from the cavity 60.

  When a plurality of pots 24 are provided in the lower chess 20, the upper chess 30 may be provided with a number of cull portions 34 and upper cavities 35 corresponding to the number of pots 24.

(Lead frame 40)
The resin-sealed mold 1 according to this embodiment can correspond to a lead frame having an arbitrary shape, but here, the shape of an exemplary lead frame 40 described in the drawings will be described. As shown in FIGS. 5 to 7, the lead frame 40 includes mounting portions 41 and 42 on which electronic parts (not shown) are mounted, and other non-mounting portions 34. The mounting portions 41 and 42 are configured with an interval in the width direction (Y direction). The electronic component is mounted across the two mounting portions 41 and 42. The non-mounting portion 43 refers to a portion of the lead frame 40 excluding the mounting portions 41 and 42. As shown in FIGS. 7 and 8, the upper surface 40a of the lead frame 40 is located higher than the upper surface 27c of the dam block 27a.

(Manufacturing method of the resin molding part 50 of an electronic component)
FIG. 9 shows a method for manufacturing the resin molded part 50 of the electronic component using the resin-sealed mold 1 according to the embodiment of the present invention. The method of manufacturing the resin molded portion 50 includes a step (S1) of preparing a lead frame 40 in which electronic parts are mounted on the mounting portions 41 and 42, and a step of preparing the lead frame 40 prepared in step S1 on the lower cavity block 23. (See FIG. 5 to FIG. 8). The lead frame 40 is positioned by a pilot pin (not shown), the dam block 27, and a step between the pot block 22 and the lower cavity block 23. Thereby, when the lead frame 40 is clamped by the lower chess 20 and the upper chess 30, the mounting portions 41 and 42 are disposed in the cavity 60.

  Furthermore, the method for manufacturing the resin molded portion 50 includes a step (S3) of clamping the non-mounting portion 43 of the lead frame 40 with the lower chess 20 and the upper chess 30 (see FIG. 8). The clamping step S3 is performed by moving the movable platen 14 shown in FIG. 1 upward. As a result, the lead frame 40 is clamped between the upper surface 23 a of the lower cavity block 23 and the lower surface 33 a of the upper cavity block 33. At this time, in the clamped state, a gap 70 is formed between the upper surface 27c of the dam block 27a of the lower cavity block 23 and the lower surface 33a of the upper cavity block 33, that is, the lower chess 20 and the upper chess 30. Does not touch. As a result, the clamping force applied to the lead frame 40 is not directly applied to the resin-sealed mold 1 itself, and damage to the mold 1 is prevented.

  Further, the method for manufacturing the resin molded portion 50 includes a step (S4) of injecting a molten resin into the cavity 60 and curing the resin to seal the mounting portions 41 and 42 of the lead frame 40 (see FIG. 10). The molten resin is injected into the cavity 60 by raising the plunger provided in the pot 24. The molten resin flows from the pot 24 of the lower chess 20 through the cull portion 34 to the runner 26, the gate 28, and the cavity 60.

  At this time, the cavity 60 and the air vent 36 are connected via a gap 70 formed between the upper surface 27 c of the dam block 27 a and the lower surface 33 a of the upper cavity block 33. For this reason, the air in the cavity 60 is effectively discharged from the air vent 36 to the outside of the mold through the gap 70. In particular, since the air vent 36 is provided with an overlap portion 36 a that partially overlaps the dam block 27 a, the gap 70 communicates with the air vent 36 on the front side of the non-mounting portion 43 of the lead frame 40. As a result, the exhaust path communicating from the cavity 60 to the outside of the mold is not obstructed by the non-mounting portion 43, and the air in the cavity 60 is reliably discharged.

  The molten resin filled in the cavity 60 is cured to form the resin molded portion 50. Also, the molten resin flows into the gap 70, the flow path of the molten resin, and the air vent 36 along with the air discharged from the cavity 60, and hardens to form resin burrs 51, 52, and 53, respectively.

  Furthermore, the manufacturing method of the resin molding part 50 includes the process (S5) which removes the resin burr | flash from an intermediate product, for example using a pneumatic type and a hydraulic type deburring machine (refer FIG. 11, FIG. 12). Accordingly, the thin resin burr 51 formed in the gap 70 between the upper surface 27c of the dam blocks 27a and 27b and the lower surface 33a of the upper cavity block 33 is removed. On the other hand, the thick resin burrs 52 and 53 formed in the flow path of the molten resin formed by the runner 26 and the air vent 36 remain.

  Furthermore, the manufacturing method of the resin molding part 50 includes the process (S6) which processes the lead frame 40 (refer FIG. 11). The lead frame 40 is cut along a two-dot chain line shown in FIG. 11 by using a cutting machine such as a blade or a punch. As a result, an electronic component including the resin molded portion 50 and the lead frames 41 and 42 is manufactured.

  Here, the resin-sealed mold of the comparative example is shown in FIG. The resin-sealed mold of the comparative example is different from the resin-sealed mold 1 according to the present embodiment only in the structure of the air vent provided in the upper cavity block 33, and the other structures are the same. Therefore, in FIG. 13, the same reference numerals as those in FIG. 8 are given except for the air vent 236.

  In the resin-sealed mold of the comparative example, an air vent 236 communicating with the upper cavity 35 is provided on the lower surface 33 a of the upper cavity block 33. When the manufacturing method of the resin molding part 50 is carried out using the resin-sealed mold of this comparative example, a thick resin is applied to the air vent 236 in the step (S4) of resin-sealing the mounting parts 41 and 42 of the lead frame 40. A burr is formed.

  In this case, in the step (S5) of removing the resin burrs from the intermediate product, it is difficult to remove the resin burrs formed on the air vent 236 using, for example, a pneumatic or hydraulic deburring machine. In the deburring step S5, only thin resin burrs that can be removed by the deburring machine are removed, and the thick resin burrs remaining in the air vent 236 are cut and removed in the step (S6) of processing the lead frame 40 at the subsequent stage. It is also possible. However, in the processing step S6, it is difficult to accurately remove the thick resin burr formed in the air vent 236 and around the resin molded portion 50 in every detail. Moreover, when it is going to cut | disconnect the thick hard resin burr | flash formed around the resin molding part 50 by processing process S6, there exists a possibility that the blade of a cutting machine may be damaged.

  On the other hand, when the resin-sealed mold 1 according to the present embodiment is used, the resin burr 51 formed in the gap 70 between the upper surface 27c of the dam block 27a of the lower cavity block 23 and the lower surface 33a of the upper cavity block 33 is thin. . For this reason, the resin burr | flash 51 can be correctly removed, for example using a pneumatic type and a hydraulic type deburring machine. The thick resin burrs 52 and 53 formed in the molten resin flow path formed by the runner 26 and the like and in the air vent 36 are not removed by the deburring machine, but the lead is processed in the step (S6) of processing the lead frame 40 at the subsequent stage. It is removed together with the non-mounting portion 43 of the frame 40.

  Thus, in this embodiment, the gap 70 between the upper surface 27c of the dam block 27a of the lower cavity block 23 and the lower surface 33a of the upper cavity block 33 is based on a novel idea of securing a part of the function of the air vent 36. Is. And the air of the cavity 60 in which molten resin is inject | poured from the clearance gap 70 is discharged | emitted effectively outside a metal mold | die. Thereby, generation | occurrence | production of the void in the resin molding part 50 is suppressed, and the resin burr | flash of the periphery of the resin molding part 50 can be removed correctly using a deburring machine.

  In the present embodiment, the resin burr (resin burr 51) around the resin molded portion 50 is removed in the deburring step S5. Therefore, when the lead frame 40 is cut along the cutting line shown in FIG. 11 in the processing step S6, the blade of the cutting machine is hard except for the portion of the resin burr 52 formed in the flow path of the molten resin. The resin is not cut. Thereby, damage to the blade of the cutting machine is suppressed.

(Modification)
As mentioned above, although this invention was demonstrated by embodiment, this invention is not limited to the said embodiment, A various improvement and design change are possible in the range which does not deviate from the summary of this invention.

  For example, in the embodiment, the example in which the dam block 27 is provided in the lower chess 20 and the air vent 36 is provided in the upper chess 30 has been described. However, the present invention is not limited to this, and conversely the upper chess 30 is provided. A dam block may be provided, and an air vent may be provided in the lower chess 20.

  Further, in the embodiment, in FIG. 8, the height dimension (Z dimension) of the gap 70 between the upper surface 27 c of the dam block 27 and the lower surface 33 a of the upper cavity block 33 of the lower cavity block 23 is the air vent 36 from the cavity 60 side. The example which is constant in the vertical direction (X direction) toward the side is illustrated. However, the present invention is not limited to this. For example, the height of the gap 70 may be inclined so as to gradually increase in the vertical direction (X direction) from the cavity 60 side toward the air vent 36 side. .

  In the embodiment, an example has been described in which one air vent 36 communicates with the gap 70 and extends straight in the vertical direction (X direction), but the present invention is not limited to this, and communicates with the gap 70. If so, it can be provided at an arbitrary position. Further, the air vent 36 does not have to be provided so as to extend straight, and may be bent in a plan view or branched according to the ease of molding. Further, a plurality of air vents 36 may be provided.

DESCRIPTION OF SYMBOLS 1 Resin sealing mold 2 Lower mold 20 Lower chess 22 Pot block 23 Lower cavity block 23a Upper surface of lower cavity block 24 Pot 25 Lower cavity 26 Runner 27 Dam block 27a Upper surface of dam block 28 Gate 3 Upper mold Mold 30 Upper chess 32 Cull block 33 Upper cavity block 33a Lower surface of upper cavity block 34 Cull part 35 Upper cavity 36 Air vent 36a Overlap part 40 Lead frame 41, 42 Mounting part 43 Non-mounting part 50 Resin molding part 60 Cavity 70 Gap 100 Resin sealing device

Claims (4)

A first mold and a second mold;
Between the first main surface of the first mold and the second main surface of the second mold facing the first main surface, a mounting portion on which an electronic component is mounted and the other non-mounting portion In a cavity formed by clamping a non-mounting portion of a lead frame having a first cavity portion provided on the first main surface and a second cavity portion provided on the second main surface A resin-sealing mold for resin-sealing a mounting portion of the lead frame to be disposed,
When the lead frame is clamped along the opening edge of the first cavity portion, the first main surface of the first mold contacts the main surface of the lead frame on the second mold side. A dam block arranged so as not to touch,
The second main surface of the second mold is provided with an air vent that is separated from the second cavity portion and communicates with the outside of the second mold,
The height dimension of the dam block from the first main surface is smaller than the thickness dimension of the lead frame,
The air vent is provided at a position facing a predetermined portion of the non-mounting portion of the lead frame when the first die and the second die are overlapped,
The dam block has a first block that connects the air vent and the first cavity part in plan view,
The air vent has an overlap portion that overlaps the first block of the dam block when the first mold and the second mold are overlapped,
The overlap portion has a gap formed between the dam block and the second die when the first die and the second die are overlapped with each other so that a non-mounting portion of the lead frame is formed. have a dimension such as to communicate with the front side to the air vent predetermined portion of,
The height dimension of the gap formed between the dam block and the second mold is smaller than the depth dimension of the air vent,
The first block of the dam block has a rectangular shape composed of a long side that overlaps with the overlap portion of the air vent in a plan view and a short side that extends perpendicularly to the long side, and the opening edge of the first cavity portion Provided in a substantially U-shape in plan view formed by cutting out a part of the part side,
Resin sealing mold. A method for producing a resin molded part of an electronic component using the resin-sealed mold according to claim 1 ,
Placing the lead frame mounting portion in the cavity;
Clamping a non-mounting portion of the lead frame between the first main surface of the first mold and the second main surface of the second mold;
Injecting a resin into the cavity.
Method. The height dimension of the dam block from the first main surface is such that when the non-mounting portion is compressed and thinned by a clamping force in the step of clamping the non-mounting portion of the lead frame, The second mold is not in contact with the mold,
The method of claim 2 . After the step of resin-sealing the mounting portion of the lead frame, the method further includes a step of removing a resin burr formed in a gap between the dam block of the first mold and the second mold with a deburring machine. ,
The method according to claim 2 or 3 .

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