JP6245606B2 - Work polishing equipment - Google Patents
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- JP6245606B2 JP6245606B2 JP2013266325A JP2013266325A JP6245606B2 JP 6245606 B2 JP6245606 B2 JP 6245606B2 JP 2013266325 A JP2013266325 A JP 2013266325A JP 2013266325 A JP2013266325 A JP 2013266325A JP 6245606 B2 JP6245606 B2 JP 6245606B2
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Description
本発明は、ウェーハ等のワークのワーク研磨装置に関する。 The present invention relates to a workpiece polishing apparatus for a workpiece such as a wafer.
半導体ウェーハ等のワークの研磨は、研磨布が貼付された定盤の該研磨布に研磨ヘッドによりワークを押接し、研磨布上にスラリー（研磨液）を供給しつつワークに対して定盤を相対移動させて行う。
このような研磨液を用いた研磨では、定盤の回転数は１００〜１５０ｒｐｍ、研磨荷重は２００〜３００ｇ／ｃｍ２程度が一般的である（例えば特許文献１）。
For polishing a workpiece such as a semiconductor wafer, the workpiece is pressed against the polishing cloth of the surface plate to which the polishing cloth is affixed by a polishing head, and the surface plate is applied to the workpiece while supplying slurry (polishing liquid) onto the polishing cloth. Perform relative movement.
In polishing using such a polishing liquid, the rotation speed of the surface plate is generally 100 to 150 rpm, and the polishing load is generally about 200 to 300 g / cm 2 (for example, Patent Document 1).
ところで、パワー半導体などの用途では、省エネルギー化を図るなどのため、半導体材料として、ＳｉＣやＧａＮが用いられるようになってきている。
しかしＳｉＣ、ＧａＮ、あるいはダイヤモンドは非常に高硬度の材料であることから、その研磨には長時間を要する。この研磨時間を短縮するためには、定盤の回転数を例えば１０００ｒｐｍなどと高くし、また、研磨荷重も例えば１００００ｇ／ｃｍ２（１０００ｋＰａ）などと大きくする必要がある。しかしながら、定盤を高速回転すると研磨液が飛散し、大半の研磨液が研磨に寄与せず、研磨液切れにより発熱が生じるという課題がある。また、研磨荷重を大きくした場合にも、当然ながら発熱が生じる。各所が発熱すると、ワークの焼き付きが発生したり、研磨布が変質したり、研磨ヘッドへ悪影響が及ぼされるなどの不具合が発生してしまう。
By the way, in applications such as power semiconductors, SiC and GaN have been used as semiconductor materials in order to save energy.
However, since SiC, GaN, or diamond is a very hard material, polishing takes a long time. In order to shorten the polishing time, it is necessary to increase the rotational speed of the surface plate, for example, 1000 rpm, and to increase the polishing load, for example, 10000 g / cm 2 (1000 kPa). However, when the surface plate is rotated at a high speed, the polishing liquid is scattered, and most of the polishing liquid does not contribute to the polishing, and there is a problem that heat is generated due to the polishing liquid running out. Also, when the polishing load is increased, naturally heat is generated. If each part generates heat, defects such as seizure of the workpiece, deterioration of the polishing cloth, and adverse effects on the polishing head may occur.
従来、各所の冷却機構としては、定盤に冷却水を供給する冷却機構が採用されている。また、供給される研磨液も冷却に寄与している。しかしながら、上記のような高速、高圧化による発熱を抑えるためには、定盤に冷却機構を設けるだけでは足りず、また研磨液による冷却を期待するとすれば、極めて大量の研磨液を用いる必要がある。しかしながら、大量の研磨液を用いると装置が大型化してしまうという課題がある。この大型化の要因としては、スラリー循環方式を採用する場合、スラリー循環水量を多くすると循環装置がかなり大掛かりな装置になってしまうことなどがある。
本発明は、上記課題を解決すべくなされ、その目的とするところは、装置を高速化、高圧化した場合でも発熱を抑えることができ、ＳｉＣ、ＧａＮやダイヤモンドなどの高硬度のワークであっても効率よく研磨することのできるワーク研磨装置を提供することにある。
Conventionally, a cooling mechanism for supplying cooling water to a surface plate has been adopted as a cooling mechanism at various places. Further, the supplied polishing liquid also contributes to cooling. However, in order to suppress the heat generation due to high speed and high pressure as described above, it is not sufficient to provide a cooling mechanism on the surface plate, and if cooling with a polishing liquid is expected, it is necessary to use a very large amount of polishing liquid. is there. However, when a large amount of polishing liquid is used, there is a problem that the apparatus becomes large. As a cause of the increase in size, when the slurry circulation system is adopted, if the amount of slurry circulation water is increased, the circulation device becomes a considerably large device.
The present invention has been made to solve the above-mentioned problems, and the object of the present invention is to suppress the generation of heat even when the apparatus is increased in speed and pressure, and is a high-hardness workpiece such as SiC, GaN or diamond. Is to provide a workpiece polishing apparatus capable of efficiently polishing.
上記目的を達成するため、本発明は次の構成を備える。
すなわち、本発明に係るワーク研磨装置は、上面に研磨布が貼られた定盤と、下面にワークを保持する研磨ヘッドと、を具備し、研磨ヘッドに保持されたワークを定盤の研磨布上に押圧し、研磨液を供給しつつ、定盤と研磨ヘッドとを相対的に移動させてワークの研磨を行うワーク研磨装置において、前記定盤外周部を囲んで設けられ、前記定盤から流出した研磨液が外方に飛散しない高さを有するバンクと、前記定盤が回転することによる遠心力によって、定盤外方に流出し、前記バンク内壁に這い上がった研磨液を前記定盤に戻す戻し流路とを有し、前記バンク内壁に沿って這い上がった研磨液の取り出し位置を所定の高さに設けることにより、大きさが所要の分布である研磨砥粒を含有する研磨液を前記定盤に戻すことを特徴とする。
In order to achieve the above object, the present invention comprises the following arrangement.
That is, the work polishing apparatus according to the present invention includes a surface plate having a polishing cloth affixed to the upper surface and a polishing head that holds the work on the lower surface, and the work held by the polishing head is a polishing cloth for the surface plate. In a workpiece polishing apparatus that polishes a workpiece by moving the surface plate and the polishing head relatively while pressing the upper surface and supplying a polishing liquid, the workpiece polishing device is provided so as to surround the outer surface of the surface plate. A bank having a height at which the flowing polishing liquid does not scatter outward, and the polishing liquid that has flowed out to the outside of the surface plate by the centrifugal force generated by the rotation of the surface plate and scooped up on the inner wall of the bank. A polishing liquid containing polishing abrasive grains having a predetermined distribution in size by providing a predetermined position for taking out the polishing liquid scooping up along the inner wall of the bank. Is returned to the surface plate .
前記バンクに、該バンク内壁を這い上がった研磨液を冷却する冷却装置を設けると好適である。
また研磨液が、前記戻し流路内を自然流下して前記定盤に戻されるようにするとよい。
前記戻し流路の一部もしくは全部をパイプで構成することができる。
前記パイプの取液口を断面矩形状とすることで、バンク内壁を這い上がった研磨液の取液を容易に行うことができる。
It is preferable that the bank is provided with a cooling device that cools the polishing liquid scooping up the inner wall of the bank.
Further, it is preferable that the polishing liquid flows down naturally in the return channel and returns to the surface plate.
A part or all of the return flow path can be constituted by a pipe.
By making the liquid intake port of the pipe have a rectangular cross section, it is possible to easily collect the polishing liquid scooping up the inner wall of the bank.
また、前記戻し流路を複数設けるようにすることができる。
前記複数の戻し流路の各戻し流路により、前記バンク内壁の異なる高さ位置の研磨液を前記定盤に戻すようにすることができる。
また、前記各戻し流路に該流路を開閉するバルブを設けるようにして、各流路から個別に研磨液を定盤に戻すようにすることができる。
また、前記バンク内壁にバンク内方に突出するリングを設けてもよい。
前記リングは、前記バンクの内壁を這い上がる研磨液が乗り越え可能な高さおよび形状に設けるようにし、前記リングで仕切られた上下の各ゾーンの研磨液を各戻し流路によって、前記定盤に戻すようにしてもよい。
また、前記複数の戻し流路として、大きな粒子の研磨砥粒が混入する研磨液を定盤の外周部に戻す戻し流路と、小さな粒子の研磨砥粒が混入する研磨液を定盤の中央部に戻す戻し流路とを設け、同一定盤上で異なる研磨を行うようにしてもよい。
Further, a plurality of the return flow paths can be provided.
The polishing liquid at different height positions on the inner wall of the bank can be returned to the surface plate by the return flow paths of the plurality of return flow paths.
Further, a valve for opening and closing the flow path may be provided in each return flow path so that the polishing liquid can be individually returned to the surface plate from each flow path.
Further, a ring protruding inward of the bank may be provided on the inner wall of the bank.
The ring is provided in such a height and shape that the polishing liquid climbing up the inner wall of the bank can get over, and the polishing liquid in each of the upper and lower zones partitioned by the ring is transferred to the surface plate by each return channel. You may make it return.
Further, as the plurality of return channels, a return channel for returning a polishing liquid mixed with large particles of abrasive grains to the outer peripheral portion of the surface plate, and a polishing liquid mixed with small particles of abrasive grains are arranged at the center of the platen A return flow path returning to the part may be provided, and different polishing may be performed on the same surface plate.
本発明によれば、定盤外周部を囲んでバンクを設け、定盤が回転することによる遠心力によって、定盤外方に流出し、バンク内壁に這い上がった研磨液を定盤に戻す戻し流路を設けたので、バンク内壁に這い上がって冷却された研磨液を循環して定盤に戻すことができ、装置を大型化することなく、装置を高速化、高圧化した場合でも発熱を抑えることができ、ＳｉＣ、ＧａＮやダイヤモンドなどの高硬度のワークであっても効率よく研磨することのできるワーク研磨装置を提供できる。 According to the present invention, a bank is provided so as to surround the outer periphery of the surface plate, and the polishing liquid that has flowed out of the surface plate and crawled up on the inner wall of the bank is returned to the surface plate by centrifugal force generated by the rotation of the surface plate. Since the flow path is provided, it is possible to circulate and cool the polishing liquid that has risen up to the inner wall of the bank and return it to the surface plate, and generate heat even when the device is increased in speed and pressure without increasing the size of the device. Therefore, it is possible to provide a workpiece polishing apparatus capable of efficiently polishing even a hard workpiece such as SiC, GaN, or diamond.
以下、本発明の好適な実施の形態について、添付図面に基づいて詳細に説明する。
図１は研磨装置１０の概略を示す説明図である。
図１において、１２は定盤であり、駆動機構により回転軸１４を中心に水平面内で回転する。定盤１２の上面には、例えば発泡ポリウレタンを主材とする研磨布１６が貼付されている。
１８は研磨ヘッドであり、その下面側に研磨すべきワーク（半導体ウェーハ等）２０が保持される。研磨ヘッド１８は回転軸２２を中心に回転される。また研磨ヘッド１８は、加圧シリンダ等の上下動機構により上下動可能となっている。
２４はスラリー供給ノズルであり、スラリー（研磨液）を研磨布１６上に供給するものである。
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an explanatory view showing an outline of the polishing apparatus 10.
In FIG. 1, reference numeral 12 denotes a surface plate, which is rotated within a horizontal plane around a rotation shaft 14 by a drive mechanism. On the upper surface of the surface plate 12, a polishing cloth 16 mainly made of foamed polyurethane is affixed.
Reference numeral 18 denotes a polishing head, and a work (semiconductor wafer or the like) 20 to be polished is held on the lower surface side thereof. The polishing head 18 is rotated about the rotation shaft 22. The polishing head 18 can be moved up and down by a vertical movement mechanism such as a pressure cylinder.
A slurry supply nozzle 24 supplies slurry (polishing liquid) onto the polishing pad 16.
図２は研磨装置１０の斜視図である。
図２において、２６は定盤駆動モータであり、定盤１２を水平面内で回転させる。定盤駆動モータ２６は基台２８上に配設されている。３０は加圧シリンダであり、研磨ヘッド１８を上下方向に移動可能であると共に、研磨ヘッド１８に保持されたワーク２０を定盤１２の研磨布１６上に所要荷重で押圧する。３２はヘッド駆動モータであり、研磨ヘッド１８を回転軸２２を中心に回転駆動する。加圧シリンダ３０およびヘッド駆動モータ３２は、基台２８に定盤１２を跨いで配置された門形の支持台３４上に配設されている。なお、３６は操作盤である。
FIG. 2 is a perspective view of the polishing apparatus 10.
In FIG. 2, 26 is a surface plate drive motor, and rotates the surface plate 12 within a horizontal surface. The surface plate drive motor 26 is disposed on a base 28. A pressure cylinder 30 can move the polishing head 18 in the vertical direction and presses the work 20 held by the polishing head 18 onto the polishing cloth 16 of the surface plate 12 with a required load. Reference numeral 32 denotes a head drive motor that drives the polishing head 18 to rotate about the rotation shaft 22. The pressure cylinder 30 and the head drive motor 32 are disposed on a gate-shaped support base 34 that is disposed on the base 28 across the surface plate 12. Reference numeral 36 denotes an operation panel.
定盤１２は、基台２８に水平面内で回転可能に配設され、上記のように、定盤駆動モータ２６により回転駆動される。定盤１２には、図示しないが空洞に冷却水を通流させる公知の冷却機構が設けられている。
本実施の形態では、定盤１２外周部を囲むようにしてバンク３８を設けている。バンク３８は、定盤１２から流失した研磨液がバンク３６の外方に飛散しない高さに形成されている。
The surface plate 12 is disposed on the base 28 so as to be rotatable in a horizontal plane, and is rotationally driven by the surface plate drive motor 26 as described above. Although not shown, the surface plate 12 is provided with a known cooling mechanism that allows cooling water to flow through the cavity.
In the present embodiment, the bank 38 is provided so as to surround the outer periphery of the surface plate 12. The bank 38 is formed at such a height that the polishing liquid that has flowed away from the surface plate 12 does not scatter to the outside of the bank 36.
図３は定盤１２とバンク３８の組立断面図である。
バンク３８は、上記の所要高さを有する円筒状に形成され、本実施の形態では、その下端において定盤１２の外周部に液密に固定して一体に設けられている。また、バンク３８の上縁にはフランジ４０が内方に向けて突出するようにして設けられ、研磨液のバンク３８外への飛散を防止している。
図示しないが、バンク３８にも冷却機構を設けると好適である。この冷却機構は、バンク３８に設けた空洞部（図示せず）に冷却水を通流する水冷機構が好適である。
なお、バンク３８は必ずしも円筒形状でなくともよい。また、バンク３８は定盤１２外周との間を液密にして、定盤１２とは別体に設けるようにしてもよい。
FIG. 3 is an assembly sectional view of the surface plate 12 and the bank 38.
The bank 38 is formed in a cylindrical shape having the required height described above. In the present embodiment, the bank 38 is liquid-tightly fixed to the outer peripheral portion of the surface plate 12 at the lower end thereof. Further, a flange 40 is provided on the upper edge of the bank 38 so as to protrude inward, thereby preventing the polishing liquid from being scattered outside the bank 38.
Although not shown, it is preferable to provide the bank 38 with a cooling mechanism. The cooling mechanism is preferably a water cooling mechanism that allows cooling water to flow through a cavity (not shown) provided in the bank 38.
Note that the bank 38 does not necessarily have a cylindrical shape. Further, the bank 38 may be provided in a liquid-tight manner between the outer periphery of the surface plate 12 and provided separately from the surface plate 12.
本実施の形態では、図４の概念説明図に示すように、定盤１２が回転することによる遠心力によって、定盤１２外方に流出し、バンク３８内壁に沿って這い上がった研磨液Ｑを定盤１２の略中央部に戻す戻し流路４２を設けたことを特徴としている。定盤１２を、例えば２００〜１０００ｒｐｍ程度で高速で回転することで、研磨液は定盤１２の外方に流出し、さらにバンク３８の内壁を這い上がる状態となる。
戻し流路４２は、断面円形あるいは矩形状のパイプ状のものとするのが好適である。あるいは戻し流路４２は樋状のものとすることもできる。
戻し流路４２は、支持台２８に支持部（図示せず）を介して吊持するようにするとよい。
In the present embodiment, as shown in the conceptual explanatory diagram of FIG. 4, the polishing liquid Q flows out of the surface plate 12 by the centrifugal force generated by the rotation of the surface plate 12 and scoops up along the inner wall of the bank 38. Is characterized in that a return channel 42 is provided to return to a substantially central portion of the surface plate 12. By rotating the surface plate 12 at a high speed of, for example, about 200 to 1000 rpm, the polishing liquid flows out to the outside of the surface plate 12 and further scoops up the inner wall of the bank 38.
The return channel 42 is preferably a pipe having a circular or rectangular cross section. Alternatively, the return channel 42 may be bowl-shaped.
The return channel 42 may be suspended from the support base 28 via a support portion (not shown).
戻し流路４２の、バンク３８内壁に接近する端部に、バンク３８内壁に沿って這い上がる研磨液を取り入れる取液口４４が設けられている。この取液口４４は、バンク３８の内壁上部から流下する研磨液を受けるロート状に設けることができる。
あるいは、戻し流路４２をパイプ状に形成し、取液口４４を、単にパイプの開口部としてもよい。この場合には、この開口したパイプの端部をバンク３８の内壁に沿わせるようにして、バンク３８内壁に沿って這い上がった研磨液が自然流入するようにするとよい。
A liquid intake port 44 is provided at the end of the return channel 42 that approaches the inner wall of the bank 38 and takes in the polishing liquid that crawls up along the inner wall of the bank 38. The liquid inlet 44 can be provided in a funnel shape for receiving the polishing liquid flowing down from the upper part of the inner wall of the bank 38.
Alternatively, the return flow path 42 may be formed in a pipe shape, and the liquid inlet 44 may be simply an opening of the pipe. In this case, it is preferable that the end of the opened pipe be along the inner wall of the bank 38 so that the polishing liquid scooped up along the inner wall of the bank 38 naturally flows.
戻し流路４２が断面矩形のパイプであれば、パイプの開口端（取液口）をバンク３８の内壁に沿わせることで、容易に研磨液をパイプ内に流入させることができる。
なお、取液口４４から取液された研磨液が、戻し流路４２を自重により自然流下して定盤１２の中央部に戻されるように、戻し流路は、取液口４４から定盤１２の中央部に向けて低くなるように傾斜して設けるようにするとよい。
If the return flow path 42 is a pipe having a rectangular cross section, the polishing liquid can be easily caused to flow into the pipe by having the open end (liquid intake port) of the pipe along the inner wall of the bank 38.
Note that the return flow path is provided from the liquid intake port 44 to the surface plate so that the polishing liquid collected from the liquid intake port 44 naturally flows down the return flow path 42 by its own weight and is returned to the center portion of the surface plate 12. It is good to provide it inclining so that it may become low toward the center part of 12.
上記のように、本実施の形態では、定盤１２外周部を囲んでバンク３８を設け、定盤１２が回転することによる遠心力によって、定盤１２外方に流出し、バンク３８内壁を這い上がった研磨液を定盤１２に戻す戻し流路４２を設けている。研磨液はバンク３８内壁を這い上がることによって冷却される。バンク３８に冷却機構を設ければ、研磨液をさらに好適に冷却できる。そして、バンク内壁を這い上がって冷却された研磨液が、戻し流路４２を通じて定盤１２のほぼ中央部に戻される。これにより、定盤を高速で回転しても研磨液の液切れを生じさせることがなく、発熱を抑えることができる。また、研磨ヘッドによりワークを高い圧力で研磨布に押圧しても、研磨液が液切れすることなく、定盤１２に供給されるので、発熱を抑えることができる。 As described above, in this embodiment, the bank 38 is provided so as to surround the outer periphery of the surface plate 12, and flows out of the surface plate 12 due to the centrifugal force generated by the rotation of the surface plate 12, and scoops the inner wall of the bank 38. A return channel 42 for returning the raised polishing liquid to the surface plate 12 is provided. The polishing liquid is cooled by scooping up the inner wall of the bank 38. If the bank 38 is provided with a cooling mechanism, the polishing liquid can be more suitably cooled. Then, the polishing liquid that has been scooped up and cooled on the inner wall of the bank is returned to the substantially central portion of the surface plate 12 through the return channel 42. Thereby, even if the surface plate is rotated at high speed, the polishing liquid does not run out, and heat generation can be suppressed. Further, even when the workpiece is pressed against the polishing cloth with a high pressure by the polishing head, the polishing liquid is supplied to the surface plate 12 without running out of the liquid, so that heat generation can be suppressed.
なお、研磨液は、あらかじめ所要量の研磨液を供給、滞留させておき、新たに外部から供給することなく、上記のように戻し流路４２により循環させて使用するようにすることができる。
あるいは、図１に示すスラリー供給ノズル２４から所要量ずつ研磨液を定盤１２上に供給しつつワークの研磨を行ってもよい。この場合にも、戻し流路４２により所要量の研磨液を定盤１２に戻しつつワークの研磨を行えるので、全体として、大量の研磨液を用いる必要がなく、したがって、装置の大型化を解消できる。このように、本実施の形態では、装置を大型化することなく、装置を高速化、高圧化した場合でも発熱を抑えることができ、ＳｉＣ、ＧａＮやダイヤモンドなどの高硬度のワークであっても効率よく研磨することができる。
It should be noted that the polishing liquid can be used by circulating and supplying the polishing liquid through the return channel 42 as described above without supplying a predetermined amount of the polishing liquid and retaining it in advance and supplying it from the outside.
Alternatively, the workpiece may be polished while supplying a required amount of polishing liquid onto the surface plate 12 from the slurry supply nozzle 24 shown in FIG. Also in this case, since the workpiece can be polished while returning the required amount of polishing liquid to the surface plate 12 by the return flow path 42, it is not necessary to use a large amount of polishing liquid as a whole, thus eliminating the increase in size of the apparatus. it can. As described above, in the present embodiment, heat generation can be suppressed even when the apparatus is increased in speed and pressure without increasing the size of the apparatus, and even a high-hardness workpiece such as SiC, GaN, or diamond can be used. It can be polished efficiently.
定盤１２の中央部に戻される研磨液を必要量確保するために、戻し流路４２を適宜複数設けるようにするとよい。この場合の各戻し流路４２の取液口４４は、バンク３８内壁の同一高さ位置（ただし、周方向に異なる位置）となるようにしてもよいし、異なる高さ位置となるようにしてもよい。
図５は、バンク３８内壁の異なる高さ位置に溝状の液溜まり４６、４６を設け、この液溜まり４６に取液口４４が臨むようにして各戻し流路（図示せず）を設けた例を示す。
In order to secure a necessary amount of polishing liquid to be returned to the center of the surface plate 12, a plurality of return channels 42 may be provided as appropriate. In this case, the liquid intake port 44 of each return channel 42 may be at the same height position on the inner wall of the bank 38 (however, at different positions in the circumferential direction), or at different height positions. Also good.
FIG. 5 shows an example in which groove-like liquid reservoirs 46 and 46 are provided at different height positions on the inner wall of the bank 38, and each return channel (not shown) is provided so that the liquid inlet 44 faces the liquid reservoir 46. Show.
なお、研磨液には、粒子状の研磨砥粒が含有されている。定盤１２が高速回転され、遠心力により定盤１２から外方に流出してバンク３８内壁を這い上がる際、研磨砥粒は、遠心力により、大きい粒子がバンク３８の内壁下部に、小さい粒子が内壁の上部に分級される傾向にある。
この場合に、各戻し流路に流路を独立に開閉できる電磁バルブ（図示せず）を設け、各戻し流路から別々に研磨液を定盤１２に戻すようにして、大きさの異なる研磨砥粒が混入する性質の異なる研磨液により、ワークの研磨を行うようにすることができる。
The polishing liquid contains particulate abrasive grains. When the surface plate 12 is rotated at a high speed and flows out of the surface plate 12 by centrifugal force and scoops up the inner wall of the bank 38, the abrasive particles are separated into small particles by the centrifugal force. Tends to be classified at the top of the inner wall.
In this case, each return flow path is provided with an electromagnetic valve (not shown) that can open and close the flow path independently, and the polishing liquid is returned to the surface plate 12 separately from each return flow path so that polishing of different sizes is performed. The workpiece can be polished with polishing liquids having different properties mixed with abrasive grains.
例えば、研磨初期の粗研磨のときには、バンク３８内壁の下部から取液した、大きな粒子の研磨砥粒が混入する研磨液を定盤１２の中央部に戻して、研磨効率を上げ、研磨終盤の仕上げ研磨のときには、バンク３８内壁の上部から取液した、小さな粒子の研磨砥粒が混入する研磨液を定盤１２の中央部に戻して、仕上げ研磨を行うようにすることができる。
あるいは、大きな粒子の研磨砥粒が混入する研磨液を定盤１２の外周部に戻す戻し流路を設け、小さな粒子の研磨砥粒が混入する研磨液を定盤１２の中央部に戻す戻し流路を設けることにより、同一定盤上で中央部の粗研磨と外周部の精密研磨（仕上げ研磨）を同時にできるようにしてもよい。なお、このときの定盤上の研磨布は、同一のものでもよいが、中央部と外周部で異なるものを貼付してもよい。
For example, at the time of rough polishing in the initial stage of polishing, the polishing liquid taken from the lower part of the inner wall of the bank 38 and mixed with large abrasive grains is returned to the center of the surface plate 12 to increase the polishing efficiency, At the time of final polishing, the final polishing can be performed by returning the polishing liquid, which is collected from the upper part of the inner wall of the bank 38, to which the abrasive grains of small particles are mixed and returned to the center of the surface plate 12.
Alternatively, a return flow path is provided for returning a polishing liquid mixed with large abrasive grains to the outer periphery of the surface plate 12, and a return flow for returning the polishing liquid mixed with small abrasive grains to the center of the surface plate 12. By providing a path, rough polishing of the central portion and precise polishing (finish polishing) of the outer peripheral portion may be simultaneously performed on the same surface plate. Note that the polishing cloth on the surface plate at this time may be the same, or different ones may be attached at the center and the outer periphery.
図６、図７はさらに他の実施の形態を示す説明図である。
本実施の形態では、バンク３８内壁の中途部に該内壁を這い上がる研磨液が乗り越え可能な高さで内方に突出するリング４８を設けている。
本実施の形態の場合、図７に原理を説明するように、定盤１２が回転することにより、研磨液中の大きな研磨砥粒は遠心力により外方に飛ばされ、リング４８より下方に捕捉され、小さな研磨砥粒はその内方に位置してリング４８を乗り越え、リング４８の上方に集まる傾向になる。つまり、大きな粒子と小さな粒子の分級がより進行して行われる。
6 and 7 are explanatory views showing still another embodiment.
In the present embodiment, a ring 48 is provided in the middle of the inner wall of the bank 38. The ring 48 protrudes inward at a height at which the polishing liquid scooping up the inner wall can get over.
In the case of the present embodiment, as illustrated in FIG. 7, as the surface plate 12 rotates, large abrasive grains in the polishing liquid are blown outward by centrifugal force and captured below the ring 48. As a result, the small abrasive grains tend to gather over the ring 48 over the ring 48 located inside. In other words, classification of large particles and small particles is performed with further progress.
したがって、リング４８の下方に取液口４４が位置するように一方の戻し流路４２を配設し、大きな研磨砥粒が混入する研磨液を取液して定盤１２に戻すことによってワークの粗研磨を行うことができる。また、リング４８の上方に取液口４４が位置するように他方の戻し流路４２を配設し、小さな研磨砥粒が混入する研磨液を取液して定盤１２に戻すことによってワークの仕上げ研磨を行うことができる。
なお、リング４８の断面形状は特に限定されるものではなく、円形、三角形、矩形等、研磨液の粘性等に応じて適宜選定するようにするとよい。
Accordingly, one return channel 42 is arranged so that the liquid inlet 44 is positioned below the ring 48, and the polishing liquid mixed with large abrasive grains is taken and returned to the surface plate 12 to return the workpiece. Rough polishing can be performed. Further, the other return flow path 42 is disposed so that the liquid inlet 44 is positioned above the ring 48, and the polishing liquid mixed with small abrasive grains is taken and returned to the surface plate 12 to return the workpiece. Final polishing can be performed.
The cross-sectional shape of the ring 48 is not particularly limited, and may be appropriately selected according to the viscosity of the polishing liquid, such as a circle, a triangle, or a rectangle.
図８は、従来の、バンクを有しないワーク研磨装置と、本実施の形態の、バンク３８および戻し流路４２を備えるワーク研磨装置を用いて、それぞれＳｉＣ基板を研磨した際の、経過研磨時間における研磨布（パッド）の表面温度を計測したグラフである。
なお、定盤の回転速度はそれぞれ２００ｒｐｍ、研磨荷重はそれぞれ３００ｋＰａ、研磨液の研磨砥粒濃度は１ｗｔ％であり、条件を揃えるため、本実施の形態においてバンクに冷却機構は設けていない。
FIG. 8 shows the elapsed polishing time when the SiC substrate is polished using the conventional workpiece polishing apparatus having no bank and the workpiece polishing apparatus including the bank 38 and the return channel 42 according to the present embodiment. It is the graph which measured the surface temperature of polishing cloth (pad) in.
The rotational speed of the surface plate is 200 rpm, the polishing load is 300 kPa, and the polishing abrasive grain concentration of the polishing liquid is 1 wt%. In order to make the conditions uniform, no cooling mechanism is provided in the bank in this embodiment.
研磨液の供給量は、従来装置の場合、研磨液供給ノズルから室温の研磨液を１分当たり６ｍｌ（１時間使用量３６０ｍｌ）で掛け流しとし、本実施の形態の研磨装置の場合、研磨液の総量を３００ｍｌとし、１時間当たりの研磨液使用量を両者ほぼ同じとなるようにした。
図８からわかるように、従来装置の場合、研磨布の表面温度は１５分ほどで５０℃以上にまで上昇したが、本実施の形態の装置の場合、１５分ほどの研磨で７℃程度上昇したにすぎない。
In the case of the conventional apparatus, the supply amount of the polishing liquid is such that room temperature polishing liquid is poured from the polishing liquid supply nozzle at a rate of 6 ml per minute (amount used per hour: 360 ml). In the case of the polishing apparatus of the present embodiment, the polishing liquid is supplied. The total amount of these was set to 300 ml so that the amount of polishing liquid used per hour was approximately the same.
As can be seen from FIG. 8, in the case of the conventional apparatus, the surface temperature of the polishing cloth increased to 50 ° C. or more in about 15 minutes, but in the case of the apparatus of the present embodiment, it increased by about 7 ° C. after polishing for about 15 minutes. I just did it.
１０ 研磨装置、１２ 定盤、１４ 回転軸、１６ 研磨布、１８ 研磨ヘッド、２０ ワーク、２２ 回転軸、２４ スラリー供給ノズル、２６ 定盤駆動モータ、２８ 基台、３０ 加圧シリンダ、３２ ヘッド駆動モータ、３４ 支持台、３６ 操作盤、３８ バンク、４０ フランジ、４２ 戻し流路、４４ 取液口、４６ 液溜まり、４８ リング DESCRIPTION OF SYMBOLS 10 Polishing apparatus, 12 Surface plate, 14 Rotating shaft, 16 Polishing cloth, 18 Polishing head, 20 Workpiece, 22 Rotating shaft, 24 Slurry supply nozzle, 26 Surface plate drive motor, 28 Base, 30 Pressure cylinder, 32 Head drive Motor, 34 Support base, 36 Operation panel, 38 Bank, 40 Flange, 42 Return flow path, 44 Liquid inlet, 46 Liquid pool, 48 Ring
Claims (9)
前記定盤外周部を囲んで設けられ、前記定盤から流出した研磨液が外方に飛散しない高さを有するバンクと、
前記定盤が回転することによる遠心力によって、定盤外方に流出し、前記バンク内壁に這い上がった研磨液を前記定盤に戻す戻し流路とを有し、
前記バンク内壁に沿って這い上がった研磨液の取り出し位置を所定の高さに設けることにより、大きさが所要の分布である研磨砥粒を含有する研磨液を前記定盤に戻すことを特徴とするワーク研磨装置。 A surface plate having a polishing cloth affixed to the upper surface, and a polishing head for holding the workpiece on the lower surface, while pressing the work held by the polishing head onto the polishing cloth of the surface plate and supplying the polishing liquid In the workpiece polishing apparatus for polishing the workpiece by relatively moving the surface plate and the polishing head,
A bank provided around the outer periphery of the surface plate, and having a height at which the polishing liquid flowing out of the surface plate does not scatter outwards;
A flow path that flows out of the surface plate by centrifugal force generated by the rotation of the surface plate and returns the polishing liquid scooped up to the inner wall of the bank to the surface plate ;
The polishing liquid containing polishing abrasive grains having a distribution having a predetermined size is returned to the surface plate by providing a predetermined position at which the polishing liquid scooped up along the inner wall of the bank is provided at a predetermined height. Work polishing equipment.
前記定盤外周部を囲んで設けられ、前記定盤から流出した研磨液が外方に飛散しない高さを有するバンクと、
前記定盤が回転することによる遠心力によって、定盤外方に流出し、前記バンク内壁に這い上がった研磨液を前記定盤に戻す戻し流路とを有し、
前記バンクに、該バンク内壁を這い上がった研磨液を冷却する冷却装置が設けられていることを特徴とするワーク研磨装置。 A surface plate having a polishing cloth affixed to the upper surface, and a polishing head for holding the workpiece on the lower surface, while pressing the work held by the polishing head onto the polishing cloth of the surface plate and supplying the polishing liquid In the workpiece polishing apparatus for polishing the workpiece by relatively moving the surface plate and the polishing head,
A bank provided around the outer periphery of the surface plate, and having a height at which the polishing liquid flowing out of the surface plate does not scatter outwards;
A flow path that flows out of the surface plate by centrifugal force generated by the rotation of the surface plate and returns the polishing liquid scooped up to the inner wall of the bank to the surface plate ;
A work polishing apparatus , wherein the bank is provided with a cooling device for cooling the polishing liquid that has been scooped up the inner wall of the bank .
前記定盤外周部を囲んで設けられ、前記定盤から流出した研磨液が外方に飛散しない高さを有するバンクと、
前記定盤が回転することによる遠心力によって、定盤外方に流出し、前記バンク内壁に這い上がった研磨液を前記定盤に戻す戻し流路とを有し、
研磨液が、前記戻し流路内を自然流下して前記定盤に戻されることを特徴とするワーク研磨装置。 A surface plate having a polishing cloth affixed to the upper surface, and a polishing head for holding the workpiece on the lower surface, while pressing the work held by the polishing head onto the polishing cloth of the surface plate and supplying the polishing liquid In the workpiece polishing apparatus for polishing the workpiece by relatively moving the surface plate and the polishing head,
A bank provided around the outer periphery of the surface plate, and having a height at which the polishing liquid flowing out of the surface plate does not scatter outwards;
A flow path that flows out of the surface plate by centrifugal force generated by the rotation of the surface plate and returns the polishing liquid scooped up to the inner wall of the bank to the surface plate ;
A workpiece polishing apparatus , wherein a polishing liquid flows down naturally in the return flow path and returns to the surface plate .
前記定盤外周部を囲んで設けられ、前記定盤から流出した研磨液が外方に飛散しない高さを有するバンクと、
前記定盤が回転することによる遠心力によって、定盤外方に流出し、前記バンク内壁に這い上がった研磨液を前記定盤に戻す戻し流路とを有し、
前記戻し流路が複数設けられ、
前記複数の戻し流路の各戻し流路が、前記バンク内壁の異なる高さ位置の研磨液を前記定盤に戻すことを特徴とするワーク研磨装置。 A surface plate having a polishing cloth affixed to the upper surface, and a polishing head for holding the workpiece on the lower surface, while pressing the work held by the polishing head onto the polishing cloth of the surface plate and supplying the polishing liquid In the workpiece polishing apparatus for polishing the workpiece by relatively moving the surface plate and the polishing head,
A bank provided around the outer periphery of the surface plate, and having a height at which the polishing liquid flowing out of the surface plate does not scatter outwards;
A flow path that flows out of the surface plate by centrifugal force generated by the rotation of the surface plate and returns the polishing liquid scooped up to the inner wall of the bank to the surface plate ;
A plurality of the return flow paths are provided;
Each of the return channels of the plurality of return channels returns the polishing liquid at different height positions on the bank inner wall to the surface plate .
前記定盤外周部を囲んで設けられ、前記定盤から流出した研磨液が外方に飛散しない高さを有するバンクと、
前記定盤が回転することによる遠心力によって、定盤外方に流出し、前記バンク内壁に這い上がった研磨液を前記定盤に戻す戻し流路とを有し、
前記バンク内壁にバンク内方に突出するリングが設けられていることを特徴とするワーク研磨装置。 A surface plate having a polishing cloth affixed to the upper surface, and a polishing head for holding the workpiece on the lower surface, while pressing the work held by the polishing head onto the polishing cloth of the surface plate and supplying the polishing liquid In the workpiece polishing apparatus for polishing the workpiece by relatively moving the surface plate and the polishing head,
A bank provided around the outer periphery of the surface plate, and having a height at which the polishing liquid flowing out of the surface plate does not scatter outwards;
A flow path that flows out of the surface plate by centrifugal force generated by the rotation of the surface plate and returns the polishing liquid scooped up to the inner wall of the bank to the surface plate ;
A work polishing apparatus, wherein a ring protruding inward of the bank is provided on the inner wall of the bank .
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