JP6116716B2 - Electrical connection structure of piezoelectric element - Google Patents
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- JP6116716B2 JP6116716B2 JP2016006441A JP2016006441A JP6116716B2 JP 6116716 B2 JP6116716 B2 JP 6116716B2 JP 2016006441 A JP2016006441 A JP 2016006441A JP 2016006441 A JP2016006441 A JP 2016006441A JP 6116716 B2 JP6116716 B2 JP 6116716B2
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- 239000000853 adhesive Substances 0.000 claims description 69
- 230000001070 adhesive effect Effects 0.000 claims description 69
- 239000000725 suspension Substances 0.000 claims description 17
- 238000010030 laminating Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 23
- 239000010935 stainless steel Substances 0.000 description 23
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 9
- 238000009826 distribution Methods 0.000 description 7
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Moving Of The Head To Find And Align With The Track (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
Description
本発明は、圧電素子の電極と配線部材との接続に係わる圧電素子の電気的接続構造及びこれを備えたヘッド・サスペンションに関する。 The present invention relates to an electrical connection structure of a piezoelectric element related to the connection between an electrode of a piezoelectric element and a wiring member, and a head suspension provided with the same.
近年、情報機器の小型化、精密化が急速に進展し、微小距離での位置決め制御が可能なマイクロ・アクチュエータの需要が高まっている。例えば、光学系の焦点補正や傾角制御、インクジェット・プリンタ装置、磁気ディスク装置のヘッド・アクチュエータ等の技術分野での要請がある。 In recent years, miniaturization and precision of information equipment have rapidly advanced, and the demand for micro actuators capable of positioning control at a minute distance is increasing. For example, there is a demand in the technical field of focus correction and tilt angle control of an optical system, an inkjet printer device, a head actuator of a magnetic disk device, and the like.
磁気ディスク装置では、単位長さあたりのトラック数 (TPI : Track Per inch)を増大して記憶容量を大きくしているため、トラックの幅が益々狭くなっている。 In the magnetic disk device, since the storage capacity is increased by increasing the number of tracks per unit length (TPI: Track Per inch), the width of the track is becoming narrower.
このため、トラック幅方向の磁気ヘッド位置決め精度の向上が必要となり、微細領域で高精度の位置決めが可能なアクチュエータが望まれていた。 For this reason, it is necessary to improve the positioning accuracy of the magnetic head in the track width direction, and an actuator capable of highly accurate positioning in a fine region has been desired.
こうした要請に応える技術としては、例えば特許文献１のように、いわゆるデュアル・アクチュエータ方式のヘッド・サスペンションがある。このヘッド・サスペンションは、キャリッジを駆動するボイス・コイル・モータの他に、ベース・プレートとロード・ビームとの間に圧電素子が設けられている。 As a technology that meets such a demand, there is a so-called dual actuator type head suspension as disclosed in Patent Document 1, for example. In this head suspension, a piezoelectric element is provided between a base plate and a load beam, in addition to a voice coil motor that drives a carriage.
従って、デュアル・アクチュエータ方式のヘッド・サスペンションでは、ボイス・コイル・モータによる旋回駆動に加え、圧電素子の給電状態に応じた変形によりロード・ビームを介して先端のヘッド部をスウェイ方向へ微少移動させることができる。これにより、磁気ヘッドの位置決めを高精度に行うことができる。 Therefore, in the dual-actuator type head suspension, in addition to the turning drive by the voice coil motor, the head part at the tip is slightly moved in the sway direction via the load beam by the deformation according to the feeding state of the piezoelectric element. be able to. Thereby, the magnetic head can be positioned with high accuracy.
こうしたデュアル・アクチュエータ方式のヘッド・サスペンションでは、例えば図１１のような、電気的接続構造１０１が採用されたものがある。 Some of these dual actuator type head suspensions employ an electrical connection structure 101 as shown in FIG. 11, for example.
図１１の電気的接続構造１０１では、圧電素子１０３の電極１０３ａに、対向配置された配線部材としてのフレキシャ１０５の端子部１０７が固着接続されている。 In the electrical connection structure 101 of FIG. 11, a terminal portion 107 of a flexure 105 serving as a wiring member disposed so as to face the electrode 103 a of the piezoelectric element 103 is fixedly connected.
フレキシャ１０５は、電気絶縁層１０９上に配線パターン１１１が積層して形成されている。フレキシャ１０５の端子部１０７では、電気絶縁層１０９に貫通孔１１３が形成され、この貫通孔１１３により配線パターン１１１を圧電素子１０３側に露出させた接続部１１５が形成されている。フレキシャ１０５の接続部１１５は、導電性接着剤１１７によって圧電素子１０３の電極１０３ａに固着接続されている。 The flexure 105 is formed by laminating a wiring pattern 111 on an electrical insulating layer 109. In the terminal portion 107 of the flexure 105, a through hole 113 is formed in the electrical insulating layer 109, and a connection portion 115 is formed through the through hole 113 so that the wiring pattern 111 is exposed to the piezoelectric element 103 side. The connection portion 115 of the flexure 105 is fixedly connected to the electrode 103 a of the piezoelectric element 103 by a conductive adhesive 117.
このような電気的接続構造１０１では、フレキシャ１０５の接続部１１５から導電性接着剤１１７を介して圧電素子１０３の電極１０３ａに給電を行わせることができる。 In such an electrical connection structure 101, power can be supplied from the connection portion 115 of the flexure 105 to the electrode 103 a of the piezoelectric element 103 via the conductive adhesive 117.
しかしながら、かかる給電時には、図１２のように、電気的接続構造１０１に各部の熱膨張による応力が発生する。特に、導電性接着剤１１７と圧電素子１０３の電極１０３ａ及びフレキシャ１０５の端子部１０７の接続部１１５との各間には、熱膨張による相対的に高い応力が発生する。なお、図１２では、濃度の濃い部分が応力の高い部分である。 However, at the time of such power feeding, stress due to thermal expansion of each part is generated in the electrical connection structure 101 as shown in FIG. In particular, a relatively high stress is generated between the conductive adhesive 117 and the electrode 103a of the piezoelectric element 103 and the connection portion 115 of the terminal portion 107 of the flexure 105 due to thermal expansion. In FIG. 12, the dark portion is a portion with high stress.
ここで、圧電素子１０３の電極１０３ａは、その表面が圧電素子１０３の表面性状に応じて粗く、導電性接着剤１１７との接着強度が相対的に高くなっている。このため、圧電素子１０３の電極１０３ａと導電性接着剤１１７との間では、熱膨張による相対的に高い応力にも対抗できる。 Here, the surface of the electrode 103a of the piezoelectric element 103 is rough according to the surface property of the piezoelectric element 103, and the adhesive strength with the conductive adhesive 117 is relatively high. Therefore, a relatively high stress due to thermal expansion can be resisted between the electrode 103a of the piezoelectric element 103 and the conductive adhesive 117.
これに対し、フレキシャ１０５の端子部１０７の接続部１１５は、その表面が圧電素子１０３の電極１０３ａよりも滑らかであり、導電性接着剤１１７との接着強度が相対的に弱くなっている。この結果、端子部１０７の接続部１１５と導電性接着剤１１７との間では、熱膨張による相対的に高い応力に対抗することができず、剥がれが生じることがあった。 On the other hand, the connection part 115 of the terminal part 107 of the flexure 105 has a smoother surface than the electrode 103a of the piezoelectric element 103, and the adhesive strength with the conductive adhesive 117 is relatively weak. As a result, between the connection part 115 of the terminal part 107 and the conductive adhesive 117, a relatively high stress due to thermal expansion cannot be resisted, and peeling may occur.
解決しようとする問題点は、圧電素子の電極と配線部材の端子部とを導電性接着剤によって固着接続する場合に、端子部と導電性接着剤との間で熱膨張による剥がれが生じていた点である。 The problem to be solved is that when the electrode of the piezoelectric element and the terminal part of the wiring member are fixedly connected with the conductive adhesive, peeling due to thermal expansion occurs between the terminal part and the conductive adhesive. Is a point.
本発明は、配線部材の端子部と導電性接着剤との間の熱膨張による剥がれを抑制するために、基部にロード・ビームを介して読み書き用のヘッド部を支持し、前記基部と前記ロード・ビームとの間に設けられて電圧の印加状態に応じて変形する圧電素子が前記ロード・ビームを介し前記ヘッド部を前記基部に対してスウェイ方向に微少移動させるヘッド・サスペンションに用いる圧電素子の電気的接続構造であって、前記圧電素子の電極に対向配置された配線部材の端子部を導電性接着剤によって固着接続し、前記端子部に貫通形成された貫通孔と、前記端子部の圧電素子側に対する反対側で前記貫通孔の周囲に露出して設けられた接続部とを備え、前記配線部材は、前記圧電素子の電極に対向配置された電気絶縁層に配線部を積層して形成され、前記貫通孔が前記電気絶縁層及び前記配線部を貫通して前記接続部が前記貫通孔の周囲の前記配線部からなり、前記導電性接着剤は、前記貫通孔を介し前記接続部の表面から前記電極の表面にわたって配置固化し、前記導電性接着剤の配置固化により前記端子部と前記圧電素子との間に第１固着部を備えると共に前記接続部の表面に第２固着部を備え、前記第１固着部は、前記貫通孔の周囲で前記端子部の前記電気絶縁層に固着されると共に、前記第２固着部は、前記貫通孔の周囲で前記接続部の表面に固着され、前記第１固着部の前記電気絶縁層への固着は、前記貫通孔から放射方向へ前記電気絶縁層の厚みを超える範囲で行われ、前記第２固着部の前記接続部の表面への固着は、前記貫通孔から放射方向へ前記配線部の厚みを超える範囲で行われ、前記第１固着部の前記貫通孔から放射方向への範囲は、前記第２固着部の前記貫通孔から放射方向への範囲と同一又は前記第２固着部の前記貫通孔から放射方向への範囲を超え、前記電気絶縁層の前記圧電素子側で前記貫通孔の周囲且つ前記第１固着部の前記電気絶縁層に対する固着の範囲の周囲で前記電気絶縁層から突設され前記導電性接着剤の固化前の流れ出しの障害となる障突部を備え、前記障突部は、前記接続部に対して外側に位置し積層方向で重ならないことを最も主な特徴とする。 In order to suppress peeling due to thermal expansion between the terminal portion of the wiring member and the conductive adhesive, the present invention supports a read / write head portion via a load beam on the base portion, and the base portion and the load portion. A piezoelectric element used for a head suspension provided between the beam and deformed in accordance with a voltage application state slightly moves the head part in the sway direction with respect to the base part via the load beam. An electrical connection structure, wherein a terminal portion of a wiring member disposed opposite to an electrode of the piezoelectric element is fixedly connected by a conductive adhesive, and a through hole formed through the terminal portion and a piezoelectric portion of the terminal portion The wiring member is formed by laminating a wiring portion on an electrical insulating layer disposed opposite to the electrode of the piezoelectric element. The through hole penetrates the electrical insulating layer and the wiring part, and the connection part is formed of the wiring part around the through hole, and the conductive adhesive is connected to the connection part via the through hole. A first fixing portion is provided between the terminal portion and the piezoelectric element by arranging and solidifying the conductive adhesive from the surface to the surface of the electrode, and a second fixing portion is provided on the surface of the connection portion. The first fixing portion is fixed to the electrical insulating layer of the terminal portion around the through hole, and the second fixing portion is fixed to the surface of the connection portion around the through hole, The first fixing portion is fixed to the electric insulating layer in a range exceeding the thickness of the electric insulating layer in the radial direction from the through hole, and the second fixing portion is fixed to the surface of the connection portion. , Exceeding the thickness of the wiring part in the radial direction from the through hole The range from the through hole of the first fixing portion to the radial direction is the same as the range from the through hole of the second fixing portion to the radial direction or from the through hole of the second fixing portion. Exceeding the range in the radial direction, projecting from the electrical insulating layer around the through-hole on the piezoelectric element side of the electrical insulating layer and around the range of fixing of the first fixing portion to the electric insulating layer The main feature is that it is provided with a hindrance that obstructs the flow-out before the conductive adhesive is solidified, and that the hindrance is located outside the connecting portion and does not overlap in the stacking direction .
本発明は、上記構成であるから、接続部と導電性接着剤との間の熱膨張に起因する応力を低減して剥がれを抑制することができる。 Since this invention is the said structure, the stress resulting from the thermal expansion between a connection part and a conductive adhesive can be reduced and peeling can be suppressed.
配線部材の端子部と導電性接着剤との間の熱膨張による剥がれを抑制するという目的を、第１固着部は、貫通孔の周囲で端子部の電気絶縁層に固着されると共に、第２固着部は、貫通孔の周囲で接続部の表面に固着され、第１固着部の電気絶縁層への固着は、貫通孔から放射方向へ電気絶縁層の厚みを超える範囲で行われ、第２固着部の接続部の表面への固着は、貫通孔から放射方向へ配線部の厚みを超える範囲で行われ、第１固着部の貫通孔から放射方向への範囲は、第２固着部の貫通孔から放射方向への範囲と同一又は第２固着部の貫通孔から放射方向への範囲を超えることによって実現した。 For the purpose of suppressing peeling due to thermal expansion between the terminal portion of the wiring member and the conductive adhesive, the first fixing portion is fixed to the electric insulating layer of the terminal portion around the through hole, and the second fixing portion. The fixing portion is fixed to the surface of the connection portion around the through hole, and the first fixing portion is fixed to the electric insulating layer in a range exceeding the thickness of the electric insulating layer in the radial direction from the through hole. The fixing portion is fixed to the surface of the connecting portion in a range exceeding the thickness of the wiring portion in the radial direction from the through hole, and the range from the through hole of the first fixing portion to the radial direction is the penetration of the second fixing portion. This is realized by the same range as the radial direction from the hole or exceeding the radial range from the through hole of the second fixing portion.
実施形態においては、配線部材は、圧電素子の電極に対向配置された電気絶縁層に配線部を積層して形成され、端子部は、貫通孔が電気絶縁層及び配線部を貫通し、接続部が貫通孔周囲の配線部からなる。 In the embodiment, the wiring member is formed by laminating the wiring portion on the electrical insulating layer disposed opposite to the electrode of the piezoelectric element, and the terminal portion has a through hole penetrating the electrical insulating layer and the wiring portion, and the connection portion. Consists of a wiring portion around the through hole.
好ましくは、貫通孔が、配線部側の径を電気絶縁層側の径に対して同径以上に設定される。 Preferably, the through hole is set such that the diameter on the wiring portion side is equal to or larger than the diameter on the electric insulating layer side.
図1〜図８は、参考例を示す。実施例１の説明の前に、理解を容易にするため参考例を説明する。 1 to 8 show reference examples. Prior to the description of the first embodiment, a reference example will be described to facilitate understanding.
［ヘッド・サスペンションの概略構成］
図１は圧電素子の電気的接続構造を採用したヘッド・サスペンションの一例を示す概略平面図、図２はヘッド・サスペンションの斜視図である。
[Schematic configuration of head suspension]
FIG. 1 is a schematic plan view showing an example of a head suspension adopting an electrical connection structure of piezoelectric elements, and FIG. 2 is a perspective view of the head suspension.
図１及び図２のように、ヘッド・サスペンション１は、本発明参考例の圧電素子３の電気的接続構造４を用いており、基部５にロード・ビーム７を介して先端の読み書き用のヘッド部９を支持している。 As shown in FIGS. 1 and 2, the head suspension 1 uses the electrical connection structure 4 of the piezoelectric element 3 of the reference example of the present invention, and a read / write head at the tip via a load beam 7 on the base 5. The part 9 is supported.
圧電素子３は、矩形の圧電セラミック、例えば矩形のＰＺＴ（チタン酸ジルコン酸鉛）からなる。圧電素子３の一側面には、金メッキにより共通の電極３ａが形成され、他側面には、金メッキにより一対の電極３ｂ，３ｃが形成されている。 The piezoelectric element 3 is made of rectangular piezoelectric ceramic, for example, rectangular PZT (lead zirconate titanate). A common electrode 3a is formed on one side surface of the piezoelectric element 3 by gold plating, and a pair of electrodes 3b and 3c is formed on the other side surface by gold plating.
この圧電素子３は、基部５とロード・ビーム７との間に設けられて電極３ａ，３ｂ，３ｃを介した電圧の印加状態に応じて変形し、ロード・ビーム７を介しヘッド部９を基部５に対してスウェイ方向に微少移動させる。 The piezoelectric element 3 is provided between the base portion 5 and the load beam 7 and is deformed in accordance with a voltage application state via the electrodes 3 a, 3 b, 3 c, and the head portion 9 is connected to the base portion via the load beam 7. 5 is slightly moved in the sway direction.
基部５は、ステンレスなど導電性のべース・プレート１１にステンレスなど導電性の補強プレート１３の基端側を重ねて構成されている。ベース・プレート１１と補強プレート１３との間は、レーザー溶接などにより結合されている。 The base 5 is configured by superposing a base end side of a conductive reinforcing plate 13 such as stainless steel on a conductive base plate 11 such as stainless steel. The base plate 11 and the reinforcing plate 13 are coupled by laser welding or the like.
べース・プレート１１及び補強プレート１３には、両者を貫通する貫通孔１５が形成されている。ベース・プレート１１には、ボス部１７が一体に形成されている。ボス部１７は、ボイス・コイル・モータ（図示せず）に取り付けられたキャリッジ（図示せず）の取付穴にスエージングにより取り付けられている。 A through hole 15 is formed in the base plate 11 and the reinforcing plate 13 so as to penetrate both. A boss portion 17 is formed integrally with the base plate 11. The boss portion 17 is attached to a mounting hole of a carriage (not shown) attached to a voice coil motor (not shown) by swaging.
これにより、ヘッド・サスペンション１では、ボイス・コイル・モータによる旋回駆動と圧電素子３によるヘッド部９の微小駆動とを行うことができるようになっている。 As a result, the head suspension 1 can perform the turning drive by the voice coil motor and the minute drive of the head portion 9 by the piezoelectric element 3.
補強プレート１３の先端側には、圧電素子３の取付部１９が形成されている。取付部１９には、圧電素子３を配置する開口部２１が形成され、開口部２１内にエッチング処理等による取付フランジ２３，２５が備えられている。この開口部２１内には、圧電素子３が非導電性接着剤により固定されている。開口部２１のスウェイ方向両側には、可撓部２７ａ，２７ｂが設けられている。 A mounting portion 19 for the piezoelectric element 3 is formed on the distal end side of the reinforcing plate 13. An opening 21 in which the piezoelectric element 3 is disposed is formed in the mounting portion 19, and mounting flanges 23 and 25 by etching or the like are provided in the opening 21. In the opening 21, the piezoelectric element 3 is fixed by a non-conductive adhesive. Flexible portions 27 a and 27 b are provided on both sides of the opening 21 in the sway direction.
取付部１９の先端には、結合部２９が形成されている。結合部２９と圧電素子３の一対の電極面３ｂ，３ｃとの間には、銀ペースト等の導電性接着剤３１ａ，３１ｂが塗布されている。この導電性接着剤３１ａ，３１ｂにより補強プレート１３と電極面３ｂ，３ｃとの間が導通接続されている。結合部２９には、ロード・ビーム７が結合されている。 A coupling portion 29 is formed at the tip of the attachment portion 19. Conductive adhesives 31 a and 31 b such as silver paste are applied between the coupling portion 29 and the pair of electrode surfaces 3 b and 3 c of the piezoelectric element 3. The conductive adhesives 31a and 31b are electrically connected between the reinforcing plate 13 and the electrode surfaces 3b and 3c. The load beam 7 is coupled to the coupling portion 29.
ロード・ビーム７は、情報の書き込み，読み取りを行う先端側のヘッド部９に負荷荷重を与えるものである。ロード・ビーム７は、例えばステンレス鋼薄板で形成され、剛体部３３とばね部３５とを含んでいる。 The load beam 7 applies a load to the head portion 9 on the distal end side where information is written and read. The load beam 7 is formed of, for example, a stainless steel thin plate, and includes a rigid portion 33 and a spring portion 35.
ばね部３５は、窓３７により二股に形成され、厚み方向の曲げ剛性を下げている。ばね部３５の基端には、基部５側の結合部２９に結合する被結合部３９が形成されている。被結合部３９は、結合部２９にレーザー溶接などにより結合されている。 The spring part 35 is bifurcated by the window 37 and reduces the bending rigidity in the thickness direction. At the base end of the spring portion 35, a coupled portion 39 that is coupled to the coupling portion 29 on the base 5 side is formed. The coupled portion 39 is coupled to the coupling portion 29 by laser welding or the like.
剛体部３３の幅方向両縁には、レール部４１ａ，４１ｂが箱曲げにより板厚方向に立ち上げ形成されている。レール部４１ａ，４１ｂは、剛体部３３の先端側から基端に渡って設けられている。 On both edges in the width direction of the rigid portion 33, rail portions 41a and 41b are formed to rise in the plate thickness direction by box bending. The rail portions 41a and 41b are provided from the distal end side to the proximal end of the rigid portion 33.
剛体部３３の先端には、ロード・アンロード用のタブ４３が設けられ、同先端側にディンプル（図示せず）が設けられている。 A load / unload tab 43 is provided at the distal end of the rigid portion 33, and dimples (not shown) are provided on the distal end side.
ヘッド部９のスライダは、配線部材としてのフレキシャ４５のタング部４５ａに支持されている。 The slider of the head unit 9 is supported by a tongue 45a of a flexure 45 as a wiring member.
図３は、フレキシャの端子部周辺を示す一部省略斜視図、図４は、図３のフレキシャを反転した一部省略斜視図、図５は、電気的接続構造の端子部を拡大して示し、（ａ）は平面図、（ｂ）は（ａ）のＶ−Ｖ線矢視に係る断面図である。なお、図３〜図５のフレキシャは、図１、図２のフレキシャと若干形状は異なるが、基本的には同構造である。 3 is a partially omitted perspective view showing the periphery of the flexure terminal portion, FIG. 4 is a partially omitted perspective view in which the flexure of FIG. 3 is inverted, and FIG. 5 is an enlarged view of the terminal portion of the electrical connection structure. (A) is a top view, (b) is sectional drawing which concerns on the VV arrow of (a). The flexures shown in FIGS. 3 to 5 are basically the same in structure, although slightly different from the flexures shown in FIGS. 1 and 2.
フレキシャ４５は、ばね性を有する薄いステンレス鋼圧延板（ＳＳＴ）などの導電性薄板４７に、電気絶縁層４９を形成し、この電気絶縁層４９に配線部である銅の配線パターン５１，５３を積層して形成したものである。本参考例では、図５のように、フレキシャ４５の圧電素子側に対する反対側の表面がカバー絶縁層５４によって被覆されている。なお、カバー絶縁層５４は省略することも可能である。 The flexure 45 forms an electrical insulating layer 49 on a conductive thin plate 47 such as a thin stainless steel rolled plate (SST) having spring properties, and copper wiring patterns 51 and 53 as wiring portions are formed on the electrical insulating layer 49. It is formed by laminating. In this reference example, as shown in FIG. 5, the surface of the flexure 45 opposite to the piezoelectric element side is covered with a cover insulating layer 54. The insulating cover layer 54 can be omitted.
導電性薄板４７の厚みは、１０〜２５μｍ程度の範囲で、電気絶縁層４９の厚みは、５〜１５μｍ程度の範囲で、配線パターン５１，５３の厚みは、８〜１５μｍ程度の範囲で、カバー絶縁層５４の厚みは、１〜５μｍ程度の範囲で形成される。 The thickness of the conductive thin plate 47 is in the range of about 10 to 25 μm, the thickness of the electrical insulating layer 49 is in the range of about 5 to 15 μm, and the thickness of the wiring patterns 51 and 53 is in the range of about 8 to 15 μm. The insulating layer 54 has a thickness in the range of about 1 to 5 μm.
配線パターン５１の一端は、図１及び図３のように、ヘッド部９のスライダに支持された書き込み用の端子、読み取り用の端子に導通接続され、配線パターン５３の一端には、圧電素子３に対する端子部５５が形成されている。この圧電素子３と端子部５５との間には、電気的接続構造４が適用されている。なお、配線パターン５１及び５３の他端には、外部接続用の端子部（図示せず）が設けられている。 As shown in FIGS. 1 and 3, one end of the wiring pattern 51 is electrically connected to a writing terminal and a reading terminal supported by the slider of the head portion 9, and the piezoelectric element 3 is connected to one end of the wiring pattern 53. A terminal portion 55 is formed. An electrical connection structure 4 is applied between the piezoelectric element 3 and the terminal portion 55. Note that the other end of the wiring patterns 51 and 53 is provided with a terminal portion (not shown) for external connection.
［電気的接続構造］
図６は、図１の電気的接続構造のＶＩ−ＶＩ線矢視に係る斜視断面図である。
[Electrical connection structure]
6 is a perspective cross-sectional view of the electrical connection structure of FIG. 1 taken along line VI-VI.
図６のように、電気的接続構造４では、端子部５５の圧電素子側に対する反対側で、端子部５５の接続部５６に導電性接着剤６３を固着接続している。 As shown in FIG. 6, in the electrical connection structure 4, the conductive adhesive 63 is fixedly connected to the connection portion 56 of the terminal portion 55 on the side opposite to the piezoelectric element side of the terminal portion 55.
本参考例の端子部５５は、図３〜図６のように、その周辺を含めてエッチング処理等により導電性薄板４７が除去されている。この端子部５５には、円形の貫通孔５９が貫通形成されている。 As shown in FIG. 3 to FIG. 6, the conductive thin plate 47 is removed from the terminal portion 55 of this reference example by etching or the like including the periphery thereof. A circular through hole 59 is formed through the terminal portion 55.
貫通孔５９は、図５及び図６のように、電気絶縁層４９及び配線パターン５３を貫通し、電気絶縁層４９側の絶縁層孔５９ａ及び配線パターン５３側の配線孔５９ｂからなっている。絶縁層孔５９ａ及び配線孔５９ｂの径は、同一径に設定されている。ただし、配線孔５９ｂを絶縁層孔５９ａよりも大径に形成してもよい。 As shown in FIGS. 5 and 6, the through hole 59 penetrates the electrical insulating layer 49 and the wiring pattern 53, and includes an insulating layer hole 59 a on the electrical insulating layer 49 side and a wiring hole 59 b on the wiring pattern 53 side. The diameters of the insulating layer hole 59a and the wiring hole 59b are set to the same diameter. However, the wiring hole 59b may be formed with a larger diameter than the insulating layer hole 59a.
従って、貫通孔５９は、配線パターン５３側の径が電気絶縁層４９側の径に対して同一径以上に設定された構成となっている。 Therefore, the through hole 59 has a configuration in which the diameter on the wiring pattern 53 side is set to be equal to or larger than the diameter on the electric insulating layer 49 side.
貫通孔５９の周囲には、リング状の接続部５６が形成されている。接続部５６は、配線パターン５３の一部からなっている。接続部５６の表面側は、カバー絶縁層５４が除去されて外部に露出している。 A ring-shaped connection portion 56 is formed around the through hole 59. The connection part 56 is formed of a part of the wiring pattern 53. The surface of the connecting portion 56 is exposed to the outside after the insulating cover layer 54 is removed.
従って、接続部５６は、端子部５５の圧電素子側に対する反対側で貫通孔５９周囲に設けられた構成となっている。 Accordingly, the connection portion 56 is provided around the through hole 59 on the opposite side of the terminal portion 55 to the piezoelectric element side.
接続部５６の裏面側は、電気絶縁層４９によってカバーされると共に支持されている。これにより、接続部５６が端子部５５の圧電素子側に露出しないようになっている。 The back surface side of the connecting portion 56 is covered and supported by the electrical insulating layer 49. Thereby, the connection part 56 is not exposed to the piezoelectric element side of the terminal part 55.
端子部５５の圧電素子側には、障突部としてのステンレス・リング５７が電気絶縁層４９から突設されている。ステンレス・リング５７は、貫通孔５９の周囲で導電性薄板４７を部分的に残すことで形成されている。ステンレス・リング５７は、接続部５６の裏面側で径方向中間部に位置している。 On the piezoelectric element side of the terminal portion 55, a stainless steel ring 57 is provided as an obstacle protrusion from the electrical insulating layer 49. The stainless steel ring 57 is formed by partially leaving the conductive thin plate 47 around the through hole 59. The stainless steel ring 57 is located in the radially intermediate portion on the back side of the connecting portion 56.
導電性接着剤６３は、図６のように、端子部５５の接続部５６表面から貫通孔５９を介して圧電素子３の電極３ａにわたって塗布固化されている。固化した導電性接着剤６３は、端子部５５の両側に位置して全体として略工字状となっている。 As shown in FIG. 6, the conductive adhesive 63 is applied and solidified from the surface of the connection portion 56 of the terminal portion 55 to the electrode 3 a of the piezoelectric element 3 through the through hole 59. The solidified conductive adhesive 63 is positioned on both sides of the terminal portion 55 and has a substantially letter shape as a whole.
端子部５５の圧電素子側では、導電性接着剤６３が圧電素子３の電極３ａに固着した第１固着部６３ａとなっている。第１固着部６３ａは、ステンレス・リング５７が、端子部５５と圧電素子３との間で導電性接着剤６３の固化前の流れ出しの障害となることで形成される。具体的には、ステンレス・リング５７によって圧電素子３の電極３ａとの間を狭くし、導電性接着剤６３が毛細管現象により両間に入り込んで固化する。 On the piezoelectric element side of the terminal portion 55, the conductive adhesive 63 is a first fixing portion 63 a that is fixed to the electrode 3 a of the piezoelectric element 3. The first fixing portion 63 a is formed by the stainless steel ring 57 becoming an obstacle to the flow of the conductive adhesive 63 before solidification between the terminal portion 55 and the piezoelectric element 3. Specifically, the space between the electrodes 3a of the piezoelectric element 3 is narrowed by the stainless steel ring 57, and the conductive adhesive 63 enters between the two due to capillary action and solidifies.
これにより、第１固着部６３ａは、ステンレス・リング５７と圧電素子３の電極３ａとの間及びステンスレス・リング５７の内周側で段付の円柱形状となっている。 Thus, the first fixing portion 63 a has a stepped columnar shape between the stainless steel ring 57 and the electrode 3 a of the piezoelectric element 3 and on the inner peripheral side of the stainless steel ring 57.
一方、端子部５５の圧電素子側に対する反対側では、導電性接着剤６３が端子部５５の接続部５６に固着した第２固着部６３ｂとなっている。第２固着部６３ｂは、貫通孔５９に対して放射方向に突出した円柱形状に形成されている。この第２固着部６３ｂは、その外周側が端子部５５の接続部５６表面上に位置して固着している。 On the other hand, on the side opposite to the piezoelectric element side of the terminal portion 55, the conductive adhesive 63 is a second fixing portion 63 b that is fixed to the connection portion 56 of the terminal portion 55. The second fixing portion 63 b is formed in a cylindrical shape protruding in the radial direction with respect to the through hole 59. The outer peripheral side of the second fixing portion 63 b is fixed on the surface of the connection portion 56 of the terminal portion 55.
第２固着部６３ｂと第１固着部６３ａとの間は、貫通孔５９内の連結部６３ｃによって一体に連結されている。連結部６３ｃは、絶縁層孔５９ａ及び配線孔５９ｂの内周に固着した円柱形状となっている。 The second fixing portion 63b and the first fixing portion 63a are integrally connected by a connecting portion 63c in the through hole 59. The connecting portion 63c has a cylindrical shape fixed to the inner periphery of the insulating layer hole 59a and the wiring hole 59b.
従って、導電性接着剤６３は、第２固着部６３ｂ及び連結部６３ｃが端子部５５の接続部５６表面及び内周に導通し、第１固着部６３ａが圧電素子３の電極３ａに導通している。この結果、導電性接着剤６３は、端子部５５の接続部５６と圧電素子３の電極３ａとの間を導通接続し、端子部５５から導電性接着剤６３を介して圧電素子３に給電を行わせることができる。 Accordingly, in the conductive adhesive 63, the second fixing portion 63 b and the connecting portion 63 c are electrically connected to the surface and inner periphery of the connection portion 56 of the terminal portion 55, and the first fixing portion 63 a is electrically connected to the electrode 3 a of the piezoelectric element 3. Yes. As a result, the conductive adhesive 63 conductively connects the connection portion 56 of the terminal portion 55 and the electrode 3 a of the piezoelectric element 3, and supplies power to the piezoelectric element 3 from the terminal portion 55 via the conductive adhesive 63. Can be done.
給電の際には、導電性接着剤６３と端子部５５の接続部５６との間に熱膨張による応力が発生するが、本参考例では、この応力を低減することができる。 When power is supplied, stress due to thermal expansion is generated between the conductive adhesive 63 and the connection portion 56 of the terminal portion 55. In this reference example, this stress can be reduced.
すなわち、電気的接続構造４では、端子部５５の圧電素子側に対する反対側において、 貫通孔５９周囲に設けられた接続部５６表面に導電性接着剤６３の第２固着部６３ｂが固着している。 That is, in the electrical connection structure 4, the second fixing portion 63 b of the conductive adhesive 63 is fixed to the surface of the connection portion 56 provided around the through hole 59 on the side opposite to the piezoelectric element side of the terminal portion 55. .
このため、第２固着部６３ｂを接続部５６に対する反対側で開放することができると共に貫通孔５９によって接続部５６の面方向の強度を低下させることができる。 For this reason, the second fixing portion 63b can be opened on the opposite side to the connection portion 56, and the strength in the surface direction of the connection portion 56 can be reduced by the through hole 59.
この結果、電気的接続構造４では、接続部５６表面に対する拘束の発生を抑制することができ、接続部５６と第２固着部６３ｂとの間（界面）の熱膨張による応力を低減することができる。 As a result, in the electrical connection structure 4, it is possible to suppress the occurrence of restraint on the surface of the connection portion 56, and to reduce stress due to thermal expansion between the connection portion 56 and the second fixing portion 63 b (interface). it can.
また、接続部５６の裏面側では、電気絶縁層４９が導電性接着剤６３の第１固着部６３ａに固着し、導電性接着剤６３の食い付きを弱くすることができる。これにより、接続部５６の裏面側と第１固着部６３ａとの間でも、熱膨張による応力を低減することができる。 Further, on the back surface side of the connection portion 56, the electric insulating layer 49 is fixed to the first fixing portion 63 a of the conductive adhesive 63, and the biting of the conductive adhesive 63 can be weakened. Thereby, the stress by thermal expansion can be reduced also between the back surface side of the connection part 56, and the 1st adhering part 63a.
なお、圧電素子３の電極３ａと導電性接着剤６３との間では、熱膨張による相対的に高い応力が発生するが、従来技術と同様に接着強度が相対的に高く、かかる応力にも対抗できる。 A relatively high stress is generated due to thermal expansion between the electrode 3a of the piezoelectric element 3 and the conductive adhesive 63, but the adhesive strength is relatively high as in the prior art, and this stress is also countered. it can.
図７は、電気的接続構造の応力分布を示し、（ａ）は斜視断面図、（ｂ）は導電性接着剤のみの斜視断面図、（ｃ）は（ｂ）のＶＩＩ−ＶＩＩ線矢視に係る斜視断面図である。図７では、圧電素子３と導電性接着剤６３との界面及び端子部５５の基端側を拘束し、温度を２０℃から１４０℃まで上昇させたときの応力分布の解析結果を示している。なお、図７では、濃度の濃い部分が応力の高い部分である。 7A and 7B show the stress distribution of the electrical connection structure, where FIG. 7A is a perspective sectional view, FIG. 7B is a perspective sectional view of only a conductive adhesive, and FIG. 7C is a sectional view taken along line VII-VII in FIG. It is a perspective sectional view concerning. FIG. 7 shows the analysis result of the stress distribution when the interface between the piezoelectric element 3 and the conductive adhesive 63 and the base end side of the terminal portion 55 are constrained and the temperature is raised from 20 ° C. to 140 ° C. . In FIG. 7, the dark portion is a portion with high stress.
図７から明らかなように、電気的接続構造４では、端子部５５の接続部５６と導電性接着剤６３の第２固着部６３ｂとの間での熱膨張による応力を低減できることが確認できた。 As is clear from FIG. 7, in the electrical connection structure 4, it was confirmed that stress due to thermal expansion between the connection portion 56 of the terminal portion 55 and the second fixing portion 63 b of the conductive adhesive 63 can be reduced. .
接続部５６の裏面側においても、導電性接着剤６３の第１固着部６３ａとの間での熱膨張による応力を低減できることが確認できた。 It was confirmed that the stress due to thermal expansion between the conductive adhesive 63 and the first fixing part 63a can be reduced also on the back surface side of the connection part 56.
［参考例の効果］
本参考例の電気的接続構造４では、端子部５５に貫通形成された貫通孔５９と、端子部５５の圧電素子側に対する反対側で貫通孔５９周囲に設けられた接続部５６とを備え、導電性接着剤６３が、貫通孔５９を介し接続部５６表面から電極３ａ表面にわたって配置固化している。
[Effect of reference example]
The electrical connection structure 4 of the present reference example includes a through hole 59 formed through the terminal portion 55 and a connection portion 56 provided around the through hole 59 on the opposite side of the terminal portion 55 from the piezoelectric element side. The conductive adhesive 63 is disposed and solidified from the surface of the connecting portion 56 to the surface of the electrode 3a through the through hole 59.
すなわち、本参考例では、端子部５５の圧電素子側に対する反対側で貫通孔５９周囲の接続部５６表面に導電性接着剤６３を固着させることで、接続部５６表面に対する拘束の発生を抑制することができる。 That is, in this reference example, the conductive adhesive 63 is fixed to the surface of the connection portion 56 around the through hole 59 on the side opposite to the piezoelectric element side of the terminal portion 55, thereby suppressing the occurrence of restraint on the surface of the connection portion 56. be able to.
この結果、本参考例では、接続部５６と導電性接着剤６３との間（界面）での熱膨張による応力を低減することができ、両者間の剥がれを抑制して電気的接続に対する長期信頼性を確保することができる。 As a result, in this reference example, stress due to thermal expansion between the connection portion 56 and the conductive adhesive 63 (interface) can be reduced, and peeling between the two can be suppressed to provide long-term reliability for electrical connection. Sex can be secured.
本参考例の電気的接続構造４では、フレキシャ４５が、圧電素子３の電極３ａに対向配置された電気絶縁層４９に配線パターン５１，５３を積層して形成され、端子部５５が、貫通孔５９が電気絶縁層４９及び配線パターン５３を貫通し、接続部５６が貫通孔５９周囲の配線パターン５３からなる。
従って、本参考例では、端子部５５と導電性接着剤６３との間での熱膨張による剥がれを抑制できる電気的接続構造４を確実に実現することができる。
In the electrical connection structure 4 of this reference example, the flexure 45 is formed by laminating the wiring patterns 51 and 53 on the electrical insulating layer 49 disposed to face the electrode 3a of the piezoelectric element 3, and the terminal portion 55 has a through hole. 59 penetrates the electrical insulating layer 49 and the wiring pattern 53, and the connection portion 56 is composed of the wiring pattern 53 around the through hole 59.
Therefore, in this reference example, it is possible to reliably realize the electrical connection structure 4 that can suppress peeling due to thermal expansion between the terminal portion 55 and the conductive adhesive 63.
貫通孔５９は、配線パターン５３側の径が電気絶縁層４９側の径に対して同径以上に設定されている。 The diameter of the through hole 59 is set to be equal to or larger than the diameter of the wiring pattern 53 side with respect to the diameter of the electrical insulating layer 49 side.
このため、本参考例では、接続部５６の裏面側を電気絶縁層４９によって支持することができ、貫通孔５９周囲に位置する接続部５６の剛性を向上することができる。 For this reason, in this reference example, the back surface side of the connection part 56 can be supported by the electrical insulating layer 49, and the rigidity of the connection part 56 located around the through-hole 59 can be improved.
しかも、電気絶縁層４９が、接続部５６の裏面側で導電性接着剤６３に固着し、導電性接着剤６３の食い付きを弱くすることができる。このため、本参考例では、接続部５６の裏面側と導電性接着剤６３との間での熱膨張による応力も低減することができる。 In addition, the electrical insulating layer 49 is fixed to the conductive adhesive 63 on the back surface side of the connection portion 56, and the biting of the conductive adhesive 63 can be weakened. For this reason, in this reference example, the stress due to thermal expansion between the back surface side of the connecting portion 56 and the conductive adhesive 63 can also be reduced.
従って、本参考例では、より確実に端子部５５と導電性接着剤６３との間での熱膨張による剥がれを抑制して電気的接続に対する長期信頼性を確保することができる。 Therefore, in this reference example, it is possible to more reliably suppress peeling due to thermal expansion between the terminal portion 55 and the conductive adhesive 63 and ensure long-term reliability for electrical connection.
本参考例の電気的接続構造４では、接続部５６がリング状であるため、接続部５６全体で表面に対する拘束の発生を確実に抑制することができる。
また、本参考例の電気的接続構造４では、電気絶縁層４９の圧電素子側で貫通孔５９周囲に突設され導電性接着剤６３の固化前の流れ出しの障害となるステンレス・リング５７を備えている。
In the electrical connection structure 4 of the present reference example, since the connection portion 56 has a ring shape, it is possible to reliably suppress the occurrence of restraint on the surface in the entire connection portion 56.
In addition, the electrical connection structure 4 of the present reference example includes a stainless steel ring 57 that protrudes around the through hole 59 on the piezoelectric element side of the electrical insulating layer 49 and obstructs the flow-out before the conductive adhesive 63 is solidified. ing.
このため、本参考例では、ステンレス・リング５７により、圧電素子３と端子部５５との間の導電性接着剤６３の均一化を図ることができると共に導電性接着剤６３に対する食い付きを強くすることができる。 For this reason, in this reference example, the stainless steel ring 57 makes it possible to make the conductive adhesive 63 uniform between the piezoelectric element 3 and the terminal portion 55 and to increase the biting of the conductive adhesive 63. be able to.
従って、本参考例では、圧電素子３と端子部５５との間の接着強度を向上することができる。この結果、上記のように接続部５６の裏面側で導電性接着剤６３の食い付きを弱くしても、圧電素子３と端子部５５との間を確実に接着させることができる。 Therefore, in this reference example, the adhesive strength between the piezoelectric element 3 and the terminal portion 55 can be improved. As a result, even if the biting of the conductive adhesive 63 is weakened on the back surface side of the connection portion 56 as described above, the piezoelectric element 3 and the terminal portion 55 can be reliably bonded.
かかる電気的接続構造４を用いたヘッド・サスペンション１は、圧電素子３とフレキシャ４５の端子部５５との導電接続の信頼性の向上したヘッド・サスペンション１を得ることができ、ヘッド・サスペンション１の高精度の位置決めを信頼性高く達成することができる。 With the head suspension 1 using the electrical connection structure 4, it is possible to obtain the head suspension 1 with improved reliability of the conductive connection between the piezoelectric element 3 and the terminal portion 55 of the flexure 45. Highly accurate positioning can be achieved with high reliability.
［変形例］
本参考例では、図８のように、ステンレス・リングの形状を変更することも可能である。
[Modification]
In this reference example, the shape of the stainless steel ring can be changed as shown in FIG.
図８は、本参考例の変形例に係る電気的接続構造の端子部を示す断面図である。なお、変形例においては、上記参考例と基本構成が共通しているため、対応する部分に同符号或いは同符号にＡを付して重複した説明を省略する。 FIG. 8 is a cross-sectional view showing a terminal portion of an electrical connection structure according to a modification of this reference example. In the modified example, since the basic configuration is the same as that of the reference example, the corresponding portions are denoted by the same reference numerals or the same reference numerals with an A, and redundant description is omitted.
図８のように、本変形例は、ステンレス・リング５７Ａの内径を貫通孔５９と同径に形成したものである。これに応じて、ステンレス・リング５７Ａの外径が、参考例と比較して小径に設定されている。 As shown in FIG. 8, in this modification, the inner diameter of the stainless steel ring 57 </ b> A is formed to be the same diameter as the through hole 59. Accordingly, the outer diameter of the stainless steel ring 57A is set smaller than that of the reference example.
このような変形例においても、上記参考例と同様の作用効果を奏することができる。 Also in such a modification, the same effect as the reference example can be obtained.
図９は、本発明の実施例１に係る電気的接続構造の斜視断面図である。なお、本実施例においては、上記参考例と基本構成が共通しているため、対応する部分に同符号或いは同符号にＢを付して重複した説明を省略する。 FIG. 9 is a perspective sectional view of the electrical connection structure according to the first embodiment of the present invention. In this embodiment, since the basic configuration is the same as that of the above-described reference example, the same reference numerals are assigned to the corresponding portions or B is added to the same reference numerals, and redundant description is omitted.
図９のように、本実施例の電気的接続構造４Ｂは、ステンレス・リング５７Ｂが、端子部５５Ｂの接続部５６に対して積層方向で重ならないようにしたものである。 As shown in FIG. 9, the electrical connection structure 4B of the present embodiment is such that the stainless steel ring 57B does not overlap the connection portion 56 of the terminal portion 55B in the stacking direction.
すなわち、ステンレス・リング５７Ｂは、接続部５６の外径よりも大きい内径を有するリング状であり、接続部５６に対して外側に位置している。本実施例では、ステンレス・リング５７Ｂの内径が、接続部５６及び導電性接着剤６３Ｂの第２固着部６３Ｂｂの外径と同一径となっている。 That is, the stainless steel ring 57 </ b> B has a ring shape having an inner diameter larger than the outer diameter of the connection portion 56, and is located outside the connection portion 56. In this embodiment, the inner diameter of the stainless steel ring 57B is the same as the outer diameter of the connection portion 56 and the second fixing portion 63Bb of the conductive adhesive 63B.
かかる電気的接続構造４Ｂでは、接続部５６の裏面側にステンレス・リング５７Ｂが位置しないので、接続部５６がステンレス・リング５７Ｂによって引っ張られ或いは拘束されることがない。このため、接続部５６の全域にわたって、導電性接着剤６３Ｂの第２固着部６３Ｂｂとの間の応力を低減することができる。 In such an electrical connection structure 4B, since the stainless steel ring 57B is not located on the back side of the connection portion 56, the connection portion 56 is not pulled or restrained by the stainless steel ring 57B. For this reason, the stress between the second adhesive portion 63Bb of the conductive adhesive 63B can be reduced over the entire area of the connection portion 56.
図１０は、電気的接続構造の応力分布を示し、（ａ）は斜視断面図、（ｂ）は導電性接着剤のみの斜視断面図、（ｃ）は（ｂ）のＸ−Ｘ線矢視に係る斜視断面図である。なお、図１０の応力分布は、参考例の図７と同様にして解析したものであり、濃度の濃い部分が応力の高い部分を示す。 10A and 10B show the stress distribution of the electrical connection structure, where FIG. 10A is a perspective sectional view, FIG. 10B is a perspective sectional view of only a conductive adhesive, and FIG. 10C is a sectional view taken along line XX in FIG. It is a perspective sectional view concerning. Note that the stress distribution in FIG. 10 is analyzed in the same manner as in FIG. 7 of the reference example, and the portion with a high concentration indicates a portion with a high stress.
ここで、上記参考例では、図７のように（特に図７（ｃ）参照）、接続部５５と導電性接着剤６３の第２固着部６３ｂとの間の応力を低減することはできたものの、ステンレス・リング５７に重なる部分で応力の高い部分が残存していた。 Here, in the above reference example, as shown in FIG. 7 (see particularly FIG. 7C), the stress between the connection portion 55 and the second fixing portion 63b of the conductive adhesive 63 could be reduced. However, a high stress portion remained in the portion overlapping the stainless steel ring 57.
これに対し、電気的接続構造４Ｂでは、図１０から明らかなように（特に図１０（ｃ）参照）、端子部５５Ｂの接続部５６と導電性接着剤６３Ｂの第２固着部６３Ｂｂとの間で生じる応力を全域にわたって低減できることが確認できた。 In contrast, in the electrical connection structure 4B, as is apparent from FIG. 10 (particularly, refer to FIG. 10C), between the connection portion 56 of the terminal portion 55B and the second fixing portion 63Bb of the conductive adhesive 63B. It was confirmed that the stress generated in the process can be reduced over the entire area.
このように、本実施例の電気的接続構造４Ｂでは、端子部５５Ｂの接続部５６と導電性接着剤６３Ｂの第２固着部６３Ｂｂとの間で生じる応力を全域にわたって低減できる。従って、本実施例では、より確実に端子部５５と導電性接着剤６３Ｂとの間での熱膨張による剥がれを抑制して、電気的接続に対する長期信頼性を確保することができる。 Thus, in the electrical connection structure 4B of the present embodiment, the stress generated between the connection portion 56 of the terminal portion 55B and the second fixing portion 63Bb of the conductive adhesive 63B can be reduced over the entire area. Therefore, in this embodiment, it is possible to more reliably suppress peeling due to thermal expansion between the terminal portion 55 and the conductive adhesive 63B, thereby ensuring long-term reliability for electrical connection.
また、本実施例では、上記参考例と同様の作用効果も奏することができる。 Further, in this embodiment, the same operational effects as those of the reference example can be obtained.
１ ヘッド・サスペンション
３ 圧電素子
３ａ 電極
４Ｂ 電気的接続構造
５ 基部
７ ロード・ビーム
９ ヘッド部
４５ フレキシャ（配線部材）
４９ 電気絶縁層
５１，５３ 配線パターン（配線部）
５７Ｂ ステンレス・リング（障突部）
５５Ｂ 端子部
５６ 接続部
５９ 貫通孔
６３Ｂ 導電性接着剤
６３Ｂａ 第１固着部
６３Ｂｂ 第２固着部
DESCRIPTION OF SYMBOLS 1 Head suspension 3 Piezoelectric element 3a Electrode 4B Electrical connection structure 5 Base part 7 Load beam 9 Head part 45 Flexure (wiring member)
49 Electrical insulating layers 51, 53 Wiring pattern (wiring part)
57B Stainless steel ring
55B Terminal portion 56 Connection portion 59 Through hole 63B Conductive adhesive 63Ba First fixing portion 63Bb Second fixing portion
Claims (4)
前記圧電素子の電極に対向配置された配線部材の端子部を導電性接着剤によって固着接続し、前記端子部に貫通形成された貫通孔と、前記端子部の圧電素子側に対する反対側で前記貫通孔の周囲に露出して設けられた接続部とを備え、
前記配線部材は、前記圧電素子の電極に対向配置された電気絶縁層に配線部を積層して形成され、
前記貫通孔が前記電気絶縁層及び前記配線部を貫通して前記接続部が前記貫通孔の周囲の前記配線部からなり、
前記導電性接着剤は、前記貫通孔を介し前記接続部の表面から前記電極の表面にわたって配置固化し、
前記導電性接着剤の配置固化により前記端子部と前記圧電素子との間に第１固着部を備えると共に前記接続部の表面に第２固着部を備え、
前記第１固着部は、前記貫通孔の周囲で前記端子部の前記電気絶縁層に固着されると共に、前記第２固着部は、前記貫通孔の周囲で前記接続部の表面に固着され、
前記第１固着部の前記電気絶縁層への固着は、前記貫通孔から放射方向へ前記電気絶縁層の厚みを超える範囲で行われ、
前記第２固着部の前記接続部の表面への固着は、前記貫通孔から放射方向へ前記配線部の厚みを超える範囲で行われ、
前記第１固着部の前記貫通孔から放射方向への範囲は、前記第２固着部の前記貫通孔から放射方向への範囲と同一又は前記第２固着部の前記貫通孔から放射方向への範囲を超え、
前記電気絶縁層の前記圧電素子側で前記貫通孔の周囲且つ前記第１固着部の前記電気絶縁層に対する固着の範囲の周囲で前記電気絶縁層から突設され前記導電性接着剤の固化前の流れ出しの障害となる障突部を備え、
前記障突部は、前記接続部に対して外側に位置し積層方向で重ならない、
ことを特徴とする圧電素子の電気的接続構造。 A piezoelectric element that supports a read / write head portion via a load beam at a base portion and is deformed according to a voltage application state provided between the base portion and the load beam is provided via the load beam. An electrical connection structure of a piezoelectric element used for a head suspension that slightly moves the head portion in the sway direction with respect to the base portion,
The terminal portion of the wiring member disposed opposite to the electrode of the piezoelectric element is fixedly connected with a conductive adhesive, and the through hole formed through the terminal portion and the penetrating hole on the side opposite to the piezoelectric element side of the terminal portion. A connection portion provided exposed around the hole,
The wiring member is formed by laminating a wiring portion on an electrical insulating layer disposed to face the electrode of the piezoelectric element,
The through hole penetrates the electrical insulating layer and the wiring part, and the connection part is composed of the wiring part around the through hole,
The conductive adhesive is disposed and solidified from the surface of the connection portion to the surface of the electrode through the through hole,
A first fixing part is provided between the terminal part and the piezoelectric element by arrangement and solidification of the conductive adhesive, and a second fixing part is provided on the surface of the connection part,
The first fixing portion is fixed to the electrical insulating layer of the terminal portion around the through hole, and the second fixing portion is fixed to the surface of the connection portion around the through hole,
The fixing of the first fixing portion to the electrical insulating layer is performed in a range exceeding the thickness of the electrical insulating layer in the radial direction from the through hole,
The fixing of the second fixing part to the surface of the connection part is performed in a range exceeding the thickness of the wiring part in the radial direction from the through hole,
The range of the first fixing portion from the through hole in the radial direction is the same as the range of the second fixing portion from the through hole in the radial direction or the range of the second fixing portion from the through hole to the radial direction. Beyond
The electric insulating layer protrudes from the electric insulating layer around the through-hole on the piezoelectric element side and around the fixed range of the first fixing portion to the electric insulating layer, and before the conductive adhesive is solidified. Has an obstruction to obstruct the flow,
The obstacle protrusion is located outside the connection portion and does not overlap in the stacking direction.
An electrical connection structure for a piezoelectric element.
前記貫通孔は、前記配線部側の径が前記電気絶縁層側の径に対して同径以上に設定された、
ことを特徴とする圧電素子の電気的接続構造。 An electrical connection structure for a piezoelectric element according to claim 1,
The diameter of the through-hole is set to be equal to or larger than the diameter of the wiring portion side with respect to the diameter of the electrical insulating layer side,
An electrical connection structure for a piezoelectric element.
前記接続部は、リング状である、
ことを特徴とする電気的接続構造。 An electrical connection structure for a piezoelectric element according to claim 1 or 2,
The connecting portion is ring-shaped.
An electrical connection structure characterized by that.
前記障突部は、前記接続部の外径よりも大きい内径のリング状である、
ことを特徴とする圧電素子の電気的接続構造。 The electrical connection structure of the piezoelectric element according to any one of claims 1 to 3 ,
The obstacle portion is a ring shape having an inner diameter larger than the outer diameter of the connection portion.
An electrical connection structure for a piezoelectric element.
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