JP6102222B2 - Vacuum pump - Google Patents

Description

  The present invention relates to an integrated vacuum pump in which a pump unit and a control unit are integrated.

  As a vacuum pump used in a semiconductor manufacturing apparatus, an analysis apparatus, or the like, a turbo molecular pump in which a pump unit and a control unit described in Patent Document 1 are integrated is known. In the turbo molecular pump described in Patent Document 1, a control unit for driving and controlling the pump unit is coupled to the lower part of the pump unit that performs vacuum evacuation. For this reason, there is a problem that the height dimension of the turbo molecular pump (dimension in the axial direction of the pump) increases, and the space required for mounting the turbo molecular pump increases.

  Therefore, in the turbo molecular pump described in Patent Document 2, an increase in the height of the turbo molecular pump is suppressed by integrally attaching a control unit to the side surface of the pump unit. The control unit includes a heat sink in which heat radiating fins are formed, and heat generated from the circuit components is radiated by attaching a circuit board to the heat sink.

JP-A-11-173293 JP 2007-32535 A

  However, in the turbo molecular pump device described in Patent Document 1, the controller is disposed on the side surface side of the pump unit, and further, the radiating fin protrudes in the pump radial direction. There is a problem of end.

A vacuum pump according to a preferred embodiment of the present invention includes a pump unit that rotates a rotor at a high speed and discharges gas sucked from a pump intake port from a pump exhaust port provided in a base, a substrate on which electronic components are mounted, and a substrate And a control unit for controlling the operation of the pump unit, and a recess for housing the housing is formed on the side surface of the base of the pump unit. is, on the inner peripheral surface of the upper wall portion facing to the pump inlet side of the housing is a substrate contact fixing, the outer peripheral surface of the upper wall portion facing to the pump inlet side of the casing, are exposed from the recess A first radiating fin is formed in the region, and a contact surface that comes into contact with the wall surface of the concave portion is formed on the outer peripheral surface of the region of the upper wall portion facing the pump inlet port of the housing in the concave portion. .
In a more preferred embodiment, the substrate has an inner wall surface of the upper wall portion facing the pump inlet side of the housing and an inner peripheral surface of the region where the first heat dissipating fins are formed and a region corresponding to a contact surface contacting the concave wall surface . It is in contact with both the inner peripheral surface.
Further, the connector is preferably disposed on the outer peripheral surface of the upper wall portion facing the pump inlet side of the housing .
In a more preferred embodiment, one or more second radiating fins extending in the circumferential direction are provided on the side peripheral surface of the base in the pump shaft direction.
In a more preferred embodiment, a fan that blows air in the extending direction of the first heat dissipating fins is provided.

  According to the present invention, in the integrated vacuum pump, it is possible to reduce the size of the entire pump and improve the cooling performance of the control unit.

FIG. 1 is a cross-sectional view of a power source integrated turbo molecular pump 1. FIG. 2 is a front view of the turbo molecular pump 1. FIG. 3 is a side view of the turbo molecular pump 1. FIG. 4 is a bottom view of the turbo molecular pump 1. FIG. 5 is a view of the control unit 100 as seen from the pump inlet side. 6 is a cross-sectional view taken along the line AA in FIG. FIG. 7 is a diagram illustrating the flow of cooling air. FIG. 8 is a view showing a modified example of the radiation fin.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. 1 to 4 are views showing an embodiment of a vacuum pump according to the present invention. FIG. 1 is a cross-sectional view of a power source integrated turbo molecular pump 1. 2 is a front view of the turbo molecular pump 1, FIG. 3 is a side view, and FIG. 4 is a bottom view. In FIG. 4, the portion of the connector that connects the pump unit 10 and the control unit 100 is shown in a broken section.

  The turbo-molecular pump 1 has a pump unit 10 that performs evacuation and a control unit 100 that drives the pump unit 10. As shown in FIG. 1, the base 2 of the pump unit 10 is formed with a recess 23 having a shape in which a part of the side surface of the base is cut away. The control unit 100 is housed in the recess 23 and is fixed to the base 2 of the pump unit 10 with bolts.

  First, the structure of the pump unit 10 will be described. The pump unit 10 includes a turbo pump unit having a turbine blade and a Holweck pump unit having a spiral groove as an exhaust function unit. Of course, the present invention is not limited to a vacuum pump having a turbo pump part and a Holweck pump part in the exhaust function part, but only a vacuum pump having only turbine blades and a drag pump such as a Ziegburn pump or a Holweck pump. It can also be applied to vacuum pumps and vacuum pumps that combine them.

  The turbo pump unit includes a plurality of stages of rotating blades 30 formed on the rotor 3 and a plurality of stages of fixed blades 20 arranged on the base 2 side. On the other hand, the Holweck pump portion provided on the downstream side of the turbo pump portion is composed of a pair of cylindrical portions 31a and 31b formed on the rotor 3 and a pair of stators 21a and 21b disposed on the base 2 side. Yes. Of the inner and outer peripheral surfaces of the cylindrical stators 21a and 21b, spiral grooves are formed on the peripheral surfaces facing the cylindrical portions 31a and 31b.

  The rotor 3 is fastened to the shaft 5, and the rotor 3 and the shaft 5 constitute an integral rotating body unit. The shaft 5 is rotationally driven by the motor 4. The motor rotor 4 a is provided on the shaft 5, and the motor stator 4 b is fixed to the base 2. The upper side of the shaft 5 is supported in a non-contact manner by a permanent magnet magnetic bearing 6 using permanent magnets 6 a and 6 b, and the lower side of the shaft 5 is rotatably supported by a ball bearing 8.

  A ball bearing 9 is held on the inner peripheral side of the magnet holder 11. The ball bearing 9 functions as a touch-down bearing that limits the radial deflection of the upper part of the shaft. In a state where the rotor 3 is in a steady rotation, the shaft 5 and the ball bearing 9 are not in contact with each other, and when a large disturbance is applied or when the runout of the rotor 3 becomes large at the time of acceleration or deceleration of rotation Furthermore, the shaft 5 contacts the inner ring of the ball bearing 9. As the ball bearings 8 and 9, for example, deep groove ball bearings are used. The lower ball bearing 8 is filled with grease.

  A base cover 2 a for sealing the opening 24 when attaching or detaching the ball bearing 8 is fixed to the bottom surface of the base 2 with bolts. The pump casing 12 is formed with an inlet flange 12a for fixing the pump unit 10 to a chamber or the like. An exhaust port 22 is provided on the side surface of the base 2. The gas molecules flowing in from the intake port flange 12a are transferred to the pump downstream side by the turbo pump unit and the Holweck pump unit and exhausted from the exhaust port 22.

  A recess 23 for accommodating the control unit 100 is formed on the side surface of the base 2. The surface of the recess 23 includes a recess bottom surface 23a (see FIG. 1) parallel to the pump bottom surface and the inlet flange surface, and a recess side surface 23b (see FIG. 1) perpendicular to the recess bottom surface 23a. As shown in FIG. 4, the recess side surface 23 b has two planes 231 and 232 and one arc surface 233. The recess bottom surface 23a is provided close to the lower end of the Holweck pump portion. Further, the recess 23 reaches the vicinity of the opening 24 for attaching and detaching the ball bearing 8, and the arc surface 233 is formed near the opening 24. Moreover, the range of the circumferential direction of the recessed part 23 is set to about 180 deg as shown in FIG. A plurality of circumferential radiating fins 201 are formed on the outer peripheral surface of the base 2.

  Next, the control unit 100 will be described. The outer shape of the control unit 100 is a substantially rectangular parallelepiped shape, and the side surface of the recess 23 facing the recess side surface 23b is the same shape as the recess side surface 23b. FIG. 5 is a plan view of the control unit 100 as seen from the pump inlet side. 6 is a cross-sectional view taken along the line AA of FIG. 5, and is a cross-sectional view similar to that shown in FIG. 5 and 6, the alternate long and two short dashes line indicates the outer peripheral surface of the base 2 to which the control unit 100 is fixed.

  The control unit 100 includes a unit case 101, electronic components housed in the unit case 101, connectors 102, 103, and the like. The unit case 101 has a heat sink case 101a in which heat dissipating fins 106 are formed on the outer peripheral surface, the circuit board and the connector 102 are fixed, and a bottom plate 101b provided so as to cover a lower opening of the heat sink case 101a. . As described above, the unit case 101 has a sealed structure in which dust or the like cannot enter from the outside.

  The upper wall part 110 of the heat sink case 101a is a wall part that functions as a heat sink, and is set to be thicker than other wall parts. It is preferable to use a material having excellent thermal conductivity such as an aluminum material for the heat sink case 101a. A plurality of heat radiating fins 106 are formed on the outer peripheral surface of the upper wall portion 110. A circuit board 104 is fixed to the inner peripheral surface of the upper wall portion 110. Another circuit board 105 is fixed to the inner peripheral surface of the upper wall portion 110 via a support column 108.

  A connector 102 is disposed on the upper wall portion 110. The connector 102 is connected to power wiring and control wiring, and is connected to an external device via the connector 102. That is, power is supplied from an external device via the connector 102, and control signals are exchanged with the external device via the connector 102. The electrical connection between the control unit 100 and the pump unit 10 is performed by connecting the connector 103 on the control unit side to the connector 200 on the pump unit side, as shown in FIG. The connector 200 is provided on the recess side surface 23 b of the recess 23. On the other hand, the connector 103 is not fixed to the unit case 101 of the control unit 100, but is in a flexible state while being connected to the wiring.

  The back side of the circuit board 104 is in close contact with the inner peripheral surface of the upper wall portion 110 that is a heat sink. For example, when the metal pattern is not formed on the back surface side of the circuit board 104 and there is no problem in electrical insulation, the circuit board 104 is fixed so that the back surface side contacts the wall surface. In addition, when a metal pattern or the like is formed and it is necessary to ensure insulation from the wall surface, the metal pattern is fixed to the wall surface via an insulating material having excellent heat conduction performance such as a heat radiation insulating sheet. On the circuit board 104, for example, an electronic component 107 having a large heat generation amount is mounted, such as a power semiconductor element for driving a motor. The heat generated in the circuit board 104 is transferred from the back side of the circuit board 104 to the upper wall portion 110.

  On the other hand, an electronic component 107 such as a control IC that has a relatively small amount of heat generation is mounted on the circuit board 105 fixed to the upper wall portion 110 via the support column 108. In the case of the circuit board 105, electronic components are also mounted on the back side. The heat generated in the circuit board 105 is transferred to the upper wall portion 110 through the support column 108. In the present embodiment, the circuit board has a two-layer structure, but it may have three or more layers. It is preferable that an electronic component with a larger calorific value is disposed closer to the upper wall portion 110.

  As shown in FIG. 1, the heat sink case 101 a is bolted to the bottom surface 23 a of the recess 23. As shown in FIG. 5, the upper wall portion 110 of the heat sink case 101a is formed with three through holes 112 for fixing bolts. In the upper wall portion 110, a region indicated by reference numeral R2 is a region where the heat radiating fins 106 are formed, and the outer peripheral surfaces of the other regions are planar. When fixing the control unit 100 to the pump unit 10, first, the heat sink case 101a on which the circuit boards 104 and 105 are mounted is fixed to the base 2, and then the connector 103 is connected to the connector 200 on the pump unit side, Finally, the bottom plate 101b is attached to the heat sink case 101a.

  When the control unit 100 is housed in the recess 23 of the base 2 and fixed to the base 2 with bolts, a planar region R3 (region surrounded by a solid line and a two-dot chain line) below the region R2 of the upper wall 110 is shown. Is accommodated in the recess 23 of the base 2 and contacts the recess bottom surface 23 a of the recess 23. On the other hand, the region R2 and the region above the region R2 of the upper wall portion 110 are exposed outside the recess 23. The connector 102 is provided in the exposed plane area.

  The height dimension H <b> 1 (FIG. 6) of the unit case 101 is set to be substantially the same as the axial dimension of the recess 23. Therefore, as shown in FIGS. 1 to 3, the pump axial dimension when the pump unit 10 and the control unit 100 are integrated is suppressed to be substantially the same as the pump axial dimension of the pump unit 10 alone. The reason why the height of the control unit 100 can be suppressed in this way is that the circuit boards 104 and 105 are arranged horizontally (perpendicular to the pump shaft). Then, by allowing the control unit 100 to sink deeply into the base of the pump unit 10, the pump radial dimension could be reduced.

  As described above, the heat sink case 101 a has an upper wall portion 110 in which heat radiation fins are formed in the portion exposed from the recess 23, and the portion housed in the recess 23 is in contact with the base 2. The heat generated in the circuit boards 104 and 105 is transferred to the upper wall portion 110, and then is radiated from the radiating fins to the atmosphere and moves from the surface in contact with the base 2 to the base 2 having a large heat capacity. . In particular, since the entire rear surface side of the circuit board 104 is in contact with the inner peripheral surface of the upper wall portion, heat transfer to the upper wall portion 110 is effectively performed. Furthermore, since it is in contact over both the area where the heat dissipating fins of the upper wall part 110 are provided and the area in contact with the base 2, the heat transfer path to the heat dissipating fins 106 and the base contact surface is short, and the amount of heat generated The cooling effect related to the large circuit board 104 is excellent.

  As described above, in the turbo molecular pump of the present embodiment, natural air cooling that radiates heat from the outer surface to the atmosphere is employed for cooling the pump unit 10 and the control unit 100. Therefore, in order to further improve the cooling performance, a cooling fan 300 may be mounted as shown in FIG. The cooling fan 300 is attached to the right side of the pump via a bracket 301.

  In the present embodiment, the radiating fins 106 are formed so as to continue to the left and right side wall portions 111 and 112 together with the upper wall portion 110, but may be configured to be provided only on the upper wall portion 110. Each radiating fin 106 formed on the upper wall portion 110 is formed so as to extend from one side wall portion to the other side wall portion. That is, the gap between the radiating fin 106 and the adjacent radiating fin 106 extends in the horizontal direction in the figure. Cooling air from the cooling fan 300 is blown to the control unit 100 and the pump unit 10 as indicated by solid arrows. The cooling air that has flowed into the gaps between the heat radiating fins 106 flows in the gaps as indicated by broken line arrows. Similarly, the cooling air blown from the cooling fan 300 to the pump unit 10 flows in the outer peripheral surface of the pump and in the grooves of the radiating fins 201 as indicated by broken arrows.

  In general, the cooling fan 300 is arranged so that the flow of cooling air is the same as the extending direction of the radiating fins 106. Therefore, as shown in FIG. 7, the heat dissipating fins 106 are formed so that the extending direction is the left-right direction in the figure, and the cooling fan 300 is arranged at the left-right position where the control unit 100 does not protrude greatly. When viewed, the size can be reduced (that is, the installation area can be reduced).

  FIG. 8 shows a modification of the radiating fin 106. In addition, the area | region enclosed with the dashed-two dotted line has shown the surface which contacts the base 2 of the pump unit 10. FIG. In the first modification shown in FIG. 8A, the radiating fins 106 are arranged in an arc shape so that the cooling air flowing in the groove flows in a form (arc shape) along the outer peripheral surface of the pump unit. It is comprised by three types of radiation fins 106a, 106b, 106c. That is, the radiating fin 106a is inclined from the lower right to the upper left in the figure, the radiating fin 106b is extended in the horizontal direction in the figure, and the radiating fin 106c is inclined from the upper right to the lower left in the figure.

  The cooling air that has flowed into the gap between the adjacent radiating fins 106a flows along the extending direction of the radiating fin 106a and flows into the gap between the next radiating fins 106b. The cooling air flows between the radiation fins 106b from the right side to the left side in the figure, and flows between the fins of the third radiation fin 106c. And it flows between the radiation fins 106c in the lower left direction in the figure. As described above, by adopting a fin shape as shown in FIG. 8A, the heat radiation area can be increased as compared with the embodiment shown in FIG. Further, since the cooling air blown from the cooling fan flows smoothly in a circular arc shape without being disturbed, such as the heat radiation fin 106a → the heat radiation fin 106b → the heat radiation fin 106c, the heat radiation performance can be improved.

  In the second modified example shown in FIG. 8B, the radiation fins 106a to 106c shown in FIG. 8A are replaced with a plurality of columnar fins 106d arranged in a line. In this case, the cooling air flows through the same passage as in FIG. 8A and also flows between the fins arranged in a row. As a result, the heat dissipation area can be increased.

  As described above, in the vacuum pump according to the present embodiment, the recess 23 for housing the unit case 101 is formed on the side surface of the base of the pump unit 10, and the upper wall portion 110 of the unit case 101 on the pump inlet side is formed. The circuit board 104 is contacted and fixed on the inner peripheral side, and on the outer peripheral side of the upper wall portion 110, a plurality of heat radiation fins 106 are formed in the region R2 exposed from the concave portion 23, and are accommodated in the concave portion 23. A contact surface 113 that is in contact with the concave wall surface (the concave bottom surface 23a) is formed in the region.

  With such a configuration, the circuit board 104 is fixed, and the upper wall portion 110 functioning as a heat sink radiates heat from the radiation fins 106 to the atmosphere and from the surface in contact with the base 2 to the pump unit 10. It can dissipate heat. As a result, by storing the control unit 100 in the recess 23, the integrated vacuum pump can be miniaturized and the cooling performance of the control unit 100 can be improved.

  Further, as shown in FIGS. 5 and 6, the circuit board 104 has a wall portion region in which an inner peripheral surface of the wall portion region where the heat dissipating fins 106 are formed and a contact surface (surface of the region R <b> 3) that contacts the recess 23. Therefore, the heat transfer path to the heat radiation fin 106 and the recess bottom surface 23a is shortened, and the heat radiation effect to the atmosphere and the base 2 is improved. Of course, the circuit board 104 may be in contact with either one.

  Further, by arranging the connector 102 on the outer peripheral surface of the pump inlet side wall (upper wall 110), it is possible to prevent the wiring connected to the connector 102 from protruding greatly to the side of the pump. In the above-described embodiment, the power line and the control line are connected by the single connector 102. However, the power system connector and the control system connector are provided separately, and these two connectors are connected to the upper wall portion. You may make it arrange | position on 110 outer peripheral surface.

  Furthermore, one or more ring-shaped heat radiation fins 201 extending in the circumferential direction may be provided on the side peripheral surface of the base 2 of the pump unit 10. By providing the heat dissipating fins 201, the heat dissipating performance from the base 2 to the atmosphere is improved, and the cooling performance of the control unit 100 can be improved.

  By further including the cooling fan 300 that blows air in the extending direction of the heat radiating fins 106, the amount of heat radiated from the heat radiating fins 106 can be increased, and the cooling performance of the control unit 100 is improved.

  In addition, the above description is an example to the last, and this invention is not limited to the said embodiment at all unless the characteristic of this invention is impaired. For example, in the above-described embodiment, the turbo molecular pump using the permanent magnet magnetic bearing 6 as a bearing has been described as an example. However, the present invention is not limited to this and can be applied to various power source integrated vacuum pumps.

  1: turbo molecular pump, 2: base, 3: rotor, 4: motor, 10: pump unit, 12: pump casing, 12a: intake port flange, 22: exhaust port, 23: recess, 23a: recess bottom, 23b: Side surface of recess, 100: control unit, 101: unit case, 101a: heat sink case, 101b: bottom plate, 102, 103, 200: connector, 104, 105: circuit board, 106, 106a to 106c, 201: radiating fin, 106d: Columnar fin, 107: electronic component, 110: upper wall portion, 113: contact surface, 300: cooling fan

Claims (5)

A pump unit that rotates the rotor at a high speed and discharges the gas sucked from the pump inlet through a pump outlet provided in the base;
A board on which electronic components are mounted, a housing for housing the board, and a connector used for connection with an external device, and a control unit for controlling the operation of the pump unit,
On the base side surface of the pump unit, a recess for housing the housing is formed,
Wherein said substrate is contacted fixed to the inner peripheral surface of the upper wall portion facing to the pump inlet side of the housing,
Wherein the outer peripheral surface of the upper wall portion facing to the pump inlet side of the housing, the first heat radiation fin is formed in a region exposed from the recess and the upper wall facing to the pump inlet side of the housing A vacuum pump in which a contact surface that comes into contact with the wall surface of the recess is formed on an outer peripheral surface of an area of the portion that is accommodated in the recess. The vacuum pump according to claim 1, wherein
The substrate, the upper wall facing to the pump inlet side of the housing, a front Symbol inner peripheral surface of the first heat radiation fin is formed region, a region corresponding to the contact surface in contact with the recess wall A vacuum pump that is in contact with both the inner surface and the inner surface. The vacuum pump according to claim 1 or 2,
The vacuum pump which has arrange | positioned the said connector in the outer peripheral surface of the upper wall part which faces the pump inlet side of the said housing | casing. The vacuum pump according to any one of claims 1 to 3,
A vacuum pump in which one or more second radiating fins extending in a circumferential direction are provided on a side circumferential surface of the base in a pump axial direction. The vacuum pump according to any one of claims 1 to 4,
The vacuum pump further provided with the fan which ventilates in the extension direction of the said 1st radiation fin.

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