JP6187728B1 - Wireless communication device and manufacturing method thereof - Google Patents

Abstract

Improve the connection reliability of the coil antenna. A method of manufacturing a wireless communication device of the present invention includes an RFIC element mounted on a first surface, and an interlayer conductor extending from the first surface to a second surface facing the first surface and connected to the RFIC element, Preparing a circuit board comprising: a step of covering at least the first surface of the circuit board with a body block; and being connected to an end of the interlayer conductor, and circulating around the circuit board and the body block Providing a coiled conductor to form a coil antenna connected to the RFIC element via the interlayer conductor.

Description

  The present invention relates to a wireless communication device used for a short-range wireless communication apparatus such as an RFID (Radio Frequency Identification) tag.

  In recent years, a wireless communication device that forms a coil antenna by connecting a plurality of conductors is known (see, for example, Patent Document 1).

  In the wireless communication device of Patent Document 1, a coil antenna is formed by connecting a plurality of conductors such as a lower conductor, a side conductor, an upper conductor, and an interlayer conductor formed in an insulating layer.

Japanese Patent No. 5573937

  In the wireless communication device of Patent Document 1, since the coil antenna is formed by connecting a plurality of conductors in a plurality of different processes, there is still room for improvement in terms of improving the connection reliability of the coil antenna.

  The present invention solves the above-described problems, and an object of the present invention is to provide a wireless communication device capable of improving the connection reliability of a coil antenna and a manufacturing method thereof.

A method of manufacturing a wireless communication device of one aspect of the present invention includes:
Preparing a circuit board comprising: an RFIC element mounted on the first surface; and an interlayer conductor extending from the first surface to a second surface opposite to the first surface and connected to the RFIC element;
Covering at least the first surface of the circuit board with an element block;
Providing a coiled conductor that goes around the circuit board and the element block, and forming a coil antenna connected to the RFIC element via the interlayer conductor;
including.

A wireless communication device of one embodiment of the present invention includes:
A circuit board comprising: an RFIC element mounted on a first surface; and an interlayer conductor extending from the first surface to a second surface opposite to the first surface and connected to the RFIC element;
An element block covering at least the first surface of the circuit board;
A coil antenna connected to the RFIC element via the interlayer conductor and formed of a coiled conductor that goes around the circuit board and the element block;
Is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the radio | wireless communication device which can improve the connection reliability of a coil antenna, and its manufacturing method can be provided.

1 is a perspective view of a wireless communication device according to a first embodiment of the present invention. 1 is a schematic configuration diagram of a wireless communication device according to a first embodiment of the present invention. 1 is a circuit diagram of a wireless communication device according to a first embodiment of the present invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 1 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 1 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 1 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 1 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 1 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 1 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 1 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 1 which concerns on this invention. FIG. 3 is a perspective view of the wireless communication device according to the second embodiment of the present invention. Schematic configuration diagram of a wireless communication device according to a second embodiment of the present invention The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 2 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 2 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 2 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 2 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 2 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 2 which concerns on this invention. 3 is a perspective view of a wireless communication device according to a third embodiment of the present invention. Partial enlarged view of a wireless communication device according to a third embodiment of the present invention Schematic configuration diagram of a wireless communication device according to a third embodiment of the present invention The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 3 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 3 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 3 which concerns on this invention. A perspective view of a wireless communication device according to a fourth embodiment of the present invention Schematic configuration diagram of a wireless communication device according to a fourth embodiment of the present invention The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 4 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 4 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 4 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 4 which concerns on this invention. Schematic configuration diagram of a wireless communication device according to a fifth embodiment of the present invention A perspective view of an article with a wireless communication device according to a sixth embodiment of the present invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 7 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 7 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 7 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 7 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 7 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 7 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 7 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 7 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 7 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 8 which concerns on this invention. The figure which shows the manufacturing process of the radio | wireless communication device of Embodiment 8 which concerns on this invention.

(Background to the present invention)
In the wireless communication device of Patent Document 1, a coil antenna is formed by connecting a plurality of conductors through a plurality of different processes. Since the plurality of conductors are formed and connected in different processes, an interface is formed at a place where the conductors are connected. The present inventors have found that the connection reliability of the coil antenna is reduced at this interface. Accordingly, the present inventors have reached the following invention in order to improve the connection reliability of the coil antenna.

A method of manufacturing a wireless communication device of one aspect of the present invention includes:
Preparing a circuit board comprising: an RFIC element mounted on the first surface; and an interlayer conductor extending from the first surface to a second surface opposite to the first surface and connected to the RFIC element;
Covering at least the first surface of the circuit board with an element block;
Providing a coiled conductor that goes around the circuit board and the element block, and forming a coil antenna connected to the RFIC element via the interlayer conductor;
including.

  With such a configuration, since the coil antenna is formed by the coiled conductor that circulates around the circuit board and the element block, a wireless communication device having a coil antenna with improved connection reliability can be manufactured.

  The step of covering the circuit board with the element block may embed the circuit board in the element block.

  With this configuration, since the circuit board is not exposed to the outside of the element block, a wireless communication device with improved heat resistance can be manufactured.

The step of preparing the circuit board includes preparing a mother board in which a plurality of circuit boards are continuously provided,
The step of covering the circuit board with the element block covers the mother substrate with the element block,
The step of forming the coil antenna includes a plurality of coil-shaped conductors that circulate between the element block and the mother board, with a direction in which the plurality of circuit boards are continuous as a winding axis direction. By forming a plurality of coil antennas connected to each, a collective substrate in a state where a plurality of wireless communication devices are connected,
The method may further include a step of cutting the collective substrate in a direction intersecting the winding axis direction to obtain a piece of wireless communication device.

  With such a configuration, a plurality of wireless communication devices can be easily manufactured.

  In the method for manufacturing the wireless communication device, the coiled conductor may be a plating pattern.

  With such a configuration, a wireless communication device having a coil antenna whose connection reliability is improved by a plating pattern can be easily manufactured.

  The step of forming the coil antenna includes the step of activating the pattern formation region of the circuit board and the element block by laser processing and forming the plating pattern by forming a plating film in the pattern formation region. May be included.

  With such a configuration, since a plating pattern can be formed by laser processing, a wireless communication device having a coil antenna with improved connection reliability can be easily manufactured.

  The step of forming the plating pattern may include a step of performing electrolytic plating.

  With such a configuration, the plating pattern can be grown thicker.

  The element block may include a plating nucleus material.

  With such a configuration, the plating pattern can be more easily formed by laser processing.

Furthermore,
Covering the outer peripheral surface of the element block with a thick film layer containing a plating nucleus;
Including
In the step of forming the plating pattern, laser processing may be performed from above the thick film layer.

  With such a configuration, the plating pattern can be formed more easily and at low cost by performing laser processing on the thick film layer.

  In the method of manufacturing a wireless communication device, the coiled conductor may be a metal wire.

  With such a configuration, the resistance of the coil antenna itself can be reduced.

  In the method of manufacturing a wireless communication device, the coiled conductor may be a spring material.

  With such a configuration, the resistance of the coil antenna itself can be reduced, and the shape of the coil antenna can be easily maintained.

A wireless communication device of one embodiment of the present invention includes:
A circuit board comprising: an RFIC element mounted on a first surface; and an interlayer conductor extending from the first surface to a second surface opposite to the first surface and connected to the RFIC element;
An element block covering at least the first surface of the circuit board;
A coil antenna connected to the RFIC element via the interlayer conductor and formed of a coiled conductor that goes around the circuit board and the element block;
Is provided.

  With such a configuration, since the coil antenna is formed by the coil-shaped conductor that goes around the circuit board and the element block, the connection reliability of the coil antenna can be improved.

  The circuit board may be embedded in the element block.

  With such a configuration, since the circuit board is not exposed to the outside of the element block, the heat resistance can be improved.

  The interlayer conductor may be a metal pin.

  With such a configuration, the DC resistance component can be made smaller than that of the sintered metal body or the conductor film, so that the loss due to the interlayer conductor can be reduced.

  In the wireless communication device, the coiled conductor may be a plating pattern.

  With such a configuration, the connection reliability of the coil antenna can be improved.

  In the wireless communication device, the coiled conductor may be a metal wire.

  With such a configuration, the resistance of the coil antenna itself can be reduced.

  In the wireless communication device, the coiled conductor may be a spring material.

  With such a configuration, the resistance of the coil antenna itself can be reduced, and the shape of the coil antenna can be easily maintained.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In each drawing, each element is exaggerated for easy explanation.

(Embodiment 1)
[overall structure]
FIG. 1 is a perspective view of a wireless communication device 10A according to the first embodiment of the present invention. In the orthogonal X, Y, Z coordinate system in FIG. 1, the X-axis direction indicates the width direction of the wireless communication device 10A, the Y-axis direction indicates the thickness direction of the wireless communication device 10A, and the Z-axis direction indicates the wireless communication device. The height direction of 10A is shown. FIG. 2 is a schematic configuration diagram of the wireless communication device 10A.

  As shown in FIG. 1, the wireless communication device 10 </ b> A includes a circuit board 11, a body block 30 that covers the circuit board 11, and a coil antenna formed by a plating pattern 40 that goes around the circuit board 11 and the body block 30. And comprising. In Embodiment 1, although not shown in FIG. 1 for ease of explanation, the plating pattern 40 is prevented from being oxidized from above the coil antenna, the impact resistance and heat resistance of the wireless communication device itself, Is formed with a protective layer 50 for improving moldability during resin embedding. In addition, although the side surface of the circuit board 11 is exposed from the end surface in the Y-axis direction of the element block 30, this side surface may also be covered with the element block 30.

<Circuit board>
As shown in FIG. 1, the circuit board 11 has a first surface PS1, a second surface PS2 facing the first surface PS1, and four side surfaces connected to the first surface PS1 and the second surface PS2. It is a flat printed wiring board having a rectangular shape in plan view. As shown in FIG. 2, a wiring conductor pattern 14 is formed on the first surface PS <b> 1 of the circuit board 11. On the first surface PS <b> 1 of the circuit board 11, the RFIC element 12, the chip capacitor 13, and the like are mounted on the wiring conductor pattern 14. The circuit board 11 includes interlayer conductors 20A and 20B extending from the first surface PS1 to the second surface PS2, that is, in the Z-axis direction. The interlayer conductors 20 </ b> A and 20 </ b> B are electrically connected to the RFIC element 12 and the chip capacitor 13 through the wiring conductor pattern 14 and are also electrically connected to a coil antenna formed by the plating pattern 40.

  The circuit board 11 may be, for example, a glass epoxy board or a resin board, or may be a ceramic board formed with a thick film pattern. A substrate having heat resistance against heat when the device is embedded in a resin molded body, specifically, a substrate having low thermal conductivity typified by FR4 (Flame Retardant Type 4) is preferable. The wiring conductor pattern 14 is patterned, for example, by etching a copper foil. The RFIC element 12 is, for example, a packaged RFIC chip (bare chip) having input / output terminals. The RFIC chip is an IC chip on which an RF circuit, a memory circuit, a control circuit, etc. for an RFID system are mounted. The chip capacitor 13 is, for example, a multilayer ceramic chip component. The interlayer conductors 20A and 20B are, for example, metal columnar bodies such as through-hole conductors by plating or the like, sintered metal bodies by firing of conductive paste, or thin-film metal bodies by etching of conductive thin films.

<Element block>
The element block 30 is made of a resin member that covers the first surface PS1 of the circuit board 11 and protects mounting components such as the RFIC element 12 mounted on the first surface PS1 of the circuit board 11. This resin member is also preferably a resin member having heat resistance against heat when the device is embedded in a resin molding. In the first embodiment, the element block 30 is a resin block, and is made of, for example, a resin member made of an epoxy resin or the like. As shown in FIG. 1, the element block 30 has a rectangular parallelepiped shape. Specifically, the element block 30 includes a first main surface VS1, a second main surface VS2 facing the first main surface VS1, and a first main surface VS1 and a second main surface VS2. It has a side surface VS3 and a second side surface VS4 connected to the first main surface VS1 and the second main surface VS2. In the first embodiment, the second main surface VS2 of the element body block 30 is flush with the second surface PS2 of the circuit board 11, as shown in FIG. That is, a part of the second main surface VS <b> 2 of the element block 30 is formed by the second surface PS <b> 2 of the circuit board 11.

<Coil antenna>
As shown in FIG. 1, the coil antenna is formed by a plating pattern 40 that circulates the circuit board 11 and the element block 30 around the winding axis direction, that is, the Y-axis direction. Although the plating pattern 40 is not limited, for example, it is formed in a 6-turn rectangular helical shape. One end of the plating pattern 40 is connected to the interlayer conductor 20 </ b> A of the circuit board 11. On the other hand, the other end of the plating pattern 40 is connected to the interlayer conductor 20 </ b> B of the circuit board 11.

  The plating pattern 40 extends from the end portion of the interlayer conductor 20A on the second surface PS2 of the circuit board 11, circulates around the outer peripheral surface of the circuit board 11 and the element block 30, and the interlayer conductor of the second surface PS2 of the circuit board 11 Connected to the end of 20B. More specifically, the plating pattern 40 extends from the end portion of the interlayer conductor 20A and circulates in the order of the second main surface VS2, the first side surface VS3, the first main surface VS1, and the second side surface VS4 of the element block 30. , Connected to the end of the interlayer conductor 20B. The plating pattern 40 extends in the X-axis direction on the first main surface VS1 and the second main surface VS2, and extends in the Z-axis direction on the first side surface VS3 and the second side surface VS4. Here, “extending in the X-axis direction” does not limit that the extending direction of the plating pattern 40 that circulates around the circuit board 11 and the element block 30 is parallel to the X-axis direction. The extending direction of 40 includes a direction extending substantially in the X-axis direction. Similarly, “extending in the Z-axis direction” does not limit that the extending direction of the plating pattern 40 that goes around the circuit board 11 and the element block 30 is parallel to the Z-axis direction. The extending direction of 40 includes a direction extending substantially in the Z-axis direction. The plating pattern 40 is preferably made of a material having a small specific resistance mainly composed of nickel or copper. Moreover, you may have the multilayer structure which has 2nd plating films, such as tin or gold | metal | money, for example in the surface layer of 1st plating films, such as nickel.

  FIG. 3 is a circuit diagram of the wireless communication device 10A. As shown in FIG. 3, a coil antenna ANT is connected to the RFIC element 12. A chip capacitor 13 is connected in parallel to the coil antenna ANT. An antenna resonance circuit having a resonance frequency in the HF band is configured by the coil antenna ANT, the chip capacitor 13, and the capacitance component of the RFIC element 12 itself. Accordingly, the wireless communication device 10A is configured as an HF band RFID tag.

[Production method]
A method for manufacturing wireless communication device 10A according to Embodiment 1 will be described with reference to FIGS. 4A to 4F are diagrams sequentially illustrating manufacturing steps of the wireless communication device 10A.

  As shown in FIG. 4A, a circuit board 11 is prepared in which an RFIC element 12 and a chip capacitor 13 are mounted on a wiring conductor pattern 14 provided on the first surface PS1 side, and interlayer conductors 20A and 20B are provided therein. To do. The circuit board 11 is arranged on the base 1 with the second surface PS2 side as a lower surface. An adhesive layer (not shown) is provided on the pedestal 1, and the second surface PS2 side of the circuit board 11 is in contact with the adhesive layer. That is, the circuit board 11 is fixed to the adhesive layer of the base 1. The adhesive layer is, for example, a resin having adhesiveness.

  Next, as shown in FIG. 4B, the circuit board 11 on the base 1 is covered with the element block 30. The element block 30 is formed, for example, by applying a liquid thermosetting resin on the pedestal 1 on which the circuit board 11 is disposed, and curing it by heat treatment. The element block 30 may be formed by covering a circuit board 11 with a semi-cured resin sheet and curing it.

  Next, as shown in FIG. 4C, the pedestal 1 is removed, and the upper surface and the lower surface of the element block 30 are subjected to surface polishing. The element block 30 is polished to predetermined polishing positions P1 and P2 by, for example, buffing or scribing. Here, the upper surface of the element body block 30 is a surface on the first main surface VS1 side, and the lower surface of the element body block 30 is a surface on the second main surface VS2 side.

  More specifically, the upper surface of the element block 30 is polished to a predetermined polishing position P1 so as to be flat. In addition, if the upper surface of the element block 30 is in a flat state before polishing, the polishing may not be performed. The lower surface of the element block 30 is polished together with the circuit board 11 to a predetermined polishing position P2. Further, by polishing the second surface PS2 of the circuit board 11, the end portions of the interlayer conductors 20A and 20B are exposed. When the lower surface of the element block 30 is polished, the entire base 1 may be polished without removing the base 1. The predetermined polishing positions P1, P2 may be determined based on the dimensions of the wireless communication device 10A to be manufactured.

  Thus, by polishing the element block 30 and the circuit board 11, the upper and lower surfaces of the element block 30 can be planarized as shown in FIG. 4D. In addition, the size of the wireless communication device 10A can be adjusted by adjusting the predetermined polishing positions P1 and P2. The corners of the element block 30 are preferably chamfered. By chamfering the corners of the element block 30, laser processing and wiring pattern formation described later can be performed smoothly.

  Next, as shown in FIG. 4E, a coil antenna is formed by a plating pattern 40 that is connected to the interlayer conductors 20A and 20B of the circuit board 11 and goes around the circuit board 11 and the element block 30. The plating pattern 40 is formed using a processing technique such as MID (Molded Interconnect Device).

  In the first embodiment, the pattern formation region of the circuit board 11 and the element block 30 is activated by ablation by laser processing, and the plating pattern 40 is formed by forming a plating film in this pattern formation region. .

  More specifically, a portion of the circuit board 11 and the element block 30 where the plating pattern 40 is to be formed, that is, a pattern formation region is irradiated with laser. Laser irradiation is performed from the end of the interlayer conductor 20A exposed at the second surface PS2 of the circuit board 11 through the second main surface VS2, the first side surface VS3, the first main surface VS1, and the second side surface VS4 of the element block 30. Is spirally wound up to the end of the interlayer conductor 20B exposed at the second surface PS2 of the circuit board 11. For example, in FIG. 1, the laser is irradiated while rotating around the element block 30 clockwise around the winding axis of the coil antenna, that is, the Y-axis direction (see FIG. 1). Since the portion irradiated with the laser is activated (that is, the surface becomes rough), the plating easily occurs. Next, by performing electroless plating or the like, a plating pattern 40 is formed by forming a plating film on the portion irradiated with the laser.

  In this way, the laser is applied to the outer peripheral surfaces of the circuit board 11 and the element block 30. And a coil antenna can be formed by performing electroless plating and forming the continuous plating pattern 40 in the laser irradiated part. Furthermore, electrolytic plating may be performed to increase the film thickness of the pattern.

  Next, as shown in FIG. 4F, a protective layer 50 is formed on the surface of the circuit board 11 and the element block 30 from above the plating pattern 40. The protective layer 50 is provided to protect the coil antenna. The protective layer 50 is a protective resin film for preventing oxidation of the plating pattern 40, impact resistance and heat resistance of the wireless communication device itself, and improving moldability at the time of resin embedding. It is a solder resist film.

  Thus, 10 A of radio | wireless communication devices are manufactured by performing the process shown to FIG. 4A-FIG. 4F. These steps may be processing steps of individual wireless communication devices, but in the present embodiment, processing is performed in a collective substrate state in which a plurality of wireless communication devices are assembled.

  5A and 5B show a manufacturing process of the wireless communication device 10A using a rod-shaped aggregate substrate.

  As shown in FIG. 5A, a mother board 90 in which a plurality of circuit boards 11 are continuously provided in a row is fixed on the base 1. In FIG. 5A, in the mother board 90, the plurality of circuit boards 11 are provided in a row continuously in the Y-axis direction. The plurality of circuit boards 11 may be independent. Next, the mother substrate 90 fixed on the base 1 is covered with the element block 30. Next, the base 1 is removed, and the upper and lower surfaces of the element block 30 are flattened by surface polishing.

  Next, as shown in FIG. 5B, in the mother substrate 90 covered with the element block 30, in order to form a plurality of coil antennas connected to each circuit board 11, a portion where a plurality of plating patterns 40 are to be formed, That is, the pattern formation region is irradiated with laser. The laser irradiation is performed while circulating around the mother substrate 90 with the direction in which the plurality of circuit boards 11 are continuous, that is, the Y-axis direction as an axial direction. After the laser irradiation, electroless plating is performed to form a plurality of plating patterns 40 in the laser irradiated portion. As a result, a plurality of coil antennas connected to each of the plurality of circuit boards 11 are formed by the plurality of plating patterns 40 that circulate around the mother substrate 90 and the element block 30 around the winding axis.

  In this way, by performing the steps shown in FIG. 5A and FIG. 5B, it is produced in a collective substrate state in which a plurality of wireless communication devices 10A are connected in the winding axis direction, that is, the Y-axis direction.

  Next, after forming the protective layer 50, the collective substrate is cut in a direction intersecting the winding axis direction, that is, in the X-axis direction or the Z-axis direction in FIG. Divide into pieces. Accordingly, the individual wireless communication device 10A is acquired from the collective substrate.

[effect]
According to the wireless communication device 10A according to the first embodiment, the following effects can be obtained.

  According to the wireless communication device 10 </ b> A according to the first embodiment, the coil antenna is formed by the plating pattern 40 that goes around the circuit board 11 and the element block 30. Thus, since the coil antenna of 10 A of radio | wireless communication devices is not formed by connecting a some conductor, generation | occurrence | production of the interface which arises when a different conductor connects in a coil antenna can be suppressed. Therefore, in the wireless communication device 10A, the connection reliability of the coil antenna can be improved.

  In particular, the coil antenna has a rectangular cross-sectional shape when viewed from the Y-axis direction. In this case, stress due to heat or impact is likely to be applied to the four corners, but at least the patterns including the four corners are continuous with the same material. Therefore, the risk of disconnection at this portion can be greatly reduced.

  For example, when the wireless communication device 10A is embedded in a resin molded article, the reliability of the wireless communication device 10A is not impaired even if the wireless communication device 10A comes into contact with a resin having a high temperature (for example, 300 ° C. or higher instantaneously) that flows during injection molding. . That is, the wireless communication device 10A has excellent heat resistance.

  In the wireless communication device 10 </ b> A, the first surface PS <b> 1 side of the circuit board 11 is covered with the element block 30. That is, a surface mount component such as an RFIC element or a chip capacitor which is a semiconductor integrated circuit element is surrounded by the circuit board and the element block. For this reason, since the surface mounted chip components such as the RFIC element 12 and the chip capacitor 13 are protected by the circuit board 11 and the element block 30, the heat resistance can be further improved.

  According to the wireless communication device 10A, since the coil antenna is formed on the outer peripheral surface of the circuit board 11 and the element block 30, the opening of the coil antenna can be utilized to the maximum extent. For this reason, it is possible to increase the communication distance with the communication partner while reducing the size of the wireless communication device 10A itself.

  Further, the RFIC element 12 is not exposed to the outside of the wireless communication device 10A, and an increase in the size of the wireless communication device 10A due to the mounting of the RFIC element 12 outside can be avoided.

  Further, since the RFIC element 12 is mounted on the circuit board 11 and the element body of the coil antenna is a resin block, that is, the support member of the RFIC element 12 and the support member of the coil antenna are separate members, the circuit board 11 and An optimum member can be selected for each element block 30. For example, the amount of expensive printed wiring board (circuit board 11) used can be suppressed, and the cost can be reduced by using an inexpensive resin block. In addition, by reducing the magnetic permeability of the printed wiring board and the resin block, specifically, by selecting a resin block having a magnetic permeability higher than that of the printed wiring board, the coil antenna can be reduced in size. Can do.

  That is, since the base substrate of the wireless communication device 10A is occupied by the resin block, the resin block is dominant in physical properties such as heat resistance, strength, and magnetic permeability. Therefore, the material of the resin block can be selected according to the use of the wireless communication device 10A, and the wireless communication device 10A having physical characteristics suitable for various uses can be created. For this purpose, the volume ratio of the resin block is preferably 5 times or more the volume of the printed wiring board.

  In the first embodiment, in the circuit board 11, the first surface PS1 and two side surfaces of the resin block (element block 30) facing the first side surface VS3 and the second side surface VS4 are embedded in the resin block. However, the second surface PS2 and the other two side surfaces are exposed from the resin block. With such a configuration, when a physical impact such as dropping or a thermal impact such as injection molding is applied, stress can be released from the surface exposed from the resin block, and the reliability of the wireless communication device 10A is improved. It becomes easy to secure. From the viewpoint of impact resistance, it is sufficient that at least the first surface PS1 on which the RFIC element 12 and the like are mounted is covered with the resin block, and the other surface may be exposed from the resin block.

  In the first embodiment, from the viewpoint of improving impact resistance and heat resistance, the first surface PS1 of the circuit board 11 and a part of the surface other than the first surface PS1 are embedded in the resin block, and the other surface is resin. It is preferably exposed from the block. More preferably, the second surface PS2 of the circuit board 11 and a part (one surface) of the side surfaces of the circuit board 11 are exposed from the resin block, but the other surface is embedded in the resin block. Is preferred.

  According to the method for manufacturing wireless communication device 10A according to Embodiment 1, the following effects can be obtained.

  According to the method for manufacturing the wireless communication device 10 </ b> A, the coil antenna can be formed by the plating pattern 40 that goes around the circuit board 11 and the element block 30. In particular, since the plating pattern 40 is formed using the same material and the same process, it is possible to suppress the occurrence of an interface caused by connecting different conductors in the coil antenna. Thereby, 10 A of radio | wireless communication devices which have a coil antenna which improved connection reliability can be manufactured.

  Further, since the coil antenna is formed by the plating pattern 40 on the outer peripheral surfaces of the circuit board 11 and the element block 30, the coil antenna can be easily formed. For example, the coil antenna can be formed by activating the pattern formation region of the circuit board 11 and the element block 30 by ablation by laser processing such as MID and performing electroless plating on the pattern formation region. In such a method, the coil antenna can be easily formed without performing a complicated process such as connecting a plurality of conductors in order to form the coil antenna.

  When the mother substrate 90 including the plurality of circuit boards 11 is used, that is, when a wireless communication device is manufactured by dividing the collective substrate, the plurality of wireless communication devices 10A can be manufactured more easily and efficiently.

  In Embodiment 1, the example in which the plating pattern 40 for forming the coil antenna is formed by forming a plating film using laser processing has been described, but is not limited thereto. For example, the plating pattern 40 may be formed by plating the entire circumference of the circuit board 11 and the element block 30 and then patterning using an exposure / development technique.

  In the first embodiment, the element block 30 may include a magnetic powder such as ferrite powder. According to this configuration, since the element block 30 has magnetism, the overall size required to obtain a coil antenna having a predetermined inductance can be reduced. The element block 30 may be a powder compact formed by compacting metal magnetic powder through a resin or the like. With such a configuration, the inductance can be increased, so that the device can be further downsized.

  In Embodiment 1, although the structure provided with the protective layer 50 was demonstrated about 10 A of radio | wireless communication devices, it is not limited to this. The protective layer 50 may be provided as necessary.

  In the first embodiment, the interlayer conductors 20A and 20B have been described with respect to the configuration provided inside the circuit board 11, but the present invention is not limited to this. The interlayer conductors 20A and 20B may be provided on the side surface of the circuit board 10, for example.

  Although the plating pattern 40 that forms the coil antenna has been described as being formed in a rectangular helical shape (that is, the body shape is formed in a rectangular parallelepiped shape), the present invention is not limited to this. The plating pattern 40 may be a shape having a plurality of turns in the Y-axis direction, and may be, for example, a round shape or a semicircular shape according to the cross-sectional shape of the main body of the wireless communication device. Also, the number of turns is not limited.

  In the first embodiment, in the step of forming the plating pattern 40, the laser irradiation may be performed while rotating the element block 30.

  In Embodiment 1, although the example which forms a coil antenna with the plating pattern 40 was demonstrated, it is not limited to this. In the first embodiment, the plating pattern 40 is an example of a coil antenna. The coil antenna only needs to be formed of a coiled conductor, and may be formed of a conductor such as a metal wire or a spring material, for example. From the viewpoint of improving the connection reliability of the coil antenna, the coiled conductor is preferably a conductor having no interface. The coiled conductor is preferably, for example, one continuous conductor.

(Embodiment 2)
[overall structure]
A wireless communication device according to a second embodiment of the present invention will be described with reference to FIGS.
FIG. 6 is a perspective view of the wireless communication device according to the second embodiment of the present invention. FIG. 7 shows a schematic configuration of the wireless communication device according to the second embodiment. In the second embodiment, differences from the first embodiment will be mainly described. In the second embodiment, the same or equivalent components as those in the first embodiment will be described with the same reference numerals. In the second embodiment, descriptions overlapping with those in the first embodiment are omitted.

  As shown in FIG. 6, the wireless communication device 10B according to the second embodiment is different from the first embodiment in that the interlayer conductors 20C and 20D are formed of metal pins and the circuit board 11 is the second main block of the element block 30. The difference is that the circuit board 11 is disposed away from the surface VS2, that is, the entire circumference of the circuit board 11 is embedded in the element block 30. The element block 30a of the wireless communication device 10B according to the second embodiment is different from the first embodiment in that it includes a plating core material.

  As shown in FIG. 7, the interlayer conductors 20C and 20D are, for example, columnar metal pins. The length in the longitudinal direction of the interlayer conductors 20C and 20D, that is, the length in the Z direction is longer than the thickness of the circuit board 11. Therefore, the interlayer conductors 20C and 20D protrude from the second surface PS2 of the circuit board 11 toward the second main surface VS2 of the element block 30. Thereby, since the circuit board 11 can be arrange | positioned away from 2nd main surface VS2 of the element | base_body block 30a, the circuit board 11 can be embed | buried in the element | base_body block 30a. The interlayer conductors 20C and 20D only need to be made of a conductive material, and may be made of a metal material such as Cu, for example.

  The element block 30a includes a plating core material. The plating core material is a member that can expose the plating core to a portion irradiated with laser by an LDS (Laser Direct Structuring) processing technique or the like. Examples of the plating core material include organic metals such as copper. In the second embodiment, the plating pattern 40 is formed by laser processing the element block 30a including the plating core material.

[Production method]
A method for manufacturing wireless communication device 10B according to Embodiment 2 will be described with reference to FIGS. 8A to 8F are diagrams sequentially illustrating manufacturing steps of the wireless communication device 10B.

  As shown in FIG. 8A, the RFIC element 12 and the chip capacitor 13 are mounted on the first surface PS1 side, and the circuit board 11 provided with the interlayer conductors 20C and 20D protruding outward from the second surface PS2. The circuit board 11 is arranged on the base 1 with the second surface PS2 side as a lower surface. An adhesive layer (not shown) is provided on the pedestal 1, and the end portions of the interlayer conductors 20C and 20D protruding from the second surface PS2 side of the circuit board 11 are in contact with the adhesive layer. That is, the interlayer conductors 20 </ b> C and 20 </ b> D of the circuit board 11 are fixed to the adhesive layer of the base 1.

  Next, as shown in FIG. 8B, the circuit board 11 on the pedestal 1 is covered with the element block 30a. The element block 30a is formed, for example, by applying a liquid thermosetting resin on the pedestal 1 on which the circuit board 11 is disposed, and curing it by heat treatment. The element block 30a may be formed by covering a circuit board 11 with a semi-cured resin sheet and curing it.

  Next, as shown in FIG. 8C, the base 1 is removed, and the upper surface and the lower surface of the element block 30a are subjected to surface polishing. The element block 30a is polished to predetermined polishing positions P1 and P2 by, for example, buffing or scribing. Here, the upper surface of the element block 30a is a surface on the first main surface VS1 side, and the lower surface of the element block 30a is a surface on the second main surface VS2 side.

  More specifically, the upper surface of the element block 30a is polished to a predetermined polishing position P1 so as to be flat. The upper surface of the element block 30a may not be polished if it is in a flat state before polishing. The lower surface of the element block 30a is polished to a predetermined polishing position P2. By polishing the lower surface of the element block 30a, the end portions of the interlayer conductors 20C and 20D are exposed. When the lower surface of the element block 30a is polished, the entire pedestal 1 may be polished without removing the pedestal 1. The predetermined polishing positions P1, P2 may be determined based on the dimensions of the wireless communication device 10A to be manufactured.

  Thus, by polishing the upper and lower surfaces of the element block 30a, the upper and lower surfaces of the element block 30a can be planarized as shown in FIG. 8D. Further, the dimensions of the wireless communication device 10B can be adjusted by adjusting the predetermined polishing positions P1, P2. In addition, the corner | angular part of the element | base_body block 30a may be chamfered. By chamfering the corners of the element block 30a, laser processing described later can be performed smoothly.

  Next, as shown in FIG. 8E, a coil antenna is formed by a plating pattern 40 that is connected to the interlayer conductors 20 </ b> C and 20 </ b> D of the circuit board 11 and goes around the circuit board 11 and the element block 30. The plating pattern 40 is formed using a processing technique such as LDS, for example.

  In the second embodiment, the circuit board 11 is not exposed to the outside of the element block 30a, and the element block 30a includes a plating core material. Therefore, the plating pattern 40 is formed using the LDS processing technique. Can be formed. Hereinafter, formation of the plating pattern 40 using the LDS processing technique will be described.

  In the element block 30a, a portion where the plating pattern 40 is to be formed, that is, a pattern formation region is irradiated with laser. Specifically, laser irradiation is performed from the end of the interlayer conductor 20C exposed to the second main surface VS2 of the element block 30a, from the second main surface VS2, the first side surface VS3, the first main surface VS1, and the second main surface VS2. The process is performed to the end of the interlayer conductor 20D exposed to the second main surface VS2 by circling the side surface VS4. In the portion of the element block 30a irradiated with the laser, the plating core material contained in the element block 30a is activated, and the plating core material is exposed on the surface of the element block 30a. A plating film is grown using the exposed plating core material as a core. Next, the film formed on the surface of the element block 30a is grown to be thicker by performing electrolytic plating or the like. In this way, the plating pattern 40 can be selectively formed on the outer periphery of the element block 30a.

  Next, as shown in FIG. 8F, a protective layer 50 is formed on the surface of the element block 30a from above the coil antenna. The protective layer 50 is provided to protect the coil antenna. The protective layer 50 is a protective resin film for preventing oxidation, and is, for example, a solder resist film of an insulating material.

  In this way, the wireless communication device 10B is manufactured by performing the steps shown in FIGS. 8A to 8F. Further, the wireless communication device 10B may be manufactured using a collective substrate, as in the first embodiment.

[effect]
According to the wireless communication device 10B according to Embodiment 2, the following effects can be obtained.

  The wireless communication device 10B according to Embodiment 2 uses metal pins for the interlayer conductors 20C and 20D. With such a configuration, the direct current resistance component can be made smaller than that of a conductive metal film such as a sintered metal body obtained by firing a conductive paste or a thin film metal body obtained by etching a conductive thin film. The loss due to can be reduced.

  According to the wireless communication device 10B, the element block 30a includes a plating nucleus material. For this reason, the plating pattern 40 can be easily formed on the outer peripheral surface of the element block 30a using the LDS processing technique. That is, the coil antenna can be formed more easily. In the first embodiment, since the second surface PS2 of the circuit board 11 is exposed outside the element block 30, the plating pattern 40 is formed on the second surface PS2 of the circuit board 11 by the LDS processing technique. It ’s difficult. In the second embodiment, since the circuit board 11 is embedded in the element block 30a, the plating pattern 40 need not be formed on the second surface PS2 of the circuit board 11. For this reason, in Embodiment 2, since the plating pattern 40 can be formed using the LDS processing technique, the coil antenna can be easily formed.

  Moreover, since the circuit board 11 is not exposed to the outside of the element block 30a, that is, is embedded, the heat resistance can be further improved. In particular, in the wireless communication device 10B, the circuit board 11 on which the RFIC element 12 is mounted is separated from the surface of the element block 30a. For this reason, when a resin molded product such as plastic containing the wireless communication device 10B is manufactured by injection molding, the heat of the resin at the time of injection molding is hardly transmitted to the circuit board 11. Therefore, according to the wireless communication device 10B, it is possible to reduce the risk of solder splash and the like.

  Further, the magnetic field formed by the coil antenna becomes stronger as it is closer to the coil antenna. In the wireless communication device 10B, by arranging the circuit board 11 away from the coil antenna, the influence of the magnetic field that the circuit board 11 receives from the coil antenna can be reduced.

(Embodiment 3)
[overall structure]
A wireless communication device according to a third embodiment of the present invention will be described with reference to FIGS.
FIG. 9 is a perspective view of the wireless communication device according to the third embodiment of the present invention. FIG. 10 shows a partially enlarged view of the wireless communication device according to the third embodiment of the present invention. FIG. 11 shows a schematic configuration of the wireless communication device according to the third embodiment. In the third embodiment, differences from the first embodiment will be mainly described. In the third embodiment, the same or equivalent components as those in the first embodiment will be described with the same reference numerals. In the third embodiment, descriptions overlapping with those in the first embodiment are omitted.

  As shown in FIG. 9, the wireless communication device 10C according to the third embodiment is provided with a wiring pattern 40a and a through-hole plating 41 for forming a coil antenna on the circuit board 11a in advance as compared with the first embodiment. It is different in point. The third embodiment is also different from the first embodiment in that the element block 30a includes a plating nucleus material and that the LC resonance circuit is configured using the chip capacitors 15 and 16.

  As shown in FIG. 9, the circuit board 11a has dimensions in the X-axis direction and Y-axis direction equal to the dimensions of the element block 30a, and constitutes the bottom of the wireless communication device 10C. The circuit board 11a is provided with a wiring pattern 40a connected to the interlayer conductors 20A and 20B on the second surface PS2. The wiring pattern 40a forms a part of the coil antenna and is formed of a plating pattern.

  As shown in FIG. 10, the circuit board 11a is provided with through-hole plating 41 on the third surface PS3 and the fourth surface PS4 connected to the first surface PS1 and the second surface PS2. The through-hole plating 41 connects the wiring pattern 40a on the second surface PS2 of the circuit board 11a and the plating pattern 40b of the element block 30a. That is, as shown in FIG. 11, in the wireless communication device 10C, a coil antenna is formed by the wiring pattern 40a, the through-hole plating 41, and the plating pattern 40b.

  The chip capacitors 15 and 16 constitute a wireless IC element 12 and an LC resonance circuit and a matching circuit for adjusting the frequency. The chip capacitors 15 and 16 are used for coarse or fine adjustment of the frequency.

[Production method]
A method for manufacturing wireless communication device 10C according to Embodiment 3 will be described with reference to FIGS. 12A to 12C. 12A to 12C are diagrams sequentially illustrating manufacturing steps of the wireless communication device 10C. Note that in the method for manufacturing the wireless communication device 10C according to the third embodiment, the description of the same parts as those in the first and second embodiments is omitted.

  As shown in FIG. 12A, a circuit board 11a is prepared. A wiring conductor pattern 14 is formed on the first surface PS1 side of the circuit board 11a, and the RFIC element 12 and the chip capacitors 15 and 16 are mounted on the wiring conductor pattern 14. A wiring pattern 40a connected to the interlayer conductors 20A and 20B is formed on the second surface PS2 side of the circuit board 11a. A through-hole plating 41 connected to the wiring pattern 40a is formed on the third surface PS3 and the fourth surface PS4 side of the circuit board 11a.

  The wiring pattern 40a is formed of, for example, a plating layer (plating pattern).

  Next, as shown in FIG. 12B, the first surface PS1 side of the circuit board 11a is covered with the element block 30a. The element block 30a is formed, for example, by applying a liquid thermosetting resin to the first surface PS1 of the circuit board 11a and curing it by heat treatment. The element block 30a may be formed by covering and curing a semi-cured resin sheet on the first surface PS1 of the circuit board 11. The upper surface of the element block 30a is planarized by surface polishing. In addition, the corner | angular part of the element | base_body block 30a may be chamfered. By chamfering the corner a of the element block 30, laser processing described later can be performed smoothly.

  Next, as shown in FIG. 12C, a plating pattern 40b is formed on the element block 30a. The plating pattern 40b is connected to the through-hole plating 41 of the circuit board 11a. Thereby, a coil antenna can be formed by the wiring pattern 40a of the circuit board 11a, the through-hole plating 41, and the plating pattern 40b of the element block 30a. The plating pattern 40b is formed using a processing technique such as LDS or MID, for example. In the third embodiment, similarly to the second embodiment, the plating pattern 40b is formed using the LDS processing technique.

  In addition, it is preferable to form a continuous plating film on the surfaces of the wiring pattern 40a and the through-hole conductor 41 and the plating pattern 40b of the circuit board 11a by further performing electrolytic plating. Thereby, the connection reliability between the through-hole conductor 41 and the plating pattern 40b can be improved, and the DC resistance value of the coil antenna can be reduced. Moreover, you may form the protective layer 50 in the surface of the circuit board 11a and the element | base_body block 30a.

  As described above, the wireless communication device 10C is manufactured by performing the steps shown in FIGS. 12A to 12C. Also, the wireless communication device 10C may be manufactured using a collective substrate, as in the first and second embodiments.

[effect]
According to the wireless communication device 10C according to Embodiment 3, the following effects can be achieved.

  According to the wireless communication device 10C according to the third embodiment, even when the circuit board 11a forms the bottom of the device, the coil antenna can be easily formed using the LDS processing technique.

  Further, by forming the wiring pattern 40a in advance on the second surface PS2 side of the circuit board 11a, the time for forming the coil antenna can be shortened.

  In the third embodiment, the example in which the dimensions of the circuit board 11a in the X-axis direction and the Y-axis direction are equal to the dimensions of the element block 30a has been described. However, the present invention is not limited to this.

(Embodiment 4)
[overall structure]
A wireless communication device according to a fourth embodiment of the present invention will be described with reference to FIGS.
FIG. 13 is a perspective view of the wireless communication device according to the fourth embodiment of the present invention. FIG. 14 shows a schematic configuration of the wireless communication device according to the fourth embodiment. In the fourth embodiment, differences from the first embodiment will be mainly described. In the fourth embodiment, the same or equivalent components as those in the first embodiment will be described with the same reference numerals. In the fourth embodiment, descriptions overlapping with those in the first embodiment are omitted.

  As shown in FIG. 13, the wireless communication device 10D according to the fourth embodiment has a thick film layer 60 containing plating nuclei coated on the outer peripheral surfaces of the circuit board 11b and the element block 30 as compared with the first embodiment. Is different. The fourth embodiment is also different from the first embodiment in that an antenna resonant circuit is configured using the chip capacitors 15 and 16.

  As shown in FIG. 13, the circuit board 11b has the same dimensions in the X-axis direction and the Y-axis direction as the dimensions of the element block 30, and constitutes the bottom of the wireless communication device 10D. The outer surfaces of the circuit board 11b and the element block 30 are coated with a thick film layer 60 containing plating nuclei. More specifically, as shown in FIG. 14, the thick film layer 60 including the plating nucleus includes the second surface PS2 of the circuit board 11b, the first main surface VS1, the second main surface VS2, and the first surface of the element block 30. The side surface VS3 and the second side surface VS4 are coated.

  The wireless communication device 10D forms the plating pattern 40 in the pattern formation region by irradiating the thick film layer 60 including the plating nucleus coated on the outer periphery of the circuit board 11b and the element block 30 with a laser.

[Production method]
A method for manufacturing wireless communication device 10D according to Embodiment 4 will be described with reference to FIGS. 15A to 15D. 15A to 15D are diagrams sequentially illustrating manufacturing steps of the wireless communication device 10D. Note that in the method for manufacturing the wireless communication device 10D according to the fourth embodiment, the description of the same parts as those in the first embodiment is omitted.

  As shown in FIG. 15A, a circuit board 11b is prepared. A wiring conductor pattern 14 is formed on the first surface PS1 side of the circuit board 11b, and the RFIC element 12 and the chip capacitors 15 and 16 are mounted on the wiring conductor pattern 14. Interlayer conductors 20A and 20B extending from the first surface PS1 to the second surface PS2 are provided inside the circuit board 11b.

  Next, as shown in FIG. 15B, the first surface PS1 side of the circuit board 11b is covered with the element block 30. The upper surface of the element block 30 is flattened by surface polishing to a predetermined polishing position P1. Further, the second surface PS2 of the circuit board 11b is subjected to surface polishing to a predetermined polishing position P2, thereby exposing the end portions of the interlayer conductors 20A and 20B. The corners of the element block 30 may be chamfered. By chamfering the corners of the element block 30, laser processing to be described later can be performed smoothly.

  Next, as shown in FIG. 15C, the outer periphery of the circuit board 11b and the element block 30 is coated with a thick film layer 60 containing plating nuclei. Specifically, the thick film layer 60 including the plating nucleus includes the second surface PS2 of the circuit board 11b, the first main surface VS1, the second main surface VS2, the first side surface VS3, and the second side surface VS4 of the element block 30. Coated.

  Next, as shown in FIG. 15D, the coil antenna is formed by forming a plating pattern 40 by laser processing the thick film layer 60 including the plating nucleus. In the fourth embodiment, similarly to the second and third embodiments, the plating pattern is formed using the LDS processing technique.

  More specifically, the pattern forming region of the thick film layer 60 including the plating nucleus is irradiated with a laser to expose the plating nucleus on the outer surface, and the plating film is grown from the exposed plating nucleus. Here, the pattern formation region is a portion where the coil antenna, that is, the plating pattern 40 is to be formed. Thereafter, the plating pattern 40 is formed by thickening the plating film by performing electrolytic plating.

  Moreover, you may form the protective layer 50 in the surface of the circuit board 11a and the element | base_body block 30a.

  As described above, the wireless communication device 10D is manufactured by performing the steps shown in FIGS. 15A to 15D. Further, the wireless communication device 10D may be manufactured using a collective substrate, as in the first and second embodiments.

[effect]
The wireless communication device 10D according to Embodiment 4 can provide the following effects.

  According to the wireless communication device 10D according to the fourth embodiment, by coating the outer peripheral surface of the circuit board 11b and the element block 30 with the thick film layer 60 including the plating nucleus, for example, using the LDS processing technique, the coil An antenna can be easily formed.

  In addition, the coil antenna can be formed at a lower cost compared to the element block including the plating core material.

  In the fourth embodiment, the thick film layer 60 including the plating nucleus only needs to be coated on the portion where the plating pattern 40 is formed. For example, the thick film layer 60 including the plating nucleus may be partially coated on each surface of the element block 30.

(Embodiment 5)
[overall structure]
A wireless communication device according to a fifth embodiment of the present invention will be described with reference to FIG.
FIG. 16 shows a schematic configuration of the wireless communication device according to the fifth embodiment. In the fifth embodiment, differences from the second embodiment will be mainly described. In the fifth embodiment, the same or equivalent components as those in the second embodiment will be described with the same reference numerals. In the fifth embodiment, descriptions overlapping with those in the second embodiment are omitted.

  As shown in FIG. 16, the wireless communication device 10E according to the fifth embodiment is different from the second embodiment in that it includes a sealing resin layer 17 and a magnetic block 18.

  As shown in FIG. 16, in the wireless communication device 10 </ b> E, the sealing resin layer 17 is formed on the first surface PS <b> 1 side of the circuit board 11, and the magnetic block 18 is disposed on the sealing resin layer 17. . The circuit board 11, the sealing resin layer 17, and the magnetic block 18 are embedded in the element block 30 and disposed inside the coil antenna.

  The sealing resin layer 17 seals surface mounted components such as the RFIC 12 and the chip capacitor 13 mounted on the first surface PS1 of the circuit board 11. The sealing resin layer 17 is made of, for example, a thermosetting resin such as an epoxy resin.

  The magnetic block 18 is disposed on the sealing resin layer 17. The magnetic body block 18 has a rectangular parallelepiped shape, and is made of, for example, ferrite. The magnetic block 18 is disposed inside the coil antenna and acts as a magnetic core (magnetic core) for the coil antenna.

[effect]
The wireless communication device 10E according to Embodiment 5 can provide the following effects.

  According to the wireless communication device 10E of the fifth embodiment, the surface-mounted component on the first surface PS1 side of the circuit board 11 is sealed with the sealing resin layer 17, and the magnetic block 18 is placed on the sealing resin layer 17. It is arranged. Moreover, the magnetic body block 18 is arrange | positioned inside the coil antenna. With such a configuration, the magnetic block 18 acts as a magnetic core (magnetic core) for the coil antenna, and the magnetic flux collecting effect can be improved. As a result, the magnetic field coupling with the communication partner antenna can be enhanced. Further, according to the wireless communication device 10E of the fifth embodiment, the device size can be reduced without reducing the magnetic field coupling with the communication partner as compared with the second embodiment.

  According to the wireless communication device 10E of the fifth embodiment, the surface mount component can be protected by sealing the surface mount component mounted on the first surface PS1 side of the circuit board 11 with the sealing resin layer 17. it can.

(Embodiment 6)
[overall structure]
An article with a wireless communication device according to a sixth embodiment of the present invention will be described with reference to FIG.
FIG. 17 is a perspective view of article 100 with a wireless communication device according to the sixth embodiment. The article 100 with a wireless communication device is a resin molded body 101 with a built-in wireless communication device, for example, a toy such as a miniature car made by resin molding. The wireless communication device-equipped article 100 includes the wireless communication device 10A according to the first embodiment as a wireless communication device. The wireless communication device-equipped article 100 can be formed, for example, by injection molding a molding resin such as an epoxy resin in a state where the wireless communication device 10A is fixed in the mold for the resin molded product.

  As shown in FIG. 17, the wireless communication device 10 </ b> A is embedded in the resin molded body 101 and is not exposed to the outside of the article 100. For example, the wireless communication device 10A is embedded in the bottom of a toy. The bottom of the toy corresponds to the vicinity of the top surface of the RFID-tagged article 301 from the viewpoint of FIG.

  The winding axis of the coil antenna of the wireless communication device 10A faces the normal direction with respect to the bottom surface of a toy such as a miniature car. Therefore, the reader / writer device communicates with the wireless communication device 10A by making the bottom surface of the toy face the reading unit of the reader / writer device. Thus, the reader / writer device or the host device connected to the reader / writer device performs a predetermined process.

[effect]
According to article 100 with a wireless communication device according to Embodiment 6, the following effects can be achieved.

  According to the article 100 with the wireless communication device according to the sixth embodiment, the wireless communication device 10A in which the surface on which the surface mounting component is mounted on the circuit board 11 is covered with the element block 30 is used. For this reason, a mounting component such as an RFIC element is sandwiched between the circuit board 11 and the element block 30, and it is wireless with respect to an injection molding resin that flows with high heat when the resin molding 101 is injection molded. The solder connection portion of the surface mount chip component in the communication device 10 </ b> A is protected by the element block 30. Therefore, according to the article 100 with the wireless communication device, excellent electrical characteristics and heat resistance that can be communicated by a reader / writer device or the like are high, and the reliability is high.

  In addition, in Embodiment 6, although the article | item provided with 10 A of radio | wireless communication devices of Embodiment 1 was demonstrated, it is not limited to this. For example, it may be an article provided with the wireless communication device according to the second to fifth embodiments. The article 100 with the wireless communication device may be, for example, a container or tableware in which the wireless communication device 10A is embedded by resin molding. It is particularly suitable for articles that are exposed to high temperatures for disinfection and the like.

(Embodiment 7)
A wireless communication device according to a seventh embodiment of the present invention will be described with reference to FIGS. 18A to 18I.
18A to 18I are diagrams sequentially illustrating manufacturing steps of the wireless communication device 10F. Note that in the method for manufacturing the wireless communication device 10F according to the seventh embodiment, the description of the same parts as those in the first to sixth embodiments is omitted. 18A to 18I, the RFIC element 12 and the like mounted on the circuit board 11 are not shown for ease of explanation.

  As shown in FIGS. 18A to 18I, in the method of manufacturing the wireless communication device 10F according to the seventh embodiment, the coil antenna is formed by winding the metal wire 42 around the element block 30 as compared with the first to fifth embodiments. The point of formation is different. That is, the wireless communication device 10F according to the seventh embodiment is different from the first to fifth embodiments in that the coil antenna is formed of the metal wire 42.

[Production method]
As shown in FIG. 18A, a circuit board 11 is prepared in which an RFIC element 12 and a chip capacitor 13 are mounted on a wiring conductor pattern 14 provided on the first surface PS1 side, and interlayer conductors 20A and 20B are provided therein. To do. The circuit board 11 is arranged on the base 1 with the second surface PS2 side as a lower surface. An adhesive layer (not shown) is provided on the pedestal 1, and the second surface PS2 side of the circuit board 11 is in contact with the adhesive layer. That is, the circuit board 11 is fixed to the adhesive layer of the base 1.

  Next, as shown in FIG. 18B, the circuit board 11 on the base 1 is covered with the element block 30. The element block 30 is formed, for example, by applying a liquid thermosetting resin on the pedestal 1 on which the circuit board 11 is disposed, and curing it by heat treatment. The element block 30 may be formed by covering a circuit board 11 with a semi-cured resin sheet and curing it.

  Next, as shown in FIG. 18C, the base 1 is removed, and the upper surface and the lower surface of the element block 30 are subjected to surface polishing. The element block 30 is polished to predetermined polishing positions P1 and P2 by, for example, buffing or scribing.

  Thus, by polishing the element block 30 and the circuit board 11, the upper and lower surfaces of the element block 30 can be planarized as shown in FIG. 18D. Moreover, the dimension of the radio | wireless communication device 10F can also be adjusted by adjusting the predetermined grinding | polishing position P1, P2.

  FIG. 18E shows the appearance of the resulting product created in the manufacturing process of FIG. 18D. As shown in FIG. 18E, by flattening the lower surface of the element block 30, the first main surface VS1 that is the lower surface of the element block 30 and the second surface PS2 of the circuit board 11 are formed on the same plane. . Further, the end surfaces of the interlayer conductors 20A and 20B are exposed on the second surface PS2 of the circuit board 11.

  As shown in FIG. 18F, one end of a metal wire 42 is attached to the end surface of the interlayer conductor 20A exposed on the second surface PS2 of the circuit board 11 by welding or the like. As the metal wire 42, for example, a copper wire or the like can be used.

  As shown in FIG. 18G, the metal wire 42 is wound around the element block 30. Specifically, a metal wire 42 circulates around the element block 30 around the Y-axis direction to form a rectangular helical coil antenna. The element block 30 may be formed with a groove in which at least a part of the metal wire 42 enters at a portion around which the metal wire 42 is wound. By forming a groove for the metal wire 42 in the element block 30, it is possible to suppress the movement of the gap between the metal wires 42 and to easily wind the metal wire 42.

  As shown in FIG. 18H, after the metal wire 42 is wound around the element block 30 to form a coil antenna, the other end of the metal wire 42 is attached to the end face of the interlayer conductor 20B by welding or the like. In FIG. 18H, the metal wire 42 is wound around the element block 30 in a three-turn rectangular helical shape, but is not limited thereto. The number of turns, the coil shape, and the like may be changed according to, for example, the shape of the wireless communication device 10F, that is, the shape of the element block 30 serving as the base substrate.

  18A to 18H, description is made using one circuit board 11 for ease of explanation, but in the seventh embodiment, as shown in FIG. 18I, a plurality of circuit boards 11 are arranged in a line. The wireless communication device 10F is manufactured using the mother substrate 90a provided continuously. Specifically, the mother board 90a fixed on the base 1 is covered with the element block 30 (see FIGS. 18A to 18B). Next, the upper surface and the lower surface of the element block 30 are flattened (see FIGS. 18C to 18E). By winding metal wires 42 around the respective circuit boards 11 of the mother board 90a (see FIGS. 18F to 18H), coil antennas corresponding to the respective circuit boards 11 are formed around the element block 30 (see FIG. 18). 18I).

  Thus, when the mother substrate 90a is used, as shown in FIG. 18I, a collective substrate in which a plurality of wireless communication devices 10F are connected in the winding axis direction, that is, the Y-axis direction, is produced. After forming a protective layer on the outer periphery of the collective substrate, the collective substrate is cut in a direction intersecting the winding axis direction, that is, in the X-axis direction or the Z-axis direction in FIG. Is divided into pieces. Thus, the individual wireless communication device 10F is acquired from the collective substrate.

  In the seventh embodiment, as the element block 30, for example, a resin block made of an epoxy resin or the like is used. The resin block preferably contains a magnetic filler such as ferrite powder or metal magnetic powder. When the coil antenna is formed with a plating pattern as in the first to sixth embodiments, abnormal deposition of plating may occur if the resin block contains a magnetic filler. In the seventh embodiment, since the coil antenna is formed by the metal wire 42, the problem of abnormal deposition of plating does not occur.

[effect]
The wireless communication device 10F according to Embodiment 7 can provide the following effects.

  According to the wireless communication device 10F according to the seventh embodiment, the resistance of the coil antenna itself can be reduced by forming the coil antenna with the metal wire 42 as compared with the case where the coil antenna is formed with the plating pattern. .

  According to the wireless communication device 10 </ b> F, the metal wire 42 straddles the circuit board 11 and the element block 30 and is wound around the element block 30. Therefore, the circuit board 11 is fixed to the element block 30 by the metal wire 42. be able to. Thereby, the metal wire 42 can prevent the circuit board 11 from falling off the element block 30.

  In the seventh embodiment, the example in which the metal wire 42 is a copper wire has been described. However, the present invention is not limited to this. The metal wire 42 may be, for example, a metal wire (covered wire) covered with an insulating film.

  In Embodiment 7, although the example which manufactures the some radio | wireless communication device 10F using the mother board | substrate 90a was demonstrated, it is not limited to this. For example, the manufacturing method of the seventh embodiment may be used to manufacture one wireless communication device 10F.

(Embodiment 8)
A wireless communication device according to a seventh embodiment of the present invention will be described with reference to FIGS. 19A and 19B.
19A and 19B are diagrams sequentially illustrating the manufacturing process of the wireless communication device 10G. Note that in the method for manufacturing the wireless communication device 10G according to the eighth embodiment, the description of the same parts as those in the first to seventh embodiments is omitted. 19 and 19B, illustration of the RFIC element 12 and the like mounted on the circuit board 11 is omitted for ease of explanation.

  As shown in FIGS. 19A and 19B, in the method of manufacturing the wireless communication device 10G of the eighth embodiment, the coil antenna is formed by attaching the spring material 43 to the element block 30 as compared with the seventh embodiment. The point is different. That is, the wireless communication device 10G according to the eighth embodiment is different from the seventh embodiment in that the coil antenna is formed of the spring material 43.

[Production method]
The manufacturing method of the wireless communication device 10G according to the eighth embodiment is the same as the manufacturing method of the wireless communication device 10F according to the seventh embodiment shown in FIGS.

  As shown in FIG. 19A, a spring material 43 formed in a rectangular helical shape is attached to the element block 30 (see FIG. 18E) in which the circuit board 11 is embedded. Specifically, the spring member 43 is fitted into the element block 30 so that the element block 30 enters the inner region of the spring member 43.

  As shown in FIG. 19B, after the spring material 43 is fitted into the element block 30, one end of the spring material 43 is welded to the end face of the interlayer conductor 20A or connected using a conductive material such as solder. Further, the other end of the spring material 43 is welded to the end face of the interlayer conductor 20B, or is connected using a conductive material such as solder.

  Thus, in Embodiment 8, the coil antenna is formed by the spring material 43 having spring properties.

  In the eighth embodiment, similarly to the seventh embodiment, a plurality of wireless communication devices 10G may be manufactured using the mother substrate 90b.

  In the eighth embodiment, a groove into which the spring material 43 enters may be provided around the element body block 30. Thereby, positioning of the spring material 43 can be performed easily.

  In the eighth embodiment, as in the seventh embodiment, a resin block containing a magnetic filler such as ferrite powder or metal magnetic powder may be used as the element block 30.

[effect]
The wireless communication device 10G according to Embodiment 8 can provide the following effects.

  According to the wireless communication device 10G according to the eighth embodiment, by forming the coil antenna with the spring material 43, the resistance of the coil antenna itself can be reduced as compared with the case where the coil antenna is formed with a plating pattern. .

  Further, since the spring material 43 is a metal having spring properties, the shape of the coil antenna can be maintained. For example, when attaching the spring material 43 to the element block 30, the spring material 43 can be easily attached by deforming it. On the other hand, after the spring member 43 is attached to the element block 30, the spring member 43 returns to its original shape, so that the shape of the coil antenna can be maintained.

  Although the present invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. Such changes and modifications are to be understood as included within the scope of the present invention as long as they do not depart from the scope of the present invention.

  The present invention is useful for a wireless communication device, and can improve the connection reliability of a coil antenna.

ANT Coil Antenna PS1 First surface of circuit board PS2 Second surface of circuit board PS3 Third surface of circuit board PS4 Fourth surface of circuit board VS1 First main surface of element block VS2 Second main surface of element block VS3 First side of element block VS4 Second side of element block 1 Pedestal 10A, 10B, 10C, 10D, 10E Wireless communication device 11, 11a, 11b Circuit board 12 RFIC element 13 Chip capacitor 14 Wiring conductor pattern 15, 16 Chip Capacitor 17 Sealing resin layer 18 Magnetic block 20A, 20B, 20C, 20D Interlayer conductor 30, 30a Element block 40, 40b Plating pattern 40a Wiring pattern 41 Through-hole plating 42 Metal wire 43 Spring material 50 Protective layer 60 With plating nucleus Thick film layer 90, 90a, 90b Mother board 100 Article with wireless communication device 101 Resin molding

Claims (16)

Providing a circuit board comprising: an RFIC element mounted on the first surface; and an interlayer conductor extending from the first surface to a second surface opposite to the first surface and connected to the RFIC element;
Covering at least the first surface of the circuit board with an element block;
Providing a coiled conductor that goes around the circuit board and the element block, and forming a coil antenna connected to the RFIC element via the interlayer conductor;
A method for manufacturing a wireless communication device, comprising:   The method of manufacturing a wireless communication device according to claim 1, wherein the step of covering the circuit board with the element body block embeds the circuit board in the element body block. The step of preparing the circuit board includes preparing a mother board in which a plurality of circuit boards are continuously provided,
The step of covering the circuit board with the element block covers the mother substrate with the element block,
In the step of forming the coil antenna, the plurality of circuit boards are formed by the plurality of coiled conductors that circulate between the element block and the mother board, with a direction in which the plurality of circuit boards are continuous as a winding axis direction. By forming a plurality of coil antennas connected to each of the above, a collective substrate in a state where a plurality of wireless communication devices are connected,
The method for manufacturing a wireless communication device according to claim 1, further comprising a step of cutting the collective substrate in a direction intersecting the winding axis direction to obtain a piece of the wireless communication device. .   The method for manufacturing a wireless communication device according to claim 1, wherein the coiled conductor is a plating pattern.   The step of forming the coil antenna includes the step of activating the pattern formation region of the circuit board and the element block by laser processing and forming the plating pattern by forming a plating film in the pattern formation region. The manufacturing method of the radio | wireless communication device of Claim 4 containing this.   The method of manufacturing a wireless communication device according to claim 5, wherein the step of forming the plating pattern includes a step of performing electrolytic plating.   The method of manufacturing a wireless communication device according to claim 5, wherein the element block includes a plating core material. Furthermore,
Covering the outer peripheral surface of the element block with a thick film layer containing a plating nucleus;
Including
The method for manufacturing a wireless communication device according to claim 5, wherein in the step of forming the plating pattern, laser processing is performed from above the thick film layer.   The method for manufacturing a wireless communication device according to claim 1, wherein the coiled conductor is a metal wire. The method for manufacturing a wireless communication device according to claim 1, wherein the coiled conductor is a spring material.
A circuit board comprising: an RFIC element mounted on a first surface; and an interlayer conductor extending from the first surface to a second surface facing the first surface and connected to the RFIC element;
An element block covering at least the first surface of the circuit board;
A coil antenna connected to the RFIC element via the interlayer conductor and formed of a coiled conductor that circulates the circuit board and the element block;
A wireless communication device comprising:   The wireless communication device according to claim 11, wherein the circuit board is embedded in the element block.   The wireless communication device according to claim 11 or 12, wherein the interlayer conductor is a metal pin.   The wireless communication device according to claim 11, wherein the coiled conductor is a plating pattern.   The wireless communication device according to any one of claims 11 to 13, wherein the coiled conductor is a metal wire.   The wireless communication device according to any one of claims 11 to 13, wherein the coiled conductor is a spring material.

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