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JP6169347B2 - Anisotropic conductive film and semiconductor device with improved pre-bonding processability - Google Patents

Anisotropic conductive film and semiconductor device with improved pre-bonding processability Download PDF

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Publication number
JP6169347B2
JP6169347B2 JP2012250429A JP2012250429A JP6169347B2 JP 6169347 B2 JP6169347 B2 JP 6169347B2 JP 2012250429 A JP2012250429 A JP 2012250429A JP 2012250429 A JP2012250429 A JP 2012250429A JP 6169347 B2 JP6169347 B2 JP 6169347B2
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JP
Japan
Prior art keywords
adhesive layer
anisotropic conductive
conductive film
acrylate
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012250429A
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Japanese (ja)
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JP2013110110A (en
Inventor
連 助 高
連 助 高
鎭 圭 金
鎭 圭 金
東 善 魚
東 善 魚
吉 ▲よう▼ 李
吉 ▲よう▼ 李
長 鉉 ▲そう▼
長 鉉 ▲そう▼
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Cheil Industries Inc
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Cheil Industries Inc
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Publication of JP2013110110A publication Critical patent/JP2013110110A/en
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Publication of JP6169347B2 publication Critical patent/JP6169347B2/en
Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
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    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
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    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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    • C09J2433/00—Presence of (meth)acrylic polymer
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Description

本発明は、導電性接着層及び絶縁性接着層が積層された異方性導電フィルムに関するもので、前記導電性接着層の反応性モノマー含量を前記絶縁性接着層の反応性モノマー含量より高くしガラスに対する導電性接着層の粘着力を強化することで、仮圧着時に工程不良の問題を改善した異方性導電フィルムに関するものである。   The present invention relates to an anisotropic conductive film in which a conductive adhesive layer and an insulating adhesive layer are laminated, and the reactive monomer content of the conductive adhesive layer is set higher than the reactive monomer content of the insulating adhesive layer. It is related with the anisotropic conductive film which improved the problem of the process defect at the time of temporary crimping | bonding by strengthening the adhesive force of the electroconductive contact bonding layer with respect to glass.

異方性導電フィルム（Ａｎｉｓｏｔｒｏｐｉｃ ｃｏｎｄｕｃｔｉｖｅ ｆｉｌｍ、ＡＣＦ）とは、一般的にニッケル（Ｎｉ）や金（Ａｕ）などの金属粒子、またはそのような金属でコーティングされた高分子粒子などの導電粒子をエポキシなどの樹脂に分散したフィルム形状の接着剤をいうもので、フィルムの膜の厚さ方向には導電性を帯び、面方向には絶縁性を有する、電気異方性及び接着性を有する高分子膜を意味する。異方性導電フィルムを接続しようとする回路間に前記フィルムを置いた後、所定条件の加熱・加圧工程を経ると、回路端子同士の間は導電性粒子により電気的に接続するようになり、隣接する電極間には絶縁性接着樹脂が充填されて導電性粒子がお互いに独立して存在することで高絶縁性が与えられる。   Anisotropic conductive film (ACF) is generally a metal particle such as nickel (Ni) or gold (Au) or conductive particles such as polymer particles coated with such a metal. An adhesive in the form of a film dispersed in a resin such as a polymer having electrical anisotropy and adhesiveness that is conductive in the thickness direction of the film and has insulation in the surface direction. Means a membrane. After the film is placed between the circuits to which the anisotropic conductive film is to be connected, the circuit terminals are electrically connected to each other by conductive particles after a predetermined heating / pressurizing process. Insulating adhesive resin is filled between the adjacent electrodes, and the conductive particles exist independently of each other, thereby providing high insulation.

最近ＩＴ（情報技術）デバイスの軽薄短小化及びフラットパネルディスプレイの解像度増加などにより前記デバイスの回路幅が従来より段々狭くなっている。この場合、回路幅が狭くなることにより、接着層に含まれていて回路を接続させる導電粒子（同士）が固まる（凝集、塊状化する）ことによる電気的な短絡が発生せざるを得なくなる。これを回避するために多層構造の異方性導電フィルムが一般的に広く使用されている。   Recently, the circuit width of the device has become narrower than before due to the reduction in the size of IT (information technology) devices and the increase in the resolution of flat panel displays. In this case, since the circuit width is narrowed, an electrical short circuit due to the solidification (aggregation or agglomeration) of the conductive particles (combined) that are included in the adhesive layer and connect the circuits is inevitably generated. In order to avoid this, an anisotropic conductive film having a multilayer structure is generally widely used.

現在使用されている多層構造の異方性導電フィルムは、ＰＥＴ（ポリエチレンテレフタラート）などの離型フィルム上に絶縁性接着層が積層されていて、その上に導電粒子を含み前記絶縁性接着層より反応性モノマーの含量が少なく溶融粘度の高い導電性接着層が積層されている構造となっている。   The anisotropic conductive film having a multi-layer structure currently used has an insulating adhesive layer laminated on a release film such as PET (polyethylene terephthalate), and includes the conductive particles on the insulating adhesive layer. It has a structure in which a conductive adhesive layer having a lower reactive monomer content and a higher melt viscosity is laminated.

このような異方性導電フィルムを使用する場合、ボンディング時に相対的に高溶融粘度を有する導電性接着層は導電粒子の流動性を最大限に抑えるし、相対的に低溶融粘度を有する絶縁性接着層は電極間を埋めることで、導電粒子の流動による電気的短絡を防止する長所がある。   When such an anisotropic conductive film is used, the conductive adhesive layer having a relatively high melt viscosity during bonding minimizes the fluidity of the conductive particles and has an insulating property having a relatively low melt viscosity. The adhesive layer has an advantage of preventing an electrical short circuit due to the flow of the conductive particles by filling between the electrodes.

しかし、前記の従来の異方性導電フィルムは仮圧着工程性に劣る短所を有する。具体的に、異方性導電フィルムを利用したモジュール工程において、前記異方性導電フィルムをガラス上に整列させこれを熱圧着などによりガラス上に固定させた後、離型フィルムを除去する仮圧着工程を経るが、この際従来の異方性導電フィルムの場合ガラスに固定される導電性接着層の溶融粘度が離型フィルム側に隣接した絶縁性接着層の溶融粘度より高くてガラスに対する導電性接着層の粘着力が低いため、離型フィルムを除去する時異方性導電フィルムが残っていけずガラスから全て剥れてしまう仮圧着工程不良が頻繁に発生するようになる。   However, the conventional anisotropic conductive film has a disadvantage inferior to the provisional pressure bonding process. Specifically, in the module process using the anisotropic conductive film, the anisotropic conductive film is aligned on the glass, fixed on the glass by thermocompression bonding, etc., and then the temporary pressure bonding is performed to remove the release film. In this case, in the case of a conventional anisotropic conductive film, the melt viscosity of the conductive adhesive layer fixed to the glass is higher than the melt viscosity of the insulating adhesive layer adjacent to the release film side and the conductivity to the glass Since the adhesive force of the adhesive layer is low, a temporary crimping process failure that the anisotropic conductive film does not remain when the release film is removed and all of the film is peeled off from the glass frequently occurs.

また、本圧着時に不良が発生するとガラスを廃棄することよりリワーク（ｒｅｗｏｒｋ）工程を通して除去し、再び異方性導電フィルムの手動仮圧着工程を経ることになるため問題となる。   Further, if a defect occurs during the main pressure bonding, the glass is discarded and removed through a reworking process, which causes a problem because the anisotropic conductive film is again subjected to a manual temporary pressure bonding process.

従って、導電性接着層の粘着力を強化して仮圧着工程性の向上された異方性導電フィルムの開発が要求される。   Therefore, it is required to develop an anisotropic conductive film having an improved temporary pressure bonding process by strengthening the adhesive strength of the conductive adhesive layer.

一方、多層構造の異方性導電フィルムに関する先行技術は以下の通りである。   On the other hand, the prior art regarding an anisotropic conductive film having a multilayer structure is as follows.

特許文献１は、重合開始剤として、１分間の半減期が異なる２種類の有機過酸化物を使用することにより低温速硬化を達成した多層異方性導電フィルムに関するものである。   Patent Document 1 relates to a multilayer anisotropic conductive film that achieves low-temperature rapid curing by using two kinds of organic peroxides having different half-lives of 1 minute as polymerization initiators.

特許文献２は、絶縁性接着層にナノシリカを添加することにより絶縁性接着層の接着強度を高めた多層異方性導電フィルムに関するものである。   Patent Document 2 relates to a multilayer anisotropic conductive film in which the adhesion strength of the insulating adhesive layer is increased by adding nano silica to the insulating adhesive layer.

特許文献３は、絶縁性接着層より高溶融粘度を有し多数の孔部がある導電性接着層から構成されたもので、ファインピッチ（ｆｉｎｅ ｐｉｔｃｈ）に対応できる多層異方性導電フィルムに関するものである。   Patent Document 3 is composed of a conductive adhesive layer having a higher melt viscosity than an insulating adhesive layer and having a large number of pores, and relates to a multilayer anisotropic conductive film that can cope with fine pitch (fine pitch). It is.

導電性接着層の観点から、前記先行技術は全て導電性接着層の溶融粘度を絶縁性接着層より高くして導電粒子の流動を防止する効果を図るだけで、先行技術のどこにも導電性接着層の粘着力改善、即ち仮圧着時の工程不良を改善することに関する内容は開示されてない。   From the viewpoint of the conductive adhesive layer, all of the above prior arts have the effect of preventing the flow of the conductive particles by making the melt viscosity of the conductive adhesive layer higher than that of the insulating adhesive layer, and the conductive adhesive can be applied anywhere in the prior art. There is no disclosure regarding the improvement of the adhesive strength of the layer, that is, the improvement of the process failure during temporary pressing.

特開２０１０−００３７５３９号公報JP 2010-0037539 A 特開２００７−０２５７９４７号公報JP 2007-0257947 A 韓国公開特許第１０−２０１０−００１０６９４号公報Korean Published Patent No. 10-2010-0010694

本発明者は上述の通り、仮圧着工程時に導電性接着層の溶融粘度が絶縁性接着層の溶融粘度より高い異方性導電フィルムを使用する場合、導電性接着層の粘着力が低くて仮圧着時に工程不良を誘発する問題点を認識し、これを解決しようとして導電性接着層の反応性モノマー含量を絶縁性接着層の反応性モノマー含量より高くすることで、粘着力の優秀な異方性導電フィルムを開発するに至ったものである。   As described above, the inventor uses an anisotropic conductive film in which the melt viscosity of the conductive adhesive layer is higher than the melt viscosity of the insulating adhesive layer during the temporary press-bonding step. Recognizing the problems that cause process failure during crimping, and trying to solve this problem, the reactive monomer content of the conductive adhesive layer is made higher than the reactive monomer content of the insulating adhesive layer. Has led to the development of conductive films.

具体的に、本発明は従来の多層異方性導電フィルムの主な効果である電気的短絡の発生抑制性能を保持しながらも、導電性接着層の粘着力が強化され仮圧着工程性の優れた異方性導電フィルムを提供することを目的とする。   Specifically, the present invention retains the performance of suppressing the occurrence of electrical short-circuits, which is the main effect of conventional multilayer anisotropic conductive films, while enhancing the adhesive strength of the conductive adhesive layer and providing superior pre-bonding processability. Another object of the present invention is to provide an anisotropic conductive film.

本発明の実施形態において、（１）導電性接着層及び絶縁性接着層が積層された異方性導電フィルムであって、前記導電性接着層の反応性モノマー含量が、前記絶縁性接着層の反応性モノマー含量より多い、異方性導電フィルムを提供する。   In an embodiment of the present invention, (1) an anisotropic conductive film in which a conductive adhesive layer and an insulating adhesive layer are laminated, wherein the reactive monomer content of the conductive adhesive layer is equal to that of the insulating adhesive layer. An anisotropic conductive film having a reactive monomer content greater is provided.

本発明の他の実施形態において、（２）前記導電性接着層の総質量を基準として、前記導電性接着層の反応性モノマー含量が２５ないし５０質量％で、前記絶縁性接着層の総質量を基準として前記絶縁性接着層の反応性モノマー含量が２０ないし４０質量％である、上記（１）に記載の異方性導電フィルムを提供する。   In another embodiment of the present invention, (2) based on the total mass of the conductive adhesive layer, the reactive monomer content of the conductive adhesive layer is 25 to 50% by mass, and the total mass of the insulating adhesive layer The anisotropic conductive film according to the above (1), wherein the reactive monomer content of the insulating adhesive layer is 20 to 40% by mass based on the above.

本発明の他の実施形態において、（３）前記導電性接着層の反応性モノマー含量が、前記絶縁性接着層のモノマー含量の１倍超過ないし２倍以下である、上記（１）または（２）に記載の異方性導電フィルムを提供する。   In another embodiment of the present invention, (3) the reactive monomer content of the conductive adhesive layer is more than 1 to 2 times less than the monomer content of the insulating adhesive layer. The anisotropic conductive film described in 1) is provided.

本発明の他の実施形態において、（４）前記導電性接着層、前記絶縁性接着層、又は前記導電性接着層及び前記絶縁性接着層の反応性モノマーは、２−メタクリロイルオキシエチルホスフェート、ペンタエリスリトールトリ（メタ）アクリレート、及び２−ヒドロキシエチル（メタ）アクリレートからなる群より選ばれる１種以上である、上記（１）ないし（３）の何れか一つに記載の異方性導電フィルムを提供する。   In another embodiment of the present invention, (4) the conductive adhesive layer, the insulating adhesive layer, or the reactive monomer of the conductive adhesive layer and the insulating adhesive layer is 2-methacryloyloxyethyl phosphate, penta The anisotropic conductive film according to any one of (1) to (3) above, which is one or more selected from the group consisting of erythritol tri (meth) acrylate and 2-hydroxyethyl (meth) acrylate. provide.

本発明の他の実施形態において、（５）異方性導電フィルムの総質量を基準として、反応性モノマー２０ないし４５質量％、及びバインダー樹脂５５ないし８０質量％を含み、各々のピール強度（引きはがし強度）が異なる２以上の層を有する、上記（１）ないし（４）の何れか一つに記載の異方性導電フィルムを提供する。   In another embodiment of the present invention, (5) based on the total mass of the anisotropic conductive film, 20 to 45 mass% of reactive monomer and 55 to 80 mass% of binder resin, The anisotropic conductive film according to any one of the above (1) to (4), which has two or more layers having different peel strengths.

本発明の他の実施形態において、（６）異方性導電フィルムの総質量を基準として、反応性モノマー２０ないし４５質量％、及びバインダー樹脂５５ないし８０質量％を含み、ピール強度は２５℃、１ＭＰａ、１秒の条件で、上面（導電性接着層層）のピール強度が３ないし１０ｇｆ／ｍｍで、下面（絶縁性接着層）のピール強度が２ないし７ｇｆ／ｍｍである、上記（５）に記載の異方性導電フィルムを提供する。   In another embodiment of the present invention, (6) based on the total mass of the anisotropic conductive film, containing 20 to 45 mass% reactive monomer and 55 to 80 mass% binder resin, the peel strength is 25 ° C., (5) The peel strength of the upper surface (conductive adhesive layer) is 3 to 10 gf / mm and the peel strength of the lower surface (insulating adhesive layer) is 2 to 7 gf / mm under the conditions of 1 MPa and 1 second. The anisotropic conductive film as described in 1. is provided.

本発明の他の実施形態において、（７）前記反応性モノマーは、２−メタクリロイルオキシエチルホスフェート、ペンタエリスリトールトリ（メタ）アクリレート、及び２−ヒドロキシエチル（メタ）アクリレートからなる群より選ばれる１種以上である、上記（５）または（６）に記載の異方性導電フィルムを提供する。   In another embodiment of the present invention, (7) the reactive monomer is selected from the group consisting of 2-methacryloyloxyethyl phosphate, pentaerythritol tri (meth) acrylate, and 2-hydroxyethyl (meth) acrylate. The anisotropic conductive film according to (5) or (6) above is provided.

本発明の他の実施形態において、（８）異方性導電フィルムの総質量を基準として、熱可塑性樹脂４５ないし７５質量％、導電粒子１ないし１０質量％、及び反応性モノマー２０ないし４５質量％を含み、伸び率が４００ないし８００％である、上記（１）ないし（７）の何れか一つに記載の異方性導電フィルムを提供する。   In another embodiment of the invention, (8) 45 to 75% by weight of thermoplastic resin, 1 to 10% by weight of conductive particles, and 20 to 45% by weight of reactive monomer, based on the total weight of the anisotropic conductive film. The anisotropic conductive film according to any one of (1) to (7) above, wherein the elongation percentage is 400 to 800%.

本発明の他の実施形態において、（９）異方性導電フィルムの総質量を基準として、熱可塑性樹脂４５ないし７５質量％、導電粒子１ないし１０質量％及び反応性モノマー２０ないし４５質量％を含み、２５℃、１ＭＰａ、１秒の条件で、上面（導電性接着層層）のピール強度が３ないし１０ｇｆ／ｍｍで、下面（絶縁性接着層）のピール強度が２ないし７ｇｆ／ｍｍである、上記（１）ないし（８）の何れか一つに記載の異方性導電フィルムを提供する。   In another embodiment of the present invention, (9) 45 to 75 mass% thermoplastic resin, 1 to 10 mass% conductive particles and 20 to 45 mass% reactive monomer based on the total mass of the anisotropic conductive film. In addition, the peel strength of the upper surface (conductive adhesive layer) is 3 to 10 gf / mm and the peel strength of the lower surface (insulating adhesive layer) is 2 to 7 gf / mm at 25 ° C., 1 MPa, and 1 second. The anisotropic conductive film according to any one of (1) to (8) is provided.

本発明の他の実施形態において、（１０）前記反応性モノマーは、２−メタクリロイルオキシエチルホスフェート、ペンタエリスリトールトリ（メタ）アクリレート、及び２−ヒドロキシエチル（メタ）アクリレートからなる群より選ばれる１種以上である、上記（８）または（９）に記載の異方性導電フィルムを提供する。   In another embodiment of the present invention, (10) the reactive monomer is selected from the group consisting of 2-methacryloyloxyethyl phosphate, pentaerythritol tri (meth) acrylate, and 2-hydroxyethyl (meth) acrylate. The anisotropic conductive film according to the above (8) or (9) is provided.

本発明の他の実施形態において、（９）前記（１）ないし（８）の何れか一つに記載の異方性導電フィルムより接続した半導体装置を提供する。   In another embodiment of the present invention, (9) a semiconductor device connected by the anisotropic conductive film according to any one of (1) to (8) is provided.

前記半導体装置は、配線基板；前記配線基板のチップ搭載面に接着（付着）されている異方性導電フィルム；及び前記フィルム上に搭載された半導体チップを含むことができる。   The semiconductor device may include a wiring substrate; an anisotropic conductive film adhered (attached) to a chip mounting surface of the wiring substrate; and a semiconductor chip mounted on the film.

本発明の異方性導電フィルムは、導電性接着層の粘着力が強化され、仮圧着時の工程性が優れる効果を有する。   The anisotropic conductive film of this invention has the effect that the adhesive force of a conductive contact bonding layer is strengthened and the process property at the time of temporary crimping | compression-bonding is excellent.

より具体的には、本発明は導電性接着層の反応性モノマー含量を絶縁性接着層の反応性モノマー含量より高くすることで仮圧着時に導電性接着層の粘着力が強化され離型フィルムが容易に除去できるようにし、本圧着時には導電性接着層の速い反応性によって導電性接着層の流動性が絶縁性接着層より急激に減ることで電気的短絡を防止する効果を有する。   More specifically, in the present invention, the adhesive strength of the conductive adhesive layer is strengthened at the time of pre-bonding by making the reactive monomer content of the conductive adhesive layer higher than the reactive monomer content of the insulating adhesive layer. It can be easily removed, and has the effect of preventing electrical short-circuiting due to a rapid decrease in the fluidity of the conductive adhesive layer as compared with the insulating adhesive layer due to the fast reactivity of the conductive adhesive layer during the main compression bonding.

以下、本発明に関して、より詳細に説明する。本願明細書に記載されてない内容は本発明の技術分野、又は類似分野での熟練者であれば十分に認識し類推できるので説明を省略する。   Hereinafter, the present invention will be described in more detail. The contents not described in the specification of the present application will be fully recognized and analogized by those skilled in the technical field of the present invention or similar fields, and will not be described.

本発明の実施形態において、導電性接着層及び絶縁性接着層が積層された異方性導電フィルムであって、前記導電性接着層の反応性モノマー含量が前記絶縁性接着層の反応性モノマー含量より多い、異方性導電フィルムを提供する。   In an embodiment of the present invention, an anisotropic conductive film in which a conductive adhesive layer and an insulating adhesive layer are laminated, wherein the reactive monomer content of the conductive adhesive layer is the reactive monomer content of the insulating adhesive layer. More anisotropic conductive films are provided.

前記本発明は、仮圧着時に導電性接着層とガラスとの間の粘着力が優秀であり、絶縁性接着層と離型フィルムとの間の離型力が優秀で、工程不良を防止する効果を有する。   The present invention has an excellent adhesive force between the conductive adhesive layer and the glass at the time of temporary pressure bonding, an excellent release force between the insulating adhesive layer and the release film, and an effect of preventing a process failure. Have

前記導電性接着層の反応性モノマー含量は、好ましくは前記導電性接着層の総質量を基準として、２５ないし５０質量％で、より好ましくは３０ないし４５質量％である。   The reactive monomer content of the conductive adhesive layer is preferably 25 to 50% by mass, more preferably 30 to 45% by mass, based on the total mass of the conductive adhesive layer.

前記絶縁性接着層の反応性モノマー含量は、好ましくは前記絶縁性接着層の総質量を基準として、２０ないし４０質量％で、より好ましくは２５ないし３５質量％である。   The reactive monomer content of the insulating adhesive layer is preferably 20 to 40% by mass, more preferably 25 to 35% by mass, based on the total mass of the insulating adhesive layer.

本発明の他の実施形態において、前記導電性接着層の反応性モノマーの含量は、好ましくは前記絶縁性接着層の反応性モノマー含量の１倍超過ないし２倍以下、より好ましくは１倍超過ないし１．８倍以下で、最も好ましくは１．１倍ないし１．５倍の範囲である。   In another embodiment of the present invention, the content of reactive monomer in the conductive adhesive layer is preferably more than 1 to less than 2 times, more preferably more than 1 time than the reactive monomer content of the insulating adhesive layer. It is 1.8 times or less, most preferably in the range of 1.1 times to 1.5 times.

本発明の他の実施形態において、異方性導電フィルムの総質量を基準として、好ましくは反応性モノマー２０ないし４５質量％、及びバインダー樹脂５５ないし８０質量％、より好ましくは反応性モノマー２５ないし４０質量％、及びバインダー樹脂６０ないし７５質量％を含み、上面（導電性接着層）と下面（絶縁性接着層）のピール強度が異なる２以上の層を有する異方性導電フィルムを提供する。   In another embodiment of the present invention, the reactive monomer is preferably 20 to 45% by weight, and the binder resin 55 to 80% by weight, more preferably the reactive monomer 25 to 40, based on the total weight of the anisotropic conductive film. Provided is an anisotropic conductive film comprising 2% or more layers containing 2% by mass and a binder resin of 60 to 75% by mass and having different peel strengths on an upper surface (conductive adhesive layer) and a lower surface (insulating adhesive layer).

前記上面のピール強度（導電性接着層）は２５℃、１ＭＰａ、１秒の条件で、好ましくは３ないし１０ｇｆ／ｍｍで、下面（絶縁性接着層）のピール強度は前記と同じ条件で、好ましくは２ないし７ｇｆ／ｍｍである。上面（導電性接着層）のピール強度および下面（絶縁性接着層）のピール強度が、上記範囲内であれば、導電性接着層は、仮圧着（prebonding）の際に絶縁性接着層に比べて接着力が高く、離型フィルムの除去を容易にすることができる点で優れている。   The peel strength of the upper surface (conductive adhesive layer) is preferably 25 ° C., 1 MPa, 1 second, preferably 3 to 10 gf / mm, and the peel strength of the lower surface (insulating adhesive layer) is preferably the same as described above. Is 2 to 7 gf / mm. If the peel strength of the upper surface (conductive adhesive layer) and the peel strength of the lower surface (insulating adhesive layer) are within the above ranges, the conductive adhesive layer is compared to the insulating adhesive layer during prebonding. It is excellent in that the adhesive strength is high and the release film can be easily removed.

本発明の他の実施形態において、異方性導電フィルムの総質量を基準として、好ましくは熱可塑性樹脂４５ないし７５質量％、導電粒子１ないし１０質量％、及び反応性モノマー２０ないし４５質量％、より好ましくは熱可塑性樹脂６０ないし７０質量％、導電粒子１ないし１０質量％、反応性モノマー２５ないし４０質量％を含み、伸び率が４００ないし８００％である異方性導電フィルムを提供する。   In another embodiment of the present invention, preferably based on the total mass of the anisotropic conductive film, the thermoplastic resin is preferably 45 to 75 mass%, the conductive particles 1 to 10 mass%, and the reactive monomer 20 to 45 mass%, More preferably, an anisotropic conductive film comprising 60 to 70% by weight of a thermoplastic resin, 1 to 10% by weight of conductive particles, 25 to 40% by weight of a reactive monomer and having an elongation of 400 to 800% is provided.

前記導電性接着層、及び／又は、絶縁性接着層の反応性モノマーは、好ましくは（メタ）アクリレートモノマーで、より好ましくはホスフェート基を有するアクリレート、水酸基を有するアクリレート、エポキシ基を有するアクリレート、トリ（メタ）アクリレート及びイソシアヌレートからなる群より選ばれる１種以上で、より好ましくは２−メタクリロイルオキシエチルホスフェート、ペンタエリスリトールトリ（メタ）アクリレート、及び２−ヒドロキシエチル（メタ）アクリレートからなる群より選ばれる１種以上である。最も好ましくは、２−ヒドロキシエチル（メタ）アクリレートである。   The reactive monomer of the conductive adhesive layer and / or the insulating adhesive layer is preferably a (meth) acrylate monomer, more preferably an acrylate having a phosphate group, an acrylate having a hydroxyl group, an acrylate having an epoxy group, One or more selected from the group consisting of (meth) acrylates and isocyanurates, more preferably selected from the group consisting of 2-methacryloyloxyethyl phosphate, pentaerythritol tri (meth) acrylate, and 2-hydroxyethyl (meth) acrylate. One or more types. Most preferred is 2-hydroxyethyl (meth) acrylate.

本発明の他の実施形態において、前記異方性導電フィルムで接続された半導体装置を提供する。   In another embodiment of the present invention, a semiconductor device connected by the anisotropic conductive film is provided.

前記半導体装置は、配線基板；前記配線基板のチップ搭載面に付着（接着）されている異方性導電フィルム；及び前記フィルム上に搭載される半導体チップを含むことができる。
本発明に用いられる前記配線基板、半導体チップは特に限定されなく、当該技術分野で知られているものを用いることができる。 The semiconductor device may include a wiring board; an anisotropic conductive film attached (adhered) to a chip mounting surface of the wiring board; and a semiconductor chip mounted on the film.
The wiring board and semiconductor chip used in the present invention are not particularly limited, and those known in the technical field can be used.

本発明の半導体装置を製造する方法は特に限定されなく、当該技術分野で知られている方法で行うことができる。   The method for manufacturing the semiconductor device of the present invention is not particularly limited, and can be performed by a method known in the art.

本発明の異方性導電フィルムにおいて、前記導電性接着層はバインダー樹脂、反応性モノマー、ラジカル開始剤、及び導電粒子を含むことができ、前記絶縁性接着層はバインダー樹脂、反応性モノマー及びラジカル開始剤を含むことができる。以下、各成分に関してより詳細に説明する。   In the anisotropic conductive film of the present invention, the conductive adhesive layer may include a binder resin, a reactive monomer, a radical initiator, and conductive particles, and the insulating adhesive layer may include a binder resin, a reactive monomer, and a radical. An initiator can be included. Hereinafter, each component will be described in detail.

（ａ）バインダー樹脂
本発明に使用されるバインダー樹脂として、例えば、熱可塑性樹脂、アクリル系樹脂、ポリウレタン系樹脂、ポリウレタンアクリレート樹脂、ポリエステルウレタン樹脂、またはＮＢＲ系樹脂などがある。 (A) Binder resin Examples of the binder resin used in the present invention include thermoplastic resins, acrylic resins, polyurethane resins, polyurethane acrylate resins, polyester urethane resins, and NBR resins.

（ａ−１）熱可塑性樹脂
本発明で使用できる熱可塑性樹脂としては、アクリロニトリル系、フェノキシ系、ブタジエン系、アクリル系、ポリウレタン系、ウレタンアクリレート系、ポリアミド系、オレフィン系、シリコン系、及びＮＢＲ（Ｎｉｔｒｉｌｅ ｂｕｔａｄｉｅｎｅ ｒｕｂｂｅｒ）系樹脂からなる群より選ばれる１種以上を使用することができるが、これらに限定されない。 (A-1) Thermoplastic resin The thermoplastic resin that can be used in the present invention includes acrylonitrile, phenoxy, butadiene, acrylic, polyurethane, urethane acrylate, polyamide, olefin, silicon, and NBR ( One or more selected from the group consisting of (Nitile butadiene rubber) -based resins can be used, but is not limited thereto.

熱可塑性樹脂は、重量平均分子量が１，０００ないし１，０００，０００ｇ／ｍｏｌであるものが良い。前記範囲内で、適切なフィルム強度を有することができるし、相分離が起こらなく、被着材との密着性が低くて接着力が低下されないためである。   The thermoplastic resin preferably has a weight average molecular weight of 1,000 to 1,000,000 g / mol. This is because, within the above range, the film can have an appropriate film strength, phase separation does not occur, adhesion with the adherend is low, and adhesive strength is not reduced.

前記熱可塑性樹脂の含量は、導電性接着層の場合、導電性接着層の総質量を基準として、好ましくは５０ないし８０質量％、より好ましくは６０ないし７５質量％で、絶縁性接着層の場合、絶縁性接着層の総質量を基準として、好ましくは５０ないし９０質量％、より好ましくは６５ないし８５質量％である。   In the case of a conductive adhesive layer, the thermoplastic resin content is preferably 50 to 80% by mass, more preferably 60 to 75% by mass, based on the total mass of the conductive adhesive layer. The amount is preferably 50 to 90% by mass, more preferably 65 to 85% by mass, based on the total mass of the insulating adhesive layer.

（ａ−２）アクリル系樹脂
本発明で使用できるアクリル系樹脂は、アクリル系単量体及び／又はこれと重合できる単量体を重合して得ることができる。例えば、アクリル系樹脂は炭素数２ないし１０のアルキル基を有する（メタ）アクリレート、（メタ）アクリル酸、ビニルアセテート及びこれから変性されたアクリル系単量体からなる群より選ばれる１種以上の単量体を重合して製造することができる。重合方法は特に限定されない。 (A-2) Acrylic Resin The acrylic resin that can be used in the present invention can be obtained by polymerizing an acrylic monomer and / or a monomer that can be polymerized therewith. For example, the acrylic resin is one or more types selected from the group consisting of (meth) acrylates having 2 to 10 carbon atoms, (meth) acrylate, (meth) acrylic acid, vinyl acetate, and acrylic monomers modified therefrom. It can be produced by polymerizing a monomer. The polymerization method is not particularly limited.

本発明に使用されるバインダー樹脂中、アクリル系樹脂の含量は特に限定されないが、フィルムの総質量を基準として、好ましくは０ないし４０質量％である。   The content of the acrylic resin in the binder resin used in the present invention is not particularly limited, but is preferably 0 to 40% by mass based on the total mass of the film.

（ａ−３）ポリウレタン系樹脂
本発明で使用できるポリウレタン系樹脂はウレタン結合を有する高分子樹脂で、イソホロンジイソシアネート、ポリテトラメチレングリコールなどを重合して製造されるが、これらに限定されない。ポリウレタン系樹脂は重量平均分子量が５０，０００ないし１００，０００ｇ／ｍｏｌの樹脂であり得る。 (A-3) Polyurethane resin The polyurethane resin that can be used in the present invention is a polymer resin having a urethane bond, and is produced by polymerizing isophorone diisocyanate, polytetramethylene glycol, or the like, but is not limited thereto. The polyurethane resin may be a resin having a weight average molecular weight of 50,000 to 100,000 g / mol.

本発明で使用されるバインダー樹脂中、ポリウレタン系樹脂の含量は特に限定されないが、好ましくはフィルムの総質量を基準として０ないし４０質量％である。   The content of the polyurethane resin in the binder resin used in the present invention is not particularly limited, but is preferably 0 to 40% by mass based on the total mass of the film.

（ａ−４）ポリウレタンアクリレート樹脂
本発明で使用できるポリウレタンアクリレート樹脂は、イソシアネート、ポリオール、ジオール類及びヒドロキシアクリレートを共重合した樹脂であり得る。 (A-4) Polyurethane acrylate resin The polyurethane acrylate resin that can be used in the present invention may be a resin obtained by copolymerization of an isocyanate, a polyol, a diol, and a hydroxy acrylate.

イソシアネートは、芳香族、脂肪族及び脂環族のジイソシアネートからなる群より選ばれる１種以上であることができる。例えば、テトラメチレン−１，４−ジイソシアネート、ヘキサメチレン−１，６−ジイソシアネート、シクロヘキシレン−１，４−ジイソシアネート、メチレンビス（４−シクロヘキシルイソシアネート）、イソホロンジイソシアネート、及び４，４−メチレンビス（シクロヘキシルジイソシアネート）からなる群より選ばれる１種以上であることができる。   The isocyanate can be one or more selected from the group consisting of aromatic, aliphatic and alicyclic diisocyanates. For example, tetramethylene-1,4-diisocyanate, hexamethylene-1,6-diisocyanate, cyclohexylene-1,4-diisocyanate, methylenebis (4-cyclohexylisocyanate), isophorone diisocyanate, and 4,4-methylenebis (cyclohexyldiisocyanate). It can be one or more selected from the group consisting of:

ポリオールは、ポリエステルポリオール、ポリエーテルポリオール、及びポリカーボネートポリオールからなる群より選ばれる１種以上であることができる。ポリオールは、ジカルボン酸化合物とジオール化合物の縮合反応により得ることができる。ジカルボン酸の例では、コハク酸、グルタル酸、イソフタル酸、アジピン酸、スベリン酸、アゼライン酸、セバシン酸、ドデカンジカルボン酸、ヘキサヒドロフタル酸、イソフタル酸、テレフタル酸、オルトフタル酸、テトラクロロフタル酸、１，５−ナフタレンジカルボン酸、フマル酸、マレイン酸、イタコン酸、シトラコン酸、メサコン酸、テトラヒドロフタル酸などがあるが、これらに限定されることではない。ジオール化合物は、エチレングリコール、プロピレングリコール、１，３−プロパンジオール、１，３−ブタンジオール、１，４−ブタンジオール、１，５−ペンタンジオール、１，６−ヘキサンジオール、ネオペンチルグリコール、ジエチレングリコール、ジプロピレングリコール、トリエチレングリコール、ジブチレングリコール、２−メチル−１，３−ペンタンジオール、２，２，４−トリメチル−１，３−ペンタンジオール、１，４−シクロヘキサンメタノールなどがあるが、これらに限定されることではない。また、適切なポリエーテルポリオールは、ポリエチレングリコール、ポリプロピレングリコール、ポリテトラエチレングリコールなどがあるが、これらに限定されることではない。   The polyol can be one or more selected from the group consisting of polyester polyols, polyether polyols, and polycarbonate polyols. The polyol can be obtained by a condensation reaction of a dicarboxylic acid compound and a diol compound. Examples of dicarboxylic acids include succinic acid, glutaric acid, isophthalic acid, adipic acid, suberic acid, azelaic acid, sebacic acid, dodecanedicarboxylic acid, hexahydrophthalic acid, isophthalic acid, terephthalic acid, orthophthalic acid, tetrachlorophthalic acid, Examples include, but are not limited to, 1,5-naphthalenedicarboxylic acid, fumaric acid, maleic acid, itaconic acid, citraconic acid, mesaconic acid, and tetrahydrophthalic acid. Diol compounds include ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, diethylene glycol , Dipropylene glycol, triethylene glycol, dibutylene glycol, 2-methyl-1,3-pentanediol, 2,2,4-trimethyl-1,3-pentanediol, 1,4-cyclohexanemethanol, It is not limited to these. Suitable polyether polyols include, but are not limited to, polyethylene glycol, polypropylene glycol, and polytetraethylene glycol.

ジオール類は、１，３−プロパンジオール、１，３−ブタンジオール、１，４−ブタンジオール、１，５−ペンタンジオール、１，６−ヘキサンジオール、ネオペンチルグリコール、ジエチレングリコール、ジプロピレングリコール、トリエチレングリコール、テトラエチレングリコール、ジブチレングリコール、２−メチル−１，３−ペンタンジオール、２，２，４−トリメチル−１，３ペンタンジオール、及び１，４−シクロヘキサンジメタノールからなる群より選ばれる１種以上であることができるが、これらに限定されることではない。   Diols include 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, diethylene glycol, dipropylene glycol, Selected from the group consisting of ethylene glycol, tetraethylene glycol, dibutylene glycol, 2-methyl-1,3-pentanediol, 2,2,4-trimethyl-1,3-pentanediol, and 1,4-cyclohexanedimethanol Although it can be 1 or more types, it is not limited to these.

ポリウレタンアクリレート樹脂を製造する重合方法は特に限定されない。   The polymerization method for producing the polyurethane acrylate resin is not particularly limited.

本発明で使用されるバインダー樹脂中、ポリウレタンアクリレート樹脂の含量は特に限定されないが、好ましくはフィルムの総質量を基準として０ないし３０質量％である。   The content of the polyurethane acrylate resin in the binder resin used in the present invention is not particularly limited, but is preferably 0 to 30% by mass based on the total mass of the film.

（ａ−５）ポリエステルウレタン樹脂
本発明で使用できるポリエステルウレタン樹脂は、ポリエステルポリオールとジイソシアネートの反応により得ることができる。 (A-5) Polyester urethane resin The polyester urethane resin which can be used by this invention can be obtained by reaction of polyester polyol and diisocyanate.

ポリエステルポリオールは、複数のエステル基及び複数の水酸基を有する重合体である。ポリエステルポリオールは、ジカルボン酸とジオールの反応により得ることができる。
ジカルボン酸の例として、テレフタル酸、イソフタル酸、アジピン酸、セバシン酸などがあり、前記のような芳香族ジカルボン酸、又は脂肪族ジカルボン酸が好ましい。 The polyester polyol is a polymer having a plurality of ester groups and a plurality of hydroxyl groups. Polyester polyol can be obtained by reaction of dicarboxylic acid and diol.
Examples of the dicarboxylic acid include terephthalic acid, isophthalic acid, adipic acid, sebacic acid and the like, and the aromatic dicarboxylic acid or aliphatic dicarboxylic acid as described above is preferable.

ジオールの例として、エチレングリコール、プロピレングリコール、１，４−ブタンジオール、ヘキサンジオール、ネオペンチルグリコール、ジエチレングリコール、トリエチレングリコールなどがあり、前記のようなグリコール類が好ましい。   Examples of the diol include ethylene glycol, propylene glycol, 1,4-butanediol, hexanediol, neopentyl glycol, diethylene glycol, triethylene glycol, and the like, and the above glycols are preferable.

ジイソシアネートの例として、２，４−トリレンジイソシアネート（ＴＤＩ）、４，４’−ジフェニルメタンジイソシアネート（ＭＤＩ）、１，６−ヘキサメチレンジイソシアネート（ＨＤＩ）、イソホロンジイソシアネート（ＩＰＤＩ）などがあり、芳香族、脂環族、または脂肪族のジイソシアネートが好ましい。   Examples of diisocyanates include 2,4-tolylene diisocyanate (TDI), 4,4′-diphenylmethane diisocyanate (MDI), 1,6-hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI), aromatic, Alicyclic or aliphatic diisocyanates are preferred.

（ａ−６）ＮＢＲ系樹脂
本発明で使用できるＮＢＲ系樹脂は、アクリロニトリルとブタジエンの乳化重合により製造される共重合体で、共重合体の中でアクリロニトリルとブタジエンの各々の含量は特に限定されなく、重合方法も特に限定されない。ＮＢＲ系樹脂は重量平均分子量が５０，０００ないし２，０００，０００ｇ／ｍｏｌの樹脂であることができる。 (A-6) NBR resin The NBR resin that can be used in the present invention is a copolymer produced by emulsion polymerization of acrylonitrile and butadiene, and the contents of acrylonitrile and butadiene in the copolymer are particularly limited. The polymerization method is not particularly limited. The NBR resin may be a resin having a weight average molecular weight of 50,000 to 2,000,000 g / mol.

本発明で使用されるバインダー樹脂の中でＮＢＲ系樹脂の含量は特に限定されないが、好ましくはフィルムの総質量を基準として０ないし１５質量％である。   The content of the NBR resin in the binder resin used in the present invention is not particularly limited, but is preferably 0 to 15% by mass based on the total mass of the film.

（ｂ）反応性モノマー
反応性モノマーとは、一般的に分子量が１，０００未満の化合物で実質的に硬化反応を起こす化合物を意味する。本発明の反応性モノマーとして、好ましくは（メタ）アクリレートモノマーを使用することができる。 (B) Reactive monomer A reactive monomer generally means a compound that substantially undergoes a curing reaction with a compound having a molecular weight of less than 1,000. As the reactive monomer of the present invention, a (meth) acrylate monomer can be preferably used.

本発明の導電性接着層の反応性モノマーは、導電性接着層の総質量を基準として、２５ないし５０質量％であることが好ましい。前記範囲内で導電性接着層の粘着力を高めることができ仮圧着時の工程不良が防止できるし、接着層の流動性が適切に調節され導電粒子の流動による電気的短絡を防止することができる。前記反応モノマーの含量は、より好ましくは３０ないし４５質量％である。   The reactive monomer of the conductive adhesive layer of the present invention is preferably 25 to 50% by mass based on the total mass of the conductive adhesive layer. Within the above range, the adhesive strength of the conductive adhesive layer can be increased, process defects during temporary crimping can be prevented, and the fluidity of the adhesive layer can be appropriately adjusted to prevent electrical shorting due to the flow of conductive particles. it can. The content of the reactive monomer is more preferably 30 to 45% by mass.

本発明の絶縁性接着層の反応性モノマーは、絶縁性接着層の総質量を基準として、好ましくは２０ないし４０質量％で、より好ましくは２５ないし３５質量％である。   The reactive monomer of the insulating adhesive layer of the present invention is preferably 20 to 40% by mass, more preferably 25 to 35% by mass, based on the total mass of the insulating adhesive layer.

本発明の導電性接着層の反応性モノマーは、絶縁性接着層の反応性モノマーより高い含量で含まれる。   The reactive monomer of the conductive adhesive layer of the present invention is contained in a higher content than the reactive monomer of the insulating adhesive layer.

前記導電性接着層の反応性モノマーの含量は、好ましくは絶縁性接着層の反応性モノマー含量の１倍超過ないし２倍以下であり得る。前記含量比率の範囲内で、仮圧着工程時に導電性接着層の粘着力が絶縁性接着層の粘着力より高くて離型フィルムの除去が容易になるし、導電性接着層の導電粒子の流動性を制御して電気的短絡を防止することができる。   The content of the reactive monomer in the conductive adhesive layer may be more than 1 to 2 times the reactive monomer content of the insulating adhesive layer. Within the range of the content ratio, the adhesive strength of the conductive adhesive layer is higher than the adhesive strength of the insulating adhesive layer during the temporary pressure bonding process, and the release film can be easily removed, and the flow of the conductive particles in the conductive adhesive layer It is possible to prevent electrical short circuit by controlling the characteristics.

前記導電性接着層の反応性モノマーの含量は、より好ましくは絶縁性接着層の反応性モノマー含量の１倍超過ないし１．８倍以下で、最も好ましくは１．１倍ないし１．５倍の範囲である。   The reactive monomer content of the conductive adhesive layer is more preferably more than 1 to 1.8 times, most preferably 1.1 to 1.5 times the reactive monomer content of the insulating adhesive layer. It is a range.

（ｂ−１）（メタ）アクリレートモノマー
（メタ）アクリレートモノマーは特に限定されないが、６−ヘキサンジオールモノ（メタ）アクリレート、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、２−ヒドロキシブチル（メタ）アクリレート、２−ヒドロキシ−３−フェニルオキシプロピル（メタ）アクリレート、１，４−ブタンジオール（メタ）アクリレート、２−ヒドロキシアルキル（メタ）アクリロイルホスフェート、４−ヒドロキシシクロヘキシル（メタ）アクリレート、ネオペンチルグリコールモノ（メタ）アクリレート、トリメチロールエタンジ（メタ）アクリレート、トリメチロールプロパンジ（メタ）アクリレート、ペンタエリスリトールトリ（メタ）アクリレート、ジペンタエリスリトールペンタ（メタ）アクリレート、ペンタエリスリトールヘキサ（メタ）アクリレート、ジペンタエリスリトールヘキサ（メタ）アクリレート、グリセリンジ（メタ）アクリレート、ｔ−ヒドロフルフリル（メタ）アクリレート、イソデシル（メタ）アクリレート、２−（２−エトキシエトキシ）エチル（メタ）アクリレート、ステアリル（メタ）アクリレート、ラウリル（メタ）アクリレート、２−フェノキシエチル（メタ）アクリレート、イソボルニル（メタ）アクリレート、トリデシル（メタ）アクリレート、エトキシ化ノニルフェノール（メタ）アクリレート、エチレングリコールジ（メタ）アクリレート、ジエチレングリコールジ（メタ）アクリレート、トリエチレングリコールジ（メタ）アクリレート、ｔ−エチレングリコールジ（メタ）アクリレート、ポリエチレングリコールジ（メタ）アクリレート、１，３−ブチレングリコールジ（メタ）アクリレート、トリプロピレングリコールジ（メタ）アクリレート、エトキシ化ビスフェノール−Ａジ（メタ）アクリレート、シクロヘキサンジメタノールジ（メタ）アクリレート、フェノキシ−ｔ−グリコール（メタ）アクリレート、２−メタクリロイルオキシエチルホスフェート、ジメチロールトリシクロデカンジ（メタ）アクリレート、トリメチロールプロパンベンゾエートアクリレート、アシッドホスホキシエチル（メタ）アクリレート、２−アクリロイルオキシエチルフタレート、トリメチロールプロパントリアクリレート、テトラメチロールメタンテトラアクリレート、２−ヒドロキシ−１，３−ジアクリロキシプロパン、２，２−ビス［４−（アクリロキシポリメトキシ）フェニル］プロパン、２，２−ビス［４−アクリロキシポリエトキシ）フェニル］プロパン、ジシクロペンテニルアクリレート、トリシクロデカニルアクリレート、トリス（アクリロイルオキシエチル）イソシアヌレート、イソシアヌル酸エチレンオキサイド変性ジアクリレート、ウレタンアクリレート、及びこれらの組合せからなる群より選ばれる１種以上であることができる。 (B-1) (Meth) acrylate monomer The (meth) acrylate monomer is not particularly limited, but 6-hexanediol mono (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2 -Hydroxybutyl (meth) acrylate, 2-hydroxy-3-phenyloxypropyl (meth) acrylate, 1,4-butanediol (meth) acrylate, 2-hydroxyalkyl (meth) acryloyl phosphate, 4-hydroxycyclohexyl (meth) Acrylate, neopentyl glycol mono (meth) acrylate, trimethylolethane di (meth) acrylate, trimethylolpropane di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipen Taerythritol penta (meth) acrylate, pentaerythritol hexa (meth) acrylate, dipentaerythritol hexa (meth) acrylate, glycerin di (meth) acrylate, t-hydrofurfuryl (meth) acrylate, isodecyl (meth) acrylate, 2- (2-ethoxyethoxy) ethyl (meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, isobornyl (meth) acrylate, tridecyl (meth) acrylate, ethoxylated nonylphenol (meth) ) Acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, t-ethylene Glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, 1,3-butylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, ethoxylated bisphenol-A di (meth) acrylate, cyclohexanedimethanol Di (meth) acrylate, phenoxy-t-glycol (meth) acrylate, 2-methacryloyloxyethyl phosphate, dimethylol tricyclodecane di (meth) acrylate, trimethylolpropane benzoate acrylate, acid phosphoxyethyl (meth) acrylate, 2 -Acryloyloxyethyl phthalate, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, 2-hydroxy-1,3- Acryloxypropane, 2,2-bis [4- (acryloxypolymethoxy) phenyl] propane, 2,2-bis [4-acryloxypolyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, It may be at least one selected from the group consisting of tris (acryloyloxyethyl) isocyanurate, isocyanuric acid ethylene oxide-modified diacrylate, urethane acrylate, and combinations thereof.

本発明で使用される反応性モノマーは、好ましくは（メタ）アクリレートモノマーであり得るし、より好ましくはホスフェーと基を有するアクリレート、水酸基を有するアクリレート、エポキシ基を有するアクリレート、トリ（メタ）アクリレート、及びイソシアヌレートからなる群より選ばれる１種以上であり、さらに好ましくは、２−メタクリロイルオキシエチルホスフェート、ペンタエリスリトールトリ（メタ）アクリレート、及び２−ヒドロキシエチル（メタ）アクリレートからなる群より選ばれる１種以上である。最も好ましくは、２−ヒドロキシエチル（メタ）アクリレートである。   The reactive monomer used in the present invention may preferably be a (meth) acrylate monomer, more preferably an acrylate having a phosphate and a group, an acrylate having a hydroxyl group, an acrylate having an epoxy group, a tri (meth) acrylate, And one or more selected from the group consisting of isocyanurates, more preferably 1 selected from the group consisting of 2-methacryloyloxyethyl phosphate, pentaerythritol tri (meth) acrylate, and 2-hydroxyethyl (meth) acrylate. More than a seed. Most preferred is 2-hydroxyethyl (meth) acrylate.

本発明の導電性接着層で使用される反応性モノマー中、２−メタクリロイルオキシエチルホスフェートの含量は特に限定されないが、好ましくは導電性接着層の総質量を基準として０ないし５質量％である。   In the reactive monomer used in the conductive adhesive layer of the present invention, the content of 2-methacryloyloxyethyl phosphate is not particularly limited, but is preferably 0 to 5% by mass based on the total mass of the conductive adhesive layer.

本発明の導電性接着層で使用される反応性モノマー中、ペンタエリスリトールトリ（メタ）アクリレートの含量は特に限定されないが、好ましくは導電性接着層の総質量を基準として０ないし２０質量％である。   The content of pentaerythritol tri (meth) acrylate in the reactive monomer used in the conductive adhesive layer of the present invention is not particularly limited, but is preferably 0 to 20% by mass based on the total mass of the conductive adhesive layer. .

本発明の導電性接着層で使用される反応性モノマー中、２−ヒドロキシエチル（メタ）アクリレートの含量は特に限定されないが、好ましくは導電性接着層の総質量を基準として０ないし２０質量％である。   The content of 2-hydroxyethyl (meth) acrylate in the reactive monomer used in the conductive adhesive layer of the present invention is not particularly limited, but is preferably 0 to 20% by mass based on the total mass of the conductive adhesive layer. is there.

本発明の絶縁性接着層で使用される反応性モノマー中、２−メタクリロイルオキシエチルホスフェートの含量は特に限定されないが、好ましくは絶縁性接着層の総質量を基準として０ないし５質量％である。   In the reactive monomer used in the insulating adhesive layer of the present invention, the content of 2-methacryloyloxyethyl phosphate is not particularly limited, but is preferably 0 to 5% by mass based on the total mass of the insulating adhesive layer.

本発明の絶縁性接着層で使用される反応性モノマー中、ペンタエリスリトールトリ（メタ）アクリレートの含量は特に限定されないが、好ましくは絶縁性接着層の総質量を基準として０ないし１５質量％である。   In the reactive monomer used in the insulating adhesive layer of the present invention, the content of pentaerythritol tri (meth) acrylate is not particularly limited, but is preferably 0 to 15% by mass based on the total mass of the insulating adhesive layer. .

本発明の絶縁性接着層で使用される反応性モノマー中、２−ヒドロキシエチル（メタ）アクリレートの含量は特に限定されないが、好ましくは絶縁性接着層の総質量を基準として０ないし１５質量％である。   The content of 2-hydroxyethyl (meth) acrylate in the reactive monomer used in the insulating adhesive layer of the present invention is not particularly limited, but is preferably 0 to 15% by mass based on the total mass of the insulating adhesive layer. is there.

（ｃ）ラジカル開始剤
本発明で使用されるラジカル開始剤として、光重合型開始剤又は熱硬化型開始剤の中で、１種以上を組み合わせて使用することができる。好ましくは、熱硬化型開始剤を使用することができる。 (C) Radical initiator As the radical initiator used in the present invention, one or more kinds of photopolymerization initiators or thermosetting initiators can be used in combination. Preferably, a thermosetting initiator can be used.

本発明で使用されるラジカル開始剤の含量は特に限定されないが、好ましくはフィルムの総質量を基準として、０．５ないし１０質量％である。   The content of the radical initiator used in the present invention is not particularly limited, but is preferably 0.5 to 10% by mass based on the total mass of the film.

（ｃ−１）光重合型開始剤
光重合型開始剤として、ベンゾフェノン、ｏ−ベンゾイル安息香酸メチル、４−ベンゾイル−４−メチルジフェニル硫化物、イソプロピルチオクサントン、ジエチルチオクサントン、４−ジエチル安息香酸エチル、ベンゾインエーテル、ベンゾイルプロピルエーテル、２−ヒドロキシ−２−メチル−１−フェニルプロパン−１−オン、ジエトキシアセトフェノンなどが使用できるが、これらに限定されることではない。 (C-1) Photopolymerization initiator As the photopolymerization initiator, benzophenone, methyl o-benzoylbenzoate, 4-benzoyl-4-methyldiphenyl sulfide, isopropylthioxanthone, diethylthioxanthone, 4-diethyl Ethyl benzoate, benzoin ether, benzoylpropyl ether, 2-hydroxy-2-methyl-1-phenylpropan-1-one, diethoxyacetophenone, and the like can be used, but are not limited thereto.

（ｃ−２）熱硬化型開始剤
熱硬化型開始剤として、パーオキサイド系とアゾ系を使用することができるが、これらに限定されることではない。 (C-2) Thermosetting initiator Although a peroxide type and an azo type can be used as a thermosetting initiator, it is not limited to these.

パーオキサイド系として、ベンゾイルパーオキサイド、ラウリルパーオキサイド、ｔ−ブチルパーオキシラウレート、１，１，３，３−テトラメチルブチルパーオキシ−２−エチルヘキサノエート、キュメンハイドロパーオキサイドなどが使用できるが、これらに限定されることではない。   As the peroxide system, benzoyl peroxide, lauryl peroxide, t-butyl peroxylaurate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, cumene hydroperoxide, etc. can be used. However, it is not limited to these.

アゾ系開始剤として、２，２’−アゾビス（４−メトキシ−２，４−ジメチルバレロニトリル）、ジメチル２，２’−アゾビス（２−メチルプロピオネート）、２，２’−アゾビス（Ｎ−シクロヘキシル−２−メチルプロピオネート）などが使用できるが、これらに限定されることではない。   As azo initiators, 2,2′-azobis (4-methoxy-2,4-dimethylvaleronitrile), dimethyl 2,2′-azobis (2-methylpropionate), 2,2′-azobis (N -Cyclohexyl-2-methylpropionate) and the like can be used, but is not limited thereto.

（ｄ）導電粒子
本発明の導電性接着層に使用できる導電粒子として、金、銀、ニッケル、銅、錫、ハンダなどを含む金属粒子；炭素；ベンゾグアニン、ポリメタクリル酸メチル（ＰＭＭＡ；Ｐｏｌｙｍｅｔｈｙｌｍｅｔｈａｃｒｙｌａｔｅ）、アクリルコポリマー、ポリスチレンなどを含む樹脂、及びその変性樹脂を粒子にして、金、銀、ニッケル、銅、錫、ハンダなどを含む金属でコーティングされたもの；及び、その上に絶縁粒子又は絶縁膜を加えてコーティングし絶縁化処理した導電粒子などを使用することができるが、これらに限定されることではない。 (D) Conductive Particles As conductive particles that can be used in the conductive adhesive layer of the present invention, metal particles containing gold, silver, nickel, copper, tin, solder, etc .; carbon; benzoguanine, polymethylmethacrylate (PMMA) , A resin containing acrylic copolymer, polystyrene, etc., and its modified resin as particles and coated with a metal containing gold, silver, nickel, copper, tin, solder, etc .; and insulating particles or insulating film thereon However, the present invention is not limited to these.

導電粒子の適切な含量は、当該異方性導電フィルムの用途により非常に多様であるが、導電性接着層の総質量を基準として、好ましくは０．５ないし２０質量％である。前記範囲内で適当に導通が行われるし、電気的短絡の発生を防止することができる。より好ましくは１ないし１０質量％である。   The appropriate content of the conductive particles varies greatly depending on the use of the anisotropic conductive film, but is preferably 0.5 to 20% by mass based on the total mass of the conductive adhesive layer. Conduction is appropriately performed within the above range, and an electrical short circuit can be prevented. More preferably, it is 1 to 10% by mass.

導電粒子の大きさ（平均粒径）は特に限定されないが、好ましくは０．１ないし１０μｍである。前記範囲内で適当な接着力と接続信頼性を得ることができる。より好ましくは、１ないし５μｍである。   The size (average particle diameter) of the conductive particles is not particularly limited, but is preferably 0.1 to 10 μm. An appropriate adhesive force and connection reliability can be obtained within the above range. More preferably, it is 1 to 5 μm.

（ｅ）接着層の厚さ
（ｅ−１）導電性接着層の厚さ
本発明の導電性接着層の厚さは導電性粒子の大きさに応じて適切な範囲で選択することができ、例えば導電粒子の大きさ（平均粒径）が３μｍである場合、導電性接着層の厚さは、好ましくは４ないし６μｍであり得る。すなわち、導電性接着層の厚さは、一般的に導電粒子の大きさの１．３倍〜２倍程度の範囲が望ましいものである。 (E) Thickness of the adhesive layer (e-1) Thickness of the conductive adhesive layer The thickness of the conductive adhesive layer of the present invention can be selected within an appropriate range depending on the size of the conductive particles, For example, when the size (average particle diameter) of the conductive particles is 3 μm, the thickness of the conductive adhesive layer may be preferably 4 to 6 μm. That is, the thickness of the conductive adhesive layer is generally desirably in the range of about 1.3 to 2 times the size of the conductive particles.

（ｅ−２）絶縁性接着層の厚さ
本発明の絶縁性接着層の厚さは電極間のスペース部の大きさ、及び間隔などにより決定され、好ましくは６ないし２０μｍである。 (E-2) Thickness of Insulating Adhesive Layer The thickness of the insulating adhesive layer of the present invention is determined by the size and spacing of the space between the electrodes, and is preferably 6 to 20 μm.

絶縁性接着層の厚さは導電性接着層の厚さより大きい方が好ましい。   The thickness of the insulating adhesive layer is preferably larger than the thickness of the conductive adhesive layer.

本願明細書で使用されたピール強度は下記の方法により測定されたことを意味する。
導電性接着層のピール強度は多層異方性導電フィルム各々を常温（２５℃）で１時間放置した後、パターン無しのガラスに実測温度２５℃で１ＭＰａ、１秒の仮圧着条件で１．５ｍｍ幅の異方性導電フィルムを仮圧着してＰＥＴ離型フィルムを除去する。その後、接着テープ（Ｎｉｔｔｏ社）を、１．５ｍｍの幅でガラス上に仮圧着した異方性導電フィルムより５ｃｍ長く準備して前記接着テープをガラス上に仮圧着した異方性導電フィルム上に置いてゴムローラを２回移動させ接着テープと異方性導電フィルムをくっつける。 The peel strength used in the present specification means that it was measured by the following method.
The peel strength of the conductive adhesive layer was determined by leaving each multilayer anisotropic conductive film at room temperature (25 ° C.) for 1 hour, and then placing it on an unpatterned glass at a measured temperature of 25 ° C. at 1 MPa for 1 second and a temporary pressure bonding condition of 1.5 mm. The PET release film is removed by temporarily pressing the anisotropic conductive film having a width. Then, an adhesive tape (Nitto) was prepared 5 cm longer than the anisotropic conductive film temporarily bonded onto the glass with a width of 1.5 mm, and the adhesive tape was temporarily bonded onto the glass on the anisotropic conductive film. Then, the rubber roller is moved twice to attach the adhesive tape and the anisotropic conductive film.

前記のような方法で３個の同じ試片を準備し、前記接着テープの中で前記ガラスの外部に露出された部分をＵＴＭ（万能試験機（引張強度試験機ないし剥離強度試験装置））に置いて各々のピール強度を測定した後、その平均値を計算する。   Prepare the same three specimens by the above-mentioned method, and use UTM (universal tester (tensile tester or peel strength tester)) for the exposed part of the adhesive tape outside the glass. After measuring each peel strength, the average value is calculated.

絶縁性接着層のピール強度は導電性接着層のピール強度測定と同様であるが、多層異方性導電フィルムに接着テープをくっつけて離型フィルムを除去した後パターン無しのガラスに、導電性接着層のピール強度測定と同一条件で仮圧着した後、測定する。   The peel strength of the insulating adhesive layer is the same as the peel strength measurement of the conductive adhesive layer, but the adhesive tape is attached to the multilayer anisotropic conductive film and the release film is removed. Measurement is performed after temporary pressure bonding under the same conditions as the peel strength measurement of the layer.

以下、実施例、比較例、及び実験例を記述し、本発明をより詳細に説明する。但し、下記の実施例、比較例、及び実験例は本発明の例示に過ぎなく、本発明の内容がこれらに限定されて理解されるべきではない。   Hereinafter, the present invention will be described in more detail by describing examples, comparative examples, and experimental examples. However, the following examples, comparative examples, and experimental examples are merely illustrative of the present invention, and the contents of the present invention should not be understood as being limited thereto.

［実施例１、２及び比較例１、２］
≪多層構造の異方性導電フィルムの製造≫
実施例１
＜導電性接着層の反応性モノマー含量が絶縁性接着層の反応性モノマー含量より高い異方性導電フィルムの製造＞
（１）導電性接着層
バインダー樹脂として、ＮＢＲ系樹脂（Ｎ−３４、日本ゼオン）５質量％、ポリウレタンバインダー（ＮＰＣ７００７Ｔ、ＮＡＮＵＸ社）２４質量％、アクリルバインダー（ＡＯＦ−７００３、ＡＥＫＹＵＮＧ化学）２８質量％、及びウレタンアクリレート（ＮＰＣ７００７、ＮＡＮＵＸ社）１２質量％；反応性モノマーとして、２−メタクリロイルオキシエチルホスフェート１質量％、ペンタエリスリトールトリ（メタ）アクリレート１２質量％、及び、２−ヒドロキシエチル（メタ）アクリレート１２質量％；熱硬化型開始剤として、ラウリルパーオキサイド３質量％；及び、導電粒子として、３μｍの大きさ（平均粒径）の導電粒子（Ｓｅｋｉｓｕｉ社）３質量％を使用しこれを混合することにより、４μｍ厚さの導電性接着層を製造した。 [Examples 1 and 2 and Comparative Examples 1 and 2]
≪Manufacture of anisotropic conductive film with multilayer structure≫
Example 1
<Manufacture of an anisotropic conductive film in which the reactive monomer content of the conductive adhesive layer is higher than the reactive monomer content of the insulating adhesive layer>
(1) Conductive adhesive layer As binder resin, NBR resin (N-34, Nippon Zeon) 5 mass%, polyurethane binder (NPC7007T, NANUX) 24 mass%, acrylic binder (AOF-7003, AEKYUNG Chemical) 28 mass% %, And urethane acrylate (NPC7007, NANUX) 12% by mass; as reactive monomers, 1% by mass of 2-methacryloyloxyethyl phosphate, 12% by mass of pentaerythritol tri (meth) acrylate, and 2-hydroxyethyl (meth) Acrylate 12% by mass; 3% by mass of lauryl peroxide as a thermosetting initiator; and 3% by mass of conductive particles (Sekisui) having a size (average particle size) of 3 μm as conductive particles. Of 4 μm thickness It was produced conductive adhesive layer.

（２） 絶縁性接着層
バインダー樹脂として、ＮＢＲ系樹脂（Ｎ−３４、日本ゼオン）５質量％、ポリウレタンバインダー（ＮＰＣ７００７Ｔ、ＮＡＮＵＸ社）２９質量％、アクリルバインダー（ＡＯＦ−７００３、ＡＥＫＹＵＮＧ化学）３０質量％、及び、ウレタンアクリレート（ＮＰＣ７００７、ＮＡＮＵＸ社）１２質量％；反応性モノマーとして、２−メタクリロイルオキシエチルホスフェート１質量％、ペンタエリスリトールトリ（メタ）アクリレート１０質量％、及び、２−ヒドロキシエチル（メタ）アクリレート１０質量％；及び、熱硬化型開始剤として、ラウリルパーオキサイド３質量％を使用しこれらを混合することにより、１０μｍ厚さの絶縁性接着層を製造した。 (2) Insulating adhesive layer As binder resin, NBR resin (N-34, Nippon Zeon) 5 mass%, polyurethane binder (NPC7007T, NANUX) 29 mass%, acrylic binder (AOF-7003, AEKYUNG Chemical) 30 mass% % And urethane acrylate (NPC7007, NANUX) 12% by mass; As reactive monomers, 1% by mass of 2-methacryloyloxyethyl phosphate, 10% by mass of pentaerythritol tri (meth) acrylate, and 2-hydroxyethyl (meta ) 10% by mass of acrylate; and 3% by mass of lauryl peroxide as a thermosetting initiator, and mixing them, an insulating adhesive layer having a thickness of 10 μm was produced.

前記導電性接着層に前記絶縁性接着層を積層して多層構造の異方性導電フィルムを製造した。   The insulating adhesive layer was laminated on the conductive adhesive layer to produce a multi-layered anisotropic conductive film.

実施例２
＜導電性接着層の反応性モノマー含量が絶縁性接着層の反応性モノマー含量より高い異方性導電フィルムの製造＞
（１）導電性接着層
前記実施例１の（１）において、ポリウレタンバインダー（ＮＰＣ７００７Ｔ、ＮＡＮＵＸ社）を２０質量％、アクリルバインダー（ＡＯＦ−７００３、ＡＥＫＹＵＮＧ化学）を２２質量％、ペンタエリスリトールトリ（メタ）アクリレートを１７質量％、２−ヒドロキシエチル（メタ）アクリレートを１７質量％として含量を変えて使用したこと以外は、前記実施例１の（１）と同一方法で製造した。 Example 2
<Manufacture of an anisotropic conductive film in which the reactive monomer content of the conductive adhesive layer is higher than the reactive monomer content of the insulating adhesive layer>
(1) Conductive adhesive layer In (1) of Example 1, 20% by mass of polyurethane binder (NPC7007T, NANUX), 22% by mass of acrylic binder (AOF-7003, AEKYUNG Chemical), pentaerythritol tri (meta) ) It was produced by the same method as (1) of Example 1 except that the acrylate was 17% by mass and 2-hydroxyethyl (meth) acrylate was 17% by mass and the content was changed.

（２）絶縁性接着層
前記実施例１の（２）において、ポリウレタンバインダー（ＮＰＣ７００７Ｔ、ＮＡＮＵＸ社）を２７質量％、アクリルバインダー（ＡＯＦ−７００３、ＡＥＫＹＵＮＧ化学）を２８質量％、ペンタエリスリトールトリ（メタ）アクリレートを１２質量％、２−ヒドロキシエチル（メタ）アクリレートを１２質量％として含量を変えて使用したこと以外は、前記実施例１の（２）と同一方法で製造した。 (2) Insulating adhesive layer In (2) of Example 1, 27% by mass of polyurethane binder (NPC7007T, NANUX), 28% by mass of acrylic binder (AOF-7003, AEKYUNG Chemical), pentaerythritol tri (meta) ) Prepared by the same method as (2) of Example 1 except that acrylate was 12% by mass and 2-hydroxyethyl (meth) acrylate was 12% by mass and the content was changed.

前記導電性接着層に前記絶縁性接着層を積層して多層構造の異方性導電フィルムを製造した。   The insulating adhesive layer was laminated on the conductive adhesive layer to produce a multi-layered anisotropic conductive film.

比較例１
＜絶縁性接着層の反応性モノマー含量が導電性接着層の反応性モノマー含量より高い異方性導電フィルムの製造＞
（１）導電性接着層
前記実施例１の（１）において、アクリルバインダー（ＡＯＦ−７００３、ＡＥＫＹＵＮＧ化学）を４０質量％、ペンタエリスリトールトリ（メタ）アクリレートを６質量％、２−ヒドロキシエチル（メタ）アクリレートを６質量％として含量を変えて使用したこと以外は、前記実施例１の（１）と同一方法で製造した。 Comparative Example 1
<Manufacture of an anisotropic conductive film in which the reactive monomer content of the insulating adhesive layer is higher than the reactive monomer content of the conductive adhesive layer>
(1) Conductive adhesive layer In (1) of Example 1, 40% by mass of acrylic binder (AOF-7003, AEKYUNG Chemical), 6% by mass of pentaerythritol tri (meth) acrylate, 2-hydroxyethyl (meta) ) Manufactured in the same manner as (1) of Example 1 except that acrylate was used at 6% by mass and the content was changed.

（２）絶縁性接着層
前記実施例１の（２）と同一方法で製造した。 (2) Insulating adhesive layer The insulating adhesive layer was produced in the same manner as in Example 1 (2).

前記導電性接着層に前記絶縁性接着層を積層して多層構造の異方性導電フィルムを製造した。   The insulating adhesive layer was laminated on the conductive adhesive layer to produce a multi-layered anisotropic conductive film.

比較例２
＜絶縁性接着層の反応性モノマー含量が導電性接着層の反応性モノマー含量より高い異方性導電フィルムの製造＞
（１）導電性接着層
前記実施例１の（１）において、ポリウレタンバインダー（ＮＰＣ７００７Ｔ、ＮＡＮＵＸ社）を３１質量％、アクリルバインダー（ＡＯＦ−７００３、ＡＥＫＹＵＮＧ化学）を３８質量％、ペンタエリスリトールトリ（メタ）アクリレートを３質量％、２−ヒドロキシエチル（メタ）アクリレートを４質量％として含量を変えて使用したこと以外は、前記実施例１の（１）と同一方法で製造した。 Comparative Example 2
<Manufacture of an anisotropic conductive film in which the reactive monomer content of the insulating adhesive layer is higher than the reactive monomer content of the conductive adhesive layer>
(1) Conductive adhesive layer In (1) of Example 1, 31% by mass of polyurethane binder (NPC7007T, NANUX), 38% by mass of acrylic binder (AOF-7003, AEKYUNG Chemical), pentaerythritol tri (meta) ) Prepared by the same method as (1) of Example 1 except that 3% by mass of acrylate and 4% by mass of 2-hydroxyethyl (meth) acrylate were used.

（２）絶縁性接着層
前記実施例１の（２）において、ポリウレタンバインダー（ＮＰＣ７００７Ｔ、ＮＡＮＵＸ社）を１７質量％、アクリルバインダー（ＡＯＦ−７００３、ＡＥＫＹＵＮＧ化学）を１８質量％、ペンタエリスリトールトリ（メタ）アクリレートを２２質量％、２−ヒドロキシエチル（メタ）アクリレートを２２質量％として含量を変えて使用したこと以外は、前記実施例１の（２）と同一方法で製造した。 (2) Insulating adhesive layer In (2) of Example 1, 17% by mass of polyurethane binder (NPC7007T, NANUX), 18% by mass of acrylic binder (AOF-7003, AEKYUNG Chemical), pentaerythritol tri (meta) ) Prepared by the same method as (2) of Example 1 except that the content was changed to 22% by mass of acrylate and 22% by mass of 2-hydroxyethyl (meth) acrylate.

前記導電性接着層に前記絶縁性接着層を積層して多層構造の異方性導電フィルムを製造した。   The insulating adhesive layer was laminated on the conductive adhesive layer to produce a multi-layered anisotropic conductive film.

下記の表１は、前記実施例１、２及び比較例１、２の反応性モノマー含量を示す。   Table 1 below shows the reactive monomer contents of Examples 1 and 2 and Comparative Examples 1 and 2.

Figure 0006169347
Figure 0006169347

実験例１
＜仮圧着性測定−ピール強度の測定＞
前記実施例１、２及び比較例１、２の多層異方性導電フィルムにおいて、導電性接着層及び絶縁性接着層のピール強度を各々測定した。 Experimental example 1
<Temporary pressure bonding measurement-peel strength measurement>
In the multilayer anisotropic conductive films of Examples 1 and 2 and Comparative Examples 1 and 2, peel strengths of the conductive adhesive layer and the insulating adhesive layer were measured.

導電性接着層のピール強度を測定するために多層異方性導電フィルム各々を常温（２５℃）で１時間放置した後、パターン無しのガラスに実測温度２５℃で１ＭＰａ、１秒の仮圧着条件で１．５ｍｍ幅の異方性導電フィルムを仮圧着しＰＥＴ離型フィルムを除去した。その後、接着テープ（Ｎｉｔｔｏ社）を、１．５ｍｍの幅でガラス上に仮圧着した異方性導電フィルムより５ｃｍ長く準備して、前記接着テープをガラス上に仮圧着した異方性導電フィルム上に置いてゴムローラを２回移動させて接着テープと異方性導電フィルムをくっつけた。   In order to measure the peel strength of the conductive adhesive layer, each multilayer anisotropic conductive film was allowed to stand at room temperature (25 ° C.) for 1 hour, and then applied to glass without a pattern at a measured temperature of 25 ° C. at 1 MPa for 1 second for temporary bonding conditions. Then, an anisotropic conductive film having a width of 1.5 mm was temporarily pressure-bonded to remove the PET release film. Then, an adhesive tape (Nitto) was prepared 5 cm longer than the anisotropic conductive film temporarily bonded onto the glass with a width of 1.5 mm, and the adhesive tape was temporarily bonded onto the glass on the anisotropic conductive film. The rubber roller was moved twice and the adhesive tape and the anisotropic conductive film were attached to each other.

前記のような方法で３個の同じ試片を準備し、前記接着テープの中で前記ガラス外部に露出された部分をＵＴＭ（万能試験機（引張強度試験機ないし剥離強度試験装置））に置いて各々のピール強度を測定した後、その平均値を計算した。   Prepare the same three specimens as described above, and place the exposed part of the adhesive tape outside the glass in a UTM (universal tester (tensile strength tester or peel strength tester)). After measuring the peel strength, the average value was calculated.

絶縁性接着層のピール強度も前記方法と同様に測定したが、多層異方性導電フィルムに接着テープをくっつけて離型フィルムを除去した後パターン無しのガラスに導電性接着層のピール強度測定と同一条件で仮圧着した後測定した。   The peel strength of the insulating adhesive layer was also measured in the same manner as described above, but after peeling the release film by attaching an adhesive tape to the multilayer anisotropic conductive film, measuring the peel strength of the conductive adhesive layer on the glass without pattern The measurement was performed after provisional pressure bonding under the same conditions.

下記の表２は、前記実施例１、２及び比較例１、２の導電性接着層及び絶縁性接着層のピール強度を示す。   Table 2 below shows the peel strengths of the conductive adhesive layers and the insulating adhesive layers of Examples 1 and 2 and Comparative Examples 1 and 2.

Figure 0006169347
Figure 0006169347

実験例２
＜接着力の信頼性の評価＞
前記実施例１、２及び比較例１、２の多層異方性導電フィルムの各々をメタル電極ガラス（Ｍｏ／Ａｌ／Ｍｏ構造、サムスン電子）とＣＯＦ（Ｃｈｉｐ ｏｎ Ｆｉｌｍ）（サムスン電子）を利用して実測温度７０℃で１秒の仮圧着条件と、１８０℃、５秒、４．５ＭＰａの本圧着条件で接続して、前記の各々の試片を１０個ずつ準備して、これら各々の初期接着力を測定して平均値を計算した。 Experimental example 2
<Evaluation of adhesive strength reliability>
Each of the multilayer anisotropic conductive films of Examples 1 and 2 and Comparative Examples 1 and 2 is made of metal electrode glass (Mo / Al / Mo structure, Samsung Electronics) and COF (Chip on Film) (Samsung Electronics). The test specimens were connected to each other at a measured temperature of 70 ° C. for 1 second and a final pressure bonding condition of 180 ° C. for 5 seconds and 4.5 MPa. The adhesive force was measured and the average value was calculated.

前記の各々の１０個ずつの試片を、温度８５℃、相対湿度８５％で５００時間放置して高温・高湿信頼性評価を行った後、これらの各々の信頼性接着力を測定して平均値を計算した。   Each of the 10 specimens was allowed to stand for 500 hours at a temperature of 85 ° C. and a relative humidity of 85%, and then the high temperature / high humidity reliability was evaluated. The average value was calculated.

実験例３
＜接続抵抗の信頼性の評価＞
前記実施例１、２及び比較例１、２の多層異方性導電フィルム各々を常温（２５℃）で１時間放置した後、ＩＴＯ層を１０００Åで被膜した、パターン無しのガラスに４端子測定可能なパターンを形成したＣＯＦ（サムスン電子）を利用して実測温度７０℃で１秒の仮圧着条件と、１８０℃、５秒、４．５ＭＰａの本圧着条件で接続して前記の各々の試片を１０個ずつ準備し、これらの各々を４端子測定方法で初期接続抵抗を測定（ＡＳＴＭ Ｆ４３−６４Ｔの方法に準する）して平均値を計算した。 Experimental example 3
<Evaluation of reliability of connection resistance>
The multi-layer anisotropic conductive films of Examples 1 and 2 and Comparative Examples 1 and 2 are allowed to stand at room temperature (25 ° C.) for 1 hour, and then the ITO layer is coated with 1000 mm, and 4 terminals can be measured on glass without a pattern. Each of the above-mentioned specimens is connected by using a COF (Samsung Electronics) with an appropriate pattern and connected under a temporary pressure bonding condition of 1 second at an actually measured temperature of 70 ° C. and a final pressure bonding condition of 180 ° C., 5 seconds, 4.5 MPa. Each of these was prepared, the initial connection resistance of each of these was measured by a four-terminal measurement method (according to the method of ASTM F43-64T), and the average value was calculated.

前記の各々の１０個ずつの試片を、温度８５℃、相対湿度８５％で５００時間放置して高温・高湿信頼性評価を行った後、これらの各々の信頼性接続抵抗を測定（ＡＳＴＭ Ｄ１１７に準する）して平均値を計算した。   Each of the 10 specimens was allowed to stand for 500 hours at a temperature of 85 ° C. and a relative humidity of 85% and subjected to a high temperature / high humidity reliability evaluation, and then each of the reliability connection resistances was measured (ASTM The average value was calculated according to D117.

実験例４
＜電気的短絡発生の測定＞
前記実施例１、２及び比較例１、２の多層異方性導電フィルムの各々に対する電気的短絡発生は、１００回測定した時短絡による問題発生の比率を測定した。 Experimental Example 4
<Measurement of electrical short-circuit occurrence>
The occurrence of an electrical short circuit for each of the multilayer anisotropic conductive films of Examples 1 and 2 and Comparative Examples 1 and 2 was measured as a ratio of occurrence of problems due to a short circuit when measured 100 times.

前記実施例１、２及び比較例１、２の多層異方性導電フィルムの各々を常温（２５℃）で１時間放置した後、ＩＴＯ層を１，０００Åで被膜した、パターン無しのガラスに２端子測定が可能であるけどパターンが連結されてないＣＯＦ（ＳＴＥＭＣＯ；東レと韓国サムスン電機とのジョイントベンチャー（ＪＶ））を利用して実測温度７０℃で１秒の仮圧着条件と、１８０℃、５秒、４．５ＭＰａの本圧着条件で接続して前記各々の試片を１００個ずつ準備して、これらの各々に５０Ｖの電圧を印加して通電する試片の個数を測定した。   Each of the multilayer anisotropic conductive films of Examples 1 and 2 and Comparative Examples 1 and 2 was allowed to stand at room temperature (25 ° C.) for 1 hour, and then coated with an ITO layer with a thickness of 1,000 mm on an unpatterned glass. Terminal measurement is possible but the pattern is not connected COF (STEMCO; joint venture (JV) between Toray and Samsung Electronics Korea) Temporary crimping conditions of 1 second at an actual measurement temperature of 70 ° C, 180 ° C, 100 pieces of each of the above-mentioned specimens were prepared by connecting under the final pressure bonding conditions of 4.5 MPa for 5 seconds, and the number of specimens to be energized by applying a voltage of 50 V to each of them was measured.

実験例５
＜伸び率の測定＞
前記実施例１、２及び比較例１、２の異方性導電フィルムを１．５ｍｍの幅でスリーティングして３ｃｍの長さで準備した。前記フィルムの２ｃｍを離型フィルムから除去した後ＵＴＭ（万能試験機（引張強度試験機ないし剥離強度試験装置））に置いて他方の片側（離型フィルムが除去されてない部分）をＵＴＭ（万能試験機（引張強度試験機ないし剥離強度試験装置））の反対側に置いた後、５Ｎのロードセルを使用して５０ｍｍ／分の速度で引張り、切れるまでの伸び率を測定した。 Experimental Example 5
<Measurement of elongation>
The anisotropic conductive films of Examples 1 and 2 and Comparative Examples 1 and 2 were prepared with a width of 1.5 mm and a length of 3 cm. After removing 2 cm of the film from the release film, it is placed on a UTM (universal tester (tensile strength tester or peel strength tester)) and the other side (the part where the release film is not removed) is UTM (universal) After placing it on the opposite side of the tester (tensile strength tester or peel strength tester), it was pulled at a speed of 50 mm / min using a 5N load cell, and the elongation until breaking was measured.

下記の表３は、前記実験例２ないし５の測定結果を示す。   Table 3 below shows the measurement results of Experimental Examples 2 to 5.

Figure 0006169347
Figure 0006169347

前記表２及び表３で示した通り、本発明の実施例１及び２の異方性導電フィルムの場合、ピール強度が優秀で、仮圧着性が優れているだけでなく接着力及び接続抵抗の信頼性が高く、電気的短絡も発生しないことが確認できた。   As shown in Table 2 and Table 3, in the case of the anisotropic conductive films of Examples 1 and 2 of the present invention, the peel strength is excellent and not only the temporary press bonding property is excellent but also the adhesive strength and the connection resistance. It was confirmed that the reliability was high and no electrical short circuit occurred.

一方、比較例１の場合、接着力及び接続抵抗の信頼性が高く電気的短絡も発生しなかったが、ピール強度が低く仮圧着性能が劣っていて工程不良をもたらす問題があることが確認できた。比較例２の場合にはピール強度が低くて仮圧着性能が劣っているだけでなく電気的短絡も誘発することが確認できた。   On the other hand, in the case of Comparative Example 1, the reliability of the adhesive force and the connection resistance was high and no electrical short circuit occurred, but it was confirmed that there was a problem that the peel strength was low and the temporary press bonding performance was inferior, resulting in a process failure. It was. In the case of Comparative Example 2, it was confirmed that not only the peel strength was low and the temporary press bonding performance was inferior, but also an electrical short circuit was induced.

従って、多層構造の異方性導電フィルムにおいて、ｉ）導電性接着層と絶縁性接着層の反応性モノマーの含量が物性を決定する重要な要因の一つであること、ｉｉ）導電性接着層の反応性モノマー含量が絶縁性接着層の反応性モノマー含量より高い時に異方性導電フィルムが最も優れた物性を有することが確認された。   Accordingly, in the anisotropic conductive film having a multilayer structure, i) the content of the reactive monomer in the conductive adhesive layer and the insulating adhesive layer is one of the important factors determining physical properties, ii) the conductive adhesive layer It was confirmed that the anisotropic conductive film has the most excellent physical properties when the reactive monomer content is higher than the reactive monomer content of the insulating adhesive layer.

Claims (7)

反応性モノマー及びラジカル開始剤を含む導電性接着層、及び
反応性モノマー及びラジカル開始剤を含む絶縁性接着層が積層され、
前記導電性接着層のピール強度が前記絶縁性接着層のピール強度より高く、
２５℃、１ＭＰａ、１秒の条件で前記導電性接着層のピール強度が３ないし１０ｇｆ／ｍｍであり、
前記条件で前記絶縁性接着層のピール強度が２ないし７ｇｆ／ｍｍであり、
前記導電性接着層の総重量を基準とする前記導電性接着層の反応性モノマー含量が前記絶縁性接着層の総重量を基準とする前記絶縁性接着層の反応性モノマー含量より高い、異方性導電フィルム。 Conductive adhesive layer comprising a reactivity monomer及beauty La radical initiator, and
Insulating adhesive layer comprising a reactivity monomer及beauty La radical initiator is laminated,
The peel strength of the conductive adhesive layer is rather high than the peel strength of the insulating adhesive layer,
The peel strength of the conductive adhesive layer is 3 to 10 gf / mm at 25 ° C., 1 MPa, and 1 second.
Under the above conditions, the peel strength of the insulating adhesive layer is 2 to 7 gf / mm,
The reactive monomer content of the conductive adhesive layer based on the total weight of the conductive adhesive layer is higher than the reactive monomer content of the insulating adhesive layer based on the total weight of the insulating adhesive layer. Conductive film. 前記導電性接着層の総重量を基準として、前記導電性接着層の反応性モノマー含量が２５ないし５０質量％で、前記絶縁性接着層の総重量を基準として前記絶縁性接着層の反応性モノマー含量が２０ないし４０質量％である、請求項１に記載の異方性導電フィルム。 Based on the total weight of the conductive adhesive layer, to reactivity monomer content of the conductive adhesive layer is 25 to 50 mass%, reactivity monomer of the insulating adhesive layer on the total weight of the insulating adhesive layer as a reference The anisotropic conductive film according to claim 1, wherein the content is 20 to 40% by mass. 前記導電性接着層の総重量を基準とする前記導電性接着層の反応性モノマー含量が、前記絶縁性接着層の総重量を基準とする前記絶縁性接着層の反応性モノマー含量の１倍超過ないし２倍以下である、請求項１または２に記載の異方性導電フィルム。 Reactivity monomer content of the conductive adhesive layer relative to the total weight of the conductive adhesive layer, 1-fold excess of reactivity monomer content of the insulating adhesive layer relative to the total weight of the insulating adhesive layer The anisotropic conductive film of Claim 1 or 2 which is thru | or 2 times or less. 前記導電性接着層、前記絶縁性接着層、又は前記導電性接着層及び前記絶縁性接着層の反応性モノマーがそれぞれ独立的に、２−メタクリロイルオキシエチルホスフェート、ペンタエリスリトールトリ（メタ）アクリレート、及び２−ヒドロキシエチル（メタ）アクリレートからなる群より選ばれる１種以上である、請求項１ないし３の何れか一つに記載の異方性導電フィルム。 The conductive adhesive layer, wherein the insulating adhesive layer, or the reactive monomer of the conductive adhesive layer and the insulating adhesive layer is each independently, 2-methacryloyloxyethyl phosphate, pentaerythritol tri (meth) acrylate and, The anisotropic conductive film as described in any one of Claim 1 thru | or 3 which is 1 or more types chosen from the group which consists of 2-hydroxyethyl (meth) acrylate. 異方性導電フィルムの総重量を基準として、
前記導電性接着層の反応性モノマーの含量と前記絶縁性接着層の反応性モノマーの含量との合計は２０ないし４５質量％であり、
バインダー樹脂５５ないし８０質量％を含む請求項１ないし４の何れか一つに記載の異方性導電フィルム。 Based on the total weight of the anisotropic conductive film,
The total of the reactive monomer content of the conductive adhesive layer and the reactive monomer content of the insulating adhesive layer is 20 to 45% by mass;
The anisotropic conductive film according to any one of claims 1 to 4, comprising 55 to 80% by mass of a binder resin. 異方性導電フィルムの総重量を基準として、
熱可塑性樹脂４５ないし７５質量％、及び
導電粒子１ないし１０質量％を含み、
伸び率が４００ないし８００％である、請求項１ないし５の何れか一つに記載の異方性導電フィルム。 Based on the total weight of the anisotropic conductive film,
Including 45 to 75% by weight of thermoplastic resin and 1 to 10% by weight of conductive particles,
The anisotropic conductive film according to any one of claims 1 to 5, which has an elongation of 400 to 800%. 配線基板；
前記配線基板のチップ搭載面に接着されている異方性導電フィルム；及び、
前記フィルム上に搭載された半導体チップを含む半導体装置において、
前記異方性導電フィルムは、請求項１〜６の何れか一つに記載のフィルムである、半導体装置。 Wiring board;
An anisotropic conductive film adhered to a chip mounting surface of the wiring board; and
In a semiconductor device including a semiconductor chip mounted on the film,
The said anisotropic conductive film is a semiconductor device which is a film as described in any one of Claims 1-6 .
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Families Citing this family (9)

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Publication number Priority date Publication date Assignee Title
KR101479658B1 (en) * 2011-11-18 2015-01-06 제일모직 주식회사 Anisotropic conductive film with easy pre-bonding process
US10209016B2 (en) * 2013-03-22 2019-02-19 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same
TWI496870B (en) * 2013-09-10 2015-08-21 Benq Materials Corp Anisotropic conductive adhesive for conduction between electrical elements
JP6204187B2 (en) * 2013-12-27 2017-09-27 リンテック株式会社 Conductive adhesive composition, conductive adhesive sheet, and method for producing conductive adhesive sheet
JP6026446B2 (en) 2014-01-10 2016-11-16 古河電気工業株式会社 Flat insulated wires and coils for motor generators
JP5778332B1 (en) * 2014-12-26 2015-09-16 古河電気工業株式会社 Insulated wires with excellent bending resistance, coils and electronic / electric equipment using them
JP5778331B1 (en) * 2014-12-26 2015-09-16 古河電気工業株式会社 Insulated wires and coils
JPWO2022102573A1 (en) * 2020-11-10 2022-05-19
KR20240118833A (en) * 2021-12-10 2024-08-05 가부시끼가이샤 레조낙 Adhesive film for circuit connection, circuit connection structure, and method of manufacturing the same

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06139824A (en) * 1992-10-27 1994-05-20 Oki Electric Ind Co Ltd Anisotropic conducting film
US6444305B2 (en) * 1997-08-29 2002-09-03 3M Innovative Properties Company Contact printable adhesive composition and methods of making thereof
JP3325000B2 (en) * 1999-05-28 2002-09-17 ソニーケミカル株式会社 Semiconductor element mounting method
CA2596134C (en) * 2005-01-28 2015-07-21 Mmr Marketing & Management Ag Rotkreuz Extruder system for extruding a fluid
CN1955765B (en) * 2005-08-02 2010-06-16 富士胶片株式会社 Optical film, particularly antireflection film and method of manufacturing the same, and polarizer and liquid crystal display device
KR100673778B1 (en) * 2005-08-19 2007-01-24 제일모직주식회사 Fast curable anisotropic conductive film composition, anisotropic conductive film using the composition and method for fabricating the same
KR100722493B1 (en) * 2005-09-02 2007-05-28 제일모직주식회사 Insulated Conductive Particles and an Anisotropic Conductive Adhesive Film Using the Same
KR100673773B1 (en) * 2005-10-18 2007-01-24 제일모직주식회사 Anisotropic conductive film composition using fluoren-based (meth)acrylate
KR100713333B1 (en) 2006-01-04 2007-05-04 엘에스전선 주식회사 Multi-layered anisotropic conductive film
JP2007217503A (en) 2006-02-15 2007-08-30 Asahi Kasei Electronics Co Ltd Anisotropically electroconductive adhesive film
JP4809701B2 (en) 2006-03-22 2011-11-09 古河電気工業株式会社 Anisotropic conductive film and manufacturing method thereof
KR100787727B1 (en) * 2006-10-31 2007-12-24 제일모직주식회사 Anisotropic conductive film composition using styrene-acrylonitrile copolymer for high reliability
JP5226562B2 (en) * 2008-03-27 2013-07-03 デクセリアルズ株式会社 Anisotropic conductive film, joined body and method for producing the same
CN102090154B (en) * 2008-07-11 2014-11-05 迪睿合电子材料有限公司 Anisotropic conductive film
KR20100010694A (en) 2008-07-23 2010-02-02 주식회사 효성 Triple layered anistropic conductive film and manufacturing method thereof
JP5833809B2 (en) * 2010-02-01 2015-12-16 デクセリアルズ株式会社 Anisotropic conductive film, joined body and connection method
US10141084B2 (en) * 2010-10-08 2018-11-27 Cheil Industries, Inc. Electronic device
KR101332441B1 (en) * 2010-12-31 2013-11-25 제일모직주식회사 Anisotropic conductive film
CN103155050B (en) * 2010-10-08 2017-05-03 第一毛织株式会社 Anisotropic conducting film
KR101279980B1 (en) * 2010-12-29 2013-07-05 제일모직주식회사 Anisotropic conductive film composition and the anisotropic conductive film thereof
US9281097B2 (en) * 2010-12-29 2016-03-08 Cheil Industries, Inc. Anisotropic conductive film, composition for the same, and apparatus including the same
ES2428290T3 (en) * 2011-03-22 2013-11-06 Henkel Ag & Co. Kgaa Multi-step anticorrosive treatment for metal components, which at least partially have zinc or zinc alloy surfaces
KR101479658B1 (en) * 2011-11-18 2015-01-06 제일모직 주식회사 Anisotropic conductive film with easy pre-bonding process
KR101355855B1 (en) * 2011-12-19 2014-01-29 제일모직주식회사 Anisotropic conductive film

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