JP6145111B2 - Method for investigating the cause of mounting position shift - Google Patents

Description

The present invention relates to how to determine the cause of the mounting position deviation of the electronic circuit components on the circuit substrate.

  In the mounting line described in Patent Document 1 below, after mounting an electronic circuit component on a circuit board in the electronic circuit component mounting device, the mounting state is inspected by an inspection device, and if a mounting failure is detected, Cause identification is performed. In the electronic circuit component mounting apparatus, the program for mounting the electronic circuit component on the circuit board is changed so that the circuit board is imaged by the imaging device before and after mounting, and the imaging data is compared with the master data. The cause of the failure is identified. For example, the presence of foreign matter on the circuit board, the interference between the electronic circuit component held by the suction nozzle or the suction nozzle after mounting the electronic circuit component, and the electronic circuit component already mounted on the circuit board, circuit board transport The cause of failure is vibration or impact applied at the time of positioning or positioning, and the specified cause of failure is displayed on the monitor.

JP 2008-103411 A

The present invention has been completed with the above view in mind, it is an object to provide a more practical excellent in mounting position deviated cause investigation how.

In order to solve the above problems , the method for investigating the cause of the mounting position deviation of the present invention is:
A method for investigating the cause of displacement of the mounting position of an electronic circuit component on a circuit substrate,
It is determined whether or not there is at least one cause of a shift in lateral movement, which is a shift of an electronic circuit component with respect to a suction surface of the suction nozzle when performing a lateral movement that is a movement perpendicular to the axial direction of the suction nozzle. A first determination step;
A second determination step of determining whether or not a cause is a shift in rotation, which is a shift of an electronic circuit component relative to a suction surface of the suction nozzle during rotation around the axis of the suction nozzle;
A third determination step for determining whether or not the relative position of the lowering stop of the suction nozzle with respect to the upper surface height position of the circuit base material is inappropriate is at least one of causes of inappropriate lowering stop position;
Including at least one of
The first determination step includes
Before the lateral movement in which the suction nozzle that has picked up the electronic circuit component is captured by an imaging device in a direction from the direction toward the suction surface of the suction nozzle parallel to the axial direction of the suction nozzle before the lateral movement starts. A state acquisition process;
The first setting movement in which the suction nozzle starts the lateral movement at a predetermined first set acceleration, stops the lateral movement at a predetermined first set deceleration after reaching the predetermined set speed. After the lateral movement in the pattern, the lateral movement state acquisition step of acquiring and acquiring the image by the imaging device from the direction toward the suction surface of the suction nozzle parallel to the axial direction of the suction nozzle;
Based on both imaging results obtained by performing the pre-lateral movement state acquisition step and the post-lateral movement state acquisition step, the lateral displacement amount of the electronic circuit component before and after the horizontal movement according to the first set movement pattern is acquired. If the acquired lateral deviation amount is larger than a predetermined reference lateral deviation amount, the lateral movement pre- and post-movement state dependency determining step for determining that the lateral deviation occurring during the lateral movement is at least one of the causes of the mounting position deviation;
Including
The state acquisition step after the lateral movement is a state acquisition step before the lateral movement of the suction nozzle in a second set movement pattern in which it is ensured that no lateral deviation occurs in the suction nozzle after the lateral movement according to the first set movement pattern. This is a step of acquiring the post-lateral movement state based on the imaging result of the post-return imaging in which the imaging is performed by the same imaging device.
For example, (a) a printed wiring board on which an electronic circuit component is not yet mounted, (b) an electronic circuit component is mounted on one surface and electrically connected to the circuit substrate, and the other surface is A printed circuit board on which no electronic circuit component is mounted, (c) a base material on which a bare chip is mounted and constituting a substrate with a chip, (d) a base material on which an electronic circuit component having a ball grid array is mounted, (e ) Substrates having a three-dimensional shape rather than a flat shape are included.
In the lateral movement, movement in the X-axis direction along a straight line parallel to the X-axis, which is an axis parallel to one of two directions orthogonal to each other, in one plane parallel to the mounting surface of the circuit substrate, parallel to the other At least one of movement in the Y-axis direction along a straight line parallel to the Y-axis, which is the axis, and movement in a direction including components in both the X- and Y-axis directions is included. The movement in the direction including the components in both the X and Y axes includes at least one of movement along a straight line and movement along a turning trajectory around one axis.

In connection with the mounting position shift cause investigation method of the present invention described above, (i) a suction nozzle that sucks electronic circuit components at a negative pressure, (ii) a substrate holding device that holds a circuit substrate, and (iii) ) A nozzle moving device that moves the suction nozzle relative to the substrate holding device; and (iv) a negative pressure control device that controls supply / stop of negative pressure to the suction nozzle. The electronic circuit component mounting device to be mounted is (A) (a) Inadequate linear lateral movement condition, which is a movement along a straight line perpendicular to the axial direction of the suction nozzle, and (b) along the circumference of the suction nozzle. Inadequate swirling conditions, (c) Inappropriate rotation conditions of the suction nozzle around its own axis, and (d) Inappropriate relative position of the suction nozzle descending stop relative to the upper surface height position of the circuit board Mounting that acquires at least one of the above as a cause of mounting position deviation of the electronic circuit component with respect to the circuit substrate A misplacement cause acquisition device, (B) (a) a notification device for notifying the at least one cause acquired by the mounting position shift cause acquisition device in a form that can be recognized by a person, and (b) the mounting position shift the acquired by reason acquisition apparatus at least one of the causes may be assumed to include at least one of inappropriate conditions reducing device for reducing in automatically.
The inappropriate condition reducing device can eliminate the inappropriate condition at once, or can reduce it gradually while observing the reduced state of the mounting position deviation.

According to the method of the present invention, it is possible to determine that the cause of the mounting position deviation includes at least one of a lateral displacement of the suction nozzle, a rotational deviation, and an inappropriate lowering stop position. The cause of misalignment can be reduced, and the occurrence of defective electronic circuit boards can be reduced. The cause investigation by the method according to the present invention may be performed with respect to the mounting position shift that occurs during the production of the actual electronic circuit by mounting the electronic circuit component on the circuit base material. , Setting of speed pattern including moving speed and acceleration / deceleration, rotation condition, for example, setting of rotation pattern including angular velocity, angular acceleration and deceleration, setting of descent stop position of suction nozzle, or set condition and position May be performed for the inspection.
According to the electronic circuit component mounting apparatus described above, the cause of the mounting position deviation can be acquired, and the cause of the mounting position deviation can be reduced by notifying the cause, for example, or an inappropriate condition can be obtained. It is possible to automatically reduce the cause of the mounting position shift by operating the reduction device.

1 is a front view schematically showing an electronic circuit component mounting system including an electronic circuit component mounting device according to an embodiment of the present invention. It is a top view which shows the said electronic circuit component mounting apparatus schematically. It is a rear view (partial cross section) which shows the mounting head and mounting head movement apparatus of the said electronic circuit component mounting apparatus. It is a block diagram which shows roughly the control apparatus of the said electronic circuit component mounting apparatus. It is a flowchart which shows the mounting routine memorize | stored in ROM of the mounting control computer which comprises the main body of the said control apparatus. It is a flowchart which shows the cause investigation routine memorize | stored in ROM of the said mounting control computer. It is a flowchart which shows the test | inspection routine memorize | stored in ROM of the test | inspection control computer which comprises the main body of the control apparatus of the mounting | wearing test | inspection apparatus of the said electronic circuit component mounting system. It is a figure explaining the statistical process of the mounting position shift acquired in the said inspection routine. It is a figure explaining the linear displacement | movement deviation at the time of conveyance of the electronic circuit component by an adsorption | suction nozzle in the said electronic circuit component mounting apparatus. It is a figure explaining the cause investigation of the above-mentioned linear lateral displacement. It is a figure explaining the mounting position shift by improper of the descent | fall stop position of a suction nozzle in the said electronic circuit component mounting apparatus. It is a figure explaining the mounting position shift by the curvature of a circuit board in the said electronic circuit component mounting apparatus.

  Embodiments of the present invention will be described below with reference to the drawings. In addition, the present invention can be implemented in a mode in which various modifications are made based on the knowledge of those skilled in the art, in addition to the following embodiments. Further, “electronic circuit component” is abbreviated as “component”.

  FIG. 1 shows a component mounting system including a component mounting apparatus according to an embodiment of the present invention. The system includes a component mounting apparatus 10 and a mounting inspection apparatus 12, and a mounting position shift cause investigation method according to an embodiment of the present invention is performed.

  The component mounting apparatus 10 is configured in the same manner as the component mounting apparatus described in Japanese Patent Application Laid-Open No. 2009-170536 except for the portion related to the present invention, and will be briefly described. As shown in FIG. 2, the component mounting apparatus 10 is a mounting apparatus body 20, a substrate transport device 22 that is a base material transport device, a substrate holding device 24 that is a base material holding device, a component supply device 26, a mounting head 28, and a nozzle moving device. It includes a mounting head moving device 30, a reference mark imaging system 32, a lower side component imaging system 34 as a suction surface side component imaging system, a side side component imaging device 36, a control device 38, and the like.

  The board conveyance device 22 conveys the circuit board 50 which is a kind of circuit base material in one horizontal direction. In the present embodiment, “circuit board” is a general term for a printed wiring board and a printed circuit board. As shown in FIG. 2, the substrate holding device 24 is provided at an intermediate portion in the conveyance direction of the substrate conveyance device 22, and a support member that supports the circuit board 50 from below and both side edges parallel to the conveyance direction of the circuit board 50. Clamp members for clamping the respective parts are provided, and the circuit board 50 is held in a posture in which the upper surface 52 as a mounting surface on which the component is mounted is horizontal. In the present embodiment, the circuit board 50 is transported by the board transport device 22 in the X-axis direction, and is a plane parallel to the mounting surface of the circuit board 50 held by the board holding device 24, and the X in the horizontal plane. A direction orthogonal to the axial direction is taken as a Y-axis direction. The component supply device 26 includes a plurality of tape feeders 54 which are a kind of component supply feeder as a component supply tool.

  The mounting head moving device 30 includes an X-axis direction moving device 60 and a Y-axis direction moving device 62. The X-axis direction moving device 60 includes an X-axis slide 64 and an X-axis slide moving device 66 as movable members, and moves the mounting head 28 to an arbitrary position in the horizontal plane. The X-axis slide moving device 66 includes an electric motor 68 as a driving source, and a feed screw mechanism 72 including a feed screw 70 and a nut. In this embodiment, the electric motor 68 is constituted by a servo motor with an encoder. The servo motor is an electric rotary motor capable of accurately controlling the rotation angle. A step motor or a linear motor may be used instead of the servo motor. A ball screw mechanism is suitable as the feed screw mechanism. The same applies to other electric motors and feed screw mechanisms described below. The Y-axis direction moving device 62 is provided on the X-axis slide 64, and includes a Y-axis slide 76 and a Y-axis slide moving device 78 as movable members. Similar to the X-axis slide moving device 66, the Y-axis slide moving device 78 includes an electric motor 80 as a drive source, and a feed screw mechanism 86 (see FIG. 3) having a feed screw 82 and a nut 84.

  As shown in FIG. 3, the Y-axis slide 76 has a rotator 90 as a nozzle holder, which is uniaxial, is held around its own vertical axis and is not movable in the axial direction. Is rotated by an arbitrary angle in both the forward and reverse directions. A plurality of, for example, three or more nozzle holders 98 in the present embodiment are provided in the nozzle holding portion 96 of the rotating body 90 (two nozzle holders 98 are typically shown in FIG. 3). However, they are provided at an appropriate interval, for example, at an equiangular interval on a circumference around the rotation axis of the rotating body 90. Each of these nozzle holders 98 has a circular cross-sectional shape, and the nozzle holder 96 is movable in the vertical direction in a direction parallel to the rotation axis of the rotating body 90 and around its own vertical axis. The suction nozzles 104 are detachably held one by one by a nozzle holder 102 that is rotatably held and is provided at the lower end thereof.

  Each of the plurality of suction nozzles 104 is held at a position eccentric from the rotation axis of the rotator 90 so as to be rotatable about its own vertical axis. Swiveled around the axis of rotation. In the present embodiment, the rotating body 90 and the rotating body driving device 94 constitute a nozzle turning device. The suction nozzle 104 sucks and holds parts by negative pressure, and includes a nozzle body 106 and a suction pipe 108, and passes through a passage (not shown) provided in the rotating body 90, and a negative pressure source (not shown). The negative pressure is supplied from the suction pipe 108, and the component 112 is sucked to the suction surface 110 which is the tip surface of the suction pipe 108. FIG. 3 shows a square chip as an example of the component 112. The suction surface 110 forms a single plane perpendicular to the axis of the suction nozzle 104. Supply and stop of the negative pressure to the suction nozzle 104 are individually performed for each of the plurality of suction nozzles 104 by a negative pressure control device (not shown). The negative pressure control device includes a switching valve device provided for each of the plurality of suction nozzles 104 and a valve switching device for switching the switching valve device provided at a position corresponding to a lift position described later of the Y-axis slide 76. .

  The plurality of nozzle holders 98 are rotated around their own axes by the nozzle rotating device 120. As shown in FIG. 3, the nozzle rotating device 120 is provided on the Y-axis slide 76, and the rotation of the electric motor 122 as a driving source is transmitted to the nozzle holder 98 by gears 124, 126, 128, and 130. The gear 130 is provided in each of the plurality of nozzle holders 98 and meshed with the common gear 128. The plurality of nozzle holders 98 are simultaneously rotated around their own axes, and the plurality of suction nozzles 104 are simultaneously moved to their own axes. The suction nozzle 104 is rotated around the same angle and in the same direction (hereinafter, the rotation of the suction nozzle 104 is referred to as rotation). When the rotating body 90 is rotated, the gear holder 132 that holds the gears 126 and 128 is rotated in the same direction as the rotating body 90 at the same angular velocity so that the nozzle holder 98 does not rotate around its own axis. The

  Each of the plurality of nozzle holders 98 is biased upward by a compression coil spring 134 as an elastic member which is a kind of biasing device disposed between the nozzle holding portion 96 and the gear 130. The upper limit of the nozzle holder 98 due to the bias of the spring 134 is defined by the nozzle holder 102 coming into contact with the nozzle holder 96, and the nozzle holder 98 and the suction nozzle 104 are positioned at the upper end position.

  As shown in FIG. 3, the Y-axis slide 76 has one place on the trajectory of the suction nozzle 104, in this embodiment, the side on which the component supply device 26 is provided in the Y-axis direction. If it is set as the front, the nozzle raising / lowering apparatus 140 is provided in the part corresponding to the raising / lowering position which is the position of the most front side. The nozzle lifting / lowering device 140 includes a lifting / lowering driving member 142 and a lifting / lowering driving member driving device 144. The elevating drive member driving device 144 includes an electric motor 146 and a feed screw mechanism 152 including a feed screw 148 and a nut 150.

  It can be considered that the rotating body 90, the nozzle holder 98, and the suction nozzle 104 constitute the mounting head 28, and the rotating body 90 constitutes the head main body, and the rotating body 90, the nozzle holder 98, the suction nozzle 104, and the nozzle rotation. The device 120, the nozzle turning device, and the nozzle lifting / lowering device 140 constitute the mounting head 28, the Y-axis slide 76 constitutes a part of the head main body, or the head main body is provided integrally with the Y-axis slide 76. You can also think about it.

  The reference mark imaging system 32 is a system for imaging a plurality of reference marks 160 (see FIG. 2) provided on the circuit board 50. The reference mark imaging system 32 includes a mark imaging device 162 and is mounted on a Y-axis slide 76. It is moved together with the head 28.

  A distance sensor 170 is further mounted on the Y-axis slide 76 and is moved by the mounting head moving device 30. The distance sensor 170 is a laser-type distance sensor in this embodiment, and is detected by irradiating a detection target with a laser beam by a laser beam generator, and calculating the condensing position of the reflected light on the semiconductor position detection element. The distance to the object is detected, thereby obtaining the height position of the detection object. The distance sensor may be an ultrasonic type and may include a light emitting unit and an imaging unit.

  As shown in FIG. 2, the lower part imaging system 34 is a position between the substrate transport device 22 and the component supply device 26 of the mounting apparatus main body 20, and the substrate transport device within the movement range of the mounting head 28. The position is fixed at a central position in the conveyance direction of the circuit board 50 by 22. The lower component imaging system 34 includes a lower component imaging device 180 and an illumination device 182 as suction surface side component imaging devices, the imaging center line is provided vertically and upward, and the component 112 is attached to the axis of the suction nozzle 104. An image is taken from below in the vertical direction, which is parallel to the direction. Therefore, the suction nozzle 104 includes a background forming member 184. The lower part imaging device 180 is, for example, a surface imaging device, and includes, for example, a CCD camera and a lens system. The lower part imaging device 180 can capture images of all the components 112 held by the suction nozzles 104 at a time in a state where the suction nozzles 104 are held by all the nozzle holders 98 of the mounting head 28. The size can be.

  As shown in FIG. 3, the side part imaging system 36 is provided at a position corresponding to the ascending / descending position of the swiveling locus of the suction nozzle 104 on the Y-axis slide 76. Moved to position. The side part imaging system 36 includes a side part imaging device 200, an illumination device 202, and a light guide device 204. The side component imaging device 200 is, for example, a surface imaging device, and includes, for example, a CCD camera and a lens system, and is provided in a state where the imaging center line is horizontal and orthogonal to the rotation axis of the rotating body 90. The part 112 held by the nozzle 104 is imaged from a position directly beside the axis of the suction nozzle 104 and parallel to the suction surface 110.

  As shown in FIG. 4, the control device 38 is mainly composed of a mounting control computer 220, and controls drive sources and the like of various devices constituting the component mounting device 10 such as the board transfer device 22 through a driving circuit 222. Then, the display screen 236 is controlled via the control circuit 234. The control circuit 234 and the display screen 236 constitute a display device 238 that is a notification device, and various information and the like are displayed by characters, figures, and the like. As the notification device, it is possible to employ a device that notifies information or the like in various modes such as lighting of a lamp, blinking, sounding of a buzzer, announcement by voice, communication to a portable terminal held by an operator, and the like.

  In the input / output unit of the mounting control computer 220, an encoder 246 (FIG. 4) provided in the distance sensor 170, the image processing computer 244 that processes data obtained by imaging by the imaging devices 162, 180, and 200, the electric motor 68, and the like. 1 is representatively shown), and an input device 248 and the like are connected. The ROM of the mounting control computer 220 stores various programs and data for mounting components on the circuit board 50, routines represented by flowcharts in FIGS. 5 and 6, and the like.

  Although not shown, the mounting inspection device 12 includes a substrate transport device, a substrate holding device, an inspection head, an inspection head moving device, and a control device 270 (see FIG. 1). The inspection head includes, for example, an imaging device and an illumination device. The imaging device is constituted by, for example, a CCD camera as a surface imaging device, and images the component 112 mounted on the circuit board 50 from above in a direction perpendicular to the upper surface 52 and in the vertical direction. The imageable area of the imaging apparatus is smaller than the circuit board 50. The control device 270 is configured mainly by the inspection control computer 272 and controls the substrate transfer device and the like. The input / output unit of the inspection control computer 272 is connected to an image processing computer that processes data obtained by imaging of the imaging device of the inspection head, and the ROM stores an inspection routine and the like shown in the flowchart of FIG. ing. In addition, the inspection control computer 272 is connected to the mounting control computer 220 via a communication cable 274 so that communication is possible.

  In the component mounting apparatus 10 of the component mounting system configured as described above, the mounting routine shown in FIG. 5 is executed, and the component 112 is mounted on the circuit board 50. Here, for simplification, the twelve suction nozzles 104 are of the same type, the types have already been checked and there is no mistake, and the suction surface 110 of the suction nozzle 104 is in a normal state, that is, a flat surface. It has been confirmed that the degree is practically sufficient and is perpendicular to the axis, and there is no error in the suction stop position of the suction nozzle 104 or in the height direction position of the suction surface 110 when the suction nozzle 104 is stopped. It shall be confirmed. The lowering stop position is set based on the height (vertical dimension) of the component 112 and the distance between the suction surface 110 of the suction nozzle 104 and the upper surface 52 of the circuit board 50 when positioned at the rising end position. . Further, the circuit board 50 has a plate shape with a constant thickness, and the substrate holding device 24 in a state where the upper surface 52 is positioned at a preset reference height position in the height direction by the positioning portion of the substrate holding device 24. It shall be held by Further, prior to the start of mounting, the displacement of the component take-out position where the suction nozzle 104 takes out the component 112 from the feeder 54 is corrected, and the suction nozzle 104 is in a state where the center of the suction surface 110 substantially coincides with the center of gravity of the component 112. It shall be made to adsorb | suck. That is, although not necessary to correct the holding position error described below, for example, the suction nozzle is simply moved linearly in a direction perpendicular to the axis of the suction nozzle, but the center of the suction surface 110 and the part 112 It is assumed that the discrepancy that causes the rotational displacement of the component 112 due to the deviation from the center of gravity of the component 112 does not occur between the center of the suction surface 110 and the center of gravity of the component 112.

  First, in step 1 (hereinafter abbreviated as S1. The same applies to other steps), the circuit board 50 is carried into the component mounting apparatus 10 by the board conveying device 22 and stopped at a predetermined position, and then the board is held. The reference mark imaging system 32 is held by the device 24 and moved to image the reference mark 160, and position errors of a plurality of target mounting positions set on the upper surface 52 of the circuit board 50 are calculated. The target mounting position includes the position of the reference point for mounting the component 112 and the rotational position around the reference point. The position error is perpendicular to each position error in the X-axis and Y-axis directions and the upper surface 52. Includes rotational position error about the axis. Next, the component 112 is mounted on the circuit board 50 in S2. The mounting head 28 is moved to the component supply device 26 to take out the component 112 from the feeder 54. The twelve suction nozzles 104 are sequentially moved to the lift position by the rotation of the rotating body 90, are lowered by the lowering of the lift drive member 142, are supplied with negative pressure, and suck the component 112. Although there may be one type of component 112 to be mounted on the circuit board 50, it is assumed here that a plurality of types of components 112 are mounted.

  After suction of the component 112, the suction nozzle 104 is raised to the rising end position by the bias of the spring 134, and the component 112 is imaged by the side-side component imaging device 200. Based on the imaging data, the actual height (vertical dimension) of the component 112 is detected. At the same time, it is checked whether the suction nozzle 104 is picking up the component 112 and whether the type and posture of the sucked component 112 are as planned. If not, processing is performed accordingly. . The detected height of the component 112 is stored in the component height memory provided in the RAM of the mounting control computer 220 in association with the type of the component 112. The component height memory constitutes a storage means. The same applies to other memories described below.

  If all the suction nozzles 104 held by the mounting head 28 have taken out the component 112 from the feeder 54, the mounting head 28 is moved to the imaging execution position located on the lower component imaging device 180 and held by the suction nozzle 104. The captured part 112 is imaged, and the holding position error of the part 112 by the suction nozzle 104 is calculated. The holding position error includes the position of a preset reference point of the component 112, for example, each position error in the X-axis and Y-axis directions of the center of gravity and a rotational position error that is a position error around the axis of the component 112. The circuit board 50 is corrected together with the position error of the target mounting position. After imaging, the mounting head 28 is moved to the substrate holding device 24, and the plurality of suction nozzles 104 are sequentially moved to the lifting position, and are lowered by the nozzle lifting device 140 on the set target mounting position and negative pressure is applied. The supply is stopped, and the component 112 is placed on the pad provided at the target mounting position and mounted on the circuit board 50.

  After all the components 112 scheduled to be mounted on one circuit board 50 are mounted, S3 is executed, and the circuit board 50 is released from the holding by the board holding device 24 and carried out to the mounting inspection device 12. Next, in S4, it is determined whether or not the mounting position deviation occurrence information has been transmitted from the mounting inspection apparatus 12. If there is no transmission, in S5, whether or not the mounting of the components 112 has been completed for the set number of circuit boards 50. Is determined, and if not completed, S1 to S4 are executed.

  If the mounting position shift occurs before the mounting of the component 112 on the last circuit board 50 of the set number, the steps after S6 are executed, and the mounting position is awaited by the instruction from the mounting inspection device 12. The cause of the deviation is investigated. In parallel with the inspection at the time of occurrence of the mounting position deviation, the circuit board 50 on which component mounting has been performed is inspected, and in order to reflect the result in the investigation of the cause of the mounting position deviation, the end of the inspection is awaited. It is done like that. Further, when the mounting position shift occurs for the first time after the last circuit board 50 is inspected, the next circuit board 50 is not present, so that the mounting from the mounting inspection apparatus 12 can be performed without waiting for the end of the inspection for the next circuit board 50. The cause investigation is started immediately upon transmission of the occurrence of misalignment (S11, S7).

  In the mounting inspection device 12, the inspection routine shown in FIG. 7 is executed, and in S51, it is determined whether or not the electronic circuit board 50, which is the circuit board 50 on which the component 112 is mounted, should be carried from the component mounting device 10. This determination is made on the basis of a signal from a board sensor that is provided in the board conveyance device of the mounting inspection apparatus 12 and detects the electronic circuit board 50 carried out from the component mounting apparatus 10. The electronic circuit board 50 is carried into the mounting inspection device 12 by the substrate transfer device, stopped at a predetermined position, and then held in a horizontal posture by the substrate holding device.

  In step S53, an inspection is performed, the inspection head is moved by the inspection head moving device, and the upper surface 52 of the electronic circuit board 50 is imaged. The inspection head divides and captures the upper surface 52 into a plurality of regions. In the present embodiment, the entire upper surface 52 is imaged, and the actual mounting position of the component 112 at each of the target mounting positions based on the imaging data. A deviation amount with respect to the target mounting position is calculated. The actual mounting position of the part 112 includes the position of the reference point set in advance for the part 112, for example, the position of the center of gravity and the rotational position around the reference point. The position of the set reference point, for example, the positional deviation amounts Δx and Δy of the center of gravity position in the X-axis and Y-axis directions and the rotational positional deviation amount Δθ of the component 112 are included. The mounting position deviation amount is stored in an inspection result memory provided in the inspection control computer 272 as inspection result data in association with the target mounting position. In parallel with the inspection, the component mounting apparatus 10 mounts the component 112 on the next circuit board 50.

  Next, in S54, it is determined whether or not a mounting failure has occurred. This determination is made based on the inspection result, and is made based on whether or not the absolute values of the mounting position deviation amounts Δx, Δy, Δθ are larger than the set values. This set value is determined to determine whether or not the mounting position deviation is so large that the electronic circuit board 50 cannot be used as a product, and at least the absolute values of the mounting position deviation amounts Δx, Δy, and Δθ. If there is even one mounting position where one is larger than the set value, it is judged as defective, the determination in S54 is YES, S65 is executed, and the occurrence of the defect is displayed on the display screen 236 together with the defect content to notify the operator. The Then, in S66, a failure process is performed. For example, the defective electronic circuit board 50 is discharged to the collection device, or waiting for removal by the operator. Further, the operation of the component mounting apparatus 10 is stopped, and the processing of the circuit board 50 on which the component 112 has been mounted is performed in parallel with the inspection of the defective electronic circuit board 50. For example, an operator takes out the component mounting apparatus 10 and a visual inspection is performed. After resolving the cause of the failure, the component mounting apparatus 10 is restarted to mount the component 112 on the circuit board 50.

  If there is no mounting position where the mounting position deviation amount is larger than the set value, the electronic circuit board 50 is not defective, and the determination in S54 is NO, and in S55, the holding of the electronic circuit board 50 is released and carried out by the substrate holding device. After that, statistical processing is performed in S56. Statistical processing is performed by examining each distribution of the mounting position deviation amounts Δx, Δy, Δθ. As shown in FIG. 8 (a), an allowable range is set for each mounting position deviation amount in the X-axis and Y-axis directions, and if there is a deviation from the allowable range in at least one direction, there is a mounting position deviation. . The upper and lower limits of the allowable range, which is the reference misalignment amount, are not so great that the electronic circuit after component mounting becomes defective, but it is set to a size that it is desirable to take measures to reduce misalignment. Yes. The same applies to the rotational position deviation shown in FIG. As a result of the processing, if there is a mounting position deviation that is larger than the upper limit of the allowable range or smaller than the lower limit and deviates from the allowable range, the target mounting position where the mounting position shift has occurred and the component 112 mounted at the target mounting position The type is stored in the statistical processing result memory as statistical processing data.

  After the statistical processing, it is determined in S57 whether or not a flag (indicated by F in FIG. 7) is set to 1. The flag is reset to 0 in the initial setting, and the determination in S57 is NO, and S58 is executed. Based on the result of the statistical process, it is determined whether or not a mounting position shift has occurred. For example, when at least one of the target mounting positions where at least one of the mounting position shift amounts Δx, Δy, Δθ is out of the allowable range is equal to or greater than the set number, the mounting position shift is generated. The number of settings may be one or a plurality. If it is determined that the mounting position deviation has occurred, if the electronic circuit board 50 that has been inspected is not the last one, the flag is set and the occurrence of the mounting position deviation is stored, and the occurrence of the mounting position deviation is inspected. It is transmitted from the control computer 272 to the mounting control computer 220 (S61, S62). As a result, the determination in S4 of the mounting routine becomes YES, and a cause investigation execution instruction from the mounting inspection device 12 is awaited (S6). Whether or not it is the last electronic circuit board 50 is determined based on, for example, the number of inspected electronic circuit boards 50.

  The mounting inspection device 12 carries in, inspects, carries out, and statistically processes the electronic circuit board 50 in which the parts are mounted in parallel with the inspection of the electronic circuit board 50 in which the mounting position deviation has occurred after detecting the occurrence of the mounting position deviation. If the electronic circuit board 50 is not a defective electronic circuit board, S64 is executed based on the setting of the flag, and the statistical processing data obtained by the investigation of the cause of the mounting position deviation and the statistical processing are obtained. This is transmitted to the component mounting apparatus 10, whereby the determination in S6 is YES, and the steps after S7 are executed. In S64, the flag is reset together with the transmission. Inspection result data may also be transmitted.

  On the other hand, when the number of target mounting positions where the mounting position deviation amount is out of the allowable range is small, the mounting position deviation does not occur in S58, and the electronic circuit board 50 that has been inspected is not the last one. Execution of the inspection routine ends (S59). When the mounting position deviation occurs due to the last inspection of the electronic circuit board 50, S63 is executed, and the fact and statistical processing data are transmitted to the mounting control computer 220. If the mounting position deviation does not occur even after the final electronic circuit board 50 has been inspected, S60 is executed and a message to that effect is transmitted to the mounting control computer 220. The transmission data of S60 and S63 is used for the determination of S11 of the mounting routine. Since the determination of S11 is performed after the final inspection of the electronic circuit board 50, if the mounting position shift has occurred, S7 and subsequent steps are executed, and if not, the execution of the routine is ended.

  If the statistical processing data is transmitted to the component mounting apparatus 10 in S63 and S64, the statistical processing data is not used for the subsequent statistical processing. For example, the statistical processing data is erased or not erased, and is distinguished and used as data that has been used for determining the occurrence of the mounting position deviation and accumulated. In any case, component mounting on the circuit board 50 and mounting inspection are resumed after investigating the cause of the mounting position deviation, or component mounting and mounting on the same or different circuit boards 50 after the component mounting on the series of circuit boards 50 is completed. When the examination is performed, the statistical processing data is newly acquired from a state where the statistical processing data is not present. In the inspection of the circuit board 50 in which the component is mounted according to the corrected mounting data based on the cause investigation or another mounting data, new statistical processing data is acquired without including the used statistical processing data. Thus, the determination of the occurrence of the mounting position deviation is performed. Even if the mounting position deviation is not generated, if there is statistical processing data, the same processing is performed when S60 is executed. In addition, the inspection result data may be processed in the same manner as the statistical processing data, or may be deleted every time inspection and statistical processing are performed on one circuit board 50.

The cause investigation of the mounting position deviation in S7 is performed according to the cause investigation routine shown in FIG. First, is the at least one of the causes of the linear lateral movement of the suction nozzle 104 by the execution of S21 to S25, that is, the linear lateral movement shift which is the shift applied to the mounting head 28 by the mounting head moving device 30? It is investigated whether or not. If the movement pattern including acceleration, deceleration, and speed for linear lateral movement is inappropriate, the component 112 may be displaced with respect to the suction surface 110 of the suction nozzle 104 as shown in FIG. This is because the mounting position 112 on the circuit board 50 may deviate from the target mounting position. This cause investigation is performed for the component 112 in which the mounting position shift has occurred. First, S21 is executed, the mounting head 28 is moved to the component supply device 26, and the suction nozzle 104 causes the component 112 to be taken out from the feeder 54. Statistical processing data can be used to obtain the types of the parts 112 in which the mounting position deviation has occurred. If there are a plurality of types, the plurality of suction nozzles 104 are used for taking out the parts 112, and the plurality of types of parts 112 are all in the mounting head 28. Retained. After the holding, the mounting head 28 is moved to the imaging execution position. At the time of this movement, the mounting head 28 is moved according to a predetermined set movement pattern. This set movement pattern is referred to as a second set movement pattern in order to distinguish it from the following first set movement pattern. In the present embodiment, the second set movement pattern has the same set speed as the first set movement pattern described below, and the second set acceleration and the second set deceleration have the same absolute value. The absolute value of the first setting acceleration and the first setting deceleration in the first setting movement pattern is smaller than the absolute value of the first setting acceleration and the first setting deceleration so that the lateral displacement of the component 112 with respect to the suction surface 110 is guaranteed. The mounting head 28 is started to move at the second set acceleration, and after reaching the set speed, the mounting head 28 is stopped to move at the second set deceleration.
The setting speed of the second setting movement pattern may be different from the setting speed of the first setting movement pattern, and the absolute values of the second setting acceleration and the second setting deceleration may be different from each other.

  After the mounting head 28 is moved to the imaging execution position as described above, the holding state of the component 112 by the suction nozzle 104 is imaged by the lower component imaging device 180 as shown in FIG. Since the mounting head 28 is moved according to the second set movement pattern, the component 112 does not shift with respect to the suction nozzle 104 during the movement to the imaging execution position, and the suction nozzle 104 has the center of the suction surface 110. The state in which the component 112 is held by the suction nozzle 104 is imaged while the component 112 remains sucked in a state that substantially matches the center of gravity of the component 112. In FIG. 10, the mounting head 28 and the lower part imaging device 180 are schematically illustrated, and a state in which one suction nozzle 104 is imaged is shown. However, in reality, all the suction nozzles of the mounting head 28 are illustrated. 104 is imaged simultaneously.

After the imaging, the mounting head 28 is moved to a preset position on the substrate holding device 24 and stopped as shown in FIG. At this time, the mounting head 28 is moved in a predetermined first setting movement pattern. That is, the movement is started at the first set acceleration, and after reaching the set speed, the movement is stopped at the first set deceleration. In the present embodiment, the first set acceleration / deceleration and the set speed are determined when the suction nozzle 104 moves from the lower component imaging system 34 to the substrate holding device 24 when the component 112 is normally mounted on the circuit board 50. The first set acceleration and the first set deceleration have the same absolute value in this embodiment.
However, the absolute values of the first set acceleration and the first set deceleration of the first set movement pattern may be different from each other. When different from each other, for example, the deceleration can be set to an absolute value that ensures that no lateral deviation occurs, and the lateral deviation that occurs during acceleration is reduced or eliminated by the lateral deviation that occurs during deceleration. It can be avoided. Conversely, the acceleration can be set to an absolute value that ensures that no lateral deviation occurs. Furthermore, the setting speed of the first setting movement pattern may be different from the movement speed of the suction nozzle 104 when the component 112 is normally mounted on the circuit board 50.

  Thereafter, the mounting head 28 is returned to the imaging execution position as shown in FIG. At this time, the mounting head 28 is moved in the second set movement pattern. After the movement, the holding state of the component 112 by the suction nozzle 104 is imaged again by the lower component imaging device 180. From the imaging data obtained by imaging before and after the suction nozzle 104 moves to a preset position on the substrate holding device 24, the holding position errors Δx and Δy of the component 112 by the suction nozzle 104 before and after the movement are obtained. The difference between before and after is calculated and the amount of lateral deviation of the component 112 during linear lateral movement is obtained. When returning, the suction nozzle 104 is moved in a speed pattern that ensures that no lateral deviation occurs, and thus the obtained difference between before and after represents the amount of lateral deviation when moving to a preset position on the substrate holding device 24. . If there are a plurality of types of parts 112 for which the cause of the mounting position shift is investigated, the lateral shift amount is acquired for each type. As described above, the suction nozzle 104 has its center position substantially coincident with the position of the center of gravity of the component 112, and there is no rotational position shift during lateral movement.

  Then, S22 is executed, and it is determined whether or not the absolute value of the lateral deviation amount acquired in S21 is larger than the reference lateral deviation amount. In the present embodiment, the reference lateral deviation amount is acquired with the same magnitude as the absolute value of the upper limit value and the lower limit value that define the allowable range of each positional deviation in the X-axis and Y-axis directions in the statistical processing of the mounting inspection. If the absolute value of the lateral displacement amount is greater than the reference lateral displacement amount in at least one of the X-axis direction and the Y-axis direction, it is determined that the displacement during linear lateral movement is at least one cause of the mounting position displacement. In the case where there are a plurality of types of parts 112, even if there is a part 112 whose lateral deviation amount exceeds the reference lateral deviation amount, it is determined that the deviation at the time of linear lateral movement is at least one cause of the mounting position deviation. Then, the determination in S22 is YES, S23 is executed, and the movement pattern is corrected. In the present embodiment, the correction movement pattern is set by multiplying the acceleration and deceleration of the first setting movement pattern by a coefficient smaller than 1 set in advance.

  After the setting, the mounting head 28 is moved in the correction movement pattern, and the lateral deviation amount is acquired. This acquisition is performed in the same manner as the lateral displacement acquisition in S21 except that the mounting head 28 is moved from the imaging execution position to the substrate holding device 24 in a correction movement pattern. Further, the previously held component 112 is put into the storage device, and the suction nozzle 104 newly takes out the component 112 from the feeder 54. If the lateral deviation amount acquired by correcting the movement pattern has decreased from before the correction, but is still larger than the reference lateral deviation amount of S22, the acceleration / deceleration of the corrected movement pattern is reduced and the lateral deviation amount is acquired again. Is called. When there are a plurality of types of parts 112, if at least one part 112 has an acquired lateral deviation amount larger than the reference lateral deviation amount, the correction movement pattern is corrected, moved, and the lateral deviation amount is acquired.

  When the lateral deviation amount is reduced by correcting the movement pattern, until the lateral deviation amount becomes sufficiently small, for example, when there is one type of component 112, for the component 112, and when there are multiple types, the standard lateral deviation amount for all components 112 The movement pattern correction is repeated until the following is reached. If the amount of lateral deviation does not decrease even when the movement pattern is corrected, the correction is stopped when the correction and the lateral deviation amount are acquired a set number of times, for example, twice. Then, in S24, it is determined whether or not the lateral deviation amount has decreased due to the correction of the movement pattern. If the lateral deviation amount has decreased, the corrected movement pattern when the lateral deviation amount becomes equal to or smaller than the reference lateral deviation amount in S25 is stored in the correction data memory. It is memorized. If the lateral shift amount does not decrease, S25 is skipped.

  Next, S26 to S30 are executed, and it is checked whether or not the shift of the suction nozzle 104 during turning is at least one of the causes of the mounting position shift. When there are a plurality of types of parts 112 in which the mounting position shift is assumed to have occurred in the statistical processing, the cause can be examined for the plurality of types of parts 112 as in the case of the linear lateral movement. In S26, first, the suction nozzle 104 takes out the component 112 from the feeder 54 and moves it to the imaging execution position. At this time, the mounting head 28 is moved according to a predetermined set movement pattern, in the present embodiment, the second set movement pattern. Then, the component 112 is imaged by the lower component imaging device 180, and then the rotating body 90 is rotated at a set angle, for example, 180 degrees, with a set turning pattern, and the suction nozzle 104 that sucks the component 112 is turned. The set turning pattern includes a set angular acceleration, a set angular velocity, and a set angular deceleration. In this embodiment, the set turning pattern is the same as the pattern for rotating the rotating body 90 when the actual component 112 is mounted on the circuit board 50. The set angular acceleration and the set angular deceleration have the same absolute value.

  After the turn, the part 112 is imaged again, the holding position error of the part 112 by the suction nozzle 104 before and after the turn is calculated, the difference between the front and the back is calculated, and the lateral deviation amount is calculated. The lateral deviation that occurs during turning is also the deviation in the X-axis and Y-axis directions, and the calculated absolute value of the lateral deviation amount is compared with the reference lateral deviation amount (S27). Determined as at least one of the causes. The reference lateral deviation amount is set to be the same as the reference lateral deviation amount in S22, for example. Then, the turning pattern is corrected (S28). In the present embodiment, correction is performed by reducing the angular acceleration and deceleration of the rotating body 90 and reducing the angular velocity. This is because a centrifugal force acts on the component 112 when the rotating body 90 rotates, thereby causing a lateral shift.

  The suction nozzle 104 newly holds the component 112. First, the rotating body 90 is rotated in a modified turning pattern in which the angular acceleration and deceleration are reduced, and the lateral deviation amount is acquired in the same manner as in S26. If the amount of lateral deviation decreases, the angular acceleration / deceleration is at least one of the causes of the deviation, and if the deviation is still large and larger than the reference lateral deviation, the angular addition / deceleration of the corrected turning pattern is reduced and the lateral deviation occurs. The quantity is acquired again. The correction is performed until the lateral deviation amount is sufficiently small and equal to or less than the reference lateral deviation amount. If the set number of corrections does not decrease, the correction is canceled. Next, the lateral deviation amount is acquired by reducing the angular velocity. If the lateral deviation amount is reduced by the correction, the lateral deviation amount is corrected until the lateral deviation amount becomes sufficiently small. If the lateral deviation amount is reduced by correcting the turning pattern, a corrected turning pattern including at least one of angular acceleration, deceleration and angular velocity at the time of reduction is stored in the correction data memory (S29, S30). If any correction does not reduce the lateral deviation amount and the correction is stopped, S30 is skipped.

  Next, S31 to S35 are executed, and it is checked whether or not a rotation time shift, which is a shift of the component 112 with respect to the suction surface 110 when the suction nozzle 104 rotates, is at least one of the causes of the mounting position shift. When there are a plurality of types of parts 112 in which the mounting position shift is assumed to have occurred in the statistical processing, the cause of the plurality of types of parts 112 can be investigated as in the case of linear lateral movement or the like. In S31, first, the suction nozzle 104 takes out the component 112 from the feeder 54 and moves it to the imaging execution position. At this time, the mounting head 28 is moved according to a predetermined set movement pattern, in the present embodiment, the second set movement pattern. Then, the component 112 is imaged by the lower component imaging device 180, and then the suction nozzle 104 is rotated around a set angle, for example, 180 degrees around its own axis. The suction nozzle 104 is rotated according to a preset rotation pattern, starts rotating at a set angular acceleration, reaches a set angular velocity, and then stops at a set angular deceleration. In the present embodiment, the set rotation pattern is the same as the rotation pattern when the component 112 is actually mounted on the circuit board 50, and the rotation angular acceleration and the rotation angle deceleration have the same absolute value.

  After the rotation, the component 112 is imaged again by the lower component imaging device 180, and each holding position shift of the component 112 by the suction nozzle 104 before and after the rotation is calculated. Since the suction nozzle 104 holds the center of gravity of the component 112 at its center, only the rotational position error Δθ occurs during rotation, the difference between the rotational position errors before and after rotation is calculated, the rotational deviation amount is acquired, and the absolute value is If it is larger than the reference rotational deviation amount, the rotational pattern is corrected (S32, S33). The reference rotational deviation amount is, for example, the same size as the absolute value of the upper limit value and the lower limit value that define the allowable range of rotational positional deviation in the statistical processing of mounting inspection, and the absolute value of the acquired rotational deviation amount is the reference rotation If it is larger than the displacement amount, it is determined that the rotational displacement is the cause of the mounting position displacement.

  In this embodiment, the rotation pattern is corrected by reducing the angular acceleration and the angular deceleration, and after the correction, the rotational deviation amount of the suction nozzle 104 is acquired again. This acquisition is performed in the same manner as S31 except that the suction nozzle 104 is rotated in a corrected rotation pattern. If the rotational deviation amount is reduced by the correction, the rotational deviation amount is sufficiently reduced and the correction is performed until the rotational rotational deviation amount is equal to or less than the reference rotational deviation amount. If the rotation deviation amount decreases, the corrected rotation pattern when the absolute value of the rotation deviation amount becomes equal to or smaller than the reference rotation deviation amount is stored in the correction data memory (S34, S35), and if it does not decrease, S35 is skipped. Is done.

  Next, S36 to S41 are executed, and it is checked whether or not the height of the component 112 is at least one cause of the mounting position shift. If the height of the component 112 is the set height, the suction nozzle 104 is lowered to the set lowering stop position, so that the component 112 is mounted on the circuit board 50 as shown in FIG. Installed. On the other hand, for example, if the height is smaller than the set height, the lowering amount of the suction nozzle 104 is insufficient as shown in FIG. 11B, and the component 112 is not placed on the circuit board 50 from the suction nozzle 104. This is because it may come off and fall on the circuit board 50 to shift the mounting position.

  Therefore, all the height data detected at the time of mounting until the mounting position deviation occurrence information is received for the parts 112 of the same type as the parts 112 included in the statistical processing data is read from the part height memory (S36). Then, it is determined whether or not the variation in component height is large (S37). If there are a plurality of types of components 112 whose heights have been read, this determination is performed in the order set in advance, for example, the components 112 with the earlier mounting order on the circuit board 50. The determination in S37 is made based on whether or not the difference between the maximum value and the minimum value is larger than the set value among a plurality of detected heights of the same type of component 112. If the difference is greater than the set value and variations occur, S38 is performed. Is displayed on the display screen 236 to notify the operator. This is because the height variation is not regular and cannot be handled by correcting the lowering stop position of the suction nozzle 104.

  If there is no variation in the height of the component 112, S39 is executed, and it is determined whether or not there is a deviation in the same tendency between the plurality of detected heights of the same type of component 112 with respect to the set height. The set height is the design height of the part 112, and the difference from the set height is calculated for all the detected heights. The positive and negative values are the same for all the differences, and the amount is not less than the set value. For example, it is determined that there is a magnitude of the same tendency, and the descent stop position of the suction nozzle 104 is corrected (S40). The set value is set to a value smaller than the set value for detecting the variation in height, for example, slightly smaller than the maximum error that may occur in manufacturing the component 112. The correction is performed, for example, by calculating an average value of the difference between the detected height and the set height to obtain a correction value for the descent stop position, and is stored in the correction data memory in association with the type of the part 112. This correction value is set with a positive or negative sign. And it is determined whether S37-S40 was performed about all the components 112 read in S41, and if there is any component 112 which has not been performed yet, it will be performed.

  Next, S42 to S44 are executed to check whether or not the warp of the circuit board 50 is at least one of the causes of the mounting position shift. If the circuit board 50 is not warped, the component 112 is normally mounted on the circuit board 50 as shown in FIG. 12A, whereas if warped, as shown in FIG. 12B, This is because the mounting position of the component 112 may be shifted due to an inclination of the upper surface 52, an error in the height position of the upper surface 52 at the target mounting position, or the like. Therefore, S42 is executed, the circuit board 50 is carried into the component mounting apparatus 10, and after being stopped, the height position of the upper surface 52 of the circuit board 50 is detected by the distance sensor 170 while being held by the board holding device 24. (S42). In the present embodiment, this detection is performed for a target mounting position that is determined to have a mounting position shift in the inspection of the mounting inspection device 12, and the detected actual height position is compared with the set height position. The set height position is a position where the upper surface 52 determined by the positioning portion of the substrate holding device 24 should be located.

  If the absolute value of the difference between the actual height position and the set height position is larger than the set value, the upper surface 52 is warped upward or downward beyond the set amount, thereby causing the lowering position of the suction nozzle 104 to be lowered. Appropriate is determined as the cause of the mounting position shift (S43), and the lowering stop position of the suction nozzle 104 is corrected (S44). The set value is set to a value slightly smaller than the minimum warp that can occur in the circuit board 50. When there are a plurality of target mounting positions from which the height position is detected, S44 is executed if there is a position where the difference from the set height position is larger than the set value, and for each of the target mounting positions having a large warp. The descent stop position is corrected. For example, the difference between the actual height position and the set height position is used as the correction value for the descent stop position, and is stored in the correction data memory in association with the target mounting position. The correction value is set with a positive or negative sign.

  After investigating the cause of the mounting position deviation as described above, the mounting routine S8 is executed to determine whether or not the cause of the mounting position deviation should be automatically corrected. Whether or not to correct automatically is set in advance by the operator using the input device 248. If automatic correction is to be performed, S9 is executed, and the correction data acquired by executing the cause investigation routine is stored. The component 112 is used for mounting on the circuit board 50. Further, the display device 238 notifies the operator of the occurrence, cause, automatic correction, and contents of the mounting position deviation. If correction data cannot be obtained and the cause is unknown, this is notified. If the mounting position deviation is not to be corrected automatically, S10 is executed, the occurrence of the mounting position deviation for the operator, the acquired cause and correction data or the cause unknown, the investigation of the cause of the positional deviation by the operator, conditions The display device 238 notifies the execution of the correction.

  The correction data is not used after S9 and S10 are executed. For example, the correction data is erased after correction of the mounting data in S9, or is distinguished and stored as data already used for correction. In S10, the corrected data is distinguished and stored as already notified data, or is deleted after execution of cause investigation by the operator. The height data of the part 112 and the statistical processing data transmitted from the mounting inspection device 12 are also deleted or stored as distinguished data as used data. Alternatively, the height data may be erased after checking whether or not the height of the component 112 is at least one of the causes of the mounting position deviation, or may be stored separately as used data. Good. When the height of the component 112 is set as at least one cause of the mounting position shift, only component data for the component 112 that is the cause may be distinguished and stored as used data.

  In addition, when it is determined that the mounting position shift occurs as a result of the inspection and statistical processing for the circuit board 50 that is not the last, the inspection and statistical processing are performed for the circuit board 50 on which component mounting is performed in parallel with the inspection. The cause investigation may be performed immediately without waiting.

  In addition, if multiple types of parts are mounted on the circuit board and the result of statistical processing of the mounting position deviation in the mounting inspection is a mounting position deviation exceeding the allowable range only for a specific type of part, The cause may be investigated only for the part, for example, only the height of the part may be examined. As a result of the statistical processing, if the mounting position deviation exceeding the allowable range occurs for the specific target mounting position, it is only necessary to examine the warp of the circuit substrate. As a result of statistical processing, if a deviation exceeding the allowable range occurs only in the X-axis direction and the Y-axis direction, or only in the rotation direction, the former is examined only for lateral movement, and the latter is the rotation. Only the time lag may be examined. In any case, if statistical processing is performed, the cause of the mounting position deviation can be easily determined, and can be quickly performed.

  Further, when a plurality of defective electronic circuit boards are continuously generated, a shift in lateral movement or the like may be examined as a cause investigation.

  If the types of parts held by multiple suction nozzles are the same, or if parts of different types can be considered to be substantially the same, such as having the same mass, the mounting position will shift. In order to investigate the cause by linearly moving, turning, and rotating the suction nozzle, the movement pattern, turning pattern, and rotation pattern must be stricter than the actual mounting conditions, that is, absolute values for acceleration and deceleration. , Increase the speed, investigate the amount of displacement and investigate the cause, and if a displacement that exceeds the set amount occurs, consider at least one of the causes of the displacement, and accordingly, The currently set wearing pattern may be gradual, that is, the absolute value may be reduced if acceleration / deceleration, and may be decreased if speed.

Further, the mounting head may hold only one suction nozzle, or may have a plurality of suction nozzles arranged in one or a plurality of rows.
Furthermore, the present invention can also be applied to a component mounting apparatus constituting a component mounting line including a plurality of component mounting apparatuses. In this case, the mounting inspection apparatus may be provided on the downstream side of the most downstream component mounting apparatus and shared by a plurality of component mounting apparatuses. This is because it can be determined from which mounting device a plurality of components mounted on the circuit board is mounted, and the cause of the defect can be investigated for each component mounting device based on the inspection.

  Further, in order to investigate the cause of the mounting position shift, an imaging device that captures the state before and after the suction nozzle that sucks the component starts lateral movement is like an imaging device provided with a fixed position. In addition, an imaging device that moves relative to the suction nozzle may be used, or an imaging device that moves the same as the suction nozzle as the suction nozzle moves. In the latter case, it is possible to acquire the state of the component after moving in the first set movement pattern without performing imaging after returning, and according to the former aspect, there is an advantage that it is not necessary to move the imaging device. .

Furthermore, when it is guaranteed that the circuit substrate has no substantial warpage or thickness error, the substrate upper surface height position detection step can be omitted, and the actual height of the component can be substantially reduced. When it is guaranteed that there is no significant error, the part height detection process can be omitted.
If the exact height direction position of the suction surface of the suction nozzle is known, the actual height of the part is detected by detecting the height direction position of the bottom surface of the part sucked on the suction surface. be able to.
If it is not guaranteed that there is no error in the suction nozzle descent stop position or the height position of the adsorption surface of the adsorption nozzle during descent stop, improper descent stop position of the adsorption nozzle In the determination process for determining that it is at least one of the causes, the tip of the suction nozzle is imaged by the imaging device from a direction perpendicular to the axis of the suction nozzle, or from the direction orthogonal to the suction surface to the suction surface by the distance detection device. It is desirable to include a step of detecting the lowering position of the suction nozzle or the height position of the suction surface of the suction nozzle when the suction nozzle is stopped by detecting the distance.

  Furthermore, in order to determine that the cause of the mounting position deviation is that the suction nozzle descent stop position is inappropriate, the suction nozzle is pushed when the component is pressed against the circuit board by lowering the set lowering amount from the rising end position. A pressing force detection process for detecting pressure may be performed. By detecting the pressing force, at least one of the height of the component and the warp of the circuit board is acquired. If the pressing force is detected in a state where one of the height of the component is the set height and the circuit board is not warped, the other of the height of the component and the warp of the circuit board is detected. It is possible to estimate, and it is possible to correct the descent stop position of the suction nozzle based on the magnitude of the detected pressing force. This pressing force detection process can also be employed when it is not guaranteed that there is no error in the position where the suction nozzle descends or stops, or the position of the suction surface of the suction nozzle when it stops.

  After the suction nozzle starts to descend, it detects the start of relative movement in the axial direction between the suction nozzle and the nozzle holder caused by the contact of the component with the circuit substrate, and descends based on the height direction position at the start of relative movement. It may be determined whether or not improper stop position is at least one of the causes of mounting position deviation.

  Further, the inspection of the electronic circuit board is not indispensable for all target mounting positions, and may be performed for a part. For example, it may be performed for a target mounting position with a large mounting position deviation. For example, with respect to a target mounting position with a large mounting position deviation obtained from the inspection result of the first electronic circuit board, the second and subsequent electronic devices Inspect on the circuit board. Alternatively, the target mounting position or component that is particularly likely to cause a mounting position shift may be inspected for a target mounting position where the contact area between the electrode of the component and the pad provided at the target mounting position is small and the shift is likely to occur. Alternatively, the inspection may be performed on a target mounting position where deviation is likely to occur based on inspection data acquired in the past.

  Furthermore, the inspection of the electronic circuit board may be performed in the component mounting apparatus or may be performed by an operator.

In addition, although it is not indispensable, it is desirable that the plurality of mounting operations for performing the statistical processing of the component mounting position deviation amount be a mounting operation during the production of an actual electronic circuit.
Further, the mounting operation for a plurality of times may be a mounting operation for one circuit substrate, a mounting operation for a plurality of circuit substrates, or both.
In addition, the method for investigating the cause of the mounting position shift according to the present invention includes at least one of the steps of determining that the cause is a shift at the time of lateral movement, a shift at the time of rotation, and an inappropriate lowering stop position. ) The result of the judgment is the provisional judgment result, and the result of the provisional judgment is compared with the detection result of the mounting position deviation of the part that triggered the cause investigation process. The final determination step, which is the final determination result in some cases, and (b) a measure for reducing the mounting position deviation based on the determination result, and the determination result by comparing the mounting position deviation before and after the execution of the countermeasure. It is desirable to include at least one of the determination validity confirmation step for confirming the validity of.

As in the above-described embodiment, it is desirable to perform the mounting of the component on the circuit substrate and the inspection of the mounting position deviation in the electronic circuit after mounting in order to shorten the time required for investigating the cause, but it is indispensable. Absent. It is also possible to wait for the inspection to be carried out after mounting, and to investigate the cause based on the inspection result.
Setting patterns such as lateral movement, turning, and rotation can be set for each type of component or for each combination of components and types of suction nozzles that are actually used for suction. For example, in the case of at least one of holding a plurality of types of suction nozzles in one mounting head and holding a plurality of types of components during an actual mounting operation, The most gradual setting pattern is selected for each mounting operation and adopted.

  30: Mounting head moving device 50: Circuit board 104: Suction nozzle

Claims (5)

A method for investigating the cause of displacement of the mounting position of an electronic circuit component on a circuit substrate,
It is determined whether or not there is at least one cause of a shift in lateral movement, which is a shift of an electronic circuit component with respect to a suction surface of the suction nozzle when performing a lateral movement that is a movement perpendicular to the axial direction of the suction nozzle. A first determination step;
A second determination step of determining whether or not a cause is a shift in rotation, which is a shift of an electronic circuit component relative to a suction surface of the suction nozzle during rotation around the axis of the suction nozzle;
A third determination step for determining whether or not the relative position of the lowering stop of the suction nozzle with respect to the height position of the upper surface of the circuit base material is inappropriate is at least one of the causes. only including,
The first determination step includes
Before the lateral movement in which the suction nozzle that has picked up the electronic circuit component is captured by an imaging device in a direction from the direction toward the suction surface of the suction nozzle parallel to the axial direction of the suction nozzle before the lateral movement starts. A state acquisition process;
The first setting movement in which the suction nozzle starts the lateral movement at a predetermined first set acceleration, stops the lateral movement at a predetermined first set deceleration after reaching the predetermined set speed. After the lateral movement in the pattern, the lateral movement state acquisition step of acquiring and acquiring the image by the imaging device from the direction toward the suction surface of the suction nozzle parallel to the axial direction of the suction nozzle;
Based on both imaging results obtained by performing the pre-lateral movement state acquisition step and the post-lateral movement state acquisition step, the lateral displacement amount of the electronic circuit component before and after the horizontal movement according to the first set movement pattern is acquired. If the acquired lateral deviation amount is larger than a predetermined reference lateral deviation amount, the lateral movement pre- and post-movement state dependency determining step for determining that the lateral deviation occurring during the lateral movement is at least one of the causes of the mounting position deviation;
Including
The state acquisition step after the lateral movement is a state acquisition step before the lateral movement of the suction nozzle in a second set movement pattern in which it is ensured that no lateral deviation occurs in the suction nozzle after the lateral movement according to the first set movement pattern. A method for investigating the cause of a mounting position deviation, which is a step of acquiring a post-lateral movement state based on an imaging result of post-return imaging that returns to an imaging execution position for imaging and performs imaging by the same imaging device . The second determination step includes
Before the suction nozzle that sucks the electronic circuit component starts to rotate, the pre-rotation imaging step of imaging by the imaging device from the direction toward the suction surface of the suction nozzle in a direction parallel to the axial direction of the suction nozzle;
The suction nozzle starts rotating at a predetermined set angular acceleration, reaches a predetermined set angular velocity, and then performs suction according to a set rotation pattern in which the rotation stops at a predetermined set angular deceleration. A post-rotation imaging step of imaging by an imaging device from a direction toward the suction surface of the suction nozzle parallel to the axial direction of the nozzle;
Based on both imaging results obtained by performing the pre-rotation imaging step and the post-rotation imaging step, the rotation deviation amount of the electronic circuit component before and after the rotation according to the set rotation pattern is obtained, and the obtained rotation deviation amount if There higher than the reference rotation deviation amount predetermined according to claim 1 rotational displacement occurring during the rotation and at least is one and determines the rotation before and after states rely determination step of causing the mounting position deviation Method for investigating the cause of mounting position shift The third determination step includes
A base material upper surface height position detecting step for detecting an actual height position of the upper surface of the circuit base material on the electronic circuit component mounting scheduled location;
A component actual height detecting step for detecting the actual height of the electronic circuit component sucked and held by the suction nozzle, and lowering the suction nozzle from the rising end position by a set lowering amount to use the electronic circuit component as a circuit substrate. A pressing force detection step for detecting a pressing force when pressed, and based on an execution result of the at least one step, the determination that the descent stop position improper is at least one of the causes a height detection result rely determination step attachment position deviation cause investigation method according to claim 1 or 2, to perform. The electronic circuit components inspection of electronic circuit board mounted on a circuit substrate, either to the mounting position of the electronic circuit components claims 1 is executed when found to have deviated from the target mounting position set amount or more 3 The method of investigating the cause of the mounting position shift described in Crab. The electronic circuit component mounted on the circuit substrate is imaged by the imaging device from a direction perpendicular to the upper surface of the circuit substrate for a plurality of mounting operations, and the electronic circuit component in each of the plurality of mounting operations The occurrence of the mounting position shift of the electronic circuit component on the circuit base material is detected based on the statistical processing result of the mounting position shift amount of the mounting position according to any one of claims 1 to 3 . A method for investigating the cause of the mounting position deviation that starts executing the cause investigation method .

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