JP6029764B2 - Method for producing metal-filled microstructure - Google Patents

Description

  The present invention relates to a method for producing a metal-filled microstructure.

Metal-filled microstructures (devices) in which fine holes provided in an insulating substrate are filled with metal are one of the fields that have recently been attracting attention in nanotechnology. For example, they are used as anisotropic conductive members. Is expected.
An anisotropic conductive member is inserted between an electronic component such as a semiconductor element and a circuit board, and electrical connection between the electronic component and the circuit board can be obtained simply by applying pressure. It is widely used as an electrical connection member or a connector for inspection when performing functional inspection.

  As such an anisotropic conductive member, Patent Document 1 states that “a film insulating member formed by anodizing a conductive material, and a film thickness of the insulating member provided in the film insulating member. An anisotropic conductive film comprising a conductive member that conducts in the direction ”([Claim 1]), and“ anodizing the upper layer portion of the conductive substrate, A step of forming an anodic oxide film having a plurality of microscopic holes of a predetermined depth, a step of forming a conductive member by folding a conductive metal into the micropores of the anodic oxide film by electrolytic deposition, and anodizing A method for producing an anisotropic conductive film, comprising: separating a film from a lower layer portion of a conductive substrate; and removing a surface layer portion of the anodized film to project a conductive member from the anodized film. ("Claim 6", Fig. 11).

Patent Document 2 states that “a plurality of conductive paths made of conductive members penetrate through the insulating base material in the thickness direction while being insulated from each other in the insulating base material, and An anisotropic conductive member provided in a state where one end of the passage is exposed on one surface of the insulating base and the other end of each conductive path is exposed on the other surface of the insulating base, An anisotropic conductive member in which the density of the conduction path is 2 million pieces / mm ² or more and the insulating base material is a structure made of an anodized film of an aluminum substrate having micropores ”is described. ([Claim 1]) Furthermore, “the anodizing treatment step of anodizing the aluminum substrate, and after the anodizing treatment step, the pores formed by the micropores generated by the anodization are penetrated to form the insulating substrate. A penetrating treatment step, and After the penetration process step, a metal filling step for filling the inside of the penetrated hole in the obtained insulating base material with a metal which is a conductive member to obtain the anisotropic conductive member is provided. The manufacturing method of a directionally conductive member "is described ([Claim 5]).

JP 04-126307 A JP 2008-270158 A

The inventor examined the manufacturing method of the anisotropic conductive film (metal-filled fine structure) described in Patent Document 1, and when the lower layer portion of the conductive substrate was used as an electrode, the anodic oxide film was small. It was found that metal deposition in the pores (micropores) did not proceed easily, and it was difficult to form a conductive member.
Moreover, when this inventor examined the manufacturing method of the anisotropically conductive member (metal filling fine structure) described in patent document 2, the metal filling fine structure manufactured by the residual stress accompanying metal filling was carried out. It was found that warping occurred and cracks occurred.

  Therefore, an object of the present invention is to provide a method for manufacturing a metal-filled microstructure that facilitates metal filling of micropores and can suppress the occurrence of residual stress associated with metal filling.

As a result of diligent research to achieve the above-mentioned problems, the present inventor performed metal filling in the micropores after removing the barrier layer formed by anodizing and before removing the aluminum substrate. The present inventors have found that the metal filling into the micropores can be facilitated and the generation of residual stress accompanying the metal filling can be suppressed, and the present invention has been completed.
That is, this invention provides the manufacturing method of the metal filling fine structure of the following structures.

[1] Anodizing is performed on the surface of one side of the aluminum substrate, and an anodized film having micropores existing in the thickness direction and a barrier layer existing at the bottom of the micropores is formed on the surface of one side of the aluminum substrate. Anodizing treatment process;
A barrier layer removing step of removing the barrier layer of the anodized film after the anodizing treatment step;
After the barrier layer removal step, a metal filling step of performing electrolytic plating treatment to fill the inside of the micropore with a metal,
After the metal filling step, the substrate removing step of removing the aluminum substrate to obtain a metal filled fine structure.
[2] Production of metal-filled microstructure according to [1], wherein the barrier layer removing step is a step of electrochemically dissolving the barrier layer at a potential lower than the potential in the anodizing treatment of the anodizing treatment step. Method.
[3] The method for producing a metal-filled microstructure according to [1], wherein the barrier layer removing step is a step of removing the barrier layer by etching.
[4] The barrier layer removing step is a step of further removing the barrier layer by etching after electrochemically dissolving the barrier layer at a potential lower than the potential in the anodizing treatment of the anodizing treatment step. ] The manufacturing method of the metal filling fine structure of description.
[5] Any of [1] to [4], including a mask layer forming step of forming a mask layer having a desired shape in advance on one surface of the aluminum substrate to be anodized before the anodizing step. A method for producing a metal-filled microstructure according to claim 1.
[6] After the metal filling step and before the substrate removing step, a film sticking step of attaching a peelable adhesive layer-attached film to the surface of the anodized film having the micropores filled with metal ,
Furthermore, the manufacturing method of the metal filling fine structure in any one of [1]-[5] which has a film peeling process which peels a film with an adhesion layer after a board | substrate removal process.
[7] The method according to [5] or [6], further including a polishing step of polishing the surfaces of the anodized film having a micropore filled with metal and the mask layer and removing at least the mask layer after the metal filling step. Method for producing a metal-filled microstructure.
[8] After the substrate removing step, [1] to [7] having a surface smoothing step of smoothing the surface of the anodized film having micropores filled with metal on the side in contact with the aluminum substrate A method for producing a metal-filled microstructure according to any one of the above.

  ADVANTAGE OF THE INVENTION According to this invention, the metal filling to a micropore becomes easy, and the manufacturing method of the metal filling fine structure which can suppress generation | occurrence | production of the residual stress accompanying metal filling can be provided.

1A to 1E are schematic cross-sectional views showing members before and after each processing step in an example (first aspect) of the method for producing a metal-filled microstructure of the present invention. FIGS. 2A to 2F are schematic cross-sectional views showing members before and after each processing step in another example (second embodiment) of the method for producing a metal-filled microstructure of the present invention. 3A to 3H are schematic cross-sectional views showing members before and after each processing step in another example (third aspect) of the method for producing a metal-filled microstructure of the present invention. 4A to 4I are schematic cross-sectional views showing members before and after each processing step in another example (fourth embodiment) of the method for producing a metal-filled microstructure of the present invention. 5A to 5J are schematic cross-sectional views showing members before and after each processing step in another example (fifth aspect) of the method for producing a metal-filled microstructure of the present invention. 6A to 6D are schematic cross-sectional views showing members before and after each processing step in the method for producing a metal-filled microstructure manufactured in Comparative Example 1. FIG.

[Method for producing metal-filled microstructure]
The method for producing a metal-filled microstructure of the present invention (hereinafter also abbreviated as “the production method of the present invention”) is performed by anodizing the surface on one side (hereinafter also referred to as “one side”) of an aluminum substrate, An anodizing process for forming an anodized film having micropores in the thickness direction and a barrier layer at the bottom of the micropores on one surface of the aluminum substrate, and an anodized film barrier layer after the anodizing process A barrier layer removing step for removing metal, a metal filling step for performing electrolytic plating treatment after the barrier layer removing step to fill the inside of the micropore, a metal filling microstructure for removing the aluminum substrate after the metal filling step A substrate removing step for obtaining a body, and a method for producing a metal-filled microstructure.

In the present invention, as described above, after removing the barrier layer formed by anodic oxidation, and before removing the aluminum substrate, metal is filled into the micropores to fill the micropores with metal. And the occurrence of residual stress accompanying metal filling can be suppressed.
This is not clear in detail, but is estimated to be as follows.
That is, by removing the barrier layer existing at the bottom of the micropore of the anodic oxide film, it is not necessary to remove the aluminum substrate, but the aluminum substrate is used as an electrode when filling the metal inside the micropore. It is also possible that the residual stress was unexpectedly relaxed by filling the inside of the micropores existing in the anodized film with the anodized film supported by the aluminum substrate. It is done.
This is because the metal-filled microstructure shown in Comparative Example 1 produced by the manufacturing method described in Patent Document 2, that is, the method of filling the metal after removing the aluminum substrate and forming the through-hole derived from the micropores. It can also be inferred from the result that the body shows a large residual stress value. Similarly, when the mask layer is formed before the anodizing treatment and the inside of the micropore is filled with the metal in the state where not only the lower part of the anodized film but also the periphery of the anodized film is surrounded by the aluminum substrate, It can be inferred from the result that the residual stress becomes extremely small.

  Next, after describing the outline of each process in the manufacturing method of the present invention and the conventional manufacturing method described in Patent Document 2, etc., it will be used in the manufacturing method of the present invention. The aluminum substrate and each processing step applied to the aluminum substrate will be described in detail.

<First aspect>
As shown in FIGS. 1A to 1E, the metal-filled microstructure 10 is obtained by subjecting one surface of an aluminum substrate 1 to anodization, and micropores 2 existing in the thickness direction on one surface of the aluminum substrate 1. An anodizing process (see FIGS. 1A and 1B) for forming an anodized film 4 having a barrier layer 3 present at the bottom of the micropore 2, and a barrier for the anodized film 4 after the anodizing process. A barrier layer removing step for removing the layer 3 (see FIGS. 1B and 1C) and a metal filling step for filling the inside of the micropore 2 with the metal 5 after the barrier layer removing step (FIGS. 1C and 1D). )) And a substrate removing step (see FIGS. 1D and 1E) for removing the aluminum substrate 1 after the metal filling step.

<Second Aspect (Preferred Aspect)>
The manufacturing method of the present invention preferably includes a mask layer forming step described later.
For example, as shown in FIGS. 2A to 2F, the metal-filled microstructure 10 has a mask layer forming step (FIG. 2A) in which a mask layer 6 having a desired shape is formed on one surface of the aluminum substrate 1. b)), and the surface of the aluminum substrate 1 on the side where the mask layer 6 is formed after the mask layer forming step is subjected to anodizing treatment, and the micropores 2 and micropores existing in the thickness direction are formed on one surface of the aluminum substrate 1. 2 and the barrier layer 3 of the anodized film 4 after the anodized process (see FIGS. 2B and 2C). The barrier layer removing step (see FIGS. 2C and 2D) for removing the metal, and the metal filling step of filling the inside of the micropore 2 with the metal 5 after the barrier layer removing step (see FIGS. 2D and 2E) ) And aluminum after the metal filling process A substrate removal step of removing the mask layer 6 together with the plate 1 (see FIG. 2 (e) (f)), it can be prepared by the production method having.

<Third Aspect (Preferred Aspect)>
It is preferable that the manufacturing method of this invention has the film sticking process and film peeling process which are mentioned later.
For example, as shown in FIGS. 3A to 3H, the metal-filled microstructure 10 has a mask layer forming step (FIG. 3A) in which a mask layer 6 having a desired shape is formed on one surface of the aluminum substrate 1. b)), and the surface of the aluminum substrate 1 on the side where the mask layer 6 is formed after the mask layer forming step is subjected to anodizing treatment, and the micropores 2 and micropores existing in the thickness direction are formed on one surface of the aluminum substrate 1. 2 and the barrier layer 3 of the anodized film 4 after the anodized process (see FIGS. 3B and 3C). Barrier layer removing step (see FIGS. 3C and 3D), and metal filling step of filling the inside of the micropore 2 with the metal 5 after the barrier layer removing step (see FIGS. 3D and 3E) ) And micropores filled with metal 5 A film sticking step (see FIGS. 3 (e) and 3 (f)) for attaching a peelable adhesive layer-attached film 7 to the surfaces of the anodic oxide film 4 and the mask layer 6 having the above, and the aluminum substrate 1 after the film sticking step. A substrate removing step to be removed (see FIGS. 3 (f) and 3 (g)), a film peeling step (see FIGS. 3 (g) and (h)) for peeling the film 7 with the adhesive layer together with the mask layer 6 after the substrate removing step; It can produce by the manufacturing method which has these.

<4th aspect (preferred aspect)>
The production method of the present invention preferably has a polishing step described later.
For example, as shown in FIGS. 4A to 4I, the metal-filled microstructure 10 has a mask layer forming step (FIG. 4A) in which a mask layer 6 having a desired shape is formed on one surface of the aluminum substrate 1. b)), and the surface of the aluminum substrate 1 on the side where the mask layer 6 is formed after the mask layer forming step is subjected to anodizing treatment, and the micropores 2 and micropores existing in the thickness direction are formed on one surface of the aluminum substrate 1. 2 and the barrier layer 3 of the anodized film 4 after the anodized process (see FIGS. 4B and 4C). Barrier layer removing step (see FIGS. 4C and 4D) for removing the metal, and metal filling step for filling the inside of the micropores 2 with the metal 5 after the barrier layer removing step (see FIGS. 4D and 4E) ) And micropores filled with metal 5 A polishing step (see FIGS. 4 (e) and 4 (f)) for polishing the surfaces of the anodic oxide film 4 and the mask layer 6 each having at least the mask layer 6, and an anode having the micropores 2 filled with the metal 5 A film sticking step (see FIGS. 4 (f) and (g)) for attaching the peelable adhesive layer-attached film 7 to the surfaces of the oxide film 4 and the aluminum substrate 1, and a substrate from which the aluminum substrate 1 is removed after the film sticking step Produced by a manufacturing method having a removing step (see FIGS. 4 (g) (h)) and a film peeling step (see FIGS. 4 (h) (i)) for peeling the film 7 with the adhesive layer after the substrate removing step. can do.

<Fifth Aspect (Preferred Aspect)>
The production method of the present invention preferably has a surface smoothing step described later.
For example, as shown in FIGS. 5A to 5J, the metal-filled microstructure 10 has a mask layer forming step for forming a mask layer 6 having a desired shape on one surface of the aluminum substrate 1 (FIG. 5A). b)), and the surface of the aluminum substrate 1 on the side where the mask layer 6 is formed after the mask layer forming step is subjected to anodizing treatment, and the micropores 2 and micropores existing in the thickness direction are formed on one surface of the aluminum substrate 1. 2 and the barrier layer 3 of the anodic oxide film 4 after the anodic oxidation process (see FIGS. 5B and 5C). The barrier layer removing step (see FIGS. 5C and 5D) for removing the metal and the metal filling step for filling the inside of the micropore 2 with the metal 5 after the barrier layer removing step (see FIGS. 5D and 5E) ) And micropores filled with metal 5 A polishing step (see FIGS. 5 (e) and 5 (f)) for polishing the surfaces of the anodic oxide film 4 and the mask layer 6 each having at least the mask layer 6, and an anode having the micropores 2 filled with the metal 5 A film sticking step (see FIGS. 5 (f) and (g)) for attaching the peelable adhesive layer-attached film 7 to the surfaces of the oxide film 4 and the aluminum substrate 1, and a substrate from which the aluminum substrate 1 is removed after the film sticking step The surface of the anodic oxide film 4 having the micropores 2 filled with the metal 5 (the surface on the side in contact with the aluminum substrate 1) after the removing step (see FIGS. 5G and 5H) and the substrate removing step. A surface smoothing step for smoothing (see FIGS. 5 (h) (i)), a film peeling step for peeling the film 7 with an adhesive layer after the surface smoothing step (see FIGS. 5 (i) (j)), In the manufacturing method having Ri can be produced.

<Conventional aspect>
As shown in FIGS. 6A to 6D, the metal-filled microstructure 20 produced by a conventionally known manufacturing method is anodized on one side of the aluminum substrate 1, and on one side of the aluminum substrate 1, Anodizing treatment step (see FIGS. 6A and 6B) for forming an anodized film 4 having micropores 2 present in the thickness direction and a barrier layer 3 present at the bottom of the micropores 2, and anodizing treatment After the step, the aluminum substrate 1 and the barrier layer 3 are removed to penetrate the micropore 2 (see FIGS. 6B and 6C), and after the penetration step, the metal 5 is placed inside the micropore 2. And a metal filling step for filling (see FIGS. 6C and 6D).

[Aluminum substrate]
The aluminum substrate used in the production method of the present invention is not particularly limited, and specific examples thereof include a pure aluminum plate; an alloy plate containing aluminum as a main component and a trace amount of foreign elements; low-purity aluminum (for example, recycled material) ) On which a high-purity aluminum is deposited; a substrate on which the surface of silicon wafer, quartz, glass or the like is coated with high-purity aluminum by a method such as vapor deposition or sputtering; a resin substrate on which aluminum is laminated;

  In the present invention, of the aluminum substrate, the surface on which the anodized film is provided by an anodizing process described later preferably has an aluminum purity of 99.5% by mass or more, and 99.9% by mass or more. Is more preferable, and it is still more preferable that it is 99.99 mass% or more. When the aluminum purity is in the above range, the regularity of the micropore array is sufficient.

Moreover, in this invention, it is preferable that the surface of one side which performs the anodic oxidation process mentioned later among aluminum substrates is heat-processed, a degreasing process, and a mirror surface finishing process previously.
Here, the heat treatment, the degreasing treatment, and the mirror finishing treatment can be performed in the same manner as the treatments described in paragraphs [0044] to [0054] of Patent Document 2 (Japanese Patent Laid-Open No. 2008-270158). .

[Anodizing treatment process]
In the anodic oxidation process, an anodic oxidation process is performed on one surface of the aluminum substrate, whereby an anodic oxide film having micropores existing in the thickness direction and a barrier layer existing at the bottom of the micropores on one surface of the aluminum substrate. Is a step of forming.
For the anodizing treatment in the production method of the present invention, a conventionally known method can be used, but from the viewpoint of increasing the regularity of the micropore arrangement and ensuring the anisotropic conductivity of the metal-filled microstructure, self-regulation It is preferable to use a chemical method or a constant voltage treatment.
Here, regarding the self-ordering method and the constant voltage treatment of the anodizing treatment, each treatment described in paragraphs [0056] to [0108] and [FIG. 3] of Patent Document 2 (Japanese Patent Laid-Open No. 2008-270158). The same processing can be performed.

[Barrier layer removal process]
The barrier layer removing step is a step of removing the barrier layer of the anodized film after the anodizing treatment step. By removing the barrier layer, a part of the aluminum substrate is exposed through the micropore 2 as shown in FIG.
The method for removing the barrier layer is not particularly limited. For example, the method for electrochemically dissolving the barrier layer at a potential lower than the potential in the anodizing treatment in the anodizing treatment step (hereinafter referred to as “electrolytic removal treatment”). A method of removing the barrier layer by etching (hereinafter, also referred to as “etching removal treatment”); a combination of these methods (particularly, after the electrolytic removal treatment is performed, the remaining barrier layer is removed by the etching removal treatment). And the like.

<Electrolytic removal treatment>
The electrolytic removal treatment is not particularly limited as long as it is an electrolytic treatment performed at a potential lower than the potential (electrolytic potential) in the anodizing treatment in the anodizing treatment step.
In the present invention, the electrolytic dissolution treatment can be performed continuously with the anodizing treatment, for example, by lowering the electrolytic potential at the end of the anodizing treatment step.

The electrolytic removal treatment can employ the same electrolytic solution and treatment conditions as those of the previously known anodizing treatment described above for conditions other than the electrolytic potential.
In particular, as described above, when the electrolytic removal treatment and the anodizing treatment are successively performed, it is preferable to perform treatment using the same electrolytic solution.

(Electrolytic potential)
The electrolytic potential in the electrolytic removal treatment is preferably lowered continuously or stepwise (stepwise) to a potential lower than the electrolytic potential in the anodizing treatment.
Here, the reduction width (step width) when the electrolytic potential is lowered stepwise is preferably 10 V or less, more preferably 5 V or less, from the viewpoint of the withstand voltage of the barrier layer, and 2 V or less. More preferably.
In addition, the voltage drop rate when dropping the electrolytic potential continuously or stepwise is preferably 1 V / second or less, more preferably 0.5 V / second or less, and 0.2 V / second from the viewpoint of productivity. More preferred is less than a second.

<Etching removal treatment>
The etching removal process is not particularly limited, but may be a chemical etching process that dissolves using an acid aqueous solution or an alkali aqueous solution, or may be a dry etching process.

(Chemical etching process)
The removal of the barrier layer by the chemical etching treatment is performed by, for example, immersing the structure after the anodizing treatment step in an acid aqueous solution or an alkali aqueous solution and filling the inside of the micropore with an acid aqueous solution or an alkali aqueous solution, Only the barrier layer can be selectively dissolved by a method of contacting the surface of the micropores on the opening side with a pH buffer solution.

Here, when an acid aqueous solution is used, it is preferable to use an aqueous solution of an inorganic acid such as sulfuric acid, phosphoric acid, nitric acid, hydrochloric acid, oxalic acid, or a mixture thereof. Moreover, it is preferable that the density | concentration of acid aqueous solution is 1-10 mass%. The temperature of the acid aqueous solution is preferably 15 to 80 ° C, more preferably 20 to 60 ° C, and further preferably 30 to 50 ° C.
On the other hand, when using an alkaline aqueous solution, it is preferable to use an aqueous solution of at least one alkali selected from the group consisting of sodium hydroxide, potassium hydroxide and lithium hydroxide. Moreover, it is preferable that the density | concentration of aqueous alkali solution is 0.1-5 mass%. The temperature of the alkaline aqueous solution is preferably 10 to 60 ° C, more preferably 15 to 45 ° C, and further preferably 20 to 35 ° C.
Specifically, for example, 50 g / L, 40 ° C. phosphoric acid aqueous solution, 0.5 g / L, 30 ° C. sodium hydroxide aqueous solution, 0.5 g / L, 30 ° C. potassium hydroxide aqueous solution, etc. are preferably used. It is done.
In addition, as a pH buffer solution, the buffer solution corresponding to the acid aqueous solution or alkali aqueous solution mentioned above can be used suitably.

  Further, the immersion time in the aqueous acid solution or aqueous alkali solution is preferably 5 to 120 minutes, more preferably 8 to 120 minutes, still more preferably 8 to 90 minutes, and 10 to 90 minutes. It is particularly preferred. Especially, it is preferable that it is 10 to 60 minutes, and it is more preferable that it is 15 to 60 minutes.

(Dry etching process)
For the dry etching treatment, for example, a gas species such as a Cl ₂ / Ar mixed gas is preferably used.

[Metal filling process]
The metal filling step is a step of filling the inside of the micropores in the anodic oxide film with an electrolytic plating treatment after the barrier layer removing step.

<Metal>
The metal is preferably a material having an electric resistivity of 10 ³ Ω · cm or less. Specific examples thereof include gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium ( Suitable examples include Mg), nickel (Ni), tin oxide (ITO) doped with indium.
Among these, from the viewpoint of electrical conductivity, copper, gold, aluminum, and nickel are preferable, and copper and gold are more preferable.

<Filling method>
As a method of filling the inside of the micropore with the above metal, for example, the same methods as those described in paragraphs [0123] to [0126] and [FIG. 4] of Patent Document 2 (Japanese Patent Laid-Open No. 2008-270158) are used. The method etc. are mentioned.

In the present invention, since the barrier layer is removed by the barrier layer removing step, unlike in Patent Document 2, the aluminum substrate can be used as an electrode (film).
Therefore, in the present invention, as described above, it is easy to fill the micropores with metal, and it is possible to suppress the occurrence of residual stress accompanying the metal filling.

[Substrate removal process]
The substrate removal step is a step of removing the aluminum substrate and obtaining a metal-filled microstructure after the metal filling step.
A method for removing the aluminum substrate is not particularly limited, and for example, a method for removing the aluminum substrate by dissolution, and the like are preferable.

<Dissolution of aluminum substrate>
For the dissolution of the aluminum substrate, it is preferable to use a treatment solution that hardly dissolves the anodic oxide film and easily dissolves aluminum.
Such a treatment liquid preferably has a dissolution rate with respect to aluminum of 1 μm / min or more, more preferably 3 μm / min or more, and further preferably 5 μm / min or more. Similarly, the dissolution rate for the anodic oxide film is preferably 0.1 nm / min or less, more preferably 0.05 nm / min or less, and still more preferably 0.01 nm / min or less.
Specifically, the treatment liquid preferably contains at least one metal compound having a lower ionization tendency than aluminum and has a pH of 4 or less or 8 or more, and the pH is 3 or less or 9 or more. Is more preferably 2 or less or 10 or more.

Such treatment liquid is based on an acid or alkaline aqueous solution, for example, manganese, zinc, chromium, iron, cadmium, cobalt, nickel, tin, lead, antimony, bismuth, copper, mercury, silver, palladium, platinum, A gold compound (for example, chloroplatinic acid), a fluoride thereof, a chloride thereof, or the like is preferably used.
Among them, an acid aqueous solution base is preferable, and it is preferable to blend a chloride.
In particular, a treatment liquid (hydrochloric acid / mercury chloride) in which mercury chloride is blended with an aqueous hydrochloric acid solution and a treatment liquid (hydrochloric acid / copper chloride) in which copper chloride is blended with an aqueous hydrochloric acid solution are preferable from the viewpoint of treatment latitude.
The composition of such a treatment liquid is not particularly limited, and for example, a bromine / methanol mixture, a bromine / ethanol mixture, aqua regia and the like can be used.

Moreover, 0.01-10 mol / L is preferable and, as for the acid or alkali concentration of such a processing liquid, 0.05-5 mol / L is more preferable.
Furthermore, the treatment temperature using such a treatment liquid is preferably −10 ° C. to 80 ° C., and preferably 0 ° C. to 60 ° C.

  In addition, the aluminum substrate is dissolved by bringing the aluminum substrate after the metal filling step into contact with the treatment liquid described above. The method of making it contact is not specifically limited, For example, the immersion method and the spray method are mentioned. Of these, the dipping method is preferred. The contact time at this time is preferably 10 seconds to 5 hours, and more preferably 1 minute to 3 hours.

[Mask layer forming process]
The mask layer forming step is an arbitrary step in which a mask layer having a desired shape is formed in advance on one surface of the aluminum substrate on which the anodizing treatment is performed before the anodizing treatment step.
By having such a mask layer forming step, it is possible to further suppress the generation of residual stress accompanying the metal filling of the metal-filled microstructure manufactured. As described above, this can be presumed to be caused by the fact that not only the lower part of the anodic oxide film but also the periphery of the anodic oxide film can be filled with the metal inside the micropore in the state surrounded by the aluminum substrate. .
Therefore, in the present invention, the mask layer is preferably provided at the end portion on the surface on one side of the aluminum substrate because a metal-filled microstructure having a small residual stress can be produced with a large area.

The mask layer is formed by, for example, a method in which an image recording layer is formed on the surface of the aluminum substrate, and then energy is applied to the image recording layer by exposure or heating to develop into a predetermined opening pattern. Can do.
Here, the material for forming the image recording layer is not particularly limited, and a conventionally known material for forming a photosensitive layer (photoresist layer) or a heat-sensitive layer can be used. If necessary, an infrared absorber or the like can be used. An additive may also be contained.

[Film pasting process]
In the film sticking step, after the metal filling step and before the substrate removing step, an anodic oxide film having micropores filled with metal (in the case of having the mask layer forming step, “anodic oxide film and This is an optional step of attaching a peelable adhesive layer-attached film to the surface of “a mask layer”, which means “an anodic oxide film and an aluminum substrate” when it has a polishing step described later.
By having such a film sticking step and a film peeling step to be described later, in the case of having the mask layer forming step, it is possible to temporarily hold the metal-filled microstructure produced by being singulated, Handling property is improved (see FIG. 3G, FIG. 4H, etc.).

The said film with an adhesion layer is not specifically limited, It is preferable to use a conventionally well-known film with an easily peelable adhesive layer.
In the present invention, as the above-mentioned film with an adhesive layer, for example, Sanitect (registered trademark) (manufactured by Sanei Kaken Co., Ltd.) in which an adhesive layer is formed on the surface of a polyethylene resin film, adhesive on the surface of a polyethylene terephthalate resin film E-MASK [registered trademark] (manufactured by Nitto Denko Corporation) in which the adhesive layer is formed, and Mastack [registered trademark] (manufactured by Fujimori Kogyo Co., Ltd.) in which the adhesive layer is formed on the polyethylene terephthalate resin film surface, etc. Commercial products sold under the series name can be used.

  Moreover, the method of affixing the said film with an adhesion layer is not specifically limited, It can affix using a conventionally well-known surface protection tape sticking apparatus and a laminator.

[Film peeling process]
In the film peeling step, after the film sticking step and the substrate removing step, the film with the adhesive layer has the above-described mask layer forming step, and peels off together with the mask layer when there is no polishing step to be described later. It is an optional process.
Here, the method of peeling the said film with the adhesion layer is not specifically limited, It can affix using a conventionally well-known surface protection tape peeling apparatus.

[Polishing process]
The polishing step is to polish the surface of the anodized film and the mask layer having micropores filled with metal after the metal filling step (before the film sticking step if the film sticking step is included), This is an optional step of removing at least the mask layer.
By having such a polishing step, it becomes easier to attach the film with the adhesive layer in the film pasting step, and the excess adhered to the surface of the anodized film after filling the micropores with metal. The metal can be removed.
Moreover, as a grinding | polishing method in the said grinding | polishing process, the various processing methods in the surface smoothing process mentioned later can be mentioned, for example.

[Surface smoothing process]
The surface smoothing step includes an anode having a micropore filled with metal on the side in contact with the aluminum substrate after the substrate removing step (before the film peeling step if the film peeling step is included). This is an optional step of smoothing the surface of the oxide film.
By having such a surface smoothing process, it is possible to remove excess metal adhering to the surface of the anodic oxide film after filling the micropores with metal.
As such a surface smoothing treatment, for example, a mechanical polishing treatment, a chemical mechanical polishing (CMP) treatment, an electrolytic polishing treatment, and an ion milling treatment described below are preferably exemplified.

<Mechanical polishing>
As the mechanical polishing treatment, for example, lapping is performed using a polishing cloth (for example, SiC cloth) of # 800 to # 1500, the thickness is adjusted, and then polishing is performed with diamond slurry having an average particle diameter of 1 to 3 μm. Further, polishing can be performed with a diamond slurry having an average particle size of 0.1 to 0.5 μm to obtain a mirror surface state.
Here, the polishing thickness of the electrode surface is preferably 0 μm to 20 μm, and the polishing thickness of the opening surface is preferably 10 μm to 50 μm.
Further, the rotation speed is preferably 10 rpm to 100 rpm, more preferably 20 to 60 rpm.
Moreover, it is preferable that it is 0.01-0.1 kgf / cm < ² >, and, as for a load, it is more preferable that it is 0.02-0.08 kgf / cm < ² >.

<Chemical mechanical polishing (CMP) treatment>
For the CMP treatment, a CMP slurry such as PNANERLITE-7000 manufactured by Fujimi Incorporated, GPX HSC800 manufactured by Hitachi Chemical Co., Ltd., CL-1000 manufactured by Asahi Glass (Seimi Chemical Co., Ltd.), or the like can be used.

<Electropolishing treatment>
As electrolytic polishing, for example, “Aluminum Handbook”, 6th edition, edited by Japan Aluminum Association, 2001, p. 164-165; various methods described in US Pat. No. 2,708,655; “Practical Surface Technology”, vol. 33, no. 3, 1986, p. The method described in 32-38;

<Ion milling>
The ion milling process is performed when more precise polishing is required than the above-described CMP process or electrolytic polishing process, and a known technique can be used. It is preferable to use general argon ions as the ion species.

[Other processing]
<Protective film formation process>
In the manufacturing method of the present invention, the pore size of the micropores of the anodic oxide film changes over time due to hydration with moisture in the air, so that the protective film forming treatment is performed before the metal filling step. It is preferable.
Here, with respect to the protective film forming process, the same processes as those described in paragraphs [0133] to [0140] of Patent Document 2 (Japanese Patent Laid-Open No. 2008-270158) can be performed.

<Washing treatment>
In the manufacturing method of this invention, it is preferable to wash with water after completion | finish of the process of each process mentioned above. For washing, pure water, well water, tap water, or the like can be used. A nip device may be used to prevent the processing liquid from being brought into the next process.

A metal-filled microstructure in which metal is filled in through-holes derived from micropores provided in an insulating base material made of an anodized film of an aluminum substrate by the manufacturing method of the present invention having such processing steps. The body is obtained.
Specifically, according to the manufacturing method of the present invention, for example, an anisotropic conductive member described in Patent Document 2, that is, an insulating base material (an anodic oxide film of an aluminum substrate having micropores) is electrically conductive. A plurality of conductive paths made of members penetrate the insulating base material in the thickness direction in a state of being insulated from each other, and one end of each conductive path is exposed on one surface of the insulating base material, An anisotropic conductive member provided in a state in which the other end of each conduction path is exposed on the other surface of the insulating base material can be obtained in a state where there is little residual stress (warping and cracks are small).

  The present invention will be specifically described below with reference to examples. However, the present invention is not limited to these.

[Example 1]
<Preparation of aluminum substrate>
Si: 0.06 mass%, Fe: 0.30 mass%, Cu: 0.005 mass%, Mn: 0.001 mass%, Mg: 0.001 mass%, Zn: 0.001 mass%, Ti: Containing 0.03% by mass, the balance is prepared using Al and an inevitable impurity aluminum alloy, and after performing the molten metal treatment and filtration, an ingot having a thickness of 500 mm and a width of 1200 mm is obtained by a DC casting method. Produced.
Next, the surface was shaved with a chamfering machine with an average thickness of 10 mm, soaked at 550 ° C. for about 5 hours, and when the temperature dropped to 400 ° C., the thickness was 2.7 mm using a hot rolling mill. A rolled plate was used.
Furthermore, after performing heat processing at 500 degreeC using a continuous annealing machine, it finished by cold rolling to thickness 1.0mm, and obtained the aluminum substrate of JIS1050 material.
After making this aluminum substrate width 1030mm, each process shown below was performed.

<Electropolishing treatment>
The aluminum substrate was subjected to an electropolishing treatment using an electropolishing liquid having the following composition under the conditions of a voltage of 25 V, a liquid temperature of 65 ° C., and a liquid flow rate of 3.0 m / min.
The cathode was a carbon electrode, and GP0110-30R (manufactured by Takasago Seisakusho Co., Ltd.) was used as the power source. Further, the flow rate of the electrolyte was measured using a vortex flow monitor FLM22-10PCW (manufactured by ASONE Corporation).
(Electrolytic polishing liquid composition)
-660 mL of 85% phosphoric acid (reagent manufactured by Wako Pure Chemical Industries, Ltd.)
・ Pure water 160mL
・ Sulfuric acid 150mL
・ Ethylene glycol 30mL

<Anodizing process>
Subsequently, the aluminum substrate after the electrolytic polishing treatment was subjected to an anodizing treatment by a self-ordering method according to the procedure described in JP-A-2007-204802.
The aluminum substrate after the electropolishing treatment was subjected to a pre-anodization treatment for 5 hours with an electrolyte solution of 0.50 mol / L oxalic acid at a voltage of 40 V, a liquid temperature of 16 ° C., and a liquid flow rate of 3.0 m / min. .
Thereafter, a film removal treatment was performed in which the aluminum substrate after the pre-anodizing treatment was immersed in a mixed aqueous solution (liquid temperature: 50 ° C.) of 0.2 mol / L chromic anhydride and 0.6 mol / L phosphoric acid for 12 hours.
Thereafter, reanodization treatment was performed for 10 hours with an electrolyte solution of 0.50 mol / L oxalic acid under conditions of a voltage of 40 V, a liquid temperature of 16 ° C., and a liquid flow rate of 3.0 m / min. An oxide film was obtained.
In both the pre-anodizing treatment and the re-anodizing treatment, the cathode was a stainless electrode, and the power supply was GP0110-30R (manufactured by Takasago Seisakusho Co., Ltd.). Further, NeoCool BD36 (manufactured by Yamato Scientific Co., Ltd.) was used as the cooling device, and Pair Stirrer PS-100 (manufactured by EYELA Tokyo Rika Kikai Co., Ltd.) was used as the stirring and heating device. Furthermore, the flow rate of the electrolytic solution was measured using a vortex type flow monitor FLM22-10PCW (manufactured by ASONE CORPORATION).

<Barrier layer removal process>
Next, electrolytic treatment (electrolytic removal treatment) was performed under the same treatment liquid and treatment conditions as in the anodizing treatment, while the voltage was continuously lowered from 40 V to 0 V at a voltage drop rate of 0.2 V / sec.
After that, an etching process (etching removal process) is performed by immersing in 5% by mass phosphoric acid at 30 ° C. for 30 minutes to remove the barrier layer at the bottom of the micropore of the anodized film, and to expose aluminum through the micropore. It was.

Here, the average opening diameter of the micropores present in the anodized film after the barrier layer removing step was 60 nm. The average opening diameter was calculated as an average value obtained by taking a surface photograph (magnification 50000 times) with FE-SEM and measuring 50 points.
The average thickness of the anodic oxide film after the barrier layer removing step was 80 μm. The average thickness was calculated as an average value obtained by cutting the anodic oxide film with FIB in the thickness direction, photographing a surface photograph (magnification 50000 times) with FE-SEM, and measuring 10 points.
The density of micropores present in the anodic oxide film was about 100 million / mm ² . The micropore density was measured and calculated by the method described in paragraphs [0168] and [0169] of Patent Document 2 (Japanese Patent Laid-Open No. 2008-270158).
Further, the degree of ordering of the micropores present in the anodic oxide film was 92%. The degree of ordering was measured by a method described in paragraphs [0024] to [0027] of Patent Document 2 (Japanese Patent Laid-Open No. 2008-270158) by taking a surface photograph (magnification 20000 times) with FE-SEM. And calculated.

<Metal filling process (electrolytic plating)>
Next, electrolytic plating was performed using the aluminum substrate as the cathode and platinum as the positive electrode.
Specifically, a metal-filled microstructure in which copper was filled in the micropores was produced by performing constant current electrolysis using a copper plating solution having the composition shown below.
Here, the constant current electrolysis is performed by cyclic voltammetry in a plating solution using a power source (HZ-3000) manufactured by Hokuto Denko Co., Ltd. using a plating apparatus manufactured by Yamamoto Metal Testing Co., Ltd. After confirming the potential, the treatment was performed under the following conditions.
(Copper plating composition and conditions)
・ Copper sulfate 100g / L
・ Sulfuric acid 50g / L
・ Hydrochloric acid 15g / L
・ Temperature 25 ℃
・ Current density 10A / dm ²

The surface of the anodic oxide film after filling the micropores with metal was observed with FE-SEM, and the presence or absence of sealing by metal in 1000 micropores was observed to determine the sealing rate (number of sealed micropores / 1000 ) Was calculated to be 96%.
In addition, the anodic oxide film after filling the micropores with metal was cut with FIB in the thickness direction, and a cross-sectional photograph of the surface was taken by FE-SEM (magnification 50000 times), and the inside of the micropores was taken. As a result of confirmation, it was found that the inside of the sealed micropore was completely filled with metal.

<Substrate removal process>
Next, a metal-filled microstructure was prepared by dissolving and removing the aluminum substrate by immersing it in a 20 mass% mercury chloride aqueous solution (raised) at 20 ° C. for 3 hours.

[Example 2]
A metal-filled microstructure was produced by the same method as in Example 1 except that the mask layer was formed by the following mask layer forming step before the anodizing treatment step.
<Mask layer forming step>
A photoresist (FC-230G, manufactured by Toyobo Co., Ltd.) was coated on the surface of the aluminum substrate, and UV irradiation was performed through a mask to give a predetermined opening pattern.
Thereafter, the non-irradiated portion was completely removed by developing with an alkaline developer, and the surface of the aluminum substrate was exposed in a pattern.

Example 3
After the metal filling step and before the substrate removing step, a film with an adhesive layer is pasted by the film pasting step shown below, and after the substrate removing step, the film with an adhesive layer is peeled by the film peeling step. A metal-filled microstructure was produced by the same method as in Example 2 except that.
<Film pasting process>
A film with an adhesive layer (E-MASK [registered trademark] HR6010, manufactured by Nitto Denko Corporation) was attached to the surface of the anodized film and mask layer of the structure after the metal filling step using a laminator.
<Film peeling process>
From the structure after the substrate removal step, the film with the adhesive layer was peeled off together with the mask layer using a surface protective tape peeling device to produce a metal-filled microstructure.

Example 4
Except for polishing the surface of the anodic oxide film and the mask layer having the micropores filled with metal by the following polishing step (mechanical polishing treatment) after the metal filling step and before the film sticking step, A metal-filled microstructure was produced by the same method as in Example 3. The thickness of the produced metal-filled microstructure was 65 μm.
<Polishing process (mechanical polishing process)>
As a sample stage used in the polishing step, a ceramic jig (manufactured by Kemet Japan Co., Ltd.) was used, and as a material to be attached to the sample stage, alcohol wax (manufactured by Nikka Seiko Co., Ltd.) was used. Further, as the abrasive, DP-suspension P-6 μm · 3 μm · 1 μm · ¼ μm (manufactured by Struers) was used in this order.

Example 5
After the substrate removal step and before the film peeling step, the surface of the anodic acid film on the side in contact with the aluminum substrate is polished by a surface smoothing step that performs the same mechanical polishing treatment as the polishing step. A metal-filled microstructure was produced by the same method as in Example 4 except that. The thickness of the produced metal-filled microstructure was 50 μm.

Example 6
A metal-filled microstructure was produced by the same method as in Example 1 except that the metal-filling step was performed by the method shown below and Ni was filled.
<Metal filling process (electrolytic plating)>
Electroplating was performed using an aluminum substrate as a cathode and platinum as a positive electrode. Then, using a mixed solution of nickel sulfate / nickel chloride / boric acid = 300/60/40 (g / L) as an electrolytic solution in a state kept at 50 ° C., constant current electrolysis (5 A / dm ² ) is performed. Was filled with metal.

Example 7
A metal-filled microstructure was produced by the same method as in Example 1 except that the barrier layer removal step was performed by the method described below, that is, the etching removal treatment was not performed in the barrier layer removal step.
<Barrier layer removal process>
Next, electrolytic treatment (electrolytic removal treatment) was performed under the same treatment liquid and treatment conditions as in the anodizing treatment, while the voltage was continuously lowered from 40 V to 0 V at a voltage drop rate of 0.2 V / sec.

[Comparative Example 1]
A metal-filled microstructure was produced by the same method as in Example 1 except that the step after the anodizing step was changed to the following step.
<Penetration process>
Next (after the anodizing treatment step), the aluminum substrate was dissolved by immersing in 20% by mass mercury chloride aqueous solution (raised) at 20 ° C. for 3 hours, and further immersed in 5% by mass phosphoric acid at 30 ° C. for 30 minutes. Thus, the bottom portion (barrier layer) of the anodic oxide film was removed, and a structure made of the anodic oxide film having micropores was produced.

<Heat treatment process>
Next, the structure obtained above was subjected to heat treatment at a temperature of 400 ° C. for 1 hour.

<Electrode film formation treatment>
Next, a treatment for forming an electrode film on one surface of the structure after the heat treatment was performed.
That is, a 0.7 g / L chloroauric acid aqueous solution was applied to one surface, dried at 140 ° C./1 minute, and further baked at 500 ° C./1 hour to create a gold plating nucleus.
Thereafter, a precious fab ACG2000 basic solution / reducing solution (manufactured by Nippon Electroplating Engineers Co., Ltd.) was used as an electroless plating solution, and an immersion treatment was performed at 50 ° C./1 hour to form an electrode film without voids.

<Metal filling process>
Subsequently, the same electroplating process as Example 1 was performed, and the metal was filled in the micropores of the structure.

<Polishing process / surface smoothing process>
Next, the same mechanical polishing treatment as in the polishing step of Example 4 was performed, and 15 μm was polished from both surfaces to obtain a metal-filled microstructure having a thickness of 50 μm.

[Comparative Example 2]
A metal-filled microstructure was produced by the same method as in Example 1 except that the barrier layer removal step (electrolytic removal treatment and etching removal treatment) was not performed.
Here, as in Example 1, after the metal filling step, the surface of the anodized film after filling the micropores with metal was observed with FE-SEM, and the presence or absence of sealing by metal in 1000 micropores was checked. The sealing rate (number of sealed micropores / 1000) was calculated by observing and found to be 1% or less.
In addition, the anodic oxide film after filling the micropores with metal was cut with FIB in the thickness direction, and a cross-sectional photograph of the surface was taken with FE-SEM (magnification 50000 times). When the vicinity of the barrier layer was confirmed, it was found that metal was not precipitated in most micropores and the metal filling was insufficient.
From this result, it was found that in the production method of Comparative Example 2, it was not easy to fill the micropores with metal.

[Evaluation]
About each metal filling fine structure produced in Examples 1-7 and the comparative example 1, the residual stress and the number of cracks were investigated with the method shown below. These results are shown in Table 1 below. In Table 1 below, for Comparative Example 2, these evaluation items are “−”.

<Residual stress>
The residual stress was calculated by the 2θ · sin ² ψ method using an X-ray diffractometer (XRD, manufactured by Bruker BioSpin Corporation, D8 Discover with GADDS). The voltage / current was 45 kV / 110 mA, the X-ray wavelength was CrKα ray, the X-ray irradiation diameter was 500 μm, and the evaluation crystal plane was measured on the Cu (311) plane or Ni (311) plane.

<Number of cracks>
The number of cracks is 10 samples of each metal-filled microstructure, and by using the microfocus X-ray CT (manufactured by Shimadzu Corporation, SMX-160CTS), the internal structure of the metal-filled microstructure is observed. The number of cracks was determined for each sample, and the average number of cracks was calculated.

From the results shown in Table 1, it was found that when the substrate was removed and the metal was filled after penetrating the micropores, the residual stress increased and the number of cracks increased (Comparative Example 1).
On the other hand, it was found that when the barrier layer was removed and the aluminum substrate was used as an electrode and the metal was filled, the residual stress was reduced and the number of cracks was reduced (Examples 1 to 7).
In particular, from the comparison between Example 1 and Example 2, a mask layer is formed, and not only the lower part of the anodic oxide film but also the periphery of the anodic oxide film is surrounded by an aluminum substrate, a metal is placed inside the micropore. It was found that the residual stress is very small when filled.
Further, from the comparison between Example 1 and Example 7, the removal process of the barrier layer not only performs the electrolytic removal process but also performs the etching removal process, so that the residual stress can be lowered and the number of cracks can be further reduced. I understood.

DESCRIPTION OF SYMBOLS 1 Aluminum substrate 2 Micropore 3 Barrier layer 4 Anodized film 5 Metal 6 Mask layer 7 Film with adhesion layer 10,20 Metal-filled microstructure

Claims (13)

An anode that performs anodization on one surface of an aluminum substrate and forms an anodized film on one surface of the aluminum substrate having micropores in the thickness direction and a barrier layer at the bottom of the micropores An oxidation treatment process;
A barrier layer removing step of removing the barrier layer of the anodized film after the anodizing treatment step;
After the barrier layer removing step, a metal filling step of performing electrolytic plating treatment to fill the inside of the micropore with a metal,
After said metal filling step, the aluminum substrate is removed, possess a substrate removal step of obtaining a metal-filled microstructure and,
The method for producing a metal-filled microstructure , wherein the barrier layer removing step is a step of electrochemically dissolving the barrier layer at a potential lower than the potential in the anodizing treatment of the anodizing treatment step . An anode that performs anodization on one surface of an aluminum substrate and forms an anodized film on one surface of the aluminum substrate having micropores in the thickness direction and a barrier layer at the bottom of the micropores An oxidation treatment process;
A barrier layer removing step of removing the barrier layer of the anodized film after the anodizing treatment step;
After the barrier layer removing step, a metal filling step of performing electrolytic plating treatment to fill the inside of the micropore with a metal,
A substrate removal step of removing the aluminum substrate after the metal filling step to obtain a metal-filled microstructure;
The barrier layer removing step is a step of further removing the barrier layer by etching after electrochemically dissolving the barrier layer at a potential lower than the potential in the anodizing treatment of the anodizing treatment step . method for manufacturing a metallic packing microstructure. Before the anodizing treatment step, the one surface of the aluminum substrate subjected to the anodic oxidation treatment, having a mask layer forming step of preliminarily forming a mask layer having a desired shape, metal according to claim 1 or 2 A method for producing a filled microstructure. After the metal filling step and before the substrate removing step, a film sticking step of sticking a peelable adhesive layer-attached film on the surface of the anodic oxide film having the micropore filled with the metal Have
Furthermore, the manufacturing method of the metal filling fine structure of any one of Claims 1-3 which has a film peeling process which peels the said film with the adhesion layer after the said board | substrate removal process. After the metal filling step, by polishing the surface of the anodic oxide film and the mask layer having the micropores which the metal is filled, with a polishing step to remove at least the mask layer, in claim 3 or 4 The manufacturing method of the metal filling fine structure of description. After the substrate removal step, with the aluminum substrate and the contact have side, surface smoothing step of smoothing the surface of the anode oxide film having the micropores which the metal is filled, claims 1-5 The method for producing a metal-filled microstructure according to any one of the above.   An anode that performs anodization on one surface of an aluminum substrate and forms an anodized film on one surface of the aluminum substrate having micropores in the thickness direction and a barrier layer at the bottom of the micropores An oxidation treatment process;
  A barrier layer removing step of removing the barrier layer of the anodized film after the anodizing treatment step;
  After the barrier layer removing step, a metal filling step of performing electrolytic plating treatment to fill the inside of the micropore with a metal,
  A substrate removal step of removing the aluminum substrate after the metal filling step to obtain a metal-filled microstructure;
  A metal-filled microstructure having a surface smoothing step of smoothing the surface of the anodic oxide film having the micropore filled with the metal on the side in contact with the aluminum substrate after the substrate removing step Manufacturing method.   The metal-filled microstructure according to claim 7, wherein the barrier layer removing step is a step of electrochemically dissolving the barrier layer at a potential lower than the potential in the anodizing treatment of the anodizing treatment step. Production method.   The method for producing a metal-filled microstructure according to claim 7, wherein the barrier layer removing step is a step of removing the barrier layer by etching.   The barrier layer removing step is a step of further removing the barrier layer by etching after electrochemically dissolving the barrier layer at a potential lower than the potential in the anodizing treatment of the anodizing treatment step. The method for producing a metal-filled microstructure according to claim 7.   11. The method according to claim 7, further comprising a mask layer forming step of forming a mask layer having a desired shape in advance on one surface of the aluminum substrate on which the anodizing treatment is performed before the anodizing treatment step. A method for producing a metal-filled microstructure according to Item.   After the metal filling step and before the substrate removing step, a film sticking step of sticking a peelable adhesive layer-attached film on the surface of the anodic oxide film having the micropore filled with the metal Have
  Furthermore, the manufacturing method of the metal filling fine structure of any one of Claims 7-11 which has a film peeling process which peels the said film with the adhesion layer after the said board | substrate removal process.   13. The method according to claim 11, further comprising a polishing step of polishing the surfaces of the anodic oxide film having the micropores filled with the metal and the mask layer and removing at least the mask layer after the metal filling step. The manufacturing method of the metal filling fine structure of description.

Images