JP6009382B2 - 熱電変換モジュール - Google Patents
熱電変換モジュール Download PDFInfo
- Publication number
- JP6009382B2 JP6009382B2 JP2013053768A JP2013053768A JP6009382B2 JP 6009382 B2 JP6009382 B2 JP 6009382B2 JP 2013053768 A JP2013053768 A JP 2013053768A JP 2013053768 A JP2013053768 A JP 2013053768A JP 6009382 B2 JP6009382 B2 JP 6009382B2
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- Prior art keywords
- thermoelectric conversion
- electrode
- conversion module
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- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000006243 chemical reaction Methods 0.000 title claims description 124
- 238000000034 method Methods 0.000 claims description 9
- 230000002265 prevention Effects 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 238000005219 brazing Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 7
- 229910019018 Mg 2 Si Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000005678 Seebeck effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- -1 for example Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910002909 Bi-Te Inorganic materials 0.000 description 1
- 229910018989 CoSb Inorganic materials 0.000 description 1
- 229910017082 Fe-Si Inorganic materials 0.000 description 1
- 229910017133 Fe—Si Inorganic materials 0.000 description 1
- 229910018643 Mn—Si Inorganic materials 0.000 description 1
- 229910002665 PbTe Inorganic materials 0.000 description 1
- 229910008310 Si—Ge Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/8556—Thermoelectric active materials comprising inorganic compositions comprising compounds containing germanium or silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Claims (4)
- 基部と、
複数の第1電極と、
一方の端部が前記第1電極と夫々電気的に接続される複数の熱電変換素子と、
該熱電変換素子の他方の端部に夫々電気的に接続される複数の第2電極と、
前記熱電変換素子に電気的に接続される前記第1電極を、隣接する前記熱電変換素子に電気的に接続される前記第2電極に、電気的に接続する接続部とを備え、
前記複数の熱電変換素子は、n形とp形との何れか一方で構成され、
前記複数の熱電変換素子が電気的に直列に接続される熱電変換モジュールであって、
前記接続部は、前記第2電極と一体に形成されると共に、前記第1電極と別体に構成され、
前記第1電極は、前記熱電変換素子の一方の端部と電気的に接触する素子配置部と、前記接続部の先端を受け入れる受入部とを備え、
前記第1電極または前記第2電極は、前記基部上に配置され、
前記基部に沿うと共に互いに直交する2つの軸線をX軸及びY軸として、
前記熱電変換素子は、前記基部上に前記X軸方向に複数並べられて素子列を構成し、
該素子列は、Y軸方向に複数並べられ、
該受入部は、前記素子列内において、前記素子配置部の前記X軸方向に位置し、前記接続部が素子列内の熱電変換素子を電気的に接続する場合と、前記接続部が隣接する素子列の間同士を電気的に接続する場合の何れであっても、同一形状の接続部で受け入れられるように構成され、
前記第1電極は、全て同一形状に構成され、
前記第2電極は、全て同一形状に構成されることを特徴とする熱電変換モジュール。 - 請求項1に記載の熱電変換モジュールであって、
前記受入部は、複数の孔部で構成され、
前記複数の孔部のうち中央に位置する前記孔部が前記素子列内で前記接続部を受け入れる孔部であり、左右方向に位置する前記孔部が前記素子列の間で前記接続部を受け入れる孔部であることを特徴とする熱電変換モジュール。 - 請求項1又は請求項2に記載の熱電変換モジュールであって、
前記第1電極は、前記素子配置部から前記基部に沿って延びる延設部を備え、
該延設部に前記受入部が設けられ、
前記第1電極は、前記基部上に誤って配置されることを防止すべく、凸部又は凹部で構成される誤組み防止部が設けられることを特徴とする熱電変換モジュール。 - 請求項3に記載の熱電変換モジュールの組立て方法であって、
前記複数の第1電極の配置及び形状に対応する切欠孔を複数備える整列部材を、前記基部上に配置し、
前記切欠孔に前記第1電極を嵌め込むことにより、前記第1電極を前記基部上に配置することを特徴とする熱電変換モジュールの組立て方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013053768A JP6009382B2 (ja) | 2013-03-15 | 2013-03-15 | 熱電変換モジュール |
PCT/JP2013/083011 WO2014141551A1 (ja) | 2013-03-15 | 2013-12-10 | 熱電変換モジュール |
EP13877529.1A EP2975660B1 (en) | 2013-03-15 | 2013-12-10 | Thermoelectric conversion module |
US14/766,744 US9537076B2 (en) | 2013-03-15 | 2013-12-10 | Thermoelectric conversion module |
CN201380071903.2A CN105122486B (zh) | 2013-03-15 | 2013-12-10 | 热电转换模块 |
KR1020157017847A KR20150132085A (ko) | 2013-03-15 | 2013-12-10 | 열전변환모듈 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013053768A JP6009382B2 (ja) | 2013-03-15 | 2013-03-15 | 熱電変換モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014179539A JP2014179539A (ja) | 2014-09-25 |
JP6009382B2 true JP6009382B2 (ja) | 2016-10-19 |
Family
ID=51536237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013053768A Expired - Fee Related JP6009382B2 (ja) | 2013-03-15 | 2013-03-15 | 熱電変換モジュール |
Country Status (6)
Country | Link |
---|---|
US (1) | US9537076B2 (ja) |
EP (1) | EP2975660B1 (ja) |
JP (1) | JP6009382B2 (ja) |
KR (1) | KR20150132085A (ja) |
CN (1) | CN105122486B (ja) |
WO (1) | WO2014141551A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6453067B2 (ja) | 2014-12-10 | 2019-01-16 | 日本サーモスタット株式会社 | 熱電変換モジュール |
KR20160137848A (ko) * | 2015-05-22 | 2016-12-01 | 에스케이이노베이션 주식회사 | 열전재료, 이를 포함하는 열전모듈 및 열전장치 |
JP6739072B2 (ja) * | 2015-10-15 | 2020-08-12 | 国立研究開発法人産業技術総合研究所 | 熱電変換モジュールの作製方法 |
KR102528360B1 (ko) * | 2016-09-02 | 2023-05-03 | 엘지이노텍 주식회사 | 열전 소자 및 열전 모듈 |
TWI608638B (zh) | 2016-12-15 | 2017-12-11 | 財團法人工業技術研究院 | 熱電模組 |
EP3721192A4 (en) * | 2017-12-08 | 2021-08-25 | 3M Innovative Properties Company | DIFFERENTIAL THERMOELECTRIC DEVICE |
JPWO2022092039A1 (ja) * | 2020-10-30 | 2022-05-05 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3496028A (en) * | 1965-11-18 | 1970-02-17 | Minnesota Mining & Mfg | Thermoelectric generator apparatus |
DE1539323A1 (de) * | 1966-06-08 | 1969-10-02 | Siemens Ag | Thermogenerator |
DE1539330A1 (de) * | 1966-12-06 | 1969-11-06 | Siemens Ag | Thermoelektrische Anordnung |
US3714539A (en) * | 1971-06-24 | 1973-01-30 | Minnesota Mining & Mfg | Pressure-contact structure for thermoelectric generators |
US3884726A (en) * | 1972-05-11 | 1975-05-20 | Kurt Landecker | Thermoelectric element |
US4497973A (en) * | 1983-02-28 | 1985-02-05 | Ecd-Anr Energy Conversion Company | Thermoelectric device exhibiting decreased stress |
JPH08149866A (ja) * | 1994-11-15 | 1996-06-07 | Nippondenso Co Ltd | 熱電変換装置 |
US6779347B2 (en) * | 2001-05-21 | 2004-08-24 | C.P. Baker Securities, Inc. | Solid-state thermionic refrigeration |
JP2004152921A (ja) * | 2002-10-30 | 2004-05-27 | Komatsu Ltd | 熱電モジュール及びその製造方法 |
US8309838B2 (en) * | 2004-01-16 | 2012-11-13 | Massachusetts Institute Of Technology | Potential amplified nonequilibrium thermal electric device (PANTEC) |
CN100499195C (zh) * | 2004-05-31 | 2009-06-10 | 株式会社电装 | 热电变换装置及其制造方法 |
WO2005124881A1 (ja) * | 2004-06-22 | 2005-12-29 | Aruze Corp. | 熱電変換素子 |
US7868242B2 (en) * | 2004-07-01 | 2011-01-11 | Universal Entertainment Corporation | Thermoelectric conversion module |
JP4834986B2 (ja) | 2004-12-10 | 2011-12-14 | 株式会社Ihi | 熱電ユニット |
US20070095381A1 (en) * | 2005-10-28 | 2007-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stacked thermoelectric device for power generation |
EP1796182A1 (en) * | 2005-12-09 | 2007-06-13 | Corning SAS | Thermoelectric device |
US8094840B2 (en) * | 2006-09-05 | 2012-01-10 | Pioneer Corporation | Thermal sound generating device |
JP5139095B2 (ja) * | 2008-01-24 | 2013-02-06 | 株式会社ユニバーサルエンターテインメント | 熱電変換モジュールおよび熱電変換素子用コネクタ |
CN101499467A (zh) * | 2008-01-29 | 2009-08-05 | 京瓷株式会社 | 热电模块 |
KR20100071601A (ko) * | 2008-12-19 | 2010-06-29 | 삼성전자주식회사 | 구 형상 열전재료를 구비한 열전모듈 및 그의 제조방법 |
JP5384954B2 (ja) * | 2009-01-20 | 2014-01-08 | 株式会社ユニバーサルエンターテインメント | 熱電変換モジュール |
JP5499317B2 (ja) * | 2009-03-03 | 2014-05-21 | 学校法人東京理科大学 | 熱電変換素子及び熱電変換モジュール |
JP5229382B2 (ja) * | 2009-03-31 | 2013-07-03 | 富士通株式会社 | 熱電変換モジュール及びその修復方法 |
US20110139203A1 (en) * | 2009-12-16 | 2011-06-16 | Gm Global Technology Operations, Inc. | Heterostructure thermoelectric generator |
WO2012091048A1 (ja) * | 2010-12-28 | 2012-07-05 | 京セラ株式会社 | 熱電変換部材 |
JP5913935B2 (ja) * | 2011-11-30 | 2016-05-11 | 日本サーモスタット株式会社 | 熱電変換モジュール |
JP5686130B2 (ja) | 2012-12-27 | 2015-03-18 | トヨタ自動車株式会社 | 固体リチウム二次電池の製造方法 |
-
2013
- 2013-03-15 JP JP2013053768A patent/JP6009382B2/ja not_active Expired - Fee Related
- 2013-12-10 EP EP13877529.1A patent/EP2975660B1/en not_active Not-in-force
- 2013-12-10 KR KR1020157017847A patent/KR20150132085A/ko not_active Application Discontinuation
- 2013-12-10 WO PCT/JP2013/083011 patent/WO2014141551A1/ja active Application Filing
- 2013-12-10 US US14/766,744 patent/US9537076B2/en not_active Expired - Fee Related
- 2013-12-10 CN CN201380071903.2A patent/CN105122486B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN105122486A (zh) | 2015-12-02 |
WO2014141551A1 (ja) | 2014-09-18 |
EP2975660B1 (en) | 2018-02-21 |
JP2014179539A (ja) | 2014-09-25 |
KR20150132085A (ko) | 2015-11-25 |
US20160005947A1 (en) | 2016-01-07 |
EP2975660A4 (en) | 2016-12-14 |
US9537076B2 (en) | 2017-01-03 |
CN105122486B (zh) | 2017-07-18 |
EP2975660A1 (en) | 2016-01-20 |
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