JP6008633B2 - Component mounting system - Google Patents

Description

  The present invention relates to a component mounting system for mounting components on a substrate.

  For example, in Patent Document 1, when a repair board that has been taken out from a board take-out station of a component mounting line and repaired as a defective board is put into the board throwing station, the board throwing station to be routed is limited and another board thrown A component mounting system that prohibits input via a station is disclosed. According to this component mounting system, repair work can be re-inspected to assure the quality of the corrected board.

JP 2009-21466 A

  In the component mounting system described in Patent Document 1, a mounting lane (component mounting line) into which a repair board is inserted is the same lane as the mounting lane from which the repair board is taken out as a defective board. For this reason, when the operation rate of the mounting lane is high at the time of loading the repair board, there is a problem that the production efficiency of the mounting lane decreases due to a temporary lane stop for loading the repair board.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a component mounting system capable of suppressing a decrease in production efficiency of the mounting lane when a repair board is inserted into the mounting lane. is there.

  In order to solve the above-described problem, an invention according to claim 1 is directed to a component mounting system for mounting a component on a substrate by sequentially carrying the substrate and performing a plurality of operations, and at least of the plurality of operations. An inspection apparatus for inspecting a work result of one work and determining a defective substrate that needs repair; a storage unit that stores identification information of the determined defective substrate and information on the operation performed on the defective substrate; A substrate dispensing device disposed downstream of the inspection device and capable of dispensing the defective substrate; an information reading device for reading identification information of the repair substrate that has been repaired; and the identification information of the read repair substrate Is read from the storage means, based on the read identification information of the repair board and the read information of the work, Is that comprising a mounting lane detecting means mounting lane or throughput to detect a high mounting lane there is spare capacity can goods mounted, and mounting lane display means for displaying the mounting lane detected, the.

  The invention according to claim 2 is that, in claim 1, the mounting lane display means displays the mounting lanes arranged in order from the highest production capacity when there are a plurality of mounting lanes detected by the mounting lane detection means.

  According to a third aspect of the present invention, in the first aspect, the component mounting system includes a board loading device capable of loading a repair board that has been repaired, and the mounting lane detection means is the mounting lane detection means. The board loading device disposed on the upstream side of the work to be repaired on the repair board or the board loading device as the loading position of the repair board in the mounting lane detected is the lane. The entry lane is specified, and the mounting lane display means displays the specified place where the repair board is inserted.

  According to the first aspect of the present invention, the mounting lane detecting means is a mounting lane that can mount components of the repair board and has sufficient production capacity or a high throughput based on the repair board identification information and work information. Is supposed to be detected. As a result, it is not necessary to put a repair board in the same lane where the repair board was taken out as a defective board, and the repair board can be put in without stopping the mounting lane detected from the mounting lanes in the entire factory. It becomes possible. The mounting lane display means displays the detected mounting lane. As a result, the operator can accurately and quickly specify the mounting lane detected from the mounting lanes of the entire factory, and can input the repair board. Therefore, it is possible to suppress a decrease in production efficiency of the mounting lanes of the entire factory.

  According to the second aspect of the present invention, the mounting lane display means displays the plurality of detected mounting lanes side by side in descending order of production capacity, so that the operator can select the optimal mounting lane determined by himself / herself. A repair board can be loaded.

  According to the invention of claim 3, the mounting lane detecting means identifies the board loading device or the lane inlet disposed upstream of the work to be repaired as the repair board loading location, and mounts The lane display means displays the specified repair board input location. Accordingly, it is possible to prevent erroneous insertion of the repair board by the operator and to inspect the repaired portion of the repair board with certainty, so that the mounting accuracy of the board can be kept high.

It is a figure which shows schematic structure of the component mounting system by embodiment of this invention. 2 is a flowchart illustrating an operation when a defective board is determined by inspection of the component mounting system of FIG. 1. It is a flowchart explaining the detection operation | movement of the mounting lane by the component mounting system of FIG. It is a flowchart explaining the specific operation | movement of the insertion location of the repair board | substrate by the component mounting system of FIG. It is a flowchart explaining the display operation | movement of the mounting lane and insertion location by the component mounting system of FIG.

  Embodiments of a component mounting system according to the present invention will be described below with reference to the drawings. As shown in FIG. 1, the component mounting system 1 according to the present embodiment is a system that mounts components on a substrate by sequentially carrying the substrate and performing a plurality of operations, that is, solder printing, component mounting, reflow, and the like. is there. The component mounting system 1 includes a plurality of mounting lanes 2, a repair device 3, a client computer 4, a host computer 5, and the like.

  Each mounting lane 2 includes a solder printing device 11, a print inspection device 12, a first board dispensing / loading device 13, a component mounting device 14A, 14B, 14C, 14D, 14E, a mounting inspection device 15, and a second substrate dispensing / throwing device. 16, the cover mounting device 17 and the reflow device 18 are connected in this order from the upstream side to the downstream side. The devices 11 to 18 constituting the mounting lane 2 are connected to each other via the communication network 6 so that the host computer 5 can perform overall control. As shown in FIG. 1, the mounting lane 2 in the present embodiment not only means that a device group constituting one lane and a device group constituting another lane are physically separated. It also means that a plurality of substrate work areas constituting different lanes exist in the same apparatus group, that is, an apparatus group constituting a plurality of lanes is the same.

  On the upstream side of the solder printing apparatus 11, a board carry-in unit 111 for carrying a board to be mounted into the solder printing apparatus 11 is attached. The solder printing apparatus 11 is configured to be able to perform solder printing for component bonding on a substrate supplied via the substrate carry-in unit 111. That is, the solder printing apparatus 11 is configured to screen-print the solder paste on the substrate by covering the substrate with the mask, supplying the solder paste onto the mask, and sliding the scraper on the mask.

  The print inspection apparatus 12 is configured to be able to determine a defective board that needs repair based on the inspection of the work result of solder printing by the solder printing apparatus 11. In other words, the print inspection apparatus 12 is configured to image the board after solder printing with a camera and to determine whether the printing is good or not by performing image recognition processing on the imaged data. As a print inspection method, in addition to a method for recognizing an image acquired by a camera, a method for three-dimensionally measuring the shape of solder after printing may be used.

  The first board dispensing / injecting device 13 is capable of delivering a defective substrate determined to be repaired determined by the printing inspection device 12 to the outside of the mounting lane 2, and the repaired substrate repaired by the repairing device 3 into the mounting lane 2. It is configured to be able to be input. That is, the first substrate dispensing / dispensing device 13 conveys the defective substrate from the print inspection device 12 to the front side of the first substrate dispensing / dispensing device 13 by belt conveyance, and the first substrate dispensing / disposal by the belt conveyance. It is configured to convey from the front side of the device 13 to the component mounting device 14A.

  The component mounting devices 14A, 14B, 14C, 14D, and 14E are configured so that components can be mounted on the board after being solder-printed by the solder printing device 11 and printed and inspected by the print inspection device 12. That is, the component mounting devices 14A, 14B, 14C, 14D, and 14E suck the components supplied by the component supply device by the suction head, transfer them onto the substrate, and mount the components on the substrate by the suction head. It is configured. The mounting lane 2 of this example is configured to include five component mounting devices 14A, 14B, 14C, 14D, and 14E, but may be configured to include an arbitrary number of component mounting devices.

  The mounting inspection device 15 is configured to be able to discriminate a defective board that needs repair based on inspection of work results for component mounting by the component mounting devices 14A, 14B, 14C, 14D, and 14E. That is, the mounting inspection device 15 is configured to image the board after mounting the component with a camera and determine whether the mounting is good or not by performing image recognition processing on the captured data.

  The second substrate dispensing / loading device 16 has the same configuration as that of the first substrate dispensing / loading device 13, so that a defective substrate requiring repair determined by the mounting inspection device 15 can be discharged out of the mounting lane 2, and A repair board repaired by the repair device 3 is configured to be able to be loaded into the mounting lane 2. That is, the second substrate dispensing / loading device 16 conveys the defective substrate from the mounting inspection device 15 to the front side of the second substrate dispensing / dispensing device 16 by belt conveyance, and the second substrate dispensing / disposal by the belt conveyance. It is configured so as to be conveyed from the front side of the device 16 to the cover mounting device 17.

  The cover mounting device 17 is configured to be capable of mounting a cover that covers a predetermined component after the components are mounted by the component mounting devices 14A, 14B, 14C, 14D, and 14E and subjected to the mounting inspection by the mounting inspection device 15.

  The reflow device 18 is configured to be capable of soldering components to the substrate by heating the substrate mounted by the cover mounting device 17 at a predetermined temperature to melt and solidify the solder paste printed on the substrate. .

  The repair device 3 is configured to be able to repair a defective board that needs repair. That is, the repair device 3 is configured such that the solder paste can be removed by washing the substrate in the case of printing failure, and the solder can be absorbed by heating the solder in the case of mounting failure.

  The client computer 4 is connected to the host computer 5 via the communication network 7 in order to manage repaired repair boards. The client computer 4 is provided with a bar code reader 41 that reads a bar code label attached with substrate identification information attached to the substrate and a display device 42 that displays various information from the host computer 5. In place of the configuration in which the barcode label attached to the substrate is read by the barcode reader 41, a storage medium capable of writing and reading information by electromagnetic means such as an IC tag is attached to the substrate, and each device is attached. A tag reader / writer may be attached.

  The host computer 5 includes a storage device 51 (corresponding to storage means) in which component mounting data such as a component mounting program, a target board in the component mounting process, identification information of the target component, and work information are stored. . The host computer 5 is configured to read a component mounting program from the storage device 51 and to perform overall control of each of the devices 11 to 18 constituting the mounting lane 2 in accordance with the component mounting program. Further, when a defective board is generated, the identification information of the defective board and the information of the work that needs repair on the defective board are extracted from the component mounting data stored in the storage device 51, and the storage device is stored as defective data. The storage device 51 can be stored again and the repaired portion of the defective board can be displayed on the display device 42 of the client computer 4.

  Next, the operation of the component mounting system 1 will be described with reference to the flowcharts of FIGS. Since the component mounting operation is a general operation, it will be omitted, and the operation when a defective board is determined by inspection will be described.

  The host computer 5 determines whether or not a defective substrate is generated based on the presence or absence of a defective substrate discrimination signal from the print inspection device 12 or the mounting inspection device 15 (step S1 in FIG. 2). When it is determined that a defective substrate has occurred, the identification information of the defective substrate and the information on the work that requires repair on the defective substrate are extracted and stored as defective data (step S2 in FIG. 2). A defective substrate dispensing signal is commanded to the substrate dispensing / dispensing device 13 and the second substrate dispensing / dispensing device 16.

  Specifically, when the print inspection apparatus 12 inspects that the shape and the like of the solder printed by the solder printing apparatus 11 are out of a predetermined allowable range, the host computer 5 sets the board as a defective board. The substrate is transferred out of the mounting lane 2 by the substrate dispensing / loading device 13. In addition, when the mounting inspection device 15 inspects that the posture of the component mounted by the component mounting devices 14A, 14B, 14C, 14D, and 14E is abnormal, the mounting inspection device 15 sets the substrate as a defective substrate. The second substrate dispensing / dispensing device 16 is carried out of the mounting lane 2.

  Here, the operator takes out the defective substrate from the first substrate dispensing / loading device 13 or the second substrate dispensing / loading device 16 and brings it into the repair device 3, and displays the defective substrate displayed on the display device 42 of the client computer 4. Check the repair point and perform the necessary work. For example, if the solder printing position is misaligned, it is determined that reprinting is necessary, the substrate is washed with a solvent to remove the solder paste, and if the solder printing is rubbed, overprinting is not possible. Judge that it is possible, do not work.

  Also, if the mounting position of the component is shifted, if it is determined that the component can be manually remounted, the solder is heated and sucked to remove the component, and the component is manually remounted. If it is determined that manual remounting of the component is impossible, only the operation of removing the component by heating and sucking the solder is performed. In addition, if a part is missing, if it is determined that the part can be manually remounted, the part must be manually remounted, and the part cannot be remounted manually. If it is determined that, then no work is performed.

  Then, the operator touches the barcode reader 41 of the client computer 4 against the barcode label attached to the repair board that has been repaired, reads the identification information of the repair board, and transmits it to the host computer 5. Furthermore, the work content that the operator has performed on the defective board with the repair device 3, for example, the work content such as whether the component was manually remounted or not manually remounted is input to the client computer 4. .

  The host computer 5 reads the work information corresponding to the repair board identification information transmitted from the client computer 4 (steps S3 and S4 in FIG. 2), and based on the repair board identification information and work information, the repair board is repaired. The mounting lane 2 that can be re-inserted is detected from all the mounting lanes 2 in the factory. In other words, the mounting lane 2 is not limited to the same mounting lane 2 as the mounting lane 2 from which the defective board is taken out, and the mounting lane 2 on which a repair board can be mounted and has sufficient production capacity is detected. At this time, if there are a plurality of mounting lanes 2, all of them are detected (step S5 in FIG. 2, corresponding to mounting lane detecting means).

  Specifically, the host computer 5 first searches the mounting lane 2 for mounting the same component as the component to be mounted on the repair board on the board having the same shape as the repair board when the solder printing position is shifted. To do. If the mounting position of the component is deviated, a board having the same width as that of the repair board is produced, and a mounting lane 2 in which the same part as the part removed by shifting the mounting position on the repair board can be searched. (Step S11 in FIG. 3).

  Next, the surplus production capacity status of the mounted lane 2 that has been searched is acquired (step S12 in FIG. 3), and the presence / absence of the mounting lane 2 having the surplus production capacity is confirmed (step S13 in FIG. 3). If there is no mounting lane 2 with sufficient production capacity, the mounting lane 2 with the highest throughput is detected as a mounting lane on which a repair board can be re-inserted (step S15 in FIG. 3). For example, in each mounting lane 2, the apparatus stops for various reasons, so that the number of boards actually produced is less than the number of boards that should have been produced at that time (a delay has occurred). Although possible, the mounting lane 2 with the smallest delay is detected. On the other hand, if there is a mounting lane 2 having a surplus production capacity, the mounting lane 2 having a surplus production capacity is detected as a mounting lane 2 on which a repair board can be re-inserted (step S14 in FIG. 3). Here, the case where there is a surplus production capacity is considered to be the following two cases.

  The first case is a case where the board loading waiting time to the mounting lane 2 is longer than the maximum tact time (the time for mounting the component on the board is the maximum). That is, the board does not come to the mounting lane 2 even though the board can be taken into the mounting lane 2. As a specific example, since it takes time in a process before the mounting lane 2 (for example, a board manufacturing process), a state in which the board is waiting in the mounting lane 2 can be considered.

  In the second case, the production time (the total loading time of the substrate (the transfer time between all the devices)) and the power on time (the total time including the waiting time for loading the substrate into the mounting lane 2 and the waiting time for loading the substrate) This is a case where the ratio of all parts mounting time is lower than a predetermined value. That is, the operation rate of the mounting lane 2 is poor.

  The host computer 5 identifies the place where the repair board is inserted in the detected mounting lane 2 (step S6 in FIG. 2), and the detected information on the mounting lane 2 and the information on the place where the repair board is inserted are displayed on the display device 42 of the client computer 4. (Step S7 in FIG. 2, corresponding to mounting lane display means).

  Specifically, the host computer 5 determines whether or not the repair board is a repair board in which the deviation of the solder printing position is repaired (step S21 in FIG. 4), and the repair board detects the deviation of the solder printing position. If it is a repaired repair board, the lane entrance is identified as the repair board input location in the detected mounting lane 2 (step S22 in FIG. 4). On the other hand, in the case where the repair board is not a repair board in which the displacement of the solder printing position is repaired, but a repair board in which the displacement of the component mounting position is repaired, the repair board is the target of the repair in the detected mounting lane 2. The substrate dispensing / loading device 13 disposed upstream of the component mounting operation in the component mounting device 14A, 14B, 14C, 14D, 14E is specified (step S23 in FIG. 4).

  Then, the host computer 5 determines whether or not the detected mounting lane 2 has a plurality of lanes (step S31 in FIG. 5), and when the detected mounting lane 2 has a plurality of lanes, the display device 42 of the client computer 4 The plurality of mounting lanes 2 detected in the above are arranged and displayed in descending order of production capacity, and the repair board input locations specified for each mounting lane 2 are displayed (step S32 in FIG. 5). On the other hand, when the detected mounting lane 2 is one, the mounting lane and the place where the repair board is inserted are displayed (step S33 in FIG. 5).

  The operator visually recognizes the display device 42 of the client computer 4, selects an arbitrary mounting lane 2 from among the plurality of displayed mounting lanes 2, and inputs a repair board to the input position of the selected mounting lane 2. Then, for example, when the repair board is inserted into the lane entrance, the host computer 5 starts from the solder printing operation in the solder printing apparatus 11. Further, when the repair board is inserted into the board dispensing / loading device 13, the component mounting apparatuses 14A, 14B, 14C, 14D, and 14E are used based on the component mounting data such as the repair board identification information and the work information. Start with the parts mounting work. For example, when a defect occurs in the component mounting device 14C, the component mounting operation of the component mounting device 14C is performed through the component mounting of the component mounting devices 14A and 14B, and the component mounting operation of the component mounting devices 14D and 14E is performed. Do the following work.

  As described above, according to the component mounting system of this embodiment, the host computer 5 can mount components on the repair board based on the repair board identification information and work information, and has a production capacity. 2 is detected. As a result, it is not necessary to put a repair board in the same lane as the mounting lane 2 from which the repair board was taken out as a defective board, and the repair board is put in without stopping the mounting lane 2 detected from the mounting lane 2 in the whole factory. It becomes possible to do. Further, the client computer 4 displays the detected mounting lane 2. As a result, the operator can accurately and quickly identify the mounting lane 2 detected from the mounting lanes 2 in the entire factory, and can insert a repair board. Therefore, it is possible to suppress a decrease in production efficiency of the mounting lane 2 of the entire factory.

  Since the host computer 5 displays the plurality of detected mounting lanes 2 in order of increasing production capacity, the operator may put a repair board into the optimal mounting lane 2 determined by the operator. It becomes possible. In addition, the host computer 5 identifies the substrate dispensing / throwing device 13 or the lane entrance disposed upstream of the work to be repaired as the repair substrate loading location, and the client computer 4 identifies The repair board input location is displayed. Accordingly, it is possible to prevent erroneous insertion of the repair board by the operator and to inspect the repaired portion of the repair board with certainty, so that the mounting accuracy of the board can be kept high.

  In the above-described embodiment, the plurality of mounting lanes 2 detected are arranged and displayed in descending order of production capacity. However, the present invention is not limited to this display form. It is good also as a structure to display. Further, it is not necessary that both the print inspection device 12 and the mounting inspection device 15 are provided in the mounting lane 2, and the present invention can be applied even if only one inspection device is provided in the mounting lane 2. is there. Further, the present invention can be applied even if one or both of the first and second substrate dispensing / loading devices 13 and 16 are divided into a substrate dispensing device and a substrate loading device. Further, the present invention can be applied as long as at least one substrate dispensing device is provided in the mounting lane 2. Further, the present invention can be applied without providing a substrate loading device in the mounting lane 2.

  DESCRIPTION OF SYMBOLS 1 ... Component mounting system, 2 ... Mounting lane, 3 ... Repair apparatus, 4 ... Client computer, 5 ... Host computer, 6, 7 ... Communication network, 11 ... Solder printing apparatus, 12 ... Print inspection apparatus, 13 ... 1st board | substrate Dispensing / loading device, 14A, 14B, 14C, 14D, 14E ... component mounting device, 15 ... mounting inspection device, 16 ... second substrate dispensing / loading device, 17 ... cover mounting device, 18 ... reflow device, 41 ... bar code Reader, 42 ... display device, 51 ... storage device.

Claims (3)

In a component mounting system that mounts components on a substrate by sequentially carrying the substrate and performing a plurality of operations,
An inspection device for inspecting a work result of at least one of the plurality of operations to determine a defective substrate that needs repair; and
Storage means for storing identification information of the determined defective substrate and information of the work performed on the defective substrate;
A substrate dispensing apparatus disposed downstream of the inspection apparatus and capable of dispensing the defective substrate;
An information reading device for reading the identification information of the repair substrate for which the repair has been completed;
The information on the work corresponding to the read identification information of the repair board is read from the storage means, and the component mounting of the repair board is possible based on the read identification information of the repair board and the read information of the work. A mounting lane detection means for detecting a mounting lane having a production capacity or a mounting lane having a high throughput;
A component mounting system comprising: mounting lane display means for displaying the detected mounting lane.   2. The component mounting system according to claim 1, wherein the mounting lane display unit displays the mounting lanes arranged in descending order of production capacity when there are a plurality of mounting lanes detected by the mounting lane detection unit. The component mounting system includes a board loading device capable of loading a repair board that has been repaired,
The mounting lane detecting means is disposed upstream of the work to be repaired on the repair board, as an input location of the repair board in the mounting lane detected by the mounting lane detecting means. If there is no board loading device or board loading device, specify the lane entrance,
The component mounting system according to claim 1 or 2, wherein the mounting lane display means displays a specified loading position of the repair board.

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